TW202014082A - Power supply device - Google Patents
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- TW202014082A TW202014082A TW107132828A TW107132828A TW202014082A TW 202014082 A TW202014082 A TW 202014082A TW 107132828 A TW107132828 A TW 107132828A TW 107132828 A TW107132828 A TW 107132828A TW 202014082 A TW202014082 A TW 202014082A
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- 238000009434 installation Methods 0.000 claims abstract description 57
- 239000003990 capacitor Substances 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims description 58
- 238000004146 energy storage Methods 0.000 claims description 39
- 230000005669 field effect Effects 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000004308 accommodation Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Abstract
Description
本發明係關於一種電源供應裝置，尤其是指一種具有低發熱元件設置空間與高發熱元件設置空間之電源供應裝置。 The invention relates to a power supply device, in particular to a power supply device with a low heating element installation space and a high heating element installation space.
一般來說，電器設備的電路模組主要是由電路板與設置於電路板上之各種電子元件所組成，而常見的電子元件例如包含了電阻、電容、開關或電晶體等元件，然而電路模組在設計時，各種同類型的電子元件通常會依據一般的布局原則而四處散布在電路板上，進而導致高發熱之電子元件與低發熱之電子元件往往會交錯的排列在散熱氣流會通過的路徑上，此時很有可能會發生散熱氣流因先通過高發熱之電子元件再通過低發熱之電子元件，使散熱氣流自高發熱之電子元件所帶走之熱能傳送至低發熱之電子元件上，反而使得低發熱之電子元件的工作效率受到影響；此外，當低發熱之電子元件的尺寸過大時，還有可能會阻擋到散熱氣流的流動，進而影響到整體的散熱效率。 Generally speaking, the circuit module of electrical equipment is mainly composed of a circuit board and various electronic components disposed on the circuit board. Common electronic components include resistors, capacitors, switches, transistors, etc. However, the circuit module When designing, various electronic components of the same type are usually scattered around the circuit board in accordance with the general layout principles, which in turn leads to high-heat electronic components and low-heat electronic components often arranged in a staggered arrangement. On the path, it is very likely that the airflow of heat dissipation will pass through the electronic components with high heat generation and then through the electronic components with low heat generation, so that the heat energy taken from the electronic components with high heat generation will be transferred to the electronic components with low heat generation. On the contrary, the working efficiency of low-heat electronic components is affected; in addition, when the size of low-heat electronic components is too large, it may also block the flow of cooling airflow, thereby affecting the overall heat dissipation efficiency.
承上所述，由於高發熱之電子元件與低發熱之電子元件四處散布在電路板上，因此電路模組的散 熱路徑也需要設計得較為廣泛，才能對所有的高發熱之電子元件進行散熱，但也因此會使得散熱氣流無法集中，相對地降低了散熱效率；或者需要提高風扇的轉速來加大散熱氣流，但卻會增加電力的消耗。 As mentioned above, since high-heat electronic components and low-heat electronic components are scattered on the circuit board, the heat dissipation path of the circuit module also needs to be designed more extensively in order to dissipate all high-heat electronic components. But it will also make the cooling airflow unable to concentrate, which relatively reduces the cooling efficiency; or the need to increase the fan speed to increase the cooling airflow, but it will increase the power consumption.
有鑑於現有之電路模組之各種類型的電子元件通常會依據一般的布局原則四散在電路板上，進而產生低發熱之電子元件阻擋到散熱氣流，或者散熱氣流將自高發熱之電子元件帶走的熱能傳送至低發熱之電子元件上的問題；緣此，本發明的目的在於提供一種電源供應裝置，可以有效率的對高發熱電子元件進行散熱，且不會與低發熱電子元件相互影響。 In view of the fact that the various types of electronic components of existing circuit modules are usually scattered on the circuit board according to the general layout principles, and then the electronic components with low heat generation are blocked from the cooling airflow, or the cooling airflow takes away the electronic components from high heat generation The problem of heat energy being transferred to low-heat electronic components; therefore, the object of the present invention is to provide a power supply device that can efficiently dissipate high-heat electronic components without interfering with low-heat electronic components.
