TW202024934A - Electronic device and signal transmission method thereof - Google Patents
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本發明是有關於一種電子裝置與其訊號傳輸方法。The invention relates to an electronic device and its signal transmission method.
一般來說,若電子裝置需要同時支援資料儲存與無線通訊功能,則需要在電子裝置內部設置至少兩個連接介面電路(或插槽)以分別連接儲存電路模組與無線通訊電路模組。其中,一個連接介面電路需要符合儲存電路模組的連接介面規格,而另一個連接介面電路則需要符合無線通訊電路模組的連接介面規格。但是,隨著電子裝置的體積越來越小,如何更為有效地利用電子裝置的內部空間為本領域技術人員所致力的課題之一。Generally speaking, if the electronic device needs to support both data storage and wireless communication functions, at least two connection interface circuits (or slots) need to be provided inside the electronic device to connect the storage circuit module and the wireless communication circuit module respectively. Among them, one connection interface circuit needs to comply with the connection interface specifications of the storage circuit module, and the other connection interface circuit needs to comply with the connection interface specifications of the wireless communication circuit module. However, as the volume of the electronic device becomes smaller and smaller, how to use the internal space of the electronic device more effectively is one of the subjects that those skilled in the art are committed to.
本發明提供一種電子裝置與其訊號傳輸方法,可使晶片模組內的儲存電路模組與無線通訊電路模組共用同一個連接介面電路,從而更有效利用電子裝置的內部空間。The invention provides an electronic device and a signal transmission method thereof, which can make the storage circuit module and the wireless communication circuit module in a chip module share the same connection interface circuit, thereby more effectively using the internal space of the electronic device.
本發明的一實施例提供一種電子裝置,其包括電路板、連接介面電路及晶片模組。所述連接介面電路設置於所述電路板且包括多個連接接腳。所述晶片模組設置於所述電路板且經由所述連接接腳連接至所述連接介面電路。所述晶片模組包括儲存電路模組與無線通訊電路模組。所述儲存電路模組提供資料儲存功能,且所述無線通訊電路模組提供無線通訊功能。所述連接接腳中的多個第一類接腳用以在所述儲存電路模組與所述連接介面電路之間傳遞與所述資料儲存功能相關的第一類訊號。所述連接接腳中的多個第二類接腳用以在所述無線通訊電路模組與所述連接介面電路之間傳遞與所述無線通訊功能相關的第二類訊號。An embodiment of the present invention provides an electronic device including a circuit board, a connection interface circuit and a chip module. The connection interface circuit is disposed on the circuit board and includes a plurality of connection pins. The chip module is disposed on the circuit board and connected to the connection interface circuit through the connection pins. The chip module includes a storage circuit module and a wireless communication circuit module. The storage circuit module provides a data storage function, and the wireless communication circuit module provides a wireless communication function. The plurality of first-type pins of the connection pins are used for transmitting the first-type signals related to the data storage function between the storage circuit module and the connection interface circuit. The plurality of second-type pins of the connection pins are used for transmitting the second-type signals related to the wireless communication function between the wireless communication circuit module and the connection interface circuit.
本發明的另一實施例提供一種訊號傳輸方法,其用於電路板。所述電路板設置有連接介面電路與晶片模組。所述連接介面電路包括多個連接接腳。所述晶片模組經由所述連接接腳連接至所述連接介面電路。所述訊號傳輸方法包括:由所述晶片模組中的儲存電路模組提供資料儲存功能;由所述晶片模組中的無線通訊電路模組提供無線通訊功能;經由所述連接接腳中的多個第一類接腳在所述儲存電路模組與所述連接介面電路之間傳遞與所述資料儲存功能相關的第一類訊號;以及經由所述連接接腳中的多個第二類接腳在所述無線通訊電路模組與所述連接介面電路之間傳遞與所述無線通訊功能相關的第二類訊號。Another embodiment of the present invention provides a signal transmission method used in a circuit board. The circuit board is provided with a connection interface circuit and a chip module. The connection interface circuit includes a plurality of connection pins. The chip module is connected to the connection interface circuit through the connection pins. The signal transmission method includes: providing a data storage function by a storage circuit module in the chip module; providing a wireless communication function by a wireless communication circuit module in the chip module; A plurality of first-type pins transmit first-type signals related to the data storage function between the storage circuit module and the connection interface circuit; and through a plurality of second-type pins of the connection pins The pins transmit the second-type signal related to the wireless communication function between the wireless communication circuit module and the connection interface circuit.
