TW201803818A - Scribing wheel having good pass-through characteristics for a brittle material substrate having high hardness - Google Patents
Scribing wheel having good pass-through characteristics for a brittle material substrate having high hardness Download PDFInfo
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- 239000000758 substrate Substances 0.000 title abstract description 34
- 239000000463 material Substances 0.000 title abstract description 25
- 239000010432 diamond Substances 0.000 claims abstract description 23
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 21
- 239000013078 crystal Substances 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本發明係關於一種適合於刻劃高硬度脆性材料基板的刻劃輪。 The invention relates to a scoring wheel which is suitable for scoring a substrate with high hardness and brittle material.
以往,在液晶顯示器面板或太陽電池等之製程中,設有脆性材料基板之分斷步驟。於分斷步驟,一邊對由超硬合金或多結晶燒結鑽石(PCD)等構成之刻劃輪施加視脆性材料基板之材質或厚度等諸多條件而定之負載、一邊使刻劃輪於脆性材料基板之表面上滾動以形成刻劃線,以形成從刻劃線往脆性材料基板之厚度方向延伸之垂直裂紋。然後,藉由沿脆性材料基板之刻劃線施加既定的力將脆性材料基板加以分斷,以製造出各個面板或玻璃板。 Conventionally, in a manufacturing process of a liquid crystal display panel, a solar cell, or the like, a breaking step of a substrate of a brittle material is provided. In the breaking step, a scoring wheel made of a cemented carbide or polycrystalline sintered diamond (PCD) is applied with a load depending on the material or thickness of the brittle material substrate, and the scoring wheel is placed on the brittle material substrate. Roll on the surface to form a score line to form a vertical crack extending from the score line to the thickness direction of the brittle material substrate. Then, the brittle material substrate is divided by applying a predetermined force along the scribe line of the brittle material substrate to manufacture each panel or glass plate.
玻璃素材製造商,在進行了基板材料的改良、熱處理加工的各種改良後的結果,出現了以下現象:在使用具備有習知的刃前端(普通刃前端)的刻劃輪(以下,亦稱普通輪)進行刻劃時,呈現「侵入不佳」的狀態,亦即在刻劃輪滾動後,刃前端於基板表面打滑而無法形成刻劃線。 As a result of the improvement of substrate materials and various heat treatments by glass material manufacturers, the following phenomenon has occurred: the use of a scoring wheel (hereinafter, also referred to as (Ordinary wheel) When scribed, the state of "poor penetration" is displayed, that is, after the scribe wheel rolls, the tip of the blade slips on the surface of the substrate and cannot form a scribe line.
專利文獻1中揭示了具有高浸透效果的刻劃輪。該刻劃輪,具有沿剖面V字形之圓周稜線於圓周方向交互形成之多個缺口與突起。當使用此刻劃輪時,能夠形成從玻璃基板表面往垂直方向、相對玻璃基板之板厚較深之垂直裂紋。 Patent Document 1 discloses a scribing wheel having a high penetration effect. The scoring wheel has a plurality of notches and protrusions alternately formed in a circumferential direction along a circumferential edge line of a V-shaped cross section. When this scribing wheel is used, a vertical crack can be formed that goes from the surface of the glass substrate to the vertical direction and has a relatively deeper plate thickness than the glass substrate.
上述高浸透刃前端之刻劃輪,被廣泛認知為係一種「侵入性」較普通刃前端之刻劃輪佳的刃前端。 The scoring wheel at the front end of the highly permeable blade is widely recognized as a type of "intrusive" blade front end which is better than the scoring wheel at the front end of the ordinary blade.
