TW201703174A - Semiconductor wafer carrier assembly, door assembly, substrate container in combination with getter modules, and method of reducing concentration of contaminants with-in a front opening container - Google Patents

Abstract

A semiconductor wafer carrier assembly includes a carrier, the carrier defining a wafer storage area adapted to support one or more semiconductor wafers. The carrier has a door for access to the wafer storage area, the door defining an interior. The assembly also includes a getter module, the getter module including a housing, getter material disposed within the housing, the getter material adapted to decrease concentration of contaminants within the wafer storage area of the carrier, and at least one connection feature adapted to readily removably secure the getter module to the interior of the door.

Description

Wafer carrier with replaceable getter [Priority statement]

The present application claims priority to US Provisional Application No. 62/131,478, filed on March 11, 2015.

Substrates (eg, wafers and reticles) used in semiconductor processing are highly susceptible to contamination (including moisture, volatile organic components (VOC), and particulates). The presence of moisture, for example, can result in growth on the reticle and wafer. One method for controlling contaminants comprising moisture is to continuously or periodically purge a space within a container in which one of the substrates is stored or fixed. During transport, it has been considered impractical to use purging, and the moisture and volatile organic components have been maintained at acceptable levels in the container during transport using, for example, a getter. The desiccant and getter in the substrate container typically need to be removed or detached prior to washing the container, as the fluid used can cause damage to the desiccant or getter.

A sealed container called a front opening unified pod (FOUP), a front opening shipping box (FOSB), or a standard mechanical interface (SMIF) box is used as a wafer container. Or a reticle box. The containers provide a microenvironment to isolate and control the volume of wafers and substrates used in the fabrication of the integrated circuit. These containers are available from the owner of this application. Company (Entegris, Inc.).

Increasing control of such contaminants may be desirable due to the adverse effects of moisture, volatile organic components, and particulates on semiconductor production.

A semiconductor wafer carrier assembly includes a carrier defining a wafer storage area adapted to support one or more semiconductor wafers. The carrier has a front open door including a door housing and a latch mechanism operatively coupled to the door housing to secure the door, the door being openable For accessing the wafer storage area, the gate is defined to face one of the wafer storage areas. The getter module also includes a getter module comprising: a rigid polymer housing having an access opening; a getter material disposed in the getter module housing, the suction The gas material is adapted to reduce the concentration of contaminants in the wafer storage region of the carrier via the access opening; and at least one rigid polymer connection feature as part of or as part of the getter module housing The getter module housing extends out, the attachment feature being adapted to easily and removably secure the getter module to the inner side of the door.

According to one embodiment, the getter material is in the form of a single getter pack disposed between a base and a single cover. According to other embodiments, the getter material is in the form of a plurality of getter packs supported on a base frame, wherein a cover is disposed over each getter pack. For ease of removal and replacement, a single getter module or assembly and a multi-aspirator module or assembly are both within the receptacle or attachment point of the door of the container. The door is removably attached to the vehicle.

Embodiments of the present invention can be used to accommodate different wafer sizes (eg, 150 mm germanium wafers, 200 mm germanium wafers, 300 mm germanium wafers, and 450 mm germanium wafers, to name a few examples) Use with a variety of transporters or other vehicles or containers. Other aspects of the invention will be apparent to those of ordinary skill in the <RTIgt; It is considered restrictive.

10‧‧‧Semiconductor Wafer Carrier Assembly/Assembly/Carriage Assembly

15‧‧‧ Vehicles/containers

20‧‧‧Semiconductor Wafer/Wafer

25‧‧‧Stacking

30‧‧‧ Wafer storage area

35‧‧‧

37‧‧‧ inner wall

40‧‧‧ inside

42‧‧‧ face-facing surface

43‧‧‧ outer wall

45‧‧‧ outside

46‧‧‧ outer surface

50‧‧‧ door housing

52‧‧‧Latch mechanism

55‧‧‧1

60‧‧‧ pores

65‧‧‧ Groove

100‧‧‧Absorber module/module/first getter module/single getter module/ getter assembly/attached module/passive getter module

