TW201946968A - Resin composition and insulation film and product using the same - Google Patents

Abstract

A resin composition for a printed circuit board and an integrated circuit (IC) package, and an insulation film and a product using the same is provided by this invention. The resin composition includes an epoxy resin composite comprising an epoxy group, the epoxy resin composite including 5 to 20 parts by weight of a bisphenol A type epoxy resin, 30 to 60 parts by weight of a cresol novolak epoxy resin, 20 to 35 parts by weight of a phosphorus-based flame-retardant epoxy resin, and 5 to 30 parts by weight of a rubber-modified epoxy resin, based on 100 parts by weight of the epoxy resin composite, an aminotriazine-based hardener, a hardening accelerator, a filler, and 0.01 to 5 parts by weight of a surface improving agent based on 100 parts by weight of the epoxy resin composite.

Description

Resin composition, and insulating film and product using the same

The present invention relates to a resin composition for a printed circuit board (PCB) and an integrated circuit (IC) package, and an insulating film and a product using the resin composition.

This application requires Korean Patent Application No. 10-2018-0054394 filed with the Korean Intellectual Property Office on May 11, 2018 and Korean Patent Application No. 10-2018-0109017 filed with the Korean Intellectual Property Office on September 12, 2018 The benefit of the patent application, the entire disclosure of said Korean patent application is hereby incorporated by reference for all purposes.

With the development of electronic devices with higher performance, higher capacity, and thinner form factors, printed circuit boards of electronic devices have realized various advanced functions in addition to thin form factors.

Recently, a microcircuit is formed after laminating an insulating film, instead of using a one-step method of laminating copper foil and PPG using an ordinary V-shaped press.

With this new method, it is necessary to develop a new insulating material that has excellent adhesion to the plating layer compared to ordinary insulating materials. Specifically, the adhesion with the wiring material must be improved to ensure reliability in a harsh environment such as drop reliability. Therefore, an insulating material having excellent peel strength is required.

In addition, since build-up materials can be used in various ways as molding materials in back-side redistribution layers (RDL) and PCB-based panel-level packaging (PLP), there is a need to ensure the reliability of PCBs and packages. Development of insulation composition.

This summary is provided to introduce a selection of concepts in a simplified form, and to further describe the concepts in the detailed description that follows. This summary is not intended to define key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In a general aspect, a resin composition includes: an epoxy resin compound comprising 5 to 20 parts by weight of a bisphenol A ring based on 100 parts by weight of the epoxy resin compound Oxygen resin, 30 to 60 parts by weight of cresol novolac epoxy resin, 20 to 35 parts by weight of phosphorus-based flame retardant epoxy resin, and 5 to 30 parts by weight of rubber-modified epoxy resin; aminotriazine-based hardener A hardening accelerator; a filler; and a surface modifier of 0.01 to 5 parts by weight based on 100 parts by weight of the epoxy resin composite.

The resin composition may be applied in a printed circuit board (PCB) or an integrated circuit (IC) package.

The epoxy resin composite may include 5 to 15 parts by weight of the bisphenol A type epoxy resin, and 50 to 60 parts by weight of the cresol novolac based on 100 parts by weight of the epoxy resin composite. Epoxy resin, 25 to 35 parts by weight of the phosphorus-based flame retardant epoxy resin, and 5 to 20 parts by weight of the rubber-modified epoxy resin.

The average epoxy resin equivalent of the bisphenol A type epoxy resin may be 100 g / eq to 700 g / eq.

The average epoxy resin equivalent of the cresol novolac epoxy resin may be 100 g / eq to 600 g / eq.

The phosphorus-based flame retardant epoxy resin may have an average epoxy resin equivalent weight of 400 g / eq to 800 g / eq.

An average epoxy resin equivalent of the rubber-modified epoxy resin may be 100 g / eq to 500 g / eq.

The aminotriazine-based hardener may be included in an amount of 0.2 to 1.5 equivalent ratio based on the mixed equivalent of the total of the epoxy groups of the epoxy resin composite.

The hardening accelerator may be included in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite.

The filler may be included in an amount of 20 to 50 parts by weight based on 100 parts by weight of the epoxy resin composite.

The filler may be an inorganic filler.

The resin composition may further include at least one of a defoamer and a viscosity enhancer.

An insulating film may include a resin composition.

The insulating film may be a build-up insulating film having a thickness of 100 μm or less.

The insulating film may be a molded film having a thickness of 100 μm or more.

The insulating film may be applied to at least one of an accumulation layer of a printed circuit board, a molding layer of a panel-level package, and a redistribution layer.

