TW201541084A - Universal testing device - Google Patents
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- TW201541084A TW201541084A TW103114030A TW103114030A TW201541084A TW 201541084 A TW201541084 A TW 201541084A TW 103114030 A TW103114030 A TW 103114030A TW 103114030 A TW103114030 A TW 103114030A TW 201541084 A TW201541084 A TW 201541084A
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- elastic positioning
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- 238000012360 testing method Methods 0.000 title claims abstract description 85
- 239000000523 sample Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009342 intercropping Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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Abstract
Description
本發明係有關於一種測試裝置,具體而言是一種測試裝置的結構改良,其在用來測試且固定待測物的測試槽附近加裝若干個彈性定位件,幫助定位待測物的位置。 The invention relates to a testing device, in particular to a structural improvement of a testing device, which is provided with a plurality of elastic positioning members near the test slot for testing and fixing the object to be tested, to help locate the position of the object to be tested.
傳統的測設座,請參考第1圖,其中承載盤71的中央設有一測試槽72以容置一待測物73,測試槽72的底部設有若干個探針74,並且測試槽72的深度大致上與待測物73的厚度相當。因此當進行測試時,加壓塊75向下施力推動待測物73,使待測物73的接腳(未繪示)與測試槽72的探針74作電性連接,藉以對待測物73作各項測試以及測試待測物73是否能夠正常運作。然而隨著封裝技術的發展,越來越多的待測物,特別是系統級封裝(System in Package,SiP)模組的厚度越來越薄,因此在進行測試時,測試槽72的深度對應地被設計得越來越薄,使得待測物73定位困難而很容易因受到外力的影響而跑出測試槽72之外。 For the conventional measuring socket, please refer to FIG. 1 , wherein a test slot 72 is disposed in the center of the carrying tray 71 to accommodate a test object 73. The bottom of the test slot 72 is provided with a plurality of probes 74, and the test slot 72 is The depth is substantially equivalent to the thickness of the object to be tested 73. Therefore, when the test is performed, the pressing block 75 pushes the object 73 downward to push the pin (not shown) of the object to be tested 73 to the probe 74 of the test slot 72 to electrically connect the object to be tested. 73 for each test and test whether the test object 73 can operate normally. However, with the development of packaging technology, more and more objects to be tested, especially system in package (SiP) modules, are becoming thinner and thinner. Therefore, the depth of the test slot 72 corresponds to the test. The ground is designed to be thinner and thinner, making the object 73 difficult to position and easily escaping out of the test slot 72 due to external force.
為了防止上述問題發生,另外一種作法是增加測試槽72的深度來防止待測物73跑出測試槽72之外,請參考第2圖。如此一來,為了能讓加壓塊75能夠順利向下推動待測物73而使待測物73能夠和探針74電性連接,加壓塊75的尺寸不僅須比測試槽72還要小,同時為了防止待測物73出 現過度施壓的問題,加壓塊75的尺寸與重量更需特別設計而無法一體適用,如此,甚為不便。 In order to prevent the above problem from occurring, another method is to increase the depth of the test slot 72 to prevent the object to be tested 73 from running out of the test slot 72. Please refer to FIG. In this way, in order to enable the pressing block 75 to smoothly push the object to be tested 73 to electrically connect the object to be tested 73 to the probe 74, the size of the pressing block 75 must be smaller than the test slot 72. At the same time, in order to prevent the object 73 from being tested The problem of excessive pressure is that the size and weight of the pressing block 75 need to be specially designed and cannot be integrally applied, which is inconvenient.
有鑑於此,本發明之主要目的在於提供一種測試裝置,其可精確定位厚度較薄的待測物,其次為用以加壓待測物的壓塊能夠一體適用於不同尺寸的待測物,增加使用上的方便性。 In view of the above, the main object of the present invention is to provide a testing device capable of accurately positioning a thin object to be tested, and secondly, a pressing block for pressing the object to be tested can be integrally applied to different sizes of the object to be tested. Increase the convenience of use.