專利文獻1:日本特許第3074143號公報 Patent Document 1: Japanese Patent No. 3074143
然而,在對較玻璃基板更硬之陶瓷等高硬度之脆性材料基板進行刻劃時,由於超硬合金或PCD製之刻劃輪係以碳化鎢或鑽石粒子與鈷等結合材構成,因此存在有因刃前端缺損或磨耗等而無法形成長距離裂紋的情況。因此,在對較硬的脆性材料基板進行刻劃時,較佳係使用較超硬合金或燒結鑽石更硬、且為均質材料的單結晶等之鑽石製刻劃輪。鑽石素材之刻劃輪中,刃前端為鏡面狀、且傾斜面之表面粗糙度小。因此被認為更容易在基板上打滑,使「侵入」變差,而難以從刻劃開始後便使垂直裂紋產生。 However, when scoring high-hardness brittle material substrates such as ceramics, which are harder than glass substrates, the scoring wheels made of cemented carbide or PCD are made of a combination of tungsten carbide or diamond particles and cobalt, so There may be cases where a long-distance crack cannot be formed due to a defect or abrasion of the blade tip. Therefore, when scribing a harder brittle material substrate, it is preferable to use a diamond scribing wheel, such as a single crystal, which is harder than a cemented carbide or sintered diamond and is a homogeneous material. In the scoring wheel of diamond material, the tip of the blade is mirror-shaped, and the surface roughness of the inclined surface is small. Therefore, it is considered that it is easier to slip on the substrate, making "intrusion" worse, and it is difficult to cause vertical cracks from the beginning of scribing.
本發明係有鑑於上述鑽石素材之刻劃輪之問題而完成,其目的在提供一種即便是使用鑽石素材之刻劃輪對脆性材料基板進行刻劃的情形,「侵入」亦佳且垂直裂紋亦容易產生之刻劃輪。 The present invention has been made in view of the above-mentioned problem of the scribe wheel of diamond material, and the purpose thereof is to provide a case where the scribe wheel of the diamond material is used to scribe a brittle material substrate. Easy to produce scratching wheel.
為了解決此課題,本發明之刻劃輪,於圓板周圍具有由以鑽石構成之稜線與一對傾斜面所構成之剖面V字形之刃前端,該一對傾斜面之算術平均粗糙度設為0.01μm以下,在該刃前端之至少一方之傾斜面之稜線部分遍及全周具有間距未達8μm之槽。 In order to solve this problem, the scribing wheel of the present invention has a tip end of a V-shaped cross section formed by a ridge line made of diamond and a pair of inclined surfaces around a circular plate, and the arithmetic average roughness of the pair of inclined surfaces is set as Below 0.01 μm, grooves with a pitch of less than 8 μm are formed on the ridge portion of the inclined surface of at least one of the leading edges of the blades over the entire circumference.
此處亦可為:該刻劃輪之槽,形成為與該刻劃輪之圓板之中心軸平行。 Here, the groove of the scribing wheel may be formed parallel to the central axis of the circular plate of the scribing wheel.
此處亦可為:該刻劃輪由單結晶鑽石構成。 Here too, the scribing wheel may be composed of a single crystal diamond.
亦可為:對該刻劃輪之稜線部分實施之槽之深度設為0.3μm以下。 The groove depth of the ridge portion of the scoring wheel may be set to 0.3 μm or less.
亦可為:對該刻劃輪之稜線部分實施之槽之間距設為1μm以下。 The distance between the grooves of the ridge portion of the scribing wheel may be set to 1 μm or less.
此外,為解決該課題,本發明之刻劃輪,於圓板周圍具有由以鑽石構成之稜線與一對傾斜面所構成之剖面V字形之刃前端,該一對傾斜面之算術平均粗糙度設為0.01μm以下,在該刃前端之至少一方之傾斜面之包含稜線之寬度為10μm以內之範圍,遍及全周實施間距未達12μm、深度未達0.7μm之圖案加工。 In addition, in order to solve this problem, the scoring wheel of the present invention has a tip of a V-shaped cross-section formed by a ridge line made of diamond and a pair of inclined surfaces around the circular plate, and the arithmetic average roughness of the pair of inclined surfaces. The thickness is set to 0.01 μm or less, and the width of the ridge line including at least one of the inclined surfaces of the leading edge of the blade is within 10 μm, and pattern processing with a pitch of less than 12 μm and a depth of less than 0.7 μm is performed throughout the circumference.
此處亦可為:該圖案加工之進行,係在該稜線設置側視觀察下曲率半徑為8~12μm之凸部。 Here too, the pattern processing may be performed by setting convex portions with a radius of curvature of 8 to 12 μm under the ridge line side view.
