TW202039099A - Coating device capable of reducing the setting work of nozzle position information during a coating operation - Google Patents
Coating device capable of reducing the setting work of nozzle position information during a coating operation Download PDFInfo
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- TW202039099A TW202039099A TW109109079A TW109109079A TW202039099A TW 202039099 A TW202039099 A TW 202039099A TW 109109079 A TW109109079 A TW 109109079A TW 109109079 A TW109109079 A TW 109109079A TW 202039099 A TW202039099 A TW 202039099A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
- B05B12/124—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus responsive to distance between spray apparatus and target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- Coating Apparatus (AREA)
- Manipulator (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
本發明是有關於一種對基板等工件進行塗佈材料的塗佈的塗佈裝置。The invention relates to a coating device for coating a substrate and other workpieces with coating materials.
從以前以來,對基板等工件塗佈液體或粉體等塗佈材料的塗佈裝置已為人所知。在塗佈裝置中,噴嘴對工件的規定的部位噴出規定量的塗佈材料,由此塗佈塗佈材料。在塗佈裝置中,進行使噴嘴呈線狀地移動來呈線狀地塗佈塗佈材料的線塗佈、或使噴嘴不動而將塗佈材料塗佈在一點上的點塗佈。A coating device for applying a coating material such as a liquid or powder to a workpiece such as a substrate has been known for a long time. In the coating device, the nozzle sprays a predetermined amount of coating material to a predetermined portion of the workpiece, thereby coating the coating material. In the coating device, linear coating in which the nozzle is moved linearly to apply the coating material in a linear shape, or spot coating in which the nozzle is not moved to apply the coating material to one point is performed.
在點塗佈中,在噴嘴已在想要實施塗佈的部位停止的狀態下進行塗佈作業,因此在塗佈作業時只要決定一個塗佈部位的位置坐標即可。相對於此,在線塗佈中,設想使噴嘴相對於工件進行移動的線,將所述線的開始點與結束點連接來進行塗佈作業。因此,在進行線塗佈的情況下,必須至少決定工件的塗佈作業的開始點與結束點這兩個位置坐標。In spot coating, the coating operation is performed in a state where the nozzle has stopped at the site where the application is to be applied. Therefore, it is only necessary to determine the position coordinates of one application site during the coating operation. In contrast, in the in-line coating, a line that moves the nozzle relative to the workpiece is assumed, and the start point and the end point of the line are connected to perform the coating operation. Therefore, in the case of line coating, it is necessary to determine at least two position coordinates of the start point and the end point of the workpiece coating operation.
另外,在通過線塗佈來對寬廣的區域進行塗佈的情況下,例如相對於工件使噴嘴Z字形地移動,以來自呈線狀地移動的噴嘴的塗佈材料包覆區域整體的方式進行塗佈作業。因此,必須設定多個噴嘴移動時的經過點,並決定各經過點的位置信息。In addition, when coating a wide area by line coating, for example, the nozzle is moved in a zigzag manner with respect to the workpiece, and the coating material from the nozzle that moves linearly covers the entire area. Coating operation. Therefore, it is necessary to set the passing points when a plurality of nozzles move, and determine the position information of each passing point.
在塗佈裝置進行塗佈作業的情況下,通常並非僅使噴嘴移動,也使工件移動,由此使噴嘴與工件相對地移動。即,“噴嘴與工件的相對移動”也包括噴嘴不移動而僅工件移動的情況。但是,關於“噴嘴與工件的相對移動”這一記載,為了避免複雜,在本說明書中,將僅噴嘴移動的情況、僅工件移動的情況、噴嘴與工件均移動的情況記載為“噴嘴的相對移動”或僅記載為“噴嘴的移動”。When a coating device performs a coating operation, generally, not only the nozzle is moved, but the workpiece is also moved, thereby moving the nozzle and the workpiece relatively. That is, the “relative movement of the nozzle and the workpiece” also includes the case where the nozzle does not move but only the workpiece moves. However, regarding the description of "relative movement of the nozzle and the workpiece", in order to avoid complexity, in this specification, the case where only the nozzle moves, the case where only the workpiece moves, and the case where both the nozzle and the workpiece move are described as "relative nozzle movement". "Movement" or simply "Nozzle movement".
[現有技術文獻] [專利文獻] [專利文獻1] 日本專利特開2002-066965號公報[Prior Art Literature] [Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2002-066965
[發明所要解決的問題] 如上所述,在塗佈裝置進行塗佈作業的情況下,必須設定噴嘴的位置信息。其中,在對具有某種程度的寬度的區域進行線塗佈的情況下,必須對多個經過點設定位置信息。因此,在塗佈裝置中,設定噴嘴的位置信息的作業變得麻煩的情況多。因此,從以前以來,要求設定噴嘴的位置信息的作業的減輕化。[The problem to be solved by the invention] As described above, when the coating device performs coating work, it is necessary to set the position information of the nozzle. However, in the case of applying line coating to an area having a certain width, it is necessary to set position information for a plurality of passing points. Therefore, in the coating apparatus, the task of setting the position information of the nozzle is often troublesome. Therefore, it has been required to reduce the work of setting nozzle position information.
本發明為了解決所述問題而提出,其目的在於提供一種塗佈裝置,謀求塗佈作業時的噴嘴的位置信息的設定作業的減輕化。The present invention is proposed in order to solve the above-mentioned problems, and its object is to provide a coating device that reduces the setting work of nozzle position information during coating work.
