TW201417158A - Method and apparatus for separating protective tape and separation tape used for the same - Google Patents

Abstract

The disclosed method for separating protective tape of the invention is to heat a chip held on an annular frame via adhesive tape after separating a wafer attached with protective tape into chips. Accordingly, the chip-shaped protective tape is wound cylindrically along a single axis s to be peeled partially from the chip. The separation tape is pressed by an attachment roller while attaching the separation tape at least to the chip distribution region. The separation tape has an adhesive layer with strong adhesion at the adhesion portion of the chip distribution region compared to the portion facing the wafer outer periphery. The protective tape wound cylindrically and the separation tape are peeled off to remove integrally from the chip by peeling off the separation tape.

Description

Protective tape peeling method, protective tape peeling device, and peeling tape used therefor

The present invention relates to a protective tape peeling method in which a semiconductor wafer in a state in which a protective tape for surface protection is attached is subjected to a dicing treatment, and a peeling tape is attached to the protective tape to be peeled off and removed. The protective tape peeling device and the peeling tape used therefor.

A sensor type such as a CMOS (Complementary Metal Oxide Semiconductor) manufactured from a small wafer (wafer) of a semiconductor wafer (hereinafter, referred to as "wafer" as appropriate) is expected to be packaged on a substrate. Previously, adhesion, contamination, and damage of dust to the wafer were avoided. Therefore, before the backgrind, the wafer is subjected to a dicing process in a state in which a protective tape attached to the surface of the wafer is attached. Then, the release tape is attached to the protective tape which is then held on the wafer of the ring frame via the dicing tape, and is peeled off (refer to Japanese Laid-Open Patent Publication No. 2003-209073).

Further, the wafer is subjected to a crystal cutting process by attaching a protective tape which is wound into a cylindrical shape along a single axis by heating. After the dicing, the wafer which is then held in the annular frame via the dicing tape is heated to peel off the protective tape. Thereafter, a method of attaching the release tape to the protective tape and peeling it off from the wafer is carried out (refer to Japanese Laid-Open Patent Publication No. 2010-129607).

In the peeling method of the prior protective tape, the following problems occurred.

That is, when the release tape is attached to the protective tape, the attaching roller rolls on the peeling tape from one end side toward the other end side of the ring frame. Due to the pressure exerted on the attaching roller downward The force causes a problem such as that the roller is caught between the ring frame and the wafer, and the adhesive surface of the peeling tape is adhered to the adhesive surface of the dicing tape, and the peeling tape cannot be peeled off.

Specifically, the release tape must have a strong adhesiveness, that is, a protective tape which is closely peeled off from the wafer after self-crystallization by heating, and is peeled off from each wafer to remove the protective tape. It will not fall off during the process. Since the tubular protective tape is attached to the wafer, the gap from the wafer is increased, so that when the peeling tape is attached, the adhesive surface of the peeling tape can be prevented from coming into contact with the wafer.

However, there is a case where the adhesive surface of the dicing tape and the adhesive surface of the peeling tape are followed by the slack of the peeling tape at the time of the sinking of the attaching roller or the operation. In this case, since the two adjoining faces are firmly adhered, the protective tape cannot be peeled off from the wafer. If the peeling tape is forcibly stretched in this state, since the adhesive force exceeds the tensile force, the following problem also occurs: the dicing tape is broken, or the wafer sandwiched between the peeling tape and the dicing tape is excessively applied. Stretching force to deform or break it.

Further, if the release tape is also in contact with or follows the annular frame, peeling from the annular frame becomes extremely difficult, and the workability is remarkably lowered. Further, in the case where the ring frame is forcibly peeled off, there is a case where a new contact is generated in a portion other than the annular frame due to excessive force, and the film cannot be peeled off.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a protective tape peeling method, a protective tape peeling device, and a use which can peel off and remove a protective tape which is cut into a wafer shape by a dicing process with high precision from a wafer. Stripping tape for it.

Therefore, the present invention has the following constitution in order to achieve such an object.

That is, a protective tape peeling method is a method of peeling a protective tape from a semiconductor wafer held by a support tape by a support tape, and the above method includes the following process: a first peeling process, which is attached to the above After the semiconductor wafer of the protective tape is separated into wafers, the wafer held by the adhesive tape and held in the ring frame is heated, thereby making the wafer The protective tape of the shape is partially detached from the wafer by being uniaxially wound into a cylindrical shape; the attaching process is performed by the attaching member while being pressed against the peripheral portion of the semiconductor wafer by the attaching member. a peeling tape having a strongly adhered adhesive layer attached to a portion of the wafer distribution region, at least one of which is attached to the wafer distribution region; and a second peeling process which is wound by peeling off the peeling tape The tubular protective tape is peeled off from the wafer integrally with the release tape.

