TW201532989A - Scribing device - Google Patents
Scribing device Download PDFInfo
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- TW201532989A TW201532989A TW103137065A TW103137065A TW201532989A TW 201532989 A TW201532989 A TW 201532989A TW 103137065 A TW103137065 A TW 103137065A TW 103137065 A TW103137065 A TW 103137065A TW 201532989 A TW201532989 A TW 201532989A
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- brittle material
- cutting wheel
- scribing
- material substrate
- support
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- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000011144 upstream manufacturing Methods 0.000 claims description 11
- 230000032258 transport Effects 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
本發明係關於一種玻璃基板、半導體基板等脆性材料基板之劃線裝置。 The present invention relates to a scribing device for a brittle material substrate such as a glass substrate or a semiconductor substrate.
通常，於自大面積之脆性材料基板切割出單位製品之步驟中，進行如底線步驟：藉由使切割輪(亦稱為劃線輪)相對於脆性材料基板之表面一面沿劃線預定線壓接一面相對移動，而形成相互正交之X方向及Y方向之劃線。其後，進行如下分斷步驟，即藉由沿該劃線施加外力使基板彎曲，而將脆性材料基板完全分斷為一個個單位顯示面板。 Generally, in the step of cutting a unit product from a large-area brittle material substrate, a bottom line step is performed by pressing a cutting wheel (also referred to as a scribing wheel) against a surface of the brittle material substrate along a predetermined line line. One side is moved relative to each other to form mutually orthogonal X-direction and Y-direction scribe lines. Thereafter, a breaking step is performed in which the substrate is bent by applying an external force along the scribe line, and the brittle material substrate is completely divided into individual unit display panels.
例如專利文獻1中公開一種自脆性材料基板之下表面進行上述劃線步驟之劃線裝置。 For example, Patent Document 1 discloses a scribing device that performs the scribing step from the lower surface of a brittle material substrate.
如圖6所示，該劃線裝置隔開間隔P而串列地配置有一對輸送機21a、21b，該等輸送機21a、21b載置並搬送脆性材料基板M，於該輸送機21a、21b之間，配置有用來對脆性材料基板M之背面加工劃線之切割輪22、以及支持該切割輪22之劃線頭23。而且，利用支承台24支承脆性材料基板M之上表面，並使切割輪22一面壓抵於脆性材料基板M之背面一面向X方向(圖6之前後方向)滾動，由此如圖7(a)所示般對脆性材料基板M之背面加工X方向之劃線S1。其後，使脆性材料基板M旋轉90度並與上述同樣地使切割輪滾動，從而如圖7(b)所示般加工Y方向之劃線S2。 As shown in Fig. 6, the scribing device is arranged with a pair of conveyors 21a and 21b arranged in series at intervals P, and the conveyors 21a and 21b mount and transport the brittle material substrate M on the conveyors 21a and 21b. A cutting wheel 22 for scribing the back surface of the brittle material substrate M and a scribing head 23 supporting the cutting wheel 22 are disposed therebetween. Further, the upper surface of the brittle material substrate M is supported by the support base 24, and the cutting wheel 22 is pressed against the back surface of the brittle material substrate M in the X direction (the front and rear directions in Fig. 6), thereby being as shown in Fig. 7 (a). The X-direction scribe line S1 is processed on the back surface of the brittle material substrate M as shown. Thereafter, the brittle material substrate M is rotated by 90 degrees, and the cutting wheel is rolled in the same manner as described above, and the Y-direction scribe line S2 is processed as shown in Fig. 7(b).
如此般形成有X方向及Y方向之劃線S1、S2之脆性材料基板M被輸送至分斷裝置且自各劃線分斷，於取出單位製品M1之後，端緣部之端材區域M2被廢棄。 The brittle material substrate M in which the scribe lines S1 and S2 in the X direction and the Y direction are formed is transported to the breaking device and is separated from each scribe line. After the unit product M1 is taken out, the end material region M2 at the edge portion is discarded. .
