TW202224173A - Light emitting display device and method of manufacturing the same - Google Patents

Abstract

A light-emitting display device has a substrate, a first patterned conductive layer, a first patterned electrically insulating layer, a second patterned conductive layer, a plurality of soldering pad areas, and a plurality of light-emitting elements sequentially arranged on the substrate. The minimum distance between the light-emitting elements is 2 to 3 mm. The first patterned conductive layer has a plurality of first wires, the second patterned conductive layer has a plurality of second wires and each second wire has derived extensions, the first patterned electrically insulating layer is used to isolate the electrical contact between the first patterned conductive layer and the second patterned conductive layer, and the second wires and the first wires are arranged in a cross manner. The soldering pad areas are separated from each other with one soldering pad area being electrically connected to the first wires while the other soldering pad areas being respectively connected to the derived extensions of three adjacent second wires.

Description

Light-emitting display device and method of manufacturing the same

The present invention relates to a display device, in particular to a light-emitting display device and a manufacturing method thereof.

In response to the development of the display screen of the display towards large size, flatness, thinning, light weight and flexibility, the passive point light source and the active point light source are used as the light source of the display, and the flexible substrate is used as the light source to carry these light sources. The development of light-emitting display technology for substrates is increasingly important. The passive point light source is, for example, a light emitting diode (LED), and the active point light source is, for example, an organic light-emitting diode (OLED). In a branch of technology development, the follow-up progress of light-emitting displays developed by using LEDs as light sources for long-distance viewing deserves attention.

In the production of this type of light-emitting display for people to watch from a long distance, a plurality of LED lamp beads or LED chips are usually installed on the substrate in an array, and the distance between adjacent LED lamp beads or LED chips is not less than 2 millimeters (mm), which is different from organic light-emitting diode (OLED) displays or micro-scale light-emitting diode (Micro-LED) displays for people to view at close range. In order for each LED lamp bead or LED chip in the array to be lit, the substrate carrying these LED lamp beads or LED chips and the conductive layer thereof must have good conductivity. In addition, in order to improve the contrast ratio of such light-emitting displays viewed from a distance, the visibility of the substrates carrying these LED lamp beads or LED chips and their conductive layers in the displayed picture must be reduced. On the other hand, in order to meet the display effects required by various applications, the fabrication of the conductive layer on the substrate carrying the LED lamp beads or the LED chip must have good design variability and be completed quickly. In view of the above technical problems, the present invention hopes to provide solutions.

In view of the above problems, the present invention provides a light-emitting display device and a manufacturing method thereof.

In one embodiment, the light-emitting display device has a substrate, a first patterned conductive layer, a first patterned electrical insulating layer, a second patterned conductive layer, and at least four pads spaced apart from each other, which are sequentially arranged on the substrate. area and multiple light-emitting elements. The light-emitting elements are arranged in an array, and the minimum distance between them is 2 to 3 mm. The substrate has a first surface and a second surface opposite to the first surface, and the light-emitting element is carried on the same side of the first surface of the substrate. The first patterned conductive layer has a plurality of linear first wires parallel to each other, and the first wires are arranged on the first surface of the substrate. The second patterned conductive layer is disposed above the first patterned conductive layer, and has a plurality of parallel second wires in the shape of a line and a linear extension portion connected from each of the second wires. The arrangement of the second wires The direction intersects with the arrangement direction of the first wires. The pad area is respectively electrically connected to four different pins of one of the light-emitting components, the first pad area of the pad area is electrically connected to the first wire, the second pad area and the third pad area of the pad area are electrically connected and the fourth pad regions are all disposed on the second patterned conductive layer and are respectively connected with the extension parts of the three adjacent second wires. The first patterned electrical insulating layer is disposed between the first patterned wire layer and the second patterned conductive layer, and has a plurality of first electrical insulating blocks for isolating the first patterned conductive layer and the second patterned conductive layer Electrical contact between conductive layers.

In one embodiment, the first patterned conductive layer further has a linear extension part connected from each first wire, the extension part of the first wire is arranged on the first surface of the substrate; a part of each second wire is arranged Above the first surface of the substrate, another part of each second wire is arranged above the first wire and spans at least one first wire, and the extension of each second wire is arranged above the first surface of the substrate; the first A pad area is disposed on the first patterned conductive layer and is connected to the extension of one of the first wires; and the first electrical insulating blocks are respectively disposed on the part of each of the second wires that straddles the first wire and between the first wires to isolate the electrical contact between the second wires and the first wires.

In one embodiment, the second patterned conductive layer further has an island portion connected from the intersection of at least two first wires, each of the second wires spans the plurality of first wires and is disposed above the first wires, and each of the first wires The extension parts of the two wires are arranged above the first wires; the first pad area is arranged on the second patterned conductive layer and is connected to the island; and each of the first electrical insulating blocks covers corresponding to all pad areas A configuration area is arranged between the first wire, the second wire and the extension of the second wire, and is used to isolate the electrical contact between the first patterned conductive layer and the second patterned conductive layer on the configuration area.

In one embodiment, the first patterned conductive layer further has a linear extension of the first wire, and the extension of the first wire is disposed on the first surface of the substrate; each second wire spans a plurality of first wires and arranged above the first wires, a part of the extension of each second wire is arranged above the first surface of the substrate; the first pad area is arranged on the first patterned conductive layer and is connected to the extension of the first wire connection; and each first electrical insulating block covers the peripheral area outside a configuration area corresponding to all the pad areas, and is configured between the second wire and the first wire to isolate the first patterning on the configuration area Electrical contact between the conductive layer and the second patterned conductive layer.

In one embodiment, the line width of each of the first conductive lines is 25 micrometers to 2 mm and the line width of each of the second conductive lines is 25 micrometers to 100 micrometers.

In one embodiment, the first wires are woven into a polygonal mesh.

In one embodiment, the light-emitting display device further has a second patterned electrical insulating layer, which has a plurality of second electrical insulating blocks, and the second electrical insulating blocks are respectively arranged along the first arrangement direction of the pad regions On the first surface of the substrate, it is used for isolating the electrical contact of the pad area in the second arrangement direction, and the second arrangement direction and the first arrangement direction intersect each other.

In one embodiment, the light-emitting display device further has a third patterned electrical insulating layer, which has a plurality of third electrical insulating blocks, and the third electrical insulating blocks are respectively arranged along the second arrangement direction of the pad regions Above the second wire connected to the third pad area, it is used to isolate the electrical contact of the pad area in the first arrangement direction.

In one embodiment, the light-emitting display device further has a patterned conductive metal seed layer, which is formed on the first surface of the substrate and has the same pattern as that of the first patterned conductive layer, and is used as the first patterned conductive layer The formation preparation layer.

In the above embodiments, the light-emitting element of the light-emitting display device may be a light-emitting diode chip.

On the other hand, the present invention provides a manufacturing method of a light-emitting display device.

In a first embodiment, a method for manufacturing a light-emitting display device includes the following steps: providing a substrate; forming a first patterned conductive layer including a plurality of first wires on the substrate; using one of screen printing and jet printing The process forms a first patterned electrical insulating layer including a plurality of first electrical insulating blocks on the top of the first patterned conductive layer; using one of screen printing and jet printing to form a plurality of second wires and self- The second patterned conductive layer of the extension part connected by the second wire is above the first patterned electrical insulating layer; and a part of the extension part of the second wire is respectively configured as a bonding pad of at least three pins of a light-emitting element Area.

In the first embodiment, the proposed manufacturing method of the light-emitting display device further includes the following steps: when forming the first patterned conductive layer, integrally forming the extension part of the first wire; and disposing a part of the extension part of the first wire into a The pad area of the other pin of the light-emitting element.

In the first embodiment, the proposed manufacturing method of the light-emitting display device may further include the following steps: forming a patterned conductive metal seed layer on the substrate by one of sputtering, screen printing and jet printing, and the first A patterned conductive layer is formed on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating.

