TW201433660A - Adjustable current shield for electroplating processes - Google Patents

Abstract

One illustrative plating apparatus disclosed herein includes a substrate holder that is adapted to receive a substrate, an anode and an adjustable current shield positioned between the substrate holder and the anode. In this illustrative embodiment, the adjustable current shield includes a stationary member, a moveable member that is adapted to be moved relative to the stationary member and a plurality of current shield members that are operatively coupled to either the stationary member or the moveable member, wherein each of the current shield members is rotatably pinned to either the stationary member or the moveable member and wherein each of the current shield members is adapted to rotate when there is relative movement between the moveable member and the stationary member.

Description

Adjustable current shield for electroplating process

In general, the present disclosure relates to the fabrication of precision semiconductor devices and, more particularly, to an adjustable current shield that can be used in electroplating processes for forming conductive metal materials.

The fabrication of semiconductor devices typically requires the formation of electrical conductors on the semiconductor wafer. For example, conductive leads are typically formed on a wafer by electroplating (depositing) a conductive layer, such as copper, onto the wafer and forming patterned grooves. There are two types of plating equipment of the general type: fountain plating equipment and vertical plating equipment. Both have their comparative advantages in some applications. Although the orientation of the surface to be plated is different in the two different processes (the horizontal plane in the spray coating equipment and the vertical surface in the vertical plating equipment), the process operation is very similar.

In general, electroplating involves making electrical contacts of a so-called conductive "seed" layer formed on the surface of a wafer to which a conductive layer such as copper is deposited. The current is then passed through a plating solution (i.e., a solution containing ions of the deposited elements, such as a solution containing Cu ⁺⁺ ) between the anode and the conductive seed layer acting as a cathode on the wafer plating surface. The seed layer carries the plating current from the edge of the wafer where the electrical contacts are made to the center of the wafer, including through the embedded structure, the grooves, and the through holes. This produces an electrochemical reaction on the wafer plating surface resulting in the deposition of a conductive layer. In theory, the final material layer electrodeposited on the seed layer should completely fill the embedded structure and it should have a specific thickness profile across the wafer surface. In general, the thickness profile of the deposited metal should be controlled as much as possible during the electroplating process.

In order to minimize variations in the deposited material, it is important that the conductive seed layer have a uniform thickness over the wafer plating surface. However, even with very uniform seed layers, conventional electroplating processes can result in non-uniform deposition due to the so-called "edge effect" associated with such plating processes. In general, edge effect means the tendency of a conductive layer deposited near the edge of the wafer to be thicker than the center of the wafer, that is, an "edge-thick" profile. In addition, a thick edge profile is created in the final layer by reducing the current through the seed layer in the intermediate region of the wafer compared to the current flowing near the edge region of the wafer. That is, since the conductive seed layer is in contact with the periphery of the wafer and the current intensity flowing from the edge of the wafer toward the center of the wafer through the seed layer is reduced, it is plated in the center of the wafer compared to the edge region of the wafer. There are fewer conductive materials such as copper.

The formation of such thick edge layer materials makes subsequent processing more difficult. For example, such thick edge material layers make subsequent chemical mechanical polishing operations more difficult, that is, it makes it more difficult to obtain a substantially flat surface after the polishing process has been performed. In another embodiment, the plating process can be adjusted to counter the tendency to create a layer of conductive material having a thick edge profile. Various processing parameters. However, such processing variations may result in a too thin conductive layer in the middle region of the wafer, resulting in the formation of a defective wiring feature that is less thick than desired by the design process. These 瑕疵 connection features may reduce the life of the integrated circuit product and, in the worst case, may result in complete failure of the device.

In order to avoid or reduce the amplitude produced by such thick edge conductive layers, efforts have been made to use a technique involving the use of so-called current shielding. Current shielding is typically placed between the anode and the wafer and acts to reduce the electric field in the edge regions of the wafer, which reduces the amount of conductive material formed on the edge regions of the wafer. The current shield can be made of various materials such as non-conductive, inert materials, plastics, and the like. The current shield can be fixed or adjustable depending on its area between the anode and the wafer. In one embodiment, the stationary current shield has a radial width of about 20 to 30 millimeters (mm) and a thickness of about 2 to 3 millimeters. Such fixed current shields are typically sized and organized for a particular program flow and/or device by a trial and error process. Once an acceptable result is achieved, a specially designed current shield is used for production operations. Unfortunately, existing process shielding may not produce acceptable results when process conditions or wafer design changes. In this case, the current shield may need to decide (by trial and error) the new design and then put it into production service. Alternatively, the process engineer may try to "make-do" with less than the original current shield required, which may result in the production of the conductive layer not having the desired or target thickness profile and the associated problems between such layers.

