TW201738162A - Electronic parts transportation device and electronic parts inspection device comprising a transportation part for transporting an electronic part, a carrying member that carries the electronic part thereon, and a heating member arranged on one side of the carrying member that is opposite to an electronic part carrying surface - Google Patents

Abstract

The present invention provides an electronic parts transportation device that allows a heating member (a carrier board) to quickly change from a high temperature to a low temperature and an electronic parts inspection device. The electronic parts transportation device 100 according to the present invention comprises: a transportation part, which transports an electronic part (IC device 90); a carrying member 51, which carries the electronic part thereon; a heating member 52, which is arranged on one side of the carrying member 51 that is opposite to a carrying surface of the electronic part; and a cooling member 53, which is arranged to proceed with a relative movement with respect to the heating member 52.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection device (semiconductor component test handler) for inspecting electrical characteristics of an electronic component such as an IC device has been known, and an electronic component transfer device for transporting an IC device is assembled in the electronic component inspection device. . Further, in the electronic component inspection apparatus, the plurality of IC devices are placed on the tray, and the tray is fed into the apparatus, and the tray is transported to the inspection unit for inspection by the transport unit. In the inspection unit, the IC device is temporarily checked from the tray to the socket or the like. Then, at the end of the inspection, the IC device is placed on the tray, and is transported to the outside of the apparatus by the conveyance unit and the tray. In such an electronic component inspection device, a temperature load test in which the temperature of the IC device is changed to a high temperature or a low temperature and the characteristics are checked under the temperature state may be performed. Also, in the temperature load test, the IC device is sometimes warmed or cooled along with the tray. For example, the electronic component inspection device described in Patent Document 1 includes a mounting plate on which a tray on which an IC device is mounted, a heating plate that is connected to a lower portion of the mounting plate, and a cooling plate that is connected to the heating plate. Further, by changing the amount of the cooling fluid (the amount of refrigerant) passing through the cooling plate or changing the amount of heat radiation from the heater of the heating plate, the temperature of the placing plate is controlled to change the temperature of the IC device (tray). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-194874

