TW202116518A - Resin supply mechanism, resin molding device, and method of manufacturing resin molded product wherein the resin supply mechanism can supply resin materials at a plurality of positions - Google Patents
Resin supply mechanism, resin molding device, and method of manufacturing resin molded product wherein the resin supply mechanism can supply resin materials at a plurality of positions Download PDFInfo
- Publication number
- TW202116518A TW202116518A TW109127213A TW109127213A TW202116518A TW 202116518 A TW202116518 A TW 202116518A TW 109127213 A TW109127213 A TW 109127213A TW 109127213 A TW109127213 A TW 109127213A TW 202116518 A TW202116518 A TW 202116518A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- container
- resin material
- resin supply
- supply
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/004—Arrangements for converting the motion of a material which is continuously fed to a working station in a stepwise motion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/02—Dispensing from vessels, e.g. hoppers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
- B29C37/0071—Dusting machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
本發明關於一種樹脂供給機構、樹脂成形裝置及樹脂成形品的製造方法的技術。The present invention relates to a technique of a resin supply mechanism, a resin molding device, and a method of manufacturing a resin molded product.
在專利文獻1中公開了一種對成形裝置供給粒狀的樹脂材料的樹脂供給系統。在所述系統中,收納有樹脂材料的容器由把持機構把持,並由升降部移送至能夠供給樹脂的位置。其後,利用開閉部卸下容器的蓋,並利用旋轉部使把持機構傾斜,由此將容器中所收納的樹脂材料供給至樹脂積存部的供給口。供給樹脂材料後變空的容器藉由升降部再次向下方移送並被回收。樹脂積存部中所收納的樹脂材料進一步被供給至樹脂成形部,來製造樹脂成形品。
[現有技術文獻]
[專利文獻]
[專利文獻1]日本專利特開平11-10096號公報[Patent Document 1] Japanese Patent Laid-Open No. 11-10096
[發明所要解決的問題]
在專利文獻1中所公開的樹脂供給系統中,容器在利用升降部上升的規定的位置(供給位置)傾斜,而將樹脂材料供給至樹脂積存部的供給口。即,在所述樹脂供給系統中,將樹脂材料從單一的位置(供給位置)供給至單一的樹脂積存部。[The problem to be solved by the invention]
In the resin supply system disclosed in
然而,近年來,伴隨樹脂成形品的大型化,樹脂材料從樹脂積存部向樹脂成形部的供給所需要的時間變長,從而擔心樹脂成形品的製造效率的劣化。因此,從製造效率的觀點出發,期望設置多個樹脂積存部,使用供給至多個樹脂積存部的樹脂材料,並行地進行樹脂材料從樹脂積存部向樹脂成形部的供給。在此情況下,需要能夠在多個位置(對多個樹脂積存部)供給樹脂材料的樹脂供給機構。However, in recent years, with the increase in the size of the resin molded product, the time required for the supply of the resin material from the resin storage portion to the resin molded portion has become longer, and there is a concern that the production efficiency of the resin molded product will deteriorate. Therefore, from the viewpoint of manufacturing efficiency, it is desirable to provide a plurality of resin reservoirs, use the resin material supplied to the plurality of resin reservoirs, and perform the supply of the resin material from the resin reservoir to the resin molded portion in parallel. In this case, a resin supply mechanism capable of supplying resin material to a plurality of positions (to a plurality of resin reservoirs) is required.
本發明是鑒於如上所述那樣的狀況而成,其所要解決的問題在於提供一種能夠在多個位置供給樹脂材料的樹脂供給機構、樹脂成形裝置及樹脂成形品的製造方法。 [解決問題的技術手段]The present invention is made in view of the situation as described above, and the problem to be solved is to provide a resin supply mechanism, a resin molding device, and a method of manufacturing a resin molded product that can supply a resin material at a plurality of positions. [Technical means to solve the problem]
本發明所要解決的問題如上所述,為了解決所述問題,本發明的樹脂供給機構包括:容器保管部,保管收納有樹脂材料的容器;升降機構,使所述容器保管部中所保管的所述容器上升至規定的上升位置;蓋開封機構,將位於所述上升位置的所述容器的蓋開封;橫向移動機構,使由所述蓋開封機構開封的所述容器在橫向方向上移動,使其移動至多個樹脂供給位置中的任一位置;以及旋轉機構,藉由使位於所述樹脂供給位置的所述容器旋轉,將所述容器中所收納的樹脂材料排出。The problem to be solved by the present invention is as described above. In order to solve the problem, the resin supply mechanism of the present invention includes: a container storage section for storing a container containing a resin material; The container is raised to a predetermined rising position; the lid opening mechanism opens the lid of the container at the raised position; the lateral movement mechanism moves the container opened by the lid opening mechanism in the lateral direction, so that It moves to any one of a plurality of resin supply positions; and a rotating mechanism for discharging the resin material contained in the container by rotating the container at the resin supply position.
另外,本發明的樹脂成形裝置包括所述樹脂供給機構。In addition, the resin molding apparatus of the present invention includes the resin supply mechanism.
另外,本發明的樹脂成形品的製造方法使用所述樹脂成形裝置來製造樹脂成形品。 [發明的效果]In addition, the method of manufacturing a resin molded product of the present invention uses the resin molding apparatus to manufacture a resin molded product. [Effects of the invention]
根據本發明,可在多個位置供給樹脂材料。According to the present invention, the resin material can be supplied at multiple locations.
以下,將圖中的箭頭U、箭頭D、箭頭F、箭頭B、箭頭L及箭頭R所示的方向分別定義為上方向、下方向、前方向、後方向、左方向及右方向來進行說明。Hereinafter, the directions shown by arrow U, arrow D, arrow F, arrow B, arrow L, and arrow R in the figure are defined as up, down, front, back, left, and right directions, respectively. .
首先,使用圖1對本實施方式的樹脂成形裝置1的結構進行說明。樹脂成形裝置1對半導體芯片等電子零件進行樹脂密封,來製造樹脂成形品。尤其在本實施方式中,例示了採用將模腔內的樹脂材料壓縮並成形的壓縮成形方式(壓縮方式)的樹脂成形裝置1。First, the structure of the
樹脂成形裝置1包括基板搬入搬出模塊10、基板交接模塊20、成形模塊30、樹脂供給模塊40及控制部50作為結構元件。各結構元件能夠相對於其他結構元件拆卸且能夠更換。The
基板搬入搬出模塊10搬入安裝有電子零件的基板P,並且搬出電子零件經樹脂密封的基板P。在本實施方式中,假定使用相對較大型的基板P。例如,基板P形成為一邊為450 mm以上、500 mm以上、或600 mm以上的矩形板狀。基板搬入搬出模塊10主要包括:搬入部11、搬出部12、檢查部13及臂機構14。The board carry-in and carry-out
搬入部11為配置未經樹脂密封的基板P的部分。搬出部12為配置經樹脂密封的基板P的部分。搬入部11及搬出部12可分別收納多個基板P。The carrying-in
檢查部13為進行經樹脂密封的基板P的檢查的部分。檢查部13包括:載置經樹脂密封的基板P的載置部、對基板P進行檢查的檢查機構(未圖示)等。The inspection part 13 is a part that performs inspection of the resin-sealed substrate P. The inspection part 13 includes a mounting part on which the resin-sealed substrate P is mounted, an inspection mechanism (not shown) that inspects the substrate P, and the like.