100'‧‧‧second getter module

105‧‧‧Shell

110‧‧‧Base

112‧‧‧ Groove

115‧‧‧ Cover

120‧‧‧Sucking material/single getter bag

125‧‧‧Sealings/joints

130‧‧‧Filter/slide-in or snap-on filter

135‧‧‧Filter cover

140‧‧‧Pore/Central Pore

145‧‧‧ circumferentially set pores/pores

150‧‧‧ pores

155‧‧‧ pores

160, 162‧‧‧ Connection characteristics

165‧‧‧ highlights

170‧‧‧Central Fin/Fin/First Module

172‧‧‧ second module

174‧‧‧ third module

175‧‧‧End fins/fins

176‧‧‧ fourth module

180‧‧‧Substantially V-shaped members/members/biased members

182‧‧‧ legs

184‧‧‧ legs

185‧‧‧Interior panels or surfaces

186‧‧‧External panels or surfaces

190‧‧‧ Container

192‧‧‧ Groove

194‧‧‧ side wall

196‧‧‧stop member

198‧‧‧Flange

200‧‧‧ Wafer Holder / Structure / Holder

205‧‧‧ Wafer Platform

210‧‧‧Snap connector

300‧‧‧Absorber module/module/multi-aspirator module/ getter assembly/passive getter module

305‧‧‧Shell

310‧‧‧Base

312, 314‧‧‧ Groove/end groove

313‧‧‧ Groove/intermediate groove

315, 317, 319‧‧ ‧ cover

320, 322, 324‧‧‧ suction materials

325, 327, 329‧ ‧ seals / joints

330‧‧‧Filter

335‧‧‧Filter cover

340‧‧‧ pores

360, 362‧‧‧ connection features

375‧‧‧ pores

410, 415, 420, 425‧ ‧ steps

1 is a front perspective view of a substrate container having a door in accordance with an embodiment of the present invention.

2 is an exploded view of a getter module in accordance with an embodiment of the present invention.

Fig. 3 is a front perspective view of the getter module shown in Fig. 2 according to an embodiment of the present invention.

Fig. 4 is a rear perspective view of the getter module shown in Fig. 2 according to an embodiment of the present invention.

Figure 5 is a perspective view of a container door having a plurality of getter modules shown in Figure 2, wherein a getter module is fixed to the door and a getter mold is used according to an embodiment of the present invention. The set is positioned relative to the door prior to or prior to installation.

Fig. 6 is a close-up perspective view of the getter shown in Fig. 2 attached to the door shown in Fig. 5 according to an embodiment of the present invention.

Figure 7 is an exploded view of a getter module in accordance with another embodiment of the present invention.

Figure 8 is a perspective view of a getter module shown in Figure 7 in accordance with an embodiment of the present invention.

Figure 9 is a perspective view of the door shown in Figure 5, in which the getter module of Figure 8 and the getter module of Figure 3 are mounted, in accordance with an embodiment of the present invention.

Figure 10 is a close-up perspective view of the getter module shown in Figure 8 attached to the door shown in Figure 5, in accordance with an embodiment of the present invention.

Figure 11 is a flow chart showing a method in accordance with an embodiment of the present invention.

Water, oxygen, airborne molecular contaminant (AMC), volatile organic compounds in the interior of the wafer container microenvironment Uncontrolled concentrations of compounds; VOCs, or other foreign matter can cause circuit defects and reduce yield. Use a getter to control and reduce these concentrations. However, in some wafer carriers (for example, wafer carriers of 450 mm or larger), there may not be enough space behind the carrier to place a getter, and there is not enough space in the carrier for one. A 26th or other additional wafer slot to accommodate a disc equipped with a getter. Certain embodiments of the present invention address these by providing an insertable and replaceable getter in a door of a carrier by using attachment points that can also be used to attach accessories such as wafer pads or holders. problem.

More specifically, a getter assembly or module includes a housing or enclosure that is provided with a getter and is mounted to an inner surface of a microenvironment door. The getter assembly is used to remove various chemicals or otherwise reduce the concentration of contaminants or other foreign matter in the carrier. One or more getter assemblies can be attached to multiple locations of the door. In one configuration, a frame is attached to a plurality of locations on the door and supports a plurality of getters. Fasteners, press fits, snap fits, and friction fits are examples of methods for attaching a frame or getter assembly to other locations in a door or carrier. The getter assembly can be a consumable or single-use product type item; the getter assembly can also be reused or replenished between multiple uses of a particular micro-environment container.

Embodiments of the present invention can provide advantages such as improved wafer yield and long-lasting protection of the microenvironment from moisture, oxygen, acids, alkalis, and other contaminants. In some cases, installing a getter module in a container door eliminates or reduces the need for additional holes in the container to the external environment. A plurality of different getter modules can be configured and arranged to remove various chemicals as needed, and can be moved through the door instead of manipulating the entire carrier assembly or otherwise invading the carrier closer to the wafer handling volume The inside is used to replace the getter module.

