TW201918221A - Adhesively attachable biological sensor - Google Patents

Abstract

This adhesively attachable biological sensor is provided with: a stretchable backing for adhering to the surface of a living body; an interposer disposed on one side of the backing in the thickness direction; and an electronic component disposed on the one side of the backing in the thickness direction. The backing is provided with a pressure-sensitive adhesive layer, an underlayer, and a wiring layer. The electronic component is electrically connected to the wiring layer of the backing via the interposer.

Description

Attached biosensor

The present invention relates to a patch type biosensor.

Previously, biosensors attached to the surface of a living body and sensing the attachment type of the living body have been known. As such a biosensor, for example, a biometric sensor module, a viscous polymer layer, an electrode disposed on the polymer layer, and a wiring for connecting the data acquisition module and the electrode are proposed. A body-compatible polymer substrate (for example, refer to Patent Document 1).

Moreover, the biocompatible polymer substrate-based polymer layer is attached to the surface of the living body, the electrode detects a biological signal such as a myocardial-derived voltage signal, and the data acquisition module receives the myocardial-derived voltage signal and records . [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-10978

[The problem that the invention wants to solve]

However, in the biocompatible polymer substrate, in addition to the mounting data acquisition module (analogous front end element), a plurality of smaller wireless transmission elements for transmitting data to an external device are mounted (mounted). Electronic parts.

However, since the polymer layer used for the biocompatible polymer substrate has stretchability or flexibility, it is difficult to mount an electronic component as compared with a normal substrate, and mounting is likely to be insufficient. As a result, the biocompatible polymer substrate is irregularly deformed in the three-dimensional direction on the surface of the living body, so that an abnormality in which the electronic component is detached from the polymer layer occurs.

The present invention provides a living body sensor capable of suppressing the falling of an electronic component. [Technical means to solve the problem]

The present invention [1] includes an attached biosensor, the attached biosensor having a substrate that is stretchable for attachment to a surface of a living body, and an interposer disposed on the substrate a side of the substrate in a thickness direction; and an electronic component disposed on a side in a thickness direction of the substrate; the substrate has a pressure-sensitive adhesive layer, a substrate layer, and a wiring layer, and the electronic component is connected to the electronic component via the interposer The wiring layer of the substrate is electrically connected.

According to the biosensor, the electronic component is electrically connected to the substrate via the interposer. That is, the electronic component can be mounted on the substrate after being mounted on the interposer. Therefore, it is not necessary to directly mount a plurality of smaller electronic components on the flexible substrate, and the electronic component can be surely attached to the substrate via the interposer. As a result, when the biosensor is attached to the surface of the living body, the falling of the electronic component can be suppressed.

The invention of claim 2, wherein the area of the electrical connection point between the substrate and the interposer is greater than the electrical connection between the electronic component and the interposer. The area at the point.

According to the biosensor, since the contact area between the substrate and the interposer is relatively large, peeling of the substrate and the interposer can be suppressed, and further, the fall of the electronic component mounted on the interposer can be suppressed.

[3] The attached biosensor according to [1] or [2] wherein the number of electrical connection points between the substrate and the interposer and the electronic component and the interposer are The number of electrical connection points is the same or less than the number.

According to the biosensor, since the number of electrical connection points between the substrate and the interposer is relatively small, the connection failure between the substrate and the interposer can be suppressed.

[4] The attached biosensor according to any one of [1] to [3] wherein the interposer has flexibility.

According to the biosensor, the interposer can softly change the shape depending on the operation of the substrate. Thereby, the interposer can be prevented from falling off from the substrate. Moreover, in use, since the surface of the living body can be prevented from coming into contact with the hard member, the wearing feeling is excellent.

[5] The biological sensor according to [4], wherein the interposer has a bending rigidity of 3.0 × 10 ¹² GPa·μm ⁴ or less.

According to the biosensor, the flexibility can be more reliably exhibited, and the interposer can be prevented from falling off from the substrate. Moreover, the wearing feeling is further improved. [Effects of the Invention]

According to the biosensor, when the biosensor is attached to the surface of the living body for use, it is possible to suppress the falling off of the electronic component.

<Embodiment> An embodiment of the attached biosensor of the present invention will be described with reference to Figs. 1 to 11 .

In Fig. 1, the longitudinal direction (first direction) of the attached biosensor 1 is attached to the left and right sides of the paper. The right side of the paper is on one side in the longitudinal direction (one side in the first direction), and the left side of the paper is on the other side in the longitudinal direction (the other side in the first direction). In FIG. 1, the short side direction (the direction orthogonal to the longitudinal direction, the width direction, and the second direction orthogonal to the first direction) of the attached biosensor 1 is attached to the upper and lower sides of the paper. The side of the paper is one side in the short side direction (one side in the width direction and one side in the second direction), and the lower side of the paper surface is the other side in the short side direction (the other side in the width direction and the other side in the second direction). In FIG. 1, the thickness direction of the paper surface is attached to the upper and lower directions of the biosensor 1 (thickness direction, third direction orthogonal to the first direction and the second direction). The front side of the paper surface is on the upper side (the side in the thickness direction and the side in the third direction), and the back side of the paper surface is the lower side (the other side in the thickness direction and the other side in the third direction).

1. Attached Biosensor Detector As shown in Figs. 1 and 3, the attached biosensor 1 has a substantially flat plate shape extending in the longitudinal direction. The attached biosensor 1 includes a substrate 2, an interposer 3 disposed on the upper side of the substrate 2, and a plurality of electronic components 4 disposed on the upper side of the interposer 3.

(Substrate) The base material 2 is a base material for attaching a circuit portion as shown in FIG. 2, and has, for example, a base material circuit portion 26 (described below) having a stretchable property and a pressure-sensitive adhesive property. The substrate 2 is a sheet having a flat plate shape extending in the longitudinal direction and having excellent stretchability. Specifically, the base material 2 has a strip shape extending in the longitudinal direction, and has a central portion in the longitudinal direction which bulges toward both sides in the short-side direction (direction orthogonal to the longitudinal direction and the vertical direction) (width direction). shape.

In the substrate 2, an electronic component region 14 and a battery region 15 are divided.

The electronic component area 14 is a region in which the electronic component 4 and the interposer 3 are mounted. In other words, the electronic component region 14 is a region overlapping the interposer 3 when the attached biosensor 1 is projected in the vertical direction (thickness direction). Specifically, the electronic component region 14 is divided into one side in the short side direction of the central portion in the longitudinal direction.

The battery area 15 is an area in which the battery 70 is mounted. In other words, the battery region 15 is a region overlapping the battery 70 when the attached biosensor 1 in which the battery 70 is mounted is projected in the vertical direction. Specifically, the battery region 15 is divided into the other side in the short side direction of the central portion in the longitudinal direction, and is spaced apart from the electronic component region 14 on the other side in the short side direction.

The base material 2 has a pressure-sensitive adhesive layer 5, a base material layer 6 disposed on the upper surface (one surface in the thickness direction) of the pressure-sensitive adhesive layer 5, and a wiring layer 7 disposed on the upper surface of the base material layer 6, and disposed on the pressure-sensitive layer Next, the probe 8 on the lower surface of the layer 5 (the other surface in the thickness direction) and the connecting portion 9 connecting the wiring layer 7 and the probe 8 are provided.

The pressure-sensitive adhesive layer 5 forms the lower surface of the substrate 2 (pressure-sensitive adhesive surface). In other words, the pressure-sensitive adhesive layer 5 is a layer that imparts pressure-sensitive adhesive to the lower surface of the attached biosensor 1 in order to attach the substrate 2 to the surface of the living body (the skin 80 in FIG. 7 or the like). The pressure-sensitive adhesive layer 5 forms an outer shape of the substrate 2. The pressure-sensitive adhesive layer 5 has a flat plate shape extending in the longitudinal direction.

The pressure-sensitive adhesive layer 5 has its first opening portion 11 at both end portions in the longitudinal direction. Each of the two first openings 11 has a substantially ring shape in plan view. The first opening portion 11 penetrates the pressure-sensitive adhesive layer 5 in the vertical direction. Further, the inner lower surface of the first opening portion 11 is open toward the lower side, and has a first groove 10 corresponding to the probe 8.

The material of the pressure-sensitive adhesive layer 5 is not particularly limited as long as it is a material having pressure-sensitive adhesive properties. Further, the pressure-sensitive adhesive layer 5 is also a stretchable stretchable material. The material of the pressure-sensitive adhesive layer 5 is specifically a material having biocompatibility, and examples of such a material include an acrylic pressure-sensitive adhesive and an anthrone-based pressure-sensitive adhesive. Preferably, an acrylic pressure-sensitive adhesive is used. An acrylic polymer or the like described in JP-A-2003-342541 is exemplified as the acrylic pressure-sensitive adhesive.