[Problem to be Solved by the Invention] However, in the electronic component inspection device of Patent Document 1, since the heating plate and the cooling plate which are connected to the lower portion of the placing plate are integrally connected to each other, cooling cannot be performed during heating. unit. Therefore, when the mounting plate is changed from a high temperature to a low temperature, it is necessary to pass the cooling fluid (refrigerant) through the cooling plate at a high temperature, and the cooling of the cooling plate takes time. Therefore, it is difficult to rapidly cool the heating plate and the mounting plate from a high temperature to a low temperature. As described above, for example, when the temperature is changed from a high temperature to a low temperature, the work efficiency is not good. [Technical means for solving the problem] The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples. [Application Example 1] The electronic component transport apparatus according to the application example of the present invention includes a transport unit that can transport electronic components, a mounting member that mounts the electronic component, and a heating member that is disposed on the mounting member The cooling member is disposed to be opposite to the heating member, and is disposed on the opposite side of the mounting surface of the electronic component. According to this application example, since the heating member provided on the opposite side of the mounting member on the mounting surface of the electronic component can relatively move relative to the cooling member, the heating member and the cooling member can be separated before heating of the heating member. . Thereby, the cooling member can be always set to a cooling state (low temperature state) even during heating of the heating member, and when the heating member is to be cooled, the cooled cooling member can be moved to the heating member side for cooling . Therefore, the heating member can be rapidly cooled, and the heating member (mounting member) can be rapidly cooled in a short time, and the work efficiency such as the case of changing the temperature condition can be improved. [Application Example 2] In the electronic component conveying device according to the application example described above, preferably, the cooling member is disposed to be in contact with and separated from the heating member. According to this application example, the cooling member may be abutted or separated from the heating member as needed. That is, the cooling member may be brought into contact with the heating member when the heating member is to be cooled, and the cooling member may be separated from the heating member when the heating member is to be heated. Thereby, rapid cooling or heating of the heating member can be performed. [Application Example 3] In the electronic component conveying apparatus according to the application example described above, preferably, when the heating member is viewed from the mounting side of the electronic component, the cooling member overlaps with the heating member. According to this application example, since the cooling member overlaps with the heating member in plan view, the entire surface of the abutting surface of the heating member and the cooling member is cooled, so that unevenness in temperature distribution can be suppressed and rapid cooling can be performed. [Application Example 4] In the electronic component conveying device according to the application example described above, preferably, the cooling member is disposed on a side opposite to the arrangement side of the mounting member with respect to the heating member. According to the application example, since the placing member, the heating member, and the cooling member are arranged to overlap each other in a plan view from the vertical direction, it is possible to increase the space (for example, the horizontal direction) intersecting with the overlapping direction (for example, the vertical direction). Efficiency, and the device can be miniaturized. In the electronic component transport apparatus according to the above aspect of the invention, the mounting member, the heating member, and the cooling member are preferably disposed on the side opposite to the vertical direction. And arranged in the direction of vertical. According to this application example, since the mounting member is located on the opposite side of the vertical direction, the electronic component can be placed on the mounting member by its own weight without using other power when the electronic component is placed. In the electronic component conveying apparatus according to the above aspect of the invention, the cooling member is preferably a power source that is at least one of a positive pressure or a negative pressure with respect to the atmospheric pressure, and is opposed to the heating member. Connect or separate. According to this application example, the cooling member can be brought into contact with or separated from the heating member by a simple power source, and the size of the device can be reduced. [Application Example 7] In the electronic component conveying device according to the application example described above, preferably, the heating member includes a temperature detector that detects a temperature of the heating member. According to this application example, since the temperature can be controlled based on the temperature of the heating member detected by the temperature detector, the temperature accuracy of the heating member can be improved. [Application Example 8] In the electronic component conveying apparatus according to the application example described above, preferably, the heating member has a heating portion and is set to a normal temperature without heating or cooling, or is set to be the heating portion a temperature higher than a normal temperature, that is, a high temperature; the cooling member has a cooling portion, and is set to a temperature lower than the normal temperature by the cooling portion; and the temperature of the heating member is higher than the high temperature or the normal temperature When the low temperature side changes, the heating of the heating member is stopped, and the cooling member is brought into contact with the heating member. According to this application example, when the temperature of the heating member is changed from the high temperature or the normal temperature to the low temperature side, the cooling member cooled to a temperature lower than the normal temperature is brought into contact with the heating member that has stopped heating, so that the cooling member can be rapidly cooled. By setting the member, the work efficiency such as the case of changing the temperature condition can be improved. [Application Example 9] In the electronic component conveying apparatus according to the application example described above, preferably, the heating unit has a heater that generates heat by electric power. According to this application example, the heating unit can be configured with a simple structure, and the heating member can be efficiently heated. [Application Example 10] In the electronic component conveying apparatus according to the application example described above, preferably, the cooling unit includes a refrigerant cooling unit that cools the refrigerant, passes the refrigerant through the hole, and controls the refrigerant control unit. When the temperature of the heating member reaches a specific temperature, the refrigerant control unit adjusts the supply amount of the refrigerant to reduce the cooling rate of the heating member. According to this application example, when the temperature of the heating member reaches a certain temperature, the cooling rate of the heating member is made slow by adjusting the supply amount of the refrigerant, and excessive cooling or the like can be suppressed, so that the specific temperature can be efficiently achieved. [Application Example 11] The electronic component inspection apparatus according to the application example of the present invention includes: a mounting member that mounts an electronic component; and a heating member that is disposed on the surface of the mounting member opposite to the surface on which the electronic component is placed a side; a cooling member disposed to be relatively movable with respect to the heating member; and an inspection portion that inspects the electronic component. According to this application example, since the heating member provided on the opposite side of the mounting member on the mounting surface of the electronic component can relatively move relative to the cooling member, the heating member and the cooling member can be separated before heating of the heating member. . Thereby, the cooling portion can be always set to the cooling state even during the heating of the heating member, and when the mounting member is to be cooled, the cooled cooling member can be moved to the heating member side for cooling. Therefore, the heating member can be rapidly cooled, and the mounting member can be rapidly cooled in a short time, so that the work efficiency of the inspection of the electronic component can be improved.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the additional drawings. Hereinafter, a first embodiment of an electronic component conveying apparatus and an electronic component inspection apparatus according to the present invention will be described with reference to Figs. 1 to 7 . In the following, for convenience of explanation, as shown in FIG. 1, FIG. 2, FIG. 4A, FIG. 4B, FIG. 5A, and FIG. 5B (the same applies to FIGS. 8 to 11 of the second embodiment to the fifth embodiment) The three axes orthogonal to each other are set to the X axis, the Y axis, and the Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the direction in which the arrows in the respective directions are directed is referred to as "positive", and the opposite direction is referred to as "negative". Moreover, the "level" stated in the specification of the present invention is not limited to a complete level, and as long as the electronic component is not hindered from being transported, it is also in a state of being slightly inclined with respect to the horizontal (for example, less than about 5 degrees). <First Embodiment> Fig. 1 is a schematic perspective view of an electronic component inspection device according to the present invention viewed from the front side. Fig. 2 is a plan view showing the electronic component inspection apparatus shown in Fig. 1. Figure 3 is a block diagram of the electronic component inspection apparatus shown in Figure 1. 4A and 4B are views showing an outline of an operation of a temperature adjustment unit (first embodiment) included in the electronic component inspection device shown in Fig. 1. 4C is a view showing a schematic configuration of a cooling member provided in the electronic component inspection device. Fig. 5A is a plan view showing a temperature adjustment unit (first embodiment) included in the electronic component inspection device shown in Fig. 1 . Fig. 5B is a front view (cross-sectional view) of the temperature adjustment shown in Fig. 5A. FIG. 6 is a flowchart showing an example of a control operation of the temperature adjustment unit (first embodiment) included in the electronic component inspection device shown in FIG. 1 . FIG. 7 is a graph showing an example of temperature change of the temperature adjustment unit (first embodiment) included in the electronic component inspection device shown in FIG. 1. The inspection device 2 (electronic component inspection device) shown in FIG. 1 and FIG. 2 is an electronic component transfer device 100, and is an electronic component such as an IC device packaged in a BGA (Ball Grid Array) package. And in the process of carrying out the inspection, the test (hereinafter referred to as "inspection") electrical characteristics of the device. The inspection device 2 includes an electronic component transport device 100, an inspection unit 16 that performs inspection of electronic components, and a control unit 80 that controls the operations. Further, the control unit 80 includes a refrigerant control unit 536 (see FIG. 4C) that controls the supply of the refrigerant used in the low temperature inspection. The electronic component transport apparatus 100 includes a transport unit 6 that can transport electronic components, an opening and closing unit 4 that can be opened and closed, and a monitor 300 that serves as a display unit that can display an operation state of the transport unit 6 and a temperature adjustment unit 12 . It adjusts the temperature of the electronic parts that are transported. In the following, for convenience of explanation, a case where an IC device is used as an electronic component will be described as a representative, and this will be referred to as "IC device 90". The IC device 90 is placed on the mounting member 51 (see FIGS. 4A and 5B). The inspection device 2 is divided into a tray supply area A1, a device supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, a device collection area A4 (hereinafter simply referred to as "recovery area"), a tray removal area A5, and The control area A6 of the upper side of the recovery area A4 in the vertical direction (the positive side of the Z direction in Fig. 1). Moreover, the IC device 90 is directed from the tray supply area A1 to the tray removal area A5 toward the arrow α. ₉₀ The direction is sequentially checked through the above-mentioned respective areas and in the inspection area A3 in the middle. As described above, the inspection apparatus 2 is configured to include an electronic component transport apparatus 100 (processing machine) that transports the IC device 90 in each area, and an inspection unit 16 that performs inspection in the inspection area A3. Further, the inspection device 2 includes a traffic light 400 as an example of a notification device and an operation panel 700. Further, the inspection device 2 is disposed on the side where the tray supply region A1 and the tray removal region A5 are disposed, that is, the lower side in FIG. 2 (the negative side in the Y direction), and is disposed on the side where the inspection region A3 is disposed, that is, The upper side (the positive side in the Y direction) in Fig. 2 is used as the back side. The tray supply area A1 is supplied to the supply unit of the tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. In the tray supply area A1, a plurality of trays 200 can be stacked. The supply area A2 supplies a plurality of IC devices 90 on the tray 200 transported from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the tray 200 in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11A can cause the tray 200 together with the IC device 90 placed on the tray 200 to face the positive side of the Y direction, that is, the arrow α in FIG. _11A Moving the mobile part. Thereby, the IC device 90 can be stably fed into the supply region A2. Further, the tray transport mechanism 11B can make the empty tray 200 face the negative side in the Y direction, that is, the arrow α in FIG. _11B Moving the mobile part. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1. In the supply area A2, a temperature adjustment unit (a soak plate, a Chinese expression (an example): a temperature equalization plate) 12, a device transfer head 13, a device supply unit 14, a tray transfer mechanism 15, and Concentration sensor 800. The temperature adjustment unit 12 is a "soaking plate" in which a plurality of IC devices 90 are placed, and the IC devices 90 can be heated or cooled together. With the heat equalizing plate, the IC device 90 before the inspection portion 16 can be preheated or cooled, and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). As shown in FIG. 4A and FIG. 4B, the temperature adjustment unit 12 of the present embodiment includes a heating member 52 that can mount the mounting member 51 on which the plurality of IC devices 90 are placed on the one surface 52f side, and the cooling member 53. It is located on the opposite side of the heating member 52 from the one surface 52f of the mounting member 51, and is provided to be relatively movable with respect to the heating member 52. By placing the placing member 51, the heating member 52, and the cooling member 53 in a plan view in the vertical direction (Z direction), the direction intersecting the overlapping direction (for example, the Z direction in the vertical direction) can be improved. The space efficiency (for example, the XY direction in the horizontal direction) is small, and the inspection apparatus 2 can be downsized. The heating member 52 has one surface 52f, the other surface 52r on the opposite side to the one surface 52f, and a side surface 52s connecting the one surface 52f and the other surface 52r, and the mounting member 51 is placed on the one surface 52f side. The heating member 52 is provided with a heater 840 (see FIG. 5B), and when the mounting member 51 is to be heated at a temperature higher than a normal temperature, that is, a high temperature, the heater 840 is heated to have a loadable member 51. The function of the heating source that heats the IC device 90 that is transported. In addition, in the present specification, the temperature in the case where heating and cooling are not performed is described as "normal temperature". The cooling member 53 has an abutting surface 53f and a back surface 53r opposite to the abutting surface 53f, and the abutting surface 53f is disposed to face the other surface 52r of the heating member 52. When the mounting member 51 is to have a temperature lower than a normal temperature, that is, a low temperature, the cooling member 53 has a function as a cooling portion, and a refrigerant containing at least one of liquid nitrogen or nitrogen gas generated from liquid nitrogen can be used. The IC device 90 (mounting member 51) that has been transported is cooled. In the present embodiment, the cooling member 53 is provided to be movable relative to the heating member 52, and the cooling member 53 is moved in the direction of the arrow Q shown in FIG. 4A as needed, thereby abutting the abutting surface 53f of the cooling member 53. The cooling member 53 is separated from the heating member 52 by the other surface 52r of the heating member 52 or moving in the opposite direction to the arrow Q. As shown in FIG. 4C, the cooling member 53 is provided with a cooling portion 533. As shown in FIG. 4C, the cooling unit 533 includes a refrigerant cooling unit 534, a flow path hole 535 as a through hole, and a refrigerant control unit 536 as its functional configuration. The refrigerant cooling unit 534 can cool the refrigerant containing at least one of liquid nitrogen and nitrogen generated from liquid nitrogen. The flow path hole 535 as a through hole can cool the cooling member 53 by flowing the above-described refrigerant. The refrigerant control unit 536 can control the supply (flow) of the refrigerant used in the low temperature inspection, and maintain the cooling member 53 at a specific temperature (for example, a low temperature state of about 45° C.). Further, the refrigerant control unit 536 can be connected to the cooling control unit 88. The temperature adjustment unit 12 will be described in detail with reference to FIGS. 5A and 5B as will be described later. Moreover, in the configuration shown in FIG. 2, the temperature adjustment unit 12 is disposed and fixed in the Y direction. The IC device 90 on the mounting member 51 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjustment units 12. The device transfer head 13 is supported to be movable in the X direction, the Y direction, and further the Z direction in the supply region A2. Thereby, the device transfer head 13 can be responsible for the transfer of the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC device between the temperature adjustment unit 12 and the device supply unit 14 to be described later. 