TW201947180A - Loop vapor chamber conducive to separation of liquid and gas - Google Patents

Abstract

A loop vapor chamber conducive to separation of liquid and gas includes a base, an upper lid, a wick structure and a working fluid. The base includes a first recess, a second recess, a first extension channel and a second extension channel. The first recess and the second recess are in communication with each other through the first extension channel and the second extension channel. The upper lid is coupled to the base. The first recess, the second recess, the first extension channel and the second extension channel together form a closed space. The wick structure is disposed in the closed space and thus corresponds in position to the first recess, the second recess and the first extension channel.

Description

Liquid and steam separation circuit equalizing plate

The invention relates to a temperature equalizing plate (Vapor Chamber), in particular to a circuit temperature equalizing plate for liquid and vapor separation.

According to the current conventional circuit type temperature equalizing plate, please refer to US Patent No. US 2016 / 0128234A1. This patent mainly discloses a cooling device and electronic equipment, which mainly uses one of the two temperature equalizing plates as a heating plate The other plate is used as a heat sink, and the heat receiving plate and the heat sink are connected by a steam pipe and a liquid pipe to form a liquid-vapor-separated circuit temperature equalizing plate. This conventional circuit temperature equalizing plate connects the steam tube and the The method of connecting the liquid pipe to the second plate is processed by welding.

However, there is a problem that the product yield is reduced by welding processing, and the structure of the welding place is also relatively fragile. Therefore, the welding place is easily damaged by collision or prolonged use, thereby reducing the service life of the product.

Therefore, the applicant believes that if the welding process can be reduced, the product yield can be effectively improved.

And, if the welding process can be reduced, the strength of the connection can be effectively improved, thereby extending the service life of the product.

The main purpose of the present invention is to provide a circuit temperature equalizing plate for liquid and vapor separation, which can reduce welding processing and improve product yield.

Another main object of the present invention is to provide a circuit temperature equalizing plate for liquid and vapor separation, which can reduce welding processing and prolong the service life of the product.

In order to achieve the above object, the present invention provides a liquid-vapor separation circuit temperature equalizing plate, which includes: a base formed with a first groove, a second groove, a first extension groove, and a second extension Groove, the first groove and the second groove communicate with each other through the first extension groove and the second extension groove; an upper cover is combined with the base, and the first groove, the second groove, The first extension groove and the second extension groove form a closed space; a capillary structure is located in the closed space and corresponds to the first groove, the second groove, and the first extension groove; and an actuating fluid , Filled in the closed space and contained in the capillary structure.

Therefore, a liquid-vapor separation circuit temperature equalizing plate of the present invention can reduce welding processing and can effectively improve product yield.

In addition, the liquid-vapor separation circuit temperature equalizing plate of the present invention can reduce welding processing, can effectively improve the strength of the product connection, and then prolong the service life of the product.

In order to explain the technical features of the present invention in detail, the following first embodiment is described below with reference to the drawings, wherein:

As shown in FIGS. 1 to 4, a liquid-vapor separation circuit temperature isolating plate 10 provided by the first embodiment of the present invention is mainly composed of a base 11, an upper cover 21, a capillary structure 31, and an operating fluid. The composition (action fluid is a technique commonly known to those skilled in the art, so it is not shown in each figure), where:

The base 11 is formed with a first groove 13, a second groove 15, a first extension groove 17 and a second extension groove 19. The first groove 13 and the second groove 15 pass through the first groove 13. An extension groove 17 and the second extension groove 19 communicate with each other. In this embodiment, as shown in FIG. 1 to FIG. 4, the first extension groove 17 and the second extension groove 19 are separated by a first predetermined distance, and are respectively located in the first groove 13. The peripheral edge of the second groove 15 sequentially defines a first side 131, a second side 133, a third side 135, and a fourth side 137. The first extension groove 17 is connected to the first groove. The third side 135 of 13 and the first side 131 of the second groove 15, and the second extension groove 19 is connected to the third side 135 of the first groove 13 and the first side of the second groove 15. Edge 131.

