TW201348696A - Substrate inspecting device and substrate inspecting method - Google Patents

Abstract

A substrate inspecting apparatus and an inspecting method are provided, using an etching simulation to perform a defect inspection with less error and without moving a substrate between a plurality of apparatus in order to detect etching information. The substrate inspection apparatus measures etching curves by using a measurement pattern formed on the surface of the substrate, performs the etching simulation by using the etching curves and thereby generates inspection data. Defects are inspected by verifying the inspection data and image data of a circuit pattern formed on the surface of the substrate. Therefore, the defect inspection with less error is performed according to the inspection data, which is generated corresponding to the etching curves. In addition, an etching curve measurement, the etching simulation and the defect inspection are performed in one single substrate inspecting apparatus. Thus, it is unnecessary for the substrate to move between a plurality of apparatus.

Description

Substrate inspection device and substrate inspection method

The present invention relates to a substrate inspection apparatus and a substrate inspection method for performing defect inspection on a wiring pattern formed on a surface of a substrate by etching.

Conventionally, a glass substrate for a printed circuit board, a semiconductor wafer, a photomask, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display panel (PDP), and a color filter (color) In the manufacturing process of the substrate for a precision electronic device such as a substrate for a substrate or a solar cell, a wiring pattern is formed on the surface of the substrate by etching. Further, in order to secure the quality of the formed wiring pattern, defect inspection of the wiring pattern is performed. In the defect inspection, for example, the pattern data for inspection is compared with the image data read from the substrate, and a portion having a large difference between the two data is detected as a defect. A conventional substrate inspection apparatus for performing such defect inspection is disclosed, for example, in Patent Document 1.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 7-325044

However, in the etching step, the degree of corrosion caused by the etching liquid changes depending on the shape or interval of the wiring pattern. This is because the flowability of the etching liquid around each pattern changes depending on the shape or interval of the pattern. For example, the line width or spacing of the line pattern, the diameter of the circular pattern, and the like may affect the degree of corrosion. Therefore, when only the design pattern data and the image data read from the real substrate are simply compared, a lot of erroneous detection occurs in a portion where the shape is likely to change due to etching. If the number of erroneous detections is large, not only the detection processing of the defects takes time, but also the confirmation operation of the detected defects is time consuming.

On the other hand, in the past, the portion where the shape is easily changed by etching is excluded from the inspection region, or the inspection sensitivity of the portion is lowered to perform defect inspection. However, in such an inspection method, there is a possibility that defects to be detected are missing.

On the other hand, if the pattern data on the design is converted using an etching simulation, the shape of the pattern material can be made close to the shape of the wiring pattern on the solid substrate. Therefore, the pattern data can be used to perform defect inspection with less false detection. However, in order to perform the etching simulation, it is necessary to measure the etching curve indicating the degree of etching of the solid substrate. In the past, in order to measure the etching curve, it is necessary to transport the substrate to a device different from the substrate inspection device, and to perform pattern distance measurement. Further, if the entire surface of the substrate is subjected to etching simulation, the etching simulation itself becomes a long-time process, and thus it is difficult to shorten the manufacturing process as a whole.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate The inspection apparatus and the substrate inspection method use the etching simulation to perform defect inspection with less erroneous detection, and it is not necessary to move the substrate between the plurality of devices in order to measure the etching information.

In order to solve the above problems, a first invention of the present application is a substrate inspection apparatus that performs defect inspection on a wiring pattern formed on a surface of a substrate by etching, and includes an information measuring unit that measures according to a surface formed on the substrate. a pattern for measuring etching information; an analog unit that etches the design data using the etching information to generate inspection data; and a defect detecting unit that photographs a wiring pattern formed on a surface of the substrate by using The obtained image data is compared with the inspection data to detect defects.

According to a second aspect of the invention, in the substrate inspection apparatus of the first aspect of the invention, the wiring pattern includes a plurality of single-chip patterns, and the simulation unit performs design information on a single-piece pattern of a part of the plurality of single-chip patterns Etching simulation is performed, and the results of the etching simulation are integrated, thereby generating the inspection data.

According to a third aspect of the invention, in the substrate inspection device of the first aspect of the invention, a plurality of inspection regions are set on a surface of the substrate, and the measurement pattern is provided in each of the plurality of inspection regions, the information measurement unit Etching information is measured for each of the plurality of measurement patterns of the measurement pattern, and the simulation unit performs etching simulation for each of the inspection regions using etching information obtained from measurement patterns included in each inspection region .

