[go: up one dir, main page]

TW201638382A - Chemical vapor deposition apparatus and cleaning method thereof - Google Patents

Chemical vapor deposition apparatus and cleaning method thereof Download PDF

Info

Publication number
TW201638382A
TW201638382A TW105112979A TW105112979A TW201638382A TW 201638382 A TW201638382 A TW 201638382A TW 105112979 A TW105112979 A TW 105112979A TW 105112979 A TW105112979 A TW 105112979A TW 201638382 A TW201638382 A TW 201638382A
Authority
TW
Taiwan
Prior art keywords
exhaust
chamber
reaction
side wall
reaction chamber
Prior art date
Application number
TW105112979A
Other languages
Chinese (zh)
Other versions
TWI563122B (en
Inventor
Zhi You Du
Pei-Jin Xing
Wenyuan Fan
Yin-Xin Jiang
Original Assignee
Advanced Micro Fab Equip Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Fab Equip Inc filed Critical Advanced Micro Fab Equip Inc
Publication of TW201638382A publication Critical patent/TW201638382A/en
Application granted granted Critical
Publication of TWI563122B publication Critical patent/TWI563122B/zh

Links

Landscapes

  • Chemical Vapour Deposition (AREA)

Abstract

The present invention discloses a chemical vapor deposition apparatus comprising a reaction chamber, a reaction zone located above the reaction chamber, an exhaust zone located at the bottom of the reaction chamber, and an air-sucking device communicating to the outside of the reaction chamber, the exhaust zone including an isolation device dividing the exhaust zone into an exhaust chamber and a storage chamber which are arranged internally and externally. The isolation device comprises a side wall which is provided with a gas opening to communicate the exhaust chamber and the storage chamber. A scraper member movable up and down is disposed in the exhaust zone, which is movable between upper and lower ends of the exhaust port.

Description

化學氣相沉積裝置及其清潔方法Chemical vapor deposition device and cleaning method thereof

本發明有關於氣相沉積製造技術領域,特別是有關於一種具有自動清潔裝置和功能的金屬有機化學氣相沉積反應器。The invention relates to the field of vapor deposition manufacturing technology, and in particular to a metal organic chemical vapor deposition reactor with an automatic cleaning device and function.

如第1圖所示,金屬有機化學氣相沉積(MOCVD)反應器包括一個反應腔100,反應腔內包括一個托盤14,多個待處理的基片15固定在托盤上,托盤14下方中心有一個旋轉軸24驅動托盤在反應過程中高速旋轉。托盤14下方更包括一個加熱器12加熱托盤14達到合適的高溫,這個高溫通常在1000度左右,以適應氮化鎵(GaN)晶體材料的結晶生長。反應腔100內與托盤相對的是一個氣體噴淋頭21,氣體噴淋頭包括多個互相隔離的多組進氣通道,第一組進氣通道藉由第一氣體管路43連接到第一反應氣源41,第二組進氣通道藉由第二氣體管路44連接到第二反應氣源42,噴淋頭中更可以再設置第三組進氣通道位於第一和第二中間進氣通道之間以隔離不同反應氣體。噴淋頭下部更包括冷卻液管路,冷卻液管路藉由冷卻液供應管道51連接到冷卻液源50,藉由控制冷卻液源輸出冷卻液的溫度和流量可以控制噴淋頭具有合適的溫度,如50度。在噴淋頭和下方托盤之間的反應空間外圍更圍繞著一個反應腔內襯62,該內襯上方更包括一個升降驅動機構64用以驅動內襯62上下移動,在內襯處於較高位置時可以屏蔽反應腔100的側壁上的托盤進出口(未圖示)帶來的不均勻性影響,以改善氣流和溫度均勻性。當托盤上的製程反應完成,需要移出托盤,驅動該內襯62可以向下移動,以使托盤14穿過反應腔100的側壁上開設的托盤進出口。托盤下方空間內更包括一基座側壁16,基座側壁圍繞旋轉軸24和加熱器12,實現對內部熱量和外部污染物的屏蔽。反應腔底部更包括排氣區域34,反應完成後的副生成物和廢氣藉由管道連接到抽氣裝置36,使得副生成物和廢氣被排出反應腔,同時控制反應腔內氣流和氣壓。排氣區域34和反應區域之間更包括一水平設置的環形擋氣板30,擋氣板30內側固定到基座側壁外側,其另一側固定到反應腔100內壁,環形擋氣板30上更開設有一個或多個沿豎直方向設置的氣流開口31,這些開口可以是環形的槽也可以是在整個環形擋氣板30圓周上均勻分佈的氣孔。藉由對這些開口大小的設計可以控制上方反應區域的氣流在不同位置的流量和分佈。上述冷卻液供應管道51也可以同時向內襯62和反應腔100側壁提供冷卻液,以控制這些部件的溫度。As shown in FIG. 1, the metal organic chemical vapor deposition (MOCVD) reactor includes a reaction chamber 100 including a tray 14 in which a plurality of substrates 15 to be processed are fixed, and a tray has a center under the tray 14 A rotating shaft 24 drives the tray to rotate at a high speed during the reaction. Below the tray 14, a heater 12 is further included to heat the tray 14 to a suitable elevated temperature, typically about 1000 degrees, to accommodate the crystal growth of gallium nitride (GaN) crystal material. Opposite the tray in the reaction chamber 100 is a gas shower head 21 comprising a plurality of mutually isolated sets of intake passages, the first set of intake passages being connected to the first by a first gas line 43 The reaction gas source 41, the second group of intake passages are connected to the second reaction gas source 42 by the second gas line 44, and the third group of intake passages can be further disposed in the first and second intermediate passages. Different reaction gases are isolated between the gas channels. The lower portion of the shower head further includes a coolant line connected to the coolant source 50 by the coolant supply pipe 51. The sprinkler can be controlled by controlling the temperature and flow rate of the coolant output coolant. Temperature, such as 50 degrees. A reaction chamber liner 62 is further disposed around the reaction space between the shower head and the lower tray. The liner further includes a lifting drive mechanism 64 for driving the liner 62 to move up and down, and the liner is at a higher position. The effect of the unevenness caused by the tray inlet and outlet (not shown) on the side wall of the reaction chamber 100 can be shielded to improve the gas flow and temperature uniformity. When the process on the tray is completed, the tray needs to be removed, and the liner 62 can be driven to move downward so that the tray 14 passes through the tray inlet and outlet opened on the side wall of the reaction chamber 100. The space below the tray further includes a base side wall 16 that surrounds the rotating shaft 24 and the heater 12 to shield internal heat and external contaminants. The bottom of the reaction chamber further includes an exhaust region 34, and the by-products and exhaust gas after the completion of the reaction are connected to the air extracting device 36 through a pipe, so that the by-products and the exhaust gas are discharged out of the reaction chamber while controlling the gas flow and the gas pressure in the reaction chamber. The exhaust region 34 and the reaction region further include a horizontally disposed annular gas barrier 30. The inner side of the gas barrier 30 is fixed to the outer side of the base sidewall, and the other side thereof is fixed to the inner wall of the reaction chamber 100. The annular gas barrier 30 is provided. Further, one or more airflow openings 31 disposed in the vertical direction are provided, and the openings may be annular grooves or air holes uniformly distributed over the circumference of the annular gas barrier plate 30. By designing the size of these openings, the flow and distribution of the gas flow in the upper reaction zone at different locations can be controlled. The coolant supply conduit 51 described above can also provide coolant to both the liner 62 and the side walls of the reaction chamber 100 to control the temperature of these components.

習知技術中,在反應過程中,反應氣體反應後形成氮化鎵(GaN)或者其它氮化物,同時反應氣體三甲基鎵(TMG)會在高溫中分解形成大量有機物,這些固體產物在極高溫的托盤14和基片15上會形成所需要的緻密的半導體晶體,但是在內襯62、反應腔100內壁或者氣體噴淋頭21等溫度較低的部件上這些產物會形成鬆散的沉積物堆積,這些沉積物堆積時間一長會形成片狀污染物,隨機剝落,沿豎直方向直接向下掉落到下方的擋氣板30上,一些大面積的片狀污染物會堵塞上述氣流開口31。一旦部分氣流開口31被堵塞,上方反應氣體的流動分佈就會出現不均勻,基片上生長的晶體結構也就會出現不均勻,這會嚴重影響LED基片的產能和質量。In the prior art, during the reaction, the reaction gas forms a gallium nitride (GaN) or other nitride, and the reaction gas trimethylgallium (TMG) decomposes at a high temperature to form a large amount of organic matter. The high temperature tray 14 and substrate 15 will form the desired dense semiconductor crystals, but these products will form loose deposits on the lower lining 62, the inner wall of the reaction chamber 100 or the lower temperature components such as the gas shower head 21. The accumulation of materials, these deposits will accumulate for a long time to form flaky contaminants, randomly peeling off, and directly fall down vertically to the lower gas barrier 30, some large-area flaky pollutants will block the above airflow. Opening 31. Once the partial airflow opening 31 is blocked, the flow distribution of the upper reaction gas will be uneven, and the crystal structure grown on the substrate will also be uneven, which will seriously affect the productivity and quality of the LED substrate.

為了解決上述問題,需要頻繁的關機,打開反應腔,再清理擋氣板30上大塊的堆積物,但是這也會影響化學氣相沉積裝置的產能。部分習知技術也揭露了利用內襯62向下移動時帶動一個清潔裝置穿過上述開口,頂碎沉積物確保開口31暢通。但是這樣的設計仍然存在弊端,內襯62只有在完成整個反應流程後才會升降一次,而整個反應流程可以長達數小時甚至數十小時,期間很有可能發生堵塞開口31的問題,該設計無法解決這一問題,所以需要一種更佳的清潔裝置或方法實現對化學氣相沉積裝置排氣口長期有效的清潔。In order to solve the above problems, frequent shutdowns are required, the reaction chamber is opened, and large deposits on the gas barrier 30 are cleaned, but this also affects the productivity of the chemical vapor deposition apparatus. Some prior art techniques also disclose that a cleaning device is driven through the opening when the liner 62 is moved downward, and the topping of the deposit ensures that the opening 31 is clear. However, such a design still has drawbacks. The liner 62 will only rise and fall once after completing the entire reaction process, and the entire reaction process can last for hours or even tens of hours, during which the problem of clogging the opening 31 is likely to occur. This problem cannot be solved, so a better cleaning device or method is needed to achieve long-term effective cleaning of the vent of the chemical vapor deposition device.

