TW201927936A - Powder, powder paint, and laminate production method - Google Patents
Powder, powder paint, and laminate production method Download PDFInfo
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- TW201927936A TW201927936A TW107143951A TW107143951A TW201927936A TW 201927936 A TW201927936 A TW 201927936A TW 107143951 A TW107143951 A TW 107143951A TW 107143951 A TW107143951 A TW 107143951A TW 201927936 A TW201927936 A TW 201927936A
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- 239000000843 powder Substances 0.000 title claims abstract description 178
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000003973 paint Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 claims abstract description 96
- 239000011347 resin Substances 0.000 claims abstract description 96
- 239000002245 particle Substances 0.000 claims abstract description 86
- 238000002844 melting Methods 0.000 claims abstract description 25
- 230000008018 melting Effects 0.000 claims abstract description 24
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 29
- 238000010304 firing Methods 0.000 claims description 28
- 230000001186 cumulative effect Effects 0.000 claims description 22
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 19
- 229920002313 fluoropolymer Polymers 0.000 claims description 15
- 239000004811 fluoropolymer Substances 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 125000000524 functional group Chemical group 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 abstract description 64
- 229910052731 fluorine Inorganic materials 0.000 abstract description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011737 fluorine Substances 0.000 abstract description 8
- 229920001577 copolymer Polymers 0.000 description 58
- 239000000178 monomer Substances 0.000 description 52
- 239000000853 adhesive Substances 0.000 description 45
- 230000001070 adhesive effect Effects 0.000 description 45
- 239000000758 substrate Substances 0.000 description 32
- -1 perfluoro Chemical group 0.000 description 23
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 22
- 239000000945 filler Substances 0.000 description 16
- 239000002994 raw material Substances 0.000 description 13
- 150000008065 acid anhydrides Chemical group 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 239000010419 fine particle Substances 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000002609 medium Substances 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 5
- 239000012943 hotmelt Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 239000012986 chain transfer agent Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000005587 carbonate group Chemical group 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000010556 emulsion polymerization method Methods 0.000 description 2
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 125000005067 haloformyl group Chemical group 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 125000006551 perfluoro alkylene group Chemical group 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000010558 suspension polymerization method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- SAHQQCUQWHJOCV-SNAWJCMRSA-N (e)-2-ethenylbut-2-enoic acid Chemical compound C\C=C(/C=C)C(O)=O SAHQQCUQWHJOCV-SNAWJCMRSA-N 0.000 description 1
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- UBYWYEGPDNYPHZ-NSCUHMNNSA-N 2-hydroxyethyl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OCCO UBYWYEGPDNYPHZ-NSCUHMNNSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- WWIHQUWEGGZJJW-UHFFFAOYSA-N FC(C(O1)(OC1=C(F)F)F)(F)F Chemical compound FC(C(O1)(OC1=C(F)F)F)(F)F WWIHQUWEGGZJJW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- XJELOQYISYPGDX-UHFFFAOYSA-N ethenyl 2-chloroacetate Chemical compound ClCC(=O)OC=C XJELOQYISYPGDX-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 125000005313 fatty acid group Chemical group 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
本發明係關於包含微小粒子之粉體、粉體塗料及積層體之製造方法。The present invention relates to a method for producing a powder, a powder coating material, and a laminated body containing fine particles.
背景技術
具有以四氟乙烯為主體之單元與以全氟(烷基乙烯醚)為主體之單元的共聚物(PFA)等氟聚合物,其摩擦係數較低、非黏著性、耐化學品性、耐熱性等特性優異。因此,氟聚合物被廣泛使用於食品工業用品、平底鍋或鍋子等廚房器具、熨斗等家庭用品、電性工業用品、機械工業用品等的表面加工。BACKGROUND ART A fluoropolymer such as a copolymer (PFA) having a unit mainly composed of tetrafluoroethylene and a unit mainly composed of perfluoro (alkyl vinyl ether) has a low coefficient of friction, non-adhesion, and chemical resistance. Excellent heat resistance and other properties. Therefore, fluoropolymers are widely used in the surface processing of food industry products, kitchen appliances such as pans and pans, household products such as irons, electrical industrial products, and mechanical industrial products.
於專利文獻1中揭示如下方法:將包含由氟聚合物粒子構成的粉體的粉體塗料塗裝於基材上並進行燒成而形成氟樹脂層,從而獲得積層體。於專利文獻2中揭示如下粉體:作為對基材的接著性優異的粉體,該粉體係由具有含羰基之基等官能基的氟聚合物粒子構成。Patent Document 1 discloses a method of applying a powder coating material containing a powder composed of fluoropolymer particles to a substrate and firing to form a fluororesin layer, thereby obtaining a laminated body. Patent Document 2 discloses a powder that is a powder having excellent adhesion to a substrate, and the powder system is composed of a fluoropolymer particle having a functional group such as a carbonyl group-containing group.
先行技術文獻
專利文獻
[專利文獻1]國際公開第2011/048965號
[專利文獻2]國際公開第2016/017801號Prior technical literature Patent literature
[Patent Document 1] International Publication No. 2011/048965
[Patent Document 2] International Publication No. 2016/017801
發明概要
發明欲解決之課題
然而,若不調整構成粉體的樹脂粒子的粒徑,則所形成的氟樹脂層的表面容易產生凹凸。本發明人等發現:尤其在將由包含高熔點氟聚合物的樹脂粒子構成的粉體燒成而形成氟樹脂層時,上述現象變得明顯。
本發明之目的係提供一種可容易地形成表面平滑的氟樹脂層的粉體、包含該粉體的粉體塗料及使用該粉體塗料的積層體之製造方法。SUMMARY OF THE INVENTION Problems to be Solved by the Invention However, if the particle diameter of the resin particles constituting the powder is not adjusted, the surface of the formed fluororesin layer is prone to unevenness. The present inventors have found that the above phenomenon becomes apparent when a powder made of resin particles containing a high-melting fluoropolymer is fired to form a fluororesin layer.
An object of the present invention is to provide a powder capable of easily forming a smooth fluororesin layer, a powder coating material including the powder, and a method for manufacturing a laminated body using the powder coating material.
用以解決課題之方法
本發明具有下述態樣。
<1>一種粉體,係由包含氟聚合物的樹脂粒子構成,該氟聚合物具有以四氟乙烯為主體之單元且熔點為260~320℃;並且,
將上述粉體的體積基準累積50%粒徑設為X且將體積基準累積10%粒徑設為Y時,Y/X為0.3以下。
<2>如<1>之粉體,其體積基準累積10%粒徑為4μm以下且體積基準累積50%粒徑為15~60μm。
<3>如<2>之粉體,其於將該粉體中所含粒徑為4μm以下的樹脂粒子量設為A且將粒徑為15~60μm的樹脂粒子量設為B時,A/B為0.1以上。
<4>如<2>或<3>之粉體,其中該粉體中所含前述粒徑為4μm以下的樹脂粒子量為5~25體積%。
<5>如<1>至<4>中任一項之粉體,其體積基準累積100%粒徑為220μm以下。
<6>如<1>至<5>中任一項之粉體,其中前述氟聚合物具有選自於由含羰基之基、羥基、環氧基及異氰酸酯基所構成群組中之至少一種官能基。
<7>如<6>之粉體,其中前述氟聚合物具有前述以四氟乙烯為主體之單元及具前述官能基之單元。
<8>一種粉體塗料,係包含如前述<1>至<7>中任一項之粉體。
<9>如<8>之粉體塗料,前述粉體塗料中所含前述粉體量為90~100質量%。
<10>一種積層體之製造方法,該積層體具有基材及設置於該基材上且由如<1>至<7>中任一項之粉體形成的氟樹脂層;
前述積層體之製造方法係將包含前述粉體的粉體塗料供給至前述基材上並進行燒成而得到前述氟樹脂層。
<11>如<10>之製造方法,其中前述粉體塗料的燒成係加熱至前述氟聚合物的熔點以上來進行。
<12>如<10>或<11>之製造方法,其中前述氟樹脂層的厚度為50~750μm。Means for Solving the Problems The present invention has the following aspects.
<1> A powder composed of resin particles containing a fluoropolymer having a unit mainly composed of tetrafluoroethylene and having a melting point of 260 to 320 ° C; and,
When the volume-based cumulative 50% particle diameter of the powder is set to X and the volume-based cumulative 10% particle diameter is set to Y, Y / X is 0.3 or less.
<2> The powder according to <1> has a volume-based cumulative 10% particle size of 4 μm or less and a volume-based cumulative 50% particle size of 15-60 μm.
<3> The powder according to <2>, when the amount of the resin particles having a particle diameter of 4 μm or less contained in the powder is A and the amount of the resin particles having a particle diameter of 15 to 60 μm is B, A / B is 0.1 or more.
<4> The powder according to <2> or <3>, wherein the amount of the resin particles having a particle diameter of 4 μm or less in the powder is 5 to 25% by volume.
<5> The powder according to any one of <1> to <4> has a cumulative 100% volume-based particle diameter of 220 μm or less.
<6> The powder according to any one of <1> to <5>, wherein the fluoropolymer has at least one selected from the group consisting of a carbonyl group-containing group, a hydroxyl group, an epoxy group, and an isocyanate group. Functional group.
<7> The powder according to <6>, wherein the fluoropolymer has the aforementioned unit mainly composed of tetrafluoroethylene and the unit having the aforementioned functional group.
<8> A powder coating material comprising the powder according to any one of <1> to <7>.
<9> The powder coating material according to <8>, wherein the amount of the powder contained in the powder coating material is 90 to 100% by mass.
<10> A method for manufacturing a laminated body, the laminated body having a base material and a fluororesin layer provided on the base material and formed of a powder such as any one of <1> to <7>;
The manufacturing method of the said laminated body is supplying the powder coating material containing the said powder to the said base material, and baking it, and obtaining the said fluororesin layer.
<11> The method according to <10>, wherein the firing of the powder coating material is performed by heating the melting point of the fluoropolymer or more.
The manufacturing method of <12> such as <10> or <11> whose thickness of the said fluororesin layer is 50-750 micrometers.
發明效果
根據本發明,可容易地形成表面平滑的氟樹脂層。Advantageous Effects of Invention According to the present invention, a fluororesin layer having a smooth surface can be easily formed.
