TW201943214A - Receiver and transmitter chips packaging structure and automotive radar detector device using same - Google Patents

Abstract

The invention relates to a package structure for transmitting and receiving chips and a radar detection device for a vehicle. The transceiver chip package structure includes a redistribution layer, a chipset, and a molding layer. The chipset has a receiving chip, a transmitting chip, and a radio frequency processing chip, and covers one side of the redistribution layer through the molding layer. The receiving chip, the transmitting chip, and the radio frequency processing chip disposed on one side of the redistribution layer are covered, and the radio frequency processing chip is electrically connected to the receiving chip and the transmitting device through a plurality of wire lines in the redistribution layer. Wafer.

Description

Transceiver chip package structure and vehicle radar detection device

The present invention relates to a package structure for transmitting and receiving chips and a radar detection device for vehicles, and more particularly to a package structure for receiving and transmitting wafers and a radar detection device for vehicles that can achieve enhanced transmission efficiency and chip performance.

With the rapid advancement of science and technology, many product technologies required for daily life have also been accompanied by substantial improvements. Especially through the maturity of semiconductor technology, the emergence and evolution of automotive electronic products have been improved, and the vehicles driven by early drivers have been improved. Make today's vehicles not only have the function of "walking", but also pay more attention to many innovative technologies and technologies on the vehicles to further protect the current vehicles and driving, from the early anti-theft system, back-up radar, to today's obstacles. Relevant technologies such as pedestrian recognition, image detection outside the car, and autonomous driving are all conducive to driving safety. And common protection systems, such as automatic cruise control, blind spot detection system, automatic braking system, front / rear chase warning system, lane shift detection system, etc., are usually frequency-modulated continuous waves in the form of microwaves (Frequency-Modulation Continuous Wave (FMCW) radar system detects targets. This type of detection is a millimeter wave signal sent by the radar system and receives the signal reflected by the target, and then calculates the speed, angle, distance, etc. of the target relative to the radar system. Information. The conventional radar system includes a receiving module, a transmitting module, a voltage-controlled oscillator, and a controller. The receiving module, the transmitting module, the voltage-controlled oscillator, and the controller are all independently separated from each other. Components, and each chip in each module is independently arranged on the circuit board in the respective module, for example, a circuit board in which the receiving chip of the receiving module is disposed, and a circuit in which the transmitting chip of the transmitting module is disposed. The circuit board on which the voltage-controlled oscillator chip of the board and the voltage-controlled oscillator is set, and the industry will integrate the antenna (such as a receiving antenna or a transmitting antenna) into the chip (such as a receiving chip or a transmitting chip) for manufacturing convenience. In the above, although this method can be made conveniently, it will cause poor transmission efficiency, and the transmitting power of the transmitting antenna is only less than 5 Watts, which causes the problem of low-power transmission. In addition, since the chips (such as the receiving chip, the transmitting chip, and the voltage-controlled oscillator chip) in each module are manufactured in a single process, the characteristics of each chip are not good.