為了達到上述目的，本發明所採用之必要技術手段是提供一種電源供應裝置，包含一裝置殼體、一儲能電容模組、一開關元件模組、一磁性元件模組以及一散熱風扇。裝置殼體係具有一入風端、一出風端與一容置空間，容置空間係位於入風端與出風端之間，並分別連通入風端與出風端，且容置空間被劃分形成一低發熱元件設置空間與一高發熱元件設置空間。儲能電容模組包含複數個儲能電容元件，儲能電容元件係位於低發熱元件設置空間中。開關元件模組包含複數個開關元件，開關元件係位於高發熱元件設置空間中。磁性元件模組包含複數個磁性元件，磁性元件係位於高發熱元件設置空間中。散熱風扇係設置於入風端，並用以朝高發 熱元件設置空間提供一散熱氣流。 In order to achieve the above object, the necessary technical means adopted by the present invention is to provide a power supply device, which includes a device casing, an energy storage capacitor module, a switching element module, a magnetic element module and a cooling fan. The device casing has an air inlet end, an air outlet end and an accommodating space, the accommodating space is located between the air inlet end and the air outlet end, and respectively connects the air inlet end and the air outlet end, and the accommodating space is A low heating element installation space and a high heating element installation space are divided. The energy storage capacitor module includes a plurality of energy storage capacitor elements, and the energy storage capacitor element is located in the installation space of the low heating element. The switch element module includes a plurality of switch elements, and the switch element is located in the space where the high heating element is installed. The magnetic element module includes a plurality of magnetic elements, and the magnetic elements are located in the installation space of the high heating element. The heat dissipation fan is installed at the air inlet end, and is used to provide a heat dissipation air flow toward the space where the high heat generating element is installed.
在上述必要技術手段所衍生之一附屬技術手段中，儲能電容模組更包含一儲能電容電路板，儲能電容電路板係設置於容置空間，並將容置空間劃分形成低發熱元件設置空間與高發熱元件設置空間，儲能電容元件係設置於儲能電容電路板上。 In one of the subsidiary technical means derived from the above necessary technical means, the energy storage capacitor module further includes an energy storage capacitor circuit board, the energy storage capacitor circuit board is disposed in the accommodating space, and the accommodating space is divided to form a low heating element The installation space and the installation space of the high heating element, the energy storage capacitor element is provided on the circuit board of the energy storage capacitor.
在上述必要技術手段所衍生之一附屬技術手段中，開關元件模組更包含一開關元件電路板，開關元件電路板係設置於容置空間，開關元件係設置於開關元件電路板上。 In one of the subsidiary technical means derived from the above necessary technical means, the switch element module further includes a switch element circuit board, the switch element circuit board is disposed in the accommodating space, and the switch element is disposed on the switch element circuit board.
在上述必要技術手段所衍生之一附屬技術手段中，磁性元件模組更包含一磁性元件電路板，磁性元件電路板係設置於容置空間，磁性元件係設置於磁性元件電路板上。 In one of the subsidiary technical means derived from the above necessary technical means, the magnetic element module further includes a magnetic element circuit board, the magnetic element circuit board is disposed in the accommodating space, and the magnetic element is disposed on the magnetic element circuit board.
在上述必要技術手段所衍生之一附屬技術手段中，開關元件模組與磁性元件模組係分別設置於高發熱元件設置空間中之兩側。 In one of the subsidiary technical means derived from the above-mentioned necessary technical means, the switching element module and the magnetic element module are respectively disposed on both sides of the high heating element installation space.
在上述必要技術手段所衍生之一附屬技術手段中，電源供應裝置更包含一散熱元件，係設置於高發熱元件設置空間中，並熱連結於開關元件模組與磁性元件模組中之至少一者。 In one of the subsidiary technical means derived from the above necessary technical means, the power supply device further includes a heat dissipating element, which is arranged in the space where the high heat generating element is installed, and is thermally connected to at least one of the switching element module and the magnetic element module By.
在上述必要技術手段所衍生之一附屬技術手段中，開關元件包含金屬氧化物半導體場效電晶體(MOSFET)。 In one of the subsidiary technical means derived from the above necessary technical means, the switching element includes a metal oxide semiconductor field effect transistor (MOSFET).
在上述必要技術手段所衍生之一附屬技 術手段中，磁性元件包含變壓器或電感器。 In one of the subsidiary technical means derived from the above necessary technical means, the magnetic element includes a transformer or an inductor.