The upper cover 21 is combined with the base 11, and forms a closed space 18 in the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19. In this embodiment, the bottom surfaces of the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19 are formed on the same horizontal plane, and the upper cover 21 is flat. It is arranged corresponding to the contours of the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19.

The capillary structure 31 includes a first capillary layer 32, a second capillary layer 34, a third capillary layer 36, a fourth capillary layer 38, and a capillary body 39 in this embodiment.

The first capillary layer 32 is sintered from copper powder. The first capillary layer 32 is formed on the upper cover 21 and is located in an area of the upper cover 21 facing the first groove 13. 32 does not affect the communication between the first groove 13, the first extension groove 17, and the second extension groove 19.

The second capillary layer 34 is sintered from copper powder. The second capillary layer 34 is formed on the upper cover 21 and is located in an area where the upper cover 21 faces the second groove 15. 34 does not affect the communication between the second groove 15, the first extension groove 17, and the second extension groove 19.

The third capillary layer 36 is sintered from copper powder. The third capillary layer 36 is formed on the base 11 and is located in the first groove 13. The third capillary layer 36 does not affect the first recess. The communication between the groove 13, the first extension groove 17, and the second extension groove 19.

The fourth capillary layer 38 is sintered from copper powder. The fourth capillary layer 38 is formed on the base 11 and is positioned in the second groove 15. The fourth capillary layer 38 does not affect the second recess. The communication between the groove 15, the first extension groove 17 and the second extension groove 19 is established.

The capillary body 39 is disposed in the first extension groove 17 and fills the first extension groove 17, and is in contact with the first, second, third, and fourth capillary layers 32, 34, 36, and 38. In this embodiment, the capillary body 39 is sintered with copper powder, and the capillary body 39 extends in the first groove 13 and the second groove 15, thereby increasing the contact of the capillary body 39 with the first groove. The areas of the first, second, third, and fourth capillary layers 32, 34, 36, and 38, thereby increasing the transmission amount of the working fluid, can improve heat dissipation efficiency.

The first capillary layer 32, the second capillary layer 34, the third capillary layer 36, and the fourth capillary layer 38 may be made of other materials, such as a woven mesh; or the first and second capillary layers 32, 34 are sintered from copper powder, and the third and fourth capillary layers 36, 38 are composed of a woven mesh; or the first and second capillary layers 32, 34 are composed of a woven mesh, and the third and fourth The capillary layers 36 and 38 are sintered from copper powder; in addition, the capillary body 39 can also be changed to a fiber bundle material. Therefore, the first, second, third, and fourth capillary layers 32, 34, 36, 38 and the capillary body The composition of 39 is not limited to sintering of copper powder.

There are a plurality of convex portions 33 between the first groove 13 and the second groove 15 and the corresponding upper cover 21, and each of the convex portions 33 is made of a capillary material. In this embodiment, copper powder sintering may be used. Thus, each of the convex portions 33 abuts between the first capillary layer 32 and the third capillary layer 36, and between the second capillary layer 34 and the fourth capillary layer 38, each of the convex portions 33 each other. There is a second predetermined distance apart, the plurality of convex portions 33 are cylindrical and arranged in a matrix; thereby, the transmission efficiency of the working fluid can be increased, and the supportability of the present invention can be increased.

The plurality of convex portions 33 may also have other columnar shapes (for example, a triangular column, a square column, etc.), and the plurality of convex portions 33 may also be dispersedly arranged. In addition, when the first, second, third, and fourth capillary layers When 32, 34, 36, and 38 are sintered from copper powder, each of the convex portions 33 may be composed of a solid metal block, because the working fluid is easily composed of the first, second, third, and fourth capillary layers 32, 34, Disengagement in 36, 38 can still be transmitted between the first capillary layer 32 and the third capillary layer 36 or the second capillary layer 34 and the fourth capillary layer 38 without affecting the circulation of the working fluid. There is also an advantage that the supportability of the present invention can be increased; therefore, the implementation form of the plurality of convex portions 33 is not limited to this embodiment only. However, if there is no problem of insufficient support, the arrangement of the plurality of convex portions 33 can be omitted, and therefore, the plurality of convex portions 33 is not an essential element of the present invention.