The present disclosure is directed to solving or reducing the above findings Novelty adjustable current shielding for one or more problems.

The simplified summary is presented below to provide a basic understanding of certain aspects of the invention. This content is not an exhaustive overview of the invention. It is not intended to identify key or critical elements of the invention or the scope of the invention. The sole purpose is to present some concepts in a simplified form as an introduction to the more detailed embodiments described hereinafter.

In general, the present disclosure is directed to a plating tool that includes an adjustable current shield that can be used in an electroplating process. An exemplary plating apparatus disclosed herein includes a substrate holder adapted to receive a substrate, an anode, and an adjustable current shield disposed between the substrate holder and the anode. In the exemplary embodiment, the adjustable current shield includes a stationary member, a movable member adapted to move relative to the stationary member, and a plurality of currents operatively coupled to the stationary member or the movable member a shielding member, wherein each of the current shielding members is rotatably nailed to the stationary member or the movable member, and wherein each of the current shielding members is adapted to rotate when there is relative movement between the movable member and the stationary member .

Another exemplary plating apparatus disclosed herein includes a substrate holder adapted to receive a substrate, an anode, and an adjustable current shield disposed between the substrate holder and the anode. In the exemplary embodiment, the adjustable current shield includes a retaining ring, a movable ring adapted to move relative to the stationary ring, and a plurality of current shielding members operatively coupled to the stationary ring and the movable ring, wherein each a current shielding member can be rotated Scratchingly to the retaining ring or the movable ring, and wherein each of the current shielding members is adapted to rotate when there is relative movement between the movable ring and the retaining ring, thereby radially inward depending on the direction of relative movement or A portion of each of the current shielding members is moved outward.

Yet another exemplary plating apparatus disclosed herein includes a substrate holder adapted to receive a substrate, an anode, and an adjustable current shield disposed between the substrate holder and the anode, wherein the adjustable current shield comprises A plurality of segmented shield members that can be moved to effectively change the size of the opening of the adjustable current shield.

10‧‧‧Spray type plating equipment

12‧‧‧Main plating tank container

14‧‧‧ plating tank

16‧‧‧ cylindrical container wall

18‧‧‧ Height

20‧‧‧Substrate holder

22‧‧‧Integrated circuit substrate

22B‧‧‧ back side of the substrate

22F‧‧‧front plating surface

24‧‧‧Power supply

26‧‧‧ Spindle

30‧‧‧Anode

32‧‧‧Arrow

34‧‧‧Arrow

36‧‧‧ Entrance

38‧‧‧Circular pump

100‧‧‧Adjustable current shielding

102‧‧‧Fixed ring

104‧‧‧ inner surface

106‧‧‧Outer surface

108‧‧‧ stitches

110‧‧‧Protruding

111‧‧‧ recess

112‧‧‧ movable ring

113‧‧‧ gear teeth

114‧‧‧ inner surface

115‧‧‧Leverage

116‧‧‧ outer surface

118‧‧‧ stitches

130‧‧‧ Current shielding components

132‧‧‧ pivot hole

134‧‧‧ slots

136‧‧‧Part of the current shielding member, distal part

140‧‧‧Drive motor

142‧‧‧ teeth, gear teeth

150‧‧‧Arrow

150A‧‧‧ Radial inward direction

152‧‧‧Arrow

160, 162‧ ‧ direction

The disclosure may be understood by reference to the following description in which the same reference numerals are considered to be commensurate elements, and wherein: FIGS. 1 and 1A are exemplary representations of an electroplating apparatus having an adjustable current shield as disclosed herein. Simplification and Schematic of a Specific Embodiment; FIGS. 2A through 2E depict various exemplary aspects of an exemplary embodiment of an adjustable current shield as disclosed herein; and FIGS. 3A through 3B depict an illustration disclosed herein An illustrative embodiment of a plurality of current shielding members can be used in a sexually adjustable current shield.