如上所述，由於本發明所提供之電源供應裝置是將裝置殼體之容置空間劃分形成低發熱元件設置空間與高發熱元件設置空間，並將低發熱電子元件與高發熱電子元件分別設置於低發熱元件設置空間與高發熱元件設置空間中，藉此，低發熱電子元件與高發熱電子元件之間不會互相受到干擾，相對的可以有效的提升散熱效率。 As described above, since the power supply device provided by the present invention divides the accommodating space of the device casing into a low heating element installation space and a high heating element installation space, and the low heating electronic component and the high heating electronic component are respectively installed in In the installation space of the low-heating element and the installation space of the high-heating element, there is no interference between the low-heating electronic element and the high-heating electronic element, and the heat dissipation efficiency can be effectively improved.
100‧‧‧電源供應裝置 100‧‧‧Power supply device
1‧‧‧裝置殼體 1‧‧‧device shell
11‧‧‧殼本體 11‧‧‧Shell body
111‧‧‧入風端 111‧‧‧Into the wind
112‧‧‧出風端 112‧‧‧ Outlet
113‧‧‧容置空間 113‧‧‧accommodation space
1131‧‧‧低發熱元件設置空間 1131‧‧‧Low heating element installation space
1132‧‧‧高發熱元件設置空間 1132‧‧‧High heating element installation space
12‧‧‧蓋板 12‧‧‧cover
2‧‧‧儲能電容模組 2‧‧‧Energy storage capacitor module
21‧‧‧儲能電容電路板 21‧‧‧Energy storage capacitor circuit board
22‧‧‧儲能電容元件 22‧‧‧Energy storage capacitor
3‧‧‧開關元件模組 3‧‧‧Switch element module
31‧‧‧開關元件電路板 31‧‧‧Switch element circuit board
32‧‧‧開關元件 32‧‧‧Switch element
4‧‧‧磁性元件模組 4‧‧‧Magnetic element module
41‧‧‧磁性元件電路板 41‧‧‧Magnetic component circuit board
42‧‧‧磁性元件 42‧‧‧Magnetic components
5‧‧‧散熱風扇 5‧‧‧cooling fan
6‧‧‧散熱風扇 6‧‧‧cooling fan
100a‧‧‧電源供應裝置 100a‧‧‧Power supply device
1a‧‧‧裝置殼體 1a‧‧‧device case
11a‧‧‧殼本體 11a‧‧‧Shell body
12a‧‧‧蓋板 12a‧‧‧Cover
1131a‧‧‧低發熱元件設置空間 1131a‧‧‧Low heating element installation space
1132a‧‧‧高發熱元件設置空間 1132a‧‧‧High heating element installation space
2a‧‧‧儲能電容模組 2a‧‧‧Energy storage capacitor module
21a‧‧‧儲能電容電路板 21a‧‧‧Energy storage capacitor circuit board
22a‧‧‧儲能電容元件 22a‧‧‧storage capacitor element
3a‧‧‧開關元件模組 3a‧‧‧Switch element module
31a‧‧‧開關元件電路板 31a‧‧‧Switch element circuit board
32a‧‧‧開關元件 32a‧‧‧Switching element
4a‧‧‧磁性元件模組 4a‧‧‧Magnetic element module
41a‧‧‧磁性元件電路板 41a‧‧‧Magnetic component circuit board
42a‧‧‧磁性元件 42a‧‧‧Magnetic components
5a‧‧‧散熱元件 5a‧‧‧Cooling element
第一圖係顯示本發明第一較佳實施例所提供之電源供應裝置之立體分解示意圖；第二圖係顯示本發明第一較佳實施例所提供之電源供應裝置之立體示意圖；第三圖係顯示本發明第一較佳實施例所提供之電源供應裝置之內部配置示意圖；第四圖係顯示本發明第一較佳實施例所提供之電源供應裝置之另一內部配置示意圖；以及第五圖係顯示本發明第二較佳實施例所提供之電源供應裝置之內部配置示意圖。 The first figure is a three-dimensional exploded schematic view of the power supply device provided by the first preferred embodiment of the present invention; the second figure is a three-dimensional schematic view of the power supply device provided by the first preferred embodiment of the present invention; It is a schematic diagram showing the internal configuration of the power supply device provided by the first preferred embodiment of the present invention; a fourth diagram is a schematic diagram showing another internal configuration of the power supply device provided by the first preferred embodiment of the present invention; and a fifth The figure is a schematic diagram showing the internal configuration of the power supply device provided by the second preferred embodiment of the present invention.