A product that may include an insulating film.

The product may be at least one of a printed circuit board and an integrated circuit (IC) package.

Other features and aspects will be apparent from the following detailed description, drawings, and scope of patent application.

The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, devices, and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications, and equivalents of the methods, devices, and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example, and is not limited to the order of operations set forth herein, but in addition to operations that must occur in a particular order, one can make after understanding the disclosure of this application will be Obvious change. In addition, to improve clarity and brevity, descriptions of features known in the art may be omitted.

The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein that will be apparent upon understanding the disclosure of this application. .

Throughout the specification, when an element such as a layer, region, or substrate is described as being "on", "connected to", or "coupled to" another element, the element may be "directly on" "Another element is" on "," directly connected to "another element, or" coupled to "another element directly, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly coupled to" another element, there may be no other element in between.

The term "and / or" as used herein includes any one of the related listed items and any combination of any two or more.

Although terms such as "first," "second," and "third" may be used herein to describe various components, components, regions, layers or sections, these components, components, regions, layers or sections are not subject to these terms limit. Rather, these terms are only used to distinguish one component, component, region, layer or section from another component, component, region, layer or section. Thus, without departing from the teachings of examples, a first component, component, region, layer, or section referred to in the examples described herein may also be referred to as a second component, component, region, layer, or section.

For convenience of description, spatially relative terms such as "above," "above," "below," and "below" may be used herein to describe an element as shown in the attached drawings and The relationship of another element. This spatial relative term is intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be "under" or "down" relative to the other element. Thus, the term "above" may include both upward and downward orientations depending on the spatial orientation of the device. The device can also be positioned in other ways (for example, rotated 90 degrees or at other orientations) and the spatially relative terms used herein can be interpreted accordingly.

The terminology used herein is used only to describe various examples and is not intended to limit the present disclosure. Articles in the singular are intended to include the plural as well, unless the context clearly indicates otherwise. The terms "comprising," "including," and "having" list the existence of stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations , Components, elements, and / or combinations thereof.

Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings, but include variations in shapes that occur during manufacturing.

The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of this application. In addition, although the examples described herein have various configurations, other configurations that will be apparent after understanding the disclosure of this application are possible.
A. Resin composition

The resin composition for a printed circuit board and / or IC package according to an embodiment of the present disclosure includes: (a) an epoxy resin compound, based on 100 parts by weight of an epoxy resin compound, the epoxy resin compound including 5 to 20 parts by weight of bisphenol A type epoxy resin, 30 to 60 parts by weight of cresol novolac epoxy resin, 20 to 35 parts by weight of phosphorus-based flame retardant epoxy resin, and 5 to 30 parts by weight of rubber modification Epoxy resins; (b) aminotriazine-based hardeners; (c) hardening accelerators; (d) fillers; and (e) based on 100 parts by weight of epoxy resin composites, including 0.01 to 5 parts by weight of surface Modifier.
( A ) Epoxy resin compound
Bisphenol A epoxy resin ( DGEBA epoxy resin)

The average epoxy resin equivalent of the bisphenol A type epoxy resin may be, but is not limited to, 100 g / eq to 700 g / eq. When the average epoxy resin equivalent is less than 100 g / eq, it may be difficult to exhibit desired physical properties. On the other hand, when the average epoxy resin equivalent is more than 700 g / eq, it may be difficult to dissolve in a solvent, and thus the melting point may become excessively high.

The bisphenol A type epoxy resin may be included in an amount of 5 to 20 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the bisphenol A-type epoxy resin is less than 5 parts by weight, the adhesiveness with the wiring material may be deteriorated. On the other hand, when the content of the bisphenol A type epoxy resin is more than 20 parts by weight, thermal stability and electrical properties may be deteriorated. Although not limited thereto, the bisphenol A type epoxy resin may preferably be used in an amount of 5 to 15 parts by weight based on 100 parts by weight of the epoxy resin composite.
Cresol novolac epoxy resin

The epoxy resin composition includes a cresol novolac epoxy resin to provide a cured product with improved thermal stability and high heat resistance. The average epoxy resin equivalent of the cresol novolac epoxy resin in the epoxy resin compound may be in a range of 100 to 600 g / eq, but is not limited thereto.