According to this method, the peeling tape has an adhesive layer which is strongly adhered to the attachment portion to the wafer distribution region as compared with the portion facing the outer peripheral region of the semiconductor wafer. In other words, the peripheral region is less adhesive, non-adhesive, or has a release treatment than the wafer distribution region. Therefore, the peeling tape does not follow the adhesive face of the adhesive tape (cutting tape) exposed between the wafer and the ring frame. Since the adhesive force of the peeling tape is weak even after that, the tape can be easily peeled off from the adhesive tape. Moreover, even if the peeling tape is attached to the ring frame, it can be easily peeled off.

That is, the peeling error caused by the adhesion between the peeling tape and the adhesive tape does not occur. Further, since the peeling tape can be smoothly peeled off from the ring frame, work efficiency is also improved.

Further, in the above method, the release tape may be cut into a strip shape or a ring frame shape in advance.

For example, when the release tape is in the form of a belt, it is preferable to take up the release tape which is integrated with the protective tape after the second peeling process.

According to this method, a plurality of protective tapes attached to the peeling tape are not scattered, but can be wound into a roll shape.

Further, the peeling tape of the shape of the annular frame can be utilized, for example, in the following manner. The protective tape peeling method of the present invention includes a cutting process in which a peeling tape is attached to a peeling annular frame that is superposed on a ring frame, and the peeling tape is cut into the peeling by a cutting member. The shape of the ring frame is used; during the attaching process, the peeling tape attached to the ring frame for peeling is attached to the protective tape; In the second peeling process, the protective tape and the release tape are integrally peeled off from the wafer in association with the recovery of the ring frame for peeling; and the protective tape peeling method of the present invention includes a third peeling process, which will be The protective tape and the peeling tape are peeled off from the recovered peeling ring frame.

Alternatively, in the attaching process, the peeling annular frame to which the peeling tape which has been cut into the shape of the peeling annular frame is attached is superposed on the annular frame, and the peeling tape is attached to the peeling tape. In the second peeling process, the protective tape and the release tape are integrally peeled off from the wafer in association with the recovery of the peeling annular frame; and the protective tape peeling method of the present invention includes a third peeling process, the third peeling In the process, the protective tape and the peeling tape are peeled off from the recovered peeling ring frame.

According to this method, since the annular frame for peeling is superposed on the annular frame, the gap from the adhesive surface of the adhesive tape for support to the peeling tape can be obtained. Therefore, it is possible to surely avoid the peeling tape and the adhesive tape.

Further, in each of the above methods, it is preferred that the release tape is attached from the direction in which the protective tape is wound during the attaching process.

According to this method, the protective tape is formed into a cylindrical shape on the wafer by heating. That is, since the pressing of the attaching member in the moving direction coincides with the winding direction, the peeling tape is easily elastically deformed. Therefore, it is possible to suppress the stress of the protective tape when the adhesive member is moved in a direction in which the attaching member crosses the winding direction in which the protective tape is hard to be elastically deformed, and the peeling tape is attached to the protective tape, thereby avoiding the wafer. Gives scratches or damage caused by the protective tape.

Moreover, in order to achieve such an object, the present invention has the following constitution.

That is, a protective tape peeling device that is a peeling protection tape for a semiconductor wafer held by a support tape by a support tape, and the device includes the following structure: a holding table to which the protective tape is attached After the semiconductor wafer is divided into wafers, the wafer held by the adhesive tape and held in the annular frame and the annular frame are held; a heater that heats the wafer on the holding stage; a tape supply portion that supplies a strip-shaped peeling tape toward the annular frame and the wafer distribution region, the strip-shaped peeling tape being compared with the semiconductor wafer a portion of the opposite portion of the region that is attached to the wafer distribution region has a strongly adhesive layer; an attaching mechanism that causes the attaching roller to roll on the peeling tape, and attaches the peeling tape to the protective tape and the ring a protective frame which is heated by a heater to be wound into a cylindrical shape along a single axis and partially attached to the wafer; and a peeling mechanism that peels off the protective tape from the wafer and is integrally peeled off And a belt recovery portion that winds up and collects the peeling tape after the peeling.

According to this configuration, when the peeling tape of the protective tape is attached, the portion of the peeling tape that is opposite to the peripheral region of the semiconductor wafer is weaker or non-adhesive than the wafer distribution region, and thus the semiconductor wafer and the ring are formed. The adhesive surface of the support adhesive tape exposed between the frames and the peeling tape may become difficult to follow. Therefore, even if the adhesive tape and the peeling tape are followed, the peeling can be easily performed.

Further, since the take-up and recovery belt is integrated into the peeling tape, the tubular protective tape can be wrapped. Therefore, scattering of the peeled protective tape can be prevented.

Moreover, in order to achieve such an object, the present invention has the following constitution.

