TW201726876A - Photocurable resin composition and method for producing picture display device - Google Patents
Photocurable resin composition and method for producing picture display device Download PDFInfo
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- C—CHEMISTRY; METALLURGY
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract
Description
本發明係關於一種將影像顯示構件與配置於其表面側之透光性光學構件經由透光性硬化樹脂層而接著並積層而製造影像顯示裝置時所使用之用以形成透光性硬化樹脂層之光硬化性樹脂組成物、及影像顯示裝置之製造方法。本申請案係以於日本在2015年9月1日提出申請之日本申請編號特願2015-171790、及於日本在2015年9月29日提出申請之日本申請編號特願2015-192011為基礎而主張優先權者,該等申請案係藉由參照而引用於本申請案中。 The present invention relates to a method for producing a light-transmitting and hardening resin layer by using an optically-transparent optical member disposed on a surface of a light-transmitting resin layer and then laminating a layer to form an image display device. A photocurable resin composition and a method of producing an image display device. This application is based on the Japanese application number No. 2015-171790, which was filed on September 1, 2015 in Japan, and the Japanese application number 2015-192011, which was filed on September 29, 2015 in Japan. Those who claim priority are referred to in this application by reference.
用於智慧型手機等資訊終端之液晶顯示面板等影像顯示裝置係例如於液晶顯示面板或有機EL面板等影像顯示構件與透光性光學構件之間配置光硬化性樹脂組成物,而形成光硬化性樹脂組成物層。其後,向光硬化性樹脂組成物層照射光而使其硬化而製成透光性硬化樹脂層。如此,影像顯示裝置係藉由將影像顯示構件與透光性光學構件進行接著並積層而製造。 For example, a video display device such as a liquid crystal display panel such as a liquid crystal display panel or an organic EL panel is provided with a photocurable resin composition to form a photohardenable resin. A layer of a resin composition. After that, the photocurable resin composition layer is irradiated with light and cured to form a light-transmitting and curing resin layer. As described above, the image display device is manufactured by laminating the image display member and the translucent optical member.
作為光硬化性樹脂組成物,提出有例如含有(甲基)丙烯酸酯低聚物成分、(甲基)丙烯酸烷基酯單體成分、光聚合起始劑、及塑化劑成分 之光硬化性樹脂組成物(例如參照專利文獻1、2)。 The photocurable resin composition contains, for example, a (meth) acrylate oligomer component, an alkyl (meth) acrylate monomer component, a photopolymerization initiator, and a plasticizer component. The photocurable resin composition (for example, refer to Patent Documents 1 and 2).
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2014-237745號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-237745
[專利文獻2]國際公開第2013/013568號 [Patent Document 2] International Publication No. 2013/013568
為了獲得更充分之接著強度,有欲將透光性硬化樹脂層(光硬化性樹脂組成物之硬化物)之玻璃轉移溫度設計為使用溫度以上之高溫之情形。 In order to obtain a more sufficient adhesive strength, it is desirable to design the glass transition temperature of the light-transmitting and hardening resin layer (hardened product of the photocurable resin composition) to a high temperature of a temperature higher than the use temperature.
此處,已知有如下傾向:低溫環境下之透光性硬化樹脂層之彈性模數越高,因低溫環境下之掉落衝擊等而透光性硬化樹脂層與被接著體(例如透光性光學構件或影像顯示構件)越容易剝離。已知尤其於硬化性樹脂組成物層之玻璃轉移溫度較高之情形時,此種傾向較為明顯。因此,要求可降低低溫環境下之透光性硬化樹脂層之彈性模數之光硬化性樹脂組成物。 Here, there is a tendency that the higher the elastic modulus of the light-transmitting and hardening resin layer in a low-temperature environment, the light-transmitting hardened resin layer and the adherend (for example, light transmission) due to a drop impact or the like in a low-temperature environment. The more easily the optical member or the image display member is peeled off. It is known that this tendency is remarkable especially when the glass transition temperature of the layer of the curable resin composition is high. Therefore, a photocurable resin composition capable of reducing the elastic modulus of the light-transmitting and hardening resin layer in a low-temperature environment is required.
本發明係鑒於此種先前之實際情況而提出者,提供一種可降低低溫環境下之透光性硬化樹脂層之彈性模數之光硬化性樹脂組成物。 The present invention has been made in view of such a conventional situation, and provides a photocurable resin composition capable of reducing the elastic modulus of a light-transmitting and hardening resin layer in a low-temperature environment.
本發明之光硬化性樹脂組成物含有具有胺酯(urethane)骨架之(甲基)丙烯酸系低聚物、(甲基)丙烯酸酯單體、聚合起始劑、及塑化劑, 且塑化劑含有1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之至少1種。 The photocurable resin composition of the present invention contains a (meth)acrylic oligomer having a urethane skeleton, a (meth) acrylate monomer, a polymerization initiator, and a plasticizer. Further, the plasticizer contains at least one of a polybutadiene having a 1,2 bond ratio of less than 80% and a polyisoprene having a 1,2 bond ratio of less than 80%.
又,本發明之影像顯示裝置之製造方法具有以下步驟:將光硬化性樹脂組成物塗佈於透光性光學構件之表面或影像顯示構件之表面之步驟;將影像顯示構件與透光性光學構件經由光硬化性樹脂組成物而貼合之步驟;及使光硬化性樹脂組成物硬化之步驟;且光硬化性樹脂組成物係上述光硬化性樹脂組成物。 Further, the method for producing an image display device of the present invention has the steps of: applying a photocurable resin composition to the surface of the translucent optical member or the surface of the image display member; and displaying the image display member and the transmissive optical a step of bonding the member via the photocurable resin composition; and a step of curing the photocurable resin composition; and the photocurable resin composition is the photocurable resin composition.
本發明係藉由使用含有具有胺酯骨架之(甲基)丙烯酸系低聚物、(甲基)丙烯酸系單體、1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之至少1種之光硬化性樹脂組成物,可降低低溫環境下之透光性硬化樹脂層之彈性模數。 The present invention is achieved by using a (meth)acrylic oligomer having an amine ester skeleton, a (meth)acrylic monomer, a 1,2 bond ratio of less than 80% of polybutadiene, and 1, The photocurable resin composition of at least one of polyisoprene having a bonding ratio of less than 80% can reduce the elastic modulus of the light-transmitting and hardening resin layer in a low-temperature environment.
1‧‧‧遮光層 1‧‧‧ shading layer
2‧‧‧透光性光學構件 2‧‧‧Transparent optical components
2a‧‧‧透光性光學構件之遮光層形成側表面 2a‧‧‧The light-shielding layer of the translucent optical member forms the side surface
3‧‧‧光硬化性樹脂組成物層 3‧‧‧Photocurable resin composition layer
3A‧‧‧光硬化性樹脂組成物 3A‧‧‧Photocurable resin composition
4‧‧‧階差 4‧‧ ‧ step
5‧‧‧暫時硬化樹脂層 5‧‧‧ Temporary hardening resin layer
6‧‧‧影像顯示構件 6‧‧‧Image display component
7‧‧‧透光性硬化樹脂層 7‧‧‧Transparent hardening resin layer
10‧‧‧影像顯示裝置 10‧‧‧Image display device
31、32‧‧‧玻璃板 31, 32‧‧‧ glass plates
33‧‧‧玻璃接合體 33‧‧‧glass joint
34‧‧‧間隔片 34‧‧‧ Spacer
35‧‧‧透光性硬化樹脂層 35‧‧‧Transparent hardening resin layer
36‧‧‧治具 36‧‧‧ fixture
圖1A係表示影像顯示裝置之製造方法之步驟(A1)之一例之說明圖。 Fig. 1A is an explanatory view showing an example of a step (A1) of a method of manufacturing a video display device.
圖1B係表示影像顯示裝置之製造方法之步驟(B1)之一例之說明圖。 Fig. 1B is an explanatory view showing an example of a step (B1) of a method of manufacturing a video display device.
圖1C係表示影像顯示裝置之製造方法之步驟(C1)之一例之說明圖。 Fig. 1C is an explanatory view showing an example of a step (C1) of the method of manufacturing the image display device.
圖1D係表示影像顯示裝置之製造方法之步驟(C1)之一例之說明圖。 Fig. 1D is an explanatory view showing an example of a step (C1) of a method of manufacturing a video display device.
圖2A係表示影像顯示裝置之製造方法之步驟(A2)之一例之說明圖。 Fig. 2A is an explanatory view showing an example of a step (A2) of a method of manufacturing a video display device.
圖2B係表示影像顯示裝置之製造方法之步驟(A2)之一例之說明圖。 Fig. 2B is an explanatory view showing an example of a step (A2) of the method of manufacturing the image display device.
圖2C係表示影像顯示裝置之製造方法之步驟(B2)之一例之說明圖。 2C is an explanatory view showing an example of the step (B2) of the method of manufacturing the image display device.
圖2D係表示影像顯示裝置之製造方法之步驟(B2)之一例之說明圖。 2D is an explanatory view showing an example of the step (B2) of the method of manufacturing the image display device.
圖2E係表示影像顯示裝置之製造方法之步驟(C2)之一例之說明圖。 2E is an explanatory view showing an example of a step (C2) of the method of manufacturing the image display device.
圖2F係表示影像顯示裝置之製造方法之步驟(D2)之一例之說明圖。 2F is an explanatory view showing an example of the step (D2) of the method of manufacturing the image display device.
圖2G係表示影像顯示裝置之製造方法之步驟(D2)之一例之說明圖。 2G is an explanatory view showing an example of the step (D2) of the method of manufacturing the image display device.
圖3A係表示影像顯示裝置之製造方法之步驟(A3)之一例之說明圖。 3A is an explanatory view showing an example of a step (A3) of the method of manufacturing the image display device.
圖3B係表示影像顯示裝置之製造方法之步驟(A3)之一例之說明圖。 Fig. 3B is an explanatory view showing an example of a step (A3) of the method of manufacturing the image display device.
圖3C係表示影像顯示裝置之製造方法之步驟(B3)之一例之說明圖。 3C is an explanatory view showing an example of the step (B3) of the method of manufacturing the image display device.
圖3D係表示影像顯示裝置之製造方法之步驟(B3)之一例之說明圖。 3D is an explanatory view showing an example of the step (B3) of the method of manufacturing the image display device.
圖3E係表示影像顯示裝置之製造方法之步驟(C3)之一例之說明圖。 3E is an explanatory view showing an example of a step (C3) of the method of manufacturing the image display device.
圖4係表示形成有透光性硬化樹脂層之玻璃接合體之立體圖。 4 is a perspective view showing a glass joined body in which a light-transmitting and hardening resin layer is formed.
圖5係圖4中之A-A'剖面圖。 Figure 5 is a cross-sectional view taken along line A-A' of Figure 4.