用以實施發明之形態
以下用語的定義適用於本說明書及發明申請專利範圍。
所謂「熱熔融性聚合物」係指於荷重49N之條件下且在比聚合物熔點高20℃以上的溫度下,存在MFR成為0.01~1000g/10分的狀態的聚合物。
「聚合物熔點」係指與利用示差掃描熱量測定(DSC)法測得的聚合物的熔解波峰最大值對應的溫度。
「聚合物的MFR」係於JIS K 7210-1:2014(對應國際規格ISO 1133-1:2011)中所定義的熔體流動速率。
「粉體的體積基準累積50%粒徑(D50)」係利用雷射繞射散射法測定粉體的粒度分布,並將粉體的總體積設為100%求得累積曲線,於該累積曲線上累積體積成為50%的點的粒徑。
同樣地,「粉體的體積基準累積10%粒徑(D10)」、「粉體的體積基準累積90%粒徑(D90)」及「粉體的體積基準累積100%粒徑(D100)」係體積基準累積10%粒徑、體積基準累積90%粒徑及體積基準累積100%粒徑(最大粒徑)。
即,粉體的D10、D50、D90及D100係構成粉體的粒子的體積基準累積10%粒徑、體積基準累積50%粒徑、體積基準累積90%粒徑及體積基準累積100%粒徑。
「以單體為主體的單元」係一分子單體進行聚合而直接形成的原子團與將該原子團的一部分進行化學轉換而獲得的原子團的總稱。於本說明書中,將以單體為主體的單元簡稱為「單元」。
「(甲基)丙烯酸酯」係丙烯酸酯與甲基丙烯酸酯的總稱。同樣地,「(甲基)丙烯酸」係丙烯酸與甲基丙烯酸的總稱、「(甲基)丙烯醯氧基」係丙烯醯氧基與甲基丙烯醯氧基的總稱。Forms for Carrying Out the Invention The definitions of the following terms apply to the scope of this specification and the patent application for inventions.
The "hot-melt polymer" refers to a polymer in a state where MFR is 0.01 to 1000 g / 10 minutes at a load of 49 N and at a temperature 20 ° C or higher than the melting point of the polymer.
"Polymer melting point" means a temperature corresponding to the maximum melting peak of a polymer measured by a differential scanning calorimetry (DSC) method.
The "MFR of the polymer" is a melt flow rate defined in JIS K 7210-1: 2014 (corresponding to the international standard ISO 1133-1: 2011).
"Volume-based cumulative 50% particle size (D50)" is a measurement of the particle size distribution of the powder by laser diffraction scattering method, and the total volume of the powder is set to 100% to obtain a cumulative curve. The particle diameter of the point where the cumulative volume is 50%.
Similarly, "Volume-based cumulative 10% particle size (D10)", "Volume-based cumulative 90% particle size (D90)" and "Volume-based cumulative 100% particle size (D100)" The volume-based cumulative 10% particle size, volume-based cumulative 90% particle size, and volume-based cumulative 100% particle size (maximum particle size).
That is, the D10, D50, D90, and D100 of the powder are particles that constitute the powder on a volume basis with a cumulative 10% particle size, a volume basis with a cumulative 50% particle size, a volume basis with a 90% particle size, and a volume basis with a 100% particle size .
A "unit mainly composed of a monomer" is a collective term for an atomic group formed directly by the polymerization of one molecule of a monomer and an atomic group obtained by chemically converting a part of the atomic group. In the present specification, a unit mainly composed of a monomer is simply referred to as a "unit".
"(Meth) acrylate" is a general term for acrylate and methacrylate. Similarly, "(meth) acrylic" is a general term for acrylic acid and methacrylic acid, and "(meth) acryloxy" is a general term for propyleneoxy and methacryloxy.
構成本發明粉體之樹脂粒子係包含具有以四氟乙烯為主體之單元(以下亦記載為「TFE單元」)且熔點為260~320℃的氟聚合物(以下亦記載為「F聚合物」)。
樹脂粒子中所含F聚合物量宜為80質量%以上、較佳為85質量%以上、更佳為90質量%以上、再更佳為100質量%。若使用由以該量包含F聚合物的樹脂粒子構成的粉體,則形成的氟樹脂層(以下亦記載為「F樹脂層」)之非黏著性、耐化學品性、耐熱性提高。F聚合物亦可併用2種以上。
作為其他聚合物,可列舉:F聚合物以外的其他氟聚合物、芳香族聚酯、聚醯胺醯亞胺、熱塑性聚醯亞胺。其他聚合物亦可併用2種以上。The resin particles constituting the powder of the present invention include a fluoropolymer (hereinafter also referred to as "F polymer") having a unit mainly composed of tetrafluoroethylene (hereinafter also referred to as "TFE unit") and having a melting point of 260 to 320 ° C. ).
The amount of the F polymer contained in the resin particles is preferably 80% by mass or more, preferably 85% by mass or more, more preferably 90% by mass or more, and even more preferably 100% by mass. When a powder composed of resin particles containing the F polymer in this amount is used, the non-adhesiveness, chemical resistance, and heat resistance of the formed fluororesin layer (hereinafter also referred to as "F resin layer") are improved. The F polymer may be used in combination of two or more.
Examples of other polymers include fluoropolymers other than F polymers, aromatic polyesters, polyamidoimines, and thermoplastic polyimides. Other polymers may be used in combination of two or more.
關於F聚合物,可列舉:四氟乙烯-全氟(烷基乙烯醚)共聚物、四氟乙烯-六氟丙烯共聚物、乙烯-四氟乙烯共聚物、聚二氟亞乙烯、聚三氟氯乙烯、乙烯-三氟氯乙烯共聚物、於此等中導入有選自於由含羰基之基、羥基、環氧基及異氰酸酯基所構成群組中之至少一種官能基(以下亦記載為「接著性基」)的聚合物、改質聚四氟乙烯。再者,只要顯示熱熔融性,亦可使用聚四氟乙烯作為F聚合物。Examples of the F polymer include a tetrafluoroethylene-perfluoro (alkyl vinyl ether) copolymer, a tetrafluoroethylene-hexafluoropropylene copolymer, an ethylene-tetrafluoroethylene copolymer, polydifluoroethylene, and polytrifluoro Vinyl chloride, ethylene-trifluorochloroethylene copolymer, and at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxyl group, an epoxy group, and an isocyanate group (hereinafter also described as "Adhesive group") polymer, modified polytetrafluoroethylene. In addition, as long as it exhibits hot-melt property, polytetrafluoroethylene may be used as the F polymer.
關於改質聚四氟乙烯,可列舉:(i)四氟乙烯(以下亦記載為「TFE」)與極微量的CH2 =CH(CF2 )4 F之共聚物、(ii)上述(i)之共聚物與進而具有極微量的接著性基的單體(以下亦記載為「接著性單體」)之共聚物、(iii)TFE與極微量的接著性單體之共聚物、(iv)藉由電漿處理等導入有接著性基的聚四氟乙烯、(v)藉由電漿處理等導入有接著性基的上述(i)之共聚物。Examples of modified polytetrafluoroethylene include: (i) a copolymer of tetrafluoroethylene (hereinafter also referred to as "TFE") and a trace amount of CH 2 = CH (CF 2 ) 4 F; (ii) the above (i) A copolymer of) and a monomer having a trace amount of an adhesive group (hereinafter also referred to as "adhesive monomer"), (iii) a copolymer of TFE and a trace amount of an adhesive monomer, (iv ) Polytetrafluoroethylene having an adhesive group introduced by plasma treatment or the like, (v) Copolymer of (i) described above having an adhesive group introduced by plasma treatment or the like.
F聚合物的熔點為260~320℃、較佳為280~320℃、更佳為295~315℃、再更佳為295~310℃。若F聚合物的熔點為上述下限值以上,則F樹脂層的耐熱性提高。若F聚合物的熔點為上述上限值以下,則F聚合物的熱熔融性提高。
F聚合物的熔點可根據構成F聚合物的單元種類或比率、F聚合物的分子量等而調整。例如,有TFE單元的比率越多、F聚合物的熔點越上升之傾向。The melting point of the F polymer is 260 to 320 ° C, preferably 280 to 320 ° C, more preferably 295 to 315 ° C, and even more preferably 295 to 310 ° C. When the melting point of the F polymer is at least the above-mentioned lower limit value, the heat resistance of the F resin layer is improved. When the melting point of the F polymer is equal to or less than the above-mentioned upper limit value, the hot-meltability of the F polymer is improved.
The melting point of the F polymer can be adjusted according to the type or ratio of units constituting the F polymer, the molecular weight of the F polymer, and the like. For example, as the ratio of TFE units increases, the melting point of the F polymer tends to increase.
比F聚合物的熔點高20℃以上的溫度下的MFR宜為0.1~1000g/10分、較佳為0.5~100g/10分、更佳為1~30g/10分、再更佳為5~20g/10分。若MFR為上述下限值以上,則F聚合物的熱熔融性更加提高、F樹脂層的外觀變得良好。若MFR為上述上限值以下,則F樹脂層的機械強度提高。
MFR係F聚合物分子量的標準,MFR越大,表示分子量越小,MFR越小,表示分子量越大。F聚合物的MFR可根據F聚合物的製造條件而調整。例如,若於單體聚合時縮短聚合時間,有F聚合物的MFR變大的傾向。The MFR at a temperature higher than the melting point of the F polymer by 20 ° C or higher is preferably 0.1 to 1000 g / 10 minutes, preferably 0.5 to 100 g / 10 minutes, more preferably 1 to 30 g / 10 minutes, and even more preferably 5 to 20g / 10 minutes. When the MFR is equal to or more than the above lower limit value, the hot-melt property of the F polymer is further improved, and the appearance of the F resin layer is improved. When the MFR is equal to or less than the above upper limit value, the mechanical strength of the F resin layer is improved.
MFR is a standard for the molecular weight of F polymers. The larger the MFR, the smaller the molecular weight, and the smaller the MFR, the larger the molecular weight. The MFR of the F polymer can be adjusted according to the manufacturing conditions of the F polymer. For example, if the polymerization time is shortened when the monomers are polymerized, the MFR of the F polymer tends to increase.
由F樹脂層與基材等之接著性優異之觀點來看,作為接著性基宜為含羰基之基。
關於含羰基之基,可列舉:於碳原子間具有羰基之烴基、碳酸酯基、羧基、鹵代甲醯基、烷氧基羰基、酸酐殘基(-C(O)-O-C(O)-)、多氟烷氧基羰基、脂肪酸殘基。
由F樹脂層與基材等之接著性進一步優異之觀點來看,關於含羰基之基,較佳為於碳原子間具有羰基之烴基、碳酸酯基、羧基、鹵代甲醯基、烷氧基羰基及酸酐殘基,更佳為羧基及酸酐殘基。
作為於碳原子間具有羰基的烴基中的烴基,可列舉:碳數2~8之伸烷基等。再者,伸烷基的碳數並不包含構成羰基的碳數。
作為鹵代甲醯基,可列舉:-C(=O)-F、-C(=O)Cl。
作為烷氧基羰基中的烷氧基,可列舉:甲氧基或乙氧基。From the viewpoint of excellent adhesion between the F resin layer and the substrate, it is preferable that the adhesive group is a carbonyl group-containing group.
