TW201813459A - Flexible display device - Google Patents

Abstract

A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and is in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer. The organic buffer layer has at least one conductive via, and the conductive via is connected to the metal layer. The insulating layer is located on the organic buffer layer.

Description

 Flexible display device  

This case is related to a flexible display device.

When a flexible display device having an Organic Thin Film Transistor (OTFT) is fabricated, a barrier layer, a buffer layer, and a wiring layer can be sequentially formed on the flexible substrate. Since the buffer layer is generally an organic material, and the circuit layer is generally a metal material, when the circuit layer is formed over the buffer layer, there is a problem that the adhesion between the circuit layer and the buffer layer is poor.

When the flexible display device is bent by the force, the circuit layer is displaced due to poor adhesion due to poor adhesion of the wiring layer located above the buffer layer. As a result, the wiring layer on the buffer layer is easily broken due to deflection. In addition, in the wet etching process, the wiring layer on the buffer layer of the non-display area is also prone to the problem of excessive criticality (CD loss). Therefore, the line width and the line pitch of the non-display area are difficult to be reduced, so that the width of the non-display area is difficult to be reduced.

One aspect of the present invention is a flexible display device.

According to an embodiment of the present invention, a flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is on the flexible substrate. The metal layer is on the inorganic barrier layer, and the metal layer contacts the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer. The organic buffer layer has at least one electrically conductive channel. The conductive path connects the metal layer. The insulating layer is on the organic buffer layer.

In an embodiment of the invention, the flexible display device has a display area and a surrounding area surrounding the display area, and the flexible display device further includes a source/drain layer and a semiconductor layer. The source/drain layer is located in the display area and on the organic buffer layer. The source/drain layers have separate source and drain regions. The semiconductor layer is on the organic buffer layer between the source region and the drain region, and the semiconductor layer extends to the surface of the source buffer region and the drain region facing away from the organic buffer layer.

In an embodiment of the invention, the flexible display device further includes a semiconductor protective layer. The semiconductor protection layer is on the semiconductor layer and between the insulating layer and the semiconductor layer.

In an embodiment of the invention, the flexible display device further includes a photoresist layer. The photoresist layer is on the semiconductor protective layer and is located between the insulating layer and the semiconductor protective layer.

In an embodiment of the invention, the conductive path is connected to the source region or the drain region.

In an embodiment of the invention, the flexible display device has a display area and a surrounding area surrounding the display area. The flexible display device further includes at least one conductive contact. The conductive contacts are located in the surrounding area and are located on the insulating layer.

In an embodiment of the invention, the flexible display device further includes an integrated circuit. The integrated circuit is located on the surrounding area and the insulating layer, and is connected to the conductive contacts.

In an embodiment of the invention, the organic buffer layer and the insulating layer together have a conductive path, and the conductive path connects the conductive contacts.

In an embodiment of the invention, the flexible display device further includes a flexible circuit board. The flexible circuit board is located in the surrounding area and on the insulating layer, and is connected to the conductive contacts.

In an embodiment of the invention, the flexible display device has a display area and a surrounding area surrounding the display area. The metal layer is located in the surrounding area and has a plurality of sections.

In an embodiment of the invention, the metal layer has a thickness of from 3,000 angstroms to 4,000 angstroms.

In an embodiment of the invention, the flexible display device has a display area and a surrounding area surrounding the display area. The metal layer has a first section and a second section. The flexible display device further includes a protective layer, a first conductive contact, a second conductive contact, a third conductive contact, an integrated circuit and a flexible circuit board. The protective layer is on the insulating layer. The protective layer, the organic buffer layer and the insulating layer have a common first conductive channel, a second conductive channel and a third conductive channel. The first conductive contact, the second conductive contact and the third conductive contact are located in the surrounding area and are located on the protective layer. The two ends of the first conductive path are respectively connected to the first conductive contact and the first segment, and the two ends of the second conductive path are respectively connected to the second conductive contact and the second segment, and the two ends of the third conductive channel are respectively connected Three conductive contacts and a second segment. The integrated circuit connects the first segment and the second segment via the first conductive contact, the second conductive contact, the first conductive path and the second conductive path. The flexible circuit board is electrically connected to the third conductive path via the third conductive contact.