The thickness of the pressure-sensitive adhesive layer 5 is, for example, 10 μm or more, preferably 20 μm or more, and is, for example, 95 μm or less, preferably 70 μm or less, and more preferably 50 μm or less.

The size of the pressure-sensitive adhesive layer 5 in plan view is appropriately set in accordance with the skin 80 (described below) to which the attached biological sensor 1 is attached. The length of the pressure-sensitive adhesive layer 5 in the longitudinal direction is, for example, 30 mm or more, preferably 50 mm or more, and further, for example, 1000 mm or less, preferably 200 mm or less. The length of the pressure-sensitive adhesive layer 5 in the short-side direction is, for example, 5 mm or more, preferably 10 mm or more, and further, for example, 300 mm or less, preferably 100 mm or less.

The substrate layer 6 forms the upper surface of the substrate 2. The base material layer 6 is formed in the outer shape of the base material 2 together with the pressure-sensitive adhesive layer 5. The top view shape of the base material layer 6 is the same as the top view shape of the pressure sensitive adhesive layer 5. The base material layer 6 is disposed on the entire surface of the upper surface of the pressure-sensitive adhesive layer 5. The substrate layer 6 supports the support layer of the pressure-sensitive adhesive layer 5. The base material layer 6 has a flat plate shape extending in the longitudinal direction.

Further, the base material layer 6 has a base material groove 12 corresponding to the wiring layer 7 (described later) on the upper surface thereof. The substrate groove 12 has the same pattern shape as the wiring layer 7 in plan view. The substrate groove 12 is open toward the upper side.

Further, the base material layer 6 has the second opening portion 13 corresponding to the first opening portion 11. The second opening 13 communicates with the first opening 11 in the vertical direction. The second opening 13 has a substantially rectangular shape in plan view and the same size as the first opening 11 .

The material of the base material layer 6 is, for example, an expandable insulator or the like. Examples of such a material include thermoplastic resins such as a polyurethane resin, an anthrone resin, an acrylic resin, a polystyrene resin, a vinyl chloride resin, and a polyester resin. A urethane resin.

The elongation at break of the base material layer 6 is, for example, 100% or more, preferably 200% or more, more preferably 300% or more, and further, for example, 2000% or less. When the elongation at break is at least the above lower limit, the material of the base material layer 6 has excellent stretchability. Further, the elongation at break was measured in accordance with JIS K 7127 (1999) at a tensile speed of 5 mm/min and a test piece type 2.

Further, the tensile strength at 20 ° C of the base material layer 6 (100 mm between the chucks, the tensile speed of 300 mm/min, and the strength at the time of breaking) is, for example, 0.1 N/20 mm or more, preferably 1 N/20. Above mm, again, for example, 20 N/20 mm or less. The tensile strength was measured in accordance with JIS K 7127 (1999).

Further, the tensile storage elastic modulus E' at 20 ° C of the base material layer 6 is, for example, 2,000 MPa or less, preferably 1,000 MPa or less, more preferably 100 MPa or less, still more preferably 50 MPa or less, and particularly preferably 20 MPa or less, and, for example, 0.1 MPa or more. When the tensile storage elastic modulus E' of the base material layer 6 is at most the above upper limit, the material of the base material layer 6 has excellent stretchability. The tensile storage elastic modulus E' of the base material layer 6 at 20 ° C was determined by dynamic viscoelasticity measurement of the base material layer 6 at a frequency of 1 Hz and a temperature increase rate of 10 ° C / minute.

At least one of the requirements of (1) elongation at break of 100% or more, (2) tensile strength of 20 N/20 mm or less, and (3) tensile storage elastic modulus E' of 2,000 MPa or less are satisfied. Preferably, it is preferably two or more elements, more preferably three elements, and the base material layer 6 has excellent flexibility and excellent stretchability.

The thickness of the base material layer 6 is, for example, 1 μm or more, preferably 5 μm or more, and is, for example, 95 μm or less, preferably 50 μm or less, and more preferably 10 μm or less.

The wiring layer 7 is embedded in the substrate groove 12. Specifically, the wiring layer 7 is embedded in the upper portion of the base material layer 6 such that its upper surface is exposed from the base material layer 6. The upper surface of the wiring layer 7 forms the upper surface of the substrate 2 together with the upper surface of the substrate layer 6.

The wiring layer 7 has a wiring pattern electrically connecting the interposer 3 to the connection portion 9 or the battery 70 (described below). Specifically, the wiring layer 7 includes the first signal wiring pattern 21 , the second signal wiring pattern 22 , the first power source wiring pattern 23 , and the second power source wiring pattern 24 .

The first signal wiring pattern 21 electrically connects the interposer 3 and the connection portion 9. The first signal wiring pattern 21 is disposed on one side in the longitudinal direction of the base material layer 6 . The first signal wiring pattern 21 includes a first substrate signal terminal 21A and a first signal wiring 21B connected to the first substrate signal terminal 21A.

The first substrate signal terminal 21A is disposed in the electronic component region 14 . Specifically, the first base material signal terminal 21A is disposed at one end portion in the longitudinal direction of the central portion of the electronic component region 14 in the short-side direction.

The first signal line 21B extends from the one end portion in the longitudinal direction of the base material layer 6 toward the other side in the longitudinal direction, and is turned toward the center portion in the longitudinal direction of the base material layer 6 and extends toward the side in the short side direction. One end of the first signal wiring 21B is connected to the first base material signal terminal 21A, and the other end is connected to the connection portion 9 located at one end portion of the base material layer 6 in the longitudinal direction.

The second signal wiring pattern 22 electrically connects the interposer 3 and the connection portion 9. The second signal wiring patterns 22 are arranged on the other side in the longitudinal direction of the first signal wiring pattern 21 with a space therebetween. The second signal wiring pattern 22 includes a second substrate signal terminal 22A and a second signal wiring 22B connected to the second substrate signal terminal 22A.

The second substrate signal terminal 22A is disposed in the electronic component region 14 . Specifically, the second base material signal terminal 22A is disposed at the other end portion in the longitudinal direction of the central portion of the electronic component region 14 in the short-side direction.

The second signal wiring 22B extends from the other end portion of the base material layer 6 in the longitudinal direction toward the longitudinal direction, and is turned toward the central portion in the longitudinal direction of the base material layer 6 and extends toward the short side direction. One end of the second signal wiring 22B is connected to the second substrate signal terminal 22A, and the other end thereof is connected to the connection portion 9 located at the other end portion of the base material layer 6 in the longitudinal direction.

The first power supply wiring pattern 23 electrically connects the interposer 3 and the battery 70. The first power supply wiring pattern 23 is disposed at the center in the longitudinal direction of the base material layer 6 . The first power supply wiring pattern 23 includes a first base material power supply terminal 23A, a first battery power supply terminal 23C, and a first power supply wiring 23B that connects the first base material power supply terminal 23A and the first battery power supply terminal 23C. .

The first substrate power supply terminal 23A is disposed in the electronic component region 14 . Specifically, the first base material power supply terminal 23A is disposed at the other end portion in the short-side direction of the central portion in the longitudinal direction of the electronic component region 14 .

The first battery power terminal 23C is disposed in the battery region 15 . Specifically, the first battery power supply terminal 23C is disposed on the other side in the short-side direction of the central portion of the base material layer 6 in the longitudinal direction.

The first power supply wiring 23B linearly extends from one side in the short side direction of the base material layer 6 toward the other side in the short side direction. One end of the first power supply wiring 23B is connected to the first base material power supply terminal 23A, and the other end thereof is connected to the first battery power supply terminal 23C.

The second power supply wiring pattern 24 electrically connects the interposer 3 and the battery 70. The second power supply wiring pattern 24 is disposed at the center in the longitudinal direction of the base material layer 6 and is disposed at the other side in the longitudinal direction of the first power supply wiring pattern 23 with a space therebetween. The second power supply wiring pattern 24 includes a second base material power supply terminal 24A, a second battery power supply terminal 24C, and a second power supply wiring 24B that connects the second base material power supply terminal 24A and the second battery power supply terminal 24C. .

The second substrate power supply terminal 24A is disposed in the electronic component region 14 . Specifically, the second base material power supply terminal 24A is disposed at the other end portion in the short-side direction of the central portion of the electronic component region 14 in the longitudinal direction, and is disposed at the distance from the first base material power supply terminal 23A in the longitudinal direction. side.