According to a fourth aspect of the present invention, in the substrate inspection apparatus of the third aspect of the present invention, the inspection area includes a plurality of single-piece patterns, and the simulation unit performs design data of a single-piece pattern of a part of the plurality of single-piece patterns. The etching is simulated, and the results of the etching simulation are integrated, thereby generating the inspection data.

According to a fifth aspect of the invention, the substrate inspection apparatus of the third invention or the fourth invention further includes an area setting unit that sets a plurality of the inspection areas by an operation of a user.

According to a sixth aspect of the invention, in the substrate inspection device according to any one of the first to fourth aspects of the invention, the wiring pattern and the measurement pattern are formed on a surface of a single substrate.

A seventh invention of the present application is a substrate inspection method for performing defect inspection on a wiring pattern formed on a surface of a substrate by etching, and performing the following steps in a single device: a) according to a measurement pattern formed on a surface of the substrate Measuring the etching information; b) performing etching simulation on the design data using the etching information, thereby generating inspection data; and c) photographing the wiring pattern formed on the surface of the substrate, by obtaining the obtained The image data is compared with the inspection data to detect defects.

According to a seventh aspect of the present invention, in the substrate inspection method of the seventh aspect of the invention, in the step b), the etching simulation is performed on design data of a single-piece pattern of a part of a plurality of single-piece patterns constituting the wiring pattern. And integrating the results of the etching simulation, thereby generating the inspection data.

According to a ninth aspect of the invention, in the substrate inspection method of the seventh aspect of the invention, in the step (a), the etching information is measured for each of the plurality of measurement patterns of the measurement pattern, wherein the measurement pattern is provided on the substrate In each of the inspection regions of the plurality of inspection regions set on the surface, in the step b), etching information obtained from the measurement patterns included in the respective inspection regions is used for each of the inspection regions. Etching simulation.

A tenth invention of the present application is the substrate inspection method according to the ninth invention, In the step b), the etching simulation is performed on design data of a part of the single-piece patterns of the plurality of single-piece patterns constituting the inspection region, and the results of the etching simulation are integrated, thereby generating the Check the information.

According to the first invention of the present application, the defect inspection with less false detection can be performed based on the inspection data generated corresponding to the etching information. Further, in a single substrate inspection apparatus, measurement of etching information, etching simulation, and detection of defects are performed. Therefore, there is a need to move the substrate between a plurality of devices.

In particular, according to the second invention of the present application, the time taken for the etching simulation can be shortened. Therefore, etching simulation and defect detection can be performed in a single substrate inspection apparatus, and the entire processing can be suppressed for a long time.

In particular, according to the third invention of the present application, inspection data which more accurately reflects the degree of etching of each inspection region can be produced. Therefore, erroneous detection of each inspection area can be further reduced.

In particular, according to the fourth invention of the present application, the time taken for the etching simulation can be shortened. Therefore, etching simulation and defect detection can be performed in a single substrate inspection apparatus, and the entire processing can be suppressed for a long time.

In particular, according to the fifth invention of the present application, the user of the substrate inspection apparatus can set the inspection area according to the tendency of the etching process or the condition of the inspection.

In particular, according to the sixth invention of the present application, it is not necessary to separately prepare a substrate for etching information measurement different from the solid substrate, and the processing from the measurement of the etching information to the detection of the defect can be continuously performed on the solid substrate.

Moreover, according to the seventh invention of the present application, the defect inspection with less erroneous detection can be performed based on the inspection data generated corresponding to the etching information. And, in a single Measurement of etching information, etching simulation, and detection of defects are performed in the device. Therefore, there is a need to move the substrate between a plurality of devices.

In particular, according to the eighth invention of the present application, the time taken for the etching simulation can be shortened. Therefore, etching simulation and defect detection can be performed in a single device, and the entire process can be suppressed from being prolonged.

In particular, according to the ninth invention of the present application, inspection data which more accurately reflects the degree of etching of each inspection region can be produced. Therefore, erroneous detection of each inspection area can be further reduced.

In particular, according to the tenth invention of the present application, the time taken for the etching simulation can be shortened. Therefore, etching simulation and defect detection can be performed in a single device, and the entire process can be suppressed from being prolonged.

