TW201710855A - Touch panel and method for fabricating the same - Google Patents
Touch panel and method for fabricating the same Download PDFInfo
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Abstract
Description
本發明是關於一種觸控面板。 The present invention relates to a touch panel.
隨著智慧型手機等智慧型產品的發展,顯示器搭配觸控面板已漸漸成為主流。為了使使用者在使用智慧型產品時,不受觸控面板的電路影響視覺效果,觸控面板的蓋板玻璃上通常設置相互堆疊的裝飾層和遮光層,裝飾層例如為各種顏色的油墨,以使觸控面板顯示出各種顏色的邊框,遮光層為不透明的材料,以阻擋金屬等可見元件的反光。 With the development of smart products such as smart phones, monitors with touch panels have gradually become mainstream. In order to enable the user to use the smart product without being affected by the circuit of the touch panel, the cover glass of the touch panel is usually provided with a decorative layer and a light shielding layer stacked on each other, and the decorative layer is, for example, ink of various colors. In order to make the touch panel display a frame of various colors, the light shielding layer is an opaque material to block the reflection of visible elements such as metal.
觸控面板的多個層體,例如裝飾層與遮光層等等,往往具有不匹配的熱膨脹係數,使得在製作過程中,因脹縮率不一致,熱膨脹係數較大的層體可能會對熱膨脹係數較小的層產生拉扯而導致熱膨脹係數較小的層體出現龜裂。觸控面板的部分電路可能設置於這些層體上,此龜裂可能會使這些電路斷路,進而造成觸控效果失靈。 The multiple layers of the touch panel, such as the decorative layer and the light shielding layer, often have a mismatched thermal expansion coefficient, so that the layer with a large thermal expansion coefficient may have a coefficient of thermal expansion during the manufacturing process due to inconsistent expansion and contraction rates. The smaller layer is pulled and the layer having a smaller coefficient of thermal expansion is cracked. Some of the circuits of the touch panel may be disposed on the layers, and the crack may cause the circuits to be broken, thereby causing the touch effect to be unsuccessful.
本發明之多個實施方式中,藉由絕緣層覆蓋裝飾層,避免觸控面板的電路直接設置於裝飾層上。如此一來,即使裝飾層在形成絕緣層前發生龜裂,可在形成絕緣層的的過程中,可藉由塗抹液態絕緣材料而填補裝飾層的裂縫,而提供一個平坦的表面。此外,由於絕緣層相較於裝飾層具有較小的膨脹係數,一方面可以壓制裝飾層與遮光層的膨脹,減少遮光層的熱脹冷縮產生較大的應力使裝飾層出現裂紋;另一方面,絕緣層本身具有較小的熱膨脹係數,故其熱脹冷縮產生的應力對裝飾層影響較小,可降低裝飾層於後續的烘烤等步驟中產生裂縫的可能性。 In various embodiments of the present invention, the decorative layer is covered by the insulating layer to prevent the circuit of the touch panel from being directly disposed on the decorative layer. In this way, even if the decorative layer is cracked before the formation of the insulating layer, a crack can be filled in the process of forming the insulating layer by filling the liquid insulating material to provide a flat surface. In addition, since the insulating layer has a smaller expansion coefficient than the decorative layer, on the one hand, the expansion of the decorative layer and the light shielding layer can be suppressed, and the thermal expansion and contraction of the light shielding layer is reduced to generate a large stress to cause cracks in the decorative layer; In respect, the insulating layer itself has a small coefficient of thermal expansion, so that the stress generated by the thermal expansion and contraction has less influence on the decorative layer, and the possibility that the decorative layer is cracked in the subsequent baking and the like can be reduced.
本發明之一態樣提供一種觸控面板,包含基板、裝飾層、遮光層以及絕緣層。基板包含可視區與設置於可視區之至少一側的非可視區。裝飾層設置於基板上且用以定義可視區與非可視區。遮光層覆蓋裝飾層之第一部分,且露出裝飾層之第二部分,其中裝飾層之第一部分與第二部分相鄰,且第二部分相較於第一部分較靠近可視區。絕緣層覆蓋裝飾層之第二部分。 One aspect of the present invention provides a touch panel including a substrate, a decorative layer, a light shielding layer, and an insulating layer. The substrate includes a viewable area and a non-visible area disposed on at least one side of the viewable area. The decorative layer is disposed on the substrate and is used to define the visible area and the non-visible area. The light shielding layer covers the first portion of the decorative layer and exposes the second portion of the decorative layer, wherein the first portion of the decorative layer is adjacent to the second portion and the second portion is closer to the viewable region than the first portion. An insulating layer covers the second portion of the decorative layer.
於本發明之一或多個實施方式中,絕緣層延伸至遮光層上,並至少部分覆蓋遮光層。 In one or more embodiments of the invention, the insulating layer extends over the light shielding layer and at least partially covers the light shielding layer.
於本發明之一或多個實施方式中,觸控面板更包含觸控感測層以及與觸控感測陣列連接之至少一導電引線。觸控感測層包含觸控感測陣列與至少一周邊引線,其中觸控感測陣列設置於可視區,周邊引線設置於非可視區且位於絕緣層之 上。導電引線設置於非可視區且位於絕緣層之上,用以連接周邊引線。 In one or more embodiments of the present invention, the touch panel further includes a touch sensing layer and at least one conductive lead connected to the touch sensing array. The touch sensing layer includes a touch sensing array and at least one peripheral lead, wherein the touch sensing array is disposed in the visible area, and the peripheral lead is disposed in the non-visible area and located in the insulating layer on. Conductive leads are disposed in the non-visible area and above the insulating layer for connecting the peripheral leads.
於本發明之一或多個實施方式中,觸控面板更包含觸控感測層以及與觸控感測陣列連接之至少一導電引線。觸控感測層包含觸控感測陣列與至少一周邊引線,其中觸控感測陣列設置於可視區,周邊引線設置於非可視區且位於絕緣層之上。導電引線設置於非可視區且位於絕緣層與遮光層之間,其中絕緣層包含至少一導電通孔以使導電引線與周邊引線電性連接。 In one or more embodiments of the present invention, the touch panel further includes a touch sensing layer and at least one conductive lead connected to the touch sensing array. The touch sensing layer includes a touch sensing array and at least one peripheral lead, wherein the touch sensing array is disposed in the visible area, and the peripheral lead is disposed in the non-visible area and above the insulating layer. The conductive lead is disposed between the insulating layer and the light shielding layer, and the insulating layer includes at least one conductive via to electrically connect the conductive lead to the peripheral lead.