In the first embodiment, the first patterned conductive layer of the proposed light-emitting display device can be formed by one of screen printing and jet printing.

In a second embodiment, the proposed manufacturing method of the light-emitting display device further includes the following steps: when forming the first patterned electrical insulating layer, part of the first wires are exposed from the first electrical insulating block; When forming the second patterned conductive layer, integrally forming an island portion connected to the intersection of the two exposed first wires from the first electrical insulating block; The pad area of the pin.

In the second embodiment, the proposed manufacturing method of the light-emitting display device may include the following steps: forming a patterned conductive metal seed layer on the substrate by one of sputtering, screen printing and jet printing; and firstly The patterned conductive layer is formed on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating.

In the second embodiment, the first patterned conductive layer of the proposed light-emitting display device can be formed by one of screen printing and jet printing.

In a third embodiment, the proposed manufacturing method of the light-emitting display device further includes the following steps: when forming the first patterned conductive layer, integrally forming the extension of the first wire; exposed in the electrical insulating layer; when forming the second patterned conductive layer, the second wire is formed on the first patterned electrical insulating layer, and the extension of the second wire is configured as at least three connections of the light-emitting element A part of the pad area of the pin is formed on the substrate; and a part of the extension part of the first wire is configured as a solder pad area of another pin of the light-emitting element.

In the third embodiment, the proposed manufacturing method of the light-emitting display device may include the following steps: forming a patterned conductive metal seed layer on the substrate by one of sputtering, screen printing and jet printing; and first The patterned conductive layer is formed on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating.

In the third embodiment, the first patterned conductive layer of the proposed light-emitting display device can be formed by one of screen printing and jet printing.

To sum up, according to the light-emitting display device and the manufacturing method thereof described in the various embodiments of the present invention, the connection wires corresponding to the pad regions of the pins of the light-emitting element are arranged in layers, so that the power supply connection wires in the pad regions and The signal connection wires in the pad area do not share the same plane configuration space, which is beneficial to increase the plane configuration space of the power source connection wires and improve the conductivity of the power source connection wires. In addition, a power connection wire can be subdivided into a plurality of equivalent wires with smaller line widths in the enlarged plane configuration space, so as to improve the transparency of the display screen. In addition, the light-emitting element can also use micro-miniature light-emitting diode chips to reduce the visibility of the light-emitting element itself in the display screen. In this way, when the substrate carrying the light-emitting element is transparent, the visibility of the wires and the light-emitting element on the substrate in the display screen can be greatly reduced, thereby improving the contrast and efficiency of the light-emitting display viewed from a certain distance. clarity. On the other hand, since the first patterned conductive layer and the second patterned conductive layer electrically connected to the light-emitting element can be fabricated by a printing process such as screen printing and jet printing, the near-infrared light irradiation can be further utilized to rapidly Curing the printed or jet-printed conductive layer to shorten process time and facilitate process procedures. In addition, the materials of the first patterned conductive layer and the second patterned conductive layer can be selected according to different processes, and have flexibility in process design. For example, the material of the first wire of the first patterned conductive layer and the extension of the first wire can be a paste doped with conductive powder, and a material that can be electroless plating can be further added, which can be indium tin oxide (Indium Tin Oxide) with high transparency ( ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film, or aluminum zinc oxide (AZO) film, and may also be copper, silver, nickel, or nickel-gold. Similarly, the material of the second wire, the extension part of the second wire and the island part of the second patterned conductive layer can be a paste mixed with conductive powder and can be further added with a material that can be chemically plated, which can be highly transparent. An indium tin oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film, or an aluminum oxide zinc (AZO) film, may also be copper, silver, nickel, or nickel-gold. In the present invention, the material of the first patterned conductive layer or the second conductive layer is not limited to the above-mentioned materials, and any conductive materials such as graphene and carbon nanotubes can also be used.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

The present invention discloses a light-emitting display device. The following descriptions have been understood by those of ordinary skill in the art, and will not be described in full, such as the light-emitting principle of light-emitting diodes, the layered layers with specific conductive circuit patterns. A patterned conductive layer with a three-dimensional structure (the line patterns have height differences between each other), etc. In addition, if the meanings of the technical terms described below are different from the meanings of common terms in the technical field, the meanings in the text shall prevail, and the drawings compared in the text are intended to express the meanings related to the features of the present invention , which are not completely drawn according to the actual size, and are also described in advance.

FIG. 1 is a schematic plan view showing the arrangement relationship of wires and bonding pads of a light-emitting display device according to a first embodiment of the present invention. FIG. 2A is a schematic cross-sectional view showing the A-A section of the light-emitting display device of FIG. 1 . FIG. 2B is a schematic cross-sectional view showing the B-B section of the light-emitting display device of FIG. 1 . FIG. 2C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 1 .

1 to 2C, in one embodiment, the light-emitting display device 1 has a plurality of light-emitting elements 100, a substrate 10, a first patterned conductive layer 20, a first patterned electrical insulating layer 30, and a second patterned The conductive layer 40, at least four pad regions 50a, 50b, 50c, 50d spaced apart from each other. The pins of the light-emitting elements 100 corresponding to the respective pad regions 50a, 50b, 50c, 50d are respectively fixed on the corresponding pad regions 50a, 50b, 50c, 50d through the electrical connection material 80, such as solder paste, and thus and The pad regions 50a, 50b, 50c, and 50d constitute electrical connections, wherein the pad regions 50a and the power pins of the light-emitting element 100 are electrically connected, and the other pad regions 50b, 50c, and 50d are respectively connected to the light-emitting signal of the light-emitting element 100. The pins form electrical connections. The fixed light-emitting elements 100 are arranged on the substrate 10 in an array manner, and the minimum distance between them is not less than 2 mm, preferably 2 to 3 mm, so as to be different from the organic light emitting diode (OLED) display or microcomputer. Dimensional Light Emitting Diode (Micro-LED) Display. The light-emitting element 100 can be a light-emitting diode (LED) in the form of a lamp bead or a wafer, and the substrate 10 is preferably transparent, and the material of the substrate 10 can be glass, ceramics, aluminum nitride ceramics, polycarbonate, polyparaphenylene Ethylene formate, polyimide, polymethyl ester, BT resin, glass fiber or cyclic olefin copolymer.

Referring to FIGS. 1 to 2C , in this embodiment, the substrate 10 has a first surface 101 and a second surface 102 opposite to the first surface 101 , and all the light-emitting elements 100 are carried on the same side of the first surface 101 . As shown in FIG. 1 and FIG. 2B , the first patterned conductive layer 20 has a plurality of linear first wires 201 that are parallel to each other and spaced equidistantly or unequally from each other, and linear wires connected from each of the first wires 201 . The arrangement direction of the extension portion 202 and the arrangement direction of the first conducting wire 201 intersect with each other, for example, they are perpendicular to each other. Since the first wire 201 is the power connection wire of the light-emitting element, its wire width can be adjusted according to the required conductivity. In the embodiment, the line widths of the first wires 201 and the extending portions 202 of the first wires 201 are 25 μm to 2 mm. The first wire 201 and the extension 202 of the first wire 201 are disposed on the first surface 101 of the substrate 10 . As shown in FIG. 1 and FIG. 2A to FIG. 2C , the second patterned conductive layer 40 is disposed above the first patterned conductive layer 20 , and has a plurality of linear first patterned conductive layers that are parallel to each other and spaced equidistantly or unequally from each other. The two conducting wires 401 and the linear extending portions 402 connected from the respective second conducting wires 401, the arrangement direction of the extending portions 402 and the arrangement direction of the second conducting wires 401 intersect with each other, for example, they are perpendicular to each other. The arrangement direction of the second conducting wire 401 and the arrangement direction of the first conducting wire 201 cross each other, for example, are perpendicular to each other. The line widths of the second wires 401 and the extending portions 402 of the second wires 401 are 25 μm to 2 mm. Optionally, the line widths of the second wire 401 and the extension portion 402 of the second wire 401 are the same or different from the line width of the first wire 201 and the extension portion 202 of the first wire 201 . As shown in FIG. 1 and FIG. 2A , a part 4011 of each second wire 401 is disposed above the first surface 101 of the substrate 10 , and the other part 4012 is disposed above the first wire 201 to span the first wire 201 and The first wires 201 are electrically isolated from each other. On the other hand, the first patterned electrical insulating layer 30 has a plurality of first electrical insulating blocks 301 , and the first electrical insulating blocks 301 are respectively disposed on the respective second wires 401 across the first wires 201 . The portion 4012 and the first wire 201 are used to isolate the electrical contact between the second wire 401 and the first wire 201 . As shown in FIG. 1 , FIG. 2B and FIG. 2C , the extending portions 402 of each of the second wires 401 are disposed above the first surface 101 of the substrate 10 .