90 transfer. In addition, in Figure 2, with the arrow α _13X Indicates the movement of the device transport head 13 in the X direction by the arrow α _13Y Indicates the movement of the device transport head 13 in the Y direction. The tray transport mechanism 15 is such that the tray 200 in which the state of all the IC devices 90 is removed is in the supply region A2 toward the positive side in the X direction, that is, the arrow α. ₁₅ The mechanism of the direction of transportation. Then, after the transfer, the empty tray 200 is returned to the tray supply area A1 from the supply area A2 by the tray transport mechanism 11B. The concentration sensor 800 detects the concentration of nitrogen used as a refrigerant in the supply region A2. The concentration sensor 800 is electrically connected to the control unit 80, and transmits information on the concentration detected by the concentration sensor 800 to the control unit 80. The inspection area A3 is an area in which the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 and a device transfer head 17 are provided. Further, a device supply unit 14 that moves across the supply area A2 and the inspection area A3, and a device recovery unit 18 that moves across the inspection area A3 and the recovery area A4 are also provided. The device supply unit 14 is configured to be placed on the temperature-adjusted IC device 90 of the temperature adjustment unit 12, and the IC device 90 can be transported to the mounting portion near the inspection unit 16, and is referred to as a "supply shuttle". Or simply referred to as "supply shuttle." Further, the device supply portion 14 is supported to be in the X direction, that is, the arrow α between the supply region A2 and the inspection region A3. ₁₄ The direction moves back and forth. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to any of the device supply units 14. Further, similarly to the temperature adjustment unit 12, the device supply unit 14 is configured to heat or cool the IC device 90 placed on the device supply unit 14. As a result, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 of the inspection area A3 while maintaining the temperature adjustment state. The device transfer head 17 is an operation unit that holds the above-described IC device 90 that maintains the temperature adjustment state and transports the IC device 90 in the inspection region A3. The device transport head 17 is supported to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is part of a mechanism called an "index arm". Thereby, the device transfer head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply region A2 and carry it on the inspection unit 16. In addition, in Figure 2, with the arrow α _17Y Reciprocal movement in the Y direction of the device transfer head 17 is indicated. Further, although the device transfer head 17 is supported to be reciprocally movable in the Y direction, the present invention is not limited thereto, and may be supported to reciprocate in the X direction. Further, similarly to the temperature adjustment unit 12, the device supply unit 17 is configured to heat or cool the held IC device 90. Thereby, the temperature adjustment state of the IC device 90 can be continuously maintained from the device supply portion 14 to the inspection portion 16. Similarly to the temperature adjustment unit 12, the device transfer head 17 includes a heating member 52 and a cooling member 53 that is provided to be relatively movable with respect to the heating member 52. The configuration of the heating member 52 and the cooling member 53 is the same as that of the temperature adjustment unit 12, and thus the detailed description thereof will be omitted. The inspection unit 16 is configured to mount the IC device 90, which is an electronic component, and to inspect and test (check) the mounting portion of the electrical characteristics of the IC device 90. The inspection unit 16 is provided with a plurality of probe pins electrically connected to the terminal portions of the IC device 90. Further, the IC device 90 can be inspected by electrically connecting, that is, contacting, the terminal portion of the IC device 90 to the probe pin. The inspection of the IC device 90 is performed based on the program stored in the memory unit 83 (see FIG. 3) of the control unit 80. Further, in the inspection unit 16, the IC device 90 may be heated or cooled in the same manner as the temperature adjustment unit 12, and the IC device 90 may be adjusted to a temperature suitable for inspection. The device recovery unit 18 is configured to mount the IC device 90 after the inspection by the inspection unit 16, and the IC device 90 can be transported to the placement portion of the collection area A4, which is referred to as a "recycling shuttle" or simply as " Recycling shuttle." Further, the device recovery portion 18 is supported to be in the X direction, that is, the arrow α between the inspection region A3 and the recovery region A4. ₁₈ The direction moves back and forth. Further, in the configuration shown in FIG. 2, the device collection unit 18 is disposed in the Y direction in the same manner as the device supply unit 14, and the IC device 90 on the inspection unit 16 is transferred to any of the device collection units 18, and Placed. This transfer is performed by the device transfer head 17. The recovery area A4 is a region of a plurality of IC devices 90 after the end of the inspection. In the collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared. The recovery tray 19 is configured to mount the mounting portion of the IC device 90 inspected by the inspection unit 16 and is fixed so as not to move in the recovery area A4. As a result, even in the collection area A4 in which various movable portions such as the device transfer head 20 are disposed, the IC device 90 that has been inspected is stably placed on the recovery tray 19. Further, in the configuration shown in Fig. 2, three collection trays 19 are arranged in the X direction. Further, three empty trays 200 are also arranged in the X direction. The empty tray 200 also serves as a mounting portion of the IC device 90 placed on the inspection unit 16 for inspection. Then, the IC device 90 that has moved to the device collection unit 18 of the recovery area A4 is transported to any one of the collection tray 19 and the empty tray 200 and placed thereon. Thereby, the IC device 90 is classified and recovered according to each inspection result. The device transfer head 20 is supported to be movable in the X direction, the Y direction, and further the Z direction in the recovery area A4. Thereby, the device transfer head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In addition, in Figure 2, with the arrow α _20X Indicates the movement of the device transport head 20 in the X direction by the arrow α _20Y Indicates the movement of the device transport head 20 in the Y direction. The tray transport mechanism 21 is such that the tray 200 that is empty from the tray removal area A5 is in the X direction, that is, the arrow α in the collection area A4. _{twenty one} The mechanism of the direction of transportation. Further, after the transfer, the tray 200 can be placed at the position where the IC device 90 is collected, that is, it can be any one of the above three empty trays 200. The tray removal area A5 is a discharge unit that collects and removes the trays 200 of the plurality of IC devices 90 in which the inspection is completed. In the tray removal area A5, a plurality of trays 200 can be stacked. Further, the tray transport mechanisms 22A and 22B that transport the tray 200 in the Y direction one by one across the collection area A4 and the tray removal area A5 are provided. The tray transport mechanism 22A can cause the tray 200 to be in the Y direction, that is, the arrow α _22A A moving portion that reciprocates in the direction. Thereby, the inspected IC device 90 can be transferred from the recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can cause the tray 200 for recycling the empty space of the IC device 90 to face the positive side of the Y direction, that is, the arrow α. _22B Move in direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the recovery area A4. The inspection device 2 divides the tray supply region A1 and the supply region A2 by the first partition wall 61, divides the supply region A2 and the inspection region A3 by the second partition wall 62, and divides the inspection by the third partition wall 63. Between the area A3 and the collection area A4, the fourth partition 64 divides the space between the collection area A4 and the tray removal area A5. Further, the supply area A2 and the recovery area A4 are also divided by the fifth partition wall 65. The inspection device 2 is covered with a cover, and the cover includes, for example, a front cover 70, sub-front covers 70A, 70B, a side cover 71, a side cover 72, a rear cover 73, and a top cover 74. The first housing is configured by assembling the front cover 70, the side cover 71, the side cover 72, the rear cover 73, and the top cover 74, and the opening and closing portion 4 is formed in the first housing. Further, the transport unit 6 and the inspection unit 16 are disposed inside the first housing. In the following, the chamber constituting the supply region A2 inside the first housing and the chamber constituting the inspection region A3 are referred to as a first chamber, and the chamber constituting the recovery region A4 is referred to as a third chamber. Further, in the upper side in the vertical direction of the top cover 74 (the positive side in the Z direction in FIG. 1), the outermost cover is surrounded by the front cover 861, the side cover 862, the side cover 863, the rear cover 865, and the top cover 866. The second frame of the flow path control room 86 (control area A6) of the second chamber. Further, a piping member (not shown) or the like is disposed in the second housing. Further, the collection area A4 (first frame) and the control area A6 (second frame) are partitioned by the top cover 74. As shown in FIG. 2, the side cover 71 is provided with a first door panel 711 and a second door panel 712. By opening the first door panel 711 or the second door panel 712, for example, maintenance in the first room or clogging of the IC device 90 can be performed. Further, the first door panel 711 and the second door panel 712 are formed as an arrow α in FIG. ₇₁ The composition of opening and closing in the direction. Similarly, the side cover 72 is provided with a first door panel 721 and a second door panel 722. By opening the first door panel 721 or the second door panel 722, for example, the work in the third room can be performed. In addition, the first door panel 721 and the second door panel 722 are formed as an arrow α in FIG. ₇₂ The composition of opening and closing in the direction. Further, the rear cover 73 is also provided with a first door panel 731, a second door panel 732, and a third door panel 733. By opening the first door panel 731, for example, an operation in the supply region A2 (first chamber) in which the temperature adjustment unit 12, the device transfer head 13, and the tray transport mechanism 15 are disposed can be performed. By opening the third door panel 733, for example, an operation in the collection area A4 in which the device recovery unit 18, the recovery tray 19, the device transfer head 20, and the like are disposed can be performed. Further, a fourth door panel 75 is provided on the inner partition wall 66 of the section inspection unit 16. Further, by opening the second door panel 732 and the fourth door panel 75, for example, the work in the inspection area A3 can be performed. In addition, the first door panel 731 is attached to the arrow α in FIG. ₇₃₁ The direction is opened and closed, and the second door panel 732 is attached to the arrow α in FIG. ₇₃₂ The direction is opened and closed, and the third door panel 733 is attached to the arrow α in FIG. ₇₃₃ The direction is opened and closed, and the fourth door panel 75 is connected to the arrow α in FIG. ₇₅ The direction is opened and closed. and, In the state of closing each door panel, It can ensure the airtightness or heat insulation of the corresponding chambers. The first door panel 711, The second door panel 712, The first door panel 721, The second door panel 722, The first door panel 731, The second door panel 732, Each of the third door panel 733 and the fourth door panel 75 is configured by an opening and closing portion 4 that can be opened and closed. As shown in Figure 3, The control unit 80 has a drive control unit 81, Inspection control unit 82, Memory unit 83, And a temperature control unit 84. The drive control unit 81 controls, for example, the tray transport mechanism 11A shown in FIG. 2, Pallet transport mechanism 11B, Temperature adjustment unit 12, Device transport head 13, Device supply unit 14, Pallet transport mechanism 15, Inspection Department 16, Device transport head 17, Device recycling unit 18, Device transport head 20, Pallet transport mechanism 21, Pallet transport mechanism 22A, And the operation of each part of the tray transport mechanism 22B. The inspection control unit 82 is based on the program stored in the storage unit 83, The electrical characteristics of the IC device 90 disposed in the inspection unit 16 are checked. The memory unit 83 is, for example, a RAM (Random-Access Memory: Volatile memory such as random access memory) ROM (Read-Only Memory: Non-volatile memory such as read-only memory, EPROM (Erasable and Programmable Read Only Memory: Can erase programmable stylized memory), EEPROM (Electronically Erasable and Programmable Read Only Memory: Electronically erasable programmable read-only memory), Flash memory, etc. can be rewritten (can be erased, It is composed of various semiconductor memories (IC memories) such as non-volatile memory. The temperature control unit 84 controls the temperature of the temperature adjustment unit 12. The temperature control unit 84 is configured to perform a high temperature inspection in the inspection unit 16 The heating control unit 85 is activated, for example, based on the detected temperature of the temperature sensor 820 as a temperature detector. Controlling the action of the heater 840 disposed on the heating member 52 to heat the heating member 52, And maintained at a specific temperature. also, The temperature control unit 84 is configured to perform a low temperature inspection in the inspection unit 16 For example, based on the detected temperature of the temperature sensor 820, the cooling control unit 88 is activated. The cooling valve 860 is operated to control the refrigerant supplied to the temperature adjustment unit 12 (including liquid nitrogen, And cooling the cooling member 53 with a flow rate of nitrogen gas or the like generated by liquid nitrogen, And maintained at a specific temperature. also, When the temperature control unit 84 switches from the high temperature inspection to the low temperature inspection in the inspection unit 16, By the cooling control unit 88, Stopping the action of the heater 840, And instructing the drive control unit 81 to move the cooling member 53, The cooling member 53 in a cooled state is brought into contact with the heating member 52. With this, The heating member 52 can be sharply cooled, On the other hand, the placing member 51 can be quickly cooled in a short time. also, The control unit 80 is electrically connected to the monitor 300 as a display unit. The monitor 300 is configured to display an operation state of the transport unit 6, Or check the operating state of other parts of the device 2. another, as shown in picture 2, The transport unit 6 has the following components: Device transport mechanism 11A, 11B, Device transport head 13, Device supply unit 14, Pallet transport mechanism 15, Device transport head 17, Device recycling unit 18, Device transport head 20, Pallet transport mechanism 21, Pallet transport mechanism 22A, And a tray transport mechanism 22B. The operator (operator) can set or confirm the operating conditions and the like of the inspection device 2 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen. And disposed on the upper side of the front side of the inspection device 2. As shown in Figure 1, On the right side of the map of the tray removal area A5, A mouse pad 600 that is placed on the mouse used when operating the screen displayed on the monitor 300 is provided. also, Relative to the monitor 300 in the lower right of FIG. 1, An operation panel 700 is disposed. The operation panel 700 is provided to the inspection device 2 separately from the monitor 300 by the desired motion commander. also, The control unit 80 is electrically connected to the signal lamp 400 as a notification device. The signal light 400 can utilize a combination of colors of illumination. The operation state of the inspection device 2 is reported. The signal lamp 400 is disposed on the upper portion of the inspection device 2. another, In the inspection device 2, Built-in speaker 500, The operating state of the inspection device 2 and the like can also be reported by the speaker 500. Referring to Figures 5A and 5B herein, The temperature adjustment unit 12 included in the inspection device 2 of the built-in electronic component conveying apparatus 100 of the first embodiment will be described in detail. The temperature adjustment unit 12 has a substrate 54, The mounting member 51 is placed on the heating member 52 on one side as described above, And the cooling member 53 located on the opposite side to the arrangement side of the mounting member 51 with respect to the heating member 52. In other words, In the temperature adjustment unit 12, Loading member 51, Heating member 52, The cooling member 53 arranges the mounting member 51 on the side opposite to the vertical direction (the negative side in the Z direction) (the positive side in the Z direction). Heating the member 52, Then the order of the cooling members 53 is Arranged in the vertical direction (Z direction). And, The heating member 52 is connected to the substrate 54 via the guide post 55, the O-ring 57, and the like. The cooling member 53 is connected to the base material 54 via the guide post 55. According to this configuration, Because the mounting member 51, Heating member 52, The cooling members 53 are arranged in an overlapping manner, Therefore, the space efficiency in the direction intersecting the overlapping direction (for example, the vertical direction, that is, the Z direction) (for example, the horizontal direction, that is, the XY direction) can be improved. Further, it is possible to reduce the size of the inspection apparatus 2. The base material 54 has a flat base portion 541, And the side wall portion 542, The side wall portion 542 has an inner circumferential surface along a side surface 52s of the heating member 52. And it is erected along the outer peripheral end of the base 541. in this way, The base material 54 has a concave space formed by the base portion 541 and the side wall portion 542. At base 541, Two guide holes 54H which are juxtaposed from the back side 54r from the space side of the concave portion of the base portion 541 are provided. In each of the guide holes 54H, The guide post 55 is fixed by fitting or the like. The two guide posts 55 are erected from the base 541 toward the positive side in the Z direction. also, On the inner side of the side wall portion 542, Positioned opposite the side 52s of the heating member 52, a guiding groove 57h is provided in a circumferential shape, The guiding groove 57h is for sealing between the base material 54 and the heating member 52, Fixed O-ring 57. The heating member 52 has a side 52f, And the other side 52r opposite to the side 52f, The placing member 51 is placed on the one side 52f side. On the heating member 52, A guide hole 52H corresponding to each of the two guide posts 55 fixed in parallel to the base material 54 is provided, And an annular recess 52P formed on the other surface 52r side and formed substantially concentrically with the guide hole 52H. also, On the side (outer circumference) 52s of the heating member 52, A guide groove (not shown) of the O-ring 57 is provided. And, The heating member 52 is such that its guiding post 55 is fitted to the guiding hole 52H. And the side surface 52s is supported by the substrate 54 via the O-ring 57. It is fixed to the substrate 54. the result, The concave space formed by the base portion 541 and the side wall portion 542 serves as a space sealed by the heating member 52. And, On the outer side of the guide post 55, A coil spring 56 which is an elastic member is disposed between the recess 52P and the cooling member 53. The coil spring 56 has one end abutting against the bottom of the recess 52P. The other end abuts against the abutting surface 53f of the cooling member 53. With this, The direction in which the cooling member 53 is separated (the negative side of the Z direction) with respect to the heating member 52 can be pushed toward. also, The heating member 52 includes a temperature sensor 820 as a temperature detector