TW201341140A - Manufacturing system of optical display device and manufacturing method of optical display device - Google Patents
Manufacturing system of optical display device and manufacturing method of optical display device Download PDFInfo
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- TW201341140A TW201341140A TW102106186A TW102106186A TW201341140A TW 201341140 A TW201341140 A TW 201341140A TW 102106186 A TW102106186 A TW 102106186A TW 102106186 A TW102106186 A TW 102106186A TW 201341140 A TW201341140 A TW 201341140A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3083—Birefringent or phase retarding elements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
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Abstract
Description
本發明係關於一種光學顯示設備之生產系統及光學顯示設備之生產方法。 The present invention relates to a production system of an optical display device and a method of producing the optical display device.
本發明案係根據2012年2月29日於日本提出申請之日本發明專利申請第2012-042840號及2012年4月3日於日本提出申請之日本發明專利申請第2012-084832號而主張其優先權,並引用其內容。 The present invention claims priority based on Japanese Patent Application No. 2012-042840 filed on Feb. 29, 2012, and Japanese Patent Application No. 2012-084832, filed on Jan. Right and quote its content.
傳統上,於液晶顯示器等光學顯示設備之生產系統中,係將貼合至液晶面板(光學顯示部件)的偏光板等光學組件,從長條薄膜切割出符合液晶面板之顯示區域尺寸的層片,包裝並運送至其他另一產線後,貼合至液晶面板(例如,參考專利文獻1)。 Conventionally, in a production system of an optical display device such as a liquid crystal display, an optical component such as a polarizing plate attached to a liquid crystal panel (optical display member) is cut out from a long film to form a layer conforming to the size of a display region of the liquid crystal panel. After being packaged and transported to another production line, it is attached to the liquid crystal panel (for example, refer to Patent Document 1).
例如,該層片係以長條狀光學薄膜為原始材料,將其以切刀呈矩形切斷所獲得。 For example, the layer is obtained by using a long optical film as a starting material and cutting it into a rectangular shape with a cutter.
第15圖係顯示習知光學薄膜切片之切出方法的示意圖。 Fig. 15 is a schematic view showing a method of cutting out a conventional optical film slice.
首先,如第15(a)圖所示,藉由搬送裝置100將光學薄膜101送出。 First, as shown in Fig. 15(a), the optical film 101 is sent out by the transport device 100.
其次,如第15(b)圖所示,由搬送裝置100所送出之光學薄膜101 係藉由圖中未顯示之切斷裝置而呈斜角切斷。藉此切割出光學薄膜中間層(第一中間薄膜102)。該斜角切斷步驟中,從光學薄膜101以特定角度切割出第一中間薄膜102,以使得光學薄膜切片中之目標光軸方向會朝向適合目標液晶顯示裝置的方向。 Next, as shown in Fig. 15(b), the optical film 101 sent by the conveying device 100 It is cut at an oblique angle by a cutting device not shown. Thereby, the intermediate layer of the optical film (the first intermediate film 102) is cut. In the bevel cutting step, the first intermediate film 102 is cut out from the optical film 101 at a specific angle so that the target optical axis direction in the optical film slice faces a direction suitable for the target liquid crystal display device.
其次,如第15(c)圖所示,由薄膜層積裝置110於第一中間薄膜102層積出層片狀組件。薄膜層積裝置110具有一對之軋輥111,112及將層片狀組件送出的滾筒113。從滾筒113所送出之層片狀組件、以特定角度切割出之第一中間薄膜102係通過一對軋輥111,112之間而層積,並送往下一步驟。 Next, as shown in Fig. 15(c), the sheet-like assembly is laminated on the first intermediate film 102 by the film stacking device 110. The film laminating apparatus 110 has a pair of rolls 111, 112 and a roll 113 for feeding the sheet-like unit. The layered sheet member fed from the drum 113 and the first intermediate film 102 cut at a specific angle are stacked by a pair of rolls 111, 112 and sent to the next step.
其次,如第15(d)圖所示,層積有從滾筒113所送出之層片狀組件與以特定角度切割出之第一中間薄膜102的層積薄膜係藉由圖中未顯示之切斷裝置切成兩半。藉此,切割出第二中間薄膜103。 Next, as shown in Fig. 15(d), the laminated film in which the layered member fed from the drum 113 and the first intermediate film 102 cut at a specific angle are laminated is cut by a not shown in the drawing. The breaking device is cut in half. Thereby, the second intermediate film 103 is cut out.
其次,如第15(e)圖所示,所切割出之第二中間薄膜103的品質係以目視進行檢查。 Next, as shown in Fig. 15(e), the quality of the cut second intermediate film 103 is visually inspected.
其次,如第15(f)圖所示,將第二中間薄膜103設置於載臺120。載臺120設有將第二中間薄膜103定位用的標誌121。將第二中間薄膜103設置於載臺120時,係以第15(d)圖所示步驟中呈斜角切斷之邊作為基準,並定位至標誌121處。 Next, as shown in Fig. 15(f), the second intermediate film 103 is placed on the stage 120. The stage 120 is provided with a mark 121 for positioning the second intermediate film 103. When the second intermediate film 103 is placed on the stage 120, the side cut at an oblique angle in the step shown in Fig. 15(d) is used as a reference, and is positioned at the mark 121.
接著,藉由圖中未顯示之切斷裝置從第二中間薄膜103切割出複數個光學薄膜切片104。於切斷裝置中,於平面視圖中呈方格狀配置地,對應光學薄膜切片104之長邊長度的間隔所排列的複數個切刀、以及對應光學薄膜切片104之短邊長度的間隔所排列的複數個切刀,由四個切刀呈矩形切割出的區域即為一個光學薄膜切片104的切出區域。 Next, a plurality of optical film slices 104 are cut out from the second intermediate film 103 by a cutting device not shown. In the cutting device, arranged in a checkered manner in plan view, the plurality of cutters arranged at intervals of the long side length of the optical film slice 104 and the intervals of the short side lengths of the corresponding optical film slices 104 are arranged. The plurality of cutters, the area cut by the four cutters in a rectangular shape, is the cut-out area of the optical film slice 104.
切斷裝置對第二中間薄膜103之切斷方向(例如,對應光學薄膜切片104之長邊長度的間隔所排列之切刀的延伸方向)係使得相對光學薄膜101的長邊方向呈目標角度(根據設計規格所制定的角度)地進行配置。例如,光學薄膜切片104之光軸相對光學薄膜切片104之長邊呈7°地設計之情況中,相對光學薄膜101長邊方向將切斷裝置之切斷方向設定為7°。 The cutting direction of the second intermediate film 103 by the cutting device (for example, the extending direction of the cutter arranged corresponding to the interval of the long side length of the optical film slice 104) is such that the longitudinal direction of the optical film 101 is at a target angle ( Configure according to the angle set by the design specifications. For example, in the case where the optical axis of the optical film slice 104 is designed to be 7° with respect to the long side of the optical film slice 104, the cutting direction of the cutting device is set to 7° with respect to the longitudinal direction of the optical film 101.
專利文獻1:日本專利特開2003-255132號公報。 Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-255132.