圖6係用以說明形成有透光性硬化樹脂層之玻璃接合體之接著強度試驗之剖面圖。 Fig. 6 is a cross-sectional view for explaining a bonding strength test of a glass bonded body in which a light-transmitting and hardening resin layer is formed.
圖7係用以說明形成有透光性硬化樹脂層之玻璃接合體之接著強度試驗之俯視圖。 Fig. 7 is a plan view showing the adhesion strength test of the glass joined body in which the light-transmitting and hardening resin layer is formed.
以下,對本發明之實施形態按照下述順序詳細地說明。本案說明書中,(甲基)丙烯酸酯之用語包含丙烯酸酯與甲基丙烯酸酯。又,(甲基)丙烯醯基之用語包含丙烯醯基與甲基丙烯醯基。 Hereinafter, embodiments of the present invention will be described in detail in the following order. In the present specification, the term "(meth)acrylate" includes acrylate and methacrylate. Further, the term "(meth)acryl fluorenyl) includes an acryl fluorenyl group and a methacryl fluorenyl group.
1.光硬化性樹脂組成物 1. Photocurable resin composition
2.影像顯示裝置之製造方法 2. Method of manufacturing image display device
3.實施例 3. Embodiment
<1.光硬化性樹脂組成物> <1. Photocurable resin composition>
本實施形態之光硬化性樹脂組成物含有具有胺酯骨架之(甲基)丙烯酸系低聚物(以下,亦稱為丙烯酸胺酯低聚物(A))、(甲基)丙烯酸酯單體、聚合起始劑、及塑化劑,且塑化劑含有1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之至少1種。藉由使用此種光硬化性樹脂組成物,可降低低溫環境下之透光性硬化樹脂層之彈性模數。 The photocurable resin composition of the present embodiment contains a (meth)acrylic oligomer having an amine ester skeleton (hereinafter also referred to as an urethane oligomer (A)) and a (meth) acrylate monomer. , a polymerization initiator, and a plasticizer, and the plasticizer contains a polybutadiene having a 1,2 bond ratio of less than 80%, and a polyisoprene having a 1,2 bond ratio of less than 80%. At least one. By using such a photocurable resin composition, the elastic modulus of the light-transmitting and hardening resin layer in a low-temperature environment can be reduced.
光硬化性樹脂組成物含有丙烯酸系低聚物、及(甲基)丙烯酸酯單體作為自由基聚合性成分,含有丙烯酸胺酯低聚物(A)作為丙烯酸系低聚物。 The photocurable resin composition contains an acrylic oligomer and a (meth) acrylate monomer as a radical polymerizable component, and contains an urethane acrylate oligomer (A) as an acryl oligomer.
[丙烯酸系低聚物] [Acrylic oligomer]
丙烯酸系低聚物係作為用以對光硬化性樹脂組成物賦予充分之反應性、及塗佈性等之反應性稀釋劑而使用。光硬化性樹脂組成物含有丙烯酸胺酯低聚物(A),視需要亦可含有丙烯酸胺酯低聚物(A)以外之其他丙烯酸系低聚物。 The acrylic oligomer is used as a reactive diluent for imparting sufficient reactivity and coating properties to the photocurable resin composition. The photocurable resin composition contains an urethane acrylate oligomer (A), and may contain an acryl oligomer other than the urethane amide oligomer (A) as needed.
[丙烯酸胺酯低聚物(A)] [Amino acid acrylate oligomer (A)]
丙烯酸胺酯低聚物(A)係具有(甲基)丙烯醯基與胺酯鍵之低聚物化合物。 The urethane acrylate oligomer (A) is an oligomer compound having a (meth) acrylonitrile group and an amine ester bond.
丙烯酸胺酯低聚物(A)之重量平均分子量較佳為1000~100000,更佳為1000~70000,進而較佳為1000~50000。 The weight average molecular weight of the urethane acrylate oligomer (A) is preferably from 1,000 to 100,000, more preferably from 1,000 to 70,000, still more preferably from 1,000 to 50,000.
丙烯酸胺酯低聚物(A)係例如藉由使聚異氰酸酯化合物、具有羥基或異氰酸酯基之(甲基)丙烯酸酯、及多元醇化合物進行反應而獲 得。 The urethane acrylate oligomer (A) is obtained, for example, by reacting a polyisocyanate compound, a (meth) acrylate having a hydroxyl group or an isocyanate group, and a polyol compound. Got it.
作為聚異氰酸酯化合物,例如可列舉:異佛爾酮二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、1,3-苯二甲基二異氰酸酯、1,4-苯二甲基二異氰酸酯、二苯基甲烷-4,4'-二異氰酸酯等二異氰酸酯。 Examples of the polyisocyanate compound include isophorone diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-benzenedimethyl diisocyanate, and 1,4-benzoic acid. Diisocyanate such as bis-isocyanate or diphenylmethane-4,4'-diisocyanate.
作為具有羥基之(甲基)丙烯酸酯,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、聚乙二醇(甲基)丙烯酸酯。作為具有異氰酸酯基之(甲基)丙烯酸酯,例如可列舉:異氰酸甲基丙烯醯氧基乙酯。 Examples of the (meth) acrylate having a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. Base) 4-hydroxybutyl acrylate, polyethylene glycol (meth) acrylate. Examples of the (meth) acrylate having an isocyanate group include methacryloxyethyl isocyanate.
作為多元醇化合物,例如可列舉:伸烷基型、聚碳酸酯型、聚酯型或聚醚型等多元醇化合物,具體而言,可列舉:聚乙二醇、聚丙二醇、聚四亞甲基二醇、聚碳酸酯二醇、聚酯二醇、聚醚二醇等。 Examples of the polyhydric alcohol compound include polyhydric alcohol compounds such as an alkylene type, a polycarbonate type, a polyester type, and a polyether type. Specific examples thereof include polyethylene glycol, polypropylene glycol, and polytetramethylene. Base diol, polycarbonate diol, polyester diol, polyether diol, and the like.
作為丙烯酸胺酯低聚物(A)之具體例,例如可使用TEAI-1000(日本曹達(股)公司製造)、EBECRYL230(Daicel Allnex(股)公司製造)、CN9014、CN9893、CN964、CN9001、CN9788、CN9783(以上為Sartomer公司製造)、UA-1(Light Chemical Industry(股)公司製造)等。 Specific examples of the urethane amide oligomer (A) include TEAI-1000 (manufactured by Nippon Soda Co., Ltd.), EBECRYL 230 (manufactured by Daicel Allnex Co., Ltd.), CN9014, CN9893, CN964, CN9001, and CN9788. , CN9783 (above is manufactured by Sartomer Co., Ltd.), UA-1 (manufactured by Light Chemical Industry Co., Ltd.), and the like.
光硬化性樹脂組成物之丙烯酸胺酯低聚物(A)之含量較佳為5~40質量%,更佳為20~40質量%。丙烯酸胺酯低聚物(A)可單獨使用一種,亦可併用兩種以上。於併用兩種以上之丙烯酸胺酯低聚物(A)之情形時,較佳為其合計量滿足上述含量之範圍。 The content of the urethane amide oligomer (A) of the photocurable resin composition is preferably from 5 to 40% by mass, more preferably from 20 to 40% by mass. The urethane acrylate oligomer (A) may be used alone or in combination of two or more. In the case where two or more kinds of urethane amide oligomers (A) are used in combination, it is preferred that the total amount thereof satisfies the above range.
[其他(甲基)丙烯酸系低聚物] [Other (meth)acrylic oligomers]
作為其他(甲基)丙烯酸系低聚物,可列舉:於骨架具有聚異戊二烯、聚丁二烯等之(甲基)丙烯酸酯系低聚物。作為具有聚異戊二烯骨架之(甲基)丙 烯酸酯低聚物之具體例,可列舉:聚異戊二烯聚合物之順丁烯二酸酐加成物與甲基丙烯酸2-羥基乙酯之酯化物(UC102、UC203、UC-1(以上為Kuraray(股)公司製造))。 Examples of the other (meth)acrylic oligomer include a (meth)acrylate oligomer having a polyisoprene or a polybutadiene in the skeleton. As a (meth) propyl group having a polyisoprene skeleton Specific examples of the enoate oligomer include an ester of a maleic anhydride adduct of a polyisoprene polymer and 2-hydroxyethyl methacrylate (UC102, UC203, UC-1 ( The above is manufactured by Kuraray Co., Ltd.)).
於光硬化性樹脂組成物含有其他(甲基)丙烯酸系低聚物之情形時,光硬化性樹脂組成物中之其他(甲基)丙烯酸系低聚物之含量較佳為1~20質量%,更佳為1~15質量%。其他(甲基)丙烯酸系低聚物可單獨使用一種,亦可併用兩種以上。於併用兩種以上之其他(甲基)丙烯酸系低聚物之情形時,較佳為其合計量滿足上述含量之範圍。 When the photocurable resin composition contains another (meth)acrylic oligomer, the content of the other (meth)acrylic oligomer in the photocurable resin composition is preferably from 1 to 20% by mass. More preferably, it is 1 to 15% by mass. Other (meth)acrylic oligomers may be used alone or in combination of two or more. In the case where two or more other (meth)acrylic oligomers are used in combination, it is preferred that the total amount thereof satisfies the above content range.
[(甲基)丙烯酸酯單體] [(Meth)acrylate monomer]
(甲基)丙烯酸酯單體雖無特別限定,但就更有效地降低低溫環境下之透光性硬化樹脂層之彈性模數之觀點而言,較佳為含有具有環結構之(甲基)丙烯酸酯單體。又,(甲基)丙烯酸酯單體亦可進而含有其他(甲基)丙烯酸酯單體。 The (meth) acrylate monomer is not particularly limited, but is preferably a (meth) group having a ring structure from the viewpoint of more effectively reducing the elastic modulus of the light-transmitting and hardening resin layer in a low-temperature environment. Acrylate monomer. Further, the (meth) acrylate monomer may further contain another (meth) acrylate monomer.
具有環結構之(甲基)丙烯酸酯較佳為具有脂環式烴基作為環結構。脂環式烴基之碳數較佳為4~30,更佳為4~20,進而較佳為8~14。脂環式烴基可為單環結構,亦可為多環結構。脂環式烴基可為飽和亦可為不飽和。脂環式烴基亦可具有取代基。 The (meth) acrylate having a ring structure preferably has an alicyclic hydrocarbon group as a ring structure. The carbon number of the alicyclic hydrocarbon group is preferably from 4 to 30, more preferably from 4 to 20, still more preferably from 8 to 14. The alicyclic hydrocarbon group may have a single ring structure or a polycyclic structure. The alicyclic hydrocarbon group may be saturated or unsaturated. The alicyclic hydrocarbon group may also have a substituent.