In the above embodiment of the present invention, since the metal layer is not organic, and the metal layer is directly on the inorganic barrier layer, it has excellent adhesion between the metal layer and the inorganic barrier layer. When the flexible display device is bent by the force, the metal layer is not easily broken by the deflection. In addition, the metal layer is located under the organic buffer layer to prevent the organic buffer layer from sliding on the inorganic barrier layer to cause displacement, so that the line above the organic buffer layer is not broken by the deflection. The organic buffer layer has a conductive path electrically connected to the metal layer, such that the line above the organic buffer layer is electrically connected to the metal layer through the conductive path. In addition, since the metal layer is located on the inorganic barrier layer, there is no need to consider the thermal expansion matching problem, so metal materials other than gold and silver may be selected to have a good critical dimension change in the wet etching process (CD loss). ). In this way, the line width and the line pitch of the metal layer in the non-display area can be reduced, so that the width of the non-display area can be reduced, or the metal layer does not occupy too much space of the non-display area to facilitate module packaging.

100‧‧‧Flexible display device

102‧‧‧ display area

104‧‧‧ surrounding area

110‧‧‧Flexible substrate

120‧‧‧Inorganic barrier layer

130‧‧‧metal layer

Section 131a~131e‧‧‧

132‧‧‧ surface

134‧‧‧ surface

135a, 135b‧‧‧ conductive channels

Section 136‧‧‧

Section 138‧‧‧

140‧‧‧Organic buffer layer

150‧‧‧Source/drain layer

152‧‧‧ source area

153‧‧‧ surface

154‧‧‧Bungee Area

155‧‧‧ surface

160‧‧‧Insulation

170‧‧‧Semiconductor layer

172‧‧‧Semiconductor protective layer

174‧‧‧ photoresist layer

180‧‧‧protection layer

190‧‧‧ gate

210‧‧‧ pixel electrodes

222a‧‧‧Electrical contacts

222b‧‧‧Electrical contacts

222c‧‧‧Electrical contacts

224a‧‧‧ conductive path

224b‧‧‧ conductive channel

224c‧‧‧ conductive channel

230‧‧‧ integrated circuit

240‧‧‧Soft circuit board

Lines 2-2, 3-3, 4-4‧‧

1 is a plan view of a flexible display device according to an embodiment of the present invention.

2 is a cross-sectional view of the flexible display device of FIG. 1 taken along line 2-2.

Figure 3 is a cross-sectional view of the flexible display device of Figure 1 taken along line 3-3.

Figure 4 is a cross-sectional view of the flexible display device of Figure 1 taken along line 4-4.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a plan view of a flexible display device 100 according to an embodiment of the present invention. The flexible display device 100 has a display area 102 and a surrounding area 104 surrounding the display area 102. As shown in the figure, the inner side of the broken line in Fig. 1 is the display area 102, and the outer side of the broken line is the surrounding area 104. Display area 102 may mean a Pixel area or an Active area, which may have an array of transistors therein. The surrounding area 104 may mean a non-pixel area, a non-display area, or a shadow area, and the surrounding area 104 may have lines.

2 is a cross-sectional view of the flexible display device 100 of FIG. 1 taken along line 2-2. Referring to FIGS. 1 and 2 together, the flexible display device 100 includes a flexible substrate 110, an inorganic barrier layer 120, a metal layer 130, an organic buffer layer 140, an insulating layer 160, and a protective layer 180. The inorganic barrier layer 120 is located on the flexible substrate 110. The metal layer 130 is on the inorganic barrier layer 120. The organic buffer layer 140 is located on the metal layer 130. The opposite surfaces 132, 134 of the metal layer 130 contact the organic buffer layer 140 and the inorganic barrier layer 120, respectively. The organic buffer layer 140 has a conductive path 135a therein. The conductive channel 135a is electrically connected to the metal layer 130. The insulating layer 160 is located on the organic buffer layer 140. The protective layer 180 is on the insulating layer 160.

In the present embodiment, the material of the flexible substrate 110 may include polyimide (PI), but is not intended to limit the present invention. The material of the metal layer 130 may comprise aluminum, molybdenum, chromium, titanium, copper, nickel or alloys thereof (eg, MoCr). The metal layer 130 may have a thickness of between 3,000 angstroms and 4,000 angstroms. The material of the inorganic barrier layer 120 may comprise niobium nitride (SiNx) or hafnium oxide (SiOx), but is not intended to limit the invention.

Since the metal layer 130 is not organic, and the metal layer 130 is directly on the inorganic barrier layer 120, it has excellent adhesion between the metal layer 130 and the inorganic barrier layer 120. When the flexible display device 100 is bent by the force, the metal layer 130 is less likely to be broken by the deflection. In addition, the metal layer 130 is located under the organic buffer layer 140, so that the organic buffer layer 140 can be prevented from sliding on the inorganic barrier layer 120 to cause displacement, and the line above the organic buffer layer 140 can be prevented from being broken due to deflection. In addition, the organic buffer layer 140 has a conductive path 135a electrically connected to the metal layer 130, so that the line above the organic buffer layer 140 can be electrically connected to the metal layer 130 through the conductive path 135a.