第15(f)圖的步驟中,第二中間薄膜103之切斷方向係以光學薄膜101的長邊方向為基準來進行設定,其乃因為,一般而言,長條狀的光學薄膜101係將經二色性染料進行染色之樹脂薄膜朝一軸延伸而製造,光學薄膜101之光軸方向會與樹脂薄膜之延伸方向概略一致。但是,關於光學薄膜101之光軸,光學薄膜101全體並非相同,於光學薄膜101之寬度方向上略有差異。例如,將經二色性染料進行染色之樹脂薄膜朝一軸延伸而製造光學薄膜101之情況中,由於有樹脂薄膜之厚度不均勻或二色性染料染色不均勻等問題,會讓光學薄膜101中央部分之光軸方向與靠近光學薄膜101端部之部分(邊緣部分)的光軸方向之間產生偏差。因此,從光學薄膜101切割出複數個光學薄膜切片104之情況,對應於該光軸偏差,於光學薄膜切片104之間亦會產生光軸之偏差。 In the step of Fig. 15(f), the cutting direction of the second intermediate film 103 is set based on the longitudinal direction of the optical film 101, because generally, the elongated optical film 101 is used. The resin film dyed with the dichroic dye is produced by stretching on one axis, and the optical axis direction of the optical film 101 is substantially consistent with the extending direction of the resin film. However, regarding the optical axis of the optical film 101, the entire optical film 101 is not the same, and there is a slight difference in the width direction of the optical film 101. For example, in the case where the resin film dyed by the dichroic dye is stretched toward one axis to produce the optical film 101, the central portion of the optical film 101 is caused by the problem of uneven thickness of the resin film or uneven dyeing of the dichroic dye. A deviation occurs between a portion of the optical axis direction and an optical axis direction of a portion (edge portion) near the end of the optical film 101. Therefore, when a plurality of optical film slices 104 are cut out from the optical film 101, a deviation of the optical axis occurs between the optical film slices 104 in accordance with the optical axis deviation.
以上,習知光學薄膜切片之切出方法中,所切割出之複數個光學薄膜切片之間會發生光軸方向偏差的問題。複數個光學薄膜切片之間發生光軸方向偏差時,光學顯示設備之生產系統所生產的光學顯示設備內,亦會發生光軸方向偏差。近來,顯示裝置之高對比化不斷演進,要求較過去更嚴格之光 軸精度。例如,過去之行動電話中,光軸之公差為±1°,但智慧手機或平板型訊息終端裝置則要求±0.25°之光軸公差,亦可想見今後要求之精度將更加嚴格。 As described above, in the conventional method of cutting an optical film slice, there is a problem that the optical axis direction is deviated between the plurality of cut optical film slices. When the optical axis direction deviation occurs between a plurality of optical film slices, the optical axis direction deviation also occurs in the optical display device produced by the production system of the optical display device. Recently, the high contrast of display devices has evolved, requiring more stringent light than in the past. Axis accuracy. For example, in the past mobile phones, the tolerance of the optical axis was ±1°, but the smart phone or tablet type message terminal device required an optical axis tolerance of ±0.25°, and it is also expected that the precision required in the future will be more stringent.
本發明係有鑑於前述問題,目的係提供一種能抑制光學顯示設備內之光軸偏差產生的光學顯示設備之生產系統及光學顯示設備之生產方法。 The present invention has been made in view of the foregoing problems, and an object thereof is to provide a production system of an optical display device and a method of producing an optical display device capable of suppressing generation of an optical axis deviation in an optical display device.
再者,前述習知結構中,考慮到液晶面板及層片的各尺寸偏差,以及對於液晶面板的層片之貼合偏差(位置偏差),而切割出較顯示區域略大的層片。因此,於顯示區域之周邊部分形成有多餘區域(邊框部),有阻礙機器小型化的問題。 Further, in the above-described conventional structure, in consideration of variations in the dimensions of the liquid crystal panel and the ply, and the lamination deviation (positional deviation) of the ply of the liquid crystal panel, a ply which is slightly larger than the display region is cut. Therefore, an unnecessary area (frame portion) is formed in the peripheral portion of the display region, which has a problem that the size of the device is prevented from being reduced.
本發明之其他目的係提供一種能縮小顯示區域周邊之邊框部,以達成顯示區域之擴大及機器小型化目的的光學顯示設備之生產系統。 Another object of the present invention is to provide a production system of an optical display device capable of reducing the frame portion around the display area to achieve the expansion of the display area and miniaturization of the machine.
為達成前述目的,本發明係採取以下作法。 In order to achieve the foregoing object, the present invention takes the following approach.
(1)關於本發明之一態樣的光學顯示設備之生產系統,係將光學組件貼合至光學顯示部件以形成光學顯示設備之生產系統,其具備:台座,係支撐該光學顯示部件;捲出部,係將寬度較該光學顯示部件之顯示區域更寬之條狀光學組件層從料捲滾筒與分離層片一同捲出;控制裝置,係取得該光學組件層之光軸面內分佈資料,根據該光學組件層之光軸面內分佈資料,算出該光學組件層之面內平均光軸方向,調整該光學組件層之切斷方向,使得該光學組件層之面內平均光軸方向相對該光學組件層之切斷方向而呈目標角度;第一切斷裝置,係於經該控制裝置調整後之切斷方向上,讓該分離層片殘留於該光學組件層的狀態下,將該光學組件層切斷成較該顯示區域更大尺寸以獲得層片;剝離部,係將該層片從該分離層片處剝離;貼合頭,係將該層片貼附而保持於圓弧狀保持面處,且為讓保持於該保持面之層片貼合至該光學顯示組件,而沿該保持面之 彎曲傾斜移動;驅動裝置,係讓該貼合頭與該台座進行相對移動,使得經該第一切斷裝置切斷後之層片的切斷邊與該光學顯示部件的一邊呈一致或平行,並為讓該傾斜移動來實施該層片之保持及貼合,而驅動該貼合頭;以及第二切斷裝置,係將該層片之顯示區域的對向部分與該對向部分外側的剩餘部分切斷,並從該層片切割出對應於該顯示區域大小的光學組件。 (1) A production system for an optical display device according to an aspect of the present invention, which is a production system for bonding an optical component to an optical display member to form an optical display device, comprising: a pedestal supporting the optical display member; The strip-shaped optical component layer having a width wider than the display area of the optical display part is taken out from the roll drum and the separation layer; the control device obtains the in-plane distribution data of the optical component layer Calculating an in-plane average optical axis direction of the optical component layer according to an in-plane distribution data of the optical component layer, and adjusting a cutting direction of the optical component layer such that an average optical axis direction of the optical component layer is opposite a direction of the cutting direction of the optical component layer is a target angle; the first cutting device is in a cutting direction adjusted by the control device, and the separation layer is left in the optical component layer, and the The optical component layer is cut to a larger size than the display area to obtain a ply; the peeling part is to peel the ply from the separation ply; the bonding head is attached to the ply Arcuate retaining surface, and is so held on the sheet holding surface of the layer bonded to the optical display unit, along which the holding surface a bending movement; the driving device moves the bonding head relative to the pedestal such that the cut edge of the layer cut by the first cutting device is aligned or parallel with one side of the optical display member, and The bonding head is driven to perform the tilting movement to maintain and fit the layer; and the second cutting device is the remaining portion of the display area of the layer and the remaining side of the facing portion Partially cut and the optical component corresponding to the size of the display area is cut from the ply.