下面將結合示意圖對本發明的具體實施方式進行更詳細的描述。根據下列描述和申請專利範 圍，本發明的優點和特徵將更清楚。需說明的是，圖式均採用非常簡化的形式且均使用非精準的比例，僅用以方便、明晰地輔助說明本發明實施例的目的。 The specific embodiments of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be clearer from the following description and patent application scope. It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to conveniently and clearly assist the purpose of explaining the embodiments of the present invention.
請參閱第一圖與第二圖，第一圖係顯示本發明第一較佳實施例所提供之電源供應裝置之立體分解示意圖；第二圖係顯示本發明第一較佳實施例所提供之電源供應裝置之立體示意圖。如圖所示，一種電源供應裝置100包含一裝置殼體1、一儲能電容模組2、一開關元件模組3、一磁性元件模組4、一散熱元件5以及一散熱風扇6。 Please refer to the first and second figures. The first figure shows a three-dimensional exploded schematic view of the power supply device provided by the first preferred embodiment of the present invention; the second figure shows the first preferred embodiment of the present invention. A three-dimensional schematic diagram of a power supply device. As shown in the figure, a
裝置殼體1包含一殼本體11與一蓋板12，殼本體11具有一入風端111、一出風端112與一容置空間113。入風端111與出風端112是相對的設置，出風端112開設有複數個出風孔(圖中僅標示一個)，而容置空間113係位於入風端111與出風端112之間，並分別連通入風端111與出風端112。 The
請繼續參閱第三圖與第四圖，第三圖係顯示本發明第一較佳實施例所提供之電源供應裝置之內部配置示意圖；第四圖係顯示本發明第一較佳實施例所提供之電源供應裝置之另一內部配置示意圖。如圖所示，儲能電容模組2包含一儲能電容電路板21與複數個儲能電容元件22(圖中僅標示一個)。儲能電容電路板21係設置於容置空間113，並將容置空間113劃分形成一低發熱元件設置空間1131與一高發熱元件設置空間1132。儲能電容元件22係設置於儲能電容電路板21上，並位於低 發熱元件設置空間1131中。 Please continue to refer to the third and fourth figures. The third figure is a schematic diagram showing the internal configuration of the power supply device provided by the first preferred embodiment of the present invention; the fourth figure is provided by the first preferred embodiment of the present invention. Another internal configuration diagram of the power supply device. As shown in the figure, the energy
開關元件模組3包含一開關元件電路板31與複數個開關元件32(圖中僅標示一個)。開關元件電路板31係設置於高發熱元件設置空間1132中，而開關元件32係設置於開關元件電路板31上，進而位於高發熱元件設置空間1132中。其中，開關元件32包含金屬氧化物半導體場效電晶體(MOSFET)。 The switching
磁性元件模組4包含一磁性元件電路板41與複數個磁性元件42(圖中僅標示一個)。磁性元件電路板41係設置於高發熱元件設置空間1132中，而磁性元件42係設置於開關元件電路板31上，進而位於高發熱元件設置空間1132中。其中，磁性元件42包含變壓器或電感器。此外，在本實施例中，開關元件模組3與磁性元件模組4係分別設置於高發熱元件設置空間1132中之兩側。 The
散熱元件5係熱連結於開關元件模組3之開關元件電路板31上，並設置於高發熱元件設置空間1132中；其中，散熱元件5為散熱鰭片。在實務運用上，散熱元件5與開關元件電路板31之間例如是以導熱膏進行熱連結，並利用鎖固元件或卡接元件進行固定。此外，雖然在本實施例中，散熱元件5僅熱連結於開關元件模組3，但在其他實施例中，散熱元件5亦可熱連結於磁性元件模組4，甚至可以同時熱連結於開關元件模組3與磁性元件模組4。 The heat dissipation element 5 is thermally connected to the switch
散熱風扇6係設置於入風端111，並用以朝高發熱元件設置空間1132提供一散熱氣流DF；其中，由 於本實施例之電源供應裝置100是將容置空間113劃分形成低發熱元件設置空間1131與高發熱元件設置空間1132，並將儲能電容元件22設置於低發熱元件設置空間1131，以及將複數個開關元件32與磁性元件42設置於高發熱元件設置空間1132中，藉此，散熱風扇6所提供之散熱氣流DF可以只用於對開關元件模組3與磁性元件模組4進行散熱，而不會受到儲能電容元件22之影響。 The cooling
請參閱第五圖，第五圖係顯示本發明第二較佳實施例所提供之電源供應裝置之內部配置示意圖。如圖所示，本實施例更提供了一電源供應裝置100a，而電源供應裝置100a與上述之電源供應裝置100相似，電源供應裝置100a同樣包含了一儲能電容模組2a、一開關元件模組3a、一磁性元件模組4a以及一散熱元件5a；其差異主要在於，電源供應裝置100a是將開關元件電路板31a設置於裝置殼體1a之殼本體11a中，進而將殼本體11a之容置空間(圖未標示)劃分成低發熱元件設置空間1131a與高發熱元件設置空間1132a，並將蓋板12a蓋合於開關元件電路板31a。 Please refer to the fifth figure, which shows a schematic diagram of the internal configuration of the power supply device provided by the second preferred embodiment of the present invention. As shown in the figure, this embodiment further provides a
承上所述，熱連結於開關元件電路板31a之散熱元件5a是位於高發熱元件設置空間1132a中，磁性元件電路板41a是相對地位於高發熱元件設置空間1132a之另一側，而磁性元件42a則是位於高發熱元件設置空間1132a中。其中，雖然開關元件32a位於低發熱元件設置空間1131a中，但由於開關元件32a之熱能主要是傳導至散熱元件5a處，因此仍能有效的透過散熱元件5a進行散 熱。此外，儲能電容電路板21a與儲能電容元件22a則是位於低發熱元件設置空間1131a中。 As mentioned above, the
