TW202314256A - Socket for inspection of IC package and method for producing same - Google Patents

Abstract

To prevent a contact pin for contacting the back surface of an IC package from being easily displaced with respect to a socket body by receiving a load from above, below, or both. A socket body 10 is provided with a space 8 that allows lateral movement of a ground contact pin 40 toward the outer periphery of the socket body 10, lateral movement of the ground contact pin 40 in the space 8 attaches the ground contact pin 40 to the socket body 10, and the socket body 10 prevents the ground contact pin 40 from being displaced in the vertical direction.

Description

IC package inspection socket and manufacturing method thereof

The invention relates to a socket for inspection of an IC (Integrated Circuit) package and a manufacturing method thereof.

In IC packages such as SOP (Small Outline Package) or QFP (Quad Flat Package: Quad Flat Package), there are sometimes heat dissipation and/or grounding on the back of the IC package in addition to the lead terminals. solder pads. When inspecting such IC packages, it is sometimes desirable to provide connector pins that are thermally or electrically connected to the backside of the IC package (eg, solder pads) (for example, refer to Patent Documents 1 and 2). [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2005-5130 [Patent Document 2] Japanese Patent Laid-Open No. 2005-166270

[Problem to be solved by the invention]

When the signal connector pins connected to the lead terminals are provided on the outer peripheral portion of the socket body, there are restrictions on providing the connector pins for contacting the back surface of the IC package on the socket body. In such a limitation, since the connector pins for contacting the back surface of the IC package are provided on the socket body, the connector pins can be inserted in the vertical direction and fixed to the socket body. However, when a load is applied to the connector pins in the same vertical direction, the connector pins are likely to be displaced, which may cause a change in the mounting posture.

Furthermore, the upper contact portion of the connector pin may come into contact with the bottom surface of the IC package and receive a downward load every time the IC package is inspected. Also, the lower contact portion of the connector pin may receive an upward load from the mounting substrate in a state where the socket is mounted on the mounting substrate. Furthermore, during the manufacturing process or transportation process of the socket, an external force may be applied to the connector pins to cause displacement or a change in posture. The displacement or posture change of the connector pins in the socket body may affect the electrical or thermal connection state with the IC package or the assembly substrate, so it is not expected.

Based on the above-mentioned exemplary problems, the inventors of the present invention have newly discovered the problem that the back contact connector pins of the IC package are prevented from being easily displaced relative to the socket body due to load from above, below, or both. Furthermore, this problem can be solved by soldering the connector pins of the receptacle to be electrically or thermally connected to the structure substrate, and the connector pins of the receptacle being electrically or thermally connected to the structure substrate in a state of being loaded upwards from the structure substrate. Either of the method of mounting the substrate or other methods. In the way that the connector pins of the receptacle are electrically or thermally connected to the build substrate in the state of being loaded upward from the build substrate, since the connector pins are always loaded upward from the build substrate, they are more likely to be loaded in the vertical direction . [means to solve the problem]

The IC package inspection socket of one aspect of the present invention includes: an insulating socket body, which carries the IC package; a set of first connector pins, which can be connected to the terminals of the IC package (such as lead terminals) ) are installed on the outer periphery of the socket body in the form of electrical connection; and one or more second connector pins are installed in such a way that they can be in contact with the heat dissipation and/or grounding pads exposed on the bottom surface of the IC package In the socket body, it is located on the inner side of the socket body than the pins of the first connector. The socket body is provided with a space that allows the second connector pins to move laterally to the outer periphery of the socket body, and the second connector pins are installed on the socket body by the lateral movement of the second connector pins in the space, and the socket body Prevent the vertical displacement of the pins of the second connector.

In some embodiments, the first connector pin is a signal connector pin, and the second connector pin is a ground or heat dissipation connector pin. The first connector pins may be configured to sandwich lead terminals of the IC package.

In some embodiments, the space includes holding grooves provided in the socket body for holding the pins of the second connector. The space may further include an introduction hole spatially communicating with the holding groove for facilitating the introduction of the second connector pin into the holding groove. The retaining groove can extend from the inner side of the socket body to the corner of the socket body. When looking down on the socket body, the retaining groove can extend elongatedly between a corner (such as a post) and a corner of the socket body. When the socket body is provided with an introduction hole, when viewing the socket body from above, the retaining groove can extend elongatedly between a corner (such as a post) of the socket body and the introduction hole. The shape or size of the introduction hole can vary. A third connector pin (for example, a heat radiation connector pin) provided to be the same as or different from the second connector pin may be arranged in the introduction hole.

In some embodiments, a plurality of holding grooves are provided to separately hold the plurality of second connector pins, and the guide holes are jointly provided in the plurality of holding grooves.

In some embodiments, the space includes a holding groove provided in the socket body for holding the pins of the second connector, and the socket body has a pair of wall surfaces facing to define the holding groove, and at least one of the pair of wall surfaces A plurality of connecting parts are connected, and the plurality of connecting parts are provided in such a way as to form an insertion path for inserting the insertion part of the pin of the second connector.