[解決問題的技術手段] 為了實現以上的目的,本發明在如下的塗佈裝置中,包括以下的構成元件,所述塗佈裝置具有:收容有塗佈材料的收容容器與朝工件噴出所述塗佈材料的噴嘴,並將所述塗佈材料從所述收容容器供給至所述噴嘴。 (1)塗佈量存儲部,存儲塗佈在工件的塗佈量。 (2)移動控制部,從開始塗佈的點進行塗佈,在到達已由所述塗佈量存儲部存儲的塗佈量之前控制所述噴嘴與所述工件的相對移動。[Technical means to solve the problem] In order to achieve the above objects, the present invention includes the following constituent elements in a coating device having: a container containing a coating material and a nozzle that sprays the coating material toward a workpiece, and The coating material is supplied from the storage container to the nozzle. (1) The coating amount storage unit stores the coating amount applied to the workpiece. (2) The movement control unit performs coating from the point where coating is started, and controls the relative movement of the nozzle and the workpiece before reaching the coating amount stored in the coating amount storage unit.
本發明也可以包括塗佈區域設定部,將所述工件的任意的區域作為塗佈區域來設定;所述移動控制部以所述噴嘴朝已由所述塗佈區域設定部設定的塗佈區域噴出所述塗佈材料的方式,來控制所述噴嘴與所述工件的相對移動。The present invention may also include a coating area setting unit that sets an arbitrary area of the workpiece as a coating area; the movement control unit uses the nozzle to face the coating area that has been set by the coating area setting unit The method of spraying the coating material controls the relative movement of the nozzle and the workpiece.
所述移動控制部也可以將已由所述塗佈量存儲部存儲的塗佈量,換算成所塗佈的塗佈材料的長度。另外,所述移動控制部也可以控制包含所述噴嘴的上下方向在內的所述噴嘴與所述工件的相對移動。The movement control unit may convert the coating amount stored in the coating amount storage unit into the length of the coating material to be coated. In addition, the movement control unit may control relative movement of the nozzle and the workpiece including the vertical direction of the nozzle.
[發明的效果] 根據本發明,移動控制部基於塗佈量來控制噴嘴的相對移動,因此可在到達塗佈量之前使噴嘴的相對移動繼續來進行塗佈作業。因此,可僅進行塗佈作業的開始點或圓的範圍等與噴嘴的位置信息相關的必要最低限度的設定,其後基於塗佈量來實施塗佈作業,而減輕塗佈作業時的噴嘴的位置信息的設定的工夫。另外,由於規定了塗佈量,因此不會產生無用的塗佈材料,在環境及經濟方面優異。[Effects of the invention] According to the present invention, the movement control unit controls the relative movement of the nozzle based on the coating amount. Therefore, the relative movement of the nozzle can be continued to perform the coating operation before the coating amount is reached. Therefore, only the minimum necessary settings related to nozzle position information, such as the start point of the coating operation or the range of the circle, can be performed, and then the coating operation can be performed based on the coating amount, thereby reducing the nozzle burden during the coating operation. Time for setting location information. In addition, since the coating amount is specified, useless coating materials are not generated, which is excellent in terms of environment and economy.
(第一實施方式)
(構成)
以下,參照圖1~圖2對本發明的第一實施方式的構成進行具體說明。圖1是第一實施方式的正面圖。如圖1所示,在塗佈裝置1設置有塗佈材料4的收容容器2、及朝工件w噴出塗佈材料4的噴嘴3。塗佈材料4由從噴嘴3中噴出的虛線表示,但也被收容在收容容器2內。塗佈材料4包含液體或粉體等,具體而言,有焊料或藥液等。在塗佈裝置1中,通過控制步進馬達(未圖示)來從收容容器2朝噴嘴3供給塗佈材料4,噴嘴3朝工件w的規定部位噴出塗佈材料4,由此將塗佈材料4塗佈在工件w。(First Embodiment)
(constitute)
Hereinafter, the configuration of the first embodiment of the present invention will be specifically described with reference to FIGS. 1 to 2. Fig. 1 is a front view of the first embodiment. As shown in FIG. 1, the
在塗佈裝置1設置有塗佈作業用的平台21。在平台21立設有支柱22。在支柱22的中間,安裝有在與支柱22正交的方向上水平地延長的兩根臂23。長方體狀的Y軸方向移動體24沿著臂23滑動自如地安裝在臂23。The
Y軸方向移動體24通過未圖示的脈衝馬達的動力而在Y軸方向(圖1的左右方向)上移動。在圖1中,移動後的Y軸方向移動體24由雙點劃線表示。在平台21,為了進行工件w的相對移動,除Y軸方向移動體24以外,設置有保持部25及滑動平台26。The Y-axis
