TW201809371A - Electrochemical machining electrode and its manufacturing method having an oxidation insulating layer fixed to the metal layer to prolong service life - Google Patents

Abstract

The present invention relates to an electrochemical machining electrode and its manufacturing method, the electrochemical machining electrode includes a substrate, a coating layer and an oxidation insulating layer. The manufacturing method is to provide a substrate and forms a coating layer on the substrate; the coating layer comprises a solid solution layer and a metal layer, wherein the metal layer is oxidized to form an oxidation insulating layer on the surface. In the present invention, the metal layer is fixed to the substrate by the solid solution layer, so that the oxidation insulating layer formed thereon by oxidizing the metal layer has good fixing property, thereby prolonging service life of the electrochemical machining electrode.

Description

Electrochemical processing electrode and manufacturing method thereof

The present invention relates to an electrochemically-processed electrode and a method for manufacturing the same, and more particularly, to an electrochemically-processed electrode with a good fixation insulating layer and a method for manufacturing the same.

With the development of various types of components gradually moving towards miniaturization, micro-machining technologies and systems have been proposed at home and abroad. Manufacturers are able to build products with special geometries according to the needs of users, and they are derived from microelectrochemical machining technology. Electrochemical Micro-Machining EMM is also known as Electrolytic Micro-Machining. Its working principle is the same as electrochemical machining. It can be applied to special geometric shapes that are difficult to perform in traditional machining, or for special Material (hard metal, special metal) is processed so that the shape and quality of the product can meet the requirements. At the same time, the processed products of microelectrochemical processing are more precise and can be used in the fields of national defense, aerospace, medical, semiconductor and so on.

It has been found that the general electrochemical processing electrode is covered with an insulating layer, which is coated on the non-processed area of the processing electrode to isolate the electric field and prevent the non-processed area of the processing electrode from electrochemically processing the workpiece, and can increase the current from the processing electrode. The precision of the outflow to be processed is reduced, and the stray electrolysis effect is reduced. Due to the large size of general electrochemical processing electrodes, a thicker insulating layer can be used to isolate the electric field, and maintain good processing accuracy of the processing electrodes. In contrast, the dimensions of workpieces and machining tools (electrodes) for microelectrochemical machining are more subtle, so the problems encountered in traditional electrochemical machining are also different. In the metal removal effect of the workpiece due to the electrochemical reaction, because the processing range is only a few micrometers to centimeters, and there are various physical / chemical impact effects, the insulating layer of the processing electrode is vulnerable to damage and peeling, which causes processing. The product yield is not good, and the service life of the processing electrode is reduced.

In order to improve the accuracy of the processed products and prolong the service life of the electrochemical processing electrodes, the inventors have improved the electrochemical processing electrodes.俾 Improve the fixation of the insulating layer of the processing electrode, in order to avoid the peeling of the insulating layer of the processing electrode during the electrochemical processing, which causes the problem of stray electrolysis, so that the processing accuracy and the service life of the processing electrode can be maintained.

An object of the present invention is to provide an electrochemical machining electrode and a manufacturing method thereof. A coating layer is formed on a substrate, the coating layer includes a solid solution layer and a metal layer, and the metal layer is oxidized to form an oxide insulation. Layer, the metal layer is fixed to the substrate by the solid solution layer, so that the fixation of the oxidized insulating layer is improved, thereby improving the processing accuracy and the service life of the electrochemical processing electrode.

An object of the present invention is to provide an electrochemically-processed electrode and a method for manufacturing the same. By forming a filling layer on the oxidized insulating layer, the porous structure of the oxidized insulating layer is filled, so that the oxidized insulating layer can be peeled off.

The invention is a method for manufacturing an electrochemically processed electrode, which comprises providing a substrate; forming a coating layer on the substrate, the coating layer comprising a solid solution layer and a metal layer, and the solid solution layer fixes the metal layer On the substrate; oxidizing the metal layer to form an oxide insulating layer on the surface.

In addition, the electrochemical machining electrode of the present invention includes a substrate; a coating layer located on the substrate, and comprising a solid solution layer and a metal layer, the solid solution layer fixes the metal layer on the substrate; an oxide insulation A layer formed by oxidizing the metal layer and located on a surface.