In other words, a protective tape peeling device is characterized in that the protective tape is peeled off from a semiconductor wafer held by a support tape by a support tape, and the device includes the following structure, that is, a holding table After dividing the semiconductor wafer with the protective tape into a wafer, the wafer held by the adhesive tape and held in the annular frame, the annular frame, and a peeling annular frame overlapping the annular frame are held; a heater that heats the wafer on the holding stage; and a tape supply unit that supplies a strip-shaped peeling tape toward the peeling annular frame, the strip-shaped strip The peeling tape has an adhesive layer strongly adhered to a portion attached to the wafer distribution region in a portion opposed to the peripheral region of the semiconductor wafer; and an attaching mechanism that causes the attaching roller to roll on the peeling tape And attached to the protective tape and the peeling annular frame, the protective tape is heated by the heater to be wound into a cylindrical shape along a single axis, and locally attached to the wafer; the cutting mechanism borrows The peeling tape is cut into the shape of the peeling annular frame by the cutting member; the tape collecting portion collects the peeling tape after the cutting, and the peeling mechanism for peeling the protective tape after the peeling tape is attached The annular frame is lifted up and down relative to the wafer to peel the protective tape from the wafer, and a tape collecting portion that collects the peeling tape from the peeling annular frame.

Moreover, in order to achieve such an object, the present invention has the following constitution.

In other words, a protective tape peeling device is characterized in that the protective tape is peeled off from a semiconductor wafer held by a support tape by a support tape, and the device includes the following structure, that is, a holding table After the semiconductor wafer with the protective tape is divided into wafers, the wafer held by the adhesive tape and held in the annular frame and the annular frame are held, and the heater heats the wafer on the holding table; a transfer mechanism that attaches a peeling ring frame to which a peeling tape is attached, and a ring frame placed on the holding table, the peeling tape being opposed to a portion facing the outer peripheral region of the semiconductor wafer a portion attached to the wafer distribution region has a strongly adhesive layer; an attaching mechanism that causes the attaching roller to roll on the peeling tape and attach to the protective tape and the peeling annular frame, the protective tape is The heater is heated and wound into a cylindrical shape along a single axis, and is locally attached to the wafer; and a peeling mechanism that lifts and lowers the peeling annular frame after attaching the protective tape to the peeling tape to the wafer And will protect Wafer peeled from the tape; and A belt collecting portion that takes up the peeling tape from the above-mentioned peeling ring frame.

According to the above two configurations, the peeling annular frame is superposed on the annular frame, and is attached to the peeling annular frame to attach the peeling tape to the protective tape, so that the adhesive surface of the self-supporting adhesive tape can be obtained to be peeled off. With the gap. Therefore, the adhesion of the adhesive tape to the peeling tape can be surely avoided.

1‧‧‧ wafer

2‧‧‧Shrinkage film

3‧‧‧Detainment

4‧‧‧Substrate

5‧‧‧Adhesive layer

6‧‧‧Adhesive layer

7‧‧‧Distribution area

10‧‧‧ Keeping the table

11‧‧‧With the supply department

12‧‧‧ Attachment unit

13‧‧‧ peeling unit

14‧‧With recycling department

15‧‧‧Optical sensor

16‧‧‧rails

17‧‧‧heater

18‧‧‧Supply bobbin

19‧‧‧ peeling roll

20‧‧‧Separator recycling department

21‧‧‧Recycling bobbin

22‧‧‧ movable frame

23‧‧‧ Attachment roller

24‧‧‧rail

25‧‧‧Motor

26‧‧‧ Screw shaft

27‧‧‧ peeling roller

28‧‧‧feed rolls

29‧‧‧Pressure roller

30‧‧‧Motor

31‧‧‧ Screw shaft

32‧‧‧Bob

33‧‧‧Transportation agency

35‧‧‧Control Department

40‧‧‧ peeling ring frame

45‧‧‧With cutting mechanism

46‧‧‧Support arm

47‧‧‧Cutter unit

48‧‧‧Cut cutter

50‧‧‧Edge components

51‧‧‧ Attachment roller

DT‧‧‧Support adhesive tape

F‧‧‧ ring frame

MF‧‧‧ installation framework

PT‧‧‧protective tape

S‧‧‧ spacer

Ts‧‧‧ peeling tape

* In order to explain the invention, there are several aspects that are currently considered to be preferable, but it should be understood that the invention is not limited to the configuration and countermeasures as illustrated.

Figure 1 is a perspective view of a mounting frame after dicing.

Figure 2 is a cross-sectional view of the protective tape.

Figure 3 is a perspective view showing a protective tape peeled from the wafer by heating.

Figure 4 is a bottom view of the peeling tape.

Figure 5 is a cross-sectional view of the peeling tape and the mounting frame.

Figure 6 is a plan view of the protective tape peeling device.

Figure 7 is a front view of the protective tape stripping device.

8 to 11 are schematic views showing the peeling operation of the protective tape.

Fig. 12 is a schematic view showing a peeling operation of a protective tape according to a modification.

13 to 19 are schematic views showing the peeling operation of the protective tape according to the modification.

20 to 21 are schematic views showing the operation of attaching the peeling tape of the modified example to the peeling annular frame in advance.

22 to 23 are cross-sectional views of a peeling tape of a modification.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<protection belt>

The protective tape protects the circuit surface formed on the surface of the semiconductor wafer (hereinafter, simply referred to as "wafer"). Therefore, a protective tape is attached to the surface of the wafer before the back grinding step. Thereafter, the protective tape PT is attached to the wafer and the wafer after the dicing from the back grinding step to the completion of the dicing step. That is, as shown in FIG. 1, the protective tape PT is cut into the same shape as the wafer 1 in the mounting frame MF.

