TW202121031A - Vacuum pasting apparatus - Google Patents
Vacuum pasting apparatus Download PDFInfo
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- TW202121031A TW202121031A TW109134586A TW109134586A TW202121031A TW 202121031 A TW202121031 A TW 202121031A TW 109134586 A TW109134586 A TW 109134586A TW 109134586 A TW109134586 A TW 109134586A TW 202121031 A TW202121031 A TW 202121031A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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Abstract
Description
本揭示係關於一種真空貼合裝置。This disclosure relates to a vacuum laminating device.
於專利文獻1中,揭示一種液晶基板之貼合裝置,其具有:上下壓板,其等分別吸附對向配置之上下基板之背面;真空腔室,其可收容該等上下壓板並調整真空壓;上壓板下降機構,其使上壓板下降至上下基板之水平方向之對位位置;水平移動機構,其為了對位而使下壓板水平移動;間隙測定機構,其測定上下基板間之間隙;及移動軸,其直接或間接支持上壓板之4個角部,且分別獨立地上下移動。該液晶基板之貼合裝置具備:上壓板傾轉調整機構,其藉由對應於間隙測定機構之測定值之移動軸之上下移動,調整上壓板之高度與傾轉位置;及加壓機構,其使上下壓板相互加壓。 [先前技術文獻] [專利文獻]Patent Document 1 discloses a liquid crystal substrate laminating device, which has: upper and lower pressing plates, which respectively adsorb the back surfaces of the upper and lower substrates arranged oppositely; a vacuum chamber, which can accommodate the upper and lower pressing plates and adjust the vacuum pressure; The upper platen lowering mechanism, which lowers the upper platen to the horizontal alignment position of the upper and lower substrates; the horizontal moving mechanism, which moves the lower platen horizontally for alignment; the gap measuring mechanism, which measures the gap between the upper and lower substrates; and A shaft, which directly or indirectly supports the 4 corners of the upper platen, and moves up and down independently. The liquid crystal substrate laminating device is equipped with: an upper platen tilt adjustment mechanism, which adjusts the height and tilt position of the upper platen by moving the moving shaft corresponding to the measured value of the gap measuring mechanism up and down; and a pressurizing mechanism, which Make the upper and lower pressure plates pressurize each other. [Prior Technical Literature] [Patent Literature]
專利文獻1:日本專利特開2003-43500號公報Patent Document 1: Japanese Patent Laid-Open No. 2003-43500
[發明所欲解決之問題][The problem to be solved by the invention]
本揭示提供一種可實現高精度之貼合位置與平行度,且實現高品質之直接貼合之真空貼合裝置。 [解決問題之技術手段]The present disclosure provides a vacuum bonding device that can achieve high-precision bonding position and parallelism, and high-quality direct bonding. [Technical means to solve the problem]
本揭示提供一種真空貼合裝置,其具備:真空腔室,其於內部將第1構件與第2構件貼合;減壓裝置,其用以將上述真空腔室內之氣壓減壓;第1載台,其將上述第1構件固定;第2載台,其將上述第2構件固定;複數根驅動軸,其等連接於上述第2載台;載台驅動部,其藉由移動上述複數根驅動軸而使上述第2載台之位置變化;及位置測定部,其設置於上述真空腔室之外部,於複數個部位測定上述第1載台與上述第2載台之間隔距離;上述載台驅動部使用:上述減壓裝置將上述真空腔室內設為真空前由上述位置測定部測定出之載台之間隔距離資訊、及設為真空後由上述位置測定部測定出之載台之間隔距離資訊,而分別獨立決定移動上述複數根驅動軸之距離。 [發明之效果]The present disclosure provides a vacuum bonding device, which includes: a vacuum chamber for bonding a first member and a second member inside; a pressure reducing device for reducing the pressure in the vacuum chamber; A stage that fixes the first member; a second stage that fixes the second member; a plurality of drive shafts connected to the second stage; a stage drive section that moves the plurality of Driving a shaft to change the position of the second stage; and a position measuring unit installed outside the vacuum chamber to measure the distance between the first stage and the second stage at a plurality of locations; the carrier Stage drive unit use: The pressure reducing device sets the vacuum chamber to the distance information of the stage measured by the position measuring unit before the vacuum, and the distance of the stage measured by the position measuring unit after the vacuum is set Distance information, and independently determine the distance to move the plural drive shafts. [Effects of Invention]
根據本揭示,於真空貼合中,可實現高精度之貼合位置與平行度,且實現高品質之直接貼合。According to the present disclosure, in vacuum bonding, high-precision bonding position and parallelism can be achieved, and high-quality direct bonding can be achieved.