(2)如前述(1)之態樣中,該控制裝置係檢測出該光學組件層之面內以最大角度交叉的二個光軸,算出該二個光軸所夾角度均分之軸,以作為該光學組件層之面內平均光軸。 (2) In the aspect of the above (1), the control device detects two optical axes intersecting at a maximum angle in the plane of the optical component layer, and calculates an axis of the angle division of the two optical axes. As the in-plane average optical axis of the optical component layer.
(3)如前述(1)或(2)之態樣中,更具有拍攝該層片於該保持面上之保持狀態的攝影裝置,該驅動裝置係根據該攝影裝置之攝影結果,讓該貼合頭與該台座進行相對移動,使得該層片之切斷邊與該光學顯示部件之一邊呈一致或平行。 (3) In the aspect of the above (1) or (2), further comprising a photographing device for photographing a state in which the layer is held on the holding surface, the driving device causing the sticker to be based on a photographing result of the photographing device The head is moved relative to the pedestal such that the cut edge of the ply is aligned or parallel with one of the sides of the optical display member.
(4)如前述(1)~(3)任一者之態樣中,更具有儲存該光學組件層之光軸面內分佈資料的儲存裝置。 (4) The aspect of any one of (1) to (3) above, further comprising a storage device for storing in-plane distribution data of the optical axis of the optical component layer.
(5)如前述(1)~(4)任一者之態樣中,更具有於該光學組件層寬度方向之複數個檢查位置處檢查該光學組件層之光軸的檢查裝置。 (5) In the aspect of any one of (1) to (4) above, the inspection apparatus for inspecting the optical axis of the optical component layer at a plurality of inspection positions in the width direction of the optical component layer.
(6)如前述(5)之態樣中,該檢查裝置具有能沿該光學組件層寬度方向移動的分析儀;且該檢查裝置係讓該分析儀沿該光學組件層寬度方向移動並藉由該分析儀檢測出該光學組件層之光軸,以於該光學組件層寬度方向之複數個檢查位置處檢查該光學組件層之光軸。 (6) In the aspect of the above (5), the inspection apparatus has an analyzer movable in the width direction of the optical component layer; and the inspection apparatus moves the analyzer along the width direction of the optical component layer by The analyzer detects the optical axis of the optical component layer to inspect the optical axis of the optical component layer at a plurality of inspection positions in the width direction of the optical component layer.
(7)關於本發明之另一態樣的光學顯示設備之生產方法,係將光學組件貼合至光學顯示部件以形成光學顯示設備之生產方法,其具有下列步 驟:第一步驟,係將寬度較該光學顯示部件顯示區域更寬之條狀光學組件層從料捲滾筒與分離層片一同捲出;第二步驟,係取得該光學組件層之光軸面內分佈資料,根據該光學組件層之光軸面內分佈資料,算出該光學組件層之面內平均光軸的方向,調整該光學組件層之切斷方向,使得該光學組件層之面內平均光軸方向相對該光學組件層之切斷方向而呈目標角度;第三步驟,係於調整後之切斷方向上,讓該分離層片殘留於該光學組件層的狀態下,將該光學組件層切斷成較該顯示區域更大尺寸以獲得層片;第四步驟,係將該層片從該分離層片處剝離;第五步驟,係將該層片貼附而保持於貼合頭的圓弧狀保持面處,且為讓保持於該保持面之層片貼合至該光學顯示組件,而沿該保持面之彎曲使該貼合頭傾斜移動;第六步驟,係讓該貼合頭與支撐該光學顯示部件的台座進行相對移動,使得切斷後之層片的切斷邊與該光學顯示部件之一邊呈一致或平行,並為讓該傾斜移動實施該層片之保持及貼合,而驅動該貼合頭;以及第七步驟,係將該層片之顯示區域的對向部分與該對向部分外側的剩餘部分切斷,從該層片切割出對應於該顯示區域大小的光學組件。 (7) A method of producing an optical display device according to another aspect of the present invention, which is a method for producing an optical display device by bonding an optical member to an optical display member, which has the following steps The first step is to roll out the strip optical component layer wider than the display area of the optical display component from the roll roll and the separation layer; the second step is to obtain the optical axis of the optical component layer. The inner distribution data is calculated according to the in-plane distribution data of the optical component layer, and the direction of the in-plane average optical axis of the optical component layer is calculated, and the cutting direction of the optical component layer is adjusted to make the in-plane average of the optical component layer The optical axis direction is at a target angle with respect to the cutting direction of the optical component layer; and the third step is performed in the adjusted cutting direction so that the separation layer remains in the optical component layer, and the optical component is The layer is cut to a larger size than the display area to obtain a layer; the fourth step is to peel the layer from the separation layer; and the fifth step is to attach the layer to the bonding head. The arc-shaped holding surface is configured such that the layer held by the holding surface is attached to the optical display assembly, and the bonding head is tilted and moved along the bending of the holding surface; in the sixth step, the sticker is attached Combine the head and support the optical display The pedestal of the piece is relatively moved such that the cut edge of the cut layer is aligned or parallel with one side of the optical display member, and the bonding is driven to perform the tilting movement to maintain and fit the layer. And a seventh step of cutting the opposite portion of the display region of the layer and the remaining portion of the outer portion of the facing portion, and cutting the optical component corresponding to the size of the display region from the layer.
(8)如前述(7)之態樣中,係檢出該光學組件層之面內以最大角度交叉的二個光軸,算出該二個光軸所夾角度均分之軸,以作為該光學組件層之面內平均光軸。 (8) In the aspect of the above (7), the two optical axes intersecting at the maximum angle in the plane of the optical component layer are detected, and the axis of the angular division of the two optical axes is calculated as the axis. The in-plane average optical axis of the optical component layer.
(9)關於本發明之另一態樣的光學顯示設備之生產系統,係將光學組件貼合至光學顯示部件以形成光學顯示設備之生產系統,其具備:貼合裝置,係將寬度較該光學顯示部件顯示區域之長邊與短邊中任一邊長度更寬的條狀光學組件層從料捲滾筒捲出,且以較該顯示區域之長邊或短邊中另一邊長度更長地將該光學組件層切斷而形成層片後,將該層片貼合至該光學顯示部件; 以及切斷裝置,係從貼合至該光學顯示部件之層片將配置於該顯示區域之對向部分外側的剩餘部分切斷,以形成作為對應於該顯示區域大小的光學組件;其中,該貼合裝置具有:捲出部,係將該光學組件層從該料捲滾筒與分離層片一同捲出;切斷部,係讓該分離層片殘留於該光學組件層的狀態下,將該光學組件層切斷以獲得該層片;剝離部,係將該層片從該分離層片處剝離;以及貼合頭,係將該層片貼附而保持於保持面處,且將保持於該保持面之層片貼合至該光學顯示部件。 (9) A production system for an optical display device according to another aspect of the present invention is a production system for bonding an optical component to an optical display component to form an optical display device, comprising: a bonding device, which has a width A strip-shaped optical component layer having a longer length on either side of the long side and the short side of the display portion of the optical display member is unwound from the roll drum and is longer than the other side of the long side or the short side of the display area After the optical component layer is cut to form a layer, the layer is bonded to the optical display component; And a cutting device for cutting a remaining portion disposed outside the opposite portion of the display region from a layer bonded to the optical display member to form an optical component corresponding to a size of the display region; wherein The bonding apparatus has a winding-out portion that winds the optical component layer together with the separation layer sheet, and the cutting portion, in which the separation layer remains in the optical component layer, The optical component layer is cut to obtain the ply; the peeling portion is peeled off from the separating ply; and the bonding head is attached to the ply and held at the holding surface, and will remain in The layer of the holding surface is attached to the optical display member.