臂機構14使基板P移動。臂機構14包括:吸附基板P的吸附手部14a、用來安裝吸附手部14a的臂部14b、使臂部14b適當旋轉或移動的驅動部14c等。The
基板交接模塊20為在基板搬入搬出模塊10與後述的成形模塊30之間進行基板P的交接的部分。基板交接模塊20主要包括裝載器21及卸載器22。The
裝載器21從臂機構14接收未經樹脂密封的基板P,並搬送至後述的成形模塊30的成形模31。卸載器22從後述的成形模31接收經樹脂密封的基板P,並搬送至基板搬入搬出模塊10。裝載器21及卸載器22可沿著在左右方向上延伸的導軌La移動。在本實施方式中,裝載器21與卸載器22以一體地移動的方式相互連結。The
成形模塊30使用從後述的樹脂供給模塊40供給的樹脂材料,來對安裝在基板P的電子零件進行樹脂密封。在本實施方式中,成形模塊30並排配置兩個。藉由利用兩個成形模塊30並行地進行基板P的樹脂密封,可提高樹脂成形品的製造效率。成形模塊30主要包括成形模31等。The
成形模31使用熔融的樹脂材料對基板P進行壓縮成形。成形模31包括上下一對模(上模及下模)。在下模形成用來收納樹脂材料的凹狀的模腔(未圖示)。另外,在成形模31設置用於使樹脂材料熔融的加熱器(未圖示)。The molding die 31 compresses and molds the substrate P using a molten resin material. The forming
樹脂供給模塊40向成形模塊30的成形模31供給樹脂材料。樹脂供給模塊40主要包括:樹脂供給機構100、小托盤41、小托盤搬送機構42、大托盤43及大托盤搬送機構44。The
樹脂供給機構100向後述的小托盤41供給樹脂材料。樹脂供給機構100可並行地向兩個小托盤41供給樹脂材料。再者,關於樹脂供給機構100的詳細結構將在後面敘述。The
小托盤41將從樹脂供給機構100接收到的樹脂材料供給至後述的大托盤43。小托盤41可在上表面保持樹脂材料。小托盤41是以俯視時的大小為後述大托盤43的大小的四分之一左右的方式形成。The
小托盤搬送機構42將小托盤41搬送至適當的位置。小托盤搬送機構42可在樹脂供給機構100與大托盤43之間以使小托盤41往返的方式搬送小托盤41。The small
大托盤43將從小托盤41接收到的樹脂材料供給至成形模塊30的成形模31。大托盤43可在上表面保持樹脂材料。大托盤43是以成為與成形模31的模腔的平面形狀對應的平面形狀(例如,矩形形狀)的方式形成。The
大托盤搬送機構44將大托盤43搬送至適當的位置。大托盤搬送機構44可沿著在左右方向上延伸的導軌La移動。
此處,對小托盤41、大托盤43補充說明。所謂此處的“托盤”,只要能夠在內部收納顆粒狀的樹脂材料即可,所述樹脂材料收納部可為單個也可為多個。例如,作為托盤,可採用如下結構:將樹脂材料收納部分割成多個區域,使用設置在下方的擋板機構使多個樹脂材料收納部中所收納的樹脂材料落下。另外,作為托盤,還可採用如下結構:將沿著長度方向而一部分開口且內部被挖通那樣的圓筒形狀的構件以多個在單方向上並排的方式排列,使這些圓筒形狀的多個構件旋轉,而使圓筒形狀的多個構件的內部空間中所收納的樹脂材料落下。The large
控制部50對樹脂成形裝置1的各模塊的動作進行控制。利用控制部50對基板搬入搬出模塊10、基板交接模塊20、成形模塊30及樹脂供給模塊40的動作進行控制。另外,可使用控制部50任意地變更(調整)各模塊的動作。The
接著,對如上所述那樣構成的樹脂成形裝置1的動作(樹脂成形品的成形方法)的概要進行說明。Next, the outline of the operation (the molding method of the resin molded product) of the
首先,配置在搬入部11的未經樹脂密封的基板P由臂機構14搬送至裝載器21。First, the substrate P that is not resin-sealed and arranged in the carry-in
接著,裝載器21沿著導軌La移動,將基板P搬送至其中一個成形模塊30。搬送至成形模塊30的基板P吸附並保持於成形模31的上模。Next, the
接著,以覆蓋成形模31的下模的方式配置離型膜。Next, a release film is arranged so as to cover the lower mold of the forming
接著,從樹脂供給模塊40向成形模塊30的成形模31供給樹脂材料。此處,在樹脂供給模塊40中,預先從樹脂供給機構100供給的樹脂材料經由小托盤41被供給至大托盤43。由於小托盤41以成為大托盤43的四分之一左右的大小的方式形成,因此利用共計四個小托盤41向整個大托盤43大致均勻地供給樹脂材料。Next, the resin material is supplied from the
藉由使大托盤搬送機構44沿著導軌La移動,將保持有樹脂材料的大托盤43搬送至成形模塊30的成形模31。其後,將大托盤43的樹脂材料供給至成形模31(下模)的模腔。大托盤搬送機構44將樹脂材料供給至成形模31之後,返回至樹脂供給模塊40。By moving the large
接著,利用成形模31的加熱器將樹脂材料熔融。其後,在下模與上模相互接近且基板P的電子零件浸漬於樹脂材料的狀態下,對樹脂材料適當施加壓力。藉由在所述狀態下將樹脂材料硬化,可獲得電子零件經樹脂密封的基板P。Next, the resin material is melted by the heater of the forming
接著,卸載器22沿著導軌La移動,從成形模31接收電子零件經樹脂密封的基板P。此時,可利用與卸載器22一起移動的裝載器21將新的基板P配置在成形模31。其後,卸載器22沿著導軌La移動,並返回至基板交接模塊20。Next, the
接著,由卸載器22保持的基板P由臂機構14搬送至檢查部13。在檢查部13中,進行電子零件經樹脂密封的基板P的檢查。Next, the substrate P held by the
接著,檢查結束後的基板P由臂機構14搬送至搬出部12。配置在搬出部12的基板P被適當搬出至外部。Then, the substrate P after the inspection is conveyed to the
如上所述,藉由對安裝在基板P的電子零件進行樹脂密封,可製造樹脂成形品。再者,在所述的動作說明中省略了說明,但在本實施方式的樹脂成形裝置1中,可利用設置有兩個的成形模塊30,並行地進行基板P的樹脂密封。具體而言,在利用其中一個成形模塊30進行樹脂密封(樹脂材料的熔融、或對基板P的按壓等)時,可向另一個成形模塊30供給樹脂材料,或進行基板P的樹脂密封。如此,可效率良好地製造樹脂成形品(電子零件經樹脂密封的基板P)。As described above, by resin-sealing the electronic components mounted on the substrate P, a resin molded product can be manufactured. In addition, although the description is omitted in the description of the operation described above, in the
以下,使用圖2至圖11,對樹脂供給模塊40的樹脂供給機構100進行具體說明。Hereinafter, the
樹脂供給機構100主要包括:框體110、容器保管部120、升降機構130、旋轉機構140、橫向移動機構150、蓋開封機構160、樹脂收納部170、集塵機構180、容器回收部190、及空調裝置200。The
圖2所示的框體110收納構成樹脂供給機構100的各部(後述的容器保管部120等)。框體110藉由適當的框架或壁面等,形成為具有適當的形狀的箱狀。藉由將容器保管部120等收納在框體110內,可抑制樹脂材料的粉末等塵埃漏出至樹脂供給機構100的外部的情況,從而抑制外部的空氣受到污染的情況。The