光硬化性樹脂組成物較佳為含有下述式(1)~(3)之任一者所表示之(甲基)丙烯酸酯單體(以下,亦稱為特定(甲基)丙烯酸酯單體)。 The photocurable resin composition preferably contains a (meth) acrylate monomer represented by any one of the following formulas (1) to (3) (hereinafter, also referred to as a specific (meth) acrylate monomer. ).
(式(1)~(3)中,R分別獨立地表示氫原子或甲基,X表示-O-、-O(CH2)nO-、-O(CH2CH2O)n-、或-O(CH(CH3)CH2O)n-,Y表示-O-、-O(CH2)mO-、-O(CH2CH2O)m-、或-O(CH(CH3)CH2O)m-,n及m分別獨立地表示1~10之整數) (In the formulae (1) to (3), R each independently represents a hydrogen atom or a methyl group, and X represents -O-, -O(CH 2 ) n O-, -O(CH 2 CH 2 O) n -, Or -O(CH(CH 3 )CH 2 O) n -, Y represents -O-, -O(CH 2 ) m O-, -O(CH 2 CH 2 O) m -, or -O(CH( CH 3 )CH 2 O) m -, n and m each independently represent an integer from 1 to 10)
式(1)~(3)中,R較佳為分別獨立地表示氫原子。式(1)~(3)中,X較佳為分別獨立地表示-O-。式(3)中,Y較佳為表示-O-。式(1)~(3)中,n及m較佳為分別獨立地表示1~6之整數。 In the formulae (1) to (3), R preferably each independently represents a hydrogen atom. In the formulae (1) to (3), X preferably each independently represents -O-. In the formula (3), Y preferably represents -O-. In the formulae (1) to (3), n and m are preferably each independently an integer of 1 to 6.
特定(甲基)丙烯酸酯單體較佳為上述式(1)或式(2)所表示之(甲基)丙烯酸酯單體。具體而言,特定(甲基)丙烯酸酯單體較佳為丙烯酸二環戊酯、甲基丙烯酸二環戊酯、丙烯酸二環戊烯酯、丙烯酸二環戊烯氧基乙酯、及甲基丙烯酸二環戊烯氧基乙酯之至少1種。尤佳為丙烯酸二環戊酯、及甲基丙烯酸二環戊酯之至少1種。 The specific (meth) acrylate monomer is preferably a (meth) acrylate monomer represented by the above formula (1) or formula (2). Specifically, the specific (meth) acrylate monomer is preferably dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, and methyl group. At least one of dicyclopentenyloxyethyl acrylate. More preferably, it is at least one of dicyclopentanyl acrylate and dicyclopentanyl methacrylate.
作為特定(甲基)丙烯酸酯單體以外之具有其他環結構之(甲 基)丙烯酸酯單體之具體例,可列舉:(甲基)丙烯酸異莰酯等。 Other than the specific (meth) acrylate monomer having other ring structures (A Specific examples of the acrylate monomer include, for example, isodecyl (meth)acrylate.
又,作為上述具有環結構之(甲基)丙烯酸酯單體以外之其他(甲基)丙烯酸酯之具體例,可列舉:己二醇二丙烯酸酯等。 Further, specific examples of the (meth) acrylate other than the (meth) acrylate monomer having a ring structure include hexanediol diacrylate.
光硬化性樹脂組成物中,(甲基)丙烯酸酯單體之含量較佳為15~45質量%,更佳為20~40質量%。(甲基)丙烯酸酯單體可單獨使用一種,亦可併用兩種以上。於併用兩種以上之(甲基)丙烯酸酯單體之情形時,較佳為其合計量滿足上述含量之範圍。 The content of the (meth) acrylate monomer in the photocurable resin composition is preferably 15 to 45% by mass, more preferably 20 to 40% by mass. The (meth) acrylate monomers may be used alone or in combination of two or more. In the case where two or more (meth) acrylate monomers are used in combination, it is preferred that the total amount thereof satisfies the above range.
又,光硬化性樹脂組成物中,具有環結構之(甲基)丙烯酸酯單體之含量較佳為1~35重量%,更佳為10~35質量%。 Further, in the photocurable resin composition, the content of the (meth) acrylate monomer having a ring structure is preferably from 1 to 35% by weight, more preferably from 10 to 35% by mass.
[聚合起始劑] [Polymerization initiator]
聚合起始劑較佳為使用光自由基聚合起始劑,更佳為含有烷基苯酮系光聚合起始劑、及醯基膦氧化物系光聚合起始劑之至少1種,進而較佳為含有烷基苯酮系光聚合起始劑、及醯基膦氧化物系光聚合起始劑。作為烷基苯酮系光聚合起始劑,可使用1-羥基環己基苯基酮(Irgacure 184,BASF公司製造)、2-羥基-1-{4-[4-(2-羥基-2-甲基-丙醯基)苄基]苯基}-2-甲基-1-丙烷-1-酮(Irgacure 127,BASF公司製造)等。作為醯基膦氧化物系光聚合起始劑,可使用2,4,6-三甲基苯甲醯基二苯基氧化膦(Lucirin TPO,BASF公司製造)等。作為其他聚合起始劑,可列舉:二苯甲酮、苯乙酮等。 The polymerization initiator is preferably a photoradical polymerization initiator, more preferably at least one of an alkylphenone photopolymerization initiator and a mercaptophosphine oxide photopolymerization initiator, and further It is preferred to contain an alkylphenone photopolymerization initiator and a mercaptophosphine oxide photopolymerization initiator. As the alkylphenone-based photopolymerization initiator, 1-hydroxycyclohexyl phenyl ketone (Irgacure 184, manufactured by BASF Corporation), 2-hydroxy-1-{4-[4-(2-hydroxy-2-) can be used. Methyl-propenyl)benzyl]phenyl}-2-methyl-1-propan-1-one (Irgacure 127, manufactured by BASF Corporation) and the like. As the mercaptophosphine oxide photopolymerization initiator, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide (Lucirin TPO, manufactured by BASF Corporation) or the like can be used. Examples of the other polymerization initiator include benzophenone and acetophenone.
光聚合起始劑之含量相對於自由基聚合性成分之合計100質量份,較佳為0.1~5質量份,更佳為0.2~3質量份。藉由設為此種範圍,可更有效地防止於光照射時產生硬化不足,並且更有效地防止因開裂導致之釋氣之增加。聚合起始劑可單獨使用一種,亦可併用兩種以上。於併用 兩種以上之聚合起始劑之情形時,較佳為其合計量滿足上述範圍。 The content of the photopolymerization initiator is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, per 100 parts by mass of the total of the radical polymerizable component. By setting it as such a range, it is possible to more effectively prevent insufficient hardening at the time of light irradiation, and more effectively prevent an increase in outgassing due to cracking. The polymerization initiator may be used alone or in combination of two or more. Use together In the case of two or more kinds of polymerization initiators, it is preferred that the total amount thereof satisfies the above range.
[塑化劑] [Plasticizer]
光硬化性樹脂組成物含有1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之至少1種作為塑化劑。光硬化性樹脂組成物藉由含有此種塑化劑,可降低光硬化性樹脂組成物之硬化物於低溫環境下之彈性模數。 The photocurable resin composition contains at least one of polybutadiene having a 1,2 bond ratio of less than 80% and polyisoprene having a 1,2 bond ratio of less than 80% as a plasticizer. The photocurable resin composition can reduce the elastic modulus of the cured product of the photocurable resin composition in a low temperature environment by containing such a plasticizer.
光硬化性樹脂組成物尤佳為含有1,2鍵結率未達80%之聚丁二烯之氫化物、及1,2鍵結率未達80%之聚異戊二烯之氫化物之至少1種作為塑化劑。藉此,即便於硬化性樹脂組成物層之玻璃轉移溫度較高之情形時,亦可更有效地降低光硬化性樹脂組成物之硬化物於低溫環境下之彈性模數。又,亦可使接著強度良好。 The photocurable resin composition is particularly preferably a hydride of polybutadiene having a 1,2 bond ratio of less than 80%, and a hydride of polyisoprene having a 1,2 bond ratio of less than 80%. At least one is used as a plasticizer. Thereby, even when the glass transition temperature of the curable resin composition layer is high, the elastic modulus of the cured product of the photocurable resin composition in a low temperature environment can be more effectively reduced. Moreover, the bonding strength can also be made good.
上述聚丁二烯中之1,2鍵結率之上限值較佳為75%以下,更佳為70%以下。又,上述聚丁二烯中之1,2鍵結率之下限值較佳為50%以上,更佳為55%以上,進而較佳為60%以上。 The upper limit of the bonding ratio of 1,2 in the above polybutadiene is preferably 75% or less, more preferably 70% or less. Further, the lower limit of the 1,2 bond ratio in the polybutadiene is preferably 50% or more, more preferably 55% or more, still more preferably 60% or more.
作為1,2鍵結率未達80%之聚丁二烯之具體例,可列舉:Krasol HLBH-P2000(1,2鍵結率為65%之聚丁二烯之氫化物,Crayvalley公司製造)、Krasol HLBH-P3000(1,2鍵結率為65%之聚丁二烯之氫化物,Crayvalley公司製造)、Krasol LBH-P2000(1,2鍵結率為65%之聚丁二烯,Crayvalley公司製造)、Krasol LBH-P3000(1,2鍵結率為65%之聚丁二烯,Crayvalley公司製造)、LBH-P5000(1,2鍵結率為65%之聚丁二烯,Crayvalley公司製造)等。 Specific examples of the polybutadiene having a 1,2 bond ratio of less than 80% include Krasol HLBH-P2000 (1,2 hydride of polybutadiene having a bonding ratio of 65%, manufactured by Crayvalley Co., Ltd.) Krasol HLBH-P3000 (1,2 hydride of polybutadiene with a bonding ratio of 65%, manufactured by Crayvalley), Krasol LBH-P2000 (1,2 polybutadiene with a bonding ratio of 65%, Crayvalley Made by the company), Krasol LBH-P3000 (1,2 bond-capacity 65% polybutadiene, manufactured by Crayvalley), LBH-P5000 (1,2 bond-capacity 65% polybutadiene, Crayvalley Manufacturing) and so on.
上述聚異戊二烯中之1,2鍵結率之上限值較佳為70%以下,更佳為60%以下,進而較佳為50%以下。又,上述聚異戊二烯中之1,2鍵結 率之下限值較佳為10%以上,更佳為15%以上,進而較佳為20%以上。 The upper limit of the bonding ratio of 1,2 in the polyisoprene is preferably 70% or less, more preferably 60% or less, still more preferably 50% or less. Further, the 1,2 bond in the above polyisoprene The lower limit of the ratio is preferably 10% or more, more preferably 15% or more, and still more preferably 20% or more.
作為1,2鍵結率未達80%之聚異戊二烯之具體例,可列舉:EPOL(1,2鍵結率為20%之聚異戊二烯之氫化物,出光興產(股)公司製造)等。 Specific examples of the polyisoprene having a 1,2 bond ratio of less than 80% include EPOL (1,2 hydride of polyisoprene having a bonding ratio of 20%). )))).