In some embodiments, a plurality of connecting parts are arranged alternately on the upper and lower sides of the insertion path along the length direction of the insertion path.

In some embodiments, the plurality of connection parts are provided in such a way that the insertion part of the second connector pin is pressed into the insertion path, and/or the second connector pin is pressed into the insertion path by the insertion part of the second connector pin constituted in a manner.

In some embodiments, a plurality of second connector pins are respectively provided on the socket body, and the introduction holes are jointly provided in a plurality of holding grooves provided to separately hold the plurality of second connector pins.

In some embodiments, the second connector pin has an upper contact portion that can be in contact with the heat dissipation and/or grounding pad, a lower contact portion that can be in contact with the construction substrate for the construction of the socket, and an upper contact portion. In the middle part between the contact part and the lower contact part, the upper contact part can elastically displace downward according to the load applied from above, and the lower contact part can elastically displace upward according to the load applied from below, the insertion of the second connector pin The portion extends laterally from the middle portion.

In some embodiments, in order to prevent the pins of the second connector from falling off from the socket body, complementary anti-loosening structures are provided on the socket body and the pins of the second connector.

In some embodiments, the pins of the second connector have an upper contact portion that can be in contact with a heat dissipation and/or grounding pad, and a lower contact portion that can be in contact with a construction substrate for constructing a socket, and the upper contact portion can be The lower contact part can elastically displace downward according to the load applied from above, and the lower contact part can elastically displace upward according to the load applied from below.

In some embodiments, the socket for inspection further includes: a cover part, which is provided to be movable up and down relative to the socket body for switching the state of the pins of the first connector; and a floating member, which is used for switching the pins of the second connector In this state, it is arranged to be movable up and down relative to the socket body in conjunction with the up and down movement of the cover portion.

Another aspect of the present invention is a method for manufacturing a socket for inspection of an IC package, including the following steps: installing a group of first connector pins on the outer periphery of the insulating socket body; Install one or more second connector pins on the socket body at the inner side of the body, and move the second connector pins laterally to the outer periphery of the socket body in the space provided on the socket body to install the second connector pins on the socket The main body prevents the vertical displacement of the pins of the second connector by the socket main body. [Effect of Invention]

According to one aspect of the present invention, it is possible to prevent the pins of the connector pins for the back contact of the IC package from being loaded from above or below or from both sides to cause easy displacement relative to the socket body, thereby improving the electrical connection or thermal connection with the IC package. connection reliability.

Hereinafter, various embodiments and features of the present invention will be described with reference to the drawings. Those skilled in the art can combine various embodiments and/or various features without excessive explanation, and can also understand the synergistic effect of the combination. In principle, overlapping descriptions between the embodiments are omitted. The drawings referred to are mainly for describing the invention and are simplified for the convenience of drawing. It should be understood that each feature is not only valid for the socket and its manufacturing method disclosed in this specification, but also is a general feature commonly used in various other sockets and its manufacturing method not disclosed in this specification.

FIG. 1 is a schematic perspective view of a socket 91 for inspection of an IC package (hereinafter simply referred to as socket 91 ). FIG. 2 is a schematic exploded perspective view of the socket 91 . FIG. 3 is a schematic top view of the socket 91 . Furthermore, the signal connector pins 20 are not installed on the socket body 10 . Fig. 4 is a schematic sectional view along the chain line A-A of Fig. 3, the socket is in the first state. Fig. 5 is a schematic sectional view along the chain line A-A of Fig. 3, the socket is in the second state.

As shown in FIG. 1 , the socket 91 is an open top socket, and is constructed on a construction substrate 92 called a test board. There are various ways to fix the socket 91 to the construction substrate 92 , for example, it is firmly fixed by screwing. The IC package accommodated in the socket 91 is electrically and thermally connected to the assembly substrate 92 through the socket 91 . Of course, sockets of other types than the open top type can also be used.

Typically, the IC package is SOP (Small Outline Package) or QFP (Quad Flat Package). The IC package system is manufactured by mounting one or more IC chips on a lead frame and sealing it with resin. Several lead terminals (eg, gull-wing lead terminals) extend from the resin sealing portion of the IC package. On the bottom surface of the IC package, there are exposed heat dissipation and/or grounding pads (exposed metal areas). In other words, the insulating material of the IC package is partially removed or not formed in order to expose the pad. The heat generated by the semiconductor chip in the IC package can be dissipated to the outside of the IC package through the pad, and/or the ground potential of the semiconductor chip in the IC package can be set from outside the IC package. In QFP, lead terminals are arranged at high density at a certain pitch on the four sides of its rectangular resin sealing part.