1‧‧‧Substrate inspection system

9‧‧‧Printing substrate

10‧‧‧data server

20‧‧‧CAM Editor

30‧‧‧Substrate inspection device

31‧‧‧ Shell

32‧‧‧Workbench

33‧‧‧Workbench moving mechanism

34‧‧‧Photography Department

35‧‧‧Control Department

40‧‧‧Testing device

51, 52, 53‧‧‧ HUB

60‧‧‧Drawing device

91‧‧‧Base plate section

92‧‧‧Wiring pattern

93‧‧‧ inspection area

94‧‧‧Measurement pattern

311‧‧‧Base Department

312‧‧‧ 盖部

313‧‧‧ legs

321‧‧‧ Frame Department

322‧‧‧Light Transmitting Department

323‧‧‧ Nut Department

331‧‧‧rails

332‧‧‧Rolling screw

333‧‧‧Motor

341‧‧‧ Roll mechanism

342‧‧‧Multiple optical heads

343‧‧‧ Head Support Department

344‧‧‧ head moving mechanism

351‧‧‧Image Acquisition Department

352‧‧‧Information Measurement Department

353‧‧‧ Simulation Department

354‧‧‧Information Control Department

355‧‧‧Display Department

356‧‧‧ Input Department

921‧‧‧one piece pattern

941‧‧‧ pattern group

941a, 941b‧‧‧ line pattern

942, 942a, 942b‧‧‧ circular pattern

D1‧‧‧Single design information

D2‧‧‧ overall design information

D3‧‧‧Image data

D4‧‧‧etching curve

D5‧‧‧Check data

S1~S4, S31, S32‧‧‧ steps

X1‧‧‧ interval

X2‧‧‧ diameter

Y1, y2‧‧‧ etching amount

1 is a perspective view of a printed substrate.

FIG. 2 is a view showing an example of a measurement pattern.

3 is a view showing the configuration of a substrate inspection system.

4 is a plan view of a substrate inspection device.

Fig. 5 is a side view of the substrate inspection apparatus.

Fig. 6 is a flow chart showing the procedure of the defect inspection.

Fig. 7 is a flow chart showing the procedure for generating inspection materials.

Fig. 8 is a block diagram conceptually showing a state of data processing by a control unit.

Figure 9 is a diagram showing parameters of a measurement for etching a curve in a pair of line patterns Figure.

FIG. 10 is a view showing an example of an etching curve.

Fig. 11 is a view showing an example of parameters for measurement of an etching curve in a circular pattern.

Fig. 12 is a view showing an example of an etching curve.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

<1. About printed circuit board>

First, a printed circuit board inspected by the substrate inspection device 30 to be described later will be described. FIG. 1 is a view showing an example of a printed circuit board 9. As shown in FIG. 1, the printed circuit board 9 has a base plate portion 91 and a wiring pattern 92 formed on the upper surface of the base plate portion 91. The base plate portion 91 is formed of an insulating material such as glass epoxy or paper phenol. The wiring pattern 92 is formed by etching a conductor such as a copper foil in a photolithography step.

As shown in FIG. 1, the wiring pattern 92 includes a plurality of single-piece patterns 921 arranged in a lattice shape. In the example of Fig. 1, the number of the single-piece patterns 921 is 24. Each of the individual patterns 921 constitutes an electronic circuit that is identical to each other. That is, each of the individual patterns 921 is designed to be the same pattern. The printed circuit board 9 shown in FIG. 1 is divided into a plurality of substrates in units of a single-piece pattern 921 in a subsequent manufacturing step.

Further, in the substrate inspection system 1 to be described later, a plurality of inspection regions 93 are set on the upper surface of the printed substrate 9. In the example of FIG. 1, the upper surface of the printed circuit board 9 is divided into four inspection areas 93, and each inspection area 93 includes six single-piece patterns 921. Further, on the upper surface of the printed substrate 9, a plurality of measurement patterns 94 for measurement of an etching curve to be described later are formed. In the example of Fig. 1, the number of measurement patterns 94 is four. The measurement pattern 94 includes one in each of the inspection regions 93. Further, the measurement pattern 94 is formed simultaneously with the wiring pattern 92 by etching a conductor such as a copper foil.

FIG. 2 is a view showing an example of the measurement pattern 94. The measurement patterns 94 of FIG. 2 each have a plurality of pattern groups 941 including a pair of line patterns, and a circular pattern 942. The spacing of a pair of line patterns differs in each pattern group 941. Moreover, the plurality of circular patterns 942 have different diameters from each other.

In addition, the design of the measurement pattern 94 is not limited to the example of FIG. For example, the line width of the line pattern can also be changed for each pattern group 941. Moreover, the number of pattern groups 941 or the number of circular patterns 942 may be different from that of FIG. Further, the measurement pattern 94 may further include a pattern other than the line pattern or the circular pattern. Further, the measurement pattern may be disposed around the wiring pattern 92 as shown in FIG. 1 or may be disposed in a gap between the plurality of single-piece patterns 921.