While the technical subject matter disclosed herein is susceptible to various modifications and alternatives, the specific embodiments are shown in the drawings and are described in detail herein. However, it should be understood that this article The description of the specific embodiments is not intended to limit the scope of the invention, and the invention is intended to be replacement.

The various illustrative embodiments of the invention are described below. For the sake of clarity, not all features of the actual implementation are described in this specification. It should of course be understood that in the development of any such actual embodiment, many implementation specific decisions must be made to achieve the specific goals of the developer, such as compliance with system-related and business-related constraints, which vary from implementation to implementation. . Again, it will be appreciated that this development plan can be complex and time consuming, but would still be a routine matter for those of ordinary skill in the art having the benefit of this disclosure.

The subject matter of the present technology will now be described with reference to the drawings. The various structures, systems, and devices illustrated in the drawings are intended to be illustrative only and not to obscure the present disclosure. Nevertheless, the attached drawings are included to illustrate and explain the illustrative embodiments of the present disclosure. Words and phrases herein are to be understood and interpreted as being compatible with the words and phrases as understood by those skilled in the relevant art. A particular definition of a term or phrase, that is, a definition of ordinary and customary meaning as understood by one of ordinary skill in the art, is intended to be metaphorized by the consistent usage of the term or phrase herein. The term or phrase is intended to have a special meaning, that is, different from the term or phrase understood by those skilled in the art, this particular definition will be in the specification. Clearly presented in a clear and direct manner and with specific definitions of terms or phrases.

The present disclosure is directed to an electroplating tool that includes an adjustable current shield that can be used in an electroplating process. It will be readily apparent to those skilled in the art, after a complete reading of this application, that the methods and apparatus disclosed herein can be used in a variety of different manufacturing applications and techniques, for example, standard plating to form a uniform conductive layer. Work, patterned plating, etc. Moreover, the methods and apparatus disclosed herein can also be used to fabricate a variety of different devices including, but not limited to, logic devices, memory devices, and the like. Referring to the drawings, the various exemplary embodiments of the methods and apparatus disclosed herein will now be described in detail.

1 depicts a spray-type plating apparatus 10 in a schematic and simplified form in accordance with an exemplary embodiment disclosed herein, wherein the adjustable current shield 100 disclosed herein is substantially horizontally oriented within the apparatus 10 and vertically disposed at the anode. Above. However, as will be appreciated by those skilled in the art, the adjustable current shield disclosed herein can also be used in a vertical type of plating tool, wherein the adjustable current shield 100 disclosed herein is substantially vertically oriented thereto. In the vertical type plating tool, as shown in Fig. 1A, it is schematically shown. The disclosed electroplating apparatus 10 includes a main plating tank vessel 12 containing a conventional plating tank 14 containing an electrolytic plating bath. The cylindrical container wall 16 determines the height 18 of the plating tank 14. The electroplating apparatus 10 also includes a substrate/wafer holder 20 and a schematically depicted anode 30. The substrate holder 20 is adapted to hold the integrated circuit substrate 22. A motor (not shown) drives the main body of the substrate holder 20 and the substrate 22 to rotate around the central axis during the plating operation Axis 26. The substrate 22 has a substrate back side 22B and a substrate front plated surface 22F. The front plated surface 22F typically has a conductive seed layer (not shown) formed thereon to facilitate the plating operation, for example, a conductive copper seed layer or a tantalum or titanium nitride barrier layer. The shape and configuration of the substrate holder 20 may vary depending on the type of plating apparatus used. In some cases, the substrate holder 20 can include a compatible O-ring seal (not shown) and a conductive seed layer for electrically connecting the negative terminal of the power source 24 to the edge of the substrate 20. A set of electrical contacts (not shown). The positive terminal of the power source 24 is electrically coupled to the anode 30. Substrate 22 can be constructed of any semiconducting material such as tantalum, niobium, tantalum, ruby, quartz, sapphire, and gallium arsenide. The anode 30 is essentially illustrative in that it can be constructed from multiple components configured in various configurations and can have multiple openings.