在本實施例中，電源供應裝置100a同樣可以利用散熱風扇(圖未示)使散熱氣流(圖未示)通過高發熱元件設置空間1132a而帶走開關元件32a(透過散熱元件5a)與磁性元件42a運作時所產生的熱能。 In this embodiment, the
綜上所述，相較於現有之電路模組因各種類型的電子元件四散在電路板上，進而容易產生低發熱之電子元件阻擋到散熱氣流，或者散熱氣流將自高發熱之電子元件帶走的熱能傳送至低發熱之電子元件上的問題；由於本發明所提供之電源供應裝置是將裝置殼體之容置空間劃分形成低發熱元件設置空間與高發熱元件設置空間，並將低發熱電子元件與高發熱電子元件分別設置於低發熱元件設置空間與高發熱元件設置空間中，因此散熱氣流在通過高發熱元件設置空間，可以有效的對高發熱電子元件進行散熱，而不會受到低發熱電子元件影響到氣流動線，有效的增進散熱效率。此外，由於本發明是將低發熱電子元件與高發熱電子元件分開設置，因此低發熱電子元件也不會接收到多於的熱能。 In summary, compared with the existing circuit modules, various types of electronic components are scattered on the circuit board, and it is easy to generate electronic components with low heat generation to block the cooling airflow, or the cooling airflow takes away the electronic components from high heat generation The heat energy is transferred to the electronic components with low heat generation; the power supply device provided by the present invention divides the accommodating space of the device casing to form a low heating element installation space and a high heating element installation space, The components and the high-heat-generating electronic components are respectively installed in the low-heat-generating component installation space and the high-heating component installation space, so the heat-dissipating airflow passes through the high-heating component installation space, which can effectively radiate the high-heating electronic components without being subject to low heat generation Electronic components affect the gas flow lines, effectively improving heat dissipation efficiency. In addition, since the present invention separates the low heat-generating electronic components from the high heat-generating electronic components, the low heat-generating electronic components will not receive more heat energy.
在本發明之較佳實施例中，雖然僅列舉了利用儲能電容電路板與開關元件電路板劃分容置空間的實施例，但不限於此，在其他實施例中，亦可利用磁性元件電路板劃分容置空間；此外，散熱元件更可在高發熱元件設置空間中同時熱連結開關元件模組與磁性元件模組。 In the preferred embodiment of the present invention, although only the embodiment in which the storage space is divided by the storage capacitor circuit board and the switching element circuit board is listed, it is not limited to this. In other embodiments, magnetic element circuits may also be used. The board divides the accommodating space; in addition, the heat dissipation element can also thermally connect the switching element module and the magnetic element module simultaneously in the high heating element installation space.
此外需特別說明的是，在本發明之較佳實施例中，電源供應裝置除設有儲能電容模組、開關元件模組與磁性元件模組外，實際上仍設有其他電子元件，包含一般電容(其尺寸相較於儲能電容元件而言極小)或電阻等各種電子元件，而儲能電容模組、開關元件模組與磁性元件模組主要是依據主要設置之電子元件所定義。 In addition, it should be particularly noted that, in a preferred embodiment of the present invention, in addition to the energy storage capacitor module, the switching element module and the magnetic element module, the power supply device actually has other electronic components, including General capacitors (the size of which is extremely small compared to energy storage capacitors) or various electronic components such as resistors, while energy storage capacitor modules, switching element modules, and magnetic element modules are mainly defined based on the main electronic components.