保持部25設置在Y軸方向移動體24的下部,在Z軸方向(圖1的上下方向)上移動自如地構成。在保持部25保持噴嘴3。保持部25伴隨Y軸方向移動體24的移動而在Y軸方向上移動,並且受到脈衝馬達(未圖示)的動力而在Z軸方向上移動。另外,也可以在保持部25設置使噴嘴3旋轉的θ軸移動體。The
在平台21的上表面配置有滑動平台26。在滑動平台26的上表面載置工件w。滑動平台26可在X軸方向(相對於圖1的紙面垂直的方向)上移動地設置在平台21上,以受到未圖示的脈衝馬達的動力而在X軸方向上移動的方式構成。A
在第一實施方式中,在塗佈裝置1中包括所述平台21、支柱22、臂23、Y軸方向移動體24、保持部25、滑動平台26的各構成元件,但也可以將所述各構成元件作為多關節型等的機器人的構成元件來理解,而將塗佈裝置1設為與機器人連接的裝置。In the first embodiment, the
在塗佈裝置1組裝入控制部10。控制部10是以微型電腦為主體來構成的中央處理器(Central Processing Unit,CPU)。控制部10是進行塗佈裝置1的輸入操作、顯示、存儲、馬達驅動、信號輸入/輸出等與塗佈作業相關的控制指令的輸出的處理部。The
如圖2所示,控制部10與操作部13及顯示部14連接。操作部13是鍵盤等輸入裝置或用於教導的硬件機構、軟件機構等。操作部13通過作業者的操作來輸入各種數據,例如塗佈材料4的塗佈量A或噴出速度V1、噴嘴3的相對的移動速度(以下,也稱為噴嘴3的移動速度)V2等。顯示部14是顯示利用操作部13的輸入狀態等的液晶顯示器(Liquid Crystal Display,LCD)顯示裝置。As shown in FIG. 2, the
在控制部10設置有三個存儲部與兩個設定部。三個存儲部是塗佈材料4的塗佈量存儲部11、塗佈材料4的噴出速度存儲部16、以及噴嘴3的移動速度存儲部17。塗佈量存儲部11是存儲塗佈在工件w的塗佈量A的存儲部。另外,所述“塗佈量”可以是體積,也可以是重量。噴出速度存儲部16是存儲利用噴嘴3的塗佈材料4的噴出速度V1的存儲部。The
移動速度存儲部17是存儲噴嘴3的移動速度V2的存儲部。噴嘴3的移動速度V2可以在噴嘴3移動的總行程中設為固定值,也能夠以在各規定的重點區間內變化的方式設定。存儲在所述各存儲部11、存儲部16及存儲部17的信息通過作業者經由操作部13來輸入而事先存儲在各存儲部11、存儲部16及存儲部17。The moving
控制部10的兩個設定部是塗佈區域設定部15及開始點設定部18。塗佈區域設定部15是將工件w的任意的區域作為塗佈區域E來設定的部分。塗佈區域E是通過從噴嘴3中的塗佈材料4的噴出而被塗佈塗佈材料4的區域。由塗佈區域設定部15所設定的塗佈區域E的形狀可以是包含圓形狀在內的橢圓形狀,也可以是線形狀或螺旋狀等。The two setting units of the
開始點設定部18是將工件w的塗佈作業的開始點S的位置坐標作為X坐標、Y坐標、Z坐標來設定的部分。由所述設定部15及設定部18所設定的信息通過作業者經由操作部13來輸入而設定在各設定部15、設定部18。The start
進而,在控制部10組裝入移動控制部12。移動控制部12與所述三個存儲部11、16、17及兩個設定部15、18連接,取入經存儲的信息或經設定的信息。移動控制部12與滑動平台26、Y軸方向移動體24及保持部25的各脈衝馬達(未圖示)連接。Furthermore, the
移動控制部12是根據已由塗佈量存儲部11存儲的塗佈量A來控制噴嘴3的相對移動的部分。移動控制部12生成X軸、Y軸、Z軸的各方向上的移動控制指令Cx、移動控制指令Cy、移動控制指令Cz,並將這些移動控制指令分別輸出至滑動平台26、Y軸方向移動體24及保持部25的各脈衝馬達(未圖示),由此控制噴嘴3的相對移動。The
移動控制部12以噴嘴3從開始點S起開始塗佈材料4的噴出,且噴嘴3朝塗佈區域E噴出塗佈材料4的方式,控制噴嘴3的相對移動。因此,噴出塗佈材料4的噴嘴3通過移動控制部12的控制,從開始點S起描繪塗佈區域E。The
另外,在移動控制部12中,根據塗佈材料4的噴出速度V1與噴嘴3的移動速度V2,將已由塗佈量存儲部11存儲的塗佈量A換算成從噴嘴3中噴出的塗佈材料4的長度L。移動控制部12根據塗佈區域E、開始點S、及塗佈材料4的長度L,控制噴嘴3的相對移動。移動控制部12也可以將經換算的塗佈材料4的長度L輸出至塗佈區域設定部15。In addition, the
在移動控制部12中,以如下方式換算塗佈材料4的長度L。例如,作為塗佈量A,給予1.23ml,將塗佈材料4的噴出速度V1設定為2ml/s,將噴嘴3的移動速度V2設定為10mm/s。當在所述條件下進行線塗佈時,每單位距離的塗佈材料4的流量變成
2ml/s÷10mm/s=0.2ml/mm。
據此,為了塗佈所給予的塗佈量A而需要的塗佈材料4的長度L變成
1.23ml÷0.2ml/mm=6.15mm。In the
(作用)
在具有以上的構成的第一實施方式中,移動控制部12分別
(1)從塗佈量存儲部11取入塗佈量A,
(2)從噴出速度存儲部16取入塗佈材料4的噴出速度V1,
(3)從移動速度存儲部17取入噴嘴3的移動速度V2,
(4)從塗佈區域設定部15取入塗佈區域E,
(5)從開始點設定部18取入塗佈作業的開始點S。移動控制部12根據塗佈量A來生成噴嘴3的移動控制指令Cx、移動控制指令Cy、移動控制指令Cz,並將各指令Cx、指令Cy、指令Cz輸出至滑動平台26、Y軸方向移動體24及保持部25的各脈衝馬達。(effect)
In the first embodiment having the above configuration, the
若滑動平台26、Y軸方向移動體24及保持部25的各脈衝馬達接收噴嘴3的移動控制指令Cx、移動控制指令Cy、移動控制指令Cz,則各脈衝馬達按照各指令Cx、指令Cy、指令Cz來運行。因此,滑動平台26在X軸方向上移動,Y軸方向移動體24在Y軸方向上移動,保持部25在Z軸方向上移動。由此,已由保持部25保持的噴嘴3與滑動平台26上的工件w相對於X軸、Y軸、Z軸這三方向相對地移動。If each pulse motor of the sliding
在如以上那樣的第一實施方式中,通過包括塗佈量存儲部11及移動控制部12,僅根據塗佈材料4的塗佈量A便可控制噴嘴3的相對移動,所述塗佈量存儲部11存儲塗佈在工件w的塗佈材料4的塗佈量A,所述移動控制部12從塗佈作業的開始點S進行塗佈,在到達已由塗佈量存儲部11存儲的塗佈量A之前控制噴嘴3與工件w的相對移動。因此,在第一實施方式中,只要決定塗佈材料4的塗佈量A,便可在從噴嘴3中噴出的塗佈材料4到達塗佈量A之前,即只要塗佈量A夠用,使噴嘴3的相對移動繼續來實施塗佈作業。In the first embodiment as described above, by including the coating
(位置信息設定作業的減輕化) 根據第一實施方式,只要設定塗佈作業的開始點S等必要最低限度的位置信息即可。其結果,在第一實施方式中,可減輕塗佈作業時的位置信息的設定的工夫。(Reduction of location information setting work) According to the first embodiment, it is sufficient to set minimum necessary position information such as the start point S of the coating operation. As a result, in the first embodiment, it is possible to reduce the time and effort of setting the position information during the coating operation.