The working fluid is filled in the closed space 18 and contained in the capillary structure 31.

It is worth mentioning that in the first embodiment, as shown in FIG. 5, the first extension groove 17 may also be changed to be connected to the second side 133 of the first groove 13 and the second recess. The second side 133 of the groove 15 is changed, and the second extension groove 19 is changed to be connected to the fourth side 137 of the first groove 13 and the fourth side 137 of the second groove 15.

Alternatively, as shown in FIG. 6, the first extension groove 17 may be changed to be connected to the third side 135 of the first groove 13 and the first side 131 of the second groove 15. The extension groove 19 is changed to be connected to the fourth side 137 of the first groove 13 and the fourth side 137 of the second groove 15.

It can be known that the present invention can change the positions of the first extension groove 17 and the second extension groove 19 formed between the first groove 13 and the second groove 15 as well as the first The channel shapes of the extension groove 17 and the second extension groove 19, therefore, the positions where the first extension groove 17 and the second extension groove 19 are connected to the first groove 13 and the second groove 15 are not based on This embodiment is limited.

In addition, it is worth noting that, as shown in FIGS. 7 to 8, the bottom surfaces of the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19 may also be It is formed on different horizontal planes. In addition, the upper cover 21 may also be provided in a non-flat plate shape (for example, the bottom surface of the first groove 13, the second groove 15, the first extension groove 17 or the second extension groove 19 is matched). It is set in a state of high and low fluctuations. This structural change is not shown in the figure). Therefore, the embodiments of the first groove 13, the second groove 15, the first extension groove 17, the bottom surface of the second extension groove 19, and the upper cover 21 are not limited to this embodiment.

In addition, as shown in FIG. 9, although only part of the first extension groove 17 is filled with the capillary body 39, as long as the third capillary layer 36 and the fourth capillary layer 38 are still connected to the capillary body 39 There is contact, that is, it does not affect the circulation of the working fluid, and still has a heat dissipation effect. Therefore, the arrangement of the capillaries 39 is not limited to this embodiment.

The structure of the first embodiment of the present invention has been described above, and a description of the use state is provided next.

Please refer to FIG. 1 to FIG. 3. The present invention is used with a heat source and a heat sink (not shown). The use state of this embodiment is that the heat source is disposed in the first groove 13 correspondingly. The upper cover 21 and the heat sink disposed in the upper cover 21 corresponding to the second groove 15 are taken as an example. When the heat source starts to heat, the working fluid of the first capillary layer 32 will evaporate in the first groove 13, and the working fluid in the vapor state will enter the second groove 15 through the second extension groove 19. Inside, when the upper cover 21 provided with the radiator is cooled, the working fluid in a vapor state will condense into the working fluid in a liquid state and be contained in the second capillary layer of the second groove 15 again. 34, and then the liquid working fluid is transmitted to the fourth capillary layer 38 in the second groove 15 through the convex portions 33 in the second groove 15, and then the liquid working fluid will be The capillary body 39 passes through the first extension groove 17 to the third capillary layer 36 in the first groove 13, and finally, the third capillary layer 36 in the first groove 13 contains the The operating fluid will transfer the liquid operating fluid to the first capillary layer 32 through the convex portions 33 in the first groove 13, thereby providing temperature reduction and recirculation.

Accordingly, the present invention can reduce welding processing, so that the product yield can be improved.

In addition, the invention can reduce welding processing and can prolong the service life of the product.

Next, referring to FIG. 10, the structure and effects of the second embodiment of the present invention are mainly the same as those of the first embodiment, and the differences are as follows:

According to a second embodiment of the present invention, a liquid-vapor separation circuit temperature equalizing plate 10 'is provided. The base 11' is formed with two first extension grooves 17 'and two second extension grooves 19'. In this embodiment, two first extension grooves 17 ′ and two second extension grooves 19 ′ are provided on the third side 135 ′ of the first groove 13 ′ and the second groove 15 ′. Taking the first side 131 ′ as an example, the return flow of the working fluid can be increased, and the heat dissipation effect can be effectively improved. However, in other embodiments, the number of the first extension grooves 17 ′ and the second extension grooves 19 ′ and the connection positions may be changed according to usage requirements. Therefore, the first extension grooves 17 ′ and the The implementation form of the second extension groove 19 'is not limited to this embodiment.