於本發明之一或多個實施方式中,第二部分自第一部分與第二部分的相鄰介面起向可視區延伸大約10微米至大約200微米。 In one or more embodiments of the invention, the second portion extends from the adjacent interface of the first portion to the second portion to the viewable region by between about 10 microns and about 200 microns.
於本發明之一或多個實施方式中,絕緣層的膨脹係數小於裝飾層的膨脹係數。 In one or more embodiments of the invention, the coefficient of expansion of the insulating layer is less than the coefficient of expansion of the decorative layer.
於本發明之一或多個實施方式中,裝飾層的膨脹係數小於遮光層的膨脹係數。 In one or more embodiments of the invention, the coefficient of expansion of the decorative layer is less than the coefficient of expansion of the light shielding layer.
於本發明之一或多個實施方式中,裝飾層更包含相鄰第二部分的第三部分,其中第三部分相較於第二部分更靠近可視區,且第三部分未受到絕緣層的覆蓋而外露。 In one or more embodiments of the present invention, the decorative layer further includes a third portion of the adjacent second portion, wherein the third portion is closer to the viewable region than the second portion, and the third portion is not subjected to the insulating layer Covered and exposed.
本發明之一態樣提供一種製造觸控面板的方法,包含形成裝飾層於基板上,其中裝飾層定義基板之可視區與設置於可視區之至少一側的非可視區;形成遮光層在裝飾層的第一部分上,以露出裝飾層之靠近可視區的第二部分,其中第二 部分相較於第一部分較靠近可視區,第一部分與第二部分相鄰;以及形成絕緣層,連接遮光層且覆蓋裝飾層之第二部分。 One aspect of the present invention provides a method of manufacturing a touch panel, comprising forming a decorative layer on a substrate, wherein the decorative layer defines a visible area of the substrate and a non-visible area disposed on at least one side of the visible area; forming a light shielding layer in the decoration a first portion of the layer to expose a second portion of the decorative layer adjacent to the viewable area, wherein the second portion The portion is closer to the visible region than the first portion, the first portion is adjacent to the second portion; and an insulating layer is formed to connect the light shielding layer and cover the second portion of the decorative layer.
於本發明之一或多個實施方式中,形成該絕緣層的步驟包含:塗佈液態材料於裝飾層之第二部分上,以使液態材料填補裝飾層之凹陷處;以及烘烤基板,以硬化液態材料而形成絕緣層。 In one or more embodiments of the present invention, the step of forming the insulating layer includes: coating a liquid material on the second portion of the decorative layer to fill the recess of the decorative layer; and baking the substrate to The liquid material is hardened to form an insulating layer.
於本發明之一或多個實施方式中,絕緣層延伸至遮光層上,並至少部分覆蓋遮光層。 In one or more embodiments of the invention, the insulating layer extends over the light shielding layer and at least partially covers the light shielding layer.
於本發明之一或多個實施方式中,上述之製造觸控面板的方法更包含形成觸控感測層之至少一周邊引線於非可視區之絕緣層之上;以及形成至少一導電引線於非可視區之絕緣層之上,其中周邊引線連接導電引線。 In one or more embodiments of the present invention, the method for manufacturing a touch panel further includes forming at least one peripheral lead of the touch sensing layer over the insulating layer of the non-visible area; and forming at least one conductive lead Above the insulating layer of the non-visible area, wherein the peripheral leads are connected to the conductive leads.
於本發明之一或多個實施方式中,上述之製造觸控面板的方法更包含在形成該絕緣層之前,形成至少一導電引線於該遮光層之上;在形成該絕緣層之後,形成至少一導電通孔於絕緣層內;以及形成一觸控感測層之至少一周邊引線於導電通孔之上,以使該導電引線透過該導電通孔電性連接該周邊引線。 In one or more embodiments of the present invention, the method for manufacturing a touch panel further includes forming at least one conductive lead over the light shielding layer before forming the insulating layer; and forming at least the insulating layer after forming the insulating layer a conductive via is formed in the insulating layer; and at least one peripheral lead of the touch sensing layer is formed on the conductive via, such that the conductive lead is electrically connected to the peripheral lead through the conductive via.
於本發明之一或多個實施方式中,絕緣層的膨脹係數小於該裝飾層的膨脹係數。 In one or more embodiments of the invention, the coefficient of expansion of the insulating layer is less than the coefficient of expansion of the decorative layer.
100‧‧‧觸控面板 100‧‧‧ touch panel
110‧‧‧基板 110‧‧‧Substrate
120‧‧‧裝飾層 120‧‧‧decorative layer
122‧‧‧第一部分 122‧‧‧Part 1
124‧‧‧第二部分 124‧‧‧Part II
126‧‧‧第三部分 126‧‧‧Part III
130‧‧‧遮光層 130‧‧‧Lighting layer
132‧‧‧側面 132‧‧‧ side
140‧‧‧絕緣層 140‧‧‧Insulation
142‧‧‧導電通孔 142‧‧‧ conductive through holes
150‧‧‧觸控感測層 150‧‧‧ touch sensing layer
152‧‧‧觸控感測陣列 152‧‧‧Touch Sensing Array
154‧‧‧周邊引線 154‧‧‧ peripheral leads
160‧‧‧導電引線 160‧‧‧Electrical leads
VA‧‧‧可視區 VA‧‧ visible area
NA‧‧‧非可視區 NA‧‧‧Invisible area
B-B’‧‧‧線 B-B’‧‧‧ line
D‧‧‧虛線 D‧‧‧ dotted line
第1A圖為本發明之一實施方式之觸控面板之上視圖。 FIG. 1A is a top view of a touch panel according to an embodiment of the present invention.
第1B圖為沿第1A圖之線B-B’之剖面圖。 Fig. 1B is a cross-sectional view taken along line B-B' of Fig. 1A.
第2圖為本發明之另一實施方式之觸控面板之剖面圖。 2 is a cross-sectional view of a touch panel according to another embodiment of the present invention.
