TW202217317A - Electronic component detecting mechanism and operating apparatus using the same - Google Patents

Abstract

The present invention reveals an electronic component detecting mechanism, having an image capturing device and an optical element. The image capturing device has an image capturing element and a light source positioned in front of the image capturing element. The optical element is positioned in front of the image capturing device for reflecting the light of the light source partially to a first electronic component and partially to a second electronic component by a first reflecting surface and a second reflecting surface thereof. The images of the first electronic component and the second electronic component are reflected to the image capturing element simultaneously by the first reflecting surface and the second reflecting surface. Therefore, the components are arranged compactly, and the images are processed speedy.

Description

Electronic device inspection mechanism and operating equipment for its application

The present invention provides a detection mechanism that facilitates rapid comparison of images of two electronic devices, effectively reduces detection components, and facilitates the spatial arrangement of equipment.

At present, for the bonding operation of two electronic devices (such as chips and flexible circuit boards), or the testing operation of two electronic devices (such as electronic components and testers), the operation equipment uses a conveying device to transfer one electronic device relative to another electronic device. , Since the alignment accuracy of the two electronic devices is related to the operation quality, the operator uses the detection mechanism to take images of the two electronic devices for comparison, so as to obtain the position difference value, and then compensate and adjust the working position of the two electronic devices.

Taking the testing equipment as an example, the machine 11 is equipped with an electronic device of the tester 12, and the transferer 13 is equipped with an electronic device of the electronic component 14. Since the tester 12 has a plurality of probes 121, the electronic component 14 There are a plurality of contacts 141, so that the plurality of contacts 141 of the electronic component 14 can be accurately aligned with the plurality of probes 121 of the tester 12; the detection mechanism (not shown) of the current test equipment uses an image finder The tester 12 is captured first, then the electronic components 14 are captured, or the tester 12 and the electronic components 14 are captured individually by a dual imager. Both of the above-mentioned two imaging methods will transmit the electronic components and tester images to the central control. The device (not shown in the figure) is used for analysis and comparison to adjust the placement position of the electronic components 14 for accurate alignment of the tester 12 .

However, when the detection mechanism uses an image finder to perform the image acquisition operation sequence of the electronic component 14 and the image acquisition operation sequence of the tester 12 twice, the detection operation is cumbersome and time-consuming, and the test capacity cannot be improved; or when the detection mechanism is used. Using the dual imager to execute the image capturing operation sequence of the electronic component 14 and the image capturing operation sequence of the tester 12 individually, the inspection mechanism increases the cost of inspection components and increases the volume, which is disadvantageous for equipment space configuration.

The first objective of the present invention is to provide an electronic device detection mechanism, which includes an imager and an optical device. The imager is provided with a light source in front of an imager, and the optical device is arranged in front of the imager, and uses a first reflection The surface and the second reflection surface are opposite to the same image pickup element, whereby the first reflection surface reflects the first illumination beam of the light source to the first electronic device, and reflects the first image beam of the first electronic device to the image pickup element, and the second reflection At the same time, the second illuminating beam of the light source is reflected to the second electronic device, and the second image beam of the second electronic device is reflected to the imaging element, so that the same imaging element can capture the images of the first electronic device and the second electronic device. It is conducive to rapid comparison, so as to shorten the detection operation time, thereby effectively improving the detection efficiency.

The second object of the present invention is to provide an electronic device detection mechanism, wherein an optical device is arranged in front of an imager, and the optical device uses a first reflection surface and a second reflection surface to detect the first image beam of the first electronic device and the second image beam and the second reflection surface. The second image beam of the electronic device is reflected to the same imager for rapid comparison, so as to effectively reduce the detection components, thereby saving costs and facilitating the space configuration of the equipment.

The third object of the present invention is to provide an operation equipment, including a machine, a feeding device, a working device, an electronic device detection mechanism of the present invention, and a central control device. The feeding device is arranged on the machine, and is provided with at least one feeding a setting device to hold at least one first electronic device; the working device is arranged on the machine table, and is provided with at least one second electronic device for bonding the first electronic device; the electronic device detection mechanism of the present invention includes an imager and a The optical device is used for an imager to simultaneously take images of the first electronic device and the second electronic device for comparison; the central control device is used to control and integrate the actions of each device and mechanism, so as to perform automatic operations and achieve the practicality of improving operational efficiency. benefit.

