TW201838051A - Surface profile measurement method and surface profile measurement system - Google Patents

Abstract

A surface profile measurement method for measuring profile of a test wafer. The method includes the following steps: using a surface profile measurement device to scan the surface of the test wafer, so as to obtain a surface data; moving a white light interferometry difference spectrometer to an initial scanning position by using a mobile device according one of the height data of the surface data; controlling the white light interferometry difference spectrometer scan the surface of the test wafer from the initial scanning position.

Description

 Surface measurement method and surface measurement system  

The invention relates to a surface measuring method and a surface measuring system, in particular to a surface measuring method and a surface measuring system for measuring a surface of a wafer.

Wafer warpage is one of the important issues in the semiconductor manufacturing process. There are many factors that cause wafer warpage. The wafer warpage caused by these factors can cause component failure on the wafer, film peeling or wafer cracking. If it is serious, it will even cause the wafer to rupture, so the monitoring of wafer warpage is very important for the semiconductor process. The existing major surface measurement systems mostly use a white light interferometer to directly measure the specific position of the wafer. However, since the scale of the surface defects of the wafer and the accuracy of the white light interferometer are very small, it takes a lot of time to perform the image capturing operation when the surface measurement is performed by the white light interferometer, so that the overall measurement time is long. And the problem of low performance is measured. Accordingly, the inventors have diligently studied and cooperated with the application of the theory, and proposed a present invention which is rational in design and effective in improving the above problems.

The main object of the present invention is to provide a surface measurement method and a surface measurement system for solving the problem of wafer surface measurement using only a white light interferometer in the prior art, and there is a problem that the measurement performance is low.

In order to achieve the above object, the present invention provides a surface measurement method for measuring a surface of a wafer to be tested, and the measurement method comprises the following steps: a surface information acquisition step: using a surface measurement device to measure The wafer is surface scanned to obtain a surface measurement information of the wafer to be tested, and the surface measurement information includes a plurality of height data; and a step of moving to the initial scanning position: according to one of the height data, using a mobile device to make a The white light interferometer is located at a corresponding initial scanning position; wherein the white light interferometer comprises an interference objective lens and a micro actuating unit, the micro actuating unit can control the interference objective lens to move in a longitudinal direction; and an image capturing step: The white light interferometer starts the scanning position, and uses the micro-actuating unit to control the interference objective lens to move in the longitudinal direction to perform image capturing operation; wherein the moving step of the mobile device is greater than the unit moving step of the micro-actuating unit, and The moving speed of the mobile device is greater than the moving speed of the microactuating unit.

In order to achieve the above object, the present invention further provides a surface measuring system for performing surface measurement on a wafer to be tested, the surface measuring system comprising: a carrying device, a surface measuring device, and a white light interference Instrument and a mobile device. The carrying device is configured to carry a wafer to be tested, and the carrying device can move the wafer to be tested on a plane. The surface measuring device is disposed on one side of the carrying device, and the surface measuring device can perform surface measurement on the wafer to be tested to generate a surface measuring information, and the surface measuring information includes a plurality of height data. The white light interferometer comprises a micro actuating unit and an interference objective lens. The micro actuating unit can control the interference objective lens to move in a longitudinal direction to perform image capturing operation on the wafer to be tested; wherein the longitudinal direction is a normal direction of the plane. The mobile device can control the white light interferometer to move in the longitudinal direction according to the height data, so that the white light interferometer moves to a corresponding starting scanning position; wherein the unit moving step of the mobile device is greater than the unit moving of the micro actuating unit Step distance, and the moving speed of the mobile device is greater than the moving speed of the micro-actuating unit. Wherein, when the white light interferometer moves to the starting scanning position, the white light interferometer can cooperate with the micro actuating unit and the interference objective lens to perform image capturing on the wafer to be tested.