此外,在針對工件w的塗佈作業時,即便被塗佈塗佈材料4的地方已改變,只要工件w的大小本身不改變,則連塗佈材料4的塗佈量A或塗佈區域E的形狀等都變更的情況也少。在第一實施方式中,由於設置了開始點設定部18,因此容易設定作為必要最低限度的位置信息的塗佈作業的開始點S。因此,在第一實施方式中,即便在工件w上塗佈塗佈材料4的地方已變更,僅通過開始點設定部18來進行塗佈作業的開始點S的位置信息的設定變更,便也可以立即對應所述變更,可有助於作業效率的提升。In addition, during the coating operation for the workpiece w, even if the area where the
(線塗佈的效果)
從利用現有的塗佈裝置的線塗佈的觀點對以上所述的位置信息的設定作業的減輕化進行說明。在現有的塗佈裝置中,當進行呈線狀地塗佈塗佈材料4的線塗佈時,必須至少對開始點與結束點這兩點逐一設定位置信息。另外,在通過線塗佈來全面塗抹寬廣的區域的情況下,必須與進行塗佈作業的區域的面積成比例地對多個經過點設定位置信息。其結果,如上所述,位置信息的設定作業變得非常麻煩。(The effect of line coating)
The reduction of the above-mentioned setting work of position information will be described from the viewpoint of line coating using the existing coating device. In the conventional coating apparatus, when performing line coating in which the
相對於此,在第一實施方式的塗佈裝置1進行線塗佈的情況下,塗佈區域設定部15設定工件w的線形狀的塗佈區域E。另外,開始點設定部18設定塗佈作業的開始點S,移動控制部12使噴嘴3的移動從開始點S開始,以將塗佈材料4塗佈在塗佈區域E。On the other hand, when the
此時,先另外進行塗佈量存儲部11的塗佈材料4的塗佈量A的存儲、及塗佈區域設定部15的塗佈區域E的形狀設定。在此情況下,在第一實施方式中,只要通過開始點設定部18來設定開始點S的位置信息即可,可在從噴嘴3中的塗佈材料4的噴出量已到達塗佈量A的時間點,使利用移動控制部12的噴嘴4的相對移動停止,而結束塗佈作業。At this time, the storage of the coating amount A of the
即,在第一實施方式中,即便不先決定噴嘴3的線移動的結束點,只要通過開始點設定部18來僅設定開始點S的位置信息,便也可以實施塗佈作業。因此,根據第一實施方式,不需要在現有的線塗佈中不可缺少的結束點的位置信息的設定。That is, in the first embodiment, even if the end point of the line movement of the
因此,即便與現有的線塗佈中最簡單的位置信息的設定(開始點與結束點的位置信息的設定)相比,也可以使設定作業的工作量減半,可實現塗佈作業的效率化。另外,即便在通過線塗佈來全面塗抹寬廣的區域的情況下,在第一實施方式中,只要先將塗佈區域設定部15的塗佈區域E設定為所期望的形狀即可。因此,與通過現有的線塗佈來全面塗抹寬廣的區域的情況不同,無需設定作為經過點的多個位置信息,可大幅度地簡化位置信息的設定作業。Therefore, even if compared with the simplest setting of position information in the existing line coating (setting of the position information of the start point and the end point), the workload of the setting work can be halved, and the efficiency of the coating work can be realized化. In addition, even in the case where a wide area is applied to the entire surface by line coating, in the first embodiment, the application area E of the application
(全面塗抹的效果) 使用圖3對全面塗抹無論是矩形,還是圓形的寬廣的區域的情況下的第一實施方式的效果進行說明。(The effect of full application) The effect of the first embodiment in the case where a wide area, whether rectangular or circular, is applied across the entire surface using FIG. 3 will be described.