第3圖為本發明之再一實施方式之觸控面板之剖面圖。 3 is a cross-sectional view of a touch panel according to still another embodiment of the present invention.
第4圖為本發明之又一實施方式之觸控面板之剖面圖。 4 is a cross-sectional view of a touch panel according to still another embodiment of the present invention.
第5A圖至第5E圖為本發明之再一實施方式之觸控面板於多個製作步驟中的剖面圖。 5A to 5E are cross-sectional views showing a touch panel according to still another embodiment of the present invention in a plurality of fabrication steps.
第6A圖至第6C圖為本發明之另一實施方式之觸控面板於多個製作步驟中的剖面圖。 6A to 6C are cross-sectional views showing a touch panel according to another embodiment of the present invention in a plurality of fabrication steps.
以下將以圖式揭露本發明之多個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式為之。 The various embodiments of the present invention are disclosed in the drawings, and in the claims However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified manner.
同時參照第1A圖與第1B圖。第1A圖為本發明之一實施方式之觸控面板100之上視圖。第1B圖為沿第1A圖之線B-B’之剖面圖。觸控面板100包含基板110、裝飾層120、遮光層130以及絕緣層140。於第1A圖中,為方便說明起見,以虛線D繪示遮光層130的邊界,而未實際繪示或標示遮光層130。基板110包含可視區VA與設置於可視區VA之至少一側的非可視區NA,本實施例以非可視區NA圍繞可視區VA周邊為例說明。裝飾層120設置於基板110上且用以定義可視區VA與 非可視區NA,裝飾層120位於非可視區NA。參照第1B圖,遮光層130覆蓋裝飾層120之第一部分122,且露出裝飾層120之第二部分124,以避免因製程精度等原因,使裝飾層120延伸到可視區VA,導致使用者自可視區VA可看到遮光層130而影響視覺效果。其中裝飾層120之第一部分122與第二部分124相鄰,且第二部分124相較於第一部分122較靠近可視區VA。絕緣層140至少設置接觸遮光層130且覆蓋裝飾層120之第二部分124。 Refer to both Figure 1A and Figure 1B. FIG. 1A is a top view of a touch panel 100 according to an embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line B-B' of Fig. 1A. The touch panel 100 includes a substrate 110 , a decorative layer 120 , a light shielding layer 130 , and an insulating layer 140 . In FIG. 1A, for convenience of explanation, the boundary of the light shielding layer 130 is indicated by a broken line D, and the light shielding layer 130 is not actually shown or labeled. The substrate 110 includes a visible area VA and a non-visible area NA disposed on at least one side of the visible area VA. In this embodiment, the non-visible area NA surrounds the periphery of the visible area VA as an example. The decorative layer 120 is disposed on the substrate 110 and is used to define the visible area VA and The non-visible area NA, the decorative layer 120 is located in the non-visible area NA. Referring to FIG. 1B, the light shielding layer 130 covers the first portion 122 of the decorative layer 120, and exposes the second portion 124 of the decorative layer 120 to avoid extending the decorative layer 120 to the visible region VA due to process precision and the like, resulting in user self- The light-shielding layer 130 can be seen in the visible area VA to affect the visual effect. The first portion 122 of the decorative layer 120 is adjacent to the second portion 124, and the second portion 124 is closer to the viewable area VA than the first portion 122. The insulating layer 140 is provided with at least a contact light shielding layer 130 and covering the second portion 124 of the decorative layer 120.
於本實施方式中,觸控面板100更包含觸控感測層150以及至少一導電引線160。觸控感測層150大部份設置於可視區VA而部份延伸至非可視區NA來設置於裝飾層120與遮光層130之上,具體的觸控感測層150還位於絕緣層140之上,並與導電引線160電性連接。導電引線160可以設置於裝飾層120與遮光層130之上,觸控感測層150用以偵側觸控資訊,並通過導電引線160將此觸控資訊傳遞至計算單元(未繪示),例如積體電路晶片,計算單元經計算得到使用者的觸控位置。 In the embodiment, the touch panel 100 further includes a touch sensing layer 150 and at least one conductive lead 160 . The touch sensing layer 150 is disposed on the visible layer VA and partially extends to the non-visible area NA to be disposed on the decorative layer 120 and the light shielding layer 130. The specific touch sensing layer 150 is also located in the insulating layer 140. And electrically connected to the conductive lead 160. The conductive lead 160 can be disposed on the decorative layer 120 and the light shielding layer 130. The touch sensing layer 150 is configured to detect the touch information and transmit the touch information to the computing unit (not shown) through the conductive lead 160. For example, an integrated circuit chip, the calculation unit calculates the touch position of the user.
於此,在佈設遮光層130的過程中需經過加熱烘烤等步驟,由於裝飾層120、遮光層130不具有相同的熱膨脹係數,其間可能存在膨脹差異。舉例而言,當裝飾層120由白色油墨組成而遮光層130由黑色油墨組成時,遮光層130的熱膨脹係數大於裝飾層120的熱膨脹係數。尤其,對於脫離遮光層130覆蓋的部分裝飾層120,也就是前述裝飾層120的第二部分124,遮光層130與裝飾層120的膨脹差異可能產生側向的應 力會對裝飾層120產生拉扯,而使已形成的此部分裝飾層120容易龜裂。 Here, in the process of arranging the light shielding layer 130, a step of heating baking or the like is required. Since the decorative layer 120 and the light shielding layer 130 do not have the same thermal expansion coefficient, there may be a difference in expansion therebetween. For example, when the decorative layer 120 is composed of white ink and the light shielding layer 130 is composed of black ink, the thermal expansion coefficient of the light shielding layer 130 is greater than the thermal expansion coefficient of the decorative layer 120. In particular, for the partial decorative layer 120 covered by the light shielding layer 130, that is, the second portion 124 of the decorative layer 120, the difference in expansion between the light shielding layer 130 and the decorative layer 120 may produce a lateral response. The force will pull the decorative layer 120, and the formed decorative layer 120 is easily cracked.