(本揭示之背景) 先前,使液晶模組與觸控面板貼合之直接貼合技術中,已確立以民生用途之電子機器(例如行動電話、平板終端或汽車導航裝置)為對象之小型(例如,面板尺寸最大為15英吋左右)之貼合技術。然而,中大型(例如,面板尺寸為15英吋以上)之貼合技術仍然問題較多,可實現高精度貼合之技術尚未確立。確立較晚之中大型貼合時之問題之一是氣泡混入。尤其,愈為大型(例如,面板尺寸為32英吋等),除非能高精度控制基板等貼合對象零件之高度方向之位置,否則貼合時氣泡混入之風險愈高。(Background of this disclosure) Previously, in the direct bonding technology for bonding the liquid crystal module and the touch panel, it has been established that the small size (for example, the largest panel size is Approximately 15 inches) laminating technology. However, there are still many problems with the bonding technology of medium and large size (for example, the panel size is 15 inches or more), and the technology that can achieve high-precision bonding has not been established. One of the problems in the establishment of late-to-large-scale bonding is the mixing of air bubbles. In particular, the larger the size (for example, the panel size is 32 inches, etc.), the higher the risk of air bubbles being mixed during the bonding unless the height direction position of the bonding target parts such as the substrate can be controlled with high accuracy.
又,作為減少氣泡混入之方法,期望將配置有貼合對象零件之腔室內設為真空環境下而進行貼合。但,愈為大型之腔室,腔室之長邊方向之尺寸愈大,將腔室內減壓為真空狀態時,導致腔室本身出現變形。一般大多情況下將貼合載台直接安裝於腔室外裝,有因腔室變形而貼合載台之位置改變,導致貼合位置產生誤差,同時,貼合面之平行度被破壞之問題。In addition, as a method of reducing the mixing of air bubbles, it is desirable to perform bonding by setting the chamber in which the bonding target parts are arranged in a vacuum environment. However, the larger the chamber, the larger the size of the chamber in the longitudinal direction. When the chamber is decompressed to a vacuum state, the chamber itself will be deformed. In most cases, the laminating carrier is directly installed outside the chamber, and the position of the laminating carrier is changed due to the deformation of the chamber, which leads to errors in the laminating position, and at the same time, the parallelism of the laminating surface is destroyed.
因此,以下之實施形態中,針對可實現高精度之貼合位置與平行度,且實現高品質之直接貼合之真空貼合裝置之例進行說明。Therefore, in the following embodiments, an example of a vacuum bonding device that can achieve high-precision bonding position and parallelism and high-quality direct bonding will be described.
(實施形態1) 以下,一面適當參照圖式,一面詳細說明具體揭示本揭示之真空貼合裝置之實施形態。但,有省略過度詳細之說明之情形。例如,有省略已廣為人知之事項的詳細說明或對於實質上同一構成之重複說明之情形。這是為了避免以下之說明不必要地冗長,而易於本領域技術人員理解之故。另,隨附圖式及以下之說明係為了使本領域技術人員充分理解本揭示而提供者,未意圖藉由該等來限定申請專利範圍所記載之主題。(Embodiment 1) Hereinafter, with appropriate reference to the drawings, a detailed description will be given to specifically disclose the implementation of the vacuum laminating device of the present disclosure. However, there are cases where excessively detailed explanations are omitted. For example, there are cases where detailed explanations of widely known matters are omitted or repeated explanations of substantially the same composition. This is to prevent the following description from being unnecessarily lengthy and to make it easy for those skilled in the art to understand. In addition, the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the scope of patent application by these.
