TW202302754A - Polymerizable composition, photocurable adhesive agent, cured product manufacturing method, and cured product - Google Patents
Polymerizable composition, photocurable adhesive agent, cured product manufacturing method, and cured product Download PDFInfo
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- TW202302754A TW202302754A TW111112102A TW111112102A TW202302754A TW 202302754 A TW202302754 A TW 202302754A TW 111112102 A TW111112102 A TW 111112102A TW 111112102 A TW111112102 A TW 111112102A TW 202302754 A TW202302754 A TW 202302754A
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- polymerizable composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 118
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000000853 adhesive Substances 0.000 title claims description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 151
- 150000003568 thioethers Chemical class 0.000 claims abstract description 39
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 28
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 207
- 125000001424 substituent group Chemical group 0.000 claims description 93
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 84
- 125000001931 aliphatic group Chemical group 0.000 claims description 83
- 239000004593 Epoxy Substances 0.000 claims description 60
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 29
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 27
- 125000003118 aryl group Chemical group 0.000 claims description 25
- 125000002723 alicyclic group Chemical group 0.000 claims description 16
- 125000002091 cationic group Chemical group 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 125000002950 monocyclic group Chemical group 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- -1 dodecyl Tridecyl Chemical group 0.000 description 85
- 150000002430 hydrocarbons Chemical group 0.000 description 53
- 125000000217 alkyl group Chemical group 0.000 description 41
- 230000003287 optical effect Effects 0.000 description 34
- 239000000126 substance Substances 0.000 description 29
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 239000002904 solvent Substances 0.000 description 12
- 125000002947 alkylene group Chemical group 0.000 description 11
- 150000001768 cations Chemical class 0.000 description 10
- 150000001450 anions Chemical class 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- 150000001925 cycloalkenes Chemical group 0.000 description 8
- 150000002921 oxetanes Chemical class 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 239000007870 radical polymerization initiator Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 125000003566 oxetanyl group Chemical group 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- IHICGCFKGWYHSF-UHFFFAOYSA-N C1=CC=CC=C1.CC1=CC=CC=C1.CC1=CC=CC=C1C Chemical group C1=CC=CC=C1.CC1=CC=CC=C1.CC1=CC=CC=C1C IHICGCFKGWYHSF-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 229960004592 isopropanol Drugs 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000005641 methacryl group Chemical group 0.000 description 2
- 229940124305 n-propanol Drugs 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- BSCCSDNZEIHXOK-UHFFFAOYSA-N phenyl carbamate Chemical group NC(=O)OC1=CC=CC=C1 BSCCSDNZEIHXOK-UHFFFAOYSA-N 0.000 description 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
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- 125000002469 tricosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005040 tridecenyl group Chemical group C(=CCCCCCCCCCCC)* 0.000 description 1
- 150000005671 trienes Chemical class 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 125000005065 undecenyl group Chemical group C(=CCCCCCCCCC)* 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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Abstract
Description
本發明係關於一種聚合性組合物及該聚合性組合物之硬化物。The present invention relates to a polymeric composition and a cured product of the polymeric composition.
陽離子聚合性組合物係於墨水、塗料、各種塗佈劑、接著劑、光學構件等領域中使用。The cationically polymerizable composition is used in the fields of ink, paint, various coating agents, adhesives, optical members, and the like.
例如,下述專利文獻1~3中揭示有各種用作光硬化性接著劑之陽離子聚合性組合物。 先前技術文獻 專利文獻 For example, various cationically polymerizable compositions used as photocurable adhesives are disclosed in the following Patent Documents 1 to 3. prior art literature patent documents
專利文獻1:日本專利特開2011-236389號公報 專利文獻2:日本專利特開2012-149262號公報 專利文獻3:國際公開2008/111584號公報 Patent Document 1: Japanese Patent Laid-Open No. 2011-236389 Patent Document 2: Japanese Patent Laid-Open No. 2012-149262 Patent Document 3: International Publication No. 2008/111584
[發明所欲解決之問題][Problem to be solved by the invention]
然而,專利文獻1~3所記載之聚合性組合物之硬化物之耐濕熱性並不充分。However, the heat-and-moisture resistance of the cured products of the polymerizable compositions described in Patent Documents 1 to 3 is not sufficient.
因此,本發明之課題在於提供一種能夠製造耐濕熱性優異之硬化物之聚合性組合物。 [解決問題之技術手段] Therefore, an object of the present invention is to provide a polymerizable composition capable of producing a cured product excellent in heat-and-moisture resistance. [Technical means to solve the problem]
本發明之發明人等為了解決上述課題而進行努力研究,結果完成了本發明。 即,本發明提供一種聚合性組合物,其含有硫醚化合物(A)、陽離子聚合性化合物(B)及陽離子聚合起始劑(C)。 The inventors of the present invention have diligently studied to solve the above-mentioned problems, and as a result, have completed the present invention. That is, the present invention provides a polymerizable composition containing a thioether compound (A), a cationic polymerizable compound (B), and a cationic polymerization initiator (C).
又,本發明提供一種含有上述聚合性組合物之光硬化性接著劑。 又,本發明提供一種硬化物之製造方法,其包括對上述聚合性組合物照射活性能量線之步驟或進行加熱之步驟。 又,本發明提供一種上述聚合性組合物之硬化物。 進而,本發明提供一種上述聚合性組合物之作為光硬化性接著劑之用途。 [發明之效果] Moreover, this invention provides the photocurable adhesive agent containing the said polymeric composition. Furthermore, the present invention provides a method for producing a cured product, which includes the step of irradiating active energy rays or heating the above-mentioned polymerizable composition. Also, the present invention provides a cured product of the above-mentioned polymerizable composition. Furthermore, the present invention provides a use of the above-mentioned polymerizable composition as a photocurable adhesive. [Effect of Invention]
根據本發明之聚合性組合物,能夠製造耐濕熱性優異之硬化物。According to the polymerizable composition of this invention, the hardened|cured material excellent in heat-and-moisture resistance can be manufactured.
以下對本發明之聚合性組合物詳細地進行說明。 本發明之聚合性組合物含有硫醚化合物(A)。藉由含有硫醚化合物(A),聚合性組合物之硬化物之耐濕熱性變得優異。進而,該硬化物之耐熱性、接著性及光學特性亦變得優異。 The polymerizable composition of the present invention will be described in detail below. The polymerizable composition of the present invention contains a thioether compound (A). By containing the thioether compound (A), the heat-and-moisture resistance of the hardened|cured material of a polymeric composition becomes excellent. Furthermore, the heat resistance, adhesiveness, and optical characteristics of this cured product also become excellent.
硫醚化合物(A)係於分子內具有硫醚鍵之化合物。於本發明中,可使用公知之硫醚化合物作為硫醚化合物(A),並無特別限制。於本發明中,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性及接著性亦變得良好之情況而言,較佳為使用在分子內具有酯鍵之硫醚化合物。The thioether compound (A) is a compound having a thioether bond in the molecule. In the present invention, a known thioether compound can be used as the thioether compound (A), without any particular limitation. In the present invention, in the case where the heat and humidity resistance of the cured product of the polymerizable composition becomes better and the heat resistance and adhesiveness of the cured product also become better, it is preferable to use a polymer having an ester bond in the molecule. sulfide compounds.
作為於分子內具有酯鍵之硫醚化合物,例如具有由下述通式(I)所表示之基之於分子內具有酯鍵之硫醚化合物由於聚合性組合物之硬化物之耐濕熱性變得更良好,且該硬化物之耐熱性及接著性亦變得良好,故而較佳。As a thioether compound having an ester bond in the molecule, for example, a thioether compound having an ester bond in the molecule having a group represented by the following general formula (I) is changed due to the moisture and heat resistance of the cured product of the polymerizable composition. It is better, and the heat resistance and adhesiveness of the cured product also become better, so it is preferable.
[化1] [chemical 1]
(式中,R 1表示可具有取代基之碳原子數1~30之脂肪族烴基、可具有取代基之碳原子數6~30之含芳香族烴環基、上述碳原子數1~30之脂肪族烴基中之1個以上之亞甲基被取代為選自下述<群A>中之2價基而成之基、或上述碳原子數6~30之含芳香族烴環基中之1個以上之亞甲基被取代為選自下述<群A>中之2價基而成之基, Y 1表示可具有取代基之碳原子數1~30之2價烴基或該碳原子數1~30之2價烴基中之1個以上之亞甲基被取代為選自下述<群A>中之2價基而成之基, *表示鍵結鍵; <群A>:-O-、-CO-、-COO-、-OCO-、-NR 2-、-NR 3CO-或-S- R 2及R 3分別獨立地表示氫原子或碳原子數1~30之烴基) ( wherein , R represents an aliphatic hydrocarbon group with 1 to 30 carbon atoms that may have substituents, an aromatic hydrocarbon-containing ring group with 6 to 30 carbon atoms that may have substituents, the above-mentioned aliphatic hydrocarbon group with 1 to 30 carbon atoms One or more methylene groups in the aliphatic hydrocarbon group are substituted with a divalent group selected from the following <Group A>, or one of the above-mentioned aromatic hydrocarbon ring groups with 6 to 30 carbon atoms One or more methylene groups are substituted with divalent groups selected from the following <Group A>, Y1 represents a divalent hydrocarbon group with 1 to 30 carbon atoms that may have a substituent or the carbon atom One or more methylene groups in the divalent hydrocarbon groups of 1 to 30 are substituted with divalent groups selected from the following <Group A>, * represents a bond; <Group A>:- O-, -CO-, -COO-, -OCO-, -NR 2 -, -NR 3 CO-, or -S- R 2 and R 3 each independently represent a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms)
作為由通式(I)中之R 1所表示之碳原子數1~30之脂肪族烴基,可例舉:碳原子數1~30之烷基、碳原子數2~30之烯基、碳原子數2~30之炔基、碳原子數3~30之環烷基等。 The aliphatic hydrocarbon group having 1 to 30 carbon atoms represented by R in the general formula (I) may, for example, be an alkyl group having 1 to 30 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, a carbon An alkynyl group having 2 to 30 atoms, a cycloalkyl group having 3 to 30 carbon atoms, and the like.
由R 1所表示之碳原子數1~30之烷基可為直鏈狀,亦可為支鏈狀。作為直鏈狀之烷基,例如可例舉:甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基、十一烷基、十二烷基、十三烷基、十四烷基、十五烷基、十六烷基、十七烷基、十八烷基、十九烷基、二十烷基、二十一烷基、二十二烷基、二十三烷基、二十四烷基、二十五烷基、二十六烷基、二十七烷基、二十八烷基、二十九烷基及三十烷基等。作為支鏈狀之烷基,可例舉上述直鏈烷基之1個或2個以上經碳原子數1~9之烷基取代之基,具體可例舉:1,3-二甲基丁基、1-異丙基丙基、1,2-二甲基丁基、2-庚基、1,4-二甲基戊基、第三庚基、2-甲基-1-異丙基丙基、1-乙基-3-甲基丁基、異辛基、第三辛基、2-乙基己基、2-甲基己基、2-丙基己基、異壬基、異癸基、異十一烷基及異十二烷基等。作為碳原子數1~9之烷基,可例舉由R 1所表示之碳原子數1~30之烷基中之碳原子數1~9之烷基。 於本發明中,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,烷基之碳原子數較佳為5~23,更佳為5~20,進而較佳為7~17,進而更佳為9~15。又,就同樣之觀點而言,烷基較佳為直鏈狀。 The alkyl group having 1 to 30 carbon atoms represented by R 1 may be linear or branched. Examples of linear alkyl groups include: methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl Tridecyl, Tetradecyl, Pentadecyl, Hexadecyl, Heptadecyl, Octadecyl, Nonadecyl, Eicosyl, Icodecyl, Eicosyl Dialkyl, tricosyl, tetracosyl, pentadecyl, hexacyl, heptacyl, octadecyl, nonacosyl and triaconyl wait. As the branched alkyl group, one or more of the above-mentioned linear alkyl groups are substituted with an alkyl group having 1 to 9 carbon atoms, specifically, 1,3-dimethylbutyl Base, 1-isopropylpropyl, 1,2-dimethylbutyl, 2-heptyl, 1,4-dimethylpentyl, third heptyl, 2-methyl-1-isopropyl Propyl, 1-ethyl-3-methylbutyl, isooctyl, tertiary octyl, 2-ethylhexyl, 2-methylhexyl, 2-propylhexyl, isononyl, isodecyl, Isoundecyl and isododecyl, etc. The alkyl group having 1 to 9 carbon atoms may, for example, be an alkyl group having 1 to 9 carbon atoms among the alkyl groups having 1 to 30 carbon atoms represented by R 1 . In the present invention, in the case where the heat resistance of the hardened product of the polymerizable composition becomes better and the heat resistance, adhesiveness and optical properties of the hardened product also become better, the number of carbon atoms of the alkyl group is higher than that of the cured product. Preferably it is 5-23, More preferably, it is 5-20, More preferably, it is 7-17, More preferably, it is 9-15. Also, from the same viewpoint, the alkyl group is preferably linear.
作為由R 1所表示之碳原子數2~30之烯基,例如可例舉:乙烯基、丙烯基、丁烯基、戊烯基、己烯基、庚烯基、辛烯基、壬烯基、癸烯基、十一碳烯基、十二碳烯基、十三碳烯基、十四碳烯基、十五碳烯基、十六碳烯基、十七碳烯基、十八碳烯基、十九碳烯基、二十碳烯基、二十一碳烯基、二十二碳烯基、二十三碳烯基、二十四碳烯基、二十五碳烯基、二十六碳烯基、二十七碳烯基、二十八碳烯基、二十九碳烯基及三十碳烯基、以及與該等基對應之烷二烯基及烷三烯基。 Examples of the alkenyl group having 2 to 30 carbon atoms represented by R include vinyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonene base, decenyl, undecenyl, dodecenyl, tridecenyl, tetradecenyl, pentadecenyl, hexadecenyl, heptadecenyl, octadecenyl Carbenyl, Nonadecenyl, Eicosenyl, Icodecenyl, Dococenyl, Tritricenyl, Tetradecenyl, Pentadecenyl , Hexadecenyl, Heptadecenyl, Hexadecenyl, Hexadecenyl and Triadecenyl, and the corresponding alkadienyl and alkatriene base.
作為由R 1所表示之碳原子數2~30之炔基,可例舉:乙炔基、1-丙炔基、2-丙炔基、1-丁炔基、2-丁炔基、3-丁炔基、1-辛炔基、1-癸炔基、1-十八碳炔基等。 The alkynyl group having 2 to 30 carbon atoms represented by R 1 may, for example, be ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, 2-butynyl, 3- butynyl, 1-octynyl, 1-decynyl, 1-octadecynyl and the like.
作為由R 1所表示之碳原子數3~30之環烷基,可例舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環十八烷基、2-𦯉基、2-異𦯉基、1-金剛烷基等。 Examples of the cycloalkyl group having 3 to 30 carbon atoms represented by R include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and cyclooctadecyl. , 2-𦯉 group, 2-iso𦯉 group, 1-adamantyl group, etc.