Further, for example, as shown in FIG. 2, the protective tape PT includes a shrinkable film layer 2 having shrinkability at least in the uniaxial direction, and a restraining layer 3 that restrains shrinkage of the shrinkable film layer 2. The protective tape PT is configured to be spontaneously peeled off from the wafer by imparting stimulation such as heating to shrinkage. In other words, the protective tape PT is spontaneously wound in one direction from one end portion or spontaneously wound from the opposite end portions toward the center after being stimulated to cause contraction. One or two cylindrical wound bodies are formed as shown in FIG. 3, and are peeled off from the wafer 1. Further, since the adhesiveness did not completely disappear at the time of becoming the wound body, it was locally attached to the wafer 1.

<Peel strip>

The release tape is attached to the protective tape PT which is formed into a cylindrical shape on each wafer 1 by heating after the dicing step, and is peeled off.

As shown in FIGS. 4 and 5, the release tape Ts has adhesive layers 5 and 6 having different adhesion forces on the substrate 4. That is, as shown in FIG. 4, the base material 4 is formed to be wider than the mounting frame MF in which the wafer is attached to the annular frame f via the support adhesive tape DT (cutting tape). The substrate 4 may also be in the form of a single piece or a strip. Further, in the case of using a circular pre-cut tape having the adhesive layer 6, the substrate 4 is used as a carrier tape.

The material of the substrate 4 is not particularly limited, and a general material can be used. For example, a polyester substrate including polyethylene terephthalate or polyethylene naphthalate, a polyolefin substrate such as polyethylene or polypropylene, and a polyvinyl chloride-based material and ethylene may be used. A single layer or a multi-layer substrate of at least one of a vinyl acetate-acrylate substrate, a polyimide substrate, a polyamide substrate, a metal, a paper, and the like. In particular, a polyolefin substrate, a polyvinyl chloride-based material, and an ethylene-vinyl acetate-acrylate substrate have high flexibility, and thus can be preferably used in the following aspects: self-winding property of the protective tape Adhesive tape and rolled by heat treatment In the case of the wound state, when the peeling tape is attached, it is easy to follow the shape of the wound body, and the adhesiveness can be further improved.

The adhesive layer 5 is formed on the substrate 4 so as to be separated from the portion on the opposite side of the wafer distribution region 7 after the dicing process. In other words, the adhesive layer 5 is formed on a portion opposite to the peripheral region of the wafer shape.

As the material of the adhesive layer 5, a known adhesive mainly composed of acrylic acid, natural rubber, synthetic rubber, or polyoxymethylene rubber can be used.

The adhesive layer 6 is formed on the substrate 4 so as to face the wafer distribution region 7. The adhesive layer 6 is formed of a strongly adherent adhesive as compared with the adhesive layer 5.

Furthermore, the adhesive layer 6 is preferably larger than the outer shape of the wafer. In other words, in the process of peeling off the protective tape PT from the wafer 1, the film is formed into a cylindrical shape and completely peeled off from the wafer 1 and then re-attached. At this time, there is a case where the guard band PT is slightly rolled to shift the direction or position and then re-attach to the wafer 1. According to this phenomenon, when this phenomenon occurs in the vicinity of the outer periphery of the wafer distribution region 7, the protective tape PT may be slightly exposed from the wafer distribution region 7. Therefore, the adhesive layer 6 is preferably a few millimeters larger than the wafer shape corresponding to the wafer distribution area.

Here, the adhesive force of the adhesive layer 6 is sufficient as long as it has sufficient adhesion to remove the adhesive force of the cylindrical protective tape PT and adhesion or viscosity (viscosity). For example, when it is attached to stainless steel (SUS (Steel Use Stainless) 304), the peeling angle is 180°, the peeling speed is 300 mm/min, and the adhesive force at room temperature is 2.5 N/20 mm or more. It is preferably 3.5 N/20 mm or more, more preferably 7.0 N/20 mm or more.

If the adhesion is less than 2.5 N/20 mm, the protective tape PT peeled off from the wafer 1 cannot be completely held and dropped.

The tackiness must be such that the peeling tape Ts is attached to the protective tape PT while the protective tape PT is held. Viscosity is measured in the viscous probe 250kN / m ² or more, preferably 300kN / m ² or more, more preferably 350kN / m ² or more. In the case where the viscosity is less than 250 kN/m ² , it is difficult to instantaneously maintain the protective tape PT.

Further, the measurement of the viscosity was obtained according to the following conditions. A release tape Ts having the same adhesive layer 6 as the present invention was attached to a 75 mm × 20 mm glass slide. In addition, the peeling tape Ts is prepared by attaching a double-sided tape (No. 5610, manufactured by Nitto Denko Corporation) to the slide glass, and bonding the base material of the peeling tape Ts to the double-sided tape. On the tape.