[專利文獻1]日本專利特開2010-026267號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-026267
於上述劃線裝置中，為了對脆性材料基板M自下表面側進行劃線，必須將具備切割輪22之劃線頭23配置於上游側之輸送機21b與下游側之輸送機21a之間。然而，劃線頭23因於內部組裝有升降驅動部等而於縮小尺寸(體積)之方面存在極限，因此，輸送機21a、21b之間隔P必然會變大。如果該間隔P較大，則如圖8(a)所示，當將脆性材料基板M自上游側輸送機21b交付至下游側輸送機21a時，有時會產生基板M之前端接觸於下游側輸送機21a之前端部分而損傷、或者基板M之方向偏移等不良情形。 In the scribing device, in order to scribe the brittle material substrate M from the lower surface side, it is necessary to arrange the scribing head 23 including the cutter wheel 22 between the upstream conveyor 21b and the downstream conveyor 21a. However, since the scribing head 23 has a limit in downsizing (volume) due to the internal assembly of the elevating drive unit or the like, the interval P between the conveyors 21a and 21b is inevitably increased. When the interval P is large, as shown in FIG. 8(a), when the brittle material substrate M is delivered from the upstream side conveyor 21b to the downstream side conveyor 21a, the front end of the substrate M may be brought into contact with the downstream side. There is a problem such as damage to the front end portion of the conveyor 21a or a shift in the direction of the substrate M.
尤其係近年來，基板越來越薄板化、小型化，於基板之厚度較薄之情形時，因基板之前端部分於間隙P內有向下方下垂之傾向，因此上述不良情形之產生尤其成為問題。再者，於基板之尺寸較小之情形時，如圖8(b)所示般亦會產生脆性材料基板M於間隔P內傾斜、或掉落等不良情形。 In particular, in recent years, the substrate has become thinner and smaller, and when the thickness of the substrate is thin, the front end portion of the substrate tends to sag downward in the gap P, and thus the occurrence of the above-described problem is particularly problematic. . Further, when the size of the substrate is small, as shown in FIG. 8(b), a problem that the brittle material substrate M is inclined or dropped in the interval P may occur.
因此，本發明之目的在於消除上述不良情形，而提供一種即便為薄板或小尺寸之基板亦能自該基板之下表面精度良好地進行劃線之劃線裝置。 Accordingly, an object of the present invention is to eliminate the above-described problems and to provide a scribing apparatus which can accurately perform scribing from the lower surface of the substrate even in the case of a thin plate or a small-sized substrate.
為了解決上述問題而完成之本發明之劃線裝置，將脆性材料基 板載置於隔開間隔而配置之一對支持機構上，自上述間隔之下方使切割輪滾動而對該脆性材料基板之下表面進行劃線，且上述劃線裝置包括：切割輪支持體，其於上端部具備上述切割輪；及劃線頭，其具有使該切割輪支持體升降之驅動部；且設為如下構成：上述切割輪支持體之沿上述間隔之寬度方向之尺寸，以成為上述間隔之範圍內的方式形成，而上述切割輪支持體之長度，係以於上述切割輪上升至對上述脆性材料基板之下表面進行劃線之位置之狀態下，上述劃線頭之上端位於不接觸於上述支持機構之下部之位置之方式而設定。 A scribing device of the present invention completed to solve the above problems, a brittle material base The onboard is placed on the support mechanism at a spaced apart interval, the cutting wheel is rolled from below the interval to scribe the lower surface of the brittle material substrate, and the scribing device comprises: a cutting wheel support body, The cutting wheel is provided at the upper end portion, and the scribing head has a driving portion for elevating and lowering the cutting wheel support body, and is configured such that the cutting wheel support body has a dimension along the width direction of the space to become Formed in the range of the interval, and the length of the cutting wheel support is such that the upper end of the scribing head is located in a state where the cutting wheel is raised to a position where the lower surface of the brittle material substrate is scribed It is set without contacting the location of the lower part of the above support organization.
上述支持機構較佳為由載置並搬送上述脆性材料基板之上游側之輸送機與下游側之輸送機而形成。 Preferably, the support mechanism is formed by a conveyor that transports and transports the upstream side of the brittle material substrate and a conveyor on the downstream side.
根據本發明，切割輪支持體之寬度尺寸比脆性材料基板之支持機構之間隔窄，而且，以於切割輪上升至劃線位置時，劃線頭之上端外緣部分位於不接觸於上述支持機構之下部之位置之方式，將切割輪支持體形成得較長，故可使支持機構靠近至與切割輪支持體接近之位置而形成。因此，有如下效果：即便為小尺寸之脆性材料基板，亦能消除該基板於間隔內傾斜或向間隔內掉落，且於較薄之基板之情形時，可緩解該基板於間隔內下垂等現象。 According to the present invention, the width of the cutting wheel support is narrower than the spacing of the support mechanism of the brittle material substrate, and the outer edge portion of the upper end of the scribing head is not in contact with the support mechanism when the cutting wheel is raised to the scribing position. The position of the lower portion is such that the cutting wheel support is formed longer, so that the support mechanism can be formed close to the position close to the cutting wheel support. Therefore, there is an effect that even if it is a small-sized brittle material substrate, the substrate can be prevented from being inclined in the interval or falling in the interval, and in the case of a thin substrate, the substrate can be relieved from sagging in the interval, and the like. phenomenon.