(10)如前述(9)之態樣中,更具有控制裝置,係根據該光學組件層之光軸方向的檢查資料,決定該光學顯示部件與該層片的相對貼合位置;且該貼合頭係根據該控制裝置所決定之相對貼合位置,將保持於該保持面的層片貼合至該光學顯示部件。 (10) In the aspect of the above (9), the control device further determines a relative bonding position of the optical display member and the layer according to the inspection data of the optical axis direction of the optical component layer; and the sticker The splicing head adheres the layer held on the holding surface to the optical display member according to the relative bonding position determined by the control device.
(11)如前述(10)之態樣中,該貼合頭係將保持於該保持面之層片,藉由水平方向之貼合頭移動方向及其垂直方向、以及迴轉方向進行位置校準。 (11) In the aspect of the above (10), the bonding head is held by the layer of the holding surface, and the position is aligned by the moving direction of the bonding head in the horizontal direction, the vertical direction thereof, and the turning direction.
(12)如前述(9)~(11)任一者之態樣中,該貼合裝置更具有檢測印於該光學組件層之缺陷標誌的檢測部,檢測出有該光學組件層之缺陷標誌的部位會保持於該貼合頭並搬送至廢棄位置。 (12) The aspect of any one of (9) to (11), wherein the bonding device further has a detecting portion for detecting a defect mark printed on the optical component layer, and detecting a defect flag of the optical component layer The part will remain in the fitting head and be transported to the disposal location.
(13)如前述(9)~(12)任一者之態樣中,更具有迴轉台,讓該光學顯示部件移動至搬入位置、搬出位置、及該層片對該光學顯示部件的貼合位置。 (13) In the aspect of any one of (9) to (12), further comprising a turntable for moving the optical display member to the carry-in position, the carry-out position, and the bonding of the layer to the optical display member position.
(14)如前述(9)~(13)任一者之態樣中,該貼合頭係將該層片貼附而保持於圓弧狀保持面處,且為讓保持於該保持面之層片貼合至該光學顯示組件,而能沿該保持面之彎曲傾斜移動。 (14) In the aspect of any one of (9) to (13), the bonding head is attached to the layer and held at the arc-shaped holding surface, and is held in the holding surface. The ply is attached to the optical display assembly and is tiltably movable along the curvature of the retaining surface.
(15)關於本發明之另一態樣的光學顯示設備之生產系統,係將光學組件貼合至光學顯示部件以形成光學顯示設備之生產系統,其具備:第一貼合裝置,係將寬度較該光學顯示部件顯示區域之長邊與短邊中任一邊長度更寬的條狀第一光學組件層從第一料捲滾筒捲出,且以較該顯示區域之長邊或短邊中另一邊長度更長地將該第一光學組件層切斷而形成第一層片後,將該第一層片貼合至該光學顯示部件之正/反面中一側之面處以形成光學組件貼合體;第二貼合裝置,係將寬度較該光學顯示部件顯示區域之長邊與短邊中任一邊長度更寬的條狀第二光學組件層從第二料捲滾筒捲出,且以較該顯示區域之長邊或短邊中另一邊長度更長地將該第二光學組件層切斷而形成第二層片後,將該第二層片貼合至該光學組件貼合體之第一層片側之面;以及第一切斷裝置,係從貼合至該光學顯示部件之第一層片及第二層片將配置於該顯示區域之對向部分外側的剩餘部分一併切斷,使得由該第一光學組件層組成之第一光學組件及由該第二光學組件層組成之第二光學組件,形成作為對應於該顯示區域大小的光學組件;其中,該第一貼合裝置具有:第一捲出部,係將該第一光學組件層從該第一料捲滾筒與第一分離層片一同捲出;第一切斷部,係讓該第一分離層片殘留於該第一光學組件層的狀態下,將該第一光學組件層切斷以獲得該第一層片;第一剝離部,係將該第一層片從該第一分離層片處剝離;以及第一貼合頭,係將該第一層片貼附而保持於第一保持面處,且將保持於該第一保持面之第一層片貼合至該光學顯示部件之正/反面中一側之面;再者,該第二貼合裝置具有:第二捲出部,係將該第二光學組件層從該第二料捲滾筒與第二分離層片一同捲出;第二切斷部,係讓該第二分離層片殘留於該第二光學組件層的狀態下,將該第二光學組件層切斷以獲得該第二層片;第二剝離部,係將該第二層片從該 第二分離層片處剝離;以及第二貼合頭,係將該第二層片貼附而保持於第二保持面處,且將保持於該第二保持面之第二層片貼合至該光學組件貼合體之第一層片側之面。 (15) A production system for an optical display device according to another aspect of the present invention is a production system for bonding an optical component to an optical display member to form an optical display device, comprising: a first bonding device, which has a width a strip-shaped first optical component layer having a wider length than either one of a long side and a short side of the display portion of the optical display member is unwound from the first roll, and is further in a longer side or a shorter side than the display area After the first optical component layer is cut to form a first layer, the first layer is bonded to the side of the positive/negative side of the optical display member to form an optical component bonding body. a second bonding device that winds a strip-shaped second optical component layer having a width wider than either one of a long side and a short side of the display area of the optical display member from the second roll roll, and After the second optical component layer is cut to form a second ply for a longer length of the long side or the short side of the display area, the second ply is attached to the first layer of the optical component bonding body. The side of the sheet; and the first cutting device And connecting the first layer and the second layer of the optical display member to the remaining portion disposed outside the opposite portion of the display region, so that the first optical component composed of the first optical component layer and a second optical component composed of the second optical component layer is formed as an optical component corresponding to the size of the display area; wherein the first bonding device has a first winding portion, the first optical component layer The first roll drum is unwound together with the first separation layer sheet; the first cutting portion is configured to leave the first separation layer sheet in the first optical component layer, and the first optical component layer is Cutting to obtain the first ply; the first peeling portion is to peel the first ply from the first separating ply; and the first bonding head is to adhere the first ply to maintain At the first holding surface, and bonding the first layer of the first holding surface to the side of the positive/negative surface of the optical display member; further, the second bonding device has: a second take-up portion from which the second optical component layer is The second separation layer is rolled out together; the second cutting portion is configured to leave the second separation layer in the state of the second optical component layer, and the second optical component layer is cut to obtain the second layer a second peeling portion, the second layer is from the The second separation layer is peeled off; and the second bonding head is attached to the second holding surface, and the second layer held on the second holding surface is bonded to The optical component is bonded to the side of the first layer side of the body.