and a heater 840 as a heating portion. When the mounting member 51 is to be set to a temperature higher than a normal temperature, that is, a high temperature, Heated by heater 840, Further, it has a function as a heating unit that can heat the transported IC device 90 (mounting member 51). The heater 840 generates heat by power supply. And is controlled based on the information of the temperature measured by the temperature sensor 820. in this way, By using the heater 840 as a heating portion, The heating member 52 can be efficiently heated in a simple configuration. also, On the heating member 52, Located on the other side of the 52r opening, And penetrates through the through hole 95 of the side surface 52s. The through hole 95 constitutes a part of the suction flow path, It is connected to the injector E as an intake source on the side 52s side. And, Actuated by the ejector E, The suction flow path including the through hole 95 is brought into a negative pressure state (vacuum state). also, Actuated by the ejector E, Including the suction flow path of the through hole 95, And by the substrate 54, Heating member 52, And the space S formed by the cooling member 53 becomes a negative pressure state (vacuum state), On the other hand, the cooling member 53 can be moved along the guide post 55 toward the heating member 52 side (the positive side in the Z direction). another, To set the space S as a confined space, On the outer circumference of the cooling member 53, Providing a holding portion 532 that is circumferentially arranged along the concave portion, Further, an O-ring 531 disposed inside the holding portion 532 is provided. And, The O-ring 531 slides with the side wall portion 542 of the base material 54. On the other hand, the cooling member 53 can be moved while maintaining the airtightness of the space S. in this way, The cooling member 53 can be used as a power source in a negative pressure state (vacuum state) with respect to atmospheric pressure. Abutting on the heating member 52, And if the negative pressure state is removed, Then, it is separated from the heating member 52 by the elastic force of the coil spring 56. another, To lift the abutment (adsorption), This can be achieved by vacuum destruction by the ejector E. The cooling member 53 can be abutted or separated from the heating member 52 by such a simple power source, that is, a negative pressure state (vacuum state). Further, it is possible to reduce the size of the inspection apparatus 2. The cooling member 53 has an abutting surface 53f, And a back surface 53r opposite to the abutting surface 53f, Further, the abutting surface 53f is disposed to face the other surface 52r of the heating member 52. On the cooling member 53, Two guide holes 59 penetrating the abutting surface 53f and the back surface 53r are provided at positions corresponding to each of the two guide posts 55 which are juxtaposed and erected on the base material 54. The two guide holes 59 are formed to have an inner diameter that is slidable relative to the outer circumference of the guide post 55. The cooling member 53 is inserted into the guide post 55 to the guide hole 59, It can be slidably held relative to the guide post 55. In other words, The cooling member 53 is disposed to be relatively movable with respect to the heating member 52. The cooling member 53 can be moved in the direction of the arrow Q shown in FIG. 5B as needed. And the abutting surface 53f abuts against the other surface 52r of the heating member 52, Or by moving in the opposite direction to the direction of the arrow Q, The abutting surface 53f is separated from the other surface 52r of the heating member 52. As above, The cooling member 53 may be abutted or separated from the heating member 52 as needed. With this, When the heating member 52 is to be cooled, Abutting the cooling member 53 against the heating member 52, And in the case where the heating member 52 is to be heated, The cooling member 53 is separated from the heating member 52. With this, Rapid cooling or heating of the heating member 52 can be performed. also, On the cooling member 53, A flow path hole (passing hole) 535 as a flow path through which the refrigerant for cooling the cooling member 53 passes is provided. The flow path hole 535 of the through hole is a mode in which the refrigerant flowing in through the movable pipe material 99a from the flow path 93a on the inlet (IN) side flows to the flow path 93b on the outlet side via the movable pipe material 99b. It is disposed inside the cooling member 53. When the cooling member 53 is to be set to a temperature lower than a normal temperature, that is, a low temperature, Has the function as a cooling unit, It can be made by including liquid nitrogen, The refrigerant of at least one of the nitrogen generated by the liquid nitrogen flows in the flow path hole 535, The IC device 90 (mounting member 51) that has been transported is cooled. another, The surface (the other surface 52r and the abutting surface 53f) of the heating member 52 and the cooling member 53 are not limited to the above-described flat surface. The surface of each of the abutting surfaces (the other surface 52r and the abutting surface 53f) may be formed, for example, in a wave shape or a concave-convex shape. It is arranged such that the wave shape or the uneven shape of each of the opposing faces is in surface contact. As a result, The contact area between the heating member 52 and the cooling member 53 can be enlarged, The heat between the heating member 52 and the cooling member 53 can be moved faster. With this, The heating member 52 can be cooled more quickly. also, When the heating member 52 is viewed from the side on which the IC device 90 is mounted (on the side of the mounting member 51), The cooling member 53 is preferably disposed to overlap the heating member 52. With this configuration, The entire surface of the heating member 52 and the abutting surface 53f of the cooling member 53 are cooled. Therefore, the unevenness of the temperature distribution can be suppressed. And can be cooled quickly. In the temperature adjustment unit 12 as described above, For example, temperature control in accordance with the flow chart shown in Fig. 6 can be performed. the following, Referring to Figures 6 and 7, An example of the control operation of the temperature adjustment unit 12 will be described. another, The flow chart shown in Fig. 6 shows a control example of the case of transitioning from a high temperature state to a low temperature state. also, The configuration of the temperature adjustment unit 12 will be described using the same reference numerals as described above. First of all, The heating control unit 85 included in the temperature control unit 84 shown in FIG. 3 energizes the heater 840 disposed in the heating member 52 (turns on the heater 840). The heating member 52 is heated. And, The energization of the heater 840 is controlled by the temperature control unit 84 (heating control unit 85). On the other hand, the heated heating member 52 is maintained at a high temperature state (for example, at 125 ° C) (step S102). at this time, Although not shown, However, the cooling member 53 is disposed separately from the heating member 52, The refrigerant control unit 536 connected to the cooling control unit 88 included in the temperature control unit 84 controls the flow of the refrigerant. While maintaining a specific temperature (for example, a low temperature state of about 45 ° C). Secondly, The temperature control unit 84 determines whether the heating member 52 is changed from the heating state to the cooling state. That is, it is judged whether or not the cooling of the heating member 52 is started (step S104). Here, When it is indicated that the cooling is started (step S104: Yes ()), The temperature control unit 84 (heating control unit 85) stops energizing the heater 840 disposed in the heating member 52 (turns off the heater 840) (step S106). Here, When the cooling is not instructed (step S104: No (No)), The temperature control unit 84 (heating control unit 85) continues to energize the heater 840 disposed on the heating member 52 (S102), While maintaining a high temperature state (for example, positive 125 ° C). also, The temperature control unit 84 stops energization of the heater 840 (stops the operation of the heater 840) in step S106, And the self-driving control unit 81 instructs the movement of the cooling member 53, On the other hand, the cooling member 53 in a cooling state (for example, a low temperature state of about 45 ° C or lower) is brought into contact with the heating member 52 (step S108). With these actions, The temperature of the heating member 52 is as shown in the graph of Fig. 7, The temperature drops from the high temperature state t1 toward the low temperature state t3. another, In Figure 7, The vertical axis represents temperature, The horizontal axis represents the elapsed time. Secondly, The temperature control unit 84 determines whether the temperature of the heating member 52 measured by the temperature sensor 820 has reached the specific temperature t2 shown in the graph of FIG. 7 (step S110). And when the specific temperature t2 is reached (step S110: Yes), The refrigerant control unit 536 starts to control the supply of the refrigerant. That is, to control the supply of refrigerant, For example, it is controlled to intermittently flow the refrigerant or the like (step S112). By doing so, The cooling rate of the heating member 52 can be slowed down, Further, it is possible to suppress excessive cooling which may occur due to excessive cooling rate. With this, A specific temperature can be achieved efficiently. another, In step S110, When the detected temperature of the temperature sensor 820 does not reach the temperature t2 shown in the graph of FIG. 7 (step S110: no), Going to step S108, The cooling member 53 that continues the supply of the refrigerant continues to abut against the heating member 52. According to the control operation of the temperature adjustment unit 12, When the temperature of the heating member 52 is changed from a high temperature or a normal temperature to a low temperature side, By abutting the cooling member 53 cooled to a temperature lower than the normal temperature to the heating member 52 that has stopped heating, The heating member 52 can be rapidly cooled, Further, it is possible to improve work efficiency such as the case of changing temperature conditions. also, By starting the control of the supply amount of the refrigerant when the specific temperature t2 is reached, And in a temperature range lower than a specific temperature t2, The cooling rate of the heating member 52 can be slowed down, Further, it is possible to suppress excessive cooling which may occur due to excessive cooling rate. With this, A specific temperature can be achieved efficiently. According to the electronic component conveying apparatus 100 of the first embodiment described above, Since the heating member 52 disposed on the opposite side of the mounting member 51 from the mounting side of the IC device 90 is relatively movable with respect to the cooling member 53, Therefore, during heating of the heating member 52, The heating member 52 can be separated from the cooling member 53. With this, Even when the heating member 52 is heated, the cooling member 53 can always be set to a cooling state. When cooling the heating member 52, The cooled cooling member 53 can be moved to the side of the heating member 52 to cool it. E.g, To cool from positive 125 ° C to minus 45 ° C, By using this embodiment, Cooling time compared to previous methods, The cooling time previously consumed by about 30 to 40 minutes can be greatly shortened to about 10 to 15 minutes. in this way, The heating member 52 can be sharply cooled, And the heating member 52 can be rapidly cooled in a short time, Therefore, work efficiency such as the case of changing temperature conditions can be improved. also, When the temperature of the heating member 52 is changed from a high temperature or a normal temperature to a low temperature side, Since the cooling member 53 cooled to a temperature lower than the normal temperature is brought into contact with the heating member 52 that stops heating, Therefore, the heating member 52 and the mounting member 51 (IC device 90) placed on the heating member 52 can be rapidly cooled. Further, it is possible to improve work efficiency such as the case of changing temperature conditions. also, When the temperature of the heating member 52 reaches a certain temperature t2, The adjustment of the supply amount of the refrigerant supplied to the cooling member 53 abutting on the heating member 52 can be controlled to reduce the cooling rate of the heating member 52. With this, It is possible to suppress excessive cooling of the heating member 52 which may occur due to excessive cooling rate, The heating member 52 can be efficiently brought to a specific temperature. another, In the inspection device 2 having the electronic component conveying device 100 and the inspection unit 16, The same effects as described above can also be exerted. also, In the above, Although the configuration in which the cooling member 53 is provided to be movable relative to the heating member 52 will be described. However, it is also possible to provide the heating member 52 so as to be movable relative to the cooling member 53. The heating member 52 can be moved to abut against the cooling member 53. <Second embodiment> Next, Referring to Figure 8, A second embodiment of the temperature adjustment unit provided in the electronic component inspection device (inspection device 2) will be described. Fig. 8 is a front view (cross-sectional view) showing a second embodiment of the temperature adjustment unit provided in the electronic component inspection device. another, The temperature adjustment unit 12A of the second embodiment shown in FIG. 8 is compared with the temperature adjustment unit 12 of the first embodiment described above. The driving method of the cooling member 53 is different, But the other components are the same. In the description of the second embodiment, The configuration different from the above-described first embodiment will be described in detail. Label the same components with the same symbol, And sometimes the description is omitted or simplified. The temperature adjustment unit 12A of the second embodiment shown in FIG. 8 is used for the inspection apparatus 2 (electronic component inspection apparatus) of the built-in electronic component conveying apparatus 100 as described with reference to FIGS. 1 and 2 . The temperature adjustment unit 12A has a substrate 54a, The mounting member 51 is placed on the heating member 52a on one side, And the cooling member 53 located on the side opposite to the arrangement side of the mounting member 51 with respect to the heating member 52a. And, The heating member 52a and the cooling member 53 are connected to the base material 54a via the guide post 55. According to this configuration, Because the mounting member 51, Heating member 52a, The cooling members 53 are arranged to overlap each other, for example, in the vertical direction, that is, in the Z direction. Therefore, the space efficiency in the direction intersecting the overlapping direction (for example, the horizontal direction, that is, the XY direction) can be improved. Further, it is possible to reduce the size of the inspection apparatus 2. The base material 54a has a flat base portion 541a, And a side wall portion 542 having a circumferential surface along the inner peripheral surface of the side surface 52as of the heating member 52a and extending along the outer peripheral end of the base portion 541a. in this way, The base material 54a has a concave space by the base portion 541a and the side wall portion 542. At the base 541a, Two guide holes 54H which are juxtaposed from the back side 54ar from the space side of the concave portion of the base portion 541a are provided. Fitted in each of the guide holes 54H, The guide post 55 is fixed. The two guide posts 55 are erected from the base 541a toward the positive side in the Z direction. also, At the base 541a, A screw hole 98 penetrating from the back surface 54a toward the concave space is provided. In the screw hole 98, a fixing screw embedded in the cylinder 96, The cylinder 96 is fixed by directing the tip end of the rod 97 toward the cooling member 53. The cylinder 96 is connected to a compressed air source P which is positive pressure with respect to atmospheric pressure. The rod 97 is moved in and out by using compressed air supplied from the compressed air source P as a power source. The cooling member 53 is pushed up to move it. The cooling member 53 can abut or separate from the heating member 52 by the movement caused by the movement of the rod 97. The heating member 52a has a side 52af, And the other side 52ar opposite to the side 52af, The placing member 51 is placed on the side of the one side 52af. On the heating member 52a, a guide hole 52H corresponding to each of the two guide posts 55 that are juxtaposed and fixed to the base material 54a, And an annular recess 52P formed on the other surface 52ar side and formed substantially concentrically with the guide hole 52H. The heating member 52a is fitted to the guide hole 52H by fitting the guide post 55, It is fixed to the substrate 54a. And, Outside the guide post 55, A coil spring 56 which is an elastic member is disposed between the recess 52P and the cooling member 53. The coil spring 56 has one end abutting against the bottom of the recess 52P. The other end abuts against the abutting surface 53f of the cooling member 53. With this, The direction in which the cooling member 53 is separated (the negative side of the Z direction) with respect to the heating member 52a can be pushed. also, The heating member 52a includes a temperature sensor 820 as a temperature detector and a heater 840 as a heating portion. When the mounting member 51 is to be set to a temperature higher than a normal temperature, that is, a high temperature, Heated by heater 840, Further, it has a function as a heating unit that can heat the transported IC device 90 (mounting member 51). The heater 840 generates heat by power supply. And is controlled based on the detected temperature of the temperature sensor 820. in this way, By using the heater 840 as a heating portion, The heating member 52a can be efficiently heated in a simple configuration. The cooling member 53 has an abutting surface 53f, And a back surface 53r opposite to the abutting surface 53f, Further, the abutting surface 53f is disposed to face the other surface 52ar of the heating member 52a. In the cooling member 53, Similarly to the first embodiment described above, A flow path hole 535 as a flow path for cooling the refrigerant of the cooling member 53 is provided. The cooling member 53 is as described above, By the action of the cylinder 96 (rod 97), And the elastic force of the coil spring 56, Sliding relative to the guide post 55, Instead, it can abut or separate from the other surface 52ar of the heating member 52a. another, The configuration of the cooling member 53 is the same as that of the first embodiment described above. Therefore, the description here is omitted. another, The surface (the other surface 52ar and the abutting surface 53f) of the heating member 52a and the cooling member 53 are not limited to the above-described flat surface. The surface of each of the abutting surfaces (the other surface 52ar and the abutting surface 53f) may be formed, for example, in a wave shape or a concave-convex shape. It is arranged such that the wave shape or the uneven shape of each of the opposing faces is in surface contact. As a result, The contact area between the heating member 52a and the cooling member 53 can be enlarged, And the heat between the heating member 52a and the cooling member 53 is moved faster, With this, The heating member 52a can be cooled more quickly. also, When the mounting member (the mounting member 51 side) of the IC device 90 is viewed from above, the heating member 52a is viewed from above. The cooling member 53 is preferably disposed to overlap the heating member 52a. With this configuration, The entire surface of the heating member 52a that abuts against the cooling member 53 is cooled. Therefore, the unevenness of the temperature distribution can be suppressed. And can be cooled quickly. According to the temperature adjustment unit 12A of the second embodiment, The same effects as those of the first embodiment described above