於本發明中,含芳香族烴環基係指具有芳香族烴環之基。 由R 1所表示之碳原子數6~30之含芳香族烴環基可為單環結構,亦可為多環結構。多環結構之含芳香族烴環基可為縮合環結構,亦可為2個芳香族烴環連結而成之結構。 作為2個芳香族烴環連結而成之含芳香族烴環基,可為2個單環結構之芳香族烴環連結而成者,亦可為單環結構之芳香族烴環與縮合環結構之芳香族烴環連結而成者,還可為2個縮合環結構之芳香族烴環連結而成者。 作為連結2個芳香族烴環之連結基,只要能使含芳香族烴環基整體具有芳香族性即可,可例舉單鍵、硫基(-S-)及羰基等。 作為單環結構之芳香族烴環,例如可例舉:苯、甲苯、乙基苯、2,4,6-三甲基苯等。 作為縮合環結構之芳香族烴環,例如可例舉:萘、蒽、菲、芘等。 作為2個芳香族烴環連結而成之含芳香族烴環基,例如可例舉二苯硫醚、苯甲醯基苯基等單環結構之芳香族烴環連結而成之基。 就聚合性組合物之硬化物之耐濕熱性變得更良好之觀點而言,於本發明中,芳香族烴環之碳原子數較佳為6~20。就除耐濕熱性變得良好以外,硬化物之耐熱性、接著性及光學特性亦變得良好之觀點而言,芳香族烴環之碳原子數更佳為6~15。 In the present invention, an aromatic hydrocarbon ring-containing group means a group having an aromatic hydrocarbon ring. The aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms represented by R 1 may have a monocyclic structure or a polycyclic structure. The aromatic hydrocarbon-containing ring group of the polycyclic structure may be a condensed ring structure or a structure in which two aromatic hydrocarbon rings are linked. As an aromatic hydrocarbon-containing ring group formed by linking two aromatic hydrocarbon rings, it may be formed by linking two aromatic hydrocarbon rings with a single-ring structure, or it may be an aromatic hydrocarbon ring with a single-ring structure and a condensed ring structure One formed by linking aromatic hydrocarbon rings, or two aromatic hydrocarbon rings of condensed ring structure linked together. As the linking group connecting two aromatic hydrocarbon rings, any aromatic hydrocarbon-containing ring group as a whole may be provided with aromaticity, and examples thereof include a single bond, a thio group (—S—), and a carbonyl group. As an aromatic hydrocarbon ring of a monocyclic structure, benzene, toluene, ethylbenzene, 2,4,6- trimethylbenzene, etc. are mentioned, for example. Examples of the aromatic hydrocarbon ring of the condensed ring structure include naphthalene, anthracene, phenanthrene, pyrene and the like. The aromatic hydrocarbon-containing ring group in which two aromatic hydrocarbon rings are linked may, for example, be a group in which aromatic hydrocarbon rings of a monocyclic structure, such as diphenyl sulfide and benzoylphenyl, are linked. In the present invention, the number of carbon atoms of the aromatic hydrocarbon ring is preferably from 6 to 20 from the viewpoint of better heat-and-moisture resistance of the cured product of the polymerizable composition. The number of carbon atoms in the aromatic hydrocarbon ring is more preferably 6-15 from the viewpoint of improving the heat resistance, adhesiveness, and optical properties of the cured product in addition to the heat-and-moisture resistance.
作為由Y 1所表示之碳原子數1~30之2價烴基,可例舉自由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基或可具有取代基之碳原子數6~30之含芳香族烴環基中去除1個氫原子而成之2價基。 As the bivalent hydrocarbon group having 1 to 30 carbon atoms represented by Y , there may be mentioned an aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by R , or a carbon atom which may have a substituent A divalent group formed by removing one hydrogen atom from an aromatic hydrocarbon-containing ring group with a number of 6 to 30.
作為群A中由R 2及R 3所表示之碳原子數1~30之烴基,例如可例舉碳原子數1~30之脂肪族烴基及碳原子數6~30之含芳香族烴環基。 作為由R 2及R 3所表示之碳原子數1~30之脂肪族烴基,可例舉與由R 1所表示之碳原子數1~30之脂肪族烴基相同者。 作為由R 2及R 3所表示之碳原子數6~30之含芳香族烴環基,可例舉與由R 1所表示之碳原子數6~30之含芳香族烴環基相同者。 As the hydrocarbon group having 1 to 30 carbon atoms represented by R2 and R3 in Group A, for example, an aliphatic hydrocarbon group having 1 to 30 carbon atoms and an aromatic hydrocarbon ring group having 6 to 30 carbon atoms . The aliphatic hydrocarbon group having 1 to 30 carbon atoms represented by R 2 and R 3 may, for example, be the same as the aliphatic hydrocarbon group having 1 to 30 carbon atoms represented by R 1 . The aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms represented by R 2 and R 3 may, for example, be the same as the aromatic hydrocarbon ring group having 6 to 30 carbon atoms represented by R 1 .
作為由R 1所表示之碳原子數1~30之脂肪族烴基及碳原子數6~30之含芳香族烴環基、以及由Y 1所表示之碳原子數1~30之2價烴基之取代基,可例舉:碳原子數1~8之烷基;乙烯基、烯丙基、丙烯酸基、甲基丙烯酸基等乙烯性不飽和基;氟、氯、溴、碘等鹵素原子;乙醯基、2-氯乙醯基、丙醯基、辛醯基、丙烯醯基、甲基丙烯醯基、苯基羰基(苯甲醯基)、鄰苯二甲醯基、4-三氟甲基苯甲醯基、特戊醯基、鄰羥苯甲醯基、草醯基、硬脂醯基、甲氧基羰基、乙氧基羰基、第三丁氧基羰基、正十八烷氧基羰基、胺甲醯基等醯基;乙醯氧基、苯甲醯氧基等醯氧基;胺基、乙胺基、二甲胺基、二乙胺基、丁胺基、環戊胺基、2-乙基己基胺基、十二烷基胺基、苯胺基、氯苯胺基、甲苯胺基、甲氧苯胺基、N-甲基-苯胺基、二苯胺基、萘胺基、2-吡啶胺基、甲氧基羰基胺基、苯氧基羰基胺基、乙醯胺基、苯甲醯胺基、甲醯胺基、特戊醯胺基、月桂醯胺基、胺甲醯胺基、N,N-二甲胺基羰基胺基、N,N-二乙胺基羰基胺基、嗎啉基羰基胺基、甲氧基羰基胺基、乙氧基羰基胺基、第三丁氧基羰基胺基、正十八烷氧基羰基胺基、N-甲基-甲氧基羰基胺基、苯氧基羰基胺基、胺磺醯胺基、N,N-二甲胺基磺醯胺基、甲基磺醯胺基、丁基磺醯胺基、苯基磺醯胺基等取代胺基;磺醯胺基、磺醯基、羧基、氰基、磺基、羥基、硝基、巰基、亞胺基、胺甲醯基、磺醯胺基、膦酸基、磷酸基、或羧基、磺基、膦酸基、磷酸基之鹽等。作為碳原子數1~8之烷基,可例舉由R 1所表示之碳原子數1~30之烷基中之碳原子數1~8之烷基。 As an aliphatic hydrocarbon group having 1 to 30 carbon atoms and an aromatic hydrocarbon ring group having 6 to 30 carbon atoms represented by R1 , and a divalent hydrocarbon group having 1 to 30 carbon atoms represented by Y1 Examples of substituents include: alkyl groups with 1 to 8 carbon atoms; ethylenically unsaturated groups such as vinyl, allyl, acrylic, and methacrylic groups; halogen atoms such as fluorine, chlorine, bromine, and iodine; Acyl, 2-chloroacetyl, propionyl, octyl, acryl, methacryl, phenylcarbonyl (benzoyl), phthaloyl, 4-trifluoromethylbenzene Formyl, popentyl, o-hydroxybenzoyl, oxalyl, stearyl, methoxycarbonyl, ethoxycarbonyl, tertiary butoxycarbonyl, n-octadecyloxycarbonyl, Aminoformyl and other acyl groups; Acyloxy, benzoyloxy and other acyloxy groups; Amino, ethylamino, dimethylamino, diethylamino, butylamino, cyclopentylamino, 2 -Ethylhexylamine, dodecylamine, anilino, chloroanilino, toluidine, methoxyanilino, N-methyl-anilino, diphenylamino, naphthylamino, 2-pyridylamine group, methoxycarbonylamine group, phenoxycarbonylamine group, acetamide group, benzamide group, formamide group, pivalylamide group, lauramide group, carbamidamide group, N ,N-Dimethylaminocarbonylamino, N,N-Diethylaminocarbonylamino, Morpholinylcarbonylamino, Methoxycarbonylamino, Ethoxycarbonylamino, Tertiary Butoxycarbonyl Amino group, n-octadecyloxycarbonylamine group, N-methyl-methoxycarbonylamine group, phenoxycarbonylamine group, sulfamoylamine group, N,N-dimethylaminosulfonamide group , methylsulfonamide, butylsulfonamide, phenylsulfonamide and other substituted amino groups; sulfonamide, sulfonyl, carboxyl, cyano, sulfo, hydroxyl, nitro, mercapto, Imino group, carbamoyl group, sulfonamide group, phosphonic acid group, phosphoric acid group, or salts of carboxyl, sulfo group, phosphonic acid group, phosphoric acid group, etc. The alkyl group having 1 to 8 carbon atoms may, for example, be an alkyl group having 1 to 8 carbon atoms among the alkyl groups having 1 to 30 carbon atoms represented by R 1 .
本發明中所規定之基之碳原子數包括取代基之碳原子數。例如,甲苯基係碳原子數7之含芳香族烴環基。 又,本發明中所規定之1個以上之亞甲基被取代為選自<群A>中之2價基而成之基之碳原子數包括2價基之碳原子數。例如,碳原子數10之烷基中之1個亞甲基經-COO-取代之基之碳原子數設為10。又,碳原子數10之烷基中之1個亞甲基被-O-取代之基之碳原子數設為9。對於1個以上之亞甲基被取代為選自下述<群A1>、<群B>、<群C>、<群D>、<群E>、<群F>或<群G>中之2價基而成之基之碳原子數亦如此。 The number of carbon atoms of a group specified in the present invention includes the number of carbon atoms of a substituent. For example, tolyl is an aromatic hydrocarbon-containing ring group having 7 carbon atoms. Also, the number of carbon atoms in a group in which one or more methylene groups specified in the present invention are substituted with divalent groups selected from <Group A> includes the number of carbon atoms in the divalent group. For example, the number of carbon atoms of a group in which one methylene group in an alkyl group having 10 carbon atoms is substituted with -COO- is assumed to be 10. Also, the number of carbon atoms of a group in which one methylene group in the alkyl group having 10 carbon atoms is replaced by -O- is set to 9. One or more methylene groups are substituted to be selected from the following <Group A1>, <Group B>, <Group C>, <Group D>, <Group E>, <Group F> or <Group G> The same is true for the number of carbon atoms in the base formed by the divalent base.
於本發明中,就聚合性組合物之硬化物之接著性及耐熱性變得良好之情況而言,通式(I)中之R 1較佳為可具有取代基之碳原子數5~20之脂肪族烴基或可具有取代基之碳原子數6~20之含芳香族烴環基,更佳為碳原子數5~20之脂肪族烴基,進而較佳為碳原子數5~20之烷基。就同樣之觀點而言,該碳原子數5~20之烷基較佳為直鏈狀。又,就相容性之觀點而言,碳原子數5~20之烷基較佳為不具有取代基。 In the present invention, in the case where the adhesiveness and heat resistance of the cured product of the polymerizable composition become good, R 1 in the general formula (I) preferably has a substituent having 5 to 20 carbon atoms. aliphatic hydrocarbon group or an aromatic hydrocarbon ring group with 6 to 20 carbon atoms which may have substituents, more preferably an aliphatic hydrocarbon group with 5 to 20 carbon atoms, and more preferably an alkane with 5 to 20 carbon atoms base. From the same viewpoint, the alkyl group having 5 to 20 carbon atoms is preferably linear. Moreover, the alkyl group having 5 to 20 carbon atoms preferably has no substituent from the viewpoint of compatibility.
於本發明中,就聚合性組合物之硬化物之接著性及耐熱性變得良好之情況而言,通式(I)中之Y 1較佳為可具有取代基之碳原子數1~10之2價烴基,更佳為可具有取代基之碳原子數1~10之伸烷基或可具有取代基之碳原子數1~10之伸芳基。就同樣之觀點而言,碳原子數1~10之伸烷基及碳原子數1~10之伸芳基較佳為不具有取代基。又,就聚合性組合物之硬化物兼具耐熱性與相容性之觀點而言,該伸烷基之碳原子數較佳為1~8,更佳為2~6。又,該伸烷基較佳為直鏈狀。 In the present invention, Y 1 in the general formula (I) preferably has 1 to 10 carbon atoms which may have a substituent in order to improve the adhesiveness and heat resistance of the cured product of the polymerizable composition. The divalent hydrocarbon group is more preferably an alkylene group having 1 to 10 carbon atoms which may have a substituent or an arylylene group having 1 to 10 carbon atoms which may have a substituent. From the same viewpoint, the alkylene group having 1 to 10 carbon atoms and the arylylene group having 1 to 10 carbon atoms preferably have no substituent. In addition, the number of carbon atoms in the alkylene group is preferably 1-8, more preferably 2-6, from the viewpoint that the cured product of the polymerizable composition has both heat resistance and compatibility. Also, the alkylene group is preferably linear.
於本發明中,硫醚化合物於分子內具有由通式(I)所表示之基之情形時,該化合物中由通式(I)所表示之基之數可為1,亦可為複數。就聚合性組合物之硬化物之接著性及耐熱性變得良好之情況而言,硫醚化合物較佳為於分子內具有複數個由通式(I)所表示之基,更佳為於分子內具有2~8個通式(I)所表示之基,進而較佳為於分子內具有2~6個通式(I)所表示之基,特佳為於分子內具有2~4個通式(I)所表示之基。In the present invention, when the thioether compound has a group represented by the general formula (I) in the molecule, the number of the groups represented by the general formula (I) in the compound may be 1 or plural. In the case where the adhesiveness and heat resistance of the cured product of the polymerizable composition become good, the thioether compound preferably has a plurality of groups represented by the general formula (I) in the molecule, and more preferably has a group represented by the general formula (I) in the molecule There are 2 to 8 groups represented by the general formula (I) in the molecule, more preferably 2 to 6 groups represented by the general formula (I) in the molecule, and particularly preferably 2 to 4 groups in the molecule The group represented by formula (I).
於本發明中,例如可使用下述通式(I-A)所表示之化合物作為具有由通式(I)所表示之基之硫醚化合物。In the present invention, for example, a compound represented by the following general formula (I-A) can be used as the thioether compound having a group represented by the general formula (I).
[化2] [Chem 2]
(式中,R 1表示可具有取代基之碳原子數1~30之脂肪族烴基、可具有取代基之碳原子數6~30之含芳香族烴環基、上述碳原子數1~30之脂肪族烴基中之1個以上之亞甲基被取代為選自下述<群A>中之2價基而成之基、或上述碳原子數6~30之含芳香族烴環基中之1個以上之亞甲基被取代為選自下述<群A>中之2價基而成之基, Y 1為可具有取代基之碳原子數1~30之2價烴基或該碳原子數1~30之2價烴基中之1個以上之亞甲基被取代為選自下述<群A>中之2價基而成之基, n表示1~6之整數, D表示n價基; <群A>:-O-、-CO-、-COO-、-OCO-、-NR 2-、-NR 3CO-或-S- R 2及R 3分別獨立地表示氫原子或碳原子數1~30之烴基) (wherein, R represents an aliphatic hydrocarbon group with 1 to 30 carbon atoms that may have substituents, an aromatic hydrocarbon-containing ring group with 6 to 30 carbon atoms that may have substituents, the above-mentioned aliphatic hydrocarbon group with 1 to 30 carbon atoms One or more methylene groups in the aliphatic hydrocarbon group are substituted with a divalent group selected from the following <Group A>, or one of the above-mentioned aromatic hydrocarbon ring groups with 6 to 30 carbon atoms One or more methylene groups are substituted with divalent groups selected from the following <Group A>, and Y1 is a divalent hydrocarbon group with 1 to 30 carbon atoms that may have a substituent or the carbon atom One or more methylene groups in divalent hydrocarbon groups with numbers 1 to 30 are substituted with divalent groups selected from the following <Group A>, n represents an integer of 1 to 6, and D represents n valency group; <Group A>: -O-, -CO-, -COO-, -OCO-, -NR 2 -, -NR 3 CO- or -S- R 2 and R 3 each independently represent a hydrogen atom or a carbon Hydrocarbon group with 1 to 30 atoms)
式(I-A)中由R 1、R 2、R 3及Y 1所表示之基與通式(I)相同。 The groups represented by R 1 , R 2 , R 3 and Y 1 in formula (IA) are the same as those in general formula (I).
於式(I-A)中之n為1之情形時,作為由D所表示之1價基,可例舉:可具有取代基之碳原子數1~30之脂肪族烴基、可具有取代基之碳原子數6~30之含芳香族烴環基、上述碳原子數1~30之脂肪族烴基中之1個以上之亞甲基被取代為選自下述<群B>中之2價基而成之基、或上述碳原子數6~30之含芳香族烴環基中之1個以上之亞甲基被取代為選自下述<群B>中之2價基而成之基。When n in the formula (I-A) is 1, the monovalent group represented by D includes, for example, an aliphatic hydrocarbon group having 1 to 30 carbon atoms that may have a substituent, and a carbon group that may have a substituent. In the aromatic hydrocarbon ring group having 6 to 30 atoms, one or more methylene groups in the aliphatic hydrocarbon group having 1 to 30 carbon atoms are substituted with divalent groups selected from the following <Group B> or a group in which at least one methylene group in the above-mentioned aromatic hydrocarbon ring group having 6 to 30 carbon atoms is substituted with a divalent group selected from the following <Group B>.
