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TW202029911A - Ventilated seat - Google Patents

Ventilated seat Download PDF

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TW202029911A
TW202029911A TW108104720A TW108104720A TW202029911A TW 202029911 A TW202029911 A TW 202029911A TW 108104720 A TW108104720 A TW 108104720A TW 108104720 A TW108104720 A TW 108104720A TW 202029911 A TW202029911 A TW 202029911A
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Taiwan
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heat dissipation
ventilated seat
item
patent application
computer
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TW108104720A
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Chinese (zh)
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TWI687182B (en
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蔡宗軒
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宏碁股份有限公司
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Publication of TW202029911A publication Critical patent/TW202029911A/en

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Abstract

A ventilated seat includes a cushion structure and a chair-back device connected to the cushion structure. The chair-back device includes a support housing, a windshield, a heat-dissipation structure, and a fan. The support housing has a support surface and a vent holes formed on the support surface. The windshield is connected to the support housing and has exhaust holes. The heat-dissipation structure is connected to the windshield. An airflow chamber is formed by the support housing, the windshield and the heat-dissipation structure. The fan is configured to provide airflow into the airflow chamber, and the airflow is exhausted from the airflow chamber via the vent holes and the exhaust holes.

Description

通風座椅Ventilated seat

本揭露主要關於一種座椅,尤指一種通風座椅。This disclosure mainly relates to a seat, especially a ventilated seat.

對於利用電腦進行工作的使用者而言,多半會有大量的時間坐於椅子上。因此,為了增加座椅之舒適,一般會以彈性材質包覆座椅。然而,當使用者長時間坐於座椅上時可能感覺到背部悶熱等不適感。For users who use computers for work, they will probably spend a lot of time sitting in chairs. Therefore, in order to increase the comfort of the seat, the seat is generally covered with elastic material. However, when the user sits on the seat for a long time, he may feel uncomfortable feelings such as a stuffy back.

此外,對於電競選手而言,如何能使電腦產生更佳之效能,藉以取得更好的顯示畫面亦是急需解決的問題。一般之解決方式可藉由更佳散熱裝置來增進電腦之散熱效能,進而使得電腦可於更高的運作效能下工作。In addition, for e-sports players, how to make the computer produce better performance so as to obtain a better display screen is also an urgent problem to be solved. The general solution can improve the heat dissipation performance of the computer by using a better heat dissipation device, so that the computer can work at a higher operating performance.

因此,雖然目前之座椅與電腦之散熱裝置符合了其使用之目的,但尚未滿足許多其他方面的要求。因此,需要提供座椅與散熱裝置改進方案。Therefore, although the current seat and computer heat dissipation device meets the purpose of its use, it has not yet met many other requirements. Therefore, there is a need to provide improved solutions for seats and heat dissipation devices.

本揭露提供了一種通風座椅,能提供使用者更為舒適的坐感,且能進一步提供電腦之散熱功能。The present disclosure provides a ventilated seat, which can provide users with a more comfortable sitting feeling and can further provide the heat dissipation function of the computer.

本揭露提供了一種通風座椅,包括一坐墊結構以及連接於坐墊結構之一椅背裝置。椅背裝置包括一支撐殼體、一集風罩、一散熱結構、以及一風扇。支撐殼體具有一支撐面以及形成於支撐面之複數個透氣孔。集風罩連接於支撐殼體,且具有複數個排氣孔。散熱結構連接於集風罩。支撐殼體、集風罩以及散熱結構內形成一氣流腔。風扇用以提供一氣流至氣流腔內,且氣流經由透氣孔以及排氣孔排出於氣流腔。The present disclosure provides a ventilated seat, which includes a cushion structure and a back device connected to the cushion structure. The seat back device includes a support shell, a wind hood, a heat dissipation structure, and a fan. The supporting shell has a supporting surface and a plurality of ventilation holes formed on the supporting surface. The wind collecting hood is connected to the supporting shell and has a plurality of exhaust holes. The heat dissipation structure is connected to the air collecting cover. An air flow cavity is formed in the supporting shell, the air collecting cover and the heat dissipation structure. The fan is used to provide an airflow into the airflow cavity, and the airflow is discharged from the airflow cavity through the ventilation holes and the exhaust holes.

於一些實施例中,通風座椅更包括一電腦,耦接於散熱結構。電腦連接於集風罩。In some embodiments, the ventilated seat further includes a computer coupled to the heat dissipation structure. The computer is connected to the wind hood.

