TW202017452A - Printed circuit board and display device having the same - Google Patents

Abstract

According to an aspect of the present invention, there is provided a printed circuit board included in a display device, the printed circuit board comprising: a rigid region and a flexible region; a flexible insulating layer included in the rigid region and the flexible region; and a rigid insulating layer laminated on the flexible insulating layer to be included in the rigid region, wherein a conductive pattern for detecting touch is formed in the flexible region, and wherein a connection pad is formed in the rigid region for mounting an electronic element.

Description

Printed circuit board and display device having the same

The present application relates to a printed circuit board and a display device having the printed circuit board.

As the display device becomes thinner and the size of the frame becomes smaller, a structure is proposed in which electronic components such as a driving integrated circuit (IC) for driving the display device are mounted on the glass of the display The substrate is connected to a flexible substrate etc. instead of a glass substrate.

In Korean Patent Publication No. 10-2005-0029042 (October 13, 2006), it is disclosed that a via-filling plating and belt sanding (via fill plating and belt sanding) is used to make build-up type (build -up) Printed circuit board (PCB) method.

According to an aspect of the present invention, there is provided a printed circuit board included in a display device, the printed circuit board including: a rigid region and a flexible region; a flexible insulating layer included in the rigid region and the flexible region Medium; and a rigid insulating layer laminated on the flexible insulating layer to be included in the rigid region, wherein a conductive pattern for detecting touch is formed in the flexible region, and wherein the A connection pad for mounting electronic components is formed in the rigid area.

According to another aspect of the present invention, there is provided a display device including: a display panel; and a printed circuit board electrically connected to the display panel, wherein the printed circuit board includes: a rigid region and a flexible region; A flexible insulating layer included in the rigid region and the flexible region; and a rigid insulating layer laminated on the flexible insulating layer to be included in the rigid region, wherein in the flexible region A conductive pattern for detecting touch is formed, and electronic components are mounted on the rigid area.

Hereinafter, various embodiments of the printed circuit board and the display device including the printed circuit board according to the present invention will be explained in detail with reference to the accompanying drawings. In the drawings, regardless of the figure number, those presented with the same reference number The components are the same or corresponding and will not be repeated here.

Although terms such as "first" and "second" may be used to describe various components, such components are not necessarily limited by the above terms. The above terms are only used to distinguish one component from another.

When an element is described as "connected", "coupled" or "coupled" to another element, the element should be interpreted as directly connected, coupled or coupled to the other element, but may also be between With another element.

The terminology used in this description is only intended to illustrate certain embodiments, and in no way should limit the invention. Unless expressly used otherwise, expressions in the singular include the plural. In this description, expressions such as "including" or "consisting of" are intended to indicate characteristics, numbers, steps, operations, elements, components, or combinations thereof, and should not be interpreted as excluding one or more other characteristics, The existence or possibility of numbers, steps, operations, elements, components or combinations thereof. A printed circuit board

1 and 2 are diagrams showing a printed circuit board according to an embodiment of the present invention. FIG. 3 is a diagram showing an enlarged view of part A in FIG. 2.

1 and 2, a printed circuit board 10 according to an embodiment of the present invention is a board for driving a display device and includes a rigid region R and a flexible region F1. The printed circuit board 10 is a rigid-flex board in which the rigid region R and the flexible region F1 are continuously integrally formed. Such an integrally formed rigid-flex board is different from a board formed by separately forming a rigid board and a flexible board and then joining these boards by welding or the like. The printed circuit board 10 includes a flexible insulating layer 100 and a rigid insulating layer 200.

The rigid region R is a part having a smaller deflection than the flexible region F1, and the flexible region F1 is a part having a larger deflection than the rigid region R, and at least a part of the flexible region F1 may be bent. As shown in FIG. 1, the thickness of the flexible region F1 may be smaller than the thickness of the rigid region R.

The rigid region R includes the flexible insulating layer 100 and the rigid insulating layer 200, and the flexible region F1 includes the flexible insulating layer 100 but does not include the rigid insulating layer 200.