(真空貼合裝置之構成)
圖1係自實施形態1之真空貼合裝置11之正面觀察之剖視圖。實施形態1之真空貼合裝置11具有真空腔室13、減壓裝置15、第1載台17、第2載台19、驅動軸21、載台驅動部23、及位置測定部25作為主要構件。(The composition of the vacuum laminating device)
FIG. 1 is a cross-sectional view viewed from the front of the
真空腔室13於內部27使第1構件29與第2構件31貼合。實施形態1中,第1構件29為例如構成搭載於航空器內之中大型(例如32英吋) 之座位監視器之液晶模組。第2構件31為例如構成搭載於航空器內之中大型(例如32英吋)之座位監視器之觸控面板。另,第1構件29、第2構件31並非限定於上述者。In the
真空腔室13由下殼構件33與上蓋構件35構成外殼。下殼構件33係以例如藉由金屬之切出加工等將壁部設為20~30 mm左右之高剛性製作。下殼構件33於上表面具有開口部37。真空腔室13藉由以上蓋構件35封閉下殼構件33之開口部37,而將內部27密閉成氣密狀態。The
減壓裝置15藉由將真空腔室13內減壓,而可將真空腔室13內設為真空狀態。減壓裝置15包含例如真空泵。減壓裝置15將吸氣管39連接於下殼構件33,吸引真空腔室13內之空氣,並向排氣管41排氣。於吸氣管39分支有真空夾盤用配管43。真空夾盤用配管43連接於真空夾盤(省略圖示),其設置於配置在真空腔室13內之第1載台17及第2載台19之各者。真空夾盤利用減壓裝置15之負壓,分別將第1構件29吸附固定於第1載台17,將第2構件31吸附固定於第2載台19。The
第1載台17配置於下殼構件33之內側。第1載台17以與大致四方形(包含四方形。以下同樣。)之液晶模組大致相似之形狀,且大於液晶模組之大致四方形形成。第1載台17於真空夾盤之吸氣孔開口之上表面吸引固定液晶模組。於第1載台17之下表面,固定有升降軸之上端。升降軸以合計4個部位分別配置於第1載台17之四個角。升降軸藉由氣密構造貫通下殼構件33之底板,可藉由氣缸45於上下方向移動。即,固定於第1載台17之第1構件29、貼合後之第1構件29及第2構件31之貼合物藉由利用氣缸45驅動升降軸,而可相對於下殼構件33升降。另,設置於第1載台17之夾盤未必係使用真空夾盤者。若為發揮同樣效果者,則亦可使用機械夾盤等其他機構。The
第2載台19以與第1載台17大致同一形狀之大致四方形形成外形。第2載台19於真空腔室13內,與下方之第1載台17對向平行配置。第2載台19於與第1載台17對向之下表面,吸引固定第2構件31。第2載台19之上表面之四個角連接於貫通上蓋構件35之複數根(例如4根)驅動軸21之貫通前端(換言之為下端)。即,4根驅動軸21之各者對應於形成為大致四方形之第2載台19之四個角逐一連接。The
載台驅動部23藉由移動複數根驅動軸21之各者,而使第2載台19之位置變化。對1根驅動軸21設置1個載台驅動部23。因此,真空貼合裝置11中,4個載台驅動部23固定於上蓋構件35。作為該載台驅動部23,可使用使驅動軸21於軸向移動之例如線性機構或齒條齒輪機構。任一情形時,載台驅動部23皆構成為可進行藉由接收驅動軸21之位置資訊,基於該位置資訊以特定之移動量進退驅動驅動軸21的控制。該驅動軸21之進退驅動之控制係藉由例如眾所周知之反饋修正進行。The
驅動軸21之上端貫通載台驅動部23。於貫通載台驅動部23之驅動軸21之上端,固定有於與軸向大致垂直方向伸展之伸出部47之基端。伸出部47之伸出部前端於下殼構件33之側面之上方延伸。伸出部前端與驅動軸21一體升降。該伸出部前端之升降方向之移動量藉由後述之位置測定部25檢測。The upper end of the
圖2係圖1所示之真空貼合裝置11之上蓋構件35打開狀態之側剖視圖。真空腔室13藉由上蓋構件35開閉例如形成為六面體形狀之下殼構件33之開口部37。如上所述,載台驅動部23固定於該開閉之上蓋構件35之上表面。固定於上蓋構件35之上表面之載台驅動部23使驅動軸21貫通上蓋構件35。驅動軸21之貫通前端固定於第2載台19。因此,若擺動旋轉上蓋構件35而打開開口部37,則將固定於第2載台19之第2構件31配置於上表面。2 is a side cross-sectional view of the
真空貼合裝置11之上蓋構件35繞沿下殼構件33之開口部37的一邊之擺動軸旋轉自如地受支持而開閉開口部37。藉此,真空貼合裝置11藉由將上蓋構件35向打開位置擺動,而可使載台驅動部23退避,且使第2構件31朝向上方地露出配置於上下反轉之上蓋構件35之上表面。與此同時,可完全打開下殼構件33之開口部37。The
於上蓋構件35,積層配備有定位台49。定位台49可使所有載台驅動部23及驅動軸21之各者於與第2載台19平行之面方向(XY方向)移動。另,XY方向係與驅動軸21正交之面內方向。本說明書中,與該XY方向正交之方向設為Z方向。該Z方向為驅動軸21相對於真空腔室內之進退方向。The
真空貼合裝置11具備於真空腔室13之上方,於X方向或Y方向延伸之直線移動機構51。直線移動機構51由例如滾珠螺桿機構構成。直線移動機構51於沿X方向或Y方向之直線方向移動自如地支持臂單元53。於臂單元53搭載有相機55、厚度測定感測器57、塗佈機59等。相機55拍攝第1構件29、第2構件31。以下,有將第1構件29或第2構件31稱為「工件」之情形。將包含藉由相機55拍攝之圖像之攝像資訊自相機55發送至定位台49(參照圖2)。定位台49基於自相機55發送之攝像資訊,使第2載台19於XY方向移動,使第2構件31對準第1構件29(即,調整第2構件31相對於第1構件29之相對位置)。該等工件位置測定與定位台49之XY移動係藉由例如眾所周知之反饋修正進行。The
厚度測定感測器57對複數個部位之每一者測定第1構件29、第2構件31之各者之厚度。將藉由厚度測定感測器57檢測出之每個工件之厚度資訊發送至載台驅動部23(參照圖1)。載台驅動部23基於自厚度測定感測器57接收到之各個工件之厚度資訊,反饋修正驅動軸21之移動量。即,載台驅動部23可根據各個工件之厚度差異,適宜地修正各驅動軸21之移動量。The