於此,為方便說明起見,將裝飾層120分為依序相連的三個部分:第一部分122、第二部分124以及第三部分126。第一部分122受到遮光層130的覆蓋,第二部分124指在加熱烘烤中靠近遮光層130而較容易龜裂的部分裝飾層120,第三部分126指在加熱烘烤中遠離遮光層130而較不易龜裂的部分裝飾層120。第二部分124與第三部分126的界線隨著使用的基板110、裝飾層120和遮光層130的材料差異與烘烤溫度的不同而變化。舉例而言,於多個實施方式中,第二部分124自第一部分122與第二部分124的相鄰介面起向可視區VA延伸大約10微米至大約200微米。需要說明的是,在其它實施例中,依據遮光層130及裝飾層120的相對大小設計,有可能裝飾層120僅分為第一部分122、第二部分124,而不會有剩餘的第三部分126,如此,絕緣層140靠近可視區VA的側面實質上與裝飾層120靠近可視區VA的側面齊平,或絕緣層140可進一步延伸到可視區VA。 Here, for convenience of explanation, the decorative layer 120 is divided into three parts that are sequentially connected: a first part 122, a second part 124, and a third part 126. The first portion 122 is covered by the light shielding layer 130, and the second portion 124 refers to a portion of the decorative layer 120 which is relatively easy to be cracked near the light shielding layer 130 during the heating baking, and the third portion 126 refers to being away from the light shielding layer 130 during the heating baking. A portion of the decorative layer 120 that is less prone to cracking. The boundary between the second portion 124 and the third portion 126 varies depending on the material difference between the substrate 110, the decorative layer 120, and the light shielding layer 130 used and the baking temperature. For example, in various embodiments, the second portion 124 extends from the adjacent interface of the first portion 122 and the second portion 124 to the viewable region VA by between about 10 microns and about 200 microns. It should be noted that, in other embodiments, according to the relative size design of the light shielding layer 130 and the decorative layer 120, it is possible that the decorative layer 120 is only divided into the first portion 122 and the second portion 124 without the remaining third portion. 126. Thus, the side of the insulating layer 140 near the visible area VA is substantially flush with the side of the decorative layer 120 adjacent to the visible area VA, or the insulating layer 140 may further extend to the visible area VA.
本發明之多個實施方式中,配置絕緣層140於裝飾層120脫離遮光層130覆蓋的部分(即第二部分124),且設計絕緣層140的膨脹係數小於裝飾層120的膨脹係數。詳細而言,絕緣層140設計覆蓋自第一部分122與第二部分124的相鄰介面起向可視區VA延伸大約10微米至大約200微米的區域。一方面可填補在先前製作遮光層130中,因烘烤等因素導致裝飾層120龜裂所產生的裂縫,以提供後續形成的觸控感測層150 或導電引線160一個平整的表面,避免斷路;另一方面可以在後續製造遮光層130的過程中,藉由絕緣層140抑制裝飾層120的膨脹,減少遮光層130的熱脹冷縮產生較大的應力使裝飾層120出現裂紋;此外,絕緣層140本身具有較小的熱膨脹係數,故其熱脹冷縮產生的應力對裝飾層120和遮光層130影響較小,而防止此部分裝飾層120的龜裂。於此,可以配置絕緣層140、裝飾層120以及遮光層130的熱膨脹係數依序遞增,以減少遮光層130的脹縮對裝飾層120的影響。 In various embodiments of the present invention, the insulating layer 140 is disposed at a portion of the decorative layer 120 that is covered by the light shielding layer 130 (ie, the second portion 124), and the insulating coefficient of the insulating layer 140 is designed to be smaller than the expansion coefficient of the decorative layer 120. In detail, the insulating layer 140 is designed to cover an area extending from the adjacent interface of the first portion 122 and the second portion 124 to the viewable region VA by about 10 microns to about 200 microns. On the one hand, the crack generated by the crack of the decorative layer 120 caused by the baking or the like may be filled in the previously made light shielding layer 130 to provide the subsequently formed touch sensing layer 150. Or a flat surface of the conductive lead 160 to avoid an open circuit; on the other hand, in the subsequent process of manufacturing the light shielding layer 130, the expansion of the decorative layer 120 is suppressed by the insulating layer 140, and the thermal expansion and contraction of the light shielding layer 130 is reduced to be large. The stress causes the decorative layer 120 to crack; in addition, the insulating layer 140 itself has a small coefficient of thermal expansion, so the stress generated by the thermal expansion and contraction has less influence on the decorative layer 120 and the light shielding layer 130, and the decorative layer 120 is prevented from being partially protected. Cracked. Herein, the thermal expansion coefficients of the insulating layer 140, the decorative layer 120, and the light shielding layer 130 may be sequentially increased to reduce the influence of the expansion and contraction of the light shielding layer 130 on the decorative layer 120.
雖然於此,僅繪示第二部分124受到絕緣層140的覆蓋,第三部分126相較於第二部分124更靠近可視區VA,且第三部分126未受到絕緣層140的覆蓋而外露,但不應以此限制本發明之範圍。於部分實施方式中,絕緣層140亦可以延伸至第三部分126上。不過,應了解到,實際設計上為了避免使用者觀察到絕緣層140的配置,因此可避免絕緣層140延伸到可視區VA,故可保留部分第三部分126未受到絕緣層140的覆蓋,或使得絕緣層140靠近可視區VA的側面與裝飾層120靠近可視區VA的側面齊平。 Although only the second portion 124 is covered by the insulating layer 140, the third portion 126 is closer to the visible region VA than the second portion 124, and the third portion 126 is not exposed by the insulating layer 140, However, the scope of the invention should not be limited thereby. In some embodiments, the insulating layer 140 may also extend onto the third portion 126. However, it should be understood that, in order to prevent the user from observing the configuration of the insulating layer 140, the insulating layer 140 may be prevented from extending to the visible region VA, so that the portion of the third portion 126 may not be covered by the insulating layer 140, or The side of the insulating layer 140 near the visible area VA is made flush with the side of the decorative layer 120 near the visible area VA.