上述僅為本發明較佳之實施例而已，並不對本發明進行任何限制。任何所屬技術領域的技術人員，在不脫離本發明的技術手段的範圍內，對本發明揭露的技術手段和技術內容做任何形式的等同替換或修改等變動，均屬未脫離本發明的技術手段的內容，仍屬於本發明的保護範圍之內。 The above are only preferred embodiments of the present invention, and do not limit the present invention in any way. Any person skilled in the art in the technical field, within the scope of not departing from the technical means of the present invention, makes any equivalent replacement or modification of the technical means and technical contents disclosed in the present invention without any deviation from the technical means of the present invention. The content still falls within the protection scope of the present invention.
100‧‧‧電源供應裝置 100‧‧‧Power supply device
1‧‧‧裝置殼體 1‧‧‧device shell
11‧‧‧殼本體 11‧‧‧Shell body
1131‧‧‧低發熱元件設置空間 1131‧‧‧Low heating element installation space
1132‧‧‧高發熱元件設置空間 1132‧‧‧High heating element installation space
12‧‧‧蓋板 12‧‧‧cover
2‧‧‧儲能電容模組 2‧‧‧Energy storage capacitor module
21‧‧‧儲能電容電路板 21‧‧‧Energy storage capacitor circuit board
22‧‧‧儲能電容元件 22‧‧‧Energy storage capacitor
3‧‧‧開關元件模組 3‧‧‧Switch element module
31‧‧‧開關元件電路板 31‧‧‧Switch element circuit board
32‧‧‧開關元件 32‧‧‧Switch element
4‧‧‧磁性元件模組 4‧‧‧Magnetic element module
41‧‧‧磁性元件電路板 41‧‧‧Magnetic component circuit board
42‧‧‧磁性元件 42‧‧‧Magnetic components
5‧‧‧散熱元件 5‧‧‧Cooling components
Claims (8)
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| TW107132828A TWI677279B (en) | 2018-09-18 | 2018-09-18 | Power supply device |
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| Application Number | Priority Date | Filing Date | Title |
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| TW107132828A TWI677279B (en) | 2018-09-18 | 2018-09-18 | Power supply device |
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| TWI677279B TWI677279B (en) | 2019-11-11 |
| TW202014082A true TW202014082A (en) | 2020-04-01 |
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| CN2798169Y (en) * | 2005-05-16 | 2006-07-19 | 东莞东城柏洲边赐得利五金厂 | Heat Dissipation Structure of Power Supply |
| CN100394353C (en) * | 2006-11-16 | 2008-06-11 | 马进 | Power supplies that rely on natural convection for cooling |
| CN201032753Y (en) * | 2007-02-17 | 2008-03-05 | 保锐科技股份有限公司 | Power supply structure with air inlet flow guiding effect |
| TW200746987A (en) * | 2007-06-12 | 2007-12-16 | Acbel Polytech Inc | Power supply and heat radiation method thereof |
| TWM328610U (en) * | 2007-09-14 | 2008-03-11 | Touch Electronic Co Ltd | Power supply heat dissipation structure |
| TWM415555U (en) * | 2011-05-25 | 2011-11-01 | Super Flower Comp Inc | Heat dissipation structure of computer power supply |
| TWM445206U (en) * | 2012-07-26 | 2013-01-11 | Hou Alex | Heat dissipating system of computer mainframe |
| CN103840540A (en) * | 2012-11-26 | 2014-06-04 | 鸿富锦精密工业（深圳）有限公司 | Power supply device |
| TWM541034U (en) * | 2016-12-14 | 2017-05-01 | 微星科技股份有限公司 | Computer host |
| TWM543391U (en) * | 2017-03-24 | 2017-06-11 | In Win Development Inc | Computer case heat dissipation device |
| TWM552123U (en) * | 2017-07-28 | 2017-11-21 | Evga Corp | Heat dissipating structure of computer chassis |
| TWM554949U (en) * | 2017-08-11 | 2018-02-01 | Super Flower Computer Inc | Fan speed control device of power supply |
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