圖2至圖4的(d)所示的容器保管部120為保管用來收納樹脂材料的容器C的部分。容器C形成為具有底的大致圓筒狀(例如,參照圖5的(a)、圖5的(b)等)。形成於容器C的長度方向一端部的開口部由蓋C1堵塞。在本實施方式中,假定使用顆粒狀的樹脂材料,所述樹脂材料以規定量收納在容器C。再者,作為樹脂材料,不僅能夠使用顆粒狀的材料,還能夠使用粉末狀或液狀等任意形態的材料。容器保管部120主要包括:側壁121、傾斜面122、下側止擋件123及上側止擋件124。The
側壁121限制容器C向左右方向的移動。側壁121以相互相對的方式設置左右一對。左右一對的側壁121的間隔形成為與容器C的直徑大致相同。The
傾斜面122用於引導從容器保管部120搬出的容器C。傾斜面122是以從其中一個側壁121(在本實施方式中為右側的側壁121)的下端部朝向左下方傾斜的方式配置。The
下側止擋件123限制容器C的落下。下側止擋件123設置在其中一個側壁121(在本實施方式中為右側的側壁121)的下端部附近。在側壁121設置有狹縫,以使下側止擋件123可朝向容器C突出。下側止擋件123可藉由適當的致動器(例如,氣缸等)而伸縮。下側止擋件123在藉由致動器的動作而收縮的狀態下,整體位於側壁121的右側。另外,當下側止擋件123藉由致動器的動作而伸長時,前端(左端)從側壁121向左方突出。The
上側止擋件124限制容器C的落下。上側止擋件124配置在下側止擋件123的上方。上側止擋件124與下側止擋件123隔開規定的間隔(與容器C的直徑大致相同的間隔)而配置。上側止擋件124的結構與下側止擋件123相同。即,當上側止擋件124伸長時,前端(左端)從側壁121向左方突出。The
再者,在通常時(容器保管部120中保管有容器C的狀態),僅下側止擋件123伸長,上側止擋件124收縮(參照圖4的(a))。即,成為僅下側止擋件123向側壁121的左方突出的狀態。In addition, in the normal time (a state where the container C is stored in the container storage unit 120), only the
在如上所述那樣構成的容器保管部120中,可保管多個容器C。具體而言,由作業者打開設置在框體110的適當的門,在一對側壁121之間配置容器C。此時,容器C以使長度方向面向橫向(前後)的狀態(更詳細而言,使蓋C1面向前方的狀態)配置。容器C因自重而欲在一對側壁121之間向下方移動(落下),但容器C的移動由下側止擋件123限制(參照圖4的(a))。由此,可將容器C保持在一對側壁121之間。另外,藉由將容器C配置為上下堆疊,可在容器保管部120保管多個容器C。In the
另外,容器保管部120可根據需要將容器C逐個搬出至後述的升降機構130。具體而言,如圖4的(b)所示,首先,上側止擋件124伸長,從下起第二個容器C向下方的移動受到限制。接著,如圖4的(c)所示,下側止擋件123收縮,最下面的容器C的限制解除。由此,最下面的容器C因自重而向下方移動,在傾斜面122的上表面滾動而被引導至配置在左方的升降機構130。最後,如圖4的(d)所示,下側止擋件123伸長,上側止擋件124收縮。由此,殘留在容器保管部120的容器C向下方移動。In addition, the
圖2至圖4的(d)所示的升降機構130使從容器保管部120搬出的容器C升降。升降機構130主要包括:載置部131、導軌132、移動部133及馬達134。The elevating
載置部131為載置容器C的部分。載置部131由前後一對板狀的構件形成(參照圖5的(b))。載置部131的上表面包括形成為左右中央朝向下方凹陷那樣的形狀(正面觀看時大致V字狀)的凹部131a。藉由在凹部131a載置橫置的容器C,可將容器C保持為不向左右滾動。The mounting
圖3所示的導軌132是以能夠使載置部131上下移動的方式引導載置部131。導軌132由在上下方向上延伸的適當的構件形成。導軌132配置在容器保管部120的左方。The
移動部133為設置為能夠相對於導軌132上下(導軌132的長度方向)移動的部分。在移動部133固定載置部131。The moving
馬達134是產生用於使移動部133上下移動的驅動力的構件(驅動源)。馬達134經由適當的動力傳遞機構與移動部133連結。藉由對馬達134的動作(旋轉方向或旋轉速度等)進行控制,可使移動部133(甚至載置部131)上下升降至任意的位置。The
圖2、圖3及圖5的(a)、圖5的(b)所示的旋轉機構140保持容器C,並且使其向規定的朝向旋轉。旋轉機構140主要包括:馬達141、基底部142及把持部143。The
圖5的(a)、圖5的(b)所示的馬達141是產生用於使後述的基底部142旋轉的驅動力的構件(驅動源)。馬達141是以輸出軸(未圖示)面向右方的方式配置。The
基底部142為支撐後述的把持部143的部分。基底部142的左端部連結於馬達141的輸出軸。由此,基底部142可與馬達141的輸出軸一起旋轉。The
把持部143為把持容器C的部分。把持部143設置左右一對。把持部143是以能夠相對於基底部142左右移動的方式設置。把持部143可藉由適當的致動器(未圖示)的驅動力而向左右移動。The
如上所述那樣構成的旋轉機構140由後述的橫向移動機構150支撐。如圖8的(a)所示,在將容器C配置在左右一對把持部143之間的狀態下,藉由使把持部143以相互接近的方式移動,可利用把持部143夾入容器C來保持。藉由在所述狀態下驅動馬達141,可使容器C向任意的朝向旋轉。例如,在圖8的(b)中,示出了容器C的蓋C1以面向上的方式旋轉的情形。The
圖2、圖5的(a)、圖5的(b)及圖6所示的橫向移動機構150使容器C在橫向方向(左右方向)上移動。橫向移動機構150主要包括:導軌151、移動部152及馬達153。The
圖5的(a)、圖5的(b)及圖6所示的導軌151以能夠使後述的移動部152在橫向方向(水平方向)上移動的方式引導移動部152。導軌151由在左右方向上延伸的適當的構件形成。導軌151是以從升降機構130的上方(導軌132的上端部附近)朝向左方延伸的方式配置。The
移動部152為設置為能夠相對於導軌151左右(導軌151的長度方向)移動的部分。在移動部152設置旋轉機構140。The moving
馬達153是產生用於使移動部152左右移動的驅動力的構件(驅動源)。馬達153經由適當的動力傳遞機構與移動部152連結。藉由對馬達153的動作(旋轉方向或旋轉速度等)進行控制,可將移動部152(甚至旋轉機構140)左右移動至任意的位置。再者,為了方便,在圖5的(b)中省略了馬達153的圖示。The
圖2、圖5的(a)、圖5的(b)及圖6所示的蓋開封機構160將容器C的蓋C1開封。蓋開封機構160配置在升降機構130的上方(比旋轉機構140及橫向移動機構150更靠上側)。蓋開封機構160主要包括:馬達161、把持部162及升降缸163。The
圖5的(a)、圖5的(b)及圖6所示的馬達161是產生用於使後述的把持部162旋轉的驅動力的構件(驅動源)。馬達161是以輸出軸161a面向下方的方式配置。The
把持部162為把持容器C的蓋C1的部分。把持部162在馬達161的輸出軸161a的下端部設置多個。把持部162設置為能夠相對於輸出軸161a擺動。把持部162可藉由適當的致動器(例如,氣缸等)而任意地擺動。藉由使多個把持部162的下端部以相互接近的方式擺動,可把持容器C的蓋C1。The
圖5的(b)所示的升降缸163用於使馬達161上下移動(升降)。升降缸163是以成為能夠上下伸縮的方式配置。升降缸163連結於馬達161。藉由使升降缸163伸縮,可使馬達161升降。The
藉由如上所述那樣構成的蓋開封機構160,可將容器C的蓋C1開封。具體而言,在將蓋C1從容器C取下的情況下,如圖8的(c)所示,在利用把持部162把持由旋轉機構140保持的容器C的蓋C1的狀態下,驅動馬達161。由此,可使蓋C1相對於容器C旋轉。伴隨於此,藉由利用升降缸163使馬達161逐漸上升,可如圖8的(d)所示,將蓋C1從容器C取下。With the