Turning to the figures, FIG. 1 illustrates a semiconductor wafer carrier assembly 10 in accordance with an embodiment of the present invention. Assembly 10 includes a carrier 15 adapted to support one or more of semiconductor wafers 20 or other substrates in stack 25 within wafer storage area 30. The carrier 15 has a closed seal for sealing The carrier 15 is coupled and used to open the carrier 15 to permit access to the door 35 of the wafer storage area 30. Referring also to FIG. 5, the door 35 has an inner wall 37 having an inner side 40 and an inwardly facing surface 42 facing the wafer storage area 30, the outer wall 43 having an outer side 45 and An outer surface 46 faces away from the wafer storage area 30. The door 35 includes a door housing 50 of a latch mechanism 52 that includes tabs 55 extending from the apertures 60 into corresponding recesses 65 in the carrier 15 to secure the door 35.

In the illustrated embodiment, the carrier assembly 10 is referred to as a front opening wafer container of a front open unified standard box (FOUP). Other types of carrier assemblies in accordance with embodiments of the present invention include a front open transport case (FOSB), a standard mechanical interface box (SMIF pod), a horizontal wafer transporter, a single wafer transporter, a universal wafer transporter, or Any other type of carrier used for semiconductor disks or wafers, for substrates, or for other articles. Examples of such vehicles are described in U.S. Patent Nos. 4,815,912, 4,995,430, 5, 788, 082, 6, 010, 008, and 6, 354, 601, each of which is owned by the assignee of In this article for all purposes.

Figures 2 through 4 illustrate a getter module 100, also referred to as a getter assembly. The getter module 100 includes a housing 105 having a base 110 and a cover 115. The getter material 120 is disposed within the housing 105 and, in particular, is supported on the base 110 in the recess 112 of the base 110. The cover 115 is disposed above the base 110 and the getter material 120. According to one embodiment, the cover 115 is sealed or otherwise substantially permanently attached to the base 110 along the seal or joint surface 125 by an adhesive, ultrasonic welding or other weld or other pattern, wherein the cover is inhaled The agent module 100 can be disposed of completely after use. Alternatively, the cover 115 can be removably attached to the base 110, for example, in a snap-fit connection such that the getter material 120 or other components within the housing 105 can be replaced or reused between multiple uses. supplement.

One or more optional filters 130 are disposed between the cover 115 and the getter material 120 and are positioned and supported by one or more optional corresponding filter covers 135. Implementation in accordance with the present invention For example, the filter cover 135 is permanently (e.g., by ultrasonic welding) or removably secured to the cover 115 to hold the filter 130 in place relative to, for example, the cover 115 and the getter material 120. The filter cover 135 can also be in the form of a holder for receiving a slide-in or snap-on filter 130. The filter 130 provides both internal and external protection and protection from the outside to protect the particulate matter and substantially reduce the contamination of the getter material 120 by the external particles, and is also used to retain any particles. Within the housing 105 to prevent corresponding contamination of the microenvironment within the carrier 15.

The getter module 100 also defines one or more apertures 140 through the cover 115 for chemically exposing the getter material 120 to the interior of the carrier 15 and the wafer storage area 30, or other The manner promotes or permits interaction between the getter material 120 and the environment outside of the getter module 100. In the illustrated embodiment, the apertures 140 are surrounded by six circumferentially disposed apertures 145, but by reading this disclosure, other numbers and configurations of the apertures 140, 145 are common to those of ordinary skill in the art. Will be obvious. The central aperture 140 and the circumferentially disposed apertures 145 correspond to and are generally aligned with corresponding apertures 150, 155 in each filter cover 135.

According to one example, the getter material 120 is in the form of a getter pack, ie, is pressed or otherwise formed as one of a unitary removable unit or one of a plurality of getter materials self-contained (self-contained )section. By reading this disclosure, other forms of getter packages will be apparent to those of ordinary skill. The getter material 120 is adapted to reduce the concentration of contaminants within the carrier 15 (specifically, in the wafer storage area 30). In one embodiment, getter material 120 removes gases, moisture, airborne molecular contaminants (AMCs), volatile organic compounds (VOCs), or other gases that may adversely affect articles or processes within carrier assembly 10. Unwanted contaminants or substances. Airborne molecular contaminants that can be controlled in accordance with the present invention include acids and bases (eg, NH ₃ and SO ₄ ), biotoxins, compressible or corrosive contaminants, volatile organic compounds, dopants, and Other types of such pollutants or substances.