塑化劑之數量平均分子量較佳為1000以上。藉由設為此種範圍,可更有效地抑制滲出。塑化劑之數量平均分子量之上限較佳為20000以下,更佳為10000以下。 The number average molecular weight of the plasticizer is preferably 1,000 or more. By setting it as such a range, bleed-out can be suppressed more effectively. The upper limit of the number average molecular weight of the plasticizer is preferably 20,000 or less, more preferably 10,000 or less.
塑化劑之分子末端之結構並無特別限定,可列舉:氫原子、羥基、丙烯醯基、異氰酸酯基、羧基等,較佳為羥基。 The structure of the molecular terminal of the plasticizer is not particularly limited, and examples thereof include a hydrogen atom, a hydroxyl group, an acrylonitrile group, an isocyanate group, and a carboxyl group, and a hydroxyl group is preferable.
光硬化性樹脂組成物中之塑化劑之含量較佳為15~50質量%,更佳為25~45質量%。藉由設為此種範圍,可更有效地降低低溫環境下之透光性硬化樹脂層之彈性模數。塑化劑可單獨使用一種,亦可併用兩種以上。於併用兩種以上之塑化劑之情形時,較佳為其合計量滿足上述範圍。 The content of the plasticizer in the photocurable resin composition is preferably from 15 to 50% by mass, more preferably from 25 to 45% by mass. By setting it as such a range, the elastic modulus of the light-transmitting-hardening resin layer in a low temperature environment can be more effectively reduced. The plasticizers may be used alone or in combination of two or more. In the case where two or more plasticizers are used in combination, it is preferred that the total amount thereof satisfies the above range.
又,塑化劑中,1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之含量之合計較佳為30質量%以上,更佳為50質量%,進而較佳為80質量%以上。藉由設為此種範圍,可更有效地降低低溫環境下之透光性硬化樹脂層之彈性模數。 Further, in the plasticizer, the total content of the polybutadiene having a 1,2 bond ratio of less than 80% and the polyisoprene having a 1,2 bond ratio of less than 80% is preferably 30% by mass. The above is more preferably 50% by mass, still more preferably 80% by mass or more. By setting it as such a range, the elastic modulus of the light-transmitting-hardening resin layer in a low temperature environment can be more effectively reduced.
光硬化性樹脂組成物亦可進而含有上述塑化劑以外之其他塑化劑。作為其他塑化劑,可列舉:固體之黏著賦予劑、液狀油成分。作為固形之黏著賦予劑,可列舉:萜烯樹脂、萜酚樹脂、氫化萜烯樹脂等萜烯系樹脂、天然松香、聚合松脂、松香酯、氫化松香等松香樹脂。作為液狀油成分,可列舉:聚丁二烯系油、聚異戊二烯系油等。 The photocurable resin composition may further contain other plasticizers other than the above plasticizer. Examples of the other plasticizer include a solid adhesion-imparting agent and a liquid oil component. Examples of the solid adhesion-imparting agent include terpene resins such as terpene resins, indophenol resins, and hydrogenated terpene resins, and rosin resins such as natural rosin, polymerized rosin, rosin ester, and hydrogenated rosin. Examples of the liquid oil component include a polybutadiene-based oil and a polyisoprene-based oil.
[其他成分] [Other ingredients]
光硬化性樹脂組成物亦可於無損降低低溫環境下之透光性硬化樹脂層之彈性模數之效果之範圍內含有上述成分以外之其他成分。例如,光硬化性樹脂組成物亦可為了調整分子量而進而含有鏈轉移劑。作為鏈轉移劑,例如可列舉:2-巰基乙醇、月桂硫醇、環氧丙基硫醇、巰基乙酸、硫代乙醇酸2-乙基己酯、2,3-二巰基-1-丙醇、α-甲基苯乙烯二聚物等。又,光硬化性樹脂組成物亦可進而含有矽烷偶合劑等接著改善劑、抗氧化劑等。 The photocurable resin composition may contain other components than the above components within a range that does not impair the effect of reducing the elastic modulus of the light-transmitting and hardening resin layer in a low-temperature environment. For example, the photocurable resin composition may further contain a chain transfer agent in order to adjust the molecular weight. As the chain transfer agent, for example, 2-mercaptoethanol, lauryl mercaptan, epoxypropyl thiol, thioglycolic acid, 2-ethylhexyl thioglycolate, and 2,3-dimercapto-1-propanol can be mentioned. , α-methylstyrene dimer, and the like. Further, the photocurable resin composition may further contain an adhesion improver such as a decane coupling agent, an antioxidant, or the like.
光硬化性樹脂組成物可藉由將上述各成分依據公知之混合方法均勻地混合而製備。 The photocurable resin composition can be prepared by uniformly mixing the above components in accordance with a known mixing method.
光硬化性樹脂組成物較佳為液狀。藉由光硬化性樹脂組成物為液狀,例如可於下述之影像顯示裝置之製造方法中,更確實地消除在遮光層與透光性光學構件之遮光層形成側表面所形成之階差。此處,所謂光硬化性樹脂組成物為液狀,較佳為利用B型黏度計所測定之25℃之黏度顯示0.01~100Pa‧s。 The photocurable resin composition is preferably in a liquid form. By using the photocurable resin composition as a liquid, for example, in the method of manufacturing an image display device described below, the step formed on the side surface of the light shielding layer and the light shielding layer of the light transmissive optical member can be more reliably eliminated. . Here, the photocurable resin composition is in the form of a liquid, and it is preferable that the viscosity at 25 ° C measured by a B-type viscometer is 0.01 to 100 Pa s.
光硬化性樹脂組成物較佳為樹脂硬化物之玻璃轉移溫度為40~80℃。玻璃轉移溫度之測定條件係如下述實施例中所記載。 The photocurable resin composition preferably has a glass transition temperature of 40 to 80 ° C. The measurement conditions of the glass transition temperature are as described in the following examples.
具體而言,光硬化性樹脂組成物較佳為以使於大氣中藉由光照射而進行光自由基聚合所獲得之樹脂硬化物整體之平均之硬化率、及樹脂硬化物之最外表面之硬化率成為90%以上(較佳為97%以上)之方式使其硬化之情形之玻璃轉移溫度滿足上述範圍。 Specifically, the photocurable resin composition is preferably an average hardening rate of the cured resin obtained by photoradical polymerization in the atmosphere by light irradiation, and an outermost surface of the cured resin. The glass transition temperature in the case where the hardening rate is 90% or more (preferably 97% or more) is hardened to satisfy the above range.
著眼於在大氣中進行光自由基聚合而成之樹脂硬化物之原因在於:由於因大氣中之氧氣而於硬化樹脂產生硬化阻礙,故而探索如不 會因此種硬化阻礙而對硬化樹脂之各種特性產生影響之硬化條件。又,較佳為將樹脂硬化物之最外表面之硬化率設為90%以上之原因在於:即便於在樹脂硬化物之表面產生硬化阻礙之情形時,亦可實用上無視樹脂硬化物之表面之接著性等特性之降低。進而,較佳為將此種硬化率下之樹脂硬化物之玻璃轉移溫度設為上述範圍之原因在於:若為該範圍內,則可不使所成膜之樹脂硬化物之貼合性或接著維持性等特性劣化。 The reason for focusing on the cured resin of the photoradical polymerization in the atmosphere is that it is difficult to cause hardening of the hardened resin due to oxygen in the atmosphere. The hardening conditions which affect the various properties of the hardened resin due to the hardening of the hardening. Moreover, it is preferable that the hardening rate of the outermost surface of the cured resin is 90% or more because the surface of the cured resin can be practically ignored even when the hardening of the surface of the cured resin is caused. The characteristics such as the adhesion are reduced. Furthermore, it is preferable that the glass transition temperature of the cured resin of the cured ratio is in the above range, and if it is within this range, the adhesion of the cured resin of the formed film can be prevented or maintained. Characteristics such as sex deteriorate.
此處,所謂硬化率(凝膠分率),係指定義為光照射後之光硬化性樹脂組成物層中之(甲基)丙烯醯基之存在量相對於光照射前之(甲基)丙烯醯基之存在量之比率(消耗量比率)之數值,且顯示出該數值越大、硬化越進行。具體而言,硬化率可藉由將光照射前之光硬化性樹脂組成物層於FT-IR測定圖中之距離基準線之1640~1620cm-1之吸收峰高度(X)、與光照射後之光硬化性樹脂組成物層(透光性硬化樹脂層)於FT-IR測定圖中之距離基準線之1640~1620cm-1之吸收峰高度(Y)代入下述式而算出。 Here, the curing rate (gel fraction) is defined as the amount of (meth)acryl fluorenyl group present in the photocurable resin composition layer after light irradiation with respect to (meth) before light irradiation. The ratio of the ratio of the amount of the acrylonitrile group (the ratio of consumption), and it is shown that the larger the value, the harder the curing. Specifically, the curing rate can be obtained by using the photocurable resin composition layer before the light irradiation in the FT-IR measurement chart, the absorption peak height (X) of the distance reference line of 1640 to 1620 cm -1 , and after the light irradiation. The light-curable resin composition layer (translucent cured resin layer) was calculated by substituting the following equation for the absorption peak height (Y) of the distance reference line from 1640 to 1620 cm -1 in the FT-IR measurement chart.
硬化率(%)=[(X-Y)/X]×100 Hardening rate (%) = [(X-Y) / X] × 100
上述樹脂硬化物之表面之硬化率意指例如對成膜為10μm厚以下(例如,5μm厚)之樹脂硬化物所測定之硬化率。又,樹脂硬化物整體之硬化率意指例如對成膜為100μm厚以上(例如,200μm厚)之樹脂硬化物所測定之硬化率。 The hardening rate of the surface of the cured resin is, for example, a hardening rate measured for a cured resin of a film having a thickness of 10 μm or less (for example, 5 μm thick). Further, the curing rate of the entire cured resin material means, for example, a curing rate measured for a cured resin of a resin having a thickness of 100 μm or more (for example, 200 μm thick).