The cresol novolac epoxy resin may be included in an amount of 30 to 60 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the cresol novolac epoxy resin is less than 30 parts by weight, it may be difficult to obtain desired physical properties. On the other hand, when the content of the cresol novolac epoxy resin is more than 60 parts by weight, electrical properties or mechanical properties may be deteriorated. The content of the cresol novolac epoxy resin may be 30 to 60 parts by weight, 40 to 60 parts by weight or 50 to 60 parts by weight, and preferably 50 to 60 parts by weight based on 100 parts by weight of the epoxy resin composite.
Phosphorus-based flame retardant epoxy resin

The epoxy resin compound may include a phosphorus-based flame retardant epoxy resin to provide a cured product having high flame retardancy. The average epoxy resin equivalent of the phosphorus-based flame retardant epoxy resin in the epoxy resin compound may be in a range of 400 g / eq to 800 g / eq, but is not limited thereto. When the average epoxy resin equivalent is less than 400 g / eq, it may be difficult to obtain desired physical properties. On the other hand, when the average epoxy resin equivalent is more than 800 g / eq, it may be difficult to dissolve in a solvent, and thus the melting point may become excessively high.

The phosphorus-based flame retardant epoxy resin may be included in an amount of 20 to 35 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the phosphorus-based flame retardant epoxy resin is less than 20 parts by weight, it may be difficult to provide suitable flame retardancy in the insulating film. On the other hand, when the content of the phosphorus-based flame retardant epoxy resin is more than 35 parts by weight, the mechanical strength may decrease. Although not limited thereto, the phosphorus-based flame retardant epoxy resin may be preferably contained in an amount of 20 to 35 parts by weight, and more preferably 25 to 35 parts by weight.
Rubber modified epoxy resin

The epoxy resin compound may include a rubber-modified epoxy resin. As the content of rubber-modified epoxy resin increases, it may affect the mechanical properties and adhesion after hardening.

Although not limited thereto, the average epoxy resin equivalent of the rubber-modified epoxy resin may be 100 g / eq to 500 g / eq. When the average epoxy resin equivalent is less than 100 g / eq, it may be difficult to exhibit desired physical properties. On the other hand, when the average epoxy resin equivalent is more than 500 g / eq, it may be difficult to dissolve in the solvent, and thus the melting point may become too high to be controlled.

The rubber-modified epoxy resin may be included in an amount of 5 to 30 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the rubber-modified epoxy resin is less than 5 parts by weight, it may be difficult to provide mechanical stability of the insulating film, and it may not be suitable for forming a circuit board to which an insulating material is applied. As the content of the rubber-modified epoxy resin increases, the tensile strength, elongation, and adhesion of the cured film can be improved. However, when the content of the rubber-modified epoxy resin is more than 30 parts by weight, the adhesion improving effect may not be great. Although not limited thereto, the amount of the rubber-modified epoxy resin contained may be 5 to 30 parts by weight, 5 to 25 parts by weight, or 5 to 20 parts by weight, and more preferably 5 to 20 parts by weight.
( B ) Hardener

The hardener contained in the resin composition of the present disclosure may be an aminotriazine-based hardener to improve thermal expansion coefficient (CTE) characteristics and hardening density. In the disclosed example, by using an aminotriazine-based hardener having many functional groups, it is possible to control the water absorption while reducing the CTE as compared with the use of a common novolac hardener.

The hardener is not limited thereto, but is a mixed equivalent based on the total of epoxy groups of the epoxy resin compound, and may include an amount of 0.2 to 1.5 equivalent ratio, preferably 0.2 to 1.0 equivalent, and more preferably 0.2 to 0.8 equivalent. . 0.6 equivalent can be optimally selected, and 0.6 equivalent satisfies the target CTE of 40 ppm / ° C without increasing the water absorption. When the equivalent ratio of the hardener is less than 0.2, the flame retardancy of the composition may be deteriorated. On the other hand, when the equivalent ratio of the hardener is more than 1.5, the adhesiveness with the wiring layer may be deteriorated, so the storage stability may be deteriorated.
( C ) Hardening accelerator

The hardening accelerator contained in the disclosed resin composition may be an imidazole-based compound, and examples thereof include 2-ethyl-4-methylimidazole, 1- (2-cyanoethyl) -2-alkylimidazole, 2-phenylimidazole and mixtures thereof, but the hardening accelerator is not limited thereto.

The hardening accelerator may be included in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite, but is not limited thereto. Since the cured product can maintain a minimum viscosity of 1000 Pa · s or less, it can provide flowability, which can further improve processability.