<2. Structure of substrate inspection system>

Next, the substrate inspection system 1 including the substrate inspection apparatus 30 according to the embodiment of the present invention will be described. FIG. 3 is a view showing a configuration of the substrate inspection system 1. The substrate inspection system 1 is for performing in the manufacturing steps of the printed substrate 9. A system for defect inspection of line patterns 92. As shown in FIG. 3, the substrate inspection system 1 includes a data server 10, a computer aided manufacturing (CAM) editor 20, a substrate inspection device 30, and a verification equipment 40.

The data server 10 and the CAM editor 20 are electrically connected via a HUB (hub) 51. Further, the CAM editor 20, the substrate inspection device 30, and the inspection device 40 are electrically connected via the HUB 52. Moreover, the CAM editor is also electrically connected to the drawing device 60 located outside the substrate inspection system 1 via the HUB 53. Various materials can be transmitted and received between a plurality of devices connected via the HUBs 51, 52, and 53.

The data server 10 stores design information of the individual patch patterns 921 arranged on the printed substrate 9. Hereinafter, the design information of each of the individual patterns 921 is referred to as "single piece design data D1". The data server 10 outputs the single piece design data D1 to the CAM editor 20 in accordance with the request from the CAM editor 20. The data server 10 includes, for example, a computer having a memory unit such as a hard disk and an arithmetic processing unit such as a central processing unit (CPU) that reads and writes data to and from the memory unit.

The CAM editor 20 is a device for creating design information of the entire printed substrate 9. Hereinafter, the design information of the entire printed substrate 9 is referred to as "the overall design data D2". The CAM editor 20 reads the single piece design data D1 from the material server 10, arranges the read single piece design data D1, and programs the design data of the measurement pattern 94 to a predetermined position. Thereby, the overall design data D2 is produced. The CAM editor 20 includes, for example, a computer having an arithmetic processing unit such as a CPU or a memory.

Here, the measurement pattern 94 is disposed, for example, for each of the inspection regions 93 on the printed substrate 9. The inspection area 93 can be set in the CAM editor 20 and incorporated into the overall design data D2, or can be set or changed in the control unit 35 of the substrate inspection apparatus 30.

The drawing device 60 is a device for selectively exposing a resist film formed on the upper surface of the printed substrate 9. The drawing device 60 receives the overall design material D2 from the CAM editor 20, and performs drawing processing for selectively exposing the upper surface of the printed substrate 9 based on the overall design data D2. The printed circuit board 9 after the drawing process is transported to an etching apparatus (not shown), and an etching process is performed. Then, the resist film is removed in the cleaning device, whereby the wiring pattern 92 and the plurality of measurement patterns 94 are formed on the upper surface of the printed substrate 9.

The substrate inspection device 30 is a device that performs defect inspection of the wiring pattern 92 formed on the surface of the printed substrate 9. The substrate inspection device 30 creates inspection data D5 based on the overall design data D2 received from the CAM editor 20 (see FIG. 8). Further, the substrate inspection device 30 images the upper surface of the printed substrate 9 to acquire image data D3 (see FIG. 8). Then, the defect of the wiring pattern 92 is detected by collating the inspection data D5 with the image data D3. The data of the inspection result is sent from the substrate inspection device 30 to the inspection device 40. A more detailed configuration of the substrate inspection device 30 will be described below.

The inspection device 40 is a device for visually confirming a portion on the printed substrate 9 detected by the substrate inspection device 30 as a defect. The inspection device 40 displays an inspection to the operator when receiving the inspection result data from the substrate inspection device 30. The part specified in the result. The operator confirms the portion on the printed substrate 9 by visual observation. Thereby, erroneous detection and classification of actual defects or determination of types of defects are performed. Regarding the type of the defect, for example, there are broken wires, defects, protrusions, and the like.

<3. Structure of substrate inspection device>

Next, a more detailed configuration of the substrate inspection device 30 will be described.

FIG. 4 is a plan view of the substrate inspection device 30. FIG. 5 is a side view of the substrate inspection device 30. As shown in FIGS. 4 and 5, the substrate inspection device 30 includes a casing 31, a table 32, a table moving mechanism 33, an imaging unit 34, and a control unit 35. In addition, in FIGS. 4 and 5, in order to clarify the inside of the casing 31, a part of the casing 31 is broken.

The outer casing 31 has a base portion 311 and a lid portion 312. The base portion 311 has a plurality of leg portions 313. The plurality of leg portions 313 are in contact with the ground in the factory to support the entire substrate inspection device 30. The cover portion 312 covers the upper portion of the base portion 311. The table 32, the table moving mechanism 33, the imaging unit 34, and the control unit 35 are housed inside a casing-shaped casing 31, and the casing 31 includes a base portion 311 and a lid portion 312.