The beneficial effects of the present invention may be that the white light interferometer can be quickly moved to the starting scanning position by the mutual cooperation of the surface measuring device and the moving device, so that the white light interferometer can save a lot of time to find the starting. The scanning position, in this way, will greatly increase the measurement speed of the white light interferometer, and greatly improve the overall measurement performance.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

1‧‧‧Surface measurement system

10‧‧‧Processing device

20‧‧‧Surface measuring device

201‧‧‧ Surface measurement information

2011‧‧‧High data

2012‧‧‧planar coordinates

30‧‧‧ Carrying device

31‧‧‧Loading station

32‧‧‧ Planar mobile unit

40‧‧‧Mobile devices

50‧‧‧White Light Interferometer

51‧‧‧Interference objective

52‧‧‧Microactuated unit

60‧‧‧ fixed seat

70‧‧‧Machine arm device

80‧‧‧ calibration device

90‧‧‧ Input device

D‧‧‧predetermined offset

ISP1, ISP2, ISP3, ISP4‧‧‧ start scanning position

ISL‧‧‧Start scan line

R‧‧‧ scan range

P1, P2, P3, P4‧‧‧ components

W‧‧‧ wafer under test

Figure 1 is a side elevational view of a surface measurement system of the present invention.

2 is a top plan view of a surface measurement system of the present invention.

3 is a block diagram of a surface measurement system of the present invention.

4 is a schematic flow chart of a first embodiment of a surface measurement method according to the present invention.

Fig. 5 is a flow chart showing the second embodiment of the surface measuring method of the present invention.

6 is a schematic diagram of a surface measurement method and a surface measurement system for measuring a wafer surface according to the present invention.

7 to 10 are schematic views showing the operation of the second embodiment of the surface measuring method of the present invention.

The embodiments of the surface measuring system and the surface measuring method of the present invention are described below by way of specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the disclosure of the present specification. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention. Further, the drawings of the present invention are merely illustrative, and are not depicted in actual dimensions, that is, the actual dimensions of the related structures are not reflected, which will be described first. The following embodiments are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

Please refer to FIG. 1 to FIG. 3 together, which is a schematic diagram of the surface measuring system of the present invention. The surface measuring system 1 of the present invention is for measuring the surface of a wafer W to be tested. As shown, the surface measuring system 1 includes a processing device 10, a surface measuring device 20, a carrying device 30, a moving device 40, and a white light interferometer 50. The surface measuring device 20, the carrying device 30, the moving device 40, and the white light interferometer 50 may be disposed on a fixing base 60. Of course, not limited thereto, each device may be fixed to a specific position according to requirements. The processing device 10 is electrically connected to the surface measuring device 20, the carrying device 30, the moving device 40 and the white light interferometer 50, and the processing device 10 can sequentially control the surface measuring device 20, the carrying device 30, the moving device 40 and the white light interferometer 50, performing surface measurement work on the wafer W to be tested. In a practical application, the processing device 10 can be, for example, a computer, a single-chip processor, etc., and is not limited herein.

Further, the surface measuring device 20 and the white light interferometer 50 may be respectively disposed at two ends of the carrying device 30, and the carrying device 30 may carry a wafer W to be tested. The surface measuring device 20 measures the surface of the wafer W to be tested to generate a surface measurement information 201, and the surface measuring device 20 can transmit the surface measurement information 201 to the processing device 10. Specifically, the surface measurement information 201 may include a plurality of height data 2011 and a plurality of corresponding plane coordinate data 2012; that is, each height data 2011 is a Z-axis coordinate value, and each plane coordinate data 2012 is It is the coordinate value of the X and Y axes.

The carrying device 30 can include a carrying platform 31 and a planar moving unit 32. The carrier 31 is connected to the plane moving unit 32. The plane moving unit 32 can be controlled by the processing device 10 to arbitrarily move the carrier 31 in a plane to move the carrier 31 between the surface measuring device 20 and the white light interferometer 50, and the plane moving unit 32 can The wafer to be tested W is moved to a specific position corresponding to the white light interferometer 50, so that the white light interferometer 50 performs an image capturing operation on a specific position of the wafer W to be tested; wherein the plane is the XY shown in the figure. flat.

The mobile device 40 is interconnected with the white light interferometer 50, and the mobile device 40 can be controlled by the processing device 10 to move the white light interferometer 50 in a longitudinal direction (not numbered, ie, the Z-axis direction shown in the figure). The longitudinal direction is the normal direction of the plane (the plane in which the aforementioned plane moving unit 32 can control the movement of the stage 31), and the longitudinal direction is the Z-axis direction shown in the drawing. The processing device 10 controls the mobile device 40 according to each height data 2011 in the surface measurement information 201 so that an interference objective lens 51 of the white light interferometer 50 is located (moved) to a corresponding initial scanning position. In practical applications, the mobile device 40 may directly control the movement of the entire white light interferometer 50 to move the interference objective lens 51 correspondingly to the initial scanning position, or the mobile device 40 may also only control the movement of the interference objective lens 51. It moves to the initial scanning position; of course, the mobile device 40 is not limited to the above two modes, as long as the interference objective 51 can be located at the corresponding starting scanning position, which is within the scope of the present invention.