(16)如前述(15)之態樣中,更具有控制裝置,係根據該第一光學組件層之光軸方向的檢查資料,決定該光學顯示部件與該第一層片的第一相對貼合位置,並根據該第二光學組件層之光軸方向的檢查資料,決定該光學組件貼合體與該第二層片的第二相對貼合位置;該第一貼合裝置之第一貼合頭係根據該控制裝置所決定之第一相對貼合位置,將保持於該第一保持面的第一層片貼合至該光學顯示部件之正/反面中一側之面;且該第二貼合裝置之第二貼合頭係根據該控制裝置所決定之第二相對貼合位置,將保持於該第二保持面的第二層片貼合至該光學組件貼合體之第一層片側之面。 (16) The aspect of the above (15), further comprising: controlling the first relative sticker of the optical display component and the first layer according to the inspection data of the optical axis direction of the first optical component layer Positioning, and determining a second relative bonding position of the optical component bonding body and the second layer according to the inspection data of the optical axis direction of the second optical component layer; the first bonding of the first bonding device The first layer of the first holding surface held by the head is attached to the side of the positive/negative side of the optical display member according to the first relative bonding position determined by the control device; and the second The second bonding head of the bonding device attaches the second layer held on the second holding surface to the first layer side of the optical component bonding body according to the second relative bonding position determined by the control device The face.
(17)如前述(16)之態樣中,該第一貼合裝置之第一貼合頭係將保持於該第一保持面之第一層片,藉由水平方向之貼合頭移動方向及其垂直方向、以及迴轉方向進行位置校準;且該第二貼合裝置之第二貼合頭係將保持於該第二保持面之第二層片,藉由水平方向之貼合頭移動方向及其垂直方向、以及迴轉方向進行位置校準。 (17) The aspect of the above (16), wherein the first bonding head of the first bonding device is held by the first layer of the first holding surface, and the moving direction of the bonding head by the horizontal direction Positioning in the vertical direction and the direction of rotation; and the second bonding head of the second bonding device is held on the second layer of the second holding surface, and the moving direction of the bonding head in the horizontal direction Position calibration in its vertical direction and in the direction of rotation.
(18)如前述(15)~(17)任一者之態樣中,該第一貼合裝置更具有檢測印於該第一光學組件層之缺陷標誌的第一檢測部,檢測出有該第一光學組件層之缺陷標誌的部位會保持於該第一貼合頭並搬送至第一廢棄位置;且該第二貼合裝置更具有檢測印於該第二光學組件層之缺陷標誌的第二檢測部,檢測出有該第二光學組件層之缺陷標誌的部位會保持於該第一貼合頭並搬送至第二廢棄位置。 (18) The first bonding apparatus further includes a first detecting unit that detects a defect mark printed on the first optical component layer, in the aspect of any one of the above (15) to (17), a portion of the defect mark of the first optical component layer is retained in the first bonding head and transported to the first disposal position; and the second bonding device further has a defect detecting mark printed on the second optical component layer The second detecting unit detects that the portion of the second optical component layer having the defect mark is held by the first bonding head and is transported to the second disposal position.
(19)如前述(15)~(18)任一者之態樣中,更具有迴轉台,讓該光學顯示部件移動至搬入位置、搬出位置、該第一層片對該光學顯示部件的貼合位置(第一貼合位置)、及該第二層片對該光學組件貼合體的貼合位置(第二貼合位置)。 (19) In any one of the aspects (15) to (18), further comprising a turntable for moving the optical display member to the carry-in position and the carry-out position, and attaching the first layer to the optical display member The bonding position (first bonding position) and the bonding position (second bonding position) of the second layer sheet to the optical component bonding body.
(20)如前述(15)~(19)任一者之態樣中,該第一貼合裝置更具有第一層片搬送裝置,係從捲取有該第一光學組件層之第一料捲滾筒將該第一光學組件層捲出,且沿其長邊方向搬送該第一光學組件層;該第二貼合裝置更具有第二層片搬送裝置,係從捲取有該第二光學組件層之第二料捲滾筒將該第二光學組件層捲出,且沿其長邊方向搬送該第二光學組件層;且該第一光學組件層之搬送方向與該第二光學組件層之搬送方向係相互平行。 (20) In the aspect of any one of (15) to (19), the first bonding apparatus further has a first layer sheet conveying device, and the first material from which the first optical component layer is wound The roll cylinder winds the first optical component layer and transports the first optical component layer along the longitudinal direction thereof; the second bonding device further has a second layer conveyance device that winds the second optical a second roll of the component layer unwinds the second optical component layer and transports the second optical component layer along a longitudinal direction thereof; and a transport direction of the first optical component layer and the second optical component layer The transport directions are parallel to each other.
(21)如前述(15)~(20)任一者之態樣中,更具有:第三貼合裝置,係將寬度較該光學顯示部件顯示區域之長邊與短邊中任一邊長度更寬的條狀第三光學組件層從第三料捲滾筒捲出,且以較該顯示區域之長邊或短邊中另一邊長度更長地將該第三光學組件層切斷而形成第三層片後,將該第三層片貼合至該光學顯示部件之正/反面中另一面處;以及第二切斷裝置,係從貼合至該光學顯示部件之第三層片將配置於該顯示區域之對向部分外側的剩餘部分切斷,形成對應於該顯示區域大小的光學組件;其中,該第三貼合裝置具有:第三捲出部,係將該第三光學組件層從該第三料捲滾筒與第三分離層片一同捲出;第三切斷部,係讓該第三分離層片殘留於該第三光學組件層的狀態下,將該第三光學組件層切斷以獲得該第三層片;第三剝離部,係將該第三層片從該第三分離層片處剝離;以及第三貼合頭,係將該第三層片貼附而保持於第三保持面處,且將保持於該第三保持面之第三層片貼合至該光學顯示部件之正/反面中另一側 之面。 (21) The aspect of any one of (15) to (20), further comprising: a third bonding device having a width longer than a length of one of a long side and a short side of the display region of the optical display member The wide strip-shaped third optical component layer is unwound from the third roll drum, and the third optical component layer is cut to form a third length longer than the other of the long side or the short side of the display area After laminating, the third ply is attached to the other of the front/reverse faces of the optical display member; and the second cutting device is disposed from the third ply bonded to the optical display member. The remaining portion of the opposite side of the opposite portion of the display region is cut to form an optical component corresponding to the size of the display region; wherein the third bonding device has a third winding portion for removing the third optical component layer The third roll drum is unwound together with the third separation layer; the third cutting portion is configured to leave the third separation layer in the third optical component layer, and cut the third optical component layer Breaking to obtain the third layer; the third peeling portion is to separate the third layer from the third layer And peeling off the sheet; and the third bonding head, the third layer sheet is attached and held at the third holding surface, and the third layer sheet held on the third holding surface is attached to the optical display unit The other side of the positive/negative side The face.
(22)如前述(21)之態樣中,更具有控制裝置,係根據該第三光學組件層之光軸方向的檢查資料,決定該光學顯示部件與該第三層片的第三相對貼合位置;且該第三貼合裝置之第三貼合頭係根據該控制裝置所決定之第三相對貼合位置,將保持於該第三保持面的第三層片貼合至該光學顯示部件之正/反面中另一面。 (22) In the aspect of (21), the control device further determines a third relative sticker of the optical display component and the third layer according to the inspection data of the optical axis direction of the third optical component layer. And a third bonding head of the third bonding device, according to the third relative bonding position determined by the control device, bonding the third layer held on the third holding surface to the optical display The other side of the front/back of the part.