can be obtained. In addition, According to the temperature adjustment unit 12A, The cooling member 53 can be moved by a simple power source like compressed air. The cooling member 53 is abutted or separated from the heating member 52, The device can be miniaturized. <Third embodiment> Next, Referring to Figure 9, A third embodiment of the temperature adjustment unit provided in the electronic component inspection device (inspection device 2) will be described. Fig. 9 is a front view (cross-sectional view) showing a third embodiment of the temperature adjustment unit provided in the electronic component inspection device. another, The temperature adjustment unit 12B of the third embodiment shown in Fig. 9 uses a power source that is positive pressure (second embodiment using compressed air) with respect to atmospheric pressure. The configuration of the cooling member 53 is driven by a power source of a negative pressure (the first embodiment using the ejector E as an intake source). therefore, In the description of the third embodiment, The configuration different from the above-described first embodiment and second embodiment will be described in detail. The same components are denoted by the same reference numerals, and their descriptions are sometimes omitted or simplified. The temperature adjustment unit 12B of the third embodiment shown in FIG. 9 is used for the inspection apparatus 2 (electronic component inspection apparatus) of the built-in electronic component conveying apparatus 100 as described with reference to FIGS. 1 and 2 . The temperature adjustment unit 12B has a substrate 54b, The heating member 52 on which the mounting member 51 is placed on one side, And the cooling member 53 located on the side opposite to the arrangement side of the mounting member 51 with respect to the heating member 52. And, The heating member 52 is connected to the base material 54b via the guide post 55, the O-ring 57, and the like. The cooling member 53 is connected to the base material 54b via the guide post 55. According to this configuration, Because the mounting member 51, Heating member 52, The cooling members 53 are arranged in an overlapping manner, Therefore, the spatial efficiency of the direction intersecting with the overlapping direction (for example, the vertical direction, that is, the Z direction) (for example, the horizontal direction, that is, the XY direction) can be improved. Further, it is possible to reduce the size of the inspection apparatus 2. The base material 54b includes a flat base portion 541b and a side wall portion 542. The side wall portion 542 has an inner circumferential surface along a side surface 52s of the heating member 52. It is erected circumferentially along the outer peripheral end of the base portion 541b. in this way, The base material 54b has a concave space by the base portion 541b and the side wall portion 542. At the base 541b, Two guide holes 54H which are arranged in parallel from the back side 54br of the space side of the base portion 541b are provided. In each of the guide holes 54H, The guide post 55 is fixed by fitting. The two guide posts 55 are erected from the base 541b toward the positive side in the Z direction. also, On the inner side of the side wall portion 542, A guiding groove (not shown) is disposed around the circumference of the side surface 52s of the heating member 52, The guiding groove is received for sealing between the base material 54b and the heating member 52, Fixed O-ring 57. also, At the base 541b, A screw hole 98 penetrating from the back surface 54br toward the concave side is provided. In the screw hole 98, a fixing screw embedded in the cylinder 96, The cylinder 96 is fixed by directing the tip end of the rod 97 toward the cooling member 53. The cylinder 96 is connected to a compressed air source P which is positive pressure with respect to atmospheric pressure. The rod 97 is operated by using compressed air supplied from the compressed air source P as a power source. The cooling member 53 can be pushed up to move it. The cooling member 53 can abut or separate from the heating member 52 by the movement caused by the rod 97. The heating member 52 has a side 52f, The other side 52r opposite to one side 52f, And connecting the side 52f to the side 52s of the other side 52r, The placing member 51 is placed on the one side 52f side. On the heating member 52, a guide hole 52H corresponding to each of the two guide posts 55 that are erected and fixed to the base material 54b, And an annular recess 52P formed on the other surface 52r side and formed substantially concentrically with the guide hole 52H. also, On the side 52s of the heating member 52, A guide groove (not shown) of the O-ring 57 is provided. And, The heating member 52 is such that its guiding post 55 is fitted to the guiding hole 52H. And the side surface 52s is supported by the base material 54b via the O-ring 57, It is fixed to the substrate 54b. And, Outside the guide post 55, A coil spring 56 which is an elastic member is disposed between the recess 52P and the cooling member 53. The coil spring 56 has one end abutting against the bottom of the recess 52P. The other end abuts against the abutting surface 53f of the cooling member 53. With this, The direction in which the cooling member 53 is separated (the negative side of the Z direction) with respect to the heating member 52 can be pushed toward. also, The heating member 52 includes a temperature sensor 820 as a temperature detector and a heater 840 as a heating portion. When the mounting member 51 is to be set to a temperature higher than a normal temperature, that is, a high temperature, Heated by heater 840, Further, it has a function as a heating unit that can heat the transported IC device 90 (mounting member 51). The heater 840 generates heat by power supply. And is controlled based on the detected temperature of the temperature sensor 820. in this way, By using the heater 840 as a heating portion, The heating member 52 can be efficiently heated in a simple configuration. also, On the heating member 52, Located on the other side of the 52r opening, Further, it penetrates through the through hole 95 on the side of the side surface 52s. The through hole 95 constitutes a part of the suction flow path, It is connected to the injector E as an intake source on the side 52s side. And, Actuated by the ejector E, The suction flow path including the through hole 95 is brought into a negative pressure state (vacuum state). also, In a state in which the cooling member 53 is pressed against the heating member 52 by the air cylinder 96, Actuated by the ejector E, And the suction flow path including the through hole 95, And by the substrate 54b, Heating member 52, The space S formed by the cooling member 53 is set to a negative pressure state (vacuum state), The cooling member 53 can be moved along the guide post 55 toward the heating member 52 side (the positive side in the Z direction). The cooling member 53 is further pressed against the heating member 52. in this way, The cooling member 53 is in a state in which the cooling member 53 is brought into contact with the heating member 52 by the operation of the cylinder 96 using compressed air. Further, the cooling member 53 is brought into close contact with the heating member 52 by the negative pressure (vacuum) formed by the ejector E. another, When the cooling member 53 is separated from the heating member 52, The elastic force of the coil spring 56 when the vacuum state is released by the ejector E to cancel the vacuum state, This is carried out by decompressing the compressed air of the cylinder 96. The cooling member 53 has an abutting surface 53f, And a back surface 53r opposite to the abutting surface 53f, Further, the abutting surface 53f is disposed to face the other surface 52r of the heating member 52. On the cooling member 53, Similarly to the first embodiment described above, A flow path hole 535 as a flow path for cooling the refrigerant of the cooling member 53 is provided. The cooling member 53 is as described above, By the action of the cylinder 96 (rod 97), And the elastic force of the coil spring 56, Sliding relative to the guide post 55, Instead, it can abut or separate from the other surface 52r of the heating member 52. another, The configuration of the cooling member 53 is the same as that of the first embodiment described above. Therefore, the description here is omitted. another, Similar to the first embodiment, The surface (the other surface 52r and the abutting surface 53f) of the heating member 52 and the cooling member 53 can be formed, for example, in a wave shape or a concave-convex shape. On the other hand, the wave shape or the uneven shape of each of the opposing members is placed in contact with each other in a planar manner. According to the temperature adjustment unit 12B of the third embodiment, The cooling member 53 can be brought into contact with the heating member 52 by the action of the cylinder 96 using compressed air. Further, the cooling member 53 is brought into close contact with the heating member 52 by the negative pressure (vacuum) formed by the ejector E. in this way, By adhering the cooling member 53 to the heating member 52, The movement of heat becomes smooth, The heating member 52 can be cooled more quickly. another, In the second embodiment and the third embodiment described above, Although an example in which the cylinder 96 using compressed air as a power source for moving the cooling member 53 is used as a driving source is disclosed, But it is not limited to this. E.g, A hydraulic system using a liquid (mainly mineral oil) as a transmission medium for energy can also be used as a power source for moving the cooling member 53. Set the hydraulic cylinder as the drive source. In this hydraulic system, Can also play the same effect. <Fourth embodiment> Next, Referring to Figure 10, A fourth embodiment of the temperature adjustment unit provided in the electronic component inspection device (inspection device 2) will be described. Fig. 10 is a front view (cross-sectional view) showing a fourth embodiment of the temperature adjustment unit provided in the electronic component inspection device. another, The temperature adjustment unit 12C of the fourth embodiment shown in FIG. 10 is compared with the temperature adjustment unit 12 of the first embodiment described above. The driving method of the cooling member 53c is different, However, the configuration of the placing member 51 and the heating member 52c is the same. another, In the description of the fourth embodiment, The configuration different from the above-described first embodiment will be described in detail. The mounting member 51 and the heating member 52c having the same configuration are denoted by the same reference numerals, and the description thereof may be omitted or simplified. The temperature adjustment unit 12C of the fourth embodiment shown in FIG. 10 is used for the inspection apparatus 2 (electronic component inspection apparatus) of the built-in electronic component conveying apparatus 100 as described with reference to FIGS. 1 and 2 . The temperature adjustment unit 12C has a substrate 54c, The heating member 52c on which the mounting member 51 is placed is placed on one side, And the cooling member 53c located on the side opposite to the arrangement side of the mounting member 51 with respect to the heating member 52c. And, The heating member 52c is connected to the substrate 54c via the guide post 55, The cooling member 53c is connected to the base material 54c via the guide post 55. According to this configuration, Similar to the first embodiment, It can improve the spatial efficiency in the horizontal direction, that is, the XY direction. Further, it is possible to reduce the size of the inspection apparatus 2. In the flat substrate 54c, Two guide holes 54H are provided in parallel to the front and back surfaces of the base material 54c. In each of the guide holes 54H, The guide post 55 is fitted and fixed. The two guide posts 55 are erected from the base 54c toward the positive side in the Z direction. also, On the substrate 54c, A cylinder mounting member 31 is attached. The cylinder mounting member 31 is provided with: Abutment 312, It is attached to the joint of the substrate 54c; And the erection part 311, It is at the end opposite to one end connected to the substrate 54c, It has a surface facing one side of the cooling member 53c and extends from the base 312 in the Z direction. The cylinder mounting member 31 is preferably disposed one on each side with respect to the cooling member 53c in a symmetrical configuration. In this embodiment, One of the cooling members 53c is also provided on both sides in the Y direction. In the standing department 311, A screw hole 35 penetrating the surface facing the one side and the opposite side of the cooling member 53c is provided. In the screw hole 35, a fixing screw embedded in the cylinder 34, The cylinder 34 is fixed by directing the tip end of the rod 36 toward the cooling member 53c. The cylinder 34 is connected to a compressed air source (not shown) that is positive pressure with respect to atmospheric pressure. The rod 36 is moved in and out by using compressed air supplied from a compressed air source as a power source. At the top end of the rod 36, A tilt cam 32 is attached. also, On the tilt cam 32, An inclined surface 33 that abuts against the cooling member 53c is provided. The tilting cam 32 is moved in and out by the rod 36 of the cylinder 34, Moving in the Y direction (the direction indicated by the arrow R in the figure), The position of the inclined surface 33 abutting on the cooling member 53c changes with the movement, With this, The cooling member 53c can be moved in the Z direction. By the movement of the Z direction, The cooling member 53c may abut or separate with respect to the heating member 52c (the other surface 52cr). The heating member 52c has one side 52cf, And the other side 52cr opposite to one side 52cf, The mounting member 51 is placed on one side of the 52cf side. On the heating member 52c, a guide hole 52H corresponding to each of the two guide posts 55 that are erected and fixed to the base material 54c, And an annular recess 52P formed on the other side 52cr side and substantially concentric with the guide hole 52H. And, Outside the guide post 55, A coil spring 56 which is an elastic member is disposed between the recess 52P and the cooling member 53c. The coil spring 56 has one end abutting against the bottom of the recess 52P. The other end abuts against the abutting surface 53cf of the cooling member 53c. With this, The direction in which the cooling member 53c is separated (the negative side in the Z direction) can be pushed toward the heating member 52c. another, The configuration of the other heating member 52c is the same as that of the first embodiment. Therefore, the description is omitted. The cooling member 53c has an abutting surface 53cf, And the back surface 53cr opposite to the abutting surface 53cf, Further, the abutting surface 53cf is disposed to face the other surface 52cr of the heating member 52c. another, On the back 53cr side, The abutting portion of the inclined cam 32 and the inclined surface 33 is preferably a rounded shape (arc shape) or the like. By setting this shape, The sliding of the inclined surface 33 and the cooling member 53c can be made smoother. On the cooling member 53c, Providing two guiding holes 59 through the abutting surface 53cf and the back surface 53cr, The cooling member 53c is slidably coupled to the base material 54c via the guide post 55 by the guide hole 59. another, The configuration of the other cooling member 53c is the same as that of the second embodiment. Therefore, the description is omitted. another, Similar to the above embodiment, The surface (the other surface 52cr and the abutting surface 53cf) of the heating member 52c and the cooling member 53c may be formed, for example, in a wave shape or a concave-convex shape. It is arranged such that the wave shape or the uneven shape of each of the opposing faces is in surface contact. According to the temperature adjustment unit 12C of the fourth embodiment, The action of the cylinder 34 in the Y direction by using compressed air as a driving source, The cooling member 53c is moved in the Z direction. in this way, When the driving source such as the air cylinder 34 that moves the cooling member 53c in the Z direction is disposed in the horizontal direction (XY direction), It is easy to ensure the supply or unloading of the IC device 90, The space from the action of the Z direction, the result, The space efficiency of the electronic component conveying device 100 (inspection device 2) can be improved. The device is miniaturized. <Fifth Embodiment> Next, Referring to Figure 11, A fifth embodiment of the temperature adjustment unit provided in the electronic component inspection device (inspection device 2) will be described. Fig. 11 is a front view (cross-sectional view) showing a fifth embodiment of the temperature adjustment unit provided in the electronic component inspection device. The temperature adjustment unit 12D of the fifth embodiment shown in FIG. 11 is applied to the IC device 90. And check, The inspection portion 16 of the electrical characteristics of the IC device 90 is tested (checked). At the inspection unit 16, A plurality of or a single IC socket 161 (mounting member) connected to the substrate 164 is provided. In this embodiment, As shown in Figure 11, There are a plurality of IC sockets 161. The temperature adjustment unit 12D of the fifth embodiment shown in FIG. 11 is used for the inspection apparatus 2 (electronic component inspection apparatus) of the built-in electronic component conveying apparatus 100 as described with reference to FIGS. 1 and 2 . The temperature adjustment unit 12D has a heating member 52d, And a cooling member 53d movable relative to the heating member 52d. The heating member 52d has a side 52df, And the opposite side of 52df is the other side 52dr, The other surface 52dr is in contact with the upper surface of the IC socket 161 (mounting member) on the side on which the mounting surface 163 of the IC device 90 is placed. another, The heating member 52d has an opening opposite to the recess 162 of the IC socket 161, The peripheral portion of the opening abuts on the upper surface of the IC socket 161 (mounting member). On the heating member 52d, A heater block 521 having a heat generating portion such as a heater 840 is connected, for example. It is heated to a high temperature such as positive 125 ° C. The cooling member 53d has an abutting surface 53df on the side of the heating member 52d, And the opposite surface of the abutting surface 53df, that is, the back surface 53dr. Although not shown, However, the cooling member 53d is provided with a flow hole for flowing the refrigerant, Flowing through the flow hole by the refrigerant, It is cooled to a low temperature such as minus 40 ° C. also, The cooling member 53d can be moved in the direction of the arrow Q in the drawing by a driving source (not shown). Instead, it can abut or separate from the heating member 52d. which is, The cooling member 53d may be abutted or separated from the heating member 52d as needed. With this, When the heating member 52d is to be cooled, Abutting the cooling member 53d to the heating member 52d, And in the case where the heating member 52d is to be heated, The cooling member 53d is separated from the heating member 52d. With this, Rapid cooling or heating of the heating member 52d can be performed. which is, The temperature of the IC socket 161 can be quickly changed (from high temperature to low temperature) in the inspection unit 16. another, In the first to fourth embodiments described above, Although the heating member 52, 52a, 52c, And a cooling member 53, 53c is applied as the temperature adjustment unit 12, 12A, 12B, The example of the 12C hot plate is explained. But it is not limited to this. E.g, The heating member 52 can also be 52a, 52c, And a cooling member 53, 53c is applied to the device transport head 17, Can be applied to and applied to the temperature adjustment unit 12, 12A, 12B, 12C the same effect. also, In the first to fourth embodiments described above, Although the heating member 52, 52a, 52c shows the configuration of the mounting member 51, But not limited to this, It can also be a heating member 52, 52a, 52c is provided as a mounting portion (mounting plate) of the mounting member 51, And on the mounting portion (mounting plate), The structure of the tray 200 is placed.