<群B>:-O-、-CO-、-COO-、-OCO-、-NR 20-、-NR 30CO-或-S- R 20及R 30分別獨立地表示氫原子或碳原子數1~30之烴基。 <Group B>: -O-, -CO-, -COO-, -OCO-, -NR 20 -, -NR 30 CO- or -S- R 20 and R 30 each independently represent the number of hydrogen atoms or carbon atoms 1 to 30 hydrocarbon groups.
作為由D所表示之可具有取代基之碳原子數1~30之1價脂肪族烴基及可具有取代基之碳原子數6~30之1價含芳香族烴環基,可例舉與上述由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基及可具有取代基之碳原子數6~30之含芳香族烴環基相同者。 Examples of the optionally substituted monovalent aliphatic hydrocarbon group having 1 to 30 carbon atoms and the optionally substituted monovalent aromatic hydrocarbon ring group having 6 to 30 carbon atoms represented by D include those mentioned above. The optionally substituted aliphatic hydrocarbon group having 1 to 30 carbon atoms represented by R 1 and the optionally substituted aromatic hydrocarbon ring group having 6 to 30 carbon atoms are the same.
作為<群B>中由R 20及R 30所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 Examples of the hydrocarbon groups having 1 to 30 carbon atoms represented by R 20 and R 30 in <Group B> include the same ones as the hydrocarbon groups having 1 to 30 carbon atoms represented by R 2 and R 3 described above.
於式(I-A)中之n為2之情形時,作為由D所表示之2價基,可例舉由下述式(1)所表示之基。When n in formula (I-A) is 2, as a divalent group represented by D, the group represented by following formula (1) is mentioned.
[化3] [Chem 3]
(式中,Y 10表示單鍵、-CO-、-NR 200-、-S-、可具有取代基之碳原子數1~30之2價烴基或該碳原子數1~30之2價烴基中之1個以上之亞甲基被取代為選自下述<群C>中之2價基而成之基, R 200表示氫原子或碳原子數1~30之烴基, Z 1及Z 2分別獨立地表示直接鍵、-CO-、可具有取代基之碳原子數1~30之2價脂肪族烴基、或可具有取代基之碳原子數6~30之2價含芳香族烴環基, *表示鍵結鍵; <群C>:-O-、-CO-、-COO-、-OCO-、-NR 21-、-NR 31CO-或-S- R 21及R 31分別獨立地表示氫原子或碳原子數1~30之烴基) (wherein, Y 10 represents a single bond, -CO-, -NR 200 -, -S-, a divalent hydrocarbon group with 1 to 30 carbon atoms which may have a substituent, or the divalent hydrocarbon group with 1 to 30 carbon atoms In which one or more methylene groups are substituted with divalent groups selected from the following <Group C>, R 200 represents a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms, Z 1 and Z 2 Each independently represents a direct bond, -CO-, an optionally substituted divalent aliphatic hydrocarbon group having 1 to 30 carbon atoms, or an optionally substituted divalent aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms , * represents a bonding bond; <Group C>: -O-, -CO-, -COO-, -OCO-, -NR 21 -, -NR 31 CO- or -S- R 21 and R 31 are independently Represents a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms)
作為式(1)中由Y 10所表示之可具有取代基之碳原子數1~30之2價烴基,可例舉與上述由Y 1所表示之碳原子數1~30之2價烴基相同者。 As the divalent hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by Y10 in formula (1), the same divalent hydrocarbon group as the above-mentioned divalent hydrocarbon group having 1 to 30 carbon atoms represented by Y1 can be exemplified. By.
作為式(1)中由R 200、R 21及R 31所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 Examples of the hydrocarbon group having 1 to 30 carbon atoms represented by R 200 , R 21 and R 31 in formula (1) include the same hydrocarbon groups as those represented by R 2 and R 3 described above. By.
作為式(1)中由Z 1及Z 2所表示之可具有取代基之碳原子數1~30之2價脂肪族烴基,可例舉自由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基中去除1個氫原子而成之2價基。 Examples of the divalent aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have substituents represented by Z1 and Z2 in the formula (1) include carbon atoms which may have substituents represented by R1 . A divalent group formed by removing one hydrogen atom from an aliphatic hydrocarbon group of 1 to 30.
作為式(1)中由Z 1及Z 2所表示之可具有取代基之碳原子數6~30之2價含芳香族烴環基,可例舉自由R 1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基中去除1個氫原子而成之2價基。 Examples of the divalent aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms that may have substituents represented by Z1 and Z2 in formula (1) include those represented by R1 that may have substituents. A divalent group obtained by removing one hydrogen atom from an aromatic hydrocarbon-containing ring group with 6 to 30 carbon atoms.
於式(I-A)中之n為3之情形時,作為由D所表示之3價基,可例舉由下述式(2)所表示之基。When n in formula (I-A) is 3, as a trivalent group represented by D, the group represented by following formula (2) is mentioned.
[化4] [chemical 4]
(式中,Y 11表示可具有取代基之碳原子數1~30之3價烴基或該碳原子數1~30之3價烴基中之1個以上之亞甲基被取代為選自下述<群D>中之2價基而成之基, Z 1、Z 2及Z 3分別獨立地表示直接鍵、-CO-、可具有取代基之碳原子數1~30之2價脂肪族烴基、或可具有取代基之碳原子數6~30之2價含芳香族烴環基, *表示鍵結鍵; <群D>:-O-、-CO-、-COO-、-OCO-、-NR 22-、-NR 32CO-或-S- R 22及R 32分別獨立地表示氫原子或碳原子數1~30之烴基) (wherein, Y11 represents a trivalent hydrocarbon group having 1 to 30 carbon atoms which may have substituents or one or more methylene groups in the trivalent hydrocarbon group having 1 to 30 carbon atoms are substituted with a group selected from the following A group consisting of divalent groups in <Group D>, Z 1 , Z 2 and Z 3 each independently represent a direct bond, -CO-, a divalent aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent , or a divalent aromatic hydrocarbon-containing ring group with 6 to 30 carbon atoms that may have a substituent, * represents a bond; <Group D>: -O-, -CO-, -COO-, -OCO-, -NR 22 -, -NR 32 CO- or -S- R 22 and R 32 each independently represent a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms)
作為式(2)中由Y 11所表示之可具有取代基之碳原子數1~30之3價烴基,可例舉自上述由Y 1所表示之碳原子數1~30之2價烴基中進而去除1個氫原子而成之3價基。 The trivalent hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by Y 11 in the formula (2) may be exemplified from the divalent hydrocarbon groups having 1 to 30 carbon atoms represented by Y 1 above. Then remove one hydrogen atom to form a trivalent group.
作為式(2)中由R 22及R 32所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 The hydrocarbon group having 1 to 30 carbon atoms represented by R 22 and R 32 in the formula (2) may, for example, be the same as the hydrocarbon group having 1 to 30 carbon atoms represented by R 2 and R 3 described above.
作為式(2)中由Z 1、Z 2及Z 3所表示之可具有取代基之碳原子數1~30之2價脂肪族烴基,可例舉自上述由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基中去除1個氫原子而成之2價基。 The optionally substituted divalent aliphatic hydrocarbon groups having 1 to 30 carbon atoms represented by Z 1 , Z 2 and Z 3 in formula (2) may be exemplified by the above-mentioned optionally substituted aliphatic hydrocarbon groups represented by R 1 . A divalent group formed by removing one hydrogen atom from an aliphatic hydrocarbon group with 1 to 30 carbon atoms in the group.
作為式(2)中由Z 1、Z 2及Z 3所表示之可具有取代基之碳原子數6~30之2價含芳香族烴環基,可例舉自上述由R 1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基中去除1個氫原子而成之2價基。 Examples of divalent aromatic hydrocarbon-containing ring groups having 6 to 30 carbon atoms which may have substituents represented by Z 1 , Z 2 and Z 3 in formula (2) include those represented by R 1 above. A divalent group obtained by removing one hydrogen atom from an aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms which may have a substituent.
於式(I-A)中之n為4之情形時,作為由D所表示之4價基,可例舉由下述式(3)所表示之基。When n in formula (I-A) is 4, as a tetravalent group represented by D, the group represented by following formula (3) is mentioned.
[化5] [chemical 5]
(式中,Y 12表示可具有取代基之碳原子數1~30之4價烴基或該碳原子數1~30之4價烴基中之1個以上之亞甲基被取代為選自下述<群E>中之2價基而成之基, Z 1、Z 2、Z 3及Z 4分別獨立地表示直接鍵、-CO-、可具有取代基之碳原子數1~30之2價脂肪族烴基、或可具有取代基之碳原子數6~30之2價含芳香族烴環基, *表示鍵結鍵; <群E>:-O-、-CO-、-COO-、-OCO-、-NR 23-、-NR 33CO-或-S- R 23及R 33分別獨立地表示氫原子或碳原子數1~30之烴基) (In the formula, Y12 represents a quaternary hydrocarbon group with 1 to 30 carbon atoms that may have a substituent or one or more methylene groups in the 4-valent hydrocarbon group with 1 to 30 carbon atoms are substituted with a group selected from the following A group formed from divalent groups in <Group E>, Z 1 , Z 2 , Z 3 , and Z 4 each independently represent a direct bond, -CO-, and a divalent group with 1 to 30 carbon atoms that may have a substituent An aliphatic hydrocarbon group, or a divalent aromatic hydrocarbon ring group with 6 to 30 carbon atoms which may have a substituent, * indicates a bond; <Group E>: -O-, -CO-, -COO-, - OCO-, -NR 23 -, -NR 33 CO- or -S- R 23 and R 33 each independently represent a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms)
作為式(3)中由Y 12所表示之可具有取代基之碳原子數1~30之4價烴基,可例舉自上述由Y 1所表示之碳原子數1~30之2價烴基中進而去除2個氫原子而成之4價基。 The tetravalent hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by Y12 in the formula (3) may be exemplified from the divalent hydrocarbon group having 1 to 30 carbon atoms represented by Y1 above. Then remove 2 hydrogen atoms to form a 4-valent group.
作為式(3)中由R 23及R 33所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 The hydrocarbon group having 1 to 30 carbon atoms represented by R 23 and R 33 in formula (3) may, for example, be the same as the hydrocarbon group having 1 to 30 carbon atoms represented by R 2 and R 3 described above.
作為式(3)中由Z 1、Z 2、Z 3及Z 4所表示之可具有取代基之碳原子數1~30之2價脂肪族烴基,可例舉自上述由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基中去除1個氫原子而成之2價基。 Examples of divalent aliphatic hydrocarbon groups having 1 to 30 carbon atoms which may have substituents represented by Z 1 , Z 2 , Z 3 and Z 4 in formula (3) include those represented by R 1 above. A divalent group obtained by removing one hydrogen atom from an aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent.
作為式(3)中由Z 1、Z 2、Z 3及Z 4所表示之可具有取代基之碳原子數6~30之2價含芳香族烴環基,可例舉自上述由R 1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基中去除1個氫原子而成之2價基。 Examples of divalent aromatic hydrocarbon-containing ring groups having 6 to 30 carbon atoms which may have substituents represented by Z 1 , Z 2 , Z 3 and Z 4 in formula (3) include the above-mentioned R 1 The divalent group obtained by removing one hydrogen atom from the aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms which may have a substituent.
於式(I-A)中之n為5之情形時,作為由D所表示之5價基,可例舉由下述式(4)所表示之基。When n in formula (I-A) is 5, as a pentavalent group represented by D, the group represented by following formula (4) is mentioned.
[化6] [chemical 6]
(式中,Y 13表示可具有取代基之碳原子數1~30之5價烴基或該碳原子數1~30之5價烴基中之1個以上之亞甲基被取代為選自下述<群F>中之2價基而成之基, Z 1、Z 2、Z 3、Z 4及Z 5分別獨立地表示直接鍵、-CO-、可具有取代基之碳原子數1~30之2價脂肪族烴基、或可具有取代基之碳原子數6~30之2價含芳香族烴環基, *表示鍵結鍵; <群F>:-O-、-CO-、-COO-、-OCO-、-NR 24-、-NR 34CO-或-S- R 24及R 34分別獨立地表示氫原子或碳原子數1~30之烴基) (In the formula, Y13 represents a 5-valent hydrocarbon group with 1 to 30 carbon atoms that may have a substituent, or one or more methylene groups in the 5-valent hydrocarbon group with 1 to 30 carbon atoms are substituted with a group selected from the following In <Group F>, a group consisting of a divalent group, Z 1 , Z 2 , Z 3 , Z 4 and Z 5 each independently represent a direct bond, -CO-, and the number of carbon atoms that may have a substituent is 1 to 30 A divalent aliphatic hydrocarbon group, or a divalent aromatic hydrocarbon ring group with 6 to 30 carbon atoms that may have a substituent, * indicates a bond; <Group F>: -O-, -CO-, -COO -, -OCO-, -NR 24 -, -NR 34 CO- or -S- R 24 and R 34 each independently represent a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms)
作為式(4)中由Y 13所表示之可具有取代基之碳原子數1~30之5價烴基,可例舉自上述由Y 1所表示之碳原子數1~30之2價烴基中進而去除3個氫原子而成之5價基。 The pentavalent hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by Y13 in the formula (4) may, for example, be selected from the divalent hydrocarbon groups having 1 to 30 carbon atoms represented by Y1 above. Then remove 3 hydrogen atoms to form a pentadyl group.
作為式(4)中由R 24及R 34所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 The hydrocarbon group having 1 to 30 carbon atoms represented by R 24 and R 34 in formula (4) may, for example, be the same as the hydrocarbon group having 1 to 30 carbon atoms represented by R 2 and R 3 described above.
作為式(4)中由Z 1、Z 2、Z 3、Z 4及Z 5所表示之可具有取代基之碳原子數1~30之2價脂肪族烴基,可例舉自上述由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基中去除1個氫原子而成之2價基。 Examples of divalent aliphatic hydrocarbon groups having 1 to 30 carbon atoms which may have substituents represented by Z 1 , Z 2 , Z 3 , Z 4 , and Z 5 in formula (4) include those represented by R 1 described above. A divalent group obtained by removing one hydrogen atom from an aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent.
作為式(4)中由Z 1、Z 2、Z 3、Z 4及Z 5所表示之可具有取代基之碳原子數6~30之2價含芳香族烴環基,可例舉自上述由R 1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基中去除1個氫原子而成之2價基。 Examples of divalent aromatic hydrocarbon-containing divalent aromatic hydrocarbon ring groups having 6 to 30 carbon atoms which may have substituents represented by Z 1 , Z 2 , Z 3 , Z 4 and Z 5 in formula (4) include the above-mentioned A divalent group formed by removing one hydrogen atom from the optionally substituent C6-30 aromatic hydrocarbon-containing ring group represented by R 1 .
於式(I-A)中之n為6之情形時,作為由D所表示之6價基,可例舉由下述式(5)所表示之基。When n in formula (I-A) is 6, as a hexavalent group represented by D, the group represented by following formula (5) is mentioned.
[化7] [chemical 7]
(式中,Y 14表示可具有取代基之碳原子數1~30之6價烴基或該碳原子數1~30之6價烴基中之1個以上之亞甲基被取代為選自下述<群G>中之2價基而成之基, Z 1、Z 2、Z 3、Z 4、Z 5及Z 6分別獨立地表示直接鍵、-CO-、可具有取代基之碳原子數1~30之2價脂肪族烴基、或可具有取代基之碳原子數6~30之2價含芳香族烴環基, *表示鍵結鍵; <群G>:-O-、-CO-、-COO-、-OCO-、-NR 25-、-NR 35CO-或-S- R 25及R 35分別獨立地表示氫原子或碳原子數1~30之烴基) (wherein, Y14 represents a hexavalent hydrocarbon group with 1 to 30 carbon atoms which may have substituents or one or more methylene groups in the hexavalent hydrocarbon group with 1 to 30 carbon atoms are substituted with a group selected from the following <Group G> is a group consisting of divalent groups, Z 1 , Z 2 , Z 3 , Z 4 , Z 5 and Z 6 each independently represent a direct bond, -CO-, and the number of carbon atoms that may have a substituent A divalent aliphatic hydrocarbon group of 1 to 30, or a divalent aromatic hydrocarbon ring group having 6 to 30 carbon atoms which may have a substituent, * indicates a bond; <Group G>: -O-, -CO- , -COO-, -OCO-, -NR 25 -, -NR 35 CO- or -S- R 25 and R 35 each independently represent a hydrogen atom or a hydrocarbon group with 1 to 30 carbon atoms)
作為式(5)中由Y 14所表示之可具有取代基之碳原子數1~30之6價烴基,可例舉自上述由Y 1所表示之碳原子數1~30之2價烴基中進而去除4個氫原子而成之6價基。 The hexavalent hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by Y14 in the formula (5) may be exemplified from the divalent hydrocarbon group having 1 to 30 carbon atoms represented by Y1 above. Then remove 4 hydrogen atoms to form a hexavalent group.