(23)如前述(21)或(22)之態樣中,該第三貼合裝置具有檢測印於該第三光學組件層之缺陷標誌的第三檢測部,檢測出有該第三光學組件層之缺陷標誌的部位會保持於該第三貼合頭並搬送至第三廢棄位置。 (23) The third bonding apparatus has a third detecting portion that detects a defect mark printed on the third optical component layer, and the third optical component is detected, in the aspect of the above (21) or (22) The portion of the defect mark of the layer is held in the third bonding head and transported to the third disposal position.
(24)如前述(21)~(23)任一者之態樣中,該第三貼合裝置更具有第三層片搬送裝置,係從捲取有該第三光學組件層之第三料捲滾筒將該第三光學組件層捲出,且沿其長邊方向搬送該第三光學組件層;且該第一光學組件層之搬送方向、該第二光學組件層之搬送方向及該第三光學組件層之搬送方向係相互平行。 (24) In the aspect of any one of (21) to (23), the third bonding apparatus further has a third layer conveying device for winding the third material of the third optical component layer Rolling the second optical component layer, and transporting the third optical component layer along the longitudinal direction thereof; and the conveying direction of the first optical component layer, the conveying direction of the second optical component layer, and the third The transport directions of the optical component layers are parallel to each other.
(25)如前述(21)~(24)任一者之態樣中,從該第一層片、該第二層片及該第三層片各自切斷之剩餘部分係一併從該光學顯示部件處剝離。 (25) In the aspect of any one of (21) to (24), the remaining portion cut from the first layer sheet, the second layer sheet, and the third layer sheet is collectively obtained from the optical Peel off at the display part.
(26)如前述(21)~(25)任一者之態樣中,該第一切斷裝置及該第二切斷裝置為雷射切割機,該第一切斷裝置及該第二切斷裝置係連接至同一個雷射輸出裝置,從該雷射輸出裝置所輸出之雷射係分歧而供給至該第一切斷裝置及該第二切斷裝置。 (26) The aspect of any one of (21) to (25), wherein the first cutting device and the second cutting device are laser cutting machines, the first cutting device and the second cutting device The breaking device is connected to the same laser output device, and the laser output from the laser output device is branched and supplied to the first cutting device and the second cutting device.
(27)如前述(21)~(26)任一者之態樣中,該第一貼合頭、該第二貼合頭及該第三貼合頭中至少一個貼合頭係將該第一層片、該第二層片及該第 三層片中至少一個層片貼附而保持於圓弧狀之第一保持面、第二保持面及第三保持面中至少一個保持面處,且為讓保持於該保持面之層片貼合至該光學顯示組件或該光學組件貼合體,而沿該保持面之彎曲傾斜移動。 (27) The aspect of any one of (21) to (26), wherein at least one of the first bonding head, the second bonding head, and the third bonding head is attached to the head a layer, the second layer, and the first At least one of the three-layer sheets is attached and held at at least one of the first holding surface, the second holding surface, and the third holding surface in an arc shape, and is attached to the layer held by the holding surface The optical display assembly or the optical component bonding body is coupled to and tilted along the curved surface of the holding surface.
根據本發明之一態樣,可提供一種可抑制光學顯示設備內產生光軸偏差的光學顯示設備之生產系統及光學顯示設備之生產方法。 According to an aspect of the present invention, a production system of an optical display device capable of suppressing generation of an optical axis deviation in an optical display device and a method of producing the optical display device can be provided.
又,根據本發明之另一態樣,可提供一種可縮小顯示區域周邊之邊框部,以達成顯示區域之擴大及機器之小型化目的的光學顯示設備之生產系統。 Moreover, according to another aspect of the present invention, it is possible to provide a production system of an optical display device which can reduce the frame portion around the display area and achieve the purpose of expanding the display area and miniaturizing the machine.
1,1A,2‧‧‧薄膜貼合系統 1,1A, 2‧‧‧ film bonding system
5‧‧‧主輸送設備 5‧‧‧Main conveying equipment
5a‧‧‧起點 5a‧‧‧ starting point
5b‧‧‧終點 5b‧‧‧end point
5c‧‧‧料架 5c‧‧‧ rack
6‧‧‧第一副輸送設備 6‧‧‧First delivery equipment
6a‧‧‧第一初始位置 6a‧‧‧First initial position
6b‧‧‧第一終點位置 6b‧‧‧first end position
7‧‧‧第二副輸送設備 7‧‧‧Second secondary conveyor
7a‧‧‧第二初始位置 7a‧‧‧ second initial position
7b‧‧‧第二終點位置 7b‧‧‧second end position
8‧‧‧第一搬送裝置 8‧‧‧First transport device
9‧‧‧洗淨裝置 9‧‧‧cleaning device
11‧‧‧第一轉台式機床 11‧‧‧First rotary machine tool
11a‧‧‧第一轉台初始位置 11a‧‧‧ Initial position of the first turntable
11b‧‧‧第一轉台終點位置 11b‧‧‧First turntable end position
11c‧‧‧第一貼合位置 11c‧‧‧First fit position
11d‧‧‧第二貼合位置 11d‧‧‧Second fitting position
11e‧‧‧薄膜剝離位置 11e‧‧‧film stripping position
12‧‧‧第二搬送裝置 12‧‧‧Second transport device
13‧‧‧第一貼合裝置 13‧‧‧First bonding device
14‧‧‧薄膜剝離裝置 14‧‧‧film stripping device
15‧‧‧第二貼合裝置 15‧‧‧Second laminating device
16‧‧‧第二轉台式機床 16‧‧‧Second rotary machine tool
16a‧‧‧第二轉台初始位置 16a‧‧‧Second turntable initial position
16b‧‧‧第二轉台終點位置 16b‧‧‧second turntable end position
16c‧‧‧第三貼合位置 16c‧‧‧ third fit position
16d‧‧‧貼合檢查位置 16d‧‧‧Finished inspection position
17‧‧‧第三搬送裝置 17‧‧‧ Third transport device
18‧‧‧第三貼合裝置 18‧‧‧ Third bonding device
