TW201729969A - Method for manufacturing tridimensional structure, die used in the same and electrical contact - Google Patents

Abstract

Provided is a method for manufacturing tridimensional structure, which includes pressing a resin plate with a die having a central part in a predetermined area formed with a recessed shape, to mold a surface shape of an end portion of a tridimensional structure, and forming a metal layer on a surface of the molded plate, so as to manufacture the tridimensional structure.

Description

Method for producing a three-dimensional structure, mold and electrical contact used in the manufacturing method

The present invention relates to a method for producing a three-dimensional structure, a mold used in the production method, and an electrical contact member as a three-dimensional structure produced by using the production method, and more specifically, the surface having the inclined surface A method of forming a three-dimensional structure of a fine metal of a concave portion, a mold having an inclined surface for forming a concave shape on a surface of the three-dimensional structure, and an electrical contact member produced by the production method.

In the method of using a metal as a body structure, a method in which a molten metal is poured into a plurality of molds and a mold is removed after cooling to form a desired three-dimensional structure is generally used. However, in the case where the structure has a fine three-dimensional structure having a diameter of about 10 μm to several 10 μm and a length of about 100 μm, different means are employed. For example, in the case of an electrical contact (probe) used for electrical inspection of a semiconductor device, the following method is employed: the three-dimensional structure to be fabricated is divided into an upper portion (front end portion), a middle portion (trunk portion), and a lower portion ( Base) A plurality of parts are sequentially formed by overlapping the front end portion, the trunk portion, and the base portion.

In the case where the above-described fine three-dimensional structure is a shape that requires a unique probe, that is, in terms of a probe, in order to make the probe contact the electrode of the semiconductor device, the front end portion is sharpened like a cone, or the front end portion is made. Tilting obliquely requires a wide variety of shapes. In the case where the inclined surface is formed at the tip end, a step of forming a concave portion having an inclined surface on the substrate, forming a metal thin film on the inner wall surface of the concave portion, and plating the metal thin film as an electrode to form an upper-layer metal layer is performed.

Further, in Patent Document 1, it is proposed that after forming a metal layer at the tip end portion, a resist is applied to form a metal layer of the trunk portion, and this is exposed and developed in a predetermined pattern, thereby forming a corresponding pattern. The surface is exposed, and a metal structure of a predetermined pattern is formed by electroforming a metal layer on the exposed surface, and a metal layer of the base is sequentially formed in the same manner. After forming the metal layers of the front end portion, the trunk portion, and the base portion, the substrate, the metal thin film, and the resist are removed to form a three-dimensional structure formed of the metal layer. However, in the three-dimensional structure disclosed in Patent Document 1, a hard tool for crimping a diamond indenter or the like is described as a means for forming a shape of a protrusion on the upper portion, but it is not specifically described, and a means for realizing it is not disclosed at all. Therefore, photolithographic is the mainstream, and it is deadlocked.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-121469

There is no particular problem in the production of a single structure by the above-described method of manufacturing a three-dimensional structure for electroforming. However, when a plurality of three-dimensional structures are to be formed at the same time, in particular, the inclined surface of the front end portion may be produced. problem.

Conventionally, a concave portion having an inclined surface is formed on a substrate, and generally, a portion in which a concave portion is formed is exposed, and a hard tool such as a diamond indenter having a sharp tip is pressed or etched, but when the tip end portion is sharp. Although the shape of the end portion of the desired shape can be obtained by pressing a mold having a sharp shape, when the concave portion is formed on the surface of the front end portion, there is a problem that the mold having an appropriate shape is not formed. Further, it is conceivable that the inclined surface is formed in a stepwise manner by overlapping of a plurality of layers, but it is necessary to form a smooth surface as much as possible, and there is a problem that a large amount of time is consumed. Further, it is unexpected to produce a three-dimensional structure having a concave portion having an inclined surface at the tip end.

An object of the present invention is to solve the above problems and to provide a method for producing a three-dimensional structure, which is capable of forming a plurality of three-dimensional structures with high precision in a short time as much as possible.

