TW202316204A - Exposure apparatus, manufacturing method of flat panel display, device manufacturing method, and exposure method - Google Patents

Abstract

This liquid crystal exposure device (10) which performs scanning exposure by irradiating a substrate (P) with illuminating light (IL) via a projection optical system (30), and driving the projection optical system (PL) relative to the substrate (P), is equipped with alignment microscopes (60) which perform mark detection of marks (Mk) provided on a substrate (P), a first drive system that drives the alignment microscopes (60), a second drive system that drives the projection optical system (PL), and a control device that controls the first and second drive systems in such a manner that the alignment microscopes (60) are driven before the projection optical system (PL) is driven. As a result of this configuration it is possible to minimize tact time required for exposure.

Description

Exposure device, method of manufacturing flat panel display, device manufacturing method, and exposure method

The present invention relates to an exposure device, a method for manufacturing a flat panel display, a method for manufacturing an element, and an exposure method. Specifically, it relates to forming a predetermined pattern on an object by performing scanning exposure of scanning an energy beam in a predetermined scanning direction on the object. The exposure device and method of the present invention, and the manufacturing method of the flat panel display or device including the above exposure device or method.

For a long time, in the lithography process of manufacturing electronic components (micro components) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), exposure devices have been used. Hereinafter, collectively referred to as "reticle"), the pattern is transferred onto a glass plate or wafer (hereinafter collectively referred to as "substrate").

As such an exposure device, there is known a line beam scanning type that scans exposure illumination light (energy beam) in a predetermined scanning direction in a state where the mask and the substrate are substantially stationary, thereby forming a predetermined pattern on the substrate. Scanning exposure apparatus (for example, refer to Patent Document 1).

The exposure apparatus described in the above-mentioned Patent Document 1 is to correct the positional error between the exposure target area on the substrate and the mask, while moving the projection optical system in the direction opposite to the scanning direction at the time of exposure, while passing through the projection optical system. The quasi-microscope measures the marks on the substrate and the mask (alignment measurement), and corrects the position error between the substrate and the mask based on the measurement results. Here, since the alignment mark on the substrate is measured through the projection optical system, the alignment operation and the exposure operation are performed sequentially (serially), and the processing time (production time) required for the exposure processing of all substrates is extremely low. difficult. Prior art literature

[Patent Document 1] Japanese Unexamined Patent Publication No. 2000-12422

means to solve problems

The present invention has been accomplished under the circumstances described above. The exposure device of the first viewpoint irradiates an object with illumination light through a projection optical system, and drives the projection optical system relative to the object to perform scanning exposure. It includes: a mark detection unit for performing Mark detection of a mark provided on the object; a first drive system for driving the mark detection unit; a second drive system for driving the projection optical system; and a control device for performing The driving method of the mark detection unit controls the first and second driving systems.

The method of manufacturing a flat-panel display according to the second aspect of the present invention includes the operation of exposing the object using the exposure device of the present invention, and the operation of developing the exposed object.

The device manufacturing method according to the third aspect of the present invention includes an operation of exposing the object using the exposure device of the present invention, and an operation of developing the exposed object.

The exposure method according to the fourth viewpoint of the present invention is to irradiate an object with illumination light through a projection optical system, and drive the projection optical system relative to the object to perform scanning exposure, which includes: using a mark detection unit to perform a mark provided on the object Mark detection; driving of the mark detection section using the first drive system; driving of the projection optical system using the second drive system; and performing the drive of the mark detection section before driving the projection optical system Control of the 1st and 2nd driving system.

A method of manufacturing a flat-panel display according to a fifth aspect of the present invention includes an operation of exposing the object using the exposure method of the present invention, and an operation of developing the exposed object.

The device manufacturing method according to the sixth aspect of the present invention includes the operation of exposing the object using the exposure method of the present invention, and the operation of developing the exposed object.

"First Embodiment" Hereinafter, the first embodiment will be described using FIGS. 1 to 7( c ).

FIG. 1 shows a conceptual diagram of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure device 10 is a step & scan method in which a rectangular (square) glass substrate P (hereinafter, simply referred to as the substrate P) used for liquid crystal display devices (flat panel displays) is used as the exposure object. The projection exposure device, the so-called scanner.

The liquid crystal exposure apparatus 10 has the illumination system 20 which irradiates the illumination light IL which is energy beam for exposure, and the projection optical system 40. Hereinafter, the direction parallel to the optical axis of the illumination light IL irradiated on the substrate P from the illumination system 20 through the projection optical system 40 is referred to as the Z-axis direction, and the X-axis orthogonal to each other is set in a plane orthogonal to the Z-axis. and Y axis for illustration. In addition, in the coordinate system of this embodiment, the Y-axis system is substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. In addition, the description will be made by taking the rotation (tilt) direction around the Z axis as the θz direction.

Here, in the present embodiment, a plurality of exposure target regions (suitably referred to as divisional regions or shot regions for description) are set on one substrate P, and the photomask is sequentially transferred to these plurality of shot regions. pattern. In addition, although this embodiment is described for the case where four divisional areas are set on the substrate P (so-called four-plane situation), the number of divisional areas is not limited to this and can be changed as appropriate.

Also, in the liquid crystal exposure apparatus 10, although the exposure operation of the so-called step-and-scan method is performed, during the scanning exposure operation, the mask M and the substrate P are substantially in a static state, and the illumination system 20 and the projection optical system 40 (illumination system 40) are in a stationary state. The light IL) moves with a long stroke in the X-axis direction (properly referred to as the scanning direction) relative to the mask M and the substrate P (refer to the white arrow in FIG. 1 ). On the other hand, during the stepping operation for changing the divisional area of the exposure target, the mask M moves steppingly with a predetermined stroke in the X-axis direction, and the substrate P moves stepwise with a predetermined stroke in the Y-axis direction (respectively refer to FIG. 1 black arrow).

FIG. 2 is a block diagram showing the relationship between the input and output of the main control device 90 that overall controls the components of the liquid crystal exposure device 10 . As shown in FIG. 2 , the liquid crystal exposure apparatus 10 includes an illumination system 20 , a mask stage device 30 , a projection optical system 40 , a substrate stage device 50 , an alignment system 60 , and the like.

The lighting system 20 includes a lighting system main body 22 such as a light source (for example, a mercury lamp) including illumination light IL (see FIG. 1 ). During the scanning exposure operation, the main control device 90 controls the drive system 24 including, for example, a linear motor, etc., so as to scan and drive the illumination system body 22 in the X-axis direction with a predetermined long stroke. The main control device 90 obtains the position information of the lighting system body 22 in the X-axis direction through the measuring system 26 including, for example, a linear encoder, and performs position control of the lighting system body 22 based on the position information. In this embodiment, g-line, h-line, i-line, etc. are used as illumination light IL, for example.

The mask stage device 30 includes a stage body 32 holding a mask M. As shown in FIG. The stage body 32 can be moved in appropriate steps in the X-axis direction and the Y-axis direction by a drive system 34 including a linear motor, for example. When the X-axis direction is a stepping operation for changing the partitioned area of the exposure object, the main control device 90 controls the driving system 34 to step-drive the stage body 32 in the X-axis direction. Also, as will be described later, during the stepping motion of the area (position) for scanning exposure in the Y-axis direction to change the area (position) of the exposure target, the main control device 90 controls the drive system 34 to move the stage body 32 step by step. Drive in the direction of the Y axis. The driving system 34 can drive the mask M appropriately and slightly in the direction of 3 degrees of freedom (X, Y, θz) in the XY plane during the alignment operation described later. The positional information of the mask M is obtained by the measurement system 36 including a linear encoder, for example.

The projection optical system 40 includes a projection system main body 42 including an optical system for forming an erect image of a mask pattern on a substrate P (see FIG. 1 ) at equal magnification. The projection system body 42 is disposed in a space formed between the substrate P and the mask M (see FIG. 1 ). During the scanning exposure operation, the main control device 90 scans and drives the projection system body 42 with a predetermined long stroke in the X-axis direction by controlling the drive system 44 including a linear motor, etc. in synchronization with the illumination system body 22 . The main control device 90 obtains the position information of the projection system body 42 in the X-axis direction through the measurement system 46 including a linear encoder, etc., and controls the position of the projection system body 42 according to the position information.