As shown in FIG. 1 , FIG. 2B and FIG. 2C , among the four pad regions 50 a , 50 b , 50 c , and 50 d , the first pad region 50 a is disposed on the first patterned conductive layer 20 and connected to the first wire 201 The extension portion 202 , the second pad region 50b, the third pad region 50c and the fourth pad region 50d are all disposed on the second patterned conductive layer 40 and are respectively connected to the extension portions of the three adjacent second wires 401 402.

Please continue to refer to FIG. 1 , in one embodiment, the light emitting display device 1 further has a second patterned electrical insulating layer 60 , and has a plurality of second electrical insulating blocks 601 , and the second electrical insulating blocks 601 are respectively along the The first arrangement direction of the pad regions 50a, 50b, 50c, 50d, such as the horizontal direction, is arranged on the first surface 101 of the substrate 10 to isolate the pad regions 50a, 50b, 50c, 50d from the pad regions 50a, The second arrangement direction of 50b, 50c, 50d is, for example, the electrical contact in the vertical direction. The second patterned electrical insulating layer 60 and the first patterned electrical insulating layer 30 may be formed in the same process. In another embodiment, the light-emitting display device 1 further has a third patterned electrical insulating layer 70, and has a plurality of third electrical insulating blocks 701, and the third electrical insulating blocks 701 are along the pad regions 50a, The second arrangement direction of 50b, 50c, and 50d, such as the vertical direction, is arranged above the second wire 401 connected to the third pad region 50c to isolate the pad regions 50a, 50b, 50c, 50d in the first arrangement direction For example, electrical contacts in the horizontal direction. The third patterned electrical insulating layer 70 can also be formed in the same process as the first patterned electrical insulating layer 30, so that the third electrical insulating block 701 is disposed on the second wire connected to the third pad region 50c below the 401. The above-mentioned second arrangement direction and the first arrangement direction cross each other, for example, are perpendicular to each other. In the embodiment, the first arrangement direction is, for example, parallel to the arrangement direction of the second wires 401 (horizontal direction shown in FIG. 1 ), and the second arrangement direction is, for example, perpendicular to the arrangement direction of the second wires 401 .

Please continue to refer to FIGS. 2A to 2C . In one embodiment, the light-emitting display device 1 further includes a patterned conductive metal seed layer 200 disposed on the first surface 101 of the substrate 10 and having a The pattern with the same pattern is used as the formation preparation layer of the first patterned conductive layer 20 . In this case, the first wire 201 and the extension 202 of the first wire 201 are disposed on the patterned conductive metal seed layer 200 .

FIG. 3A is a block flow diagram illustrating steps of an embodiment of a method of manufacturing the light-emitting display device of FIG. 1 . Referring to FIG. 3A , in one embodiment, the manufacturing method of the light-emitting display device of FIG. 1 includes the following steps:

Step 11: Provide a substrate. As shown in FIGS. 2A to 2C, a substrate 10 is provided.

Step 12 : forming a patterned conductive metal seed layer on the substrate by one of the processes of sputtering, screen printing and jet printing. As shown in FIGS. 2A to 2C , a patterned conductive metal seed layer 200 is formed on the first surface 101 of the substrate 10 .

Step 13 : integrally forming a first patterned conductive layer including a first wire and an extension of the first wire on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating. As shown in FIG. 1 to FIG. 2C , the first patterned conductive layer 20 is formed on the patterned conductive metal seed layer 200 . The first patterned conductive layer 20 includes a first wire 201 and an extension 202 of the first wire 201 . The patterns of a patterned conductive layer 20 and the patterned conductive metal seed layer 200 are the same. By forming the patterned conductive metal seed layer 200 , the formed first patterned conductive layer 20 can be firmly attached to the substrate 10 .

Step 14 : forming a first patterned electrical insulating layer including a first electrical insulating block over the first patterned conductive layer by one of screen printing and jet printing. As shown in FIG. 1 and FIG. 2A , a first patterned electrical insulating layer 30 including a first electrical insulating block 301 is formed above the first patterned conductive layer 20 .

Step 15 : integrally forming a second patterned conductive layer including the second wire and the extension of the second wire on the first patterned electrical insulating layer by one of screen printing and jet printing. As shown in FIG. 1 to FIG. 2C , a second patterned conductive layer 40 including a second wire 401 and an extension 402 of the second wire is formed above the first patterned electrical insulating layer 30 .

Step 16: Disposing a part of the extension part of the first wire and a part of the extension part of the second wire respectively as a bonding pad area of the pin of the light emitting element. As shown in FIG. 1 , FIG. 2B and FIG. 2C , a part of the extension part 202 of the first wire 201 is configured as the pad area 50a of the pin of the light-emitting element, and the extension parts of the three adjacent second wires 401 are arranged A part of 402 is respectively configured as the pad areas 50b, 50c, and 50d of the three pins of the light-emitting element. In the process of using screen printing, the extension portion 202 of the first wire 201 is integrated with the pad area 50a, and the extension portion 402 of the three adjacent second wires 401 is formed integrally with the pad area 50b, 50c, 50d respectively. .

FIG. 3B is a block flow diagram illustrating steps of another embodiment of the manufacturing method of the light-emitting display device of FIG. 1 . Referring to FIG. 3B , in another embodiment, the first patterned conductive layer of the light-emitting display device of FIG. 1 can be formed without one of the processes of sputtering, etching and electroplating, thus eliminating the need for the formation of the patterned conductive metal seed layer step. The manufacturing method of FIG. 3B includes the following steps:

Step 21: Provide a substrate. As shown in FIGS. 2A to 2C, a substrate 10 is provided.

Step 22 : integrally forming a first patterned conductive layer including a first wire and an extension of the first wire on the substrate by one of screen printing and jet printing. As shown in FIG. 1 to FIG. 2C , a first patterned conductive layer 20 including a first wire 201 and an extension 202 of the first wire 201 is formed on the first surface 101 of the substrate 10 .

Step 23 : forming a first patterned electrical insulating layer including a first electrical insulating block on the first patterned conductive layer by one of screen printing and jet printing. As shown in FIG. 1 and FIG. 2A , a first patterned electrical insulating layer 30 including a first electrical insulating block 301 is formed above the first patterned conductive layer 20 .

Step 24 : integrally forming a second patterned conductive layer including a second wire and an extension of the second wire on the first patterned electrical insulating layer by one of screen printing and jet printing. As shown in FIG. 1 to FIG. 2C , a second patterned conductive layer 40 including a second wire 401 and an extension 402 of the second wire is formed above the first patterned electrical insulating layer 30 .