In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:

Please refer to FIG. 2 , the electronic device detection mechanism 20 of the present invention includes an imager 21 and an optical device 22 , and further, the detection mechanism 20 is provided with a driver 23 to drive the imager 21 and the optical device 22 to synchronize at least one direction displacement.

The image pickup device 21 includes an image pickup element 211 and a light source 212. The image pickup element 211 can be an image sensor or a photosensitive coupling element (CCD) for taking images of the first electronic device and the second electronic device. In this embodiment, The image pickup element 211 is a CCD, which defines an image pickup axis A in a first direction (such as the X direction), and the image pickup element 211 receives a first electronic device (not shown in the figure) and a second electronic device (not shown in the figure). output), and transmit it to the central control device (not shown in the figure) for discriminant analysis and comparison.

The light source 212 is disposed in front of the image pickup element 211 to provide the first illumination beam and the second illumination beam. Further, the light source 212 can be an LED or an optical fiber. In this embodiment, the light source 212 is equipped with a plurality of optical fibers in a lamp holder, And according to the preset optical path, the first illuminating beam and the second illuminating beam are projected to the optical device 22 located in front of the image capturing element 211 .

The optical device 22 is disposed in front of the image pickup device 21, and is provided with a first reflection surface 221 and a second reflection surface 222. The first reflection surface 221 and the second reflection surface 222 are opposite to the same image pickup element 211; A reflective surface 221 and a second reflective surface 222 can be arranged adjacent to each other or located on different objects. The optical tool 22 defines an optical axis B between the first reflective surface 221 and the second reflective surface 222. The first reflective surface 221, the second reflective surface 222 The first included angle Θ1 and the second included angle Θ2 between the two reflective surfaces 222 and the optical axis B can be the same or different depending on operational requirements; for example, the first included angle Θ1 and the second included angle between the first reflective surface 221 and the optical axis B are The angle of the second included angle Θ2 between 222 and the optical axis B is the same, and the first image beam and the second image light beam of the same proportion are reflected; for example, the first included angle Θ1 and the second reflection between the first reflective surface 221 and the optical axis B The angle of the second included angle Θ2 between the surface 222 and the optical axis B is different, and reflects the first image beam and the second image beam amplified in equal proportions.

In this embodiment, the first reflection surface 221 and the second reflection surface 222 of the optical tool 22 are arranged adjacent to each other, and the first included angle Θ1 between the first reflection surface 221 and the optical axis B and the second reflection surface 222 and the optical axis The angle of the second included angle Θ2 between B is the same, and the first image beam and the second image beam are reflected in the same proportion. When the reflecting surface 221 is opposite to the first electronic device and the second reflecting surface 222 is opposite to the second electronic device, the first illuminating beam of the light source 212 is reflected to the first electronic device by the first reflecting surface 221, and the first electrons are reflected The first image beam of the device is sent to the image pickup element 211, and the second reflection surface 222 simultaneously reflects the second illumination beam of the light source 212 to the second electronic device, and reflects the second image beam of the second electronic device to the image pickup element 211. The image capturing element 211 simultaneously captures images of the first electronic device and the second electronic device for rapid comparison.

Please refer to FIG. 3, the electronic devices can be electronic components (such as chips, flexible circuit boards), operators (such as testers, printers), etc. according to the operation requirements. , the joint referred to in this case refers to two electronic devices (such as the contacts of electronic components and the probes of testers ) as a detachable mutual contact, or two electronic devices (such as a chip and a flexible circuit board) as a fixed type of mutual connection, are not limited to this embodiment.

In this embodiment, the electronic device detection mechanism 20 of the present invention is applied to a test device. The test device is equipped with a first electronic device as a tester on the machine. The tester is provided with a circuit board 31 and a test seat 32 that are electrically connected. The test seat 32 is provided with a plurality of probes 33 for supporting and testing electronic components, and a conveying device is provided with a feeder 34 for transferring a second electronic device, which is an electronic component 35, to be displaced above the test seat 32 , the electronic component 35 has a plurality of contacts 351 for a plurality of probes 33 of a detachable electrical contact test seat 32; the driver 23 of the detection mechanism 20 drives the imager 21 and the optical tool 22 to synchronize to the test Between the seat 32 and the electronic component 35, the first reflective surface 221 of the optical tool 22 is opposite to the image pickup element 211 and the test seat 32, and is located in the first optical path of the light source 212, and the second reflective surface of the optical tool 22 is located 222 is opposite to the image pickup element 211 and the electronic element 35 , and is located in the second optical path of the light source 212 .