2‧‧‧Inspection device (electronic parts inspection device)
4‧‧‧Opening and closing department
6‧‧‧Transportation Department
11A‧‧‧Tray transport mechanism
11B‧‧‧Tray transport mechanism
12‧‧‧ Temperature Adjustment Department
12A～12D‧‧‧Temperature Adjustment Department
13‧‧‧Device Transfer Head
14‧‧‧Device Supply Department
15‧‧‧Tray transport mechanism
16‧‧‧Inspection Department
17‧‧‧Device transfer head
18‧‧‧Device Recycling Department
19‧‧‧Recycling tray
20‧‧‧Device Transfer Head
21‧‧‧Tray transport mechanism
22A‧‧‧Tray transport mechanism
22B‧‧‧Tray transport mechanism
31‧‧‧Cylinder mounting components
32‧‧‧ tilt cam
33‧‧‧Sloping surface
34‧‧‧ cylinder
35‧‧‧ screw holes
36‧‧‧ rod
51‧‧‧Loading components
52‧‧‧heating components
52a‧‧‧heating components
52af‧‧‧ side
52ar‧‧‧ the other side
52as‧‧‧ side
52c‧‧‧heating components
52cf‧‧‧ side
52cr‧‧‧ the other side
52d‧‧‧heating components
52df‧‧‧ side
52dr‧‧‧other side
52f‧‧‧ side
52H‧‧‧ Guide hole
52P‧‧‧ recess
52r‧‧‧other side
52s‧‧‧ side
53‧‧‧Cooling components
53c‧‧‧Cooling components
53cf‧‧‧ Abutment
53cr‧‧‧back
53d‧‧‧Cooling components
53df‧‧‧ abutment
53dr‧‧‧back
53f‧‧‧Abutment
53r‧‧‧back
54‧‧‧Substrate
54a‧‧‧Substrate
54ar‧‧‧back
54b‧‧‧Substrate
54br‧‧‧Back
54c‧‧‧Substrate
54H‧‧‧ Guide hole
54r‧‧‧back
55‧‧‧ Guide column
56‧‧‧Helical spring
57‧‧‧O-ring
57h‧‧‧ guiding slot
59‧‧‧ Guide hole
61‧‧‧1st partition wall
62‧‧‧2nd partition wall
63‧‧‧3rd partition wall
64‧‧‧4th partition
65‧‧‧5th partition
66‧‧‧Inside partition
70‧‧‧ front cover
70A‧‧‧ son front cover
70B‧‧‧ son front cover
71‧‧‧ side cover
72‧‧‧ side cover
73‧‧‧Back cover
74‧‧‧Top cover
75‧‧‧4th door panel
80‧‧‧Control Department
81‧‧‧Drive Control Department
82‧‧‧Check Control Department
83‧‧‧Memory Department
84‧‧‧ Temperature Control Department
85‧‧‧Heating Control Department
86‧‧‧Flow Control Room
88‧‧‧Cooling Control Department
90‧‧‧IC devices as electronic components
93a‧‧‧Inlet on the (IN) side
93b‧‧‧Outflow channel on the OUT side
95‧‧‧through holes
96‧‧‧ cylinder
97‧‧‧ rod
98‧‧‧ screw holes
99a‧‧‧Tubing
99b‧‧‧tubing
100‧‧‧Electronic parts conveying device
161‧‧‧IC socket
162‧‧‧ recess
163‧‧‧Loading surface
164‧‧‧Substrate
200‧‧‧Tray
300‧‧‧ monitor
301‧‧‧Display screen
311‧‧‧立部
312‧‧‧Abutment
400‧‧‧Signal lights
500‧‧‧Speakers
521‧‧‧ heater block
531‧‧‧O-ring
532‧‧‧ Keeping Department
533‧‧‧The Ministry of Cooling
534‧‧‧Refrigerant Cooling Department
535‧‧‧ as a flow hole through the hole
536‧‧‧Refrigeration Control Department
541‧‧‧ base
541a‧‧‧ base
541b‧‧‧ base
542‧‧‧ Side wall
600‧‧‧mouse table
700‧‧‧Operator panel
711‧‧‧1st door panel
712‧‧‧2nd door panel
721‧‧‧1st door panel
722‧‧‧2nd door panel
731‧‧‧1st door panel
732‧‧‧2nd door panel
733‧‧‧3rd door panel
800‧‧‧ concentration sensor
820‧‧‧temperature sensor
840‧‧‧heater
860‧‧‧Cooling valve
861‧‧‧ front cover
862‧‧‧ side cover
863‧‧‧ side cover
865‧‧‧ back cover
866‧‧‧ top cover
A1‧‧‧Tray supply area
A2‧‧‧Device supply area (supply area)
A3‧‧‧ inspection area
A4‧‧‧Device recycling area (recycling area)
A5‧‧‧Tray removal area
A6‧‧‧Control area
E‧‧‧Injector
IN‧‧‧ into
OUT‧‧‧ Out
P‧‧‧Compressed air source
Q‧‧‧ arrow
R‧‧‧ arrow
S‧‧‧ Space
S102‧‧‧Steps
S104‧‧‧Steps
S106‧‧‧Steps
S108‧‧‧Steps
S110‧‧‧Steps
S112‧‧‧Steps
T1‧‧‧temperature
T2‧‧‧temperature
T3‧‧‧temperature
X‧‧‧ axis (direction)
Y‧‧‧ axis (direction)
Z‧‧‧ axis (direction)
α _{1 1 A} ‧‧‧Arrow α _11B ‧‧‧Arrow α _13X ‧‧‧Arrow α _13Y ‧‧‧Arrow α ₁₄ ‧‧‧Arrow α ₁₅ ‧‧‧Arrow α _17Y ‧‧‧Arrow α ₁₈ ‧‧‧Arrow α _20X ‧‧‧Arrow α _20Y ‧‧‧Arrow α ₂₁ ‧‧‧Arrow α _22A ‧‧‧Arrow α _22B ‧‧‧Arrow α ₇₁ ‧‧‧Arrow α ₇₂ ‧‧‧Arrow α ₇₅ ‧‧‧Arrow α ₉₀ ‧‧‧Arrows α ₇₃₁ ‧‧‧Arrows α ₇₃₂ ‧‧‧Arrows α ₇₃₃ ‧‧‧Arrows