It is an object of the present invention to provide a package structure for transmitting and receiving chips and a radar detection device for a vehicle, which can improve transmission efficiency. Another object of the present invention is to provide a transmitting and receiving chip package structure with improved transmission power and a vehicle radar detection device. Another object of the present invention is to provide a receiving chip, a transmitting chip, and a radio frequency integrated chip package into a single chip structure, so as to achieve a chip receiving and receiving package structure and a vehicle radar detection device capable of improving chip performance. To achieve the above object, the present invention is to provide a package structure for transmitting and receiving chips, including a redistribution layer, a molding layer, and a chipset. The redistribution layer has a plurality of conductive lines, a dielectric layer, and a plurality of conductors. A conductive circuit is disposed in the dielectric layer, the dielectric layer has a first side and a second side, and the conductors are disposed on the second side of the dielectric layer and correspond to an end corresponding to the conductive circuits. Electrically connected, the chipset has a receiving chip, a transmitting chip, and a radio frequency processing chip. The receiving chip, the transmitting chip, and the radio frequency processing chip are disposed on a first side of the dielectric layer, and are connected to the conductive lines. The other end is electrically connected, and the RF processing chip is electrically connected to the receiving chip and the transmitting chip through the wire lines. The molding layer is disposed on the first side of the dielectric layer and covers the receiving layer. The chip and the transmitting chip and the radio-frequency processing chip; through the structural design of the present invention, it is possible to achieve the improvement of the transmission efficiency and the chip efficiency, and also the effect of the improvement of the transmission power. The invention also provides a radar detection device for a vehicle, which includes a transceiver chip packaging structure, a substrate and a control chip. The transceiver chip packaging structure includes a redistribution layer, a mold encapsulation layer and a chipset. The redistribution layer has A plurality of conductive lines, a dielectric layer, and a plurality of conductors, the conductive lines are provided in the dielectric layer, the dielectric layer has a first side and a second side, and the conductors are provided on the dielectric layer The second side of the chip is electrically connected to one end corresponding to the conductive lines. The chipset includes a receiving chip, a transmitting chip, and a radio frequency processing chip. The receiving chip is disposed on the transmitting chip and the radio frequency processing chip. The first side of the dielectric layer is electrically connected to the other end of the conductive lines, and the radio frequency processing chip is electrically connected to the receiving chip and the transmitting chip through the wire lines. The molding layer is disposed on the On the first side of the dielectric layer, and covering the receiving chip, the transmitting chip, and the radio frequency processing wafer, the substrate is selected on a side corresponding to the redistribution layer or the molding layer, and the substrate has at least The first antenna, the at least one second antenna, the plurality of wires, and the plurality of contact points are electrically connected to the conductors corresponding to the redistribution layer. The wires are provided in the substrate, and the electrical connections are provided at The contact points on one side of the substrate, the first and second antennas are disposed on one side of the substrate, and are electrically connected to the receiving chip and the transmitting chip through the wires through the contact points, the control chip It is located on one side of the substrate and is electrically connected to the receiving chip and the radio frequency processing chip through the wires through the contact points. Through the device design of the present invention, it is possible to improve the transmission efficiency and improve the chip performance, and It can also achieve the effect of high power transmission.

