TW202007079A - Solidly mounted resonator - Google Patents
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Abstract
Description
本發明是有關於一種諧振器,特別是指一種固態微型諧振器。The invention relates to a resonator, in particular to a solid-state micro resonator.
近年來由於無線通訊的發展,使高頻聲波諧振器的發展受到越來越多的注意,其中,薄膜型體聲波諧振器因具有較小的元件尺寸、較低的製作成本,及優良的高頻表現而備受矚目。In recent years, due to the development of wireless communication, more and more attention has been paid to the development of high-frequency acoustic wave resonators. Among them, thin-film bulk acoustic wave resonators have smaller element sizes, lower manufacturing costs, and excellent high Frequency performance and attracted much attention.
薄膜型體聲波諧振器的傳播方式有縱向模式及剪向模式兩種,其中,縱向模式雖廣泛應用於高頻通訊元件,但於液體中傳遞時卻有能量消散的問題,使其較不適合應用於生物感測器中,而剪向模式於液體中傳遞時則不會有能量消散的問題,因此,薄膜體聲波諧振器若欲應用於生物感測器中,則其傳播方式則需使用純剪向模式避免訊號於液體中傳播時消散的問題,始有較高的品質因子(Q factor)。Thin film bulk acoustic resonators have two modes of propagation, longitudinal mode and shear mode. Among them, the longitudinal mode is widely used in high-frequency communication components, but it has the problem of energy dissipation when transmitted in liquid, making it less suitable for application. In the biosensor, there is no problem of energy dissipation when the shear mode is transmitted in the liquid. Therefore, if the thin film bulk acoustic resonator is to be used in the biosensor, its propagation mode needs to use pure Shear mode avoids the problem of signal dissipation when propagating in liquid, and has a high Q factor.
目前用於激發出縱向波的薄膜體聲波諧振器,主要是利用將電極(上電極、下電極)分別形成於壓電薄膜的相反表面(以下稱垂直式電極),並控制讓該上電極及該下電極對應於該壓電薄膜的方向與該壓電薄膜的c軸方向相同,而得到可激發出縱向波的薄膜體聲波諧振器。The thin film bulk acoustic resonator currently used to excite longitudinal waves mainly uses electrodes (upper electrode and lower electrode) formed on opposite surfaces of the piezoelectric film (hereinafter referred to as vertical electrodes), and controls the upper electrode and the The direction of the lower electrode corresponding to the piezoelectric film is the same as the c-axis direction of the piezoelectric film, and a thin film bulk acoustic resonator capable of exciting longitudinal waves is obtained.
而如欲得到可激發出剪向波的薄膜體聲波諧振器,目前常見的結構為利用與前述薄膜體聲波諧振器類似的垂直式電極結構,不同處在於需藉由控制令該壓電薄膜的c軸方向相對於該等上、下電極傾斜一特定角度,而得到可激發出剪向波的薄膜體聲波諧振器。然而此種結構除了會激發出剪向波外,也同樣會激發出縱向波,因而降低此種薄膜體聲波諧振器於液體中的品質因子;另一種可激發出剪向波的薄膜體聲波諧振器則是利用共平面電極結構,將兩個電極接製作於壓電薄膜的同一表面,從而得到可激發出純剪切波的薄膜體聲波諧振器。To obtain a thin film bulk acoustic resonator that can excite a shear wave, the current common structure is to use a vertical electrode structure similar to the aforementioned thin film bulk acoustic resonator. The difference lies in that the piezoelectric thin film The c-axis direction is inclined at a specific angle with respect to the upper and lower electrodes, and a thin film bulk acoustic resonator that can excite shear waves is obtained. However, in addition to stimulating shear waves, this structure also excites longitudinal waves, thus reducing the quality factor of such thin film bulk acoustic resonators in liquids; another type of thin film bulk acoustic resonance that can excite shear waves The device uses a coplanar electrode structure, connecting two electrodes on the same surface of the piezoelectric film, thereby obtaining a thin film bulk acoustic resonator that can excite pure shear waves.