為了達成上述目的,本發明提供了一種通用封裝測試裝置,其可用以測試一待測物,上述測試裝置包含有一承載盤、一加壓頭以及複數個彈性定位件。其中承載盤的中央凹設有一測試槽,並且測試槽設有至少一探針。加壓頭是可移動地設於承載盤的上方而可在一加壓位置與一離開位置之間移動以分別靠近或遠離測試槽,並且加壓頭的表面連接有一壓塊以加壓待測物。複數個彈性定位件設置於承載盤並且圍繞且貼近測試槽的外周緣。 In order to achieve the above object, the present invention provides a universal package test apparatus for testing a test object, the test apparatus comprising a carrier disk, a pressurizing head and a plurality of elastic positioning members. The central recess of the carrying tray is provided with a test slot, and the test slot is provided with at least one probe. The pressing head is movably disposed above the carrier tray and movable between a pressing position and an exiting position to respectively approach or away from the test slot, and a surface of the pressing head is connected with a pressing block to pressurize the test head Things. A plurality of elastic positioning members are disposed on the carrier tray and surround and abut the outer circumference of the test slot.
藉此,設置於貼近測試槽外周緣的彈性定位件可幫助定位待測物,即使待測物的厚度較薄,待測物也不易因受外力的影響或承載盤的移動而跑出測試槽外。 Thereby, the elastic positioning member disposed near the outer periphery of the test slot can help locate the object to be tested, and even if the thickness of the object to be tested is thin, the object to be tested is not easily escaping from the test slot due to the influence of the external force or the movement of the carrier disk. outer.
1‧‧‧測試裝置 1‧‧‧Testing device
10‧‧‧承載盤 10‧‧‧ Carrying tray
11‧‧‧測試槽 11‧‧‧Test slot
12‧‧‧底板 12‧‧‧floor
13‧‧‧側壁 13‧‧‧ side wall
14‧‧‧容置空間 14‧‧‧ accommodating space
15‧‧‧探針 15‧‧‧ probe
16‧‧‧安裝孔 16‧‧‧Installation holes
20‧‧‧加壓頭 20‧‧‧ Pressing head
21‧‧‧壓塊 21‧‧‧Clamps
30‧‧‧彈性定位件 30‧‧‧Flexible positioning parts
31‧‧‧頭部 31‧‧‧ head
32‧‧‧彈簧 32‧‧‧ Spring
40‧‧‧連接件 40‧‧‧Connecting parts
71‧‧‧承載盤 71‧‧‧ Carrying tray
72‧‧‧測試槽 72‧‧‧ test slot
73‧‧‧待測物 73‧‧‧Test object
74‧‧‧探針 74‧‧‧ probe
75‧‧‧加壓塊 75‧‧‧ Pressurized block
第1圖為習用的封裝測試裝置的使用示意圖。 Figure 1 is a schematic diagram of the use of a conventional package test device.
第2圖為另一習用的封裝測試裝置的使用示意圖。 Figure 2 is a schematic view showing the use of another conventional package test device.
第3圖為本發明較佳實施例封裝測試裝置的側視圖。 Figure 3 is a side elevational view of a package testing apparatus in accordance with a preferred embodiment of the present invention.
第4圖為本發明較佳實施例承載盤的立體圖。 Figure 4 is a perspective view of a carrier disk in accordance with a preferred embodiment of the present invention.
第5圖為第4圖沿5-5剖視線的剖視圖。 Fig. 5 is a cross-sectional view taken along line 5-5 of Fig. 4;
為了能更瞭解本發明之特點所在,本發明提供了一較佳實施例並配合圖式說明如下,請參考第3至5圖。本發明通用測試裝置1可用於測試一待測物,待測物在本實施例中為一SiP模組(System in Package,SiP),其亦可為一SoC模組(System on Chip,SoC)或是其他形式的待測物而不以本實施例為限。本發明通用測試裝置1的主要元件包含有一承載盤10、一加壓頭20以及複數個彈性定位件30(在本實施例為6個),各元件的結構以及相互間的關係詳述如下:請參閱第4圖,承載盤10的中央凹設有一底板12,底板12頂面的周圍環設有一側壁13使其內部形成一容置空間14。底板12中央再凹設有一測試槽11,測試槽11的底部設有若干個探針15用以對待測物作各項測試。此外,底板12更凹設有六個安裝孔16圍繞且貼近地排列在測試槽11的外周緣;於其他實施例中,測試槽亦可凹設於底板12其他位置,而不限定凹設於底板12中央。 In order to better understand the features of the present invention, the present invention provides a preferred embodiment and is described below in conjunction with the drawings. Please refer to Figures 3 through 5. The universal test device 1 of the present invention can be used to test a test object. In this embodiment, the test object is a SiP module (System in Package (SiP), which can also be a SoC module (System on Chip, SoC). Or other forms of the object to be tested are not limited to this embodiment. The main components of the universal testing device 1 of the present invention comprise a carrier 10, a pressing head 20 and a plurality of elastic positioning members 30 (six in the present embodiment). The structure of each element and the relationship between them are as follows: Referring to FIG. 4, a bottom plate 12 is defined in the central recess of the carrier plate 10. A peripheral wall of the top surface of the bottom plate 12 is provided with a side wall 13 to define an accommodating space 14 therein. A test slot 11 is further recessed in the center of the bottom plate 12. The bottom of the test slot 11 is provided with a plurality of probes 15 for testing various objects to be tested. In addition, the bottom plate 12 is further recessed with six mounting holes 16 and is closely arranged on the outer circumference of the test slot 11; in other embodiments, the test slot may also be recessed at other positions of the bottom plate 12 without limitation The center of the bottom plate 12.