The stage 32 is a plate-shaped holding portion on which the printed circuit board 9 is placed. The table 32 is disposed in a horizontal posture in the vicinity of the upper opening of the base portion 311. The table 32 has a rectangular frame portion 321 and a glass light transmitting portion 322 that is fitted into the inside of the frame portion 321 . A nut portion 323 that is screwed to a ball screw 332 to be described later is provided on the lower surface of the frame portion 321 . The printed circuit board 9 is placed on the upper surface of the light transmitting portion 322 so that the surface on which the wiring pattern 92 and the measurement pattern 94 are formed is in the upper horizontal posture.

The table moving mechanism 33 has a pair of guide rails 331, a ball screw 332, and a motor 333. The pair of guide rails 331 and the ball screw 332 extend parallel to each other and horizontally along the main scanning direction. The frame portion 321 of the table 32 is slidably attached to the guide rail 331. Further, the nut portion 323 of the table 32 is screwed to the ball screw 332. If the motor 333 is driven, the ball screw 332 rotates around its axis. Thus, the table 32 moves in the main scanning direction along the ball screw 332 and the guide rail 331.

The imaging unit 34 is a mechanism that images the upper surface of the printed substrate 9. The imaging unit 34 is disposed inside the lid portion 312. As shown in FIGS. 4 and 5, the imaging unit 34 includes a plurality of roller mechanisms 341, a plurality of optical heads 342, a head support portion 343, and a head moving mechanism 344. The plurality of roller mechanisms 341 press the upper surface of the printed substrate 9 at the front and rear of the main scanning direction of the optical head 342. Thereby, the displacement and deflection of the printed substrate 9 are suppressed below the optical head 342.

The plurality of optical heads 342 are arranged at equal intervals in the sub-scanning direction. The sub-scanning direction is a horizontal direction orthogonal to the main scanning direction. An optical system such as a lens and an imaging element such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) are mounted on each of the optical heads 342. Moreover, a plurality of optical heads 342 are fixed to the head support portion 343 and integrated. If the head moving mechanism 344 connected to the head supporting portion 343 is driven, the plurality of optical heads 342 move together with the head supporting portion 343 in the sub-scanning direction. The head moving mechanism 344 can be realized by, for example, a mechanism having a guide rail, a ball screw, and a motor in the same manner as the table moving mechanism 33. Now.

Further, the imaging unit 34 has a plurality of light sources (not shown). The light sources are respectively disposed at positions above and below the printed substrate 9 at the time of shooting. The imaging unit 34 performs imaging of the printed substrate 9 by the transmitted light and the reflected light by switching the on/off of these light sources.

The control unit 35 is disposed inside the lid portion 312. The control unit 35 is electrically connected to the motor 333, the roller mechanism 341, the optical head 342, and the head moving mechanism 344. The control unit 35 includes, for example, a computer having an arithmetic processing unit such as a CPU, a memory unit such as a hard disk, and a memory for temporarily storing data. The control unit 35 controls each unit in the substrate inspection device 30 in accordance with the user's operation, various input signals, or a preset program, and performs various data processing. Thereby, the inspection of the printed substrate 9 in the substrate inspection apparatus 30 is performed.

<4. About defect inspection>

FIG. 6 is a flow chart showing the procedure of defect inspection in the substrate inspection device 30. Fig. 7 is a flowchart showing a procedure for generating inspection materials in step S3 in Fig. 6. FIG. 8 is a block diagram conceptually showing the state of data processing by the control unit 35. Hereinafter, the defect inspection in the substrate inspection apparatus 30 will be described with reference to FIGS. 6 , 7 , and 8 . In addition, the image acquisition unit 351, the information measurement unit 352, the simulation unit 353, and the data comparison unit 354 in FIG. 8 are realized by, for example, a CPU of a computer operating while referring to data stored in a memory or the like.

When the defect inspection is performed in the substrate inspection apparatus 30, first, the printed circuit board 9 in which the wiring pattern 92 and the plurality of measurement patterns 94 are formed through the etching step is formed. It is placed on the upper surface of the table 32. Then, a signal for starting the inspection is input to the control unit 35. Then, the control unit 35 controls the motor 333, the roller mechanism 341, the optical head 342, and the head moving mechanism 344 to perform processing for reading an image of the printed substrate 9 (step S1).

In step S1, first, the motor 333 is driven in the forward direction. Thereby, the stage 32 and the printed circuit board 9 are moved in the main scanning direction. Further, when the printed substrate 9 passes under the imaging unit 34, the plurality of optical heads 342 read an image of the upper surface of the printed substrate 9. That is, the scanning of the main scanning direction of the outgoing path is performed.