A‧‧‧劃線裝置 A‧‧‧ marking device
L‧‧‧切割輪支持體及導輥支持體之寬度 L‧‧‧ Cutting wheel support and width of guide roller support
M‧‧‧脆性材料基板 M‧‧‧Battery material substrate
S1‧‧‧X方向之劃線 S1‧‧‧X direction marking
S2‧‧‧Y方向之劃線 S2‧‧‧D direction
P‧‧‧支持機構之間隔 P‧‧‧Support facility spacing
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
1‧‧‧支持機構 1‧‧‧Support institutions
1a‧‧‧輸送機 1a‧‧‧Conveyor
1b‧‧‧輸送機 1b‧‧‧Conveyor
2‧‧‧割輪 2‧‧‧ cutting wheel
3‧‧‧切割輪支持體 3‧‧‧Cutting wheel support
4‧‧‧升降驅動部(驅動部) 4‧‧‧ Lifting drive unit (drive unit)
5‧‧‧劃線頭 5‧‧‧Drawing head
6‧‧‧導輥 6‧‧‧guide roller
7‧‧‧導輥支持體 7‧‧‧guide roller support
9‧‧‧軸 9‧‧‧Axis
10‧‧‧軸承 10‧‧‧ bearing
11‧‧‧升降軸 11‧‧‧ Lifting shaft
12‧‧‧原動機 12‧‧‧ prime mover
13‧‧‧門型橋體 13‧‧‧door type bridge body
14‧‧‧樑(橫樑) 14‧‧‧ beams (beams)
15‧‧‧導軌 15‧‧‧rail
16‧‧‧支承台 16‧‧‧Support table
17‧‧‧樑 17‧‧‧ beams
18‧‧‧流體缸 18‧‧‧ fluid cylinder
21a‧‧‧輸送機 21a‧‧‧Conveyor
21b‧‧‧輸送機 21b‧‧‧Conveyor
22‧‧‧割輪 22‧‧‧ cutting wheel
23‧‧‧劃線頭 23‧‧‧Scratch head
24‧‧‧支承台 24‧‧‧Support table
圖1係表示本發明之劃線裝置之一例之局部切除立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially cutaway perspective view showing an example of a scribing apparatus of the present invention.
圖2係表示包含切割輪之劃線頭部分之放大立體圖。 Fig. 2 is an enlarged perspective view showing a portion of a scribing head including a cutting wheel.
圖3係表示劃線頭部分之局部剖面側視圖。 Figure 3 is a partial cross-sectional side view showing the portion of the scribing head.
圖4係表示劃線時之狀態之局部剖面側視圖。 Fig. 4 is a partial cross-sectional side view showing the state at the time of scribing.
圖5係表示本發明之劃線裝置之另一實施例之主要部分之側視圖。 Fig. 5 is a side elevational view showing the main part of another embodiment of the scribing apparatus of the present invention.
圖6係表示以往之劃線裝置之一例之側視圖。 Fig. 6 is a side view showing an example of a conventional scribing device.
圖7(a)、(b)係表示對脆性材料基板加工劃線之順序之俯視圖。 7(a) and 7(b) are plan views showing the procedure of scribing a brittle material substrate.
圖8(a)、(b)係表示因以往之劃線裝置而產生之不良情形之說明圖。 8(a) and 8(b) are explanatory views showing a problem caused by a conventional scribing device.
以下，基於圖1~4就本發明之劃線裝置之詳細情形進行說明。 Hereinafter, the details of the scribing apparatus of the present invention will be described based on Figs.
劃線裝置A具備載置大面積之脆性材料基板M之一對支持機構1。於本實施例中，該支持機構1係由載置脆性材料基板M並向圖1之Y方向搬送之上游側輸送機1b及下游側輸送機1a形成。 The scribing device A includes a pair of supporting mechanisms 1 for placing a large-area brittle material substrate M. In the present embodiment, the support mechanism 1 is formed by the upstream side conveyor 1b and the downstream side conveyor 1a which are placed on the brittle material substrate M and transported in the Y direction of FIG.