Returning to FIG. 1 , in the liquid crystal exposure device 10 , when the illumination area IAM on the mask M is illuminated with the illumination light IL from the illumination system 20 , the illumination light IL passing through the mask M passes through the projection optical system 40 to illuminate the area IAM. The projection image (partial erect image) of the mask pattern in the area IAM is formed on the substrate P in the irradiation area (exposure area IA) of the illumination light IL conjugated to the illumination area IAM. And relative to the mask M and the substrate P, the illumination light IL (the illumination area IAM and the exposure area IA) is relatively moved in the scanning direction to perform a scanning exposure operation. That is, in the liquid crystal exposure device 10, the illumination system 20 and the projection optical system 40 are used to generate the pattern of the mask M on the substrate P, and the sensing layer (resist layer) on the substrate P is exposed by the illumination light IL, The pattern is formed on the substrate P. As shown in FIG.

Here, in this embodiment, the illumination area IAM generated on the mask M by the illumination system 20 includes a pair of rectangular areas separated in the Y-axis direction. The Y-axis length of a rectangular area is set as, for example, 1/4 of the Y-axis length of the pattern surface of the mask M (that is, the Y-axis length of each partitioned area set on the substrate P). Also, the distance between a pair of rectangular regions is similarly set to, for example, 1/4 of the length of the pattern surface of the mask M in the Y-axis direction. Therefore, the exposure area IA formed on the substrate P also includes a pair of rectangular areas separated in the Y-axis direction. In this embodiment, in order to completely transfer the pattern of the mask M to the substrate P, although it is necessary to perform a second scanning exposure operation for a divided area, it has the advantage of reducing the size of the illumination system body 22 and the projection system body 42 . A specific example of the scanning exposure operation will be described later.

The substrate stage device 50 has a stage body 52 holding the back surface of the substrate P (the surface opposite to the exposure surface). Returning to FIG. 2 , when changing the stepping motion of the partitioned area of the exposure object in the Y-axis direction, the main control device 90 drives the stage body 52 stepping in the Y-axis direction by controlling the drive system 54 including, for example, a linear motor. . The driving system 54 can drive the substrate P slightly in the direction of 3 degrees of freedom (X, Y, θz) in the XY plane during the substrate alignment operation described later. The positional information of the board|substrate P (stage main body 52) is calculated|required by the measuring system 56 containing a linear encoder etc., for example.

Returning to FIG. 1 , the alignment system 60 includes, for example, two alignment microscopes 62 and 64 . The alignment microscopes 62 and 64 are arranged in the space formed between the substrate P and the mask M (the position between the substrate P and the mask M in the Z-axis direction), and detect the alignment marks Mk formed on the substrate P ( Hereinafter, only the mark (Mk) and the mark (not shown) formed in the mask M are called. In the present embodiment, one mark Mk is respectively formed near the four corners of each divisional area (one divisional area, for example, four), and the mark of the mask M is formed at a position corresponding to the mark Mk through the projection optical system 40. Location. Moreover, the number and position of the mark Mk and the mask M are not limited to this, It can change suitably. In addition, in each drawing, the mark Mk is shown larger than actual for easy understanding.

One of the alignment microscopes 62 is arranged on the +X side of the projection system body 42 , and the other alignment microscope 64 is arranged on the −X side of the projection system body 42 . The alignment microscopes 62 and 64 each have a pair of detection fields of view (detection areas) separated in the Y-axis direction, and can simultaneously detect, for example, two markers Mk separated in the Y-axis direction in one divisional area.

Moreover, the alignment microscopes 62 and 64 can detect the marks formed on the mask M and the marks Mk formed on the substrate P simultaneously (in other words, without changing the positions of the alignment microscopes 62 and 64 ). The main control device 90, for example, calculates the relative positional deviation between the mark formed on the mask M and the mark Mk formed on the substrate P every time the mask M performs an X stepping motion or the substrate P performs a Y stepping motion. information, and perform relative positioning of the substrate P and the mask M along the XY plane, so as to correct the positional deviation (offset, or reduce). In addition, the alignment microscopes 62 and 64 are integrally composed of a mask detection unit for detecting (observing) the mark of the mask M, and a substrate detection unit for detecting (observing) the mark Mk of the substrate P through a common box, etc. Driven by the drive system 66 through the common box. Alternatively, the mask inspection section and the substrate inspection section may be composed of separate boxes. In this case, it is preferable to configure such that, for example, the mask inspection section and the substrate inspection section can operate in the same manner through a substantially common drive system 66. Action characteristics to move the mask M.

The main control device 90 (refer to FIG. 2 ) independently drives the alignment microscopes 62 and 64 in the X-axis direction with a predetermined long stroke by controlling the drive system 66 including, for example, a linear motor. In addition, the main control device 90 obtains the position information of the respective X-axis directions of the collimating microscopes 62 and 64 through the measuring system 68 including, for example, linear encoders, etc., and independently performs the collimating of the microscopes 62 and 64 according to the position information. position control. In addition, the projection system body 42 and the alignment microscopes 62 and 64 have almost the same positions in the Y-axis direction, and their movable ranges partially overlap each other.

Here, although the alignment microscopes 62, 64 of the alignment system 60 and the projection system body 42 of the above-mentioned projection optical system 40 are physically (mechanically) independent (separated) elements, they are controlled by the main control device 90 (see FIG. 2 ). Drive (speed, and position) control in a manner independent of each other, but the drive system 66 for driving the alignment microscope 62, 64 and the drive system 44 for driving the projection system body 42 share the drive system in the X-axis direction such as a linear motor, A part of the linear guide etc., the driving characteristics of the alignment microscopes 62, 64 and the projection system body 42, or the control characteristics performed by the main control device 90 are substantially the same.

Specifically, for example, when the collimating microscopes 62, 64 and the projection system body 42 are respectively driven in the X-axis direction by a moving-coil linear motor, the above-mentioned drive system 66 and the drive system 44 share the magnetic field of the stator. Body (such as permanent magnet, etc.) unit. In contrast, the movable sub-coil unit is independently provided for the alignment microscopes 62, 64, and the projection system body 42, and the main control device 90 (refer to FIG. 2 ) independently controls the pair of coil units by individually supplying power to the coil units. The driving (speed and position) of the quasi-microscopes 62 and 64 towards the X-axis direction, and the driving (speed and position) of the projection system body 42 towards the X-axis direction. Therefore, the main control device 90 can change (arbitrarily change) the distance (distance) between the alignment microscopes 62 , 64 and the projection system body 42 in the X-axis direction. In addition, the main control device 90 can also move the collimating microscopes 62 , 64 and the projection system body 42 at different speeds in the X-axis direction.

The main control device 90 (refer to FIG. 2 ) detects the plurality of marks Mk formed on the substrate P by using the alignment microscope 62 (or the alignment microscope 64). The whole wafer enhanced alignment (EGA) method calculates the arrangement information (including information related to the position (coordinate value), shape, etc.) of the divisional area where the mark Mk of the detection object is formed.

Specifically, in the scanning exposure operation, when the projection system body 42 is driven in the +X direction, the main controller 90 (see FIG. 2 ) uses the +X direction arranged on the projection system body 42 before the scanning exposure operation. The alignment microscope 62 on the side detects the position of a plurality of marks Mk to calculate the arrangement information of the divisional area of the exposure object. Also, in the scanning exposure operation, when the projection system body 42 is driven in the -X direction, before the scanning exposure operation, a plurality of markings are performed using the alignment microscope 64 arranged on the -X side of the projection system body 42 The position detection of Mk is used to calculate the arrangement information of the division area of the exposure object. Based on the calculated arrangement information, the main controller 90 performs precise positioning of the substrate P in the 3-degree-of-freedom direction in the XY plane (substrate alignment operation), and appropriately controls the illumination system 20 and the projection optical system 40 to perform object division. Area scanning exposure operation (transfer of mask pattern).