於一些實施例中,散熱結構更包括一散熱基板以及多個散熱鰭片。散熱基板連接於集風罩。散熱鰭片設置於散熱基板上,且位於氣流腔內。In some embodiments, the heat dissipation structure further includes a heat dissipation substrate and a plurality of heat dissipation fins. The heat dissipation substrate is connected to the air collecting cover. The heat dissipation fins are arranged on the heat dissipation substrate and are located in the air flow cavity.

於一些實施例中,通風座椅更包括一散熱管,連接於電腦以及散熱結構。散熱基板更包括連接於散熱管之一冷卻通道,且一冷卻液填充於散熱管以及冷卻通道內。In some embodiments, the ventilated seat further includes a heat dissipation pipe connected to the computer and the heat dissipation structure. The heat dissipation substrate further includes a cooling channel connected to the heat dissipation pipe, and a cooling liquid is filled in the heat dissipation pipe and the cooling channel.

於一些實施例中,通風座椅更包括一間隔板,連接於集風罩,且位於散熱結構以及支撐殼體之間。In some embodiments, the ventilated seat further includes a partition plate connected to the wind hood and located between the heat dissipation structure and the supporting shell.

於一些實施例中,椅背裝置相對於坐墊結構傾斜,且相對於坐墊結構為可轉動的。排氣孔位於集風罩之頂部,且風扇位於集風罩之底部。In some embodiments, the seat back device is inclined relative to the cushion structure and is rotatable relative to the cushion structure. The exhaust hole is located at the top of the air collecting hood, and the fan is located at the bottom of the air collecting hood.

於一些實施例中,通風座椅,更包括一基座以及設置於基座上之一調整機構。坐墊結構設置於調整機構上,且調整機構用以轉動坐墊結構。椅背裝置更包括一彈性透氣罩,包覆支撐殼體。In some embodiments, the ventilated seat further includes a base and an adjustment mechanism disposed on the base. The cushion structure is arranged on the adjustment mechanism, and the adjustment mechanism is used for rotating the cushion structure. The seat back device further includes an elastic ventilating cover, which covers the supporting shell.

於一些實施例中,集風罩包括一頂部以及二側壁。頂部具有上述排氣孔。側壁連接於頂部,且相互分離。頂部以及側壁形成一U型結構,連接於支撐殼體。散熱結構以及風扇連接於側壁。In some embodiments, the air collecting hood includes a top and two side walls. The top has the above-mentioned exhaust hole. The side walls are connected to the top and separated from each other. The top and side walls form a U-shaped structure, which is connected to the support shell. The heat dissipation structure and the fan are connected to the side wall.

於一些實施例中,集風罩更包括一背板,連接於頂部以及側壁,且與支撐殼體分離,其中背板連接於散熱結構以及一電腦。In some embodiments, the air collecting hood further includes a back plate connected to the top and side walls, and separated from the supporting housing, wherein the back plate is connected to the heat dissipation structure and a computer.

綜上所述,本揭露之通風座椅可經由透氣孔向使用者之背部吹出氣流進而可增加使用者之舒適度。此外,通風座椅可利用散熱結構對電腦進行散熱,藉此可增加電腦之運作效能。In summary, the ventilated seat of the present disclosure can blow air flow to the back of the user through the vent hole to increase the comfort of the user. In addition, the ventilated seat can use the heat dissipation structure to dissipate the heat of the computer, thereby increasing the operating efficiency of the computer.

以下之說明提供了許多不同的實施例、或是例子,用來實施本揭露之不同特徵。以下特定例子所描述的元件和排列方式,僅用來精簡的表達本揭露,其僅作為例子,而並非用以限制本揭露。例如,第一特徵在一第二特徵上或上方的結構之描述包括了第一和第二特徵之間直接接觸,或是以另一特徵設置於第一和第二特徵之間,以致於第一和第二特徵並不是直接接觸。The following description provides many different embodiments or examples for implementing different features of the present disclosure. The elements and arrangements described in the following specific examples are only used to concisely express the present disclosure, and are only used as examples, and are not intended to limit the present disclosure. For example, the description of a first feature on or above a second feature includes direct contact between the first and second features, or another feature is placed between the first and second features, so that the first feature The first and second features are not in direct contact.

於此使用之空間上相關的詞彙,例如上方或下方等,僅用以簡易描述圖式上之一元件或一特徵相對於另一元件或特徵之關係。除了圖式上描述的方位外,包括於不同之方位使用或是操作之裝置。此外,圖式中之形狀、尺寸、厚度、以及傾斜之角度可能為了清楚說明之目的而未依照比例繪製或是被簡化,僅提供說明之用。The spatially related words used here, such as above or below, are only used to simply describe the relationship of one element or feature to another element or feature on the drawing. In addition to the positions described in the drawings, it includes devices used or operated in different positions. In addition, the shape, size, thickness, and angle of inclination in the drawings may not be drawn to scale or simplified for the purpose of clear description, and are only provided for illustrative purposes.