由上敘述可知,薄膜體聲波諧振器若要激發出純縱向態或純剪向波,必須改變該薄膜體聲波諧振器的結構才能達成。此外,當要利用垂直式電極結構製作得到能激發出縱向波的薄膜體聲波諧振器時,需嚴謹控制該壓電薄膜結晶方向,使該薄膜體聲波諧振器的製程困難度因而提升。As can be seen from the above description, if a thin film bulk acoustic resonator is to excite a pure longitudinal state or a pure shear wave, the structure of the thin film bulk acoustic resonator must be changed to achieve it. In addition, when a thin-film bulk acoustic resonator capable of exciting longitudinal waves is to be fabricated by using a vertical electrode structure, the crystal direction of the piezoelectric thin film needs to be strictly controlled, so that the difficulty of manufacturing the thin-film bulk acoustic resonator is increased.
因此,本發明之目的,即在提供一種激發波為縱向波的固態微型諧振器。Therefore, the object of the present invention is to provide a solid-state microresonator whose excitation wave is a longitudinal wave.
於是,本發明固態微型諧振器包含一基板、一布拉格反射器、一壓電薄膜,及一電極單元。Therefore, the solid-state microresonator of the present invention includes a substrate, a Bragg reflector, a piezoelectric film, and an electrode unit.
該布拉格反射器設於該基板的表面,包括複數高聲阻抗層,及複數與該等高聲阻抗層交錯堆疊的低聲阻抗層,且該等低聲阻抗層的聲阻抗小於該等高聲阻抗層。The Bragg reflector is provided on the surface of the substrate and includes a plurality of high acoustic impedance layers, and a plurality of low acoustic impedance layers stacked alternately with the high acoustic impedance layers, and the acoustic impedance of the low acoustic impedance layers is less than the high acoustic impedance Impedance layer.
該壓電薄膜設於該布拉格反射器遠離該基板的表面。The piezoelectric film is provided on the surface of the Bragg reflector away from the substrate.
該電極單元設於該壓電薄膜遠離該布拉格反射層的表面,包括二個沿一第一方向間隔設置的接地電極,及二個位於該等接地電極間的訊號電極,該等訊號電極沿一與該第一方向正交的第二方向彼此成一間隙間隔設置。The electrode unit is disposed on the surface of the piezoelectric film away from the Bragg reflection layer, and includes two ground electrodes spaced along a first direction, and two signal electrodes located between the ground electrodes. The second directions orthogonal to the first direction are arranged at a gap from each other.
其中,該電極單元選自與該等高聲阻抗層相同的材料,而能令該壓電薄膜激發出縱向波。Wherein, the electrode unit is selected from the same material as the high acoustic impedance layers, and the piezoelectric film can excite longitudinal waves.
此外,本發明的另一目的,在於還提供一種激發波為剪向波的固態微型諧振器。In addition, another object of the present invention is to provide a solid-state microresonator whose excitation wave is a shear wave.
於是,本發明固態微型諧振器包含一基板、一布拉格反射器、一壓電薄膜,及一電極單元。Therefore, the solid-state microresonator of the present invention includes a substrate, a Bragg reflector, a piezoelectric film, and an electrode unit.
該布拉格反射器設於該基板的表面,包括複數高聲阻抗層,及複數與該等高聲阻抗層交錯堆疊的低聲阻抗層,且該等低聲阻抗層的聲阻抗小於該等高聲阻抗層。The Bragg reflector is provided on the surface of the substrate and includes a plurality of high acoustic impedance layers, and a plurality of low acoustic impedance layers stacked alternately with the high acoustic impedance layers, and the acoustic impedance of the low acoustic impedance layers is less than the high acoustic impedance Impedance layer.
該壓電薄膜設於該布拉格反射器遠離該基板的表面。The piezoelectric film is provided on the surface of the Bragg reflector away from the substrate.