另外,在將蓋C1安裝於容器C的情況下,如圖8的(e)所示,在利用把持部162把持經取下的蓋C1的狀態下,驅動馬達161。在所述狀態下,藉由利用升降缸163使馬達161逐漸下降,可將蓋C1安裝於由旋轉機構140保持的容器C。In addition, when the cap C1 is attached to the container C, as shown in FIG. 8( e ), the
圖2、圖6及圖7的(a)、圖7的(b)所示的樹脂收納部170為暫時收納從容器C供給至小托盤41的樹脂材料的部分。樹脂收納部170沿著橫向移動機構150的導軌151設置多個(在本實施方式中為兩個)。再者,在圖7的(a)、圖7的(b)中示出了從右方觀看兩個樹脂收納部170中的右側的樹脂收納部170的情形(右側視圖)。樹脂收納部170主要包括:引導部171、儲料器172、第一給料機173、樹脂供給部174及第二給料機175。The
圖6及圖7的(a)、圖7的(b)所示的引導部171為將從容器C排出的樹脂材料引導至後述的儲料器172的部分。引導部171形成為上下開口的筒狀。引導部171形成為與上部相比下部窄那樣的大致漏斗狀。The
儲料器172暫時保持從容器C排出的樹脂材料,並將其供給至後述的樹脂供給部174。儲料器172形成為上部開口的大致箱狀。在儲料器172的底部形成用於將所收納的樹脂材料向下方(樹脂供給部174)供給的供給口(未圖示)。在儲料器172設置感測器172a。The
感測器172a用於對在儲料器172中是否收納有規定量的樹脂材料進行檢測。感測器172a可由例如反射式光電感測器構成,但也可由透射式感測器構成。The
第一給料機173用於將樹脂材料從儲料器172排出。第一給料機173設置在儲料器172的下部,可使儲料器172振動。藉由利用第一給料機173使儲料器172振動,可使樹脂材料從儲料器172的供給口逐漸落下,並將其供給至配置在下方的樹脂供給部174。The
圖6所示的樹脂供給部174將樹脂材料供給至小托盤41。樹脂供給部174形成為上部開口的大致箱狀。在樹脂供給部174的底部形成用於將所收納的樹脂材料向下方(小托盤41)供給的供給口(未圖示)。另外,在樹脂供給部174設置重量感測器(未圖示),可對樹脂供給部174的重量(甚至收納在樹脂供給部174的樹脂材料的重量)進行檢測。The
第二給料機175用於將樹脂材料從樹脂供給部174排出。第二給料機175設置在樹脂供給部174的下部,可使樹脂供給部174振動。藉由利用第二給料機175使樹脂供給部174振動,可使樹脂材料從樹脂供給部174的供給口逐漸落下,並將其供給至配置在下方的小托盤41(參照圖1)。The
利用如上所述那樣構成的樹脂收納部170收納樹脂材料,並且可將樹脂材料適當供給至小托盤41。具體而言,在儲料器172收納從容器C供給的樹脂材料。對樹脂供給部174,以始終收納規定量的樹脂材料的方式,基於重量感測器的檢測值而從儲料器172適當供給樹脂材料。樹脂供給部174中所收納的樹脂材料在適當的時機被供給至小托盤41。另外,在由感測器172a檢測到儲料器172中所收納的樹脂材料減少的情況下,如後所述,將容器C的樹脂材料供給至儲料器172。The resin
圖2及圖3所示的集塵機構180藉由抽吸框體110內的空氣,來回收樹脂材料的粉末等塵埃。集塵機構180主要包括:本體部181、抽吸口182及軟管183。The
圖3所示的本體部181是將用於抽吸空氣的風扇、或回收塵埃的過濾器等單元化而成的構件。本體部181配置在框體110的適當的部位。The
抽吸口182是用於抽吸框體110內的空氣的開口。抽吸口182分別配置在樹脂收納部170的引導部171的左右。The
軟管183將本體部181與抽吸口182連接。軟管183適當分支,並分別連接於多個抽吸口182。The
圖2及圖3所示的容器回收部190為回收將樹脂材料供給至樹脂收納部170而變空的容器C的部分。容器回收部190主要包括回收盒191及傾斜面192。The
圖3所示的回收盒191收納變空的容器C。回收盒191形成為上部開口的大致箱狀。回收盒191配置在容器保管部120的下方。The
傾斜面192將容器C引導至回收盒191。傾斜面192配置在容器保管部120的傾斜面122的左下方。傾斜面192是以從回收盒191的左上端部朝向左上方傾斜的方式配置。傾斜面192配置在升降機構130的載置部131升降的路徑的中途部(下部)。在傾斜面192形成升降機構130的載置部131能夠上下通過的狹縫(未圖示)。The
圖2及圖3所示的空調裝置200調整框體110內的溫度或濕度。空調裝置200主要包括本體部201及軟管202。The
圖3所示的本體部201進行空氣的冷卻及除濕。在圖3中,本體部201配置在框體110的外部,但也可包含軟管202在內,空調裝置200的整體配置在框體110的內部。本體部201可導入框體110的外部的空氣,來適當進行冷卻及除濕。The
軟管202將由本體部201進行了冷卻及除濕的空氣引導至框體110內。軟管202分別連接於本體部201及框體110的適當的部位。藉由將經冷卻及除濕的空氣經由軟管202供給至框體110,可適當調整框體110內的溫度或濕度。The
接著,對如上所述那樣構成的樹脂供給機構100的動作(具體而言,將容器C中所收納的樹脂材料供給至樹脂收納部170的動作)進行說明。Next, the operation of the
在利用設置於儲料器172的感測器172a檢測到儲料器172內的樹脂材料在某種程度上減少(儲料器172中所收納的樹脂材料小於規定量)的情況下,開始容器C中所收納的樹脂材料向樹脂收納部170的供給。再者,以下的動作說明是假定兩個樹脂收納部170中的右側的樹脂收納部170的儲料器172內的樹脂材料減少的情況。When the
首先,如圖3所示,利用容器保管部120將所保管的容器C中的一個(最下面的容器C)搬出至升降機構130。搬出至升降機構130的容器C載置在載置部131的凹部131a。First, as shown in FIG. 3, one of the stored containers C (the lowermost container C) is carried out to the elevating
接著,如圖3及圖6所示,容器C被升降機構130抬起,配置在能夠由旋轉機構140保持的上升位置。在所述狀態下,容器C由旋轉機構140保持(參照圖8的(a)),蓋C1以面向上的方式旋轉(參照圖8的(b))。Next, as shown in FIGS. 3 and 6, the container C is lifted by the
接著,如圖8的(c)及圖8的(d)所示,利用蓋開封機構160將容器C的蓋C1開封。Next, as shown in FIGS. 8( c) and 8 (d ), the lid C1 of the container C is opened by the
接著,如圖9所示,開始利用橫向移動機構150使旋轉機構140(甚至容器C)向左方的移動。另外,基於利用橫向移動機構150使容器C移動的開始時機,使集塵機構180運行。此處,當開始利用橫向移動機構150使容器C移動時,本體部181的風扇運行,開始來自抽吸口182的抽吸。藉由使集塵機構180運行,可抽吸從打開的容器C出來的塵埃等。容器C停止在能夠向樹脂收納部170供給樹脂材料的位置(樹脂供給位置)。具體而言,容器C停止在從正面觀看時與右側的樹脂收納部170(引導部171)重合的位置。再者,集塵機構180的運行的開始可以相對於利用橫向移動機構150使容器C移動的開始時機而提前/延後一定時間等的方式,基於利用橫向移動機構150使容器C移動的開始時機進行控制。Next, as shown in FIG. 9, the
接著,如圖7的(b)所示,容器C藉由旋轉機構140旋轉。由此,容器C的開口部面向下方,容器C內的樹脂材料經由引導部171被供給至儲料器172。Next, as shown in FIG. 7( b ), the container C is rotated by the