塗佈機59具備對工件之貼合面(即,第1構件29與第2構件31之貼合面)供給接著劑61的接著劑塗佈噴嘴(省略圖式)。塗佈機59例如對固定於第1載台17之上表面之第1構件29之上表面塗佈接著劑61。一面使固定於第2載台19之第2構件31自上方平行接近塗佈有該接著劑61之第1構件29,一面進行貼合。即,將第1構件29與第2構件31直接貼合。The
此處,對液晶模組(第1構件29之一例)積層蓋玻璃或觸控面板(第2構件31之一例)之情形時,若中間存在空氣層,會因空氣層與液晶模組之玻璃的上表面之折射率之差、及觸控面板之背面與空氣層之折射率之差而引起界面反射,從而產生因液晶模組之亮度降低、反射率增加所致之外觀惡化。將於液晶模組與蓋玻璃或觸控面板之間消除空氣層而進行接著稱為直接貼合。直接貼合係藉由填充具有接近液晶模組或觸控面板之折射率之透明樹脂,而成為如光學上幾乎無界面之狀態。因此,直接貼合亦稱為光學貼合(光學接著)。直接貼合使用例如紫外線硬化型之接著劑61。Here, when a liquid crystal module (an example of the first member 29) is laminated with a cover glass or a touch panel (an example of the second member 31), if there is an air layer in between, it will be caused by the air layer and the glass of the liquid crystal module. The difference in refractive index between the upper surface of the touch panel and the difference between the refractive index of the back surface of the touch panel and the air layer cause interface reflection, resulting in the deterioration of the appearance due to the decrease in the brightness of the liquid crystal module and the increase in reflectivity. Subsequent to removing the air layer between the liquid crystal module and the cover glass or the touch panel is called direct bonding. Direct bonding is by filling a transparent resin with a refractive index close to that of a liquid crystal module or touch panel, and it becomes a state where there is almost no interface in the optics. Therefore, direct bonding is also called optical bonding (optical bonding). For direct bonding, for example, an ultraviolet
塗佈機59首先於第1構件29之上表面,塗佈作為大致四方框狀之壩體(換言之為壁)之接著劑61。該壩體於大致四方框狀之四個角部分設置有氣泡排出用之不連續部。接著,於壩體之內側塗佈貼合用接著劑61。接著劑61於壩體之內側,以所謂魚骨狀塗佈。藉由將第2構件31按壓於第1構件29,該等接著劑61及壩體逐漸平坦地延展而均勻化。藉此,將因對第1構件29按壓第2構件31而產生之氣泡最終自壩體之不連續部排出,而將工件之貼合面以無氣泡之狀態貼合。The
圖3係圖1所示之真空腔室部分之主要部分放大圖。實施形態1中,位置測定部25設置於真空腔室13之外部。位置測定部25使用例如可測定按壓量(換言之為變化量)之按壓感測器,在實施形態1中,以成為固定於各個驅動軸21之伸出部前端之正下方之方式,固定於下殼構件33之側面。位置測定部25藉由檢測件63與伸出部47接觸,而測定第1載台17與第2載台19之間隔距離。即,第1載台17與第2載台19之間隔距離係藉由驅動軸21與位置測定部25,於複數個部位予以測定。Fig. 3 is an enlarged view of the main part of the vacuum chamber shown in Fig. 1. In the first embodiment, the
載台驅動部23使用減壓裝置15將真空腔室13內設為真空前由位置測定部25測定出之載台之間隔距離資訊、及減壓裝置15將真空腔室13內設為真空後由位置測定部25測定出之載台之間隔距離資訊,分別獨立決定移動複數根驅動軸21之距離。The
即,實施形態1之真空貼合裝置11使用真空前後之間隔距離資訊(即,變化量),於減壓裝置15將真空腔室13內設為真空後,獨立移動複數根驅動軸21以使第1構件29與第2構件31之貼合面平行。That is, the
另,真空貼合裝置11亦可使用位置測定部25以外之機構,進行載台間之距離測定。例如,載台間之距離亦可藉由以雷射光之反射直接測定距離之方法,或使用由相機(省略圖示)之拍攝而得之圖像之解析處理之方法等進行。In addition, the
圖4係改變驅動軸21對第2載台19之連接位置之變化例之構成的主要部分放大圖。如圖4所示,真空貼合裝置11中,第2載台19具有用以固定第2構件31之貼合有效區域65。貼合有效區域65具有至少與第2構件31同等或其以上之大小之大致四方形之大小。圖4所示之變化例中,4個驅動軸21之各者連接於較該貼合有效區域65更外側之第2載台19。針對將4個驅動軸21連接於較貼合有效區域65更外側之第2載台19之理由,於下文敘述。FIG. 4 is an enlarged view of the main part of the configuration of a modified example in which the connection position of the
(真空貼合裝置之動作)
接著,針對利用真空貼合裝置11貼合第1構件29與第2構件31時之動作順序,參照圖5進行說明。(Action of vacuum laminating device)
Next, the operation sequence at the time of bonding the
