TW201439465A - Light emitting diode tube - Google Patents

Abstract

A light emitting diode tube includes a shell, two end caps, two set of electrodes, a heat dissipation substrate, a circuit layer and at least one light emitting diode array. The shell is tubular shape. The two end caps are disposed on two opposite ends of the shell, and combine with the shell to form a tubular body. The two set of electrodes are disposed on the two end caps. The heat dissipation substrate is fixed in the tubular body and includes N+2 boards, N ≥ 1, wherein the N+1th board is connected to the Nth board and N+2th board via two elongated sides of the N+1th board opposite to each other, respectively and the N+2 boards are bended to form a polygon structure. The circuit layer is disposed on at least one board. The light emitting diode array is disposed on the board having the circuit layer thereon, and connects with the electrodes via the circuit layer.

Description

Light-emitting diode tube

The present invention relates to a lamp, and more particularly to a light-emitting diode lamp.

In today's society, the application of light emitting diodes (LEDs) is very common and easy to use. Common applications include backlight modules, desk lamps and lamps. Since the driving voltage of the light-emitting diode is low and the service life is high, the power consumption of the conventional fluorescent tube is lower. Therefore, the LED lamp has gradually replaced the traditional fluorescent tube.

In general, the LED lamp has a two-end cover, a half-cover lamp housing and a metal heat sink. The half-cover lamp cover covers the metal heat sink, and the two end caps are fixed at the two ends of the lamp. . With the metal heat sink, the light-emitting diode lamp board can be fixed in the lamp tube, and the heat is quickly dissipated by the metal heat sink. Since the conventional LED lamp is complicated in assembly, the assembly cost is increased, and the metal heat sink is blocked, and the light-emitting diode has a limited light-emitting angle or cannot be adjusted, so that a wide angle cannot be achieved (for example, 270). Degree or 360 degrees) light effect.

The invention relates to a light-emitting diode lamp for improving the habit Know the heat dissipation structure and the assembly method of the light board.

According to an aspect of the invention, a light-emitting diode lamp tube includes a lamp housing, a two-end cover, two sets of electrodes, a heat dissipation substrate, a circuit layer, and at least one LED array. The lamp housing is a long tubular shape. The two end caps are disposed at opposite ends of the lamp housing and combined with the lamp housing to form a tubular body. The two sets of electrodes are disposed on the two end caps. The heat dissipation substrate is fixed in the tubular body, and the heat dissipation substrate comprises N+2 plates, and N≧1, wherein the Nth plate body is connected to the Nth plate body and the N+2 plate body respectively on the opposite long axis sides, N+2 plates are bent into a polygonal structure. The circuit layer is disposed on at least one of the boards. The at least one LED array is disposed on the board with the circuit layer, and is electrically connected to the two sets of electrodes by the circuit layer.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

10‧‧‧Lighting diode tube

100‧‧‧Lighting diode board

101‧‧‧heated substrate

101a‧‧‧ upper surface

101b‧‧‧ lower surface

102‧‧‧ circuit layer

103‧‧‧Lighting diode array

104‧‧‧Metal substrate

105‧‧‧Insulation

106‧‧‧ lamp shell

107‧‧‧End cover

108‧‧‧Electrode

109‧‧‧Tube body

110‧‧‧ first board

111‧‧‧ board

112‧‧‧Polygon structure

113‧‧‧Care Department

120‧‧‧Second plate

121‧‧‧Card end

123‧‧‧ Scotch

130‧‧‧ Third plate

1A and 1B are schematic top and side views of the light-emitting diode lamp panel before being bent.

2A and 2B are schematic top and side views of a light-emitting diode lamp panel of another embodiment.

3A and 3B are schematic top and side views of a light-emitting diode lamp panel according to still another embodiment.

4A-4C are schematic views showing the bending of the plate body of the heat dissipation substrate into a geometric structure.

5A and 5B are schematic views showing the heat dissipating substrate after being bent in a fixing structure in the lamp housing.

FIG. 6 is a schematic view showing the heat dissipating substrate after being bent in the lamp housing in another embodiment.

FIG. 7 is a schematic view showing the heat dissipating substrate after being bent in the lamp housing in still another embodiment.

In the light-emitting diode lamp of the present embodiment, a full-cover lamp housing (for example, a glass tube or a plastic tube) and a heat dissipation substrate are used instead of the conventional half-hood lamp housing and the metal heat sink. When assembled, the two end caps can be attached directly to the full-cover lamp housing. In addition, the at least one LED array and the at least one circuit layer may be directly disposed on any one of the heat dissipation substrate, a part of the board, or all of the boards. For example, the heat dissipation substrate includes N+2 plates, and N≧1, wherein the Nth plate body is connected to the Nth plate body and the N+2 plate body on the opposite long axis sides, so that N+2 The plates are bent into a polygonal structure. After the heat dissipation substrate is bent into a polygonal structure, the position of the LED array and the circuit board can be adjusted to change the direction of the light along with the shape of the polygon, thereby achieving the effect of adjusting the light angle.