As still shown in FIG. 1, the electroplating apparatus also includes an adjustable current shield 100 as schematically depicted herein. In general, the adjustable current shield 100 is placed between the anode 30 and the substrate 22 or substrate holder 20. The adjustable current shield 100 can be secured to the container wall 16 by any of the desired techniques, such as clips, lugs, bolted connections, and the like. The periphery of the adjustable current shield 100 does not have to be sealed against the inner face of the container wall 16. The adjustable current shield 100 can be placed at any desired distance from the substrate 22, and this distance can vary depending on the particular application. For example, the position of the adjustable current shield 100 can be determined, at least in part, based on the desired thickness profile of the conductive layer to be deposited on the substrate 22. In general, the closer the adjustable current shield 100 is to the substrate 22, the adjustable current shield 100 produces the conductive layer to be deposited on the wafer 22. The effect of the thickness profile is greater. The adjustable current shield 100 and the container wall 16 may be constructed of a material that blocks the electrolytic plating solution in the bath 14. These structures may be comprised of a composite material or dielectric material including dielectric coatings used to prevent metal plating onto these structures during the electroplating process. These structures can also be made of various plastics such as polypropylene, polyethylene and fluoropolymers (especially polyvinylidine fluoride, or ceramics such as alumina or zirconia). Apparatus 10 is a simplified and schematic depiction of an exemplary spray-type plating tool, the basic construction of which is well known to those skilled in the art. As previously described, the adjustable current shield 100 disclosed herein can also be used for so-called vertical Type plating tools, the basic construction of which is well known to those skilled in the art. Figure 1A is a simplified and schematic illustration of some of the main components of this vertical type plating apparatus. More specifically, as shown in Figure 1A. In some embodiments, the substrate holder 20, the substrate 22, and the adjustable current shield 100 are all substantially vertically oriented, wherein the adjustable current shield 100 is disposed between the substrate holder 20 and the anode 30. .

Exemplary electroplating baths 14 are conventional tanks that typically contain a metal to be plated (along with associated anions) in an acidic solution. Copper plating is usually carried out using a dissolved CuSO ₄ solution in an aqueous sulfuric acid solution. In addition to these major components of plating bath 14, tank 14 also often contains a number of additives that are any type of compound that is added to plating bath 14 to alter the plating behavior. There are three common plating bath additions depending on the design choices of those skilled in the art: inhibitors, accelerators, and levelers. The inhibitor additive blocks the plating reaction and raises the flatness of the cell. The promoter additive is typically a catalyst that accelerates the plating reaction under the influence or control of inhibition. The leveling agent acts similarly to the inhibitor, but is highly electrochemically active (i.e., easier to electrochemically convert) and has less inhibitory properties in electrochemical reactions. The leveling agent also tends to accelerate plating on the recessed areas of the plated surface, tending to flatten the plated surface. Of course, those skilled in the art, after reading this application in its entirety, will appreciate that the invention disclosed herein is not limited to the use of any type of plating bath, and that the invention disclosed herein may utilize a variety of different plating chemistries.

What will now be described is the general aspect of a typical plating process. Those skilled in the art will appreciate that the vessel wall 16 of the plating apparatus 10 acts as an overflow weir. During a typical operation, the substrate holder 20 is partially immersed in the plating tank 14 such that the electrolytic plating solution wets the plated surface 22F of the substrate 22 but does not wet the upper portion of the substrate holder 20. In general, the plating solution overflows from the container/clam 16 as indicated by arrow 32 to the space between the main plating tank vessel 12 and the vessel wall 16. Thereafter, as indicated by arrow 34, the plating solution flows to the inlet 36 of the circulation pump 38. During operation, the circulation pump 38 typically circulates the plating solution continuously to the plating tank 14, as indicated by arrow 26. In this manner, the trough height 18 can be maintained during the plating operation. Basically, the plating solution flows upward through the opening of the anode 30 (not shown) and flows around the anode 30 toward the substrate 22. During use, the power supply 24 biases the wafer 22 to a negative potential relative to the anode 30, causing current to flow from the anode 30 to the substrate 22. This also causes a current flux from the anode 30 to the substrate 22, where the current flux is defined as the number of force lines (field lines) through the area. This causes an electrochemical reaction (e.g., Cu ⁺⁺ + 2e ^- = Cu), resulting in deposition of a conductive layer (e.g., copper) on the front face 22F of the substrate 22. The ion concentration of the desired metal in the plating solution can be replenished during the plating cycle by dissolving the metal of the anode 30, such as copper, in the plating solution.