Different types of getter packs or getter materials 120 can be selected to remove or reduce The concentration of a contaminant or substance of a given type, as may be required in a particular application. A user of the vehicle assembly 10 may select and select different getter materials 120 or getter modules depending on the type of contaminants to be controlled and/or depending on the particular item or process occurring within the carrier assembly 10. 100.

Examples of getter materials suitable for use in accordance with embodiments of the present invention include getter materials for use in Integral CLARILITE wafers, which are mated to a front open unified standard box and front open transport case The wafer slot is used to absorb contaminants and moisture. CLARILITE is a registered trademark of Intertek. Examples of suitable getter materials are also disclosed in co-pending U.S. Patent No. 8,776,841, U.S. Patent No. 8,783,463, and the Patent Cooperation Treaty Application No. PCT/US2014/054399, filed on Sep. 5, 2014. The above patents are hereby incorporated by reference in their entirety for all purposes.

The getter material according to an embodiment of the present invention may be a granular desiccant, a rigid plate, an absorbent disc, a molecular sieve, and/or a polymer matrix holding a desiccant or molecular sieve material (only a few are listed here) The form of the example). The getter material also includes a polymer base, a channeling agent, and/or a desiccant as needed. In certain embodiments, the polymer is a thermoplastic polymer. Thermoplastic polymers include: acrylic acid, such as poly(methyl methacrylate; PMMA); polyamines such as nylon; polybenzimidazole (PBI); polyethylene, including ultra high Ultra-high molecular weight polyethylene (UHMWPE), high-density polyethylene (HDPE), and low-density polyethylene; polypropylene (PP); polystyrene; polyvinyl chloride (polyvinyl chloride) Chloride; PVC); and polytetrafluoroethylene (PTFE). The channeling agent is a compound that is insoluble in the polymer but is used to form a passage through the polymer that is in communication with the desiccant. Examples of such channeling agents include, but are not limited to, ethylene-vinyl alcohol (EVOH) and polyvinyl alcohol (PVOH). Examples of the desiccant include: an anhydrous salt, a shape Forming a crystal containing water; a reactive compound, chemically reacting with water to form a new compound; and a physical absorber having a plurality of microtubes and thus absorbing moisture from the environment by capillary action. Examples of such absorbers include molecular sieves, enamel gels, clays, and starches. In embodiments, the activated carbon can be an absorbent material, especially for volatile organic compounds. Embodiments of the present invention can substantially reduce the amount of oxygen, moisture, moisture, volatile organic compounds, and other contaminants in associated transporters or other containers.

The getter module 100 includes one or more attachment features 160, 162 adapted to securely and removably secure the getter module 100 to the inner side 40 of the door 35. The attachment feature 160 includes a protrusion 165 that extends substantially parallel to the plane of the base 110 and that extends substantially perpendicular to the attachment feature 162. Central fin 170 and end fin 175 connect protrusion 165 to the remainder of one of pedestals 110 and provide enhanced rigidity and structural strength of protrusion 165 relative to pedestal 110. The fins 170, 175 also provide the proper alignment of the attachment features 160 and the module 100 relative to the door 35. The attachment feature 162 shown in FIG. 4 is a substantially V-shaped member 180 having one of the two legs 182, 184 biased. The leg 184 is flexed relative to the leg 182 to bias the getter module 100 to the position on the inner side 40 of the door 35. The member 180 thus acts as a spring or biasing member and serves to assist in snap fitting the getter module 100 into place in the door 35. The protrusion 165 is disposed on one side of the getter module 100 opposite to the member 180 and extends in a direction substantially perpendicular to one of the members 180.

Figures 5 through 6 show the connection of the getter module 100 to the inner side 40 of the door 35. The door 35 includes an interior panel or surface 185 and an exterior panel or surface 186 defining an interior volume of the door 35 between the interior panel or surface 185 and the exterior panel or surface 186. Door 35 includes a plurality of receptacles 190 or attachment points for module 100. Each of the receptacles 190 includes a recess 192 that extends into the volume 189 and is of sufficient size and depth to at least partially receive the getter module 100. The side wall 194 is disposed on one side of the recess 192. A stop member 196 in the form of two laterally extending stops is disposed adjacent or adjacent to the side wall 194. Side wall 194 and stop member 196 are for receiving and The biased member 180 is held. The leg 184 of the member 180 contacts the sidewall 194 and one of the upper ends of the leg 184 abuts or nearly abuts the underside of one of the stop members 196.

