TW202027101A - Flexible resistor component and manufacturing method thereof - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000005452 bending Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 17
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 238000004383 yellowing Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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Abstract
Description
本發明是關於一種電阻元件領域,尤其是關於一種可和軟性電路載體組裝的可撓性電阻元件。The present invention relates to the field of resistance elements, in particular to a flexible resistance element that can be assembled with a flexible circuit carrier.
台灣專利號I529753揭露一種過電流保護元件,包括一正溫度係數(Positive Temperature Coefficient, PTC)特性的導電複合材料疊設於二金屬箔片之間,其電阻對於溫度變化具有反映敏銳的特性,正常溫度下過電流保護元件維持低電阻,當電路或電池發生過電流或過高溫的現象時,過電流保護元件會瞬間提高至一高電阻狀態,以達到保護電池或電路元件的目的。其中,PTC導電複合材料由一種或一種以上具結晶性的聚合物及導電添料所組成。Taiwan Patent No. I529753 discloses an over-current protection element, which includes a positive temperature coefficient (PTC) conductive composite material laminated between two metal foils, and its resistance is sensitive to temperature changes. Normal The overcurrent protection element maintains a low resistance under temperature. When the circuit or battery has an overcurrent or high temperature, the overcurrent protection element will instantly increase to a high resistance state to protect the battery or circuit element. Among them, the PTC conductive composite material is composed of one or more crystalline polymers and conductive additives.
類似上述的可實現特定功能的電阻元件,通常使用硬度高的基板,對於和其他結構或元件組裝時有所侷限,可以加以改善。Similar to the above-mentioned resistor elements that can achieve specific functions, usually a high-hardness substrate is used, which has limitations when it is assembled with other structures or elements and can be improved.
於此提供一種可撓式電阻元件,其具有一被設定的電阻值、額定功率(rated power)和電阻溫度係數(temperature coefficient of resistance)特性,適用於和軟性基板組裝。可撓式電阻元件可包括可撓性基板和可撓性導電材料,具有軟性可曲撓及彎折的功能,可作為承受大角度彎折的電阻產品。Provided herein is a flexible resistor element, which has a set resistance value, rated power and temperature coefficient of resistance characteristics, and is suitable for assembly with a flexible substrate. The flexible resistance element can include a flexible substrate and a flexible conductive material, and has the function of being flexible and flexible, and can be used as a resistance product that can withstand large-angle bending.
依據上述,一種可撓式電阻元件,包括: 一可撓性基板;一電阻層附著於該可撓性基板的一表面上,其中該電阻層具有一電阻圖案;複數個電極彼此分開地附著於該可撓性基板的該表面上以及部分該電阻層上;以及一保護層覆蓋於該可撓性基板的另一表面上、該電阻層上和部分該可撓性基板的該表面上,其中該保護層暴露出該些電極,以及該可撓性電組元件具有大於90度的彎折度。According to the above, a flexible resistance element includes: a flexible substrate; a resistance layer attached to a surface of the flexible substrate, wherein the resistance layer has a resistance pattern; a plurality of electrodes are separately attached to each other On the surface of the flexible substrate and part of the resistance layer; and a protective layer covering the other surface of the flexible substrate, on the resistance layer and part of the surface of the flexible substrate, wherein The protective layer exposes the electrodes, and the flexible electrical component has a bending degree greater than 90 degrees.
依據上述,一種可撓式電阻元件的製作方法,包括: 提供一可撓性基板;形成一電阻圖案在該可撓性基板的至少一表面上;形成一電極在該可撓性基板和部分該電阻圖案上,其中該電極和該電阻圖案有導電接觸;以及覆蓋一保護層在該可撓性基板上,其中該保護層覆蓋該電阻圖案、該電阻圖案旁的該可撓性基板的該表面以及該可撓性基板的另一表面,並暴露出該電極,以及該可撓式電阻元件具有大於90度的彎折度。According to the above, a method for manufacturing a flexible resistance element includes: providing a flexible substrate; forming a resistance pattern on at least one surface of the flexible substrate; forming an electrode on the flexible substrate and part of the flexible substrate On the resistance pattern, wherein the electrode and the resistance pattern have conductive contact; and cover a protective layer on the flexible substrate, wherein the protective layer covers the resistance pattern and the surface of the flexible substrate beside the resistance pattern And the other surface of the flexible substrate exposes the electrode, and the flexible resistance element has a bending degree greater than 90 degrees.
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The following detailed descriptions are provided with specific embodiments in conjunction with the accompanying drawings to make it easier to understand the purpose, technical content, characteristics and effects of the present invention.
以下將詳述本發明之各實施例,並配合圖式作為例示。除了這些詳細說明之外,本發明亦可廣泛地施行於其它的實施例中,任何所述實施例的輕易替代、修改、等效變化都包含在本發明之範圍內,並以申請專利範圍為準。在說明書的描述中,為了使讀者對本發明有較完整的瞭解,提供了許多特定細節;然而,本發明可能在省略部分或全部特定細節的前提下,仍可實施。此外,眾所周知的步驟或元件並未描述於細節中,以避免對本發明形成不必要之限制。特別注意的是,圖式僅為示意之用,並非代表元件實際之尺寸或數量,有些細節可能未完全繪出,以求圖式之簡潔。Hereinafter, various embodiments of the present invention will be described in detail, with drawings as examples. In addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments. Easy substitutions, modifications, and equivalent changes of any of the embodiments are included in the scope of the present invention, and the scope of the patent application is quasi. In the description of the specification, in order to enable the reader to have a more complete understanding of the present invention, many specific details are provided; however, the present invention may still be implemented under the premise that some or all of the specific details are omitted. In addition, well-known steps or elements are not described in details to avoid unnecessary limitation of the present invention. It should be noted that the drawings are for illustration purposes only, and do not represent the actual size or quantity of the components. Some details may not be completely drawn in order to keep the drawings simple.
