TW202021029A - Holding device capable of preventing wafer from releasing from carrying disc and reducing risks of cracks or damages on wafer surface - Google Patents

Abstract

The present invention relates to holding device for holding a wafer, which comprises a carrying disc and multiple support arm units. The carrying disc is suitable for carrying and sucking a wafer, and may rotate by using a center axle as the axis. The support arm unit is connected with the carrying disc and linked therewith. Each support arm unit comprises a rail rack, a transmission module, and a position-limiting module. The rail rack is connected with the periphery of the carrying disc and defines a rail space. The transmission module is disposed in the rail space, and is provided with a transmission member, which may be dragged by the centrifugal force generated during the rotation of the carrying disc and moved in the direction away from the center axle. The position-limiting module is connected with the transmission module and the rail rack, and is provided with a position-limiting mechanism that is driven by the transmission member for rotating in a direction towards or away from the center axle. The position-limiting mechanism is provided with a buckling groove for receiving the edge of the wafer.

Description

Holding device

The invention relates to a holding device, in particular to a wafer holding device.

Referring to FIGS. 1 and 2, in the lithography process of the existing wafer, the wafer 9 is driven to rotate through the carrier device 8 for photoresist coating, development, photoresist removal, and etching processes. The carrying device 8 includes a vacuum chuck 81 and a plurality of limiting mechanisms 82 disposed on the periphery of the vacuum chuck 81. The vacuum chuck 81 is used to attract the wafer 9. Each limit mechanism 82 has a weight 821 and a pressing member 822. The weight 821 is suspended from the peripheral side of the vacuum chuck 81. The pressing member 822 is connected to the weight 821 and can pivot relative to the vacuum chuck 81. During the rotation of the vacuum chuck 81, the weight 821 is driven by the centrifugal force generated by the rotation of the vacuum chuck 81 to be displaced obliquely upward, so that the pressing member 822 is pressed against the top surface of the wafer 9 to reach the wafer 9 The effect of positioning. However, using the weight 821 to drive the pressing member 822 to position the wafer 9 makes it more difficult to control the stress under which the pressing member 822 presses down. It is easy to cause the weight 821 to deflect greatly due to the violent acceleration required when the vacuum chuck 81 rotates, but it also causes The pressing member 822 instantly presses down on the top surface of the wafer 9, which is easy to cause cracks or damage on the surface of the wafer 9.

Therefore, one of the objects of the present invention is to provide a holding device that can reduce the damage to the wafer.

Therefore, in some embodiments, the holding device of the present invention is suitable for holding a wafer having a top surface and a bottom surface on opposite sides, and an outer side surface connected to the top surface and the bottom surface. The holding device includes a bearing plate and a plurality of arm units. The carrier plate is suitable for supporting and attracting the bottom surface of the wafer, and can rotate around a central axis. The support arm units are connected to the periphery of the carrier plate at intervals and interlocked with the carrier plate, and jointly define a wafer placement area corresponding to the wafer size with the carrier plate. The arm units are suitable for limiting the wafer to the carrier disk when the carrier disk rotates. Each arm unit includes a track frame, a transmission module and a limit module. The track frame is connected to the periphery of the bearing plate and extends in a radial direction of the bearing plate in a direction away from the central axis. The track frame defines a track space. The transmission module is disposed in the track space, and has a transmission member that can be pulled away by the centrifugal force generated when the carrier disk rotates and moves away from the central axis. The limit module is connected to the transmission module and the rail frame, and has a limit mechanism that can be driven by the transmission member to rotate toward or away from the central axis. The limit mechanism has a snap groove for accommodating the side edge of the wafer, and the limit mechanism can be driven by the transmission member to rotate between a normal position and a holding position when the limit mechanism is located In the normal position, the buckle groove leaves the wafer placement area, and when the limiting mechanism rotates to the holding position, the buckle groove enters the wafer placement area to accommodate the side edge of the wafer.

In some embodiments, each transmission element has a plate body and a toothed portion formed on a surface of the plate body, and each limiting mechanism further has a toothed structure corresponding to the toothed portion.

In some embodiments, the toothed structure is a gear, and each limit module further has an end frame member connected to the rail frame, and a pivot shaft with both ends pivotally connected to the end frame member, each The limit mechanism also has a limit member, the limit member has the buckle groove, the tooth structure and the limit member are sleeved on the pivot.

In some embodiments, the rail frame of each arm unit has a side wall portion, the side wall portion has an elongated limiting groove extending in the same direction as the rail frame, the transmission of each arm unit The module also has a limiting rod connected to the transmission member and passing through the limiting slot. The movement range of the limiting rod is limited by the limiting slot, thereby limiting the moving distance of the transmission member.