2 is a cross-sectional view of the display area 102. The flexible display device 100 further includes a source/drain layer 150 and a semiconductor layer 170. The source/drain layer 150 is located in the display region 102 and on the organic buffer layer 140. Source/drain layer 150 has separate source regions 152 and drain regions 154. The semiconductor layer 170 is located on the organic buffer layer 140 between the source region 152 and the drain region 154. In addition, the semiconductor layer 170 extends over the surface 153 of the source buffer region 152 opposite the organic buffer layer 140, with the drain region 154 facing away from the surface 155 of the organic buffer layer 140.

In the present embodiment, the conductive via 135a is electrically connected to the source region 152 and the metal layer 130 such that current can be transmitted to the source region 152 via the metal layer 130. In other embodiments, the flexible display device 100 can have the conductive channel 135b without the conductive channel 135a. The conductive channel 135b is electrically connected to the drain region 154 and the metal layer 130, so that current can be transmitted to the metal layer via the drain region 154. 130.

In addition, the flexible display device 100 further includes a semiconductor protective layer 172 and a photoresist layer 174. The semiconductor protective layer 172 is located on the semiconductor layer 170 and between the insulating layer 160 and the semiconductor layer 170. The photoresist layer 174 is located on the semiconductor protection layer 172 and between the insulating layer 160 and the semiconductor protection layer 172.

The flexible display device 100 further includes a gate 190 and a pixel electrode 210. The gate 190 is on the insulating layer 160, and a portion of the insulating layer 160 is located between the gate 190 and the semiconductor layer 170. The gate 190 is covered by a protective layer 180. The pixel electrode 210 is located on the protective layer 180, and a portion of the protective layer 180 is located between the pixel electrode 210 and the gate 190.

In the present embodiment, the material of the semiconductor protective layer 172 may include an organic material and serve as an organic protective layer (OPL). The material of the photoresist layer 174 may include an organic material to form an organic photoresist (OPR) layer. The material of the insulating layer 160 may include an organic material and become an organic gate insulator (OGI). The material of the protective layer 180 may comprise an organic material to form an organic passivation (OPV) layer.

It should be understood that the component connection relationships and materials that have been described will not be repeated, and will be described first. In the following description, the structure of the flexible display device 100 in the surrounding area 104 will be explained.

3 is a cross-sectional view of the flexible display device 100 of FIG. 1 taken along line 3-3. Referring also to Figures 1 and 3, which is a cross-sectional view of the surrounding region 104, the metal layer 130 is located in the peripheral region 104 and has a plurality of segments 131a, 131b, 131c, 131d, 131e. The metal layer 130 in the surrounding area 104 can serve as a surrounding line outside the display area 102. The organic buffer layer 140 covers the inorganic barrier layer 120 and the segments 131a, 131b, 131c, 131d, and 131e of the metal layer 130. The number of segments of metal layer 130 is not intended to limit the invention, depending on the needs of the designer. Further, in the present embodiment, the manner in which the metal layer 130 is patterned may be subjected to a wet etching process.

Since the metal layer 130 is located on the inorganic barrier layer 120, it is not necessary to consider the thermal expansion matching problem, so metal materials other than gold and silver (for example, aluminum, molybdenum-chromium alloy) may be selected to have a wet etching process. Good critical dimension change (CD loss). As such, the width (line width) of each of the segments 131a, 131b, 131c, 131d, and 131e of the metal layer 130 in the peripheral region 104 (non-display region) and the distance between the adjacent two segments (line spacing) It can be reduced, so that the width of the surrounding area 104 can be reduced, which is helpful for the narrow bezel design, or the space occupied by the metal layer 130 in the surrounding area 104 can be reduced to facilitate the module encapsulation.

4 is a cross-sectional view of the flexible display device 100 of FIG. 1 taken along line 4-4. Referring to FIGS. 1 and 4, the cross-sectional position of FIG. 4 is a region where the peripheral region 104 is used to electrically connect the integrated circuit 230 and the flexible circuit board 240. The flexible display device 100 further includes a first conductive contact 222a, a second conductive contact 222b, and a third conductive contact 222c. The first conductive contact 222a, the second conductive contact 222b and the third conductive contact 222c are located in the surrounding area 104 and are located on the protective layer 180. The flexible display device 100 further includes an integrated circuit 230 and a flexible circuit board 240. The integrated circuit 230 is located in the surrounding area 104 and the protective layer 180, and is electrically connected to the first conductive contact 222a and the second conductive contact 222b. The flexible circuit board 240 is located in the surrounding area 104 and the protective layer 180, and is electrically connected to the third conductive contact 222c.