作為式(5)中由R 25及R 35所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 The hydrocarbon group having 1 to 30 carbon atoms represented by R 25 and R 35 in the formula (5) may, for example, be the same as the hydrocarbon group having 1 to 30 carbon atoms represented by R 2 and R 3 described above.
作為式(5)中由Z 1、Z 2、Z 3、Z 4、Z 5及Z 6所表示之可具有取代基之碳原子數1~30之2價脂肪族烴基,可例舉自上述由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基中去除1個氫原子而成之2價基。 Examples of divalent aliphatic hydrocarbon groups having 1 to 30 carbon atoms that may have substituents represented by Z 1 , Z 2 , Z 3 , Z 4 , Z 5 and Z 6 in formula (5) include the above-mentioned A divalent group obtained by removing one hydrogen atom from an aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent represented by R 1 .
作為式(5)中由Z 1、Z 2、Z 3、Z 4、Z 5及Z 6所表示之可具有取代基之碳原子數6~30之2價含芳香族烴環基,可例舉自上述由R 1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基中去除1個氫原子而成之2價基。 Examples of divalent aromatic hydrocarbon-containing ring groups having 6 to 30 carbon atoms that may have substituents represented by Z 1 , Z 2 , Z 3 , Z 4 , Z 5 and Z 6 in formula (5) include A divalent group obtained by removing one hydrogen atom from the above-mentioned optionally substituted carbon atom-containing aromatic hydrocarbon ring group represented by R 1 and having 6 to 30 carbon atoms.
於本發明中,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,式(I-A)中之n較佳為1~6,更佳為1~5,進而較佳為1~4。In the present invention, when the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better and the heat resistance, adhesiveness, and optical properties of the cured product also become better, n in the formula (I-A) Preferably it is 1-6, More preferably, it is 1-5, More preferably, it is 1-4.
於式(I-A)中之n為1之情形時,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,由D所表示之1價基較佳為可具有取代基之碳原子數1~30之脂肪族烴基、或可具有取代基之碳原子數6~30之含芳香族烴環基。就同樣之觀點而言,該含芳香族烴環基較佳為具有單環結構之芳香族烴環,進而較佳為2個單環結構之芳香族烴環連結而成者。又,就聚合性組合物之耐濕熱性變得更良好之情況而言,較佳為2個芳香族烴環由-S-連結。又,就聚合性組合物之硬化物之耐熱性變得良好之情況而言,該含芳香族烴環基較佳為具有取代基。進而,作為該取代基,就相容性之觀點而言,較佳為碳原子數1~10之烷基或羥基,更佳為含芳香族烴環基經烷基及羥基取代。該烷基較佳為支鏈狀。作為碳原子數1~10之烷基,可例舉上述由R 1所表示之碳原子數1~30之烷基中之碳原子數1~10之烷基。又,就同樣之觀點而言,由D所表示之上述脂肪族烴基之碳原子數較佳為5~20,更佳為8~19,更佳為10~15。又,該脂肪族烴基較佳為可具有取代基之烷基,更佳為不具有取代基之烷基。於由D所表示之1價基為可具有取代基之脂肪族烴之情形時,R 1較佳為可具有取代基之碳原子數5~23之脂肪族烴基或可具有取代基之碳原子數5~23之脂肪族烴基中之1個以上之亞甲基被取代為-COO-或-OCO-而成之基,更佳為可具有取代基之碳原子數5~23之脂肪族烴基中之1個以上之亞甲基被取代為-COO-或-OCO-而成之基,進而較佳為可具有取代基之碳原子數5~23之烷基中之1個以上之亞甲基被取代為-COO-或-OCO-而成之基,進而更佳為未經取代之碳原子數9~23之烷基中之1個亞甲基被取代為-COO-或-OCO-而成之基。藉由使脂肪族烴基之碳原子數處於上述範圍內,相容性及耐熱性變得更良好。又,藉由R 1於其結構中具有-COO-或-OCO-,耐熱性變得更良好。就耐濕熱性之觀點而言,由R 1所表示之基中之-COO-及-OCO-之數較佳為1~3,更佳為1~2。 When n in the formula (IA) is 1, the moisture and heat resistance of the cured product of the polymerizable composition becomes better, and the heat resistance, adhesiveness and optical properties of the cured product also become better. In other words, the monovalent group represented by D is preferably an aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent, or an aromatic hydrocarbon ring group having 6 to 30 carbon atoms which may have a substituent. From the same viewpoint, the aromatic hydrocarbon-containing ring group is preferably an aromatic hydrocarbon ring having a monocyclic structure, and is more preferably formed by linking two aromatic hydrocarbon rings having a monocyclic structure. Moreover, when the heat-and-moisture resistance of a polymeric composition becomes more favorable, it is preferable that two aromatic hydrocarbon rings are connected by -S-. In addition, when the heat resistance of the cured product of the polymerizable composition becomes good, it is preferable that the aromatic hydrocarbon-containing ring group has a substituent. Furthermore, the substituent is preferably an alkyl group having 1 to 10 carbon atoms or a hydroxyl group from the viewpoint of compatibility, and is more preferably an aromatic hydrocarbon-containing ring group substituted with an alkyl group or hydroxyl group. The alkyl group is preferably branched. The alkyl group having 1 to 10 carbon atoms may, for example, be an alkyl group having 1 to 10 carbon atoms among the alkyl groups having 1 to 30 carbon atoms represented by R 1 described above. Also, from the same viewpoint, the number of carbon atoms in the aliphatic hydrocarbon group represented by D is preferably 5-20, more preferably 8-19, and still more preferably 10-15. Also, the aliphatic hydrocarbon group is preferably an alkyl group which may have a substituent, more preferably an alkyl group which does not have a substituent. When the monovalent group represented by D is an aliphatic hydrocarbon which may have a substituent, R1 is preferably an aliphatic hydrocarbon group with 5 to 23 carbon atoms which may have a substituent or a carbon atom which may have a substituent A group in which one or more methylene groups in an aliphatic hydrocarbon group of 5 to 23 is substituted with -COO- or -OCO-, more preferably an aliphatic hydrocarbon group of 5 to 23 carbon atoms which may have substituents A group in which one or more methylene groups are substituted with -COO- or -OCO-, and more preferably one or more methylene groups in an alkyl group having 5 to 23 carbon atoms that may have a substituent A group in which the group is substituted with -COO- or -OCO-, and more preferably one methylene group in an unsubstituted alkyl group having 9 to 23 carbon atoms is substituted with -COO- or -OCO- The foundation of becoming. When the number of carbon atoms of the aliphatic hydrocarbon group is within the above-mentioned range, compatibility and heat resistance become more favorable. Also, when R 1 has -COO- or -OCO- in its structure, heat resistance becomes more favorable. From the viewpoint of moisture and heat resistance, the number of -COO- and -OCO- in the group represented by R 1 is preferably 1-3, more preferably 1-2.
於式(I-A)中之n為2之情形時,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,式(1)中之Y 10較佳為-S-。於Y 10為-S-之情形時,較佳為Z 1及Z 2為可具有取代基之碳原子數1~30之2價脂肪族烴基、或Z 1及Z 2為可具有取代基之碳原子數6~30之2價含芳香族烴環基之化合物。 就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,由Z 1及Z 2所表示之碳原子數1~30之2價脂肪族烴基較佳為碳原子數1~30之伸烷基。就同樣之觀點而言,該伸烷基較佳為直鏈狀。又,該伸烷基較佳為不具有取代基。進而,就相容性之觀點而言,該伸烷基之碳原子數較佳為1~10,更佳為1~4。 就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,由Z 1及Z 2所表示之碳原子數6~30之2價含芳香族烴環基較佳為單環結構之芳香族烴環,更佳為伸苯基。又,該含芳香族烴環基較佳為具有取代基。作為該取代基,較佳為碳原子數1~10之烷基。就相容性之觀點而言,該烷基較佳為支鏈狀。作為碳原子數1~10之烷基,可例舉上述由R 1所表示之碳原子數1~30之烷基中之碳原子數1~10之烷基。 When n in the formula (IA) is 2, the moisture and heat resistance of the cured product of the polymerizable composition becomes better, and the heat resistance, adhesiveness and optical properties of the cured product also become better. In other words, Y 10 in formula (1) is preferably -S-. When Y 10 is -S-, Z 1 and Z 2 are preferably divalent aliphatic hydrocarbon groups with 1 to 30 carbon atoms that may have substituents, or Z 1 and Z 2 may have substituents. A divalent compound containing an aromatic hydrocarbon ring group with 6 to 30 carbon atoms. In the case where the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better and the heat resistance, adhesiveness, and optical properties of the cured product also become better, the number of carbon atoms represented by Z 1 and Z 2 The divalent aliphatic hydrocarbon group of 1 to 30 is preferably an alkylene group having 1 to 30 carbon atoms. From the same viewpoint, the alkylene group is preferably linear. Moreover, it is preferable that this alkylene group does not have a substituent. Furthermore, from the viewpoint of compatibility, the number of carbon atoms in the alkylene group is preferably 1-10, more preferably 1-4. In the case where the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better and the heat resistance, adhesiveness, and optical properties of the cured product also become better, the number of carbon atoms represented by Z 1 and Z 2 The divalent aromatic hydrocarbon-containing ring group of 6 to 30 is preferably an aromatic hydrocarbon ring with a monocyclic structure, more preferably a phenylene group. Also, the aromatic hydrocarbon-containing ring group preferably has a substituent. The substituent is preferably an alkyl group having 1 to 10 carbon atoms. From the viewpoint of compatibility, the alkyl group is preferably branched. The alkyl group having 1 to 10 carbon atoms may, for example, be an alkyl group having 1 to 10 carbon atoms among the alkyl groups having 1 to 30 carbon atoms represented by R 1 described above.
於式(I-A)中之n為4之情形時,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,式(3)中之Y 12較佳為碳原子數1~30之4價脂肪族烴基,更佳為碳原子數1~30之烷四基。該烷四基之碳原子數較佳為1~10,更佳為1~7。 式(3)中之Z 1、Z 2、Z 3及Z 4較佳為直接鍵。 When n in the formula (IA) is 4, the moisture and heat resistance of the cured product of the polymerizable composition becomes better, and the heat resistance, adhesiveness and optical properties of the cured product also become better. In other words, Y 12 in formula (3) is preferably a tetravalent aliphatic hydrocarbon group having 1 to 30 carbon atoms, more preferably an alkanetetrayl group having 1 to 30 carbon atoms. The number of carbon atoms of the alkanetetrayl group is preferably 1-10, more preferably 1-7. Z 1 , Z 2 , Z 3 and Z 4 in formula (3) are preferably direct bonds.
作為本發明之硫醚化合物(A),就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性及接著性亦變得良好之情況而言,由下述通式(I-B)所表示之化合物亦較佳。As the thioether compound (A) of the present invention, when the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better, and the heat resistance and adhesiveness of the cured product also become better, the following general Compounds represented by formula (I-B) are also preferred.
[化7A] [Chem 7A]
(式中,R 11表示可具有取代基之碳原子數1~30之脂肪族烴基、可具有取代基之碳原子數6~30之含芳香族烴環基、上述碳原子數1~30之脂肪族烴基中之1個以上之亞甲基被取代為選自下述<群A1>中之2價基而成之基、或上述碳原子數6~30之含芳香族烴環基中之1個以上之亞甲基被取代為選自下述<群A1>中之2價基而成之基, n1表示1~6之整數, D1表示可具有取代基之碳原子數6~30之含芳香族烴環基或可具有取代基之碳原子數6~30之含芳香族烴環基中之1個以上之亞甲基被取代為選自下述<群A1>中之2價基而成之基; <群A1>:-O-、-CO-、-COO-、-OCO-、-NR 2a-、-NR 3aCO-或-S- R 2a及R 3a分別獨立地表示氫原子或碳原子數1~30之烴基) (In the formula, R11 represents an aliphatic hydrocarbon group with 1 to 30 carbon atoms that may have substituents, an aromatic hydrocarbon-containing ring group with 6 to 30 carbon atoms that may have substituents, the above-mentioned aliphatic hydrocarbon group with 1 to 30 carbon atoms One or more methylene groups in the aliphatic hydrocarbon group are substituted with a divalent group selected from the following <Group A1>, or one of the above-mentioned aromatic hydrocarbon ring groups having 6 to 30 carbon atoms One or more methylene groups are substituted with divalent groups selected from the following <Group A1>, n1 represents an integer of 1 to 6, and D1 represents an optional substituent having 6 to 30 carbon atoms One or more methylene groups in an aromatic hydrocarbon-containing ring group or an optionally substituted aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms is substituted with a divalent group selected from the following <Group A1> Formed base; <Group A1>: -O-, -CO-, -COO-, -OCO-, -NR 2a -, -NR 3a CO- or -S- R 2a and R 3a each independently represent hydrogen atoms or hydrocarbon groups with 1 to 30 carbon atoms)
作為由R 11所表示之可具有取代基之碳原子數1~30之脂肪族烴基及可具有取代基之碳原子數6~30之含芳香族烴環基,可例舉與上述由R 1所表示之可具有取代基之碳原子數1~30之脂肪族烴基及可具有取代基之碳原子數6~30之含芳香族烴環基相同者。 The aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent and the aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms which may have a substituent represented by R 11 include the same as those represented by R 11 above. The aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent and the aromatic hydrocarbon-containing ring group having 6 to 30 carbon atoms which may have a substituent are the same.
作為由D1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基,可例舉與上述由R 1所表示之可具有取代基之碳原子數6~30之含芳香族烴環基相同者。 The aromatic hydrocarbon ring group having 6 to 30 carbon atoms which may have a substituent represented by D1 may, for example, be the same as the aromatic hydrocarbon ring group having 6 to 30 carbon atoms which may have a substituent represented by R1 . Those with the same hydrocarbon ring group.
作為<群A1>中由R 2a及R 3a所表示之碳原子數1~30之烴基,可例舉與上述由R 2及R 3所表示之碳原子數1~30之烴基相同者。 Examples of the hydrocarbon groups having 1 to 30 carbon atoms represented by R 2a and R 3a in <Group A1> include the same ones as the hydrocarbon groups having 1 to 30 carbon atoms represented by R 2 and R 3 described above.
就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,上述通式(I-B)中之R 11較佳為可具有取代基之碳原子數1~30之脂肪族烴基。就同樣之觀點而言,該脂肪族烴基較佳為烷基。又,該脂肪族烴基之碳原子數較佳為1~10,更佳為4~8。該脂肪族烴基較佳為未經取代。 就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,上述通式(I-B)中之n1較佳為1~4,更佳為2~3。 就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,上述通式(I-B)中由D1所表示之含芳香族烴環基較佳為具有單環結構之芳香族烴環,更佳為苯基。該含芳香族烴環基之碳原子數較佳為6~20,更佳為6~16,進而較佳為6~110。又,就聚合性組合物之硬化物之耐熱性變得良好之情況而言,該含芳香族烴環基較佳為具有取代基。作為該取代基,就相容性之觀點而言,較佳為碳原子數1~10之烷基或羥基,其中尤佳為碳原子數1~4之烷基或羥基,且更佳為含芳香族烴環基經烷基及羥基取代。作為該碳原子數1~10之烷基,可例舉上述由R 1所表示之碳原子數1~30之烷基中之碳原子數1~10之烷基。 R11 in the above general formula (IB) is preferable in the case where the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better and the heat resistance, adhesiveness, and optical properties of the cured product also become better. It is an aliphatic hydrocarbon group having 1 to 30 carbon atoms which may have a substituent. From the same viewpoint, the aliphatic hydrocarbon group is preferably an alkyl group. Also, the number of carbon atoms in the aliphatic hydrocarbon group is preferably 1-10, more preferably 4-8. The aliphatic hydrocarbon group is preferably unsubstituted. In the case where the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better and the heat resistance, adhesiveness, and optical properties of the cured product also become better, n1 in the above general formula (IB) is preferably 1-4, more preferably 2-3. In the case where the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better and the heat resistance, adhesiveness, and optical properties of the cured product also become better, the compound represented by D1 in the above general formula (IB) The aromatic hydrocarbon-containing ring group is preferably an aromatic hydrocarbon ring having a monocyclic structure, more preferably a phenyl group. The number of carbon atoms in the aromatic hydrocarbon-containing ring group is preferably 6-20, more preferably 6-16, and still more preferably 6-110. In addition, when the heat resistance of the cured product of the polymerizable composition becomes good, it is preferable that the aromatic hydrocarbon-containing ring group has a substituent. As the substituent, from the viewpoint of compatibility, it is preferably an alkyl group or hydroxyl group having 1 to 10 carbon atoms, particularly preferably an alkyl group or hydroxyl group having 1 to 4 carbon atoms, and more preferably a group containing The aromatic hydrocarbon ring group is substituted by an alkyl group and a hydroxyl group. The alkyl group having 1 to 10 carbon atoms may, for example, be an alkyl group having 1 to 10 carbon atoms among the alkyl groups having 1 to 30 carbon atoms represented by R 1 described above.