As shown in Figures 1 and 2, the socket 91 has: an insulating socket body 10, which carries the IC package; a signal connector pin 20 (the first connector pin), which can be electrically connected to the lead terminal of the IC package. It is installed and fixed on the outer periphery of the socket body 10 by way of sexual connection; and the grounding connector pin 40 (the second connector pin), which is at a position closer to the inner side of the socket body 10 than the signal connector pin 20, can be connected to the IC package. It is installed and fixed on the socket body 10 in a way of contacting the bottom surface. Furthermore, the socket 91 has: heat dissipation connector pins 30 (third connector pins), which are provided on the socket body 10 in a position closer to the inside of the socket body 10 than the signal connector pins 20 so as to be in contact with the bottom surface of the IC package. ; the cover portion 50, which is configured to move up and down relative to the socket body 10 in order to switch the state of the signal connector pin 20; and the floating member 60, which is used to switch the state of the heat dissipation connector pin 30 and the grounding connector pin 40 And it is installed so that it can move up and down with respect to the socket main body 10 in conjunction with the up and down movement of the cover part 50.

The socket body 10 is an insulating fixing member fixed on the construction substrate 92, and is composed of a combination of a base member 10A and a bottom cover 10B, but is not necessarily limited thereto. The base member 10A has an outer peripheral portion 6 for mounting and fixing the signal connector pins 20 , and an inner portion 7 for setting the heat dissipation connector pins 30 and the grounding connector pins 40 . The inner portion 7 is offset downwards from the upper surface of the outer peripheral portion 6 to form an accommodating space for the IC package. The bottom cover 10B is attached and fixed to the inner portion 7 of the base member 10A so as to sandwich the floating member 60 . As a result, the inner portion 7 and the floating member 60 are covered by the bottom cover 10B from above.

Columns 11 are provided at the corners of the outer peripheral portion 6 of the base member 10A. The column 11 is provided with a space for accommodating the cylindrical portion 63 of the floating member 60 described later, and the inner wall of the column 11 is provided with a notch for allowing the vertical displacement of the floating member 60 to be longer. A holding groove arrangement portion 12 is provided between adjacent columns 11 . Several holding grooves for inserting and holding the signal connector pins 20 are provided in each holding groove arrangement portion 12 . Retaining grooves are formed between adjacent partition walls to ensure that the signal connector pins 20 held in adjacent retaining grooves are insulated from each other.

The bottom cover 10B has an upper surface 14 on which the IC package is placed, and is mounted and fixed on the inner portion 7 of the base member 10A. In particular, an upwardly protruding rib 15 is provided on the periphery of the upper surface 14 of the bottom cover 10B to facilitate the positioning of the IC package (especially its resin sealing portion) on the upper surface 14 . The bottom cover 10B has an X-shaped guide hole G1 for guiding the vertical displacement of the floating member 60 , and an opening is formed on the upper surface 14 of the bottom cover 10B. A part of the floating member 60 described below (for example, the entirety of the central part 61 and a part of the extension part 62 ) is accommodated in the guide hole G1 . Four legs 96 are provided on the bottom cover 10B, and the legs 96 are respectively inserted into the holding grooves of the inner portion 7 of the base member 10A. When the leg 96 is inserted into the holding groove, the protrusion at the lower end of the leg 96 goes over the protrusion provided on the wall of the holding groove, whereby the bottom cover 10B is locked to the base member 10A.

The heat dissipation connector pin 30 is an elastic rod-shaped metal member that can expand and contract in the vertical direction. For example, the heat dissipation connector pin 30 is an assembly of a plurality of accessories, as shown in Figure 2, it is held between the upper and lower accessories 31, 32 that can be relatively displaced, and the flanges 33, 34 of the upper and lower accessories 31, 32. The spring 35 springs the upper and lower fittings 31, 32 to opposite sides in the up and down direction. The upper surface of the upper part 31 is in contact with the heat dissipation pad on the bottom surface of the IC package. The lower surface of the lower fitting 32 is in contact with the heat dissipation wiring of the construction substrate 92 . The upper fitting 31 and the lower fitting 32 are mechanically connected in such a way that the heat dissipation connector pins 30 are retractable so that they are not separated from each other.

The pin 40 of the grounding connector is a pin-shaped metal member that can expand and contract in the vertical direction, for example, it is made of copper or copper alloy with a plated layer on the surface. As shown in FIG. 2 , the ground connector pin 40 has an intermediate portion 41, and a lower contact portion 42 connected to the intermediate portion 41 via a spring portion 43 in order to elastically contact the wiring pad of the construction substrate 92. The upper contact part 44 is connected to the middle part 41 through the spring part 45 through the elastic contact of the bottom surface, and the upper contact part 44 is connected to the middle part 41 through the upper contact part 44 and the spring part 45 in order to be pressed downward by the pressing part 66 of the floating member 60. Section 46. An insertion portion 49 is provided at an intermediate portion 41 of the ground connector pin 40, and is inserted and held in an insertion path 81 provided in a holding groove 17 of a base member 10A described below.