The flexible insulating layer 100 is formed of a flexible and insulating material (for example, an insulating material including polyimide (PI), liquid crystal polymer (LCP), etc.). The flexible insulating layer 100 is included in the rigid region R and the flexible region F1.

The rigid insulating layer 200 may be made of an insulating material having a relatively low deflection (for example, an insulating material including epoxy resin). Specifically, the insulating material including epoxy resin may include a fiber reinforced material such as glass fiber, and such insulating material may be a prepreg. Insulation materials including epoxy resin may also contain inorganic fillers.

The rigid insulating layer 200 may be formed on a predetermined area of the flexible insulating layer 100. The predetermined region in which the rigid insulating layer 200 is formed becomes the rigid region R. That is, the rigid insulating layer 200 is laminated on the flexible insulating layer 100 to be included in the rigid region R.

The number of flexible insulating layers 100 and the number of rigid insulating layers 200 included in the rigid region R may be plural, respectively. The number of flexible insulating layers 100 included in the flexible region F1 may also be plural. In this case, multiple rigid insulating layers 200 and multiple flexible insulating layers 100 may be alternately laminated.

The flexible insulating layer 100 may be located outside the rigid insulating layer 200. In this case, the flexible insulating layer 100 may be located on the outermost layer (the outermost layer does not include the protective layer 400 to be explained later).

For example, the flexible insulating layer 100 and the flexible insulating layer 300 may be formed on both surfaces of the rigid insulating layer 200 as shown in FIG. 1. Here, the flexible region F1 may include only one of the two flexible insulating layers 100 and the flexible insulating layer 300. In this case, only the flexible insulating layer 300 located in the rigid region R is formed to be symmetrical in thickness with respect to the flexible insulating layer 100 included in the rigid region R and the flexible region F1, so that the flexible insulating layer 300 can participate in the control of warpage.

The flexible region F1 and the rigid region R may include conductor patterns formed on each insulating layer. This conductor pattern can perform electrical signal transmission.

A conductive pattern P ₁ for detecting touch may be formed in the flexible region F1, and a connection pad P may be formed as a conductive pattern for mounting the electronic component 500 in the rigid region R. The electronic component 500 can be mounted on the connection pad P using the solder member SB. The electronic component 500 can be mounted on the rigid region R to implement a chip on board (COB).

The conductive pattern P ₁ for detecting touch is a conductive pattern for detecting touch when making a touch on a display panel connected to a printed circuit board in the display device. Detecting touch means identifying the position, intensity, area, etc. of the touch. The conductive pattern P ₁ for detecting touch transmits the electric signal achieved by touch to the electronic component 500.

The electronic component 500 may be an integrated circuit, such as a touch controller IC, a power management IC (PMIC), a finger on display (FOD) IC, a display driver IC (DDI), Touch display driver IC (TDDI), etc. Can constitute multiple electronic components.

The electronic component 500 may further include passive components such as capacitors. In FIGS. 2 and 6, PMIC 500a, FOD IC 500b, DDI (or TDDI) 500c, and passive device 500d are shown, but the present invention is not limited to this.

The conductive pattern P ₁ for detecting touch can be electrically connected to the electronic component 500 via the connection pad P. The electronic component 500 can process the electrical signal transmitted from the conductive pattern P ₁ for detecting touch to extract the position, strength, area, etc. of the touch. In addition, according to the FOD IC, it is possible to perform fingerprint recognition by the display.

The electronic component 500 can process electrical signals in various ways according to a touch detection method (static capacitance method, optical method, ultrasonic method, etc.).

The conductive pattern P ₁ for detecting touch may include a plurality of unit patterns U. The unit pattern U may have various patterns such as angle spirals, curved spirals, lattices, and the like. Each unit pattern U may be connected to the connection pad P.

2 is a schematic diagram illustrating a plurality of unit patterns U for detecting the conductive pattern P ₁ for touch and a connection portion P ₁ ′ as a conductor connecting the unit pattern U and the connection pad P. That is, one end of the connection portion P ₁ ′ is connected to one end of the unit pattern U, and the other end of the connection portion P ₁ ′ is connected to the connection pad P. The connection part P ₁ ′ connects each unit pattern U to the connection pad P, but only some of the connection parts are shown in FIG. 2.