Examples of the carbonyl-containing group include a hydrocarbon group having a carbonyl group between carbon atoms, a carbonate group, a carboxyl group, a haloformyl group, an alkoxycarbonyl group, and an acid anhydride residue (-C (O) -OC (O)- ), Polyfluoroalkoxycarbonyl, fatty acid residues.
From the viewpoint of further excellent adhesion between the F resin layer and the substrate, the carbonyl group-containing group is preferably a hydrocarbon group having a carbonyl group between carbon atoms, a carbonate group, a carboxyl group, a haloformyl group, and an alkoxy group. The carbonyl group and the acid anhydride residue are more preferably a carboxyl group and an acid anhydride residue.
Examples of the hydrocarbon group in the hydrocarbon group having a carbonyl group between carbon atoms include an alkylene group having 2 to 8 carbon atoms and the like. The carbon number of the alkylene group does not include the carbon number of the carbonyl group.
Examples of the haloformamyl group include -C (= O) -F and -C (= O) Cl.
Examples of the alkoxy group in the alkoxycarbonyl group include a methoxy group and an ethoxy group.
接著性基可作為接著性單元包含於F聚合物中、亦可作為末端基包含於F聚合物主鏈的末端。再者,接著性基作為主鏈的末端基包含時,F聚合物可包含或不包含接著性單元。
關於F聚合物,宜包含TFE單元與以接著性單體為主體的單元(接著性單元)。
接著性單體具有的接著性基可為1個,亦可為2個以上。具有2個以上接著性基時,2個以上接著性基可分別相同、亦可不同。The adhesive group may be included in the F polymer as an adhesive unit, or may be included in a terminal of the F polymer main chain as a terminal group. When an adhesive group is included as an end group of the main chain, the F polymer may or may not include an adhesive unit.
The F polymer preferably includes a TFE unit and a unit mainly composed of an adhesive monomer (adhesive unit).
The adhesive group which the adhesive monomer has may be one or two or more. When there are two or more adhesive groups, the two or more adhesive groups may be the same or different, respectively.
關於接著性單體,可列舉:具有含羰基之基的單體、具有羥基的單體、具有環氧基的單體、具有異氰酸酯基的單體。由F樹脂層與基材等之接著性優異之觀點來看,作為接著性單體宜為具有含羰基之基的單體。
關於具有含羰基之基的單體,可列舉:具有酸酐殘基的環狀單體、具有羧基的單體、乙烯酯、(甲基)丙烯酸酯、CF2
=CFORf1
CO2
X1
(其中,Rf1
為碳數1~10的全氟伸烷基或於碳原子間具有醚性氧原子之碳數2~10的全氟伸烷基,X1
為氫原子或碳數1~3之烷基)。Examples of the adhesive monomer include a monomer having a carbonyl group-containing group, a monomer having a hydroxyl group, a monomer having an epoxy group, and a monomer having an isocyanate group. From the viewpoint of excellent adhesion between the F resin layer and the substrate, the monomer having a carbonyl group-containing group is preferably used as the adhesive monomer.
Examples of the monomer having a carbonyl group include a cyclic monomer having an acid anhydride residue, a monomer having a carboxyl group, a vinyl ester, a (meth) acrylate, CF 2 = CFOR f1 CO 2 X 1 (wherein , R f1 is a perfluoroalkylene group having 1 to 10 carbon atoms or a perfluoroalkylene group having 2 to 10 carbon atoms having an etheric oxygen atom between the carbon atoms, and X 1 is a hydrogen atom or 1 to 3 carbon atoms alkyl).
關於具有酸酐殘基的環狀單體,可列舉不飽和二羧酸酐。關於不飽和二羧酸酐,可列舉:衣康酸酐(以下亦記載為「IAH」)、檸康酐(以下亦記載為「CAH」)、5-降冰片烯-2,3-二羧酸酐(別稱:納迪克酸酐。以下亦記載為「NAH」)、馬來酸酐。
關於具有羧基的單體,可列舉:不飽和二羧酸(衣康酸、檸康酸、5-降冰片烯-2,3-二羧酸、馬來酸等)、不飽和單羧酸(丙烯酸、甲基丙烯酸等)。
關於乙烯酯,可列舉:乙酸乙烯酯、氯乙酸乙烯酯、丁酸乙烯酯、三甲基乙酸乙烯酯、苯甲酸乙烯酯、巴豆酸乙烯酯。
關於(甲基)丙烯酸酯,可列舉:(多氟烷基)丙烯酸酯、(多氟烷基)甲基丙烯酸酯。Examples of the cyclic monomer having an acid anhydride residue include unsaturated dicarboxylic acid anhydrides. Examples of the unsaturated dicarboxylic anhydride include itaconic anhydride (hereinafter also referred to as "IAH"), citraconic anhydride (hereinafter also referred to as "CAH"), 5-norbornene-2,3-dicarboxylic anhydride ( Another name: Nadic acid anhydride. Hereinafter also referred to as "NAH"), maleic anhydride.
Examples of the monomer having a carboxyl group include unsaturated dicarboxylic acids (itaconic acid, citraconic acid, 5-norbornene-2,3-dicarboxylic acid, and maleic acid), and unsaturated monocarboxylic acids (such as Acrylic, methacrylic, etc.).
Examples of vinyl esters include vinyl acetate, vinyl chloroacetate, vinyl butyrate, trimethyl vinyl acetate, vinyl benzoate, and vinyl crotonic acid.
Examples of the (meth) acrylate include (polyfluoroalkyl) acrylate and (polyfluoroalkyl) methacrylate.
由使F樹脂層與基材等之接著性更加提高之觀點來看,作為具有含羰基之基的單體宜為具有酸酐殘基的環狀單體、更佳為IAH、CAH或NAH。若使用IAH、CAH或NAH,可容易地製造具有酸酐殘基的F聚合物。由F樹脂層的接著性容易提高之觀點來看,關於具有含羰基之基的單體,尤佳為NAH。From the viewpoint of further improving the adhesion between the F resin layer and the substrate, the monomer having a carbonyl group-containing monomer is preferably a cyclic monomer having an acid anhydride residue, and more preferably IAH, CAH, or NAH. When IAH, CAH or NAH is used, an F polymer having an acid anhydride residue can be easily produced. From the viewpoint that the adhesion of the F resin layer is likely to be improved, the monomer having a carbonyl group-containing group is particularly preferably NAH.
關於具有羥基的單體,可列舉:具有羥基的乙烯酯、具有羥基的乙烯醚、具有羥基的烯丙醚、具有羥基的(甲基)丙烯酸酯、羥乙基巴豆酸酯、烯丙醇。
關於具有環氧基的單體,可列舉:不飽和環氧丙基醚(烯丙基環氧丙基醚、2-甲基烯丙基環氧丙基醚、乙烯基環氧丙基醚等)、不飽和環氧丙基酯((甲基)丙烯酸環氧丙基酯等)。
關於具有異氰酸酯基的單體,可列舉:2-(甲基)丙烯醯氧基乙基異氰酸酯、2-(2-(甲基)丙烯醯氧基乙氧基)乙基異氰酸酯、1,1-雙((甲基)丙烯醯氧基甲基)乙基異氰酸酯。
接著性單體亦可併用2種以上。Examples of the monomer having a hydroxyl group include vinyl esters having a hydroxyl group, vinyl ethers having a hydroxyl group, allyl ethers having a hydroxyl group, (meth) acrylates having a hydroxyl group, hydroxyethylcrotonate, and allyl alcohol.
Examples of the monomer having an epoxy group include unsaturated glycidyl ether (allyl glycidyl ether, 2-methylallyl glycidyl ether, vinyl glycidyl ether, etc.) ), Unsaturated glycidyl ester (glycidyl (meth) acrylate, etc.).
Examples of the monomer having an isocyanate group include 2- (meth) acryloxyethyl isocyanate, 2- (2- (meth) acryloxyethoxy) ethyl isocyanate, and 1,1- Bis ((meth) acryloxymethyl) ethyl isocyanate.
The adhesive monomer may be used in combination of two or more.
關於接著性單元及TFE單元以外的其他單元,可列舉:以全氟(烷基乙烯醚)(以下亦記載為「PAVE」)為主體之單元(以下亦記載為「PAVE單元」)、以六氟丙烯(以下亦記載為「HFP」)為主體之單元(以下亦記載為「HFP單元」)、以接著性單體、TFE、PAVE及HFP以外的其他單體為主體之單元。Examples of the unit other than the adhesive unit and the TFE unit include a unit mainly composed of perfluoro (alkyl vinyl ether) (hereinafter also referred to as "PAVE") (hereinafter also referred to as "PAVE unit"), A unit mainly composed of fluoropropylene (hereinafter also referred to as "HFP") (hereinafter also referred to as "HFP unit"), and a unit mainly composed of an adhesive monomer, TFE, PAVE, and monomers other than HFP.
關於PAVE,可列舉:CF2
=CFOCF3
、CF2
=CFOCF2
CF3
、CF2
=CFOCF2
CF2
CF3
(以下,亦記載為「PPVE」)、CF2
=CFOCF2
CF2
CF2
CF3
、CF2
=CFO(CF2
)8
F,較佳為PPVE。
PAVE亦可併用2種以上。Examples of PAVE include: CF 2 = CFOCF 3 , CF 2 = CFOCF 2 CF 3 , CF 2 = CFOCF 2 CF 2 CF 3 (hereinafter also referred to as “PPVE”), CF 2 = CFOCF 2 CF 2 CF 2 CF 3. CF 2 = CFO (CF 2 ) 8 F, preferably PPVE.
PAVE can also be used in combination of two or more.