The above-mentioned object of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the drawings. The invention relates to a package structure for transmitting and receiving chips and a radar detection device for a vehicle. Please refer to FIG. 1 for a three-dimensional assembly schematic diagram of a transceiver chip packaging structure according to a first embodiment of the present invention; FIG. 1A is a schematic cross-sectional schematic diagram for a transceiver chip packaging structure of a first embodiment of the present invention. The transceiver chip packaging structure 1 is used in this embodiment for a vehicle radar detection device 2 (as shown in FIG. 2), but it is not limited to this. In specific implementation, it can also be applied to, for example, a medical scanning system. . The transceiving chip package structure 1 includes a redistribution layer 10 (Redistribution laver, RDL for short), a molding layer 14 and a chipset 12. The redistribution layer 10 has a plurality of conductive lines 102, a dielectric layer 103, and a plurality of openings 101 And a plurality of conductors 104, the openings 101 are formed by penetrating from a first side 1031 (ie, the top side) of the dielectric layer 103 to a second side 1032 (ie, the bottom side), and the conductive lines 102 are a Metal wires. The conductive lines 102 are made of materials such as gold, aluminum, copper, tungsten, titanium, titanium nitride, or a combination thereof. The conductive lines 102 are disposed in the dielectric layer 103 and are disposed in corresponding dielectrics. Within the openings 101 of the electrical layer 103, and the dielectric layer 103 is a thin film polymer, such as Benzocyclobutene (BCB), polyimind (PI), or other organic polymers, Or an organic material, such as polyimide (PI), or an inorganic material, such as silicon nitride, silicon oxide, or similar materials. The dielectric layer 103 has the first side 1031 and the second side 1032. The conductors 104 are disposed on the second side 1032 (ie, the bottom side) of the dielectric layer 103, and correspond to the conductive lines 102. One end of the chipset 12 is electrically connected, and the chipset 12 has a receiving chip 121, a transmitting chip 122, and a radio frequency processing chip 123. The receiving chip 121 is used for receiving millimeter wave signals, and the transmitting chip 122 is used for transmitting millimeter wave signals. The receiving chip 121, the transmitting chip 122, and the RF processing chip 123 are disposed on the first side 1031 (ie, the top side) of the dielectric layer 103, and are electrically connected to the other ends of the conductive lines 102. The RF processing chip 123 The receiving chip 121 and the transmitting chip 122 are electrically connected through the conductive lines 102. The aforementioned receiving chip 121, transmitting chip 122, and RF processing chip 123 can be manufactured by any suitable process, for example, a GaN-on-Si process, a GaN-on-Si SiC) process, silicon germanium-complementary metal oxide semiconductor (SiGe CMOS) process, gallium arsenide (GaAs) process or radio frequency-complementary metal oxide semiconductor (RF CMOS) process, and the receiving chip in this embodiment 121 and the RF processing chip 123 are manufactured using an RF CMOS process, and the transmitting chip 122 is manufactured using a SiGe CMOS process. In one embodiment, the transmitting chip 122 can be redesigned and manufactured using a GaAs process or a GaN-on-Si process, and the receiving chip 121 and the RF processing chip 123 are manufactured using an RF CMOS process. In addition, the aforementioned receiving chip 121 and transmitting chip 122 respectively receive and transmit 24 GHz, Hertz, or 120 GHz GHz frequencies, and 24 GHz and 77 millimeter wave signals. The bandwidth of the center frequency of GHZ or 120 GHZ is from -10 GHZ (Hertz) to +10 GHZ (Hertz). Please refer to FIG. 1A. In this embodiment, the electrical conductors 104 are represented as a solder ball (such as a metal sphere). The electrical conductors 104 are extended to the corresponding receiving chip 121 and the transmitting chip 122 through the conductive lines 102. And the RF processing chip 123, so that the conductors 104 are electrically connected to the corresponding receiving chip 121, the transmitting chip 122 and the RF processing chip 123. The material of the mold encapsulation layer 14 may be an epoxy resin, and the mold encapsulation material mentioned above is only an example, and is not intended to limit the present invention. The mold encapsulation layer 14 is disposed on the first side of the dielectric layer 103. On 1031 (that is, the top side), the molding layer 14 in this embodiment covers the entire first side 1031 of the dielectric layer 103 in a manner such as molding, and covers the entire receiving chip 121. The transmitting chip 122 and the radio frequency processing chip 123 are used to seal the chip group 12, so that the chip group 12 is encapsulated in the redistribution layer 10 by the molding layer 14 to constitute the transceiver chip package structure 1. Therefore, the transceiving chip package structure 1 of the present invention uses a Fan-Out Wafer Level Packaging (FOWLP) technology to multi-fabricate multiple chips (that is, the receiving chip 121 and the transmitting chip 122 and the RF processing chip). 