TW201614730A - Chemical mechanical polishing pad with internal channels - Google Patents
Chemical mechanical polishing pad with internal channelsInfo
- Publication number
- TW201614730A TW201614730A TW104118131A TW104118131A TW201614730A TW 201614730 A TW201614730 A TW 201614730A TW 104118131 A TW104118131 A TW 104118131A TW 104118131 A TW104118131 A TW 104118131A TW 201614730 A TW201614730 A TW 201614730A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- polishing
- chemical mechanical
- mechanical polishing
- internal channels
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462062092P | 2014-10-09 | 2014-10-09 | |
US62/062,092 | 2014-10-09 | ||
US201462065193P | 2014-10-17 | 2014-10-17 | |
US62/065,193 | 2014-10-17 | ||
US14/695,299 | 2015-04-24 | ||
US14/695,299 US9873180B2 (en) | 2014-10-17 | 2015-04-24 | CMP pad construction with composite material properties using additive manufacturing processes |
US14/695,778 | 2015-04-24 | ||
US14/695,778 US20160101500A1 (en) | 2014-10-09 | 2015-04-24 | Chemical mechanical polishing pad with internal channels |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614730A true TW201614730A (en) | 2016-04-16 |
TWI652735B TWI652735B (en) | 2019-03-01 |
Family
ID=56361276
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108102132A TWI685896B (en) | 2014-10-09 | 2015-06-04 | Method of manufacturing chemical mechanical polishing pad with internal channels |
TW104118131A TWI652735B (en) | 2014-10-09 | 2015-06-04 | Chemical mechanical polishing pad with internal channels |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108102132A TWI685896B (en) | 2014-10-09 | 2015-06-04 | Method of manufacturing chemical mechanical polishing pad with internal channels |
Country Status (1)
Country | Link |
---|---|
TW (2) | TWI685896B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114473842A (en) * | 2020-11-11 | 2022-05-13 | 中国科学院微电子研究所 | A grinding disc, chemical mechanical polishing equipment, system and method |
CN114800057A (en) * | 2022-05-11 | 2022-07-29 | 浙江工业大学 | Polishing device based on non-Newtonian fluid film shearing mechanism |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022534384A (en) | 2019-05-31 | 2022-07-29 | アプライド マテリアルズ インコーポレイテッド | Polishing platen and method of manufacturing polishing platen |
TWI792559B (en) * | 2021-09-13 | 2023-02-11 | 中國砂輪企業股份有限公司 | Grinding tool capable of sensing grinding status and grinding system comprising the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW559975B (en) * | 2002-09-13 | 2003-11-01 | Taiwan Semiconductor Mfg | Equipment and method for preventing wafer from scratching |
US20040242121A1 (en) * | 2003-05-16 | 2004-12-02 | Kazuto Hirokawa | Substrate polishing apparatus |
JP2004243518A (en) | 2004-04-08 | 2004-09-02 | Toshiba Corp | Polishing device |
TWI287486B (en) * | 2006-05-04 | 2007-10-01 | Iv Technologies Co Ltd | Polishing pad and method thereof |
US9067299B2 (en) * | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
-
2015
- 2015-06-04 TW TW108102132A patent/TWI685896B/en active
- 2015-06-04 TW TW104118131A patent/TWI652735B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114473842A (en) * | 2020-11-11 | 2022-05-13 | 中国科学院微电子研究所 | A grinding disc, chemical mechanical polishing equipment, system and method |
CN114800057A (en) * | 2022-05-11 | 2022-07-29 | 浙江工业大学 | Polishing device based on non-Newtonian fluid film shearing mechanism |
Also Published As
Publication number | Publication date |
---|---|
TWI652735B (en) | 2019-03-01 |
TWI685896B (en) | 2020-02-21 |
TW201929088A (en) | 2019-07-16 |
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