第1圖為根據一些實施中本揭露之通風座椅1的側視圖。通風座椅1可包括一基座10、一調整機構20、一坐墊結構30、一椅背裝置40、以及一電腦50。基座10可放置於一地面。調整機構20可設置於基座10上,且坐墊結構30可設置於調整機構20上。調整裝置可用以轉動坐墊結構30。於一些實施例中,調整裝置可於水平方向上使坐墊結構30相對於基座10旋轉。於一些實施例中,調整裝置可使坐墊結構30相對於基座10傾斜。Figure 1 is a side view of a ventilated seat 1 according to the present disclosure in some implementations. The ventilated seat 1 may include a base 10, an adjustment mechanism 20, a cushion structure 30, a seat back device 40, and a computer 50. The base 10 can be placed on a ground. The adjustment mechanism 20 may be arranged on the base 10, and the cushion structure 30 may be arranged on the adjustment mechanism 20. The adjusting device can be used to rotate the cushion structure 30. In some embodiments, the adjusting device can rotate the cushion structure 30 relative to the base 10 in a horizontal direction. In some embodiments, the adjusting device can tilt the cushion structure 30 relative to the base 10.

椅背裝置40可連接於坐墊結構30,且可相對於坐墊結構30傾斜。椅背裝置40以及坐墊結構30形成一椅子或是一L型結構。於本實施例中,椅背裝置40樞接於坐墊結構30。換句話說,椅背裝置40可相對於坐墊結構30轉動。使用者可依據需求調整椅背裝置40相對於坐墊結構30之角度。舉例而言,椅背裝置40與坐墊結構30之間的夾角可為90度至170度之間。於本實施例中,使用者可坐於坐墊結構30上,且使用者之背部可靠於椅背裝置40,藉以提供使用者舒適感。The seat back device 40 can be connected to the cushion structure 30 and can be inclined relative to the cushion structure 30. The seat back device 40 and the cushion structure 30 form a chair or an L-shaped structure. In this embodiment, the seat back device 40 is pivotally connected to the cushion structure 30. In other words, the seat back device 40 can rotate relative to the cushion structure 30. The user can adjust the angle of the seat back device 40 relative to the cushion structure 30 according to requirements. For example, the included angle between the seat back device 40 and the cushion structure 30 may be between 90 degrees and 170 degrees. In this embodiment, the user can sit on the cushion structure 30, and the user's back is securely attached to the seat back device 40, thereby providing the user with a sense of comfort.

電腦50可連接於椅背裝置40,但並不以此為限。舉例而言,電腦50可連接於基座10或是坐墊結構30。於一些實施例中,電腦50可拆卸地連接於基座10、坐墊結構30或是椅背裝置40,藉以方便使用者維修或是更新電腦50。The computer 50 can be connected to the chair back device 40, but is not limited to this. For example, the computer 50 can be connected to the base 10 or the cushion structure 30. In some embodiments, the computer 50 is detachably connected to the base 10, the cushion structure 30, or the seat back device 40, so as to facilitate the user to repair or update the computer 50.

於本實施例中,電腦50可控制調整機構20,藉以相對於基座10旋轉或是傾斜坐墊結構30。舉例而言,當電腦50執行一遊戲程式時,電腦50可依據遊戲程式之命令控制調整機構20,以使使用者更能融入遊戲的情境。In this embodiment, the computer 50 can control the adjustment mechanism 20 to rotate or tilt the cushion structure 30 relative to the base 10. For example, when the computer 50 executes a game program, the computer 50 can control the adjustment mechanism 20 according to the commands of the game program, so that the user can better integrate into the game situation.