該電極單元設於該壓電薄膜遠離該布拉格反射層的表面,包括二個沿一第一方向間隔設置的接地電極,及二個位於該等接地電極間的訊號電極,該等訊號電極沿一與該第一方向正交的第二方向彼此成一間隙間隔設置,該間隙大於20微米,且該間隙的長度與該壓電薄膜沿該第二方向的長度的比例大於1:50。The electrode unit is disposed on the surface of the piezoelectric film away from the Bragg reflection layer, and includes two ground electrodes spaced along a first direction, and two signal electrodes located between the ground electrodes. The second direction orthogonal to the first direction is arranged at a gap from each other, the gap is greater than 20 microns, and the ratio of the length of the gap to the length of the piezoelectric film along the second direction is greater than 1:50.
其中,該電極單元選自與該等高聲阻抗層不同的材料,而能令該壓電薄膜激發出剪向波。Wherein, the electrode unit is selected from materials different from the high acoustic impedance layers, and the piezoelectric film can excite the shear wave.
本發明之功效在於:藉由控制該電極單元與該等高聲阻抗層的材料,而可利用相同結構的固態微型諧振器分別得到可激發出純剪向波及純縱向波的特性,相較於習知的薄膜體聲波諧振器,該固態微型諧振器使用範圍更加廣泛,且製作簡單而易實施。The effect of the present invention lies in that: by controlling the materials of the electrode unit and the high acoustic impedance layers, the solid microresonators with the same structure can be used to obtain the characteristics that can excite pure shear waves and pure longitudinal waves, respectively. The conventional thin film bulk acoustic resonator, the solid-state micro-resonator is more widely used, and is simple to manufacture and easy to implement.
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。此外,本發明的圖式為示意圖,各元件間的尺寸並非按照比例繪製。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers. In addition, the drawings of the present invention are schematic diagrams, and the dimensions between the elements are not drawn to scale.
參閱圖1及圖2,本發明固態微型諧振器的一第一實施例包含一基板2、一設於該基板2的布拉格反射器3、一設於該布拉格反射器3的壓電薄膜4,及一設於該壓電薄膜4的電極單元5。1 and 2, a first embodiment of the solid-state microresonator of the present invention includes a
詳細地說,該布拉格反射器3設於該基板2的表面,包括複數高聲阻抗層31,及複數與該等高聲阻抗層31交錯堆疊的低聲阻抗層32,且該等高聲阻抗層31的聲阻抗大於該等低聲阻抗層32。該等高聲阻抗層31的材料可選自鋁、鎢、鎳,或鉬,該等低聲阻抗層32的材料則可選自二氧化矽、鋁、鈦,或矽。In detail, the Bragg
較佳地,該等高聲阻抗層31及該等低聲阻抗層32的厚度符合四分之一波長條件,據此,聲波於該等高聲阻抗層31及該等低聲阻抗層32中傳遞並於各阻抗層間的界面反射後,可產生建設性干涉而具有較大的反射率,令該第一實施例有較佳的頻率響應。Preferably, the thicknesses of the high-