本發明解決的問題是實現對化學氣相沉積裝置中排氣區域的清潔,以防止大量沉積的污染物堵塞排氣口,造成氣流分佈不均。The problem solved by the present invention is to achieve cleaning of the exhaust region in the chemical vapor deposition apparatus to prevent a large amount of deposited contaminants from clogging the exhaust port, resulting in uneven airflow distribution.

根據本發明的目的,本發明提供一種化學氣相沉積裝置,包括:反應腔,包括一反應腔側壁;基座,位於反應腔內,基座包括基座側壁,基座側壁和反應腔側壁之間包括一排氣區域;隔離裝置,將排氣區域分隔為圍繞基座側壁呈內外排布的一排氣腔和一儲存腔,儲存腔與基座上方的反應區域聯通;隔離裝置包括一隔離裝置側壁,隔離裝置側壁上開設有複數個排氣口,藉由排氣口使排氣腔和儲存腔之間聯通;其中,排氣口用於允許反應腔製程處理過程中的反應氣體和副產物進入排氣腔,排氣腔用於將反應氣體和副產物排出至反應腔外;儲存腔用於容納收集製程處理過程中的顆粒狀或片狀沉積物。According to an object of the present invention, the present invention provides a chemical vapor deposition apparatus comprising: a reaction chamber including a reaction chamber sidewall; a susceptor disposed in the reaction chamber, the pedestal including a pedestal sidewall, a pedestal sidewall and a reaction chamber sidewall The utility model comprises an exhausting area; the separating device divides the exhausting area into an exhausting chamber and a storage cavity arranged inside and outside the side wall of the base, the storage cavity is in communication with the reaction area above the base; the isolating device comprises an isolation a side wall of the device, a plurality of exhaust ports are opened on the side wall of the isolating device, and the exhaust port and the storage chamber are connected by the exhaust port; wherein the exhaust port is used to allow the reaction gas and the auxiliary in the process of the reaction chamber process The product enters the exhaust chamber for exhausting reactive gases and by-products out of the reaction chamber; the storage chamber is for containing particulate or flaky deposits during the collection process.

本發明更提供一種前述的化學氣相沉積裝置的製程處理方法,包括:向反應腔輸入反應氣體,以在基座上進行化學氣相沉積,在製程處理的過程中,從反應區域的反應氣體和副反應產物經由排氣口沿著非豎直路徑進入至排氣腔,再被排出至反應腔外,顆粒狀或片狀沉積物沿豎直方向直接落入並被收集於儲存腔內。The invention further provides a process processing method of the foregoing chemical vapor deposition apparatus, comprising: inputting a reaction gas into a reaction chamber to perform chemical vapor deposition on a susceptor, and a reaction gas from the reaction region during the process of the process And the side reaction product enters the exhaust chamber along the non-vertical path through the exhaust port, and is discharged to the outside of the reaction chamber, and the granular or flake deposit directly falls in the vertical direction and is collected in the storage chamber.

本發明更提供一種化學氣相沉積裝置,包括:反應腔,包括一反應腔側壁;基座,位於反應腔內,基座包括基座側壁,基座側壁和反應腔側壁之間包括一排氣區域;隔離裝置,將排氣區域分隔為圍繞基座側壁呈內外排布的一排氣腔和一儲存腔,儲存腔與基座上方的反應區域聯通;隔離裝置包括一隔離裝置側壁,隔離裝置側壁上開設有複數個排氣口,藉由排氣口使排氣腔和儲存腔之間聯通;排氣區域更包括至少一個可移動的刮擦部件,其可以在排氣口附近移動。The invention further provides a chemical vapor deposition apparatus, comprising: a reaction chamber comprising a reaction chamber sidewall; a susceptor located in the reaction chamber, the pedestal comprising a pedestal sidewall, and an exhaust between the pedestal sidewall and the reaction chamber sidewall An isolation device divides the exhaust region into an exhaust chamber and a storage chamber disposed inside and outside the base sidewall, the storage chamber is in communication with the reaction region above the base; the isolation device includes an isolation device sidewall, the isolation device A plurality of exhaust ports are opened on the side wall, and the exhaust chamber and the storage chamber are connected by the exhaust port; the exhaust region further includes at least one movable scraping member that can move near the exhaust port.

本發明提供一種化學氣相沉積裝置,包括:反應腔,反應腔內包括設置在反應腔頂部的進氣裝置,一個基座位於反應腔內與進氣裝置相對的下方,基座包括一個基座側壁,基座側壁和反應腔側壁之間包括一排氣區域;一個隔離裝置,將排氣區域分隔為圍繞基座側壁呈內外排布的一個排氣腔和一個儲存腔,儲存腔與基座上方的反應區域聯通;隔離裝置包括一個側壁,側壁上開設有排氣口,藉由排氣口使排氣腔和儲存腔之間聯通,排氣區域更包括至少一個可移動的刮擦部件可以在排氣口的兩端之間移動。其中排氣腔可以位於內側,儲存腔圍繞排氣腔位於外側。隔離裝置包括位於頂部的頂蓋,頂蓋位於排氣口上方,用以防止沉積物從排氣腔頂部落入排氣腔。頂蓋具有傾斜上表面,且形狀與可升降內襯的內表面向匹配,使得內側下降時與頂蓋上表面靠近並壓碎兩者表面的大塊沉積物。The invention provides a chemical vapor deposition apparatus, comprising: a reaction chamber, wherein the reaction chamber comprises an air inlet device disposed at the top of the reaction chamber, a base is located below the reaction chamber and opposite to the air intake device, and the base includes a base The side wall, the side wall of the base and the side wall of the reaction chamber comprise an exhaust area; an isolating device divides the exhaust area into an exhaust chamber and a storage chamber arranged inside and outside the side wall of the base, the storage chamber and the base The upper reaction area is connected; the isolating device comprises a side wall, the side wall is provided with an exhaust port, and the exhaust port is connected between the exhaust chamber and the storage chamber, and the exhausting region further comprises at least one movable scraping component Move between the ends of the exhaust port. The exhaust chamber may be located on the inner side, and the storage chamber is located outside the exhaust chamber. The isolation device includes a top cover at the top, the top cover being located above the exhaust port to prevent deposits from falling into the exhaust chamber from the top of the exhaust chamber. The top cover has an inclined upper surface and is shaped to match the inner surface of the liftable inner liner such that when the inner side is lowered, it is adjacent to the upper surface of the top cover and crushes the bulk deposits on both surfaces.

基座側壁圍繞一個加熱裝置和一個旋轉軸,旋轉軸上方設置有托盤;一個可升降的內襯圍繞基座上方的反應區域,可升降內襯驅動刮擦部件在開口上端和下端之間移動。其中刮擦部件可以是藉由一個連桿連接到內襯。排氣區域更可以包括一個杠桿,刮擦部件連接到杠桿的第一端,杠桿的第二端藉由一個連桿連接到內襯。排氣區域進一步包括一個頂舉桿,杠桿的第一端藉由頂舉桿抬升刮擦部件,且杠桿支點低於排氣口下端,這樣可以避免對流過排氣口的氣體的干擾。儲存區域底部更可以進一步包括一個分隔板,杠桿位於分隔板下方。The base side wall surrounds a heating device and a rotating shaft, and a tray is disposed above the rotating shaft; a liftable inner liner surrounds the reaction area above the base, and the liftable inner liner drives the scraping member to move between the upper end and the lower end of the opening. The scraping member may be connected to the inner liner by a connecting rod. The venting region may further include a lever, the scraping member being coupled to the first end of the lever, and the second end of the lever being coupled to the lining by a link. The venting region further includes a jacking rod, the first end of the lever lifting the scraping member by the jacking rod, and the lever fulcrum is lower than the lower end of the exhaust port, thereby avoiding interference with the gas flowing through the exhaust port. The bottom of the storage area may further include a partition plate with the lever below the partition plate.

較佳地,頂舉桿位於基座側壁內側的排氣腔中上下移動,刮擦部件沿隔離裝置的側壁內側在開口上下端之間移動。或者刮擦部件可以位於儲存腔內,沿隔離裝置的側壁外側在開口上下端之間移動。Preferably, the jacking rod is moved up and down in the exhaust chamber inside the side wall of the base, and the scraping member moves between the upper and lower ends of the opening along the inner side of the side wall of the spacer. Alternatively, the scraping member can be located within the storage chamber and move between the upper and lower ends of the opening along the outside of the side wall of the spacer.

較佳地,本發明可以採用多個刮擦部件位於多個排氣口之間,驅動多個刮擦部件圍繞隔離裝置側壁作圓周運動,使每個刮擦部件至少掃過一個排氣口區域。Preferably, the present invention can employ a plurality of scraping members between the plurality of exhaust ports to drive the plurality of scraping members to move circumferentially around the side walls of the spacer so that each of the scraping members sweeps at least one of the exhaust ports. .

其中儲存腔包括至少一個防沉積物反流裝置,防沉積物反流裝置包括向下傾斜的板。The storage chamber includes at least one anti-sediment reflux device, and the anti-sediment reflux device includes a downwardly inclined plate.

進一步的,本發明刮擦部件具有一橫向延伸的延伸部,在刮擦部件經過排氣口時延伸部伸入排氣口。Further, the scraping member of the present invention has a laterally extending extension that extends into the exhaust port as the scraping member passes through the exhaust port.

本發明更提供一種清潔前述化學氣相沉積裝置的清潔方法,包括:移動刮擦部件,使其在排氣口附近移動,以刮擦沉積於排氣口的沉積物。The present invention further provides a cleaning method for cleaning the aforementioned chemical vapor deposition apparatus, comprising: moving the scraping member to move it near the exhaust port to scrape deposits deposited on the exhaust port.

較佳地,上下移動反應腔內的可升降內襯,以帶動刮擦部件上下移動。Preferably, the liftable lining in the reaction chamber is moved up and down to drive the scraping member to move up and down.

較佳地,可升降內襯與刮擦部件藉由連接桿或杠桿實現二者聯動。Preferably, the liftable lining and the scraping member are linked by a connecting rod or a lever.