Fig. 1 is a schematic perspective view of the electronic component inspection device of the present invention viewed from the front side. Fig. 2 is a plan view of the electronic component inspection device. Figure 3 is a block diagram of an electronic component inspection device. 4A is a schematic view showing the operation of a temperature adjustment unit provided in the electronic component inspection device. 4B is a schematic view showing the operation of the temperature adjustment unit provided in the electronic component inspection device. 4C is a view showing a schematic configuration of a cooling member provided in the electronic component inspection device. FIG. 5A is a plan view showing a temperature adjustment unit (first embodiment) included in the electronic component inspection device. Fig. 5B is a front view (cross-sectional view) of the temperature adjustment unit (first embodiment) shown in Fig. 5A. Fig. 6 is a flowchart showing an example of a control operation of the temperature adjustment unit (first embodiment). Fig. 7 is a graph showing an example of temperature change of the temperature adjustment unit (first embodiment). Fig. 8 is a front view (cross-sectional view) showing a second embodiment of the temperature adjustment unit. Fig. 9 is a front view (cross-sectional view) showing a third embodiment of the temperature adjustment unit. Fig. 10 is a front view (cross-sectional view) showing a fourth embodiment of the temperature adjustment unit. Fig. 11 is a front view (cross-sectional view) showing a fifth embodiment of the temperature adjustment unit.