上游側輸送機1b及下游側輸送機1a，係於同一平面上沿Y方向隔開間隔P而串列地配置，該間隔P係用來配置下述之切割輪2及導輥6及其等之支持體3、7。將上游側輸送機1b及下游側輸送機1a，設為皮帶於輪體間旋動之帶式輸送機即可。 The upstream side conveyor 1b and the downstream side conveyor 1a are arranged in series on the same plane with a space P in the Y direction, and the space P is used to arrange the following cutting wheel 2, guide roller 6, and the like. Supports 3, 7. The upstream conveyor 1b and the downstream conveyor 1a may be belt conveyors that are rotated between the wheels.
於上游側輸送機1b與下游側輸送機1a之間，配置有用來對脆性材料基板M之背面加工X方向及Y方向之劃線S1、S2(參照圖7)之切割輪2。該切割輪2安裝於沿垂直方向延伸之切割輪支持體3之上端部，切割輪支持體3與下述之導輥支持體7一起被可升降地保持於內置有升降驅動部4之劃線頭5。 A cutting wheel 2 for processing the X-direction and the Y-direction scribe lines S1 and S2 (see FIG. 7) on the back surface of the brittle material substrate M is disposed between the upstream side conveyor 1b and the downstream side conveyor 1a. The cutting wheel 2 is attached to an upper end portion of the cutting wheel support 3 extending in the vertical direction, and the cutting wheel support 3 is held up and down with the guide roller support 7 described below in a line in which the elevation driving portion 4 is built. Head 5.
本實施例中，於切割輪2之滾動方向之前後之位置，保持於導輥支持體7、7上之導輥6、6係配置於一條直線上。該導輥6、6以輥面位於較切割輪2之刃尖稍微向下方後退之高度位置之方式而配置，從而抑制劃線時之切割輪2之刃尖對於基板M過度陷入。 In the present embodiment, the guide rollers 6, 6 held on the guide roller supports 7, 7 are disposed on a straight line at a position before and after the rolling direction of the cutter wheel 2. The guide rollers 6 and 6 are disposed such that the roller surface is located at a height position slightly lower than the blade edge of the cutting wheel 2, thereby suppressing the blade edge of the cutter wheel 2 from being excessively caught in the substrate M during the scribing.
切割輪支持體3及導輥支持體7分別於下端部藉由共用之基座8而連結，且經由垂直之軸9及軸承10而可旋動地安裝於內置於劃線頭5中之升降驅動部4之升降軸11。升降驅動部4係藉由流體缸或馬達等原動機12驅動。 The cutting wheel support 3 and the guide roller support 7 are respectively coupled to the lower end portion by a common base 8 and are rotatably attached to the built-in dash head 5 via the vertical shaft 9 and the bearing 10 The lifting shaft 11 of the driving portion 4. The elevation drive unit 4 is driven by a prime mover 12 such as a fluid cylinder or a motor.
再者，劃線頭5係以可沿形成於門型橋體13之水平之樑(橫樑)14 之導軌15向X方向往返移動之方式而安裝。 Furthermore, the scribing head 5 is a beam (beam) 14 which can be formed along the level of the portal type bridge body 13. The guide rail 15 is mounted to reciprocate in the X direction.
於本發明中，切割輪支持體3及導輥支持體7之沿輸送機1a、1b間之間隔P之寬度方向之寬度尺寸L，以成為輸送機1a、1b之間隔P之範圍內之方式較窄地形成。而且，間隔P以使輸送機1a、1b靠近至與該等支持體3、7接近之位置之方式儘可能地較窄地形成。 In the present invention, the width L of the width direction of the gap P between the cutter wheel support body 3 and the guide roller support 7 along the conveyors 1a and 1b is in the range of the distance P between the conveyors 1a and 1b. Formed narrowly. Further, the interval P is formed as narrow as possible so that the conveyors 1a, 1b are brought close to the positions of the supports 3, 7.
再者，切割輪支持體3及導輥支持體7以如下方式較長地形成：於切割輪2上升至對脆性材料基板M之下表面進行劃線之位置之圖4之狀態下，內置有升降驅動部4之劃線頭5之上端外緣部分位於不接觸於輸送機1a、1b之下部之位置。 Further, the cutting wheel support 3 and the guide roller support 7 are formed long in such a manner that the state in which the cutting wheel 2 is raised to the position where the lower surface of the brittle material substrate M is scribed is shown in FIG. The outer edge portion of the upper end of the scribing head 5 of the elevation drive unit 4 is located not in contact with the lower portion of the conveyors 1a, 1b.