較佳地,驅動刮擦部件圍繞隔離裝置側壁作圓周運動,使每個刮擦部件至少掃過部分排氣口區域。Preferably, the wiper member is driven to move circumferentially about the side wall of the spacer such that each of the scraping members sweeps at least a portion of the vent area.

較佳地,第一位置和第二位置位於排氣口的上端和下端,或者第一位置和第二位置位於不同的排氣口之間。Preferably, the first position and the second position are located at the upper and lower ends of the exhaust port, or the first position and the second position are located between the different exhaust ports.

本發明要解決化學氣相沉積裝置在運行過程中產生的污染物堵塞排氣區域的排氣口造成反應氣體氣流分佈不均的問題。The invention solves the problem that the pollutants generated during the operation of the chemical vapor deposition device block the exhaust port of the exhaust region, causing uneven distribution of the reaction gas flow.

為了解決如第1圖所示的化學氣相沉積裝置中,大的片狀沉積物從上方剝落,沿豎直方向直接向下掉落到位於下方的擋氣板30上,堵塞氣流開口31,從而導致製程結果不均一的問題,本發明提供了一種完全不同思路的、更簡單有效的解決方案。與習知技術不同,本發明提供了一種側向排氣裝置,使其排氣口的開口朝向為非豎直方向(例如,沿水平方向),這樣,可以有效地避免在製程處理過程中來自上方的顆粒狀或片狀沉積物沿豎直方向直接落入並堵塞排氣口;同時,本發明更巧妙地在排氣區域內設置了一與排氣腔相隔離的沉積物儲存區,使顆粒狀或片狀沉積物被有效收集並被壓實,而不會在反應腔內隨氣流亂竄,從而影響排氣和製程處理的均一性。In order to solve the chemical vapor deposition apparatus as shown in FIG. 1, a large sheet-like deposit is peeled off from above, and is directly dropped downward in the vertical direction onto the gas barrier 30 located below, blocking the airflow opening 31, As a result, the process result is not uniform, and the present invention provides a simpler and more effective solution with completely different ideas. Different from the prior art, the present invention provides a lateral exhaust device such that the opening of the exhaust port is oriented in a non-vertical direction (for example, in a horizontal direction), so that it can be effectively avoided during the process. The upper granular or flaky deposit directly falls in the vertical direction and blocks the exhaust port; at the same time, the present invention more subtly provides a deposit storage area in the exhaust region that is isolated from the exhaust chamber, so that Granular or flaky deposits are effectively collected and compacted without turbulence in the reaction chamber, thereby affecting the uniformity of the exhaust and process.

以下結合第2及3圖所示的實施例來說明本發明。第2圖所示為本發明提出的一種化學氣相沉積裝置的實施例,該圖示狀態為反應器在進行化學氣相沉積時的狀態,此時,可升降內襯62位於一較上方的位置。其反應器的基本結構與第1圖所示的習知技術基本相同,主要改進在於位於基座側壁和反應腔側壁之間的排氣區域(圖中虛線框A所示)。本發明中,位於下方的排氣區域中包括一個隔離裝置139,用於將排氣區域分隔成位於內部的排氣腔134和環繞排氣腔外圍設置的用於儲存沉積物的儲存區域或儲存腔138。作為一種實施例,隔離裝置為一包含頂蓋(容後詳述)的圓桶型隔離板139。隔離裝置包括一隔離裝置側壁139a,在隔離裝置側壁139a上開設有複數個開口137。排氣腔134位於隔離裝置側壁139a的內側,並圍繞基座側壁16的外側而設置;儲存腔138位於隔離裝置側壁139a的外側,並圍繞排氣腔134的外側而設置。The present invention will be described below in conjunction with the embodiments shown in Figs. 2 and 3. Fig. 2 is a view showing an embodiment of a chemical vapor deposition apparatus according to the present invention, which is in a state in which the reactor is subjected to chemical vapor deposition, and at this time, the liftable liner 62 is located at an upper side. position. The basic structure of the reactor is substantially the same as that of the prior art shown in Fig. 1. The main improvement is the venting region (shown by the dashed box A in the figure) between the side wall of the susceptor and the side wall of the reaction chamber. In the present invention, the lower exhaust region includes an isolation device 139 for separating the exhaust region into an internal exhaust chamber 134 and a storage region for storing deposits disposed around the periphery of the exhaust chamber or for storage. Cavity 138. As an embodiment, the isolation device is a drum-type spacer 139 including a top cover (described in detail later). The isolation device includes an isolation device sidewall 139a, and a plurality of openings 137 are defined in the isolation device sidewall 139a. The exhaust chamber 134 is located inside the spacer side wall 139a and is disposed around the outside of the base side wall 16; the storage chamber 138 is located outside the spacer side wall 139a and disposed around the outside of the exhaust chamber 134.

隔離裝置更包括一個頂蓋135,其設置在排氣腔134的上方,頂蓋135內側固定到基座側壁16的外側表面,頂蓋135下表面與隔離裝置側壁139a之間存在一個或多個開口朝向為非豎直方向的開口137作為排氣口,以使反應氣體沿第2圖中18所示的排氣路徑進入排氣腔134,並被抽氣裝置136抽走,同時反應中形成的小顆粒狀污染物也隨著氣流被抽走。而從上方內襯62或氣體噴淋頭脫落的大片的沉積物或更大顆粒狀的沉積物,在向下掉落的過程中,由於重力的作用會豎直或垂直地掉落到位於下方的儲存區域或儲存腔138,而不會橫向穿過開口137,進入排氣腔或直接堵塞開口137。只要儲存腔138的空間容積夠大,就能將多個(如大於100個)晶體生長週期中產生的沉積污染物儲存在儲存區內的空間中,無需開反應腔作清潔處理,也無需如前述習知技術所述的,採用機械結構頻繁運動刮擦或者穿過水平開口31(第1圖)來保證開口不會被堵塞。The isolation device further includes a top cover 135 disposed above the exhaust chamber 134, the inside of the top cover 135 is fixed to the outer side surface of the base side wall 16, and one or more of the lower surface of the top cover 135 and the spacer side wall 139a The opening 137 whose opening faces the non-vertical direction serves as an exhaust port, so that the reaction gas enters the exhaust chamber 134 along the exhaust path shown by 18 in FIG. 2, and is evacuated by the air extracting device 136 while being formed in the reaction. The small particulate contaminants are also pumped away with the gas stream. Large pieces of sediment or larger granular deposits falling off from the upper lining 62 or the gas sprinkler, falling down vertically or vertically due to gravity during the downward falling process The storage area or storage chamber 138 does not pass laterally through the opening 137, enters the exhaust chamber or directly blocks the opening 137. As long as the space volume of the storage chamber 138 is large enough, a plurality of (for example, more than 100) deposition pollutants generated in the crystal growth period can be stored in the space in the storage area, without opening the reaction chamber for cleaning, and without As described in the prior art, the mechanical structure is frequently moved to scrape or pass through the horizontal opening 31 (Fig. 1) to ensure that the opening is not blocked.

由上述描述可知,本發明在化學氣相沉積裝置的反應腔內,在位於基座側壁和反應腔側壁之間的排氣區域內,設置一具有側向排氣功能的隔離裝置或排氣裝置,將排氣區域分隔為圍繞所述基座側壁呈內外排布的一排氣腔和一儲存腔。儲存腔與基座上方的反應區域聯通,隔離裝置包括一隔離裝置側壁,在隔離裝置側壁上開設有複數個排氣口,藉由排氣口使排氣腔和儲存腔之間聯通;在反應腔製程處理的過程中,從反應區域的反應氣體和副反應產物經由排氣口和排氣腔被排出至反應腔外,顆粒狀或片狀沉積物落入並被收集於儲存腔內。排氣口用於允許反應腔製程處理過程中的反應氣體和副產物進入排氣腔,排氣腔用於將反應氣體和副產物排出至反應腔外;儲存腔用於容納收集製程處理過程中的顆粒狀或片狀沉積物。It can be seen from the above description that the present invention provides an isolation device or an exhaust device having a lateral exhaust function in a reaction chamber between the side wall of the base and the side wall of the reaction chamber in the reaction chamber of the chemical vapor deposition apparatus. The exhaust region is partitioned into an exhaust chamber and a storage chamber that are arranged inside and outside the side wall of the base. The storage chamber is in communication with the reaction area above the base, the isolation device includes an isolation device side wall, and a plurality of exhaust ports are opened on the side wall of the isolation device, and the exhaust chamber and the storage chamber are connected by the exhaust port; During the process of the chamber process, the reaction gas and side reaction products from the reaction zone are discharged to the outside of the reaction chamber through the exhaust port and the exhaust chamber, and the granular or flake deposits fall into and are collected in the storage chamber. The exhaust port is used to allow the reaction gas and by-products in the process of the reaction chamber process to enter the exhaust chamber, the exhaust chamber is used to discharge the reaction gas and by-products to the outside of the reaction chamber; the storage chamber is used to accommodate the collection process Granular or flaky deposits.

較佳地,複數個排氣口的開口朝向為非豎直方向(為水平方向或為與水平方向呈一小於90度角的傾斜方向),以避免在製程處理過程中顆粒狀或片狀沉積物沿豎直方向直接落入並堵塞排氣口。Preferably, the openings of the plurality of exhaust ports are oriented in a non-vertical direction (horizontal direction or an oblique direction with an angle of less than 90 degrees from the horizontal direction) to avoid granular or flaky deposition during the processing process. The object directly falls in the vertical direction and blocks the exhaust port.

較佳地,一個頂蓋位於複數個排氣口的上方,頂蓋在上方為複數個排氣口提供遮擋,以防止顆粒狀或片狀沉積物沿豎直方向直接落入複數個排氣口。Preferably, a top cover is located above the plurality of exhaust ports, and the top cover provides shielding for the plurality of exhaust ports at the top to prevent the granular or sheet-like deposit from directly falling into the plurality of exhaust ports in the vertical direction. .