第2圖為根據一些實施中本揭露之坐墊結構30以及椅背裝置40的分解圖。第3圖為根據一些實施中本揭露之椅背裝置40以及電腦50的示意圖。椅背裝置40可包括一支撐殼體41、一集風罩42、一散熱結構43、一間隔板44、以及一風扇45。支撐殼體41可樞接於坐墊結構30,且用以支撐使用者之背部。於一些實施例中,支撐殼體41可固定於坐墊結構30。支撐殼體41與坐墊結構30一體成形。換句話說,支撐殼體41無法相對於坐墊結構30轉動。支撐殼體41可為大致為一長條形板狀結構,且可大致沿一延伸方向D1延伸。於本揭露中,大致沿延伸方向D1延伸包括了沿延伸方向D1延伸的實施態樣。FIG. 2 is an exploded view of the cushion structure 30 and the seat back device 40 according to the present disclosure in some implementations. FIG. 3 is a schematic diagram of the chair back device 40 and the computer 50 according to the present disclosure in some implementations. The seat back device 40 may include a supporting shell 41, a wind collecting cover 42, a heat dissipation structure 43, a partition plate 44, and a fan 45. The supporting shell 41 can be pivotally connected to the cushion structure 30 and used to support the back of the user. In some embodiments, the support shell 41 can be fixed to the cushion structure 30. The support shell 41 and the cushion structure 30 are integrally formed. In other words, the support shell 41 cannot rotate relative to the cushion structure 30. The supporting shell 41 may be a substantially elongated plate-like structure, and may extend substantially along an extension direction D1. In the present disclosure, extending substantially along the extending direction D1 includes an embodiment of extending along the extending direction D1.

於本實施例中,支撐殼體41之長度可約為50公分至120公分之間。支撐殼體41之寬度可約為30公分至70公分之間。支撐殼體41之長度可於延伸方向D1上進行測量。支撐殼體41之寬度可於垂直於延伸方向D1的方向上進行測量。於本揭露中,延伸方向D1為支撐殼體41之縱向,當支撐殼體41改變與坐墊結構30之間的角度時,延伸方向D1亦會隨著支撐殼體41之縱向改變。於一些實施例中,支撐殼體41可由硬質材料所製成,例如硬質塑膠。In this embodiment, the length of the support shell 41 may be about 50 cm to 120 cm. The width of the support shell 41 may be about 30 cm to 70 cm. The length of the support shell 41 can be measured in the extension direction D1. The width of the support shell 41 can be measured in a direction perpendicular to the extension direction D1. In the present disclosure, the extension direction D1 is the longitudinal direction of the support shell 41. When the support shell 41 changes the angle with the cushion structure 30, the extension direction D1 will also change with the longitudinal direction of the support shell 41. In some embodiments, the support shell 41 may be made of a hard material, such as hard plastic.

支撐殼體41可具有一支撐面411以及多個透氣孔412。當使用者坐於坐墊結構30上時,支撐面411可對應於使用者之背部。透氣孔412形成於支撐面411上,且貫穿支撐殼體41。於一些實施例中,透氣孔412可以陣列的方式排列於支撐面411,且可均勻地分布於支撐面411上。The supporting shell 41 may have a supporting surface 411 and a plurality of ventilation holes 412. When the user sits on the cushion structure 30, the supporting surface 411 may correspond to the back of the user. The ventilation hole 412 is formed on the supporting surface 411 and penetrates the supporting housing 41. In some embodiments, the ventilation holes 412 can be arranged on the supporting surface 411 in an array, and can be evenly distributed on the supporting surface 411.

集風罩42連接於支撐殼體41,且可為一中空狀結構。集風罩42可連接於支撐殼體41之邊緣。於本實施例中,集風罩42可具有一U型連接面421連接於支撐殼體41之邊緣。集風罩42可大致沿延伸方向D1延伸。集風罩42之長度以及寬度可對應於支撐殼體41。於本實施例中,集風罩42以及支撐殼體41之長度可於相同之方向進行測量。集風罩42以及支撐殼體41之寬度可於相同之方向進行測量。The air collecting hood 42 is connected to the supporting shell 41 and can be a hollow structure. The air collecting hood 42 can be connected to the edge of the supporting shell 41. In this embodiment, the air collecting hood 42 may have a U-shaped connecting surface 421 connected to the edge of the supporting shell 41. The wind hood 42 may extend substantially along the extension direction D1. The length and width of the wind collecting hood 42 can correspond to the supporting shell 41. In this embodiment, the length of the air collecting hood 42 and the supporting shell 41 can be measured in the same direction. The width of the air collecting hood 42 and the supporting shell 41 can be measured in the same direction.

集風罩42可包括一頂部422、兩側壁423、以及一背板424。頂部422以及兩側壁423可形成一U型結構,且U型連接面421位於頂部422以及兩側壁423之邊緣。於本實施例中,集風罩42可具有多個排氣孔425形成於頂部422。側壁423連接於頂部422,且可大致垂直於頂部422延伸。側壁423可相互間隔,且相互平行。於本揭露中,大致垂直包括垂直之實施態樣。The air collecting hood 42 may include a top 422, two side walls 423, and a back plate 424. The top 422 and the two side walls 423 can form a U-shaped structure, and the U-shaped connecting surface 421 is located at the edges of the top 422 and the two side walls 423. In this embodiment, the air collecting hood 42 may have a plurality of exhaust holes 425 formed on the top 422. The side wall 423 is connected to the top 422 and can extend substantially perpendicular to the top 422. The side walls 423 may be spaced apart and parallel to each other. In this disclosure, substantially vertical includes vertical implementation aspects.