2A through 2E depict various aspects of an exemplary embodiment of an adjustable current shield 100 as disclosed herein. 3A-3B depict one illustrative embodiment of a plurality of current shield members that may be used in the exemplary adjustable current shield 100 disclosed herein. In general, in the disclosed embodiment, the adjustable current shield 100 is comprised of a retaining ring 102 (see Figures 2A-2B), an adjustable or movable ring 112 (see Figures 2C through 2D), and A plurality of current shielding members 130 (see FIGS. 3A to 3B) are constructed. As will be more fully described below, the movable ring 112 is adapted to move relative to the stationary ring 102 during operation. The relative movement of the movable ring 112 causes a portion (136) of each of the current shielding members 130 to move radially inwardly, thereby effectively changing the "size" of the shield member 130 and its shielding capability.

2A-2B depict various aspects of an exemplary embodiment of the retaining ring 102. In the illustrated embodiment, the retaining ring 102 has an inner surface 104, an outer surface 106, and a projection 110 that defines a recess 111 suitable for receiving the movable ring 112. A plurality of stitches 108 are attached to the retaining ring 102. The retaining ring 102 can be secured to the container wall 16 by any desired technique, such as a clip, a sleeve, a bolted connection, and the like (not shown). The outer surface 106 of the retaining ring 102 does not necessarily seal against the inner surface of the container wall 16. The physical dimensions of the retaining ring 102 can vary depending on various factors, including the size of the plating apparatus 10 to be used therein and the mechanical negative that is expected to be experienced during operation. Lotus. In an exemplary embodiment, the retaining ring 102 can have a radial thickness (outer diameter minus inner diameter) of about 5 to 50 millimeters, and an overall thickness of about 5 to 25 millimeters. The retaining ring 102 may be comprised of a composite material comprising a dielectric of various plastics such as polypropylene, polyethylene and a fluoropolymer (especially polyvinylidene fluoride), or a ceramic such as alumina or zirconia or Made of dielectric material. The number, size, and location of the pivot pins 108 may also vary depending on the number of current shield members 130 used in the adjustable current shield 100 and the particular application.

2C through 2D depict various aspects of an illustrative embodiment of a movable ring 112 that may be used in the adjustable current shield 100 disclosed herein. In the illustrated embodiment, the movable ring 112 has an inner surface 114 and an outer surface 116. A plurality of pins 118 are attached to the retaining ring 102. As shown in FIG. 2E, the movable ring 112 is adapted to be placed in the recess 111 formed in the retaining ring 102. Any of a variety of means can be provided to move the movable ring 112 relative to the stationary ring 102. In the illustrated embodiment, this means can include a plurality of schematically depicted gear teeth 113 coupled to the movable ring 112. The gear teeth 113 are adapted to be engaged by a drive member or device (not shown in FIG. 2C) to cause relative movement of the movable ring 112. Alternatively, this means may include a schematically illustrated lever 115 coupled to the movable ring 112. The lever 115 is adapted to cause relative movement of the movable ring 112 by a drive member or device (not shown in Figure 2C) or manually. The physical size of the movable ring 112 can vary depending on various factors, including the size of the plating apparatus 10 to be used therein and the mechanical load that is expected to be experienced during operation. In an exemplary embodiment, the movable ring 112 can have approximately 5 to 30 millimeters Radial thickness (outer diameter minus inner diameter), and overall thickness of about 5 to 20 mm. The movable ring 112 may be composed of a composite material including a dielectric of various plastics such as polypropylene, polyethylene and fluoropolymer (especially polyvinylidene fluoride), or ceramics such as alumina or zirconia. Or made of dielectric material. The number, size, and location of the pins 118 may also vary depending on the number of current shielding members 130 used in the adjustable current shield 100 and the particular application.

