TW202226931A - Temperature controlling unit and operating apparatus using the same - Google Patents
Temperature controlling unit and operating apparatus using the same Download PDFInfo
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- TW202226931A TW202226931A TW109145137A TW109145137A TW202226931A TW 202226931 A TW202226931 A TW 202226931A TW 109145137 A TW109145137 A TW 109145137A TW 109145137 A TW109145137 A TW 109145137A TW 202226931 A TW202226931 A TW 202226931A
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本發明提供一種有效降低流道損失,並迅速排出已熱交換流體,進而提高溫控使用效能之溫控單元。The present invention provides a temperature control unit that effectively reduces the loss of the flow channel and rapidly discharges the heat-exchanged fluid, thereby improving the use efficiency of the temperature control.
在現今,電子元件測試設備之壓接機構以下壓治具下壓測試器內之電子元件,以確保電子元件之接點電性接觸測試器之探針而執行測試作業。由於電子元件測試時,將會快速地產生自熱,以致超出預設的測試溫度範圍而影響測試良率,為防止電子元件過熱,業者於壓接機構裝配溫控單元,利用溫控單元降低電子元件之高熱,期以預設測試溫度執行測試作業。At present, the crimping mechanism of the electronic component testing equipment presses the electronic components in the tester with the lower pressure fixture to ensure that the contacts of the electronic components are electrically contacted with the probes of the tester to perform the test operation. During testing of electronic components, self-heating will rapidly occur, which will affect the test yield beyond the preset test temperature range. Due to the high heat of the component, the test operation is expected to be performed at the preset test temperature.
請參閱圖1,測試器包含電性連接之電路板11及具探針121之測試座12,以供承置及測試電子元件,壓接機構於移動臂13與下壓治具14間設置溫控單元,溫控單元包含熱交換本體15及熱交換件16,熱交換本體15之頂面連結移動臂13,於底面凹設有容室151,並於容室151頂面之中間位置連通一供水流道152,供水流道152之一端連接供水管,另一端彎折向下延伸形成一入水口153,入水口153連通容室151,以供注入冷卻水,另於容室151頂面近外周緣處設有出水口154,出水口154連通一出水流道155,以供排出已熱交換之冷卻水;熱交換件16設有複數個陣列之鰭片161,並將鰭片161置入於熱交換本體15之容室151內,熱交換件16以底面連結下壓治具14;於下壓治具14下壓測試座12之電子元件17時,利用流入於容室151內之冷卻水與熱交換件16之鰭片161作熱交換
,以降低電子元件17之自熱而執行測試作業。
Please refer to FIG. 1 , the tester includes an electrically connected
惟,供水流道152之冷卻水流動至入水口153時,會先碰撞流道彎折擋部A,再流入於入水口153,導致冷卻水之各水分子間因碰撞磨擦產生能量耗損之流道損失,不僅損耗冷卻水,亦會減緩流速,而無法快速補充流入於容室151,以致無法提升冷卻效能。However, when the cooling water in the
再者,電子元件17的高熱集中於中心位置,因而熱交換件16僅需以中心位置之鰭片161與電子元件17之中心位置作較佳之熱交換,電子元件17周圍熱交換之需求則不高,但熱交換件16之全部鰭片161的高度相同,導致流過熱交換件16中心位置之鰭片161的已熱交換冷卻水,仍必須蜿蜒流動於熱交換件16周圍位置之複數個鰭片間,方可由出水口154排出,在冷卻水流動緩慢之狀態下
,不僅無法迅速排出已熱交換之冷卻水,更影響入水口153輸送預溫冷卻水至熱交換件16中心位置之鰭片161處的流速,以致降低熱交換冷卻效能,甚至業者必須耗損冷卻設備之更多能源,方可使電子元件降溫至預設測試溫度,以致增加成本及作業時間。
Furthermore, the high heat of the
本發明之目的一,提供一種溫控單元,包含承具及熱交換件,承具設有相通溫控空間之第一、二入水口及出水口,第一入水口之第一端周圍相對供水流道之主流動路徑未設有擋部,第二入水口之第三端周圍相對供水流道之主流動路徑設有擋部,熱交換件裝配於承具之溫控空間,並於基板設有複數個第一鰭片及複數個第二鰭片;藉以承具之第一入水口可避免流體碰撞而有效降低流道損失,並提高流體之流速,使可供快速流通之第一入水口搭配第二入水口而迅速將流體輸送至溫控空間,進而提高溫控使用效能。The first objective of the present invention is to provide a temperature control unit, which includes a holder and a heat exchange member. The holder is provided with first and second water inlets and water outlets that communicate with the temperature control space, and the first end of the first water inlet is relatively supplied with water around the first end. The main flow path of the flow channel is not provided with a blocking part, and the third end of the second water inlet is provided with a blocking part relative to the main flow path of the water supply flow channel. There are a plurality of first fins and a plurality of second fins; the first water inlet of the holder can avoid fluid collision, effectively reduce the loss of the flow channel, and increase the flow rate of the fluid, so that the first water inlet can be used for rapid circulation Combined with the second water inlet, the fluid can be quickly transported to the temperature-controlled space, thereby improving the efficiency of temperature-controlled use.