12‧‧‧ Temperature Adjustment Department

51‧‧‧Loading components

52‧‧‧heating components

52f‧‧‧ side

52H‧‧‧ Guide hole

52P‧‧‧ recess

52r‧‧‧other side

52s‧‧‧ side

53‧‧‧Cooling components

53f‧‧‧Abutment

53r‧‧‧back

54‧‧‧Substrate

54H‧‧‧ Guide hole

54r‧‧‧back

55‧‧‧ Guide column

56‧‧‧Helical spring

57‧‧‧O-ring

57h‧‧‧ guiding slot

59‧‧‧ Guide hole

93a‧‧‧Inlet on the (IN) side

93b‧‧‧Outflow channel on the OUT side

95‧‧‧through holes

99a‧‧‧Tubing

99b‧‧‧tubing

531‧‧‧O-ring

532‧‧‧ Keeping Department

535‧‧‧ as a flow hole through the hole

541‧‧‧ base

542‧‧‧ Side wall

820‧‧‧temperature sensor

840‧‧‧heater

IN‧‧‧ into

OUT‧‧‧ Out

Q‧‧‧ arrow

S‧‧‧ Space

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

Claims (11)

An electronic component conveying apparatus comprising: a conveying unit that can transport an electronic component; a mounting member that mounts the electronic component; and a heating member that is disposed on the mounting member and that mounts the electronic component The face is the opposite side; and the cooling member is disposed to be relatively movable with respect to the heating member. The electronic component conveying apparatus of claim 1, wherein the cooling member is disposed to be in contact with and separated from the heating member. The electronic component transport apparatus according to claim 1 or 2, wherein the cooling member overlaps with the heating member when the heating member is viewed from a side on which the electronic component is mounted. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the cooling member is disposed on a side opposite to an arrangement side of the placing member with respect to the heating member. The electronic component transporting apparatus according to claim 4, wherein the mounting member, the heating member, and the cooling member are disposed such that the mounting member is disposed on a side opposite to a direction perpendicular to the vertical direction and disposed in a vertical direction. The electronic component conveying apparatus according to any one of claims 1 to 5, wherein the cooling member is at least one of a positive pressure or a negative pressure with respect to atmospheric pressure as a power source, and is abutted or separated from the heating member. The electronic component conveying apparatus according to any one of claims 1 to 6, wherein the heating member includes a temperature detector that detects a temperature of the heating member. The electronic component conveying apparatus according to any one of claims 1 to 7, wherein the heating member has a heating portion and is set to a normal temperature without heating or cooling, or is set to be higher than the normal temperature by the heating portion. The cooling member has a cooling portion, and the cooling portion is set to a temperature lower than the normal temperature, that is, a low temperature; and the temperature of the heating member is changed from the high temperature or the normal temperature to the low temperature side. In this case, the heating of the heating member is stopped, and the cooling member is brought into contact with the heating member. The electronic component transporting apparatus of claim 8, wherein the heating section has a heater that generates heat by electric power. The electronic component conveying apparatus according to claim 8 or 9, wherein the cooling unit includes: a refrigerant cooling unit that cools the refrigerant; a passage through which the refrigerant passes; and a refrigerant control unit that controls supply of the refrigerant; and the refrigerant When the temperature of the heating member reaches a specific temperature, the control unit adjusts the supply amount of the refrigerant to slow the cooling rate of the heating member. An electronic component inspection apparatus comprising: a mounting member that mounts an electronic component; and a heating member that is disposed on a side opposite to a surface on which the electronic component is placed on the mounting member; and a cooling member that is disposed To be relatively movable with respect to the heating member; and an inspection portion that inspects the electronic component.