於本實施方式中,絕緣層140可以延伸至遮光層130上,並至少部分覆蓋遮光層130。於此,如圖所示,絕緣層140可完全覆蓋遮光層130。觸控感測層150包含觸控感測陣列152以及與觸控感測陣列152連接之至少一周邊引線154,其中周邊引線154與導電引線160直接連接,且皆位於絕緣層140之上。觸控感測陣列152設置於可視區VA,周邊引線154與導電引線160設置於非可視區NA,其中導電引線160設置於遮光 層130的上方。導電引線160可由金屬或其他導電材料形成。遮光層130的設置是為了遮蔽導電引線160的反光,避免影響視覺效果。 In the present embodiment, the insulating layer 140 may extend onto the light shielding layer 130 and at least partially cover the light shielding layer 130. Here, as shown, the insulating layer 140 may completely cover the light shielding layer 130. The touch sensing layer 150 includes a touch sensing array 152 and at least one peripheral lead 154 connected to the touch sensing array 152 , wherein the peripheral leads 154 are directly connected to the conductive leads 160 and are located above the insulating layer 140 . The touch sensing array 152 is disposed in the visible area VA, and the peripheral lead 154 and the conductive lead 160 are disposed in the non-visible area NA, wherein the conductive lead 160 is disposed in the light blocking area. Above layer 130. Conductive lead 160 can be formed from a metal or other electrically conductive material. The light shielding layer 130 is disposed to shield the reflective light of the conductive lead 160 from affecting the visual effect.
本實施方式中,基板110可以由透明材料所組成,基板110可以是剛性基板或可撓性基板。基板110可由玻璃、聚甲基丙烯酸甲酯(Poly(methyl methacrylate);PMMA)、聚碳酸酯(Polycarbonate;PC)、聚對苯二甲酸乙二醇酯(polyethylene terephthalate;PET)、聚氯乙烯(Polyvinyl chloride;PVC)、上述之組合或其他材料所組成。基板110相對設置有裝飾層120的另一表面為提供使用者觸控操作的表面,為更加靠近使用者的表面。 In this embodiment, the substrate 110 may be composed of a transparent material, and the substrate 110 may be a rigid substrate or a flexible substrate. The substrate 110 may be made of glass, poly(methyl methacrylate), PMMA, polycarbonate (PC), polyethylene terephthalate (PET), polyvinyl chloride (polyvinyl terephthalate). Polyvinyl chloride; PVC), a combination of the above or other materials. The other surface of the substrate 110 opposite to the decorative layer 120 is a surface that provides a user's touch operation, which is closer to the surface of the user.
於部分實施方式中,遮光層130可以由不透光材料所形成,例如黑色光阻,以達到遮蔽反射光線的作用。裝飾層120的材料可為壓克力、環氧樹脂或矽中的一種或其組合,其中可以摻雜染料而具有特定顏色。舉例而言,裝飾層120可以由白色油墨形成。 In some embodiments, the light shielding layer 130 may be formed of an opaque material, such as a black photoresist, to shield the reflected light. The material of the decorative layer 120 may be one or a combination of acryl, epoxy or ruthenium, wherein the dye may be doped to have a specific color. For example, the decorative layer 120 can be formed from a white ink.
本實施方式中,絕緣層140可以由二氧化矽、聚亞醯胺(polyimide)等絕緣材料所組成。導電引線160的材料可以是具有較佳導電能力的金屬,例如銀、銅等等。觸控感測層150的材料可以是氧化銦錫(Indium Tin Oxide;ITO)或摻雜鋁的氧化鋅(Al-doped ZnO;AZO)等透明導電材料。可透過沉積透明導電材料於基板110的表面上,再以圖案化製程形成觸控感測層150。詳細的圖案化製程包含多個步驟,例如光阻塗佈、曝光顯影、蝕刻、高溫烘烤等等。 In the present embodiment, the insulating layer 140 may be composed of an insulating material such as cerium oxide or polyimide. The material of the conductive lead 160 may be a metal having a preferable electrical conductivity such as silver, copper or the like. The material of the touch sensing layer 150 may be a transparent conductive material such as Indium Tin Oxide (ITO) or aluminum-doped zinc oxide (Al-doped ZnO; AZO). The touch sensing layer 150 can be formed by depositing a transparent conductive material on the surface of the substrate 110 and then performing a patterning process. The detailed patterning process involves multiple steps such as photoresist coating, exposure development, etching, high temperature baking, and the like.
如上所述,在形成遮光層130或觸控感測層150的過程中,可能會經過高溫烘烤而導致裝飾層120產升裂紋等凹陷,而使後續形成的周邊引線154斷路。本實施方式中,藉由絕緣層140的配置可以填補裝飾層120的裂縫,並降低其於後續的烘烤步驟中產生裂縫的可能性。 As described above, in the process of forming the light shielding layer 130 or the touch sensing layer 150, the high temperature baking may cause the decorative layer 120 to cause cracks such as cracks and the like, and the subsequently formed peripheral leads 154 may be broken. In the present embodiment, the crack of the decorative layer 120 can be filled by the arrangement of the insulating layer 140, and the possibility of cracks in the subsequent baking step can be reduced.
第2圖為本發明之另一實施方式之觸控面板100之剖面圖。本實施方式與第1B圖的實施方式相似,差別在於:本實施方式中,導電引線160是先形成於遮光層130,之後再形成絕緣層140來覆蓋導電引線160,並且絕緣層140包含至少一導電通孔142,周邊引線154與導電引線160透過導電通孔142而電性連接,而不同於第1B圖的實施方式中周邊引線154與導電引線160直接連接。 2 is a cross-sectional view of a touch panel 100 according to another embodiment of the present invention. The embodiment is similar to the embodiment of FIG. 1B . The difference is that in the embodiment, the conductive lead 160 is formed on the light shielding layer 130 , and then the insulating layer 140 is formed to cover the conductive lead 160 , and the insulating layer 140 includes at least one. The conductive vias 142, the peripheral leads 154 and the conductive leads 160 are electrically connected through the conductive vias 142, and the peripheral leads 154 are directly connected to the conductive leads 160 in an embodiment different from that of FIG. 1B.