The white light interferometer 50 also includes a micro-actuating unit 52 (e.g., piezoelectric actuator PZT). When the white light interferometer 50 performs image capturing on the wafer W to be tested, the micro-actuating unit 52 moves the control interference objective 51 in the longitudinal direction, and cooperates with an image capturing unit (not shown) to perform an image capturing operation. It is worth mentioning that the unit moving step of the mobile device 40 is greater than the unit moving step of the micro-actuating unit 52 (specifically, the difference may be 1000 times), and the movement of the mobile device 40 is faster than the micro-actuating unit 52. Moving speed.

In addition, the surface measuring device 20 measures a position of the wafer W to obtain a speed corresponding to the height value of the position, and is faster than using only the white light interferometer 50 to measure the position to obtain the position. The speed of the corresponding height value; in other words, the surface measuring device 20 measures faster than the white light interferometer 50. Specifically, the surface measuring device 20 may perform a surface measurement operation on the wafer W to be tested by using a stripe reflection method, so that the surface measurement information 201 can be obtained quickly and once.

In other words, through the surface measuring device 20 which has a relatively fast measuring speed and relatively relatively accurate measurement accuracy, the entire surface height of the wafer W to be tested is quickly scanned, and then the height data 2011 obtained by the scanning is used. The white light interferometer 50 can quickly reach the corresponding starting scanning position, so that the white light interferometer 50 can quickly start the image capturing operation, so that the overall measuring speed can be greatly improved, thereby greatly increasing the amount. Measured performance.

Compared with the prior art that the surface of the wafer to be tested is measured by using only the white light interferometer, since the surface of the wafer to be tested may be in a state of ruggedness due to warpage or various reasons, in the prior art, The white light interferometer requires a lot of time to go to the above-mentioned starting scanning position, and then the image capturing operation can be performed, which will cause the measurement performance to be low. In addition, as the dimensions of the components on the wafer W to be tested become finer and finer, the existing apparatus for surface measurement by the stripe reflection method has a poor precision, and therefore, only the apparatus for performing surface measurement by the stripe reflection method is used. It is impossible to effectively perform fine image capturing operations on the components on the wafer W.

In a special application, the surface measuring device 20 and the white light interferometer 50 may be disposed on the same side, and are not limited to the positions shown in the figure; even in a better application, the surface measurement is performed by the stripe reflection method. The surface measuring device 20, some of which may be shared with the components inside the white light interferometer 50, is not limited to the two separate devices previously described.

Specifically, in practical applications, the surface measuring system 1 may further include a mechanical arm device 70 (shown in FIG. 2) for transferring the wafer to be tested W to be unmeasured. The test wafer W is placed on the carrier device 30, or the measured wafer W to be tested is removed from the carrier device 30; and the robot arm device 70 can be electrically connected to the processing device 10, and the processing device 10 After the measurement of the wafer to be tested is completed, the robot arm device 70 is controlled to transfer the wafer W to be tested on the carrier device 30, thereby achieving the effect of automatic measurement. Of course, the number of the robot arm device 70 and the carrier device 30 can be increased according to requirements. Thus, when one of the carrier device 30 and the robot arm device 70 performs the unloading operation of the wafer W to be tested, the other carrier device 30 The mounting of the wafer W to be tested can be performed simultaneously with the robot arm device 70, and even at the same time, another wafer to be tested can be subjected to the measurement operation.

