[go: up one dir, main page]

TW201613140A - Semiconductor light emitting device and light emitting apparatus - Google Patents

Semiconductor light emitting device and light emitting apparatus

Info

Publication number
TW201613140A
TW201613140A TW104106371A TW104106371A TW201613140A TW 201613140 A TW201613140 A TW 201613140A TW 104106371 A TW104106371 A TW 104106371A TW 104106371 A TW104106371 A TW 104106371A TW 201613140 A TW201613140 A TW 201613140A
Authority
TW
Taiwan
Prior art keywords
light emitting
semiconductor
face
emitting device
semiconductor light
Prior art date
Application number
TW104106371A
Other languages
Chinese (zh)
Inventor
Rintaro Okamoto
Shinji Nunotani
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201613140A publication Critical patent/TW201613140A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

A semiconductor light emitting device is provided. The semiconductor light emitting device includes a semiconductor substrate having a first face on a first side, a second face on a second side opposite to the first face, and a third face which joins the first face and the second face. The semiconductor light emitting device further includes a first light reflection film in contact with at least a portion of the third face of the semiconductor substrate. The semiconductor device further includes a laminated body that is provided on the second side of the semiconductor substrate, and includes a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer.
TW104106371A 2014-09-16 2015-02-26 Semiconductor light emitting device and light emitting apparatus TW201613140A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014187332A JP2016062945A (en) 2014-09-16 2014-09-16 Semiconductor light emitting element and light emitting device

Publications (1)

Publication Number Publication Date
TW201613140A true TW201613140A (en) 2016-04-01

Family

ID=55455631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106371A TW201613140A (en) 2014-09-16 2015-02-26 Semiconductor light emitting device and light emitting apparatus

Country Status (4)

Country Link
US (1) US20160079497A1 (en)
JP (1) JP2016062945A (en)
CN (1) CN105990490A (en)
TW (1) TW201613140A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672944B2 (en) 2016-03-28 2020-03-25 Tdk株式会社 Terminal blocks and electronics

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101327106B1 (en) * 2007-08-09 2013-11-07 엘지이노텍 주식회사 Semiconductor light emitting device
KR101497953B1 (en) * 2008-10-01 2015-03-05 삼성전자 주식회사 Light emitting device with improved light extraction efficiency, light emitting device including same, method of manufacturing light emitting device and light emitting device
KR101662010B1 (en) * 2010-05-20 2016-10-05 엘지이노텍 주식회사 Light Emitting Device
JP5792694B2 (en) * 2012-08-14 2015-10-14 株式会社東芝 Semiconductor light emitting device

Also Published As

Publication number Publication date
JP2016062945A (en) 2016-04-25
CN105990490A (en) 2016-10-05
US20160079497A1 (en) 2016-03-17

Similar Documents

Publication Publication Date Title
TW201614870A (en) Semiconductor light emitting device and method for manufacturing the same
AU2018223054B2 (en) Asymmetric multilayer film for ostomy application
PH12016502549A1 (en) Vaporizer assembly
PH12015502664A1 (en) Daylight redirecting glazing laminates
IN2014MU03848A (en)
TW201612964A (en) Semiconductor device and semiconductor device manufacturing method
GB2543194A (en) Thin film coating on mechanical face seals
TW201130173A (en) Semiconductor light emitting device and method for manufacturing same
TW201613156A (en) Light-emitting device, module, and electronic device
BR112016024795A2 (en) organic LED with surface modification layer
PH12016501804A1 (en) Bonds for solar cell metallization
BR112016014241A2 (en) MULTI-LAYER FILM, ARTICLE AND MANUFACTURING METHOD OF A MULTI-LAYER FILM
PH12016502287A1 (en) Dicing sheet
TWD187625S (en) Electrical contact element
EP2949720A4 (en) Optical-member adhesive composition, optical-member adhesive layer, and surface light source device
TW201612592A (en) Display panel
JP2015005732A5 (en) Semiconductor device
MX2016012548A (en) Intermediate film for laminated glass, and laminated glass.
MX363199B (en) Stretch laminate.
JP2015079955A5 (en) Light emitting device
PL3178651T3 (en) Transparent, biaxially oriented polyester film with a smooth surface on one side and good curlability
MX2017008235A (en) Design transfer sheet and decorative film, and method for producing same.
MX2014002608A (en) Semiconductor device and method for manufacturing same.
TWM489761U (en) Easy-peeling protective film and peeling sheet thereof
TW201614845A (en) Semiconductor device and method of manufacturing the semiconductor device