The evaluation device was a Tacking tester (manufactured by RHESCA Co., Ltd., TAC-II). The conditions and settings of the evaluation device are: probe material: SUS304, probe diameter: 5mm, probe pressing speed: 30mm/min, probe pulling speed: 30mm/min, pressurized load: 100gf, Pressurization time: 3 seconds, and measurement temperature: 23 °C.

Under this condition, the maximum load when the probe in contact with the surface of the adhesive layer 6 was pulled vertically was measured, and the average value of n = 10 was determined as the probe viscosity value.

Further, in order to reliably hold the protective tape which is deformed into a tubular shape, it is preferable that the adhesive layer 6 is deformed so as to follow the shape of the protective tape PT. Therefore, in order to cause such deformation, the thickness of the adhesive layer 6 × Young's modulus is in the range of 5 × 10 ^-3 to 3 × 10 ³ N / m, preferably 1.5 × 10 ^-2 to 2.3 × 10 ³ The range of N/m is more preferably in the range of 3 × 10 ^-2 to 1.5 × 10 ³ N/m.

In the case where the thickness of the adhesive layer 6 and the Young's modulus are less than 5 × 10 ^-3 N/m, there is a case where the deformation of the adhesive layer 6 becomes excessively large and is also below the protective tape PT. The wafer surface is in contact, so that it is not possible to recover only the protective tape PT.

When the thickness of the adhesive layer 6 × the Young's modulus exceeds 3 × 10 ³ N/m, the deformation is insufficient, and the adhesion to the protective tape PT is low, and good peeling removal cannot be achieved.

The thickness of the adhesive layer 6 is in the range of 5 to 2000 μm, preferably in the range of 15 to 1500 μm, more preferably in the range of 30 to 1000 μm. Further, the Young's modulus of the adhesive of the adhesive layer 6 (the stretching speed is 50 mm/min in an environment of 23 ° C) is in the range of 0.001 to 1.5 MPa.

Further, the Young's modulus was measured in accordance with the following conditions. For the measuring device: Tensilon universal testing machine (manufactured by ORIENTEC Co., Ltd., RTC-1150A), tensile speed: 50mm/min, distance between chucks: 10mm, measuring temperature: 23°C, 50mm×50mm The layer 6 was rolled into a rod shape to obtain a sample. The sample was mounted at a distance of 10 mm between the chucks and stretched at 50 mm/min, thereby obtaining stress-strain related measurements. The Young's modulus was obtained by obtaining stress at two points of 0.2% and 0.45%. This measurement was repeated 5 times for the same sample, and the average value thereof was used.

<Protection tape peeling device>

The protective tape peeling apparatus of the present embodiment is subjected to a dicing treatment on the wafer W in a state in which the protective tape PT is attached, and then distributed in the direction of the support tape DT and then held in the ring as shown in FIG. The wafer distribution area 7 of the plurality of wafers 1 of the frame f is attached to the peeling tape Ts to be peeled off.

Fig. 6 is a plan view showing the entire configuration of a protective tape peeling device according to an embodiment of the present invention, and Fig. 7 is a front view thereof.

The protective tape peeling device includes a holding table 10, a tape supply portion 11, a attaching unit 12, a peeling unit 13, a tape collecting portion 14, an optical sensor 15, and the like.

The holding table 10 adsorbs and holds the mounting frame MF. Further, the holding table 10 is configured to be reciprocally movable along the guide rail 16 between the mounting position of the mounting frame MF and the attaching position of the peeling tape Ts by the driving mechanism. Further, a heater 17 is embedded in the holding table 10. Further, the heater 17 corresponds to the heater of the present invention.

As shown in FIG. 7, the tape supply unit 11 guides the peeling tape Ts attached to the separator s from the supply bobbin 18 to the peeling roller 19. The peeling roller 19 winds the guide spacer s and peels it from the peeling tape Ts, and guides it to the spacer collecting portion 20. Therefore, the tape supply unit 11 is configured to guide the peeling tape Ts of the peeled spacer s to the attaching unit 12.

The supply bobbin 18 is coupled to the electromagnetic brake in conjunction with the electromagnetic brake to apply appropriate rotational resistance, thereby preventing the excessive feeding of the belt.

The separator collecting unit 20 includes a collecting bobbin 21 that winds up the separator s stripped from the peeling tape Ts, And controlled by motor rotation drive.

The attaching unit 12 includes an attaching roller 23 that can be lifted and lowered on the movable frame 22 attached to the movable table by an actuator such as a cylinder. Further, the attaching unit 12 is supported in such a manner as to be horizontally movable along the guide rails 24, and is screw-fed and driven by the screw shaft 26 driven by the motor 25 in forward and reverse rotation. Furthermore, the attaching unit 12 corresponds to the attaching mechanism of the present invention.

The peeling unit 13 is provided with a peeling roller 27. Further, the entire peeling unit 13 is supported so as to be horizontally movable along the guide rails 24, and the screw feed drive is reciprocally driven by the screw shaft 31 driven by the motor 30 in the forward and reverse rotation. On the downstream side of the peeling unit 13, a feed roller 28 and a pressure roller 29 driven by a motor are provided. Further, the peeling unit 13 corresponds to the peeling mechanism of the present invention.