3A-3B depict an illustrative embodiment of a plurality of current shield members 130 that can be used with the adjustable current shield 100 disclosed herein. FIG. 3B is, to some extent, an assembly diagram of an adjustable current shield 100 having a stationary ring 102 and a movable ring 112 depicted in dashed lines. It will be apparent to those skilled in the art, after a complete reading of this application, that the size, number, shape and configuration of the current shield member 130 used in conjunction with the adjustable current shield 100 shown herein may vary depending on the particular application. In the embodiment illustrated in Figure 3A, each of the current shielding members 130 has a generally elongated, curved configuration. In the particular embodiment disclosed herein, each current shield member 130 includes a pivot hole 132 and a slot 134. In the present embodiment, the pivot hole 132 is adapted to be received and operates effectively with one of the pins 108 on the retaining ring 102, while the slot 134 is adapted to receive and function effectively with one of the pins 118 on the movable ring 112. If desired, the positions of the slots 134 and the apertures 132 on the current shield member 130 are interchangeable, but the orientation of the slots 134 must be rotated ninety degrees relative to the orientation of the slot 134 shown in the figures. In some embodiments, the slot 134 can have some degree of curvature, but is not depicted in the figures. Electricity The number and physical dimensions of the flow shield member 130 can vary depending on various factors, including the size of the plating apparatus 10 to be used therein and the mechanical load that the current shield member 130 is expected to experience during operation. In an exemplary embodiment, current shielding member 130 can have a width of about 130 to about 30 millimeters, and an overall thickness of about 1 to 3 millimeters. The current shielding member 130 may be composed of a composite material including a dielectric of various plastics such as polypropylene, polyethylene and a fluoropolymer (especially polyvinylidene fluoride), or a ceramic such as alumina or zirconia. Or made of dielectric material.

Referring to FIG. 3B, in one embodiment, the gear teeth 113 on the movable ring 112 are adapted to be engaged by the teeth 142 on an exemplary drive motor 140, such as a stepper motor. In one particular embodiment, the drive motor 140 is adapted to cause the movable ring 112 to rotate in the direction indicated by arrow 150 (clockwise) or 152 (counterclock). Thus, in the present embodiment, drive motor 140 constitutes a component of the mechanism that relatively moves moving ring 112. The illustrative lever 115 can also move in directions 160, 162 to cause relative movement of the movable ring 112. Movement of the lever 115 can be accomplished manually or by a motor mechanism, such as an electric motor (not shown) coupled to the lever 115 by a suitable mechanical linkage.

In the embodiment illustrated in FIG. 3B, the exemplary current shielding member 130 has eight components that are part of the exemplary adjustable current shield 100 disclosed herein. Of course, as noted above, the number of such current shield members 130 used in any particular plating apparatus 10 can vary depending on the particular application. Adjustable current shield 100 is shown in its fully enclosed position in Figure 3B, where it relates to current as during the plating operation Shielded, so current shield member 130 has a minimum effective width. In the particular embodiment shown herein, the distal end portion 136 of each current shield member 130 (see FIG. 3A) is placed over a portion of the adjacent current shield member 130 and, in some cases, is accessible. Adjacent current shielding member 130. The amount or extent to which the distal portion 136 overlaps adjacent current shielding members 130 may vary depending on the particular application. In some embodiments, this overlap may not exist at all.

The effective width of the current shielding member 130 can be adjusted as follows. The movable ring 112 is rotated radially toward the direction of the arrow 150 relative to the retaining ring 102 (by the lever 115 or the motor 140/gear teeth 113/142) causing a portion of the current shield member 130 to be radially oriented in the direction indicated by arrow 150A. The inner extension increases the effective width of the adjustable current shield 100. During the present process, the current shielding member 130 is rotated about the stitch 108 on the stationary ring 102. The slot 134 moves the current shield member 130 together with the pins 118 on the movable ring 112. The amount or extent by which the current shielding member 130 can move radially inward depends on the desired effective width of the adjustable current shield 100 and the particular design of the plating apparatus. In general, the adjustable current shield 100 will have a limit on how far the movable ring 112 can rotate relative to the stationary ring 102, which will correspond to the maximum of the radially inward direction 150A of the current shield member 130 (not shown). Displacement. In some cases, the overlap relationship is such that the current shield member 130 overlaps the adjacent current shield member 130 when the adjustable current shield 100 is in its fully closed position (as shown in FIG. 3B). The current shielding member 130 may not be present when displaced inward. The movable ring 112 is fixed relative to the direction indicated by the arrow 152 (counterclock) Rotation of ring 102 (by lever 115 or motor 140/gear teeth 113/142) causes current shield member 130 to move radially outward as indicated by arrow 152A, thereby reducing the effective width of adjustable current shield 100. Once the adjustable current shield 100 is adjusted such that the current shield member 130 is positioned to provide the amount of current shielding required during the plating operation, the adjustable current can be locked or tightened at the desired location by any suitable mechanism. Shield 100.