要說明的是,該等高聲阻抗層31及該等低聲阻抗層32的層數並沒有一定限制,當該等高聲阻抗層31及該等低聲阻抗層32的層數越多時,能提升該布拉格反射器3的聲波反射能力,而令該固態微型諧振器的諧振響應上升,但該等高聲阻抗層31及該等低聲阻抗層32的層數過多時,會令該等高聲阻抗層31與該等低聲阻抗層32界面的粗糙度上升,使該固態微型諧振器的諧振響應下降。較佳地,控制該等高聲阻抗層31與該等低聲阻抗層32的界面粗糙度不大於10奈米,可使該固態微型諧振器有較佳的諧振響應,於該第一實施例中是以該等高聲阻抗層31及該等低聲阻抗層32的層數分別為四層為例作說明,然實際實施時並不以此為限。It should be noted that the number of layers of the high
此外,要再說明的是,該布拉格反射器3是作為聲波反射器,與該壓電薄膜4連接的阻抗層,可為該高聲阻抗層31或該低聲阻抗層32並沒有一定限制,均能達成聲波反射的目的,於該第一實施例中是以該低聲阻抗層32與該壓電薄膜4連接,可進一步降低該固態微型諧振器的雜訊而提升品質因子。In addition, it should be further explained that the Bragg
該壓電薄膜4設於該布拉格反射器3遠離該基板2的表面。The
具體的說,該壓電薄膜4的組成材質可選自氧化鋅、氮化鋁、鎂摻雜的氧化鋅、鈦酸鋇,或鋯鈦酸鉛等可產生壓電效應的材料。Specifically, the material of the
要說明的是,該壓電薄膜4的厚度可視元件的特性及需求,而符合二分之一波長條件或符合四分之一波長條件,當該壓電薄膜4的厚度符合二分之一波長條件時,該固態微型諧振器的有效機電耦合係數(Effective Electromechanical Coupling Coefficient)將比該壓電薄膜4厚度符合四分之一波長條件的固態微型諧振器大,而有較大的頻寬;當該壓電薄膜4的厚度符合四分之一波長條件時,該壓電薄膜4的應力較小而不易破裂,使該固態微型諧振器有較佳的良率,且所需的製程時間較短,能提升該固態微型諧振器的產率。於該第一實施例中,該壓電薄膜4的厚度是以符合二分之一波長條件為例作說明。It should be noted that the thickness of the
此外,要再說明的是,該壓電薄膜4的c軸方向可與該壓電薄膜4與該電極單元5連接面的法線方向同向,或相對於該壓電薄膜4與該電極單元5連接面的法線方向傾斜一角度,並沒有一定限制,例如傾斜角度範圍可從傾斜20到垂直90度,相較於習知可激勵剪模態的薄膜體聲波諧振器是用傾角方式濺鍍壓電層,而共面電極的體聲波諧振器則是垂直濺鍍壓電層或傾斜濺鍍壓電層,該實施例中該壓電薄膜4的c軸方向並不影響該固態微型諧振器的激發波型態。In addition, it should be re-explained that the c-axis direction of the
該電極單元5設於該壓電薄膜4遠離該布拉格反射器3的表面,材料選自與該等高聲阻抗層31相同的材料,包括二個沿一第一方向X間隔設置的接地電極51,及二個位於該等接地電極51間的訊號電極52,且該等訊號電極52沿一與該第一方向X正交的第二方向Y彼此成一間隙d間隔設置。The
詳細地說,每一個訊號電極52具有一鄰近另一訊號電極52的電極部521,及自該電極部521朝反向該另一訊號電極52延伸的延伸部522。利用該兩個訊號電極52施加電壓至該壓電薄膜4,即可激發出縱向波,而得到具有縱模態的的固態微型諧振器。In detail, each
要說明的是,前述該等訊號電極52的電極部521及延伸部522的尺寸、該間隙d的大小,及該等接地電極51的尺寸為視該壓電薄膜4的尺寸而可進行調整,並沒有一定限制,只要可於該等訊號電極52間激發出聲波即可,然而當該間隙d過大時,該等訊號電極52激發出的聲波傳遞距離會過長,而容易有能量消散的問題;當該間隙d過小時,則會導致該等訊號電極52間的電場方向不均勻,而容易產生雜訊,因此,較佳地,該間隙d與該壓電薄膜4沿該第二方向Y的長度的比例介於1:50至1:4,例如該壓電薄膜4沿該第一方向X及該第二方向Y的長度為1000×1000微米為例,則該間隙d介於20至250微米可使該固態微型諧振器激發出的聲波雜訊較少,且能量不易消散而有較高的品質因子。It should be noted that the size of the
於一些實施例中,當該壓電薄膜4沿該第一方向X及該第二方向Y的長度為1000×1000微米時,該等電極部521沿該第一方向X的長度L介於300至500微米,沿該第二方向Y的寬度W介於20至250微米,且該等電極部521間的該間隙d距離介於20至250微米,據此,當施加電場於該等訊號電極52時,該等電極部521間的電場分布密度較均勻且方向一致,使該第一實施例有較佳的頻率響應,進而有較佳的品質因子。In some embodiments, when the length of the
此外,要說明的是,該等接地電極51及該等電極部521的形狀沒有特別的限制,例如該等接地電極51及該等電極部521可為直線延伸或是呈弧狀延伸,該等接地電極51可為長方形、橢圓形,或多邊形等,該等電極部521可為長方形、圓形,或多邊形等。於該第一實施例中,該等接地電極51及該等電極部521是以長方形為例作說明,可避免產生額外電場,並使該等電極部521間的電場分布較均勻,令該第一實施例有較低的雜訊。In addition, it should be noted that the shapes of the