本發明之目的二,提供一種溫控單元,其熱交換件設有不同高度之第一鰭片與第二鰭片,並於高度較低之第二鰭片上方形成一速流區,而供已熱交換之流體由速流區迅速流動至出水口排出,並使第一、二入水口迅速輸送預溫流體至溫控空間,進而提高溫控使用效能。The second object of the present invention is to provide a temperature control unit, wherein the heat exchange element is provided with first fins and second fins of different heights, and a high-speed flow area is formed above the second fins with a lower height for supplying The heat-exchanged fluid flows rapidly from the high-speed flow area to the water outlet for discharge, and the first and second water inlets quickly deliver the pre-warmed fluid to the temperature-controlled space, thereby improving the temperature-controlled use efficiency.
本發明之目的三,提供一種溫控單元,其承具設有第一、二溫控空間,以供配置第一、二熱交換件,第一溫控空間配設有第一、二入水口及第一出水口,第二溫控空間配設有第三、四入水口及第二出水口,藉以形成複數個獨立之溫控區域,不僅縮短第一、二溫控空間之流體的流動路徑,使流體迅速與第一、二熱交換件作熱交換,並利用複數個獨立溫控區域,以便利應用於大尺寸電子元件或複數個微小尺寸電子元件之溫控作業,進而提高溫控使用效能。The third object of the present invention is to provide a temperature control unit, the holder is provided with first and second temperature control spaces for arranging the first and second heat exchange elements, and the first temperature control space is equipped with first and second water inlets And the first water outlet, the second temperature control space is equipped with the third and fourth water inlets and the second water outlet, so as to form a plurality of independent temperature control areas, which not only shortens the flow path of the fluid in the first and second temperature control spaces , make the fluid quickly exchange heat with the first and second heat exchange parts, and use multiple independent temperature control areas to facilitate the temperature control operation of large-sized electronic components or multiple micro-sized electronic components, thereby improving the use of temperature control. efficacy.
本發明之目的四,提供一種溫控單元,其承具於第一、二入水口之兩側分別設有第一出水口及第二出水口,第一、二出水口相通溫控空間及第一、二出水流道,而供溫控空間內之流體以較短流動路徑迅速分流至第一、二出水口排出,進而提高溫控使用效能。The fourth object of the present invention is to provide a temperature control unit, which is provided with a first water outlet and a second water outlet on both sides of the first and second water inlets, respectively, and the first and second water outlets communicate with the temperature control space and the second water outlet. The first and second water outlet channels, and the fluid in the temperature control space is quickly diverted to the first and second water outlets with a short flow path for discharge, thereby improving the efficiency of temperature control.
本發明之目的五,提供一種溫控單元,其承具之出水口的口徑尺寸大於第一、二入水口的口徑尺寸,以增加出水口與第一、二入水口之壓力差 ,使已熱交換之流體迅速且大量地由出水口排出,進而提高溫控使用效能。 The fifth object of the present invention is to provide a temperature control unit, the diameter of the water outlet of the holder is larger than that of the first and second water inlets, so as to increase the pressure difference between the water outlet and the first and second water inlets , so that the heat-exchanged fluid is quickly and massively discharged from the water outlet, thereby improving the temperature control efficiency.