第3圖所示為第2圖所示的反應腔中可升降內襯位於一較下方的位置,在此位置下,反應腔停止製程處理,托盤14穿過反應腔100的側壁上開設的托盤進出口被傳送。可升降內襯62圍繞基座上方的反應區域而設置,並可沿反應腔側壁上下移動,可升降內襯包括一底端面62a。第3圖中,開口137具有位於上方的開口起始線L1與位於下方的開口結束線L2,當可升降內襯62移動至其下方位置時,可升降內襯的底端面62a越過開口起始線L1,其可以進一步刮擦位於開口137附近的大的沉積物顆粒或片狀沉積物,並可以停止於開口起始線L1下方的某一位置。更佳地,當可升降內襯移動至其下方位置時,其底端面62a越過開口結束線L2,並停止於開口結束線L2下方的一位置,在此位置下,底端面62a不僅可以全面刮擦位於開口137附近的大的沉積物顆粒或片狀沉積物,而且更可以下壓、壓實儲存於所述儲存腔138內的沉積物。Figure 3 is a view showing the lower and lower lining of the reaction chamber shown in Fig. 2, in which the reaction chamber is stopped, and the tray 14 is passed through the tray opened on the side wall of the reaction chamber 100. Import and export are transmitted. The liftable inner liner 62 is disposed around the reaction area above the base and is movable up and down along the side wall of the reaction chamber, and the liftable inner liner includes a bottom end surface 62a. In Fig. 3, the opening 137 has an opening start line L1 located above and an opening end line L2 located below, and when the liftable inner liner 62 is moved to a position below it, the bottom end face 62a of the liftable inner liner is over the opening. Line L1, which can further scrape large deposit particles or flaky deposits located near opening 137, and can stop at a position below opening starting line L1. More preferably, when the liftable inner liner is moved to the lower position thereof, the bottom end surface 62a passes over the opening end line L2 and stops at a position below the opening end line L2, in which the bottom end surface 62a can not only be fully scraped The large deposit particles or flaky deposits located near the opening 137 are rubbed, and the deposits stored in the storage chamber 138 can be pressed and compacted.

隔離裝置的頂蓋135具有傾斜的上表面,且形狀與可升降內襯62的內表面相匹配或相適配,只要當可升降內襯62上下移動時,可升降內襯62的內表面不與頂蓋135的上表面碰撞。The top cover 135 of the isolating device has an inclined upper surface and is shaped to match or fits the inner surface of the liftable inner liner 62 so long as the inner surface of the liftable inner liner 62 does not move when the liftable inner liner 62 moves up and down Colliding with the upper surface of the top cover 135.

進一步地,儲存腔138內更可以設置至少一個防沉積物反流裝置,作為一種實施方式,防沉積物反流裝置包括向下傾斜的板。Further, at least one anti-sediment reflux device may be disposed in the storage chamber 138. As an embodiment, the anti-sediment reflux device includes a downwardly inclined plate.

進一步地,如第10圖所示,圍繞隔離裝置外側壁更可以設置有一旋轉環566,所述旋轉環566上設置有多個向上延伸部567,所述延伸部上端設置有刮擦部568,所述旋轉環566可圍繞所述隔離裝置外側壁旋轉,以帶動所述刮擦部568在不同的開口137之間刮擦。Further, as shown in FIG. 10, a rotating ring 566 may be further disposed around the outer side wall of the separating device, and the rotating ring 566 is provided with a plurality of upward extending portions 567, and the upper end of the extending portion is provided with a scraping portion 568. The rotating ring 566 is rotatable about the outer side wall of the isolating device to drive the scraping portion 568 to scrape between different openings 137.

為了更有效地防止或清除可能堵塞住開口137附近的大的沉積物,本發明以下多種實施例可以有效實現此目的。In order to more effectively prevent or remove large deposits that may block the vicinity of the opening 137, the following various embodiments of the present invention can effectively achieve this object.

如第4圖所示,本發明提出了一種化學氣相沉積裝置,反應器基本結構與第1圖所示的習知技術基本相同,主要改進在於位於基座側壁和反應腔側壁之間的排氣區域(圖中虛線框A)。本發明中下方的排氣區域中包括一個圓桶型隔離板139將排氣區域分隔成內部的排氣腔134和環繞排氣腔外圍設置的儲存腔138,用於儲存沉積物。所述排氣腔上方更包括一個環形頂蓋135,頂蓋135內側固定到所述基座側壁16的外側表面,頂蓋135下表面與隔離板139之間存在一個或多個開口137作為排氣口,以使反應氣體沿圖中18所示的排氣路徑進入排氣腔134並被抽氣裝置136抽走,同時反應中形成的小顆粒狀污染物也隨著氣流被抽走。從上方內襯62脫落的大片的沉積物在向下掉落的過程中由於重力的作用會垂直掉落到下方的儲存區域(或儲存腔138),而不會橫向穿過開口137進入排氣腔或直接堵塞開口137。只要儲存區域(或儲存腔138)的空間容積夠大,就能將多個(如大於100個)晶體生長週期中產生的污染物儲存在儲存區內的空間中,無需開反應腔作清潔處理,也無需如前述習知技術所示的,採用機械結構頻繁運動刮擦或者穿過水平開口31(第1圖)來保證開口不會被堵塞。As shown in Fig. 4, the present invention proposes a chemical vapor deposition apparatus. The basic structure of the reactor is substantially the same as that of the prior art shown in Fig. 1. The main improvement is the row between the side wall of the base and the side wall of the reaction chamber. Gas area (dashed box A in the figure). The lower exhaust region of the present invention includes a drum-type partitioning plate 139 that divides the exhaust region into an inner exhaust chamber 134 and a storage chamber 138 disposed around the periphery of the exhaust chamber for storing deposits. The exhaust chamber further includes an annular top cover 135, the inner side of the top cover 135 is fixed to the outer side surface of the base side wall 16, and one or more openings 137 are arranged as a row between the lower surface of the top cover 135 and the partition plate 139. The port is such that the reaction gas enters the exhaust chamber 134 along the exhaust path shown in Fig. 18 and is withdrawn by the pumping device 136, while the small particulate contaminants formed in the reaction are also withdrawn as the air stream. The large piece of sediment falling off the upper liner 62 will fall vertically into the lower storage area (or storage chamber 138) due to gravity during the downward fall without entering the exhaust through the opening 137 laterally. The cavity or directly blocks the opening 137. As long as the space of the storage area (or the storage chamber 138) is large enough, a plurality of (eg, more than 100) crystal growth cycles can be stored in the space in the storage area without opening the reaction chamber for cleaning. It is also not necessary to use a mechanical structure to frequently scrape or pass through the horizontal opening 31 (Fig. 1) as shown in the prior art to ensure that the opening is not blocked.

本發明化學氣相沉積裝置結構中只有頂蓋135上表面和隔離板139外側表面會逐漸積累沉積物,長期運行過程中,這些沉積物大量積累仍會向開口137部分擴展,影響氣流分佈,所以仍需要間隔一段時間後清潔一次。但是由於主要的大塊的沉積物都會掉落儲存腔,所以這個清潔頻率可以很低就能保證氣流穩定均勻,比如完成一個生長週期,在將基片傳輸出反應腔時進行一次。In the structure of the chemical vapor deposition apparatus of the present invention, only the upper surface of the top cover 135 and the outer surface of the partition plate 139 gradually accumulate deposits. During long-term operation, a large amount of these deposits will still partially expand toward the opening 137, affecting the airflow distribution, so It still needs to be cleaned once after a while. However, since the main bulk deposits will fall into the storage chamber, this cleaning frequency can be low to ensure a stable and uniform airflow, such as completing a growth cycle, once when the substrate is transported out of the reaction chamber.

第4圖中內襯62下端包括一個向下延伸的連桿166,連桿一端固定到內襯62,另一端連接到一個刮擦部件168。連桿166的形狀和結構設計使得刮擦部件緊貼在開口137上端的頂蓋135外側壁。The lower end of the inner liner 62 in Fig. 4 includes a downwardly extending link 166 which is secured to the inner liner 62 at one end and to a scraping member 168 at the other end. The shape and configuration of the link 166 is such that the wiper member abuts against the outer sidewall of the top cover 135 at the upper end of the opening 137.

如第5a和5b圖為第4圖中A處虛線框內排氣區域結構的局部放大圖,其中第5a圖所示為在晶體生長過程中內襯62處於較高位置時的狀態;第5b圖所示為完成一次晶體生長過程開啟反應腔側壁上的門,將托盤傳輸出反應腔時,內襯被降下一定高度,此時刮擦部件隨內襯向下運動,移動到了開口下端的隔離板139的外側壁。在每個晶體生長過程週期中,刮擦部件在開口137上下兩端往復運動一次以保證開口137的暢通。5a and 5b are partial enlarged views of the structure of the exhaust region in the dotted line frame at A in Fig. 4, wherein Fig. 5a shows the state when the liner 62 is at a higher position during crystal growth; The figure shows that after completing a crystal growth process, the door on the side wall of the reaction chamber is opened. When the tray is transported out of the reaction chamber, the lining is lowered to a certain height. At this time, the scraping member moves downward with the lining and moves to the lower end of the opening. The outer side wall of the plate 139. During each crystal growth process cycle, the scraping members reciprocate once at the upper and lower ends of the opening 137 to ensure the smoothness of the opening 137.