In the present embodiment, the metal layer 130 has sections 136, 138. The organic buffer layer 140, the insulating layer 160 and the protective layer 180 have a common first conductive channel 224a, a second conductive channel 224b and a third conductive channel 224c. The two ends of the first conductive channel 224a are respectively electrically connected to the first conductive contact 222a and the segment 136 of the metal layer 130. The two ends of the second conductive channel 224b are electrically connected to the second conductive contact 222b and the metal layer respectively. Section 138 of 130. As such, the integrated circuit 230 can electrically connect the segments 136, 138 of the metal layer 130 via the first conductive contact 222a, the second conductive contact 222b, the first conductive via 224a, and the second conductive via 224b. In addition, the two ends of the third conductive path 224c are electrically connected to the third conductive contact 222c and the segment 138 of the metal layer 130, respectively, so that the flexible circuit board 240 can be electrically connected to the third conductive path 224c via the third conductive contact 222c. A section 138 of the metal layer 130 is joined.

Since the metal layer 130 is located on the inorganic barrier layer 120, the thermal expansion matching problem does not need to be considered, and thus the thickness of the metal layer 130 can be increased to lower the impedance. Further, when the flexible display device 100 is bent, the metal layer 130 having a large thickness can be prevented from being damaged by bending. In this way, the metal layer 130 can be stably disposed on the inorganic barrier layer 120, and can have a large thickness to electrically connect the integrated circuit 230 and the flexible circuit board 240, thereby effectively improving the flexible display device 100. Yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

Claims (12)

 A flexible display device comprising: a flexible substrate; an inorganic barrier layer on the flexible substrate; a metal layer on the inorganic barrier layer, and the metal layer contacting the inorganic barrier layer; An organic buffer layer covering the inorganic barrier layer and the metal layer, the organic buffer layer having at least one conductive via and the conductive via connecting the metal layer; and an insulating layer on the organic buffer layer.    The flexible display device of claim 1, comprising a display area and a surrounding area surrounding the display area, the flexible display device further comprising: a source/drain layer located in the display area and located in the organic a source/drain layer having a separate source region and a drain region on the buffer layer; and a semiconductor layer on the organic buffer layer between the source region and the drain region, and the The semiconductor layer extends to the surface of the source buffer region and the drain region away from the organic buffer layer.    The flexible display device of claim 2, further comprising: a semiconductor protective layer on the semiconductor layer and between the insulating layer and the semiconductor layer.    The flexible display device of claim 3, further comprising: a photoresist layer on the semiconductor protective layer between the insulating layer and the semiconductor protective layer.    The flexible display device of claim 2, wherein the conductive path connects the source region or the drain region.    The flexible display device of claim 1, comprising a display area and a surrounding area surrounding the display area, the flexible display device further comprising: at least one conductive contact located in the surrounding area and located in the insulation On the floor.    The flexible display device of claim 6, further comprising: an integrated circuit disposed on the surrounding area and the insulating layer and connected to the conductive contact.    The flexible display device of claim 6, wherein the organic buffer layer and the insulating layer have the conductive path together, and the conductive path connects the conductive contact.    The flexible display device of claim 6, further comprising: a flexible circuit board located in the surrounding area and the insulating layer, and connecting the conductive contacts.    A flexible display device according to claim 1, comprising a display area and a surrounding area surrounding the display area, wherein the metal layer is located in the peripheral area and has a plurality of sections.    The flexible display device of claim 1, wherein the metal layer has a thickness of from 3,000 angstroms to 4,000 angstroms.    The flexible display device of claim 1, comprising a display area and a surrounding area surrounding the display area, wherein the metal layer has a first section and a second section, and the flexible display device further comprises a protective layer is disposed on the insulating layer, the protective layer, the organic buffer layer and the insulating layer have a first conductive path, a second conductive path and a third conductive path; a first conductive contact a second conductive contact and a third conductive contact are located in the surrounding area and are located on the protective layer, wherein two ends of the first conductive path are respectively connected to the first conductive contact and the first area a second conductive channel is connected to the second conductive contact and the second segment, and the two ends of the third conductive path are respectively connected to the third conductive contact and the second segment; a first circuit segment, the second conductive contact, the first conductive channel and the second conductive channel connecting the first segment and the second segment; and a flexible circuit board The third conductive contact is connected to the third conductive path and the second Section.