At the end of the scanning of the main scanning direction of the outgoing path, then the head moving mechanism 344 operates. Thereby, the head supporting portion 343 and the plurality of optical heads 342 move in the sub-scanning direction. The amount of movement in the sub-scanning direction here is, for example, half the interval of the optical head 342.

Then, the motor 333 is driven in the reverse direction. Thereby, the stage 32 and the printed circuit board 9 move in the opposite direction to the scan of the main scanning direction of the outward path. Further, when the printed substrate 9 passes under the imaging portion 34, the plurality of optical heads 342 read an image of the upper surface of the printed substrate 9. That is, the scanning of the main scanning direction of the return path is performed.

As described above, in the substrate inspection apparatus 30, the plurality of optical heads 342 image an image of the entire upper surface of the printed substrate 9 by scanning in the main scanning direction of the outward path and the return path. The output signals of the plurality of optical heads 342 are integrated and digitized in the image acquisition section 351. Thereby, the image data D3 is acquired. The image data D3 includes an image of the wiring pattern 92 and an image of the plurality of measurement patterns 94.

Then, the information measuring section 352 will indicate the etching according to the image data D3. The etching curve D4 of the degree of strength is measured as etching information (step S2). Here, first, the information measuring unit 352 performs an edge on the image of the plurality of measurement patterns 94 included in the image data D3 and the images of the plurality of measurement patterns 94 included in the entire design data D2. Edge) extraction process. Next, the etching curve D4 is measured based on the difference in the outline after the edge is extracted.

The etching curve D4 is calculated, for example, as a relationship between the line pattern interval or the diameter of the circular pattern and the etching amount of the line pattern and the circular pattern. Further, the etching curve D4 is individually calculated for each of the measurement patterns 94. That is, the etching curve D4 is individually calculated for each of the inspection regions 93.

As described, the measurement pattern 94 has a plurality of pattern groups 941 including a pair of line patterns. FIG. 9 is a view showing an example of parameters x1 and y1 for measuring the etching curve D4 in the pattern group 941 in the measurement pattern 94. In FIG. 9, the design line pattern 941a included in the overall design data D2 is indicated by a broken line, and the etched line pattern 941b included in the image data D3 is indicated by a solid line. When the etching curve D4 is measured, the difference between the contour lines of the design line pattern 941a and the etched line pattern 941b is measured as the etching amount y1 for the plurality of pattern groups 941. Then, an etching curve D4 indicating the relationship between the interval x1 of the pair of line patterns 941a on the design and the etching amount y1 is calculated. FIG. 10 is a view showing an example of the etching curve D4 thus obtained.

FIG. 11 is a view showing an example of parameters x2 and y2 for measuring the etching curve D4 in the circular pattern 942 in the measurement pattern 94. In Fig. 11, the design circular pattern 942a included in the overall design data D2 is indicated by a broken line, The etched circular pattern 942b included in the image data D3 is indicated by a solid line. When the etching curve D4 is measured, the difference between the contour lines of the design circular pattern 942a and the etched circular pattern 942b is measured as the etching amount y2 for the plurality of circular patterns 942. Then, an etching curve D4 indicating the relationship between the diameter x2 of the circular pattern 942a on the design and the etching amount y2 is calculated. FIG. 12 is a view showing an example of the etching curve D4 thus obtained.

Return to Figures 6, 7, and 8. Next, the simulation unit 353 generates the inspection data D5 based on the overall design data D2 using the etching curve D4 (step S3).

As shown in FIG. 7, in step S3, first, the simulation unit 353 extracts one piece of design information D1 of each inspection region 93 from the overall design data D2. Then, the single-chip design material D1 is subjected to etching simulation (step S31). An etching curve D4 corresponding to the inspection region 93 is used in the etching simulation. That is, an etching curve measured according to the measurement pattern 94 included in the inspection region 93 is used in the etching simulation. Next, the simulation unit 353 deforms the pattern in the single-piece design data D1 with an intensity corresponding to the etching curve D4.

Further, in the etching simulation using the etching information, for example, the simulation method described in Japanese Laid-Open Patent Publication No. 2005-202949 can be applied. However, in the etching simulation of the present invention, not only the simulation method of the publication but also various other simulation methods for performing simulation based on the amount of etching can be applied. Further, the etching information of the present invention includes not only an etching curve as in the present embodiment but also information indicating an etching amount such as an etching rate.

Next, the simulation unit 353 outputs the result of the etching simulation of the single piece design data D1. It is sent back to the overall design data D2 (step S32). At this time, all the single-piece design data D1 in the inspection region 93 are replaced based on the result of the etching simulation of the one-piece design data D1. That is, in each of the inspection regions 93, the result of the etching simulation of one single piece of design data D1 is integrated. Thereby, the time of the etching simulation is greatly shortened. As a result of this processing, inspection data D5 is generated.