The second battery power terminal 24C is disposed in the battery region 15. Specifically, the second battery power supply terminal 24C is disposed on the other side in the short-side direction of the center portion of the base material layer 6 in the longitudinal direction, and is disposed at the distance from the first battery power supply terminal 23C in the longitudinal direction. side.

The second power supply wiring 24B linearly extends from one side in the short side direction of the base material layer 6 toward the other side in the short side direction. One end of the second power supply wiring 24B is connected to the second base material power supply terminal 24A, and the other end thereof is connected to the second battery power supply terminal 24C.

Each terminal of the wiring layer 7 (the first base material signal terminal 21A, the second base material signal terminal 22A, the first base material power supply terminal 23A, the second base material power supply terminal 24A, the first battery power supply terminal 23C, and the second battery Each of the power supply terminals 24C) has a substantially rectangular shape (pad shape) in plan view.

Further, the first substrate signal terminal 21A, the second substrate signal terminal 22A, the first substrate power terminal 23A, and the second substrate power source terminal 24A, which are disposed at the terminals of the electronic component region 14, are configured to be mounted on the interposer 3 The interposer side substrate terminal 25.

Examples of the material of the wiring layer 7 include conductors such as copper, nickel, gold, and the like. As a material of the wiring layer 7, copper is preferable.

The thickness of the wiring layer 7 is, for example, thinner than the thickness of the base material layer 6. Specifically, the thickness of the wiring layer 7 is, for example, 0.1 μm or more, preferably 1 μm or more, and is, for example, 100 μm or less, or preferably 50 μm or less.

As shown in FIG. 7, the probe 8 is in contact with the skin 80 when the pressure-sensitive adhesive layer 5 is attached to the skin 80, and senses an electrical signal from the living body or an electrode of temperature, vibration, sweat, metabolite, or the like ( Biological electrode). The probe 8 is embedded in the pressure-sensitive adhesive layer 5 so as to be exposed to the lower surface of the layer 5 by the self-inductance. That is, the probe 8 is fitted inside the first opening 11 and is fitted into the first groove 10 in the pressure-sensitive adhesive layer 5. Further, the probe 8 is disposed on the lower surface of the pressure-sensitive adhesive layer 5 on which the first groove 10 is formed. The probe 8 forms the lower surface of the substrate 2 together with the pressure-sensitive adhesive layer 5. The probe 8 has a mesh shape, and preferably has a substantially grid shape (or a substantially mesh shape) in plan view. Further, as shown in FIG. 10A, the outer side of the side surface of the probe 8 is formed to pass through the imaginary circles in a plan view.

The material of the probe 8 is exemplified as a material (specifically, a conductor) exemplified in the wiring layer 7. The outer dimension of the probe 8 is set to an imaginary circle passing through the outer side surface 16 so as to overlap the inner peripheral surface of the first opening portion 11 in plan view.

As shown in FIGS. 1 to 3, the connecting portion 9 is provided corresponding to the second opening portion 13 and the first opening portion 11, and has the same shape as the above. The connection portion 9 penetrates (passes) the base material layer 6 and the pressure-sensitive adhesive layer 5 in the vertical direction, and is filled in the second opening portion 13 and the first opening portion 11. The connecting portion 9 has a circular shape in plan view along the outer side 16 of the probe 8 as shown in FIG. 10B. Specifically, the connecting portion 9 has a substantially cylindrical shape in which the axis extends in the up and down direction (along the imaginary circle passing through the outer side surface 16).

The inner side of the connecting portion 9 is in contact with the outer side 16 of the probe 8. The connection portion 9 is pressure-sensitive to the pressure-sensitive adhesive layer 5 on the outer side of the first opening portion 11 and the pressure-sensitive adhesive layer 5 and the inner side of the first opening portion 11. Moreover, the connection portion 9 is in contact with the base material layer 6 on the outer side of the second opening portion 13 and the base material layer 6 on the inner side of the second opening portion 13.

The upper surface of the connecting portion 9 is flush with the upper surface of the base material layer 6. The lower surface of the connecting portion 9 is flush with the lower surface of the pressure-sensitive adhesive layer 5.

As shown in FIG. 1 to FIG. 3, the connection portion 9 of the two connection portions 9 on the side in the longitudinal direction is connected to one end edge of the first signal wiring 21B in the longitudinal direction at the upper end portion thereof. The connection portion 9 located on the other side in the longitudinal direction is connected to the other end edge of the second signal wiring 22B in the longitudinal direction at the upper end portion thereof. That is, the connection portion 9 is electrically connected to the wiring layer 7.

Thereby, the connection portion 9 electrically connects the wiring layer 7 and the probe 8.

The material of the connection portion 9 is, for example, a metal or a conductive resin (including a conductive polymer), and a conductive resin or the like is preferably used.

Further, the connection portion 9 and the wiring layer 7 constitute a base circuit portion 26 that electrically connects the probe 8 to the interposer 3 . In other words, the base material circuit portion 26 has the wiring layer 7 disposed on the upper surface of the base material 2 and the connecting portion 9 passing through the base material 2 in the vertical direction.

(Intermediate Layer) The interposer 3 electrically connects a plurality of electronic components 4 and the wiring layer 7, and is interposed between the plurality of electronic components 4 and the wiring layer 7, and is electrically connected thereto.

The interposer 3 is disposed in the electronic component region 14 as shown in FIGS. 1 and 4A to 5B. The interposer 3 is formed in a substantially rectangular shape in plan view. The interposer 3 has flexibility (flexibility). As shown in FIGS. 6A to 6B, the interposer 3 has a support substrate 31, a lower wiring layer 32 disposed on the lower surface of the support substrate 31, a wiring layer 33 disposed on the upper surface of the support substrate 31, and a wiring layer 33. The via portions 34 are electrically connected.

The support substrate 31 has a flat plate shape having a substantially rectangular shape in plan view, and forms an outer shape of the interposer 3. The support substrate 31 is formed with a plurality of through holes corresponding to the plurality of through hole portions 34.

As a material of the support substrate 31, for example, a flexible insulator is exemplified. Examples of such a material include a polyimide-based resin, a polyamidoximine-based resin, an acrylic resin, a polyether nitrile resin, a polyether oxime resin, and a polyethylene terephthalate resin. A synthetic resin such as a polyethylene naphthalate resin or a polyvinyl chloride resin is preferably a polyimide resin.

Further, in addition to the above synthetic resin, the support substrate 31 also includes a metal thin film (for example, a stainless steel foil) having an insulating layer laminated on its surface.

Preferably, the support substrate 31 is a polyimide substrate formed of a polyimide resin.

The thickness of the support substrate 31 is, for example, 5 μm or more, preferably 10 μm or more, and is, for example, 2 mm or less, preferably 1 mm or less.

The lower wiring layer 32 has a lower terminal (substrate side relay terminal) 35 and a lower wiring 36 as indicated by a broken line in FIG. 5B.

The lower terminal 35 has a plurality of (two) relay signal terminals 37 and a plurality of (two) relay power supply terminals 38.

The plurality of relay signal terminals 37 have a first relay signal terminal 37A and a second relay signal terminal 37B.

The first relay signal terminal 37A is disposed at one end portion in the longitudinal direction of the central portion of the interposer 3 in the short-side direction. The first relay signal terminal 37A is connected to one end of the first lower wiring 36A (described later). The first relay signal terminal 37A is electrically connected to the first base material signal terminal 21A via a conductive bonding material (described later).

The second relay signal terminal 37B is disposed at the other end portion in the longitudinal direction of the central portion of the interposer 3 in the short-side direction. The second relay signal terminal 37B is connected to one end of the second lower wiring 36B (described later). The second relay signal terminal 37B is electrically connected to the second base material signal terminal 22A via a conductive bonding material.

The plurality of relay power supply terminals 38 have a first relay power supply terminal 38A and a second relay power supply terminal 38B.

The first relay power supply terminal 38A is disposed at the other end portion of the interposer 3 in the short side direction. The first relay power supply terminal 38A is connected to one end of the third lower wiring 36C. The first relay power supply terminal 38A is electrically connected to the first base material power supply terminal 23A via a conductive bonding material.

The second relay power supply terminal 38B is disposed at the other end in the short-side direction of the interposer 3, and is disposed on the other side in the longitudinal direction of the first relay power supply terminal 38A. The second relay power terminal 38B is connected to one end of the fourth lower wiring 36D. The second relay power supply terminal 38B is electrically connected to the second base material power supply terminal 24A via a conductive bonding material.