In order to make the reviewing committee members have a better understanding and understanding of the features of the present invention and the effects achieved, I would like to provide detailed descriptions with examples and cooperation, as follows:

Refer to the first figure, which is a schematic diagram of an electrochemical machining electrode applied to an electrochemical machining device according to the present invention. As shown in the figure, the electrochemical machining device clamps a machining electrode 1 through a clamping element 30 of a feeding device 3 to drive the machining electrode 1 to a workpiece 2 for electrochemical machining, for example, for the workpiece 2 Surface removal or drilling. The workpiece 2 is placed in an electrolyte tank 4. An electrolyte supply module 40 provides an electrolyte 402 between the processing electrode 1 and the workpiece 2 to perform electrochemical processing on the workpiece 2. The electrolyte 402 is recovered in Electrolytic solution body 4. In addition, the negative electrode of a power supply 5 is electrically connected to the clamping element 30, and the positive electrode is electrically connected to the workpiece 2 to supply power to the processing electrode 1 and the workpiece 2 for electrochemical processing.

Refer to the second figure, which is a cross-sectional view of a first embodiment of an electrochemically-processed electrode of the present invention. As shown in the figure, the electrochemical machining electrode 1 of the present invention includes a substrate 10, a coating layer 12 and an oxide insulating layer 16, the coating layer 12 is located on the substrate 10, and the coating layer 12 includes a solid solution layer 122 and a The metal layer 124 and the solid solution layer 122 fix the metal layer 124 to the substrate 10, and the oxidizing and insulating layer 16 is formed by oxidizing a part of the metal layer 124 and is located on the surface. The generation of the solid solution layer 122 is that part of the material of the substrate 10 and part of the metal layer 124 are mutually soluble, and are located between the substrate 10 and the metal layer 124. Since the solid solution layer 122 is formed by the solid solution of the metal layer 124 and the substrate 10, the solid solution layer 122 can improve the adhesion between the metal layer 124 and the substrate 10, so that the adhesion between the oxide insulating layer 16 and the substrate 10 is relatively improved Therefore, the precision of electrochemical machining of the workpiece 2 by the machining electrode 1 and the service life of the machining electrode 1 can be improved.

In addition, the oxidized insulating layer 16 is located in the non-processed area of the processed electrode 1. The processed area of the processed electrode 1 does not have the oxidized insulating layer 16. For example, if the processed electrode 1 is used for electrochemical processing using an end surface, such as drilling The end surface of the electrode 1 processed in this way does not have the oxide insulating layer 16, and the metal layer 124 or the substrate 10 is exposed on the end surface of the processed electrode 1. The material of the base body 10 is selected from metal simple materials, metal alloys, tungsten carbide or other conductive materials. The material of the metal layer 124 is selected from materials that can be oxidized, such as aluminum, titanium, magnesium, etc. The oxidized insulating layer 16 may be an aluminum oxide layer. , Titanium oxide layer or magnesium oxide layer, but it is not limited thereto.

Please also refer to the third figure, which is a flowchart of a first embodiment of a method for manufacturing an electrochemically-processed electrode according to the present invention. As shown in the figure, the method for manufacturing an electrochemically-processed electrode of the present invention firstly provides a substrate 10 as shown in step S10; then, as shown in step S30, a coating layer 12 is formed on the substrate 10, and the coating layer 12 includes a solid The dissolution layer 122 and the metal layer 124, the solid solution layer 122 fixes the metal layer 124 on the substrate 10; and as shown in step S50, a part of the metal layer 124 is oxidized to form an oxide insulating layer 16 on the surface. In addition, the user can remove the oxide insulating layer 16 located in the processing area of the processing electrode 1 according to the processing requirements, and expose the metal layer 124 or the substrate 10 opposite to the processing area on the surface of the processing electrode 1 to electrify the workpiece 2 Learn to process. In other words, the oxide insulating layer 16 is located in a non-processed region of the processed electrode 1.

Referring again to the second and third figures, and referring to the fourth figure together, it is a schematic diagram of an embodiment of a hot dip plating process for an electrochemically processed electrode of the present invention. In the method for forming the coating layer 12 on the substrate 10 in the present invention, a hot dip plating process can be adopted. In one embodiment of the present invention, the material of the substrate 10 may be sintered tungsten carbide, cobalt is used as a bonding metal, and tungsten carbide crystal grains are bonded together, and the material of the metal layer 124 is aluminum. As shown in the fourth figure, a holding element 602 of a feeding device 60 holds the substrate 10 and heats and melts an aluminum ingot in a furnace body 62 to form an aluminum melt 622. The feeding device 60 is used to drive the substrate 10 downward, and the substrate 10 is immersed in the furnace body 62, so that the aluminum melt 622 is coated on the substrate 10, and then the substrate 10 is driven upward to leave the furnace body 62. A coating layer 12 is formed on the substrate 10. The metal layer 124 coated on the substrate 10 and the substrate 10 are solid-solved with each other in a thermal diffusion manner, and a solid solution layer 122 is formed between the substrate 10 and the metal layer 124. The metal layer 124 has an alloy property and provides a fixed metal layer 124 on the substrate 10. Ability.