It is worth mentioning that the surface measuring system 1 further comprises a correcting device (not shown), which may be selectively disposed on the carrying device 30. When the calibration device is disposed on the carrier device 30, the processing device 10 can control the surface measurement device 20 to perform surface measurement thereon, and then control the carrier device 30 to carry it to the white light interferometer 50 to match the mobile device 40 with white light. The interferometer 50 performs surface measurement on the calibration device. Thereby, the processing device 10 or a related person can correspondingly measure the result measured by the calibration device according to the surface measuring device 20 and the white light interferometer 50, corresponding to the calibration surface measuring device 20, the carrying device 30, the white light interferometer 50, and the moving The relative positions of the devices 40 relative to each other, so that the carrying device 30 can correctly move the wafer to be tested W from the surface measuring device 20 to a predetermined position of the white light interferometer 50, and through the correcting device, the white light interferometer 50 and The mobile device 40 can accurately perform related image capturing operations based on the surface measurement information 201. In addition, as shown in FIG. 2, the correcting means 80 may be used to correct the measured value of the white light interferometer 50 itself.

In a specific implementation, the surface measuring system 1 further includes an input device 90 electrically connected to the processing device 10, and the input device 90 is configured to provide a user to input a measurement information (not shown), the measurement information. Contains several wafer measurement location data (not shown). Thereby, the processing device 10 can control the carrying device 30 and the moving device 40 according to the wafer measurement position data, so that the white light interferometer 50 performs image capturing at a position corresponding to the wafer W to be tested. More specifically, the user can input the position of the wafer to be tested W that is actually prone to warpage, and input the position information of the wafer through the input device 90, so that the white light interferometer 50 is prone to the input. The position of the song is measured on the surface.

Please refer to FIG. 4 and FIG. 5 together, which are schematic diagrams of two embodiments of a surface measuring method for measuring a surface type of a wafer according to the present invention; in the following description, specific settings of each device and component The position and the linkage relationship may be referred to the foregoing embodiments, and will not be described below. However, the method steps defined in the following embodiments are not limited to the use of the devices and components of the foregoing embodiments, and any device that can achieve the same function and purpose. And the components are all variations of the application scope of the embodiment.

As shown in FIG. 4, it is a first embodiment of the surface measuring method, which comprises the following steps: a surface information capturing step S11: performing surface scanning on the wafer W to be tested by using the surface measuring device 20 to obtain The surface measurement information 201 of the wafer W to be tested; wherein the surface measurement information 201 includes a plurality of height data 2011; a movement to the initial scanning position step S12: according to one of the height data 2011 (ie, the Z-axis coordinate value) The white light interferometer 50 is moved by the moving device 40 such that the interference objective lens 51 of the white light interferometer 50 is located at a corresponding initial scanning position (that is, the interference objective lens 51 corresponds to the position of the Z-axis coordinate value); The white light interferometer 50 has a micro-actuating unit 52 therein for controlling the interference objective lens 51 to move in a longitudinal direction when the white light interferometer 50 performs measurement, and the moving device 40 is not used for white light. When the interferometer 50 performs an image capturing operation, the member that controls the interference objective lens 51 to move is controlled; wherein the height data 2011 described in this step may include a user setting (or an associated processing device) a predetermined offset amount D (as shown in FIG. 6); in an actual implementation, the mobile device 40 may be configured to control the white light interferometer 50 to move along the Z axis (the longitudinal direction) while transmitting through the carrier device 30. Controlling the wafer W to be tested to move in the XY plane, or the moving device 40 may control the white light interferometer 50 to move in the X, Y, and Z axes; an image capturing step S13: causing the white light interferometer 50 to start the scanning position, utilizing The micro-actuating unit 52 controls the interference objective lens 51 to move in the longitudinal direction to perform an image capturing operation.

In a specific implementation, the surface measuring device 20, the mobile device 40, and the white light interferometer 50 may be electrically connected to each other, and the surface measurement information 201 and related control signals may be performed by wire or wirelessly. Pass. Of course, the surface measuring device 20, the mobile device 40, and the white light interferometer 50 may be connected to the processing device 10, and the related information and signals may be transmitted through the processing device 10. Specifically, the moving to the initial scanning position step S12 and the image capturing step S13 are for performing surface state measurement on a single position on the wafer W to be tested. In practical applications, the moving to the starting scanning position is performed. Step S12 and the image capturing step S13 may be repeated several times according to the user's needs; for example, the user may preset the surface state of the N positions on the wafer W to be tested, and the above moves to The start scan position step S12 and the image capture step S13 are performed repeatedly for N times.