The present invention provides a method for fabricating a three-dimensional structure, which is formed by pressing a flat plate of a resin in a central portion of a predetermined region to form a surface shape of a front end portion of the three-dimensional structure, and the formed flat plate A metal layer is formed on the surface to form a three-dimensional structure.

According to the present invention, the front end portion of the three-dimensional structure can be formed by the mold of the resin by the mold, so that a plurality of three-dimensional structures having the same surface shape can be repeatedly formed, and the first three-dimensional structure is formed on the resin plate. A resist layer is used to form the reference disk, so that the step after the reference disk can be maintained at a high precision.

1‧‧‧Mold

2‧‧‧First Acrylic Sheet

3‧‧‧Sacrificial metal layer

4‧‧‧Resist layer

5‧‧‧ body metal layer

6‧‧‧ mask layer

7‧‧‧Second acrylic sheet

8‧‧‧ Third Acrylic Sheet

11‧‧‧Ontology

12‧‧‧through holes

13‧‧‧Sloping surface

14‧‧‧ Protrusion

15‧‧‧Ditch Department

20‧‧‧ benchmark

21‧‧‧ sloped surface

22‧‧‧Protruding

41‧‧‧Resist layer

70‧‧‧ boards

71‧‧‧through holes

72‧‧‧Mold

73‧‧‧ points

81‧‧‧through holes

100‧‧‧Three-dimensional structure

101‧‧‧ probe

1011‧‧‧Parts

1012‧‧‧ sloped surface

1013‧‧‧Base section

Fig. 1 is a view showing the steps of a manufacturing process of the three-dimensional structure of the present invention.

Fig. 2 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 3 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 4 is a diagram showing the comparison of the molds.

Fig. 5 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 6 is a view showing the steps of the steps of fabricating the three-dimensional structure of the present invention.

Fig. 7 is a view showing the steps of the steps of fabricating the three-dimensional structure of the present invention.

Fig. 8 is a view showing the steps of the steps of producing the three-dimensional structure of the present invention.

Fig. 9 is a view showing the steps of the manufacturing steps of the three-dimensional structure of the present invention.

Fig. 10 is a view showing the steps of the manufacturing steps of the three-dimensional structure of the present invention.

Fig. 11 is a view showing the steps of the steps of producing the three-dimensional structure of the present invention.

Fig. 12 is a view showing the steps of the steps of producing the three-dimensional structure of the present invention.

Fig. 13 is a schematic view showing the plating state of the present invention.

Fig. 14 is a schematic view showing a plating state of the present invention.

Fig. 15 is a schematic view showing a plating state of the present invention.

Fig. 16 is a view showing the steps of the steps of producing the three-dimensional structure of the present invention.

Fig. 17 is a view showing the steps of the steps of producing the three-dimensional structure of the present invention.

Fig. 18 is a schematic view showing a state in which a through hole is formed in a flat plate in the present invention.

Fig. 19 is a schematic view showing a state in which a through hole is formed in a flat plate in the present invention.

Fig. 20 is a view showing the steps of the manufacturing steps of the three-dimensional structure of the present invention.

Fig. 21 is a schematic view showing an example of the probe of the present invention.

Fig. 22 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 23 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 24 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 25 is an explanatory view of a mold used in the production steps of the present invention.

Fig. 26 is a schematic view showing a state of molding of a mold by the present invention.

Embodiment 1

Fig. 1 is a view showing a step of molding by a mold in the steps of the first embodiment of the present invention. As shown in the figure, in the step of Fig. 1, molding is performed by applying pressure to the first acrylic plate 2 as a resin sheet using the mold 1. In the above molding, the first acrylic sheet 2 is heated to make it easy to deform. Further, the mold 1 is also heated to make the first acrylic sheet 2 easy to deform. The cross-sectional shape of the mold 1 used therein is as shown in Fig. 1, but the production of the mold 1 is carried out as shown in Figs. 2 and 3. First, as shown in FIG. 2, the through hole 12 is provided in the central axis of the cylindrical body 11, and etching is performed to form the inclined surface 13 in the opening of the through hole 12 as shown in FIG. Further, the mold 1 can be made of a material mainly composed of nickel.