參考圖1和圖2,一可撓性電阻元件1包括作為本體的一可撓性基板10、一電阻層12、一保護層14以及電極16、電極18。於一例中,可撓性電阻元件1為一具有一均勻厚度和片狀外觀的片電阻元件,表現一電阻值、額定功率以及電阻溫度係數。其次,可撓性基板10可由一塑膠材料提供,此塑膠材料具有輕薄和抗撓折的特性,舉例但不限地,例如 聚醯亞胺(Polyimide, PI)、聚萘二甲酸乙二醇酯(Polyethylene naphthalate, PEN)、聚酯(Polyester, PET)等等。電阻層12具有一直條或曲線條的電阻形狀,並以適當的方法附著或形成在可撓性基板10的至少一表面,其材料舉例但不限地,例如一導電合金、金屬皮膜或是導電漿料。電極16、18以適當的方法附著或形成在電阻層12上,並和電阻層12有電性連接,例如和電阻層12的電阻圖案有部分重疊(圖上未繪),保護層14則覆蓋於電阻層12上並暴露出電極16、18的至少一部份或全部。另,保護層14亦覆蓋可撓性基板10的另一表面,其材料舉例但不限地,例如環氧樹脂、聚酯樹脂、聚醯亞胺或聚丙烯。Referring to FIGS. 1 and 2, a
圖3為本案的可撓性電阻元件1的製作流程示意圖。請參考圖3,提供一可撓性基板(步驟20),其次,在可撓性基板的至少一表面上形成一電阻圖案(步驟22),其中,電阻層的電阻圖形的形成方法,舉例但不限地,包括沖切、印刷、雷射或蝕刻等方式。以蝕刻為例,移除方法是以一感光膜覆蓋於導電皮膜上,透過黃光製程,例如透過曝光、顯影、蝕刻等步驟將導電皮膜塑形以做出具有電阻圖案的電阻層。以印刷為例,其透過印刷製程形成電阻圖案,依照電阻值需求使用設計網版圖形以提供具有一電阻圖形的一網版。之後,應用該網版進行印刷,可將導電漿料印刷於該可撓性基板的該表面上以形成該電阻圖案,電阻圖案可以是直條狀或是曲折線條狀。之後,在部分該可撓性基板上和部分該電阻圖案上形成一電極(步驟24),此形成方式是以一另一感光膜覆蓋在電阻圖案和電阻圖案旁被暴露出的可撓性基板的表面上,透過黃光製程暴露出部分電阻圖案後,再透過電鍍等適當方式將導電材料形成在暴露出的電阻圖案上以形成電極,其中電極和電阻圖案有導電接觸。之後,將保護層覆蓋在電阻圖案的表面、電阻圖案旁的可撓性基板的表面以及可撓性基板的另一表面(步驟26)。要說明的是,考量實務上,上述製程可用於一次製作複數個可撓性電阻元件,故於上述步驟後,可再加上適當的分割方式,例如沖切,形成複數個分離的片狀可撓性電阻元件(步驟28)。FIG. 3 is a schematic diagram of the manufacturing process of the
是以,依據上述製作出的可撓性電阻元件,透過可撓性基板和電阻層的材料匹配,加上幾何尺寸(包括面積和厚度)的設計,可以使得成形的片狀可撓性電阻元件具有大於90度的彎折度、較低的電阻溫度係數(TCR)(如可提供數值範圍則請提供)、耐功率,可適合高低溫儲存環境(如可提供數值範圍則請提供)。Therefore, according to the above-mentioned flexible resistance element, through the material matching of the flexible substrate and the resistance layer, plus the design of geometric dimensions (including area and thickness), the formed sheet-shaped flexible resistance element It has a bend degree greater than 90 degrees, a low temperature coefficient of resistance (TCR) (please provide if the value range is available), power resistance, and can be suitable for high and low temperature storage environments (if the value range is available, please provide).
以上所述之實施例僅是為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。The above-mentioned embodiments are only to illustrate the technical ideas and features of the present invention, and their purpose is to enable those who are familiar with the art to understand the content of the present invention and implement them accordingly. When they cannot be used to limit the patent scope of the present invention, That is, all equal changes or modifications made in accordance with the spirit of the present invention should still be covered by the patent scope of the present invention.
1:可撓性電阻元件 10:可撓性基板 12:電阻層 14:保護層 16:電極 18:電極 20、22、24、26、28:步驟 1: Flexible resistance element 10: Flexible substrate 12: Resistance layer 14: protective layer 16: electrode 18: Electrode 20, 22, 24, 26, 28: steps
圖1為本案的單一個可撓式電阻元件的部分結構立體彎曲示意圖。Figure 1 is a three-dimensional bending schematic diagram of a partial structure of a single flexible resistance element of the present application.
圖2為本案的單一個可撓式電阻元件的剖面示意圖。Fig. 2 is a schematic cross-sectional view of a single flexible resistor element of the present application.
圖3為本案的可撓式電阻元件的製作流程示意圖。Fig. 3 is a schematic diagram of the manufacturing process of the flexible resistance element of the present invention.
1:可撓性電阻元件 1: Flexible resistance element
10:可撓性基板 10: Flexible substrate
12:電阻層 12: Resistance layer
14:保護層 14: protective layer
16:電極 16: electrode
18:電極 18: Electrode
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US7059769B1 (en) * | 1997-06-27 | 2006-06-13 | Patrick Henry Potega | Apparatus for enabling multiple modes of operation among a plurality of devices |
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