The embodiments are described in detail below, and the embodiments are only intended to be illustrative and not intended to limit the scope of the invention.

Please refer to FIGS. 1A and 1B , which are schematic top and side views of the LED panel 100 before being bent. The LED panel 100 includes a heat dissipation substrate 101, a circuit layer 102, and a plurality of LED arrays 103. The heat dissipation substrate 101 has N + 2 plates, and N is a positive integer of 1 or more. For example, the heat dissipation substrate 101 has three plate bodies, and the second plate body 120 is located on the first plate body. The first plate body 110 and the third plate body 130 are respectively connected between the first plate body 110 and the third plate body 130. The circuit layer 102 can be disposed on any of the boards. For example, the circuit layer 102 is disposed on the second board 120. The LED array 103 is disposed on a board body (for example, the second board body 120) having the circuit layer 102.

Next, please refer to FIGS. 2A and 2B , which are schematic top and side views of a light-emitting diode lamp panel 100 according to another embodiment. The LED panel 100 includes a heat dissipation substrate 101, two circuit layers 102, and two sets of LED arrays 103. The heat dissipation substrate 101 has three plate bodies, the second plate body 120 is located between the first plate body 110 and the third plate body 130, and the two opposite longitudinal sides S1 and S2 of the second plate body 120 are respectively connected to the first plate body 110. And the third plate body 130. The two circuit layers 102 are respectively disposed on the second board body. For example, the first circuit layer 102 is disposed on the first board body 110, and the second circuit layer 102 is disposed on the third board body 130. The two sets of LED arrays 103 are respectively disposed on two plates (for example, the first plate body 110 and the third plate body 130) each having a circuit layer 102.

Next, please refer to FIGS. 3A and 3B , which are schematic top and side views of a light-emitting diode lamp panel 100 according to still another embodiment. The LED panel 100 includes a heat dissipation substrate 101, a three circuit layer 102, and three sets of LED arrays 103. The heat dissipation substrate 101 has three plate bodies, the second plate body 120 is located between the first plate body 110 and the third plate body 130, and the two opposite longitudinal sides S1 and S2 of the second plate body 120 are respectively connected to the first plate body 110. And the third plate body 130. The three circuit layers 102 are respectively disposed on the three boards. For example, the first circuit layer 102 is disposed on the first board 110, and the second circuit layer 102 is disposed on the second board 120. The third circuit layer 102 is disposed. On the third plate body 130. The three groups of LED arrays 103 are respectively disposed on three boards each having a circuit layer 102.

In FIGS. 1B, 2B, and 3B, the heat dissipation substrate 101 includes a metal substrate 104 and an insulating layer 105, and the insulating layer 105 is formed on the surface of the metal substrate 104. Therefore, the circuit layers 102 of the LED board 100 and the metal substrate 104 can be electrically insulated from each other by an insulating layer 105. The insulating layer 105 is, for example, a polymer resin such as polypropylene (PP) or epoxy resin. In addition, the material of the metal substrate 104 is not limited. For example, a substrate of an aluminum substrate, a copper substrate or an alloy thereof is preferably a metal having good ductility and high thermal conductivity, and can be appropriately bent or formed into a polygonal structure. 112 (refer to Figures 4A to 4C).

Referring to FIGS. 1B, 2B and 3B, the heat dissipation substrate 101 has an upper surface 101a and a lower surface 101b. The heat-dissipating substrate 101 is an engaging end 121 at a long axis bending between the plates of the upper surface 101a to connect the plates together. Further, the lower surface 101b of the heat dissipation substrate 101 has a score 123 at a long axis bend between the respective plates. That is to say, if there are N+2 plates, the number of nicks 123 is relatively small. The shape of the score 123 is not limited, and is, for example, a V-shape, a U-shape, or a semi-circular shape. The depth of the score 123 is smaller than the thickness of each of the plates, whereby the heat dissipation substrate 101 can be appropriately bent and become a polygonal structure.

Referring to FIGS. 4A-4C, the plate body 111 of the heat dissipation substrate can be appropriately bent into any polygonal structure 112, such as an equilateral triangle structure, an isosceles triangle structure (Fig. 4A), and an equilateral square structure (Fig. 4B). ), a rectangular structure, a pentagon structure or a hexagonal structure (Fig. 4C), etc., but not limited thereto, any of the equilateral or unequal geometry structures may be used. Further, in the present embodiment, it is not limited to a single heat dissipation substrate 101. For example, for example, the plate body 111 of two or more heat dissipation substrates may be appropriately bent, and then the polygonal structure 112 of any of the above may be combined.