As shown in Fig. 2, after the through hole 12 is opened in the center axis of the mold 1, as shown in Fig. 3, a desired inclined surface 13 is formed by etching. As shown in Fig. 3, the through hole 12 is provided in the central axis of the cylindrical body 11, which has a unique effect.

The mold 1 of the comparative example of the mold 1 of the present invention has a shape without the through hole 12 as shown in Fig. 4 . When the mold 1 shown in FIG. 4 is pressed to the first acrylic sheet 2 and the first acrylic sheet 2 is molded, the concave portion in the central portion of the mold 1 and the first acrylic sheet 2 are Air pockets are created between the surfaces, making it difficult to apply the pressing force of the mold 1 to the first acrylic sheet 2, causing the molding to be formed in an unexpected manner. In order not to produce In the air pocket, the mold 1 must form a through hole 12 as a vent hole.

Further, in the molds shown in Figs. 2 and 3, the outer side is formed into a cylindrical shape, but the outer shape is not limited thereto, and the mold 1 in the case where a plurality of structures are simultaneously formed is shown in Fig. 5. A plurality of regions may be formed on the surface of the flat plate-shaped main body 11, and the through holes 12 may be provided in the central portion of each of the regions, and the inclined faces 13 may be provided by etching around the through holes 12. Further, Fig. 5 is a view showing a case where the mold 1 is in the shape of a flat plate, so that a part of the mold is judged in a manner of judging the cross section.

After the pressure is applied to the first acrylic sheet 2 by using the mold 1 shown in FIG. 3 above, the mold 1 is removed, and as shown in FIG. 6, the first acrylic sheet 2 remains with the mold 1. The inclined surface 21 of the inclined surface 13 has the same shape, and the portion of the through hole 12 of the mold 1 has a slight projection 22 because the first acrylic sheet 2 can be released during molding. In the drawing shown in Fig. 6, since it is difficult to judge the actual shape because it is a sectional view, the shape of the first acrylic plate 2 after molding is shown in a perspective view in Fig. 7 . As shown in FIG. 7, the first acrylic plate 2 has an inclined surface 21 and a protruding portion 22.

Further, in the step of molding in Fig. 7, although only one molding portion is shown, in actual processing, as shown in Fig. 8, a plurality of portions are simultaneously performed, whereby efficiency can be improved.

After the molding step of Fig. 6, as shown in Fig. 9, a sacrificial metal layer 3 is formed on the surface of the first acrylic sheet 2 after molding. The sacrificial metal layer 3 is formed as an electrode when the stereostructure 100 is formed by electroplating. Next, as shown in FIG. 10, the entire layer is covered by the resist layer 4, and is blocked. The agent layer 4 is applied with a mask, and as shown in Fig. 11, the sacrificial metal layer 3 of the inclined surface 21 is exposed, and the resist layer 41 around the inclined surface 21 is left.

Further, as shown in Fig. 12, the surface of the sacrificial metal layer 3 surrounded by the inner wall surface of the resist layer 41 is plated, whereby the bulk metal layer 5 is formed.

The state in which plating is performed using the exposed sacrificial metal layer 3 will be described using FIG. The state of plating shown in Fig. 13 is a case where the convex portion of the bottom surface and the central portion has a sacrificial metal layer. In this case, a plating layer is formed along the sacrificial layer, and the plating layer is formed from the bottom surface and the wall surface of the convex portion. The state of plating shown in Fig. 14 shows the case where the sacrificial layer is exposed only to the bottom surface. In this case, the plating layer is formed in parallel with respect to the bottom surface.

The state of electroplating shown in Fig. 15 is a comparative example showing a case where the sacrificial metal layer is expanded on the inner wall surface of the concave portion. In this case, since the plating layer is formed from the bottom surface and the side surface, in some cases, the plating liquid is sealed in the plating layer.