Referring to FIG. 3, the conductive pattern for detecting touch pattern unit P ₁ U is formed by a linear conductor lines, and the linear conductor lines may be connected to the connecting portion P ₁ '. The linear conductor wire may be formed in various patterns such as angle spirals, curved spirals, lattices and the like.

A conductive pattern for detecting touch P ₁ of may be formed of a metal such as copper, and may be plated layer is formed. That is, the linear conductor line of the unit pattern U may be a copper wire. This is different from the pattern printed with metal paste.

A conductive pattern for detecting touch P ₁ of 100 may be formed in the insulating layer in the flexible flexible region F1. In this case, the conductive pattern formed thereon for detecting touch P (outermost protective layer 400 in the outer insulating layer) 100 may be the outermost layer of the flexible printed circuit board ₁ is an insulating layer.

Wherein the rigid region R is formed in a circuit pattern P ₀ and the rigid region R in the case of the circuit pattern P ₀ of a plurality of layers formed in different layers of the circuit pattern P ₀ by the through hole are electrically connected. Some circuit patterns P ₀ on the outermost layer become connection pads P ₀ ′ for electrical connection with another substrate.

Some circuit patterns P ₀ on the outermost layer in the rigid region R may serve as connection pads P, and the connection pads P are provided corresponding to the electrodes of the electronic component 500. The electrode pattern may be formed on the outermost layer in the rigid region R and on the flexible insulating layer 100. The flexible insulating layer 100 on which the electrode pattern P is formed may be formed on the outermost layer of the printed circuit board (the outermost layer among the insulating layers outside the protective layer 400).

The circuit pattern P ₀ on the outermost layer in the rigid region R is covered by the protection layer 400, and the connection pad P and the connection pad P ₀ ′ are exposed by the protection layer 400.

The conductive pattern P ₁ and the connection part P ₁ ′ for detecting touch on the flexible insulating layer 100 and the circuit pattern P ₀ on the outermost layer in the rigid region R can be formed together by the same circuit forming process and also It may have substantially the same thickness.

The protective layer 400 is a layer that protects the outermost conductor pattern of the printed circuit board. The protective layer 400 may be formed in the rigid region R to expose the connection pad P and the connection pad P ₀ , but may cover and protect other circuit patterns P ₀ . The protective layer 400 in the rigid region R may be a solder resist.

The protective layer 400 may be formed in the flexible region F1 to cover and protect the conductive pattern P ₁ for detecting touch. The protective layer 400 in the flexible region F1 may be made of a material different from that of the protective layer 400 in the rigid region R. Specifically, the protective layer 400 formed in the flexible region F1 may be a coverlay made of a flexible and bendable material. As another option, the protective layer 400 formed in the flexible region F1 may be formed of ink, and in this case, the flexible region F1 may be bendable.

The protective layer 400 is not necessary and therefore may be omitted if necessary.

In FIG. 2, the protective layer 400 is shown only in the rigid region R, and the protective layer in the flexible region F1 is not shown.

5 and 6 are diagrams showing a printed circuit board according to another embodiment of the present invention.

5 and 6, in the printed circuit board 10, the flexible region includes a first flexible region F1 and a second flexible region F2. The first flexible region F1 and the second flexible region F2 respectively extend from the rigid region R in different directions.

The flexible insulating layer 100 is included in the rigid region R, the first flexible region F1 and the second flexible region F2, and the rigid insulating layer 200 is only included in the rigid region R. That is, the flexible insulating layer 100 is formed on the rigid region R, the first flexible region F1, and the second flexible region F2, and the rigid insulating layer 200 is laminated on a predetermined portion of the flexible insulating layer 100 to be included in In the rigid zone R.

A conductive pattern P1 for detecting touch is formed in the first flexible region F1, and a circuit pattern P ₀ and a connection pad P for mounting the electronic component 500 are formed in the rigid region R. A circuit pattern P ₂ is formed in the second flexible region F2, and a part of the circuit pattern P ₂ is connected to the circuit pattern P ₀ . A second flexible region F2 to be bent, and the circuit pattern P ₂ may be the electronic component 500 and the display panel 1 (see FIG. 7) is electrically connected. Here, a part P ₂ ′ of the circuit pattern P ₂ is coupled to the display panel 1 (see FIG. 7 ).