19‧‧‧檢查裝置 19‧‧‧Checking device
21‧‧‧第四搬送裝置 21‧‧‧fourth transport device
22‧‧‧第五搬送裝置 22‧‧‧ fifth transport device
24‧‧‧儲存裝置 24‧‧‧Storage device
25‧‧‧控制裝置 25‧‧‧Control device
31‧‧‧層片搬送裝置 31‧‧‧Ply conveying device
31a‧‧‧捲出部 31a‧‧‧Departure
31b‧‧‧第一切斷裝置 31b‧‧‧First cutting device
31c‧‧‧刀刃 31c‧‧‧ Blade
31d‧‧‧捲取部 31d‧‧‧Winding Department
31e‧‧‧分離層剝離位置(剝離位置) 31e‧‧‧Separation layer peeling position (peeling position)
32‧‧‧貼合頭 32‧‧‧Fitting head
32a‧‧‧保持面 32a‧‧‧ Keep face
33‧‧‧驅動裝置 33‧‧‧ drive
34‧‧‧第一檢測攝影機 34‧‧‧First inspection camera
35‧‧‧第二檢測攝影機 35‧‧‧Second detection camera
36‧‧‧第三檢測攝影機 36‧‧‧ Third detection camera
37‧‧‧第四檢測攝影機 37‧‧‧Fourth detection camera
38‧‧‧第五檢測攝影機 38‧‧‧ Fifth detection camera
39‧‧‧位置校準台 39‧‧‧Location Calibration Table
39a‧‧‧載置面 39a‧‧‧Loading surface
40‧‧‧光學組件層之製造裝置 40‧‧‧Manufacturer for optical component layers
41a,41c‧‧‧捲出部 41a, 41c‧‧‧Departs
41b,41d‧‧‧捲取部 41b, 41d‧‧‧Winding Department
42‧‧‧檢查裝置 42‧‧‧Checking device
43‧‧‧光源 43‧‧‧Light source
44‧‧‧分析儀 44‧‧‧Analyzer
45‧‧‧切刀 45‧‧‧Cutter
50‧‧‧第二切斷裝置 50‧‧‧Second cutting device
51‧‧‧第一切斷裝置 51‧‧‧First cutting device
52‧‧‧第二切斷裝置 52‧‧‧Second cutting device
53‧‧‧雷射輸出裝置 53‧‧‧Laser output device
60‧‧‧貼合頭 60‧‧‧Fitting head
60a‧‧‧保持面 60a‧‧‧ Keep face
61‧‧‧導桿 61‧‧‧Guide bars
62‧‧‧貼合滾筒 62‧‧‧Finishing roller
100‧‧‧搬送裝置 100‧‧‧Transporting device
101‧‧‧光學薄膜 101‧‧‧Optical film
102‧‧‧第一中間薄膜 102‧‧‧First intermediate film
103‧‧‧第二中間薄膜 103‧‧‧Second intermediate film
104‧‧‧光學薄膜切片 104‧‧‧ Optical film sectioning
110‧‧‧薄膜層積裝置 110‧‧‧film stratification device
111,112‧‧‧軋輥 111,112‧‧‧ rolls
113‧‧‧滾筒 113‧‧‧Roller
120‧‧‧載臺 120‧‧‧ stage
121‧‧‧標誌 121‧‧‧ sign
131b‧‧‧切斷部 131b‧‧‧cutting department
140‧‧‧廢棄位置 140‧‧‧Discarded location
151‧‧‧攝影機 151‧‧‧ camera
CL‧‧‧橫切線 CL‧‧‧ transverse line
CP‧‧‧檢查點 CP‧‧‧ checkpoint
EL‧‧‧邊緣線 EL‧‧‧ edge line
F‧‧‧搬送方向 F‧‧‧Transfer direction
F0‧‧‧母片 F0‧‧‧ mother piece
F0A‧‧‧檢查後層片 F0A‧‧‧After inspection
F1‧‧‧第一光學組件層 F1‧‧‧First optical component layer
F2‧‧‧第二光學組件層 F2‧‧‧Second optical component layer
F3‧‧‧第三光學組件層 F3‧‧‧ third optical component layer
F1a‧‧‧光學組件本體 F1a‧‧‧Optical component body
F2a‧‧‧黏著層 F2a‧‧‧Adhesive layer
F3a‧‧‧分離層片 F3a‧‧‧Separation layer
F4a‧‧‧表面保護薄膜 F4a‧‧‧Surface protection film
F5‧‧‧貼合層片 F5‧‧‧Fitting layer
F6‧‧‧偏光鏡 F6‧‧‧ polarizer
F7‧‧‧第一薄膜 F7‧‧‧ first film
F8‧‧‧第二薄膜 F8‧‧‧second film
F11‧‧‧第一光學組件 F11‧‧‧First optical component
F12‧‧‧第二光學組件 F12‧‧‧Second optical component
F13‧‧‧第三光學組件 F13‧‧‧ Third optical component
F1X‧‧‧光學組件 F1X‧‧‧ optical components
F1m‧‧‧第一層片 F1m‧‧‧ first layer
F2m‧‧‧第二層片 F2m‧‧‧Second layer
F3m‧‧‧第三層片 F3m‧‧‧ third layer film
FXm‧‧‧層片 FXm‧‧‧ layer
FX‧‧‧光學組件層 FX‧‧‧ optical component layer
G‧‧‧邊框部 G‧‧‧Border Department
L1-L4‧‧‧軸 L1-L4‧‧‧ axis
Lc‧‧‧切斷邊 Lc‧‧‧ cut edge
Lp‧‧‧一邊 Lp‧‧‧ side
Lp1‧‧‧一邊 Lp1‧‧‧ side
P‧‧‧液晶面板 P‧‧‧ LCD panel
P1‧‧‧第一基板 P1‧‧‧ first substrate
P2‧‧‧第二基板 P2‧‧‧second substrate
P3‧‧‧液晶層 P3‧‧‧ liquid crystal layer
P4‧‧‧顯示區域 P4‧‧‧ display area
PA1‧‧‧第一光學組件貼合體 PA1‧‧‧First optical component fit
PA2‧‧‧第二光學組件貼合體 PA2‧‧‧Second optical component fit
PA3‧‧‧第三光學組件貼合體 PA3‧‧‧The third optical component fit
PA4‧‧‧第四光學組件貼合體 PA4‧‧‧Four optical component bonding body
PA5‧‧‧第五光學組件貼合體 PA5‧‧‧Fix optical component fit
R0‧‧‧原紙捲筒 R0‧‧‧original paper reel
R0A‧‧‧檢查後捲筒 R0A‧‧‧reel after inspection
R1‧‧‧料捲滾筒 R1‧‧‧ Roller
R2‧‧‧分離滾筒 R2‧‧‧Separation roller
S1-S7‧‧‧步驟 S1-S7‧‧‧ steps
V1‧‧‧第一光軸 V1‧‧‧first optical axis
V2‧‧‧第二光軸 V2‧‧‧second optical axis
V3‧‧‧平均光軸 V3‧‧‧ average optical axis
Vc‧‧‧切斷方向 Vc‧‧‧ cut direction
WCL‧‧‧切斷線 WCL‧‧‧ cut line
θmax‧‧‧最大偏移角 θ max ‧‧‧maximum offset angle
θmin‧‧‧最小偏移角 θ min ‧‧‧minimum offset angle
θmid‧‧‧平均偏移角 θ mid ‧‧‧average offset angle
γ‧‧‧角度 γ ‧‧‧ angle
第1圖係顯示本發明第一實施形態之薄膜貼合系統的示意平面圖。 Fig. 1 is a schematic plan view showing a film bonding system according to a first embodiment of the present invention.
第2圖係本實施形態之液晶面板的平面圖。 Fig. 2 is a plan view showing a liquid crystal panel of the embodiment.
第3圖係第2圖中的A-A剖面圖,顯示光學薄膜切片之切割裝置的主要部位平面圖。 Fig. 3 is a cross-sectional view taken along line A-A of Fig. 2, showing a plan view of a main part of a cutting apparatus for optical film slicing.
第4圖係本實施形態之光學組件層的剖面圖。 Fig. 4 is a cross-sectional view showing the optical component layer of the embodiment.
第5圖係前述薄膜貼合系統之平面圖。 Figure 5 is a plan view of the aforementioned film bonding system.
第6圖係顯示前述薄膜貼合系統之主要部位側面圖。 Fig. 6 is a side view showing the main part of the aforementioned film bonding system.
第7圖係光學組件層之製造裝置的側面圖。 Fig. 7 is a side view showing a manufacturing apparatus of the optical component layer.
第8圖係顯示光學組件層之製造裝置的主要部位平面圖。 Fig. 8 is a plan view showing the main part of the manufacturing apparatus of the optical component layer.