As shown in FIG. 5 to FIG. 10 , it is a second embodiment of the surface measuring method, which comprises the following steps: a surface information capturing step S21: performing surface scanning on the wafer W to be tested by using the surface measuring device 20 To obtain the surface measurement information 201 of the wafer to be tested, the surface measurement information 201 includes a plurality of height data 2011; specifically, as shown in FIG. 6, the height data obtained by the surface measuring device 20 is 2011. (Z-axis coordinate value) and a predetermined offset D, after calculation, the starting scan line ISL can be obtained; wherein the predetermined offset D can be a component of the user according to the wafer W to be tested. The heights of P1, P2, P3, and P4 are set, or the processing device 10 may be determined according to the surface measurement information 201; that is, the predetermined offset D may be manually set or automatically set by a computer, and is not limited thereto. . Specifically, the starting scan line ISL is determined based on the topography of the surface of the wafer W to be tested and a predetermined offset amount D, which is determined by the scanning direction and the scanning distance of the white light interferometer 50. Therefore, when the white light interferometer is used When the 50 scans downward, the start scan line ISL is basically located above the wafer W to be tested; a wafer carrying step S22: controlling the carrier device 30 carrying the wafer W to be tested, so that the wafer W to be tested is The surface measuring device 20 is moved to a predetermined position; wherein the predetermined position is a position at which the white light interferometer 50 performs surface measurement on the wafer W to be tested; specifically, as shown in FIG. When the image capturing operation is performed on the member P1 on the wafer W to be tested, the processing device 10 will be based on the plane coordinate data 2012 of the member P1 (which may be user-selected, and the carrier device 30 is controlled to move, so that the member P1 is substantially Located below the white light interferometer 50 (ie, the position at which the white light interferometer 50 can perform image capture); a move to the start scan position step S23: according to one of the height data (corresponding to the plane coordinate data 2012 in step 23) 2011, using mobile equipment Setting 40 (moving the white light interferometer 50 in the longitudinal direction) causes the (interference objective lens 51) of the white light interferometer 50 to be located at a corresponding initial scanning position; wherein the white light interferometer 50 has a micro-actuating unit 52 therein, For controlling the image capturing operation of the white light interferometer 50, the interference objective lens 51 is controlled to move, and the moving device 40 is not used to control the movement of the interference objective lens 51 when the white light interferometer 50 performs scanning and image capturing. Specifically, please refer to FIG. 6 to FIG. 8. When the processing device 10 (shown in FIG. 3) moves the control carrier 30 in the XY plane to move below the white light interferometer 50, the processing device 10 will control the white light interferometer 50 to move to a starting scanning position ISP1 corresponding to the component P1 according to one of the height data 2011 (Z-axis coordinate value) and a predetermined offset D; that is, the processing device 10 will According to the plane coordinate data 2012 (which may be determined by the processing device 10 or the X and Y coordinate values selected by the user), the corresponding height data 2011 (Z-axis coordinate) in the surface measurement information 201 is searched. Value) and based on The scanning direction and the scanning distance of the optical interferometer 50 are selectively superimposed (or subtracted) by a predetermined offset amount D, thereby obtaining a Z-axis coordinate value of the initial scanning position ISP1, thereby causing the white light interferometer 50 Correspondingly, moving to the initial scanning position ISP1. In practical applications, each height data 2011 output by the surface measuring device 20 may directly include the predetermined offset amount D; or, each height data 2011 may also be The predetermined offset amount D is not included, and the post-processing device 10 or the mobile device 40 calculates the height data 2011 according to the user customization or the predetermined offset amount D calculated by the processing device 10 to The start scan bit ISP1 is obtained. An image capturing step S24: the white light interferometer 50 is caused to start the scanning position, and the micro-actuating unit 52 is used to control the interference objective lens 51 to move in the longitudinal direction to perform an image capturing operation. Specifically, please refer to FIG. 6 to FIG. 9, the processing device 10 (shown in FIG. 3) controls the mobile device 40, and after the white light interferometer 50 is moved to the initial scanning position ISP1, the processing device 10 will make white light. The micro-actuating unit 52 of the interferometer 50 is actuated to drive the interference objective lens 51 to move longitudinally, so that the white light interferometer 50 performs an image capturing operation; wherein the dotted frame R shown in FIG. The moving unit 52 controls the interference objective 51 to be actuated to cause the white light interferometer 50 to perform a longitudinal scanning range of image capture of the wafer W to be measured.