Next, the measurement system 46 (refer to FIG. 2 ) for obtaining the position information of the projection system body 42 possessed by the projection optical system 40 and the measurement for obtaining the position information of the alignment microscope 62 possessed by the alignment system 60 will be described. The specific composition of the line 68.

As shown in FIG. 3 , the liquid crystal exposure device 10 has a guide 80 for guiding the projection system body 42 in the scanning direction. The guide 80 is constituted by a member extending parallel to the scanning direction. The guide 80 also has the function of guiding the movement of the alignment microscope 62 in the scanning direction. In addition, in FIG. 7 , although the guide 80 is shown between the mask M and the substrate P, actually, the guide 80 is arranged at a position avoiding the optical path of the illumination light IL in the Y-axis direction.

A scale 82 including at least a reflective diffraction grating whose periodic direction is in a direction parallel to the scanning direction (X-axis direction) is fixed to the guide 80 . Also, the projection system body 42 has a head 84 arranged to face the scale 82 . In this embodiment, an encoder system is formed in which the scale 82 and the head 84 constitute the measurement system 46 (see FIG. 2 ) for obtaining position information of the projection system main body 42 . In addition, the alignment microscopes 62 and 64 each have a head 86 arranged to face the scale 82 (the alignment microscope 64 is not shown in FIG. 3 ). In the present embodiment, an encoder system is formed in which the scale 82 and the head 86 constitute the measurement system 68 (see FIG. 2 ) for obtaining positional information of the alignment microscopes 62 and 64 . Here, the read heads 84 and 86 can respectively irradiate the encoder measurement beam to the scale 82, receive the beam passing through the scale 82 (reflected beam on the scale 82), and output the relative position information to the scale 82 according to the received light result.

As mentioned above, in this embodiment, the scale 82 constitutes the measurement system 46 (refer to FIG. 2 ) for obtaining the position information of the projection system body 42 , and also constitutes a system for obtaining the position information of the alignment microscopes 62 and 64 . Measurement system 68 (see FIG. 2 ). That is, the position of the projection system body 42 and the alignment microscopes 62 and 64 is controlled based on a common coordinate system (measurement axis) set by the diffraction grating formed on the scale 82 . Also, the driving system 44 (referring to FIG. 2 ) used to drive the projection system body 42 and the driving system 66 (referring to FIG. 2 ) used to drive the alignment microscopes 62 and 64 can have some elements in common or can be completely independent. Elements make up.

In addition, the encoder system constituting the measurement systems 46 and 68 may be a linear (1DOF) encoder system in which the length-measuring axis is only in the X-axis direction (scanning direction), for example, or may have a plurality of length-measuring axes. For example, by arranging a plurality of read heads 84 and 86 at predetermined intervals in the Y-axis direction, the amount of rotation in the θz direction of the projection system body 42 and the alignment microscopes 62 and 64 can be obtained. Also, a 3DOF encoder system may be formed in which an XY 2-dimensional diffraction grating is formed on the scale 82 and has a length-measuring axis in the 3-degree-of-freedom directions of the X, Y, and θz directions. Furthermore, a plurality of known two-dimensional read heads that can measure length in a direction perpendicular to the scale surface in addition to the periodic direction of the diffraction grating can also be used as the read heads 84 and 86 to obtain the projection system body 42 . Position information of the 6-DOF directions of the alignment microscopes 62 and 64 .

Next, an example of the operation of the liquid crystal exposure apparatus 10 at the time of scanning exposure operation is demonstrated using FIG.4(a) - FIG.7(c). The following exposure operation (including the alignment measurement operation) is performed under the management of the main controller 90 (not shown in FIG. 4( a ) to FIG. 7( c ). Refer to FIG. 2 .

In the present embodiment, the first divisional area in the exposure order (hereinafter, referred to as the first shot area S ₁ ) is set on the -X side and the -Y side of the substrate P. As shown in FIG. In addition, symbols S ₂ to S ₄ assigned to the partitioned regions on the substrate P represent the shot regions whose exposure sequence is the second to the fourth, respectively.

As shown in FIG. 4( a ), before exposure starts, each of the projection system body 42 and the collimating microscopes 62 and 64 is arranged at an initial position set on the -X side of the first irradiation region _S1 in plan view. At this time, the projection system body 42 and the alignment microscopes 62 and 64 are arranged in close proximity to each other in the X-axis direction. Also, the position in the Y-axis direction of the detection field of view of the alignment microscope 62 almost coincides with the position in the Y-axis direction of the marks Mk formed in the first and fourth shot areas S ₁ and S ₄ .

Next, the main controller 90 drives the alignment microscope 62 in the +X direction as shown in _FIG . There are, for example, two marks Mk near the part (refer to the thick circle mark in Fig. 4(b). The same applies below). In addition, the main controller 90, as shown in FIG. 4(c), further drives the collimating microscope 62 in the +X direction to detect, among the four marks Mk formed in the first shot area _S1 , for example, those formed on the +X side. There are, for example, two marks Mk near the end. Also, in FIG. 4( b ), although the projection system body 42 is stopped, it can be detected that the mark Mk is being detected after the microscope 62 starts to detect the mark Mk in the first irradiation area _S1 . For example, the acceleration of the projection system body 42 starts while the marker Mk on the -X side is detected and then moves to the marker Mk on the +X side (specifically, immediately before the marker Mk on the +X side is detected).

The main controller 90 obtains the arrangement information of the first shot area _S1 based on the detection results (position information) of, for example, four marks Mk formed in the first shot area _S1 . The main control device 90, as shown in FIG. 4(d), performs precise positioning of the substrate P in the 3-degree-of-freedom direction in the XY plane (substrate alignment operation) based on the arrangement information of the first shot area _S1 . The projection system body 42 and the illumination system body 22 of the illumination system 20 (not shown in FIG. 4( d ). Refer to FIG. 1 ) are synchronously driven in the +X direction to perform the first scanning exposure on the first irradiation area _S1 .

In addition, the main controller 90, in parallel with _the start of the first scanning exposure operation on the first shot area _S1 , uses the alignment microscope ₆₂ to detect the Among the four marks Mk in the division area), for example, two marks Mk are formed near the end on the -X side.

The main control device 90 can be based on the newly acquired detection results of, for example, two markers Mk in the fourth irradiation area _S4 , and the previously obtained (stored in a memory device not shown in the figure) in the first irradiation area _S1 For example, for the detection results of 4 markers, EGA calculation is performed to update the arrangement information of the first irradiated area S ₁ . The main controller 90 can continue the scanning exposure operation of the first shot area _S1 while properly performing precise positioning in the 3-degree-of-freedom direction in the XY plane of the substrate P based on the updated arrangement information. In order to obtain the arrangement information of the first shot region _S1 , using the mark position information in the fourth shot region _S4 is compared with obtaining the arrangement information only based on the four marks Mk provided in the first shot region _S1 . It is possible to obtain alignment information that takes into account statistical trends over a wide range, thereby improving alignment accuracy with respect to the first shot region _S1 .

Moreover, the main controller 90, as shown in FIG. 5(a), drives the projection system body 42 in the +X direction to perform scanning exposure operation, and further drives the alignment microscope 62 in the +X direction to detect Of the, for example, four marks Mk in the region _S4 , for example, two marks Mk are formed near the end on the +X side. The main control device 90 can be based on the newly acquired detection results of, for example, two markers Mk in the fourth irradiation region _S4 , and the previously acquired markers Mk (in this example, for example, four markers in the first irradiation region _S1 ). EGA calculation is performed on the detection results of the mark Mk and, for example, two marks Mk) in the fourth shot region _S4 to update the arrangement information of the first shot region _S1 . The main controller 90 can continue the scanning exposure operation of the first shot area _S1 while performing precise positioning in the 3-degree-of-freedom direction in the XY plane of the substrate P based on the updated arrangement information.