In some embodiments, the rail frame of each arm unit has a bottom wall portion and a top wall portion opposite, the bottom wall portion has a first guide groove facing the top wall portion, the top wall portion There is a second guide groove facing the bottom wall portion, and the transmission module of each arm unit also has a plurality of guides connected to the transmission member and capable of rolling in the first guide groove and the second guide groove wheel.

In some embodiments, each arm unit further includes a reset module connected to the rail frame and the transmission member to provide a constant elastic recovery force of the transmission member toward the central axis.

In some implementations, the reset module has a fixing member connected to the rail frame, a connecting member connected to the transmission member, and two ends respectively abutting the fixing member and the connecting member to provide the The transmission member is an elastic member with a constant elastic recovery force toward the central axis.

The invention has at least the following effects: the centrifugal force generated when the bearing disc rotates around the central axis drives the transmission member to move away from the central axis in the track space, and at the same time, the transmission member drives the limit mechanism to rotate in a direction close to the central axis, The snap grooves of the limiting mechanisms are connected to the outer periphery of the wafer to prevent the wafer from flying off the carrier plate and reduce the risk of cracks or damage on the surface of the wafer.

3 and 4, an embodiment of the holding device 100 of the present invention is suitable for holding a wafer 9 and driving the wafer 9 to rotate for photoresist coating, development, photoresist removal, and etching processes. The wafer 9 has a top surface 91 and a bottom surface 92 on opposite sides, and an outer side surface 93 connected to the top surface 91 and the bottom surface 92. In the present embodiment, the wafer 9 is described with a flat appearance as an example, but the wafer 9 with this appearance is not limited, and may be a wafer 9 with a slightly warped peripheral edge.

The holding device 100 includes a carrying tray 1 and four arm units 2. The carrier plate 1 is suitable for supporting and attracting the bottom surface 92 of the wafer 9 and can rotate around a central axis C1. In detail, the carrier tray 1 includes a tray body 11, a rotating shaft 12 connected to the bottom side of the tray body 11, and a suction channel 13 penetrating the tray body 11 and the rotating shaft 12 along the central axis C1. The outer surface of the disc body 11 is circular and the center axis C1 is the center of the circle. The disc body 11 is suitable for the placement of the wafer 9 and has a plurality of first grooves 111 formed concentrically and recessed from the top side, and a cross-shaped and intersecting the disc body 11 The center of the second groove 112. The first grooves 111 and the second grooves 112 communicate with the suction channel 13. The rotating shaft 12 is suitable for connecting a driving device (not shown) and a vacuum pump (not shown). The driving device can drive the rotating shaft 12 to rotate, thereby driving the disk body 11 to rotate around the central axis C1. The vacuum pump can generate a suction force so that the gas between the bottom surface 92 of the wafer 9 and the disk body 11 is simultaneously introduced into the suction channel 13 through the first groove 111 and the second groove 112, and then The gas is led out from the suction channel 13 to the vacuum pump, so as to achieve the effect of the carrier plate 1 vacuum adsorbing the wafer 9. The design of the first trenches 111 and the second trenches 112 increases the area where the bottom surface 92 of the wafer 9 is adsorbed, and enhances the vacuum adsorption effect.

The arm units 2 are connected to the periphery of the carrier plate 1 at equal intervals and are interlocked with the carrier plate 1 and define a wafer corresponding to the size of the wafer 9 together with the disk body 11 of the carrier plate 1 Placement area 3. The arm units 2 are suitable for clamping the wafer 9 together when the carrier disk 1 rotates, so as to limit the wafer 9 on the carrier disk 1 and prevent the wafer 9 from flying off the carrier disk 1.

5 and FIG. 6 together, in detail, each arm unit 2 includes a rail frame 4, a transmission module 5, a limit module 6, and a reset module 7. The rail frame 4 is connected to the periphery of the carrier disk 1 and extends in a radial direction away from the central axis C1 in the radial direction of the carrier disk 1, and has a rail wall 41 defining a rail space 411, and a detachably covering The side cover 42 on the side of the rail wall 41. In the present embodiment, the rail wall 41 is integrally formed, and has a side wall portion 412, and a bottom wall portion 413 and a top wall portion 414 that extend from opposite sides of the side wall portion 412. The side wall portion 412 has a long limiting groove 412 a communicating with the rail space 411 and extending in the same direction as the rail frame 4. The bottom wall portion 413 has a first guide groove 413 a facing the top wall portion 414. The top wall portion 414 has a second guide groove 414a facing the bottom wall portion 413 and having the same shape as the first guide groove 413a. With the detachable design of the side cover 42, it is convenient to install or replace the transmission module 5 provided in the track space 411.