When the content of the hardening accelerator is less than 0.1 parts by weight, the hardening rate may be significantly reduced. On the other hand, when the content of the hardening accelerator is more than 1 part by weight, hardening may occur rapidly, and thus it may be difficult to provide desired physical properties.
( D ) Filler

The filler included in the disclosed resin composition may be an inorganic filler, and the inorganic filler may be, but is not limited to, barium titanium oxide, barium strontium titanate, titanium oxide, lead zirconate titanate, lead lanthanum zirconate titanate, lead magnesium niobate- At least one of lead titanate, silver, nickel, nickel-coated polymer balls, gold-coated polymer balls, tin solder, graphite, tantalum nitride, metal silicon nitride, carbon black, silicon dioxide, clay, aluminum, and aluminum borate One.

The inorganic filler may be included in an amount of 20 to 50 parts by weight based on 100 parts by weight of the epoxy resin composite, but is not limited thereto. When the content of the inorganic filler is less than 20 parts by weight, it may be difficult to provide desired mechanical properties. On the other hand, when the content of the inorganic filler is more than 50 parts by weight, phase separation may occur. The amount of the inorganic filler included may be preferably 30 to 45 parts by weight, but is not limited thereto.

In addition, the inorganic filler may be surface-treated with a silane coupling agent, and may preferably include fillers of different sizes and shapes. Although not limited thereto, as the silane coupling agent, various amino groups, epoxy groups, acrylic groups, vinyl groups, and the like can be used.
( E ) Surface modifier

The surface modifier contained in the resin composition of the present disclosure may be, but is not limited to, one selected from the group consisting of ammonium compounds, amine compounds, imine compounds, amidine compounds, and mixtures thereof. The surface modifier may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the surface modifier is less than 0.01 parts by weight, when the resin composition is coated on a carrier film or a substrate, dewetting of the surface may occur. On the other hand, when the content of the surface modifier is more than 5 parts by weight, depressions may be formed in the coating film, and interfacial delamination may occur during reliability evaluation by a volatile low molecular weight material.

Examples of the surface modifier include, but are not limited to, polyether-modified dimethylpolysiloxane containing BYK-345, BYK-348, BYK-346, BYK-UV3510, BYK-337, and the like. Although not limited to this, BYK-337 can be used in the examples disclosed herein.

In order to facilitate coating and film formation using the resin composition of the present disclosure, different solvents having different boiling points may be used, and the resin composition may include at least one of a defoamer and a viscosity enhancer.
( F ) Defoaming agent

The antifoaming agent contained in the disclosed exemplary resin composition plays a role of suppressing foaming and improving water absorption by imparting a dispersion effect. When bubbles are generated, the bubbles float on the substrate and cause defective physical properties. By using such an antifoaming agent, such defects can be prevented. The defoamer may be, but is not limited to, a siloxane type or a non-siloxane polymer type.

The antifoaming agent may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the defoaming agent is less than 0.01 parts by weight, the adhesiveness and elongation with the wiring material may be reduced. On the other hand, when the content of the defoaming agent is more than 5 parts by weight, it may be difficult to provide desired mechanical properties.
( G ) Viscosity enhancer

The disclosed exemplary resin composition may include a viscosity enhancer to form a high-viscosity insulating composition. The viscosity enhancer may be selected from inorganic viscosity enhancers and / or organic viscosity enhancers.

Although not limited thereto, the organic viscosity enhancer may be selected from the group consisting of urea-modified polyamide wax, thixotropic resin, cellulose ether, starch, natural hydrocolloid, synthetic biopolymer, polyacrylate, alkali-activated acrylic emulsion And at least one of fatty acid alkanolamine.

Although not limited thereto, the inorganic viscosity enhancer may be at least one selected from the group consisting of magnesium oxide, magnesium hydroxide, amorphous silicon dioxide, and layered silicate.

Although not limited thereto, the viscosity enhancer may be selected from inorganic viscosity enhancers, such as silicon dioxide. Silicon dioxide can effectively prevent precipitation without impairing the performance of the resin composition. Although not limited thereto, the viscosity enhancer may be included in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the epoxy resin composite. When the content of the viscosity enhancer is less than 0.01 parts by weight, the adhesiveness with the wiring material may be deteriorated. On the other hand, when the content of the viscosity enhancer is more than 5 parts by weight, it may be difficult to provide desired mechanical properties.
( H ) Solvent

In order to facilitate coating and film formation using the resin composition of the present disclosure, different solvents having different boiling points may be used. The resin composition can be dissolved in 2-methoxyethanol, methyl ethyl ketone (MEK), dichloromethane (MC), dimethylformamide (DMF), methyl cellosolve (MCS) ) In a mixed solvent.
B. Insulation film

By using the resin composition of the present disclosure, an insulating film having improved water absorption, reliability, thermal stability, and mechanical properties can be manufactured.