詳細而言,周邊引線154設置於非可視區NA且位於絕緣層140之上。導電引線160設置於非可視區NA且位於絕緣層140與遮光層130之間。絕緣層140可以透過蝕刻等方式形成開口於其中,開口連通絕緣層140的上表面與下表面,再於開口內填入導電材料,例如鐵、銅、鈦或銀等,而形成導電通孔142。周邊引線154與導電引線160分別設置於絕緣層140的上表面與下表面,而透過導電通孔142電性連接。 In detail, the peripheral lead 154 is disposed on the non-visible area NA and above the insulating layer 140. The conductive lead 160 is disposed in the non-visible area NA and between the insulating layer 140 and the light shielding layer 130. The insulating layer 140 may be formed by etching or the like, and the opening communicates with the upper surface and the lower surface of the insulating layer 140, and then a conductive material such as iron, copper, titanium or silver is filled in the opening to form the conductive via 142. . The peripheral leads 154 and the conductive leads 160 are respectively disposed on the upper surface and the lower surface of the insulating layer 140, and are electrically connected through the conductive vias 142.
本實施方式中,導電引線160設置於絕緣層140與遮光層130之間,可減少導電引線160在後續製程,如形成觸控感測層150的過程中受到酸鹼溶液或其它液體或氣體的腐蝕,進而提高導電引線160的可靠性。本實施方式的其他細節大致上與第1B圖的實施方式相似,在此不在贅述。 In this embodiment, the conductive lead 160 is disposed between the insulating layer 140 and the light shielding layer 130, which can reduce the conductive lead 160 to be subjected to an acid-base solution or other liquid or gas during the subsequent process, such as forming the touch sensing layer 150. Corrosion, which in turn increases the reliability of the conductive leads 160. Other details of the present embodiment are substantially similar to the embodiment of FIG. 1B and will not be described herein.
第3圖為本發明之再一實施方式之觸控面板100之剖面圖。為方便說明起見,在此並未繪示觸控感測層150與導電引線160,但應了解到,導電引線160可以設置於遮光層130上,或者設置於絕緣層140與遮光層130上。本實施方式與第1B圖的實施方式相似,差別在於:本實施方式中,絕緣層140僅部分覆蓋遮光層130,而使部分遮光層130外露。 FIG. 3 is a cross-sectional view of a touch panel 100 according to still another embodiment of the present invention. For convenience of description, the touch sensing layer 150 and the conductive lead 160 are not shown here, but it should be understood that the conductive lead 160 may be disposed on the light shielding layer 130 or on the insulating layer 140 and the light shielding layer 130. . This embodiment is similar to the embodiment of FIG. 1B except that in the present embodiment, the insulating layer 140 partially covers only the light shielding layer 130, and the partial light shielding layer 130 is exposed.
相同的,絕緣層140覆蓋較容易龜裂的部分裝飾層120,即第二部分124。一方面可填補裝飾層120龜裂所產生的裂縫,以提供後續製程一個平整的表面,避免斷路;另一方面可以在後續製程中,藉由絕緣層140抑制裝飾層120的膨脹。本實施方式的其他細節大致上與第1B圖的實施方式相似,在此不在贅述。 Similarly, the insulating layer 140 covers the portion of the decorative layer 120 that is more susceptible to cracking, that is, the second portion 124. On the one hand, the crack generated by the crack of the decorative layer 120 can be filled to provide a flat surface for the subsequent process to avoid the open circuit; on the other hand, the expansion of the decorative layer 120 can be suppressed by the insulating layer 140 in the subsequent process. Other details of the present embodiment are substantially similar to the embodiment of FIG. 1B and will not be described herein.
第4圖為本發明之又一實施方式之觸控面板100之剖面圖。為方便說明起見,在此並未繪示觸控感測層150與導電引線160。本實施方式與第1B圖的實施方式相似,差別在於:本實施方式中,絕緣層140僅接觸遮光層130之側面132而不覆蓋遮光層130,而使遮光層130完全外露。 4 is a cross-sectional view of a touch panel 100 according to still another embodiment of the present invention. For convenience of description, the touch sensing layer 150 and the conductive leads 160 are not shown here. This embodiment is similar to the embodiment of FIG. 1B except that in the present embodiment, the insulating layer 140 contacts only the side surface 132 of the light shielding layer 130 without covering the light shielding layer 130, and the light shielding layer 130 is completely exposed.
相同的,絕緣層140覆蓋較容易龜裂的部分裝飾層120,即第二部分124。一方面可填補裝飾層120龜裂所產生的裂縫,以提供後續製程一個平整的表面,避免斷路;另一方面可以在後續製程中,藉由絕緣層140抑制裝飾層120的膨脹。本實施方式的其他細節大致上與第1B圖的實施方式相似,在此不在贅述。 Similarly, the insulating layer 140 covers the portion of the decorative layer 120 that is more susceptible to cracking, that is, the second portion 124. On the one hand, the crack generated by the crack of the decorative layer 120 can be filled to provide a flat surface for the subsequent process to avoid the open circuit; on the other hand, the expansion of the decorative layer 120 can be suppressed by the insulating layer 140 in the subsequent process. Other details of the present embodiment are substantially similar to the embodiment of FIG. 1B and will not be described herein.
第5A圖至第5D圖為本發明之再一實施方式之觸控面板於多個製作步驟中的剖面圖。本發明之一實施方式提供一種製造觸控面板的方法,以下搭配第5A圖至第5D圖介紹此製作方法。 5A to 5D are cross-sectional views showing a touch panel according to still another embodiment of the present invention in a plurality of fabrication steps. One embodiment of the present invention provides a method of manufacturing a touch panel, which is described below in conjunction with FIGS. 5A-5D.
首先,參考第5A圖,形成裝飾層120於基板110上,其中裝飾層120定義基板110之可視區VA與設置於可視區VA之至少一側的非可視區NA。於此,可以透過網版印刷等方式塗佈液態材料(例如白色油墨)於基板110之周邊區域上,並烘烤基板110以固化此液態材料而形成裝飾層120。 First, referring to FIG. 5A, a decorative layer 120 is formed on the substrate 110, wherein the decorative layer 120 defines a visible area VA of the substrate 110 and a non-visible area NA disposed on at least one side of the visible area VA. Here, a liquid material (for example, a white ink) may be applied to a peripheral region of the substrate 110 by screen printing or the like, and the substrate 110 may be baked to cure the liquid material to form the decorative layer 120.