如第5a及5b圖所述的實施例由於在晶體生長過程中連桿166和刮擦結構位於排氣路徑18上,所以會對氣流造成影響,本發明提出第6a和6b圖所示的另一實施例的排氣區域結構放大圖。其中第6a圖為晶體生長過程中的圖示,其中內襯62下端固定有一個連桿266,連桿向下延伸的下端連接到一個杠桿的第一端265,杠桿包括支點267和第二端269,第二端269連接到刮擦部件268。同樣地,如第6b圖所示,在完成一次晶體生長週期後,內襯62被降下,連桿266向下運動驅動杠桿第一端265向下,同時杠桿第二端帶動刮擦部件268向上到達開口137的上端。這樣採用杠桿結構也能實現對開口137的清潔,刮除表面附著的污染物。其中杠桿支點267可以固定到反應腔100的側壁或者隔離板139或者反應腔內任何其它固定的部件上。杠桿支點位置不低於開口137的位置時,可以保證杠桿向下運動過程中不會與下方儲存腔138內積累的大量沉積物觸碰甚至被頂住,影響刮擦部件268的運動軌跡。The embodiment as illustrated in Figures 5a and 5b has an effect on the air flow due to the fact that the link 166 and the scraping structure are located on the exhaust path 18 during crystal growth, and the present invention proposes the other as shown in Figures 6a and 6b. An enlarged view of the structure of the exhaust region of an embodiment. Wherein Figure 6a is an illustration of a crystal growth process in which a lower end of the inner liner 62 is secured with a link 266, the lower end of which extends downwardly coupled to a first end 265 of a lever, the lever including a fulcrum 267 and a second end 269, the second end 269 is coupled to the scraping member 268. Similarly, as shown in FIG. 6b, after completing a crystal growth cycle, the liner 62 is lowered, and the link 266 moves downward to drive the first end 265 of the lever downward, while the second end of the lever drives the scraping member 268 upward. The upper end of the opening 137 is reached. Thus, the use of the lever structure can also clean the opening 137 and scrape off the contaminants adhering to the surface. Wherein the lever fulcrum 267 can be secured to the side wall of the reaction chamber 100 or to the spacer 139 or any other fixed component within the reaction chamber. When the position of the lever fulcrum is not lower than the position of the opening 137, it can be ensured that the lever does not touch or even be caught by a large amount of deposit accumulated in the lower storage chamber 138 during the downward movement, which affects the movement trajectory of the scraping member 268.

在如第6a及6b圖所述的實施例中,由於在晶體生長過程中連桿266和杠桿位於排氣路徑18上,所以也會對氣流造成影響,本發明提出第7a和7b圖所示的另一實施例的排氣區域結構放大圖。其中第7a圖為晶體生長過程中的圖示,其中內襯62下端固定有一個連桿366,連桿向下延伸的下端連接到一個杠桿的第一端365,杠桿包括支點367和第二端361,第二端361連接到一個頂舉桿369,頂舉桿369頂部固定有刮擦部件368,其底部連接到一個下拉部件360,下拉部件360可以是重錘或者彈簧、氣體彈簧等提供向下的拉力的物件。同樣地,如第7 b圖所示,在完成一次晶體生長週期後,內襯62被降下,連桿366向下運動驅動杠桿第一端365向下,同時杠桿第二端帶動頂舉桿369和固定在頂舉桿369上端的刮擦部件368到達開口137的上端。這樣採用杠桿結構也能實現對開口137的清潔,刮除表面附著的污染物。其中杠桿的高度在第一開口137的下端以下,所以在晶體生長過程中不會對氣流造成影響。In the embodiment as described in Figures 6a and 6b, since the link 266 and the lever are located on the exhaust path 18 during crystal growth, the air flow is also affected, and the present invention proposes the Figs. 7a and 7b. An enlarged view of the structure of the exhaust region of another embodiment. 7a is a diagram during crystal growth, wherein a lower end of the inner liner 62 is fixed with a link 366, and a lower end of the connecting rod is connected to a first end 365 of a lever, the lever including a fulcrum 367 and a second end 361, the second end 361 is connected to a jacking rod 369, the top of the jacking rod 369 is fixed with a scraping member 368, the bottom portion of which is connected to a pull-down member 360, which may be a weight or a spring, a gas spring, etc. Under the tension of the object. Similarly, as shown in FIG. 7b, after completing a crystal growth cycle, the inner liner 62 is lowered, and the link 366 moves downward to drive the first end 365 of the lever downward, while the second end of the lever drives the jacking rod 369. A scraping member 368 fixed to the upper end of the jacking rod 369 reaches the upper end of the opening 137. Thus, the use of the lever structure can also clean the opening 137 and scrape off the contaminants adhering to the surface. Wherein the height of the lever is below the lower end of the first opening 137, so that the airflow is not affected during crystal growth.

為了防止杠桿和頂舉桿等機械裝置被埋入沉積的污染物中,本發明更可以進一步的修改為如第8圖所示的另一實施例。如第8圖所示可知,儲存腔中設置水平的分隔板470,將儲存腔138分隔為上下兩個子腔,上方的子腔仍然用於儲存污染物,下方的子腔140用於放置杠桿,只有連桿466垂直地穿過分隔板470上對應位置的小孔,在兩個子腔之間上下運動。其它杠桿部件中的460、461、467、465與實施例中的對應編號360、361、367、365的部件/部位具有相同的屬性。由於連桿466是垂直運動的,每完成一次晶體生長週期都會往復運動一次,所以能夠保證這兩個桿不會被長期積累的沉積物卡住。橫向設置的杠桿由於被放置在了下方子腔140中,所以不會有大量的沉積物穿過分隔板470上的小孔進入下方子腔形成堆積,也就不會使得杠桿運動受到堆積物高度的影響。這樣的結構能夠使得刮擦部件468可以清潔隔離板139位於排氣腔134內側的表面。本發明的杠桿可以包括多根頂舉桿469,同時頂舉多個刮擦部件上下運動,同時清潔開口137位於隔離板139兩側的沉積物。In order to prevent mechanical means such as a lever and a jacking rod from being buried in the deposited contaminants, the present invention can be further modified to another embodiment as shown in Fig. 8. As shown in FIG. 8, a horizontal partition plate 470 is disposed in the storage chamber to divide the storage chamber 138 into upper and lower sub-chambers, the upper sub-chamber is still used for storing pollutants, and the lower sub-chamber 140 is used for placing. The lever, only the link 466 vertically passes through the corresponding hole in the partition plate 470, moves up and down between the two sub-chambers. 460, 461, 467, 465 of the other lever members have the same properties as the parts/portions of the corresponding numbers 360, 361, 367, 365 in the embodiment. Since the link 466 is vertically movable, it reciprocates once every time the crystal growth cycle is completed, so that it is ensured that the two rods are not caught by the deposit accumulated for a long period of time. Since the laterally disposed lever is placed in the lower sub-cavity 140, a large amount of deposit does not pass through the small hole in the partition plate 470 into the lower sub-cavity to form a pile, so that the lever movement is not affected by the height of the deposit. Impact. Such a configuration enables the scraping member 468 to clean the surface of the partition plate 139 located inside the exhaust chamber 134. The lever of the present invention may include a plurality of jacking rods 469 while lifting a plurality of scraping members up and down while cleaning the deposits 137 on the sides of the partitioning plate 139.

進一步地,當隔離板139厚度足夠,板中包括容納刮擦部或者頂舉桿上下運動的空間時,頂舉桿369更可以設置於隔離板139內,並作上下運動帶動開口137內的刮擦部件在開口上下兩端之間運動。Further, when the thickness of the partitioning plate 139 is sufficient, and the panel includes a space for accommodating the scraping portion or the jacking rod to move up and down, the jacking rod 369 can be disposed in the partitioning plate 139, and the upper and lower movements can drive the scraping in the opening 137. The wiper member moves between the upper and lower ends of the opening.

本發明的刮擦部件除了可以是上下方向運動以藉由刮擦將積累在開口137上的沉積物去除外,刮擦部件也可以藉由其它方向的動作方式實現本發明清潔目的。如第10圖所示為本發明另一實施例,圖中所示為隔離板139的側視圖,圖中與前述實施例的主要區別在於一個旋轉環566設置在隔離板139的外壁,旋轉環上包括多個向上延伸部567,延伸部上端為刮擦部568,多個刮擦部568位於不同的開口137之間。當驅動裝置驅動旋轉環566圍繞隔離板139作圓周方向運動時,多個刮擦部件568會分別掃過一個或多個開口137,最終停止在開口137之間的位置以免影響氣流。前述實施例中的刮擦和驅動裝置設置在氣流通道以下,這樣可以避免影響晶體沉積過程中的氣流分佈。The wiping member of the present invention can be moved in the up and down direction to remove deposits accumulated on the opening 137 by scratching, and the wiping member can also achieve the cleaning purpose of the present invention by means of other directions of action. Another embodiment of the present invention is shown in Fig. 10, which is a side view of the spacer 139. The main difference from the foregoing embodiment is that a rotating ring 566 is disposed on the outer wall of the spacer 139, and the rotating ring. The upper portion includes a plurality of upwardly extending portions 567, the upper end of the extending portion is a scraping portion 568, and the plurality of scraping portions 568 are located between the different openings 137. When the drive unit drives the rotating ring 566 to move circumferentially about the spacer 139, the plurality of scraping members 568 will sweep through the one or more openings 137, respectively, and eventually stop at a position between the openings 137 to avoid affecting the air flow. The wiping and driving means in the foregoing embodiments are disposed below the air flow path so as to avoid affecting the air flow distribution during crystal deposition.

本發明中的儲存區域(或儲存腔138)也可以是設置在靠近基座側壁16,排氣腔134設置在靠近反應腔100的側壁位置,形成排氣腔圍繞儲存區域的結構。此時排氣腔的頂蓋135的形狀需要作相應的修正,其傾斜方向與前述實施例的方向相反,呈從外側向內側基座方向傾斜向下的形狀。這樣的結構仍能實現本發明目的,也是屬同一發明構思。The storage area (or storage chamber 138) in the present invention may also be disposed adjacent to the base side wall 16, and the exhaust chamber 134 is disposed adjacent to the side wall of the reaction chamber 100 to form a structure in which the exhaust chamber surrounds the storage area. At this time, the shape of the top cover 135 of the exhaust chamber needs to be corrected accordingly, and the inclination direction thereof is opposite to the direction of the foregoing embodiment, and is inclined downward from the outer side toward the inner base direction. Such a structure can still achieve the object of the present invention and is also the same inventive concept.