基於上述,在將包含儲存電路模組與無線通訊電路模組的晶片模組設置於電路板後,晶片模組可經由連接接腳連接至電路板上的連接介面電路。爾後,與儲存電路模組提供的資料儲存功能相關的第一類訊號可經由所述連接接腳中的第一類接腳在儲存電路模組與連接介面電路之間傳輸,且與無線通訊電路模組提供的無線通訊功能相關的第二類訊號可經由所述連接接腳中的第二類接腳在無線通訊電路模組與連接介面電路之間傳輸,從而更有效利用電子裝置的內部空間。Based on the above, after the chip module including the storage circuit module and the wireless communication circuit module is installed on the circuit board, the chip module can be connected to the connection interface circuit on the circuit board through the connection pins. Thereafter, the first type of signal related to the data storage function provided by the storage circuit module can be transmitted between the storage circuit module and the connection interface circuit through the first type of the connection pins, and is connected to the wireless communication circuit The second type of signal related to the wireless communication function provided by the module can be transmitted between the wireless communication circuit module and the connection interface circuit through the second type of the connection pins, thereby more effectively using the internal space of the electronic device .
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
圖1是根據本發明的一實施例所繪示的電子裝置的示意圖。請參照圖1,電子裝置包括電路板10、連接介面電路11及晶片模組12。所述電子裝置可以是筆記型電腦、桌上型電腦等任何支援無線通訊功能、資料儲存功能及資料處理功能的電子裝置。電路板10設置於所述電子裝置內。例如,電路板10可以為所述電子裝置的主機板。連接介面電路11及晶片模組12設置於電路板10上。此外,電路板10上還可設置有其他類型的電路或晶片,例如中央處理器(CPU)、隨機存取記憶體(RAM)等,本發明不加以限制。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention. Please refer to FIG. 1, the electronic device includes a
連接介面電路11包括多個連接接腳13。晶片模組12可經由連接接腳13連接至連接介面電路11。例如,晶片模組12可具有多個相應的接腳,以與連接接腳13電性連接。經由連接介面電路11,晶片模組12可與電路板10上的其他電路及/或晶片進行通訊。The
晶片模組12包括儲存電路模組121與無線通訊電路模組122。儲存電路模組121用以提供資料儲存功能。例如,儲存電路模組121可包括固態硬碟(SSD)模組,以提供非揮發性的資料儲存功能。無線通訊電路模組122用以提供無線通訊功能。例如,無線通訊電路模組122可包括WiFi與藍芽(bluetooth)模組,以提供無線區域網路連線與短距離無線通訊功能。The
連接接腳13包括多個第一類接腳、多個第二類接腳、至少一第三類接腳及至少一第四類接腳。所述第一類接腳用以在儲存電路模組121與連接介面電路11之間傳遞與所述資料儲存功能相關的第一類訊號S1。例如,第一類訊號S1可包含在儲存電路模組121運行過程中與中央處理器(或記憶體控制器)進行通訊的訊號(例如資料訊號)。此外,第一類訊號S1也可包括在儲存電路模組121運行過程中可能使用到的時脈訊號等等。The connecting
所述第二類接腳用以在無線通訊電路模組122與連接介面電路11之間傳遞與所述無線通訊功能相關的第二類訊號S2。例如,第二類訊號S2可包含在無線通訊電路模組122運行過程中從外部裝置無線地接收到的訊號或欲無線地傳送至外部裝置的訊號。此外,第二類訊號S2也可包括在無線通訊電路模組122運行過程中可能使用到的時脈訊號等等。The second-type pins are used to transmit a second-type signal S2 related to the wireless communication function between the wireless
所述第三類接腳用以提供電源訊號PWR至儲存電路模組121與無線通訊電路模組122。所述第四類接腳用以提供參考接地訊號GND至儲存電路模組121與無線通訊電路模組122。The third type of pins is used to provide the power signal PWR to the
換言之,在儲存電路模組121與無線通訊電路模組122的運作過程中,儲存電路模組121與無線通訊電路模組122可共用第三類接腳所提供的電源訊號PWR以及第四類接腳所提供的參考接地訊號GND。但是,與儲存電路模組121提供的資料儲存功能相關的第一類訊號S1則經由第一類接腳傳遞,並且與無線通訊電路模組122所提供的無線通訊功能相關的第二類訊號則經由第二類接腳傳遞。In other words, during the operation of the
從另一角度來看,第一類接腳是被配置給儲存電路模組121使用,第二類接腳是被配置給無線通訊電路模組122使用,並且第三類接腳與第四類接腳則可同時配置給儲存電路模組121與無線通訊電路模組122共同使用。From another point of view, the first type of pins are configured for the
下表1為根據本發明的一實施例所提出的連接接腳13的新的腳位定義。須注意的是,表1是以符合M.2連接介面標準的連接介面電路11作為範例,且連接接腳13為M.2的M-Key類型。 表1
參照表1,在一實施例中,編號為5、7、11、13、17、19、23、25、29、31、35、37、38、41、43、47、49、50、52、53、55、68、69的接腳可為第一類接腳;編號為6、8、20、22、24、26、28、30、32、34、36、40、42、44、46、48、54、56的接腳可為第二類接腳;編號為2、4、12、14、16、18、70、72、74的接腳可為第三類接腳;並且編號為1、3、9、15、21、27、33、39、45、51、57、71、73、75的接腳可為第四類接腳。Referring to Table 1, in one embodiment, the numbers are 5, 7, 11, 13, 17, 19, 23, 25, 29, 31, 35, 37, 38, 41, 43, 47, 49, 50, 52, The pins of 53, 55, 68, 69 can be the first type of pins; the numbers are 6, 8, 20, 22, 24, 26, 28, 30, 32, 34, 36, 40, 42, 44, 46, The pins of 48, 54, 56 can be the second type of pins; the pins numbered 2, 4, 12, 14, 16, 18, 70, 72, 74 can be the third type of pins; and the number is 1 The pins of, 3, 9, 15, 21, 27, 33, 39, 45, 51, 57, 71, 73, 75 can be the fourth type of pins.