As mentioned above, in this embodiment, the alignment microscope 62 arranged in front of the scanning direction (+X direction) relative to the projection system body 42 can be used to simultaneously (parallel) detect the exposure area IA (illumination light IL) formed in the scanning area. At least a part of the operation of the marker Mk in the forward direction (+X direction) and the scanning exposure operation of scanning the projection system main body 42 in the +X direction. In this way, the time required for a series of operations including the alignment operation and the scanning exposure operation can be shortened. In addition, the main control device 90 can properly perform EGA calculation each time when sequentially measuring, for example, the marks Mk set at different positions, so as to update the arrangement information of the partitioned areas of the exposure object. According to this, the alignment accuracy of the divided area of the exposure object can be improved.

Moreover, when the main controller 90 drives the projection system body 42 in the +X direction for scanning exposure operation, it can arrange the alignment microscope 64 behind the projection system body 42 in the scanning direction (-X direction) to track Drive in the +X direction in the way of the projection system body 42 (refer to Fig. 5(a) and Fig. 5(b)). At this time, the main controller 90 can use the alignment microscope 64 to detect the mark Mk formed behind the exposure area IA (illumination light IL) in the scanning direction (−X direction), and use the detection result for EGA calculation.

As described above, in this embodiment, since the illumination area IAM (refer to FIG. 1 ) formed on the mask M and the exposure area IA formed on the substrate P are a pair of rectangular areas separated in the Y-axis direction, the The pattern image of the mask M transferred to the substrate P by one scanning exposure operation is formed in a pair of strip-shaped areas (half of the entire area of a divided area) separated in the Y-axis direction and extending in the X-axis direction.

Next, _the main control device 90, as shown in FIG. 5(b), moves the substrate P and the mask M stepwise in the -Y direction ( Refer to the black arrow in Figure 5(b)). The amount of step movement of the substrate P at this time is, for example, 1/4 of the length of one divisional area in the Y-axis direction. At this time, during the stepwise movement of the substrate P and the photomask M in the -Y direction, it is preferable to ensure that the relative positional relationship between the substrate P and the photomask M does not change (or in such a way that the relative positional relationship can be corrected). way) to make it better to move step by step.

In this embodiment, the second scanning exposure operation of the first shot area _S1 is performed by moving the projection system main body 42 in the −X direction as shown in FIG. 5( c ). The main controller 90 drives the alignment microscope 64 in the −X direction to detect, for example, a mark Mk (not shown) formed in the vicinity of the +X side end in the first shot region _S1 . The main controller 90 executes the first shot area _S1 while performing precise positioning in the direction of three degrees of freedom in the XY plane of the substrate P based on the detection result of the alignment microscope 64 and the arrangement information of the first shot area _S1. The second scanning exposure action. Accordingly, as shown in FIG. 5(d), the mask pattern transferred by the first scanning exposure operation and the mask pattern transferred by the second scanning exposure operation are in the first shot area _S1 In inner bonding, the entire pattern of the mask M is transferred to the first shot area S ₁ . In addition, for the alignment operation of the second scanning exposure corresponding to the first shot area _S1 , it is only necessary to measure the XY plane in accordance with the marks of the mask M and the marks Mk of the substrate P at two points (+X side marks). The position deviation in the 3 degrees of freedom (X, Y, θz) direction can substantially shorten the time required for alignment compared with the first alignment action.

When the scanning exposure on _the first shot area _S1 ends _, the main controller 90 makes the substrate After P moves in steps in the -Y direction, the scanning exposure to the second shot area _S2 is performed in the same procedure as the above-mentioned scanning exposure operation on the first shot area _S1 .

That is, the first scanning exposure operation on the second shot area S ₂ is based on the second shot area S ₂ and the third shot area S ₃ detected by the alignment microscope 62 as shown in FIG. 6( a ). (The divisional area on the +X side of the second shot area _S2 ) The detection result of the mark Mk in the second shot area S2 is obtained to obtain the arrangement information of the second shot area _S2 , and the 3-degree-of-freedom direction in the XY plane of the substrate P is carried out according to the arrangement information. Precision positioning. Wherein, the detection operation of the marks Mk in the third shot region _S3 (and the update of the arrangement information) and at least a part of the scanning exposure operation on the second shot region _S2 are performed in parallel. Moreover, the main controller 90 detects, for example, the _mark Mk ( not shown). The main control device 90 performs precise positioning in the direction of 3 degrees of freedom in the XY plane of the substrate P based on the detection result of the alignment microscope 64 and the arrangement information of the second irradiation area _S2 , as shown in FIG. 6(b) , while moving the projection system body 42 in the −X direction, the second scanning exposure operation for the second shot region _S2 is performed.

When the scanning exposure of the second shot area _S2 ends, the main controller 90 moves the mask M (see FIG. 1 ) in steps in the +X direction, so that the third shot on the mask M and the substrate P Area S ₃ is opposite. The main controller 90 detects, for example, the mark Mk formed near the -X side end in the third shot area _S3 with the collimating microscope 62 . In this state, the main controller 90 performs the first scanning exposure operation on the third shot area _S3 while moving the projection system body 42 in the +X direction as shown in FIG. 6( c ). The alignment (precise positioning of the substrate P) control at this time is performed depending on the arrangement information of the third shot region _S3 and the detection result of the alignment microscope 62 . The arrangement information of the third shot region _S3 is calculated based on the positions of the marks Mk in the second and third shot regions S2 _{and S3} obtained when the second shot region _S2 is exposed, and is placed in the alignment microscope 62 , it is only necessary to measure the ₃ degrees of freedom in the XY plane according to the mark of the mask M and the mark Mk of the substrate P in the state where the third shot area S3 is arranged opposite to the mask M ( The position deviation in X, Y, θz) direction is enough. Therefore, compared with the alignment of the second shot area _S2 , the time required for the alignment of the third shot area _S3 can be substantially shortened.

Thereafter, the main controller 90 moves the substrate P and the mask M stepwise in the +Y direction as shown in _FIG . Accordingly, the position in the Y-axis direction of the detection field of view of the alignment microscope 64 and the position in the Y-axis direction of the marks Mk formed in the second and third shot regions S ₂ and S ₃ almost coincide.

The main control device 90 performs the same procedure as the above-mentioned first scanning exposure operation on the first shot area _S1 (except that the alignment microscope used for the detection of the mark Mk is different) to perform the exposure on the third shot area _S3 . The second scanning exposure action. That is to say, the main control device 90 performs the second scanning exposure operation on the third shot area _S3 , as shown in FIG. For example, four marks Mk in the area _S3 , depending on the detection result, the main control device 90 updates the arrangement information of the third irradiation area _S3 . The main controller 90 performs the scanning exposure operation on the third shot region _S3 while performing precise positioning in the 3-degree-of-freedom direction in the XY plane of the substrate P based on the updated arrangement information. In parallel with this scanning exposure operation, the microscope 64 is aligned, and as shown in FIG. 7( c ), for example, four marks Mk formed in the second shot region _S2 are detected. The main control device 90 updates the arrangement information of the third shot region _S3 based on the newly acquired position information of the mark Mk, and concurrently performs the second scanning exposure operation on the third shot region _S3 .

Hereinafter, although not shown, the main controller 90 performs scanning exposure to the fourth shot area _S4 while appropriately performing the Y stepping operation of the substrate P. The scanning exposure operation for the fourth shot region _S4 is substantially the same as the scanning exposure operation for the third shot region _S3 , and therefore description thereof will be omitted.

In addition, during the scanning exposure operation of the third and fourth shot areas _S3 and _S4 , the alignment microscope 62 can be used together with the alignment microscope 64 to detect the mark Mk, and the alignment microscope 62 and 64 can be used together Output the arrangement information of the updated division area. In addition, when obtaining the arrangement information of the divisional areas for exposing the divisional areas after the second shot area _S2 , the position information of the mark Mk previously obtained for exposing the divisional areas can be used. Specifically, for example, when obtaining the arrangement information of the fourth shot area _S4 , although the main control device 90 uses the position information of the marks Mk in the first and fourth shot areas _S1 , _S4 , it can also be used in conjunction with this The position information of the marker Mk in the second and third shot areas S ₂ and S ₃ obtained earlier is also used.