本發明所述的刮擦部件除了如第5至8圖所示的可以是垂直延伸整塊的鋼片以外,也可以包括橫向延展部,在刮擦部件經過開口137時橫向性延展部可以伸入開口137中,這樣可以同時清潔開口137內部和開口外側表面。如第9a及9b圖所示為本發明另一實施例,其結構與內部元件編號與第7a及7b圖所示的實施例基本相同,主要的區別在於刮擦部件包括刮擦板668與橫向延伸的延伸部669。第9a圖所示為刮擦部件位於開口下方與隔離板139接觸時,延展部669位於開口底部;第9b圖所示為刮擦部件經過開口位置時延展部669向內延伸穿入開口內部,實現對開口內的清潔。延展部669可以是任何形狀的機械結構,不限於第9a及 9b圖所示的形狀,只要能在經過開口時能伸入開口空間即能實現本發明目的。The scraping member of the present invention may include a laterally extending portion in addition to the steel sheet which may be vertically extending as shown in Figures 5 to 8, and the laterally extending portion may extend when the scraping member passes through the opening 137. Into the opening 137, it is possible to simultaneously clean the inside of the opening 137 and the outside surface of the opening. Another embodiment of the present invention is shown in Figures 9a and 9b, the structure and internal component number being substantially the same as those shown in Figures 7a and 7b, the main difference being that the scraping member comprises a wiping plate 668 and a lateral direction. Extended extension 669. Figure 9a shows the extension 669 at the bottom of the opening when the scraping member is in contact with the spacer 139 under the opening, and the extension 669 extends inwardly into the opening when the scraping member passes the opening position, as shown in Fig. 9b. Achieve cleanliness within the opening. The extension portion 669 may be a mechanical structure of any shape, and is not limited to the shape shown in Figs. 9a and 9b, and the object of the present invention can be achieved as long as it can protrude into the open space when passing through the opening.

本發明多個實施例中的儲存區域(或儲存腔138)內進一步可以設置一個防止污染物小顆粒向上反流的防沉積物反流裝置。如第5a及5b圖所示,圖中141即是防沉積物反流裝置。該防沉積物反流裝置141可以是一塊或多塊一端固定到隔離板或者反應腔內壁,另一端向下傾斜一定角度的板。在化學氣相沉積裝置運行過程中,從上方掉落的大塊沉積物的部分會掉落到防沉積物反流裝置上,並向下滑落到下方的儲存空間中,同時防沉積物反流裝置下方的大部分飛起的顆粒會被防沉積物反流裝置擋住,無法向上擴散,避免造成二次污染。防沉積物反流裝置141可以焊接固定在儲存區域(或儲存腔138)內,也可以可拆卸地固定於儲存區域(或儲存腔138)內。Further, in the storage region (or storage chamber 138) in various embodiments of the present invention, an anti-sediment reflux device for preventing small particles of contaminants from flowing upward may be disposed. As shown in Figures 5a and 5b, 141 is an anti-sediment reflux device. The anti-sediment reflux device 141 may be one or more plates that are fixed at one end to the partition or the inner wall of the reaction chamber, and the other end is inclined downward by a certain angle. During the operation of the chemical vapor deposition apparatus, part of the large sediment falling from above will fall onto the anti-sediment reflux device and slide down into the storage space below, while anti-sediment reflux Most of the flying particles below the device will be blocked by the anti-sediment reflow device and will not spread upwards to avoid secondary pollution. The anti-sediment reflux device 141 may be soldered to the storage area (or storage chamber 138) or may be detachably secured within the storage area (or storage chamber 138).

本發明中,刮擦部件168、268、368除了可以由內襯帶動上下運動,也可以是由其它機械驅動裝置如氣缸或電機來驅動,這些驅動機構都能實現本發明目的。採用其它機械驅動裝置時,可以不用等待晶體生長階段結束後使內襯下降,一旦發現開口137發生堵塞,就可以直接驅動刮擦部件清除沉積物,具有更好的靈活性。In the present invention, the scraping members 168, 268, 368 can be driven by the inner lining up and down, or by other mechanical driving means such as a cylinder or a motor, and these driving mechanisms can achieve the object of the present invention. When other mechanical driving devices are used, the inner liner can be lowered without waiting for the end of the crystal growth stage. Once the opening 137 is found to be clogged, the scraping member can be directly driven to remove the deposit, which has better flexibility.

本發明隔離排氣空間的隔離板或隔離裝置除了如第5及6圖所示垂直分隔排氣腔和儲存區域外,也可以是傾斜的,傾斜可以是向內傾斜,也可以是向外側傾斜,只要能保證隔離板139上的開口不會落入或者積累大片沉積物造成堵塞,就能實現本發明目的。The isolating plate or the isolating device for isolating the exhaust space of the present invention may be inclined except that the exhaust chamber and the storage region are vertically separated as shown in FIGS. 5 and 6, and the tilt may be inclined inward or inclined outward. The object of the present invention can be achieved as long as it can be ensured that the opening on the partitioning plate 139 does not fall into or accumulate large deposits causing clogging.

作為一種實施方式,第圖11a及11b圖分別顯示了本發明的排氣裝置或隔離裝置的前視圖及剖面圖。排氣裝置或隔離裝置大體呈一圓筒形結構,其包括頂蓋735、隔離裝置側壁739、排氣腔734及排氣口737。排氣腔734與排氣泵(未圖示)相連接。排氣口737位於頂蓋735下方,其開口朝向為非豎直方向(例如,沿水平方向)。As an embodiment, Figures 11a and 11b show front and cross-sectional views, respectively, of an exhaust or isolation device of the present invention. The venting or isolating device is generally cylindrical in shape and includes a top cover 735, an isolating device side wall 739, an exhaust chamber 734, and an exhaust port 737. The exhaust chamber 734 is connected to an exhaust pump (not shown). The exhaust port 737 is located below the top cover 735 with its opening oriented in a non-vertical direction (eg, in a horizontal direction).

本發明藉由隔離裝置實現對排氣區域的垂直分隔,形成排氣腔和儲存區域,大量沉積物落直接落入儲存區域,氣體通過隔離裝置的側壁開口橫向流入排氣腔,這樣的設計可以確保開口不會被大片沉積物堵塞,這樣可以在很長的沉積反應時間內不會發生堵塞,而且經過優化的清潔裝置設計可以在晶體生長過程中不會影響反應氣體分佈。The invention realizes the vertical separation of the exhaust region by the isolating device, forms the exhaust cavity and the storage region, a large amount of deposit falls directly into the storage region, and the gas flows into the exhaust cavity laterally through the sidewall opening of the isolating device, such a design can Make sure that the opening is not blocked by large deposits, so that it can be blocked during long deposition times, and the optimized cleaning device design does not affect the reaction gas distribution during crystal growth.

雖然本發明披露如上,但本發明並非限定於此。任何本領域具通常知識者,在不脫離本發明的精神和範圍內,均可作各種更動與修改,因此本發明的保護範圍應當以申請專利範圍所限定的範圍為准。Although the present invention has been disclosed above, the present invention is not limited thereto. Any changes and modifications may be made without departing from the spirit and scope of the invention, and the scope of the invention should be determined by the scope defined by the scope of the claims.

100‧‧‧反應腔
12‧‧‧加熱器
134、734‧‧‧排氣腔
135‧‧‧頂蓋
136、36‧‧‧抽氣裝置
137、31‧‧‧開口
138‧‧‧儲存腔
139‧‧‧隔離板
139a、739‧‧‧隔離裝置側壁
14‧‧‧托盤
141‧‧‧防沉積物反流裝置
15‧‧‧基片
16‧‧‧基座側壁
166‧‧‧連桿
168、268、368、468‧‧‧刮擦部件
18‧‧‧排氣路徑
21‧‧‧氣體噴淋頭
24‧‧‧旋轉軸
265、365、465‧‧‧第一端
266、366、466‧‧‧連桿
267、367、467‧‧‧支點
269、361、461‧‧‧第二端
30‧‧‧擋氣板
34‧‧‧排氣區域
360、460‧‧‧下拉部件
369、469‧‧‧頂舉桿
41‧‧‧第一反應氣源
42‧‧‧第二反應氣源
43‧‧‧第一氣體管路
44‧‧‧第二氣體管路
50‧‧‧冷卻液源
51‧‧‧冷卻液供應管道
566‧‧‧旋轉環
567‧‧‧上延伸部
568‧‧‧刮擦部
62‧‧‧內襯
62a‧‧‧底端面
64‧‧‧升降驅動機構
668‧‧‧刮擦板
669‧‧‧延伸部
735‧‧‧頂蓋
737‧‧‧排氣口
L1‧‧‧開口起始線
L2‧‧‧開口結束線
100‧‧‧reaction chamber
12‧‧‧heater
134, 734‧‧ ‧ exhaust chamber
135‧‧‧Top cover
136, 36‧‧‧ evacuation device
137, 31‧‧‧ openings
138‧‧‧ Storage chamber
139‧‧‧Isolation board
139a, 739‧‧‧Isolation device side walls
14‧‧‧Tray
141‧‧‧Anti-sediment reflux device
15‧‧‧Substrate
16‧‧‧Base wall
166‧‧‧ linkage
168, 268, 368, 468‧‧‧ scraping parts
18‧‧‧Exhaust path
21‧‧‧ gas sprinkler
24‧‧‧Rotary axis
265, 365, 465‧‧‧ first end
266, 366, 466‧‧‧ linkage
267, 367, 467‧‧ fulcrum
269, 361, 461‧‧‧ second end
30‧‧‧ gas shield
34‧‧‧Exhaust area
360, 460‧‧‧ drop-down parts
369, 469‧‧‧ jacking pole
41‧‧‧First reaction gas source
42‧‧‧Second reaction gas source
43‧‧‧First gas line
44‧‧‧Second gas pipeline
50‧‧‧ Coolant source
51‧‧‧Cool supply pipeline
566‧‧‧Rotating ring
567‧‧‧Upper extension
568‧‧‧Scratch
62‧‧‧ lining
62a‧‧‧ bottom end
64‧‧‧ Lifting drive mechanism
668‧‧‧Scratch board
669‧‧‧Extension
735‧‧‧Top cover
737‧‧ vent
L1‧‧‧ opening starting line
L2‧‧‧ opening end line

第1圖是習知技術化學氣相沉積裝置整體結構示意圖。 第2圖是本發明化學氣相沉積裝置的實施例結構示意圖。 第3圖是第2圖化學氣相沉積裝置的另一狀態示意圖。 第4圖是本發明另一化學氣相沉積裝置的實施例結構示意圖。 第5a及5b圖是本發明一實施例排氣區域放大示意圖。 第6a及6b圖是本發明一實施例排氣區域放大示意圖。 第7a及7b圖是本發明一實施例排氣區域放大示意圖。 第8圖是本發明另一實施例的排氣區域放大示意圖。 第9a及9b圖是本發明另一實施例的排氣區域放大示意圖。 第10圖是本發明另一實施例隔離裝置的側視圖。 第11a及11b圖是本發明所示的排氣裝置或隔離裝置的示意圖。Fig. 1 is a schematic view showing the overall structure of a conventional chemical vapor deposition apparatus. Fig. 2 is a schematic view showing the structure of an embodiment of the chemical vapor deposition apparatus of the present invention. Fig. 3 is a view showing another state of the chemical vapor deposition apparatus of Fig. 2. Fig. 4 is a schematic view showing the structure of another embodiment of the chemical vapor deposition apparatus of the present invention. 5a and 5b are enlarged views of an exhaust region according to an embodiment of the present invention. 6a and 6b are enlarged views of an exhaust region according to an embodiment of the present invention. 7a and 7b are enlarged views of an exhaust region according to an embodiment of the present invention. Fig. 8 is an enlarged schematic view showing an exhaust region of another embodiment of the present invention. 9a and 9b are enlarged schematic views of an exhaust region according to another embodiment of the present invention. Figure 10 is a side elevational view of an isolation device in accordance with another embodiment of the present invention. Figures 11a and 11b are schematic views of the exhaust or isolation device of the present invention.