The number of heat dissipation connector pins 30 and the number of ground connector pins 40 can be changed appropriately. For example, the heat dissipation performance of the socket 91 is improved by increasing the heat dissipation connector pins 30 . The ground resistance is reduced by increasing the number of pins 40 of the ground connector.

The pin 20 of the signal connector is a pin-shaped metal member with elasticity that can expand and contract in the vertical direction, for example, it is made of copper or copper alloy with a plated layer on the surface. As shown in Figures 4 and 5, the signal connector pin 20 has a middle part 21, a lower contact part 22 connected to the middle part 21 through a spring part 23 in order to elastically contact with the wiring pad of the assembly substrate 92, and a lower contact part 22 for clamping The clamping portion 24 is formed to hold the ends of the lead terminals of the IC package.

The clamping part 24 has a contact part 25 for placing and contacting the end of the lead terminal of the IC package, a pressing part 26 connected to the middle part 21 through a spring part 27 in order to spring to the contact part 25, and a pressing part 26 for pressing the contact part 25. The part 26 is separated from the contact part 25 by the rod 28 operated by the cover part 50 .

An insertion portion 29 is provided in the middle portion 21, and is press-fitted into the slot 13 of the holding groove arrangement portion 12 provided in the outer peripheral portion 6 of the base member 10A. The signal connector pin 20 is attached and fixed to the holding groove arrangement portion 12 of the base member 10A by pressing the insertion portion 29 into the slot 13 . Furthermore, the signal connector pins 20 are transmission lines for various purposes such as data transmission, control signal transmission, test signal transmission, and clock signal transmission.

The cover portion 50 has a resin rectangular frame 51 formed with a window through which the IC package can pass. On the inner surface of the rectangular frame 51 is formed an inclined guide surface that narrows the window width downwards to promote the smooth movement of the IC package to the socket body 10 . Four hollow cylindrical parts 52 extending downward are provided at the four corners of the rectangular frame 51 . The hole of the cylindrical portion 52 reaches the upper surface of the rectangular frame 51 and opens on the upper surface of the rectangular frame 51 .

The rectangular frame 51 is provided with a slot 53 for the rod 28 of the signal connector pin 20 to be inserted from below. When the cover part 50 descends, the rod 28 enters the groove 53 more deeply, and contacts the bottom surface 53B of the groove 53 . As the cover portion 50 descends further, the rod 28 is pushed outward by the bottom surface 53B of the groove 53 , and the pressing portion 26 is pulled upward from the contact portion 25 .

The floating member 60 is an X-shaped member having a central portion 61 and four extending portions 62 radially extending from the central portion 61 . The central part 61 is provided with an engaging hole 64 configured and engaged with the upper part of the heat dissipation connector pin 30 . The engaging hole 64 of the floating member 60 is divided into an upper hole 64A and a lower hole 64B, and a pressed surface that is a stepped surface intersecting or perpendicular to the central axis CL is formed between them. The heat dissipation connector pin 30 (for example, the flange 33 ) contacts the pressed surface, and the floating member 60 springs upward. Furthermore, the upper hole 64A has a smaller diameter than the lower hole 64B. Furthermore, when the floating member 60 descends, the heat dissipation connector pins 30 receive a downward load from the floating member 60 and shrink. When the downward load on the cover portion 50 is released, the heat dissipation connector pins 30 are extended, and the floating member 60 is pushed upward by the heat dissipation connector pins 30 .

The extension portion 62 is provided with an insertion groove 65 allowing the upper portion of the ground connector pin 40 (in short, the upper contact portion 44 , the spring portion 45 , and the pressed portion 46 ) to be inserted. A pressing portion 66 is provided in the insertion groove 65 , which presses down the pressed portion 46 of the grounding connector pin 40 when the floating member 60 descends. The pressed portion 46 is provided directly below the pressing portion 66 , and when the floating member 60 descends, the pressing portion 66 presses the pressed portion 46 downward. The insertion space of the upper contact portion 44 is provided adjacent to the central axis CL side of the socket 91 compared with the pressing portion 66 , and the insertion space of the spring portion 45 is provided on the opposite side. When the pressing portion 66 presses the pressed portion 46 downward, the upper contact portion 44 of the ground connector pin 40 approaches the central axis CL of the receptacle 91 and/or displaces downward. When the downward load on the cover portion 50 is released, the floating member 60 rises, and the ground connector pin 40 returns to the original posture.

At the outer end of each extension part 62, there is provided a hollow cylindrical part 63 which should be arranged coaxially with the cylindrical part 52 of the cover part 50. The cylindrical portion 52 of the cover portion 50 is inserted into the through hole of the cylindrical portion 63 of the floating member 60 . With the spring 71 provided between the cylindrical portion 63 of the floating member 60 and the cylindrical portion 52 of the cover 50 , the floating member 60 and the cover 50 are mechanically connected by pins 72 . The spring 71 is a compression coil spring, and the cover portion 50 and the floating member 60 are urged by the spring 71 in a vertical direction to separate from each other. A spring 71' is provided between the base member 10A and the cover part 50, and these springs 71' are biased in directions to separate from each other.