Please refer to FIGS. 3 and 4 , the image finder 21 of the electronic device detection mechanism 20 uses the light source 212 to project the first illumination beam 213 and the second illumination beam 214 forward according to the first optical path and the second optical path. The first reflecting surface 221 and the second reflecting surface 222 of 22 are located in front of the light source 212, so that the first illumination beam 213 of the light source 212 is incident on the first reflecting surface 221 of the optical tool 22, and simultaneously , the second illumination beam 214 of the light source 212 is incident on the second reflecting surface 222 of the optical device 22 .

The first reflective surface 221 of the optical device 22 receives the first illumination beam 213 of the light source 212. Since the first reflective surface 221 is also opposite to the test seat 32, the first reflective surface 221 totally reflects the first illumination beam 213 to the test seat 32. After receiving the incident first illumination beam 213, the test seat 32 reflects a first image beam, which is the image beam 321 of the test seat, to the first reflection surface 221 of the optical tool 22, and the first reflection surface 221 receives the incident test. The image beam 321 of the test seat is totally reflected to the image capturing element 211 of the imager 21; at the same time, the second reflection surface 222 of the optical device 22 receives the second illumination beam 214 of the light source 212, because the second The reflective surface 222 is also opposite to the electronic component 35, so that the second reflective surface 222 totally reflects the second illumination beam 214 to the electronic component 35. After the electronic component 35 receives the incident second illumination beam 214, the second illuminating beam 214 is reflected as an electronic component. The second image beam of the image beam 352 is sent to the second reflection surface 222 of the optical device 22 . The second reflection surface 222 receives the incident electronic component image beam 352 and totally reflects the electronic component image beam 352 to the same image finder 21 . The image pickup element 211; therefore, the present invention utilizes the configuration design of an image pickup device 21 and an optical device 22, so that an image pickup device 21 can receive the image pickup test seat image beam 321 and the electronic component image beam 352 at one time, so as to quickly The test seat image beam 321 and the electronic component image beam 352 are transmitted to the central control device (not shown in the figure) for a comparative analysis, thereby improving the detection efficiency. However, the present invention only configures an imager 21 with an optical device 22, which can effectively reduce the volume and detect components, not only reduce the Z-direction displacement travel of the electronic components carried by the feeder and improve the feeding performance, but also facilitate the Equipment space configuration and cost savings.

Please refer to FIGS. 2 and 5 , the electronic device detection mechanism 20 of the present invention is applied to operation equipment, and the operation equipment includes a machine 40 , a feeding device 50 , an operation device, the electronic device detection mechanism 20 of the present invention and a central control device (not shown in the figure). shown), the operation equipment further includes a conveying device 60 for transferring the first electronic device. In this embodiment, the operation equipment is a hot pressing operation equipment. The feeding device 50 is arranged on the machine table 40 , and is provided with at least one feed holder 51 to hold at least one first electronic device. In this embodiment, the feed holder 51 supports the frame module 71 and the frame module 71 supports At least one is the first electronic device of the chip 72 . The conveying device 60 is disposed on the machine table 40 and is provided with at least one feeder for transferring the first electronic device. In this embodiment, the conveying device 60 uses a frame mover 61 on the feeding holder of the feeding device 50 . 51 Take out a frame carrier module 71 with a wafer 72, and carry the frame carrier module 71 to a carrier table 62. The conveying device 60 uses a feeder 63 to take out the wafer 72 from the frame carrier module 71 of the carrier table 62, And the wafer 72 is transferred to the refueling position. The working device is disposed on the machine table 40, and is provided with at least one second electronic device for bonding the first electronic device. In this embodiment, the working device is a thermocompression bonding device 80, and the thermocompression bonding device 80 is a thermocompression bonding device. 81 Take out the wafer 72 from the feeder 63, transfer the wafer 72 to the thermocompression bonding position, and transfer at least one second electronic device, which is the flexible circuit board 73, to the thermocompression bonding position by the thermocompression carrier 82. The electronic device detection mechanism 20 of the present invention includes an imager 21 and an optical device 22. The first reflection surface 221 and the second reflection surface 222 of the optical device 22 are opposite to the same imager 21 to simultaneously capture the first electronic device. and the second electronic device; in this embodiment, the detection mechanism 20 drives the imager 21 and the optical tool 22 to displace synchronously between the chip 72 and the flexible circuit board 73 by the driver 23, so as to simultaneously capture the image of the chip 72 and the flexible circuit board 73, and transmit the image data to the central control device for discriminating analysis. The central control device quickly controls the thermocompression bonder 81 to adjust and correct the placement position and angle of the wafer 72; then the thermocompression bonder 81 moves the wafer in the Z direction. 72 is fixed on the flexible circuit board 73 by hot pressing. After the hot pressing operation is completed, the hot-pressing feeder 82 outputs a flexible circuit board 73 with the chip 72 bonded thereto. The central control device is used to control and integrate the actions of various devices and mechanisms to perform automated operations and achieve practical benefits of improving operational efficiency.