例如,作為塗佈作業的用途,有粘接,有時將一個零件粘接在板零件。將包含粘接劑的塗佈材料4塗佈在作為進行粘接的一方的零件的工件w,其後,將工件w放置在板零件(未圖示)來進行粘接。在現有技術中,若為了決定如何將塗佈材料4塗在工件w而想要進行噴嘴3的移動路徑的設定作業,則必須將噴嘴3的移動路徑設為Z字形、或設為螺旋。因此,經過點的設定作業非常複雜。For example, as the application of the coating operation, there is bonding, and sometimes a part is bonded to a plate part. The
但是,當必須將塗佈材料4塗在工件w的某種程度的寬廣的範圍內時,最重要的參數是塗佈材料4的塗佈量A,只要將所期望的量的塗佈材料4塗在規定的區域上即可,根據噴嘴3的移動路徑所導出的塗佈材料4的軌跡、或塗佈材料4在何處結束這樣的結束點的位置信息並不是那麼重要的參數。However, when the
在第一實施方式中,如圖3所示,通過開始點設定部18來設定全面塗抹的開始點S(圖3的旋渦的中心),通過塗佈區域設定部15來將塗佈區域E的形狀設為旋渦形狀,並僅設定所述旋渦的間距數。另外,通過塗佈量存儲部11來存儲塗佈量A。移動控制部12首先使噴嘴3移動至開始點S。噴嘴3在已到達開始點S的時間點,開始塗佈材料4的噴出。In the first embodiment, as shown in FIG. 3, the start point S (the center of the vortex in FIG. 3) of the entire coating is set by the start
若噴嘴3開始塗佈材料4的噴出,則移動控制部12使噴嘴3在X軸方向及Y軸方向上移動,以描繪變成已由塗佈區域設定部15設定的間距間隔的旋渦。移動控制部12在從噴嘴3中噴出的塗佈材料4的量已到達塗佈量A的時間點,使朝X軸方向及Y軸方向的噴嘴3的移動停止,噴嘴3停止塗佈材料4的噴出。When the
在第一實施方式中,只要決定塗佈材料4的塗佈量A,移動控制部12便可在從噴嘴3中噴出的塗佈材料4到達塗佈量A之前,使噴嘴3的相對移動繼續來實施塗佈作業。因此,根據第一實施方式,可利用塗佈材料4簡單地全面塗抹某種程度的寬廣的區域。In the first embodiment, as long as the coating amount A of the
而且,在第一實施方式中,僅使塗佈材料4的塗佈量A變化,便也可以進行維持塗佈品質時的塗佈量A的最佳值的決定試驗。因此,也可以容易地決定如成為粘接所需要的最小限度的量那樣的塗佈量A。由此,可使塗佈材料4最佳化而有助於塗佈材料4的使用量的削減。Furthermore, in the first embodiment, only by changing the coating amount A of the
(點塗佈的效果)
關於第一實施方式的效果,與利用現有的塗佈裝置的點塗佈進行比較來說明。在現有的點塗佈中,在利用單一的位置坐標決定塗佈材料4的塗佈部位後,已停止的狀態的噴嘴3噴出塗佈材料4。因此,如圖4所示,塗佈材料4在工件w上大幅度隆起,容易形成高度尺寸大的塗佈材料積存部5。因此,存在噴嘴3埋沒在塗佈材料積存部5,塗佈材料4附著在噴嘴3的周圍的擔憂。(The effect of dot coating)
The effect of the first embodiment will be described in comparison with spot coating using a conventional coating device. In the conventional spot coating, after the application site of the
若在塗佈材料4已附著在噴嘴3的周圍的狀態下,噴嘴3繼續塗佈作業,則連已附著在噴嘴3的塗佈材料4也與原本應塗佈的塗佈材料4一同接觸工件w,有可能塗佈的形狀或量錯亂且塗佈品質劣化。因此,以前在噴嘴3埋沒在塗佈材料積存部5且塗佈材料4已附著在噴嘴的周圍的情況下,噴嘴3的清潔(已附著的塗佈材料4的拭去)或維護(噴嘴3的清洗)變得不可缺少。這些噴嘴3的清潔或維護成為使塗佈作業的生產效率下降的因素。If the
另一方面,在第一實施方式中,當進行塗佈區域E的形狀為微小的圓形狀的塗佈作業時,即使經塗佈的塗佈材料4的形狀描繪作為塗佈區域E的圓周,也接近利用現有的點塗佈的塗佈。此時,在根據塗佈量A來進行噴嘴3的移動控制的第一實施方式中,在噴嘴3噴出塗佈材料4的期間,可使噴嘴3的移動繼續。On the other hand, in the first embodiment, when the coating operation in which the shape of the coating area E is a minute circular shape is performed, even if the shape of the
即,如圖5所示,在第一實施方式中,移動中的噴嘴3噴出塗佈材料4,從停止狀態的噴嘴3中不噴出塗佈材料4而難以產生塗佈材料積存部5。因此,噴嘴3埋沒在塗佈材料4的情況少,無噴嘴3前端被污染的擔憂。圖5的上段是噴出塗佈材料4的噴嘴3的正面圖,下段是塗佈區域E的平面圖。That is, as shown in FIG. 5, in the first embodiment, the moving
此處,列舉具體例對根據第一實施方式的塗佈與現有的點塗佈的不同進行說明。例如,在根據噴嘴3的性能或塗佈材料4的性質等所規定的塗佈的條件下,在現有的點塗佈中,通過1秒的噴出時間來形成直徑5mm的塗佈材料積存部5。此時,在第一實施方式中,塗佈區域設定部15將具有比塗佈材料積存部5的外徑小的外徑的區域作為塗佈區域E來設定。Here, specific examples are given to describe the difference between the coating according to the first embodiment and the conventional spot coating. For example, under the coating conditions prescribed by the performance of the