The tape collecting portion 14 winds up and collects the peeling tape Ts to which the protective tape PT peeled off by the peeling unit 13 is attached, to the bobbin 32.

The optical sensor 15 is mounted above the attachment position. The optical sensor 15 includes a camera or a photo sensor or the like. Therefore, the optical sensor 15 monitors the position of the adhesive layer 6 of the peeling tape Ts, and transmits the image data at the time of monitoring to the control unit 35.

The control unit 35 controls the operation of the tape supply unit 11 based on the image data transmitted from the optical sensor 15, and controls the peeling of the peeling tape Ts so that the adhesive layer 6 of the peeling tape Ts overlaps the wafer distribution region 7.

Next, based on Figs. 7 to 11, the operation of the above-described embodiment will be explained.

The mounting frame MF after the dicing process is placed on the holding table 10 at the mounting position by the conveying mechanism 33 shown in FIG. The holding table 10 holding the mounting frame MF is moved to the attached position. At this time, as shown in FIG. 7, the attaching unit 12 and the peeling unit 13 are located at the initial position on the left side.

When the holding table 10 reaches the attaching position, the heater 17 is actuated to cause the protective tape PT to be cylindrical and peeled off from the wafer 1. At this time, the protective tape PT is attached to the contact portion of the center thereof. Attached to the wafer 1 in part.

When the heat treatment by the heater 17 is completed, the cylinder is actuated to lower the pressure roller 29, and the peeling tape Ts is held by the feed roller 28.

Next, as shown in FIG. 8, the attaching roller 23 is lowered, and the attaching unit 12 is moved forward. The peeling tape Ts is pressed along with the movement of the attaching roller 23. Therefore, the adhesive layer 5 is attached to the annular frame f, and is gradually attached to the wafer distribution region 7.

As shown in FIG. 9, when the attaching unit 12 reaches the end position beyond the holding table 10, the peeling unit 13 is actuated. That is, the holding of the peeling tape Ts by the pressing roller 29 is released, and the peeling unit 13 as a whole is moved to the end position of the peeling operation. At this time, the portion of the weakly adhered adhesive layer 5 is easily peeled off from the ring frame f. Since the portion of the strongly adhered adhesive layer 6 is in close contact with the protective tape PT, the protective tape PT is gradually peeled off from the wafer 1.

As shown in FIG. 10, when the peeling unit 13 reaches the end position beyond the holding stage 10, the tape collecting portion 14 winds up the recovered peeling tape Ts, and the tape feeding portion 11 successively feeds the peeling tape Ts of a specific length. At the same time, as shown in FIG. 11, the peeling unit 13 and the attaching unit 12 return to the initial position.

Further, the holding table 10 is moved from the attaching position to the placing position. Thereafter, the mounting frame MF in which the protective tape is peeled off is carried out.

The action of one of the embodiments of the embodiment is completed in accordance with the above, and then the same action is repeated until a certain number of slices is reached.

According to the apparatus of the above embodiment, the adhesive layer 5 of the peeling tape Ts opposed to the region on the outer side of the wafer distribution region 7 is weaker adhered to the adhesive layer 6 attached to the wafer distribution region 7. That is, the adhesive surface of the adhesive tape DT exposed between the outer periphery of the wafer distribution region 7 and the annular frame f is easily brought into contact with the peeling tape Ts, and does not firmly follow. Therefore, the peeling tape Ts can be easily peeled off from the adhesive tape DT. Further, since the portion of the adhesive layer 5 is also attached to the annular frame f, it can be easily peeled off from the annular frame f. Therefore, the peeling error does not occur, and the work efficiency of the peeling process can also be improved.

Further, since the portion of the adhesive layer 5 which is weakly adhered is attached to the annular frame f, it can be easily peeled off from the annular frame f.

Furthermore, the present invention can also be implemented in the following forms.

(1) In the apparatus of the above-described embodiment, as shown in FIG. 12, for example, the peeling tape Ts may be attached to the peeling annular frame 40 having the same shape as the annular frame f. That is, as shown in FIG. 13, the peeling tape Ts is attached across the peeling ring frame 40 and the protective tape PT. When the attaching process is completed, as shown in FIG. 14, the peeling tape Ts is peeled off from the peeling annular frame 40. Thereafter, as shown in FIG. 15, the protective tape PT is peeled off from the wafer 1 integrally with the peeling tape Ts, and is taken up and recovered in the tape collecting portion 14.

Further, in another embodiment, after the peeling tape Ts is attached to the peeling annular frame 40 and the protective tape PT which are superposed on the annular frame f, the peeling tape Ts is cut on the peeling annular frame 40. In a circle. Thereafter, the protective tape PT may be peeled off together with the peeling annular frame 40.

In the case of realizing the peeling method, for example, it is assumed that the apparatus of the above-described embodiment includes a belt cutting mechanism. That is, as shown in FIG. 16, the ejectable belt cutting mechanism 45 is provided above the attachment position.