加壓頭20是相對設置於承載盤10的上方並以其一端樞接一連接件40,如第3圖所示,且連接件40連接承載盤10,使加壓頭20可在一加壓位置與一離開位置之間移動以分別靠近或遠離測試槽11。此外,加壓頭20的表面連接有一壓塊21,當加壓頭20樞擺至加壓位置時,壓塊21會隨加壓頭20而進入容置空間14。 The pressing head 20 is oppositely disposed above the carrying tray 10 and pivotally connected to the connecting member 40 at one end thereof, as shown in FIG. 3, and the connecting member 40 is connected to the carrying tray 10, so that the pressing head 20 can be pressurized. The position is moved between a position and an exit position to approach or move away from the test slot 11, respectively. Further, a pressing block 21 is attached to the surface of the pressing head 20. When the pressing head 20 is pivoted to the pressing position, the pressing block 21 enters the accommodating space 14 with the pressing head 20.
請參閱第5圖,該六彈性定位件30是各自容置於該六安裝孔16,各彈性定位件30皆包含了一頭部31以及一彈簧32,彈簧32的二端分別抵頂安裝孔16的底部以及頭部31的底部。頭部31是用來抵頂壓塊21,當壓 塊21沒有抵頂頭部31時,頭部31至少有一部份會凸出安裝孔16外。此外,該等彈性定位件30所圍繞形成的面積是小於壓塊21用於加壓待測物的表面的面積。 Referring to FIG. 5 , the six elastic positioning members 30 are respectively disposed in the six mounting holes 16 , and each of the elastic positioning members 30 includes a head 31 and a spring 32 , and the two ends of the spring 32 respectively abut the mounting holes. The bottom of the 16 and the bottom of the head 31. The head 31 is used to abut the pressing block 21 when pressed When the block 21 does not abut the head portion 31, at least a portion of the head portion 31 may protrude outside the mounting hole 16. Further, the area formed by the elastic positioning members 30 is smaller than the area of the surface of the pressing block 21 for pressurizing the object to be tested.