圖5係顯示實施形態1之真空貼合裝置11之貼合動作順序之一例之流程圖。圖5所示之各個處理主要由圖1或圖2所示之真空貼合裝置11執行。Fig. 5 is a flowchart showing an example of the lamination operation sequence of the
圖5中,為了使工件即第1構件29(例如液晶模組)與第2構件31(例如觸控面板)貼合,首先進行該等工件之設置(St1)。例如,工件之設置中,於第1載台17固定液晶模組(LCD:Liquid Crystal Display,液晶顯示器),於第2載台19固定觸控面板。In FIG. 5, in order to bond the first member 29 (for example, a liquid crystal module) and the second member 31 (for example, a touch panel), which are workpieces, first, the workpieces are set (St1). For example, in the setting of the workpiece, a liquid crystal module (LCD: Liquid Crystal Display) is fixed on the
例如,藉由真空貼合裝置11之使用者(以下,簡稱為「使用者」)之操作(包含使用者設定之動作程式之操作),臂單元53移動至各個工件之上方。同樣地,藉由使用者之操作,搭載於臂單元53之厚度測定感測器57分別測定觸控面板之厚度、液晶模組之厚度(St2)。藉由使用者之操作,臂單元53移動至各個工件之上方。同樣地,藉由使用者之操作,搭載於臂單元53之相機55分別檢測觸控面板、液晶模組之位置(St3)。For example, by the operation of the user (hereinafter referred to as "user") of the vacuum laminating device 11 (including the operation of the action program set by the user), the
藉由使用者之操作,定位台49基於步驟St3中檢測出之工件之位置資訊,移動第2載台19,進行觸控面板之XY位置之對準(即,觸控面板相對於液晶模組之位置之相對位置之XY修正)(St4)。By the user’s operation, the
藉由使用者之操作,臂單元53於液晶模組之上方移動,使用接著劑塗佈噴嘴對液晶模組之貼合面供給接著劑61,於液晶模組之貼合面形成壩體(St5)。接著,臂單元53使用接著劑塗佈噴嘴,在形成於液晶模組之貼合面之壩體之內側,進而塗佈接著劑61(填充劑)。藉此,於液晶模組之貼合面,形成魚骨狀之接著劑61(St6)。By the operation of the user, the
藉由使用者之操作,上蓋構件35以擺動軸67為中心旋轉,將下殼構件33之開口部37封閉(St7)。其後,藉由使用者之操作,驅動減壓裝置15。即,減壓裝置15將空氣自真空腔室13內排氣(抽真空)。與該抽真空之同時,位置測定部25測定驅動軸21之位置變動量(換言之,位置測定部25之變化量)(St8)。By the operation of the user, the
藉由使用者之操作,真空貼合裝置11驅動載台驅動部23,使各驅動軸21向Z方向移動,開始工件之貼合(St9)。此時,載台驅動部23根據藉由步驟St2檢測出之工件之厚度資訊、及藉由步驟St8檢測出之驅動軸21之變化量資訊,修正Z方向之移動量(Z修正)。By the operation of the user, the
藉由步驟St9中經Z修正之各驅動軸21將液晶模組與觸控面板貼合後,藉由使用者之操作將釋放閥等打開,藉此將真空腔室13大氣開放(St10)。即,步驟St10中,對真空腔室13內導入大氣。其後,將第1載台17及第2載台19之各者之真空夾盤打開,解除各工件與載台之固定(St11)。After the liquid crystal module is attached to the touch panel by the Z-corrected
藉由使用者之操作,上蓋構件35以擺動軸67為中心旋轉,藉此,上蓋構件35移動至退避位置(St12)。藉此,下殼構件33之開口部37被打開(St13)。藉由使用者之操作,對載置於打開之下殼構件33之第1載台17之已貼合工件(所謂貼合物),自觸控面板側於複數個部位點照射UV光,固定已貼合工件(St14)。最後,藉由使用者之操作,厚度測定感測器57測定上述之貼合物之厚度(St15),利用真空貼合裝置11之液晶模組與觸控面板之貼合步驟結束。By the operation of the user, the
接著,詳細說明上述之真空貼合裝置11之作用。Next, the function of the above-mentioned
實施形態1之真空貼合裝置11具備:真空腔室13,其於內部27將第1構件29與第2構件31貼合;減壓裝置15,其用以將真空腔室內之氣壓減壓;第1載台17,其固定第1構件29;第2載台19,其固定第2構件31;複數根驅動軸21,其等連接於第2載台19;載台驅動部23,其藉由移動複數根驅動軸21而使第2載台19之位置變化;及位置測定部25,其設置於真空腔室13之外部,且於複數個部位測定第1載台17與第2載台19之間隔距離。載台驅動部23使用減壓裝置15將真空腔室13內設為真空前由位置測定部25測定出之載台之間隔距離資訊、及減壓裝置15將真空腔室13內設為真空後由位置測定部25測定出之載台之間隔距離資訊,分別獨立決定移動複數根驅動軸21之距離。The
真空貼合裝置11中,真空腔室13於內部27具有第1載台17與第2載台19。於第1載台17固定有第1構件29(例如液晶模組)。於第2載台19固定有第2構件31(例如觸控面板)。第1構件29及第2構件31藉由第1載台17與第2載台19以貼合面對向而配置。In the
真空腔室13藉由減壓裝置15將內部27減壓為大致真空。於真空腔室13之外部,設置有複數個(例如4個)載台驅動部23。各個載台驅動部23具有貫通真空腔室13之驅動軸21。驅動軸21被氣密密封而相對於真空腔室內進退自如。各個驅動軸21之貫通前端固定於第2載台19。例如,固定大致四方形之觸控面板之大致四方形之第2載台19之大致四方形之四個角之各者固定於驅動軸21之貫通前端。The