Step 25 : Disposing a part of the extension part of the first wire and a part of the extension part of the second wire respectively as a bonding pad area of the pin of the light emitting element. As shown in FIG. 1 , FIG. 2B and FIG. 2C , a part of the extension part 202 of the first wire 201 is configured as the pad area 50a of the pin of the light-emitting element, and the extension parts of the three adjacent second wires 401 are arranged A part of 402 is respectively configured as the pad areas 50b, 50c, and 50d of the three pins of the light-emitting element. In the process of using screen printing, the extension portion 202 of the first wire 201 is integrated with the pad area 50a, and the extension portion 402 of the three adjacent second wires 401 is formed integrally with the pad area 50b, 50c, 50d respectively. .

4 is a schematic plan view showing the arrangement relationship of wires and bonding pads of a light-emitting display device according to a second embodiment of the present invention. FIG. 5A is a schematic cross-sectional view showing the A-A section of the light-emitting display device of FIG. 4 . FIG. 5B is a schematic cross-sectional view showing the B-B cross-section of the light-emitting display device of FIG. 4 . FIG. 5C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 4 .

4 to 5C, in one embodiment, the light-emitting display device 1a includes a plurality of light-emitting elements 100, a substrate 10, a first patterned conductive layer 20a, a first patterned electrical insulating layer 30a, a second patterned The conductive layer 40a, at least four pad regions 50e, 50f, 50g, 50h spaced apart from each other. The pins of the light-emitting elements 100 corresponding to the respective pad regions 50e, 50f, 50g, 50h are respectively fixed on the corresponding pad regions 50e, 50f, 50g, 50h through the electrical connection material 80, such as solder paste, and thus and The bonding pad regions 50e, 50f, 50g, and 50h constitute electrical connections, wherein the bonding pad regions 50e and the power pins of the light-emitting element 100 are electrically connected, and the other bonding pad regions 50f, 50g, and 50h are respectively connected with the light-emitting signal of the light-emitting element 100. The pins form electrical connections. The fixed light-emitting elements 100 are arranged on the substrate 10 in an array manner, and the minimum distance between them is not less than 2 mm, preferably 2 to 3 mm, so as to be different from the organic light emitting diode (OLED) display or microcomputer. Dimensional Light Emitting Diode (Micro-LED) Display.

4 to 5C , in this embodiment, the substrate 10 has a first surface 101 and a second surface 102 opposite to the first surface 101 , and all the light-emitting elements 100 are carried on the same side of the first surface 101 . The first patterned conductive layer 20a has a plurality of linear first wires 201a that are parallel to each other and spaced equidistantly or unequally from each other, and are disposed on the first surface 101 of the substrate 10. The mesh shape is a polygon, such as a hexagon, or other shapes such as a circle. The line width of the first wire 201a is 25 to 100 microns. Compared with the embodiment of FIG. 1 , the first conductive lines 201 are subdivided into equivalent first conductive lines 201 a with smaller line widths, so as to reduce the visibility of the first conductive lines 201 a. As shown in FIGS. 4 and 5A to 5C, the second patterned conductive layer 40a is disposed above the first patterned conductive layer 20a as in the embodiment of FIG. The spaced apart second wires 401a in the shape of a line, the extension portions 402a in the shape of a line connected from each of the second wires 401a, and the island portion 403a connected from the intersection of the two first wires 201a. The arrangement direction of the extending portion 402a and the arrangement direction of the second conducting wire 401a intersect with each other, for example, they are perpendicular to each other. The island portion 403 a is arranged perpendicular to the substrate 10 . The island portion 403a may be a block, and may be formed in the same process as the second wire 401a, or may be formed in another process. The arrangement direction of the second conducting wire 401a and the arrangement direction of the first conducting wire 201a intersect each other. The line widths of the second wires 401a and the extending portions 402a of the second wires 401a are 25 microns to 100 microns. Optionally, the line widths of the second conducting wire 401a and the extending portion 402a of the second conducting wire 401a are the same or different from that of the first conducting wire 201a. As shown in FIG. 4 and FIG. 5A to FIG. 5C , each of the second wires 401a and the extension portion 402a thereof are disposed on the first patterned electrical insulating layer 30a, and each of the second wires 401a spans the plurality of first wires 201a. The upper and the first wires 201a are electrically isolated from each other. On the other hand, the first patterned electrical insulating layer 30a is disposed above the first patterned conductive layer 20a, and has a plurality of first electrical insulating blocks 301a, and each first electrical insulating block 301a covers correspondingly all the A configuration area of the pad regions 50e, 50f, 50g, and 50h is used to isolate the electrical contact between the first patterned conductive layer 20a and the second patterned conductive layer 40a on the configuration area. The island portion 403a is connected to the intersection of the two first wires 201a exposed from the first electrically insulating block 301a.

As shown in FIGS. 4 , 5B and 5C, among the four pad regions 50e, 50f, 50g, and 50h, the first pad region 50e is formed on the first patterned conductive layer 20a and connected to the island portion 403a, The second pad region 50f, the third pad region 50g and the fourth pad region 50h are all disposed on the first patterned electrical insulating layer 30a and are respectively connected to the extending portions 402a of the three adjacent second wires 401a.

Please continue to refer to FIG. 4 , in one embodiment, the light-emitting display device 1a further has a second patterned electrical insulating layer 60a, and has a plurality of second electrical insulating blocks 601a, and the second electrical insulating blocks 601a are along the The first arrangement direction of the pad regions 50e, 50f, 50g, and 50h, such as horizontal arrangement, is arranged on the first patterned electrical insulating layer 30a to isolate the pad regions 50e, 50f, 50g, and 50h from the pads The second arrangement direction of the regions 50e, 50f, 50g, 50h is, for example, the electrical contact in the vertical direction. In another embodiment, the light-emitting display device 1a further has a third patterned electrical insulating layer 70a, and has a plurality of third electrical insulating blocks 701a, and the third electrical insulating blocks 701a are along the pad regions 50e, The second arrangement direction of 50f, 50g, 50h, such as the vertical direction, is arranged above the second wire 401a connected to the third pad region 50g to isolate the pad regions 50e, 50f, 50g, 50h in the first arrangement direction For example, electrical contacts in the horizontal direction. The third patterned electrical insulating layer 70a can also be formed in the same process as the second patterned electrical insulating layer 60a, so that the third electrical insulating block 701a is disposed on the second wire connected to the third pad region 50g below 401a. The above-mentioned second arrangement direction and the first arrangement direction cross each other, for example, are perpendicular to each other. In the embodiment, the first arrangement direction is, for example, parallel to the arrangement direction of the second wires 401a (horizontal direction shown in FIG. 4 ), and the second arrangement direction is, for example, perpendicular to the arrangement direction of the second wires 401a.

Please continue to refer to FIG. 5A to FIG. 5C. In one embodiment, the light-emitting display device 1a further includes a patterned conductive metal seed layer 200a disposed on the first surface 101 of the substrate 10 and having a The same pattern is used as the formation preparation layer of the first patterned conductive layer 20a. In this case, the first wires 201 a are disposed on the patterned conductive metal seed layer 200 .

FIG. 6A is a block flow diagram illustrating steps of an embodiment of a method of manufacturing the light-emitting display device of FIG. 4 . Referring to FIG. 6A , in one embodiment, the manufacturing method of the light-emitting display device of FIG. 4 includes the following steps:

Step 31: Provide a substrate. As shown in FIGS. 5A to 5C, a substrate 10 is provided.

Step 32 : forming a patterned conductive metal seed layer on the substrate by one of the processes of sputtering, screen printing and jet printing. As shown in FIGS. 5A to 5C , a patterned conductive metal seed layer 200 a is formed on the first surface 101 of the substrate 10 .

Step 33 : forming a first patterned conductive layer including a first wire on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating. As shown in FIG. 4 to FIG. 5C , a first patterned conductive layer 20a including a first wire 201a is formed on the patterned conductive metal seed layer 200a, and the patterns of the first patterned conductive layer 20a and the patterned conductive metal seed layer 200a are the same . By forming the patterned conductive metal seed layer 200a, the formed first patterned conductive layer 20a can be firmly attached to the substrate 10.