123) Integrated packaging into a single chip packaging structure (ie, transceiver chip packaging structure 1), which effectively improves the performance of each chip, and because the receiving chip 121 and the transmitting chip 122 are not integrated with any antenna (the receiving antenna ( (Or transmitting antenna) is separated from the receiving chip 121 (or transmitting chip 122), so as to effectively increase the transmission power effect. For example, the transmitting power of the transmitting chip 122 generates more than 6 watts or 15 watts to 30 watts. The outer surfaces of the receiving wafer 121, the transmitting wafer 122, and the RF processing wafer 123 are covered by the mold layer 14 to a thickness of 100um (micrometer) to 700um (micrometer), and the surface of the wafer group 12 is covered by the mold layer 14 , So that the surface shell of the chipset 12 achieves a flattening effect. In one embodiment, the conductive bodies 104 are redesigned as soldering pads of a metal (such as copper or gold). Therefore, with the design of the transceiving chip package structure 1 of the present invention, it is possible to achieve the improvement of the transmission efficiency and the chip efficiency, and also the effect of the improvement of the transmission power. Please refer to FIG. 2 for a schematic diagram of a three-dimensional assembly of a vehicle radar detection device according to a second embodiment of the present invention; FIG. 2A is a schematic cross-sectional view of a vehicle radar detection device for a second embodiment of the present invention; FIG. 3 is a block diagram of a vehicle radar detection device according to a second embodiment of the present invention; FIG. 3B is another block diagram of a vehicle radar detection device according to a second embodiment of the present invention. As shown in the figure, the vehicle radar detection device 2 includes a transceiver chip package structure 1, a substrate 21, and a control chip 24. The structure, connection relationship, and efficacy of the transceiver chip package structure 1 of this embodiment are the same as those described above. The structure, connection relationship, and effect of the transceiver chip package structure 1 of an embodiment are the same, so they will not be described again. The substrate 21 is shown as a printed circuit board in this embodiment. The substrate 21 is a glass fiber epoxy (FR-4) substrate, a polyphenylene oxide (PPO) substrate, and a polytetrafluoroethylene ( PTFE ) substrate. In one embodiment, the substrate 21 may be selected as a glass substrate. The electrical conductors 104 on the second side 1032 of the dielectric layer 103 of the redistribution layer 10 in this embodiment are solder balls (such as metal spheres), and the electrical conductors 104 are in a spherical array (or called The ball grid array (BGA) arrangement is described on the second side 1032 of the dielectric layer 103, but it is not limited thereto. The substrate 21 is disposed on a side corresponding to the redistribution layer 10 and is located below the second side 1032 of the dielectric layer 103 of the redistribution layer 10. The substrate 21 has at least one first antenna 22 and at least one first antenna 22. Two antennas 23, a plurality of conductors 211, and a plurality of contact points 213. The contact points 213 are solder pads. The contact points 213 are formed on one side of the substrate 21 and correspond to the corresponding ones of the redistribution layer 10. The conductors 104 are electrically connected, and the conductors 104 are located between the dielectric layer 103 and the substrate 21. The wires 211 are a metal (such as copper or gold) wires 211, and the wires 211 are provided on the substrate. 21, and the electrical connection corresponds to the contact points 213, and the first and second antennas 22 and 23 are shown in this embodiment as an array antenna provided on a side of the substrate 21 facing the interlayer, the The first and second antennas 22 and 23 are electrically connected to the receiving chip 121 and the transmitting chip 122 through the wires 211 and the contact points 213, respectively. The contact points connected to the first antenna 22 in this embodiment 213 directly contacts the electrical conductors 104 corresponding to the receiving chip 121 to form a signal connection (or electrical connection). The contact point 213 connected to the two antennas 23 directly contacts the conductor 104 corresponding to the transmitting chip 122 to form a signal connection (or electrical connection). The control chip 24 is a microprocessor (MCU) or a processor (CPU) or a digital signal processor (DSP). The control chip 24 is disposed on one side of the substrate 21 and passes through the wires 211 through the The contact points 213 are electrically connected to the receiving chip 121 and the radio frequency processing chip 123. The contact points 213 connected to the control chip 24 in this embodiment are in direct contact with the corresponding receiving chip 121 and the radio frequency processing chip 123. The electrical conductors 104 form a signal connection (or electrical connection). The receiving chip 121 has at least a receiving circuit 1211 and a signal processing circuit 1212. The receiving circuit 1211 and the signal processing circuit 1212 are shown in this embodiment as a receiving circuit 1211 and a signal processing circuit 1212 correspondingly connected to a first Antenna 22, the signal processing circuit 1212 is electrically connected to the receiving circuit 1211 and the RF processing chip 123, and the signal processing circuit 1212 includes a mixer 1212a, which is used as a frequency reduction in this embodiment. The mixer 1212a is used, but is not limited to this, and the mixer 1212a is used to process the receiving circuit 1211 to receive a reception signal (ie, a reflection signal from an external object) transmitted by the first antenna 22 and to process the radio frequency processing chip 123 A local oscillation signal (LO) transmitted causes the mixer 1212a to mix the received reception signal with the local oscillation