After the bulk metal layer 5 is formed, the first acrylic plate 2, the resist layer 4, and the bulk metal layer 5 are integrally formed, and are ground as shown in Fig. 16 to form the reference disk 20. The reference disk 20 is a structure in which a structure in which an upper portion (front end portion) of the three-dimensional structure 100 to be formed is embedded is formed, and the intermediate portion (foot portion) is sequentially formed by plating, based on the portion. Lower part (base part).

The reference plate 20 is composed of a first acrylic plate 2, a sacrificial metal layer 3, a resist layer 4, and a bulk metal layer 5. Among them, the first pressure The force plate 2 is pressurized at the time of molding, but the back surface of the first acrylic plate 2 is maintained in a flat state, and the mold 1 is caused to sink to a predetermined depth of the first acrylic plate 2. Therefore, the resist layer 4 and the bulk metal layer 5 are polished on the basis of the back surface of the first acrylic plate 2, whereby the body metal layer 5 is adjusted to the reference height.

The reference plate 20 is completed, that is, as shown in Fig. 17, in order to form the intermediate portion (foot portion) of the body structure 100 in the reference disk 20, the mask layer 6 is formed, and the intermediate portion (foot portion) is formed by selective plating. ). In the first embodiment, since the probe is exemplified and a special shape is displayed, even if it is another structure, as long as the reference disk 20 is completed, various shapes can be realized.

The mask layer 6, usually stacked on the reference pad 20, is obtained by removing a predetermined pattern from the resist layer. The intermediate portion (foot portion) of the solid structure 100 is formed by laminating a portion of the pattern of the resist layer removed by plating to form a metal layer.

However, when a resist layer is used as the mask layer 6, since a thick layer cannot be formed in one step, formation of a resist layer, formation of a metal layer, and polishing are repeated, which causes a problem of a processing time.

This problem can be overcome by using the second acrylic plate 7 of a predetermined thickness.

The second acrylic sheet 7 is a thickness that is the size of the intermediate portion (foot portion) of the three-dimensional structure 100, and a through hole 71 is provided in a portion corresponding to the leg portion. The second acryl plate 7 is superposed on the reference plate 20, and the body metal layer 5 exposed to the through hole 71 can be used as an electrode and plated. A metal layer of the foot is formed.

Since the second acrylic plate 7 used here is extremely fine, the through hole 71 is extremely fine, and a special method is required when the through hole 71 is provided.

A method of providing the through hole 71 in the second acrylic plate 7 will be described. As shown in Fig. 18, a plate member 70 thicker than the acrylic plate 7 to be used is prepared, and from the surface side of the thick plate member 70, the hole portion 73 is formed by the through hole mold 72. After the hole portion 73 is formed, as shown in Fig. 19, from the back side of the thick plate member, it is ground to a predetermined thickness. Further, the hole portion 73 is turned into the through hole 71 by repeated polishing. The second acrylic sheet 7 formed as described above is adjusted in position by the alignment mark or the like on the reference tray 20, and is superposed on a predetermined place.

The preparation of the second acryl plate 7 is performed in parallel with the production of the reference plate 20, and the steps can be shortened by combining the two structures at the stage of preparation.

Similarly to the formation of the intermediate portion (foot portion) of the three-dimensional structure 100, the third acrylic plate 8 having the predetermined pattern of through holes 81 is also overlapped in the lower portion (base portion), and by Electroplating can be used as a lower portion (base portion) of the body structure 100.

When the lower portion (base portion) of the three-dimensional structure 100 is fabricated, the first acrylic plate 2, the sacrificial metal layer 3, the resist layer 41, the second acrylic plate 7, and the third acrylic plate 8 are removed. Thus, as shown in FIG. 20, the three-dimensional structure 100 having a predetermined shape in which the structure of the upper portion (front end portion), the structure of the intermediate portion (foot portion), and the structure of the lower portion (base portion) are integrated is obtained. .

According to the method of fabricating the three-dimensional structure 100, it is possible to A three-dimensional structure having a special shape at the front end.