Then, the data collating unit 354 detects the defect of the wiring pattern 92 by collating the image data D3 with the inspection data D5 (step S4). Here, a portion where the difference between the pattern in the image data D3 and the pattern in the inspection data D5 is larger than a predetermined threshold is detected as a defect. That is, in the present embodiment, the imaging unit 34 and the data collating unit 354 in the control unit 35 constitute a defect detecting unit. The inspection result is displayed in the display unit 355 connected to the control unit 35 and transmitted to the inspection device 40.

In this manner, in the substrate inspection apparatus 30, the defect inspection of the printed substrate 9 is performed based on the inspection data D5 generated corresponding to the etching curve D4. Thereby, it is possible to perform defect inspection with less erroneous detection. Further, the step S1, the step S2, the step S3, and the step S4 are performed in a single substrate inspection device 30. Therefore, it is not necessary to move the substrate 9 between a plurality of devices in order to perform measurement or etching simulation of the etching curve D4. Thereby, the inspection of the printed substrate 9 can be performed efficiently.

In particular, in the present embodiment, the wiring pattern 92 and the measurement pattern 94 are formed on the surface of the single printed substrate 9. Therefore, it is not necessary to separately separate the solid substrate from the printed substrate 9 as a product, and prepare a substrate for etching curve measurement. The substrate inspection device 30 can perform the processes of step S1, step S2, step S3, and step S4 in series on the solid substrate.

Further, in the present embodiment, a part of the single-piece design data D1 in each of the inspection regions 93 is subjected to etching simulation, and the results of the etching simulation are integrated to generate inspection data D5. Thus, the time taken for the etching simulation is shortened. Therefore, the processes of step S1, step S2, step S3, and step S4 are performed in the single substrate inspection device 30, and the length of the entire process is suppressed.

Further, in the present embodiment, the etching simulation of the inspection region 93 is performed using the etching curve D4 measured for each of the inspection regions 93. In this way, inspection data D5 that more accurately reflects the degree of etching of each inspection region 93 can be produced. Therefore, erroneous detection of each inspection region 93 can be further reduced.

Further, the plurality of inspection regions 93 on the printed circuit board 9 may be set or changed in the control unit 35 of the substrate inspection device 30. For example, the shape or size of each inspection region 93 or the number of inspection regions 93 can be arbitrarily set from the input unit 356 electrically connected to the control unit 35. That is, the substrate inspection device 30 may have a region setting unit that sets a plurality of inspection regions 93 in accordance with an operation of the user. Thus, the user of the substrate inspection apparatus 30 can set a more suitable inspection area 93 according to the tendency of the etching process or the condition of the inspection.

<5. Modifications>

Although an embodiment of the present invention has been described above, the present invention is not limited to the embodiment.

In the above embodiment, the wiring pattern 92 and the measurement pattern 94 are formed on the upper surface of the printed substrate 9, and the wiring pattern 92 and the measurement pattern 94 may be formed on both the upper surface and the lower surface of the printed substrate 9. Moreover, the substrate inspection device 30 The imaging unit 34 may be configured to image both the upper surface and the lower surface of the printed circuit board 9 .

Further, in the above-described embodiment, one measurement pattern 94 is disposed in each of the inspection regions 93 of the printed circuit board 9, and a plurality of measurement patterns 94 may be disposed in one inspection region 93. Further, in the example of FIG. 1, four inspection regions 93 are set on the printed substrate 9, but the number of inspection regions 93 set on the printed substrate 9 may be one, two, or three, and may be five. More than one. The number or shape of the inspection region 93 may be set in accordance with the size of the printed substrate 9, the required inspection accuracy, the flow direction of the etching liquid, and the like.

Further, it is also possible to separately prepare a substrate for etching curve measurement in which only the measurement pattern is formed, separately from the solid substrate on which the wiring pattern is formed. In this case, first, a substrate for etching curve measurement is placed on the substrate inspection device 30, and an etching curve is measured based on image data of the substrate. Then, a solid substrate is placed on the substrate inspection device 30 to detect defects. In this case, it is also unnecessary to move the substrate between the plurality of devices in order to measure the etching curve.

Further, the substrate inspection system 1 described above may be provided with the inspection device 40 separately from the substrate inspection device 30, or the inspection device 40 may be omitted, and the substrate inspection device 30 itself may be provided with a function capable of visually confirming defects.

In the above-described substrate inspection device 30, the substrate inspection device and the substrate inspection method may be a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, or a glass substrate for a PDP. Base for other precision electronic devices such as a color filter substrate or a solar cell substrate The board is used as an inspection object.