光硬化性樹脂組成物之樹脂硬化物於-20℃之彈性模數較佳為3.0E+08Pa以下,更佳為2.9E+08Pa以下。又,光硬化性樹脂組成物之樹脂硬化物於-20℃之彈性模數之下限值通常較佳為1.0E+08Pa以上。又,光硬化性樹脂組成物之樹脂硬化物於25℃之彈性模數較佳為1.0E+08Pa以 下。光硬化性樹脂組成物之樹脂硬化物於25℃之彈性模數之下限值通常較佳為1.0E+06Pa以上。彈性模數之測定條件係如下述實施例中所記載。此處,所謂樹脂硬化物,係指以使於大氣中藉由光照射而進行光自由基聚合所獲得之樹脂硬化物整體之平均之硬化率、及樹脂硬化物之最外表面之硬化率成為90%以上(較佳為97%以上)之方式使其硬化者。 The elastic modulus of the cured resin of the photocurable resin composition at -20 ° C is preferably 3.0E+08 Pa or less, more preferably 2.9E+08 Pa or less. Further, the lower limit of the elastic modulus of the cured resin of the photocurable resin composition at -20 ° C is usually preferably 1.0 E + 08 Pa or more. Further, the resin cured product of the photocurable resin composition preferably has an elastic modulus at 25 ° C of 1.0 E + 08 Pa. under. The lower limit of the elastic modulus of the cured resin of the photocurable resin composition at 25 ° C is usually preferably 1.0 E + 06 Pa or more. The measurement conditions of the elastic modulus are as described in the following examples. Here, the resin cured product refers to an average hardening rate of the cured resin obtained by photoradical polymerization by light irradiation in the atmosphere, and a hardening rate of the outermost surface of the cured resin. 90% or more (preferably 97% or more) makes it harder.
光硬化性樹脂組成物之樹脂硬化物之穿透率較佳為90%以上,更佳為92%以上。藉由滿足此種範圍,可使形成於構成影像顯示裝置之影像顯示構件之影像之視認性更良好。此處,所謂樹脂硬化物,係指與上述樹脂硬化物同義。 The transmittance of the cured resin of the photocurable resin composition is preferably 90% or more, more preferably 92% or more. By satisfying such a range, the visibility of the image formed on the image display member constituting the image display device can be made better. Here, the term "resin cured product" means the same as the above-mentioned resin cured product.
<2.影像顯示裝置之製造方法> <2. Method of Manufacturing Image Display Device>
以下,針對影像顯示裝置之製造方法之第1~第3實施形態,一面參照圖式一面對每個步驟詳細地說明。再者,於圖式中相同圖號表示相同之構成要素。 Hereinafter, the first to third embodiments of the method of manufacturing the video display device will be described in detail with reference to the drawings. In the drawings, the same reference numerals denote the same constituent elements.
[第1實施形態] [First Embodiment]
[步驟(A1)] [Step (A1)]
於步驟(A1)中,將光硬化性樹脂組成物塗佈於透光性光學構件之表面或影像顯示構件之表面。圖1A係表示影像顯示裝置之製造方法之步驟(A1)之一例之說明圖。準備具有形成於單面之周緣部之遮光層1之透光性光學構件2,於透光性光學構件2之表面塗佈光硬化性樹脂組成物3A。 In the step (A1), the photocurable resin composition is applied onto the surface of the light transmissive optical member or the surface of the image display member. Fig. 1A is an explanatory view showing an example of a step (A1) of a method of manufacturing a video display device. The translucent optical member 2 having the light shielding layer 1 formed on the peripheral portion of one surface is prepared, and the photocurable resin composition 3A is applied onto the surface of the translucent optical member 2.
遮光層1係例如用以提高影像之對比度而設置者。遮光層1係將著色為黑色等之塗料利用網版印刷法等進行塗佈,並使其乾燥、硬化者。遮光層1之厚度通常為5~100μm。 The light shielding layer 1 is provided, for example, to increase the contrast of the image. In the light-shielding layer 1, a paint colored in black or the like is applied by a screen printing method or the like, and dried and cured. The thickness of the light shielding layer 1 is usually 5 to 100 μm.
透光性光學構件2只要為具有能夠視認出形成於影像顯示構件之影像之透光性者即可。例如可列舉:玻璃、丙烯酸樹脂、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚碳酸酯等板狀材料或片狀材料。針對該等材料,亦可對單面或雙面實施硬塗處理、抗反射處理等。透光性光學構件2之厚度或彈性模數等物性可根據使用目的而適宜決定。 The translucent optical member 2 may have a light transmissive property capable of visually recognizing an image formed on the image display member. For example, a plate-shaped material or a sheet material such as glass, acrylic resin, polyethylene terephthalate, polyethylene naphthalate or polycarbonate may be mentioned. For these materials, hard coating treatment, anti-reflection treatment, or the like may be applied to one side or both sides. The physical properties such as the thickness or the modulus of elasticity of the light-transmitting optical member 2 can be appropriately determined depending on the purpose of use.
[步驟(B1)] [Step (B1)]
於步驟(B1)中,將影像顯示構件與透光性光學構件經由光硬化性樹脂組成物而貼合。圖1B係表示影像顯示裝置之製造方法之步驟(B1)之一例之說明圖。於影像顯示構件6經由光硬化性樹脂組成物3A而貼合透光性光學構件2。藉此,於影像顯示構件6與透光性光學構件2之間形成光硬化性樹脂組成物層3。 In the step (B1), the image display member and the light transmissive optical member are bonded together via a photocurable resin composition. Fig. 1B is an explanatory view showing an example of a step (B1) of a method of manufacturing a video display device. The light-transmitting optical member 2 is bonded to the image display member 6 via the photo-curable resin composition 3A. Thereby, the photocurable resin composition layer 3 is formed between the image display member 6 and the translucent optical member 2.
[步驟(C1)] [Step (C1)]
於步驟(C1)中,使光硬化性樹脂組成物硬化。圖1C係表示影像顯示裝置之製造方法之步驟(C1)之一例之說明圖。對夾持於影像顯示構件6與透光性光學構件2之間之光硬化性樹脂組成物(光硬化性樹脂組成物層3)照射光(較佳為紫外線)而使其硬化。藉此,可獲得如圖1D所示般經由透光性硬化樹脂層7將影像顯示構件6與透光性光學構件2積層而成之影像顯示裝置10。 In the step (C1), the photocurable resin composition is cured. Fig. 1C is an explanatory view showing an example of a step (C1) of the method of manufacturing the image display device. The photocurable resin composition (photocurable resin composition layer 3) sandwiched between the image display member 6 and the translucent optical member 2 is irradiated with light (preferably ultraviolet rays) to be cured. Thereby, the image display device 10 in which the image display member 6 and the translucent optical member 2 are laminated via the translucent cured resin layer 7 as shown in FIG. 1D can be obtained.
光照射較佳為以透光性硬化樹脂層7之硬化率成為90%以上之方式進行,更佳為以成為95%以上之方式進行。藉由滿足此種範圍,可使形成於影像顯示構件6之影像之視認性良好。此處,所謂硬化率,係指與上述硬化率同義。進行硬化時之光源之種類、輸出、照度、累計光量 等並無特別限制,例如可採用公知之藉由紫外線照射之(甲基)丙烯酸酯之光自由基聚合處理條件。 The light irradiation is preferably carried out so that the curing rate of the light-transmitting and curing resin layer 7 is 90% or more, and more preferably 95% or more. By satisfying such a range, the visibility of the image formed on the image display member 6 can be improved. Here, the hardening rate means the same as the above-described hardening rate. Type, output, illuminance, and cumulative amount of light source when hardening There is no particular limitation, and for example, a photoradical polymerization treatment condition of a known (meth) acrylate irradiated with ultraviolet rays can be employed.
作為影像顯示構件6,可列舉:液晶顯示面板、有機EL顯示面板、電漿顯示面板、觸控面板等。此處,所謂觸控面板,意指將如液晶顯示面板之顯示元件與如觸控板之位置輸入裝置組合而成之影像顯示、輸入面板。 Examples of the image display member 6 include a liquid crystal display panel, an organic EL display panel, a plasma display panel, and a touch panel. Here, the touch panel means an image display and input panel in which a display element such as a liquid crystal display panel and a position input device such as a touch panel are combined.
透光性硬化樹脂層7於-20℃之彈性模數、及25℃之彈性模數係與上述樹脂硬化物於-20℃之彈性模數、及25℃之彈性模數同義,較佳之範圍亦同樣。 The modulus of elasticity of the light-transmitting and hardening resin layer 7 at -20 ° C and the modulus of elasticity at 25 ° C are synonymous with the modulus of elasticity of the cured resin at -20 ° C and the modulus of elasticity at 25 ° C, preferably a range The same is true.
以上,於第1實施形態中,對在透光性光學構件2之形成有遮光層1之側之表面塗佈光硬化性樹脂組成物3A之例進行了說明,但亦可於影像顯示構件6之表面塗佈光硬化性樹脂組成物3A。 In the first embodiment, the photocurable resin composition 3A is applied to the surface of the translucent optical member 2 on the side where the light shielding layer 1 is formed. However, the image display member 6 may be used. The surface of the surface is coated with a photocurable resin composition 3A.
[第2實施形態] [Second Embodiment]
[步驟(A2)] [Step (A2)]
圖2A及圖2B係表示影像顯示裝置之製造方法之步驟(A2)之一例之說明圖。首先,如圖2A所示,準備具有形成於單面之周緣部之遮光層1之透光性光學構件2。又,如圖2B所示,於透光性光學構件2之表面2a,以消除於遮光層1與透光性光學構件2之遮光層形成側表面2a形成之階差4之方式,將光硬化性樹脂組成物比遮光層1之厚度更厚地塗佈而形成光硬化性樹脂組成物層3。具體而言,較佳為於亦包含遮光層1之表面之透光性光學構件2之遮光層形成側表面2a之整個表面以使光硬化性樹脂組成物成為平坦之方式塗佈,以不使其產生階差。光硬化性樹脂組成物層3之厚度 較佳為遮光層1之厚度之1.2~50倍之厚度,更佳為2~30倍之厚度。 2A and 2B are explanatory views showing an example of the step (A2) of the method of manufacturing the image display device. First, as shown in FIG. 2A, a translucent optical member 2 having a light shielding layer 1 formed on a peripheral portion of a single surface is prepared. Further, as shown in FIG. 2B, the surface 2a of the translucent optical member 2 is cured by eliminating the step 4 formed between the light shielding layer 1 and the light shielding layer forming side surface 2a of the translucent optical member 2. The resin composition is applied thicker than the thickness of the light shielding layer 1 to form the photocurable resin composition layer 3. Specifically, it is preferable that the entire surface of the light-shielding layer forming side surface 2a of the light-transmitting optical member 2, which also includes the surface of the light-shielding layer 1, is applied so that the photocurable resin composition is flat so as not to be made It produces a step. Thickness of the photocurable resin composition layer 3 It is preferably 1.2 to 50 times the thickness of the light shielding layer 1, more preferably 2 to 30 times the thickness.
光硬化性樹脂組成物之塗佈只要以可獲得必需之厚度之方式進行即可,可以1次進行,亦可進行複數次。 The coating of the photocurable resin composition may be carried out as long as it can obtain a necessary thickness, and may be carried out once or in multiple times.