本發明之目的六,提供一種溫控單元,其熱交換件之基板的底面作為接合部以供貼接電子元件,或於基板底面裝配至少一具接合部之治具以供貼接電子元件,利用接合部執行下壓或承載電子元件之作業,並溫控電子元件 ,進而提高溫控使用效能。 The sixth object of the present invention is to provide a temperature control unit, in which the bottom surface of the substrate of the heat exchange element is used as a joint for attaching electronic components, or at least one jig with a joint section is installed on the bottom surface of the substrate for attaching electronic components, Use the joint to perform the operation of pressing down or carrying electronic components, and to control the temperature of electronic components , thereby improving the efficiency of temperature control.
本發明之目的七,提供一種作業設備,包含機台、供料裝置、收料裝置、作業裝置、輸送裝置及中央控制裝置;供料裝置配置於機台,並設有至少一容納待作業電子元件之供料承置器;收料裝置配置於機台,並設有至少一容納已作業電子元件之收料承置器;作業裝置配置於機台,並設有至少一作業器,以供對電子元件執行預設作業;輸送裝置配置於機台,並設有至少一移料器及至少一本發明溫控單元,移料器以供移載電子元件,溫控單元以供溫控電子元件;中央控制裝置以供控制及整合各裝置作動,而執行自動化作業,達到提升作業效能之實用效益。The seventh object of the present invention is to provide an operation equipment, including a machine, a feeding device, a receiving device, an operating device, a conveying device and a central control device; the feeding device is arranged on the machine, and is provided with at least one accommodating electronic The feeding and receiving device for components; the receiving device is arranged on the machine table, and is provided with at least one receiving and receiving device for accommodating the electronic components that have been processed; the working device is arranged on the machine table, and is provided with at least one operating device Perform preset operations on electronic components; the conveying device is arranged on the machine table, and is provided with at least one feeder and at least one temperature control unit of the present invention, the feeder is used for transferring electronic components, and the temperature control unit is used for temperature control electronics Components; the central control device is used to control and integrate the actions of various devices to perform automated operations to achieve practical benefits of improving operational efficiency.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:
請參閱圖2、3、4,一種溫控單元,包含承具21及熱交換件,承具21設有至少一溫控空間;更進一步,承具21依作業需求,可設有複數個未相通之溫控空間,複數個溫控空間之尺寸相同或相異;於本實施例,承具21於第一面211凹設第一溫控空間2121及第二溫控空間2122,第一溫控空間2121與第二溫控空間2122間設有隔板2123而未相通,使得第一溫控空間2121與第二溫控空間2122分別形成二獨立之溫控空間,以利應用於大尺寸電子元件或複數個微小尺寸電子元件之溫控作業。Please refer to FIGS. 2 , 3 and 4 , a temperature control unit includes a
承具21設有第一入水口2131及第二入水口2132,第一入水口2131之第一端相通第一供水流道2141,且第一端周圍相對第一供水流道2141之第一主流動路徑L1未設有擋部,第一入水口2131之第二端相通第一溫控空間2121,第二入水口2132之第三端相通第一供水流道2141,且第三端周圍相對第一供水流道2141之第一主流動路徑L1設有擋部,第二入水口2132之第四端相通第一溫控空間2121;於本實施例,承具21設有第一入水口2131及第二入水口2132,以相通第一溫控空間2121及第一供水流道2141,並設有第三入水口2133及第四入水口2134,以相通第二溫控空間2122及第二供水流道2142。The