接著,參考第5B圖,形成遮光層130在裝飾層120遠離可視區VA的第一部分122上,並露出部分靠近可視區VA的裝飾層120,以免使用者容易觀察到遮光層130。可以透過塗佈液態材料於裝飾層120之第一部分122上,並烘烤基板110以固化此液態材料而形成遮光層130。然而,由於基板110、裝飾層120以及遮光層130的膨脹係數不相同,於上述的烘烤步驟,可能會造成不受到遮光層130覆蓋的部份裝飾層120形成裂痕而產生多個凹陷處,不利於後續製程的進行。 Next, referring to FIG. 5B, the light shielding layer 130 is formed on the first portion 122 of the decorative layer 120 away from the visible area VA, and the decorative layer 120 partially exposed to the visible area VA is exposed to prevent the user from easily observing the light shielding layer 130. The light shielding layer 130 may be formed by coating a liquid material on the first portion 122 of the decorative layer 120 and baking the substrate 110 to cure the liquid material. However, since the expansion coefficients of the substrate 110, the decorative layer 120, and the light shielding layer 130 are different, in the baking step described above, a part of the decorative layer 120 not covered by the light shielding layer 130 may be cracked to generate a plurality of depressions. Not conducive to the subsequent process.
於此,如前所述,為方便說明起見,以第一部分122、第二部分124與第三部分126分別定義裝飾層120的不同區域。第一部分122受到遮光層130的覆蓋,第二部分124指在加熱烘烤中靠近遮光層130而較容易龜裂的部分裝飾層120,第三部分126指在加熱烘烤中遠離遮光層130而較不易龜裂的部分裝飾層120。在遮光層130之後,第二部分124可能產生多個凹陷處。 Here, as described above, for convenience of explanation, different regions of the decorative layer 120 are defined by the first portion 122, the second portion 124, and the third portion 126, respectively. The first portion 122 is covered by the light shielding layer 130, and the second portion 124 refers to a portion of the decorative layer 120 which is relatively easy to be cracked near the light shielding layer 130 during the heating baking, and the third portion 126 refers to being away from the light shielding layer 130 during the heating baking. A portion of the decorative layer 120 that is less prone to cracking. After the light shielding layer 130, the second portion 124 may create a plurality of depressions.
參考第5C圖,本實施方式中,在形成遮光層130之後,以及形成觸控感測層150(參考第5D圖)之前,形成絕緣層140。絕緣層140的膨脹係數小於裝飾層120的膨脹係數。絕緣層140至少接觸遮光層130且至少覆蓋裝飾層120之第二部分124。 Referring to FIG. 5C, in the present embodiment, the insulating layer 140 is formed after the light shielding layer 130 is formed and before the touch sensing layer 150 is formed (refer to FIG. 5D). The coefficient of expansion of the insulating layer 140 is smaller than the coefficient of expansion of the decorative layer 120. The insulating layer 140 contacts at least the light shielding layer 130 and at least covers the second portion 124 of the decorative layer 120.
於此,可以透過塗佈液態絕緣材料於裝飾層120之第二部分124上,以使液態絕緣材料填補裝飾層120之凹陷處;再烘烤基板110,以硬化液態絕緣材料而形成絕緣層140。如此一來,可以提供後續製程一個平坦的表面,而不會因為裝飾層120之凹陷處而影響後續的製程。 Herein, the liquid insulating material may be applied to the second portion 124 of the decorative layer 120 to fill the recess of the decorative layer 120 with the liquid insulating material; and the substrate 110 is baked to harden the liquid insulating material to form the insulating layer 140. . In this way, a flat surface can be provided for the subsequent process without affecting the subsequent process due to the depression of the decorative layer 120.
於部分實施方式中,絕緣層140可延伸至遮光層130上,並至少部分覆蓋遮光層130。當然,本發明並不以此為限制,實際應用上,絕緣層140可以僅接觸遮光層130的側面132,而不覆蓋遮光層130。 In some embodiments, the insulating layer 140 may extend onto the light shielding layer 130 and at least partially cover the light shielding layer 130. Of course, the present invention is not limited thereto. In practical applications, the insulating layer 140 may only contact the side surface 132 of the light shielding layer 130 without covering the light shielding layer 130.
參考第5D圖,形成觸控感測陣列152於可視區VA,並形成至少一周邊引線154於非可視區NA之絕緣層140之上,以電性連接觸控感測陣列152。於此,可透過沉積透明導電材料於基板110的表面上,再以圖案化製程形成觸控感測層150而形成觸控感測陣列152與周邊引線154。詳細的圖案化製程包含多個步驟,例如光阻塗佈、曝光顯影、蝕刻、高溫烘烤等等。 Referring to FIG. 5D, the touch sensing array 152 is formed in the visible area VA, and at least one peripheral lead 154 is formed on the insulating layer 140 of the non-visible area NA to electrically connect the touch sensing array 152. The touch sensing array 152 and the peripheral leads 154 can be formed by depositing a transparent conductive material on the surface of the substrate 110 and forming the touch sensing layer 150 by a patterning process. The detailed patterning process involves multiple steps such as photoresist coating, exposure development, etching, high temperature baking, and the like.
參考第5E圖,形成至少一導電引線160於非可視區NA之絕緣層140之上,其中周邊引線154連接導電引線 160,而將觸控感測資訊傳遞至計算單元(未繪示),例如積體電路晶片,計算單元經計算得到使用者的觸控位置。 Referring to FIG. 5E, at least one conductive lead 160 is formed over the insulating layer 140 of the non-visible area NA, wherein the peripheral lead 154 is connected to the conductive lead The touch sensing information is transmitted to a computing unit (not shown), such as an integrated circuit chip, and the computing unit calculates the touch position of the user.
以上提供一種製作觸控面板的方法,但不應以此限制本發明之範圍。除了上述的部分步驟之外,還可另加入額外的步驟,不應以上述的步驟限制本發明之範圍。舉例而言,於部分實施方式中,可以配置導電引線160與周邊引線154具有不同的電性連接方式,如下所述。 The above provides a method of fabricating a touch panel, but should not limit the scope of the invention. In addition to the above-mentioned partial steps, additional steps may be added, and the scope of the invention should not be limited by the above steps. For example, in some embodiments, the conductive leads 160 can be configured to have different electrical connections to the perimeter leads 154, as described below.