The substrate 10 is placed in a hot dip plating solution (metal melt, aluminum melt 622), and its surface will oxidize to form an oxide film in contact with high temperature. The oxide film will affect the hot dip plating solution to cover the substrate 10. Therefore, before the substrate 10 is subjected to the hot-dip plating process, a pre-treatment operation may be performed. As shown in step S12 in the fifth figure, the surface of the substrate 10 is first coated with a first flux to facilitate hot dipping. Effect of plating process. In addition, since the metal is heated in the furnace body 62, an oxide film will also be formed on the surface of the metal body in contact with the air. This oxide film will affect the effect of the metal melt coating on the substrate 10. Therefore, as shown in step S14 of the fifth figure, A second flux can be added to the hot-dip plating solution (metal solution, aluminum solution 622) to remove the surface oxide film.

Referring again to the second and third figures, and also to the sixth figure, it is a schematic diagram of an embodiment of the powder bath manufacturing process of the electrochemical processing electrode of the present invention. The method for forming the coating layer 12 on the substrate 10 according to the present invention is a powder bath process. The base body 10 is placed in a powder bath chamber 702, which is a powder bath furnace 70. The powder bath chamber 702 contains a powder bath powder 73, which is a powder bath process with the base body 10. The powder bath powder 73 is a metal powder and a halide activity. Agents and inert fillers are blended in proportion. A gas input port 704 is connected to the powder bath chamber 702, and a protective gas (for example, argon Ar) can be passed to the powder bath chamber 702 to prevent the substrate 10 from being oxidized during the powder bath. The protective gas can be discharged from a gas output port 706 connected to the powder bath chamber 702. The powder bath furnace 70 is placed in a heat treatment furnace 75 to heat the powder bath furnace 70 to decompose the halide activator of the powder bath powder 73 at a high temperature and form a metal halide gas with the metal powder, which will form a gas. The phase is diffused, and then the reduction reaction causes the metal to be separated from the halide and deposited on the substrate 10. The metal deposited on the substrate 10 and the substrate 10 are dissolved and diffused with each other, so that the coating layer 12 is formed.

Referring again to the sixth figure, a temperature sensing rod 708 is set in the powder bath chamber 702, which is used to sense the temperature change in the powder bath chamber 702, so as to monitor and adjust the base 10 and the powder bath powder 73 for the powder bath. Process temperature. In addition, the powder bath furnace 70 has a cooling chamber 710 for cooling the powder bath chamber 702, which is located on the periphery of the powder bath chamber 702, that is, the powder bath chamber 702 is located in the cooling chamber 710, and a cooling liquid is input. The port 712 is connected to the cooling chamber 710 for passing a cooling liquid, and a cooling liquid output port 714 is connected to the cooling chamber 710 for discharging the cooling liquid.

Referring again to the second and third figures, and also to the seventh figure, it is a schematic diagram of one embodiment of the micro-arc oxidation process of the electrochemical machining electrode of the present invention. After the coating layer 12 is formed on the substrate 10, the operation of oxidizing the metal layer 124 to form the oxide insulating layer 16 is performed. In one embodiment of the present invention, a micro-arc oxidation process or an annealing oxidation process may be performed to oxidize a part of the metal layer 124 of the coating layer 12 to generate an oxidized insulating layer 16 on the surface. However, there are many manufacturing processes of the metal oxide layer 124, and the oxide insulating layer 16 cannot be generated by using only these two processes.

The invention is illustrated by the micro-arc oxidation device in the seventh figure. The micro-arc oxidation device includes a power supply 5. The positive electrode of the power supply 5 is electrically connected to the processing electrode 1. The processing electrode 1 is placed in an electrolyte tank 80. The electrolytic solution tank 80 contains an electrolytic solution 82, and the negative electrode of the power supply 5 is electrically connected to the electrolytic solution tank 80. The power supply 5 provides power to the electrolytic solution tank 80 and the processing electrode 1 to perform a micro-arc oxidation process, and a part of the metal layer 124 is oxidized to form an oxidized insulating layer 16. In addition, the electrolyte tank 80 is disposed in a cooling tank 90, a cooling liquid input port 902 is provided on one side of the cooling tank 90, and a cooling liquid output port 904 is provided on the other side of the cooling tank 90. The cooling liquid 92 is injected into the cooling tank 90 through the cooling liquid input port 902 to cool the electrolyte tank 90, and then the cooling liquid 92 is discharged out of the cooling tank 90 through the cooling liquid output port 904.