The circuit pattern P ₂ in the second flexible region F2 may have a more precise pitch than the circuit pattern P ₀ in the rigid region R. The circuit pattern P ₂ in the second flexible region F2 may be formed by the MSAP method, but the present invention is not limited to this.

The protective layer 400 may be formed in all the rigid regions R, the first flexible region F1, and the second flexible region F2. The protective layer 400 formed in the rigid region R exposes the connection pad P, but covers and protects other conductive patterns. The protective layer 400 formed in the first flexible region F1 and the second flexible region F2 may be a cover film made of a flexible and bendable material, which may be used for The material of the protective layer 400 in the rigid region R is made of different materials.

The protective layer 400 in the first flexible region F1 can cover and protect the conductive pattern P ₁ for touch detection, and the protective layer 400 in the second flexible region F2 can protect the circuit pattern P ₂ . However, the protective layer is formed on a portion of the F2 region of the second flexible circuit pattern 400 is exposed to P _2, and exposes a circuit pattern P ₂ 'may be coupled to the display panel 1 (see FIG. 7).

The protective layer 400 is not necessary and therefore may be omitted if necessary.

In FIG. 6, the protective layer 400 is shown only in the rigid region R and the second flexible region F2, and the protective layer in the first flexible region F1 is not shown. Display device

4 is a diagram illustrating a display device according to an embodiment of the present invention.

4, a display device according to an embodiment of the present invention includes a display panel 1 and a printed circuit board electrically connected to the display panel 1. The electronic component 500 is mounted on the rigid region R of the printed circuit board to drive the display panel 1.

The display panel 1 may be a light emitting diode (LED) panel, an organic light emitting diode (OLED) panel, an electrophoretic display panel, an electrochromic display (ECD), etc. Able to convert electrical signals into visual signals. The display panel 1 can also be a touch screen panel.

The display device may include a frame 2 provided on the rear surface of the display panel 1, and the frame 2 may support the display panel 1, a printed circuit board, and the like. The frame 2 may be made of metal materials, plastic materials, etc. having superior thermal conductivity, but the present invention is not limited to this.

In addition, the display device may further include a cover glass 3 located on the front surface of the display panel 1, and the cover glass 3 may protect the display panel 1.

The printed circuit board in this embodiment may be understood as the printed circuit board 10 described with reference to FIGS. 1 and 2. The repeated content will not be repeated.

The display panel 1 and the printed circuit board 10 may be coupled by the connection board 600. The connection board may be a flexible board, and may be formed of a flexible insulating layer. The connection board may include a circuit pattern 600', and one end of the circuit pattern 600' may be bonded to the rigid region R by soldering of the solder member SB, and the other end of the circuit pattern 600' may be soldered by the solder member SB组合至Display panel 1.

The printed circuit board may be disposed on the rear surface of the display panel 1. The connection board 600 is bent and disposed on the rear surface, side surface, and front surface of the display panel 1. However, since the area covered by the connection plate at the front surface is small, the size of the bezel can be small. Specifically, when DDI is mounted on the rigid region R as in the present invention, the bezel can be reduced compared to the case where DDI for driving the display panel 1 is mounted on the display panel 1.

The flexible region F1 is bent at least partially and provided on the rear surface of the display panel 1. Here, the flexible region F1 is positioned closer to the display panel 1 than the rigid region R. Since the electronic component 500 is mounted on the rigid region R and the electronic component 500 protrudes from the upper surface of the rigid region R, the gap between the upper surface of the rigid region R and the rear surface of the display panel 1 is equal to or greater than the height of the electronic component 500. However, since the electronic component 500 is not mounted on the flexible area F1 and the flexible area F1 is flexible, the flexible area F1 may be bent toward the rear surface of the display panel 1 to be closely attached to the display panel 1 Rear surface. In this case, the space under the flexible region F1 may be secured as much as possible while the flexible region F1 is bent. This space can be further occupied by the battery B of the electronic device in which the display device is installed.

7 is a diagram illustrating a display device according to another embodiment of the present invention.