The transmission module 5 is disposed in the track space 411, and can be pulled by the centrifugal force generated when the carrier disk 1 rotates to move away from the central axis C1 along the track space 411. Specifically, the transmission module 5 has a transmission member 51, two guide wheels 52, and a limit lever 53. In this embodiment, the transmission member 51 is a rack plate, and has an elongated plate body 511, and an upper surface formed on the plate body 511 and adjacent to the plate body 511 farther away from the central axis The toothed portion 512 at one end of C1. The guide wheels 52 are spaced apart on one side surface of the plate body 511 and can roll in the first guide groove 413a and the second guide groove 414a, so that when the transmission member 51 is pulled by centrifugal force, The orbit space 411 slides. The limit lever 53 is vertically connected to the side surface of the plate body 511 and passes through the limit groove 412a, so that the movement range of the limit lever 53 is limited by the limit groove 412a, thereby limiting the transmission member 51 The moving distance prevents the transmission member 51 from flying out of the track space 411.

The limit module 6 is connected to the transmission module 5 and the rail frame 4 and can be driven by the transmission member 51 to abut the lateral surface 93 of the wafer 9 laterally. Specifically, the limit module 6 has an end frame 61, a pivot 62, two bearings 63, and a limit mechanism 64. The end frame member 61 surrounds a square groove 611 and is connected to the end of the rail frame 4, and has two shaft holes 612 on both sides of the square groove 611. The bearings 63 are respectively sleeved on the two ends of the pivot 62 and installed in the shaft holes 612 respectively, so that the two ends of the pivot 62 are pivoted on the end frame 61. The limit mechanism 64 has a limit member 641 and a tooth structure 642. The limiter 641 has a square groove 611 located in the end frame 61 and pivotally mounted on the pivot 62, a transmission part 641a extending upward from the top side of the transmission part 641a, and a The shielding wall portion 641c that extends and bends on the top side of the abutting portion 641b. The transmission part 641a, the abutting part 641b and the shielding wall part 641c jointly define a locking groove 641d for accommodating the side edge of the wafer 9. The toothed structure 642 is a gear in this embodiment, and the toothed structure 642 is sleeved on the pivot 62 and correspondingly meshes with the toothed portion 512 of the transmission member 51. When the transmission member 51 moves in the track space 411, the tooth structure 642 can be linked through the tooth portion 512, so that the pivot 62 rotates synchronously with the limiting member 641. In a modified embodiment, the tooth structure 642 may also be formed directly on the outer edge of the transmission portion 641a of the limiting member 641 and can be correspondingly engaged with the tooth portion 512 of the transmission member 51, without Also add gears.

The reset module 7 is connected to the rail frame 4 and the transmission member 51, and can provide a constant elastic recovery force of the transmission member 51 toward the central axis C1. In detail, the reset module 7 has a fixing member 71, a connecting member 72, and an elastic member 73. The fixing member 71 has a square shape and abuts against the end of the rail frame 4, and is fixed to the end frame member 61 by, for example, screws, so that the fixing member 71 is relatively fixed to the rail frame 4. The connecting member 72 is L-shaped and fixedly connected to the side surface of the plate body 511 of the transmission member 51, so it can move in the track space 411 with the transmission member 51. The elastic member 73 is a spring in this embodiment, and both ends abut the fixing member 71 and the connecting member 72 respectively. When the carrier disk 1 rotates to generate a centrifugal force, the transmission member 51 is pulled away from the central axis C1 by the centrifugal force, so that the connecting member 72 compresses the elastic member 73 to accumulate an elastic restoring force, and when the carrier disk 1 speed decreases , The centrifugal force is lowered, and the elastic restoring force drives the transmission member 51 to move toward the central axis C1 and return to the original position.