[步驟(B2)] [Step (B2)]
於步驟(B2)中,藉由對在步驟(A2)中所形成之光硬化性樹脂組成物層進行光照射而進行暫時硬化,而形成暫時硬化樹脂層。 In the step (B2), the photocurable resin composition layer formed in the step (A2) is temporarily hardened by light irradiation to form a temporarily cured resin layer.
圖2C及圖2D係表示影像顯示裝置之製造方法之步驟(B2)之一例之說明圖。如圖2C所示,藉由對在步驟(A2)中所形成之光硬化性樹脂組成物層3照射光(較佳為紫外線)而進行暫時硬化,而形成暫時硬化樹脂層5。進行光硬化性樹脂組成物層3之暫時硬化之原因在於:使光硬化性樹脂組成物自液狀成為不明顯流動之狀態,如圖2D所示,使其即便上下反轉亦不向下流淌而提高操作性。又,藉由進行暫時硬化,可使遮光層1與影像顯示構件之間之透光性硬化樹脂層3不自其等之間排除而充分光硬化,亦可降低硬化收縮。 2C and 2D are explanatory views showing an example of the step (B2) of the method of manufacturing the image display device. As shown in FIG. 2C, the photocurable resin composition layer 3 formed in the step (A2) is temporarily hardened by irradiating light (preferably ultraviolet rays) to form the temporarily cured resin layer 5. The reason why the photocurable resin composition layer 3 is temporarily hardened is that the photocurable resin composition is in a state of not flowing from the liquid state, and as shown in FIG. 2D, it does not flow downward even if it is reversed upside down. Improve operability. Moreover, by performing the temporary hardening, the light-transmitting-hardened resin layer 3 between the light-shielding layer 1 and the image display member can be sufficiently photo-cured without being removed from the same, and the hardening shrinkage can be reduced.
光硬化性樹脂組成物層3之暫時硬化較佳為以暫時硬化樹脂層5之硬化率成為10~80%之方式進行,更佳為以成為40~80%之方式進行,進而較佳為以成為70~80%之方式進行。 The temporary curing of the photocurable resin composition layer 3 is preferably performed so that the curing rate of the temporarily cured resin layer 5 is 10 to 80%, more preferably 40 to 80%, and still more preferably It is done in 70~80% way.
光照射只要可以硬化率較佳為成為10~80%之方式使其暫時硬化,則光源之種類、輸出、照度、累計光量等並無特別限制,例如可採用公知之藉由紫外線照射之(甲基)丙烯酸酯之光自由基聚合處理條件。 The light irradiation is not particularly limited as long as the curing rate is preferably 10 to 80%, and the type, output, illuminance, and integrated light amount of the light source are not particularly limited. For example, it can be irradiated by ultraviolet rays. Photopolymerization conditions for photopolymerization of acrylates.
又,光照射較佳為於上述硬化率之範圍內,於下述步驟(C2)之貼合操作時,選擇不會使暫時硬化樹脂層5產生滴液或變形之條件。例 如,若以黏度表示,則較佳為設為20Pa‧S以上(錐鈑流變計,25℃,錐及鈑C35/2,轉速10rpm)。 Further, it is preferable that the light irradiation is within the range of the above-described curing rate, and in the bonding operation of the following step (C2), the condition that the temporarily cured resin layer 5 is not dripped or deformed is selected. example For example, when expressed by viscosity, it is preferably 20 Pa ‧ or more (cone rheometer, 25 ° C, cone and 钣 C35/2, rotation speed 10 rpm).
[步驟(C2)] [Step (C2)]
於步驟(C2)中,將影像顯示構件與透光性光學構件經由暫時硬化樹脂層而貼合。 In the step (C2), the image display member and the translucent optical member are bonded together via the temporarily cured resin layer.
圖2E係表示影像顯示裝置之製造方法之步驟(C2)之一例之說明圖。如圖2E所示,將透光性光學構件2自暫時硬化樹脂層5側貼合於影像顯示構件6。貼合例如可藉由使用公知之壓接裝置,於10~80℃進行加壓而進行。 2E is an explanatory view showing an example of a step (C2) of the method of manufacturing the image display device. As shown in FIG. 2E, the translucent optical member 2 is bonded to the image display member 6 from the side of the temporarily cured resin layer 5. The bonding can be carried out, for example, by pressurization at 10 to 80 ° C using a known pressure bonding device.
[步驟(D2)] [Step (D2)]
於步驟(D2)中,藉由對配置於影像顯示構件與透光性光學構件之間之暫時硬化樹脂層照射光使其正式硬化,而使影像顯示構件與透光性光學構件經由透光性硬化樹脂層積層而獲得影像顯示裝置。 In the step (D2), the temporary curing resin layer disposed between the image display member and the translucent optical member is irradiated with light to be substantially hardened, whereby the image display member and the translucent optical member are translucent. The cured resin layer was laminated to obtain an image display device.
圖2F及圖2G係表示影像顯示裝置之製造方法之步驟(D2)之一例之說明圖。如圖2F所示,對夾持於影像顯示構件6與透光性光學構件2之間之暫時硬化樹脂層5照射光(較佳為紫外線)而使其正式硬化。使暫時硬化樹脂層5正式硬化之原因在於:使暫時硬化樹脂層5充分地硬化,使影像顯示構件6與透光性光學構件2接著而積層。藉此,使影像顯示構件6與透光性光學構件2經由透光性硬化樹脂層7而積層,獲得如圖2G所示之影像顯示裝置10。再者,亦可藉由視需要對透光性光學構件2之遮光層1與影像顯示構件6之間之暫時硬化樹脂層5照射光,而使該暫時硬化樹脂層5正式硬化。 2F and 2G are explanatory views showing an example of the step (D2) of the method of manufacturing the image display device. As shown in FIG. 2F, the temporarily cured resin layer 5 sandwiched between the image display member 6 and the translucent optical member 2 is irradiated with light (preferably ultraviolet rays) to be completely cured. The reason why the temporarily cured resin layer 5 is completely cured is that the temporarily cured resin layer 5 is sufficiently cured, and the image display member 6 and the translucent optical member 2 are subsequently laminated. Thereby, the image display member 6 and the translucent optical member 2 are laminated via the translucent cured resin layer 7, and the image display device 10 shown in FIG. 2G is obtained. Further, the temporarily cured resin layer 5 may be completely cured by irradiating light to the temporarily cured resin layer 5 between the light shielding layer 1 of the light-transmitting optical member 2 and the image display member 6 as needed.
正式硬化較佳為以透光性硬化樹脂層7之硬化率成為90%以上之方式進行,更佳為以成為95%以上之方式進行。進行正式硬化時之光源之種類、輸出、照度、累計光量等並無特別限制,例如可採用公知之藉由紫外線照射之(甲基)丙烯酸酯之光自由基聚合處理條件。 The hardening of the light-transmitting-hardenable resin layer 7 is preferably 90% or more, and more preferably 95% or more. The type, output, illuminance, and integrated light amount of the light source when the main curing is performed are not particularly limited. For example, photopolymerization treatment conditions of a known (meth) acrylate irradiated with ultraviolet rays can be employed.
於第2實施形態中,對在透光性光學構件2之形成有遮光層1之側之表面2a塗佈光硬化性樹脂組成物之例進行了說明,但亦可於影像顯示構件6之表面塗佈光硬化性樹脂組成物。 In the second embodiment, an example in which a photocurable resin composition is applied to the surface 2a on the side of the light-transmitting optical member 2 on which the light-shielding layer 1 is formed is described, but the surface of the image display member 6 may be used. A photocurable resin composition was applied.
[第3實施形態] [Third embodiment]
[步驟(A3)] [Step (A3)]
圖3A及圖3B係表示影像顯示裝置之製造方法之步驟(A3)之一例之說明圖。如圖3A所示,準備具有形成於單面之周緣部之遮光層1之透光性光學構件2,如圖3B所示,對透光性光學構件2之表面2a,以消除於遮光層1與透光性光學構件2之遮光層形成側表面2a所形成之階差4之方式,將光硬化性樹脂組成物比遮光層1之厚度更厚地塗佈。 3A and 3B are explanatory views showing an example of the step (A3) of the method of manufacturing the image display device. As shown in FIG. 3A, a translucent optical member 2 having a light shielding layer 1 formed on a peripheral portion of a single surface is prepared, as shown in FIG. 3B, to the surface 2a of the translucent optical member 2 to be removed from the light shielding layer 1 The photocurable resin composition is applied thicker than the thickness of the light shielding layer 1 so as to form a step 4 formed by the light shielding layer forming side surface 2a of the light transmitting optical member 2.
[步驟(B3)] [Step (B3)]
圖3C及圖3D係表示影像顯示裝置之製造方法之步驟(B3)之一例之說明圖。如圖3C所示,對在步驟(A3)中所塗佈之光硬化性樹脂組成物照射光(較佳為紫外線),使光硬化性樹脂組成物硬化而形成透光性硬化樹脂層7(圖3D)。透光性硬化樹脂層7之硬化率較佳為90%以上,更佳為95%以上。 3C and 3D are explanatory views showing an example of the step (B3) of the method of manufacturing the image display device. As shown in FIG. 3C, the photocurable resin composition applied in the step (A3) is irradiated with light (preferably ultraviolet rays) to cure the photocurable resin composition to form the light-transmitting and hardening resin layer 7 ( Figure 3D). The curing rate of the light-transmitting and hardening resin layer 7 is preferably 90% or more, and more preferably 95% or more.
[步驟(C3)] [Step (C3)]
圖3E係表示影像顯示裝置之製造方法之步驟(C3)之一例之說明圖。 如圖3E所示,將透光性光學構件2自透光性硬化樹脂層7側貼合於影像顯示構件6。藉此獲得影像顯示裝置10。貼合可利用與上述步驟(C2)同樣之方法進行。 3E is an explanatory view showing an example of a step (C3) of the method of manufacturing the image display device. As shown in FIG. 3E, the translucent optical member 2 is bonded to the image display member 6 from the side of the translucent cured resin layer 7. Thereby, the image display device 10 is obtained. The bonding can be carried out in the same manner as in the above step (C2).
於上述影像顯示裝置之製造方法中,對使用形成有遮光層之透光性光學構件之情形進行了說明,但亦可使用未形成有遮光層之透光性光學構件製作影像顯示裝置。 In the method of manufacturing the image display device described above, the case of using the light-transmitting optical member in which the light-shielding layer is formed has been described. However, the light-transmitting optical member not having the light-shielding layer may be used to form the image display device.