The insulating film can be applied to a buildup layer of a printed circuit board, a mold layer of a PLP, and a backside redistribution layer (RDL).

The insulating film may be a build-up insulating film having a thickness of 100 μm or less. In this case, by using a resin composition containing a surface modifier, an insulating film having a thickness of 100 μm or less can be easily manufactured.

The insulating film may be a molded film having a thickness of 100 μm or more. In this case, by using a resin composition containing a surface modifier, an insulating film having a thickness of 100 μm or more can be easily manufactured.

The minimum viscosity of the insulating film can be 1000 Pa · s or less (Figure 5). As a result, processing can be facilitated during the manufacturing of a substrate or the like using the insulating film of the disclosed example.
C. Package

Provided are printed circuit boards and IC packages having improved water absorption, reliability, thermal stability, and mechanical properties using the disclosed example insulating films. Specifically, the disclosed example insulating film can be applied to an accumulation layer of a printed circuit board, a molded film of PLP, and a back-side RDL.

Hereinafter, although a more detailed description will be given by way of example, these descriptions are only for explanation and are not intended to limit the present disclosure. In the following examples, only examples using specific compounds are disclosed. However, it will be apparent to those skilled in the art that even when the equivalents of these compounds are used, equivalents of similar compounds may be exhibited.
Example 1
Preparation of resin composition

Preparation of the resin composition of Example 1. The resin composition includes: an epoxy resin compound, the epoxy resin compound includes a bisphenol A epoxy resin (KUKDO CHEMICAL Co., LTD., YD011), a cresol novolac epoxy Resin (KUKDO CHEMICAL Co., LTD., YDCN), phosphorus-based flame retardant epoxy resin (KUKDO CHEMICAL Co., LTD., KDP550) and rubber modified epoxy resin (TRUKTOL, Polydis 3616); aminotriazine hardening (GUN EI CHEMICAL INDUSTRY Co., LTD., PS-6313); and hardening accelerator.

More specifically, an aminotriazine-based hardener was added in an amount of 0.6 wt% of the epoxy resin compound, and a spherical silica slurry having a size distribution of 300 nm to 1.2 μm was added and stirred at 300 rpm for 3 hours.

2.5 g of 2-ethyl-4-methylimidazole as a hardening accelerator and 92.89 g of BYK-337 as a surface modifier were added to the mixture, and further mixed at 300 rpm for 1 hour to provide an insulating resin composition Thing. The components of the resin composition of Example 1 are shown in Table 1 in detail.

[Table 1]
Preparation of insulation film and cured product

The prepared resin composition is cast on a polyethylene terephthalate (PET) film to provide a roll film product. The prepared product was laminated at a temperature of about 100 ° C. in a size of 405 mm × 510 mm. After lamination, the laminate was cured at about 110 ° C for 30 minutes and decontaminated to form roughness. Then, a circuit layer having a thickness of about 25 μm is formed by a plating process. The circuit layer was cured at 190 ° C for 1 hour to provide a final cured product.
Example 2

A final cured product was provided in the same manner as in Example 1 except that the content of the phosphorus-based flame retardant epoxy resin in the resin composition was 35% by weight.
Comparative Example 1

A final cured product was provided in the same manner as in Example 1 except that a phosphorus-based flame retardant epoxy resin was not added to the resin composition.
Comparative Example 2

A final cured product was provided in the same manner as in Example 1 except that the content of the phosphorus-based flame retardant epoxy resin in the resin composition was 15 wt%.
Example 3

A final cured product was provided in the same manner as in Example 1 except that the content of the rubber-modified epoxy resin in the resin composition was 5 wt%.
Example 4

A final cured product was provided in the same manner as in Example 1 except that the content of the rubber-modified epoxy resin in the resin composition was 15 wt%.
Example 5

A final cured product was provided in the same manner as in Example 1 except that the content of the rubber-modified epoxy resin in the resin composition was 30 wt%.
Comparative Example 3

A final cured product was provided in the same manner as in Example 1 except that the rubber-modified epoxy resin was not added to the resin composition.
Comparative Example 4

A final cured product was provided in the same manner as in Example 1 except that the content of the rubber-modified epoxy resin in the resin composition was 40 wt%.
Example 6

A final cured product was provided in the same manner as in Example 1 except that an aminotriazine-based hardener was added to the resin composition in an amount of 0.2 equivalent based on the total amount of the epoxy resin composite.
Example 7