當在容器C面向下方的狀態下經過規定的時間時,容器C的開口部藉由旋轉機構140再次面向上方。When a predetermined time elapses with the container C facing downward, the opening of the container C faces upward again by the
再者,將容器C內的樹脂材料供給至儲料器172,在利用感測器172a檢測到在儲料器172中收納有規定量的樹脂材料的情況下,集塵機構180停止。Furthermore, the resin material in the container C is supplied to the
另一方面,即使將容器C內的樹脂材料供給至儲料器172,在利用感測器172a檢測到在儲料器172中未收納有規定量的樹脂材料的情況下,集塵機構180也不停止而持續運行。On the other hand, even if the resin material in the container C is supplied to the
在容器C的開口部面向上方之後,容器C藉由橫向移動機構150向右方移動。容器C停止在蓋開封機構160的緊靠其的下方。After the opening of the container C faces upward, the container C is moved to the right by the
接著,如圖8的(e)所示,利用蓋開封機構160安裝容器C的蓋C1。進而,如圖8的(f)所示,容器C藉由旋轉機構140橫向(以蓋C1面向前方的方式)旋轉。Next, as shown in FIG. 8( e ), the cap C1 of the container C is attached by the
接著,如圖10所示,利用旋轉機構140對容器C的保持解除,容器C藉由升降機構130向下方移動。當載置部131通過傾斜面192的狹縫而向比傾斜面192更靠下方移動時,載置於載置部131的容器C被傾斜面192引導而回收至回收盒191內。Next, as shown in FIG. 10, the holding of the container C by the
如此,一個容器C中所收納的樹脂材料向樹脂收納部170的供給完成。此處,在儲料器172內的樹脂材料仍然少的情況下(在利用感測器172a檢測到在儲料器172中未收納有預定量的樹脂材料的情況下),進而將另一個容器C的樹脂材料供給至儲料器172。如此,反復將容器C的樹脂材料供給至儲料器172,直至在儲料器172中收納規定量的樹脂材料。在此期間,集塵機構180持續運行。In this way, the supply of the resin material contained in one container C to the
再者,在所述動作說明中,例示了右側的儲料器172的樹脂材料減少的情況,但左側的儲料器172的樹脂材料減少的情況,也同樣地供給容器C的樹脂材料。在此情況下,如圖11所示,容器C藉由橫向移動機構150移動至在正面觀看時與左側的樹脂收納部170(引導部171)重合的位置,將容器C的樹脂材料供給至左側的儲料器172。In addition, in the operation description, the case where the resin material of the
如此,在本實施方式中,可利用橫向移動機構150使容器C移動至多個位置(與左右的樹脂收納部170對應的位置)。由此,可將樹脂材料供給至設置在多個部位的樹脂收納部170。由於可將樹脂材料從以如上方式被供給有樹脂材料的多個樹脂收納部170並行地供給至小托盤41,因此可提高樹脂成形品的製造效率。In this way, in this embodiment, the container C can be moved to a plurality of positions (positions corresponding to the left and right resin storage portions 170) by the
另外,集塵機構180的運行在適當的時機開始及停止。即,集塵機構180間歇地進行集塵。由此,在進行集塵的同時,也可抑制由空調裝置200進行了調整的框體110內的溫度或濕度被打亂的情況。此處,使集塵機構180的運行停止的時機例如可基於利用蓋開封機構160將蓋C1安裝在樹脂供給後的容器C的時機進行控制,或基於將樹脂供給後的容器C回收至回收盒191內的時機進行控制,或基於利用感測器172a檢測到在儲料器172收納有規定量的樹脂材料進行控制。In addition, the operation of the
如上所述,本實施方式的樹脂供給機構100包括:
容器保管部120,保管收納有樹脂材料的容器C;
升降機構130,使所述容器保管部120中所保管的所述容器C上升至規定的上升位置;
蓋開封機構160,將位於所述上升位置的所述容器C的蓋C1開封;
橫向移動機構150,使由所述蓋開封機構160開封的所述容器C在橫向方向上移動,並使其移動至多個樹脂供給位置中的任一個位置;以及
旋轉機構140,藉由使位於所述樹脂供給位置的所述容器C旋轉,將所述容器C中所收納的樹脂材料排出。As described above, the
藉由如上所述那樣構成,可在多個位置供給樹脂材料。即,可利用橫向移動機構150使容器C移動至多個位置(樹脂供給位置),來供給樹脂材料。由此,可將樹脂材料供給至多個部位(在本實施方式中為多個樹脂收納部170),並行地進行同樣的製造步驟(在本實施方式中為樹脂材料向小托盤41的供給),進而可實現製造的效率化。By configuring as described above, the resin material can be supplied at a plurality of positions. That is, the
另外,樹脂供給機構100還包括:
多個樹脂收納部170,以與所述多個樹脂供給位置對應的方式配置,收納從所述容器C排出的樹脂材料。In addition, the
藉由如上所述那樣構成,可實現製造的效率化。即,可使用供給至多個樹脂收納部170的樹脂材料,並行地進行樹脂材料向小托盤41的供給。由此,推進樹脂成形品(基板P)的大型化,即使樹脂成形所需要的樹脂材料增加,也可抑制製造效率的劣化(實現製造效率的提高)。By configuring as described above, the efficiency of manufacturing can be achieved. That is, the resin material supplied to the plurality of
另外,樹脂供給機構100還包括:
容器回收部190,回收排出樹脂材料後的所述容器C。In addition, the
藉由如上所述那樣構成,可實現製造的效率化。即,不需要作業者每次都取出變空的容器C的作業,因此可實現製造的效率化。另外,如本實施方式那樣,藉由在框體110內設置容器回收部190,可抑制來自變空的容器C的塵埃等漏出至樹脂供給機構100的外部的情況。By configuring as described above, the efficiency of manufacturing can be achieved. In other words, there is no need for the operator to take out the empty container C every time, so that the efficiency of manufacturing can be achieved. In addition, as in the present embodiment, by providing the
另外,樹脂供給機構100還包括:
集塵機構180,進行所述容器C所移動的空間(框體110內)的集塵。In addition, the