Step 34 : forming a first patterned electrical insulating layer including a first electrical insulating block over the first patterned conductive layer by one of screen printing and jet printing, and making a portion of the first conductive line exposed from the first electrically insulating block. As shown in FIG. 4 to FIG. 5C , a first patterned electrical insulating layer 30a including a first electrical insulating block 301a is formed above the first patterned conductive layer 20a, and a portion of the first conductive line 201a is formed from the first electrical insulating block 301a. The insulating block 301a is exposed.

Step 35 : integrally forming a second patterned conductive layer including a second wire, an extension of the second wire, and an island portion above the first patterned electrical insulating layer by one of screen printing and jet printing. As shown in FIG. 4 to FIG. 5C , a second patterned conductive layer 40a including a second wire 401a, an extension portion 402a of the second wire 401a, and an island portion 403a is formed above the first patterned electrical insulating layer 30a. The island portion 403a is connected to the intersection of the first conductive line 201a exposed from the first electrically insulating block 301a.

Step 36: Disposing a part of the island part and a part of the extension part of the second wire as a pad area of the pin of the light-emitting element, respectively. As shown in FIG. 4 , FIG. 5B and FIG. 5C , a part of the island portion 403a is arranged as the pad area 50e of the pin of the light-emitting element, and a part of the extension portion 402a of the three adjacent second wires 401a is arranged respectively The pad areas 50f, 50g and 50h of the three pins of the light-emitting element are formed. In the process of screen printing, the island portion 403a and the pad region 50e are integrated, and the extending portions 402a of the three adjacent second wires 401a are respectively integrated with the pad regions 50f, 50g, and 50h.

FIG. 6B is a block flow diagram showing the steps of another embodiment of the manufacturing method of the light-emitting display device of FIG. 4 . Referring to FIG. 6B , in another embodiment, the first patterned conductive layer of the light-emitting display device of FIG. 4 can be formed without one of sputtering, etching and electroplating processes, thus eliminating the need for the formation of a patterned conductive metal seed layer step. The manufacturing method of FIG. 6B includes the following steps:

Step 41: Provide a substrate. As shown in FIGS. 5A to 5C, a substrate 10 is provided.

Step 42 : forming a first patterned conductive layer including a first wire on the substrate by one of screen printing and jet printing. As shown in FIG. 4 to FIG. 5C , a first patterned conductive layer 20 a including first wires 201 a is formed on the first surface 101 of the substrate 10 .

Step 43 : forming a first patterned electrical insulating layer including a first electrical insulating block on the first patterned conductive layer by one of screen printing and jet printing, and making a portion of the first conductive line exposed from the first electrically insulating block. As shown in FIG. 4 to FIG. 5C , a first patterned electrical insulating layer 30a including a first electrical insulating block 301a is formed above the first patterned conductive layer 20a, and a portion of the first conductive line 201a is formed from the first electrical insulating block 301a. The insulating block 301a is exposed.

Step 44 : integrally forming a second patterned conductive layer including a second wire, an extension of the second wire, and an island portion over the first patterned electrical insulating layer by one of screen printing and jet printing. As shown in FIG. 4 to FIG. 5C , a second patterned conductive layer 40a including a second wire 401a, an extension portion 402a of the second wire 401a, and an island portion 403a is formed above the first patterned electrical insulating layer 30a. The island portion 403a is connected to the intersection of the first conductive line 201a exposed from the first electrically insulating block 301a.

Step 45: Disposing a part of the island part and a part of the extension part of the second wire as a bonding pad area of the pin of the light-emitting element, respectively. As shown in FIG. 4 , FIG. 5B and FIG. 5C , a part of the island portion 403a is arranged as the pad area 50e of the pin of the light-emitting element, and a part of the extension portion 402a of the three adjacent second wires 401a is arranged respectively The pad areas 50f, 50g and 50h of the three pins of the light-emitting element are formed. In the process of screen printing, the island portion 403a and the pad region 50e are integrated, and the extending portions 402a of the three adjacent second wires 401a are respectively integrated with the pad regions 50f, 50g, and 50h.

FIG. 7 is a schematic plan view showing the arrangement relationship of wires and bonding pads of a light-emitting display device according to a third embodiment of the present invention. FIG. 8A is a schematic cross-sectional view showing the A-A section of the light-emitting display device of FIG. 7 . FIG. 8B is a schematic cross-sectional view showing the B-B cross-section of the light-emitting display device of FIG. 7 . FIG. 8C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 7 .

7 to 8C, in one embodiment, the light-emitting display device 1b has a plurality of light-emitting elements 100, a substrate 10, a first patterned conductive layer 20b, a first patterned electrical insulating layer 30b, a second patterned The conductive layer 40b, at least four pad regions 50i, 50j, 50k, 50l spaced apart from each other. The respective pins of the light-emitting elements 100 corresponding to the respective pad regions 50i, 50j, 50k, 50l are respectively fixed on the corresponding pad regions 50i, 50j, 50k, 50l through the electrical connection material 80, such as solder paste, and thus and The pad regions 50i, 50j, 50k, and 50l constitute electrical connections, wherein the pad regions 50i and the power pins of the light-emitting element 100 are electrically connected, and the other pad regions 50j, 50k, and 50l are respectively connected with the light-emitting signal of the light-emitting element 100. The pins form electrical connections. The fixed light-emitting elements 100 are arranged on the substrate 10 in an array manner, and the minimum distance between them is not less than 2 mm, preferably 2 to 3 mm, so as to be different from the organic light emitting diode (OLED) display or microcomputer. Dimensional Light Emitting Diode (Micro-LED) Display.

Please continue to refer to FIGS. 7 to 8C , the substrate 10 has a first surface 101 and a second surface 102 opposite to the first surface 101 , and all the light-emitting elements 100 are carried on the same side of the first surface 101 . The first patterned conductive layer 20b has a plurality of linear first wires 201b and extending portions 202b of the linear first wires 201b that are parallel to each other and spaced equidistantly or unequally from each other. The first wires 201b are interwoven into a grid, and the grid shape is a polygon, such as a hexagon, or other shapes such as a circle. The line width of the first wire 201b is 25 to 100 microns, and the line width of the extending portion 202b of the first wire 201b is 25 to 100 microns. Compared with the embodiment of FIG. 1 , the first conducting wire 201 is subdivided into a plurality of equivalent first conducting wires 201 b with smaller line widths, so as to reduce the visibility of the first conducting wires 201 b. The first wire 201b and the extension portion 202b of the first wire 201b are both formed on the first surface 101 of the substrate 10 . In other embodiments, the first patterned conductive layer 20b may only have the first conductive lines 201b. As shown in FIG. 7 and FIG. 8A to FIG. 8C, the second patterned conductive layer 40b is disposed above the first patterned conductive layer 20b as in the embodiment of FIG. The spaced apart second wires 401b and the linear extensions 402b connected from the second wires 401b. The arrangement direction of the extending portion 402b and the arrangement direction of the second conducting wire 401b intersect with each other, for example, they are perpendicular to each other. The arrangement direction of the second conducting wire 401b and the arrangement direction of the first conducting wire 201b cross each other. The line widths of the second wires 401b and the extending portions 402b of the second wires 401b are 25 to 100 microns. Optionally, the line widths of the second wire 401b and the extension portion 402b of the second wire 401b are the same or different from that of the first wire 201b. As shown in FIGS. 7 and 8A to 8C , a part of the extension part 402 b is disposed above the first patterned electrical insulating layer 30 b , and another part of the extension part 402 b is disposed above the first surface 101 of the substrate 10 . Each of the second wires 401b spans over the plurality of first wires 201b and is electrically isolated from the first wires 201b. In other embodiments, all parts of the extension portion 402 b are disposed above the first surface 101 of the substrate 10 . On the other hand, the first patterned electrical insulating layer 30b is disposed above the first patterned conductive layer 20b, and has a plurality of first electrical insulating blocks 301b, and each first electrical insulating block 301b covers all corresponding The pad regions 50i, 50j, 50k, and 50l are disposed between the second conductive lines 401b and the first conductive lines 201b on a peripheral region other than a configuration region to isolate the first patterned conductive layer 20b and the first conductive layer 20b on the peripheral region. Electrical contact between the two patterned conductive layers 40b.