Accordingly, the second embodiment of the present invention can increase the return flow of the working fluid, thereby improving the heat dissipation effect of the present invention.

The remaining structures and functions of the second embodiment of the present invention are the same as those of the first embodiment, so they will not be described again.

Please refer to FIG. 11 again, the structure and effect of the third embodiment of the present invention are mainly similar to the first embodiment, and the differences are as follows:

A third embodiment of the present invention provides a liquid-vapor separation circuit temperature isolating plate 10 ", and the capillary structure 31" includes a second capillary layer 34 "and a third capillary layer 36", It omits the first capillary layer 32 and the fourth capillary layer 38 shown in FIG. 2 of the first embodiment, and the effect of circulating the working fluid can also be achieved. Therefore, the capillary structure 31 '' may have other configurations, and is not limited to this embodiment.

The remaining structures and functions of the third embodiment of the present invention are the same as those of the first embodiment, so they will not be described again.

10‧‧‧Circular temperature equalizing plate for liquid and vapor separation

11‧‧‧ base

13‧‧‧first groove

15‧‧‧Second groove

131‧‧‧first side

133‧‧‧Second side

135‧‧‧ Third side

137‧‧‧ Fourth side

17‧‧‧first extension slot

18‧‧‧ confined space

19‧‧‧Second extension slot

21‧‧‧ Upper cover

31‧‧‧ Capillary structure

32‧‧‧ first capillary layer

33‧‧‧ convex

34‧‧‧Second capillary layer

36‧‧‧ third capillary layer

38‧‧‧ fourth capillary layer

39‧‧‧ Capillary

10’‧‧‧Circuit temperature equalization board for liquid and vapor separation

11’‧‧‧ base

13’‧‧‧first groove

131’‧‧‧ the first side

15’‧‧‧second groove

135’‧‧‧ the third side

17’‧‧‧first extension groove

19’‧‧‧second extension slot

10’’‧‧‧Circuit temperature equalization board for liquid and vapor separation

31’’‧‧‧ Capillary structure

34’’‧‧‧ second capillary layer

36’’‧‧‧ third capillary layer

Fig. 1 is a perspective view of a first embodiment of the present invention. Fig. 2 is a first exploded view of the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 1. Fig. 4 is a sectional view taken along the line 4-4 of Fig. 1; FIG. 5 is a second exploded view of the first embodiment of the present invention, showing changes of the first extension groove and the second extension groove at different positions. FIG. 6 is a third exploded view of the first embodiment of the present invention, showing changes of the first extension groove and the second extension groove at different positions. FIG. 7 is a fourth exploded view of the first embodiment of the present invention, showing the internal conditions when the bottom surfaces of the first groove, the second groove, the first extension groove, and the second extension groove are formed at different levels. Figure 8 and Figure 7 only show a part of the front view, showing the bottom surfaces of the first groove, the second groove, the first extension groove and the second extension groove, which are formed at different levels. FIG. 9 is a fifth exploded view of the first embodiment of the present invention, showing the case where the first extension groove of the portion is filled with the capillaries. Fig. 10 is an exploded view of the second embodiment of the present invention. FIG. 11 is an exploded view of the third embodiment of the present invention.