藉由如上所述那樣構成,可抑制空氣或各部的污染。即,伴隨容器C的移動,容器C中所收納的樹脂材料的粉末等有可能飛散至框體110內。因此,藉由進行框體110內的集塵,可回收飛散的塵埃,從而抑制空氣或各部的污染。另外,伴隨於此,可抑制塵埃向框體110外部的流出,因此還可抑制框體110外部的空氣的污染。By configuring as described above, it is possible to suppress contamination of the air or each part. That is, along with the movement of the container C, the powder of the resin material contained in the container C may be scattered into the
另外,所述集塵機構180間歇地進行集塵。In addition, the
藉由如上所述那樣構成,在進行框體110內的集塵同時,也可抑制框體110內的溫度或濕度被打亂的情況。尤其是如本實施方式那樣,在利用空調裝置200進行框體110內的空調的情況下,可兼顧利用空調裝置200進行的框體110內的空調及利用集塵機構180進行的框體110內的集塵(框體110內的污染的抑制)。With the configuration as described above, it is possible to prevent the temperature or humidity in the
另外,所述集塵機構180基於利用所述橫向移動機構150使所述容器C移動開始的時機,開始集塵。In addition, the
藉由如上所述那樣構成,可有效地進行集塵。即,認為伴隨容器C的移動,樹脂材料的粉末等從容器C飛散的可能性高。因此,藉由伴隨容器C的移動開始使集塵機構180運行,可有效地進行集塵。By configuring as described above, dust can be collected efficiently. That is, it is considered that there is a high possibility that the powder of the resin material or the like will scatter from the container C along with the movement of the container C. Therefore, by starting the
另外,所述容器保管部120能夠在將所述容器C的長度方向面向橫向的狀態下,以上下重疊的方式保管多個容器。In addition, the
藉由如上所述那樣構成,可在少的面積保管更多的容器C。即,藉由將容器C上下重疊地保管,可抑制保管所需要的面積(前後及左右的寬度)。另外,藉由使容器C的長度方向面向橫向,可抑制將多個容器C堆疊時的高度,因此可保管更多的容器C。By configuring as described above, more containers C can be stored in a small area. That is, by stacking the container C up and down and storing it, it is possible to reduce the area required for storage (the width of the front and rear and the left and right). In addition, since the longitudinal direction of the container C faces the lateral direction, the height when stacking a plurality of containers C can be suppressed, and therefore more containers C can be stored.
另外,本實施方式的樹脂成形裝置1包括所述樹脂供給機構100。In addition, the
藉由如上所述那樣構成,可在多個位置供給樹脂材料,進而可實現製造的效率化。By configuring as described above, the resin material can be supplied to a plurality of positions, and the efficiency of manufacturing can be improved.
另外,本實施方式的樹脂成形品的製造方法使用所述樹脂成形裝置1來製造樹脂成形品。In addition, the method of manufacturing a resin molded product of the present embodiment uses the
藉由如上所述那樣構成,可在多個位置供給樹脂材料,進而可實現製造的效率化。By configuring as described above, the resin material can be supplied to a plurality of positions, and the efficiency of manufacturing can be improved.
以上,對本發明的實施方式進行了說明,但本發明並不限定於所述實施方式,能夠在權利要求書中所記載的發明的技術思想的範圍內進行適當的變更。The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and can be appropriately changed within the scope of the technical idea of the invention described in the claims.
例如,在本實施方式中,例示了壓縮方式的樹脂成形裝置1,但本發明並不限於此,也能夠採用其他方式(例如,將熔融的樹脂移送至模腔內並使其硬化的傳送方式等)。For example, in the present embodiment, a compression type
另外,本實施方式的樹脂成形裝置1所使用的結構元件(基板搬入搬出模塊10等)為一例,能夠適當地進行裝卸或更換。例如,也能夠不設置基板搬入搬出模塊10,作業者藉由手動進行基板P的搬入搬出。In addition, the structural elements (the substrate carry-in/out
另外,在本實施方式中,例示了矩形板狀的基板P,但本發明並不限於此,能夠使用其他各種形狀(例如,圓形板狀等)的基板P。In addition, in the present embodiment, a rectangular plate-shaped substrate P is exemplified, but the present invention is not limited to this, and substrates P of various other shapes (for example, a circular plate shape, etc.) can be used.
另外,在本實施方式中例示的各部的具體的結構(例如,用於利用旋轉機構140保持容器C並使其旋轉的結構、或用於利用橫向移動機構150使容器C向橫向方向移動的結構等)為一例,能夠進行任意變更。In addition, the specific structure of each part illustrated in this embodiment (for example, a structure for holding and rotating the container C by the
另外,在本實施方式中例示的容器C的形狀為一例,能夠使用其他各種形狀(例如,長方體狀等)的容器C。In addition, the shape of the container C illustrated in this embodiment is an example, and the container C of other various shapes (for example, a rectangular parallelepiped shape, etc.) can be used.