According to the present embodiment described above, since the alignment microscopes 62 and 64 are separated from the projection system body 42 and move in the scanning direction independently, at least part of the scanning exposure operation and the alignment operation can be performed simultaneously (parallel). Accordingly, the time required for a series of operations including an alignment operation and a scanning exposure operation, that is, a series of processing times (production time) required for exposure processing of the substrate P can be shortened.

Also, since the alignment microscopes 62, 64 are respectively arranged on one side and the other side of the projection system body 42 in the scanning direction, it can be independent of the scanning direction (forward scanning and reciprocating scanning) during the scanning exposure operation, shortening The time required for a series of actions including the alignment action and the scanning exposure action.

"Second Embodiment" Next, the liquid crystal exposure apparatus of 2nd Embodiment is demonstrated using FIG.8(a) - FIG.8(d). The structure of the liquid crystal exposure apparatus of the second embodiment is the same as that of the above-mentioned first embodiment except for the structure and operation of the alignment system. Therefore, only the differences will be described below, and the differences from the above-mentioned first embodiment will be described. Elements having the same configuration and function are given the same reference numerals as those of the above-mentioned first embodiment, and their descriptions are omitted.

In the above-mentioned first embodiment, alignment microscopes 62 and 64 (refer to FIG. 1 ) are respectively arranged in front and rear (+X side and −X side) of the projection system main body 42 in the scanning direction (see FIG. 1 ). Among them, as shown in FIG. 8( a ), an alignment microscope 162 is provided only on the +X side of the projection system body 42 .

Also, compared to the alignment microscopes 62 and 64 of the first embodiment described above, which have a pair of detection fields separated in the Y-axis direction (see FIG. 4(b) etc.), the alignment microscope 162 has a separation in the Y-axis direction. For example, 4 detection fields of view. The intervals between, for example, four detection fields of view included in the alignment microscope 162 are set so that they can simultaneously detect marks Mk straddling, for example, two divisional regions formed adjacently in the Y-axis direction.

In the second embodiment, the main controller 90 (see FIG. 2 ), as shown in FIG. 8( b ) and _FIG . 162 is driven in the +X direction while detecting a total of, for example, 16 marks Mk formed on the substrate P. According to the detection results of the marks Mk, the arrangement information of the first shot area _S1 is obtained, and the substrate P is inspected based on the arrangement information. While controlling the precise position, the projection system body 42 is driven in the +X direction as shown in _FIG .

In the second embodiment, since the alignment microscope 162 has, for example, four detection fields of view in the Y-axis direction, by moving the alignment microscope 62 once in the +X direction, it is possible to detect the defects formed in a wider range of the substrate P. Mark Mk (in this second embodiment, all marks Mk). Therefore, compared with the first embodiment, a series of processing time (production time) required for the exposure processing of the substrate P can be further shortened.

In this second embodiment, as in the above-mentioned first embodiment, the Y stepping motion of the substrate P and/or the X stepping motion of the mask M (refer to FIG. 1 ) are performed to expose the object. The movement of the division area. Also, in the second embodiment, since all the marks Mk formed on the substrate P are detected before the scanning exposure of the first shot area _S1 , it is not necessary to perform the scanning exposure again after the second shot area _S2 . EGA calculations. Of course, alignment measurement (EGA calculation) can also be performed again during the scanning exposure after the second shot area S ₂ to update the arrangement information of each divisional area.

"Third Embodiment" Next, the liquid crystal exposure apparatus of 3rd Embodiment is demonstrated using FIG.9(a) and FIG.9(b). The structure of the liquid crystal exposure apparatus of the third embodiment is the same as that of the above-mentioned first embodiment except for the structure and operation of the alignment system. Therefore, only the differences will be described below, and the differences from the above-mentioned first embodiment will be described. Elements having the same configuration and function are given the same reference numerals as those of the above-mentioned first embodiment, and their descriptions are omitted.

In the above-mentioned first embodiment, the alignment system 60 has the alignment microscopes 62 and 64 in the front and rear (+X side and −X side) of the projection system body 42 in the scanning direction, but the difference in the third embodiment That is, the alignment microscope 62 is provided only on the +X side of the projection system body 42 .

In the third embodiment, the main controller 90 (see FIG. 2 ) returns the alignment microscope 62 and the projection system body 42 to predetermined initial positions when the substrate P is Y-stepped relative to the projection system body 42 . Specifically, for example, as shown in FIG. 9( a ), when the scanning exposure operation of the first shot area _S1 ends, the main controller 90 , as shown in FIG. 9( b ), similarly to the above-mentioned first embodiment, The board|substrate P is made to move Y step in -Y direction (refer black arrow in FIG.9(b)).

In addition, the main control device 90, in parallel with the Y stepping motion of the above-mentioned substrate P to the -Y direction, respectively drives the collimating microscope 62 and the projection system body 42 in the -X direction to make them return (refer to Figure 9(b) white arrow) to the initial position (refer to Figure 4(a)). In the present embodiment, the initial positions of the alignment microscope 62 and the projection system body 42 are near the −X side ends of their respective movable ranges. Afterwards, the main control device 90 drives the collimating microscope 62 and the projection system body 42 in the +X direction, respectively, so as to perform the second scanning exposure operation on the first shot region _S1 . In addition, before the second scanning exposure operation, the alignment microscope 62 may be used to detect the marks Mk formed on the substrate P, and the arrangement information of the first shot region _S1 may be updated according to the output.

According to the third embodiment, even if there is only one collimating microscope 62, the same effect as that of the above-mentioned first embodiment can be obtained.

In addition, the configurations of the first to third embodiments described above can be appropriately changed. For example, in the above-mentioned second embodiment, as in the above-mentioned first embodiment, the alignment microscope 162 can be arranged on both sides (+X side and −X side) of the projection system body 42 in the scanning direction. In this case, alignment measurement can be performed before the projection system body 42 moves even if the scanning direction is the -X direction.

Also, in the above-mentioned first embodiment, although the scanning exposure operation of the first shot area S1 is started after the detection of all the marks Mk in the first shot area _S1 is completed, it is not limited thereto, _and may be formed in the first shot area S1. In the measurement of the plurality of marks Mk in the shot area _S1 , the scanning exposure operation of the first shot area _S1 is started.

Also, in the above-mentioned embodiments, although the alignment measurement operation and the scanning exposure operation are performed in parallel on a single substrate P, they are not limited thereto. For example, two substrates P may be prepared, and one of the substrates P may be subjected to scanning exposure, Alignment measurement on the other substrate P is performed on one side.

Also _, in each of the above-mentioned embodiments, after the scanning exposure of the first shot area _S1 , the scanning exposure of the second shot area _S2 set on the +Y (upper) side of the first shot area S1 is performed. It is not limited to this, and the scanning exposure to the _4th shot area _S4 may be performed next to the scanning exposure of the 1st shot area S1. In this case, by using, for example, a mask facing the first shot region _S1 and a mask facing the fourth shot region _S4 (a total of two masks), the first and fourth shot regions S ₁ and S ₄ perform scanning exposure continuously. Moreover, after the scanning exposure of the _1st shot area S1, you may make the mask M move stepwise to + X direction, and may perform the scanning exposure of the _4th shot area S4.

In addition, in each of the above-mentioned embodiments, although the mark Mk is formed in each divisional area (first to fourth irradiation areas S ₁ to S ₄ ), it is not limited thereto, and may be formed in an area between adjacent divisional areas ( The so-called scribe line).

Also, in each of the above-mentioned embodiments, although a pair of illumination area IAM and exposure area IA separated in the Y-axis direction are respectively generated on the mask M and substrate P (refer to FIG. 1 ), the illumination area IAM and exposure area IA The shape and length are not limited to this, and can be changed appropriately. For example, the Y-axis lengths of the illumination area IAM and the exposure area IA can be equal to the Y-axis lengths of the pattern surface of the mask M and a partitioned area on the substrate P, respectively. In this case, the transfer of the mask pattern is completed by performing one scan exposure operation for each divisional area. Alternatively, the illumination area IAM and the exposure area IA may be an area whose length in the Y-axis direction is half of the length in the Y-axis direction of the pattern surface of the mask M and a partitioned area on the substrate P, respectively. In this case, as in the above-mentioned embodiment, it is necessary to perform scanning exposure operation twice for one partitioned area.

