TW202041121A - Electronic device housings with metal foam structures - Google Patents

Abstract

In one example, an electronic device may include a keyboard and a base housing to house the keyboard. The base housing may include a metal substrate, a non-metal layer, and a metal foam layer disposed between the metal substrate and the non-metal layer.

Description

Electronic device casing with metal foam structure

The invention relates to an electronic device casing with a metal foam structure.

In recent years, as portable electronic products have become lighter and smaller, metal housings with light weight and high robustness have become popular. Under this demand, the technology of combining metal shells with plastic components or carbon fiber components has become the focus of the industry. Composite materials can refer to materials made of two or more constituent materials with different physical properties.

According to an embodiment of the present invention, an electronic device is specifically proposed, which includes: a keyboard; and a base housing for accommodating the keyboard, wherein the base housing includes: a metal substrate; a non-metal layer; And a metal foam layer, which is arranged between the metal base and the non-metal layer.

Electronic devices, such as laptop computers, personal digital assistants, and the like, may be provided with keyboards, displays, internal electronic components, and the like. The keyboard can be installed in the base casing, and the display can be installed in the display casing that is rotatably, detachably or twistably connected to the base casings. These housings can also protect the internal electrical components of the electronic device. Moreover, the shells may include composite materials, such as metal-plastic composites or metal-carbon fiber composites. For example, a housing may include a plastic layer and a metal layer assembled together to achieve good communication and mechanical strength. In this example, an outer layer of the casing can be formed by a metal layer, which can be supported by an inner plastic layer. The external metal layer can provide the shell with abrasion resistance, stability and aesthetics.

The casing for the keyboard can be formed using different materials and assembly techniques. The shell can be formed by metal and plastic bonding technology to save cost and keep the device lighter. In some electronic devices, the housing can be formed by combining metal and plastic technology to allow wireless antenna signal transmission/reception. Due to the light weight requirement of the housing, the thickness of the housing (such as the top cover or the bottom cover of the keyboard case) may be reduced, but this weakens the rigidity of the housing. Moreover, the strength of the corner structure of such a housing may be restricted by the manufacturing process. In such cases, the corners of the electronic device housing may be easily damaged by impact such as falling.

Several examples described herein provide an electronic device housing, including a metal substrate (such as an aluminum substrate), a non-metallic layer (such as a plastic layer), and a metal attached between the metal substrate and the non-metallic layer Foam layer. The electronic device housing in which the metal foam layer is formed can be reduced in weight and thickness, and the strength of the electronic device housing can be enhanced. In addition, several examples described herein can provide a metal foam structure at the corner of the electronic device housing to enhance the strength at the corner.

In the following description, for explanatory purposes, several specific details are released to provide a thorough understanding of the technology of the case. However, it will be obvious to those who are familiar with this technique that the equipment, devices, and systems of this case can be implemented without these specific details. In the specification, "an example" or similar terms mean that a specific feature, structure, or characteristic described is included in at least the example as described, but not necessarily in other examples.

As shown in the drawing, FIG. 1A is an exploded view of an exemplary electronic device 100, and an exemplary base case 104 includes a metal foam layer 110. The exemplary electronic device 100 may include a portable laptop (or notebook) computer with a keyboard, a personal digital assistant, a tablet computer, a convertible device, or any other electronic device. The illustrated switchable device may refer to a device that can be "transformed" from a laptop mode to a tablet mode.

The electronic device 100 may include a keyboard 102. The illustrated keyboard 102 may include multiple keys for providing input to the electronic device 100. In addition, the electronic device 100 may include a base housing 104 for accommodating the keyboard 102. As shown in FIG. 1A, the base housing 104 may include a metal base 106. The exemplary metal matrix 106 may include aluminum, magnesium, lithium, zinc, titanium, aluminum alloy, magnesium alloy, lithium alloy, zinc alloy, titanium alloy, or any combination thereof. Furthermore, the base housing 104 may include a non-metal layer 108. The illustrated non-metal layer 108 may include plastic, carbon fiber composite, or a combination thereof.

In addition, the base housing 104 may include a metal foam layer 110 disposed between the metal base 106 and the non-metal layer 108. In an example, the metal foam layer 110 may include a closed-cell metallic foam, such as a closed-cell aluminum foam. Exemplary properties of closed-cell aluminum foams may include sufficient energy absorption, high stiffness-to-weight ratio, fire resistance, shock wave attenuation, sound and vibration suppression and absorption, and recycling potential. In other examples, the metal foam layer 110 may also include magnesium foam, titanium foam, or the like.