On the opposite side of the getter module 100, the flange 198 on the inner side 40 of the door 35 defines a recess below the flange 198 for receiving the projection 165 of the attachment feature 160. To insert or attach the getter module 100 into the door 35, the tab 165 is first placed in a recess below the flange 198. The module 100 is then further rotated or pressed into the recess 192 such that the biased member 180 contacts the sidewall 194. The getter module 100 is pushed by the biasing member 180 to the right as viewed in FIG. 6 to lock or snap fit the tab 165 into the recess below the flange 198 and toward the flange 198 pushes the fins 170, 175 or pushes the fins 170, 175 into alignment contact flanges 198. The stop member 196 substantially prevents the member 180 from sliding up and out of position along the sidewall 194. The getter module 100 is thus at least partially disposed within the recess 192 and extends to the interior volume of the door 35 between the inner panel or surface 185 and the outer panel or surface 186. According to an alternative embodiment, the getter module 100 extends completely within the recess 192 such that one of the top surfaces of the getter module 100 is substantially flush or substantially coplanar with the inner panel 186 of the door 35. For removal, according to one embodiment, the module 100 is pushed to the left as viewed in FIG. 6, the protrusion 165 is removed from the recess below the flange 198, and then from the recess 192 and The door 35 completely removes the module 100.

In FIG. 5, a first getter module 100 has been attached to the inner side 40 of the door 35. According to one embodiment of the present invention, the getter material 120 in the attached module 100 is a type of suction selected by a user to remove one or more specific types of contaminants from the carrier 15. Gas material. A second getter module 100' is inserted into the inner side 40 of the door 35 as shown. According to one embodiment, the getter material in the second getter module 100 is used to remove one or more different types of contaminants from the carrier 15 than the contaminants controlled by the attached module 100. One type of getter material. Alternatively, such getter material may be the same as getter material 120 attached to getter module 100. By selecting and selecting different ones for the desired container 190 in the door 15 a getter module, a user may be placed according to a particular item to be placed in the carrier 15, the process to be performed, or otherwise with a contaminant that may be present in the carrier 15 and may need to be removed The type, concentration, and consistency of the getter distribution, quantity, and arrangement within the carrier 15 are consistently tailored.

FIG. 5 also illustrates a wafer holder 200 for guiding or supporting a wafer held in the carrier 15. According to one embodiment, the holder 200 includes a plurality of stacked wafer platforms 205 to assist in guiding or supporting the stacked wafers 20 within the carrier 15. The structure 200 includes a snap-on connector 210 for attachment to a receptacle on the inner side 40 of the door 35, similar in shape, size, and/or function to the receptacle 190 for receiving the getter module 100 The receiver. Thus, according to one example, if the holder 200 needs to be replaced with a larger holder to accommodate the larger wafer 20, the larger holder can be equipped with the getter module 100 for housing. The connection structure in the receiver 190 is provided with a connector suitable for fitting in the receiver 190 in the same manner. Therefore, each of the accommodators 190 is adapted to receive an accessory (such as the holder 200 or other guiding or supporting structure for the wafer 20), and each of the accommodators 190 is also adapted to receive the getter module. The connection features 160 and/or 162 of 100 are used to easily and removably secure the getter module 100 to the inner side 40 of the door 35. In accordance with an embodiment of the present invention, each of the receptacles 190 has a variety of uses regardless of where on the door 35 or other locations within the carrier 15.

The getter module 100 is a single getter module that includes a type of contaminant or a group of contaminants that are used to remove or otherwise reduce one type of carrier 15 One of the concentrations is a single getter pack 120. Embodiments of the present invention also contemplate a multi-suction module for accommodating a plurality of getter packages for handling various types of contaminants or higher concentrations of contaminants within the carrier 15, as will now be referred to This is illustrated in detail in Figures 7 through 8.

Figures 7 through 8 illustrate a getter module 300, also referred to as a getter assembly. The getter module 300 includes a housing 305 having a base 310 in the form of a base frame and a plurality of covers 315, 317, 319. The getter materials 320, 322, 324 are disposed in the housing 305. Specifically, it is supported on the pedestal 310 in the grooves 312, 313, 314 of the susceptor 310. The getter materials 320, 322, and 324 are in the form of a plurality of getter packs similar to the getter packs described with reference to Figures 2 through 4, respectively.