背板424可連接於頂部422以及兩側壁423,且可與支撐殼體41分離。背板424可大致垂直於頂部422以及兩側壁423延伸。於一些實施例中,背板424可連接於兩側壁423,且可與頂部422分離。於一些實施例中,集風罩42可由硬質材料所製成,例如硬質塑膠或金屬。The back plate 424 can be connected to the top 422 and the two side walls 423 and can be separated from the support housing 41. The back plate 424 may extend substantially perpendicular to the top 422 and the two side walls 423. In some embodiments, the back plate 424 can be connected to the two side walls 423 and can be separated from the top 422. In some embodiments, the air collecting cover 42 may be made of a hard material, such as hard plastic or metal.

散熱結構43連接集風罩42,且耦接於電腦50。散熱結構43用以傳導電腦50所產生之熱量,進而對電腦50進行散熱。散熱結構43可平行於背板424,或是大致垂直於側壁423延伸。散熱結構43可為一板狀結構,且可由散熱材質所製成,例如金屬。散熱結構43之寬度可對應於集風罩42之寬度。於本實施例中,散熱結構43之寬度大於集風罩42之寬度的一半。散熱結構43之長度大於集風罩42之長度的三分之一。散熱結構43以及集風罩42之寬度可於相同之方向進行測量。散熱結構43以及集風罩42之長度可於相同之方向進行測量。The heat dissipation structure 43 is connected to the air collecting cover 42 and is coupled to the computer 50. The heat dissipation structure 43 is used to conduct heat generated by the computer 50 to further dissipate the computer 50. The heat dissipation structure 43 can be parallel to the back plate 424 or extend substantially perpendicular to the side wall 423. The heat dissipation structure 43 may be a plate-shaped structure and may be made of heat dissipation materials, such as metal. The width of the heat dissipation structure 43 may correspond to the width of the air collecting cover 42. In this embodiment, the width of the heat dissipation structure 43 is greater than half of the width of the air collecting cover 42. The length of the heat dissipation structure 43 is greater than one third of the length of the air collecting cover 42. The widths of the heat dissipation structure 43 and the air collecting cover 42 can be measured in the same direction. The length of the heat dissipation structure 43 and the air collecting cover 42 can be measured in the same direction.

於本實施例中,散熱結構43可包括一散熱基板431以及多個散熱鰭片432。散熱基板431可連接於集風罩42之兩側壁423。於一些實施例中,散熱基板431可連接於背板424。散熱鰭片432設置於散熱基板431上,且可沿延伸方向D1延伸。散熱鰭片432之間可相互平行及間隔。In this embodiment, the heat dissipation structure 43 may include a heat dissipation substrate 431 and a plurality of heat dissipation fins 432. The heat dissipation substrate 431 can be connected to the two side walls 423 of the air collecting cover 42. In some embodiments, the heat dissipation substrate 431 may be connected to the back plate 424. The heat dissipation fin 432 is disposed on the heat dissipation substrate 431 and can extend along the extension direction D1. The heat dissipation fins 432 may be parallel and spaced apart from each other.

間隔板44連接於集風罩42,且可位於散熱結構43以及支撐殼體41之間。間隔板44可大致平行於散熱結構43以及背板424。換句話說,間隔板44可沿延伸方向D1延伸。於本實施例中,支撐殼體41、集風罩42以及散熱結構43內形成一氣流腔S1。間隔板44以及散熱結構43位於氣流腔S1內。間隔板44可將氣流腔S1分隔於兩個部分。換句話說,間隔板44可分隔透氣孔412與散熱結構43。The partition plate 44 is connected to the air collecting cover 42 and can be located between the heat dissipation structure 43 and the support shell 41. The spacer plate 44 may be substantially parallel to the heat dissipation structure 43 and the back plate 424. In other words, the partition plate 44 may extend along the extension direction D1. In this embodiment, an air flow cavity S1 is formed in the supporting housing 41, the air collecting hood 42, and the heat dissipation structure 43. The partition plate 44 and the heat dissipation structure 43 are located in the air flow cavity S1. The partition plate 44 can divide the air flow chamber S1 into two parts. In other words, the partition plate 44 can separate the ventilation hole 412 and the heat dissipation structure 43.