In some examples, the metal foam layer 110 may be incorporated into the base housing 104 during the molding operation. Components such as internal electrical components on printed circuits, mechanical components such as screws, components such as hollow pipes, components that facilitate the formation of electrical paths, and other structures can be embedded in the metal foam layer 110 and housed in the base housing 104 Within the gap between several layers.

FIG. 1B is an exploded view of the electronic device 100 of FIG. 1A with additional features drawn. For example, similarly named elements in FIG. 1B may be similar in structure and/or function to the elements described with reference to FIG. 1A. As shown in FIG. 1B, the base housing 104 may include a top cover 152 and a bottom cover 154. The top cover 152 may interface with the bottom cover 154 to form a sealed enclosure for electronic components such as integrated circuits, batteries, and the like. Also, the keyboard 102 can be installed on the top cover 152. For example, the keyboard 102 may be disposed in the base housing 104, and a plurality of keys extend through the openings of the top cover 152.

In the example shown in FIG. 1B, the metal foam layer 110 may be disposed between the metal base 106 and the non-metal layer 108 of the bottom cover 154. However, the examples described herein can also be shown in the top cover 152, so that the top cover 152 may include a metal base, a non-metal layer, and a metal foam layer disposed between the metal base and the non-metal layer. Therefore, the metal foam layer 110 described herein may now be shown as part of the top cover 152, the bottom cover 154, or a combination thereof.

In some examples, manufacturing techniques, such as machining, forging, cutting, molding, injection molding, lamination, and other manufacturing techniques, can be used to utilize layered bodies (such as metal foam layer 110, metal base 106, and non-metal layer 108) The base housing 104 is formed. In this example, a sandwich structure can be formed in which the layers are attached to each other to form the base housing 104 (such as the top cover 152 or the bottom cover 154).

Therefore, the several examples described herein can provide a type of thin, rigid, and lightweight structure that can be used to support a flat housing. By forming the composite material sandwich body including the metal foam layer 110, the thickness and weight can be reduced, the rigidity can be enhanced, and internal structures such as embedded components can be accommodated.

FIG. 2 is an exploded view of an exemplary electronic device 200, which depicts a keyboard housing 206 including a metal foam layer 212. The electronic device 200 may include a display housing 202 to accommodate a display 204. The exemplified display 204 may be a liquid crystal display, an organic light emitting diode display, a plasma display, an electrophoretic display, a touch-insensitive display, a touch-sensitive display, or may be any other type of suitable display. Also, the electronic device 200 may include a keyboard housing 206 coupled to the display housing 202. The illustrated keyboard housing 206 may include components such as a keyboard, a mouse pad, and the like. In an example, the keyboard housing 206 is rotatably, detachably or twistably connected to the display housing 202.

In an example, the keyboard housing 206 may include a metal base 208 and a plastic layer 210. In addition, the keyboard shell 206 may include a metal foam layer 212, which has a first surface and a second surface opposite to the first surface. In addition, the keyboard housing 206 may include a first attachment layer 214 for fixing the first surface of the metal foam layer 212 to the metal base 208, and a second surface for fixing the second surface of the metal foam layer 212 to the plastic layer 210. The second attachment layer 216. An example keyboard shell 206 with a metal foam layer 212 sandwiched between the metal base 208 and the plastic layer 210 is shown in FIG. 3.

FIG. 3 is a cross-sectional side view showing a sandwich structure of a keyboard shell 206 of FIG. 2. For example, similarly named elements in FIG. 3 may be similar in structure and/or function to the elements described with reference to FIG. 2. As shown in FIG. 3, the keyboard housing 206 may include a metal foam layer 212 sandwiched between the metal base 208 and the plastic layer 210 by using each of the first attachment layer 214 and the second attachment layer 216 . The illustrated first attachment layer 214 and second attachment layer 216 may include pressure sensitive attachments, liquid attachments, or the like. In other examples, the metal foam layer 212, the metal base 208, and the plastic layer 210 can also be attached to each other by fixing members, such as screws, joint shapes (such as clamps and springs, etc.), magnets or other suitable ones. Attachment mechanism.