Referring to FIGS. 7 and 9, the limit mechanism 64 of each arm unit 2 can be driven by the transmission member 51 to rotate between a normal position shown in FIG. 7 and a holding position shown in FIG. 9. When the limiting mechanism 64 is in the normal position, the limiting element 641 assumes an inclined state, so that the locking groove 641d of the limiting element 641 leaves the wafer placement area 3, so that the operator can place the wafer Or take out the wafer without being disturbed by the limiting member 641. When the limiting mechanism 64 is in the holding position, the locking groove 641d of the limiting element 641 enters the wafer placement area 3, corresponding to the side edge of the wafer 9 to be accommodated, so that the position of the limiting mechanism 64 The abutting portion 641b of the stopper 641 abuts the outer surface 93 of the wafer 9. Referring to FIG. 8, it is worth mentioning that, in other implementations, the wafer 9 may also have a peripheral warped appearance during the packaging process, resulting in the chemical liquid in the wet process being easily concentrated in the center of the wafer 9. The phenomenon of uneven development or etching occurs because the limiting mechanisms 64 can jointly limit the wafer 9 to the wafer placement area 3 when the carrier plate 1 (see FIG. 3) rotates, or Assist in leveling the wafer 9 with a large warpage slightly, so that the chemical solution can be evenly coated on the surface of the wafer 9 during the rotation process.

7 and 9, the following paragraphs use the operation process of any arm unit 2 of the holding device 100 as an example for description. When the carrier disk 1 (see FIG. 4) is at a standstill without generating centrifugal force, or the rotation speed of the rotating shaft 12 (see FIG. 4) is low, the centrifugal force generated is insufficient to overcome the transmission module 5 and the rail frame 4 The frictional force between the transmission module 5 and the resetting module 7 makes the transmission module 5 unable to move under force. The limiting rod 53 is located in the limiting groove 412a near the center At one end of the axis C1 (see FIG. 3), the limit mechanism 64 is at the normal position. The operator can put the wafer 9 into the wafer placement area 3 and turn on the vacuum pump. Start the driving device, rotate the rotating shaft 12 and gradually increase the speed, the centrifugal force generated by the holding device 100 will gradually increase, so that the transmission module 5 is pulled by the centrifugal force and overcomes the friction force and the elastic restoring force away from the central axis C1 Moving in the direction of, the limit lever 53 moves to the end of the limit groove 412a away from the central axis C1, and the transmission member 51 progresses through the tooth portion 512 during the movement of the track space 411 (see FIG. 6) Synchronously drive the tooth structure 642, the pivot 62, and the limiting member 641 to rotate toward the central axis C1, so that the locking groove 641d of the limiting member 641 gradually enters the wafer The placement area 3 accommodates the side edge of the wafer 9 in a softer manner, so that the shielding wall portion 641c of the limiting member 641 of the limiting mechanism 64 gradually abuts the top of the wafer 9 Face 91 enables the limit mechanism 64 to reach the holding position. In this embodiment, the abutting portion 641b is spaced apart from the outer surface 93 of the wafer 9 by a predetermined distance, but not limited to this, the abutting portion 641b may also be in contact with the wafer 9 Outside side 93. In addition, since the fixing member 71 of the reset module 7 is immovable, when the transmission member 51 is pulled away by the centrifugal force in a direction away from the central axis C1, the connecting member 72 will compress the elastic member 73 to accumulate an elasticity Resilience.

Finally, when the wafer 9 process is completed, the rotation speed of the carrier plate 1 decreases, and the centrifugal force also decreases. The elastic restoring force generated by the elastic member 73 drives the transmission member 51 to move closer to the central axis C1, causing the limit The mechanism 64 rotates in the reverse direction and automatically returns to the normal position shown in FIG. 7.

In summary, the holding device 100 of the present invention drives the transmission member 51 to move away from the central axis C1 in the track space 411 by the centrifugal force generated when the carrier disk 1 rotates around the central axis C1, and at the same time The toothed portion 512 cooperates with the toothed structure 642 of the limit mechanism 64 to drive the limit mechanism 64 to gradually rotate toward the central axis C1, so that the snap groove 641d of the limit mechanism 64 is softer Is connected to the outer edge of the wafer 9 to prevent the wafer 9 from flying off the carrier disk 1 and reduce the risk of cracks or damage on the surface of the wafer 9; in addition, by setting the reset module 7, the carrier disk 1 When the rotation speed decreases, the transmission member 51 can automatically move in the direction close to the central axis C1 and return to the normal position of the initial use, so the purpose of the invention can indeed be achieved.

However, the above are only examples of the present invention, and should not be used to limit the scope of implementation of the present invention, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification still belong to This invention covers the patent.