The covers 315, 317, 319 are disposed above the base 310 and are respectively disposed above the grooves 312, 313, 314 of the base 310 and the corresponding getter materials 320, 322, 324. According to one embodiment, the closures 315, 317, 319 are sealed or otherwise attached to the base 310 along the seal or joint faces 325, 327, 329 by adhesive, ultrasonic welding or other welding, or other means, The getter module 300 can be disposed of completely after use. Alternatively, the closures 315, 317, 319 are removably attached to the base 310, for example, in a snap-fit connection such that the getter material 320, 322, 324 or other components within the housing 305 are Sub-use can be replaced or replenished. One or more optional filters 330 are disposed between the closures 315, 317, 319 and the respective getter materials 320, 322, 324 to be positioned and supported by one or more corresponding filter covers 335 as desired. In accordance with an embodiment of the present invention, the filter cover 335 is permanently or removably secured to the cover 315 to hold the filter 330 in place, for example, relative to the cover 315 and the getter material 320, 322, 324. . The getter module 300 also defines one or more apertures 340 through the covers 315, 317, 319 for chemically exposing the getter material to the interior of the carrier 15 and the wafer storage area 30, Or otherwise promote or allow interaction between the getter material and the environment outside of the getter module 300. Other aspects of the one or more apertures 340 and corresponding apertures in the filter cover 335 are the same as described for the apertures 140, 145, 150, 155 of Figures 2 through 4, and The details will not be repeated here. Moreover, unless otherwise indicated, all other details associated with the getter module 300 (eg, being inserted into the interior volume of the recess 192 and the door 35 and removed from the interior volume of the recess 192 and the door 35) This is the same as described with respect to the getter module 100.

Although the illustrated embodiment of the module 300 includes three getter packs and three closures, an alternative embodiment of the module 300 includes two getter packs and two flaps, four getter packs and four a cover, or any other required number.

The getter module 300 includes one or more attachment features 360, 362 adapted to securely and removably secure the getter module 300 to the inner side 40 of the door 35. The connection features 360, 362 are identical in construction and operation to the connection features 160, 162 described with reference to Figures 2 through 4, and will not be repeated here. Each of the receptacles 190 of the door 35 is adapted to easily and removably receive a single getter module 100 as described above, and the plurality of receptacles 190 are adapted to be easily and removably The connection features 360 are placed to secure the multi-suction module 300 to the door 35.

The apertures 375 are disposed adjacent or disposed on opposite sides of the recesses 312, 313, 314 in the base frame or base 310. The intermediate recess 313 includes two such apertures 375, one on either longitudinal side of the two longitudinal sides of the intermediate recess 313, and the end recesses 312, 314 include one such aperture 375 on its inner end. The recess 375, for example, houses a tool for assisting in inserting the base 310 into the door 35 or removing the base 310 from the door 35.

9 through 10 show the connection of the getter module 300 with respect to the inner side 40 of the door 35. As previously described herein with reference to Figures 5 through 6, the door 35 includes a plurality of receptacles 190 or attachment points for the module 100. These receptacles 190 (including recesses 192, sidewalls 194, stop members 196, and other features) accommodate multiple suctions in the same manner as their attachment features 160, 162 that house a single getter module 100. Connection features 360, 362 of the dosage module 300. Figure 9 shows both the multi-aspirator module 300 attached to the inner side 40 of the door 35 and a single getter module 100, which can be selected by a user. The modules include a first module 170, a second module 172, a third module 174, and a fourth module 176.

As should be appreciated, the single getter module 100 and/or the multi-aspirator module 300 can be attached to the inner side 40 of the door 35 in any desired manner and combination to reduce the carrier 15 in a customized manner. Concentration of contaminants. Each getter module 300 includes a getter package for a particular application, such as two or three different getter packages, two getter packages of the same type, and one A different type of getter package, or any other desired combination of getter packages. The multi-aspirator module 300 can be used on the same door as the single getter module 100 as needed. The getter modules 100, 300 can be customized or purchased for a particular application, or can be provided and used with a kit of different types of getter modules 100 and/or 300.

Figure 11 shows the method steps in accordance with an embodiment of the present invention. A method of reducing the concentration of gas, moisture, and/or other airborne molecular contaminants in a container microenvironment includes: at 410, attaching one or more getter assemblies 100 or 300 to the container 15 Door 35. Each getter assembly is adapted to remove a different type of contaminant from the container microenvironment, and/or a getter assembly as needed to remove a plurality of different contaminants. The method additionally includes, at 415, closing the door 35 of the container 15 to expose the getter assembly to the container microenvironment. At 420, door 35 is finally opened, and at 425, one or more of the getter assemblies are replaced.