The terminals (the relay signal terminal 37 and the relay power supply terminal 38) forming the lower terminal 35 have a substantially rectangular shape (pad shape) in plan view.

The lower wiring 36 has a first lower wiring 36A, a second lower wiring 36B, a third lower wiring 36C, and a fourth lower wiring 36D.

The first lower wiring 36A electrically connects the first relay signal terminal 37A and the first through hole 34A (described later). Specifically, one end of the first lower wiring 36A is connected to the first relay signal terminal 37A, and the other end thereof is connected to the first through hole 34A.

The second lower wiring 36B electrically connects the second relay signal terminal 37B and the second through hole 34B (described later). Specifically, one end of the second lower wiring 36B is connected to the second relay signal terminal 37B, and the other end thereof is connected to the second through hole 34B.

The third lower wiring 36C electrically connects the first relay power supply terminal 38A to the third through hole 34C (described later) and the fourth through hole 34D (described later). Specifically, one end of the third lower wiring 36C is connected to the first relay electric ground terminal 38A, and the other end thereof is connected to the third through hole 34C. Further, the intermediate portion and the fourth through hole 34D are connected. connection.

The fourth lower wiring 36D electrically connects the second relay power supply terminal 38B to the fifth through hole 34E (described later) and the sixth through hole 34F (described later). Specifically, one end of the fourth lower wiring 36D is connected to the second relay power terminal 38B, and the other end thereof is connected to the fifth through hole 34E, and the intermediate portion and the sixth through hole 34F are provided at the intermediate portion. connection.

As shown by the solid line in FIG. 5B, the upper wiring layer 33 has an upper terminal (electronic component side relay terminal) 39 and an upper wiring 40.

The upper terminal 39 has a plurality of (eight) first upper terminals 41, a plurality of (four) second upper terminals 42, and a plurality of (four) third upper terminals 43.

The plurality of first upper terminals 41 are provided on the upper surface of the interposer 3 so as to correspond to a plurality of (eight) first component terminals 54 (described below) of the first electronic component 51. Specifically, the plurality of first upper terminals 41 have the first upper terminal A (41A), the first upper terminal B (41B), the first upper terminal C (41C), the first upper terminal D (41D), and the first The upper terminal E (41E), the first upper terminal F (41F), the first upper terminal G (41G), and the first upper terminal H (41H).

The plurality of second upper terminals 42 are provided on the upper surface of the interposer 3 so as to correspond to a plurality of (four) second component terminals 55 (described below) of the second electronic component 52. Specifically, the plurality of second upper terminals 42 include a second upper terminal A (42A), a second upper terminal B (42B), a second upper terminal C (42C), and a second upper terminal D (42D).

The plurality of third upper terminals 43 are provided on the upper surface of the interposer 3 so as to correspond to a plurality of (four) third component terminals 56 (described below) of the third electronic component 53. Specifically, the plurality of third upper terminals 43 include a third upper terminal A (43A), a third upper terminal B (43B), a third upper terminal C (43C), and a third upper terminal D (43D).

Each of the first upper terminal 41, the second upper terminal 42, and the third upper terminal 43 has a substantially rectangular shape (pad shape) in plan view.

The upper wiring 40 has the first upper wiring 40A, the second upper wiring 40B, the third upper wiring 40C, the fourth upper wiring 40D, the fifth upper wiring 40E, the sixth upper wiring 40F, the seventh upper wiring 40G, and the eighth upper wiring. 40H, ninth upper side wiring 40I.

The first upper wiring 40A electrically connects the first upper terminal A (41A) and the first through hole 34A (described later). Specifically, one end of the first upper wiring 40A is connected to the first upper terminal A (41A), and the other end thereof is connected to the first through hole 34A.

The second upper wiring 40B electrically connects the first upper terminal B (41B) and the second through hole 34B (described later). Specifically, one end of the second upper wiring 40B is connected to the first upper terminal B (41B), and the other end thereof is connected to the second through hole 34B.

The third upper wiring 40C electrically connects the first upper terminal C (41C) and the second upper terminal D (42D). Specifically, one end of the third upper wiring 40C is connected to the first upper terminal C (41C), and the other end thereof is connected to the second upper terminal D (42D).

The fourth upper wiring 40D electrically connects the first upper terminal D (41D) and the third upper terminal A (43A). Specifically, one end of the fourth upper wiring 40D is connected to the first upper terminal D (41D), and the other end thereof is connected to the third upper terminal A (43A).

The fifth upper wiring 40E electrically connects the first upper terminal E (41E) and the second upper terminal A (42A). Specifically, one end of the fifth upper wiring 40E is connected to the first upper terminal E (41E), and the other end thereof is connected to the second upper terminal A (42A).

The sixth upper wiring 40F electrically connects the first upper terminal F (41F) and the third upper terminal B (43B). Specifically, one end of the sixth upper wiring 40F is connected to the first upper terminal F (41F), and the other end thereof is connected to the third upper terminal B (43B).

The seventh upper wiring 40G electrically connects the first upper terminal G (41G) to the second upper terminal B (42B) or the third through hole 34C. Specifically, one end of the seventh upper wiring 40G is connected to the first upper terminal G (41G), the other end thereof is connected to the second upper terminal B (42B), and the intermediate portion and the third communication are connected. The holes 34C (described below) are connected.

The eighth upper wiring 40H electrically connects the first upper terminal H (41H) and the fifth through hole 34E. Specifically, one end of the eighth upper wiring 40H is connected to the first upper terminal H (41H), and the other end thereof is connected to the fifth through hole 34E.

The ninth upper wiring 40I is electrically connected to the second upper terminal C (42C). The ninth upper wiring 40I has a substantially T-shape in plan view. Specifically, one end portion of the ninth upper wiring 40I extends from the second upper terminal C (42C) toward the other side in the short side direction, and is branched at the other end portion of the interposer 3 in the short side direction, and extends toward both sides in the longitudinal direction. . The ninth upper wiring 40I has a function as an antenna wiring.

The through hole portion 34 penetrates the support substrate 31 in the vertical direction so as to electrically connect the lower wiring layer 32 and the upper wiring layer 33. The through hole portion 34 has a first through hole 34A, a second through hole 34B, a third through hole 34C, a fourth through hole 34D, a fifth through hole 34E, and a sixth through hole 34F.

The first through hole 34A electrically connects the first lower wiring 36A and the first upper wiring 40A. Specifically, the lower end of the first through hole 34A is connected to the other end of the first lower wiring 36A, and the upper end thereof is connected to the other end of the first upper wiring 40A.

The second through hole 34B electrically connects the second lower wiring 36B and the second upper wiring 40B. Specifically, the lower end of the second through hole 34B is connected to the other end of the second lower wiring 36B, and the upper end thereof is connected to the other end of the second upper wiring 40B.

The third through hole 34C electrically connects the third lower wiring 36C and the seventh upper wiring 40G. Specifically, the lower end of the third through hole 34C is connected to the other end of the third lower wiring 36C, and the upper end thereof is connected to the intermediate portion of the seventh upper wiring 40G.

The fourth through hole 34D electrically connects the third lower wiring 36C and the third upper terminal C (43C). Specifically, the lower end of the fourth through hole 34D is connected to the intermediate portion of the third lower wiring 36C, and the upper end thereof is connected to the third upper terminal C (41C).

The fifth through hole 34E electrically connects the fourth lower wiring 36D and the eighth upper wiring 40H. Specifically, the lower end of the fifth through hole 34E is connected to the other end of the fourth lower wiring 36D, and the upper end thereof is connected to the other end of the eighth upper wiring 40H.

The sixth through hole 34F electrically connects the fourth lower wiring 36D and the third upper terminal D (43D). Specifically, the lower end of the sixth through hole 34F is connected to the intermediate portion of the fourth lower wiring 36D, and the upper end thereof is connected to the third upper terminal D (43D).

Each of the first through hole 34A to the third through hole 34F has a substantially circular shape in plan view.

Examples of the material of the lower wiring layer 32, the upper wiring layer 33, and the via hole portion 34 include conductors such as copper, nickel, gold, and the like, and copper is preferable.

The thickness of the lower wiring layer 32 and the upper wiring layer 33 is, for example, 0.1 μm or more, preferably 1 μm or more, and is, for example, 100 μm or less, or preferably 50 μm or less.

Further, the lower wiring layer 32, the upper wiring layer 33, and the via portion 34 constitute a relay circuit portion 44 that electrically connects the wiring layer 7 to the electronic component 4. In other words, the relay circuit unit 44 includes the lower wiring layer 32 disposed on the lower surface of the support substrate 31, the upper wiring layer 33 disposed on the upper surface of the support substrate 31, and the through hole portion passing through the support substrate 31 in the vertical direction. 34.