In addition, as in the above-mentioned embodiment, in order to form one mask pattern in a divisional area, when the projection system body 42 is reciprocated to perform splicing exposure, it is possible to align the forward and backward paths with different detection fields of view. The microscope is arranged in front of and behind the projection system body 42 in the scanning direction (X direction). In this case, for example, the mark Mk at the four corners of the division area can be detected using an alignment microscope for the forward route (for the first exposure operation), and the mark Mk near the junction can be detected using an alignment microscope for the return route (for the second exposure operation) . Here, the junction part refers to the junction part of the area exposed by the scanning exposure of the previous path (pattern transfer area) and the area exposed by the scanning exposure of the return path (pattern transfer area). As the mark Mk in the vicinity of the bonding portion, the mark Mk may be formed on the substrate P in advance, or an exposed pattern may be used as the mark Mk. In each of the above-mentioned embodiments, when the projection system body 42 is driven in the +X direction to perform the scanning exposure operation, the alignment microscope for the forward path is the alignment microscope 62 , and the alignment microscope for the return path is the alignment microscope 64 . In addition, when the projection system body 42 is driven in the −X direction to perform a scanning exposure operation, the alignment microscope for the forward path is aligned with the microscope 64 , and the alignment microscope for the return path is aligned with the microscope 62 .

Also, in the above-mentioned embodiment (and the first and second modified examples), although the drive system 24 for driving the illumination system body 22 of the illumination system 20 and the stage body 32 for driving the photomask stage device 30 The drive system 34 for driving the projection optical system body 42 of the projection optical system 40, the drive system 44 for driving the stage body 52 of the substrate stage device 50, and the drive system 54 for driving the alignment system 60 The driving system 66 (respectively referring to FIG. 2 ) of the alignment microscope 62 has been described in the case of a linear motor, but is used to drive the above-mentioned illumination system body 22, stage body 32, projection optical system body 42, stage body 52 and The type of the actuator for aligning the microscope 62 is not limited thereto, and can be appropriately changed. For example, various actuators such as a feed screw (ball screw) device and a belt drive device can be appropriately used.

Also, in the above-mentioned embodiments, although the projection system body 42 and the alignment microscope 62 share a part of the driving system in the scanning direction (such as linear motors, guides, etc.), as long as the projection system body 42 and the alignment microscope 62 can be individually driven The microscope 62 is not limited thereto, and the driving system 66 for driving the alignment microscope 62 and the driving system 44 for driving the projection system body 42 of the projection optical system 40 can be completely independent structures. That is, like exposure apparatus 10A shown in FIG. The driving system 66 used to drive the alignment microscope 62 (for example, includes a linear motor, guides, etc.) and the driving system 44 (for example, including a linear motor, guides, etc.) for driving the projection system body 42 are completely independent components. In this case, the alignment measurement of the divided area to be exposed is performed by moving the substrate P stepwise (reciprocating) in the Y-axis direction before the scanning exposure operation of the divided area to be exposed is started. Also, like the exposure apparatus 10B shown in FIG. The driving system 66 (for example, including linear motors, guides, etc.) of the alignment microscope 62 in the driving alignment system 60B is arranged so that the Y position does not overlap, so that the driving system 44 and the driving system 66 are completely independent.

Also, in the above-mentioned embodiments, although the measurement system 26 for measuring the position of the illumination system body 22 of the illumination system 20 and the measurement system for measuring the position of the stage body 32 of the photomask stage device 30 are 36. A measuring system 46 for measuring the position of the projection optical system body 42 of the projection optical system 40, a measuring system 56 for measuring the position of the stage body 52 of the substrate stage device 50, and for alignment The measuring system 68 (respectively referring to FIG. 2 ) for measuring the position of the alignment microscope 62 of the system 60 has been described in the case of including a linear encoder, but it is used for the above-mentioned illumination system body 22, stage body 32, and projection system projection. The type of the measurement system for measuring the position of the optical system body 42, the stage body 52, and the alignment microscope 62 is not limited thereto, and can be appropriately changed. various measurement systems.

Here, the illumination system 20, the mask stage device 30, the projection optical system 40, the substrate stage device 50, and the alignment system 60 can be modularized. Hereinafter, the illumination system 20 is referred to as the illumination system module 12M, the mask stage device 30 is referred to as the mask stage module 14M, the projection optical system 40 is referred to as the projection optical system module 16M, and the substrate stage device 50 is referred to as the substrate stage module. Group 18M and alignment system 60 are called alignment system module 20M. Hereinafter, although they are appropriately referred to as "the modules 12M to 20M", they are physically arranged independently of each other by being mounted on the corresponding racks 28A to 28E.

Therefore, as shown in FIG. 12 , in the liquid crystal exposure device 10 , any (one or more) of the above-mentioned modules 12M to 20M (in FIG. 12 , for example, the substrate stage module 18M) can be used , to be replaced independently of other mods. At this time, the module to be replaced is replaced integrally with the stands 28A to 28E (the stand 28E in FIG. 12 ) supporting the module.

During the replacement of the modules 12M to 20M, the modules 12M to 20M (and the stands 28A to 28E supporting the modules) to be replaced move in the direction of the X axis along the surface of the ground 26 . Therefore, it is preferable to install, for example, wheels or air-floating devices that can be easily moved on the ground 26 on the platforms 28A-28E. As mentioned above, in the liquid crystal exposure apparatus 10 of this embodiment, since arbitrary modules among each module 12M-20M can be separated easily individually from another module, it is excellent in maintainability. Also, in FIG. 12 , although the substrate stage module 18M is shown to move in the +X direction (inside the paper surface) relative to other elements (the projection optical system module 16M, etc.) together with the stand 28E, and to separate from other elements, However, the moving direction of the moving object module (and the stand) is not limited to this, for example, it may be the -X direction (front of the paper), or the +Y direction (upward of the paper). In addition, a positioning device for ensuring positional reproducibility after installation on the floor 26 of each of the mounts 28A to 28E may be provided. The positioning device can be installed on each of the stands 28A-28E, and can reproduce the installation position of each stand 28A-28E through the cooperative action of the members on the stands 28A-28E and the members on the ground 26.

In addition, since the liquid crystal exposure apparatus 10 of this embodiment is configured so that each of the above-mentioned modules 12M to 20M can be separated independently, each of the modules 12M to 20M can be upgraded individually. The so-called upgrading includes, for example, upgrading to cope with an increase in the size of the substrate P to be exposed, and also includes the case where the modules 12M to 20M are replaced with ones with better performance even though the substrates P are the same size.

Here, for example, when increasing the size of the substrate P, only the area of the substrate P (in this embodiment, the dimensions in the X-axis and Y-axis directions) becomes larger, and usually the thickness of the substrate P (dimensions in the Z-axis direction) becomes substantially larger. will not change. Therefore, for example, when upgrading the substrate stage module 18M of the liquid crystal exposure apparatus 10 in response to an increase in the size of the substrate P, as shown in FIG. As well as the stand 28G supporting the substrate stage module 18AM, although the dimension in the X-axis and/or Y-axis direction changes, the dimension in the Z-axis direction does not change substantially. Similarly, the size of the photomask stage module 14M will not substantially change in the Z-axis direction due to the upgrade in response to the upsizing of the photomask M.

Also, for example, in order to expand the illumination area IAM and the exposure area IA (refer to FIG. 1 etc. respectively), it is possible to increase the number of illumination optical systems in the illumination system module 12M and the projection lens modules in the projection optical system module 16M. The number of groups is used to upgrade the lighting system module 12M and the projection optical system module 16M respectively. Compared with the upgraded illumination system module and projection optical system module (both not shown in the figure), only the size of the X-axis and/or Y-axis direction changes, and the size of the Z-axis direction does not change substantially.