關於其他單體,可列舉:其他含氟單體(其中,接著性單體、TFE、PAVE及HFP除外)、其他非含氟單體(其中,接著性單體除外)。
關於其他含氟單體,可列舉:氟乙烯、二氟亞乙烯、三氟乙烯、三氟氯乙烯、CF2
=CFORf3
SO2
X3
(其中,Rf3
為碳數1~10的全氟伸烷基或於碳原子間具有醚性氧原子之碳數2~10的全氟伸烷基,X3
為鹵素原子或羥基)、CF2
=CF(CF2
)p
OCF=CF2
(其中,p為1或2)、CH2
=CX4
(CF2
)q
X5
(其中,X4
為氫原子或氟原子、q為2~10之整數、X5
為氫原子或氟原子)、全氟(2-亞甲基-4-甲基-1,3-二氧環戊烷)。其他含氟單體亦可併用二種以上。
關於CH2
=CX4
(CF2
)q
X5
,可列舉CH2
=CH(CF2
)2
F、CH2
=CH(CF2
)3
F、CH2
=CH(CF2
)4
F、CH2
=CF(CF2
)3
H、CH2
=CF(CF2
)4
H,較佳為CH2
=CH(CF2
)4
F、CH2
=CH(CF2
)2
F。Examples of other monomers include other fluorinated monomers (except for adhesive monomers, TFE, PAVE, and HFP), and other non-fluorinated monomers (except for adhesive monomers).
Examples of other fluorine-containing monomers include vinyl fluoride, difluoroethylene, trifluoroethylene, trifluorochloroethylene, CF 2 = CFOR f3 SO 2 X 3 (wherein R f3 is perfluoro with 1 to 10 carbon atoms) An alkylene or perfluoroalkylene having 2 to 10 carbon atoms having an etheric oxygen atom between carbon atoms, X 3 is a halogen atom or a hydroxyl group), CF 2 = CF (CF 2 ) p OCF = CF 2 (where , P is 1 or 2), CH 2 = CX 4 (CF 2 ) q X 5 (where X 4 is a hydrogen atom or a fluorine atom, q is an integer from 2 to 10, and X 5 is a hydrogen atom or a fluorine atom), Perfluoro (2-methylene-4-methyl-1,3-dioxetane). Other fluorine-containing monomers may be used in combination of two or more kinds.
Regarding CH 2 = CX 4 (CF 2 ) q X 5 , CH 2 = CH (CF 2 ) 2 F, CH 2 = CH (CF 2 ) 3 F, CH 2 = CH (CF 2 ) 4 F, CH 2 = CF (CF 2 ) 3 H, CH 2 = CF (CF 2 ) 4 H, preferably CH 2 = CH (CF 2 ) 4 F, and CH 2 = CH (CF 2 ) 2 F.
關於其他非含氟單體,可列舉乙烯、丙烯,較佳為乙烯。其他非含氟單體亦可併用2種以上。
關於其他單體,亦可併用其他含氟單體與其他非含氟單體。Examples of other non-fluorine-containing monomers include ethylene and propylene, and ethylene is preferred. Other non-fluorinated monomers may be used in combination of two or more.
As for other monomers, other fluorine-containing monomers and other non-fluorine-containing monomers may be used in combination.
F聚合物於主鏈末端具有接著性基作為末端基時,關於接著性基宜為烷氧基羰基、碳酸酯基、羧基、氟甲醯基、酸酐殘基、羥基。再者,該接著性基可適當選擇製造F聚合物時所使用的自由基聚合引發劑、鏈轉移劑等來導入。When the F polymer has an adhesive group at the end of the main chain as a terminal group, the adhesive group is preferably an alkoxycarbonyl group, a carbonate group, a carboxyl group, a fluoroformamyl group, an acid anhydride residue, or a hydroxyl group. The adhesive group can be introduced by appropriately selecting a radical polymerization initiator, a chain transfer agent, or the like used in the production of the F polymer.
由提高F樹脂層的耐熱性之觀點來看,關於F聚合物宜為具有接著性單元、TFE單元與PAVE單元之共聚物(以下亦記載為共聚物(A1))、具有接著性單元、TFE單元與HFP單元之共聚物(以下亦記載為共聚物(A2)),較佳為共聚物(A1)。From the viewpoint of improving the heat resistance of the F resin layer, the F polymer is preferably a copolymer having an adhesive unit, a TFE unit and a PAVE unit (hereinafter also referred to as a copolymer (A1)), an adhesive unit, and a TFE. The copolymer of the unit and the HFP unit (hereinafter also referred to as a copolymer (A2)) is preferably a copolymer (A1).
共聚物(A1)視必要亦可具有HFP單元及其他單元中之至少一種。即,共聚物(A1)可為具有接著性單元、TFE單元與PAVE單元之共聚物,亦可為具有接著性單元、TFE單元、PAVE單元與HFP單元之共聚物,亦可為具有接著性單元、TFE單元、PAVE單元與其他單元之共聚物,亦可為具有接著性單元、TFE單元、PAVE單元、HFP單元與其他單元之共聚物。
由進一步提高F樹脂層與基材等之接著性之觀點來看,關於共聚物(A1)宜為具有以具有含羰基之基之單體為主體之單元、TFE單元與PAVE單元之共聚物,較佳為具有以具酸酐殘基的環狀單體為主體之單元、TFE單元與PAVE單元之共聚物。
關於共聚物(A1)之較佳具體例,可列舉:具有TFE單元、PPVE單元與NAH單元之共聚物、具有TFE單元、PPVE單元與IAH單元之共聚物、具有TFE單元、PPVE單元與CAH單元之共聚物。
共聚物(A1)中接著性單元之比率宜佔構成共聚物(A1)之全部單元中0.01~3莫耳%、較佳為0.05~1莫耳%。此時,易於平衡F樹脂層與基材等之接著性、F樹脂層之耐熱性、顏色。
共聚物(A1)中TFE單元之比率宜佔構成共聚物(A1)之全部單元中90~99.89莫耳%、較佳為96~98.95莫耳%。此時,易於平衡F樹脂層之耐熱性、耐化學品性等及共聚物(A1)之熱熔融性、抗應力開裂性等。
共聚物(A1)中PAVE單元之比率宜佔構成共聚物(A1)之全部單元中0.1~9.99莫耳%、較佳為1~9.95莫耳%。此時,容易調整氟共聚物(A1)之熱熔融性。
共聚物(A1)中接著性單元、TFE單元及PAVE單元的合計宜為90莫耳%以上、較佳為98莫耳%以上。其上限值為100莫耳%。The copolymer (A1) may have at least one of HFP units and other units as necessary. That is, the copolymer (A1) may be a copolymer having an adhesive unit, a TFE unit, and a PAVE unit, or a copolymer having an adhesive unit, a TFE unit, a PAVE unit, and an HFP unit, or an adhesive unit The copolymer of TFE unit, TFE unit, PAVE unit and other units may also be a copolymer having adhesive units, TFE units, PAVE units, HFP units and other units.
From the viewpoint of further improving the adhesion between the F resin layer and the substrate, the copolymer (A1) is preferably a copolymer having a unit mainly composed of a monomer having a carbonyl group, a TFE unit, and a PAVE unit. A copolymer having a unit mainly composed of a cyclic monomer having an acid anhydride residue, a TFE unit and a PAVE unit is preferred.
Specific examples of the copolymer (A1) include: copolymers having TFE units, PPVE units and NAH units, copolymers having TFE units, PPVE units and IAH units, having TFE units, PPVE units and CAH units Of copolymers.
The ratio of the adhering units in the copolymer (A1) should preferably be 0.01 to 3 mol%, preferably 0.05 to 1 mol% in all the units constituting the copolymer (A1). In this case, it is easy to balance the adhesiveness between the F resin layer and the substrate, and the heat resistance and color of the F resin layer.
The ratio of the TFE units in the copolymer (A1) should preferably account for 90 to 99.89 mole%, preferably 96 to 98.95 mole% of all the units constituting the copolymer (A1). At this time, it is easy to balance the heat resistance, chemical resistance, and the like of the F resin layer, and the hot-meltability, stress crack resistance, and the like of the copolymer (A1).
The ratio of the PAVE units in the copolymer (A1) should preferably be 0.1 to 9.99 mol%, preferably 1 to 9.95 mol% in all the units constituting the copolymer (A1). In this case, it is easy to adjust the hot-melt property of the fluorocopolymer (A1).
The total of the adhesive unit, TFE unit and PAVE unit in the copolymer (A1) is preferably 90 mol% or more, and more preferably 98 mol% or more. The upper limit is 100 mol%.
共聚物(A2)視必要亦可具有PAVE單元及其他單體單元中之至少一種。即,共聚物(A2)可為具有接著性單元、TFE單元與HFP單元之共聚物,亦可為具有接著性單元、TFE單元、HFP單元與PAVE單元之共聚物,亦可為具有接著性單元、TFE單元、HFP單元與其他單元之共聚物,亦可為具有接著性單元、TFE單元、HFP單元、PAVE單元與其他單元之共聚物。
由進一步提高F樹脂層與基材等之接著性之觀點來看,關於共聚物(A2)宜為具有以具有含羰基之基之單體為主體之單元、TFE單元與HFP單元之共聚物,較佳為具有以具酸酐殘基的環狀單體為主體之單元、TFE單元與HFP單元之共聚物。
關於共聚物(A2)之較佳具體例,可列舉:具有TFE單元、HFP單元與NAH單元之共聚物、具有TFE單元、HFP單元與IAH單元之共聚物、具有TFE單元、HFP單元與CAH單元之共聚物。The copolymer (A2) may have at least one of a PAVE unit and other monomer units as necessary. That is, the copolymer (A2) may be a copolymer having an adhesive unit, a TFE unit, and an HFP unit, or a copolymer having an adhesive unit, a TFE unit, an HFP unit, and a PAVE unit, or an adhesive unit The copolymer of TFE unit, TFE unit, HFP unit and other units may also be a copolymer having adhesive unit, TFE unit, HFP unit, PAVE unit and other units.
From the viewpoint of further improving the adhesion between the F resin layer and the substrate, the copolymer (A2) is preferably a copolymer having a unit mainly composed of a monomer having a carbonyl group, a TFE unit and an HFP unit. A copolymer having a unit mainly composed of a cyclic monomer having an acid anhydride residue, a TFE unit and an HFP unit is preferred.
Specific examples of the copolymer (A2) include: copolymers having TFE units, HFP units and NAH units, copolymers having TFE units, HFP units and IAH units, having TFE units, HFP units and CAH units Of copolymers.