It will be apparent to those skilled in the art, after a complete reading of this application, that the adjustable current shield 100 provides a number of advantages as it relates to performing a plating operation. For example, the adjustable current shield 100 provides a process engineer with an attempt to reduce or eliminate the formation of a plated metal layer having a thick edge profile in terms of substrate design changes or process parameter changes to be processed by the plating apparatus 10. An easily adjustable mechanism for related issues. Moreover, by adjusting the shape, size and/or number of current shielding members 130, and to the extent that the current shielding member 130 can be positioned radially inward, the process engineer has the ability to "adjust" the plating operation as needed. Larger processing flexibility. In a specific embodiment, the subject matter disclosed herein is directed to a plurality of segmented shield members that include simultaneous or separate actuation of a current shield opening or opening size (effective diameter) that can be used to effectively alter a substantially circular shape. Plating equipment inside.

The specific embodiments disclosed above are illustrative only, and are intended to be modified and practiced in the various embodiments of the invention as claimed. For example, the aforementioned process steps can be performed in a different order. In addition, as The details of the construction or design shown herein are not intended to be limiting as described in the claims below. Therefore, it is to be understood that the specific embodiments disclosed above may be modified or modified and all such variations are considered within the scope and spirit of the invention. Therefore, the protection sought in this paper is as set forth in the scope of the patent application below.

10‧‧‧Spray type plating equipment

12‧‧‧Main plating tank container

14‧‧‧ plating tank

16‧‧‧ cylindrical container wall

18‧‧‧ Height

20‧‧‧Substrate holder

22‧‧‧Integrated circuit substrate

22B‧‧‧ back side of the substrate

22F‧‧‧front plating surface

24‧‧‧Power supply

26‧‧‧ Spindle

30‧‧‧Anode

32‧‧‧Arrow

34‧‧‧Arrow

36‧‧‧ Entrance

38‧‧‧Circular pump

100‧‧‧Adjustable current shielding

Claims (30)