The bending rigidity of the interposer 3 is, for example, 3.0 × 10 ¹² GPa·μm ⁴ or less, preferably 1.0 × 10 ¹² GPa·μm ⁴ or less, more preferably 5.4 × 10 ¹⁰ GPa·μm ⁴ or less, further preferably 6.0 × Further, 10 ⁶ GPa·μm ⁴ or less is, for example, 7.5 × 10 ² GPa·μm ⁴ or more, preferably 1.0 × 10 ³ GPa·μm ⁴ or more, and more preferably 9.4 × 10 ⁴ GPa·μm ⁴ or more. When the bending rigidity of the interposer 3 is not more than the above-described upper limit, the interposer 3 exhibits flexibility, and when the attached biosensor 1 expands and contracts, the interposer 3 is prevented from falling off from the substrate 2.

The bending rigidity (Z) of the interposer 3 can be calculated by a known method, for example, according to the following formula.

[Number 1]

Ei represents the elastic modulus, Ai represents the cross-sectional area (the cross-sectional area obtained by the product of the width bi and the thickness hi), Gi represents the center of gravity coordinate, bi represents the width, and hi represents the thickness. The elastic modulus is determined by measuring at a tensile speed of 300 mm/min using, for example, a tensile compression tester (manufactured by TA Instruments, "Model RSA-G2"). Furthermore, the bending rigidity of the interposer 3 can also approximate the bending rigidity of the support substrate 31.

The size of the interposer 3 in plan view is appropriately set in accordance with the size of the electronic component 4. That is, the interposer 3 is set to have a size (plan view) in which all of the plurality of electronic components 4 can be mounted. Specifically, the length of the interposer 3 in the longitudinal direction is, for example, 5 mm or more, preferably 10 mm or more, and is, for example, 60 mm or less, preferably 40 mm or less. The length of the interposer 3 in the short-side direction is, for example, 4 mm or more, preferably 8 mm or more, and is, for example, 50 mm or less, preferably 30 mm or less. The thickness of the interposer 3 is, for example, 0.1 mm or more, preferably 0.2 mm or more, and is, for example, 3 mm or less, preferably 2 mm or less.

(Electronic Component) A plurality of (three) electronic components 4 include a first electronic component 51, a second electronic component 52, and a third electronic component 53 as shown in FIGS. 1 and 4A to 4B.

The first electronic component 51 is, for example, an analog front end element, and has a box shape having a substantially rectangular shape in plan view. The first electronic component 51 has a plurality of (eight) first component terminals 54 (54A to 54H) on its lower surface as indicated by a broken line in FIG. 4A.

The second electronic component 52 is, for example, a memory element, and has a box shape having a substantially rectangular shape in plan view. The second electronic component 52 has a plurality of (four) second component terminals 55 (55A to 55D) on its lower surface.

The third electronic component 53 is, for example, a wireless communication element, and has a box shape having a substantially rectangular shape in plan view. The third electronic component 53 has a plurality of (four) third component terminals 56 (56A to 56D) on its lower surface.

Each of the first component terminal 54, the second component terminal 55, and the third component terminal 56 has a substantially rectangular shape (pad shape) in plan view.

The dimensions of each of the electronic components (51 to 53) in plan view are not limited as long as the total area in the plan view is smaller than the area of the intermediate layer 3 in plan view. Specifically, the length of each electronic component (51 to 53) in the longitudinal direction is, for example, 0.2 mm or more, preferably 0.3 mm or more, and is, for example, 10 mm or less, preferably 8 mm or less. The length of each electronic component in the short-side direction is, for example, 0.1 mm or more, preferably 0.2 mm or more, and is, for example, 8 mm or less, preferably 6 mm or less. The thickness of each electronic component is, for example, 0.02 mm or more, preferably 0.03 mm or more, and is, for example, 2 mm or less, preferably 1 mm or less.

2. Method of Manufacturing Attached Biosensor The method of manufacturing the attached biosensor 1 will be described with reference to Figs. 8A to 9G.

The biosensor 1 includes, for example, a preparation step of preparing the substrate 2, the interposer 3, and the plurality of electronic components 4, a first mounting step of mounting the plurality of electronic components 4 on the interposer 3, and an electronic component attached thereto. The interposer 60 is attached to the second mounting step of the substrate 2 to be manufactured.

(Preparation Step) First, the substrate 2 was prepared in accordance with Figs. 8A to 8D.

To prepare the substrate 2, first, as shown in FIG. 8A, the substrate layer 6 and the wiring layer 7 are prepared. For example, the substrate layer 6 and the wiring layer 7 are prepared by embedding the wiring layer 7 in the substrate groove 12 by the method described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. .

Then, as shown in FIG. 8B, the pressure-sensitive adhesive layer 5 is disposed on the lower surface of the substrate layer 6. In order to arrange the pressure-sensitive adhesive layer 5, for example, first, a coating liquid containing a material of the pressure-sensitive adhesive layer 5 is prepared, and then a coating liquid is applied onto the upper surface of the release sheet 19, after which it is dried by heating. . Thereby, the pressure-sensitive adhesive layer 5 is placed on the upper surface of the release sheet 19.

Then, the pressure-sensitive adhesive layer 5 and the base material layer 6 are bonded together by, for example, a bonding machine. Specifically, the upper surface of the pressure-sensitive adhesive layer 5 is brought into contact with the lower surface of the substrate layer 6.

In this case, each of the base material layer 6 and the pressure-sensitive adhesive layer 5 does not include each of the second opening portion 13 and the first opening portion 11 (opening portion 17) (see FIG. 8C).

As shown in FIG. 8C, the opening portion 17 is then formed on the base material layer 6 and the pressure-sensitive adhesive layer 5.

The opening portion 17 penetrates the base material layer 6 and the pressure-sensitive adhesive layer 5 . The opening 17 is a hole (through hole) having a substantially circular shape in plan view which is defined by dividing the outer circumferential surface of the second opening 13 and the outer circumferential surface of the first opening 11 . The opening 17 is opened toward the upper side. On the other hand, the lower end of the opening portion 17 is closed by the peeling piece 19.

In order to form the opening 17, the pressure-sensitive adhesive layer 5 and the base material layer 6 are subjected to, for example, punching and half etching.

Then, as shown in FIG. 10A, the probe member 18 is prepared, and the probe member 18 is fitted into the opening portion 17.

In order to prepare the probe member 18, a probe sheet is prepared, and the probe-containing sheet is subjected to outer shape processing by punching or the like.

The probe member 18 has a substantially circular shape in plan view. The probe member 18 includes a probe 8, a pressure-sensitive adhesive layer 5 in which the probe 8 is embedded, and a base material layer 6 disposed on the upper surface of the pressure-sensitive adhesive layer 5.

The probe-containing sheet is prepared by the method described in, for example, Japanese Patent Laid-Open Publication No. Hei. No. Hei.

Thereafter, as shown by the arrow in Fig. 8C, the probe member 18 is fitted into the opening portion 17.

At this time, the pressure-sensitive adhesive layer 5 and the base material layer 6 around the pressure-sensitive adhesive layer 5 of the probe member 18, the base material layer 6, the probe 8, and the opening portion 17 are spaced apart from each other. That is, the probe member 18 is fitted into the opening 17 to form the second opening 13 and the first opening 11.

Thereafter, as shown in FIG. 8D, the connecting portion 9 is provided in the second opening portion 13 and the first opening portion 11.

Specifically, when the material of the connection portion 9 is a conductive resin composition, the conductive resin composition (conductive composition liquid) is injected (or applied) to the second opening portion 13 and the first opening portion 11 . Thereafter, the conductive resin composition (conductive composition liquid) is heated, the solvent is removed, and the binder resin is crosslinked by a crosslinking agent.

Thereby, the laminated body 28 for biological sensors provided with the base material 2 and the peeling sheet 19 is manufactured. Furthermore, the laminated body 28 for a living body sensor does not have the electronic component 4 (or even the battery 70), that is, it is not the attached biological sensor 1, but is used to manufacture the attached biological sensor 1 Intermediate part.

On the other hand, a known one can be used for the interposer 3 and the plurality of electronic components 4.

(First Mounting Step) In the first mounting step, as shown in FIG. 9E, a plurality of electronic components 4 are mounted on the interposer 3.