Referring to FIG. 7, a display device according to another embodiment of the present invention includes a display panel 1 and a printed circuit board electrically connected to the display panel 1. The electronic component 500 is installed in the rigid region R of the printed circuit board to drive the display panel 1.

The printed circuit board in this embodiment may be understood as the printed circuit board described with reference to FIGS. 5 and 6. The repeated content will not be repeated.

One end of the circuit pattern P ₂ of the second flexible region F2 is soldered to the display panel 1 by the solder member SB, so that the second flexible region F2 is coupled with the display panel 1.

The rigid region R and the first flexible region F1 may be disposed on the rear surface of the display panel 1. The second flexible region F2 is bent and disposed on the rear surface, side surface, and front surface of the display panel 1. However, since the area covered by the second flexible region F2 on the front surface of the display panel 1 is small, the size of the bezel can be reduced.

The flexible region F1 is bent at least partially and provided on the rear surface of the display panel 1. Here, the flexible region F1 is positioned closer to the display panel 1 than the rigid region R. Since the electronic component 500 is mounted on the rigid region R and the electronic component 500 protrudes from the upper surface of the rigid region R, the gap between the upper surface of the rigid region R and the rear surface of the display panel 1 is equal to or greater than the height of the electronic component 500. However, since the electronic component 500 is not mounted on the flexible area F1 and the flexible area F1 is flexible, the flexible area F1 may be bent toward the rear surface of the display panel 1 to be closely attached to the display panel 1 Rear surface. In this case, the space under the flexible region F1 may be secured as much as possible while the flexible region F1 is bent. This space can be further occupied by the battery B of the electronic device in which the display device is installed.

Since the first flexible region F1, the rigid region R, and the second flexible region F2 are formed integrally, unlike the foregoing embodiment, the rigid region R and the display panel are as shown in the previous embodiment. The use of a separate connection plate for coupling makes it possible to ensure a better mechanical and electrical connection. Since the separate connection board is bonded to the display panel by the solder member, electrical noise may occur at the bonding area between the solder member and the display panel. However, there is no such bonding area in this embodiment, and therefore electrical reliability can be improved. In addition, depending on the curvature of the connection board, stress may be concentrated on the bonding area between the solder member and the display panel, and therefore, the connection board may come off. However, even if the second flexible region F2 is bent, the mechanical stability of the connection is enhanced because in this embodiment, the second flexible region F2 is not separated from the rigid region R.

8 is a diagram showing a display device according to still another embodiment of the present invention.

Referring to FIG. 8, the printed circuit board included in the display device may be connected to the main board M. In this case, the printed circuit board may be disposed between the main board M and the display panel 1.

The printed circuit board may be connected to the main board M through the connection member C. The connecting member C may be formed of a flexible material, and may extend from the first flexible region F1. That is, the flexible insulating layer 100 of the first flexible region F1 protrudes to provide the connection member C.

At one end of the connector C, a pad connected to the main board M is provided, and the pad can be electrically connected to the electronic component 500 mounted on the rigid region R by a circuit wire. The circuit line is formed on the rigid region R and the first flexible region F1. One end of the circuit wire is connected to a connection pad on which the electronic component 500 is mounted, and the other end of the circuit wire is connected to a pad at one end of the connector C. The pad at the one end of the connector C may be coupled to the circuit of the motherboard M.

The spirit of the present invention has been described above by way of example, and those skilled in the art can modify, change, and replace the present invention in various ways without departing from the essential characteristics of the present invention. Therefore, the exemplary embodiments disclosed in the present invention and the accompanying drawings are not limiting but illustrate the spirit of the present invention, and the scope of the present invention is not limited by the exemplary embodiments and the accompanying drawings. The scope of the present invention should be interpreted by the following patent application scope, and it should be interpreted that all spirits equivalent to the following patent application scope fall within the scope of the present invention.