The cover portion 50 and the floating member 60 can be assembled as follows. First, the cylindrical portion 52 passes through the spring 71 , and then passes through the cylindrical portion 63 of the floating member 60 . The spring 71 is placed between the cylindrical portion 52 and the cylindrical portion 63 . Insert the pin 72 into the cylindrical portion 52, and fasten the insertion end of the pin 72. The cover portion 50 and the floating member 60 are assembled in this way.

When the bottom cover 10B is attached to the base member 10A, the floating member 60 is sandwiched between the base member 10A and the bottom cover 10B. Therefore, the assembly of the floating member 60 and the cover portion 50 is prevented from falling off from the socket body 10 . Of course, the assembly of the floating member 60 and the cover portion 50 is provided so as to be movable up and down relative to the socket body 10 .

Fig. 6 is a schematic sectional view along the chain line B-B in Fig. 3, the socket is in the first state. Fig. 7 is a schematic sectional view along the chain line B-B in Fig. 3, the socket is in the second state. As can be seen from Figures 6 and 7, the socket body 10 is provided with a holding groove 17 for holding the grounding connector pin 40, and an introduction hole spatially communicated with the holding groove 17 in order to promote the introduction of the grounding connector pin 40 into the holding groove 17. 16. The introduction hole 16 is provided on the central axis CL of the socket 91 and passes through the inner part of the socket body 10 (for example, the inner part 7 ). The retaining groove 17 includes a portion extending from the inner side of the socket body 10 to the outer peripheral portion 6 . Specifically, each wall surface 18 defining the retaining groove 17 extends from the wall defining the introduction hole 16 to the outer peripheral portion 6 of the socket body 10 (for example, its corner (for example, the post 11 )).

In this embodiment, the socket body 10 is provided with a space 8 that allows the grounding connector pin 40 to move laterally toward the outer peripheral portion 6 of the socket body 10, and the grounding connector pin 40 is moved laterally by the grounding connector pin 40 in the space 8. The pins 40 are installed on the socket body 10 , and the socket body 10 prevents the pins 40 of the grounding connector from being displaced in the vertical direction. For example, the lower portion of the ground connector pin 40 is introduced from above and accommodated in the introduction hole 16 . Next, the lower portion of the ground connector pin 40 moves from the introduction hole 16 to the holding groove 17 , and is inserted into and held in the holding groove 17 . In this way, the ground connector pin 40 is mounted on the socket body 10 through the lateral movement of the ground connector pin 40 , and the socket body 10 prevents the displacement of the ground connector pin 40 in the vertical direction. The displacement or posture change of the grounding connector pin 40 in the socket body 10 is suppressed, and the reliability of the electrical or thermal connection with the IC package or the assembly substrate is improved.

Furthermore, the above-mentioned space 8 includes a holding space of the holding groove 17 . When the socket body 10 is provided with the introduction hole 16 , the above-mentioned space 8 also includes the inner space of the introduction hole 16 . In the socket 91 in the completed state, the heat radiation connector pin 30 is arranged in the introduction hole 16, and the ground connector pin 40 is arranged in the holding groove 17, but the present invention is not limited thereto. Therefore, in this specification, please note that a space does not mean a state where nothing is placed there.

The lateral movement direction of the ground connector pin 40 is typically consistent with the direction perpendicular to the central axis CL of the socket 91, but it is not limited thereto, and may also be configured in a certain direction relative to the direction perpendicular to the central axis CL of the socket 91. Tilt at an angle (for example, below 35°). The introduction hole 16 is provided so that the ground connector pin 40 can be inserted into the holding groove 17 . It is not necessary to arrange the heat dissipation connector pins 30 in the introduction holes 16 .

In some cases, a plurality of holding grooves 17 are provided (for example radially) to separately hold a plurality of ground connector pins 40 . The introduction holes 16 are jointly provided in the plurality of holding grooves 17 to promote the miniaturization of the socket body 10 .

In some cases, the socket body 10 has a pair of wall surfaces 18 facing to define the holding groove 17, and a plurality of connecting portions 19 connected to at least one of the pair of wall surfaces 18 (both in the illustrated example). , the plurality of connecting portions 19 are arranged to form an insertion path 81 into which the insertion portion 49 of the ground connector pin 40 is inserted. The insertion portion 49 of the ground connector pin 40 is inserted (for example, press-fitted) into and held in the insertion path 81 .