100: holding device 1: carrier plate 11: plate body 111: first groove 112: second groove 12: rotating shaft 13: suction channel 2: arm unit 3: wafer placement area 4: rail frame 41: Rail wall 411: Rail space 412: Side wall portion 412a: Limit groove 413: Bottom wall portion 413a: First guide groove 414: Top wall portion 414a: Second guide groove 42: Side cover 5: Transmission module 51: Transmission Piece 511: plate 512: tooth 52: guide wheel 53: limit lever 6: limit module 61: end frame 611: square groove 612: shaft hole 62: pivot 63: bearing 64: limit mechanism 641: Limiting piece 641a: Transmission part 641b: Abutting part 641c: Covering wall part 641d: Snap groove 642: Tooth structure 7: Reset module 71: Fixing piece 72: Connecting piece 73: Elastic piece 8: Carrying device 81: Vacuum chuck 82: Limit mechanism 821: Weight 822: Pressed part 9: Wafer 91: Top surface 92: Bottom surface 93: Outer side C1: Central axis

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a schematic diagram of an existing wafer carrier device; FIG. 2 is a schematic diagram illustrating an existing wafer carrier device When rotating, a pressing member of the wafer carrying device is easily pressed down on the surface of the wafer instantly, causing damage to the wafer; FIG. 3 is a perspective view of an embodiment of the holding device of the present invention; A side view of a wafer; FIG. 5 is a partially enlarged view of FIG. 4 illustrating an arm unit of this embodiment; FIG. 6 is an exploded perspective view of FIG. 5; FIG. 7 is a part of the arm unit A schematic side view illustrating that a limiting mechanism of the arm unit is at a normal position; FIG. 8 is a schematic side view illustrating that the wafer may have a warped peripheral edge after the packaging process in other implementations; and 9 is a schematic side view of the arm unit, illustrating that the limit mechanism is located in a holding position.

100: holding device

1: bearing plate

11: Disk

111: first groove

112: Second groove

12: shaft

13: Inhalation channel

2: Arm unit

3: Wafer placement area

C1: Central axis

Claims (7)

A holding device is suitable for holding a wafer. The wafer has a top surface and a bottom surface on opposite sides, and an outer side surface connected to the top surface and the bottom surface. The holding device includes: a carrier plate, suitable for For supporting and adsorbing the bottom surface of the wafer, and can rotate around a central axis; and a plurality of arm units, connected to the periphery of the carrier disk at intervals and interlocking with the carrier disk, and with the carrier disk Jointly define a wafer placement area corresponding to the wafer size, the support arm units are adapted to limit the wafer to the support tray when the support tray rotates, and each support arm unit includes a track A rack, connected to the periphery of the bearing plate and extending in a radial direction of the bearing plate in a direction away from the central axis, the track frame defines a track space; a transmission module is provided in the track space and has an acceptable A transmission member that is driven by centrifugal force generated when the carrier disk rotates and moves away from the central axis; and a limit module connected to the transmission module and the rail frame, and having a drive member that can be driven by the transmission member A limit mechanism that rotates toward or away from the central axis. The limit mechanism has a snap groove for accommodating the side edge of the wafer, and the limit mechanism can be driven by the transmission member to be in a normal state Between the position and a holding position, when the limit mechanism is in the normal position, the buckle slot leaves the wafer placement area, and when the limit mechanism rotates to the holding position, the buckle slot enters the wafer The placement area accommodates the side edge of the wafer. The holding device according to claim 1, wherein each transmission member has a plate body, and a tooth portion formed on a surface of the plate body, and each limit mechanism further has a corresponding engagement with the tooth portion Tooth structure. The holding device according to claim 2, wherein the tooth structure is a gear, and each limit module further has an end frame member connected to the rail frame, and one end pivotally disposed at the end frame member For the pivot shaft, each limiting mechanism further has a limiting member, the limiting member has the buckling groove, and the tooth structure and the limiting member are sleeved on the pivot shaft. The holding device according to claim 1, wherein the rail frame of each arm unit has a side wall portion, the side wall portion has an elongated limiting groove extending in the same direction as the rail frame, each branch The transmission module of the arm unit also has a limit lever connected to the transmission member and passing through the limit slot, the movement range of the limit lever is limited by the limit slot, thereby limiting the moving distance of the transmission member . The holding device according to claim 1, wherein the rail of each arm unit has a bottom wall portion and a top wall portion opposite to each other, the bottom wall portion has a first guide groove facing the top wall portion , The top wall portion has a second guide groove facing the bottom wall portion, the transmission module of each arm unit also has a plurality of transmission grooves connected to the transmission member, and capable of connecting the first guide groove and the second guide groove A guide wheel rolling in the groove. The holding device according to claim 1, wherein each arm unit further includes a reset module connected to the rail frame and the transmission member to provide a constant elastic recovery force of the transmission member toward the central axis. The holding device according to claim 6, wherein the resetting module has a fixing member connected to the rail frame, a connecting member connected to the transmission member, and two ends respectively abutting the fixing member and the The connecting member is an elastic member that provides the transmission member with a constant elastic restoring force toward the central axis.

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