Therefore, in the liquid crystal exposure apparatus 10 of the present embodiment, the stands 28A-28E supporting the modules 12M-20M and the stands supporting the upgraded modules (refer to the stand 28G supporting the substrate stage module 18AM shown in FIG. 12 ), the size in the Z-axis direction is fixed. Here, the so-called fixed size means that the size of the Z-axis direction of the stand before replacement and the stand after replacement are the same, that is, the size of the Z-axis direction of the stand supporting modules with the same function is roughly constant. In this manner, in the liquid crystal exposure apparatus 10 of the present embodiment, since the dimensions in the Z-axis direction of the stages 28A to 28E are fixed, time for designing each module can be shortened.

In addition, in the liquid crystal exposure device 10, since the exposure surface of the substrate P and the pattern surface of the mask M are parallel to the direction of gravity (so-called tandem arrangement), the illumination system module 12M, the mask stage module The modules of 14M, projection optics module 16M, and substrate stage module 18M are arranged in a row on the ground 26 . In this way, since the above-mentioned modules do not have the effect of mutual self-weight, there is no need to overlap and arrange the substrate stage device, projection optical system, mask stage device, and illumination system corresponding to the above-mentioned modules, for example, in the direction of gravity. Like the conventional exposure device, a high-rigidity main frame (body) is provided to support various elements. In addition, due to the simple structure, the installation process of the device, the maintenance work of each module 12M to 20M, and the replacement work can all be carried out easily and in a short time. Moreover, since the above modules can be arranged along the floor 26, the height of the whole device can be reduced. In this way, the chamber for accommodating each of the above-mentioned modules can be miniaturized, and the cost can be reduced and the installation period can be shortened.

Also, in each of the above-mentioned embodiments, the light source used in the illumination system 20 and the wavelength of the illumination light IL irradiated from the light source are not particularly limited, and may be, for example, ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm) and other ultraviolet light, or F ₂ laser light (wavelength 157nm) and other vacuum ultraviolet light.

Also, in the above-mentioned embodiment, although the illumination system main body 22 including the light source is driven in the scanning direction, it is not limited to this, and the light source can also be fixed like the exposure device disclosed in JP-A-2000-12422, for example. Only the illumination light IL is scanned in the scanning direction.

In addition, the illumination area IAM and the exposure area IA are formed in a belt shape extending in the Y-axis direction in the above-mentioned embodiment, but they are not limited thereto. For example, as disclosed in US Patent No. 5,729,331, a plurality of zigzags can be arranged. combine the regions.

Also, in each of the above-mentioned embodiments, the mask M and the substrate P are arranged perpendicular to the horizontal plane (so-called column arrangement), but the invention is not limited to this, and the mask M and the substrate P may be arranged parallel to the horizontal plane. In this case, the optical axis of the illumination light IL is substantially parallel to the gravitational direction.

In addition, although the micro-positioning of the substrate P in the XY plane is performed based on the results of the alignment measurement during the scanning exposure operation, it is also possible to obtain the substrate P in parallel with this before the scanning exposure operation (or in parallel with the scanning exposure operation). The surface position information of P is used to control the surface position of the substrate P during the scanning exposure operation (so-called auto-focus control).

In addition, the use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display element to the square glass plate, and can be widely applied to, for example, the exposure device for the manufacture of organic EL (Electro-Luminescence) panels, and the manufacture of semiconductors. Exposure devices for manufacturing thin-film magnetic heads, microcomputers and DNA chips, etc. In addition, not only micro-elements such as semiconductor elements, but also applicable to the transfer of circuit patterns for the manufacture of photomasks or reticles used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, and electron beam exposure equipment. Exposure devices to glass substrates or silicon wafers, etc.

In addition, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer, a ceramic substrate, a film member, or a photomask mother board. In addition, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a sheet (a flexible sheet member). In addition, the exposure apparatus of this embodiment is particularly effective when the object to be exposed is a substrate having a side length or a diagonal length of 500 mm or more. Moreover, when the board|substrate of an exposure object is a sheet shape (sheet material) which has flexibility, this sheet material may be formed in roll form. In this case, without relying on the stepping motion of the stage device, it is possible to easily change (step and move) the divisional area of the exposure target relative to the illumination area (illumination light) by rotating (winding) the reel.

Electronic components such as liquid crystal display components (or semiconductor components) are processed through the steps of designing the functions and performance of the components, making a photomask (or reticle) according to the design steps, and making glass substrates (or wafers). Steps, the photolithography step of transferring the photomask (reticle) pattern to the glass substrate using the exposure device and the exposure method of each of the above-mentioned embodiments, the developing step of developing the exposed glass substrate, and the remaining photoresist Exposed members other than the part are manufactured by an etching step of removing by etching, a photoresist removal step of removing unnecessary photoresist after etching, an element assembly step, an inspection step, and the like. In this case, the above-mentioned exposure method is implemented in the lithography step using the exposure apparatus of the above-mentioned embodiment to form a device pattern on the glass substrate, so that high-density devices can be manufactured with good productivity. Industrial availability _

As described above, the exposure apparatus and method of the present invention are suitable for performing scanning exposure on an object. Moreover, the manufacturing method of the flat-panel display of this invention is suitable for the production of a flat-panel display. In addition, the device manufacturing method of the present invention is suitable for the production of micro devices.

10, 10A, 10B: Liquid crystal exposure device 12M: Illumination system module 14M: Mask stage module 16M: Projection optics system module 18M: Substrate stage module 18AM: Substrate stage module 20: Lighting system 20M: Alignment system module 22: illumination system body 28A-28G: platform 30: mask stage device 32: stage body 40, 40A, 40B: projection optical system 42: projection system body 44: drive system 46: measurement system 50 : substrate stage device 52: stage body 60, 60A, 60B: alignment system 62, 64: alignment microscope 66: drive system 80: guide 82: scale 84, 86: reading head IA: exposure area IAM: illumination Area IL: illumination light M: mask Mk: mark P: substrate S ₁ to S ₄ : irradiation area

[FIG. 1] It is a conceptual diagram of the liquid crystal exposure apparatus of 1st Embodiment. [FIG. 2] It is a block diagram showing the input-output relationship of the main control device comprised centering on the control system of the liquid crystal exposure apparatus of FIG. 1. [FIG. [FIG. 3] is a diagram for explaining the configuration of the projection system body and the measurement system aligned with the microscope. [ FIGS. 4( a ) to 4 ( d )] are diagrams (1 to 4 ) for explaining the operation of the liquid crystal exposure device during the exposure operation. [ FIGS. 5( a ) to 5 ( d )] are diagrams (5 to 8 ) for explaining the operation of the liquid crystal exposure device during the exposure operation. [ FIGS. 6( a ) to 6 ( c )] are diagrams (9 to 11 ) for explaining the operation of the liquid crystal exposure device during the exposure operation. [ FIGS. 7( a ) to 7 ( c )] are diagrams (12 to 15 ) for explaining the operation of the liquid crystal exposure device during the exposure operation. [FIG. 8(a)-FIG. 8(d)] It is a figure (1-4) for demonstrating the operation|movement of the alignment system of 2nd Embodiment. [FIG. 9(a) and FIG. 9(b)] are diagrams (1 and 2) for explaining the operation of the alignment system and the projection optical system of the third embodiment. [ Fig. 10 ] is a diagram showing a modified example (Part 1) of the projection optical system and the driving system of the alignment system. [ Fig. 11 ] is a diagram showing a modified example (Part 2) of the projection optical system and the driving system of the alignment system. [Fig. 12] is a conceptual diagram of module replacement of a liquid crystal exposure device.