根據具有上述特徵之本發明,在刻劃輪之傾斜面之刃前端之全圓周部分實施槽加工,該刃前端之槽之間距形成為8μm以下之小間距。因此,可獲得侵入性良好、能夠在刻劃開始後立即以深的裂紋對硬度高之基板進行刻劃。 According to the present invention having the above-mentioned characteristics, groove processing is performed on the entire circumference of the front end of the blade of the sloping surface of the scoring wheel, and the pitch between the front ends of the blades is formed at a small pitch of 8 μm or less. Therefore, it is possible to obtain a substrate having a high invasiveness and capable of scoring a substrate having high hardness with deep cracks immediately after the scoring starts.
10‧‧‧刻劃輪 10‧‧‧ Scribing Wheel
11‧‧‧中心軸 11‧‧‧ center axis
12‧‧‧貫通孔 12‧‧‧through hole
13‧‧‧稜線 13‧‧‧Edge
14a、14b‧‧‧傾斜面 14a, 14b ‧‧‧ inclined surface
15a、15b、15‧‧‧槽 15a, 15b, 15‧‧‧ slots
16‧‧‧凸部 16‧‧‧ convex
圖1,係本發明之第1實施形態之刻劃輪的側視圖及前視圖。 Fig. 1 is a side view and a front view of a scribing wheel according to a first embodiment of the present invention.
圖2,係放大顯示本實施形態之刻劃輪之刃前端部分的側視圖及前視圖。 FIG. 2 is an enlarged side view and a front view of the front end portion of the blade of the scoring wheel of this embodiment.
圖3,係本實施形態之刻劃輪之刃前端之稜線部分的立體圖及其側視圖。 FIG. 3 is a perspective view and a side view of a ridge portion of a front end of a scoring wheel blade according to this embodiment.
圖4,係本實施形態之刻劃輪之變形例之刃前端之稜線部分的側視圖。 FIG. 4 is a side view of a ridgeline portion of a blade tip of a modification of the scoring wheel according to this embodiment.
圖5,係放大顯示本發明之第2實施形態之刻劃輪之刃前端部分的側視圖及前視圖。 FIG. 5 is an enlarged side view and a front view of a front end portion of a blade of a scoring wheel according to a second embodiment of the present invention.
圖6,係放大顯示本發明之第3實施形態之刻劃輪之刃前端部分的側視圖及前視圖。 FIG. 6 is an enlarged side view and a front view of a front end portion of a blade of a scoring wheel according to a third embodiment of the present invention.
以下,針對本發明之實施形態之刻劃輪,使用圖式詳細地進行說明。本實施形態中作為加工對象之脆性材料基板,雖為硬度高之SiC基板,但並不限定於此,亦可為液晶顯示器面板、電漿顯示器面板等之玻璃基板、單結晶矽基板、陶瓷基板、藍寶石基板等之脆性材料基板。此外,本說明書中所使用之「算術平均粗糙度Ra」,係表示JISB0601規定之工業製品之表面粗糙度的參數之一。 Hereinafter, the scribing wheel according to the embodiment of the present invention will be described in detail using drawings. Although the brittle material substrate to be processed in this embodiment is a SiC substrate with high hardness, it is not limited to this. It can also be a glass substrate, a single crystal silicon substrate, or a ceramic substrate such as a liquid crystal display panel or a plasma display panel. And sapphire substrates. In addition, the "arithmetic average roughness Ra" used in this specification is one of the parameters representing the surface roughness of industrial products specified in JISB0601.
說明本發明之第1實施形態之刻劃輪形狀。圖1(a)係本實施形態之刻劃輪從其中心軸方向觀察時的前視圖,圖1(b)係該刻劃輪之側視圖。又,圖2(a)係放大顯示稜線部分的側視圖,圖2(b)係其前視圖。 The shape of the scribing wheel according to the first embodiment of the present invention will be described. FIG. 1 (a) is a front view of the scoring wheel according to this embodiment when viewed from the center axis direction, and FIG. 1 (b) is a side view of the scoring wheel. Fig. 2 (a) is a side view showing the ridge line portion in an enlarged manner, and Fig. 2 (b) is a front view thereof.