a position moving step S25: controlling the carrying device 30 to move the wafer to be tested W from a predetermined position to another predetermined position; specifically, the carrying device 30 will carry the wafer to be tested according to different plane coordinate data 2012 The W moves to make the different positions of the wafer W to be tested corresponding to the position at which the white light interferometer 50 can perform the image capturing operation. The step of moving to the starting scanning position, the image capturing step and the position moving step are repeated for a predetermined number of times, the predetermined number of times being less than the number of the height data. Specifically, as shown in FIG. 6, FIG. 9, and FIG. 10, the surface detecting system 1 performs scanning and image capturing operations on the positions of the four members P1, P2, P3, and P4 on the wafer W to be tested. After the white light interferometer 50 starts the image capturing step S24, the white light interferometer 50 performs the image capturing step S24 to control the carrying device 30 to be measured according to the plane coordinate value corresponding to the component P2. The circle W moves to the lower side of the white light interferometer 50, and then moves to the start scanning position step S23 again to move the white light interferometer 50 to the start scanning position ISP2 to perform the image capturing step S24 again. Similarly, the measurement of the components P3 and P4 follows the same steps as above.

The wafer carrying step S22 can be, for example, transmitted through the carrying device 30 to enable the wafer to be tested to move between the surface measuring device 20 and the white light interferometer 50. The position shifting step may also be performed by moving the wafer W to be tested to the next predetermined measurement position through the carrier device 30 to cause the white light interferometer to measure. In practical applications, the carrying device 30 may be a linear moving device of the X-Y axis, a robot arm, etc., and is not limited herein.

Referring to FIG. 6 , the surface measurement system and the surface measurement method of the present invention first obtain a plurality of initial scanning positions ISP1, ISP2, ISP3, and ISP4 as shown in the figure through the surface measuring device 20. Then, after the white light interferometer 50 reaches the starting scanning position (ISP1, ISP2, ISP3, ISP4) through the cooperation of the carrying device 30 and the moving device 40, the micro-actuating unit 52 is used to drive the longitudinal movement of the interference objective lens 51 to interfere with the white light. The instrument 50 performs an image capturing operation. Since the starting scanning positions (ISP1, ISP2, ISP3, ISP4) are measured by the surface measuring device 20, the surface topography of the wafer W to be tested is calculated (selectively superimposing or subtracting the predetermined partial deviation) The displacement D) is obtained. Therefore, after the white light interferometer 50 reaches the initial scanning position (ISP1, ISP2, ISP3, ISP4), the micro-actuating unit 52 can be used to drive the longitudinal movement of the interference objective lens 51, so that the white light interferometer 50 pairs The wafer to be tested at this position performs an associated image capturing operation.

The wafer surface measuring system that directly scans images by using a white light interferometer has the following problems compared with the present invention: since the user controls the specific position of the white light interferometer to be tested, before performing the image capturing operation The user does not know the surface topography of the wafer to be tested. Therefore, in the prior art, the relevant user must set the white light interferometer to the same predetermined Z-axis height according to the past experience, and start to perform different positions. Image capture operation. In this way, the white light interferometer will take a lot of time (the unit moving step of the microactuating unit is very small) to reach the starting scanning position of the present invention, so that image scanning and capturing operations can be performed (based on white light). The optical characteristics of the interferometer, the white light interferometer must be moved to the correct scanning position before the micro-actuator unit can be used effectively for image capture). In extreme cases, when the Z-axis height set by the user cannot match the warpage value of the different points of the wafer to be tested, the white light interferometer will take a lot of time to scan and still cannot find the start scan. Position, and the user must adjust the initial Z-axis height again to allow the white light interferometer to scan again.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

Claims (10)