本發明固態微型諧振器藉由控制該電極單元5的材料與該等高聲阻抗層31的材料相同,而可利用共平面電極側向激發的方式激發出縱向波,相較於習知利用上、下電極並配合壓電薄膜的c軸方向而激發出縱向波,該固態微型諧振器的製程簡易且頻率響應高,有利於大量生產並應用於通訊元件中。By controlling the material of the
續參閱圖1及圖2,本發明固態微型諧振器的第二實施例與該第一實施例的結構大致相同,不同處在於該電極單元5的材料與該等高聲阻抗31的材料不同,以及該等訊號電極52的該間隙d大於20微米,且該間隙d的長度與該壓電薄膜4沿該第二方向Y的長度比例大於1:50。1 and 2, the structure of the second embodiment of the solid-state microresonator of the present invention is substantially the same as that of the first embodiment, except that the material of the
藉由控制該電極單元5的材料與該等高聲波阻抗層31不同,以及令該等訊號電極52的該間隙d大於20微米,並控制令該間隙d與該壓電薄膜4的邊長比例大於1:50,即可利用具有共平面電極的該固態微型諧振器激發出剪向波,頻率響應大而可應用於液態感測器。By controlling the material of the
要再進一步說明的是,當該第一實施例的該壓電薄膜4沿該第二方向Y的長度為1000微米時,控制該間隙d介於20至50微米,可令該第一實施例的激發波為純縱向波,進一步控制該第一實施例的該間隙d介於40至50微米時,激發出的純縱向波頻率響應可達30dB;當該第二實施例的該壓電薄膜4沿該第二方向Y的長度為1000微米時,控制該間隙d介於40至50微米,可令該第二實施例的激發波為純剪向波,且激發出的純剪向波頻率響應可達20dB,顯示,該固態微型諧振器藉由控制該等高聲阻抗層31與該電極單元5的材料,以及該等訊號電極52的間隙d而可激發出純縱向波或純剪向波,且頻率響應高而可應用於不同元件中。To further explain, when the length of the
以下以具體例1~8說明本發明固態微型諧振器的激發波特性。The following describes the excitation wave characteristics of the solid-state microresonator of the present invention with specific examples 1-8.
具體例1Specific example 1
該具體例1的元件結構與該第一實施例相同,即該電極單元5的材料與該等高聲阻抗層31的材料相同的固態微型諧振器,其中,設定諧振頻率為2.5GHz,該基板2的材料為矽,每一個高聲阻抗層31的材料為鉬,厚度為0.629微米,每一個低聲阻抗層32的材料為二氧化矽,厚度為0.52微米,該壓電薄膜4的材料為氧化鋅,厚度為1.268微米,且沿該第一方向X及該第二方向Y的邊長為1000×1000微米,該電極單元5的材料為鉬,該等電極部521的長度L為150微米、寬度W為20微米,該間隙d為20微米。The element structure of this specific example 1 is the same as that of the first embodiment, that is, the solid micro-resonator of the
具體例2~4Specific examples 2~4
該具體例2~4的各元件結構、材料等與該具體例1大致相同,不同處在於該具體例2~4的該間隙d分別為30微米、40微米,及50微米,且該等電極部521的寬度W分別為30微米、40微米,及50微米。The element structures and materials of the specific examples 2 to 4 are substantially the same as those of the specific example 1, except that the gaps d of the specific examples 2 to 4 are 30 μm, 40 μm, and 50 μm, respectively, and the electrodes The width W of the
具體例5~8Specific examples 5~8
該具體例5~8的元件結構與該第二實施例相同,即該電極單元5的材料與該等高聲阻抗層31的材料不同的固態微型諧振器,其中,該基板2、該布拉格反射器3,及該壓電薄膜4的材料、厚度及邊長與該具體例1相同,而該電極單元5的材料則選自鋁,且該具體例5~8的該間隙d分別20微米、30微米、40微米,及50微米,該等電極部521的寬度W分別20微米、30微米、40微米,及50微米。The element structure of the specific examples 5 to 8 is the same as that of the second embodiment, that is, the solid-state microresonator of which the material of the