承具21之第一入水口2131位於近第一溫控空間2121的中心位置,第一入水口2131的第一端相通第一供水流道2141,且第一端周圍相對第一供水流道2141之第一主流動路徑L1未設有擋部,即第一入水口2131與第一供水流道2141形成T型之第一支流流動路徑L3,又第一入水口2131之第二端相通第一溫控空間2121,以供第一供水流道2141之流體經第一入水口2131流入於第一溫控空間2121;第二入水口2132之第三端相通第一供水流道2141,且第三端周圍相對第一供水流道2141之第一主流動路徑L1設有擋部2141A,即第二入水口2132與第一供水流道2141形成「型之第二支流流動路徑L4,又第二入水口2132之第四端相通第一溫控空間2121,以供第一供水流道2141之流體經第二入水口2132流入於第一溫控空間2121。The
承具21之第三入水口2133位於近第二溫控空間2122的中心位置,第三入水口2133的第一端相通第二供水流道2142,且第一端周圍相對第二供水流道2142之第二主流動路徑L2未設有擋部,即第三入水口2133與第二供水流道2142形成T型之第三支流流動路徑L5,又第三入水口2133之第二端相通第二溫控空間2122,以供第二供水流道2142之流體經第三入水口2133流入於第二溫控空間2122;第四入水口2134之第三端相通第二供水流道2142,且第三端周圍相對第二供水流道2142之第二主流動路徑L2設有擋部2142A,即第四入水口2134與第二供水流道2142形成「型之第四支流流動路徑L6,又第四入水口2134之第四端相通第二溫控空間2122,以供第二供水流道2142之流體經第四入水口2134流入於第二溫控空間2122。The
承具21設有至少一出水口,出水口相通出水流道及第一溫控空間2121,更進一步,出水口之口徑尺寸大於第一、二入水口2131、2132之口徑尺寸,使第一、二入水口2131、2132與出水口之壓力差變大,以供迅速排出已熱交換之流體。The
於本實施例,承具21於第一、二入水口2131、2132之二側分別設有第一出水口2151及第二出水口2152,第一出水口2151相通第一出水流道2161及第一溫控空間2121,第二出水口2152相通第二出水流道2162及第一溫控空間2121。承具21另於第三、四入水口2133、2134之二側分別設有第三出水口2153及第四出水口2154,第三出水口2153相通第三出水流道2163及第二溫控空間2122,第四出水口2154相通第四出水流道2164及第二溫控空間2122。In this embodiment, the
至少一熱交換件裝配於承具21之溫控空間,並於基板設有複數個第一鰭片及複數個第二鰭片;更進一步,第一鰭片及第二鰭片呈圓柱狀、角柱狀或片狀,複數個第一鰭片及複數個第二鰭片排列呈複數環同心圓或呈凸型;第一鰭片與第二鰭片具有相同或相異之高度,若第一鰭片與第二鰭片具有相異高度,以於高度較低之第二鰭片上方形成一速流區,以供已熱交換之流體經速流區而迅速流動至出水口排出。又承具21之第一入水口2131相對於熱交換件於第一鰭片。At least one heat exchange element is assembled in the temperature control space of the
另,基板可直接或間接接合電子元件,例如基板之第二面(如底面)作為接合部,以供直接接合且溫控電子元件,例如基板之底面裝配至少一具接合部之治具,以供間接接合電子元件,利用接合部執行下壓或承載電子元件之作業,並溫控電子元件,進而提高溫控使用效能。In addition, the substrate can be directly or indirectly bonded to electronic components. For example, the second surface (such as the bottom surface) of the substrate can be used as a bonding portion for direct bonding and temperature control of electronic components. For example, the bottom surface of the substrate is equipped with a fixture with at least one bonding portion to It is used for indirect bonding of electronic components, using the joints to perform the operation of pressing down or carrying electronic components, and to temperature control the electronic components, thereby improving the performance of temperature control.
然,溫控單元依作業需求而設置複數個溫控空間供裝配複數個熱交換件,複數個熱交換件可搭配複數個加熱器或致冷晶片使用。Of course, the temperature control unit is provided with a plurality of temperature control spaces for assembling a plurality of heat exchange elements according to operational requirements, and the plurality of heat exchange elements can be used with a plurality of heaters or cooling chips.