100‧‧‧反應腔 100‧‧‧reaction chamber

12‧‧‧加熱器 12‧‧‧heater

134‧‧‧排氣腔 134‧‧‧Exhaust chamber

135‧‧‧頂蓋 135‧‧‧Top cover

136‧‧‧抽氣裝置 136‧‧‧Exhaust device

137‧‧‧開口 137‧‧‧ openings

138‧‧‧儲存腔 138‧‧‧ Storage chamber

139‧‧‧隔離板 139‧‧‧Isolation board

14‧‧‧托盤 14‧‧‧Tray

15‧‧‧基片 15‧‧‧Substrate

16‧‧‧基座側壁 16‧‧‧Base wall

166‧‧‧連桿 166‧‧‧ linkage

168‧‧‧刮擦部件 168‧‧‧Scratch parts

18‧‧‧排氣路徑 18‧‧‧Exhaust path

21‧‧‧氣體噴淋頭 21‧‧‧ gas sprinkler

24‧‧‧旋轉軸 24‧‧‧Rotary axis

41‧‧‧第一反應氣源 41‧‧‧First reaction gas source

42‧‧‧第二反應氣源 42‧‧‧Second reaction gas source

43‧‧‧第一氣體管路 43‧‧‧First gas line

44‧‧‧第二氣體管路 44‧‧‧Second gas pipeline

50‧‧‧冷卻液源 50‧‧‧ Coolant source

51‧‧‧冷卻液供應管道 51‧‧‧Cool supply pipeline

62‧‧‧內襯 62‧‧‧ lining

64‧‧‧升降驅動機構 64‧‧‧ Lifting drive mechanism

Claims (30)

一種化學氣相沉積裝置,其包括: 反應腔,包括一反應腔側壁; 基座,位於該反應腔內,該基座包括基座側壁,該基座側壁和該反應腔側壁之間包括一排氣區域;以及 隔離裝置,將該排氣區域分隔為圍繞該基座側壁呈內外排布的一排氣腔和一儲存腔,該儲存腔與該基座上方的反應區域聯通,該隔離裝置包括一隔離裝置側壁,該隔離裝置側壁上開設有複數個排氣口,藉由該排氣口使該排氣腔和該儲存腔之間聯通; 其中,該排氣口用於允許該反應腔製程處理過程中的反應氣體和副產物進入該排氣腔,該排氣腔用於將反應氣體和副產物排出至該反應腔外,該儲存腔用於容納收集製程處理過程中的顆粒狀或片狀沉積物。A chemical vapor deposition apparatus comprising: a reaction chamber including a reaction chamber sidewall; a susceptor located in the reaction chamber, the pedestal including a pedestal sidewall, the pedestal sidewall and the reaction chamber sidewall including a row a gas region; and an isolating device that divides the exhaust region into an exhaust chamber and a storage chamber disposed inside and outside the side wall of the base, the storage chamber being in communication with a reaction area above the base, the isolation device including a side wall of the isolating device, a plurality of exhaust ports are opened on the side wall of the isolating device, and the exhaust port is connected to the storage cavity through the exhaust port; wherein the exhaust port is used to allow the process of the reaction chamber The reaction gas and by-products in the process enter the exhaust chamber for discharging the reaction gas and by-products to the outside of the reaction chamber for accommodating the granular or sheet during the collection process Sediment. 如申請專利範圍第1項所述之裝置,其中該排氣腔位於該隔離裝置側壁的內側,並圍繞該基座側壁的外側而設置,該儲存腔位於該隔離裝置側壁的外側,並圍繞該排氣腔的外側而設置。The device of claim 1, wherein the exhaust chamber is located inside the side wall of the spacer and is disposed around an outer side of the side wall of the base, the storage chamber being located outside the side wall of the spacer and surrounding the It is provided outside the exhaust chamber. 如申請專利範圍第1項所述之裝置,其中該複數個排氣口的開口朝向為非豎直方向,以避免在製程處理過程中該顆粒狀或片狀沉積物沿豎直方向直接落入並堵塞該排氣口。The device of claim 1, wherein the opening of the plurality of exhaust ports is oriented in a non-vertical direction to prevent the granular or sheet-like deposit from falling directly in the vertical direction during the processing process. And block the exhaust port. 如申請專利範圍第3項所述之裝置,其中該複數個排氣口的開口朝向為水平方向或為與水平方向呈一小於90度角的傾斜方向。The device of claim 3, wherein the opening of the plurality of exhaust ports is oriented in a horizontal direction or an oblique direction that is less than 90 degrees from the horizontal direction. 如申請專利範圍第1項所述之裝置,其中該隔離裝置更包括位於頂部的頂蓋,該頂蓋位於該排氣腔上方,用以防止沉積物落入排氣腔。The device of claim 1, wherein the isolating device further comprises a top cover at the top, the top cover being located above the exhaust chamber to prevent deposits from falling into the exhaust chamber. 如申請專利範圍第5項所述之裝置,其中該複數個排氣口位於該頂蓋的下方,該頂蓋在上方為該複數個排氣口提供遮擋,以防止該顆粒狀或片狀沉積物沿豎直方向直接落入該複數個排氣口。The device of claim 5, wherein the plurality of exhaust ports are located below the top cover, the top cover provides shielding for the plurality of exhaust ports above to prevent the granular or sheet-like deposition The object falls directly into the plurality of exhaust ports in a vertical direction. 如申請專利範圍第1項所述之裝置,其中該反應腔內更包括一可升降內襯,其圍繞該基座上方的反應區域而設置,並可沿該反應腔側壁上下移動,該可升降內襯包括一底端面。The device of claim 1, wherein the reaction chamber further comprises a liftable inner liner disposed around the reaction area above the base and movable up and down along the side wall of the reaction chamber, the liftable The inner liner includes a bottom end face. 如申請專利範圍第7項所述之裝置,其中該排氣口具有位於上方的開口起始線與位於下方的開口結束線,當該可升降內襯移動至其下方位置時,該可升降內襯的底端面越過該開口起始線,並停止於該開口起始線下方的一位置。The device of claim 7, wherein the exhaust port has an opening start line located above and an opening end line located below, and when the liftable inner liner moves to a lower position thereof, the liftable inner portion The bottom end of the liner passes over the opening line of the opening and stops at a position below the starting line of the opening. 如申請專利範圍第8項所述之裝置,其中當該可升降內襯移動至其下方位置時,該可升降內襯的底端面越過該開口結束線,並停止於該開口結束線下方的一位置,在此位置下,該底端面下壓儲存於該儲存腔內的沉積物。The device of claim 8, wherein when the liftable lining is moved to a lower position thereof, a bottom end surface of the liftable lining passes over the opening end line and stops at a lower end of the opening end line. Position, in which the bottom end presses down deposits stored in the storage chamber. 如申請專利範圍第7項所述之裝置,其中該隔離裝置更包括位於該排氣腔上方的頂蓋,該頂蓋具有傾斜的上表面,且形狀與該可升降內襯的內表面相匹配,當該可升降內襯上下行動時,該內表面不與該上表面碰撞。The device of claim 7, wherein the isolating device further comprises a top cover over the exhaust chamber, the top cover having an inclined upper surface and having a shape matching the inner surface of the liftable inner liner When the liftable lining moves up and down, the inner surface does not collide with the upper surface. 如申請專利範圍第1項所述之裝置,其中該儲存腔包括至少一個防沉積物反流裝置,該防沉積物反流裝置包括向下傾斜的板。The device of claim 1, wherein the storage chamber comprises at least one anti-sediment reflux device, the anti-sediment reflux device comprising a downwardly inclined plate. 如申請專利範圍第7項所述之裝置,其中該可升降內襯上連接有至少一個刮擦部件,其可以在所述排氣口附近移動。The device of claim 7, wherein the liftable lining is coupled to at least one scraping member that is movable adjacent the exhaust port. 如申請專利範圍第1項所述之裝置,其中圍繞該隔離裝置外側壁設置有一旋轉環,該旋轉環上設置有多個向上延伸部,該延伸部上端設置有刮擦部,該旋轉環可圍繞該隔離裝置外側壁旋轉,以帶動該刮擦部在不同的開口之間刮擦。The device of claim 1, wherein a rotating ring is disposed around the outer side wall of the separating device, and the rotating ring is provided with a plurality of upward extending portions, and the upper end of the extending portion is provided with a scraping portion, and the rotating ring can be provided. Rotating around the outer side wall of the isolating device to drive the scraping portion to scrape between different openings. 一種如申請專利範圍第1至13中之任一項所述之化學氣相沉積裝置的製程處理方法,其包括: 向該反應腔輸入反應氣體,以在該基座上進行化學氣相沉積,在製程處理的過程中,從反應區域的反應氣體和副反應產物經由該排氣口沿著非豎直路徑進入至該排氣腔,再被排出至該反應腔外,該顆粒狀或片狀沉積物沿豎直方向直接落入並被收集於該儲存腔內。A process processing method for a chemical vapor deposition apparatus according to any one of claims 1 to 13, comprising: inputting a reaction gas to the reaction chamber to perform chemical vapor deposition on the susceptor, During the processing of the process, the reaction gas and the side reaction product from the reaction zone enter the exhaust chamber along the non-vertical path via the exhaust port, and are discharged to the outside of the reaction chamber, the granular or sheet-like The deposit falls directly into the vertical direction and is collected in the storage chamber. 一種化學氣相沉積裝置,其包括: 反應腔,包括一反應腔側壁; 基座,位於該反應腔內,該基座包括基座側壁,該基座側壁和該反應腔側壁之間包括一排氣區域;以及 隔離裝置,將該排氣區域分隔為圍繞該基座側壁呈內外排布的一排氣腔和一儲存腔,該儲存腔與該基座上方的反應區域聯通,該隔離裝置包括一隔離裝置側壁,該隔離裝置側壁上開設有複數個排氣口,藉由該排氣口使該排氣腔和該儲存腔之間聯通; 其中,該排氣區域更包括至少一個可移動的刮擦部件,其可以在該排氣口附近移動。A chemical vapor deposition apparatus comprising: a reaction chamber including a reaction chamber sidewall; a susceptor located in the reaction chamber, the pedestal including a pedestal sidewall, the pedestal sidewall and the reaction chamber sidewall including a row a gas region; and an isolating device that divides the exhaust region into an exhaust chamber and a storage chamber disposed inside and outside the side wall of the base, the storage chamber being in communication with a reaction area above the base, the isolation device including a side wall of the isolating device, a plurality of exhaust ports are defined in the side wall of the isolating device, and the exhaust port is connected to the storage cavity by the exhaust port; wherein the exhausting region further comprises at least one movable A scraping member that is movable near the exhaust port. 如申請專利範圍第15項所述之裝置,其中該排氣腔位於靠近該隔離裝置側壁的內側,該儲存腔圍繞該排氣腔位於外側。The device of claim 15, wherein the exhaust chamber is located adjacent to an inner side of the side wall of the isolator, the storage chamber being located outside the exhaust chamber. 如申請專利範圍第15項所述之裝置,其中該隔離裝置包括位於頂部的頂蓋,該頂蓋位於該排氣腔上方,用以防止沉積物落入該排氣腔。The device of claim 15, wherein the isolating device comprises a top cover at the top, the top cover being located above the exhaust chamber to prevent deposits from falling into the exhaust chamber. 如申請專利範圍第15項所述之裝置,其中該反應腔內更包括一可升降內襯,其圍繞該基座上方的反應區域而設置,並可沿該反應腔側壁上下移動。The apparatus of claim 15 wherein the reaction chamber further comprises a liftable inner liner disposed around the reaction zone above the base and movable up and down along the sidewall of the reaction chamber. 如申請專利範圍第17項所述之裝置,其中該頂蓋具有傾斜的上表面,且形狀與位於該反應腔內的一可升降內襯的內表面相匹配。The device of claim 17, wherein the top cover has a sloped upper surface and is shaped to match an inner surface of a liftable liner located within the reaction chamber. 如申請專利範圍第18項所述之裝置,其中該刮擦部件藉由一個連桿連接到該可升降內襯,該可升降內襯在上下移動時驅動該刮擦部件在該排氣口的上端和下端之間移動。The device of claim 18, wherein the scraping member is coupled to the liftable lining by a connecting rod that drives the scraping member at the exhaust port when moving up and down Move between the upper end and the lower end. 如申請專利範圍第18項所述之裝置,其中該排氣區域更包括一個杠桿,該刮擦部件連接到該杠桿的第一端,該杠桿的第二端藉由一個連桿連接到該可升降內襯。The device of claim 18, wherein the venting region further comprises a lever, the scraping member is coupled to the first end of the lever, and the second end of the lever is coupled to the second end by a link Lifting the lining. 如申請專利範圍第21項所述之裝置,其中該杠桿的第一端藉由一根頂舉桿抬升該刮擦部件,且該杠桿支點低於該排氣口下端。The device of claim 21, wherein the first end of the lever lifts the scraping member by a jacking rod, and the lever pivot point is lower than the lower end of the exhaust port. 如申請專利範圍第22項所述之裝置,其中該儲存腔底部更包括一個分隔板,該杠桿位於該分隔板下方。The device of claim 22, wherein the bottom of the storage chamber further comprises a partition plate, the lever being located below the partition plate. 如申請專利範圍第23項所述之裝置,其中該頂舉桿沿著該隔離裝置的側壁內側上下移動,該刮擦部件沿該隔離裝置的側壁內側在開口上下端之間移動。The device of claim 23, wherein the jacking rod moves up and down along the inside of the side wall of the isolating device, and the scraping member moves between the upper and lower ends of the opening along the inner side of the side wall of the isolating device. 如申請專利範圍第15項所述之裝置,其中該刮擦部件位於該儲存腔內,沿該隔離裝置的側壁外側在開口上下端之間移動。The device of claim 15 wherein the scraping member is located within the storage chamber and moves between the upper and lower ends of the opening along the outside of the side wall of the spacer. 如申請專利範圍第15項所述之裝置,其中該儲存腔包括至少一個防沉積物反流裝置,該防沉積物反流裝置包括向下傾斜的板。The device of claim 15, wherein the storage chamber comprises at least one anti-sediment reflux device, the anti-sediment reflux device comprising a downwardly inclined plate. 如申請專利範圍第15項所述之裝置,其中該刮擦部件更包括一延伸部,該延伸部至少部分地延伸進入該排氣口內。The device of claim 15 wherein the scraping member further comprises an extension that extends at least partially into the vent. 一種清潔如申請專利範圍第15至27項中之任一項所述之化學氣相沉積裝置的清潔方法,其包括: 移動該刮擦部件,使其在該排氣口附近移動,以刮擦沉積於該排氣口的沉積物。A cleaning method for cleaning a chemical vapor deposition apparatus according to any one of claims 15 to 27, comprising: moving the scraping member to move it near the exhaust port to scrape A deposit deposited on the exhaust port. 如申請專利範圍第28項所述之清潔方法,其中上下移動該反應腔內的該可升降內襯,以帶動該刮擦部件上下移動。The cleaning method of claim 28, wherein the liftable lining in the reaction chamber is moved up and down to drive the scraping member to move up and down. 如申請專利範圍第29項所述之清潔方法,其中該可升降內襯與該刮擦部件藉由連接桿或該杠桿實現二者聯動。The cleaning method of claim 29, wherein the liftable lining and the scraping member are linked by a connecting rod or the lever.
TW105112979A 2015-02-16 2016-04-26 Chemical vapor deposition apparatus and cleaning method thereof TW201638382A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510084012 2015-02-16
CN201510218357.1A CN106191809B (en) 2015-02-16 2015-04-30 A kind of chemical vapor deposition unit and its clean method