參閱圖3至圖6,圖3至圖6為該具體例1~4於設定諧振頻率為2.5GHz的頻率響應結果。由圖3至圖6可知,該間隙d介於20至50微米時,該固態微型諧振器可激發出純縱向波,且當該間隙d介於40至50微米時,該固態微型諧振器的頻率響應可達30dB以上,顯示,藉由控制該電極單元5的材料與該等高聲阻抗層31相同確實可使該固態微型諧振器激發縱向波,而進一步控制令該間隙d介於20至50微米時,可得頻率響應高的純縱向波,此外,當令該等訊號電極52的間隙d介於40至50微米時,該固態微型諧振器可得到頻率響應達30dB的純縱向波。Referring to FIGS. 3 to 6, FIGS. 3 to 6 are the frequency response results of the specific examples 1 to 4 when the resonance frequency is set to 2.5 GHz. It can be seen from FIGS. 3 to 6 that when the gap d is between 20 and 50 μm, the solid-state microresonator can excite pure longitudinal waves, and when the gap d is between 40 and 50 μm, the solid-state microresonator’s The frequency response can reach more than 30dB, showing that by controlling the material of the
參閱圖7至圖10,圖7至圖10為該具體例5~8於設定諧振頻率為2.5GHz的頻率響應結果。由圖7至圖10可知,該間隙d大於20且不大於50微米時,該固態微型諧振器可激發出剪向波,較佳地,該間隙d介於40至50微米時,該固態微型諧振器可激發出純剪向波,且頻率響應可達20dB以上,顯示,藉由控制該電極單元5的材料與該等高聲阻抗層31不同,以及該間隙d大於20且不大於250微米,確實可使該固態微型諧振器激發出高頻率響應的剪向波,而當進一步控制該等訊號電極52的間隙d則可得到頻率響應高的純剪向波。7 to 10, FIG. 7 to FIG. 10 are the frequency response results of the specific examples 5 to 8 when the resonance frequency is set to 2.5 GHz. As can be seen from FIGS. 7 to 10, when the gap d is greater than 20 and not greater than 50 microns, the solid-state microresonator can excite a shear wave. Preferably, when the gap d is between 40 and 50 microns, the solid-state micro The resonator can excite pure shear waves, and the frequency response can reach more than 20dB, showing that by controlling the material of the
要說明的是,該固態微型諧振器適用的諧振頻率並沒有一定限制,可為高頻或低頻,皆可使該固態微型諧振器激發出縱向波或剪向波,於上述具體例1~8中是以該諧振頻率為2.5GHz為例作說明,然實際實施時並不以此為限。It should be noted that the applicable resonant frequency of the solid-state microresonator is not limited, and it can be high frequency or low frequency, which can cause the solid-state microresonator to excite longitudinal waves or shear waves. In the above specific examples 1~8 In this example, the resonant frequency is 2.5 GHz as an example, but the actual implementation is not limited to this.
綜上所述,本發明固態微型諧振器藉由控制該電極單元5的材料與該等高聲阻抗層31相同或不同,可使同一結構的該固態微型諧振器激發出剪向波或縱向波,而進一步配合該等訊號電極52的間隙d控制,則可進一步得到頻率響應高並可激發出純剪向波或純縱向波的固態微型諧振器,使得該固態微型諧振器的應用範圍更加廣泛,且製程簡易而易實施,故確實可達成本發明之目的。In summary, by controlling the material of the
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still classified as This invention covers the patent.