共聚物(A2)中接著性單元之比率宜佔構成共聚物(A2)之全部單元中0.01~3莫耳%、較佳為0.05~1.5莫耳%。此時,易於平衡F樹脂層與基材等之接著性、F樹脂層之耐熱性、顏色。
共聚物(A2)中TFE單元之比率宜佔構成共聚物(A2)之全部單元中90~99.89莫耳%、較佳為92~96莫耳%。此時,易於平衡F樹脂層之耐熱性、耐化學品性等及共聚物(A2)之熱熔融性、抗應力開裂性等。
共聚物(A2)中HFP單元之比率宜佔構成共聚物(A2)之全部單元中0.1~9.99莫耳%、較佳為2~8莫耳%。若HFP單元的比率為上述範圍內,共聚物(A2)之熱熔融性更加提高。
共聚物(A2)中接著性單元、TFE單元及HFP單元的合計比率宜為90莫耳%以上、較佳為98莫耳%以上。其上限值為100莫耳%。
F聚合物中各單元的比率可藉由融化核磁共振(NMR)分析等NMR分析、氟含量分析、紅外吸收光譜分析來求出。例如如日本特開2007-314720號公報所記載,使用紅外吸收光譜分析等方法來求出構成F聚合物之全部單元中接著性單元之比率(莫耳%)。The ratio of the adhering units in the copolymer (A2) should preferably account for 0.01 to 3 mol%, preferably 0.05 to 1.5 mol% of all the units constituting the copolymer (A2). In this case, it is easy to balance the adhesiveness between the F resin layer and the substrate, and the heat resistance and color of the F resin layer.
The ratio of the TFE units in the copolymer (A2) should preferably account for 90 to 99.89 mol%, preferably 92 to 96 mol% of all units constituting the copolymer (A2). At this time, it is easy to balance the heat resistance, chemical resistance, and the like of the F resin layer, and the hot-melt property, stress crack resistance, and the like of the copolymer (A2).
The ratio of the HFP units in the copolymer (A2) should preferably be 0.1 to 9.99 mol%, preferably 2 to 8 mol% in all the units constituting the copolymer (A2). When the ratio of the HFP units is within the above range, the thermal melting property of the copolymer (A2) is further improved.
The total ratio of the adhesive unit, TFE unit and HFP unit in the copolymer (A2) is preferably 90 mol% or more, and more preferably 98 mol% or more. The upper limit is 100 mol%.
The ratio of each unit in the F polymer can be determined by NMR analysis such as melting nuclear magnetic resonance (NMR) analysis, fluorine content analysis, and infrared absorption spectrum analysis. For example, as described in Japanese Patent Application Laid-Open No. 2007-314720, a ratio (mole%) of an adhesive unit among all units constituting the F polymer is determined using a method such as infrared absorption spectrum analysis.
關於F聚合物之製造方法,可列舉:(i)使接著性單體及TFE與視需要加入之PAVE、FEP、其他單體聚合之方法;(ii)將具有TFE單元與具可藉由熱分解生成接著性基的官能基的單元的含氟共聚物加熱,使官能基熱分解而生成接著性基(例如羧基)之方法;(iii)於具有TFE單元之含氟共聚物接枝聚合接著性單體之方法,較佳為上述(i)之方法。
聚合方法(塊狀聚合法、溶液聚合法、懸浮聚合法、乳化聚合法等)並無特別限定,可適當設定。又,亦可適當設定於聚合中使用的溶劑、聚合引發劑、鏈轉移劑之量及種類。又,聚合條件(溫度、壓力、時間等)亦可根據所使用的單體種類而適當設定。As for the manufacturing method of the F polymer, it can be enumerated: (i) a method of polymerizing an adhesive monomer and TFE and optionally added PAVE, FEP, and other monomers; (ii) a method having a TFE unit and A method for heating a fluorinated copolymer that decomposes a functional unit of a bonding group to thermally decompose the functional group to generate a bonding group (for example, a carboxyl group); (iii) graft polymerizing a fluorinated copolymer having a TFE unit The method of the sex monomer is preferably the method of (i) above.
The polymerization method (bulk polymerization method, solution polymerization method, suspension polymerization method, emulsion polymerization method, etc.) is not particularly limited, and can be appropriately set. The amount and type of the solvent, polymerization initiator, and chain transfer agent used in the polymerization may be appropriately set. In addition, the polymerization conditions (temperature, pressure, time, etc.) can be appropriately set depending on the type of monomer used.
於本發明之粉體中,將D50設為X並將D10設為Y時,Y/X為0.3以下。即,本發明之粉體包含粒徑為中等程度的樹脂粒子(以下亦記載為「中等粒子」)與粒徑相對於中等粒子足夠小的樹脂粒子(以下亦記載為「微小粒子」)。
F樹脂膜係將粉體供給於基材上而形成粉體層後,將粉體層進行燒成而形成。此時,如圖1(a)所示,於粉體層中在中等粒子彼此之間形成空隙,該空隙被微小粒子填充。因此,於將粉體層進行燒成時,如圖1(b)的粗線所示,粉體層表面(中等粒子及微小粒子)會大致均勻地開始熔融,易形成表面平滑的F樹脂層。In the powder of the present invention, when D50 is set to X and D10 is set to Y, Y / X is 0.3 or less. That is, the powder of the present invention includes resin particles having a moderate particle size (hereinafter also referred to as "medium particles") and resin particles having a particle size sufficiently smaller than the medium particles (hereinafter also referred to as "fine particles").
The F resin film is formed by supplying powder onto a substrate to form a powder layer, and then firing the powder layer. At this time, as shown in FIG. 1 (a), a space is formed between the intermediate particles in the powder layer, and the space is filled with fine particles. Therefore, when the powder layer is fired, as shown by the thick line in FIG. 1 (b), the surface of the powder layer (medium particles and fine particles) will start to melt almost uniformly, and an F resin layer with a smooth surface is easily formed. .
相對於此,若不包含微小粒子,則如圖2(a)所示,於粉體層中存在多數個形成於中等粒子彼此間的空隙。因此,於將粉體層進行燒成時,如圖2(b)的粗線所示,粉體層表面會沿著中等粒子的形狀開始熔融,易形成於表面具有反映中等粒子形狀的凹凸的F樹脂層。
具有適合用於本發明的接著性基的F聚合物,相較於不具有接著性基的F聚合物,有MFR變高之傾向。因此,具有接著性基的F聚合物,即使於燒成時熔融亦難以流動,於F樹脂層表面易殘留凹凸形狀。此時,使用包含微小粒子的粉體的本發明效果特別高。On the other hand, if fine particles are not included, as shown in FIG. 2 (a), there are many voids formed between the intermediate particles in the powder layer. Therefore, when the powder layer is fired, as shown by the thick line in FIG. 2 (b), the surface of the powder layer will start to melt along the shape of the medium particles, and it is easy to form the surface with irregularities reflecting the shape of the medium particles. F resin layer.
An F polymer having an adhesive group suitable for use in the present invention tends to have a higher MFR than an F polymer having no adhesive group. Therefore, the F polymer having an adhesive group is difficult to flow even if it is melted during firing, and an uneven shape is liable to remain on the surface of the F resin layer. In this case, the effect of the present invention using powder containing fine particles is particularly high.
於本發明中,Y/X宜為0.25以下、較佳為0.15~0.2。若Y/X於上述範圍內,於粉體層中可以微小粒子更確實地填充形成於中等粒子彼此間的空隙。其結果,可形成表面更平滑的F樹脂層。又,所謂Y/X為Y除以X之值。
更具體而言,較佳為D10為4μm以下且D50為15~60μm。若將粉體的D10與D50調整於上述範圍內,則不管F聚合物具有或不具有接著性基,皆可容易地形成表面平滑且薄的F樹脂層。In the present invention, Y / X is preferably 0.25 or less, and more preferably 0.15 to 0.2. When Y / X is within the above range, fine particles can more surely fill the spaces formed between the intermediate particles in the powder layer. As a result, an F resin layer having a smoother surface can be formed. In addition, Y / X is a value of Y divided by X.
More specifically, it is preferable that D10 is 4 μm or less and D50 is 15 to 60 μm. When D10 and D50 of the powder are adjusted within the above range, a smooth and thin F resin layer can be easily formed regardless of whether the F polymer has an adhesive group or not.
粉體的D10較佳為0.5~3.9μm、更佳為2~3.9μm。若D10為上述上限值以下,可容易地形成表面更平滑的F樹脂層。若D10為上述下限值以上,於塗裝包含粉體的粉體塗料時,粉體難以附著於噴嘴,塗裝時作業性提高。
粉體的D50較佳為17~50μm、更佳為20~40μm。若D50為上述下限值以上,容易形成更薄的F樹脂層。若D50為上述上限值以下,容易形成表面更平滑的F樹脂層。The D10 of the powder is preferably 0.5 to 3.9 μm, and more preferably 2 to 3.9 μm. When D10 is below the above-mentioned upper limit value, an F resin layer having a smoother surface can be easily formed. When D10 is at least the above lower limit value, it is difficult for the powder to adhere to the nozzle when the powder coating material containing the powder is applied, and the workability during the coating is improved.
The D50 of the powder is preferably 17 to 50 μm, and more preferably 20 to 40 μm. If D50 is more than the said lower limit value, it becomes easy to form a thinner F resin layer. When D50 is below the above upper limit value, it is easy to form an F resin layer having a smoother surface.
粉體的D100宜為220μm以下、較佳為100~210μm、更佳為140~205μm。若D100為上述上限值以下,由於粉體不包含粒徑相對於中等粒子過大的樹脂粒子(以下亦記載為「粗大粒子」),故易形成表面更平滑的F樹脂層。若D100為上述下限值以上,易形成厚度足夠的F樹脂層。The D100 of the powder is preferably 220 μm or less, preferably 100 to 210 μm, and more preferably 140 to 205 μm. When D100 is equal to or less than the above upper limit, the powder does not include resin particles having an excessively large particle size relative to the medium particles (hereinafter also referred to as "coarse particles"), and therefore it is easy to form an F resin layer having a smoother surface. When D100 is at least the above lower limit value, it is easy to form an F resin layer having a sufficient thickness.
又,於將粉體中粒徑為4μm以下的樹脂粒子量設為A、將粒徑為15~60μm的樹脂粒子量設為B時,A/B宜為0.1以上、較佳為0.2以上。A/B宜為0.5以下、較佳為0.4以下。若A/B滿足上述範圍,於粉體層中可以微小粒子更高密度地填充形成於中等粒子彼此間的空隙。又,所謂A/B為A除以B之值。
粉體中所含粒徑為4μm以下的樹脂粒子的具體量宜為5~25體積%、較佳為10~20體積%。若以該量包含粒徑為4μm以下的樹脂粒子,即使粉體包含粗大粒子時,亦容易形成表面平滑的F樹脂層。When the amount of resin particles having a particle diameter of 4 μm or less in the powder is A and the amount of resin particles having a particle diameter of 15 to 60 μm is B, A / B is preferably 0.1 or more, and more preferably 0.2 or more. A / B is preferably 0.5 or less, and more preferably 0.4 or less. If the A / B satisfies the above range, fine particles can be filled in the powder layer with a higher density to fill the spaces formed between the intermediate particles. The A / B is the value of A divided by B.