Two or more (preferably three or more) connecting portions 19 may be alternately arranged on the upper and lower sides of the insertion path 81 along the length direction of the insertion path 81 . In this case, the connecting portion 19 can be formed by a general injection molding technique. The longitudinal direction of the insertion path 81 is typically a direction perpendicular to the central axis CL of the socket 91, and may be inclined at a certain angle. The insertion portion 49 of the ground connector pin 40 may also be appropriately shaped for press-fitting into the insertion path 81 . In order to hold the ground connector pin 40 or other purposes, a protrusion or a recess may also be provided on the wall 18 .

Hereinafter, the process of mounting the IC package 200 on the socket body 10 will be described with reference to FIGS. 8 to 12 . FIG. 8 is a schematic diagram showing the process of placing the IC package 200 on the socket body when the socket 91 is in the second state. FIG. 9 is a schematic view showing that the socket 91 changes from the second state to the first state, and the lead terminals 202 of the IC package 200 are clamped by the pins of the signal connector. FIG. 10 is a schematic diagram showing a state where the pins of the second connector are not in contact with the IC package (not shown) when the socket 91 is in the second state. FIG. 11 is a schematic diagram showing that the receptacle 91 changes from the second state to the first state, and the second connector pins are in a state where they can contact the back surface of an IC package (not shown). Fig. 12 is a schematic view showing a state where the pins of the second connector are in contact with the back surface of the IC package.

As shown in FIGS. 8 and 10 , the socket 91 is in the second state, and the IC package 200 can be installed on the socket 91 . When the cover part 50 is pressed down, the socket 91 moves from the first state to the second state. Specifically, the floating member 60 also descends in synchronization with the descending of the cover portion 50 . During the lowering process of the cover part 50 and the floating member 60, the cover part 50 operates the signal connector pins 20 and becomes a state capable of accommodating lead terminals of an IC package. For example, the cover portion 50 tilts the rod 28 outward, and the pressing portion 26 is pulled upward from the contact portion 25 . Furthermore, the floating member 60 presses down the heat dissipation connector pin 30 , and then presses down the pressed portion 46 of the ground connector pin 40 to lower the position of the upper contact portion 44 . Thereby, the heat dissipation connector pin 30 and the ground connector pin 40 are prevented from contacting the bottom surface of the IC package.

As shown in FIG. 9 and FIG. 11 , the socket 91 returns to the first state, and the IC package 200 is firmly set on the socket 91 . When the downward pressing of the cover portion 50 is released, the socket 91 automatically returns from the second state to the first state. Specifically, the floating member 60 also rises in synchronization with the rise of the cover portion 50 . When the cover portion 50 and the floating member 60 are raised, the signal connector pin 20 returns to the initial position, the rod 28 moves inward, the pressing portion 26 approaches the contact portion 25, and the IC package 200 is sandwiched between them. The front end of the lead terminal 202 . The heat dissipation connector pin 30 is extended upward, the floating member 60 pushes upward, and the upper contact portion 44 of the ground connector pin 40 moves to the original height. Thereby, the contact of the heat radiation connector pin 30 and the ground connector pin 40 with the bottom surface of the main body part 201 of the IC package 200 is ensured (refer FIG. 12).

The method of detaching the IC package from the socket 91 can be understood from the above description, so it is omitted.

Next, the outline of the manufacturing method of the socket 91 is demonstrated. The manufacturing method includes the following steps: installing a group of signal connector pins 20 on the outer peripheral portion 6 of the insulating socket body 10; 40 is mounted on the socket body 10 . Here, in the space 8 provided in the socket body 10, the grounding connector pin 40 moves laterally toward the outer peripheral portion 6 of the socket body 10 to install the grounding connector pin 40 on the socket body 10, and the grounding connector pin is blocked by the socket body 10. 40 displacement in the up and down direction. After the ground connector pin 40 is provided, the heat dissipation connector pin 30 is arranged in the introduction hole 16 . Movement of the ground connector pin 40 is performed by a human or a robot. Since the connector pins are metal parts that are easily deformed, it is expected to handle them carefully with tweezers or the like. The connection of the base member 10A and the bottom cover 10B, or the installation of the assembly of the floating member 60 and the cover portion 50 has already been described, and repeated description thereof will be omitted.

As shown in FIG. 13 , the ground connector pin 40 is disposed in the introduction hole 16 by lowering the ground connector pin 40 . Then, the ground connector pin 40 is moved laterally towards the outer peripheral portion 6 of the socket body 10 . Accordingly, the insertion portion 49 of the ground connector pin 40 is inserted into and held in the holding groove 17 . Specifically, the insertion portion 49 of the ground connector pin 40 is inserted into and held in the insertion path 81 formed by the plurality of connection portions 19 .

It can be understood that when the socket body 10 is provided with the heat dissipation connector pin 30 in addition to the grounding connector pin 40, the arrangement space of the heat dissipation connector pin 30 in the socket body 10 (in short, it is the introduction hole) 16) It is also used for lateral movement of the pin 40 of the grounding connector to the holding groove 17 .