A final cured product was provided in the same manner as in Example 1 except that an aminotriazine-based hardener was added to the resin composition in an amount of 1.0 equivalent based on the total amount of the epoxy resin composite.
Comparative Example 5

A final cured product was provided in the same manner as in Example 1 except that a BPA novolac resin hardener (KBN4135) was added to the resin composition in an amount of 0.2 equivalent based on the total amount of the epoxy resin composite.
Comparative Example 6

A final cured product was provided in the same manner as in Example 1 except that a BPA novolac resin hardener (KBN4135) was added to the resin composition in an amount of 0.6 equivalent based on the total amount of the epoxy resin composite.
Comparative Example 7

A final cured product was provided in the same manner as in Example 1 except that a BPA novolac resin hardener (KBN4135) was added to the resin composition in an amount of 1.0 equivalent based on the total amount of the epoxy resin composite.
Example 8

A final cured product was provided in the same manner as in Example 1 except that a hardening accelerator was added to the resin composition at a content of 0.1 wt% based on the total amount of the epoxy resin composite.
Comparative Example 8

Use ordinary accumulation film (ABF epoxy film).
Example 9

A final cured product was provided in the same manner as in Example 1 except that the content of the surface modifier in the resin composition was 0.1 wt% based on the total amount of the epoxy resin composite.
Example 10

A final cured product was provided in the same manner as in Example 1 except that the content of the surface modifier in the resin composition was 0.5 wt% based on the total amount of the epoxy resin composite.
Example 11

A final cured product was provided in the same manner as in Example 1, except that the content of the surface modifier in the resin composition was 1.0 wt% based on the total amount of the epoxy resin composite.
Example 12

A final cured product was provided in the same manner as in Example 1 except that the content of the surface modifier in the resin composition was 5.0 wt% based on the total amount of the epoxy resin composite.
Comparative Example 9

A final cured product was provided in the same manner as in Example 1 except that a surface modifier was not added to the resin composition.
Comparative Example 10

A final cured product was provided in the same manner as in Example 1 except that the content of the surface modifier in the resin composition was 0.005 wt% based on the total amount of the epoxy resin composite.
Comparative Example 11

A final cured product was provided in the same manner as in Example 1 except that the content of the surface modifier in the resin composition was 6 wt% based on the total amount of the epoxy resin composite.
Experimental example 1
Flame retardancy according to the amount of phosphorus-based flame retardant epoxy resin

The flame retardance test was performed based on the amount of the phosphorus-based flame retardant epoxy resin in the resin composition, and the results are shown in Table 2.

As shown in Table 2, it was confirmed that the final products of Examples 1 and 2 (in which the content of the phosphorus-based flame retardant epoxy resin in the resin composition was 20 wt% or more) were good in the flame retardancy test ( V-0). On the other hand, the final products of Comparative Example 1 and Comparative Example 2 (in which the content of the phosphorus-based flame retardant epoxy resin in the resin composition was 15 wt% or less) were poor in the flame retardancy test (as V- 1).

[Table 2]
Experimental example 2
Tensile strength, elongation, and peel strength based on the amount of rubber-modified epoxy resin

The tensile strength, elongation, and peel strength of the film prepared by changing the content of the rubber-modified epoxy resin in the resin composition were determined, and the results are shown in Table 3.

As shown in Table 3, FIGS. 2A to 2D, and FIG. 3, when the content of the rubber-modified epoxy resin is in a range of 5 wt% to 30 wt%, tensile strength, elongation, and peel strength are excellent. .

[table 3]
Experimental example 3
Water absorption and coefficient of thermal expansion ( CTE ) based on the type and content of hardener

As described below, the disclosed exemplary aminotriazine-based hardener is compared with a common novolac hardener, the water absorption rate and the coefficient of thermal expansion are measured, and the conditions for controlling the water absorption rate while the coefficient of thermal expansion is low are set.

The results are shown in FIG. 4. As shown in FIG. 4, when the aminotriazine-based hardener has an -OH equivalent ratio of 0.2 to 1, the CTE is low and the water absorption is controlled (Example 1, Example 6, and Example 7).
Experimental example 4
Reliability and viscosity testing

The peel strength with the Cu pattern was measured after decontamination. The peeling strength with the Cu pattern of the cured product of Example 1 was found to be 0.898 kgf / cm. It has been confirmed that reliability meets both High Accelerated Stress Test (HAST) and Thermal Cycle (TC) reliability standards. The following Table 4 shows the results of the reliability evaluation of the products prepared in Example 1.