更具體而言,將不超出直徑5mm的程度,例如直徑4mm的圓作為塗佈區域E來設定。移動控制部12將直徑4mm的圓的圓周的長度作為塗佈材料4的長度L來算出,並按照所述塗佈材料4的長度L來控制噴嘴3的相對移動。噴嘴3受到所述移動控制,以花費1秒的噴出時間描繪直徑4mm的圓的方式噴出塗佈材料4。More specifically, a circle with a diameter of 4 mm, which does not exceed 5 mm in diameter, is set as the coating area E. The
即,在第一實施方式中,通過塗佈區域設定部15將微小的圓形狀作為塗佈區域E來設定,一邊使噴嘴3移動一邊噴出塗佈材料41,由此描繪作為微小的圓形狀的塗佈區域E。即,在第一實施方式中,並非將微小的圓形狀的塗佈區域E作為位置坐標為一個的“點”來理解而進行塗佈作業,而作為圓形狀來理解,通過使噴嘴3沿著圓周移動來進行塗佈作業。That is, in the first embodiment, the application
根據此種第一實施方式,在噴嘴3正噴出塗佈材料4的狀態下,噴嘴3繼續移動,因此可避免噴嘴3朝塗佈材料4的埋沒,可減少噴嘴3前端的污垢。因此,在第一實施方式中,實施與現有同等的點塗佈,並僅將原本應塗佈的塗佈材料4塗佈在工件w,因此可提高塗佈品質。另外,噴嘴3前端的污垢減少,因此也可以減少噴嘴3的清潔或維護的頻率,塗佈作業的生產效率提升。According to this first embodiment, the
而且,移動控制部12可通過保持部25來控制噴嘴3朝上下方向(Z軸方向)的相對移動。因此,如圖6所示,也可以一邊使噴嘴3從工件w上升,一邊朝圓形狀的塗佈區域E上繼續噴出塗佈材料4。圖6的上段是噴出塗佈材料4的噴嘴3的正面圖,下段是塗佈區域E的平面圖。在此情況下,即便正將塗佈材料4塗佈在工件w,噴嘴3也朝上方離去,因此可防止噴嘴3前端的污垢的附著。Furthermore, the
進而,如圖7所示,也可以將塗佈區域E設定成螺旋狀。在此情況下,不會一邊在塗佈區域E中描繪相同的圓,一邊噴嘴3噴出塗佈材料4,塗佈材料4的高度不會增大。因此,不會在工件w上形成塗佈材料積存部5,可一邊確實地避免噴嘴3朝塗佈材料積存部5的埋沒,一邊噴出足夠量的塗佈材料4。因此,可防止噴嘴3前端的污垢的附著,並有助於塗佈質量的進一步的提升。另外,螺旋狀的塗佈區域E的開始點S可以是位於旋渦的中心的點,也可以是位於旋渦的最外周的點。Furthermore, as shown in FIG. 7, the coating area E may be set to a spiral shape. In this case, the
在所述第一實施方式中,也可以理解為由移動控制部12控制的噴嘴3根據線塗佈的運行原理進行點塗佈。因此,即便是因應實施的點塗佈而形成的塗佈材料積存部5例如為直徑0.5mm這樣極其微小的情況,通過使移動控制部12具有與其相比足夠精細的控制分辨率(例如,0.01mm),也可以通過描繪非常小的圓來進行線塗佈。In the first embodiment, it can also be understood that the
在進行點塗佈與線塗佈的現有的塗佈裝置中,關於塗佈材料4的噴出量,有時在點塗佈與線塗佈中切換控制模式。例如,有時在點塗佈中採取將塗佈材料4的噴出量設為固定的噴出量固定模式,在線塗佈中採取對應於噴嘴3的移動量或移動速度V2來變更塗佈材料4的噴出量的噴出量可變模式。在進行此種控制模式的切換的情況下,產生控制複雜化等不良情況。In a conventional coating device that performs spot coating and line coating, the discharge amount of the
相對於此,在第一實施方式中,通過線塗佈的運行原理來實施點塗佈,因此無需在點塗佈與線塗佈中切換塗佈材料4的噴出控制模式。因此,根據第一實施方式,可避免控制的複雜化。進而,即便是無法切換噴出控制模式的塗佈裝置、或不具有噴出控制模式的切換功能而僅使用線塗佈的塗佈裝置,在第一實施方式中,也可以僅以線塗佈的控制方式進行點塗佈,而可應用於這些塗佈裝置。In contrast to this, in the first embodiment, spot coating is performed based on the operating principle of line coating, so there is no need to switch the ejection control mode of the
而且,由於可避免相對於塗佈材料4的噴嘴3的埋沒,因此在如上所述的塗佈裝置中,也可以獲得塗佈質量的維持或塗佈作業的生產效率的提升等效果。另外,在第一實施方式中,由於事先規定了塗佈量A,因此不會無用地噴出塗佈材料,在環境及經濟方面也優異。Furthermore, since the
另外,關於“噴嘴3與工件w的相對移動”,在所述實施方式中主要記載了噴嘴3的移動,但即便是使噴嘴3不動而僅使“工件w”移動的情況,也可以實現與所述效果相同的效果。In addition, regarding the "relative movement of the
(第二實施方式) (構成) 以下,參照圖8對本發明的第二實施方式的構成進行具體說明。第二實施方式的構成基本上與所述第一實施方式相同。因此,對與第一實施方式相同的構成元件賦予相同的符號並省略說明。(Second Embodiment) (constitute) Hereinafter, the configuration of the second embodiment of the present invention will be specifically described with reference to FIG. 8. The configuration of the second embodiment is basically the same as that of the first embodiment. Therefore, the same reference numerals are assigned to the same constituent elements as those of the first embodiment, and the description thereof is omitted.