Moreover, it is also possible to prevent the ground connector pin 40 from falling off from the holding groove 17 by arranging the heat dissipation connector pin 30 in the introduction hole 16 . As an alternative to the heat dissipation connector pins 30 , a fall-off prevention member 250 that prevents the ground connector pins 40 from falling off from the holding groove 17 may be provided (refer to FIG. 14 ).

In order to prevent the grounding connector pins 40 from falling off from the socket body 10 , complementary anti-off structures can also be provided on the socket body 10 and the grounding connector pins 40 (refer to FIG. 15 ). A locking portion 181 is provided on the wall surface 18 of the holding groove 17 of the socket body 10 , and a locked portion 47 is provided on the pin 40 of the ground connector. When the ground connector pin 40 is inserted into the holding groove 17 , it will be locked by the locking portion 47 by the locking portion 181 . It is also possible to obtain a snap feeling indicating that the ground connector pin 40 has been inserted, and to suppress insufficient insertion of the ground connector pin 40 . The locked portion 47 is a concave portion, and the locking portion 181 is a lance (a metal piece inclined obliquely) that can enter the concave portion. The convex-concave relationship between the locking portion 181 and the locked portion 47 can be reversed.

Based on the above teaching, those skilled in the art can add various modifications to the respective embodiments and respective features. The heat dissipation connector pin 30 and the ground connector pin 40 can be operated in a manner not to contact the bottom surface of the IC package placed on the socket body 10, and can be omitted depending on the embodiment. The introduction hole is not limited to a cylindrical space, and may be formed in a slender slit shape along a predetermined direction similarly to the holding groove. The position and number of lead-in holes can be changed.

6: Peripheral 7: inner part 8: space 10: Socket body 10A: Base member 10B: Bottom cover 11: column 12:Holding groove configuration part 13: slot 14: Upper surface 15: Rib 16: Import hole 17: Holding groove 18: wall 19: Connection Department 20: Signal connector pin (1st connector pin) 21: middle part 22: Lower contact part 23: spring part 24: clamping part 25: contact part 26: Consolidation Department 27: spring part 28: Rod 29: Insertion part 30: Heat dissipation connector pin 31: Upper accessories 32: Bottom accessories 33: Flange 34: Flange 35: spring 40: Ground connector pin (2nd connector pin) 41: middle part 42: Lower contact part 43: spring part 44: Upper contact part 45: spring part 46: Pressed part 47: locked part 49: Insertion part 50: cover part 51: rectangular frame 52: Cylindrical part 53: Slot 53B: bottom surface 60: Floating components 61: central part 62: Extension 63: Cylindrical part 64: snap hole 64A: Upper hole 64B: Bottom hole 65: slot 66: Pressing part 71: Spring 71': spring 72: pin 81: insert road 90: socket 91: socket 92: Construct the substrate 96: feet 181: locking part 200: IC package 201: Body Department 202: Lead terminal 250: anti-detachment member G1: guide hole

[ Fig. 1 ] is a schematic perspective view of a socket for inspection of an IC package according to an aspect of the present invention. [ Fig. 2 ] is a schematic exploded perspective view of an inspection socket according to an aspect of the present invention. Furthermore, no signal connector pins are installed on the socket body. [ Fig. 3 ] is a schematic plan view of an inspection socket according to an aspect of the present invention. [Fig. 4] is a schematic cross-sectional view along the dotted line A-A in Fig. 3, and the socket is in the first state. [Fig. 5] is a schematic cross-sectional view along the dotted line A-A in Fig. 3, and the socket is in the second state. [FIG. 6] It is a schematic cross-sectional view along the dotted line B-B in FIG. 3, and the socket is in the first state. [FIG. 7] It is a schematic sectional view along the dotted line B-B in FIG. 3, and the socket is in the second state. [ Fig. 8 ] is a schematic diagram showing the process of placing the IC package on the socket body when the socket is in the second state. [FIG. 9] It is a schematic diagram showing that the socket changes from the second state to the first state, and the lead terminals of the IC package are clamped by the pins of the signal connector. [ Fig. 10 ] is a schematic diagram showing a state where the pin of the ground connector is not in contact with the IC package (not shown) when the socket is in the second state. [FIG. 11] It is a schematic diagram which shows the socket from the 2nd state to the 1st state, and the ground connector pin is in the state which can contact the back surface of an IC package (not shown). [ Fig. 12 ] is a schematic diagram showing a state where the ground connector pins are in contact with the back surface of the IC package. [FIG. 13] It is a schematic diagram showing that the pin of the grounding connector is moved laterally and installed on the socket body. [ Fig. 14 ] is a schematic view showing a variation using a plug that prevents displacement or falling off of the pin of the ground connector. [FIG. 15] It is a schematic diagram showing the variation of the socket body and the grounding connector pins being provided with complementary anti-off structures.