第1實施形態之刻劃輪10,係以單結晶鑽石形成之圓板狀之輪,如圖1及圖2所示,於中心軸11之中心具有供用於軸支刻劃輪10之未圖示之銷貫通之貫通孔12。該刻劃輪10之外周面切削成剖面V字形,於其中心形成稜線13,於左右如圖示般具有傾斜面14a、14b。傾斜面14a、14b,形成為具有收斂角度(α)。傾斜面14a、14b,被加工成傾斜面之算術平均粗糙度Ra例如為0.01μm以下。如上所述,藉由將傾斜面之算術平均粗糙度設得小,能夠使刻劃時施加於基板之負載集中,且能夠使垂直裂紋 之深度固定。此外,能減少刻劃輪之稜線之缺損或對基板之破壞。 The scoring wheel 10 of the first embodiment is a disc-shaped wheel formed of a single crystal diamond. As shown in FIG. 1 and FIG. The shown pin penetrates the through hole 12. The outer peripheral surface of the scoring wheel 10 is cut into a V-shaped cross section, a ridge line 13 is formed at the center, and inclined surfaces 14a and 14b are provided on the left and right as shown in the figure. The inclined surfaces 14a and 14b are formed to have a convergence angle (α). The arithmetic average roughness Ra of the inclined surfaces 14 a and 14 b processed into the inclined surfaces is, for example, 0.01 μm or less. As described above, by setting the arithmetic mean roughness of the inclined surface to be small, the load applied to the substrate during the scoring can be concentrated, and vertical cracks can be caused. Its depth is fixed. In addition, it can reduce the loss of the ridge line of the scribing wheel or damage to the substrate.
本實施形態之刻劃輪,如圖1所示,對在中心包含刃前端之稜線13的傾斜面14a、14b分別於既定寬度w之範圍內遍及全周實施固定的線距(間距)P之圖案加工。此處,圖案加工較佳為至少形成在刻劃時與基板接觸之部分,本實施形態中,寬度w例如設為10~20μm。此圖案加工,如圖2及圖3之放大圖所示,以與圓板之中心軸11平行之方式以固定的間距P形成有多個槽15a、15b。將該圖案加工之槽15a、15b之間距P設為0.5μm以上未達12μm,較佳為未達8μm,更佳為1μm以下,並將刻劃輪10之槽15a、15b之深度d設為0.05μm以上未達0.7μm,較佳為0.3μm以下。 As shown in FIG. 1, the scoring wheel of this embodiment implements a fixed line pitch (pitch) P over the entire circumference of the inclined surfaces 14a, 14b including the ridgeline 13 at the center of the blade within a predetermined width w. Pattern processing. Here, the pattern processing is preferably formed at least in a portion that comes into contact with the substrate during the scoring. In this embodiment, the width w is set to, for example, 10 to 20 μm. In this pattern processing, as shown in the enlarged views of FIGS. 2 and 3, a plurality of grooves 15 a and 15 b are formed at a fixed pitch P so as to be parallel to the central axis 11 of the circular plate. The distance P between the grooves 15a and 15b of the pattern processing is 0.5 μm or more and less than 12 μm, preferably 8 μm or less, more preferably 1 μm or less, and the depth d of the grooves 15 a and 15 b of the scribing wheel 10 is set as 0.05 μm or more and less than 0.7 μm, and preferably 0.3 μm or less.
藉由在稜線13兩側形成上述之微細圖案加工,即便是對高硬度之SiC基板等之基板亦能夠確保一定的摩擦係數,而能夠謀求侵入性的改善。此外,藉由將槽之深度設得小,能夠充分減少對刻劃品質之影響。 By forming the above-mentioned fine pattern processing on both sides of the ridgeline 13, a certain friction coefficient can be secured even on a substrate such as a high-hardness SiC substrate, and the invasiveness can be improved. In addition, by setting the depth of the groove to be small, the influence on the scribe quality can be sufficiently reduced.
第1實施形態之對以鑽石形成之稜線及傾斜面的圖案加工,可使用飛秒雷射之表面加工裝置來進行。飛秒雷射係在飛秒(femtosecond)單位之極短的時間壓縮功率而成之光源,能夠對各種材料形成周期性的構造之槽或圖案。此處,如圖2、圖3所示,係對包含稜線之傾斜面14a、14b進行與中心軸平行之槽加工。而且,可藉由適當選擇該飛秒雷射之光源或脈衝寬以進行所欲之間距P及深度d之槽加工。 In the first embodiment, the pattern processing of the ridges and the inclined surfaces formed with diamonds can be performed using a surface processing apparatus using a femtosecond laser. A femtosecond laser is a light source that compresses power in a very short time in femtosecond units. It can form periodic structural grooves or patterns for various materials. Here, as shown in FIG. 2 and FIG. 3, the inclined surfaces 14 a and 14 b including the ridge lines are grooved parallel to the central axis. Moreover, the groove processing of the desired distance P and depth d can be performed by appropriately selecting the light source or pulse width of the femtosecond laser.