That is, a plurality of electronic components 4 are flip-chip mounted on the upper surface of the interposer 3 such that the upper terminal 39 of the interposer 3 corresponds to the terminals of the plurality of electronic components 4. Specifically, as shown in FIG. 4B, each of the first upper terminals 41 (41A to 41H), the second upper terminals 42 (42A to 42D), and the third upper terminals 43 (43A to 43D) corresponds to the first one. The first electronic component 51, the second electronic component 52, and the first of the component terminals 54 (54A to 54H), the second component terminals 55 (55A to 55D), and the third component terminals 56 (56A to 56D) The electronic component 53 is disposed on the upper surface of the interposer 3 .

At this time, the conductive bonding material 61 is disposed between the upper terminal 39 of the interposer 3 and the terminals (54, 55, 56) of the plurality of electronic components 4.

Examples of the material of the conductive bonding material 61 include solder, a conductive paste, and the like.

Thereby, each of the first upper terminal 41 (41A to 41H), the second upper terminal 42 (42A to 42D), and the third upper terminal 43 (43A to 43D) is electrically connected to each other via the conductive bonding material 61. Each of the first component terminals 54 (54A to 54H), the second component terminals 55 (55A to 55D), and the third component terminals 56 (56A to 56D). That is, between the interposer 3 and the plurality of electronic components 4, a plurality of (16) electronic component-side electrical connection points (part connection points) 62 including the conductive bonding material 61 are present.

The plurality of component connection points 62 have substantially the same shape, and each of the areas S _{A is,} for example, 100 μm ² or more, preferably 400 μm ² or more, and further, for example, 0.25 mm ² or less, preferably 0.16 mm ² or less.

Further, the area S _{A of the} component connection point 62 is a plan view and a bottom view as enlarged with reference to FIG. 6A, and shows a plan view area of the contact interface between the conductive bonding material 61 and the upper terminal 39, or the conductive bonding material 61 and the electron. The look-up area in the contact interface of the terminals (54, 55, 56) of the part 4. The top view area and the bottom view area are substantially the same as each other, and may be any one area, but in the case of the difference, the smaller area is indicated.

Thereby, as shown in FIG. 9F, the interposer 60 having the interposer 3 and the accompanying electronic components of the plurality of electronic components 4 mounted on the interposer 3 is obtained.

Further, in the interposer 60 with electronic components, the first relay signal terminal 37A and the second relay signal terminal 37B pass through the lower wiring 36, the lower terminal 35, the through hole portion 34, the upper wiring 40, and the upper side, respectively. The terminal 39 and the component connection point 62 are electrically connected to all of the electronic components 4 (51, 52, 53). On the other hand, the first relay power supply terminal 38A and the second relay power supply terminal 38B pass through the lower wiring 36, the lower terminal 35, the through hole portion 34, the upper wiring 40, the upper terminal 39, and the component connection point 62, respectively. It is electrically connected to all electronic components 4 (51, 52, 53).

Further, one of the terminals of each of the first electronic component 51, the second electronic component 52, and the third electronic component 53 is grounded. Specifically, the first component terminal G (54G), the second component terminal B (55B), and the third component terminal C (56C) are grounded.

(Second Mounting Step) In the second mounting step, as shown in FIG. 9G, the interposer 60 with the electronic component is attached to the substrate 2 of the laminated body 28 for a biosensor.

In other words, the interposer 60 with an electronic component is flip-chip mounted on the upper surface of the substrate 2 so that the lower terminal 35 of the interposer 3 corresponds to the interposer-side substrate terminal 25 of the substrate 2. Specifically, the first relay signal terminal 37A, the second relay signal terminal 37B, the first relay power source terminal 38A, and the second relay power source terminal 38B correspond to the first base material signal terminal 21A and the second base material. In the form of the signal terminal 22A, the first substrate power supply terminal 23A, and the second substrate power supply terminal 24A, the interposer 60 with the electronic component is placed in the electronic component region 14 of the substrate 2.

At this time, the conductive bonding material 61 is disposed between the lower terminal 35 of the interposer 3 and the interposer side substrate terminal 25 of the substrate 2.

The material of the conductive bonding material 61 is the same as that of the above-described conductive bonding material 61 in the first mounting step.

Thereby, the first relay signal terminal 37A, the second relay signal terminal 37B, the first relay power source terminal 38A, and the second relay power source terminal 38B are electrically connected to the first substrate via the conductive bonding material 61. The signal terminal 21A, the second substrate signal terminal 22A, the first substrate power source terminal 23A, and the second substrate power source terminal 24A. That is, between the interposer 3 and the substrate 2, a plurality of (four) substrate-side electrical connection points (substrate connection points) 64 including the conductive bonding material 61 are present.

The plurality of substrate connection points 64 are substantially identical in shape to one another, and each of the areas S _{B is} greater than a plurality of part connection points 62. Specifically, the area S _{B of the} substrate connection point 64 is, for example, 2500 μm ² or more, preferably 10000 μm ² or more, and is, for example, 1.00 mm ² or less, preferably 0.25 mm ² or less.

Further, the area S _B of the substrate connection point 64 is a plan view and a bottom view of the contact interface between the conductive bonding material 61 and the interposer-side substrate terminal 25, as shown in the enlarged plan view and the bottom view of FIG. 6A. The look-up area in the contact interface between the bonding material 61 and the lower terminal 35. The top view area and the bottom view area are substantially the same as each other, and any area may be used, but in the case of the different cases, the area of the smaller one is indicated.

Thereby, the attached biosensor 1 including the base material 2, the interposer 3, the plurality of electronic components 4, and the release sheet 19 is obtained. In other words, the attached biosensor 1 includes a release sheet 19, a substrate 2 disposed on the upper surface of the release sheet 19, an interposer 3 attached to the upper surface of the substrate 2, and an interposer 3 attached thereto. a plurality of electronic parts 4 on the upper surface.

In the attached biological sensor 1, the number of substrate connection points 64 of the substrate 2 and the interposer 3 is the same as or less than the number of the part connection points 62 of the plurality of electronic parts 4 and the interposer 3. Quantity. Preferably, the number of substrate attachment points 64 (four in Figure 4B) is less than the number of part connection points 62 (16 in Figure 4B).

Further, each area S _B in the substrate connection point 64 is larger than each area S _A in the part connection point 62. That is, a plurality of substrates 64 for each connection point of a plurality of area S _B is greater than the point of connection 64 parts per one area S _A.

3. Method of Using the Attached Biosensor The method of using the attached biosensor 1 will be described with reference to Figs. 1, 3 and 7.

In order to use the attached biosensor 1 , first, the battery 70 is mounted on the attached biosensor 1 as shown by the imaginary line in FIG. 1 .

The battery 70 has a disk shape. The battery 70 has two terminals (a positive electrode terminal and a negative electrode terminal: not shown) provided on the lower surface thereof. The thickness of the battery 70 is, for example, 1 μm or more, preferably 10 μm or more, and is, for example, 1000 μm or less, preferably 100 μm or less.

In order to mount the battery 70 on the attached biosensor 1 , the battery 70 is placed in the battery region 15 , and the two terminals of the battery 70 and the first battery power terminal 23C and the second battery of the substrate 2 are used. The power terminal 24C is electrically connected. At this time, the lower surface of the battery 70 is brought into contact with the upper surface of the substrate layer 6.

Then, the release sheet 19 (see the arrow and the imaginary line of FIG. 3) is peeled off from the base material 2.

Then, the lower surface of the substrate 2 is brought into contact with the skin 80 as an example of the surface of the living body as shown in FIG. Specifically, the pressure-sensitive adhesive layer 5 is pressure-sensitive to the surface of the skin 80. Thereby, the probe 8 is in contact with the surface of the skin 80.

Thereafter, the probe 8, the substrate circuit portion 26 (the connection portion 9 and the wiring layer 7), the relay circuit portion 44 (the lower wiring layer 32, the upper wiring layer 33, and the via portion 34), and the electronic components are used. 4. Sensing the organism.

Specifically, the probe 8 senses an electrical signal from the living body, and the electrical signal sensed by the probe 8 passes through the substrate circuit portion 26 (the connection portion 9, the wiring layer 7), the substrate connection point 64, and the relay. The circuit portion 44 (the lower wiring layer 32, the upper wiring layer 33, the via portion 34), and the component connection point 62 are input to a plurality of electronic components 4. The electronic component 4 processes the electrical signal based on the power supplied from the battery 70 and serves as an information memory. Further, if necessary, the electrical signal is converted into a radio wave, and the radio wave is wirelessly transmitted to an external receiver.