然而,上表1僅為範例,在其他實施例中,連接介面電路11的規格、連接接腳13的至少一個腳位定義、及連接接腳13的接腳總數皆可視實務需求調整,本發明不加以限制。However, the above Table 1 is only an example. In other embodiments, the specifications of the
圖2是根據本發明的一實施例所繪示的晶片模組的示意圖。請參照圖2,在一實施例中,晶片模組12可包括開關電路21、WiFi電路22及藍芽電路23。WiFi電路22用以提供WiFi通訊功能。藍芽電路23用以提供藍芽通訊功能。WiFi電路22及藍芽電路23皆連接至開關電路21以經由開關電路21傳輸第二類訊號S2。在本實施例中,開關電路21可根據選擇訊號(未繪示)導通WiFi電路22與藍芽電路23的其中之一以傳輸第二類訊號S2。例如,當WiFi電路22被導通時,WiFi電路22可經由開關電路21傳輸與WiFi通訊相關的第二類訊號S2,且此時藍芽電路23無法傳輸第二類訊號S2。當藍芽電路23被導通時,藍芽電路23可經由開關電路21傳輸與藍芽通訊相關的第二類訊號S2,且此時WiFi電路22無法傳輸第二類訊號S2。FIG. 2 is a schematic diagram of a chip module according to an embodiment of the invention. Please refer to FIG. 2, in an embodiment, the
須注意的是,在圖2的實施例中,WiFi電路22與藍芽電路23可被開關電路21切換以傳輸第二類訊號S2。然而,在圖1的實施例中,儲存電路模組121與無線通訊電路模組122之間並不需要由特定的開關電路進行切換。亦即,儲存電路模組121與無線通訊電路模組122可同時運作以分別傳輸第一類訊號S1與第二類訊號S2。It should be noted that in the embodiment of FIG. 2, the
在圖1的一實施例中,若僅儲存電路模組121被致能或啟動,則被致能或啟動的儲存電路模組121可單獨運作,不受未被致能或未被啟動的無線通訊電路模組122影響。或者,若僅無線通訊電路模組122被致能或啟動,則無線通訊電路模組122可單獨運作,不受未被致能或未被啟動的儲存電路模組121影響。In the embodiment of FIG. 1, if only the
圖3是根據本發明的一實施例所繪示的訊號傳輸方法的流程圖。請參照圖3,在步驟S301中,致能或啟動晶片模組中的儲存電路模組,並由儲存電路模組提供資料儲存功能。在步驟S302中,致能或啟動晶片模組中的無線通訊電路模組,並由無線通訊電路模組提供無線通訊功能。在步驟S303中,經由多個第一類接腳在儲存電路模組與連接介面電路之間傳遞與所述資料儲存功能相關的第一類訊號。在步驟S304中,經由多個第二類接腳在無線通訊電路模組與連接介面電路之間傳遞與所述無線通訊功能相關的第二類訊號。FIG. 3 is a flowchart of a signal transmission method according to an embodiment of the invention. Referring to FIG. 3, in step S301, the storage circuit module in the chip module is enabled or activated, and the storage circuit module provides a data storage function. In step S302, the wireless communication circuit module in the chip module is enabled or activated, and the wireless communication circuit module provides the wireless communication function. In step S303, the first-type signals related to the data storage function are transmitted between the storage circuit module and the connection interface circuit through a plurality of first-type pins. In step S304, a second-type signal related to the wireless communication function is transmitted between the wireless communication circuit module and the connection interface circuit through a plurality of second-type pins.