圖6係顯示貼合時之正常狀態之真空腔室部分之主要部分放大圖。載台驅動部23藉由使第2載台19向第1載台17接近第1構件29與第2構件31之間隔距離,而將預先塗佈有接著劑61之第1構件29與第2構件31貼合。即,載台驅動部23將驅動軸21於向真空腔室13之內部27進入之方向驅動第1構件29與第2構件31之間隔距離。藉此,第1構件29對第2構件31以正確位置且交叉內之平行度P對位。其後,藉由使驅動軸21進而向真空腔室13內移動,接著劑61於自中心部朝外側之方向延展,第1構件29與第2構件31可藉由未混入氣泡之接著層貼合。Fig. 6 is an enlarged view of the main part of the vacuum chamber part showing the normal state during lamination. The
圖7係顯示於載台間產生平行偏差之狀態之真空腔室部分之主要部分放大圖。此處,為抑制貼合時之氣泡混入,而將真空腔室13減壓至大致真空。此時,真空腔室13因大氣壓而於朝內部27受壓之方向變形(換言之,壓扁)。尤其,若設置有載台驅動部23(例如參照圖1)之部分朝內側變形,則與驅動軸21一起固定於第2載台19之第2構件31亦朝接近第1構件29之方向移動(參照圖7)。此處,針對圖7中以上蓋構件35變形之方式圖示之理由進行說明。如上所述,由於下殼構件33係以切削金屬而製作,故可相對容易地實現剛性高而不易變形之構造。另一方面,如上所述,由於上蓋構件35包含使載台驅動部23及驅動軸21可移動之定位台49而需要為平板,又,為了作為蓋開閉而需要某程度之輕量。因此,有非常難以確保剛性之設計制約。即,與下殼構件33相比,上蓋構件35具有相對壓倒性更容易變形之特徵。Fig. 7 is an enlarged view of the main part of the vacuum chamber part showing a state of parallel deviation between the stages. Here, in order to suppress mixing of air bubbles at the time of bonding, the
圖8係說明修正驅動軸移動量之真空腔室部分之主要部分放大圖。因此,於真空腔室13之外部,設置有於複數個部位測定第1載台17與第2載台19之間隔距離之位置測定部25。位置測定部25分別測定減壓裝置15將真空腔室13內設為真空前之載台之間隔距離資訊、及減壓裝置15將真空腔室13內設為真空後之載台之間隔距離資訊。藉此,可檢測因真空腔室13之變形所致之驅動軸21之變化量∆G。Fig. 8 is an enlarged view of the main part of the vacuum chamber part for correcting the movement of the drive shaft. Therefore, outside the
載台驅動部23使用該等真空前後之間隔距離資訊,分別獨立決定移動複數根驅動軸21之距離。即,位置測定部25測定設為真空後兩個載台之位置關係發生了多大之變形。載台驅動部23使用該資訊決定載台之移動方式。藉此,載台驅動部23可個別決定使複數個驅動部位之各者移動之距離,而進行微調整(換言之,位置修正)。The
又,真空貼合裝置11中,貫通於真空腔室13內之驅動軸21之Z方向之位置變化係藉由設置於真空腔室13之外部的位置測定部25檢測。藉此,真空貼合裝置11與將位置測定部25設置於真空腔室13內之情形相比,可避免真空對位置測定部25之影響。因此,位置測定部25可提高接觸型感測器、非接觸型感測器、被動型感測器、主動型感測器等之選擇自由度。其結果,真空貼合裝置11可以簡單之構造使用高精度且低價之位置測定部25。In addition, in the
再者,藉由將位置測定部25設置於真空腔室13之外部,而可簡單地進行位置測定部25之校正(校準)。例如,可藉由設置比例尺等簡單之構件,而容易實現移動量之0點修正(換言之,原點檢測)。藉此,真空貼合裝置11可於每次之位置測定時高精度維持載台之平行度與位置。又,假設將構成位置測定部25之感測器類設置於真空腔室13內之情形時,由於感測器類始終暴露於存在壓力變化之環境下,故易受較大之外部損壞。因此,有難以保證位置測定部25之輸出值之精度等問題,但該問題亦可藉由將位置測定部25置於真空腔室13外而解決。Furthermore, by providing the
又,由於該真空貼合裝置11之機構簡單,故對現有之真空貼合裝置之變更點相對較少。因此,亦可容易地進行對現有之真空貼合裝置之後續加裝。因此,根據實施形態1之真空貼合裝置11,可實現高精度之貼合位置與平行度,進而實現高品質之直接貼合。In addition, since the mechanism of the
又,真空貼合裝置11中,載台驅動部23使用:減壓裝置15將真空腔室13內設為真空前由位置測定部25測定出之載台之間隔距離資訊、及減壓裝置15將真空腔室13內設為真空後由位置測定部25測定出之載台之間隔距離資訊,於減壓裝置15將真空腔室13內設為真空後,移動複數根驅動軸21以使第1構件29與第2構件31之貼合面平行。In addition, in the
該真空貼合裝置11中,載台驅動部23個別決定使複數根驅動軸21各自移動之距離,而進行微調整(位置修正),藉此使兩個載台平行。其結果,即使真空腔室13因真空減壓而變形,真空貼合裝置11亦可確保貼合面之位置與平行度。In this
又,真空貼合裝置11之驅動軸21具備於與軸向大致垂直之方向伸展的伸出部47。位置測定部25藉由與伸出部47接觸,而測定第1載台17與第2載台19之間隔距離。Moreover, the
該真空貼合裝置11中,貫通真空腔室13之驅動軸21於真空腔室13之外部,具備於與軸向大致垂直之方向伸展的伸出部47。於真空腔室13之外部,設置上述位置測定部25。位置測定部25較佳使用例如接觸型感測器。接觸型感測器藉由與伸出部47接觸,而檢測驅動軸21之軸向之移動量。In the
即,驅動軸21以真空腔室內之貫通前端被固定於第2載台19。第2載台19固定第2構件31。驅動軸21藉由固定於真空腔室13之載台驅動部23而於軸向移動。載台驅動部23於非驅動時限制驅動軸21與真空腔室13之相對移動,而支持固定於真空腔室13。因此,載台驅動部23之非驅動時,藉由減壓裝置15之減壓而於真空腔室13中產生之變形(位置變化)可作為各個驅動軸21之位置變化(移位),而由各個位置測定部25檢測。That is, the
又,真空貼合裝置11之第2載台19具有固定第2構件31之貼合有效區域65。驅動軸21連接於較貼合有效區域65更外側之第2載台19。In addition, the
該真空貼合裝置11中,第2載台19具有固定第2構件31之貼合有效區域65。驅動軸21於真空腔室13內,貫通前端連接於較貼合有效區域65更外側之第2載台19。即,驅動軸21連接於第2載台19之端。驅動軸21藉由連接於第2載台19之端,而貫通真空腔室13之端。支持驅動軸21並使之移動自如之載台驅動部23亦固定於該真空腔室13之端。In this