另外,在本實施方式中,示出了利用橫向移動機構150使容器C移動至兩個樹脂供給位置(兩個樹脂收納部170)的例子,但本發明並不限於此。即,也能夠設為如下結構:利用橫向移動機構150使容器C移動至三個以上的樹脂供給位置(即,設置三個以上的樹脂收納部170)。In addition, in this embodiment, an example is shown in which the container C is moved to two resin supply positions (two resin storage portions 170) by the
另外,在本實施方式中,示出了利用橫向移動機構150使容器C向單方向(左右方向)移動的例子,但本發明並不限於此。即,也能夠構成為利用橫向移動機構150使容器C向多個方向(例如,左右方向及前後方向)移動。In addition, in the present embodiment, an example in which the container C is moved in one direction (left and right direction) by the
另外,利用升降機構130使容器C移動的方向可未必是上下方向(鉛垂方向),例如也可為相對於鉛垂方向傾斜的方向。另外,利用橫向移動機構150使容器C移動的方向可未必是水平方向,例如也可為相對於水平方向傾斜的方向。In addition, the direction in which the container C is moved by the
另外,在本實施方式中,示出了利用集塵機構180間歇地進行集塵的例子,但本發明並不限於此,也能夠始終進行集塵。另外,在間歇地進行集塵的情況下,集塵機構180的運行的開始及停止的時機不限於本實施方式,可任意地設定。例如,可與利用容器保管部120、升降機構130、旋轉機構140及橫向移動機構150使容器C移動、或利用蓋開封機構160將容器C的蓋C1開閉、以及空調裝置200的運行等連動,設定集塵機構180的運行的開始及停止的時機。In addition, in the present embodiment, an example in which dust is collected intermittently by the
另外,在本實施方式中,示出了將集塵機構180的抽吸口182配置在樹脂收納部170的引導部171的左右的例子,但本發明並不限於此。即,抽吸口182能夠配置在任意的場所,能夠根據各部的結構從所需要的部位進行集塵。In addition, in this embodiment, the example in which the
另外,在本實施方式中,示出了空調裝置200調整框體110內的溫度及濕度的例子,但本發明並不限於此,也可僅調整溫度。In addition, in the present embodiment, an example in which the
1:樹脂成形裝置 10:基板搬入搬出模塊 11:搬入部 12:搬出部 13:檢查部 14:臂機構 14a:吸附手部 14b:臂部 14c:驅動部 20:基板交接模塊 21:裝載器 22:卸載器 30:成形模塊 31:成形模 40:樹脂供給模塊 41:小托盤 42:小托盤搬送機構 43:大托盤 44:大托盤搬送機構 50:控制部 100:樹脂供給機構 110:框體 120:容器保管部 121:側壁 122、192:傾斜面 123:下側止擋件 124:上側止擋件 130:升降機構 131:載置部 131a:凹部 132、151、La:導軌 133、152:移動部 134、141、153、161:馬達 140:旋轉機構 142:基底部 143、162:把持部 150:橫向移動機構 160:蓋開封機構 161a:輸出軸 163:升降缸 170:樹脂收納部 171:引導部 172:儲料器 172a:感測器 173:第一給料機 174:樹脂供給部 175:第二給料機 180:集塵機構 181、201:本體部 182:抽吸口 183、202:軟管 190:容器回收部 191:回收盒 200:空調裝置 B、D、F、L、R、U:箭頭 C:容器 C1:蓋 P:基板1: Resin molding device 10: The substrate is moved in and out of the module 11: Move in department 12: Moving out department 13: Inspection Department 14: Arm mechanism 14a: Attaching hands 14b: Arm 14c: Drive section 20: Substrate transfer module 21: Loader 22: Uninstaller 30: forming module 31: Forming die 40: Resin supply module 41: small tray 42: Small tray conveying mechanism 43: large tray 44: Large pallet transport mechanism 50: Control Department 100: Resin supply mechanism 110: Frame 120: Container Storage Department 121: sidewall 122, 192: Inclined surface 123: Lower stop 124: upper stop 130: Lifting mechanism 131: Placement Department 131a: recess 132, 151, La: rail 133, 152: Mobile Department 134, 141, 153, 161: Motor 140: Rotating mechanism 142: base part 143, 162: Control Department 150: lateral movement mechanism 160: cover opening mechanism 161a: output shaft 163: Lifting cylinder 170: Resin storage section 171: Guidance 172: Stocker 172a: sensor 173: The first feeder 174: Resin Supply Department 175: second feeder 180: Dust collection mechanism 181, 201: main body 182: Suction Port 183, 202: hose 190: Container Recycling Department 191: Recycle Box 200: Air conditioning unit B, D, F, L, R, U: Arrow C: container C1: cover P: substrate
圖1是表示本發明一實施方式的樹脂成形裝置的整體結構的平面示意圖。 圖2是表示本發明一實施方式的樹脂供給裝置的整體結構的主視圖。 圖3是表示樹脂供給裝置的右部的放大主視圖。 圖4的(a)~圖4的(d)是表示在容器保管部保管有容器的情形、及將容器搬出的情形的圖。 圖5的(a)是表示旋轉機構、橫向移動機構及蓋開封機構的放大主視圖。圖5的(b)是表示所述旋轉機構、橫向移動機構及蓋開封機構的放大右側視圖。 圖6是表示樹脂供給裝置的上部的放大主視圖。 圖7的(a)是表示樹脂收納部的放大右側視圖。圖7的(b)是表示向樹脂收納部供給樹脂材料的情形的放大右側視圖。 圖8的(a)是表示旋轉機構保持容器的情形的主視圖。圖8的(b)是表示旋轉機構使容器縱向旋轉的情形的右側視圖。圖8的(c)是表示蓋開封機構使容器的蓋旋轉的情形的右側視圖。圖8的(d)是表示從容器取下蓋的狀態的右側視圖。圖8的(e)是表示蓋開封機構將蓋安裝在容器的情形的右側視圖。圖8的(f)是表示旋轉機構使容器橫向旋轉的情形的右側視圖。 圖9是表示容器移動至右側的樹脂收納部的情形的放大主視圖。 圖10是表示將容器回收的情形的放大主視圖。 圖11是表示容器移動至左側的樹脂收納部的情形的放大主視圖。FIG. 1 is a schematic plan view showing the overall structure of a resin molding apparatus according to an embodiment of the present invention. Fig. 2 is a front view showing the overall structure of a resin supply device according to an embodiment of the present invention. Fig. 3 is an enlarged front view showing the right part of the resin supply device. Figs. 4(a) to 4(d) are diagrams showing a situation in which a container is stored in the container storage unit and a situation in which the container is carried out. Fig. 5 (a) is an enlarged front view showing the rotation mechanism, the lateral movement mechanism, and the lid opening mechanism. Fig. 5(b) is an enlarged right side view showing the rotation mechanism, the lateral movement mechanism, and the lid opening mechanism. Fig. 6 is an enlarged front view showing the upper part of the resin supply device. Fig. 7(a) is an enlarged right side view showing the resin storage portion. Fig. 7(b) is an enlarged right side view showing a state in which the resin material is supplied to the resin storage portion. Fig. 8(a) is a front view showing a state in which the rotating mechanism holds the container. Fig. 8(b) is a right side view showing a state where the rotating mechanism rotates the container in the longitudinal direction. Fig. 8(c) is a right side view showing a state where the lid unsealing mechanism rotates the lid of the container. Fig. 8(d) is a right side view showing a state where the cap is removed from the container. Fig. 8(e) is a right side view showing a state where the lid unsealing mechanism attaches the lid to the container. Fig. 8(f) is a right side view showing a state where the rotating mechanism rotates the container laterally. Fig. 9 is an enlarged front view showing a state in which the container moves to the resin storage portion on the right side. Fig. 10 is an enlarged front view showing how the container is recovered. Fig. 11 is an enlarged front view showing a state where the container is moved to the resin storage portion on the left side.