第6A圖至第6C圖為本發明之另一實施方式之觸控面板於多個製作步驟中的剖面圖。第6A圖至第6C圖可以接續在前述的第5B圖之後進行。 6A to 6C are cross-sectional views showing a touch panel according to another embodiment of the present invention in a plurality of fabrication steps. 6A to 6C can be continued after the aforementioned FIG. 5B.
詳細而言,參考第6A圖,可以在形成遮光層130於裝飾層120上之後(即第5B圖之後),形成導電引線160於遮光層130之上。 In detail, referring to FIG. 6A, conductive leads 160 may be formed over the light shielding layer 130 after the light shielding layer 130 is formed on the decorative layer 120 (ie, after FIG. 5B).
接著,參照第6B圖,形成絕緣層140以覆蓋裝飾層120之第二部分124、遮光層130以及對應位於裝飾層120之第一部分122上的至少部份導電引線160。於此,可透過蝕刻等方式形成導電通孔142於絕緣層140內。導電通孔142對應於導電引線160設置。詳細而言,絕緣層140可以透過蝕刻等方式形成開口於其中,再於開口內填入導電材料,例如鐵、銅、鈦或銀等,而形成導電通孔142。 Next, referring to FIG. 6B, an insulating layer 140 is formed to cover the second portion 124 of the decorative layer 120, the light shielding layer 130, and at least a portion of the conductive leads 160 corresponding to the first portion 122 of the decorative layer 120. Here, the conductive vias 142 may be formed in the insulating layer 140 by etching or the like. The conductive vias 142 are disposed corresponding to the conductive leads 160. In detail, the insulating layer 140 may be formed by etching or the like, and then filled with a conductive material such as iron, copper, titanium or silver in the opening to form the conductive via 142.
然後,參照第6C圖,形成具有觸控感測陣列152與周邊引線154的觸控感測層150,周邊引線154設置於導電通孔142之上,以使導電引線160透過導電通孔142電性連接該周邊引線154。同樣地,此觸控感測層150可由包含多個步驟, 例如光阻塗佈、曝光顯影、蝕刻、高溫烘烤等等之圖案化製程而形成。 Then, referring to FIG. 6C, a touch sensing layer 150 having a touch sensing array 152 and a peripheral lead 154 is formed. The peripheral lead 154 is disposed on the conductive via 142 to electrically pass the conductive lead 160 through the conductive via 142. The peripheral lead 154 is connected sexually. Similarly, the touch sensing layer 150 can include multiple steps. Formed by a patterning process such as photoresist coating, exposure development, etching, high temperature baking, and the like.
如此一來,本發明之多個實施方式中,可以透過配置絕緣層140具有導電通孔142而電性連接周邊引線154與導電引線160。本實施方式的其他細節大致上如前述實施方式所述,在此不再贅述。 As such, in various embodiments of the present invention, the insulating layer 140 can be electrically connected to the peripheral lead 154 and the conductive lead 160 through the conductive via 142. Other details of the present embodiment are substantially as described in the foregoing embodiments, and are not described herein again.
本發明之多個實施方式中,藉由絕緣層覆蓋裝飾層,避免觸控面板的電路直接設置於裝飾層上。如此一來,即使裝飾層在形成絕緣層前發生龜裂,可在形成絕緣層的的過程中,可藉由塗抹液態絕緣材料而填補裝飾層的裂縫,而提供一個平坦的表面。此外,由於絕緣層相較於裝飾層具有較小的膨脹係數,一方面可以壓制裝飾層與遮光層的膨脹,減少遮光層的熱脹冷縮產生較大的應力使裝飾層出現裂紋;另一方面,絕緣層本身具有較小的熱膨脹係數,故其熱脹冷縮產生的應力對裝飾層影響較小,可降低裝飾層於後續的烘烤等步驟中產生裂縫的可能性。 In various embodiments of the present invention, the decorative layer is covered by the insulating layer to prevent the circuit of the touch panel from being directly disposed on the decorative layer. In this way, even if the decorative layer is cracked before the formation of the insulating layer, a crack can be filled in the process of forming the insulating layer by filling the liquid insulating material to provide a flat surface. In addition, since the insulating layer has a smaller expansion coefficient than the decorative layer, on the one hand, the expansion of the decorative layer and the light shielding layer can be suppressed, and the thermal expansion and contraction of the light shielding layer is reduced to generate a large stress to cause cracks in the decorative layer; In respect, the insulating layer itself has a small coefficient of thermal expansion, so that the stress generated by the thermal expansion and contraction has less influence on the decorative layer, and the possibility that the decorative layer is cracked in the subsequent baking and the like can be reduced.
雖然本發明已以多種實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the invention has been described above in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.
100‧‧‧觸控面板 100‧‧‧ touch panel
110‧‧‧基板 110‧‧‧Substrate
120‧‧‧裝飾層 120‧‧‧decorative layer
122‧‧‧第一部分 122‧‧‧Part 1
124‧‧‧第二部分 124‧‧‧Part II
126‧‧‧第三部分 126‧‧‧Part III
130‧‧‧遮光層 130‧‧‧Lighting layer
140‧‧‧絕緣層 140‧‧‧Insulation
150‧‧‧觸控感測層 150‧‧‧ touch sensing layer
152‧‧‧觸控感測陣列 152‧‧‧Touch Sensing Array
154‧‧‧周邊引線 154‧‧‧ peripheral leads
160‧‧‧導電引線 160‧‧‧Electrical leads
VA‧‧‧可視區 VA‧‧ visible area
NA‧‧‧非可視區 NA‧‧‧Invisible area
Claims (14)
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CN201510558238.0A CN106502438B (en) | 2015-09-06 | 2015-09-06 | Touch panel and manufacturing method thereof |
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TWI571784B TWI571784B (en) | 2017-02-21 |
TW201710855A true TW201710855A (en) | 2017-03-16 |
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CN107329611B (en) * | 2017-06-29 | 2020-09-29 | 业成科技(成都)有限公司 | Narrow-frame touch module structure and manufacturing method thereof |
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JP6170288B2 (en) * | 2012-09-11 | 2017-07-26 | 富士フイルム株式会社 | Transfer material, method for manufacturing capacitive input device, capacitive input device, and image display device including the same |
CN203178950U (en) * | 2012-11-22 | 2013-09-04 | 宸鸿科技(厦门)有限公司 | Single-glass touchpad |
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