More specifically, the operation of the first electronic component 51, the second electronic component 52, and the third electronic component 53 in the electronic component 4 is as follows. When the attached biosensor 1 is an attached electrocardiograph (described below), the change in the potential of the heart obtained by the probe 8 is converted into digital data by using the first electronic component 51 as an analog front end component. The change in the potential of the heart is recorded in the third electronic component 53 as a memory element. As an example, the potential change of the heart is recorded in the third electronic component 53 at a data rate of 16 bits and 1 kHz. On the other hand, the second electronic component 52, which is a wireless communication device, wirelessly transmits the recorded data from the ninth upper wiring 40I serving as the antenna wiring to the outside.

4. Effect of the attached biological sensor 1 The attached biological sensor 1 has a substrate 2, an interposer 3 disposed on the upper side of the substrate 2, and a substrate 2 and an interposer. A plurality of electronic parts 4 on the upper side of 3. Moreover, the base material 2 is provided with the pressure sensitive adhesive layer 5, the base material layer 6, and the wiring layer 7. Further, a plurality of electronic components 4 are electrically connected to the wiring layer 7 of the substrate 2 via the interposer 3 .

According to the attached biosensor 1 , a plurality of electronic components 4 are mounted on the interposer 3 to form an interposer 60 with electronic components, and then the interposer 60 with electronic components is mounted on the substrate 2 . A plurality of electronic components 4 are attached to the substrate 2 via the interposer 3 . Therefore, it is not necessary to directly mount a plurality of smaller electronic components 4 on the stretchable substrate 2 (material that is difficult to mount), and a plurality of electronic components 4 can be reliably attached to the substrate 2 via the interposer 3 . Moreover, since the interposer 3 having a plan view larger than the electronic component 4 is attached to the substrate 2, it can be mounted more reliably. As a result, when the attached biosensor 1 is attached to the skin 80, the fall of the plurality of electronic components 4 can be suppressed.

Further, each of the areas of the attachment type biosensor 1 in the substrate connection point 64 is larger than the area in the part connection point 62.

Therefore, the strength of the base material connection point 64 of the base material 2 which is likely to cause a load due to expansion and contraction is higher than that of the component connection point 62. Therefore, peeling of the base material 2 and the interposer 3 can be suppressed, and even if the attached biosensor 1 expands and contracts, the fall of the electronic component 4 attached to the interposer 3 can be suppressed.

Further, in the attached type biosensor 1, the number of substrate connection points 64 is smaller than the number of part connection points 62.

Therefore, since the substrate connection point 64 of the substrate 2 which is likely to cause a load due to expansion and contraction is relatively small, connection failure between the substrate 2 and the interposer 3 can be suppressed, and connection failure between the substrate 2 and the electronic component 4 can be suppressed. .

Further, in the attached biosensor 1 , the interposer 3 has flexibility.

Therefore, the interposer 3 can be softly deformed in shape according to the action or change of the substrate 2. For example, as shown in FIG. 11, when the substrate 2 is convexly deformed toward the upper side in response to the action of the skin 80, the interposer 3 can also be deformed convexly following the substrate 2 to the upper side, thereby preventing the substrate 2 from being deformed. The upper surface presses the lower surface of the interposer 3 to the upper side. Thereby, the interposer 3 can be prevented from falling off from the substrate 2.

Further, in use, since the skin 80 can be prevented from interfering with the interposer 3 or the hard member (electronic component or the like) via the substrate 2, the wearing feeling is excellent.

The attached biosensor 1 is not particularly limited as long as it can sense the state of the bioelectrical signal monitoring organism, and specifically, a patch-type electrocardiograph or a patch type is used. EEG, attached sphygmomanometer, attached pulse rate meter, attached type electromyography, attached thermometer, attached accelerometer, etc. Moreover, the devices may be separate devices or assembled in a single device.

The attached biosensor 1 is preferably used as an attached electrocardiograph. In the attached electrocardiograph, the probe 8 senses the active potential of the heart as an electrical signal.

Further, the living body includes a living body and a living body other than the human body, but is preferably a human body.

<Modifications> In the following various modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. Moreover, each variation can be combined as appropriate. Further, each modification has the same operational effects as those of the embodiment except that it is specifically indicated.

(1) In the patch type biosensor 1 shown in Fig. 1, the interposer 3 has flexibility. For example, although not shown, the interposer 3 may not have flexibility. That is, the interposer 3 has rigidity.

Examples of the material of the support substrate 31 having the rigid interposer 3 include hard materials such as enamel, glass, and glass epoxy. It is preferable that the interposer 3 has flexibility depending on the viewpoint of the suppression of the release of the interposer 3 at the time of use and the wearability.

(2) In the attached biosensor 1 shown in Fig. 1, a plurality of electronic components 4 are provided with three electronic components (51, 52, 53). However, for example, although not shown, the number of electronic components is also There is no limitation, and it may be one or plural (two or four or more). Further, the type of the electronic component is not limited, and may be an element having at least two functions of an analog front end element, a memory element, and a wireless communication element, or an electronic component other than the above (such as a microcomputer).

Further, the number of the substrate connection points 64 and the component connection points 62 is not limited as long as the number of the substrate connection points 64 is equal to or less than the number of the component connection points 62. The number of the substrate connection points 64 is, for example, 1 or more, preferably 2 or more, and is, for example, 10 or less, preferably 5 or less, and more preferably 3 or less. The number of the component connection points 62 is, for example, 2 or more, preferably 6 or more, and is, for example, 20 or less, preferably 10 or less.

(3) The attached biosensor 1 shown in the solid line of FIG. 1 and FIG. 6A is electrically bonded to the interposer 3 via the conductive bonding material 61, but may be, for example, As shown in the imaginary line of FIG. 6A, part or all of the electronic component 4 is further fixed to the interposer 3 by the underfill rubber 90 in addition to the conductive bonding material 61.

As the underfill, for example, a curable resin containing an epoxy resin as a main component is exemplified.

(4) The attached biosensor 1 shown in FIG. 1 and FIG. 6A is mounted on the electronic component 4 and the interposer 3, but for example, as shown in FIG. 12, the electronic component 4 is wired. Engaged and mounted with the interposer 3.

Specifically, the interposer 60 with electronic components includes an interposer 3, a plurality of electronic components 4 (51, 52, 53), and a plurality of bonding wires 91 electrically connected thereto.

One end of the bonding wire 91 is connected to the upper terminal 39 of the interposer 3, and the other end thereof is connected to a plurality of electronic component terminals (54, 55, 56). One end and the other end of the bonding wire 91 are connected to the terminal by, for example, thermocompression bonding or the like.

In the embodiment shown in Fig. 12, the electronic component side electrical connection point 62 is one end of the bonding bonding wire 91 (portion in contact with the upper terminal 39).

Further, as shown in the imaginary line of FIG. 12, the plurality of electronic components 4 and the bonding wires 91 may be sealed by the sealing member 92.

(5) In the embodiment shown in FIG. 1, the electronic component region 14 and the battery region 15 are not overlapped, but the electronic component region 14 may be overlapped with the battery region 15, for example, as shown in FIG. That is, as shown in FIG. 14, the battery 70 may be disposed on the upper side with a plurality of electronic components 4 spaced apart from each other.

In the embodiment shown in FIG. 13, the attached biosensor 1 has a lead portion 95 that electrically connects the wiring layer 7 and the battery 70 as shown in FIG. 13 (and the imaginary line of FIG. 14).

The lead portion 95 has a first lead 95A and a second lead 95B.

The first lead 95A electrically connects the first base material power supply terminal 23A and the battery 70. The first lead 95A is provided to extend in the downward direction, and has a lower end connected to the first power supply wiring 23B and an upper end connected to one terminal of the battery 70.

The second lead 95B electrically connects the second substrate power supply terminal 24A and the battery 70. The second lead 95B is provided to extend in the lower direction, and has a lower end connected to the second power supply wiring 24B and an upper end connected to the other terminal of the battery 70.

Further, the embodiment shown in FIG. 13 has a fixing member (sealing resin or the like: not shown) for arranging the battery 70 on the upper side of the plurality of electronic components 4.

(6) In the embodiment shown in FIGS. 1 and 6A, a plurality of electronic components 4 are disposed on the upper side of the interposer 3. However, as shown in FIG. 15, for example, a plurality of electronic components 4 may be disposed under the interposer 3. side.

The attached biosensor 1 shown in FIG. 15 is provided with a plurality of electronic components 4 mounted on the lower side of the interposer 3. That is, a plurality of electronic components 4 are disposed on the upper side of the substrate 2 and on the lower side of the interposer 3.

In the attached biosensor 1 shown in FIG. 15, the interposer 3 has a support substrate 31, a lower wiring layer 32, an upper wiring layer 33, and a via portion 34, as shown in FIG.