風扇45設置於集風罩42,用以提供一氣流至氣流腔S1內。當氣流於氣流腔S1流動時,氣流可經過散熱結構43,進而帶走散熱結構43之熱量。最後,氣流經由透氣孔412以及排氣孔425排出於氣流腔S1。氣流通過透氣孔412可吹向使用者之背部,進而降低使用者長時間坐於座椅上時背部悶熱等不適感。 因此本揭露之通風座椅1可提高使用者坐於通風座椅1上之舒適感,並可對電腦50進行散熱。由於本揭露之散熱結構43可配合於椅背裝置40的尺寸,因此散熱結構43可具有較大之體積,可強化電腦50之散熱效能,進而使得電腦50可於更高效能下運作。The fan 45 is disposed in the air collecting hood 42 to provide an air flow into the air flow cavity S1. When the airflow flows in the airflow cavity S1, the airflow can pass through the heat dissipation structure 43 to take away the heat of the heat dissipation structure 43. Finally, the air flow is discharged into the air flow chamber S1 through the vent hole 412 and the exhaust hole 425. The air flow through the vent 412 can blow toward the user's back, thereby reducing the user's uncomfortable feeling such as hot back when sitting on the seat for a long time. Therefore, the ventilated seat 1 of the present disclosure can improve the comfort of the user sitting on the ventilated seat 1 and can dissipate heat from the computer 50. Since the heat dissipation structure 43 of the present disclosure can be matched to the size of the seat back device 40, the heat dissipation structure 43 can have a larger volume, which can enhance the heat dissipation performance of the computer 50, so that the computer 50 can operate at higher performance.

於本實施例中,由於排氣孔425可位於集風罩42之頂部422,且風扇45可位於集風罩42之底部,因此流經散熱結構43且受熱後的氣流可更容易經由排氣孔425排出,進而可增加散熱結構43的散熱效率。In this embodiment, since the exhaust hole 425 can be located at the top 422 of the air collecting hood 42, and the fan 45 can be located at the bottom of the air collecting hood 42, the heated air flowing through the heat dissipation structure 43 can more easily pass through the exhaust The holes 425 are discharged, thereby increasing the heat dissipation efficiency of the heat dissipation structure 43.

於本實施例中,可藉由間隔板44來防止經由散熱結構43受熱後的氣流從透氣孔412流出。因此由風扇45所吹出之未受熱的氣流可經由透氣孔412流出後吹向使用者之背部,進而提高使用者之背部的舒適感。In this embodiment, the spacer 44 can be used to prevent the airflow heated by the heat dissipation structure 43 from flowing out of the vent 412. Therefore, the unheated air flow blown by the fan 45 can flow out through the vent 412 and blow toward the back of the user, thereby improving the comfort of the back of the user.

於本實施例中,電腦50可包括一主機殼51、一主機板52、一處理晶片53、以及一顯示卡54。電腦50之主機殼51可連接於集風罩42之背板424及/或散熱結構43。主機板52設置於主機殼51內。處理晶片53以及顯示卡54可設置於主機板52上。電腦50之處理晶片53以及顯示卡54可經由一散熱管T1耦接於散熱結構43。於一些實施例中,上述之散熱管T1可為一熱導管。In this embodiment, the computer 50 may include a mainframe 51, a mainboard 52, a processing chip 53, and a display card 54. The main casing 51 of the computer 50 can be connected to the back plate 424 of the air collecting hood 42 and/or the heat dissipation structure 43. The main board 52 is disposed in the main casing 51. The processing chip 53 and the display card 54 can be disposed on the motherboard 52. The processing chip 53 and the display card 54 of the computer 50 can be coupled to the heat dissipation structure 43 via a heat pipe T1. In some embodiments, the aforementioned heat pipe T1 may be a heat pipe.

於本實施例中,電腦50可水冷系統進行散熱。上述之散熱管T1可為水冷管,其內填充一水冷液。散熱結構43可更包括二連接頭433以及一冷卻通道434。連接頭433連接散熱管T1以及冷卻通道,且水冷液填充於散熱管T1以及冷卻通道434內。冷卻通道434可以一彎曲路徑分布於散熱基板431內,且冷卻通道434之兩端連接於二連接頭433。In this embodiment, the computer 50 can be cooled by a water cooling system. The aforementioned heat pipe T1 can be a water-cooled pipe filled with a water-cooling liquid. The heat dissipation structure 43 may further include two connectors 433 and a cooling channel 434. The connector 433 is connected to the heat dissipation tube T1 and the cooling channel, and the water cooling liquid is filled in the heat dissipation tube T1 and the cooling channel 434. The cooling channel 434 may be distributed in the heat dissipation substrate 431 in a curved path, and two ends of the cooling channel 434 are connected to the two connectors 433.