Next, a probe 101 having a special shape at the tip end in the case of a three-dimensional structure will be described.

Since the probe 101 is in contact with the electrode of the semiconductor device and detects an electrical signal accompanying the operation of the semiconductor device, it is necessary to reliably contact the electrode of the semiconductor device. Therefore, the shape of each of the various types of probes is conceivable. However, when the electrodes of the semiconductor device have a spherical shape, there is no such thing as to surround such an electrode.

That is, as shown in Fig. 21, the probe 101 of the special shape is configured such that a plurality of fingers 1011 extending in a vertical manner are in contact with one electrode. Further, the front end of the finger portion has an inclined surface 1012 for guiding the spherical electrode to the central portion of the front end position of the plurality of fingers. That is, the fingers 1011 are three or more, and the inclined surface 1012 is provided so as to face the center of the front end of the plurality of fingers 1011. Further, each of the fingers 1011 is configured to have flexibility and to be in soft contact with the electrodes of the semiconductor device.

If the performance is changed, the overall shape of the probe 101 is similar to the shape of the wrist. The base portion 1013 is connected to the palm of the hand, and the finger portion 1011 has a shape extending toward the contact object, and is formed such that the tip end of the finger portion 1011 is in contact with the electrode of the semiconductor device.

According to the above configuration, the shape of the probe 101 that contacts the electrode of the semiconductor device in a surrounding manner can be provided.

In addition, this special shape can also be used for configurations other than the probe. For example, as an electrical contact, it can also be used as an electrical connection. Used in contact with the structure. In other words, when the electrode of the semiconductor device has a spherical shape, as a connection means for replacing the lead frame, a plurality of fingers are electrically connected to each other to be an effective structure.

In addition, as a three-dimensional structure for electrical connection, a structure in which four fingers 1011 are in contact with each other is shown in FIG. 21, but in the case where electrical connection is assumed, three fingers are required to be in stable contact. effect. That is, in the case of four fingers, all the fingers should be in equal contact, and all the fingers must be bent. If there is no bending, one of the four fingers will not be in contact, and if not, the contact is not Stable, it forms an electronic micro-discharge phenomenon, causing interference to the electrical signal to be processed. Therefore, it is meaningful to set the fingers to three in order to stabilize the contact.

In addition, since the three fingers are formed by electroplating, the materials are the same. Among them, among the three, the bendability or the elasticity can be changed by changing the sectional area of one or two. By changing the elastic force, the finger portion which is easily deformed can be used to determine the direction in which the semiconductor device can be moved when an external force is applied thereto.

Embodiment 2

The shape of the mold of the first embodiment is such that the shape of the concave portion is provided at the central portion of the predetermined region, and the shape of the conical shape is cut from the cylindrical shape. On the other hand, in the second embodiment, in order to shorten the step of molding the resin sheet by the mold, it is further examined to determine the shape of the mold according to the shape of the objective three-dimensional structure.

That is, as shown in Fig. 21, the three-dimensional structure of the object is as follows: The shape is used as an electrical contact: the base portion 1013 is connected like a palm, and the finger 1011 is shaped to extend toward the contact object, and the front end of the finger 1011 is provided with an inclined surface 1012.

Specifically, the special-shaped three-dimensional structure is a shape in which a front end portion of a resin flat plate is molded by a mold, and is specifically limited to a front end portion of a finger portion that needs to be an inclined surface instead of the conical surface of the first embodiment. To highlight the shape of the mold.

Specifically, as shown in Fig. 22, the mold 1 is formed in a pair of the main body 11 and provided with a projection 14 having an inclined surface 13 at the front end portion. The common point with the first embodiment is that the central portion of the predetermined region is formed into a concave shape. In the second embodiment, the structure in which the projections 14 are provided at four locations is shown, but the number of the projections 14 can be further increased or decreased.