Claims (14)

The steam isolating circuit temperature isolating plate includes: a base formed with a first groove, a second groove, a first extension groove, and a second extension groove; the first groove and the second groove The first extension groove and the second extension groove communicate with each other. An upper cover is combined with the base and forms a first groove, the second groove, the first extension groove, and the second extension groove. A confined space; a capillary structure located in the confined space, corresponding to the first groove, the second groove, and the first extension groove; and a working fluid filled in the confined space and contained in the capillary structure . The liquid-temperature and vapor-separation circuit isothermal plate according to item 1 of the scope of the patent application, wherein the bottom surfaces of the first groove, the second groove, the first extension groove, and the second extension groove are formed on the same surface. The horizontal surface is flat. The liquid temperature and vapor separation circuit isothermal plate according to item 1 of the patent application scope, wherein the first extension groove and the second extension groove are separated by a first predetermined distance. According to the liquid-temperature and vapor-separation circuit equalizing plate of the first patent application scope, wherein: the first groove, the second groove, and the first groove are sequentially defined on the periphery of the first groove and the second groove, respectively. Three sides and a fourth side; the first extension groove is connected to the third side of the first groove and the first side of the second groove, and the second extension groove is connected to the first groove A third side and a first side of the second groove. According to the liquid-temperature and vapor-separation circuit equalizing plate of the first patent application scope, wherein: the first groove, the second groove, and the first groove are sequentially defined on the periphery of the first groove and the second groove, respectively. Three sides and a fourth side; the first extension groove is connected to the second side of the first groove and the second side of the second groove, and the second extension groove is connected to the first groove A fourth side and a fourth side of the second groove. According to the liquid-temperature and vapor-separation circuit equalizing plate of the first patent application scope, wherein: the first groove, the second groove, and the first groove are sequentially defined on the periphery of the first groove and the second groove, respectively. Three sides and a fourth side; the first extension groove is connected to the third side of the first groove and the first side of the second groove, and the second extension groove is connected to the first groove A fourth side and a fourth side of the second groove. The liquid temperature and vapor separation circuit isothermal plate according to item 1 of the patent application scope, wherein the capillary structure includes a first capillary layer, a second capillary layer, a third capillary layer, a fourth capillary layer, and a capillary. The first capillary layer is formed on the upper cover and is located in an area where the upper cover faces the first groove, and the first capillary layer does not affect the first groove, the first extension groove, and the second The communication between the extension grooves; the second capillary layer is formed on the upper cover and is located in the area where the upper cover faces the second groove, and the second capillary layer does not affect the second groove and the first extension Communication between the groove and the second extension groove; the third capillary layer is formed on the base and is located in the first groove, and the third capillary layer does not affect the first groove and the first extension groove And the second extension groove; the fourth capillary layer is formed on the base and located in the second groove, and the fourth capillary layer does not affect the second groove, the first extension groove and Communication between the second extension grooves; the capillary body is provided in the first extension grooves, and at least part of The first extension groove is filled with the capillary body. The liquid-temperature and vapor-separation circuit isothermal plate according to item 7 of the patent application scope, wherein: the first capillary layer, the second capillary layer, the third capillary layer, and the fourth capillary layer are made of copper powder or a woven mesh. The capillaries are made of copper powder or fiber bundles. The liquid-temperature and vapor-separation circuit isothermal plate according to item 7 of the patent application scope, wherein: the capillary system extends into the first groove and the second groove. The liquid temperature and vapor separation circuit temperature isolating plate according to item 7 of the scope of patent application, wherein: the first groove and the second groove have a plurality of convex portions between the corresponding upper cover, and each of the convex portions abuts against Between the first capillary layer and the third capillary layer, and between the second capillary layer and the fourth capillary layer, each convex portion is separated from each other by a second predetermined distance. The liquid-temperature and steam-separation circuit temperature equalizing plate according to item 10 of the patent application scope, wherein each of the convex portions is composed of a capillary material or a solid metal block. The circuit temperature equalizing plate for liquid and vapor separation according to item 10 of the scope of patent application, wherein: the plurality of convex portions are cylindrical. The circuit temperature equalizing plate for liquid and vapor separation according to item 10 of the scope of patent application, wherein the plurality of convex portions are arranged in a matrix. According to the scope of the patent application, the liquid and vapor separation circuit temperature isolating plate, wherein: the first groove, the second groove, the first extension groove and the bottom surface of the second extension groove are formed in different level.