於本實施例,溫控單元配置第一熱交換件22及第二熱交換件23,第一熱交換件22裝配於承具21之第一溫控空間2121,並設有第一基板221,第一基板221於第一面中心位置凸設陣列有複數個第一鰭片222,複數個第一鰭片222相對於承具21之第一入水口2131及第二入水口2132,第一鰭片222之兩側分別凸設陣列有複數個第二鰭片223,第一鰭片222與第二鰭片223具有高低位差,即第二鰭片223之高度低於第一鰭片222,以於第二鰭片223之上方形成一速流區,使第一鰭片222之兩側與第一、二出水口2151、2152間分別具有速流區。In this embodiment, the temperature control unit is configured with a first
又第一基板221之第二面(如底面)供裝配至少一具接合部之治具(圖未示出,如下壓治具或承置具等),以供接合電子元件,利用接合部執行下壓或承載電子元件之作業,並溫控電子元件。In addition, the second surface (such as the bottom surface) of the
第二熱交換件23裝配於承具21之第二溫控空間2122,並設有第二基板231,第二基板231於第一面中心位置凸設陣列有複數個第三鰭片232,複數個第三鰭片232相對於承具21之第三入水口2133及第四入水口2134,第三鰭片232之兩側分別凸設陣列有複數個第四鰭片233,第三鰭片232與第四鰭片233具有高低位差,即第四鰭片233之高度低於第三鰭片232,以於第四鰭片233之上方形成一速流區,使第三鰭片232之兩側與第三、四出水口2153、2154間分別具有速流區。The second
又第二基板231之第二面(如底面)可供裝配至少一具接合部之治具(圖未示出,如下壓治具或承置具等),以供貼接電子元件,利用接合部執行下壓或承載電子元件之作業,並溫控電子元件。The second surface (such as the bottom surface) of the
請參閱圖3、5,溫控單元應用於輸送裝置之壓接機構,溫控單元之承具21以第二面連接移動臂31,更進一步,承具21可作直接或間接裝配移動臂31,若為間接裝配,移動臂31與承具21間可配置浮動器等;於本實施例,承具21之第二面間接裝配移動臂31;第一熱交換件22之基板221及第二熱交換件23之基板231裝配下壓治具32,下壓治具32設有第一、二接合部321、322,以供執行下壓電子元件之作業,並溫控電子元件。另測試裝置於相對下壓治具32之第一、二接合部321、322的位置設有具探針之第一、二測試座33、34,第一、二測試座33、34電性連接電路板35;一移料器(圖未示出)將第一、二電子元件36、37分別移入第一、二測試座33、34,移動臂31即帶動溫控單元及下壓治具32作Z方向位移,使下壓治具32之第一、二接合部321、322分別下壓第一、二電子元件36、37執行測試作業。Please refer to FIGS. 3 and 5 , the temperature control unit is applied to the crimping mechanism of the conveying device. The
請參閱圖6、7,以溫控單元之第一熱交換件22為例,承具21之第一供水流道2141供應低溫流體,低溫流體沿第一主流動路徑L1流動至第一入水口2131及第二入水口2132,由於第一入水口2131的第一端周圍相對第一供水流道2141並無設有擋部,而可避免低溫流體之各水分子因碰撞擋部而發生流道損失,使得低溫流體流經第一入水口2131時,即迅速沿第一支流流動路徑L3流入於第一入水口2131,接著低溫流體沿第一主流動路徑L1流動至第二入水口2132
,由於擋部2141A為第一供水流道2141之封閉端,低溫流體會碰撞擋部2141A後
,再沿第二支流流動路徑L4流入於第二入水口2132,然低溫流體於第二入水口2132處雖會發生部分流道損失,但因第一入水口2131並不會有流道損失,且相對於熱交換件22之中央位置,使得第一入水口2131以預設流量之低溫流體流入至熱交換件22中央位置之第一鰭片222作熱交換,並搭配第二入水口2132流入之低溫流體,進而迅速且確實降低第一電子元件36中央位置之高熱。
Please refer to FIGS. 6 and 7 , taking the first
由於熱交換件22之第二鰭片223上方形成速流區,通過第一鰭片222且已熱交換之低溫流體可分別沿第二鰭片223及速流區流動,由於第一電子元件36周側位置的降溫需求相較低於中央位置,而可於低溫流體流入熱交換件22兩側之第二鰭片223時,使低溫流體與第二鰭片223作一熱交換,以降低第一電子元件36周側位置之高熱;再者,位於第一鰭片222兩側之速流區可供已熱交換的低溫流體毋需作蜿蜒流動,使已熱交換的低溫流體迅速分別經由兩側之速流區而通過兩側之第二鰭片223上方,然第一出水口2151及第二出水口2152位於第一入水口2131之兩側,可縮短出水路徑,使得已熱交換的低溫流體分別流入第一出水口2151及第二出水口2152,進而迅速由第一出水流道2161及第二出水流道2162排出。Since a high-speed flow area is formed above the
請參閱圖2~4、8,一種作業設備包含機台40、供料裝置50、收料裝置60、作業裝置70、輸送裝置80及中央控制裝置(圖未示出);供料裝置50裝配於機台40,並設有至少一供料承置器51,以供承置待作業之電子元件;收料裝置60裝配於機台40,並設有至少一收料承置器61,以供承置已作業之電子元件
;作業裝置70裝配於機台40,並設有至少一作業器,以供對電子元件執行預設作業,於本實施例中,作業器為測試器,測試器設置電性連接之電路板71及測試座72,以供測試電子元件;輸送裝置80裝配於機台40,並設有至少一移料器及至少一本發明之溫控單元,移料器以供移載電子元件,本發明之溫控單元以供溫控電子元件;於本實施例中,輸送裝置80之第一移料器81於供料裝置50之供料承置器51取出待測之電子元件,並移載至輸送載台82,第二移料器83於輸送載台82取出待測電子元件,並移載至測試座72,輸送裝置80於測試裝置70之上方配置壓接機構,壓接機構於移動臂與下壓治具間配置溫控單元,於下壓治具下壓測試座72之電子元件時,利用溫控單元使電子元件保持預設測試溫度而執行測試作業,第二移料器83將測試座72之已測電子元件移載至輸送載台82,第一移料器81於輸送載台82取出已測電子元件,並移載至收料裝置60之收料承置器61收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to FIGS. 2-4 and 8 , a working equipment includes a machine table 40 , a