As shown in FIGS. 7 , 8B and 8C, among the four pad regions 50i, 50j, 50k, and 50l, the first pad region 50i is formed on the first patterned conductive layer 20b and is connected to the first conductive line 201b. The extension portion 202b or the intersection directly connected to the first wire 201b (in the absence of the extension portion 202b), the second pad region 50j, the third pad region 50k and the fourth pad region 50l are all configured in the second pattern Parts of the extending portions 402b disposed on the first surface 101 of the substrate 10 are respectively connected to the three adjacent second conductive lines 401b on the conductive layer 40b.

Please continue to refer to FIG. 7 , in one embodiment, the light emitting display device 1b further has a second patterned electrical insulating layer 60b, and has a plurality of second electrical insulating blocks 601b, and the second electrical insulating blocks 601b are along the The first arrangement direction of the pad regions 50i, 50j, 50k, 50l, such as the horizontal direction, is arranged on the first surface 101 of the substrate 10 to isolate the pad regions 50i, 50j, 50k, 50l from the pad regions 50i, The second arrangement direction of 50j, 50k, 50l is, for example, the electrical contact in the vertical direction. The second patterned electrical insulating layer 60b and the first patterned electrical insulating layer 30b may be formed in the same process. In another embodiment, the light-emitting display device 1b further has a third patterned electrical insulating layer 70b, and has a plurality of third electrical insulating blocks 701b, and the third electrical insulating blocks 701b are along the pad regions 50i, 701b, respectively. The second arrangement direction of 50j, 50k, 50l, for example, the vertical direction, is arranged above the second wire 401b connected to the third pad region 50k to isolate the pad regions 50i, 50j, 50k, 50l in the first arrangement direction For example, electrical contacts in the horizontal direction. The third patterned electrical insulating layer 70b can also be formed in the same process as the first patterned electrical insulating layer 30b, so that the third electrical insulating block 701b is disposed on the second wire connected to the third pad region 50k below 401b. The above-mentioned second arrangement direction and the first arrangement direction cross each other, for example, are perpendicular to each other. In the embodiment, the first arrangement direction is, for example, parallel to the arrangement direction of the second wires 401b (horizontal direction shown in FIG. 7 ), and the second arrangement direction is, for example, perpendicular to the arrangement direction of the second wires 401b.

Please continue to refer to FIG. 8A to FIG. 8C. In one embodiment, the light-emitting display device 1b further includes a patterned conductive metal seed layer 200b formed on the first surface 101 of the substrate 10, and has a The same pattern is used as the formation preparation layer of the first patterned conductive layer 20b. In this case, the first wire 201b is disposed on the patterned conductive metal seed layer 200b.

FIG. 9A is a block flow diagram illustrating steps of an embodiment of a method of manufacturing the light-emitting display device of FIG. 7 . Referring to FIG. 9A , in one embodiment, the manufacturing method of the light-emitting display device of FIG. 7 includes the following steps:

Step 51: Provide a substrate. As shown in FIGS. 8A to 8C, a substrate 10 is provided.

Step 52: Form a patterned conductive metal seed layer on the substrate by one of the processes of sputtering, screen printing and jet printing. As shown in FIGS. 8A to 8C , a patterned conductive metal seed layer 200 b is formed on the first surface 101 of the substrate 10 .

Step 53 : Use one of sputtering, etching, electroless plating and electroplating to integrally form a first patterned conductive layer including a first wire and an extension of the first wire on the patterned conductive metal seed layer. As shown in FIG. 7 to FIG. 8C , a first patterned conductive layer 20b including a first wire 201b and an extension 202b of the first wire 201b is formed on the patterned conductive metal seed layer 200b, the first patterned conductive layer 20b and the pattern The pattern of the conductive metal seed layer 200b is the same. By forming the patterned conductive metal seed layer 200b, the formed first patterned conductive layer 20b can be firmly attached to the substrate 10.

Step 54: Use one of screen printing and jet printing to form a first patterned electrical insulating layer including a first electrical insulating block over the first patterned conductive layer, and make a part of the substrate free The first patterned electrical insulating layer is exposed. As shown in FIGS. 7 to 8C , a first patterned electrical insulating layer 30b including a first electrical insulating block 301b is formed above the first patterned conductive layer 20b, and the first patterned electrical insulating layer 30b is exposed A partial area of the substrate 10 is removed.

Step 55: Form a second patterned conductive layer including the second wire and the extension of the second wire by one of screen printing and jet printing, so that the second wire is formed on the first patterned electrical insulating layer , and a part of the extension portion of the second wire is formed on the substrate. As shown in FIGS. 7 to 8C , the second patterned conductive layer 40 includes a second wire 401b and an extension 402b of the second wire 401b. The second wire 401b is formed on the first patterned electrical insulating layer 30b, and the second wire 401b is formed on the first patterned electrical insulating layer 30b. The extending portions 402 b of the two wires 401 b are formed on the first surface 101 of the substrate 10 .

Step 56 : Disposing a part of the extension part of the first wire and a part of the extension part of the second wire respectively as a pad area of the pin of the light emitting element. Alternatively, a part of the first wire and a part of the extension part of the second wire are respectively configured as pad areas of the pins of the light-emitting element. As shown in FIG. 7 , FIG. 8B and FIG. 8C , a part of the extension part 202b of the first wire 201b is configured as the pad area 50i of the pin of the light-emitting element, and the extension of the three adjacent second wires 401b is respectively configured A part of the portion 402b is configured as the pad regions 50j, 50k, 50l of the three pins of the light-emitting element. In the process of screen printing, the extension portion 202b of the first wire 201b and the bonding pad region 50i are integrated, and the extension portions 402b of the three adjacent second wires 401b are formed integrally with the bonding pad regions 50j, 50k, 50l respectively. .

FIG. 9B is a block flow diagram showing the steps of another embodiment of the manufacturing method of the light-emitting display device of FIG. 7 . Referring to FIG. 9B , in another embodiment, the first patterned conductive layer of the light-emitting display device of FIG. 7 can be formed without one of the processes of sputtering, etching and electroplating, thus eliminating the need for the formation of the patterned conductive metal seed layer step. The manufacturing method of FIG. 9B includes the following steps:

Step 61: Provide a substrate. As shown in FIGS. 8A to 8C, a substrate 10 is provided.

Step 62 : Use one of screen printing and jet printing to integrally form a first patterned conductive layer including a first wire and an extension of the first wire on the substrate. As shown in FIG. 7 to FIG. 8C , a first patterned conductive layer 20 b including a first wire 201 b and an extension 202 b of the first wire 201 b is formed on the first surface 101 of the substrate 10 .

Step 63: Use one of screen printing and jet printing to form a first patterned electrical insulating layer including a first electrical insulating block on the first patterned conductive layer, and make a part of the substrate free The first patterned electrical insulating layer is exposed. As shown in FIGS. 7 to 8C , a first patterned electrical insulating layer 30b including a first electrical insulating block 301b is formed above the first patterned conductive layer 20b, and the first patterned electrical insulating layer 30b is exposed A partial area of the substrate 10 is removed.