The mold 1 is cut away from a part of the perspective view as shown in Fig. 23, and the through hole 12 is provided in the main body 11, and a release path at the time of molding of the resin sheet is provided. Further, as shown in Fig. 24, a plurality of groove portions 15 are provided on the side surface of the projection 14 of the mold 1 so as to be pressed in the direction in which the resin is pressed by the projections 14 (the direction of the arrow in the drawing). The groove portion 15 is formed by molding the resin using the mold 1, and the resin is vibrated by the pressing of the mold 1 to prevent a large amount of pulsation from remaining in the resin.

Also in the second embodiment, as in the first embodiment, the mold 1 can be placed on the plurality of planes to simultaneously form a plurality of portions. This state is as shown in Fig. 25.

Further, as shown in Fig. 22, the front end portion of the projection 14 portion of the mold 1, as shown in the drawing, does not only have the inclined surface 13, but has a flat Face part. This planar portion is a desired shape in terms of a mold even if it is not required for the shape of the intended three-dimensional structure. That is, in order to have the mechanical strength required for the mold, it is necessary to have a structure of the block as much as possible. In this mold, if the portion is set to have only an inclined surface, the protrusion is broken.

When the resin is plate-formed by the mold of the second embodiment, as shown in Fig. 26, the shape of the inclined surface of the front end portion of the three-dimensional structure obtained by extracting the objective three-dimensional structure can be obtained.

In the first and second embodiments, the shape of the front end portion of the three-dimensional structure is formed by the mold on the resin sheet. However, it is preferable that the resin sheet has a weight average molecular weight of 1,000 to 100,000 for the resin flat plate molding. In particular, an acrylic plate having a weight average molecular weight of 30,000 or less is suitable. This is because when the resin is molded by a mold, if the molecular weight is too small, the memory of the deformation at the time of molding tends to remain.

Further, in the embodiment of the invention, the example in which the slab is used for the slab is described, but it is needless to say that a flat plate of another resin can be used.

Further, the present invention can be freely combined with the embodiments, or modified as appropriate, and the embodiments are omitted within the scope of the invention.

1‧‧‧Mold

2‧‧‧First Acrylic Sheet

Claims (10)

A method for fabricating a three-dimensional structure is formed by pressing a flat plate of a resin in a central portion of a predetermined region to form a surface shape of a front end portion of the three-dimensional structure, and forming a surface of the formed flat plate. A three-dimensional structure is produced by a metal layer. A method for fabricating a three-dimensional structure, wherein a first flat plate of a reference resin is formed into a surface shape of an upper portion of a three-dimensional structure by a mold, and a sacrificial metal layer is formed on a surface of the first flat plate, and Forming a first resist layer around the surface shape of the upper portion, and forming a bulk metal layer by plating a surface of the sacrificial metal layer surrounded by an inner wall surface of the first resist layer, so that the first flat plate, The first resist layer and the main metal layer are integrally formed, and the integrated structure is polished to form a three-dimensional structure as a reference disk. The method for producing a three-dimensional structure according to the first or second aspect of the invention, wherein the resin has a weight average molecular weight of 1,000 or more and 100,000 or less. The method for producing a three-dimensional structure according to the first or second aspect of the invention, wherein the resin has a weight average molecular weight of 1,000 or more and 30,000 or less. The method of manufacturing a three-dimensional structure according to claim 2, wherein a second flat plate having a through hole having a predetermined shape is superposed on the reference disk, and the reference plate is passed through the through hole of the second flat plate The foregoing body metal layer serves as an electrode to form a metal plating a layer forms a second metal structure bonded to the body metal layer. A mold used for the production of a three-dimensional structure has a columnar shape and is provided with a through hole in a pressing direction on a pressing surface, and an inclined surface is formed from a periphery of the pressing surface toward the through hole. The mold according to claim 6, wherein the side surface is provided with a groove portion along the pressing direction. An electrical contact comprising a base and a plurality of fingers extending perpendicularly from the base; wherein the front end of the plurality of fingers has a central portion of the plurality of fingers before the base Sloping sloped surface. The electrical contact of claim 8, wherein the plurality of root fingers are three. The electrical contact of claim 8, wherein the plurality of fingers have different elastic forces.