於本發明中,硫醚化合物(A)可使用市售品。作為硫醚化合物(A)之市售品,例如可例舉:Adekastab AO-412S、Adekastab AO-503及Adekastab AO-26(ADEKA股份有限公司製造);以及Irganox PS800FL及Irganox PS802FL(BASF公司製造)等。In this invention, a commercial item can be used for a thioether compound (A). Commercially available thioether compounds (A) include, for example, Adekastab AO-412S, Adekastab AO-503, and Adekastab AO-26 (manufactured by ADEKA Co., Ltd.); and Irganox PS800FL and Irganox PS802FL (manufactured by BASF Corporation). wait.
於本發明中,可單獨使用上述硫醚化合物之1種,亦可將上述硫醚化合物之2種以上組合使用。於將2種以上之硫醚化合物組合使用之情形時,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,較佳為將式(I-A)中之n為1所表示之化合物與式(I-A)中之n為2所表示之化合物組合使用。In the present invention, one of the above-mentioned thioether compounds may be used alone, or two or more of the above-mentioned thioether compounds may be used in combination. When two or more thioether compounds are used in combination, the heat and humidity resistance of the cured product of the polymerizable composition becomes better, and the heat resistance, adhesiveness and optical properties of the cured product also become better Specifically, it is preferable to use the compound represented by n in formula (I-A) being 1 and the compound represented by n in formula (I-A) being 2 in combination.
關於本發明之聚合性組合物中之硫醚化合物(A)之含量,就聚合性組合物之硬化物之耐熱性及接著性變得良好之情況而言,相對於下述陽離子聚合性化合物(B)100質量份,較佳為含有0.1質量份以上且未達10質量份之硫醚化合物(A),更佳為含有0.2質量份以上且未達5質量份之硫醚化合物(A),進而較佳為含有0.3質量份以上且未達3質量份之硫醚化合物(A),特佳為含有0.4質量份以上且未達2質量份之硫醚化合物(A)。Regarding the content of the thioether compound (A) in the polymerizable composition of the present invention, when the heat resistance and adhesiveness of the cured product of the polymerizable composition become good, the following cation polymerizable compound ( B) 100 parts by mass, preferably more than 0.1 parts by mass and less than 10 parts by mass of the thioether compound (A), more preferably more than 0.2 parts by mass and less than 5 parts by mass of the thioether compound (A), Furthermore, it is more preferable to contain 0.3 mass part or more and less than 3 mass parts of thioether compounds (A), and it is especially preferable to contain 0.4 mass parts or more and less than 2 mass parts of thioether compounds (A).
其次,對本發明之聚合性組合物中所含之陽離子聚合性化合物(B)進行說明。 於本發明中,陽離子聚合性化合物係指藉由因光照射或加熱而活化之陽離子聚合起始劑引起高分子化或交聯反應之化合物。 Next, the cation polymerizable compound (B) contained in the polymerizable composition of this invention is demonstrated. In the present invention, the cationically polymerizable compound refers to a compound that causes macromolecularization or crosslinking reaction by a cationic polymerization initiator activated by light irradiation or heating.
於本發明中,可使用公知之陽離子聚合性化合物作為陽離子聚合性化合物(B),並無特別限制。作為陽離子聚合性化合物(B),例如可例舉環氧化合物及氧雜環丁烷化合物(B4)。就聚合性組合物之耐濕熱性變得更良好且耐熱性及接著性亦變得良好之情況而言,陽離子聚合性化合物(B)較佳為含有選自由脂環式環氧化合物(B1)、脂肪族環氧化合物(B2)及芳香族環氧化合物(B3)所組成之群中之至少1種。In the present invention, a known cationically polymerizable compound can be used as the cationically polymerizable compound (B), without any particular limitation. As a cationically polymerizable compound (B), an epoxy compound and an oxetane compound (B4) are mentioned, for example. In the case where the heat-and-moisture resistance of the polymerizable composition becomes better, and the heat resistance and adhesiveness also become better, the cationic polymerizable compound (B) preferably contains an alicyclic epoxy compound (B1) , at least one of the group consisting of an aliphatic epoxy compound (B2) and an aromatic epoxy compound (B3).
於本發明中,就聚合性組合物之硬化性變得良好之情況而言,陽離子聚合性化合物(B)較佳為含有脂環式環氧化合物(B1)。脂環式環氧化合物係具有氧化環烯烴結構且不具有芳香族環之化合物。 氧化環烯烴結構係如藉由利用氧化劑對含環己烯環化合物或含環戊烯環化合物進行環氧化而獲得之環氧環己烷結構或環氧環戊烷結構般,脂肪族環與環氧環共用部分環結構之結構。 In the present invention, the cationically polymerizable compound (B) preferably contains an alicyclic epoxy compound (B1) when the curability of the polymerizable composition becomes favorable. The alicyclic epoxy compound is a compound having an oxidized cycloalkene structure and not having an aromatic ring. The oxidized cycloalkene structure is such as an epoxycyclohexane structure or an epoxycyclopentane structure obtained by epoxidizing a cyclohexene ring-containing compound or a cyclopentene ring-containing compound with an oxidizing agent, and an aliphatic ring and a ring A structure in which the oxygen ring shares part of the ring structure.
於本發明中,脂環式環氧化合物(B1)於1分子中可具有1個氧化環烯烴結構,亦可具有2個以上氧化環烯烴結構。就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性、接著性及光學特性亦變得良好之情況而言,脂環式環氧化合物(B1)較佳為於1分子中具有1個或2個氧化環烯烴結構。In the present invention, the alicyclic epoxy compound (B1) may have one cycloalkene oxide structure in one molecule, or may have two or more cycloalkene oxide structures. The alicyclic epoxy compound (B1) is preferably It has one or two cycloalkene oxide structures in one molecule.
作為具有1個氧化環烯烴結構之脂環式環氧化合物,例如可例舉:3,4-環氧環己基甲基丙烯酸酯、3,4-環氧環己基甲基甲基丙烯酸酯、二環戊二烯二環氧化物、環氧六氫鄰苯二甲酸二辛酯、環氧六氫鄰苯二甲酸二-2-乙基己酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧基-2-環氧基乙基環己烷、二氧化檸檬烯等。As an alicyclic epoxy compound having one cycloolefin oxide structure, for example, 3,4-epoxycyclohexyl methacrylate, 3,4-epoxycyclohexyl methyl methacrylate, di Cyclopentadiene diepoxide, Dioctyl epoxy hexahydrophthalate, Di-2-ethylhexyl epoxy hexahydrophthalate, 1-oxiranyl-3,4-cyclo Oxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, limonene dioxide, etc.
作為具有2個氧化環烯烴結構之脂環式環氧化合物,例如可例舉:3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧環己基甲基-6-甲基-3,4-環氧環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧環己基甲基)己二酸酯、丙烷-2,2-二基-雙(3,4-環氧環己烷)、2,2-雙(3,4-環氧環己基)丙烷、伸乙基雙(3,4-環氧環己烷羧酸酯)等。Examples of alicyclic epoxy compounds having two cycloalkene oxide structures include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-cyclohexane Oxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3 ,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3, 4-Epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl)adipic acid Esters, propane-2,2-diyl-bis(3,4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, ethylidene bis(3,4- Epoxy cyclohexane carboxylate), etc.
脂環式環氧化合物(B1)可使用市售品。作為市售品之具體例,例如可例舉:Celloxide 2021P、Celloxide 2081、Celloxide 2000、Celloxide 3000(Daicel製造)、LDO(Symrise製造)等。As alicyclic epoxy compound (B1), a commercial item can be used. As a specific example of a commercial item, Celloxide 2021P, Celloxide 2081, Celloxide 2000, Celloxide 3000 (made by Daicel), LDO (made by Symrise), etc. are mentioned, for example.
於本發明中,可單獨使用上述脂環式環氧化合物(B1)之1種,亦可將上述脂環式環氧化合物(B1)之2種以上組合使用。 關於陽離子聚合性化合物(B)中之脂環式環氧化合物(B1)之含量,就聚合性組合物之硬化物之耐熱性及接著性變得良好之情況而言,於陽離子聚合性化合物(B)100質量份中,較佳為含有1~20質量份之脂環式環氧化合物(B1),更佳為含有3~10質量份之脂環式環氧化合物(B1)。 In the present invention, one of the above-mentioned alicyclic epoxy compounds (B1) may be used alone, or two or more of the above-mentioned alicyclic epoxy compounds (B1) may be used in combination. Regarding the content of the alicyclic epoxy compound (B1) in the cationically polymerizable compound (B), when the heat resistance and adhesiveness of the cured product of the polymerizable composition become good, the content of the alicyclic epoxy compound (B1) in the cationically polymerizable compound ( B) In 100 mass parts, it is preferable to contain 1-20 mass parts of alicyclic epoxy compounds (B1), and it is more preferable to contain 3-10 mass parts of alicyclic epoxy compounds (B1).
於本發明中,就聚合性組合物之黏度較低且處理性優異之情況而言,陽離子聚合性化合物(B)較佳為含有脂肪族環氧化合物(B2)。In the present invention, the cationically polymerizable compound (B) preferably contains an aliphatic epoxy compound (B2) when the viscosity of the polymerizable composition is low and the handleability is excellent.
脂肪族環氧化合物(B2)係具有1個以上之環氧基且不具有芳香族環及氧化環烯烴結構之化合物。作為脂肪族環氧化合物,例如可例舉單官能環氧化合物及多官能環氧化合物。作為單官能環氧化合物,例如可例舉脂肪族醇之縮水甘油醚化物及烷基羧酸之縮水甘油酯等。作為多官能環氧化合物,例如可例舉脂肪族多元醇或其環氧烷加成物之聚縮水甘油醚化物、或者脂肪族長鏈多元酸之聚縮水甘油酯等。於本發明中,就聚合性組合物之黏度較低且處理性優異之情況而言,脂肪族環氧化合物(B2)較佳為單官能或2官能。The aliphatic epoxy compound (B2) is a compound which has one or more epoxy groups and does not have an aromatic ring and an oxidized cycloolefin structure. As an aliphatic epoxy compound, a monofunctional epoxy compound and a polyfunctional epoxy compound are mentioned, for example. As a monofunctional epoxy compound, the glycidyl ether compound of aliphatic alcohol, the glycidyl ester of alkylcarboxylic acid, etc. are mentioned, for example. As a polyfunctional epoxy compound, the polyglycidyl ether compound of an aliphatic polyhydric alcohol or its alkylene oxide adduct, the polyglycidyl ester of an aliphatic long-chain polybasic acid, etc. are mentioned, for example. In the present invention, the aliphatic epoxy compound (B2) is preferably monofunctional or difunctional because the viscosity of the polymerizable composition is low and the handleability is excellent.
作為脂肪族環氧化合物(B2)之代表性化合物,可例舉:烯丙基縮水甘油醚、丁基縮水甘油醚、2-乙基己基縮水甘油醚、C12~13混合烷基縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、甘油之三縮水甘油醚、三羥甲基丙烷之三縮水甘油醚、山梨糖醇之四縮水甘油醚、二季戊四醇之六縮水甘油醚、聚乙二醇之二縮水甘油醚、聚丙二醇之二縮水甘油醚等多元醇之縮水甘油醚,又可例舉:藉由使1種或2種以上之環氧烷與丙二醇、三羥甲基丙烷、甘油等脂肪族多元醇加成而獲得之聚醚多元醇之聚縮水甘油醚化物、脂肪族長鏈二元酸之二縮水甘油酯。進而可例舉:脂肪族高級醇之單縮水甘油醚或高級脂肪酸之縮水甘油酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。Typical examples of aliphatic epoxy compounds (B2) include: allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12-13 mixed alkyl glycidyl ether, 1,4-Butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol , hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol and other polyhydric alcohol glycidyl ethers. Polyglycidyl etherification of polyether polyol obtained by adding oxane to propylene glycol, trimethylolpropane, glycerin and other aliphatic polyols, diglycidyl ester of aliphatic long-chain dibasic acid. Further examples include: monoglycidyl ether of aliphatic higher alcohol or glycidyl ester of higher fatty acid, epoxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized soybean oil, epoxidized poly butadiene etc.
脂肪族環氧化合物(B2)可使用市售品。作為上述脂肪族環氧化合物(B2)之市售品,例如可例舉:Denacol EX-121、Denacol EX-171、Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Denacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931(長瀨化成公司製造);Epolight M-1230、Epolight 40E、Epolight 100E、Epolight 200E、Epolight 400E、Epolight 70P、Epolight 200P、Epolight 400P、Epolight 1500NP、Epolight 1600、Epolight 80MF、Epolight 100MF(共榮社化學公司製造)、Adeka Glycirol ED-503、Adeka Glycirol ED-503G、Adeka Glycirol ED-506、Adeka Glycirol ED-523T(ADEKA公司製造)、Epogosey 2EH(四日市合成製造)等。As aliphatic epoxy compound (B2), a commercial item can be used. As a commercial item of the said aliphatic epoxy compound (B2), for example, Denacol EX-121, Denacol EX-171, Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase Chemical Corporation); Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP , Epolight 1600, Epolight 80MF, Epolight 100MF (manufactured by Kyoeisha Chemical Co., Ltd.), Adeka Glycirol ED-503, Adeka Glycirol ED-503G, Adeka Glycirol ED-506, Adeka Glycirol ED-523T (manufactured by ADEKA), Epogosey 2EH ( Yokkaichi Gosei Manufacturing), etc.
於本發明中,可單獨使用上述脂肪族環氧化合物(B2)之1種,亦可將上述脂肪族環氧化合物(B2)之2種以上組合使用。 關於陽離子聚合性化合物(B)中之脂肪族環氧化合物(B2)之含量,就聚合性組合物之硬化物之耐熱性及接著性變得良好之情況而言,於陽離子聚合性化合物(B)100質量份中,較佳為含有20~60質量份之脂肪族環氧化合物(B2),更佳為含有30~50質量份之脂肪族環氧化合物(B2)。 In the present invention, one of the above-mentioned aliphatic epoxy compounds (B2) may be used alone, or two or more of the above-mentioned aliphatic epoxy compounds (B2) may be used in combination. Regarding the content of the aliphatic epoxy compound (B2) in the cationically polymerizable compound (B), when the heat resistance and adhesiveness of the cured product of the polymerizable composition become good, the content of the aliphatic epoxy compound (B2) in the cationically polymerizable compound (B) ) in 100 parts by mass, preferably 20 to 60 parts by mass of the aliphatic epoxy compound (B2), more preferably 30 to 50 parts by mass of the aliphatic epoxy compound (B2).
於本發明中,就聚合性組合物之硬化物之耐熱性變得良好之情況而言,陽離子聚合性化合物(B)較佳為含有芳香族環氧化合物(B3)。 芳香族環氧化合物(B3)係具有芳香族環及至少1個環氧基之化合物。芳香族環氧化合物(B3)可為單官能,亦可為多官能。於本發明中,就聚合性組合物之硬化物之耐熱性變得良好之情況而言,芳香族環氧化合物(B3)較佳為至少包含單官能芳香族環氧化合物或2官能之芳香族環氧化合物。 In the present invention, the cationically polymerizable compound (B) preferably contains an aromatic epoxy compound (B3) when the heat resistance of the cured product of the polymerizable composition becomes good. The aromatic epoxy compound (B3) is a compound having an aromatic ring and at least one epoxy group. The aromatic epoxy compound (B3) may be monofunctional or polyfunctional. In the present invention, the aromatic epoxy compound (B3) preferably contains at least a monofunctional aromatic epoxy compound or a bifunctional aromatic epoxy compound in order to improve the heat resistance of the cured product of the polymerizable composition. epoxy compound.