於本實施例中,椅背裝置40可更包括一彈性透氣罩46,包覆支撐殼體41以及集風罩42。於一些實施例中,彈性透氣罩46可不包覆集風罩42。經由透氣孔412或排氣孔425所排出之氣流可通過彈性透氣罩46。於本實施例中,藉由彈性透氣罩46可更進一步增加使用者坐於通風座椅1上之舒適度。In this embodiment, the seat back device 40 may further include an elastic air-permeable cover 46 covering the supporting shell 41 and the air collecting cover 42. In some embodiments, the elastic breathable cover 46 may not cover the wind collecting cover 42. The air flow discharged through the ventilation hole 412 or the exhaust hole 425 can pass through the elastic ventilation cover 46. In this embodiment, the elastic ventilating cover 46 can further increase the comfort of the user sitting on the ventilated seat 1.

綜上所述,本揭露之通風座椅可經由透氣孔向使用者之背部吹出氣流進而可增加使用者之舒適度。此外,通風座椅可利用散熱結構對電腦進行散熱,藉此可增加電腦之運作效能。In summary, the ventilated seat of the present disclosure can blow air flow to the back of the user through the vent hole to increase the comfort of the user. In addition, the ventilated seat can use the heat dissipation structure to dissipate the heat of the computer, thereby increasing the operating efficiency of the computer.

本揭露雖以各種實施例揭露如上,然而其僅為範例參考而非用以限定本揭露的範圍,任何熟習此項技藝者,在不脫離本揭露之精神和範圍內,當可做些許的更動與潤飾。因此上述實施例並非用以限定本揭露之範圍,本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure uses various embodiments to disclose the above, it is only an example for reference and not intended to limit the scope of this disclosure. Anyone who is familiar with this technique can make some changes without departing from the spirit and scope of this disclosure. And retouch. Therefore, the above-mentioned embodiments are not used to limit the scope of the disclosure, and the protection scope of the disclosure shall be subject to the scope of the attached patent application.

1:通風座椅 10:基座 20:調整機構 30:坐墊結構 40:椅背裝置 41:支撐殼體 411:支撐面 412:透氣孔 42:集風罩 421:U型連接面 422:頂部 423:側壁 424:背板 425:排氣孔 43:散熱結構 431:散熱基板 432:散熱鰭片 433:連接頭 434:冷卻通道 44:間隔板 45:風扇 46:彈性透氣罩 50:電腦 51:主機殼 52:主機板 53:處理晶片 54:顯示卡 D1:延伸方向 S1:氣流腔 T1:散熱管 1: Ventilated seat 10: Pedestal 20: Adjustment mechanism 30: Cushion structure 40: Chair back device 41: Support shell 411: support surface 412: Vent hole 42: wind hood 421: U-shaped connection surface 422: top 423: Sidewall 424: Backplane 425: Vent 43: heat dissipation structure 431: heat sink substrate 432: cooling fins 433: Connector 434: Cooling Channel 44: Spacer 45: Fan 46: Elastic breathable cover 50: Computer 51: mainframe 52: Motherboard 53: Handling wafers 54: display card D1: Extension direction S1: Airflow chamber T1: heat pipe

第1圖為根據一些實施中本揭露之通風座椅的側視圖。 第2圖為根據一些實施中本揭露之坐墊結構以及椅背裝置的分解圖。 第3圖為根據一些實施中本揭露之椅背裝置以及電腦的示意圖。Figure 1 is a side view of a ventilated seat according to the present disclosure in some implementations. Fig. 2 is an exploded view of the cushion structure and the seat back device according to the present disclosure in some implementations. FIG. 3 is a schematic diagram of a chair back device and a computer according to the present disclosure in some implementations.

1:通風座椅 1: Ventilated seat

10:基座 10: Pedestal

20:調整機構 20: Adjustment mechanism

30:坐墊結構 30: Cushion structure

40:椅背裝置 40: Chair back device

45:風扇 45: Fan

50:電腦 50: Computer

Claims (12)