[實施例] [Examples]
以下,對本發明之實施例進行說明。於本實施例中,製備光硬化性樹脂組成物,製作具有使用該光硬化性樹脂組成物之透光性硬化樹脂層之影像顯示裝置。並且,針對所製作之影像顯示裝置,評價-20℃之掉落衝擊試驗、25℃之接著強度、穿透率、-20℃之彈性模數、25℃之彈性模數、及玻璃轉移溫度。再者,本發明並不限定於該等實施例。 Hereinafter, embodiments of the invention will be described. In the present embodiment, a photocurable resin composition was prepared, and an image display device having a light-transmitting and curing resin layer using the photocurable resin composition was produced. Further, with respect to the produced image display device, a drop impact test at -20 ° C, a bonding strength at 25 ° C, a transmittance, an elastic modulus at -20 ° C, an elastic modulus at 25 ° C, and a glass transition temperature were evaluated. Furthermore, the invention is not limited to the embodiments.
於本實施例中,使用以下之簡稱。 In the present embodiment, the following abbreviation is used.
[具有胺酯骨架之(甲基)丙烯酸系低聚物] [(meth)acrylic oligomer having an amine ester skeleton]
TEAI-1000:日本曹達(股)公司製造 TEAI-1000: Made by Japan Soda Co., Ltd.
EBECRYL230:Daicel Allnex(股)公司製造 EBECRYL230: Made by Daicel Allnex Co., Ltd.
CN9014:脂肪族丙烯酸胺酯,Sartomer公司製造 CN9014: Aliphatic acrylate, manufactured by Sartomer
[(甲基)丙烯酸酯單體] [(Meth)acrylate monomer]
FA511AS:丙烯酸二環戊烯酯,日立化成工業(股)製造 FA511AS: Dicyclopentyl acrylate, manufactured by Hitachi Chemical Co., Ltd.
Light Acrylate IB-XA:丙烯酸異莰酯,共榮社化學(股)製造 Light Acrylate IB-XA: Isodecyl acrylate, manufactured by Kyoeisha Chemical Co., Ltd.
HDDA:己二醇二丙烯酸酯,Miramer M200,Miwon Specialty Chemical公司製造 HDDA: hexanediol diacrylate, Miramer M200, manufactured by Miwon Specialty Chemical Co., Ltd.
[塑化劑] [Plasticizer]
HLBH-P2000:1,2鍵結率為65%之聚丁二烯之氫化物(兩末端為羥基之氫化聚丁二烯,Krasol HLBH-P2000),Crayvalley公司製造 HLBH-P2000: 1,2 hydride of polybutadiene with a bonding ratio of 65% (hydrogenated polybutadiene with hydroxyl groups at both ends, Krasol HLBH-P2000), manufactured by Crayvalley
HLBH-P3000:1,2鍵結率為65%之聚丁二烯之氫化物(兩末端為羥基之氫化聚丁二烯,Krasol HLBH-P3000),Crayvalley公司製造 HLBH-P3000: 1,2 hydride of polybutadiene with a bonding ratio of 65% (hydrogenated polybutadiene with hydroxyl groups at both ends, Krasol HLBH-P3000), manufactured by Crayvalley
LBH-P2000:1,2鍵結率為65%之聚丁二烯(兩末端為羥基之聚丁二烯,Krasol LBH-P2000),Crayvalley公司製造 LBH-P2000: 1,2 polybutadiene with a bonding ratio of 65% (polybutadiene with hydroxyl groups at both ends, Krasol LBH-P2000), manufactured by Crayvalley
LBH-P3000:1,2鍵結率為65%之聚丁二烯(兩末端為羥基之聚丁二烯,Krasol LBH-P3000),Crayvalley公司製造 LBH-P3000: 1,2 polybutadiene with a bonding ratio of 65% (polybutadiene with hydroxyl groups at both ends, Krasol LBH-P3000), manufactured by Crayvalley
EPOL:1,2鍵結率為20%之聚異戊二烯之氫化物(兩末端為羥基之氫化聚異戊二烯),出光興產(股)公司製造 EPOL: 1,2 hydride of polyisoprene with a bonding ratio of 20% (hydrogenated polyisoprene with hydroxyl groups at both ends), manufactured by Idemitsu Kosan Co., Ltd.
GI-1000:1,2鍵結率為85%以上之聚丁二烯之氫化物(兩末端為羥基之氫化聚丁二烯),日本曹達(股)公司製造 GI-1000: 1,2 hydride of polybutadiene with a bonding ratio of 85% or more (hydrogenated polybutadiene with hydroxyl groups at both ends), manufactured by Japan Soda Co., Ltd.
GI-2000:1,2鍵結率為85%以上之聚丁二烯之氫化物(兩末端為羥基之氫化聚丁二烯),日本曹達(股)公司製造 GI-2000: 1,2 hydride of polybutadiene with a bonding ratio of 85% or more (hydrogenated polybutadiene with hydroxyl groups at both ends), manufactured by Japan Soda Co., Ltd.
GI-3000:1,2鍵結率為85%以上之聚丁二烯之氫化物(兩末端為羥基之氫化聚丁二烯),日本曹達(股)公司製造 GI-3000: 1,2 hydride of polybutadiene with a bonding ratio of 85% or more (hydrogenated polybutadiene with hydroxyl groups at both ends), manufactured by Japan Soda Co., Ltd.
G-1000:1,2鍵結率為85%以上之聚丁二烯(兩末端為羥基之聚丁二烯),日本曹達(股)公司製造 G-1000: 1,2-bonded polybutadiene with a bonding ratio of 85% or more (polybutadiene with hydroxyl groups at both ends), manufactured by Japan Soda Co., Ltd.
G-2000:1,2鍵結率為85%以上之聚丁二烯(兩末端為羥基之聚丁二烯),日本曹達(股)公司製造 G-2000: 1,2-bonded polybutadiene with a bonding ratio of 85% or more (polybutadiene with hydroxyl groups at both ends), manufactured by Japan Soda Co., Ltd.
[聚合起始劑] [Polymerization initiator]
Irg184:1-羥基環己基苯基酮,BASF公司製造 Irg184: 1-hydroxycyclohexyl phenyl ketone, manufactured by BASF
[光硬化性樹脂組成物之製備] [Preparation of photocurable resin composition]
以表1所示之摻合量(質量份)將各成分均勻地混合而製備實施例1~4、比較例1~3之光硬化性樹脂組成物。 The components of Examples 1 to 4 and Comparative Examples 1 to 3 were prepared by uniformly mixing the components in the amounts shown in Table 1 (parts by mass).
[實施例1] [Example 1]
使用35質量份之TEAI-1000、25質量份之FA511AS、40質量份之HLBH-P2000、及1質量份之Irg184而製備光硬化性樹脂組成物。 A photocurable resin composition was prepared using 35 parts by mass of TEAI-1000, 25 parts by mass of FA511AS, 40 parts by mass of HLBH-P2000, and 1 part by mass of Irg184.
[實施例2] [Embodiment 2]
將HLBH-P2000變更為等量之HLBH-P3000,除此以外,以與實施例1相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 1 except that HLBH-P2000 was changed to an equivalent amount of HLBH-P3000.
[實施例3] [Example 3]
將25質量份之FA511AS變更為20質量份之Light Acrylate IB-XA及5質量份之HDDA,除此以外,以與實施例1相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 1 except that 25 parts by mass of FA511AS was changed to 20 parts by mass of Light Acrylate IB-XA and 5 parts by mass of HDDA.
[實施例4] [Example 4]
將40質量份之HLBH-P2000變更為20質量份之HLBH-P3000、及20質量份之GI-1000,除此以外,以與實施例1相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 1 except that 40 parts by mass of HLBH-P2000 was changed to 20 parts by mass of HLBH-P3000 and 20 parts by mass of GI-1000.
[比較例1] [Comparative Example 1]
將HLBH-P2000變更為等量之GI-1000,除此以外,以與實施例1相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 1 except that the HLBH-P2000 was changed to the same amount of GI-1000.
[比較例2] [Comparative Example 2]
將HLBH-P2000變更為等量之GI-2000,除此以外,以與實施例1相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 1 except that the HLBH-P2000 was changed to an equivalent amount of GI-2000.
[比較例3] [Comparative Example 3]
將HLBH-P2000變更為等量之GI-3000,除此以外,以與實施例1相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 1 except that the HLBH-P2000 was changed to an equivalent amount of GI-3000.
以表2所示之摻合量(質量份)將各成分均勻地混合而製備實施例5、6、比較例4、5之光硬化性樹脂組成物。 The photocurable resin compositions of Examples 5 and 6, and Comparative Examples 4 and 5 were prepared by uniformly mixing the components in the amounts shown in Table 2 (parts by mass).
[實施例5] [Example 5]
使用25質量份之EBECRYL230、30質量份之FA511AS、45質量份之LBH-P2000、及1質量份之Irg184而製備光硬化性樹脂組成物。 A photocurable resin composition was prepared using 25 parts by mass of EBECRYL 230, 30 parts by mass of FA511AS, 45 parts by mass of LBH-P2000, and 1 part by mass of Irg 184.
[實施例6] [Embodiment 6]
將LBH-P2000變更為等量之LBH-P3000,除此以外,以與實施例5相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 5 except that LBH-P2000 was changed to an equivalent amount of LBH-P3000.
[比較例4] [Comparative Example 4]
將LBH-P2000變更為等量之G-1000,除此以外,以與實施例5相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 5 except that LBH-P2000 was changed to an equivalent amount of G-1000.
[比較例5] [Comparative Example 5]
將LBH-P2000變更為等量之G-2000,除此以外,以與實施例5相同之方式製備光硬化性樹脂組成物。 A photocurable resin composition was prepared in the same manner as in Example 5 except that LBH-P2000 was changed to an equivalent amount of G-2000.
以表3所示之摻合量(質量份)將各成分均勻地混合而製備實施例7、比較例6之光硬化性樹脂組成物。 The photocurable resin compositions of Example 7 and Comparative Example 6 were prepared by uniformly mixing the components in the amounts shown in Table 3 (parts by mass).
[實施例7] [Embodiment 7]
使用30質量份之CN9014、35質量份之FA511AS、35質量份之EPOL、及1質量份之Irg184而製備光硬化性樹脂組成物。 A photocurable resin composition was prepared by using 30 parts by mass of CN9014, 35 parts by mass of FA511AS, 35 parts by mass of EPOL, and 1 part by mass of Irg184.
[比較例6] [Comparative Example 6]
使用30質量份之CN9014、35質量份之FA511AS、35質量份之GI-3000、及1質量份之Irg184而製備光硬化性樹脂組成物。 A photocurable resin composition was prepared by using 30 parts by mass of CN9014, 35 parts by mass of FA511AS, 35 parts by mass of GI-3000, and 1 part by mass of Irg184.
[影像顯示裝置之製作] [Production of image display device]
使用上述各實施例及比較例中所獲得之光硬化性樹脂組成物,藉由以下之各步驟而製作影像顯示裝置。 Using the photocurable resin composition obtained in each of the above Examples and Comparative Examples, a video display device was produced by the following steps.