[習知] 11:電路板 12:測試座 121:探針 13:移動臂 14:下壓治具 15:熱交換本體 151:容室 152:供水流道 153:入水口 154:出水口 155:出水流道 16:熱交換件 161:鰭片 17:電子元件 A:流道彎折擋部 [本發明] 21:承具 211:第一面 2121:第一溫控空間 2122:第二溫控空間 2123:隔板 2131:第一入水口 2132:第二入水口 2133:第三入水口 2134:第四入水口 2141:第一供水流道 2141A:擋部 2142:第二供水流道 2142A:擋部 2151:第一出水口 2152:第二出水口 2153:第三出水口 2154:第四出水口 2161:第一出水流道 2162:第二出水流道 2163:第三出水流道 2164:第四出水流道 22:第一熱交換件 221:第一基板 222:第一鰭片 223:第二鰭片 23:第二熱交換件 231:第二基板 232:第三鰭片 233:第四鰭片 L1:第一主流動路徑 L2:第二主流動路徑 L3:第一支流流動路徑 L4:第二支流流動路徑 L5:第三支流流動路徑 L6:第四支流流動路徑 31:移動臂 32:下壓治具 321:第一接合部 322:第二接合部 33:第一測試座 34:第二測試座 35:電路板 36:第一電子元件 37:第二電子元件 40:機台 50:供料裝置 51:供料承置器 60:收料裝置 61:收料承置器 70:作業裝置 71:電路板 72:測試座 80:輸送裝置 81:第一移料器 82:輸送載台 83:第二移料器 [acquaintance] 11: circuit board 12: Test seat 121: Probe 13: Moving Arm 14: Press down the jig 15: heat exchange body 151: Room 152: Water supply channel 153: Inlet 154: Water outlet 155: outlet channel 16: heat exchange parts 161: Fins 17: Electronic Components A: runner bending stop [this invention] 21: Bearing 211: The first side 2121: The first temperature control space 2122: The second temperature control space 2123: Separator 2131: The first water inlet 2132: Second water inlet 2133: The third water inlet 2134: Fourth Inlet 2141: First water supply channel 2141A: Stopper 2142: Second water supply channel 2142A: Stopper 2151: The first water outlet 2152: Second water outlet 2153: The third outlet 2154: Fourth outlet 2161: The first outlet channel 2162: Second outlet channel 2163: The third outlet channel 2164: Fourth outlet channel 22: The first heat exchange part 221: The first substrate 222: The first fin 223: Second Fin 23: Second heat exchange element 231: Second substrate 232: Third Fin 233: Fourth Fin L1: The first main flow path L2: Second main flow path L3: The first tributary flow path L4: Second tributary flow path L5: Third tributary flow path L6: Fourth tributary flow path 31: Moving Arm 32: Press down the jig 321: First Joint 322: Second Joint 33: The first test seat 34: Second test seat 35: circuit board 36: The first electronic component 37: Second electronic component 40: Machine 50: Feeding device 51: Feed holder 60: Receiving device 61: Receiving holder 70: Working device 71: circuit board 72: Test seat 80: Conveying device 81: First mover 82: Conveying stage 83: Second mover
圖1:習知溫控單元之使用示意圖。 圖2:本發明溫控單元之俯視圖。 圖3:本發明溫控單元之剖面示意圖(一)。 圖4:本發明溫控單元之剖面示意圖(二)。 圖5:本發明溫控單元裝配於壓接機構之示意圖。 圖6:本發明溫控單元之使用示意圖(一)。 圖7:本發明溫控單元之使用示意圖(二)。 圖8:本發明作業設備之配置圖。 Figure 1: A schematic diagram of the use of a conventional temperature control unit. Figure 2: A top view of the temperature control unit of the present invention. FIG. 3 is a schematic cross-sectional view (1) of the temperature control unit of the present invention. FIG. 4 is a schematic cross-sectional view (2) of the temperature control unit of the present invention. FIG. 5 is a schematic view of the temperature control unit of the present invention assembled to the crimping mechanism. Figure 6: Schematic diagram (1) of the use of the temperature control unit of the present invention. Figure 7: Schematic diagram (2) of the use of the temperature control unit of the present invention. Figure 8: The configuration diagram of the operation equipment of the present invention.