In the example shown in FIG. 3, an outer layer of the keyboard housing 206 may be formed by a metal base 208, which may be supported by an inner plastic layer 210 and a metal foam layer 212 in the middle. The metal base 208 may have a thickness in the range of about 0.3 mm to 1.2 mm. The plastic layer 210 may have a thickness in the range of about 0.5 mm to 1.0 mm. The metal foam layer 212 may have a thickness in the range of about 0.2 mm to 0.5 mm. Also, the first attachment layer 214 may have a thickness in the range of about 0.03 mm to 0.05 mm, and the second attachment layer 216 may have a thickness in the range of about 0.05 mm to 0.1 mm. In one example, compared to the electronic device housing with a metal-plastic composite material, the housing with a metal-plastic composite composite metal foam layer described herein can reduce the thickness and weight, and enhance the electronic device strength.

FIG. 4A is a schematic diagram of an exemplary electronic device housing 400, which depicts a metal foam structure 408 disposed at a corner area 410 of a metal base 404. For example, the electronic device housing 400 may be a housing for an electronic device such as an e-book reader, mobile phone, personal digital assistant (PDA), portable media player, laptop Computers, tablet computers, lightweight laptops, or similar. The example described in FIG. 4A can be shown as a display housing that houses a display, a base housing that houses a keyboard, or any other part of a housing that houses and protects several internal electronic components.

The electronic device housing 400 may include a composite structure 402. In an example, the composite structure 402 may include a metal base 404 having a corner location 410 defined by two adjacent sidewalls 414 and 416 of the metal base 404. The illustrated corner location 410 may have a sharp or rounded corner. In addition, the composite structure 402 may include a plastic layer 406 disposed on the metal substrate 404. In an example, the metal base 404 may be an outer layer of the electronic device housing 400, and the plastic layer 406 may be an inner layer of the electronic device housing 400. In an example, the plastic layer 406 can cover at least a portion of an inner surface of the metal base 404.

Furthermore, the metal base 404 can be used as a heat sink and a ground plane of the electronic device housing 400 (for example, a display housing). The non-metallic layer (such as the plastic layer 406) in the electronic device housing 400 may be formed of a molded composite material, and may have an integrated topography such as a groove. These grooves can be assembled to accommodate electrical components and other device structures. The use of the composite structure 402 of the electronic device housing 400 can facilitate the electronic device housing 400 to have rigidity, strength, and the ability to provide grooves and other desired shapes.

Furthermore, the electronic device housing 400 may include a metal foam structure 408 disposed at the corner area 410 of the metal base 404. In an example, the metal foam structure 408 can be attached to the metal base 404 or the plastic layer 406 at the inside of the electronic device housing 400, so that the metal foam structure 408 can physically contact two adjacent ones at the corner position 410 The side walls 414 and 416. In other examples, four foamed structures can be arranged at the four corners of the metal base 404.

4B is a cross-sectional side view illustrating a portion 412 of the electronic device housing 400 (for example, along X-X shown in FIG. 4A), which depicts a metal foam layer 452 and an attachment member 454. As shown in FIG. 4B, the composite structure 402 may include a metal foam layer 452 disposed between the metal base 404 and the plastic layer 406. In other examples, the composite structure 402 can be formed by directly attaching the metal base 404 and the plastic layer 406 to an inner surface of the metal base 404.

Furthermore, the electronic device housing 400 may include an attachment 454 for fixing the metal foam structure 408 to the metal base 404, so that the metal foam structure 408 can physically contact two adjacent side walls 414 at the corner position 410 And 416. The metal foam structure 408 may have a thickness less than or equal to the height of the side wall 414 or 416. In some examples, mechanical structures, such as screws, hubs, other mechanical fasteners, mounting brackets, or the like, may be provided in the metal foam structure 408.

4C is an exemplary schematic diagram of the portion 412 of the electronic device housing 400 shown in FIG. 4A, which depicts the metal foam structure 408 fixed to the plastic layer 406 at the corner area 410 of the metal base 404. 4D is another schematic diagram of the portion 412 of the electronic device housing 400 shown in FIG. 4A, which depicts the metal foam structure 408 fixed on a surface of the metal base 404. In this example, the plastic layer 406 may include an open groove 456 (ie, uncovered area) at the corner location 410, so that the metal foam structure 408 can be fixed on the surface of the metal base 404 through the open groove 456.

In this way, this case discloses a metal-plastic composite shell or a metal-carbon fiber composite shell, in which a metal foam layer can be attached to reduce weight and thickness, and enhance the strength of the shell. Moreover, this case discloses a metal-plastic composite shell or a metal-carbon fiber composite shell, in which the metal foam structure can be installed at the corner of the shell to increase the strength of the corner.