如圖8所示,在第二實施方式中設置有點塗佈參數設定部19與參數轉換部20。點塗佈參數設定部19是設定僅決定一個位置坐標的點塗佈參數T的部分。第二實施方式的點塗佈參數T與在現有的點塗佈中所設定的位置坐標相同,但噴嘴3不一定必須朝所述位置坐標噴出塗佈材料4。例如,當塗佈區域E為圓形狀時,也可以將不被噴出塗佈材料4的圓的中心點設為點塗佈參數T。由點塗佈參數設定部19所設定的點塗佈參數T通過作業者經由操作部13來輸入而設定。As shown in FIG. 8, in the second embodiment, a dot coating
在參數轉換部20事先設定線塗佈參數R,參數轉換部20是利用線塗佈參數R轉換點塗佈參數T並求出線塗佈的位置信息D的部分。參數轉換部20將已求出的線塗佈的位置信息D輸出至塗佈區域設定部15。The line coating parameter R is set in the
(作用及效果)
在第二實施方式中,僅在點塗佈參數設定部19設定點塗佈參數T,不設定開始點S或噴嘴3的經過點等,移動控制部12可控制噴嘴3的相對移動來進行塗佈材料4的塗佈作業。例如,圖9中所示的P0是僅決定了一個位置坐標的位置坐標,此處為將塗佈區域E設為圓形狀時的中心點。(Function and effect)
In the second embodiment, only the dot coating parameter T is set in the dot coating
圖9中所示的R是事先設定在參數轉換部20的線塗佈參數,此處為圓形狀的塗佈區域E的半徑。P1是線塗佈的開始點,P2~P4是線塗佈的經過點,P5是線塗佈的結束點。參數轉換部20根據作為線塗佈參數的半徑R,求出用於在線塗佈中描繪圓形狀的各點P1~點P5的位置信息D。第二實施方式的塗佈區域設定部15根據參數轉換部20已求出的線塗佈的位置信息D來設定塗佈區域E。R shown in FIG. 9 is the line coating parameter set in the
在第二實施方式中,事先在參數轉換部20中對應於塗佈裝置1或塗佈材料4的規格、性能、特性來定義線塗佈參數,參數轉換部20可對點塗佈參數T進行轉換來求出線塗佈的位置信息D。因此,作業者無需如教導線塗佈時那樣設定開始點或各經過點等,僅在點塗佈參數設定部19設定點塗佈參數T,便能夠以與現有的點塗佈相同的感覺進行線塗佈的教導。In the second embodiment, the line coating parameters are defined in the
在第二實施方式中,事先在參數轉換部20中定義線塗佈參數,因此當使用者進行教導時,完全不必意識到各種參數。因此,根據第二實施方式,當實施點塗佈時,作業者不會意識到實際的動作是線塗佈,可提供良好的操作性。其結果,作業者可進行直觀的教導,可維持優異的操作性。In the second embodiment, the line coating parameters are defined in the
另外,第二實施方式可在維持實施點塗佈的感覺的狀態下,通過線塗佈的動作來容易地調整塗佈材料積存部5的量。因此,當在通過噴射而從噴嘴3中射出塗佈材料4的噴射塗佈方式中,想要形成比噴射的一個點大的塗佈材料積存部5時,第二實施方式特別有效。In addition, in the second embodiment, the amount of the
[其它實施方式] 如以上那樣對本發明的實施方式進行了說明,但可在不脫離發明的主旨的範圍內進行各種省略、替換、變更。而且,所述實施方式或其變形包含在發明的範圍或主旨中,並且包含在請求項中記載的發明及其均等的範圍內。本發明並不限定於所述實施方式,視需要可進行各種變更。[Other embodiments] The embodiments of the present invention have been described as above, but various omissions, substitutions, and changes can be made without departing from the spirit of the invention. In addition, the above-described embodiments or modifications thereof are included in the scope or spirit of the invention, and are included in the invention described in the claims and the equivalent scope thereof. The present invention is not limited to the above-mentioned embodiment, and various modifications can be made as necessary.
例如,也可以將本發明應用於通過馬達驅動而使堵死塗佈材料4穿過的管的構件移動來控制塗佈量的旋轉-管式塗佈裝置、或通過螺桿式的泵馬達來控制塗佈材料4的塗佈量的螺桿式塗佈裝置、每一發的噴出量微少且被正確地控制的非接觸式分配裝置等。For example, the present invention can also be applied to a rotary-tube type coating device that controls the coating amount by moving a member that blocks the tube through which the
在所述實施方式中,設為通過滑動平台26來進行X軸方向的移動的構成,但通過哪個構件來進行XYZ軸方向的各移動可適宜變更。例如,也可以將支柱22或Y軸方向移動體24設置成可在X軸方向上移動,由此進行X軸方向的移動。In the above-mentioned embodiment, the configuration in which the movement in the X-axis direction is performed by the slide table 26 is adopted, but which member is used to perform each movement in the XYZ-axis direction can be appropriately changed. For example, the
所述控制部10可通過利用規定的程式控制包含CPU的電腦來實現。此情況下的程式是通過物理式地活用電腦的硬件來實現如上所述的處理者。因此,執行所述處理的方法、程式及記錄有程式的記錄媒體也可以包含在實施方式的一形態中。The
作為用於根據用於現有的點塗佈的參數即位置坐標或塗佈量等,導出線塗佈的位置信息D的線塗佈參數,有依存於噴嘴3的性能或塗佈材料4的規格、性能、特性的參數,或與塗佈區域E的形狀相關的參數等。作為前者,有塗佈材料4的噴出速度V1、噴出速度V1可變時的噴出速度V1的上限、塗佈材料4的粘度等特性與對於噴出速度V1的影響程度(修正量)等。作為後者,若塗佈區域E為圓,則有圓的半徑,若為螺旋,則有外徑或間距、朝Z軸方向的上升速度或上升量、上升的上限等。As the line coating parameters used to derive the position information D of the line coating based on the parameters used for the existing dot coating, that is, the position coordinates or the coating amount, there are specifications that depend on the performance of the
另外,在本發明中,也可以在與點塗佈時的塗佈量不同的層的菜單或畫面(例如用於維護設定的畫面等)中設定所述參數。根據此種實施方式,可發揮與現有的點塗佈同等的操作性。進而,在顯示部14中,也可以將所述參數一併顯示在相同的菜單或畫面中,可確保優異的操作性。In addition, in the present invention, the parameter may be set in a menu or screen (for example, a screen for maintenance settings) of a layer different from the coating amount at the time of spot coating. According to such an embodiment, the operability equivalent to the conventional spot coating can be exhibited. Furthermore, in the
在本發明中,也可以實施塗佈材料4的捨打(purging)。捨打的實施方法有:接受來自捨打開關或外部的指示而實施的方法、及自動捨打等方法。在自動捨打中,根據固定時間間隔或者運轉週期的開始時或結束時等事先決定的規則,自動地在那個時候進行捨打,或使噴嘴3移動至應拋棄塗佈材料4的地方來進行捨打。In the present invention, purging of the