The tape cutting mechanism 45 is provided with a cutter unit 47 via a support arm 46, and the support arm 46 is diametrically extended in a lower portion of the front end of the arm supported by the movable table cantilevered up and down along the vertical frame. The cutter unit 47 is mounted in such a manner that the cutter 48 of the round knife with the blade tip facing downward can be swung.

The cutter unit 47 is rotatable about the same axis as the holding table 10. Furthermore, the cutter unit 47 is configured to adjust the radius of gyration via the support arm 46.

Therefore, in the case of the device of the variation, after the peeling tape Ts is attached across the annular frame f and the wafer distribution region 7, the cutter unit 47 is lowered to the height at which the cutter 48 can press and cut the peeling tape Ts. . In this state, as shown in FIG. 17, the cutter 48 is rotated on the peeling annular frame 40, and the peeling tape Ts is cut.

If the cutting of the peeling tape Ts is completed, the cutter unit 47 is returned to the upper standby position. And the peeling unit 13 is actuated. When the peeling unit 13 reaches the end position beyond the holding table 10 shown in FIG. 18 in the same manner as the above-described modification, the tape collecting portion 14 winds up the recovered peeling tape Ts, and the tape feeding portion 11 successively feeds the peeling tape of a specific length. Ts. At the same time, as shown in FIG. 19, the peeling unit 13 and the attaching unit 12 return to the initial position.

Further, the holding table 10 is moved from the attaching position to the placing position. At the mounting position, the peeling annular frame 40 which is attached to the peeling tape Ts of the annular frame f is carried out, and then the mounting frame MF from which the protective tape has been peeled off is carried out.

In addition, the peeling tape Ts is peeled off from the peeling annular frame 40 in another step or the like, and the peeling annular frame 40 is used later.

(2) When the peeling annular frame 40 is used as in the above-described modification, the peeling tape Ts may be attached to the peeling annular frame 40 in advance in a state in which the annular frame f is superposed. The peeling tape Ts is attached to the peeling annular frame 40, and the peeling tape Ts attached thereto may be attached to the peeling annular frame 40 to be rounded. Alternatively, a circular pre-cut type peeling tape Ts may be attached to the peeling annular frame 40.

That is, as shown in FIGS. 20 and 21, the carrier tape 4 is folded by the edge member 50, and the peeling tape Ts formed on the carrier tape at a specific pitch is peeled off. The front end of the peeling tape Ts is pressed by the attaching roller 51 and attached to the peeling annular frame 40. Thereafter, the holding stage is moved in synchronization with the speed at which the peeling tape Ts is peeled off from the carrier tape 4, and the peeling tape Ts is gradually attached to the peeling annular frame 40.

(3) In the above modification, the adhesive layer 6 of the peeling tape Ts may be an ultraviolet curing type or an adhesive which is expanded by heating to lower or eliminate the adhesive force. By using the peeling tape Ts, the adhesive layer 5 can be heated or irradiated with ultraviolet rays after the protective tape PT is peeled off, and the adhesive force can be eliminated, whereby the peeling tape Ts can be easily peeled off from the ring frame f. Therefore, recycling of the peeling annular frame 40 can be facilitated.

(4) The portion of the adhesive layer 5 of the release tape Ts of each of the above embodiments may not have an adhesive. That is, as shown in FIG. 22, the periphery of the adhesive layer 6 is in a state in which the back surface of the base material 1 is exposed.

(5) As shown in Fig. 23, the thickness of the portion of the adhesive layer 5 of the release tape Ts of each of the above embodiments may be thinner than the portion of the adhesive layer 6. According to this configuration, the gap from the adhesive surface of the adhesive tape DT on the outer side of the wafer distribution region 7 to the peeling tape Ts can be obtained. Therefore, when the peeling tape Ts is attached to the protective tape PT, the adhesion of the adhesive tape DT and the peeling tape Ts can be more accurately avoided.

The present invention can be implemented in other specific forms without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be referred to in the appended claims.

10‧‧‧ Keeping the table

12‧‧‧ Attachment unit

13‧‧‧ peeling unit

23‧‧‧ Attachment roller

24‧‧‧rail

F‧‧‧ ring frame

PT‧‧‧protective tape

Ts‧‧‧ peeling tape

Claims (10)