[Table 4]

The viscosity of the insulating films of Examples 1 and 8 was measured using a viscometer (ARES, TA instrument) to evaluate the processability. The minimum viscosity is 1000 Pa · s or less with very low values (see Figure 5). This difference is 10 times or more compared with the minimum viscosity of the ordinary accumulated film of Comparative Example 8.
Experimental example 5
Surface coating based on the amount of surface modifier

The surface coating test was performed by changing the content of the surface modifier in the resin composition. The results are shown in Figs. 6A to 7C.

As shown in FIGS. 6A to 6E, unlike the case of Comparative Example 9 not including a surface modifier, when the content of the surface modifier in the resin composition is 0.1 wt% to 5 wt% (Example 9 to Example 12) ), The surface coating is excellent.

As shown in FIG. 7A, when the content of the surface modifier is less than 0.01 wt%, wettability is poor, and dewetting is caused when the composition is coated on a carrier film or a substrate.

As shown in FIG. 7B, when the content of the surface modifier in the resin composition as in Example 1 is 1.5 wt%, the surface coating layer is excellent.

As shown in FIG. 7C, if the content of the surface modifier is more than 5 wt%, it is difficult to control the wettability by forming depressions in the surface coating layer, and interfacial separation occurs during reliability evaluation due to the volatile low molecular weight material Floor.

On the other hand, it was confirmed that the prepared molding material had a low water absorption rate and excellent reliability in a static humidity system (two reflow cycles after 48 hours under the condition of 85 ° C / 85% RH).

It was found that the loss factor (Df, tangent (δ)) was less than 0.003.

As described above, the disclosed resin composition is suitable for package molding, has a low moisture content after hardening, and has excellent adhesion with Cu, and thus has excellent reliability when used as a package molding material. In addition, a resin composition having excellent thermal strength / mechanical strength (such as a loss factor, TC, drop reliability, etc.) can be provided.

In addition, a film-type molding material can be manufactured by using the composition of the disclosed example, and a film having a very large thickness (> 200 μm) can be formed compared to a general insulating material.

The disclosed resin composition can also be used as a molding material for encapsulation to protect circuit boards and sheets coated with an accumulated insulating material in an outer layer or a back coating to protect the outermost layer of the package by using an existing substrate manufacturing method . When the disclosed composition is applied, a substrate and a package having excellent reliability can also be manufactured.

In addition, when a general pellet-type or liquid-type molding material is used, expensive compression molding equipment may be required, and since molding and hardening are performed by one equipment, processing time is also increased. On the other hand, by using a film-type molding material prepared from the disclosed resin composition, relatively inexpensive laminating equipment can be used, and hardening can be performed separately in an ordinary oven after molding, which can shorten processing time And increase the productivity of the final product.

The use of the resin composition as described in this application provides a printed circuit board and / or IC package having improved reliability, thermal stability, mechanical strength, and adhesion to a wiring layer.

Provided is an accumulated insulating film or a molded insulating film including the above composition having improved reliability, thermal stability, mechanical strength, and adhesiveness with a wiring layer.

A printed circuit board and / or IC package including the above-mentioned composition having improved reliability, thermal stability, and mechanical strength is provided.

Provided is a resin composition for a printed circuit board and / or IC package, which resin composition has a low water absorption rate and therefore excellent reliability, and has improved thermal stability, mechanical strength, and adhesion to a wiring layer Sex.

By using the resin composition, an accumulated insulating film or a molded insulating film having improved reliability, thermal stability, mechanical strength, and adhesiveness with a wiring layer is provided.

By using the resin composition, a printed circuit board or IC package having improved reliability, thermal stability, and mechanical strength is provided.

The use of an insulating film allows the use of relatively inexpensive equipment, can shorten processing time, and can effectively increase the productivity of substrates and packages.

The insulating film can be used for large area packaging.

Although this disclosure includes specific examples, it will be apparent after understanding the disclosure of this application that forms and details can be made in these examples without departing from the spirit and scope of the scope of the patent application and its equivalents. Changes. The examples described herein are to be considered as descriptive only and not for purposes of limitation. Descriptions of features or aspects in each example will be considered to apply to similar features or aspects in other examples. If the described techniques are performed in a different order, and / or if the components in the described systems, architectures, devices or circuits are combined in different ways and / or the described systems, architectures are replaced or added by other components or their equivalents , Device, or component in a circuit to get the right result. Therefore, the scope of the present disclosure is not limited by the specific embodiments, but by the scope of the patent application and its equivalents, and all modifications within the scope of the patent application and its equivalents will be interpreted as being included in this disclosure.

