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TW201615065A - Circuit board and manufacturing method thereof - Google Patents

Circuit board and manufacturing method thereof

Info

Publication number
TW201615065A
TW201615065A TW104121696A TW104121696A TW201615065A TW 201615065 A TW201615065 A TW 201615065A TW 104121696 A TW104121696 A TW 104121696A TW 104121696 A TW104121696 A TW 104121696A TW 201615065 A TW201615065 A TW 201615065A
Authority
TW
Taiwan
Prior art keywords
hole
circuit board
conductor layer
diameter
less
Prior art date
Application number
TW104121696A
Other languages
Chinese (zh)
Other versions
TWI685285B (en
Inventor
Shigeo Nakamura
Ryo Miyamoto
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of TW201615065A publication Critical patent/TW201615065A/en
Application granted granted Critical
Publication of TWI685285B publication Critical patent/TWI685285B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides a circuit board comprising a thinner insulating layer covering a conductor layer with small surface roughness, in order to suppress the generation of defects while irradiating laser beam to form a through-hole with a small diameter. The circuit board of the present invention is a circuit board (10) comprising a conductor layer (24) and an insulating layer (30) which covers the conductor layer, and comprising a through-hole (40) allowing a part of the conductor layer to expose from the insulating layer. The arithmetic mean roughness of the surface (24a) of the conductor layer is 350 nm or less. The depth of the through-hole is 30 micrometers or less. The top diameter (Z) of the through-hole is 50 micrometers or less. The relationship among the top diameter (Z) of the through-hole, the minimum diameter (Y) of the through-hole, and the bottom diameter (X) of the through-hole satisfies Y/Z=0.7-0.99 and Y/X=0.7 - 1 (Z > Y).
TW104121696A 2014-08-01 2015-07-03 Circuit board and its manufacturing method TWI685285B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-158210 2014-08-01
JP2014158210A JP2016035969A (en) 2014-08-01 2014-08-01 Circuit board and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW201615065A true TW201615065A (en) 2016-04-16
TWI685285B TWI685285B (en) 2020-02-11

Family

ID=55250308

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104121696A TWI685285B (en) 2014-08-01 2015-07-03 Circuit board and its manufacturing method

Country Status (4)

Country Link
JP (1) JP2016035969A (en)
KR (1) KR102338968B1 (en)
CN (1) CN105323960B (en)
TW (1) TWI685285B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811275B (en) * 2018-01-09 2023-08-11 日商味之素股份有限公司 resin composition
TWI824308B (en) * 2020-12-02 2023-12-01 黃信翔 Electroless nickel gold manufacturing process method and system that can reduce chemical processing steps

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016086000A (en) * 2014-10-22 2016-05-19 太陽インキ製造株式会社 Dry film and printed wiring board
JP6728760B2 (en) * 2016-02-25 2020-07-22 味の素株式会社 Resin sheet with support
CN107278053A (en) * 2016-04-08 2017-10-20 东莞市斯坦得电子材料有限公司 The bulk softening process of the leading through-hole wall epoxy resin of hole metallization is turned on for printed wiring board
JP2017199824A (en) * 2016-04-28 2017-11-02 株式会社ジェイデバイス Manufacturing method of semiconductor package
JP6705718B2 (en) * 2016-08-09 2020-06-03 新光電気工業株式会社 Wiring board and manufacturing method thereof
JP6796482B2 (en) 2016-12-27 2020-12-09 新光電気工業株式会社 Wiring board, manufacturing method of wiring board
US11197379B2 (en) 2017-03-31 2021-12-07 Mitsubishi Gas Chemical Company, Inc. Method for producing printed wiring board
JP7279303B2 (en) * 2017-05-10 2023-05-23 味の素株式会社 Resin composition layer
KR102436225B1 (en) * 2017-07-28 2022-08-25 삼성전기주식회사 Printed circuit board
JP6852627B2 (en) * 2017-09-11 2021-03-31 味の素株式会社 Resin composition
JP6859916B2 (en) * 2017-10-13 2021-04-14 味の素株式会社 Resin composition layer
JP6919508B2 (en) * 2017-11-07 2021-08-18 味の素株式会社 Resin composition
JP7112873B2 (en) 2018-04-05 2022-08-04 新光電気工業株式会社 Wiring board, semiconductor package, and method for manufacturing wiring board
JP7196551B2 (en) * 2018-11-14 2022-12-27 味の素株式会社 RESIN SHEET WITH SUPPORT AND RESIN COMPOSITION LAYER
US12245366B2 (en) 2019-10-30 2025-03-04 Kyocera Corporation Wiring board
CN113811080A (en) * 2020-06-16 2021-12-17 深南电路股份有限公司 Circuit board and preparation method thereof
TWI807464B (en) * 2020-11-06 2023-07-01 日商互應化學工業股份有限公司 Printed wiring board and manufacturing method of printed wiring board
WO2024190442A1 (en) * 2023-03-10 2024-09-19 味の素株式会社 Method for producing circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006028225A (en) * 2004-07-12 2006-02-02 Nippon Zeon Co Ltd Thermosetting resin composition, electrical insulating film, laminate and multilayer circuit board
JP2008037957A (en) 2006-08-03 2008-02-21 Tamura Kaken Co Ltd Thermosetting resin composition, b-stage resin film and multilayer build-up substrate
JP5184115B2 (en) * 2008-01-31 2013-04-17 日東電工株式会社 Wiring circuit board and manufacturing method thereof
JP5181702B2 (en) * 2008-02-06 2013-04-10 株式会社村田製作所 Wiring board manufacturing method
JP5597498B2 (en) * 2010-09-22 2014-10-01 電気化学工業株式会社 Epoxy resin composition, circuit board, and light emitting device
JP2013077590A (en) * 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd Resin film for interlayer insulation and build-up wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811275B (en) * 2018-01-09 2023-08-11 日商味之素股份有限公司 resin composition
TWI824308B (en) * 2020-12-02 2023-12-01 黃信翔 Electroless nickel gold manufacturing process method and system that can reduce chemical processing steps

Also Published As

Publication number Publication date
KR102338968B1 (en) 2021-12-15
KR20160016665A (en) 2016-02-15
CN105323960B (en) 2020-06-19
TWI685285B (en) 2020-02-11
CN105323960A (en) 2016-02-10
JP2016035969A (en) 2016-03-17

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