當將本發明應用於塗佈材料4的捨打時,噴嘴3不會停留在經捨打的塗佈材料積存部5,且噴嘴3不會埋沒在工件w上的塗佈材料積存部5。因此,可防止塗佈材料朝噴嘴3周圍的附著或塗佈材料的殘留。由此,可實現塗佈質量的穩定化,且可有助於噴嘴的維護的減輕。When the present invention is applied to the
1:塗佈裝置 2:收容容器 3:噴嘴 4:塗佈材料 5:塗佈材料積存部 10:控制部 11:塗佈量存儲部 12:移動控制部 13:操作部 14:顯示部 15:塗佈區域設定部 16:噴出速度存儲部 17:移動速度存儲部 18:開始點設定部 19:點塗佈參數設定部 20:參數轉換部 21:平台 22:支柱 23:臂 24:Y軸方向移動體 25:保持部 26:滑動平台 A:塗佈量 Cx、Cy、Cz:移動控制指令 D:位置信息 E:塗佈區域 L:塗佈材料的長度 P0:位置坐標 P1:線塗佈的開始點 P2~P4:線塗佈的經過點 P5:線塗佈的結束點 R:半徑 S:開始點 T:點塗佈參數 V1:噴出速度 V2:移動速度 w:工件 X、Y、Z:軸1: Coating device 2: containment container 3: nozzle 4: Coating material 5: Coating material storage section 10: Control Department 11: Coating amount storage department 12: Mobile Control Department 13: Operation Department 14: Display 15: Coating area setting section 16: Discharge speed storage section 17: Moving speed storage 18: Starting point setting section 19: Point coating parameter setting department 20: Parameter Conversion Department 21: Platform 22: Pillar 23: arm 24: Moving body in Y-axis direction 25: holding part 26: Sliding platform A: Coating amount Cx, Cy, Cz: movement control instructions D: Location information E: coating area L: length of coating material P0: position coordinates P1: Starting point of line coating P2~P4: Passing point of line coating P5: End point of line coating R: radius S: starting point T: Spot coating parameters V1: spray speed V2: Movement speed w: Workpiece X, Y, Z: axis
圖1是第一實施方式的正面圖。 圖2是第一實施方式的框圖。 圖3是在第一實施方式中進行全面塗抹時的平面圖。 圖4是用於說明現有的點塗佈的放大圖。 圖5是用於說明根據第一實施方式的點塗佈的放大圖。 圖6是用於在第一實施方式中說明點塗佈的效果的放大圖(塗佈區域為圓形狀)。 圖7是用於在第一實施方式中說明點塗佈的效果的放大圖(塗佈區域為螺旋形狀)。 圖8是第二實施方式的框圖。 圖9是用於在第二實施方式中說明點塗佈參數的轉換的放大圖。Fig. 1 is a front view of the first embodiment. Fig. 2 is a block diagram of the first embodiment. Fig. 3 is a plan view when full-surface application is performed in the first embodiment. Fig. 4 is an enlarged view for explaining conventional spot coating. Fig. 5 is an enlarged view for explaining dot coating according to the first embodiment. FIG. 6 is an enlarged view for explaining the effect of dot coating in the first embodiment (the coating area is a circular shape). FIG. 7 is an enlarged view for explaining the effect of dot coating in the first embodiment (the coating area is a spiral shape). Fig. 8 is a block diagram of the second embodiment. FIG. 9 is an enlarged view for explaining the conversion of dot coating parameters in the second embodiment.
10:控制部 10: Control Department
11:塗佈量存儲部 11: Coating amount storage department
12:移動控制部 12: Mobile Control Department
13:操作部 13: Operation Department
14:顯示部 14: Display
15:塗佈區域設定部 15: Coating area setting section
16:噴出速度存儲部 16: Discharge speed storage section
17:移動速度存儲部 17: Moving speed storage
18:開始點設定部 18: Starting point setting section
24:Y軸方向移動體 24: Moving body in Y-axis direction
25:保持部 25: holding part
26:滑動平台 26: Sliding platform
A:塗佈量 A: Coating amount
Cx、Cy、Cz:移動控制指令 Cx, Cy, Cz: movement control instructions
E:塗佈區域 E: coating area
L:塗佈材料的長度 L: length of coating material
S:開始點 S: starting point
V1:噴出速度 V1: spray speed
V2:移動速度 V2: Movement speed
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JP6467132B2 (en) * | 2013-12-27 | 2019-02-06 | 蛇の目ミシン工業株式会社 | Robot, robot control method, and robot control program |
US9789497B1 (en) * | 2016-06-20 | 2017-10-17 | Nordson Corporation | Systems and methods for applying a liquid coating to a substrate |
DE112017000685B4 (en) * | 2017-05-25 | 2024-08-29 | Musashi Engineering, Inc. | Liquid material application device and liquid material application method |
CN109164649A (en) * | 2018-10-25 | 2019-01-08 | 张家港康得新光电材料有限公司 | A kind of liquid crystal coating apparatus and method |
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2019
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2020
- 2020-02-04 DE DE102020201327.6A patent/DE102020201327A1/en active Pending
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TWI758699B (en) | 2022-03-21 |
CN111822232B (en) | 2022-08-26 |
CN111822232A (en) | 2020-10-27 |
KR102287599B1 (en) | 2021-08-06 |
JP2020175327A (en) | 2020-10-29 |
JP7426198B2 (en) | 2024-02-01 |
DE102020201327A1 (en) | 2020-10-22 |
KR20200122224A (en) | 2020-10-27 |
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