The lower wiring layer 32 includes a substrate-side relay terminal 35 (corresponding to the lower terminal of FIG. 6B in the embodiment of FIG. 1) and an electronic component-side relay terminal 39 (corresponding to the upper terminal of FIG. 6B). And the lower wiring 36. That is, all the terminals mounted on the electronic component 4 and the wiring layer 7 are provided on the lower surface of the support substrate 31.

The lower wiring layer 32 has a plurality of (10) lower wirings 36A to 36J connected from the end portions of the substrate side relay terminal 35 and the electronic component side relay terminal 39.

The upper wiring layer 33 has a plurality of (two) upper wirings 40A, 40B connected to the via portion 34.

The through hole portion 34 has a plurality of (three) through holes 34A to 34C that connect the lower wiring layer 32 and the upper wiring layer 33 in the vertical direction.

Furthermore, the invention is provided by the exemplified embodiments of the invention, but the invention described above is merely illustrative and not to be construed as limiting. Variations of the invention that are apparent to those skilled in the art are included in the scope of the following claims. [Industrial availability]

The attached biosensor of the present invention can be applied to various industrial products, for example, for attaching electrocardiograph, attached electroencephalograph, attached sphygmomanometer, attached pulse rate meter, and attaching Type electromyography, attached thermometer, attached accelerometer, etc.

1‧‧‧ Attached Biosensors

2‧‧‧Substrate

3‧‧‧Intermediary

4‧‧‧Electronic parts

5‧‧‧pressure layer

6‧‧‧Substrate layer

7‧‧‧Wiring layer

8‧‧‧ probe

9‧‧‧Connecting Department

10‧‧‧1st slot

11‧‧‧1st opening

12‧‧‧Substrate trough

13‧‧‧2nd opening

14‧‧‧Electronic parts area

15‧‧‧Battery area

16‧‧‧Outside

17‧‧‧ openings

18‧‧‧ probe components

19‧‧‧ peeling film

21‧‧‧1st signal wiring pattern

21A‧‧‧1st substrate signal terminal

21B‧‧‧1st signal wiring

22‧‧‧2nd signal wiring pattern

22A‧‧‧2nd substrate signal terminal

22B‧‧‧2nd signal wiring

23‧‧‧1st power wiring pattern

23A‧‧‧1st substrate power terminal

23B‧‧‧1st power wiring

23C‧‧‧1st battery power terminal

24‧‧‧2nd power wiring pattern

24A‧‧‧2nd substrate power terminal

24B‧‧‧2nd power wiring

24C‧‧‧2nd battery power terminal

25‧‧‧Interposer side substrate terminal

26‧‧‧Substrate Circuit Department

28‧‧‧Layer for biosensors

31‧‧‧Support substrate

32‧‧‧Under wiring layer

33‧‧‧Upper wiring layer

34‧‧‧Through Hole Department

34A‧‧‧1st through hole

34B‧‧‧2nd through hole

34C‧‧‧3rd through hole

34D‧‧‧4th through hole

34E‧‧‧5th through hole

34F‧‧‧6th through hole

35‧‧‧Substrate side relay terminal

36 (36A~36J)‧‧‧Lower wiring

36A‧‧‧1st lower wiring

36B‧‧‧2nd lower wiring

36C‧‧‧3rd lower wiring

36D‧‧‧4th lower wiring

37‧‧‧Relay signal terminal

37A‧‧‧1st relay signal terminal

37B‧‧‧2nd relay signal terminal

38‧‧‧Relay power terminal

38A‧‧‧1st relay power terminal

38B‧‧‧2nd relay power terminal

39‧‧‧Upper terminal (electronic component side relay terminal)

40‧‧‧Upper wiring

40A‧‧‧1st upper wiring

40B‧‧‧2nd upper wiring

40C‧‧‧3rd upper wiring

40D‧‧‧4th upper wiring

40E‧‧‧5th upper wiring

40F‧‧‧6th upper wiring

40G‧‧‧7th upper wiring

40H‧‧‧8th upper wiring

40I‧‧‧9th upper wiring

41 (41A to 41H) ‧‧1 first upper terminal

42 (42A ~ 42D) ‧ ‧ second upper terminal

43 (43A ~ 43D) ‧ ‧ third upper terminal

44‧‧‧Relay Circuits Department

51‧‧‧1st electronic part

52‧‧‧2nd electronic parts

53‧‧‧3rd electronic part

54 (54A～54H)‧‧‧1st part terminal

55 (55A～55D)‧‧‧2nd part terminal

56 (56A～56D)‧‧‧3rd part terminal

60‧‧‧Intermediary

61‧‧‧Electrical bonding materials

62‧‧‧Electrical parts side electrical connection points

64‧‧‧Substrate side electrical connection points

70‧‧‧Battery

80‧‧‧ skin

91‧‧‧bonding line

92‧‧‧ Sealing material

95‧‧‧ lead parts

95A‧‧‧1st lead

95B‧‧‧2nd lead

Fig. 1 is a plan view showing an embodiment of an attached biosensor of the present invention. Fig. 2 is a plan view showing the substrate of the attached type biosensor shown in Fig. 1. Fig. 3 is a side cross-sectional view taken along line A-A of the attached biosensor shown in Fig. 1. 4A to 4B are enlarged views of the electronic component region of the attached biosensor shown in Fig. 1, and Fig. 4A shows a plan view in which the lower surface of the interposer is omitted, and Fig. 4B shows the interposer. Top view of the lower surface. 5A to 5B are enlarged views of the electronic component region of the attached biosensor shown in Fig. 1, Fig. 5A shows a plan view of only the substrate, and Fig. 5B shows a plan view of only the interposer. 6A to 6B are side cross-sectional views of the attached biosensor shown in Fig. 4A, Fig. 6A is a cross-sectional view taken along line A-A, and Fig. 6B is a cross-sectional view taken along line B-B. Fig. 7 is a side cross-sectional view showing the attached biosensor shown in Fig. 1 attached to the skin. 8A to 8D are manufacturing steps of the attached biosensor shown in Fig. 1. Fig. 8A shows a step of preparing a substrate layer and a wiring layer, and Fig. 8B shows a pressure-sensitive adhesive layer and a substrate layer. In the step of bonding, FIG. 8C shows a step of forming an opening portion and preparing a probe member, and FIG. 8D shows a step of embedding the probe member in the opening portion and a step of forming the connecting portion. 9E to 9G are manufacturing steps of the attached biosensor shown in Fig. 1 after Fig. 8D, and Fig. 9E shows the step of mounting the electronic component on the interposer (step 1), Fig. 9F The step of attaching the interposer to the substrate (second step) is shown, and FIG. 9G shows the step of obtaining the attached biosensor. 10A to 10C are exploded perspective views of the probe member, Fig. 10A shows the probe member, Fig. 10B shows the connecting portion, and Fig. 10C shows the opening of one end portion of the base material in the longitudinal direction. Fig. 11 is a side cross-sectional view showing the attachment of the attached biosensor shown in Fig. 1 to the skin and bending. Fig. 12 shows a modification of the attached biosensor shown in Fig. 1 (a form after wire bonding installation). Fig. 13 is a plan view showing a modification (a form in which a battery region and an electronic component region are repeated) of the attached biological sensor shown in Fig. 1. Fig. 14 is a side cross-sectional view showing the electronic component region when the battery is mounted on the attached biosensor shown in Fig. 13. Fig. 15 shows a modification of the attached type biosensor shown in Fig. 1 (a form in which an electronic component is mounted on the lower side of the interposer). Figure 16 is a plan view showing the interposer of the attached biosensor shown in Figure 15.

Claims (5)

An attached biosensor characterized by: a substrate having a stretchability for attaching to a surface of a living body; an interposer disposed on a side of a thickness direction of the substrate; and an electronic component The substrate is disposed on a side in the thickness direction of the substrate. The substrate has a pressure-sensitive adhesive layer, a substrate layer, and a wiring layer, and the electronic component is electrically connected to the wiring layer of the substrate via the interposer. The attached biosensor of claim 1, wherein an area of the electrical connection point between the substrate and the interposer is larger than an area of the electrical connection point between the electronic component and the interposer. The attached biosensor of claim 1, wherein the number of electrical connection points of the substrate and the interposer is the same as or less than the number of electrical connection points of the electronic component and the interposer Quantity. The attached biosensor of claim 1, wherein the interposer has flexibility. The attached biosensor of claim 4, wherein the interposer has a bending rigidity of 3.0 × 10 ¹² GPa·μm ⁴ or less.