作為單官能芳香族環氧化合物,例如可例舉苯酚、甲酚及丁基苯酚等具有1個芳香族環之1價酚、或進而使環氧烷與該等加成而得之化合物之縮水甘油醚化物。 作為多官能芳香族環氧化合物,例如可例舉:雙酚A、雙酚F、或進而使環氧烷與該等加成而得之化合物之縮水甘油醚化物;間苯二酚或對苯二酚、鄰苯二酚等具有2個以上之酚性羥基之芳香族化合物之縮水甘油醚;苯二甲醇或苯二乙醇、苯二丁醇等具有2個以上之醇性羥基之芳香族化合物之聚縮水甘油醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等具有2個以上之羧酸之多元酸芳香族化合物之縮水甘油酯等。 Examples of monofunctional aromatic epoxy compounds include monovalent phenols having one aromatic ring such as phenol, cresol, and butylphenol, or compounds obtained by adding alkylene oxide to these compounds. Glycerin Ethers. As polyfunctional aromatic epoxy compounds, for example, bisphenol A, bisphenol F, or glycidyl ether compounds of compounds obtained by adding alkylene oxide to these compounds; resorcinol or p-phenylene Glycidyl ethers of aromatic compounds having two or more phenolic hydroxyl groups, such as diphenols and catechols; aromatic compounds having two or more alcoholic hydroxyl groups, such as benzenedimethanol, benzenediethyl alcohol, and benzenedibutanol Polyglycidyl ether compounds; glycidyl esters of polyacid aromatic compounds having two or more carboxylic acids, such as phthalic acid, terephthalic acid, trimellitic acid, etc.
芳香族環氧化合物(B3)可使用市售品。作為芳香族環氧化合物(B3)之市售品之具體例,例如可例舉:Denacol EX-121、Denacol EX-141、Denacol EX-142、Denacol EX-145、Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、Oncoat EX-1020、Oncoat EX-1030、Oncoat EX-1040、Oncoat EX-1050、Oncoat EX-1051、Oncoat EX-1010、Oncoat EX-1011、Oncoat 1012(長瀨化成公司製造);Ogsol PG-100、Ogsol EG-200、Ogsol EG-210、Ogsol EG-250(Osaka Gas Chemicals公司製造);HP4032、HP4032D、HP4700(DIC公司製造);ESN-475V(新日鐵住金化學公司製造);Epikote YX8800(三菱化學公司製造);Marproof G-0105SA、Marproof G-0130SP(日油公司製造);Epiclon N-665、Epiclon HP-7200(DIC公司製造);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-2000-L、NC-3000、NC-7000L(日本化藥公司製造);Adeka Glycirol ED-501、Adeka Glycirol ED-502、Adeka Glycirol ED-509、Adeka Glycirol ED-529、Adeka Resin EP-4000、Adeka Resin EP-4005、Adeka Resin EP-4100E、Adeka Resin EP-4901(ADEKA公司製造);TECHMORE VG-3101L、EPOX-MKR710、EPOX-MKR151(Printec公司製造)、YX-4000(Mitsubishi Chemical製造)等。As the aromatic epoxy compound (B3), a commercially available item can be used. Specific examples of commercially available aromatic epoxy compounds (B3) include: Denacol EX-121, Denacol EX-141, Denacol EX-142, Denacol EX-145, Denacol EX-146, Denacol EX- 147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX-1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX- 1010, Oncoat EX-1011, Oncoat 1012 (manufactured by Nagase Chemicals); Ogsol PG-100, Ogsol EG-200, Ogsol EG-210, Ogsol EG-250 (manufactured by Osaka Gas Chemicals); HP4032, HP4032D, HP4700 ( DIC Corporation); ESN-475V (Nippon Steel & Sumikin Chemical Co., Ltd.); Epikote YX8800 (Mitsubishi Chemical Corporation); Marproof G-0105SA, Marproof G-0130SP (Nippon Oil Corporation); Epiclon N-665, Epiclon HP -7200 (manufactured by DIC Corporation); NC-7000L (manufactured by Nippon Kayaku); Adeka Glycirol ED-501, Adeka Glycirol ED-502, Adeka Glycirol ED-509, Adeka Glycirol ED-529, Adeka Resin EP-4000, Adeka Resin EP-4005, Adeka Resin EP - 4100E, Adeka Resin EP-4901 (manufactured by ADEKA); TECHMORE VG-3101L, EPOX-MKR710, EPOX-MKR151 (manufactured by Printec), YX-4000 (manufactured by Mitsubishi Chemical), and the like.
於本發明中,可單獨使用上述芳香族環氧化合物(B3)之1種,亦可將上述芳香族環氧化合物(B3)之2種以上組合使用。 關於陽離子聚合性化合物(B)中之芳香族環氧化合物(B3)之含量,就聚合性組合物之硬化物之耐熱性及接著性變得良好之情況而言,於陽離子聚合性化合物(B)100質量份中,較佳為含有30~70質量份之芳香族環氧化合物(B3),更佳為含有40~60質量份之芳香族環氧化合物(B3)。 In the present invention, one of the above-mentioned aromatic epoxy compounds (B3) may be used alone, or two or more of the above-mentioned aromatic epoxy compounds (B3) may be used in combination. With regard to the content of the aromatic epoxy compound (B3) in the cationically polymerizable compound (B), when the heat resistance and adhesiveness of the cured product of the polymerizable composition become good, the content of the aromatic epoxy compound (B3) in the cationically polymerizable compound (B) ) in 100 parts by mass, preferably 30 to 70 parts by mass of the aromatic epoxy compound (B3), more preferably 40 to 60 parts by mass of the aromatic epoxy compound (B3).
於本發明中,就聚合性組合物之硬化物之耐熱性及接著性變得良好之情況而言,陽離子聚合性化合物(B)較佳為含有脂環式環氧化合物(B1)、脂肪族環氧化合物(B2)及芳香族環氧化合物(B3)。In the present invention, the cationically polymerizable compound (B) preferably contains an alicyclic epoxy compound (B1), an aliphatic Epoxy compound (B2) and aromatic epoxy compound (B3).
就聚合性組合物之硬化物之耐濕熱性變得更良好之情況而言,陽離子聚合性化合物(B)較佳為含有氧雜環丁烷化合物(B4)。 氧雜環丁烷化合物(B4)係具有至少1個氧雜環丁基且不具有環氧基之化合物。於本發明中,就聚合性組合物之硬化物之耐濕熱性變得更良好之情況而言,較佳為使用具有1個或2個氧雜環丁基之氧雜環丁烷化合物。 When the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better, it is preferable that the cationically polymerizable compound (B) contains an oxetane compound (B4). The oxetane compound (B4) is a compound which has at least one oxetanyl group and does not have an epoxy group. In the present invention, it is preferable to use an oxetane compound having one or two oxetanyl groups when the heat-and-moisture resistance of the cured product of the polymerizable composition becomes better.
作為具有1個氧雜環丁基之氧雜環丁烷化合物,例如可例舉:3-乙基-3-(羥甲基)氧雜環丁烷、3-乙基-3-(甲氧基甲基)氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(環己氧基甲基)氧雜環丁烷、3-乙基-3-(4-羥基丁氧基甲基)氧雜環丁烷等。As an oxetane compound having one oxetanyl group, for example, 3-ethyl-3-(hydroxymethyl)oxetane, 3-ethyl-3-(methoxy oxetane, 3-ethyl-3-(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane Cyclobutane, 3-ethyl-3-(cyclohexyloxymethyl)oxetane, 3-ethyl-3-(4-hydroxybutoxymethyl)oxetane and the like.
作為具有2個氧雜環丁基之氧雜環丁烷化合物,例如可:3,7-雙(3-氧雜環丁基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、1,4-雙(3-乙基-3-氧雜環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧雜環丁基甲氧基)己烷、3-乙基-3-(3-乙基-3-氧雜環丁基甲氧基甲基)氧雜環丁烷、苯二甲基雙氧雜環丁烷等。As an oxetane compound having two oxetanyl groups, for example: 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[( 3-Ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3- Bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3- Ethyl-3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis(3-ethyl-3-oxetane Butylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, 3-ethyl-3-(3-ethyl-3-oxetanylmethoxy (methyl)oxetane, xylylenedioxetane, etc.
氧雜環丁烷化合物(B4)亦可使用市售品。作為氧雜環丁烷化合物之市售品,例如可例舉:ARONOXETANE OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成製造)、ETERNACOLL OXBP、OXTP(宇部興產製造)等。As the oxetane compound (B4), a commercially available item can also be used. Examples of commercially available oxetane compounds include: ARONOXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (manufactured by Toagosei), ETERNACOLL OXBP, OXTP (manufactured by Ube Industries), etc.
於本發明中,可單獨使用上述氧雜環丁烷化合物(B4)之1種,亦可將上述氧雜環丁烷化合物(B4)之2種以上組合使用。 關於陽離子聚合性化合物(B)中之氧雜環丁烷化合物(B4)之含量,就聚合性組合物之硬化物之耐濕熱性變得更良好且該硬化物之耐熱性及接著性變得良好之情況而言,於陽離子聚合性化合物(B)100質量份中,較佳為含有1~30質量份之氧雜環丁烷化合物(B4),更佳為含有5~25質量份之氧雜環丁烷化合物(B4)。 In the present invention, one of the above-mentioned oxetane compounds (B4) may be used alone, or two or more of the above-mentioned oxetane compounds (B4) may be used in combination. Regarding the content of the oxetane compound (B4) in the cationically polymerizable compound (B), the moisture and heat resistance of the cured product of the polymerizable composition becomes better, and the heat resistance and adhesiveness of the cured product become better. Preferably, the oxetane compound (B4) is preferably contained in 1 to 30 parts by mass, more preferably 5 to 25 parts by mass of oxygen, in 100 parts by mass of the cationically polymerizable compound (B). Heteretane compound (B4).
關於本發明之聚合性組合物中之陽離子聚合性化合物(B)之含量,就聚合性組合物之硬化物之耐濕熱性及耐熱性變得更良好且該硬化物之接著性及光學特性亦變得良好之情況而言,於聚合性組合物之固形物成分100質量份中,較佳為含有50質量份以上且未達99質量份之陽離子聚合性化合物(B),更佳為含有75質量份以上且未達99質量份之陽離子聚合性化合物(B),進而較佳為含有85質量份以上且未達99質量份之陽離子聚合性化合物(B)。上述固形物成分表示自聚合性組合物中去除後述溶劑所得者。With regard to the content of the cationic polymerizable compound (B) in the polymerizable composition of the present invention, the heat-and-moisture resistance and heat resistance of the cured product of the polymerizable composition become better, and the adhesiveness and optical properties of the cured product are also improved. When it becomes good, it is preferable to contain 50 mass parts or more and less than 99 mass parts of cationic polymerizable compound (B) in 100 mass parts of solid content of a polymeric composition, and it is more preferable to contain 75 mass parts It is more preferable to contain the cation polymerizable compound (B) of 85 mass parts or more and less than 99 mass parts of cation polymerizable compounds (B), and it is more preferable to contain 85 mass parts or more and less than 99 mass parts of cation polymerizable compounds (B). The above-mentioned solid content represents what removed the solvent mentioned later from a polymeric composition.
其次,對本發明之聚合性組合物中所含之陽離子聚合起始劑(C)進行說明。 於本發明中,陽離子聚合起始劑(C)係指可藉由光之照射或加熱而釋出使陽離子聚合開始之物質之化合物。 於本發明中,可使用光陽離子聚合起始劑或熱陽離子聚合起始劑作為陽離子聚合起始劑(C)。於本發明中,就硬化收縮較少而接著性優異之情況而言,陽離子聚合起始劑(C)較佳為使用光陽離子聚合起始劑。 Next, the cationic polymerization initiator (C) contained in the polymerizable composition of this invention is demonstrated. In the present invention, the cationic polymerization initiator (C) refers to a compound that releases a substance that initiates cationic polymerization by irradiation with light or heating. In the present invention, a photocationic polymerization initiator or a thermal cationic polymerization initiator can be used as the cationic polymerization initiator (C). In the present invention, it is preferable to use a photocationic polymerization initiator as the cationic polymerization initiator (C) when curing shrinkage is small and adhesiveness is excellent.
作為光陽離子聚合起始劑,只要為可藉由光之照射而釋出使陽離子聚合開始之物質之化合物即可,較佳為作為藉由光之照射而釋出路易斯酸之鎓鹽之複鹽、或其衍生物。As the photocationic polymerization initiator, as long as it is a compound that releases a substance that initiates cationic polymerization by irradiation with light, it is preferably a double salt of an onium salt that releases a Lewis acid by irradiation with light. , or its derivatives.
作為鎓鹽之複鹽或其衍生物例如可例舉由下述通式(i)所表示之陽離子與陰離子之鹽。 [A] m+[B] m(i) As a double salt of an onium salt or its derivative(s), the salt of the cation and anion represented by following general formula (i) is mentioned, for example. [A] m + [B] m (i)
此處,陽離子[A] m+為鎓,其結構例如可由下述通式表示。 [(R 110) xQ] m+(ii) 上述通式(ii)中,R 110表示碳原子數為1~60且可包含若干個除碳原子以外之原子之有機基。 x表示1~5之整數。 x個R 110各自獨立,可相同亦可不同。 x個R 110中之至少1個表示具有芳香族環之上述有機基。 Q表示選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F及N=N所組成之群中之原子或原子團。又,將陽離子[A] m+中之Q之原子價設為q時,需要關係m=x-q成立。其中,N=N視作原子價為0。 Here, the cation [A] m+ is onium, and its structure can be represented by the following general formula, for example. [(R 110 ) x Q] m+ (ii) In the above general formula (ii), R 110 represents an organic group having 1 to 60 carbon atoms and may contain some atoms other than carbon atoms. x represents an integer of 1-5. The x R 110s are independent, and may be the same or different. At least one of the x R 110 represents the aforementioned organic group having an aromatic ring. Q represents an atom or an atomic group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F and N=N. Also, when the atomic valence of Q in the cation [A] m+ is q, it is necessary that the relation m=x−q be established. Among them, N=N is regarded as the atomic valence is 0.
又,陰離子[B] m-較佳為鹵化物錯合物,其結構例如可由下述通式(iii)表示。 [LX y] m-(iii) 上述通式(iii)中,L表示作為鹵化物錯合物之中心原子之金屬或半金屬(Metalloid),且係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn或Co。 X表示鹵素原子。 y表示3~7之整數。又,將陰離子[B] m-中之L之原子價設為p時,需要關係m=y-p成立。 Also, the anion [B] m- is preferably a halide complex, and its structure can be represented by, for example, the following general formula (iii). [LX y ] m- (iii) In the above general formula (iii), L represents a metal or semimetal (Metalloid) as the central atom of a halide complex, and is B, P, As, Sb, Fe, Sn , Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn or Co. X represents a halogen atom. y represents an integer of 3-7. Also, when the valence of L in the anion [B] m- is p, the relationship m=y−p needs to be established.
作為上述通式(iii)之陰離子[LX y] m-之具體例,可例舉:四(五氟苯基)硼酸鹽[(C 6F 5) 4B] -、四氟硼酸鹽(BF 4) -、六氟磷酸鹽(PF 6) -、六氟銻酸鹽(SbF 6) -、六氟砷酸鹽(AsF 6) -、六氯銻酸鹽(SbCl 6) -、三(五氟甲基)三氟磷酸根離子(FAP陰離子)等。 Specific examples of the anion [LX y ] m- of the above general formula (iii) include: tetrakis(pentafluorophenyl) borate [(C 6 F 5 ) 4 B] - , tetrafluoroborate (BF 4 ) - , hexafluorophosphate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - , three (five Fluoromethyl) trifluorophosphate ion (FAP anion), etc.
又,陰離子[B] m-亦可為由下述通式(iv)所表示之結構。 [LX y-1(OH)] m-(iv) 此處,L、X及b與上述相同。 又,作為其他陰離子,可例舉:過氯酸根離子(ClO 4) -、三氟甲基亞硫酸根離子(CF 3SO 3) -、氟磺酸根離子(FSO 3) -、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸鹽、九氟丁磺酸鹽、十六氟辛磺酸鹽、四芳基硼酸鹽、四(五氟苯基)硼酸鹽等。 In addition, the anion [B] m- may have a structure represented by the following general formula (iv). [LX y-1 (OH)] m- (iv) Here, L, X and b are the same as above. Further, other anions include perchlorate ion (ClO 4 ) - , trifluoromethylsulfite ion (CF 3 SO 3 ) - , fluorosulfonate ion (FSO 3 ) - , toluenesulfonate anion , trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctylsulfonate, tetraaryl borate, tetrakis(pentafluorophenyl)borate, etc.