A‧‧‧Part

FIG. 1 is a schematic diagram illustrating an example of a package including a resin composition, in which an insulating film prepared by using the resin composition according to the embodiment of the present disclosure is provided in the “A” section.

2A to 2D are graphs showing examples of tensile strength and elongation of an insulating film based on the content of a rubber-modified epoxy resin in a resin composition.

3 is a graph showing an example of a peeling strength of an insulating film based on a content of a rubber-modified epoxy resin in a resin composition.

FIG. 4 is a graph showing an example of the water absorption and the coefficient of thermal expansion (CTE) of an insulating film based on the equivalent ratio of the aminotriazine-based hardener in the resin composition.

FIG. 5 is a graph showing an example of the minimum viscosity based on the type and content of the hardening accelerator in the resin composition.

6A to 6E are images showing examples of coating results based on the content of the surface modifier in the resin composition.

7A to 7C are images showing examples of coating results based on the content of the surface modifier in the resin composition.

Throughout the drawings and the detailed description, the same drawing reference numerals refer to the same elements. The drawings may not be drawn to scale, and the relative sizes, ratios, and depictions of the elements in the drawings may be exaggerated for clarity, illustration, and convenience.

Claims (18)

A resin composition including: An epoxy resin compound based on 100 parts by weight of the epoxy resin compound, the epoxy resin compound comprising 5 to 20 parts by weight of a bisphenol A type epoxy resin and 30 to 60 parts by weight of a cresol novolac Varnish epoxy resin, 20 to 35 parts by weight of phosphorus-based flame retardant epoxy resin, and 5 to 30 parts by weight of rubber-modified epoxy resin; Aminotriazine hardener; Hardening accelerator Filler; and Based on 100 parts by weight of the epoxy resin composite, 0.01 to 5 parts by weight of a surface modifier is included. The resin composition according to item 1 of the scope of patent application, wherein the resin composition is applied to at least one of a printed circuit board and an integrated circuit package. The resin composition according to item 1 of the scope of patent application, wherein the epoxy resin composite contains 5 to 15 parts by weight of the bisphenol A-type epoxy resin based on 100 parts by weight of the epoxy resin compound. Resin, 50 to 60 parts by weight of the cresol novolac epoxy resin, 25 to 35 parts by weight of the phosphorus-based flame retardant epoxy resin, and 5 to 20 parts by weight of the rubber-modified epoxy resin. The resin composition according to item 1 of the scope of patent application, wherein the average epoxy resin equivalent of the bisphenol A type epoxy resin is 100 g / eq to 700 g / eq. The resin composition according to item 1 of the scope of the patent application, wherein the average epoxy resin equivalent of the cresol novolac epoxy resin is 100 g / eq to 600 g / eq. The resin composition according to item 1 of the scope of patent application, wherein the average epoxy resin equivalent weight of the phosphorus-based flame retardant epoxy resin is 400 g / eq to 800 g / eq. The resin composition according to item 1 of the scope of patent application, wherein the average epoxy resin equivalent of the rubber-modified epoxy resin is 100 g / eq to 500 g / eq. The resin composition according to item 1 of the scope of patent application, wherein the aminotriazine-based hardener is contained in an amount of 0.2 to 1.5 equivalent ratio based on the mixed equivalent of the total epoxy group of the epoxy resin compound. . The resin composition according to item 1 of the scope of patent application, wherein the hardening accelerator is contained in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the epoxy resin composite. The resin composition according to item 1 of the scope of patent application, wherein the filler is contained in an amount of 20 to 50 parts by weight based on 100 parts by weight of the epoxy resin composite. The resin composition according to item 1 of the scope of patent application, wherein the filler is an inorganic filler. The resin composition according to item 1 of the scope of patent application, wherein the resin composition further comprises at least one of a defoamer and a viscosity enhancer. An insulating film includes the resin composition according to any one of claims 1 to 12 of the scope of patent application. The insulating film according to item 13 of the scope of patent application, wherein the insulating film is a build-up insulating film having a thickness of 100 μm or less. The insulating film according to item 13 of the scope of patent application, wherein the insulating film is a molded film having a thickness of 100 μm or more. The insulating film according to item 13 of the scope of patent application, wherein the insulating film is applied to at least one of an accumulation layer of a printed circuit board, a molding layer of a panel-level package, and a redistribution layer. A product comprising the insulating film according to any one of claims 13 to 16 of the scope of patent application. The product according to item 17 of the scope of patent application, wherein the product is at least one of a printed circuit board and an integrated circuit package.