使用上,當要進行測試時,首先將待測物放置到測試槽11上方,之後再樞轉加壓頭20使其從離開位置樞擺至加壓位置。此時壓塊21會進入容置空間14並向下抵頂該等彈性定位件30與待測物,壓塊21會壓縮彈性定位件30而使頭部31沒入安裝孔16,並且推動待測物使其接腳與該等探針15接觸以進行待測物的各項測試。由於該等彈性定位件30是設置於貼近測試槽11外周緣的地方,並且各彈性定位件30的頭部31在未加壓時均至少有一部份凸出於安裝孔16之外而發揮了良好的定位效果,因此即使待測的待測物的厚度較薄,待測物也不易因受到外力的影響或承載盤10的移動而跑出測試槽11之外而離開測試槽11的上方。另一方面,在整個測試過程當中,壓塊21在下壓時,待測物與彈性定位件30會受到壓塊21的壓抵而同時向下移動,直到壓塊21靠抵於底板12而停止,因此不會發生壓塊21過度施壓待測物的問題。而此時彈性定位件30因完全沒入安裝孔16中,更不會影響到壓塊21壓抵待測物,因此對於不同厚度的待測物,壓塊21也無須個別設計而能一體適用,遂可達到方便使用的目的。 In use, when the test is to be performed, the object to be tested is first placed above the test slot 11, and then the pressurizing head 20 is pivoted from the exit position to the pressurized position. At this time, the pressing block 21 enters the accommodating space 14 and abuts against the elastic positioning members 30 and the object to be tested. The pressing block 21 compresses the elastic positioning member 30 to cause the head 31 to immerse into the mounting hole 16 and pushes the waiting portion 16 The test object has its pins in contact with the probes 15 for various tests of the test object. Since the elastic positioning members 30 are disposed adjacent to the outer periphery of the test slot 11, and the head portions 31 of the elastic positioning members 30 are at least partially protruded from the mounting holes 16 when they are not pressurized, The positioning effect is good, so even if the thickness of the object to be tested is thin, the object to be tested is not easily escaping from the outside of the test slot 11 due to the influence of the external force or the movement of the carrier disk 10. On the other hand, during the whole test process, when the pressing block 21 is pressed down, the object to be tested and the elastic positioning member 30 are pressed by the pressing block 21 while moving downward until the pressing block 21 abuts against the bottom plate 12 and stops. Therefore, there is no problem that the compact 21 excessively presses the object to be tested. At this time, since the elastic positioning member 30 is completely immersed in the mounting hole 16, it does not affect the pressing of the pressing block 21 against the object to be tested. Therefore, the pressing block 21 can be integrally applied without being individually designed for different thicknesses of the object to be tested. , can achieve the purpose of convenient use.
需說明的是,本領域技術人員可視實際需要而增減彈性定位件30的設置數量或改變排列位置。而加壓頭20亦可改為以其一端直接樞接承載盤10,或者是改為使用其他的驅動裝置(圖未繪示)來驅動加壓頭20使其在加壓位置與離開位置之間作上下移動。 It should be noted that those skilled in the art can increase or decrease the number of the elastic positioning members 30 or change the arrangement position according to actual needs. The pressing head 20 can also be directly pivotally connected to the carrier 10 at one end thereof, or can be driven by other driving devices (not shown) to drive the pressing head 20 to the pressing position and the leaving position. Intercropping moves up and down.
最後,必須再次說明的是,本發明於前述實施例中所揭露的 構成元件僅為舉例說明,並非用來限制本案之範圍,舉凡其他易於思及的結構變化,或與其他等效元件的替代變化,亦應為本案之申請專利範圍所涵蓋。 Finally, it must be stated again that the present invention is disclosed in the foregoing embodiments. The constituent elements are merely illustrative and are not intended to limit the scope of the present invention. Other structural changes that are easily conceivable, or alternative changes with other equivalent elements, are also covered by the scope of the patent application.
10‧‧‧承載盤 10‧‧‧ Carrying tray
11‧‧‧測試槽 11‧‧‧Test slot
12‧‧‧底板 12‧‧‧floor
13‧‧‧側壁 13‧‧‧ side wall
14‧‧‧容置空間 14‧‧‧ accommodating space
15‧‧‧探針 15‧‧‧ probe
16‧‧‧安裝孔 16‧‧‧Installation holes
30‧‧‧彈性定位件 30‧‧‧Flexible positioning parts
Claims (7)
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TW103114030A TW201541084A (en) | 2014-04-17 | 2014-04-17 | Universal testing device |
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TW103114030A TW201541084A (en) | 2014-04-17 | 2014-04-17 | Universal testing device |
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TW201541084A true TW201541084A (en) | 2015-11-01 |
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US5518410A (en) * | 1993-05-24 | 1996-05-21 | Enplas Corporation | Contact pin device for IC sockets |
KR20050101231A (en) * | 2003-03-18 | 2005-10-20 | 신에츠 포리마 가부시키가이샤 | Pressure contact hold type connector |
TWM310341U (en) * | 2006-11-17 | 2007-04-21 | Advanced Electronics Co Ltd | Testing platform device and the terminals thereof |
CN102346199A (en) * | 2010-07-30 | 2012-02-08 | 中芯国际集成电路制造(上海)有限公司 | Ball grid array test socket |
CN203117232U (en) * | 2013-03-13 | 2013-08-07 | 浦创电子科技(苏州)有限公司 | Novel integrated circuit (IC) simple testing seat |
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