須注意的是,在圖3的另一實施例中,亦可以先執行步驟S302然後再執行步驟S301,及/或先執行步驟S304然後再執行步驟S303。或者,在未致能或未啟動儲存電路模組的情況下,亦可以只執行步驟S302與S304。或者,在未致能或未啟動無線通訊電路模組的情況下,亦可以只執行步驟S301與S303。It should be noted that in another embodiment of FIG. 3, step S302 may be performed first and then step S301, and/or step S304 may be performed first and then step S303 may be performed. Alternatively, when the storage circuit module is not enabled or not activated, only steps S302 and S304 may be executed. Alternatively, when the wireless communication circuit module is not enabled or activated, only steps S301 and S303 may be executed.
然而,圖3中各步驟已詳細說明如上,在此便不再贅述。值得注意的是,圖3中各步驟可以實作為多個程式碼或是電路,本發明不加以限制。此外,圖3的方法可以搭配以上範例實施例使用,也可以單獨使用,本發明不加以限制。However, each step in FIG. 3 has been described in detail as above, and will not be repeated here. It should be noted that each step in FIG. 3 can be implemented as a plurality of program codes or circuits, and the present invention is not limited. In addition, the method in FIG. 3 can be used in conjunction with the above exemplary embodiments, or can be used alone, and the present invention is not limited.
綜上所述,在將包含儲存電路模組與無線通訊電路模組的晶片模組設置於電路板後,晶片模組可經由連接介面電路的連接接腳連接至電路板上的連接介面電路。爾後,與儲存電路模組提供的資料儲存功能相關的第一類訊號可經由所述連接接腳中的第一類接腳在儲存電路模組與連接介面電路之間傳輸,且與無線通訊電路模組提供的無線通訊功能相關的第二類訊號可經由所述連接接腳中的第二類接腳在無線通訊電路模組與連接介面電路之間傳輸。透過將儲存電路模組與無線通訊電路模組整合至同一個晶片模組並使用單一個連接介面電路來連接,可更加有效利用電子裝置的內部空間。此外,在另一實施例中,其他類型的電路模組亦可以被整合至同一個晶片模組,而不限於上述儲存電路模組與無線通訊電路模組。In summary, after the chip module including the storage circuit module and the wireless communication circuit module is installed on the circuit board, the chip module can be connected to the connection interface circuit on the circuit board through the connection pins of the connection interface circuit. Thereafter, the first type of signal related to the data storage function provided by the storage circuit module can be transmitted between the storage circuit module and the connection interface circuit through the first type of the connection pins, and is connected to the wireless communication circuit The second type of signal related to the wireless communication function provided by the module can be transmitted between the wireless communication circuit module and the connection interface circuit through the second type of the connection pins. By integrating the storage circuit module and the wireless communication circuit module into the same chip module and using a single connection interface circuit to connect, the internal space of the electronic device can be more effectively used. In addition, in another embodiment, other types of circuit modules can also be integrated into the same chip module, and are not limited to the aforementioned storage circuit module and wireless communication circuit module.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.
10:電路板11:連接介面電路12:晶片模組13:連接接腳121:儲存電路模組122:無線通訊電路模組21:開關電路22:WiFi電路23:藍芽電路S301~S304:步驟10: Circuit board 11: Connection interface circuit 12: Chip module 13: Connection pin 121: Storage circuit module 122: Wireless communication circuit module 21: Switch circuit 22: WiFi circuit 23: Bluetooth circuit S301~S304: Steps
圖1是根據本發明的一實施例所繪示的電子裝置的示意圖。 圖2是根據本發明的一實施例所繪示的晶片模組的示意圖。 圖3是根據本發明的一實施例所繪示的訊號傳輸方法的流程圖。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention. FIG. 2 is a schematic diagram of a chip module according to an embodiment of the invention. FIG. 3 is a flowchart of a signal transmission method according to an embodiment of the invention.
S301~S304:步驟 S301~S304: steps
Claims (10)
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TWI815734B (en) * | 2022-11-18 | 2023-09-11 | 神基科技股份有限公司 | Electronic device with m.2 connector compatible with two communication modules and compatible method and computer-implemented method thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
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TWI815734B (en) * | 2022-11-18 | 2023-09-11 | 神基科技股份有限公司 | Electronic device with m.2 connector compatible with two communication modules and compatible method and computer-implemented method thereof |
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