100:樹脂供給機構100: Resin supply mechanism
110:框體110: Frame
120:容器保管部120: Container Storage Department
121:側壁121: sidewall
124:上側止擋件124: upper stop
130:升降機構130: Lifting mechanism
131:載置部131: Placement Department
132、151:導軌132, 151: Rails
133、152:移動部133, 152: Mobile Department
153、161:馬達153, 161: Motor
140:旋轉機構140: Rotating mechanism
162:把持部162: Control Department
150:橫向移動機構150: lateral movement mechanism
160:蓋開封機構160: cover opening mechanism
161a:輸出軸161a: output shaft
170:樹脂收納部170: Resin storage section
171:引導部171: Guidance
172:儲料器172: Stocker
172a:感測器172a: sensor
173:第一給料機173: The first feeder
174:樹脂供給部174: Resin Supply Department
175:第二給料機175: second feeder
182:抽吸口182: Suction Port
D、L、R、U:箭頭D, L, R, U: Arrow
C:容器C: container
C1:蓋C1: cover
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-193160 | 2019-10-24 | ||
JP2019193160A JP6861776B1 (en) | 2019-10-24 | 2019-10-24 | Resin supply mechanism, resin molding equipment and manufacturing method of resin molded products |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202116518A true TW202116518A (en) | 2021-05-01 |
TWI800747B TWI800747B (en) | 2023-05-01 |
Family
ID=75520961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109127213A TWI800747B (en) | 2019-10-24 | 2020-08-11 | Resin supply mechanism, resin molding device, and method for manufacturing resin molded products |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6861776B1 (en) |
KR (1) | KR102436776B1 (en) |
CN (1) | CN112706342B (en) |
TW (1) | TWI800747B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7389928B1 (en) * | 2023-03-27 | 2023-11-30 | Towa株式会社 | Dust collector, resin molding equipment, and method for manufacturing resin molded products |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0618219B2 (en) * | 1988-09-27 | 1994-03-09 | 株式会社東芝 | Resin tablet supply device for resin encapsulation of semiconductor devices |
JP2693890B2 (en) * | 1991-11-15 | 1997-12-24 | 積水化成品工業株式会社 | Material supply equipment for injection molding machine |
KR0168326B1 (en) * | 1994-09-01 | 1999-01-15 | 스미요 가나이 | Excretion device assembled in patient bed |
JP3986052B2 (en) * | 2001-12-04 | 2007-10-03 | 住友重機械工業株式会社 | Resin sealing apparatus and method |
KR100455388B1 (en) * | 2002-05-28 | 2004-11-06 | 삼성전자주식회사 | Molding apparatus carrying out automatically mold release treatment on mold for molding semiconductor devices |
JP2010247429A (en) * | 2009-04-15 | 2010-11-04 | Apic Yamada Corp | Resin sealing apparatus and resin sealing method using the same |
KR101216241B1 (en) * | 2010-06-23 | 2012-12-28 | 세크론 주식회사 | Apparatus for supplying resin |
KR101350654B1 (en) * | 2012-10-31 | 2014-01-14 | 세메스 주식회사 | Apparatus for supplying resin |
JP6049597B2 (en) * | 2013-11-28 | 2016-12-21 | Towa株式会社 | Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus |
JP6438794B2 (en) * | 2015-02-17 | 2018-12-19 | アピックヤマダ株式会社 | Mold, resin molding apparatus and resin molding method |
JP2018043388A (en) * | 2016-09-13 | 2018-03-22 | 株式会社デンソー | Resin supply system |
CN206317284U (en) * | 2016-12-09 | 2017-07-11 | 广东盟信塑胶实业有限公司 | A kind of plastic pellet material adapting system |
CN207344918U (en) * | 2017-06-09 | 2018-05-11 | 北京万向新元科技股份有限公司 | A kind of novel environment friendly cools down bucket |
CN207432579U (en) * | 2017-08-03 | 2018-06-01 | 江苏馨德高分子材料股份有限公司 | A kind of production plastic products dust-extraction unit |
-
2019
- 2019-10-24 JP JP2019193160A patent/JP6861776B1/en active Active
-
2020
- 2020-08-11 TW TW109127213A patent/TWI800747B/en active
- 2020-08-11 CN CN202010799948.3A patent/CN112706342B/en active Active
- 2020-10-06 KR KR1020200128574A patent/KR102436776B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102436776B1 (en) | 2022-08-26 |
CN112706342A (en) | 2021-04-27 |
JP6861776B1 (en) | 2021-04-21 |
CN112706342B (en) | 2022-12-06 |
TWI800747B (en) | 2023-05-01 |
KR20210048989A (en) | 2021-05-04 |
JP2021068810A (en) | 2021-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI729625B (en) | Resin casting device | |
JP7444453B2 (en) | Resin sealing equipment and resin sealing method | |
JP2019145550A (en) | Resin mold device and resin mold method | |
JP2019145548A (en) | Resin mold device and resin mold method | |
CN206750205U (en) | Fully automatic battery packing machine | |
TW202116518A (en) | Resin supply mechanism, resin molding device, and method of manufacturing resin molded product wherein the resin supply mechanism can supply resin materials at a plurality of positions | |
CN204674956U (en) | Crystal oscillator automatic packaging machine | |
CN107756707B (en) | Resin molding apparatus and method for manufacturing resin molded product | |
CN102148171B (en) | Modular molding assembly for electronic devices | |
CN107914355B (en) | Resin material supply device and method, resin molding device, and resin molded product manufacturing method | |
JP2022155897A (en) | Resin-sealing device | |
CN100366414C (en) | Resin sealing molding device | |
CN112776241B (en) | Resin material supply device, resin molding device, and method for manufacturing molded article | |
CN110745282B (en) | Automatic box-loading equipment and process for immune cups | |
JPH11314748A (en) | Container stock type product transfer device with runner separator | |
TWI825473B (en) | Resin sealing device | |
CN218867051U (en) | Compression molding device | |
KR101350654B1 (en) | Apparatus for supplying resin | |
KR20100001193U (en) | Resin feeder | |
JP5359779B2 (en) | Resin tablet supply device and resin sealing device | |
JP4098560B2 (en) | Powder and material charging apparatus and charging method | |
KR20100070840A (en) | Apparatus for supplying epoxy molding compound | |
CN114194480A (en) | Automatic change product packaging equipment | |
CN110875210A (en) | processing device | |
JPH09309111A (en) | Resin mold device provided with loading-frame rotational moving mechanism |