進而，於輸送機1a、1b之間隔P之上方，配置有沿該間隔P延伸之支承台16。該支承台16係為了於利用切割輪2進行劃線時，接觸脆性材料基板M之上表面來防止脆性材料基板M之浮升而使用者，且藉由流體缸18可升降地安裝於設置於橋體13之樑17下方。 Further, above the interval P between the conveyors 1a and 1b, a support base 16 extending along the interval P is disposed. The support base 16 is configured to be attached to the upper surface of the brittle material substrate M to prevent the floating of the brittle material substrate M when the scribing wheel 2 is scribing, and is mounted on the fluid cylinder 18 so as to be lifted and lowered. Below the beam 17 of the bridge body 13.
於上述構成中，將脆性材料基板M載置於上游側輸送機1b及下游側輸送機1a上，並藉由使切割輪2於壓抵於脆性材料基板M之背面之狀態下向X方向滾動，來加工X方向之劃線S1。當X方向之所有劃線S1之加工完成時，將脆性材料基板M旋轉90度並再次載置於輸送機1a、1b上，且藉由與上述同樣地使切割輪2一面壓抵於脆性材料基板M，一面滾動而加工Y方向之劃線S2。 In the above configuration, the brittle material substrate M is placed on the upstream conveyor 1b and the downstream conveyor 1a, and the cutting wheel 2 is rolled in the X direction while being pressed against the back surface of the brittle material substrate M. To process the X-direction scribing S1. When the processing of all the scribe lines S1 in the X direction is completed, the brittle material substrate M is rotated by 90 degrees and placed on the conveyors 1a and 1b again, and the cutting wheel 2 is pressed against the brittle material by the same as described above. The substrate M is rolled to process the scribe line S2 in the Y direction.
如上所述，於該劃線裝置中，切割輪支持體3及導輥支持體7之寬度尺寸L形成得比輸送機1a、1b之間隔P窄，且兩支持體3、7係以於切割輪2上升至劃線位置時，劃線頭5之上端外緣部分位於不接觸於輸送機1a、1b之下部之位置之方式較長地形成，故可使輸送機1a、1b之間隔P變窄至接近於該等支持體3、7之位置而形成。藉此，即便為小尺寸之脆性材料基板，亦能消除該基板於間隔P內傾斜或掉落，並且亦能消除如下不良情形：於將脆性材料基板M自上游側輸送機1b交付 至下游側輸送機1a時，基板M之前端接觸於下游側輸送機1a之前端部分而損傷、或基板M之方向產生偏移。再者，即便為薄板之脆性材料基板M，亦能緩和該基板於間隔P內下垂等現象。 As described above, in the scribing apparatus, the width dimension L of the cutter wheel support 3 and the guide roller support 7 is formed to be narrower than the interval P of the conveyors 1a, 1b, and the two supports 3, 7 are used for cutting. When the wheel 2 is raised to the scribing position, the outer edge portion of the upper end of the scribing head 5 is formed to be long in a manner not in contact with the lower portion of the conveyors 1a, 1b, so that the interval P of the conveyors 1a, 1b can be changed. It is formed to be close to the positions of the supports 3 and 7. Thereby, even if it is a small-sized brittle material substrate, the substrate can be prevented from being inclined or dropped in the interval P, and the following problem can be eliminated: the brittle material substrate M is delivered from the upstream side conveyor 1b. When the downstream conveyor 1a is reached, the front end of the substrate M comes into contact with the front end portion of the downstream conveyor 1a to be damaged, or the direction of the substrate M is shifted. Further, even in the case of the brittle material substrate M of the thin plate, the phenomenon that the substrate hangs down in the interval P can be alleviated.
於上述實施例中，表示作為載置脆性材料基板M之一對支持機構1而包括上游側輸送機1b與下游側輸送機1a之構成，但亦可代替此而如圖5所示般由隔開間隔P而配置之一對固定支持台1c、1d形成。該情形時之脆性材料基板M之搬送雖省略圖示，但只要藉由例如自設置於支持台1c、1d上表面之空氣噴出孔噴出空氣而使基板M浮起之搬送機構、或者吸附搬送機器人等基板搬送機構進行即可。 In the above embodiment, the upstream side conveyor 1b and the downstream side conveyor 1a are included as one of the brittle material substrates M on the support mechanism 1. However, instead of this, as shown in FIG. One of the openings P is arranged to form the fixed support tables 1c, 1d. In this case, the conveyance mechanism of the brittle material substrate M is not shown, but the transport mechanism that ejects the air from the air ejection holes provided on the upper surfaces of the support tables 1c and 1d, for example, or the adsorption transfer robot It is sufficient to carry out the substrate transfer mechanism.