Further, the configuration of the detail of the substrate inspection apparatus may be different from the configuration shown in each drawing of the present application. Further, each element appearing in the above-described embodiment or modification can be combined as appropriate within a range in which no contradiction occurs.

9‧‧‧Printing substrate

32‧‧‧Workbench

34‧‧‧Photography Department

35‧‧‧Control Department

342‧‧‧Multiple optical heads

351‧‧‧Image Acquisition Department

352‧‧‧Information Measurement Department

353‧‧‧ Simulation Department

354‧‧‧Information Control Department

355‧‧‧Display Department

356‧‧‧ Input Department

D2‧‧‧ overall design information

D3‧‧‧Image data

D4‧‧‧etching curve

D5‧‧‧Check data

Claims (12)

A substrate inspection apparatus for performing defect inspection on a wiring pattern formed on a surface of a substrate by etching, characterized by comprising: an information measuring unit that measures etching information according to a measurement pattern formed on a surface of the substrate; a unit that performs etching simulation on the design data using the etching information to generate inspection data, and a defect detecting unit that photographs the wiring pattern formed on a surface of the substrate by using the obtained pattern The image data is compared with the inspection data to detect defects. The substrate inspection apparatus according to claim 1, wherein the wiring pattern includes a plurality of single-chip patterns, and the simulation unit designs a single-chip pattern of a part of the plurality of single-chip patterns. The data is subjected to the etching simulation, and the results of the etching simulation are integrated, thereby generating the inspection data. The substrate inspection apparatus according to claim 1, wherein a plurality of inspection regions are set on a surface of the substrate, and the measurement pattern is provided in each of the plurality of inspection regions. The information measuring unit measures etching information for each of the plurality of measurement patterns of the measurement pattern, and the simulation unit uses etching information obtained from the measurement patterns included in the respective inspection regions, for each The inspection area is described for etching simulation. The substrate inspection device according to claim 3, characterized in that: The inspection area includes a plurality of monolithic patterns, and the simulation unit performs the etching simulation on the design data of the monolithic pattern of a part of the plurality of monolithic patterns, and integrates the results of the etching simulation Thereby, the inspection data is generated. The substrate inspection apparatus according to claim 3, further comprising an area setting unit that sets a plurality of the inspection areas by a user operation. The substrate inspection apparatus according to any one of claims 1 to 4, wherein the wiring pattern and the measurement pattern are formed on a surface of a single substrate. A substrate inspection apparatus for performing defect inspection on a wiring pattern formed on a surface of a substrate by etching, comprising: an information measuring unit for measuring the surface of an etching curve measuring substrate on which only a measurement pattern is formed a pattern for measuring etching information; an analog unit that etches the design data using the etching information to generate inspection data; and a defect detecting unit that performs the wiring pattern formed on a surface of the substrate The photographing is performed by comparing the obtained image data with the inspection data to detect the defect. A substrate inspection method for performing defect inspection on a wiring pattern formed on a surface of a substrate by etching, wherein the following steps are performed in a single device: a) measuring the etching information according to the measurement pattern formed on the surface of the substrate; b) etching the design data using the etching information, thereby generating inspection data; and c) forming the The wiring pattern on the surface of the substrate is imaged, and the obtained image data is compared with the inspection data to detect defects. The substrate inspection method according to claim 8, wherein in the step b), the design data of the single-piece pattern of a part of the plurality of single-piece patterns constituting the wiring pattern is performed. The etching is simulated, and the results of the etching simulation are integrated, thereby generating the inspection data. The substrate inspection method according to claim 8, wherein in the step a), a plurality of the inspection regions set in the plurality of inspection regions set on the surface of the substrate are provided Each of the measurement patterns of the measurement pattern measures etching information, and in the step b), etching information obtained from the measurement patterns included in the respective inspection regions is used for each of the inspection regions. Etch simulation was performed. The substrate inspection method according to claim 10, wherein in the step b), the design data of the single-piece pattern of a part of the plurality of single-piece patterns constituting the inspection region is performed. The etching is simulated, and the results of the etching simulation are integrated, thereby generating the inspection data. A substrate inspection method for performing defect inspection on a wiring pattern formed on a surface of a substrate by etching, wherein the following steps are performed in a single device: a) preparing an etching curve measuring substrate in which only the measurement pattern is formed; b) measuring the etching information based on the measurement pattern formed on the surface of the etching curve measuring substrate; c) using the etching information Etching the design data to generate inspection data; and d) photographing the wiring pattern formed on the surface of the substrate by comparing the obtained image data with the inspection data Detect defects.