Step 64: Form a second patterned conductive layer including the second wire and the extension of the second wire by one of screen printing and jet printing, so that the second wire is formed on the first patterned electrical insulating layer , and the extension portion of the second wire is formed on the substrate. As shown in FIGS. 7 to 8C , the second patterned conductive layer 40 includes a second wire 401b and an extension 402b of the second wire 401b. The second wire 401b is formed on the first patterned electrical insulating layer 30b, and the second wire 401b is formed on the first patterned electrical insulating layer 30b. The extending portions 402 b of the two wires 401 b are formed on the first surface 101 of the substrate 10 .

Step 65 : Disposing a part of the extension part of the first wire and a part of the extension part of the second wire respectively as a bonding pad area of the pin of the light emitting element. Alternatively, a part of the first wire and a part of the extension part of the second wire are respectively configured as pad areas of the pins of the light-emitting element. As shown in FIG. 7 , FIG. 8B and FIG. 8C , a part of the extension part 202b of the first wire 201b is configured as the pad area 50i of the pin of the light-emitting element, and the extension of the three adjacent second wires 401b is respectively configured A part of the portion 402b is configured as the pad regions 50j, 50k, 50l of the three pins of the light-emitting element. In the process of screen printing, the extension portion 202b of the first wire 201b and the bonding pad region 50i are integrated, and the extension portions 402b of the three adjacent second wires 401b are formed integrally with the bonding pad regions 50j, 50k, 50l respectively. .

FIG. 10 is a schematic cross-sectional view showing an electrical insulating layer in the form of a multi-layer stack of a light-emitting display device according to an embodiment of the present invention. In the foregoing embodiments, the first electrical insulating block 301 or 301 a or 301 b of the first patterned electrical insulating layer 30 or 30 a or 30 b may be formed by stacking a plurality of electrical insulating layers 302 to 306 with the sides of the Step-like, thereby increasing the flexibility of the first electrical insulating block 301 or 301a or 301b. On the other hand, FIG. 11 is a schematic plan view showing a honeycomb-shaped grid wire of a light-emitting display device according to an embodiment of the present invention. In the foregoing embodiments, the mesh shape of the mesh-shaped first patterned conductive layer 20a or 20b may be a hexagonal shape such as a honeycomb shape, so as to improve the conduction efficiency of the first wire 201d.

To sum up, according to the light-emitting display device and the manufacturing method thereof described in the various embodiments of the present invention, the connection wires corresponding to the pad regions of the pins of the light-emitting element are arranged in layers, so that the power supply connection wires in the pad regions and The signal connection wires in the pad area do not share the same plane configuration space, which is beneficial to increase the plane configuration space of the power source connection wires and improve the conductivity of the power source connection wires. In addition, a power connection wire can be subdivided into a plurality of equivalent wires with smaller line widths in the enlarged plane configuration space, so as to improve the transparency of the display screen. In addition, the light-emitting element can also use micro-miniature light-emitting diode chips to reduce the visibility of the light-emitting element itself in the display screen. In this way, when the substrate carrying the light-emitting element is transparent, the visibility of the wires and the light-emitting element on the substrate in the display screen can be greatly reduced, thereby improving the contrast and efficiency of the light-emitting display viewed from a certain distance. clarity. On the other hand, since the first patterned conductive layer and the second patterned conductive layer electrically connected to the light-emitting element can be fabricated by a printing process such as screen printing and jet printing, the near-infrared light irradiation can be further utilized to rapidly Curing the printed or jet-printed conductive layer to shorten process time and facilitate process procedures. In addition, the materials of the first patterned conductive layer and the second patterned conductive layer can be selected according to different processes, and have flexibility in process design. For example, the material of the first wire of the first patterned conductive layer and the extension of the first wire can be a paste doped with conductive powder, and a material that can be electroless plating can be further added, which can be indium tin oxide (Indium Tin Oxide) with high transparency ( ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film, or aluminum zinc oxide (AZO) film, and may also be copper, silver, nickel, or nickel-gold. Similarly, the material of the second wire, the extension part of the second wire and the island part of the second patterned conductive layer can be a paste mixed with conductive powder and can be further added with a material that can be chemically plated, which can be highly transparent. An indium tin oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film, or an aluminum oxide zinc (AZO) film, may also be copper, silver, nickel, or nickel-gold. In the present invention, the material of the first patterned conductive layer or the second conductive layer is not limited to the above-mentioned materials, and any conductive materials such as graphene and carbon nanotubes can also be used.

The above description should be understood and implemented by those skilled in the art to which the present invention pertains. Some embodiments of the present invention are disclosed above, but they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. In other words, other equivalent embodiments completed without departing from the spirit disclosed in the present invention shall be included in the present invention, and the protection scope of the present invention shall be defined by the appended claims.

1, 1a, 1b: light-emitting display device 10: Substrate 101: First Surface 102: Second Surface 20, 20a, 20b: the first patterned conductive layer 200, 200a, 200b: Patterned conductive metal seed layer 201, 201a, 201b, 201c, 201d: the first wire 202, 202b: the extension of the first wire 30, 30a, 30b: the first patterned electrical insulating layer 301, 301a, 301b: the first electrical insulating block 302~306: Electrical insulating layer 40, 40a, 40b: the second patterned conductive layer 401, 401a, 401b: the second wire 4011: Part of the second wire 4012: Another part of the second wire 402, 402a, 402b: the extension of the second wire 403a: Island Ministry 50a, 50e, 50i: first pad area 50b, 50f, 50j: the second pad area 50c, 50g, 50k: The third pad area 50d, 50h, 50l: Fourth pad area 60, 60a, 60b: the second patterned electrical insulating layer 601, 601a, 601b: the second electrically insulating block 70, 70a, 70b: the third patterned electrical insulating layer 701, 701a, 701b: the third electrical insulating block 80: Electrical connection material 100: Illuminated Pieces 11~16: Steps 21~25: Steps 31~36: Steps 41~45: Steps 51~56: Steps 61~65: Steps

FIG. 1 is a schematic plan view showing the arrangement relationship of wires and bonding pads of a light-emitting display device according to a first embodiment of the present invention.

FIG. 2A is a schematic cross-sectional view showing the A-A section of the light-emitting display device of FIG. 1 .

FIG. 2B is a schematic cross-sectional view showing the B-B section of the light-emitting display device of FIG. 1 .

FIG. 2C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 1 .

FIG. 3A is a block flow diagram showing the steps of an embodiment of the manufacturing method of the light-emitting display device of FIG. 1 .

FIG. 3B is a block flow diagram showing the steps of another embodiment of the manufacturing method of the light-emitting display device of FIG. 1 .

FIG. 4 is a schematic plan view showing the arrangement relationship of wires and bonding pads of a light-emitting display device according to a second embodiment of the present invention.

FIG. 5A is a schematic cross-sectional view showing the A-A section of the light-emitting display device of FIG. 4 .

FIG. 5B is a schematic cross-sectional view showing the B-B cross-section of the light-emitting display device of FIG. 4 .

FIG. 5C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 4 .

FIG. 6A is a block flow diagram showing the steps of an embodiment of the manufacturing method of the light-emitting display device of FIG. 4 .

FIG. 6B is a block flow diagram showing the steps of another embodiment of the manufacturing method of the light-emitting display device of FIG. 4 .

FIG. 7 is a schematic plan view showing the arrangement relationship of wires and bonding pads of a light-emitting display device according to a third embodiment of the present invention.

FIG. 8A is a schematic cross-sectional view showing the A-A section of the light-emitting display device of FIG. 7 .

FIG. 8B is a schematic cross-sectional view showing the B-B cross-section of the light-emitting display device of FIG. 7 .

FIG. 8C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG. 7 .

FIG. 9A is a block flow diagram showing the steps of an embodiment of the manufacturing method of the light-emitting display device of FIG. 7 .

FIG. 9B is a block flow diagram showing the steps of another embodiment of the manufacturing method of the light-emitting display device of FIG. 7 .

FIG. 10 is a schematic cross-sectional view showing an electrical insulating layer in the form of a multi-layer stack of a light-emitting display device according to an embodiment of the present invention.