因此,真空腔室13中產生因減壓所致之變形時,較變形增大之真空腔室13之中央,驅動軸21經由載台驅動部23支持於變形較小之真空腔室13之端,故與將驅動軸21連接於貼合有效區域65之內側之第2載台19之情形相比,可相對減小變形之影響。又,藉由將驅動軸21配置於真空腔室13之端,而可縮短與設置於真空腔室13之外部之位置測定部25之距離。藉此,亦可縮短連結位置測定部25與驅動軸21之連結構件(例如伸出部47等)之長度,亦可提高伴隨真空腔室13之變形之驅動軸21之檢測精度。Therefore, when the
又,真空貼合裝置11之4根驅動軸21之各者逐個連接於形成為大致四方形之第2載台19之四個角。In addition, each of the four
該真空貼合裝置11中,於形成為大致四方形之第2載台19之四個角之各者連接有驅動軸21。因此,大致四方形之第2構件31可於以通過任意一組驅動軸21之直線為擺動軸67之擺動方向,進行姿勢之微調整。此處,通過一組驅動軸21之直線意為作為連結4根驅動軸21之大致四方形之各邊之4條直線、與通過2組對角之2條直線之合計6條直線。即,第2載台19可繞該等6個擺動軸進行姿勢之微調整。In the
真空貼合裝置11中,有時僅使4根驅動軸21中之1根驅動軸21移動。該情形時,第2載台19之平面度降低。此種情形時,亦可藉由載台驅動部23僅將相應之1根驅動軸21之移動距離進行微調整(位置修正),而高精度維持平面度。In the
又,真空貼合裝置11之真空腔室13具有於上表面具有開口部37之六面體形狀之下殼構件33、及開閉開口部37之上蓋構件35,且載台驅動部23設置於上蓋構件35。In addition, the
該真空貼合裝置11中,真空腔室13之外殼包含下殼構件33與上蓋構件35。下殼構件33係以於上表面具有開口部37之六面體形狀形成。上蓋構件35開閉自如地安裝於下殼構件33之開口部37。下殼構件33可以藉由例如金屬之切削加工等將壁部設為20~30 mm左右之高剛性製作。藉此,下殼構件33可將因減壓所致之變形抑制為不影響貼合之程度。位置測定部25固定於下殼構件33之外部。上蓋構件35為可開閉之構造,且搭載使第2構件31於平面方向移動而定位之定位台49、或支持驅動軸21並使之進退自如之載台驅動部23。因此,與下殼構件33相比,減壓時之變形量易變大。因此,真空貼合裝置11中,可將設置於變形量大於下殼構件33之上蓋構件35之驅動軸21進行微調整。藉此,真空貼合裝置11形成為可藉由修正消除因伴隨真空腔室13中產生之減壓之變形所致之第2構件31之位置偏差、或平行度降低。In the
又,真空貼合裝置11之上蓋構件35繞沿下殼構件33之開口部37之一邊之擺動軸旋轉自如地受支持,且開閉開口部37。In addition, the
該真空貼合裝置11中,搭載有定位台49或支持驅動軸21之載台驅動部23之上蓋構件35設置成經由沿下殼構件33之一邊之擺動軸67擺動自如。真空腔室13藉由繞擺動軸旋轉,而使定位台49或載台驅動部23一起自下殼構件33移動至退避位置,可完全打開下殼構件33之開口部37。向打開方向擺動之上蓋構件35可將第2載台19作為上表面而配置。即,可容易自上方對配置於上表面之第2載台19載置第2構件31。In the
又,由於真空貼合裝置11可擺動上蓋構件35而打開,故可使第1構件29與第2構件31之兩者之貼著面朝向上側而露出,可容易進行各構件之圖像處理之位置確認或厚度測定、接著劑61之塗佈等。In addition, since the
藉此,真空貼合裝置11可容易且短時間進行貼合前之第1構件29及第2構件31之設置、或貼合後之第1構件29及第2構件31之取出作業,可提高生產效率。Thereby, the
以上,已一面參照圖式一面針對各種實施形態進行說明,但本揭示當然不限定於上述例。當明瞭,若為本領域技術人員,則可於申請專利範圍所記載之範疇內,想到各種變更例、修正例、置換例、附加例、刪除例、均等例,當了解,該等當然為屬於本揭示之技術範圍內者。又,於不脫離發明主旨之範圍內,亦可任意組合上述之各種實施形態中之各構成要件。 [產業上之可利用性]Above, various embodiments have been described with reference to the drawings, but the present disclosure is of course not limited to the above examples. It should be understood that those skilled in the art can think of various modifications, amendments, substitutions, additions, deletions, and equivalent examples within the scope of the scope of the patent application. When it is understood, these of course belong to Those within the technical scope of this disclosure. In addition, it is also possible to arbitrarily combine the constituent elements of the various embodiments described above without departing from the scope of the invention. [Industrial availability]
本揭示作為支援主焊接或修復焊接等各種焊接步驟中製造或修正不良部位之工件的識別碼之有效且簡單管理之識別碼管理方法、機器人控制裝置及總括控制裝置有用。The present disclosure is useful as an identification code management method, a robot control device, and an integrated control device that support effective and simple management of the identification code of the workpiece in the production or correction of defective parts in various welding steps such as main welding or repair welding.