Embodiments of the invention are particularly useful in non-purge, passive environments. According to these embodiments, the getter modules 100, 300 do not contain connections to the purge or other purge components and are therefore outside of a purge stream. However, the containers used with such passive getter modules 100, 300 may themselves include a microenvironment in which purge gas and systems are used to actively reduce the concentration of contaminants. In other embodiments, purge gas or other gases may be routed directly through the modules 100, 300 in a planned manner such that the modules are directly in the purge stream.

It should be noted that embodiments of the invention are not limited to use with semiconductor materials, wafers or other substrates or carriers. Embodiments of the present invention can be used to protect any item that should be transported in a clean, non-contaminated or otherwise protected state, and such embodiments can be used in a variety of industrial and other environments in addition to the semiconductor industry. The term substrate used herein includes a wafer that is processed into an integrated circuit, a solar panel, a flat panel, or other semiconductor device; the substrate also includes a photomask for use in lithography and a memory disk (eg, a hard disk drive). Medium disk; and desire Any other items protected. Embodiments of the present invention are applicable to a variety of industrial and various pollution sensitive articles, and not only to the semiconductor industry and semiconductor wafers. For example, embodiments of the invention are also applicable to the life sciences and bio/pharmaceutical industries. Moreover, unless otherwise indicated, the terms container, carrier, transporter, cassette, transport/storage bin, etc. are also used interchangeably herein. In addition, the term getter module and getter assembly are used interchangeably herein. Various modifications and variations of the illustrated and described embodiments within the scope of the present application will be apparent to those skilled in the art. Variations in form and content may be made without departing from the spirit and scope of the invention.

35‧‧‧

37‧‧‧ inner wall

40‧‧‧ inside

42‧‧‧ surface

100‧‧‧Absorber module/module/first getter module/single getter module/ getter total Formed/attached module

100'‧‧‧second getter module

185‧‧‧Interior panels or surfaces

186‧‧‧External panels or surfaces

190‧‧‧ Container

192‧‧‧ Groove

194‧‧‧ side wall

200‧‧‧ Wafer Holder / Structure / Holder

205‧‧‧ Wafer Platform

210‧‧‧Snap connector

Claims (35)