signal, and after the signal is down-converted, a signal reception result (that is, an intermediate frequency signal) is given to the mixer. The control chip 24 enables the control chip 24 to judge the displacement, speed, and distance of an external object according to the reception result of the signal, so as to achieve the effect of radar detection. The transmitting chip 122 has at least one transmitting circuit 1221. The transmitting circuit 1221 is shown in this embodiment as a transmitting circuit 1221 corresponding to a second antenna 23. The radio frequency processing chip 123 includes a voltage-controlled oscillator circuit 1231 (voltage- controlled oscillator (VCO), the voltage controlled oscillator circuit 1231 is electrically connected to the mixer 1212a and the transmitting circuit 1221 of the signal processing circuit 1212, respectively, for providing the local oscillation signal to the signal processing circuit 1212, and providing a detection signal . And the control chip 24 controls the voltage control oscillation circuit 1231 to output the detection signal to the transmitting circuit 1221, so that the transmitting circuit 1221 transmits the detection signal through the second antenna 23. The aforementioned detection signal and the received signal are the aforementioned millimeter wave signals. In specific implementation, the control chip 24 is electrically connected to a Controller Area Network BUS (CAN BUS) system (not shown), so that the control area network bus system is controlled according to the control. A notification signal transmitted by the chip 24 (such as notifying that an external object is too close to the vehicle) controls the vehicle to slow down or flash a warning light. In addition, the number of the first and second antennas 22 and 23 and the number of the receiving circuits 1211 and the transmitting circuit 1221 are not limited to the above one, and the number of the first and second antennas 22 and 23 and the receiving chip 121 The number of the receiving circuits 1211 and the transmitting circuits 1221 of the transmitting chip 122 are matched with each other. In specific implementation, the user can modify the design according to the accuracy of the detection side of the millimeter-wave radar and the size of the detection range and the installation location. Adjust the number of the first and second antennas 22, 23, the receiving circuit 1211, and the transmitting circuit 1221. For example, referring to the figure 3A, one receiving circuit 1211 and one transmitting circuit 1221 are matched with one first antenna 22 and one The second antenna 23 constitutes a group of radar detectors, or referring to the figure 3B, the three receiving circuits 1211 and the three transmitting circuits 1221 are configured with three first antennas 22 and three second antennas 23 to form three groups. Radar detector, and so on. The receiving and transmitting of the first antenna 22 and the second antenna 23 in this embodiment are millimeter wave signals of the center frequency of 24GHZ (Hertz), 77 GHZ (Hertz) or 120 GHZ (Hertz), and the 24GHZ, The center frequency of 77 GHZ or 120 GHZ is between -10 GHZ (Hertz) to +10 GHZ (Hertz). The received signal and the detected signal are the aforementioned millimeter wave signals. Therefore, by the design of the vehicle radar detection device 2 of the present invention, it is possible to achieve the effect of improving the transmission efficiency and the chip performance, and also the effect of increasing the transmission power. Please refer to FIG. 4A for a schematic three-dimensional assembly diagram of a vehicle radar detection device according to a third embodiment of the present invention; FIG. 4B is a schematic cross-section diagram for a vehicle radar detection device of a third embodiment of the present invention. The structure, connection relationship, and effect of the vehicle radar detection device 2 of this embodiment are substantially the same as the structure, connection relationship, and effect of the vehicle radar detection device 2 of the second embodiment described above, and this embodiment mainly uses The substrate 21 of the foregoing first embodiment is disposed on a side corresponding to the redistribution layer 10 and the conductive bodies 104 are solder balls (such as metal balls). The design is changed such that the substrate 21 is disposed on a side corresponding to the molding layer 14. The side and the conductors 104 are solder pads of metal (such as copper or gold). And the substrate 21 is located under the molding layer 14, and one side of the substrate 21 is in contact with the molding layer 14. The electrical conductors 104 on the second side 1032 of the dielectric layer 103 are electrically connected through a plurality of bonding wires 25. The contact points 213 corresponding to the semiconductor connection are connected. The contact points 213 connected to the first antenna 22 of this embodiment are extended to the conductors 104 corresponding to the connection of the receiving chip 121 through the welding wires 25 to form a signal. Connection (or electrical connection), the contact points 213 connected by the control chip 24 are extended through the bonding wires 25 to the conductors 104 corresponding to the receiving chip 121 and the RF processing chip 123 to form a signal connection ( (Or electrical connection), the contact point 213 connected to the second antenna 23 is extended through one of the bonding wires 25 to the conductor 104 corresponding to the connection of the transmitting chip 122 to form a signal connection. Therefore, it is effective to achieve the improvement of transmission efficiency and chip efficiency, and also the effect of increase of transmission power.