 A surface measuring method for measuring a surface of a wafer to be tested, the measuring method comprising the following steps: a surface information capturing step: performing surface scanning on the wafer to be tested by using a surface measuring device Obtaining a surface measurement information of the wafer to be tested, the surface measurement information includes a plurality of height data; and moving to the initial scanning position step: using a mobile device to position a white light interferometer according to one of the height data Initiating a scanning position; wherein the white light interferometer comprises an interference objective lens and a micro-actuating unit capable of controlling the interference objective lens to move in a longitudinal direction; and an image capturing step of: interfering the white light The micro-actuating unit controls the interference objective lens to move in the longitudinal direction, so that the white light interferometer performs an image capturing operation on the wafer to be tested; wherein the mobile device moves in a unit The step size is greater than a unit moving step of the microactuating unit, and the moving speed of the moving device is greater than the moving speed of the micro actuating unit.    The surface measuring method according to claim 1, wherein in the moving to the starting scanning position step, the moving device controls the white light interferometer to move in the longitudinal direction, so that the interference objective lens is located in the initial scanning Position, wherein the surface measuring device performs a quantity detection on a position of the wafer to be tested to obtain a height value corresponding to the position, and is faster than using the white light interferometer to detect the position to obtain the a speed corresponding to the height value of the position; in the step of moving to the initial scanning position, the white light interferometer is located at the initial scanning by the mobile device according to a predetermined offset according to one of the height data position.    The surface measuring method of claim 1, wherein the surface information capturing step and the moving to the starting scanning position step further comprise a wafer carrying step of: controlling a carrying device carrying the wafer to be tested. So that the wafer to be tested is moved from a position adjacent to the surface measuring device to a predetermined position adjacent to the white light interferometer; wherein the carrying device enables the wafer to be tested to move in a plane, the longitudinal direction Is the normal direction of the plane.    The surface measuring method of claim 3, further comprising a position moving step after the image capturing step: controlling the carrying device to move the wafer to be tested from the predetermined position to another predetermined position The step of moving to the start of scanning position, the step of capturing the image, and the step of moving the position are repeated for a predetermined number of times.    A surface measurement system for surface measurement of a wafer to be tested, the surface measurement system comprising: a carrier device for carrying a wafer to be tested, the carrier device enabling the device to be tested The wafer is moved on a plane; a surface measuring device is disposed on one side of the carrying device, and the surface measuring device can perform surface measurement on the wafer to be tested to generate a surface measurement information, The surface measurement information includes a plurality of height data; a white light interferometer is disposed on the other side of the carrying device, the white light interferometer includes a micro actuating unit and an interference objective lens, and the micro actuating unit can control the interference Moving the objective lens in a longitudinal direction to perform an image capturing operation on the wafer to be tested; wherein the longitudinal direction is a normal direction of the plane; and a moving device capable of controlling the white light interferometer according to each height data Moving in the longitudinal direction such that the white light interferometer is located at a corresponding initial scanning position; wherein the unit moving step of the mobile device is greater than a unit moving step of the micro actuating unit, and The moving speed of the mobile device is greater than the moving speed of the micro-actuating unit; wherein, when the white light interferometer is located at the initial scanning position, the white light interferometer can cooperate with the micro-actuating unit and the interference objective to The wafer to be tested is imaged.    The surface measuring system of claim 5, wherein the surface measuring system further comprises a processing device electrically connected to the surface measuring device, the carrying device, the moving device and the white light interferometer, The processing device can control the carrying device and the mobile device according to the height data and the corresponding planar coordinate data included in the surface measurement information, so that the white light interferometer can correspond to the movement of the wafer to be tested The location is for image capture.    The surface measuring system of claim 5, wherein the surface amount detecting system further comprises a correcting device for correcting the surface measuring device, the carrying device, the white light interferometer and the mobile device relative position.    The surface measuring system of claim 5, wherein the surface measuring device performs surface measurement on the wafer to be tested by using a stripe reflection method; the moving device can according to each height data and a predetermined offset Correspondingly, the white light interferometer is moved in the longitudinal direction.    The surface measuring system of claim 5, wherein the surface measuring system further comprises an input device electrically connected to the processing device, wherein the input device is configured to provide a user to input a measurement information, the measurement The information includes a plurality of wafer measurement location data; the processing device can control the carrier device and the mobile device according to the wafer measurement location data, so that the white light interferometer corresponds to the wafer to be tested. Perform image capture operations.    The surface measuring system of claim 5, wherein the surface measuring system further comprises a mechanical arm device electrically connected to the processing device, and the processing device can control the mechanical arm, and the pick and place is disposed on the bearing The wafer to be tested on the device.