A plating apparatus comprising: a substrate holder adapted to receive a substrate; an anode; and an adjustable current shield disposed between the substrate holder and the anode, wherein the adjustable current shield comprises: a fixed type a member; a movable member adapted to move relative to the stationary member; and a plurality of current shielding members operatively coupled to the fixed member and the movable member, wherein each of the plurality of current shielding members One of the fixed member or the movable member is rotatably nailed, and wherein each of the current shielding members is adapted to rotate when there is relative movement between the movable member and the fixed member. The apparatus of claim 1, wherein the substrate holder is placed vertically above the anode, and the adjustable current shield is placed vertically above the anode. The apparatus of claim 1, wherein the substrate holder, the anode, and the adjustable current shield are each substantially vertically oriented, and wherein the adjustable current shield is transverse to the substrate Between the holder and the anode. The apparatus of claim 1, wherein the fixed and movable members each have a ring-shaped configuration. The apparatus of claim 1, further comprising means for moving the movable member relative to the stationary member. The apparatus of claim 1, further comprising a plurality of gear teeth operatively coupled to the movable member. The device of claim 1, further comprising a lever operatively coupled to the movable member. The apparatus of claim 1, wherein a portion of each of the plurality of current shielding members overlaps a portion of an adjacent current shielding member when the adjustable current shield is in a fully closed position. The apparatus of claim 1, wherein when the adjustable current shield is in the fully closed position, a portion of each of the plurality of current shielding members overlaps and contacts a portion of the adjacent current shielding member. . A plating apparatus comprising: a substrate holder adapted to receive a substrate; an anode; and an adjustable current shield disposed between the substrate holder and the anode, wherein the adjustable current shield comprises: a fixed type a member; a movable member adapted to move relative to the stationary member; and a plurality of current shielding members operatively coupled to the fixed member and the movable member, wherein the plurality of current screens Each of the shielding members is rotatably nailed to one of the stationary member or the movable member, and wherein a portion of each of the current shielding members is adapted to be used between the movable member and the fixed member Depending on the direction of relative movement and moving inward or outward when moving relative to each other. The apparatus of claim 10, wherein when the adjustable current shield is in the fully closed position, a portion of each of the plurality of current shield members overlaps a portion of the adjacent current shield member. The apparatus of claim 11, wherein when the adjustable current shield is in the fully closed position, a portion of each of the plurality of current shielding members overlaps and contacts a portion of the adjacent current shielding member . The apparatus of claim 10, wherein the substrate holder is placed vertically above the anode, and the adjustable current shield is placed vertically above the anode. The apparatus of claim 10, wherein the substrate holder, the anode, and the adjustable current shield are each substantially vertically oriented, and wherein the adjustable current shield is transverse to the substrate Between the holder and the anode. A plating apparatus comprising: a substrate holder adapted to receive a substrate; an anode; and an adjustable current disposed between the substrate holder and the anode Shielding, wherein the adjustable current shield comprises: a fixed ring; a movable ring adapted to move relative to the fixed ring; and a plurality of current shielding members operatively coupled to the fixed ring and the movable ring, wherein Each of the plurality of current shielding members is rotatably nailed to one of the stationary ring or the movable ring, and wherein each of the current shielding members is adapted to be between the movable ring and the stationary ring Rotating relative to movement whereby a portion of each of the current shielding members is moved radially inward or outward depending on the direction of relative movement. The apparatus of claim 15 wherein the substrate holder is placed over the anode and the adjustable current shield is placed over the anode. The apparatus of claim 15 further comprising means for moving the movable member relative to the stationary member. The apparatus of claim 15 wherein, when the adjustable current shield is in the fully closed position, a portion of each of the plurality of current shield members overlaps a portion of the adjacent current shield member. The device of claim 15, wherein when the adjustable current shield is in the fully closed position, a portion of each of the plurality of current shielding members overlaps and contacts a portion of the adjacent current shielding member . The apparatus of claim 15 wherein the substrate holder is placed vertically above the anode and the adjustable current shield is placed vertically above the anode. The device of claim 15, wherein the substrate holder, the anode, and the adjustable current shield are each substantially vertically oriented, and wherein the adjustable current shield is transverse to the substrate Between the holder and the anode. A plating apparatus comprising: a substrate holder adapted to receive a substrate; an anode; and an adjustable current shield disposed between the substrate holder and the anode, wherein the adjustable current shield comprises: a fixing ring a movable ring adapted to move relative to the stationary ring; and a plurality of current shielding members operatively coupled to the stationary ring and the movable ring, wherein each of the plurality of current shielding members is rotatably stapled In the retaining ring, and wherein each of the current shielding members is adapted to rotate as the movable ring moves relative to the stationary ring, thereby shielding the current depending on the direction in which the movable ring moves relative to the stationary ring A portion of each of the members moves radially inward or outward. The device of claim 22, wherein the plurality of current screens when the adjustable current shield is in a fully closed position A portion of each of the shielding members overlaps a portion of the adjacent current shielding member. The apparatus of claim 23, wherein when the adjustable current shield is in the fully closed position, a portion of each of the plurality of current shielding members overlaps and contacts a portion of the adjacent current shielding member . The apparatus of claim 22, wherein the substrate holder is placed vertically above the anode, and the adjustable current shield is placed vertically above the anode. The apparatus of claim 22, wherein the substrate holder, the anode, and the adjustable current shield are each substantially vertically oriented, and wherein the adjustable current shield is transverse to the substrate Between the holder and the anode. A plating apparatus comprising: a substrate holder adapted to receive a substrate; an anode; and an adjustable current shield disposed between the substrate holder and the anode, wherein the adjustable current shield comprises: A plurality of segmented shield members that move to effectively change the size of the opening of the adjustable current shield. The apparatus of claim 27, wherein when the adjustable current shield is in a fully closed position, a portion of each of the plurality of segmented shield members is associated with an adjacent segmented shield member Some overlap and touch. The apparatus of claim 27, wherein a portion of each of the plurality of segmented shield members is adapted to move radially inward or outward upon movement. The apparatus of claim 27, wherein the size is an effective diameter of the opening.