於本發明中,就聚合性組合物之硬化性變得良好且聚合性組合物之硬化物之接著性變得良好之情況而言,此種鎓鹽之中,較佳為由下述群I或群II所表示之三苯基鋶陽離子等鋶陽離子與六氟磷酸鹽、六氟銻酸鹽、四(五氟苯基)硼酸鹽等陰離子之鋶鹽。In the present invention, in the case where the curability of the polymerizable composition becomes good and the adhesiveness of the cured product of the polymerizable composition becomes good, among such onium salts, the following group I Or a columium salt of a columium cation such as triphenylcobaltium cation represented by group II and anion such as hexafluorophosphate, hexafluoroantimonate or tetrakis(pentafluorophenyl)borate.
[化8] <群I> [Chem.8] <Group I>
[化9] <群II> [Chemical 9] <Group II>
光陽離子聚合起始劑亦可使用市售品。作為光陽離子聚合起始劑之市售品,例如可例舉:日本化藥(股)製造之"Kayarad(註冊商標)PCI-220"、"Kayarad(註冊商標)PCI-620";陶氏化學公司製造之"UVI-6990";ADEKA(股)製造之"Adeka Arkles(註冊商標)SP-150"、"Adeka Optomer(註冊商標)SP-170"、"Adeka Optomer(註冊商標)SP-500";日本曹達(股)製造之"CI-5102"、"CIT-1370"、"CIT-1682"、"CIP-1866S"、"CIP-2048S"、"CIP-2064S";日本綠化學(股)製造之"DPI-101"、"DPI-102"、"DPI-103"、"DPI-105"、"MPI-103"、"MPI-105"、"BBI-101"、"BBI-102"、"BBI-103"、"BBI-105"、"TPS-101"、"TPS-102"、"TPS-103"、"TPS-105"、"MDS-103"、"MDS-105"、"DTS-102"、"DTS-103";Rhodia公司製造之"PI-2074";及San-Apro製造之CPI-100P等。A commercial item can also be used for a photocationic polymerization initiator. As commercial products of photocationic polymerization initiators, for example, "Kayarad (registered trademark) PCI-220" and "Kayarad (registered trademark) PCI-620" manufactured by Nippon Kayaku Co., Ltd.; "UVI-6990" manufactured by the company; "Adeka Arkles (registered trademark) SP-150", "Adeka Optomer (registered trademark) SP-170", "Adeka Optomer (registered trademark) SP-500" manufactured by ADEKA Co., Ltd. ; "CI-5102", "CIT-1370", "CIT-1682", "CIP-1866S", "CIP-2048S", "CIP-2064S" manufactured by Nippon Soda Co., Ltd.; Nippon Green Chemical Co., Ltd. "DPI-101", "DPI-102", "DPI-103", "DPI-105", "MPI-103", "MPI-105", "BBI-101", "BBI-102", "BBI-103", "BBI-105", "TPS-101", "TPS-102", "TPS-103", "TPS-105", "MDS-103", "MDS-105", "DTS -102", "DTS-103"; "PI-2074" manufactured by Rhodia; and CPI-100P manufactured by San-Apro, etc.
關於本發明之聚合性組合物中之光陽離子聚合起始劑之含量,就聚合性組合物之硬化物之接著性變得良好且聚合性組合物之硬化性變得良好之情況而言,相對於陽離子聚合性化合物100質量份,較佳為含有0.1~15質量份之光陽離子聚合起始劑(C),更佳為含有1~13質量份之光陽離子聚合起始劑(C),更佳為含有3~13質量份之光陽離子聚合起始劑(C)。Regarding the content of the photocationic polymerization initiator in the polymerizable composition of the present invention, in terms of the adhesiveness of the cured product of the polymerizable composition becomes good and the curability of the polymerizable composition becomes good, it is relatively For 100 parts by mass of the cationic polymerizable compound, it is preferable to contain 0.1 to 15 parts by mass of the photocationic polymerization initiator (C), more preferably to contain 1 to 13 parts by mass of the photocationic polymerization initiator (C), and even more Preferably, it contains 3-13 mass parts of photocationic polymerization initiators (C).
於本發明中,可使用藉由加熱而產生陽離子種或路易斯酸之化合物作為熱陽離子聚合起始劑,並無特別限制。具體而言,可使用:鋶鹽、噻吩鎓鹽、四氫噻吩鎓鹽、苄基銨鹽、吡啶鎓鹽、𨥙鹽等鹽;二伸乙基三胺、三伸乙基三胺、四伸乙基五胺等聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛爾酮二胺等脂環式多胺類;間苯二甲胺、二胺基二苯甲烷、二胺基二苯基碸等芳香族多胺類;藉由利用常規方法使上述多胺類與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚、雙酚F-二縮水甘油醚等縮水甘油醚類或羧酸之縮水甘油酯類等各種環氧樹脂反應而製造之多聚環氧加成改性物;藉由利用常規方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、二聚酸等羧酸類反應而製造之醯胺化改性物;藉由利用常規方法使上述多胺類與甲醛等醛類及苯酚、甲酚、二甲苯酚、第三丁基苯酚、間苯二酚等核中具有至少1個醛化反應性部位之酚類反應而製造之曼尼希化改性物;多元羧酸(草酸、丙二酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基丁二酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等芳香族二羧酸類;環己烷二羧酸等脂環式二羧酸類;偏苯三甲酸、1,3,5-苯三甲酸、蓖麻油脂肪酸之三聚物等三羧酸類;均苯四甲酸等四羧酸類等)之酸酐;雙氰胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。In the present invention, a compound that generates a cationic species or a Lewis acid by heating can be used as a thermal cationic polymerization initiator without particular limitation. Specifically, salts such as cerium salts, thiophenium salts, tetrahydrothiophenium salts, benzyl ammonium salts, pyridinium salts, and thiophene salts; diethylenetriamine, triethylenetriamine, tetrakis Polyalkylpolyamines such as ethylpentamine; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophoronediamine and other esters Cyclic polyamines; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone; by utilizing conventional methods to make the above polyamines and phenyl glycidyl ether, Butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether and other glycidyl ethers or glycidyl esters of carboxylic acids and other epoxy resins are produced by reacting polyepoxy resins. A modified product; an amidated modified product produced by reacting the above-mentioned organic polyamines with carboxylic acids such as phthalic acid, isophthalic acid, and dimer acid by a conventional method; Manny produced by reacting the above-mentioned polyamines with aldehydes such as formaldehyde and phenols having at least one hydroformylation reactive site in the nucleus such as phenol, cresol, xylenol, tert-butylphenol, and resorcinol Helium modified products; polycarboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylglutaric acid, 2-methylsuberic acid, 3,8-dimethylsebacic acid , 3,7-dimethyl sebacic acid, hydrogenated dimer acid, dimer acid and other aliphatic dicarboxylic acids; phthalic acid, terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid and other aromatic dicarboxylic acids Carboxylic acids; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; tricarboxylic acids such as trimellitic acid, 1,3,5-benzenetricarboxylic acid, and trimers of castor oil fatty acids; pyromellitic acid and other tetracarboxylic acids Anhydrides of carboxylic acids, etc.); dicyandiamide, imidazoles, carboxylates, sulfonates, amidoimides, etc.
就聚合性組合物之硬化性變得良好之情況而言,本發明之聚合性組合物中之熱陽離子聚合起始劑之含量相對於陽離子聚合性化合物(B)100質量份而言,較佳為0.001~10質量份,更佳為0.1~8質量份。When the curability of the polymerizable composition becomes good, the content of the thermal cationic polymerization initiator in the polymerizable composition of the present invention is preferably 100 parts by mass of the cationic polymerizable compound (B). It is 0.001-10 mass parts, More preferably, it is 0.1-8 mass parts.
熱陽離子聚合起始劑亦可使用市售品。作為熱陽離子聚合起始劑之市售品,例如可例舉:Adekaopton CP-77、Adekaopton CP-66(ADEKA製造)、CI-2639、CI-2624(日本曹達)、San-Aid SI-60、San-Aid SI-80及San-Aid SI-100(三新化學工業製造)等。As a thermal cationic polymerization initiator, a commercial item can also be used. Examples of commercially available thermal cationic polymerization initiators include Adekaopton CP-77, Adekaopton CP-66 (manufactured by ADEKA), CI-2639, CI-2624 (Nippon Soda), San-Aid SI-60, San-Aid SI-80 and San-Aid SI-100 (manufactured by Sanshin Chemical Industry) and the like.
本發明之聚合性組合物亦可含有能夠使硫醚化合物(A)、陽離子聚合性化合物(B)及陽離子聚合起始劑(C)溶解或分散之溶劑。溶劑係未分類為上述成分且於25℃、1氣壓下為液體之化合物。作為溶劑,例如可例舉:甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等酮類;乙醚、二㗁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲醚、二丙二醇二甲基醚等醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸環己酯、乳酸乙酯、丁二酸二甲酯、Texanol(2,2,4-三甲基-1,3-戊二醇單異丁酸酯)等酯系溶劑;乙二醇單甲醚、乙二醇單乙醚等溶纖劑系溶劑;甲醇、乙醇、異或正丙醇、異或正丁醇、戊醇等醇系溶劑;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯、丙酸乙氧基乙酯等醚酯系溶劑;苯、甲苯、二甲苯等BTX(Benzene-Toluene-Xylene,苯-甲苯-二甲苯)系溶劑;己烷、庚烷、辛烷、環己烷等脂肪族烴系溶劑;松節油、D-檸檬烯、蒎烯等萜烯系烴油;礦油精、Swazol#310(科斯莫松山石油(股))、Solvesso#100(Exon Chemical Co.,Ltd)等石蠟系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等鹵化脂肪族烴系溶劑;氯苯等鹵化芳香族烴系溶劑;碳酸丙二酯、卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸、水等;該等溶劑亦可以2種以上之混合溶劑之形式使用。The polymerizable composition of the present invention may also contain a solvent capable of dissolving or dispersing the thioether compound (A), the cationically polymerizable compound (B) and the cationic polymerization initiator (C). The solvent is a compound that is not classified as the above-mentioned components and is liquid at 25° C. and 1 atmosphere. Examples of solvents include methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone, etc. Ketones; ether solvents such as diethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, etc.; acetic acid Methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, Texanol (2,2,4-trimethyl- 1,3-pentanediol monoisobutyrate) and other ester solvents; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether and other cellosolve solvents; methanol, ethanol, iso-or n-propanol, iso-or n-propanol Alcohol solvents such as butanol and pentanol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol mono Ether ester solvents such as methyl ether acetate, 3-methoxybutyl acetate, and ethoxyethyl propionate; BTX (Benzene-Toluene-Xylene, benzene-toluene-xylene) such as benzene, toluene, and xylene solvents; aliphatic hydrocarbon solvents such as hexane, heptane, octane, and cyclohexane; terpene hydrocarbon oils such as turpentine, D-limonene, and pinene; mineral spirits, Swazol#310 (Cosmo Songshan Petroleum ( Stock)), Solvesso#100 (Exon Chemical Co., Ltd) and other paraffin solvents; carbon tetrachloride, chloroform, trichloroethylene, methylene chloride, 1,2-dichloroethane and other halogenated aliphatic hydrocarbon solvents ; chlorobenzene and other halogenated aromatic hydrocarbon solvents; propylene carbonate, carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N,N-dimethylformamide, N,N -Dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, water, etc.; these solvents can also be used in the form of a mixed solvent of two or more.
本發明之聚合性組合物可視需要添加其他單體、其他聚合起始劑、無機填料、有機填料、顏料、染料等著色劑、光敏劑、消泡劑、增黏劑、界面活性劑、調平劑、阻燃劑、觸變劑、稀釋劑、塑化劑、穩定劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、助黏劑等各種樹脂添加物等。The polymerizable composition of the present invention may add other monomers, other polymerization initiators, inorganic fillers, organic fillers, pigments, dyes and other colorants, photosensitizers, defoamers, tackifiers, surfactants, leveling agents, etc. additives, flame retardants, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters and other resin additives.
本發明之聚合性組合物中除硫醚化合物(A)、陽離子聚合性化合物(B)及陽離子聚合起始劑(C)以外之任意成分之合計量雖亦取決於本發明之用途等,但就進一步提高本發明之效果之觀點而言,相對於陽離子聚合性化合物(A)100質量份而言,較佳為20質量份以下,特佳為10質量份以下。The total amount of optional components other than the thioether compound (A), cationic polymerizable compound (B) and cationic polymerization initiator (C) in the polymerizable composition of the present invention also depends on the use of the present invention, etc., but From the viewpoint of further enhancing the effect of the present invention, it is preferably at most 20 parts by mass, particularly preferably at most 10 parts by mass, based on 100 parts by mass of the cationically polymerizable compound (A).
本發明之聚合性組合物係將硫醚化合物(A)與陽離子聚合性化合物(B)及陽離子聚合起始劑(C)組合者。即便將硫醚化合物(A)與自由基聚合性組合物及自由基聚合起始劑組合,亦不會發揮獲得耐濕熱性良好之硬化物這一本發明之效果。進而,含有自由基聚合性組合物及自由基聚合起始劑之聚合性組合物之硬化物之接著性不良。因此,本發明之聚合性組合物較佳為不含有自由基聚合性組合物及自由基聚合起始劑。The polymerizable composition of the present invention is a combination of a thioether compound (A), a cationic polymerizable compound (B) and a cationic polymerization initiator (C). Even if a thioether compound (A) is combined with a radical polymerizable composition and a radical polymerization initiator, the effect of this invention which obtains the hardened|cured material favorable in heat-and-moisture resistance is not exhibited. Furthermore, the adhesiveness of the hardened|cured material of the polymerizable composition containing a radical polymerizable composition and a radical polymerization initiator is poor. Therefore, the polymerizable composition of the present invention preferably does not contain a radical polymerizable composition and a radical polymerization initiator.
自由基聚合性組合物係能進行自由基聚合之化合物。作為自由基聚合性化合物,例如可例舉具有丙烯酸基、甲基丙烯酸基、乙烯基等乙烯性不飽和基之化合物。具體可例舉國際公開第2018/012383號公報中記載之自由基聚合性化合物、國際公開第2014/021023號公報中記載之自由基聚合性有機物質等。The radically polymerizable composition is a compound capable of radically polymerizing. As a radically polymerizable compound, the compound which has ethylenically unsaturated groups, such as an acryl group, a methacryl group, a vinyl group, is mentioned, for example. Specifically, the radical polymerizable compound described in International Publication No. 2018/012383, the radical polymerizable organic substance described in International Publication No. 2014/021023, etc. are mentioned.
自由基聚合起始劑係藉由可見光線、紫外線、遠紫外線、電子束、X射線等放射線之曝光或加熱而產生能夠使聚合開始之自由基之化合物。具體而言,例如可例舉國際公開第2018/012383號公報等所記載之作為光自由基聚合起始劑之苯乙酮系化合物、苯偶醯系化合物、二苯甲酮系化合物、9-氧硫𠮿 系化合物及肟酯系化合物、作為熱自由基聚合起始劑之偶氮系化合物、過氧化物及過硫酸鹽等、以及日本專利特開2016-210849號公報所記載之光自由基聚合起始劑等。Radical polymerization initiators are compounds that generate free radicals that can initiate polymerization by exposure or heating to radiation such as visible light, ultraviolet rays, far ultraviolet rays, electron beams, and X-rays. Specifically, for example, acetophenone-based compounds, benzoyl-based compounds, benzophenone-based compounds, 9- Oxygen sulfur 𠮿 Oxime-based compounds and oxime ester-based compounds, azo-based compounds, peroxides, and persulfates as thermal radical polymerization initiators, and photoradical polymerization initiators described in Japanese Patent Application Laid-Open No. 2016-210849 agent etc.