The specific amount of the resin particles having a particle diameter of 4 μm or less in the powder is preferably 5 to 25% by volume, and more preferably 10 to 20% by volume. When resin particles having a particle diameter of 4 μm or less are contained in this amount, even when the powder contains coarse particles, it is easy to form an F resin layer with a smooth surface.
上述粉體可藉由如下方法而製造:(i)藉由溶液聚合法、懸浮聚合法或乳化聚合法得到F聚合物,再去除有機溶劑或水性介質而得到粉體後進行分級之方法;(ii)將F聚合物及視需要加入之其他成分進行熔融混練,將混練物粉碎並視需要將粉碎物進行分級之方法。
又,粉體亦可藉由以特定比率混合D50為上述X的第1粉體、D50為上述Y的第2粉體而製造。再者,第1粉體及第2粉體可以上述(i)或(ii)之方法製造。The above powder can be produced by the following methods: (i) a method of obtaining F polymer by solution polymerization method, suspension polymerization method or emulsion polymerization method, and then removing the organic solvent or aqueous medium to obtain powder and then classifying the powder; ii) A method of melt-kneading the F polymer and other ingredients added if necessary, pulverizing the kneaded material, and classifying the pulverized material if necessary.
The powder can also be produced by mixing a first powder having D50 as the X and a second powder having D50 as the Y in a specific ratio. The first powder and the second powder can be produced by the method (i) or (ii).
粉體之D10及D50可藉由粉碎方法的種類、粉碎條件來調節。
關於粉碎方法,可列舉使用轉子磨機、釘盤磨機、錘磨機、冷凍錘磨機、輪輾機、篩磨機、振磨機、砂磨機、旋渦磨機、球磨機、籃式磨機等粉碎機之方法。其中,由容易將粉體之D10及D50調整至上述範圍之觀點來看,較佳為使用轉子磨機、釘盤磨機之方法。
若降低粉碎機的轉數,有D10及D50變大之傾向。若粉碎機的轉數較高且粉碎時間較長,有D10及D50變小之傾向。D10 and D50 of the powder can be adjusted by the type of the grinding method and the grinding conditions.
Regarding the pulverizing method, a rotor mill, a nail disc mill, a hammer mill, a freezing hammer mill, a roller mill, a screen mill, a vibration mill, a sand mill, a vortex mill, a ball mill, and a basket mill Machine and other methods of crushing. Among them, from the viewpoint of easily adjusting the D10 and D50 of the powder to the above range, a method using a rotor mill and a nail disc mill is preferred.
If the number of revolutions of the pulverizer is reduced, D10 and D50 tend to increase. If the number of revolutions of the pulverizer is high and the pulverization time is long, D10 and D50 tend to become smaller.
本發明之粉體塗料係包含前述本發明粉體之粉體塗料。
本發明之積層體之製造方法係將包含本發明粉體之粉體塗料供給至基材上,進行燒成而形成F樹脂層。藉此,可獲得具有基材、及設置於基材上且由粉體塗料形成的F樹脂層之積層體。
粉體塗料亦可視需要包含本發明粉體以外的其他成分。關於其他成分,可列舉顏料、碳纖維、石墨。
粉體塗料中所含本發明粉體量宜為90質量%以上、較佳為95質量%以上。粉體塗料中所含本發明粉體量之上限值為100質量%。The powder coating material of the present invention is a powder coating material including the powder of the present invention.
The manufacturing method of the laminated body of this invention is to supply the powder coating material containing the powder of this invention to a base material, and baking is performed, and an F resin layer is formed. Thereby, the laminated body which has a base material and the F resin layer provided on the base material and formed from a powder coating material can be obtained.
The powder coating may optionally contain other ingredients than the powder of the present invention. Examples of the other components include pigments, carbon fibers, and graphite.
The amount of the powder of the present invention contained in the powder coating is preferably 90% by mass or more, and more preferably 95% by mass or more. The upper limit of the amount of the powder of the present invention contained in the powder coating is 100% by mass.
關於基材,可列舉:平底鍋、鍋子、熨斗等家庭用品、或工廠之配管。
關於基材之材質,可列舉:不鏽鋼、鐵等金屬、樹脂、玻璃、陶瓷。
關於粉體塗料之供給方法,宜為靜電塗裝。Examples of the substrate include household items such as pans, pans, irons, and piping in factories.
Examples of the material of the substrate include metals such as stainless steel and iron, resins, glass, and ceramics.
Regarding the supply method of powder coating, electrostatic coating is preferred.
粉體塗料的燒成宜加熱至F聚合物的熔點以上來進行。具體的燒成溫度宜為350~380℃、較佳為350~375℃、更佳為350~370℃。若燒成溫度為上述下限值以上,易形成表面平滑的F樹脂層,且F樹脂層與基材之密著性提高。
另一方面,若燒成溫度為上述上限值以下,由於本發明中F聚合物的熔點為260~320℃,故可防止因F聚合物熱分解而產生氣體。因此,可抑制F樹脂層中發生發泡或龜裂,容易得到高安全性且外觀優異的積層體。換言之,使用熔點為260~320℃的F聚合物時,不可能極端地提高燒成溫度,不得不以較低溫燒成粉體層。本發明粉體藉由包含微小粒子,即使為較低溫的燒成,亦容易獲得表面平滑的F樹脂層。The firing of the powder coating material is preferably performed by heating above the melting point of the F polymer. The specific firing temperature is preferably 350 to 380 ° C, preferably 350 to 375 ° C, and more preferably 350 to 370 ° C. When the firing temperature is equal to or higher than the above-mentioned lower limit value, it is easy to form an F resin layer with a smooth surface, and the adhesion between the F resin layer and the substrate is improved.
On the other hand, if the firing temperature is equal to or lower than the above-mentioned upper limit value, since the melting point of the F polymer in the present invention is 260 to 320 ° C., it is possible to prevent gas generation due to thermal decomposition of the F polymer. Therefore, foaming or cracking in the F resin layer can be suppressed, and a laminated body having high safety and excellent appearance can be easily obtained. In other words, when an F polymer having a melting point of 260 to 320 ° C is used, it is impossible to extremely increase the firing temperature, and the powder layer has to be fired at a lower temperature. The powder of the present invention can easily obtain an F resin layer with a smooth surface even if it is fired at a relatively low temperature by containing fine particles.
燒成時間宜為1~20分鐘、較佳為1~15分鐘。若燒成時間為上述下限值以上,容易形成表面平滑的F樹脂層。若燒成時間為上述上限值以下,更加容易抑制F樹脂層中發生發泡或龜裂。The firing time is preferably 1 to 20 minutes, and more preferably 1 to 15 minutes. When the firing time is equal to or more than the above lower limit value, it is easy to form an F resin layer having a smooth surface. When the firing time is equal to or less than the above upper limit value, it is easier to suppress foaming or cracking in the F resin layer.
於本發明中,亦可重覆2次以上將粉體塗料供給至基材上並進行燒成的操作。
此時,各燒成步驟中的燒成溫度及燒成時間可不同亦可相同。又,此時,合計燒成時間宜為3~60分鐘、較佳為4~60分鐘、更佳為5~45分鐘、再更佳為10~30分鐘。若合計燒成時間為上述上限值以下,容易抑制F樹脂層中發生發泡或龜裂。若合計燒成溫度為上述下限值以上,易形成表面平滑的F樹脂層,且F樹脂層與基材之密著性更加提高。In the present invention, the operation of supplying the powder coating material to the substrate and firing it may be repeated twice or more.
At this time, the firing temperature and firing time in each firing step may be different or the same. At this time, the total firing time is preferably 3 to 60 minutes, preferably 4 to 60 minutes, more preferably 5 to 45 minutes, and even more preferably 10 to 30 minutes. When the total firing time is equal to or less than the above upper limit value, it is easy to suppress the occurrence of foaming or cracking in the F resin layer. When the total firing temperature is equal to or higher than the above-mentioned lower limit value, it is easy to form an F resin layer having a smooth surface, and the adhesion between the F resin layer and the substrate is further improved.
應形成的F樹脂層的厚度宜為50~750μm、較佳為100~500μm。若F樹脂層的厚度為上述下限值以上,則積層體的生產性提高。若F樹脂層的厚度為上述上限值以下,則F樹脂層的耐化學品性提高。The thickness of the F resin layer to be formed is preferably 50 to 750 μm, and more preferably 100 to 500 μm. When the thickness of the F resin layer is equal to or more than the above-mentioned lower limit value, the productivity of the laminated body is improved. When the thickness of the F resin layer is equal to or less than the above upper limit value, the chemical resistance of the F resin layer is improved.
F樹脂層與基材之剝離強度宜為14N/cm以上、較佳為15~100N/cm、更佳為16~90N/cm、再更佳為16~85N/cm。F樹脂層與基材之剝離強度為上述下限值以上時,表示F樹脂層與基材之密著性較高,F樹脂層難以自基材剝離。The peel strength of the F resin layer and the substrate is preferably 14 N / cm or more, preferably 15 to 100 N / cm, more preferably 16 to 90 N / cm, and even more preferably 16 to 85 N / cm. When the peel strength between the F resin layer and the substrate is at least the above lower limit value, it means that the adhesion between the F resin layer and the substrate is high, and the F resin layer is difficult to peel from the substrate.
以上,就本發明粉體及積層體之製造方法進行說明,但本發明並不限定於前述實施形態之構成。
例如本發明粉體亦可於前述實施形態之構成中追加其他任意之構成,亦可取代為能發揮相同功能的任意構成。
又,本發明之積層體之製造方法亦可於上述實施形態之構成中追加具有其他任意之步驟,亦可取代為能產生相同作用的任意步驟。As mentioned above, the manufacturing method of the powder and laminated body of this invention was demonstrated, However this invention is not limited to the structure of the said embodiment.
For example, the powder of the present invention may be added with another arbitrary structure to the structure of the aforementioned embodiment, or may be replaced with an arbitrary structure that can perform the same function.