1: display panel 2: frame 3: cover glass 10: printed circuit board 100, 300: flexible insulating layer 200: rigid insulating layer 400: protective layer 500: electronic component 500a: power management IC (PMIC) 500b: finger on the display (FOD) IC 500c: a display driver IC (DDI) / touch display driver IC (TDDI) 500d: passive device 600: coupling plate _{600 ', P 0, P 2} , P 2': circuit pattern A: part B: battery C: connector F1: flexible area/first flexible area F2: second flexible area M: motherboard P, P ₀ ': connection pad P ₁ : conductive pattern for detecting touch P ₁ ': connection Part R: rigid area SB: solder component U: cell pattern

FIG. 1 is a diagram showing a printed circuit board according to an embodiment of the present invention.

2 is a diagram showing a printed circuit board according to an embodiment of the present invention.

FIG. 3 is a diagram showing an enlarged view of part A in FIG. 2.

4 is a diagram illustrating a display device according to an embodiment of the present invention.

FIG. 5 is a diagram showing a printed circuit board according to another embodiment of the present invention.

6 is a diagram showing a printed circuit board according to another embodiment of the present invention.

7 is a diagram illustrating a display device according to another embodiment of the present invention.

8 is a diagram showing a display device according to still another embodiment of the present invention.

10: Printed circuit board

100, 300: flexible insulating layer

200: rigid insulation

400: protective layer

500: electronic components

F1: flexible zone/first flexible zone

P: connection pad

P ₀ : circuit pattern

P ₁ : conductive pattern for touch detection

R: rigid zone

SB: solder component

Claims (16)

A printed circuit board included in a display device, the printed circuit board includes: Rigid zone and flexible zone; A flexible insulating layer included in the rigid region and the flexible region; and A rigid insulating layer laminated on the flexible insulating layer to be included in the rigid region, A conductive pattern for detecting touch is formed in the flexible area, and A connection pad for mounting electronic components is formed in the rigid area. The printed circuit board according to item 1 of the patent application range, wherein the conductive pattern for detecting touch is formed on the flexible insulating layer in the flexible region. The printed circuit board according to item 1 of the patent application range, wherein the connection pad is formed on the flexible insulating layer in the rigid region. The printed circuit board according to item 2 or item 3 of the patent application scope, wherein the flexible insulating layer is located outside the rigid insulating layer. The printed circuit board according to item 1 of the patent application range, wherein the conductive pattern for touch detection includes a plurality of unit patterns, and each of the plurality of unit patterns is electrically connected to the Connection pad. The printed circuit board as described in item 1 of the patent application range, wherein the conductive pattern for touch detection is formed by a plating layer. The printed circuit board according to item 1 of the patent application scope, wherein the flexible area includes a first flexible area and a second flexible area extending from the rigid area in different directions, and the The conductive pattern for touch detection is formed in the first flexible region. A display device, including: Display panel; and A printed circuit board electrically connected to the display panel, The printed circuit board includes: Rigid zone and flexible zone; A flexible insulating layer included in the rigid region and the flexible region; and A rigid insulating layer laminated on the flexible insulating layer to be included in the rigid region, A conductive pattern for detecting touch is formed in the flexible area, and Electronic components are mounted on the rigid area. The display device according to item 8 of the patent application range, wherein the conductive pattern for detecting touch is formed on the flexible insulating layer in the flexible region. The display device according to item 8 of the patent application range, wherein the electronic component is formed on the flexible insulating layer in the rigid region. The display device according to item 9 or 10 of the patent application scope, wherein the flexible insulating layer of the printed circuit board is located outside the rigid insulating layer. The display device according to item 8 of the patent application range, wherein the conductive pattern for touch detection includes a plurality of unit patterns, and each of the plurality of unit patterns is electrically connected to the electronic element. The display device according to item 8 of the patent application range, wherein the conductive pattern for detecting touch is formed of a plating layer. The display device according to item 8 of the patent application scope, wherein the flexible region includes a first flexible region and a second flexible region extending from the rigid region in different directions, The conductive pattern for detecting touch is formed in the first flexible area, and The second flexible area is coupled to the display panel. The display device according to item 14 of the patent application range, wherein the first flexible region and the rigid region are provided on the rear surface of the display panel, and the second flexible region is bent and coupled To the front surface of the display panel. The display device according to item 15 of the patent application scope, wherein the first flexible region is closer to the display panel than the rigid region.

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