作為本發明之聚合性組合物之具體用途,可例舉:以眼鏡、拍攝用透鏡為代表之光學材料、塗料、塗佈劑、內襯劑、墨水、抗蝕劑、液態抗蝕劑、接著劑、印刷版、絕緣清漆、絕緣片、積層板、印刷基板、半導體裝置用、LED(Light Emitting Diode,發光二極體)封裝用、液晶注入口用、有機EL(Electroluminescence,電致發光)用、光學元件用、電絕緣用、電子零件用、分離膜用等之密封劑、成形材料、油灰、玻璃纖維含浸劑、填縫劑、半導體用、太陽電池用等之鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置之背光裝置所使用之稜鏡透鏡薄片、投影電視等之屏幕所使用之菲涅耳透鏡薄片、雙凸透鏡薄片等透鏡薄片之透鏡部、或使用此種薄片之背光裝置等微透鏡等光學透鏡、光學元件、光連接器、光波導、光學造形用澆鑄劑等,關於例如作為塗佈劑時可應用之基材,可例舉金屬、木材、橡膠、塑膠、玻璃、陶瓷製品等。 藉由將硫醚化合物(A)與陽離子聚合性化合物(B)及陽離子聚合起始劑(C)組合使用,本發明之聚合性組合物之硬化物之耐濕熱性變得優異。此外,藉由將該等成分組合使用,本發明之聚合性組合物之耐熱性、接著性及光學特性亦變得優異。因此,本發明之聚合性組合物適合用作接著劑、尤其是光硬化性接著劑。 Specific applications of the polymerizable composition of the present invention include optical materials represented by eyeglasses and photographic lenses, paints, coating agents, lining agents, inks, resists, liquid resists, adhesives, etc. Agent, printing plate, insulating varnish, insulating sheet, laminate, printed circuit board, semiconductor device, LED (Light Emitting Diode, light emitting diode) package, liquid crystal injection port, organic EL (Electroluminescence, electroluminescence) , sealants for optical elements, electrical insulation, electronic parts, separation films, etc., molding materials, putty, glass fiber impregnating agents, caulking agents, passivation films for semiconductors, solar cells, etc., interlayer insulating films, Protective film, lens part of lens sheets such as lens sheets such as Fresnel lens sheets and lenticular lens sheets used in backlight devices of liquid crystal display devices, Fresnel lens sheets used in projection TV screens, or backlight devices using such sheets, etc. Optical lenses such as microlenses, optical elements, optical connectors, optical waveguides, casting agents for optical molding, etc., as substrates that can be used as coating agents, for example, metals, wood, rubber, plastics, glass, ceramics products, etc. By using the thioether compound (A) in combination with the cationic polymerizable compound (B) and the cationic polymerization initiator (C), the cured product of the polymerizable composition of the present invention has excellent heat and humidity resistance. In addition, by using these components in combination, the heat resistance, adhesiveness, and optical properties of the polymerizable composition of the present invention also become excellent. Therefore, the polymerizable composition of the present invention is suitable as an adhesive, especially a photocurable adhesive.
其次,對本發明之光硬化性接著劑進行說明。 本發明之光硬化性接著劑含有本發明之聚合性組合物。本發明之光硬化性接著劑由於含有本發明之聚合性組合物,故而耐濕熱性變得優異。此外,本發明之光硬化性接著劑之耐熱性、接著性及光學特性亦變得優異。 Next, the photocurable adhesive agent of this invention is demonstrated. The photocurable adhesive agent of this invention contains the polymerizable composition of this invention. Since the photocurable adhesive agent of this invention contains the polymeric composition of this invention, it becomes excellent in heat-and-moisture resistance. In addition, the photocurable adhesive of the present invention is also excellent in heat resistance, adhesiveness, and optical properties.
其次,對本發明之硬化物進行說明。 本發明之硬化物係本發明之聚合性組合物之硬化物,可藉由對該聚合性組合物照射活性能量線,或對該聚合性組合物進行加熱而製造。對於活性能量線,照射條件及加熱條件並無限制,可採用公知之條件。 Next, the cured product of the present invention will be described. The cured product of the present invention is a cured product of the polymerizable composition of the present invention, and can be produced by irradiating the polymerizable composition with active energy rays or heating the polymerizable composition. The irradiation conditions and heating conditions are not limited to active energy rays, and known conditions can be employed.
其次,對本發明作為聚合性組合物之光硬化性接著劑之用途進行說明。 於本發明中,將上述聚合性組合物用作光硬化性接著劑,該光硬化性接著劑用以藉由光之照射而將2個構件接著。聚合性組合物之使用量、應用於構件之方法、所照射之光之波長或照射量等並無特別限制,可適當採用公知之方法及條件。又,根據本發明,亦提供藉由上述聚合性組合物來將2個構件接著之方法。具體而言,於2個構件之間配置上述聚合性組合物之後,對該聚合性組合物照射光使聚合性組合物硬化,而將2個構件接著。 實施例 Next, the use of the present invention as a photocurable adhesive of a polymerizable composition will be described. In this invention, the said polymeric composition is used as a photocurable adhesive agent for bonding two members by irradiation of light. There are no particular limitations on the amount of the polymerizable composition used, the method of applying it to the member, the wavelength or amount of irradiated light, and known methods and conditions can be appropriately adopted. Moreover, according to this invention, the method of bonding two members with the said polymeric composition is also provided. Specifically, after disposing the above-mentioned polymerizable composition between two members, the polymerizable composition is irradiated with light to harden the polymerizable composition, and the two members are bonded together. Example
以下,基於實施例對本發明更詳細地進行說明,但本發明並不限定於該等實施例。Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.
[實施例及比較例] 以下述表1~3所示之組成充分混合各成分,從而製備實施例1~21之聚合性組合物1~21、以及比較例1及2之聚合性組合物。表中之符號意指下述成分。又,表中之數值表示質量份。 [Example and Comparative Example] Each component was fully mixed with the composition shown in the following Tables 1-3, and the polymeric composition 1-21 of Examples 1-21, and the polymeric composition of Comparative Examples 1 and 2 were prepared. The symbols in the table mean the following components. In addition, the numerical value in a table shows a mass part.
A-1:由下述式(A-1)所表示之化合物 A-2:由下述式(A-2)所表示之化合物 A-3:由下述式(A-3)所表示之化合物 A-4:由下述式(A-4)所表示之化合物 A-5:由下述式(A-5)所表示之化合物 A-6:由下述式(A-6)所表示之化合物 A-7:由下述式(A-7)所表示之化合物 A'-1:由下述式(A'-1)所表示之化合物 A-1: A compound represented by the following formula (A-1) A-2: A compound represented by the following formula (A-2) A-3: A compound represented by the following formula (A-3) A-4: A compound represented by the following formula (A-4) A-5: A compound represented by the following formula (A-5) A-6: A compound represented by the following formula (A-6) A-7: A compound represented by the following formula (A-7) A'-1: a compound represented by the following formula (A'-1)
[化10] [chemical 10]
[化11] [chemical 11]
[化12] [chemical 12]
[化13] [chemical 13]
[化13A] [chemical 13A]
[化13B] [chemical 13B]
[化13C] [chemical 13C]
[化14] [chemical 14]
B1-1:由下述式(B1-1)所表示之化合物 B1-2:由下述式(B1-2)所表示之化合物 B2-1:由下述式(B2-1)所表示之化合物 B2-2:由下述式(B2-2)所表示之化合物 B3-1:由下述式(B3-1)所表示之化合物 B3-2:由下述式(B3-2)所表示之化合物 B3-3:由下述式(B3-3)所表示之化合物 B3-4:由下述式(B3-4)所表示之化合物 B4-1:由下述式(B4-1)所表示之化合物 B4-2:由下述式(B4-2)所表示之化合物 B1-1: A compound represented by the following formula (B1-1) B1-2: A compound represented by the following formula (B1-2) B2-1: A compound represented by the following formula (B2-1) B2-2: A compound represented by the following formula (B2-2) B3-1: A compound represented by the following formula (B3-1) B3-2: A compound represented by the following formula (B3-2) B3-3: A compound represented by the following formula (B3-3) B3-4: A compound represented by the following formula (B3-4) B4-1: A compound represented by the following formula (B4-1) B4-2: A compound represented by the following formula (B4-2)
[化15] [chemical 15]
[化16] [chemical 16]
[化17] [chemical 17]
[化18] [chemical 18]
[化19] [chemical 19]
[化20] [chemical 20]
[化21] [chem 21]
[化22] [chem 22]
[化23] [chem 23]
[化24] [chem 24]
C-1:由下述式(C1-2)所表示之化合物之碳酸丙二酯50質量%溶液 C-2:由下述式(C2)所表示之化合物之碳酸丙二酯50質量%溶液 C-1: 50% by mass solution of propylene carbonate of the compound represented by the following formula (C1-2) C-2: 50% by mass solution of propylene carbonate of the compound represented by the following formula (C2)
[化25] [chem 25]
[化26] [chem 26]
藉由下述方法評估實施例及比較例中製備之聚合性組合物之硬化物之耐濕熱性、耐熱性、接著性及光學特性。將結果示於表1~3中。The heat-and-moisture resistance, heat resistance, adhesiveness, and optical properties of cured products of the polymerizable compositions prepared in Examples and Comparative Examples were evaluated by the following methods. The results are shown in Tables 1-3.
<接著性試驗> 將實施例及比較例中製備之組合物以硬化後之膜厚成為3 μm之方式分別塗佈於TAC(triacetyl cellulose,三乙酸纖維素)膜(富士膠片(股)製造之Fujitac TD80),形成塗膜。繼而,使用貼合機將實施了電暈放電處理之COP(環烯烴聚合物;日本瑞翁(股)製造:商品號ZeonorFilm14-060)膜貼合於TAC膜之形成有塗膜之面,獲得積層體。繼而,使用無電極紫外線燈將相當於1000 mJ/cm 2之光透過COP膜照射至積層體,進行接著,藉此製造試驗片。 將所獲得之試驗片自曝光起之12小時期間在30℃、50%RH、大氣壓條件下保存。繼而,自試驗片切出2.0 cm寬度,獲得評估用樣品。對所獲得之樣品進行90度剝離試驗,並依照下述基準對評估用樣品之接著性進行評估。90度剝離試驗係於30℃、50%RH、大氣壓條件下進行。N/2 cm之值越大則接著性越優異。 A:2.5 N/2 cm以上或基材破裂 B:1.5 N/2 cm以上且未達2.5 N/2 cm C:0.5 N/2 cm以上且未達1.5 N/2 cm D:未達0.5 N/2 cm。 <Adhesion test> The compositions prepared in Examples and Comparative Examples were coated on TAC (triacetyl cellulose, cellulose triacetate) films (manufactured by Fujifilm Co., Ltd.) so that the film thickness after curing became 3 μm. Fujitac TD80), forming a coating film. Then, a COP (cycloolefin polymer; manufactured by Japan Zeon Co., Ltd.: product number ZeonorFilm 14-060) film subjected to corona discharge treatment was bonded to the surface of the TAC film on which the coating film was formed by using a laminating machine to obtain laminated body. Next, the laminate was irradiated with light equivalent to 1000 mJ/cm 2 through the COP film using an electrodeless ultraviolet lamp, followed by bonding to manufacture a test piece. The obtained test pieces were preserved under conditions of 30° C., 50% RH, and atmospheric pressure for 12 hours from the exposure. Then, a 2.0 cm width was cut out from the test piece to obtain a sample for evaluation. A 90-degree peel test was performed on the obtained samples, and the adhesiveness of the evaluation samples was evaluated according to the following criteria. The 90-degree peel test is carried out at 30°C, 50%RH, and atmospheric pressure. The larger the value of N/2 cm, the better the adhesiveness. A: More than 2.5 N/2 cm or the base material is broken B: More than 1.5 N/2 cm and less than 2.5 N/2 cm C: More than 0.5 N/2 cm and less than 1.5 N/2 cm D: Less than 0.5 N /2 cm.
<耐濕熱性試驗> 以與接著性試驗同樣之方式獲得試驗片。將所獲得之試驗片於85℃、85%RH之環境下保持500小時。其後,使試驗片下降至室溫後,以與接著性試驗同樣之方式對該試驗片進行90度剝離試驗,並依照下述基準對評估用樣品之耐濕熱性進行評估。N/2 cm之值越大則耐濕熱性越優異。 A:1.5 N/2 cm以上 B:1.0 N/2 cm以上且未達1.5 N/2 cm C:0.5 N/2 cm以上且未達1.0 N/2 cm D:未達0.5 N/2 cm <Moisture resistance test> Test pieces were obtained in the same manner as in the adhesion test. The obtained test pieces were kept in an environment of 85° C. and 85% RH for 500 hours. Thereafter, after the test piece was lowered to room temperature, a 90-degree peel test was performed on the test piece in the same manner as in the adhesion test, and the heat and humidity resistance of the evaluation sample was evaluated in accordance with the following criteria. The larger the value of N/2 cm is, the more excellent the heat-and-moisture resistance is. A: 1.5 N/2 cm or more B: More than 1.0 N/2 cm and less than 1.5 N/2 cm C: More than 0.5 N/2 cm and less than 1.0 N/2 cm D: Less than 0.5 N/2 cm
<光學特性試驗> 將實施例及比較例中製備之聚合性組合物分別以硬化後之膜厚成為50 μm之方式塗佈於玻璃板,繼而,將其他玻璃板貼合於該玻璃板之形成有塗膜之面。使用高壓Hg燈對貼合後之玻璃板照射1000 mJ/cm 2之能量,繼而將該玻璃板於150℃下加熱1小時,獲得試驗片。 使用紫外可見近紅外分光光度計V-670(日本分光公司製造)測定所獲得之試驗片之b*,並以下述基準對試驗片之光學特性進行評估。b*之值越小則光學特性越優異。 A:硬化物之b*未達5 B:硬化物之b*為5以上且未達10 C:硬化物之b*為10以上 <Optical characteristic test> The polymerizable compositions prepared in Examples and Comparative Examples were applied to glass plates so that the film thickness after curing became 50 μm, and then other glass plates were bonded to the glass plates. There is a coated surface. A high-pressure Hg lamp was used to irradiate the bonded glass plate with energy of 1000 mJ/cm 2 , and then the glass plate was heated at 150° C. for 1 hour to obtain a test piece. The b* of the obtained test piece was measured using the ultraviolet-visible-near-infrared spectrophotometer V-670 (manufactured by JASCO Corporation), and the optical characteristics of the test piece were evaluated on the basis of the following criteria. The smaller the value of b* is, the more excellent the optical properties are. A: The b* of the hardened product is less than 5 B: The b* of the hardened product is 5 or more and less than 10 C: The b* of the hardened product is 10 or more
<耐熱性試驗> 以與光學特性試驗同樣之方式獲得試驗片。使用紫外可見近紅外分光光度計V-670(日本分光公司製造)測定所獲得之試驗片之b*。繼而,將試驗片於85℃、85%RH之環境下保持500小時後,測定試驗片之b*。繼而,以下述基準對試驗片之耐熱性進行評估。△b*越小則耐熱性越優異。 A:Δb*<3 B:3≦Δb*<5 C:5≦Δb*<8 D:8≦Δb* <Heat Resistance Test> A test piece was obtained in the same manner as in the optical characteristic test. b* of the obtained test piece was measured using the ultraviolet-visible-near-infrared spectrophotometer V-670 (manufactured by JASCO Corporation). Next, after maintaining the test piece in an environment of 85°C and 85%RH for 500 hours, b* of the test piece was measured. Next, the heat resistance of the test piece was evaluated according to the following criteria. The smaller Δb* is, the more excellent the heat resistance is. A: Δb*<3 B: 3≦Δb*<5 C: 5≦Δb*<8 D: 8≦Δb*
[表1]
[表2]
[表3]
由表1~3可明確,實施例1~21之聚合性組合物之硬化物之耐濕熱性良好。進而,該等硬化物之耐熱性、接著性及光學特性亦優異。與此相對,不含有硫醚化合物(A)之比較例1之聚合性組合物之硬化物除耐濕熱性不良以外,耐熱性亦不良。又,含有其他成分(A'-1)來代替硫醚化合物(A)之比較例2之聚合性組合物之硬化物除耐濕熱性不良以外,耐熱性及光學特性亦不良。As is clear from Tables 1 to 3, the cured products of the polymerizable compositions of Examples 1 to 21 have good heat and humidity resistance. Furthermore, these cured products are also excellent in heat resistance, adhesiveness and optical properties. On the other hand, the cured product of the polymerizable composition of Comparative Example 1 that did not contain the thioether compound (A) was not good in heat resistance as well as in moist heat resistance. Also, the cured product of the polymerizable composition of Comparative Example 2 containing another component (A'-1) instead of the thioether compound (A) was not good in heat resistance and optical properties in addition to poor heat and humidity resistance.
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