The foregoing describes a metal-plastic composite shell or a metal-carbon fiber composite shell with a metallic luster on the peripheral edge surface. Although the content of the above application is shown and described with reference to the aforementioned examples, it should be understood that other forms, details and implementation modes can be made without departing from the spirit and scope of this application.

100,200: electronic device 102: keyboard 104: base shell 106,208,404: metal matrix 108: Non-metallic layer 110,212,452: metal foam layer 152: top cover 154: bottom cover 202: display housing 204: display 206: keyboard shell 210,406: Plastic layer 214: The first attachment layer 216: second attachment layer 400: Electronic device housing 402: composite structure 408: Metal foam structure 410: corner location 414,416: sidewall

Several examples are described below with reference to the accompanying drawings, in which:

1A is an exploded view of an exemplary electronic device, which depicts an exemplary base housing including a metal foam layer;

FIG. 1B is an exploded view of the exemplary electronic device of FIG. 1A with additional features drawn;

2 is an exploded view of an exemplary electronic device, which depicts a keyboard housing including a metal foam layer;

FIG. 3 is a cross-sectional side view showing a sandwich structure of a keyboard housing of FIG. 2;

4A is a schematic diagram illustrating an electronic device casing, which depicts a metal foam structure disposed at a corner of a metal substrate;

4B is a cross-sectional side view of a part of the electronic device housing of FIG. 4A, which depicts a metal foam layer and an attachment;

4C is an exemplary schematic diagram of the part of the electronic device housing of FIG. 4A, which depicts the metal foam structure fixed to a plastic layer at the corner area of the metal base; and

FIG. 4D is another schematic diagram of the part of the electronic device housing of FIG. 4A, which depicts the metal foam structure fixed on a surface of the metal substrate.

100: electronic device

102: keyboard

104: base shell

106: Metal matrix

108: Non-metallic layer

110: Metal foam layer

Claims (15)

An electronic device comprising: A keyboard; and A base shell for accommodating the keyboard, wherein the base shell includes: A metal matrix; A non-metallic layer; and A metal foam layer is arranged between the metal base and the non-metal layer. The electronic device according to claim 1, wherein the metal matrix comprises aluminum, magnesium, lithium, zinc, titanium, aluminum alloy, magnesium alloy, lithium alloy, zinc alloy, titanium alloy or any combination thereof. The electronic device according to claim 1, wherein the non-metallic layer comprises plastic, carbon fiber composite, or a combination thereof. The electronic device according to claim 1, wherein the metal foam layer includes a closed-cell aluminum foam. An electronic device comprising: A display housing for accommodating a display; and A keyboard housing coupled to the display housing, wherein the keyboard housing includes: A metal matrix; A plastic layer A metal foam layer having a first surface and a second surface opposite to the first surface; A first attachment layer for fixing the first surface of the metal foam layer to the metal base; and A second attachment layer for fixing the second surface of the metal foam layer to the plastic layer. The electronic device according to claim 5, wherein the metal base has a thickness in the range of 0.3 mm to 1.2 mm. The electronic device according to claim 5, wherein the plastic layer has a thickness in the range of 0.5 mm to 1.0 mm. The electronic device according to claim 5, wherein the metal foam layer has a thickness in the range of 0.2 mm to 0.5 mm. The electronic device according to claim 5, wherein the first attachment layer has a thickness in a range of 0.03 mm to 0.05 mm. The electronic device according to claim 5, wherein the second attachment layer has a thickness in the range of 0.05 mm to 0.1 mm. An electronic device comprising: A composite structure, wherein the composite structure includes: A metal base, which includes a corner location defined by two adjacent side walls of the metal base; and A plastic layer arranged on the metal substrate; and A metal foam structure is arranged at the corner area of the metal base. The electronic device according to claim 11, further comprising: An attachment member is used to fix the metal foam structure to the metal base, so that the metal foam structure physically contacts the two adjacent side walls at the corner area. The electronic device according to claim 11, wherein the metal foam structure is fixed to the plastic layer at the corner area. The electronic device according to claim 11, wherein the plastic layer includes an open groove at the corner area, so that the metal foam structure is fixed on a surface of the metal substrate through the open groove. The electronic device according to claim 11, wherein the composite structure further comprises: A metal foam layer is arranged between the metal base and the plastic layer.

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