FIG. 11 is a schematic plan view showing a honeycomb-shaped grid wire of a light-emitting display device according to an embodiment of the present invention.

1a: Light-emitting display device

10: Substrate

20a: the first patterned conductive layer

201a: First wire

30a: the first patterned electrical insulating layer

301a: first electrically insulating block

40a: the second patterned conductive layer

401a: Second wire

402a: the extension of the second wire

403a: Island Ministry

50e: First pad area

50f: Second pad area

50g: The third pad area

50h: Fourth pad area

60a: the second patterned electrical insulating layer

601a: Second electrically insulating block

70a: the third patterned electrical insulating layer

701a: Third Electrically Insulating Block

Claims (20)

A light-emitting display device, comprising: A plurality of light-emitting elements are arranged in an array, and the minimum distance between them is 2 to 3 mm; a substrate having a first surface and a second surface opposite to the first surface, the light-emitting elements are carried on the same side of the first surface of the substrate; a first patterned conductive layer having a plurality of first wires parallel to each other in linear form, the first wires are disposed on the first surface of the substrate; a second patterned conductive layer, disposed above the first patterned conductive layer, has a plurality of second wires parallel to each other in the shape of a line and a line-shaped extension portion connected from each of the second wires, The arrangement direction of the second wires intersects with the arrangement direction of the first wires; At least four pad areas separated from each other are respectively electrically connected to four different pins of one of the light-emitting elements, a first pad area of the pad areas is electrically connected to the first wires, A second bonding pad region, a third bonding pad region and a fourth bonding pad region of the bonding pad regions are all disposed on the second patterned conductive layer and are respectively connected to the three second conductive lines adjacent to each other is connected to the extension; and A first patterned electrical insulating layer, disposed between the first patterned wire layer and the second patterned conductive layer, has a plurality of first electrical insulating blocks for isolating the first patterned conductive layer electrical contact with the second patterned conductive layer. The light-emitting display device of claim 1, wherein the first patterned conductive layer further has a linear extension portion connected from each of the first wires, and the extension portion of the first wires is disposed on the surface of the substrate. on the first surface; a part of each of the second wires is arranged above the first surface of the substrate, and another part of each of the second wires is arranged above the first wire and spans at least one of the a first wire, the extension portion of each of the second wires is disposed above the first surface of the substrate; the first pad area is disposed on the first patterned conductive layer and is among the first wires One of the extension parts is connected; and the first electrical insulating blocks are respectively arranged between the parts of the second wires that span the first wires and the first wires to isolate the first wires electrical contact between the second wires and the first wires. The light-emitting display device of claim 1, wherein the second patterned conductive layer further has an island portion connected from the intersection of at least two of the first wires, and each of the second wires spans a plurality of the first wires and disposed above the first wires, the extension portion of each of the second wires is disposed above the first wires; the first pad area is disposed on the second patterned conductive layer and is connected with the island connection; and each of the first electrical insulating blocks covers a configuration area corresponding to all the pad regions, and is configured on the first wires, the second wires and the second wires Between the extension parts, the electrical contact between the first patterned conductive layer and the second patterned conductive layer on the configuration area is isolated. The light-emitting display device of claim 1, wherein the first patterned conductive layer further has linear extension portions of the first wires, and the extension portions of the first wires are disposed on the first surface of the substrate each of the second wires is arranged above the first wires across a plurality of the first wires, and a part of the extension of each of the second wires is arranged on the first surface of the substrate above; the first pad area is disposed on the first patterned conductive layer and is connected to the extension of the first wires; and each of the first electrical insulating blocks covers correspondingly all the pads A peripheral area outside a configuration area of the region is arranged between the second wires and the first wires to isolate the first patterned conductive layer and the second patterned conductive layer on the configuration area. electrical contact between them. The light-emitting display device of claim 1, wherein the line width of each of the first wires is 25 μm to 2 mm and the line width of each of the second wires is 25 μm to 100 μm. The light-emitting display device of claim 1, wherein the first wires are interwoven into a polygonal mesh. The light-emitting display device of claim 1, further comprising: a second patterned electrical insulating layer having a plurality of second electrical insulating blocks, the second electrical insulating blocks are respectively arranged on the first arrangement direction of the bonding pad regions on the first arrangement direction of the substrate On a surface, the pads are used for isolating electrical contacts in a second arrangement direction of the pad regions, and the second arrangement direction and the first arrangement direction intersect each other. The light-emitting display device of claim 7, further comprising: a third patterned electrical insulating layer having a plurality of third electrical insulating blocks, the third electrical insulating blocks are respectively arranged along the second arrangement direction of the pad regions to connect the third solder pads The upper part of the second wire in the pad area is used for isolating the electrical contact of the pad areas in the first arrangement direction. The light-emitting display device of claim 1, further comprising: A patterned conductive metal seed layer is formed on the first surface of the substrate and has the same pattern as that of the first patterned conductive layer, and is used as a preparation layer for the formation of the first patterned conductive layer. The light-emitting display device according to any one of claims 1 to 9, wherein the light-emitting elements are light-emitting diode chips. A method of manufacturing a light-emitting display device, comprising: providing a substrate; forming a first patterned conductive layer including a plurality of first wires on the substrate; forming a first patterned electrical insulating layer including a plurality of first electrical insulating blocks on the first patterned conductive layer by one of screen printing and jet printing; forming a second patterned conductive layer including a plurality of second wires and extensions connected from the second wires on the first patterned electrical insulating layer by using one of screen printing and jet printing processes; and A part of the extending portion of the second wires is respectively configured as a bonding pad area of at least three pins of a light emitting element. The manufacturing method of the light-emitting display device of claim 11, further comprising: When forming the first patterned conductive layer, the extension portions of the first wires are integrally formed; and A part of the extension part of the first wires is configured as a bonding pad area of another pin of the light-emitting element. The manufacturing method of the light-emitting display device of claim 12, further comprising: forming a patterned conductive metal seed layer on the substrate by one of sputtering, screen printing and jet printing; and The first patterned conductive layer is formed on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating. The method for manufacturing a light-emitting display device according to claim 12, wherein the first patterned conductive layer is formed by one of screen printing and jet printing. The manufacturing method of the light-emitting display device of claim 11, further comprising: When forming the first patterned electrical insulating layer, part of the first wires are exposed from the first electrical insulating blocks; When the second patterned conductive layer is formed, an island portion connected to the intersection of the first conductive lines exposed from the first electrical insulating blocks is integrally formed; and A part of the island portion is respectively configured as a bonding pad area of another pin of the light-emitting element. The manufacturing method of the light-emitting display device of claim 15, further comprising: forming a patterned conductive metal seed layer on the substrate by one of sputtering, screen printing and jet printing; and The first patterned conductive layer is formed on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating. The method for manufacturing a light-emitting display device according to claim 15, wherein the first patterned conductive layer is formed by one of screen printing and jet printing. The manufacturing method of the light-emitting display device of claim 11, further comprising: When forming the first patterned conductive layer, the extension parts of the first wires are integrally formed; exposing a part of the substrate from the first patterned electrical insulating layer; When forming the second patterned conductive layer, the second wires are formed on the first patterned electrical insulating layer, and the extension of the second wires is configured to be at least three parts of the light-emitting element. the portion of the pad area of the pin is formed over the substrate; and A part of the extension part of the first wires is configured as a bonding pad area of another pin of the light-emitting element. The manufacturing method of the light-emitting display device as claimed in claim 18, further comprising: forming a patterned conductive metal seed layer on the substrate by one of sputtering, screen printing and jet printing; and The first patterned conductive layer is formed on the patterned conductive metal seed layer by one of the processes of sputtering, etching, electroless plating and electroplating. The method for manufacturing a light-emitting display device according to claim 18, wherein the first patterned conductive layer is formed by one of screen printing and jet printing.

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