[acquaintance] 11: Machine 12: Tester 121: Probe 13: Feeder 14: Electronic Components 141: Contact [this invention] 20: Prosecutors 21: Imagefinder 211: Image acquisition 212: light source 213: First Lighting Beam 214: Second Illumination Beam A: take the image axis 22: Optics 221: The first reflecting surface 222: Second reflective surface B: Optical axis Θ1: The first included angle Θ2: Second included angle 23: Drive 31: circuit board 32: Test seat 321: Test seat image beam 33: Probe 34: Feeder 35: Electronic Components 351: Contact 352: Electronic Components Image Beam 40: Machine 50: Feeding device 51: Feed holder 60: Conveyor 61: Frame shifter 62: Bearing platform 63: Feeder 71: Carrier frame module 72: Wafer 73: Flexible circuit board 80: Hot pressing device 81: Thermocompressor 82: Hot ballast feeder

Figure 1: Schematic diagram of the use of conventional testing equipment. Figure 2: The configuration diagram of the electronic device detection mechanism of the present invention. FIG. 3 is a configuration diagram of the electronic device detection mechanism of the present invention applied to a testing device. FIG. 4 is a schematic diagram of the use of the electronic device detection mechanism of the present invention. Fig. 5: The configuration diagram of the electronic device detection mechanism of the present invention applied to the operation equipment.

20: Prosecutors

21: Imagefinder

211: Image acquisition

212: light source

213: First Lighting Beam

214: Second Illumination Beam

22: Optics

221: The first reflecting surface

222: Second reflective surface

23: Drive

32: Test seat

321: Test seat image beam

35: Electronic Components

352: Electronic Components Image Beam

Claims (8)

An electronic device detection mechanism, comprising: Image finder: set the image capturing element and the light source, the image capturing element is used for capturing the first electronic device and the light source. A second electronic device, the light source is disposed in front of the image pickup element to provide a first illumination beam and a second illumination beam; Optical tool: It is arranged in front of the imager, and is provided with a first reflection surface and a second reflection surface, the first reflective surface and the second reflective surface are relative to the same image pickup element , the first reflective surface reflects the first illumination beam of the light source to the first electronic device, and reflects the first image beam of the first electronic device to the image pickup element, and the second reflective surface reflects the light source from the light source. The second illumination beam is reflected to the second electronic device, and the second image beam of the second electronic device is reflected to the imaging element, so that the same imaging element can image the first electronic device and the second electronic device . The electronic device detection mechanism according to claim 1, wherein the first reflection of the optical device The surface and the second reflective surface can be arranged adjacently or individually located in different objects. The electronic device detection mechanism as claimed in claim 1, wherein the optical device is reflected in the first reflection An optical axis is defined between the surface and the second reflecting surface, the first reflecting surface, the second reflecting surface The first included angle and the second included angle between the reflection surface and the optical axis may be the same or different. The electronic device detection mechanism according to any one of claims 1 to 3, wherein the optical tool is a total reflection optical element. The electronic device detection mechanism according to any one of claims 1 to 3, wherein the light source is an LED or an optical fiber. The electronic device detection mechanism according to any one of claims 1 to 3, wherein the image pickup element is an image sensor or a photosensitive coupling element (CCD). The electronic device detection mechanism according to any one of claims 1 to 3, further comprising a driver , the driver is used to drive the imager and the optical tool to move in at least one direction synchronously. An operation equipment applying an electronic device detection mechanism, comprising: Machine; Feeding device: It is arranged on the machine, and is provided with at least one feeding holder to hold the first electronic devices; Operating device: disposed on the machine, and provided with at least one second electronic device for bonding the first electronic device; At least the electronic device detection mechanism as described in claim 1: for taking images of the first electronic device device and the second electronic device; Central control device: for controlling and integrating the actions of various devices and mechanisms.

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