A semiconductor wafer carrier assembly includes: a carrier defining a wafer storage area adapted to support one or more semiconductor wafers, the carrier having a front opening door, the carrier The front opening door includes a door housing and a latch mechanism operatively coupled to the door housing to secure the door, the door being openable for accessing the wafer storage area, a door defining surface facing one of the wafer storage areas; and a getter module comprising: a rigid polymer housing having an access opening; a getter material disposed on the suction In the gas module housing, the getter material is adapted to reduce the concentration of contaminants in the wafer storage area of the carrier via the access opening; and at least one rigid polymer connection feature as the getter One or a portion of the module housing extends from the getter module housing, the connection feature being adapted to easily and removably secure the getter module to the inner side of the door. The vehicle assembly of claim 1, wherein the getter module housing comprises a base and at least one cover fixed to the base; and wherein the getter material is disposed on the cover and the cover Between the pedestals. The carrier assembly of claim 2, wherein the getter module further comprises a filter disposed between the cover and the getter material. The carrier assembly of claim 2, wherein: the getter material is in the form of a plurality of getter packs; The at least one cover includes a plurality of covers, each of which corresponds to a respective getter package; and the base defines a base frame for corresponding to the base frame The getter packs are supported between the closures. The carrier assembly of claim 4, wherein the getter packs are directly supported on the base frame. The carrier assembly of claim 4, wherein the inner side of the door defines a plurality of receptacles; and wherein the at least one attachment feature defines a plurality of attachment features to easily and removably attach the base frame The receivers fixed to the door. The carrier assembly of claim 6, wherein each of the inner sides of the door is adapted to receive at least one connection feature of a second getter module, the second getter module The set has a single base, a single cover, and a single getter package disposed between the single base and the single cover. The carrier assembly of claim 1, wherein the getter module conforms to a recess in the door. The carrier assembly of claim 1, wherein the inner side of the gate defines a receiver, and the receiver is adapted to receive or support one of a plurality of wafers in the wafer storage area. The container is adapted to receive the at least one connection feature of the getter module to easily and removably fix the getter module to the inner side of the door. The carrier assembly of claim 1, wherein the at least one attachment feature includes a snap fit member for snap fitting the getter module to the door. The carrier assembly of claim 10, wherein the at least one connection feature further comprises a protrusion The protrusion is disposed on a side of the getter module opposite to the snap fit member to fit into one of the openings of the inner side of the door. The carrier assembly of claim 1 wherein the at least one attachment feature comprises an offset substantially V-shaped member adapted to press against a receptacle of the door. The carrier assembly of claim 12, wherein the at least one attachment feature further comprises a projection extending in a direction substantially perpendicular to one of the substantially V-shaped members. A door assembly for a substrate container, comprising: a door for closing the substrate container, a first getter module, the first getter module defining a single getter, the single getter The agent comprises a first getter material for removing contaminants from the substrate container; a second getter module, the second getter module defining a second getter, the second getter The agent comprises a second getter material different from the first getter material for removing contaminants from the substrate container, wherein the door defines a plurality of attachment points, the attachment points being adapted to attach the first suction The gas module and the second getter module, wherein the first getter module and the second getter module are attached to the door at the attachment point selected by the attachment points. The door assembly of claim 14, wherein the first getter module is adapted to remove one type of contaminant from the container; and wherein the second getter module is adapted to be removed from the container At least one other type of contaminant of the one type of contaminant. The door assembly of claim 14, wherein each of the first getter module and the second getter module comprises a biased member to mold the corresponding getter mold The set snaps to engage the door at any of the attachment points. The door assembly of claim 14, wherein the attachment points have the same shape. The door assembly of claim 14, further comprising a third getter module, the third getter module having a third difference from the first getter material and the second getter material Suction material. A door assembly as claimed in claim 14 which is combined with a container. a combination of a substrate container and the first getter module and the second getter module, wherein each of the first getter module and the second getter module comprises: a suction a gas bag comprising a susceptor, the getter package comprising a getter formulation; a cover disposed over the susceptor and the getter pack; and at least one filter operatively coupled to Between the getter package and the cover; wherein the getter module is easily and removably secured to the substrate container inside one of the substrate containers; wherein the cover defines at least one channel, the cover At least one channel is adapted to chemically expose the getter package to the interior of the protective carrier. The combination of the substrate container of claim 20 and the first getter module and the second getter module, wherein the getter formulation of the first getter package is different from the second getter The getter formulation of the gas agent package. The combination of the substrate container of claim 20 or 21 and the first getter module and the second getter module, wherein each getter module comprises at least one connection feature, the at least one connection The feature is adapted to secure the getter module to a door of the substrate container. The combination of the substrate container of claim 22 and the first getter module and the second getter module, wherein each getter module comprises at least one connection feature, the at least one connection feature being suitable Fixing the getter module to the door at any of a plurality of attachment points One inside. The combination of the substrate container of claim 23 and the first getter module and the second getter module, wherein the at least one connecting feature defines a snap fit, a press fit, and a friction fit one of them. The substrate container according to claim 20, in combination with the first getter module and the second getter module, combined with the substrate or the substrate placed in the substrate container. A method of reducing the concentration of gas, moisture, and/or airborne molecular contaminants in a micro-environment of a front-opening container, the method comprising: attaching a getter assembly to a recess on a front door of the container a getter assembly comprising a getter material in a housing; and closing the front door of the container to expose the getter assembly to the container microenvironment and thereby reducing the microenvironment of the container The concentration of gas, water, and/or airborne molecular contaminants. The method of claim 26, wherein the attaching comprises attaching a first getter assembly to the front door and attaching a second getter assembly to the front door, the first getter assembly being adapted A different type of contaminant from the container of the second getter assembly is removed from the microenvironment of the container. The method of claim 26, further comprising: opening the front door of the container and replacing the getter assembly with a new getter assembly. The method of claim 26, wherein the additional comprises: adding a getter assembly comprising at least two different types of getter materials selected by a user. The method of claim 26, wherein the getter assembly is a first getter assembly comprising a single getter package; the method further comprises containing a plurality of getter packages A getter assembly is attached to the front door of the container. A door assembly for an article container, the door assembly comprising: a door frame having an inwardly facing surface for receiving a groove of a wafer pad, attached to the groove a wafer pad of the door, recessed in a receiver in a surface of the door assembly, the door assembly surface being configured to face an item in the article container, the container being adapted to receive an inhalation And a getter module, which is received by the container, and the getter module is adapted to reduce pollution in the container of the article. The door assembly of claim 31, wherein the getter module is at least partially disposed in a recess of the receptacle. The door assembly of claim 31, wherein the door assembly surface has an inner door wall and the door assembly further comprises an outer door wall, the inner door wall and the outer door wall being defined in the door assembly An internal volume, wherein the getter module extends across the inner door wall into the interior volume of the door assembly. The door assembly of claim 31, wherein the getter module is a passive getter module, the passive getter module not including a connection to a purge stream. The door assembly of claim 31, which is combined with an item container that is selectively opened and closed by the door assembly.