6: Peripheral

7: inner part

8: space

16: Import hole

17: Holding groove

18: wall

19: Connection Department

40: Ground connector pin (2nd connector pin)

41: middle part

42: Lower contact part

43: spring part

44: Upper contact part

45: spring part

46: Pressed part

49: Insertion part

81: insert road

Claims (13)

A socket, which is used for inspection of IC packages, and has: an insulating socket body, on which the above-mentioned IC package is placed; a set of first connector pins mounted on the outer periphery of the socket body in such a manner as to be electrically connected to the terminals of the IC package; and One or more second connector pins are mounted on the socket body in such a way that they can be in contact with the heat dissipation and/or grounding pads exposed on the bottom surface of the IC package, and are located closer to the first connector pins. The inner side of the above-mentioned socket body; The socket body is provided with a space that allows the second connector pins to move laterally toward the outer periphery of the socket body, and the second connector pins are installed on the socket body by laterally moving the second connector pins in the space. The socket body prevents vertical displacement of the pins of the second connector by the socket body. Such as the socket of claim 1, wherein, The space includes a retaining groove provided on the socket body for holding the pins of the second connector, and the retaining groove extends from the inner side of the socket body to the corner of the socket body. Such as the socket of claim 2, wherein, The space further includes an introduction hole spatially communicating with the holding groove for facilitating the introduction of the second connector pin into the holding groove. Such as the socket of claim 3, its A plurality of the above-mentioned holding grooves are provided to separately hold the plurality of the above-mentioned second connector pins, and the above-mentioned introduction holes are commonly provided in the plurality of the above-mentioned holding grooves. The socket of any one of claims 1 to 4, wherein, The above-mentioned space includes holding grooves provided in the above-mentioned receptacle body for holding the above-mentioned second connector pins, The socket body has a pair of wall surfaces facing to define the retaining groove, and a plurality of connecting parts connected to at least one of the pair of wall surfaces, and the plurality of connecting parts are used to form pins for the second connector The way of inserting the inserting part into the inserting way is set. Such as the socket of claim 5, wherein, The plurality of connecting parts are arranged alternately on the upper and lower sides of the insertion path along the length direction of the insertion path. Such as the socket of claim 5, wherein, The plurality of connection parts are provided in such a way that the insertion part of the second connector pin is press-fitted into the insertion path, and/or The second connector pin is configured such that an insertion portion of the second connector pin is press-fitted into the insertion path. Such as the socket of claim 5, wherein, The above-mentioned second connector pin has an upper contact portion that can be in contact with the above-mentioned heat dissipation and/or grounding pad, a lower contact portion that can be in contact with the assembly substrate on which the above-mentioned receptacle is constructed, and a contact portion that is located between the above-mentioned upper contact portion and the grounding pad. In the middle part between the above-mentioned lower contact parts, the above-mentioned upper contact part can elastically displace downward according to the load applied from above, and the above-mentioned lower contact part can elastically displace upward according to the load applied from below, and the above-mentioned second connector pin The insertion portion extends laterally from the middle portion. The socket of any one of claims 1 to 4, wherein, In order to prevent the pins of the second connector from falling off from the socket body, complementary anti-off structures are provided on the socket body and the pins of the second connector. The socket of any one of claims 1 to 4, wherein, The above-mentioned second connector pin has an upper contact portion that can be in contact with the above-mentioned heat dissipation and/or grounding pad, and a lower contact portion that can be in contact with the assembly substrate on which the above-mentioned socket is constructed. The above-mentioned upper contact portion can be used according to The load applied from above elastically displaces downward, and the above-mentioned lower contact portion elastically displaces upward according to the load applied from below. The socket according to any one of claims 1 to 4, which further has: a cover portion provided to be movable up and down relative to the socket body for switching the state of the pins of the first connector; and The floating member is provided so as to be movable up and down relative to the socket main body in conjunction with the vertical movement of the cover portion in order to switch the state of the pins of the second connector. A method for manufacturing a socket, the socket is used for inspecting IC packages, the method for manufacturing the socket includes the following steps: installing a set of first connector pins on the outer periphery of the insulating socket body; and Install one or more second connector pins on the socket body at a position closer to the socket body than the first connector pins, and direct the second connector pins to the socket in the space provided in the socket body The outer peripheral part of the body moves laterally to install the second connector pins on the socket body, and the socket body prevents the vertical displacement of the second connector pins. The manufacturing method of the socket as claimed in item 12, wherein, The second connector pin has an upper contact portion capable of contacting the heat dissipation and/or grounding pads exposed on the bottom surface of the IC package, a lower contact portion capable of contacting the mounting substrate on which the socket is mounted, And it is provided in the middle part between the above-mentioned upper contact part and the above-mentioned lower contact part, the above-mentioned upper contact part can elastically displace downward according to the load applied from above, and the above-mentioned lower contact part can elastically move upward according to the load applied from below Displacement, the insertion part inserted into the holding groove provided in the socket body as the above-mentioned space is provided in the above-mentioned middle part.

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