另外,圖案加工,可如本實施形態般包含在槽與槽之間殘留有稜線之未加工部分,此外,作為變形例如圖4所示,亦可以設置側視觀察下具有既定之曲率半徑之凸部16及其間之槽15。凸部16之曲率半徑R較佳為8~12μm左右。 In addition, the pattern processing may include an unprocessed portion with ridges remaining between the grooves as in this embodiment. In addition, as a deformation, for example, as shown in FIG. 4, a convex having a predetermined radius of curvature may be provided in a side view.部 16 和 槽 15。 Between the slot 15. The curvature radius R of the convex portion 16 is preferably about 8 to 12 μm.
又,本發明之第1實施形態中,如圖2、圖3所示,雖於傾斜面14a、14b配置相對於稜線13對稱且相同長度之槽15a、15b,但槽之長度亦可為在傾斜面14a、14b彼此不同。 In the first embodiment of the present invention, as shown in FIGS. 2 and 3, although grooves 15 a and 15 b having the same length as the ridge line 13 are symmetrical with respect to the ridge line 13 as shown in FIGS. The inclined surfaces 14a and 14b are different from each other.
接下來,針對本發明之第2實施形態之刻劃輪進行說明。本實施形態中與第1實施形態相同的部分標記相同符號並省略詳細的說明。如圖5所示,第2實施形態之刻劃輪,在傾斜面14a、14b之全周形成有彼此不同之槽15a、15b。除此之外之構成,與第1實施形態相同。此時之槽之間距P與上述第1實施形態相同,又,槽15a、15b之深度d亦與第1實施形態相同。據此可減小相對於稜線或傾斜面之圖案角度而獲得大致相同效果。 Next, a scribing wheel according to a second embodiment of the present invention will be described. In this embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions are omitted. As shown in FIG. 5, in the scribing wheel of the second embodiment, grooves 15a and 15b different from each other are formed on the entire circumference of the inclined surfaces 14a and 14b. The other configurations are the same as those of the first embodiment. The pitch P between grooves at this time is the same as in the first embodiment, and the depth d of the grooves 15a and 15b is also the same as in the first embodiment. Accordingly, the pattern angle with respect to the ridge line or the inclined surface can be reduced to obtain substantially the same effect.
接下來,針對本發明之第3實施形態之刻劃輪進行說明。本實施形態中與第1實施形態相同的部分標記相同符號並省略詳細的說明。如圖6所示,第3實施形態之刻劃輪,係在其中一方之傾斜面,此處僅在傾斜面14a之全周形成槽15a。除此之外之構成,與第1實施形態相同。此槽之間距P與上述之第1實施形態相同,又,槽15a之深度d亦與第1實施形態相同。據此可減小相對於稜線或傾斜面之圖案角度而獲得大致相同效果。另外,此實施形態中,亦可僅在另一方之傾斜面14b之全周形成槽15b。 Next, a scribing wheel according to a third embodiment of the present invention will be described. In this embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions are omitted. As shown in FIG. 6, the scribing wheel of the third embodiment is on one of the inclined surfaces. Here, the groove 15 a is formed only on the entire circumference of the inclined surface 14 a. The other configurations are the same as those of the first embodiment. The pitch P between the grooves is the same as the first embodiment described above, and the depth d of the groove 15a is also the same as the first embodiment. Accordingly, the pattern angle with respect to the ridge line or the inclined surface can be reduced to obtain substantially the same effect. In this embodiment, the groove 15b may be formed only on the entire circumference of the other inclined surface 14b.