1‧‧‧ Transceiver Chip Package Structure

10‧‧‧ redistribution layer

101‧‧‧ opening

102‧‧‧ conductive line

103‧‧‧ Dielectric layer

1031‧‧‧First side

1032‧‧‧Second side

104‧‧‧Conductor

12‧‧‧ Chipset

121‧‧‧ Receive chip

1211‧‧‧Receiving circuit

1212‧‧‧Signal Processing Circuit

1212a‧‧‧Mixer

122‧‧‧Launch chip

1221‧‧‧Transmitting circuit

123‧‧‧RF Processing Chip

1231‧‧‧Voltage Control Oscillation Circuit

14‧‧‧moulding layer

2‧‧‧vehicle radar detection device

21‧‧‧ substrate

211‧‧‧Wire

213‧‧‧contact point

22‧‧‧First antenna

23‧‧‧Second antenna

24‧‧‧control chip

25‧‧‧welding wire

FIG. 1 is a three-dimensional schematic view of a package structure of a transceiver chip according to a first embodiment of the present invention. FIG. 1A is a schematic cross-sectional view of a package structure of a transceiver chip according to a first embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a vehicle radar detection device according to a second embodiment of the present invention. FIG. 2A is a schematic sectional view of a combination of a vehicle radar detection device according to a second embodiment of the present invention. FIG. 3A is a block diagram of a vehicle radar detection device according to a second embodiment of the present invention. FIG. 3B is another block diagram of a vehicle radar detection device according to a second embodiment of the present invention. FIG. 4A is a three-dimensional schematic diagram of a vehicle radar detection device according to a third embodiment of the present invention. FIG. 4B is a schematic sectional view of a combination of a vehicle radar detection device according to a third embodiment of the present invention.

Claims (20)