11:真空貼合裝置 13:真空腔室 15:減壓裝置 17:第1載台 19:第2載台 21:驅動軸 23:載台驅動部 25:位置測定部 27:內部 29:第1構件 31:第2構件 33:下殼構件 35:上蓋構件 37:開口部 39:吸氣管 41:排氣管 43:真空夾盤用配管 45:氣缸 47:伸出部 49:定位台 51:直線移動機構 53:臂單元 55:相機 57:厚度測定感測器 59:塗佈機 61:接著劑 63:檢測件 65:貼合有效區域 67:擺動軸 ∆G:變化量 P:平行度 St1~St15:步驟11: Vacuum bonding device 13: Vacuum chamber 15: Pressure reducing device 17: First stage 19: Second stage 21: drive shaft 23: Stage drive 25: Position Measurement Department 27: Internal 29: The first member 31: The second member 33: Lower shell component 35: Upper cover member 37: Opening 39: suction tube 41: Exhaust pipe 43: Piping for vacuum chuck 45: cylinder 47: Overhang 49: positioning table 51: Linear moving mechanism 53: Arm unit 55: Camera 57: thickness measurement sensor 59: Coating machine 61: Adhesive 63: Inspection parts 65: Fit the effective area 67: swing axis ∆G: amount of change P: parallelism St1~St15: steps
圖1係自實施形態1之真空貼合裝置之正面觀察之剖視圖。 圖2係圖1所示之真空貼合裝置之上蓋構件打開之狀態之側剖視圖。 圖3係圖1所示之真空腔室部分之主要部分放大圖。 圖4係改變驅動軸對第2載台之連接位置之變化例之構成的主要部分放大圖。 圖5係顯示實施形態1之真空貼合裝置之貼合動作順序之一例之流程圖。 圖6係顯示貼合時之正常狀態之真空腔室部分之主要部分放大圖。 圖7係顯示於載台間產生平行偏差之狀態之真空腔室部分之主要部分放大圖。 圖8係說明驅動軸移動量之修正之真空腔室部分之主要部分放大圖。Fig. 1 is a cross-sectional view viewed from the front of the vacuum laminating device of the first embodiment. Fig. 2 is a side cross-sectional view of the vacuum laminating device shown in Fig. 1 with the upper cover member opened. Fig. 3 is an enlarged view of the main part of the vacuum chamber shown in Fig. 1. Fig. 4 is an enlarged view of the main part of the configuration of a modified example of changing the connection position of the drive shaft to the second stage. Fig. 5 is a flowchart showing an example of the lamination operation sequence of the vacuum lamination device of the first embodiment. Fig. 6 is an enlarged view of the main part of the vacuum chamber part showing the normal state during lamination. Fig. 7 is an enlarged view of the main part of the vacuum chamber part showing a state of parallel deviation between the stages. Fig. 8 is an enlarged view of the main part of the vacuum chamber portion illustrating the correction of the movement of the drive shaft.
11:真空貼合裝置 11: Vacuum bonding device
13:真空腔室 13: Vacuum chamber
15:減壓裝置 15: Pressure reducing device
17:第1載台 17: First stage
19:第2載台 19: Second stage
21:驅動軸 21: drive shaft
23:載台驅動部 23: Stage drive
25:位置測定部 25: Position Measurement Department
27:內部 27: Internal
29:第1構件 29: The first member
31:第2構件 31: The second member
33:下殼構件 33: Lower shell component
35:上蓋構件 35: Upper cover member
37:開口部 37: Opening
39:吸氣管 39: suction tube
41:排氣管 41: Exhaust pipe
43:真空夾盤用配管 43: Piping for vacuum chuck
45:氣缸 45: cylinder
47:伸出部 47: Overhang
49:定位台 49: positioning table
61:接著劑 61: Adhesive
63:檢測件 63: Inspection parts
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