Publications (2)

Publication Number Publication Date
TW201638382A true TW201638382A (en) 2016-11-01
TWI563122B TWI563122B (en) 2016-12-21

Family

ID=57458426

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105112979A TW201638382A (en) 2015-02-16 2016-04-26 Chemical vapor deposition apparatus and cleaning method thereof

Country Status (2)

Country Link
CN (1) CN106191809B (en)
TW (1) TW201638382A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110512178B (en) * 2018-05-22 2021-08-13 北京北方华创微电子装备有限公司 Chamber liner, process chamber and semiconductor processing equipment
US11239060B2 (en) * 2018-05-29 2022-02-01 Taiwan Semiconductor Manufacturing Company, Ltd. Ion beam etching chamber with etching by-product redistributor
CN114351117B (en) * 2020-10-13 2022-12-20 东部超导科技(苏州)有限公司 Spray plate, MOCVD reaction system with spray plate and use method of MOCVD reaction system
CN115354305B (en) * 2022-08-29 2024-04-19 西北大学 Spraying device of metal organic chemical vapor deposition reactor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030001695A (en) * 2001-06-26 2003-01-08 삼성전자 주식회사 cleaning equipment of HDP CVD chamber and method there of
TWI426579B (en) * 2010-02-01 2014-02-11 Hermes Epitek Corp Semiconductor device and cleaning method thereof
CN102560431B (en) * 2010-12-21 2015-02-25 北京北方微电子基地设备工艺研究中心有限责任公司 Metal organic chemical vapor deposition device and chamber assembly thereof
CN102899636B (en) * 2012-09-26 2015-12-09 中微半导体设备(上海)有限公司 A kind of method of In-Situ Cleaning MOCVD reaction chamber

Also Published As

Publication number Publication date
CN106191809A (en) 2016-12-07
TWI563122B (en) 2016-12-21
CN106191809B (en) 2018-12-25

Similar Documents

Publication Publication Date Title
KR101792941B1 (en) A Chemical Vapor Deposition Apparatus and Its Cleaning Method
TW201638382A (en) Chemical vapor deposition apparatus and cleaning method thereof
KR200487917Y1 (en) Shadow frame support
CN102251228B (en) The method of clean air e Foerderanlage, the method for growing film and reaction unit
KR101075171B1 (en) Side storage with gas injection block
TW201712149A (en) Gas suction device for preventing clogging, and MOCVD apparatus provided with the device can effectively prevent deposited reactants from clogging the suction holes of the gas suction device so that the gas in the reaction chamber is evenly distributed to maintain consistency of the wafer process
CN108028193A (en) Substrate board treatment and substrate processing method using same
TWI598460B (en) Chemical vapor deposition apparatus and its cleaning method
JP2013069818A (en) Vapor phase growth apparatus and method for forming crystal film
CN106944431A (en) It is pyrolyzed extraction tube dedusting mechanism
JP2010196102A (en) Vapor deposition apparatus and vapor deposition method
JP3160787B2 (en) Continuous rice cooker
CN112038257B (en) Cleaning equipment
JP4351556B2 (en) Vapor growth equipment
CN201898854U (en) Device for removing volatile base nitrogen in fish meal
CN114600976B (en) A kind of production method and equipment of fragrant white tea
CN116815306B (en) Surface deposition device for silicon carbide epitaxial wafer
CN213687485U (en) Malt roasting furnace cooling machine
CN219807224U (en) Chocolate slurry feeding device with material recycling function
CN222434602U (en) Film deposition equipment
JP3792473B2 (en) Method for forming semiconductor thin film
KR102478902B1 (en) Substrate disposition apparatus
CN110846086A (en) A direct cooling tower for washing gas
KR101677156B1 (en) Process chamber included in substrate disposition apparatus
CN215613712U (en) Device for removing impurities on silicon surface