A transmitting and receiving chip package structure includes: a heavy wiring layer having a plurality of conductive lines, a dielectric layer and a plurality of conductors, the conductive lines are provided in the dielectric layer, and the dielectric layer has a first side and a first side; On two sides, the conductors are disposed on the second side of the dielectric layer and are electrically connected to one end corresponding to the conductive lines. A chipset includes a receiving chip, a transmitting chip, and a radio frequency processing chip. The receiving chip, the transmitting chip and the radio frequency processing chip are disposed on the first side of the dielectric layer, and are electrically connected to the other ends of the conductive lines, and the radio frequency processing chip is electrically connected to the through the conductive lines. The receiving chip and the transmitting chip; and a molding layer disposed on the first side of the dielectric layer, and covering the receiving chip and the transmitting chip and the radio frequency processing chip. The transceiving chip package structure according to item 1 of the scope of patent application, wherein the rewiring layer has a plurality of openings, and the openings are formed by penetrating from the first side to the second side of the dielectric layer, and the conductive The lines are accommodated in the openings corresponding to the dielectric layers. The transceiver package structure described in item 2 of the scope of patent application, wherein the conductors are extended to the corresponding receiving chip, the transmitting chip and the RF processing chip through the conductive lines, so that the conductors and the corresponding receiving chip The chip, the transmitting chip and the RF processing chip are electrically connected. According to the transmitting and receiving chip package structure described in the first item of the patent application scope, the thickness of the receiving chip, the transmitting chip, and the RF processing chip is 100um ~ 700um covered by the molding layer. According to the transmitting and receiving chip package structure described in item 4 of the scope of patent application, wherein the conductive body is a solder pad or a solder ball, and the conductive line is a metal wire. The transceiver chip package structure described in item 1 of the scope of patent application, wherein the receiving chip and the transmitting chip respectively receive and transmit a millimeter wave signal at a center frequency of 24GHZ, 77 GHZ or 120 GHZ, and 24GHZ, 77 GHZ or 120 The center frequency of GHZ is from -10 GHZ to +10 GHZ. A radar detection device for a vehicle includes: a package structure for transmitting and receiving chips, including: a heavy wiring layer having a plurality of conductive lines, a dielectric layer, and a plurality of conductors, and the conductive lines are provided in the dielectric layer, and the dielectric The electrical layer has a first side and a second side. The electrical conductors are disposed on the second side of the dielectric layer and are electrically connected to one end corresponding to the conductive lines. A chipset includes a receiving chip. A transmitting chip and a radio frequency processing chip, the receiving chip, the transmitting chip and the radio frequency processing chip are disposed on the first side of the dielectric layer, and are electrically connected to the other ends of the conductive lines, and the radio frequency processing The chip electrically connects the receiving chip and the transmitting chip through the conductive lines; and a molding layer is provided on the first side of the dielectric layer and covers the receiving chip and the transmitting chip and the radio frequency processing chip A substrate, which is selected at the side corresponding to the rewiring layer or the molding layer, the substrate has at least a first antenna, at least a second antenna, a plurality of wires, and a plurality of contact points corresponding to the corresponding weight; The conductors of the wire layer are electrically connected, the wires are disposed in the substrate, and the electrical connections are disposed at the contact points on one side of the substrate. The first and second antennas are disposed on one of the substrates. The receiving chip and the transmitting chip are respectively electrically connected through the wires through the contact points; and a control chip is provided on one side of the substrate and is electrically connected to the contact points through the wires. The connection corresponds to the receiving chip and the radio frequency processing chip. The radar detection device for a vehicle according to item 7 of the scope of patent application, wherein the rewiring layer has a plurality of openings, and the openings are formed by penetrating from the first side to the second side of the dielectric layer. The iso-conductive lines are accommodated in the openings corresponding to the dielectric layers. The radar detection device for a vehicle according to item 8 of the scope of patent application, wherein the substrate is disposed on a side corresponding to the redistribution layer, and is located below the redistribution layer, and the second side of the dielectric layer is The conductive body directly contacts the contact points facing each other, so as to be electrically connected with the contact points. For example, the radar detection device for a vehicle as described in item 9 of the scope of the patent application, wherein the conductors are extended to the corresponding receiving chip, the transmitting chip and the RF processing chip through the conductive lines, so that the conductors and the opposite The receiving chip, the transmitting chip and the RF processing chip should be electrically connected. The radar detection device for a vehicle as described in item 10 of the scope of patent application, wherein the contact points connected by the first antenna directly contact the conductors corresponding to the receiving chip connection to form a signal connection, The contact points directly contact the conductors corresponding to the receiving chip and the radio frequency processing chip to form a signal connection, and the contact points of the second antenna connection directly contact the conductors corresponding to the transmitting chip connection to form a signal connection. The radar detection device for a vehicle according to item 8 of the scope of patent application, wherein the substrate is disposed on a side corresponding to the mold layer, and is located below the mold layer, and the second side of the dielectric layer is The isoelectric conductor is electrically connected to the corresponding contact points through a plurality of welding wires. For example, the radar detection device for a vehicle described in item 12 of the scope of the patent application, wherein the conductors are connected to the corresponding receiving chip, the transmitting chip, and the radio frequency processing chip through the conductive lines, so that the conductors and the opposite The receiving chip, the transmitting chip and the RF processing chip should be electrically connected. The radar detection device for a vehicle according to item 13 of the scope of the patent application, wherein the contact points connected by the first antenna are connected to the conductors corresponding to the receiving chip connection through the welding wires to form a signal connection. The contact points of the control chip connection are extended to the conductors corresponding to the receiving chip and the RF processing chip through the welding wires to form a signal connection, and the contact points of the second antenna connection pass through the soldering. One of the bonding wires is extended to the conductor corresponding to the connection of the transmitting chip to form a signal connection. The radar detection device for a vehicle as described in item 7 of the patent application scope, wherein the substrate is a printed circuit board or a glass substrate, and the control chip is a microprocessor or a processor. According to the vehicle radar detection device described in item 7 of the scope of the patent application, the thickness of the surface of the receiving chip, the transmitting chip, and the radio-frequency processing chip covered by the molding layer is 100um ~ 700um. According to the radar detection device for a vehicle as described in item 7 of the scope of patent application, wherein the conductive body is a solder pad or a solder ball, and the conductive line is a metal wire. According to the vehicle radar detection device described in item 7 of the patent application scope, wherein the receiving chip has at least one receiving circuit and a signal processing circuit, the signal processing circuit is electrically connected to the at least one receiving circuit and the radio frequency processing chip, It is used for processing the at least one receiving circuit to receive a receiving signal transmitted by the first antenna and a local oscillation signal transmitted by the radio frequency processing chip. According to the radar detection device for a vehicle as described in claim 18, wherein the RF processing chip has a voltage-controlled oscillator circuit, the voltage-controlled oscillator circuit is electrically connected to the signal processing circuit, and the voltage-controlled oscillator circuit is used to provide The local oscillation signal is provided to the signal processing circuit and a detection signal is provided. The transmitting chip has at least one transmitting circuit, the transmitting circuit is electrically connected to the voltage control oscillation circuit, and transmits the detection signal through the second antenna, and The control chip receives a signal reception result generated by the signal processing circuit, and controls the voltage control oscillation circuit to output the detection signal to the transmitting circuit. The vehicle radar detection device as described in item 7 of the scope of patent application, wherein the first and second antennas respectively receive and transmit a millimeter wave signal at a center frequency of 24GHZ, 77 GHZ or 120 GHZ, and 24GHZ, 77 GHZ or The 120 GHZ center frequency has a bandwidth of -10 GHZ to +10 GHZ, and the received signal and the detected signal are the aforementioned millimeter wave signals.