2‧‧‧基板521‧‧‧電極部3‧‧‧布拉格反射器522‧‧‧延伸部31‧‧‧高聲阻抗層d‧‧‧間隙32‧‧‧低聲阻抗層W‧‧‧寬度4‧‧‧壓電薄膜L‧‧‧長度5‧‧‧電極單元X‧‧‧第一方向51‧‧‧接地電極Y‧‧‧第二方向52‧‧‧訊號電極
2‧‧‧
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一立體圖,說明本發明固態微型諧振器的一第一實施例; 圖2是一俯視圖,說明該第一實施例; 圖3是一頻率響應對頻率關係圖,說明該具體例1的訊號電極間隙d為20微米的頻率響應結果; 圖4是一頻率響應對頻率關係圖,說明該具體例2的訊號電極間隙d為30微米的頻率響應結果; 圖5是一頻率響應對頻率關係圖,說明該具體例3的訊號電極間隙d為40微米的頻率響應結果; 圖6是一頻率響應對頻率關係圖,說明該具體例4的訊號電極間隙d為50微米的頻率響應結果; 圖7是一頻率響應對頻率關係圖,說明該具體例5的訊號電極間隙d為20微米的頻率響應結果; 圖8是一頻率響應對頻率關係圖,說明該具體例6的訊號電極間隙d為30微米的頻率響應結果; 圖9是一頻率響應對頻率關係圖,說明該具體例7的訊號電極間隙d為40微米的頻率響應結果;及 圖10是一頻率響應對頻率關係圖,說明該具體例8的訊號電極間隙d為50微米的頻率響應結果。Other features and functions of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a perspective view illustrating a first embodiment of the solid-state micro resonator of the present invention; FIG. 2 is a top view, The first embodiment will be described; FIG. 3 is a frequency response vs. frequency diagram illustrating the frequency response result of the signal electrode gap d of this specific example 1 being 20 microns; FIG. 4 is a frequency response vs. frequency diagram illustrating the specific The frequency response of the signal electrode gap d of Example 2 is 30 microns; FIG. 5 is a frequency response versus frequency diagram illustrating the frequency response of the signal electrode gap d of this specific example 3 is 40 microns; FIG. 6 is a frequency response For the frequency relationship diagram, the frequency response result of the signal electrode gap d of this specific example 4 is 50 μm; FIG. 7 is a frequency response vs. frequency diagram, illustrating the frequency response of the signal electrode gap d of this specific example 5 is 20 μm Results; FIG. 8 is a frequency response vs. frequency diagram illustrating the frequency response result of the signal electrode gap d of this specific example 6 is 30 μm; FIG. 9 is a frequency response vs. frequency diagram illustrating the signal electrode of the specific example 7 The gap d is a frequency response result of 40 microns; and FIG. 10 is a frequency response vs. frequency diagram illustrating the frequency response result of the signal electrode gap d of this specific example 8 is 50 microns.
2‧‧‧基板 2‧‧‧ substrate
3‧‧‧布拉格反射器 3‧‧‧ Prague reflector
31‧‧‧高聲阻抗層 31‧‧‧High acoustic impedance layer
32‧‧‧低聲阻抗層 32‧‧‧Low acoustic impedance layer
4‧‧‧壓電薄膜 4‧‧‧ Piezo film
5‧‧‧電極單元 5‧‧‧Electrode unit
51‧‧‧接地電極 51‧‧‧Ground electrode
52‧‧‧訊號電極 52‧‧‧Signal electrode
Claims (11)
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Cited By (2)
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CN113328719A (en) * | 2021-06-19 | 2021-08-31 | 深圳市封神微电子有限公司 | Solid assembled bulk acoustic wave resonator with temperature compensation function |
WO2022061618A1 (en) * | 2020-09-23 | 2022-03-31 | 华为技术有限公司 | Resonator and preparation method, filter, and electronic device thereof |
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WO2022061618A1 (en) * | 2020-09-23 | 2022-03-31 | 华为技术有限公司 | Resonator and preparation method, filter, and electronic device thereof |
CN113328719A (en) * | 2021-06-19 | 2021-08-31 | 深圳市封神微电子有限公司 | Solid assembled bulk acoustic wave resonator with temperature compensation function |
CN113328719B (en) * | 2021-06-19 | 2023-10-03 | 深圳市封神微电子有限公司 | Solid assembly type bulk acoustic wave resonator with temperature compensation function |
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