10: Liquid crystal exposure device

20: Lighting Department

22: Lighting system body

30: Mask carrier device

40: Projection optics

42:Projection system body

50: Substrate carrier device

52: Carrier body

62, 64: Aligning the microscope

IA: Exposure Area

IAM: illuminated area

IL: illumination light

M: mask

Mk: Alignment Mark

P: Substrate

Claims (32)

An exposure device, which illuminates an object with illumination light through a projection optical system, and drives the projection optical system relative to the object for scanning exposure, which has: a mark detection unit, used for mark detection of marks provided on the object; The first drive system drives the mark detection unit; a second drive system for driving the projection optics system; and a control device for controlling the first and second drive systems in such a manner that the mark detection unit is driven before the projection optical system is driven; The mark detecting unit has a first detection device provided on one side of the projection optical system in a scanning direction in which the projection optical system is driven relative to the object, and a second detection device provided on the other side of the projection optical system. : The control device is to drive the projection optical system according to the detection result of the first detection device during the scanning exposure from the other side to the one side, and to drive the projection optical system in the scanning exposure from the one side to the other side During scanning exposure, the first and second drive systems are controlled in such a way that the projection optical system is driven according to the detection result of the second detection device, and during the scanning exposure from the other side to the one side, one side The first and second drive systems are controlled in such a manner that the first detection device and the projection optical system are driven from the other side to the one side while the second detection device is driven from the other side to the one side. . The exposure device of claim 1, wherein the control device controls the first and second drive systems in such a manner that the projection optical system is driven after at least part of the mark detection by the mark detection unit is completed. . As for the exposure device in claim 1 of the scope of the patent application, wherein the object has at least the first and second divisions with different positions; The control device is used to drive and control the second detection device to detect the mark in the second division area before performing the scanning exposure from the side to the other side of the second division area. The 2nd drive train is controlled in a positional manner. The exposure device according to any one of claims 1 to 3 of the claimed patent scope, wherein the control device performs at least part of the mark detection operation including the mark detection and the scanning exposure operation including the scanning exposure in parallel control. As in the exposure device of claim 4 of the scope of the patent application, wherein the mark detection operation includes the movement of the detection position of the mark detection part to the position where the mark detection operation is performed; The scanning exposure operation includes the moving operation of the projection optical system before the scanning exposure starts. The exposure device according to claim 4 of the scope of the patent application, wherein the control device controls the driving speed of the projection optical system and the driving speed of the mark detection part during at least one of the mark detection operation and the scanning exposure operation. The speed varies. In the exposure device according to claim 6, the driving speed of the mark detection unit is slower when the mark detection operation is performed in parallel with the scanning exposure operation than when only the mark detection operation is performed. The exposure device according to claim 4 of the scope of the patent application, wherein the mark detection unit is configured to detect the length of the area irradiated by the illumination light in the direction intersecting with the scanning direction of the projection optical system that is driven relative to the object. , a plurality of marks on the object with a longer distance between the marks. The exposure device according to claim 8 of the scope of the patent application, wherein the object has first and second divisional areas arranged side by side in a direction intersecting with the scanning direction; The mark detection unit is provided to simultaneously detect at least one mark on the first divisional area and at least one mark on the second divisional area in a direction intersecting with the scanning direction. The exposure device according to claim 9 of the scope of the patent application, wherein, when the area where the exposure operation is performed is changed from the first divisional area to the second divisional area, the control device causes the object and the projection optical system to communicate with each other The relative movement in the direction intersecting with the scanning direction moves the mark detection unit and the projection optical system to a detection start position in parallel with the relative movement. The exposure device according to any one of items 1 to 3 of the scope of application, wherein the optical axis of the projection optical system is parallel to the horizontal plane; The object is arranged such that the exposure surface irradiated by the illumination light is perpendicular to the horizontal plane. The exposure device according to claim 11, wherein the mark detection unit and the projection optical system are arranged so as to be separable from each other. The exposure device according to any one of claims 1 to 3 of the patent application, wherein the object is used for a substrate of a flat-panel display device. The exposure device according to claim 13 of the patent application, wherein the length of at least one side or the diagonal length of the substrate is 500 mm or more. A method of manufacturing a flat panel display, comprising: The action of exposing the object by using any one of the exposure device in the claims 1 to 14 of the patent application; and The act of developing the exposed object. A method of manufacturing an element comprising: The action of exposing the object by using any one of the exposure device in the claims 1 to 14 of the patent application; and The act of developing the object after exposure. An exposure method is to irradiate an object with illumination light through a projection optical system, and drive the projection optical system relative to the object to perform scanning exposure, which includes: Mark detection of marks provided on the object using the mark detection unit; The drive of the mark detection unit using the first drive system; drive of the projection optical system using the second drive system; and the control of the first and second drive systems in such a manner that the drive of the mark detection unit is performed prior to the drive of the projection optical system; The mark detection unit has a first detection device provided on one side of the projection optical system and a second detection device provided on the other side of the projection optical system in the scanning direction of the projection optical system driven relative to the object; In the control, in the scanning exposure from the other side to the one side, the projection optical system is driven according to the detection result of the first detection device, and the projection optical system is driven from the one side to the other side During scanning exposure, the first and second drive systems are controlled in such a way that the projection optical system is driven according to the detection result of the second detection device, and during the scanning exposure from the other side to the one side, one side The first and second drive systems are controlled in such a manner that the first detection device and the projection optical system are driven from the other side to the one side while the second detection device is driven from the other side to the one side. . The exposure method according to claim 17 of the scope of the patent application, wherein, in the control, the first and second drive systems are controlled in such a way that the projection optical system is driven after at least part of the mark detection by the mark detection unit is completed. . Such as the exposure method of claim 17 of the scope of the patent application, wherein the object has at least the first and second divisions with different positions; The control is to drive and control the second detection device to detect the mark in the second division area before performing the scanning exposure from the side to the other side of the second division area. The 2nd drive train is controlled in a positional manner. The exposure method according to any one of the 17th to 19th claims of the patent application, wherein, in the control, the mark detection operation including the mark detection and at least part of the scanning exposure operation including the scanning exposure are performed in parallel control. As in the exposure method of claim 20 of the scope of the patent application, wherein the mark detection operation includes the movement of the detection position of the mark detection part to the position where the mark detection operation is performed; The scanning exposure operation includes the moving operation of the projection optical system before the scanning exposure starts. The exposure method according to claim 20 of the patent claims, wherein, in the control, in at least one of the mark detection operation and the scanning exposure operation, the driving speed of the projection optical system and the drive speed of the mark detection part are adjusted. The speed varies. In the exposure method according to claim 22, the driving speed of the mark detection unit is slower when the mark detection operation is performed in parallel with the scanning exposure operation than when only the mark detection operation is performed. The exposure method according to claim 20 of the scope of the patent application, wherein the mark detection unit is configured to detect the length of the area irradiated by the illumination light in the direction intersecting with the scanning direction of the projection optical system that is driven relative to the object. , a plurality of marks on the object with a longer distance between the marks. The exposure method according to claim 24 of the scope of the patent application, wherein the object has the first and second divisions arranged side by side in a direction intersecting with the scanning direction; The mark detection unit is provided to simultaneously detect at least one mark on the first divisional area and at least one mark on the second divisional area in a direction intersecting with the scanning direction. For example, the exposure method of claim 25 of the scope of the patent application, wherein, in the control, when the area where the exposure operation is performed is changed from the first divisional area to the second divisional area, the object and the projection optical system are brought together The relative movement in a direction intersecting with the scanning direction moves the mark detection unit and the projection optical system to a detection start position in parallel with the relative movement. The exposure method according to any one of claims 17 to 19 of the patent application, wherein the optical axis of the projection optical system is parallel to the horizontal plane; The object is arranged such that the exposure surface irradiated by the illumination light is perpendicular to the horizontal plane. The exposure method according to claim 27, wherein the mark detection unit and the projection optical system are arranged so as to be separable from each other. The exposure method according to any one of claims 17 to 19 of the patent application, wherein the object is used for a substrate of a flat-panel display device. The exposure method of claim 29, wherein the length of at least one side or the diagonal length of the substrate is 500 mm or more. A method of manufacturing a flat panel display, comprising: The action of exposing the object using any one of the exposure methods in the claims 17 to 30; and The act of developing the object after exposure. A method of manufacturing an element comprising: The action of exposing the object using any one of the exposure methods in the claims 17 to 30; and The act of developing the object after exposure.

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