A protective tape peeling method for peeling a protective tape from a semiconductor wafer held by a support tape by a support tape, and the above method comprises the following process: a first peeling process, which is attached to the protective tape After the semiconductor wafer is divided into wafers, the wafer held by the adhesive tape and held in the annular frame is heated, whereby the protective tape of the wafer shape is wound into a cylindrical shape along a single axis to be partially peeled off from the wafer; a bonding process in which a peeling tape having a strongly adhered adhesive layer to a bonding portion of a wafer distribution region is pressed by a bonding member with respect to a portion opposed to a peripheral region of the semiconductor wafer At least the film is distributed to the wafer distribution region; and the second peeling process is performed by peeling off the peeling tape, and the protective tape wound in a cylindrical shape is peeled off from the wafer integrally with the peeling tape. The protective tape peeling method according to claim 1, wherein the peeling tape is in the form of a belt; and after the second peeling process, the peeling tape integrated with the protective tape is taken up and recovered. The protective tape peeling method according to claim 1, comprising a cutting process of peeling the tape by a cutting member after attaching the peeling tape to the peeling annular frame which is overlapped with the annular frame Cutting into the shape of the peeling annular frame; in the attaching process, the peeling tape attached to the peeling annular frame is attached to the protective tape; and in the second peeling process, the peeling ring is used Reclamation of the frame, the protective tape is peeled off from the wafer integrally with the release tape; and the protective tape peeling method includes a third peeling process, and the third peeling process is The protective tape and the peeling tape are peeled off by the above-mentioned peeling ring frame which has been recovered. The protective tape peeling method according to claim 1, wherein the peeling loop frame to which the peeling tape which has been cut into the shape of the peeling annular frame is attached is overlapped with the loop frame in the attaching process And attaching the release tape to the protective tape; in the second peeling process, the protective tape and the release tape are integrally peeled off from the wafer in association with the recovery of the peeling annular frame; and the protective tape peeling method includes In the third peeling process, the third peeling process peels off the protective tape together with the peeling tape from the recovered peeling ring frame. A protective tape peeling method according to claim 1, wherein in the attaching process, the peeling tape is attached from the direction of the wound protective tape. A protective tape peeling device for peeling a protective tape from a semiconductor wafer held by a support tape by a support tape, and the device comprises the following structure: a holding stage for a semiconductor crystal to which the protective tape is attached After the wafer is divided into wafers, the wafer held by the adhesive tape and held in the annular frame and the annular frame are held; the heater heats the wafer on the holding table; the tape supply portion faces the ring frame And a strip-shaped peeling tape which has a strong adhesive layer attached to a portion of the semiconductor wafer opposite to the peripheral portion of the semiconductor wafer and attached to the wafer distribution region; An attaching mechanism that rolls the attaching roller on the peeling tape, and attaches the peeling tape to the protective tape and the ring frame, and the protective tape is heated by a heater to be wound along a single axis a cylindrical and partially attached to the wafer; a peeling mechanism that peels off the integrated release tape from the wafer; and A belt recovery unit that winds up and collects the peeling tape after the peeling. A protective tape peeling device for peeling a protective tape from a semiconductor wafer held by a support tape by a support tape, and the device comprises the following structure: a holding stage for a semiconductor crystal to which the protective tape is attached After the wafer is divided into wafers, the wafer held by the adhesive tape and held in the annular frame, the annular frame and the peeling annular frame superposed on the annular frame are held, and the heater is held on the holding table. The wafer is heated; the tape supply portion supplies a strip-shaped release tape toward the peeling annular frame, and the strip-shaped peeling tape is attached to the wafer distribution in comparison with a portion opposite to the peripheral region of the semiconductor wafer a portion of the region has a strongly adhesive layer; an attaching mechanism that causes the attaching roller to roll on the peeling tape, and attaches to the protective tape and the peeling annular frame, the protective tape is heated by the heater The uniaxially wound body is wound into a cylindrical shape and partially attached to the wafer; the cutting mechanism cuts the peeling tape into the shape of the peeling annular frame by the cutting member; and a belt collecting portion Recovering the above after cutting a peeling mechanism that lifts and lowers the protective tape from the wafer so that the peeling annular frame after attaching the protective tape to the peeling tape is lifted relative to the wafer; and a tape collecting portion from the peeling ring frame Recycle the strip. A protective tape peeling device for peeling a protective tape from a semiconductor wafer held by a support tape by a support tape, and the device comprises the following structure: a holding stage for a semiconductor crystal to which the protective tape is attached After the wafer is divided into wafers, the wafer held by the adhesive tape and held in the annular frame and the annular frame are held; the heater heats the wafer on the holding table; and the conveying mechanism is preliminarily attached Stripping of the peeling tape is placed on the ring frame The annular frame on the holding table, the peeling tape has an adhesive layer strongly adhered to a portion attached to the wafer distribution region opposite to the peripheral region of the semiconductor wafer; the attaching mechanism The attaching roller is rolled on the peeling tape, and attached to the protective tape and the peeling annular frame, which is heated by a heater to be wound into a cylindrical shape along a single axis, and is partially localized Attached to the wafer; a peeling mechanism that lifts and lowers the protective tape from the wafer so that the peeling annular frame after attaching the protective tape to the peeling tape is lifted relative to the wafer; and a tape collecting portion from the peeling ring The frame recovers the strip. A peeling tape which is used in a protective tape peeling method according to any one of claims 1 to 5, and which has a shape larger than that of the semiconductor wafer and which is opposite to a peripheral region of the semiconductor wafer A strong adhesive layer is formed on the attached portion of the wafer distribution region. The release tape of claim 9, wherein the thickness of the adhesive layer attached to the portion of the wafer distribution region is formed thicker than the portion opposed to the outer peripheral region of the semiconductor wafer.