Please refer to FIGS. 5A and 5B , which illustrate a schematic view of the heat-dissipating substrate 101 after being bent and fixed in the lamp housing 106 by a fastening structure. In Fig. 5A, the lamp housing 106 is a long tubular lamp, and the two end caps 107 are disposed at opposite ends of the lamp housing 106 and are combined with the lamp housing 106 to form a tubular body 109. The two sets of electrodes 108 (positive/negative electrodes) are respectively disposed on the two end caps 107 and protrude beyond the end caps 107, whereby the two sets of electrodes 108 are electrically connected to the circuit layer 102, and an external power source can be supplied to the lamps. The array of light-emitting diodes 103 in the casing 106 causes it to emit light.

In addition, in FIG. 5B, after the heat dissipation substrate 101 is bent into any of the polygonal structures 112, the lamp housing 106 has an engaging portion 113 therein, which is matched with the engaging end 121 of the polygonal structure 112 to make the heat dissipation substrate. The 101 is fixed in the tubular body 109. Compared with the conventional light-emitting diode tube, the lamp tube 10 of the present invention replaces the conventional metal heat sink with the heat-dissipating substrate 101 bent into any polygonal structure 112, which is more convenient in assembly, thereby reducing the assembly cost.

In addition, in FIG. 5B, an LED array 103 can be disposed on any of the boards (for example, the second board 120) having the circuit layer 102. Therefore, the direction in which the LED array 103 is emitted can be changed. (for example, facing up), and then achieve the effect of adjusting the angle of light.

Next, please refer to FIG. 6 , which illustrates a schematic view of the heat dissipation substrate 101 after being bent in the lamp housing 106 in another embodiment. In FIG. 6 , two groups of LED arrays 103 are respectively disposed on two plates (for example, the first plate body 110 and the third plate body 130 ) having one circuit layer 102 , so that each of the lights can be changed. The direction in which the diode array 103 emits light (for example, toward the left and right sides) achieves the effect of emitting light at a wide angle (for example, 270 degrees).

Next, please refer to FIG. 7 , which shows another embodiment after bending A schematic view of the heat dissipation substrate 101 fixed in the lamp housing 106. In FIG. 7 , three groups of LED arrays 103 are respectively disposed on three boards each having a circuit layer 102 . Therefore, the direction in which each of the LED arrays 103 is emitted can be changed (for example, toward the left and right sides). Side and bottom), and then achieve a wide angle (for example, 360 degrees) light output.

The light-emitting diode lamp disclosed in the above embodiments uses the heat-dissipating substrate itself to have heat conduction and bendability, thereby improving the heat dissipation structure of the lamp tube and the assembly mode of the lamp board, thereby reducing the cost and improvement of the lamp assembly. Luminous performance of a light-emitting diode lamp.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧Lighting diode tube

101‧‧‧heated substrate

102‧‧‧ circuit layer

103‧‧‧Lighting diode array

106‧‧‧ lamp shell

110‧‧‧ first board

120‧‧‧Second plate

130‧‧‧ Third plate

Claims (10)

A light-emitting diode lamp comprising: a lamp housing, which is a long tubular shape; and a two-end cover disposed at opposite ends of the lamp housing and combined with the lamp housing as a tubular body; The heat-dissipating substrate is fixed in the tubular body, and the heat-dissipating substrate comprises N+2 boards, and N≧1, wherein the N-th board body is respectively connected to the N-th side of the long-axis side a plate body and the N+2 plate body, wherein the N+2 plate bodies are bent into a polygonal structure; the circuit layer is disposed on the at least one plate body; and the at least one light emitting diode array is disposed on the plate body The circuit layer is electrically connected to the two sets of electrodes by the circuit layer. The light-emitting diode lamp of claim 1, wherein the heat-dissipating substrate has an upper surface and a lower surface, and the long-axis bending between the plates on the upper surface is an engaging end. The light-emitting diode lamp of claim 2, wherein the lower surface of the lower surface has a score on the long axis bend, and the mark is V-shaped, U-shaped or semi-circular. The illuminating diode lamp of claim 2, wherein the lamp housing has an engaging portion that matches the engaging end of the polygonal structure to fix the heat dissipating substrate to the tubular body. in. The light-emitting diode lamp of claim 1, wherein the light-emitting diodes The plate body is bent into an isosceles triangle structure, and the circuit layer is disposed on the N+1th plate body. The light-emitting diode lamp of claim 1, wherein the plate body is bent into an equilateral geometric structure, and the circuit layer is disposed on each plate body. The light-emitting diode lamp of claim 1, wherein the heat-dissipating substrate comprises a metal substrate and an insulating layer formed on a surface of the metal substrate. The light-emitting diode lamp of claim 7, wherein the material of the metal substrate comprises copper, aluminum or an alloy thereof. The light-emitting diode lamp of claim 7, wherein the material of the insulating layer comprises a polymer resin. The light-emitting diode lamp of claim 7, wherein the lamp shell is a glass tube or a plastic tube.