In addition, the method for producing a laminated body according to the present invention may have other arbitrary steps added to the configuration of the embodiment described above, or may be replaced with an arbitrary step capable of producing the same effect.
[實施例]
以下舉實施例具體地說明本發明,但本發明並不限定於此等實施例。[Example]
The following examples illustrate the present invention in detail, but the present invention is not limited to these examples.
1.原料粉體之製造
[製造例1]
使用NAH、TFE及PPVE,按照國際公開第2016/017801號之段落[0123]所記載之程序,製造由F聚合物(1)構成的原料粉體(A1)。
F聚合物(1)中所含的NAH單元、TFE單元及PPVE單元的比率(莫耳%)依序為0.1、97.9、2.0。F聚合物(1)的熔點為300℃、MFR為17.6g/10分、原料粉體(A1)的D50為1554μm。1. Manufacture of raw material powder
[Manufacturing example 1]
Using NAH, TFE, and PPVE, a raw material powder (A1) composed of an F polymer (1) was produced according to a procedure described in paragraph [0123] of International Publication No. 2016/017801.
The ratio (mole%) of NAH units, TFE units, and PPVE units contained in the F polymer (1) was 0.1, 97.9, and 2.0 in this order. The melting point of the F polymer (1) was 300 ° C., the MFR was 17.6 g / 10 minutes, and the D50 of the raw material powder (A1) was 1554 μm.
[製造例2]
除了將鏈轉移劑變更為0.5kg的甲醇以外,以與製造例1相同方法獲得由F聚合物(2)構成的原料粉體(A2)。
F聚合物(2)中所含的NAH單元、TFE單元及PPVE單元的比率(莫耳%)依序為0.1、97.9、2.0。F聚合物(2)的熔點為300℃、MFR為25.0g/10分、原料粉體(A2)的D50為1570μm。[Manufacturing example 2]
A raw material powder (A2) composed of an F polymer (2) was obtained in the same manner as in Production Example 1 except that the chain transfer agent was changed to 0.5 kg of methanol.
The ratios (mole%) of NAH units, TFE units, and PPVE units contained in the F polymer (2) were 0.1, 97.9, and 2.0 in this order. The melting point of the F polymer (2) was 300 ° C., the MFR was 25.0 g / 10 minutes, and the D50 of the raw material powder (A2) was 1570 μm.
[製造例3]
除了將鏈轉移劑變更為0.35kg的甲醇以外,以與製造例1相同方法獲得由F聚合物(3)構成的原料粉體(A3)。
F聚合物(3)中所含的NAH單元、TFE單元及PPVE單元的比率(莫耳%)依序為0.1、97.9、2.0。F聚合物3的熔點為300℃、MFR為8.2g/10分、原料粉體(A3)的D50為1490μm。
再者,F聚合物中所含的各單元的比率係藉由國際公開第2016/017801號所記載的方法進行測定。
熔點係使用精工儀器公司製的示差掃描熱分析儀(DSC-7020)進行測定。F聚合物的升溫速度為10℃/分。
MFR係使用Techno Seven公司製的熔融指數測定機,測定於372℃、49N荷重下從直徑2mm且長度8mm的噴嘴流出10分鐘(單位時間)的F聚合物的質量(g)而求出。
原料粉體的D50係按以下程序而求出。
從上而下依序重疊如下:2.000篩網(網目孔徑2.400mm)、1.410篩網(網目孔徑1.705mm)、1.000篩網(網目孔徑1.205mm)、0.710篩網(網目孔徑0.855mm)、0.500篩網(網目孔徑0.605mm)、0.250篩網(網目孔徑0.375mm)、0.149篩網(網目孔徑0.100mm)及承接盤。
將原料粉體放入最上面的篩子,以振動器過篩30分鐘。測定殘留於各篩上的原料粉體質量,將通過質量相對於各網目孔徑值的累計值以圖表表示,求出通過質量累計成為50%的粒徑,作為原料粉體的D50。
2.粉體及積層體之製造
[例1]
首先,使用轉子磨機(Fritsch公司製、轉子高速粉碎機P-14),以轉數1700rpm的條件將原料粉體(A1)進行粉碎,得到粉碎粉體。
接著,使用圓形振動篩機(SEISHIN企業公司製、KGO-1000型、篩網目孔徑212μm)將粉碎粉體進行分級,得到粉體(B1)。
又,粉體(B1)的D10為3.8μm、D50為22.2μm、D90為100.6μm、D100為200.5μm、鬆散填充體密度為0.491g/mL、緊密填充體密度為0.646g/mL。[Manufacturing example 3]
A raw material powder (A3) composed of an F polymer (3) was obtained in the same manner as in Production Example 1 except that the chain transfer agent was changed to 0.35 kg of methanol.
The ratios (mole%) of NAH units, TFE units, and PPVE units contained in the F polymer (3) were 0.1, 97.9, and 2.0 in this order. The melting point of the F polymer 3 was 300 ° C., the MFR was 8.2 g / 10 minutes, and the D50 of the raw material powder (A3) was 1490 μm.
The ratio of each unit contained in the F polymer is measured by a method described in International Publication No. 2016/017801.
The melting point was measured using a differential scanning thermal analyzer (DSC-7020) manufactured by Seiko Instruments Inc. The temperature rise rate of the F polymer was 10 ° C / min.
The MFR was determined by measuring the mass (g) of the F polymer flowing out of a nozzle having a diameter of 2 mm and a length of 8 mm for 10 minutes (unit time) under a load of 372 ° C and 49 N at a melt index measuring machine manufactured by Techno Seven.
The D50 of the raw material powder was obtained by the following procedure.
From top to bottom, they are sequentially overlapped as follows: 2.000 mesh (mesh aperture 2.400mm), 1.410 mesh (mesh aperture 1.705mm), 1.000 mesh (mesh aperture 1.205mm), 0.710 mesh (mesh aperture 0.855mm), 0.500 Screen (mesh aperture 0.605mm), 0.250 screen (mesh aperture 0.375mm), 0.149 screen (mesh aperture 0.100mm) and receiving tray.
Put the raw powder into the top sieve and sieve with a shaker for 30 minutes. The mass of the raw material powder remaining on each sieve was measured, and the cumulative value of the passing mass with respect to the pore size of each mesh was represented in a graph. The particle diameter that had accumulated to 50% by the mass was determined as D50 of the raw powder.
2. Manufacturing of powders and laminates
[example 1]
First, a raw material powder (A1) was pulverized using a rotor mill (Fritsch Co., high-speed rotor pulverizer P-14) at a speed of 1700 rpm to obtain a pulverized powder.
Next, the pulverized powder was classified using a circular vibrating sieve (manufactured by SEISHIN Corporation, KGO-1000 type, mesh opening 212 μm) to obtain a powder (B1).
The powder (B1) had D10 of 3.8 μm, D50 of 22.2 μm, D90 of 100.6 μm, D100 of 200.5 μm, a loose filler density of 0.491 g / mL, and a dense filler density of 0.646 g / mL.
首先,準備縱40mm、橫150mm、厚度2mm的SUS304製鋼板。
接著,使用60網目的氧化鋁粒子,以表面粗糙度Ra成為5~10μm之方式對鋼板表面進行噴砂處理。
然後,用乙醇清潔鋼板表面,製作基材。
於基材表面靜電塗裝由粉體(B1)構成的粉體塗料後,重覆10次以燒成溫度350℃×燒成時間4分鐘進行燒成的操作,得到積層體。
再者,形成於基材上的F樹脂層的厚度為314μm。First, a SUS304 steel plate having a length of 40 mm, a width of 150 mm, and a thickness of 2 mm was prepared.
Next, a 60-mesh alumina particle was used, and the steel plate surface was sand-blasted so that surface roughness Ra might become 5-10 micrometers.
Then, the surface of the steel plate was cleaned with ethanol to prepare a substrate.
After the powder coating material consisting of powder (B1) was electrostatically coated on the surface of the substrate, the firing operation was repeated 10 times at a firing temperature of 350 ° C. for 4 minutes to obtain a laminate.
The thickness of the F resin layer formed on the substrate was 314 μm.
[例2]
首先,使用釘盤磨機(SEISHIN企業公司製、M-4型),以轉數5000rpm的條件將原料粉體(A2)進行粉碎,得到粉碎粉體。
接著,使用圓形振動篩機(SEISHIN企業公司製、KGO-1000型、篩網目孔徑212μm)將粉碎粉體進行分級,得到粉體(B2)。
又,粉體(B2)的D10為3.6μm、D50為21.1μm、D90為99.4μm、D100為181.9μm、鬆散填充體密度為0.524g/mL、緊密填充體密度為0.695g/mL。
接著,於與例1相同方式製作的基材表面靜電塗裝由粉體(B2)構成的粉體塗料後,重覆2次以燒成溫度350℃×燒成時間6分鐘進行燒成的操作,得到積層體。
再者,形成於基材上的F樹脂層的厚度為330μm。[Example 2]
First, a raw material powder (A2) was pulverized using a nail disc mill (manufactured by SEISHIN Corporation, M-4 type) at a speed of 5000 rpm to obtain a pulverized powder.
Next, the pulverized powder was classified using a circular vibrating screen machine (KGO-1000 type manufactured by SEISHIN Corporation, with a mesh opening of 212 μm) to obtain a powder (B2).
D10 of the powder (B2) was 3.6 μm, D50 was 21.1 μm, D90 was 99.4 μm, D100 was 181.9 μm, the density of the loose filler was 0.524 g / mL, and the density of the compact filler was 0.695 g / mL.
Next, the base material produced in the same manner as in Example 1 was electrostatically coated with a powder coating made of powder (B2), and then repeatedly fired at a firing temperature of 350 ° C for 6 minutes. To get a laminated body.
The thickness of the F resin layer formed on the substrate was 330 μm.
[例3]
除了使用原料粉體(A3)取代原料粉體(A2)以外,以與例2相同方式得到粉體(B3)。
又,粉體(B3)的D10為3.9μm、D50為24.4μm、D90為78.2μm、D100為169.9μm、鬆散填充體密度為0.525g/mL、緊密填充體密度為0.699g/mL。
接著,於與例1相同方式製作的基材表面靜電塗裝由粉體(B3)構成的粉體塗料後,重覆5次以燒成溫度350℃×燒成時間4分鐘進行燒成的操作,進而靜電塗裝上述粉體塗料後,進行1次以燒成溫度350℃×燒成時間6分鐘進行燒成的操作,得到積層體。
再者,形成於基材上的F樹脂層的厚度為330μm。[Example 3]
A powder (B3) was obtained in the same manner as in Example 2 except that the raw material powder (A3) was used instead of the raw material powder (A2).