Refer to FIG. 8A and FIG. 8B, which are respectively a cross-sectional view of a second embodiment of an electrochemical machining electrode of the present invention, and a schematic view of a porous structure of an oxide insulating layer. As shown in the figure, the processing electrode 1 of the present invention may further include a filling layer 18 formed on the oxidized insulating layer 16. Due to the process of generating the oxidized insulating layer 16, the oxidized insulating layer 16 may have a porous structure 162 (such as As shown in FIG. 8B), in order to fill the porous structure 162 of the oxide insulating layer 16 to increase the strength of the oxide insulating layer 16, a filling layer 18 is formed to cover the oxide insulating layer 16.

Refer to FIG. 8C, which is a flowchart of a second embodiment of a method for manufacturing an electrochemically-processed electrode according to the present invention. As shown in the figure, the difference between this embodiment and the first embodiment is that step S70 is further included to form a filling layer 18 on the oxide insulating layer 16, and the filling layer 18 covers the oxide insulating layer 16 to fill the porous structure 162. The method for forming the filling layer 18 may be a boiling water sealing process or an electrophoretic deposition process.

Refer to FIG. 9A, which is a cross-sectional view of a third embodiment of the electrochemically-processed electrode of the present invention. As shown in the figure, the processed electrode 1 of the present invention may further include a barrier layer 11 located on the surface of the substrate 10. Through the arrangement of the barrier layer 11, the material of the metal layer 124 and the material of the base body 10 can be prevented from being excessively miscible, and the metal purity of the metal layer 124 can be avoided.

Refer to FIG. 9B, which is a flowchart of a third embodiment of a method for manufacturing an electrochemically-processed electrode according to the present invention. As shown in the figure, the difference between this embodiment and the first embodiment is that before forming the cover layer 12 before the substrate 10, it may further include step S11, forming the barrier layer 11 on the substrate 10, and forming the barrier layer 11 by using The barrier layer 11 is formed by an electroplating process, and the material of the barrier layer 11 may be selected from nickel, chromium carbon, or nickel and chromium carbon.

In summary, the electrochemical processing electrode and the manufacturing method thereof of the present invention can make the oxidized insulating layer of the processing electrode have a good fixing force, and it is not easy to peel off and fall off during electrochemical processing. In addition, the barrier layer formed on the substrate can prevent the material of the metal layer and the material of the substrate from being excessively miscible. Furthermore, the filling layer formed by optimizing the oxidized insulating layer can cover the porous structure of the oxidized insulating layer to increase the strength of the oxidized insulating layer. Here, when the electrochemical processing electrode of the present invention is subjected to electrochemical processing, due to the good adhesion between the oxide insulating layer and the substrate, the peeling of the oxide insulating layer is reduced, so that the processing yield of the workpiece can be maintained and the processing can be extended. Electrode life.

In view of this, the present invention has indeed reached a groundbreaking structure, with improved contents of the invention, and at the same time, it can achieve industrial applicability and progress. When it complies with the provisions of the Patent Law, it will file an application for an invention patent in accordance with the law. The examiner granted the legal patent right.

1‧‧‧ processing electrode
10‧‧‧ Matrix
11‧‧‧ barrier
12‧‧‧ Coating
122‧‧‧Solid solution layer
124‧‧‧metal layer
16‧‧‧ oxide insulation
162‧‧‧ porous structure
18‧‧‧ filling layer
2‧‧‧ Workpiece
3‧‧‧feeding device
30‧‧‧ clamping element
4‧‧‧ electrolyte tank
40‧‧‧ Electrolyte supply module
402‧‧‧electrolyte
5‧‧‧ Power Supply
60‧‧‧Feeding device
602‧‧‧ clamping element
62‧‧‧furnace
622‧‧‧Aluminum Melt
70‧‧‧ Powder Bath Furnace
702‧‧‧ powder bath chamber
704‧‧‧Gas inlet
706‧‧‧Gas outlet
708‧‧‧Thermal Stick
710‧‧‧cooling chamber
712‧‧‧Coolant input port
714‧‧‧Coolant outlet
73‧‧‧ powder bath powder
75‧‧‧Heat treatment furnace
80‧‧‧ electrolyte tank
82‧‧‧ Electrolyte
90‧‧‧ cooling tank
902‧‧‧Coolant input port
904‧‧‧Coolant outlet
92‧‧‧ Coolant

