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TW201614035A - Method for manufacturing polishing composition - Google Patents

Method for manufacturing polishing composition

Info

Publication number
TW201614035A
TW201614035A TW104127504A TW104127504A TW201614035A TW 201614035 A TW201614035 A TW 201614035A TW 104127504 A TW104127504 A TW 104127504A TW 104127504 A TW104127504 A TW 104127504A TW 201614035 A TW201614035 A TW 201614035A
Authority
TW
Taiwan
Prior art keywords
polishing composition
undiluted
water
manufacturing
composition solution
Prior art date
Application number
TW104127504A
Other languages
Chinese (zh)
Inventor
Kohsuke Tsuchiya
Yusuke Kawasaki
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of TW201614035A publication Critical patent/TW201614035A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The purpose of the present invention is to provide a method for manufacturing a polishing composition for which dispersion stability as an undiluted solution is good and which even when diluted, for example, at a high ratio, is able to achieve good surface quality. A method for manufacturing a polishing composition is provided. Said manufacturing method comprises a step for diluting an undiluted polishing composition solution containing abrasive grains, a basic compound, a water-soluble polymer, and water so that the pH change is at least 0.15. For the undiluted polishing composition solution, an index (A) determined from the relational expression: (A) = [(CA) x (CP)]/(pHC) (in the relational expression, (CA) is the content (mass%) of abrasive grains in the undiluted polishing composition solution, (CP) is the content (mass%) of water-soluble polymer in the undiluted polishing composition solution, and (pHC) is the pH value of the undiluted polishing composition solution) is not more than 0.8. The molarity of the water-soluble polymer in the polishing composition after the dilution is at least 7.0 x 10-8 moles/L.
TW104127504A 2014-09-03 2015-08-24 Method for manufacturing polishing composition TW201614035A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014179162A JP6562605B2 (en) 2014-09-03 2014-09-03 Method for producing polishing composition

Publications (1)

Publication Number Publication Date
TW201614035A true TW201614035A (en) 2016-04-16

Family

ID=55439341

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127504A TW201614035A (en) 2014-09-03 2015-08-24 Method for manufacturing polishing composition

Country Status (3)

Country Link
JP (1) JP6562605B2 (en)
TW (1) TW201614035A (en)
WO (1) WO2016035250A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6960328B2 (en) * 2016-12-26 2021-11-05 ニッタ・デュポン株式会社 Polishing composition
JP6951933B2 (en) * 2017-10-10 2021-10-20 花王株式会社 Finish polishing liquid composition for silicon wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006352043A (en) * 2005-06-20 2006-12-28 Nitta Haas Inc Composition for polishing semiconductor
JP2009231486A (en) * 2008-03-21 2009-10-08 Kao Corp Polishing liquid composition for silicon wafer
JP5822356B2 (en) * 2012-04-17 2015-11-24 花王株式会社 Polishing liquid composition for silicon wafer
JP5995659B2 (en) * 2012-10-30 2016-09-21 花王株式会社 Polishing liquid composition for silicon wafer
JP2013034026A (en) * 2012-11-14 2013-02-14 Fujimi Inc Polishing composition and method for manufacturing semiconductor wafer using the same
JP6039419B2 (en) * 2012-12-28 2016-12-07 花王株式会社 Polishing liquid composition for silicon wafer

Also Published As

Publication number Publication date
JP2016053114A (en) 2016-04-14
WO2016035250A1 (en) 2016-03-10
JP6562605B2 (en) 2019-08-21

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