以上，對本發明之代表性之實施例進行了說明，但本發明並不一定僅特定為上述實施例之結構。例如，亦可省略上述實施例中顯示之導輥6以及導輥支持體7而形成。又，於本發明中可於達成其目的、且不脫離權利要求之範圍之範圍內適當地進行修正、變更。 The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the configuration of the above embodiments. For example, the guide roller 6 and the guide roller support 7 shown in the above embodiment may be omitted. Further, the present invention can be appropriately modified or changed within the scope of the invention without departing from the scope of the claims.
本發明可應用於對玻璃基板、半導體基板等脆性材料基板之背面加工劃線之劃線裝置。 The present invention can be applied to a scribing device for scribing a back surface of a brittle material substrate such as a glass substrate or a semiconductor substrate.
L‧‧‧切割輪支持體及導輥支持體之寬度 L‧‧‧ Cutting wheel support and width of guide roller support
P‧‧‧支持機構之間隔 P‧‧‧Support facility spacing
Y‧‧‧方向 Y‧‧‧ direction
1‧‧‧支持機構 1‧‧‧Support institutions
1a‧‧‧輸送機 1a‧‧‧Conveyor
1b‧‧‧輸送機 1b‧‧‧Conveyor
2‧‧‧割輪 2‧‧‧ cutting wheel
3‧‧‧切割輪支持體 3‧‧‧Cutting wheel support
4‧‧‧升降驅動部(驅動部) 4‧‧‧ Lifting drive unit (drive unit)
5‧‧‧劃線頭 5‧‧‧Drawing head
9‧‧‧軸 9‧‧‧Axis
10‧‧‧軸承 10‧‧‧ bearing
11‧‧‧升降軸 11‧‧‧ Lifting shaft
12‧‧‧原動機 12‧‧‧ prime mover
14‧‧‧樑(橫樑) 14‧‧‧ beams (beams)
16‧‧‧支承台 16‧‧‧Support table
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014030136A JP6331454B2 (en) | 2014-02-20 | 2014-02-20 | Scribing equipment |
| JP2014-030136 | 2014-02-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201532989A true TW201532989A (en) | 2015-09-01 |
| TWI635058B TWI635058B (en) | 2018-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103137065A TWI635058B (en) | 2014-02-20 | 2014-10-27 | Scribing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6331454B2 (en) |
| KR (1) | KR20150098551A (en) |
| CN (1) | CN104860522B (en) |
| TW (1) | TWI635058B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106746559A (en) * | 2017-03-14 | 2017-05-31 | 凯盛科技股份有限公司 | It is a kind of to reduce the method that ultra-thin glass ruptures in streamline processing |
| KR101991269B1 (en) * | 2017-09-29 | 2019-06-20 | 주식회사 탑 엔지니어링 | Scribing apparatus |
| CN114214911B (en) * | 2022-01-05 | 2023-09-05 | 衡阳路旺建设有限公司 | An automatic equidistant marking device for roads |
| CN117400323B (en) * | 2023-12-14 | 2024-02-20 | 承德盛金维保温材料有限公司 | Convenient cutting device of insulation material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0952726A (en) * | 1995-08-11 | 1997-02-25 | Nippon Electric Glass Co Ltd | Inscribing line imparting device for thin sheet glass under movement |
| JP5256554B2 (en) * | 2008-07-18 | 2013-08-07 | 株式会社シライテック | LCD panel cleaving device |
| JP5767595B2 (en) * | 2012-02-23 | 2015-08-19 | 三星ダイヤモンド工業株式会社 | Scribing device for brittle material substrate |
-
2014
- 2014-02-20 JP JP2014030136A patent/JP6331454B2/en active Active
- 2014-10-16 CN CN201410549397.XA patent/CN104860522B/en not_active Expired - Fee Related
- 2014-10-16 KR KR1020140139684A patent/KR20150098551A/en not_active Ceased
- 2014-10-27 TW TW103137065A patent/TWI635058B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI635058B (en) | 2018-09-11 |
| JP6331454B2 (en) | 2018-05-30 |
| CN104860522A (en) | 2015-08-26 |
| KR20150098551A (en) | 2015-08-28 |
| JP2015155355A (en) | 2015-08-27 |
| CN104860522B (en) | 2018-10-09 |
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