21:承具 21: Bearing
211:第一面 211: The first side
2121:第一溫控空間 2121: The first temperature control space
2122:第二溫控空間 2122: The second temperature control space
2123:隔板 2123: Separator
2131:第一入水口 2131: The first water inlet
2132:第二入水口 2132: Second water inlet
2133:第三入水口 2133: The third water inlet
2134:第四入水口 2134: Fourth Inlet
2141:第一供水流道 2141: First water supply channel
2141A:擋部 2141A: Stopper
2142:第二供水流道 2142: Second water supply channel
2142A:擋部 2142A: Stopper
22:第一熱交換件 22: The first heat exchange part
221:第一基板 221: The first substrate
222:第一鰭片 222: The first fin
223:第二鰭片 223: Second Fin
23:第二熱交換件 23: Second heat exchange element
231:第二基板 231: Second substrate
232:第三鰭片 232: Third Fin
233:第四鰭片 233: Fourth Fin
L1:第一主流動路徑 L1: The first main flow path
L2:第二主流動路徑 L2: Second main flow path
L3:第一支流流動路徑 L3: The first tributary flow path
L4:第二支流流動路徑 L4: Second tributary flow path
L5:第三支流流動路徑 L5: Third tributary flow path
L6:第四支流流動路徑 L6: Fourth tributary flow path
Claims (10)
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Cited By (4)
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TWI812457B (en) * | 2022-09-07 | 2023-08-11 | 鴻勁精密股份有限公司 | Temperature control mechanism, processing apparatus, and processing machine |
TWI827473B (en) * | 2023-02-22 | 2023-12-21 | 鴻勁精密股份有限公司 | Processing machine of electronic component |
TWI860063B (en) * | 2023-08-28 | 2024-10-21 | 穎崴科技股份有限公司 | Thermal conductive device and handler using the same |
TWI867718B (en) * | 2023-08-29 | 2024-12-21 | 鴻勁精密股份有限公司 | Pressing mechanism, testing device, and processing machine |
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JP4426396B2 (en) * | 2004-07-30 | 2010-03-03 | エスペック株式会社 | Cooling system |
CN201007721Y (en) * | 2006-12-27 | 2008-01-16 | 中茂电子(深圳)有限公司 | Semiconductor component testing table with ventiduct cooling device |
TWI403732B (en) * | 2010-11-05 | 2013-08-01 | Hon Tech Inc | Semiconductor component testing sub-press under pressure device |
US10297339B2 (en) * | 2014-02-19 | 2019-05-21 | Advantest Corporation | Integrated cooling system for electronics testing apparatus |
TW201614246A (en) * | 2014-10-03 | 2016-04-16 | Hon Tech Inc | Temperature control device of crimping device of test equipment and temperature control method thereof |
CN209486144U (en) * | 2018-12-25 | 2019-10-11 | 无锡市大元广盛电气股份有限公司 | A kind of heat radiating type auto testing instrument |
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TWI812457B (en) * | 2022-09-07 | 2023-08-11 | 鴻勁精密股份有限公司 | Temperature control mechanism, processing apparatus, and processing machine |
TWI827473B (en) * | 2023-02-22 | 2023-12-21 | 鴻勁精密股份有限公司 | Processing machine of electronic component |
TWI860063B (en) * | 2023-08-28 | 2024-10-21 | 穎崴科技股份有限公司 | Thermal conductive device and handler using the same |
TWI867718B (en) * | 2023-08-29 | 2024-12-21 | 鴻勁精密股份有限公司 | Pressing mechanism, testing device, and processing machine |
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