The first figure: it is a schematic diagram of the electrochemical processing electrode of the present invention applied to an electrochemical processing device; the second figure: it is a cross-sectional view of the first embodiment of the electrochemical processing electrode of the present invention; the third figure: it is The flowchart of the first embodiment of the method for manufacturing the electrochemically-processed electrode of the present invention; FIG. 4 is a schematic diagram of an embodiment of the hot-dip plating process of the electrochemically-processed electrode of the present invention; The flow chart of the process of the electrochemical processing electrode of the present invention before the hot dip plating process; FIG. 6 is a schematic diagram of an embodiment of the powder processing process of the electrochemical processing electrode of the present invention; FIG. 7 is a diagram of the present invention Schematic diagram of one embodiment of the micro-arc oxidation process of an electrochemically processed electrode; FIG. 8A is a cross-sectional view of a second embodiment of the electrochemically-processed electrode of the present invention; FIG. 8B is a schematic view of the present invention Schematic diagram of the porous structure of the oxidized insulating layer of the second embodiment of the electrochemically-processed electrode; Figure 8C: It is a flowchart of the second embodiment of the method of manufacturing an electrochemically-processed electrode of the present invention; Figure 9A: Its hair A cross-sectional view of a third embodiment of an electrochemically-processed electrode; and FIG. 9B is a flowchart of a third embodiment of a method of manufacturing an electrochemically-processed electrode of the present invention.

1‧‧‧ processing electrode

10‧‧‧ Matrix

12‧‧‧ Coating

122‧‧‧Solid solution layer

124‧‧‧metal layer

16‧‧‧ oxide insulation

Claims (11)

A method for manufacturing an electrochemically-processed electrode includes the following steps: providing a substrate; forming a coating layer on the substrate, the coating layer including a solid solution layer and a metal layer, the solid solution layer fixing the metal layer On the substrate; and oxidizing the metal layer to form an oxide insulating layer on the surface. The method for manufacturing an electrochemically-processed electrode according to item 1 of the scope of the patent application, wherein the solid solution layer is formed by dissolving a part of the material of the substrate and a part of the metal layer, and is located between the substrate and the metal layer. . According to the method for manufacturing an electrochemically-processed electrode described in item 1 of the scope of patent application, the method further includes performing a powder bath process or a hot dip plating process on the substrate to form the coating layer on the substrate, and the material of the substrate The material of the metal layer is selected from aluminum, titanium, magnesium, or other materials that can be oxidized. The oxide insulating layer is an aluminum oxide layer, an oxide Ti or Mg layer. According to the method for manufacturing an electrochemically-processed electrode described in item 1 of the patent application scope, the method further includes performing a hot dip plating process on the substrate to form the coating layer on the substrate, wherein the hot dip plating process is performed. The method includes: coating a first flux on the surface of the substrate; and adding a second flux to a hot dip plating solution in the hot dip plating process. The method for manufacturing an electrochemically-processed electrode according to item 1 of the scope of patent application, further comprises forming a filling layer on the oxidizing insulating layer, the oxidizing insulating layer having a porous structure, and the filling layer filling the porous structure. The method for manufacturing an electrochemically-processed electrode as described in item 1 of the patent application scope further includes forming a barrier layer on the substrate. An electrochemical processing electrode includes: a substrate; a coating layer located on the substrate, and comprising a solid solution layer and a metal layer, the solid solution layer fixing the metal layer to the substrate; and an oxide insulation A layer formed by oxidizing the metal layer and located on a surface. The electrochemically-processed electrode according to item 7 of the scope of patent application, wherein the material of the substrate is selected from the group consisting of metal simple substance, metal alloy, tungsten carbide or other conductive materials, and the material of the metal layer is selected from aluminum, titanium, and magnesium Or other materials that can be oxidized, the oxidized insulating layer is an aluminum oxide layer, a titanium oxide layer, or a magnesium oxide layer. The electrochemically-processed electrode according to item 7 of the scope of the patent application, wherein the solid solution layer is formed by dissolving part of the material of the substrate and part of the material of the metal layer, and is located between the substrate and the metal layer. The electrochemically-processed electrode according to item 7 of the scope of patent application, further comprising a filling layer, the oxidizing insulating layer has a porous structure, and the filling layer fills the porous structure. The electrochemically-processed electrode according to item 7 of the patent application scope further comprises a barrier layer, which is located on the substrate.