本發明之各實施形態之刻劃輪,侵入性良好,且即便是對高硬度之基板亦不會打滑,能夠自刻劃開始後立即產生垂直裂紋。因此可獲得即便是對高硬度之基板亦能夠進行內切刻劃之優異的效果。此外,由於不會產生打滑,因此刻劃輪稜線會均勻地磨耗,能夠進一步延長刻劃輪之壽命。 The scoring wheel of each embodiment of the present invention has good invasiveness, and does not slip even on a substrate with high hardness, and can generate vertical cracks immediately after the scoring starts. Therefore, it is possible to obtain an excellent effect that an undercut can be performed even on a substrate having a high hardness. In addition, since the skid does not occur, the scribe wheel edge line is worn evenly, which can further extend the life of the scribe wheel.
又,上述各實施形態中,雖將刻劃輪之素材設為單結晶鑽石,但亦可使用多結晶鑽石作為素材。此時,能夠藉由對刻劃輪之稜線部分實施相同之槽加工而構成具有同樣效果之刻劃輪。 In each of the above embodiments, although the material of the scribing wheel is a single crystal diamond, a polycrystalline diamond may be used as a material. In this case, the scribe wheel having the same effect can be configured by performing the same groove processing on the ridge portion of the scribe wheel.
又,上述各實施形態中,雖示出了刻劃輪整體係由單結晶鑽石構成,但例如對在以超硬合金等構成之輪本體部藉由黏貼或成膜固定以單結晶或多結晶鑽石構成之刃前端部分而成之刻劃輪,本發明亦可適用。若是上述構成的刻劃輪,則能減少高價鑽石之使用,提供價格便宜之刻劃輪。 In addition, in the above-mentioned embodiments, although the entire scribing wheel is shown to be composed of single crystal diamond, for example, a single crystal or polycrystal is fixed to a wheel body made of cemented carbide or the like by adhesion or film formation. The scoring wheel formed by the front end of the blade made of diamond is also applicable to the present invention. If the scribing wheel is configured as described above, it is possible to reduce the use of high-priced diamonds and provide a cheap scribing wheel.
本發明可適用於對高硬度之脆性材料基板進行刻劃之刻劃裝置。 The invention can be applied to a scoring device for scoring a substrate of a brittle material with high hardness.
11‧‧‧中心軸 11‧‧‧ center axis
13‧‧‧稜線 13‧‧‧Edge
14a、14b‧‧‧傾斜面 14a, 14b ‧‧‧ inclined surface
15a、15b‧‧‧槽 15a, 15b‧‧‧slot
P‧‧‧間距 P‧‧‧Pitch
w‧‧‧寬度 w‧‧‧ width
Claims (8)
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TW105122679A TWI637923B (en) | 2016-07-19 | 2016-07-19 | Scoring wheel |
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CN109531638A (en) * | 2018-12-12 | 2019-03-29 | 强浩机械科技(青岛)有限公司 | A kind of dustless cutter for rock wool cutting |
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JP3074143B2 (en) * | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
JP5414536B2 (en) * | 2007-01-19 | 2014-02-12 | ミントレス ビーヴイ | Cutting disc for forming scribe lines |
JP5123996B2 (en) * | 2010-07-08 | 2013-01-23 | 三星ダイヤモンド工業株式会社 | Grooved cutter wheel |
JP5753504B2 (en) * | 2012-02-27 | 2015-07-22 | 三星ダイヤモンド工業株式会社 | A scribing wheel, a scribing device, and a scribing wheel manufacturing method. |
JP2015048260A (en) * | 2013-08-30 | 2015-03-16 | 三星ダイヤモンド工業株式会社 | Scribing wheel, holder unit, and scribing device |
JP2015120251A (en) * | 2013-12-20 | 2015-07-02 | 三星ダイヤモンド工業株式会社 | Scribing wheel for forming hollow hole, and method for forming hollow hole |
JP2016007739A (en) * | 2014-06-24 | 2016-01-18 | 三星ダイヤモンド工業株式会社 | Scribing wheel and manufacturing method of the same |
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CN109531638A (en) * | 2018-12-12 | 2019-03-29 | 强浩机械科技(青岛)有限公司 | A kind of dustless cutter for rock wool cutting |
CN109531638B (en) * | 2018-12-12 | 2024-03-26 | 强浩机械科技(青岛)有限公司 | Dust-free cutter for cutting rock wool |
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