一種通風座椅,包括: 一坐墊結構;以及 一椅背裝置,連接於該坐墊結構,且包括: 一支撐殼體,具有一支撐面以及形成於該支撐面之複數個透氣孔; 一集風罩,連接於該支撐殼體,且具有複數個排氣孔; 一散熱結構,連接於該集風罩,其中該支撐殼體、該集風罩以及該散熱結構內形成一氣流腔;以及 一風扇,用以提供一氣流至該氣流腔內,且該氣流經由該等透氣孔以及該等排氣孔排出於該氣流腔。A ventilated seat, comprising: a cushion structure; and a seat back device, connected to the cushion structure, and comprising: a supporting shell having a supporting surface and a plurality of ventilation holes formed on the supporting surface; a wind collecting A cover connected to the supporting shell and having a plurality of exhaust holes; a heat dissipation structure connected to the air collecting cover, wherein an air flow cavity is formed in the supporting shell, the air collecting cover and the heat dissipation structure; and a The fan is used to provide an air flow into the air flow cavity, and the air flow is discharged from the air flow cavity through the ventilation holes and the exhaust holes. 如申請專利範圍第1項所述之通風座椅,更包括一電腦,耦接於該散熱結構。The ventilated seat described in item 1 of the scope of patent application further includes a computer coupled to the heat dissipation structure. 如申請專利範圍第2項所述之通風座椅,其中該電腦連接於該集風罩。The ventilated seat as described in item 2 of the scope of patent application, wherein the computer is connected to the wind hood. 如申請專利範圍第2項所述之通風座椅,其中該散熱結構更包括: 一散熱基板,連接於該集風罩;以及 複數個散熱鰭片,設置於該散熱基板上,且位於該氣流腔內。According to the ventilated seat according to the second item of the patent application, the heat dissipation structure further includes: a heat dissipation substrate connected to the air collecting cover; and a plurality of heat dissipation fins arranged on the heat dissipation substrate and located in the airflow Cavity. 如申請專利範圍第4項所述之通風座椅,更包括一散熱管,連接於該電腦以及該散熱結構,其中該散熱基板更包括連接於該散熱管之一冷卻通道,且一冷卻液填充於該散熱管以及該冷卻通道內。The ventilated seat described in item 4 of the scope of patent application further includes a heat dissipation pipe connected to the computer and the heat dissipation structure, wherein the heat dissipation substrate further includes a cooling channel connected to the heat dissipation pipe, and a coolant is filled In the radiating pipe and the cooling channel. 如申請專利範圍第1項所述之通風座椅,更包括一間隔板,連接於該集風罩,且位於該散熱結構以及該支撐殼體之間。The ventilated seat as described in item 1 of the scope of patent application further includes a partition plate connected to the wind hood and located between the heat dissipation structure and the support shell. 如申請專利範圍第1項所述之通風座椅,其中該椅背裝置相對於該坐墊結構傾斜,且相對於該坐墊結構為可轉動的。According to the ventilated seat described in item 1 of the scope of patent application, the seat back device is inclined relative to the cushion structure and is rotatable relative to the cushion structure. 如申請專利範圍第1項所述之通風座椅,其中該等排氣孔位於該集風罩之頂部,且該風扇位於該集風罩之底部。In the ventilated seat described in item 1 of the scope of patent application, the exhaust holes are located at the top of the air collecting hood, and the fan is located at the bottom of the air collecting hood. 如申請專利範圍第1項所述之通風座椅,更包括: 一基座;以及 一調整機構,設置於該基座上, 其中該坐墊結構設置於該調整機構上,且該調整機構用以轉動該坐墊結構。The ventilated seat described in item 1 of the scope of patent application further includes: a base; and an adjustment mechanism disposed on the base, wherein the cushion structure is disposed on the adjustment mechanism, and the adjustment mechanism is used for Rotate the cushion structure. 如申請專利範圍第1項所述之通風座椅,其中該椅背裝置更包括一彈性透氣罩,包覆該支撐殼體。According to the ventilated seat described in claim 1, wherein the seat back device further includes an elastic ventilating cover covering the supporting shell. 如申請專利範圍第1項所述之通風座椅,其中該集風罩包括: 一頂部,具有該等排氣孔;以及 二側壁,連接於該頂部,且相互分離, 其中該頂部以及該等側壁形成一U型結構,連接於該支撐殼體,且該散熱結構以及該風扇連接於該等側壁。According to the ventilated seat described in item 1 of the scope of patent application, the air collecting hood includes: a top with the exhaust holes; and two side walls connected to the top and separated from each other, wherein the top and the The side wall forms a U-shaped structure and is connected to the support shell, and the heat dissipation structure and the fan are connected to the side walls. 如申請專利範圍第1項所述之通風座椅,其中該集風罩更包括一背板,連接於該頂部以及該等側壁,且與該支撐殼體分離,其中該背板連接於該散熱結構以及一電腦。According to the ventilated seat described in claim 1, wherein the wind hood further includes a back plate connected to the top and the side walls, and separated from the support shell, wherein the back plate is connected to the heat sink Structure and a computer.
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