The powder (B3) had D10 of 3.9 μm, D50 of 24.4 μm, D90 of 78.2 μm, D100 of 169.9 μm, a loose filler density of 0.525 g / mL, and a dense filler density of 0.699 g / mL.
Next, the surface of the substrate produced in the same manner as in Example 1 was electrostatically coated with a powder coating made of powder (B3), and then repeatedly fired at a firing temperature of 350 ° C. for a firing time of 4 minutes. Further, after the above-mentioned powder coating was electrostatically coated, the firing operation was performed once at a firing temperature of 350 ° C. for a firing time of 6 minutes to obtain a laminated body.
The thickness of the F resin layer formed on the substrate was 330 μm.
[例4]
除了將釘盤磨機的轉數變更為2100rpm且不進行分級以外,以與例2相同方式得到粉體(B4)。
又,粉體(B4)的D10為10.6μm、D50為94.4μm、D90為260.1μm、D100為340.1μm、鬆散填充體密度為0.729g/mL、緊密填充體密度為0.835g/mL。
接著,除了使用由粉體(B4)構成的粉體塗料以外,以與例3相同方式得到積層體。
再者,形成於基材上的F樹脂層的厚度為330μm。[Example 4]
A powder (B4) was obtained in the same manner as in Example 2 except that the number of revolutions of the nail disc mill was changed to 2100 rpm without classification.
Further, the powder (B4) had D10 of 10.6 μm, D50 of 94.4 μm, D90 of 260.1 μm, D100 of 340.1 μm, a loose filler density of 0.729 g / mL, and a dense filler density of 0.835 g / mL.
Next, a laminated body was obtained in the same manner as in Example 3 except that the powder coating material composed of the powder (B4) was used.
The thickness of the F resin layer formed on the substrate was 330 μm.
[例5]
除了將釘盤磨機的轉數變更為2100rpm以外,以與例2相同方式得到粉體(B5)。
又,粉體(B5)的D10為10.6μm、D50為82.1μm、D90為186.5μm、D100為212.0μm、鬆散填充體密度為0.511g/mL、緊密填充體密度為0.672g/mL。
接著,除了使用由粉體(B5)構成的粉體塗料以外,以與例3相同方式得到積層體。
再者,形成於基材上的F樹脂層的厚度為330μm。[Example 5]
A powder (B5) was obtained in the same manner as in Example 2 except that the number of revolutions of the nail disc mill was changed to 2100 rpm.
The powder (B5) had D10 of 10.6 μm, D50 of 82.1 μm, D90 of 186.5 μm, D100 of 212.0 μm, a loose filler density of 0.511 g / mL, and a dense filler density of 0.672 g / mL.
Next, a laminated body was obtained in the same manner as in Example 3 except that a powder coating material composed of powder (B5) was used.
The thickness of the F resin layer formed on the substrate was 330 μm.
[例6]
除了將釘盤磨機的轉數變更為3000rpm以外,以與例2相同方式得到粉體(B6)。
又,粉體(B6)的D10為9.2μm、D50為56.9μm、D90為131.6μm、D100為203.2μm、鬆散填充體密度為0.529g/mL、緊密填充體密度為0.691g/mL。
接著,除了使用由粉體(B6)構成的粉體塗料以外,以與例3相同方式得到積層體。
再者,形成於基材上的F樹脂層的厚度為330μm。[Example 6]
A powder (B6) was obtained in the same manner as in Example 2 except that the number of revolutions of the nail disc mill was changed to 3000 rpm.
D10 of the powder (B6) was 9.2 μm, D50 was 56.9 μm, D90 was 131.6 μm, D100 was 203.2 μm, the density of the loose filler was 0.529 g / mL, and the density of the compact filler was 0.691 g / mL.
Next, a laminated body was obtained in the same manner as in Example 3 except that a powder coating material composed of powder (B6) was used.
The thickness of the F resin layer formed on the substrate was 330 μm.
[例7(比較例)]
除了將釘盤磨機的轉數變更為4000rpm以外,以與例2相同方式得到粉體(B7)及積層體。
又,粉體(B7)的D10為8.3μm、D50為25.5μm、D90為120.6μm、D100為191.3μm、鬆散填充體密度為0.503g/mL、緊密填充體密度為0.657g/mL。
再者,形成於基材上的F樹脂層的厚度為330μm。[Example 7 (comparative example)]
A powder (B7) and a laminate were obtained in the same manner as in Example 2 except that the number of revolutions of the nail disc mill was changed to 4000 rpm.
The powder (B7) had D10 of 8.3 μm, D50 of 25.5 μm, D90 of 120.6 μm, D100 of 191.3 μm, a loose filler density of 0.503 g / mL, and a dense filler density of 0.657 g / mL.
The thickness of the F resin layer formed on the substrate was 330 μm.
構成粉體的樹脂粒子的粒徑及量、鬆散填充體密度及緊密填充體密度係如下所述地進行測定。
(樹脂粒子的粒徑及量的測定)
使用堀場製作所公司製的雷射繞射散射式粒度分布測定装置(LA-920測定器),使粉體分散於水中,測定粒度分布,算出D10、D50、D90及D100。
又,由所得到的粒度分布圖求出粒徑為4μm以下的樹脂粒子量及粒徑為15~60μm的樹脂粒子量。
(鬆散填充體密度及緊密填充體密度)
粉體的鬆散填充體密度及緊密填充體密度係分別使用國際公開第2016/017801號之[0117]、[0118]所記載的方法進行測定。The particle diameter and amount of the resin particles constituting the powder, the density of the loose filler and the density of the tight filler are measured as follows.
(Measurement of Particle Size and Amount of Resin Particles)
The powder was dispersed in water using a laser diffraction scattering particle size distribution measuring device (LA-920 measuring device) manufactured by Horiba, Ltd., and the particle size distribution was measured to calculate D10, D50, D90, and D100.
Further, the amount of resin particles having a particle diameter of 4 μm or less and the amount of resin particles having a particle diameter of 15 to 60 μm were obtained from the obtained particle size distribution chart.
(Loose packing density and tight packing density)
The bulk density and bulk density of the powder are measured using the methods described in [0117] and [0118] of International Publication No. 2016/017801, respectively.
3.測定及評價
3-1.剝離強度
首先,使用切割刀從於各例獲得的積層體的F樹脂層表面側形成間隔10mm的切痕。
接著,將F樹脂層的一部分剝離,固定於拉伸試驗機的夾頭。
然後,測定以拉伸速度50mm/分鐘、90°將F樹脂層從基材剝離時的剝離強度(N/cm)。3. Measurement and evaluation
3-1. Peeling strength First, 10 mm of cuts were formed from the F resin layer surface side of the laminated body obtained in each example using a cutter.
Next, a part of the F resin layer was peeled off and fixed to a chuck of a tensile tester.
Then, the peeling strength (N / cm) when the F resin layer was peeled from the substrate at a tensile speed of 50 mm / minute and 90 ° was measured.
3-2.外觀評價
於各例製作100個積層體,以目視確認各積層體之F樹脂層表面,並藉由以下評價基準評價外觀。
<評價基準>
◎:於任何積層體的F樹脂層表面皆沒有觀察到凹凸。
○:於5個以下積層體的F樹脂層表面觀察到凹凸。
△:於6~10個積層體的F樹脂層表面觀察到凹凸。
╳:於超過10個積層體的F樹脂層表面觀察到凹凸。
將以上結果與粉體之製造條件、粒徑(D10、D50、D90、D100)及量、積層體之製造條件顯示於表1。3-2. Appearance Evaluation 100 laminates were produced in each example, the surface of the F resin layer of each laminate was visually confirmed, and the appearance was evaluated by the following evaluation criteria.
< Evaluation criteria >
:: No unevenness was observed on the surface of the F resin layer of any laminated body.
:: Unevenness was observed on the surface of the F resin layer of 5 or less laminates.
Δ: Unevenness was observed on the surface of the F resin layer of 6 to 10 laminates.
╳: Unevenness was observed on the surface of the F resin layer of more than 10 laminates.
The above results are shown in Table 1 together with the powder manufacturing conditions, particle size (D10, D50, D90, D100) and amount, and the manufacturing conditions of the laminated body.
[表1]
[Table 1]
如表1所示,使用D10與D50之關係於本發明規定範圍內的粉體的例1~6中,基材與F樹脂層的密著性優異。
於使用D50較小的粉體的例1~3中,形成表面平滑的F樹脂層,另一方面,使用D50較大的粉體的例4~6中,有於F樹脂層表面產生凹凸的傾向。
使用D10與D50之關係脫離本發明規定範圍的粉體的例7中,於F樹脂層表面觀察到凹凸。又,有基材與F樹脂層之密著性降低之傾向。As shown in Table 1, in Examples 1 to 6 in which the powder having a relationship between D10 and D50 within the range specified in the present invention was used, the adhesiveness between the substrate and the F resin layer was excellent.
In Examples 1 to 3 using a powder with a smaller D50, an F resin layer having a smooth surface was formed. On the other hand, in Examples 4 to 6 using a powder with a larger D50, there were irregularities on the surface of the F resin layer. tendency.
In Example 7 where powders whose relationship between D10 and D50 deviated from the range specified in the present invention were used, unevenness was observed on the surface of the F resin layer. Moreover, there exists a tendency for the adhesiveness of a base material and an F resin layer to fall.
產業上之可利用性
本發明粉體適用於粉體塗裝所使用的粉體塗料,尤其適合於用以形成表面平滑的厚的氟樹脂層的粉體塗料。
再者,將於2017年12月07日申請的日本專利出願2017-235350號說明書、發明申請專利範圍、摘要及圖式的全部內容引用於此,採用作為本發明說明書的內容。Industrial Applicability The powder of the present invention is suitable for a powder coating used for powder coating, and is particularly suitable for a powder coating used to form a thick fluororesin layer with a smooth surface.
In addition, the entire contents of the Japanese Patent Application No. 2017-235350 specification, patent application scope, abstract, and drawings, which will be filed on December 07, 2017, are hereby incorporated by reference as the content of the present specification.
圖1係用以說明使用本發明粉體形成氟樹脂層時的狀態變化之圖。FIG. 1 is a diagram for explaining a state change when a fluororesin layer is formed using the powder of the present invention.
圖2係用以說明使用先前粉體形成氟樹脂層時的狀態變化之圖。 FIG. 2 is a diagram for explaining a state change when a fluororesin layer is formed using a conventional powder.
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