準備45(w)×80(l)×0.4(t)mm之大小之玻璃板,使用熱硬化型之黑色墨水(MRX油墨、帝國油墨製造公司),以乾燥厚度成為40μm之方式將4mm寬之遮光層藉由網版印刷法而塗佈於該玻璃板之周緣部整個區域,並使其乾燥,藉此準備附遮光層之玻璃板。 A glass plate having a size of 45 (w) × 80 (l) × 0.4 (t) mm was prepared, and a thermosetting type black ink (MRX ink, Imperial Ink Manufacturing Co., Ltd.) was used, and a dry thickness of 40 μm was used to make a 4 mm wide film. The light-shielding layer is applied to the entire peripheral portion of the glass sheet by screen printing, and dried to prepare a glass plate with a light-shielding layer.
使用樹脂用分注器,將上述光硬化性樹脂組成物噴出於附遮光層之玻璃板之遮光層形成面。 The photocurable resin composition was sprayed onto the light shielding layer forming surface of the glass plate with the light shielding layer using a resin dispenser.
於40(w)×70(l)mm之大小之液晶顯示元件之積層有偏光板之面,將上述玻璃板以光硬化性樹脂組成物側成為偏光板側之方式載置,利用玻璃板之自身重量貼附玻璃板。偏光板與玻璃板之間潤濕擴散之光硬化性樹脂組成物之厚度為150μm。 The liquid crystal display element having a thickness of 40 (w) × 70 (1) mm is laminated on the surface of the polarizing plate, and the glass plate is placed on the side of the photocurable resin composition so as to be on the side of the polarizing plate, and the glass plate is used. The weight is attached to the glass plate. The thickness of the photocurable resin composition which wetted and diffused between the polarizing plate and the glass plate was 150 μm.
使用紫外線照射裝置(UVL-7000M4-N,USHIO LIGHTING(股)公司製造),自玻璃板側以3000mJ/cm2照射紫外線,使光硬化性樹脂組成物硬化而形成透光性硬化樹脂層。透光性硬化樹脂層之硬化率為97%。藉此,獲得作為透光性光學構件之玻璃板經由透光性硬化樹脂層而積層於 液晶顯示元件之液晶顯示裝置。 Ultraviolet irradiation apparatus (UVL-7000M4-N, manufactured by USHIO LIGHTING Co., Ltd.) was used to irradiate ultraviolet rays at 3000 mJ/cm 2 from the glass plate side to cure the photocurable resin composition to form a light-transmitting and hardening resin layer. The hardening ratio of the light-transmitting and hardening resin layer was 97%. Thereby, a liquid crystal display device in which a glass plate as a translucent optical member is laminated on a liquid crystal display element via a translucent cured resin layer is obtained.
[評價] [Evaluation]
[掉落衝擊試驗] [drop impact test]
使所獲得之影像顯示裝置自高度1m掉落,將無透光性硬化樹脂層與液晶顯示元件之界面、及透光性硬化樹脂層與玻璃板之界面之剝離時評價為「○」,將有剝離時評價為「×」。將結果示於表1~3。 The obtained image display device was dropped from the height of 1 m, and the interface between the non-translucent-curable resin layer and the liquid crystal display element and the interface between the translucent-curable resin layer and the glass plate were evaluated as "○". When there is peeling, it is evaluated as "X". The results are shown in Tables 1 to 3.
[接著強度試驗] [Next strength test]
如圖4、5所示,於厚度1mm之玻璃板31之中央部滴加光硬化性樹脂組成物,經由150μm之間隔片34,以使厚度1mm之玻璃板32正交之方式載置。藉此,獲得於玻璃板31、32之間形成有直徑3mm、厚度150μm之光硬化性樹脂組成物層之玻璃接合體33。繼而,使用紫外線照射裝置,以累計光量成為3000mJ/cm2之方式,自玻璃板32側照射200mW/cm2強度之紫外線,使光硬化性樹脂組成物層完全硬化而形成透光性硬化樹脂層35。然後,如圖6、7所示,使位於玻璃接合體33之下側之玻璃板32固定,使用治具36將位於上側之玻璃板31於垂直方向以5mm/min之速度剝離,利用以下之基準評價接著狀態。於接著強度之測定時,使用島津製作所製造之AGS-X。接著強度係藉由於25℃測定將玻璃板31與玻璃板32分離為止所需之應力,並將該應力除以透光性硬化樹脂層35之單位面積而算出。將接著強度(25℃)為500N/cm2以上時評價為「○」,將接著強度未達500N/cm2時評價為「×」。將結果示於表1~3。 As shown in FIGS. 4 and 5, a photocurable resin composition was dropped on the center portion of the glass plate 31 having a thickness of 1 mm, and placed on the spacers 34 of 150 μm so that the glass plates 32 having a thickness of 1 mm were placed orthogonally. Thereby, a glass bonded body 33 in which a photocurable resin composition layer having a diameter of 3 mm and a thickness of 150 μm was formed between the glass plates 31 and 32 was obtained. Then, an ultraviolet ray having a strength of 200 mW/cm 2 was irradiated from the side of the glass plate 32 so that the photocurable resin composition layer was completely cured to form a light-transmitting hardened resin layer, using an ultraviolet ray irradiation device so that the integrated light amount was 3,000 mJ/cm 2 . 35. Then, as shown in FIGS. 6 and 7, the glass plate 32 located on the lower side of the glass joined body 33 is fixed, and the glass plate 31 located on the upper side is peeled off at a speed of 5 mm/min in the vertical direction by using the jig 36, and the following is used. The benchmark is evaluated next to the status. For the measurement of the subsequent strength, AGS-X manufactured by Shimadzu Corporation was used. Then, the strength is calculated by dividing the stress required for separating the glass plate 31 from the glass plate 32 at 25 ° C, and dividing the stress by the unit area of the light-transmitting and hardening resin layer 35. When the adhesive strength (25 ° C) was 500 N/cm 2 or more, it was evaluated as "○", and when the adhesive strength was less than 500 N/cm 2 , it was evaluated as "X". The results are shown in Tables 1 to 3.
[穿透率] [penetration rate]
使用紫外可見分光光度計(島津製作所製造,UV-2450),測定影像顯 示裝置中之透光性硬化樹脂層之可見光區域之穿透率。將結果示於表1~3。 Determination of image display using an ultraviolet-visible spectrophotometer (manufactured by Shimadzu Corporation, UV-2450) The transmittance of the visible light region of the light-transmitting and hardening resin layer in the device. The results are shown in Tables 1 to 3.
[彈性模數] [Elastic Modulus]
使用黏彈性測定裝置,算出影像顯示裝置中之透光性硬化樹脂層之彈性模數(-20℃及25℃)。測定係使用黏彈性測定裝置(Seiko Instruments(股)製造,DMS6100),於測定頻率1Hz、拉伸模式下進行。將結果示於表1~3。 The elastic modulus (-20 ° C and 25 ° C) of the light-transmitting and hardening resin layer in the image display device was calculated using a viscoelasticity measuring device. The measurement was carried out using a viscoelasticity measuring apparatus (manufactured by Seiko Instruments Co., Ltd., DMS6100) at a measurement frequency of 1 Hz in a tensile mode. The results are shown in Tables 1 to 3.
[玻璃轉移溫度] [glass transition temperature]
測定影像顯示裝置中之透光性硬化樹脂層之玻璃轉移溫度。測定係使用黏彈性測定裝置(Seiko Instruments(股)製造,DMS6100),於測定頻率1Hz、拉伸模式下進行。將結果示於表1~3。 The glass transition temperature of the light-transmitting hardened resin layer in the image display device was measured. The measurement was carried out using a viscoelasticity measuring apparatus (manufactured by Seiko Instruments Co., Ltd., DMS6100) at a measurement frequency of 1 Hz in a tensile mode. The results are shown in Tables 1 to 3.
如實施例1~7,可知於使用含有具有胺酯骨架之(甲基)丙烯酸系低聚物、(甲基)丙烯酸酯單體、聚合起始劑、1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之至少1種之光硬化性樹脂組成物之情形時,即便透光性樹脂組成物層之玻璃轉移溫度較高,亦可降低低溫環境下之透光性樹脂組成物層之彈性模數。又,可知-20℃之掉落衝擊 性、及穿透率亦良好。 As shown in Examples 1 to 7, it is known that a (meth)acrylic oligomer having a urethane skeleton, a (meth) acrylate monomer, a polymerization initiator, and a bonding ratio of 1, 2 are less than 80%. In the case of a photocurable resin composition of at least one of polybutadiene and polyisoprene having a 1,2 bond ratio of less than 80%, the glass transition temperature of the light transmissive resin composition layer Higher, it can also reduce the elastic modulus of the light transmissive resin composition layer in a low temperature environment. Also, we can see the drop impact of -20 °C Sex, and penetration rates are also good.
尤其如實施例1~4、7,可知於使用含有具有胺酯骨架之(甲基)丙烯酸系低聚物、(甲基)丙烯酸酯單體、聚合起始劑、1,2鍵結率未達80%之聚丁二烯之氫化物及1,2鍵結率未達80%之聚異戊二烯之氫化物之至少1種之光硬化性樹脂組成物之情形時,-20℃之掉落衝擊性亦優異,接著強度亦良好。 In particular, as in Examples 1 to 4 and 7, it was found that a (meth)acrylic oligomer having a urethane skeleton, a (meth) acrylate monomer, a polymerization initiator, and a bonding ratio of 1, 2 were not used. In the case of a photocurable resin composition of at least one of a hydride of polybutadiene of 80% and a hydride of polyisoprene having a 1,2 bond ratio of less than 80%, -20 ° C The drop impact is also excellent, and the strength is also good.
另一方面,如比較例1~6,可知於使用不含有1,2鍵結率未達80%之聚丁二烯、及1,2鍵結率未達80%之聚異戊二烯之至少1種之光硬化性樹脂組成物之情形時,難以降低低溫環境下之透光性樹脂組成物層之彈性模數。又,可知-20℃之掉落衝擊性亦不良好。 On the other hand, as in Comparative Examples 1 to 6, it was found that polybutadiene having a bonding ratio of less than 80% and a polyisoprene having a bonding ratio of less than 80% were used. In the case of at least one kind of photocurable resin composition, it is difficult to reduce the elastic modulus of the light transmissive resin composition layer in a low temperature environment. Further, it is understood that the drop impact at -20 ° C is also not good.
1‧‧‧遮光層 1‧‧‧ shading layer
2‧‧‧透光性光學構件 2‧‧‧Transparent optical components
3‧‧‧光硬化性樹脂組成物層 3‧‧‧Photocurable resin composition layer
3A‧‧‧光硬化性樹脂組成物 3A‧‧‧Photocurable resin composition
6‧‧‧影像顯示構件 6‧‧‧Image display component
7‧‧‧透光性硬化樹脂層 7‧‧‧Transparent hardening resin layer
10‧‧‧影像顯示裝置 10‧‧‧Image display device
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