第9A圖係顯示母片之光軸面內分佈圖。 Fig. 9A is a diagram showing the in-plane distribution of the optical axis of the mother piece.
第9B圖係顯示母片之光軸面內分佈圖。 Figure 9B shows the in-plane distribution of the optical axis of the master.
第9C圖係顯示母片之光軸面內分佈圖。 Figure 9C shows the in-plane distribution of the optical axis of the master.
第10圖係顯示從檢查後層片切割出複數個光學組件層之情況的立體圖。 Fig. 10 is a perspective view showing a state in which a plurality of optical component layers are cut out from the layer after inspection.
第11圖係從光學組件層切割出層片之方法的說明圖。 Figure 11 is an explanatory view of a method of cutting a layer from an optical component layer.
第12A圖係調整光學組件層之切斷方向之方法的說明圖。 Fig. 12A is an explanatory view showing a method of adjusting the cutting direction of the optical component layer.
第12B圖係調整光學組件層之切斷方向之方法的說明圖。 Fig. 12B is an explanatory view showing a method of adjusting the cutting direction of the optical component layer.
第13圖係相對光學顯示部件將層片貼合之方法的說明圖。 Fig. 13 is an explanatory view showing a method of laminating the layers with respect to the optical display member.
第14圖係光學顯示設備之生產方法的流程圖。 Figure 14 is a flow chart of a method of producing an optical display device.
第15圖係顯示習知例之光學薄膜切片的切割方法之示意圖。 Fig. 15 is a view showing a cutting method of a conventional optical film slice.
第16圖係顯示第二實施形態之薄膜貼合系統的示意側面圖。 Fig. 16 is a schematic side view showing the film bonding system of the second embodiment.
第17圖係薄膜貼合系統之平面圖。 Figure 17 is a plan view of a film bonding system.
第18圖係薄膜貼合系統之貼合裝置的示意側面圖。 Figure 18 is a schematic side view of a laminating device of a film bonding system.
第19A圖係顯示相對液晶面板決定層片貼合位置之方法的一範例圖。 Fig. 19A is a view showing an example of a method of determining a bonding position of a layer with respect to a liquid crystal panel.
第19B圖係顯示相對液晶面板決定層片貼合位置之方法的一範例圖。 Fig. 19B is a view showing an example of a method of determining a bonding position of a layer with respect to a liquid crystal panel.
第20圖係顯示第三實施形態之薄膜貼合系統的示意側面圖。 Fig. 20 is a schematic side view showing the film bonding system of the third embodiment.
第21圖係適用於第四實施形態薄膜貼合系統之貼合裝置的示意圖。 Fig. 21 is a schematic view of a bonding apparatus applied to the film bonding system of the fourth embodiment.
第22圖係顯示層片之剩餘部分的切斷方法之平面圖。 Fig. 22 is a plan view showing a cutting method of the remaining portion of the ply.
以下,參考圖式說明本發明之第一實施形態。本實施形態中,係說明作為光學顯示設備之生產系統,構成其一部份的薄膜貼合系統。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system which is a part of a production system of an optical display device will be described.
第1圖係本實施形態之薄膜貼合系統1的示意結構圖。薄膜貼合系統1係例如將偏光薄膜或相位差薄膜、輝度增加薄膜等薄膜狀光學組件貼合至液晶面板或有機電致發光(OEL,Organic Electro-Luminescence)面板等面板 狀光學顯示部件。薄膜貼合系統1係構成生產包含該光學顯示部件及光學組件之光學顯示設備的生產系統之一部份。薄膜貼合系統1中,使用液晶面板P作為該光學顯示部件。第1圖中,為了圖示方便起見,將薄膜貼合系統1分為上下二層來繪製。 Fig. 1 is a schematic configuration diagram of a film bonding system 1 of the present embodiment. In the film bonding system 1 , for example, a film-shaped optical component such as a polarizing film, a retardation film, or a brightness-increasing film is bonded to a panel such as a liquid crystal panel or an organic electroluminescence (OEL) panel. Optical display component. The film bonding system 1 is part of a production system for producing an optical display device including the optical display member and the optical assembly. In the film bonding system 1, a liquid crystal panel P is used as the optical display member. In the first drawing, for convenience of illustration, the film bonding system 1 is divided into upper and lower layers to draw.
第2圖係從該液晶層P3厚度方向所見之液晶面板P的平面圖。液晶面板P具備有:第一基板P1,平面視圖呈長方形;第二基板P2,係對向第一基板P1來配置的較小長方形;以及液晶層P3,係封入第一基板P1與第二基板P2之間。液晶面板P於俯視(平面視圖)時,沿第一基板P1的外形係呈長方形,於液晶層P3外周緣之內側的區域為顯示區域P4。 Fig. 2 is a plan view of the liquid crystal panel P seen from the thickness direction of the liquid crystal layer P3. The liquid crystal panel P includes a first substrate P1 having a rectangular shape in plan view, a second substrate P2 having a small rectangular shape disposed opposite to the first substrate P1, and a liquid crystal layer P3 enclosing the first substrate P1 and the second substrate. Between P2. The liquid crystal panel P has a rectangular shape along the outer shape of the first substrate P1 in plan view (plan view), and a region inside the outer periphery of the liquid crystal layer P3 is the display region P4.
第3圖係第2圖之A-A剖面圖。於液晶面板P之正/反面,適當地貼合有從長條形之第一光學組件層F1、第二光學組件層F2及第三光學組件層F3(參考第1圖,以下總稱為光學組件層FX)切割出的第一光學組件F11、第二光學組件F12及第三光學組件F13(以下,總稱為光學組件F1X)。本實施形態中,液晶面板P之背光側及顯示面側的雙面係各自貼合有作為偏光薄膜的第一光學組件F11及第三光學組件F13。又,液晶面板P之背光側一面進一步貼合有重疊於第一光學組件F11之作為輝度增加薄膜的第二光學組件F12。另外,第一光學組件F11、第二光學組件F12及第三光學組件F13係從後述之第一層片F1m、第二層片F2m及第三層片F3m(以下,總稱為層片FXm)所切割出者(窗型切斷)。 Figure 3 is a cross-sectional view taken along line A-A of Figure 2. The first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 of the elongated strip are appropriately bonded to the front/rear surface of the liquid crystal panel P (refer to FIG. 1 , hereinafter collectively referred to as an optical component The layer FX) is cut out of the first optical component F11, the second optical component F12, and the third optical component F13 (hereinafter, collectively referred to as optical component F1X). In the present embodiment, the first optical unit F11 and the third optical unit F13 which are polarizing films are bonded to each other on both the backlight side and the display surface side of the liquid crystal panel P. Further, on the backlight side of the liquid crystal panel P, a second optical component F12 as a luminance increasing film which is superposed on the first optical component F11 is further bonded. Further, the first optical module F11, the second optical component F12, and the third optical component F13 are from the first layer F1m, the second layer F2m, and the third layer F3m (hereinafter, collectively referred to as a layer FXm) which will be described later. Cut out (window cut).
第4圖係貼合至液晶面板P之光學組件層FX的部分剖面圖。光學組件層FX係具有:薄膜狀的光學組件本體F1a;設置於光學組件本體F1a之一側之面(第4圖的上側面)的黏著層F2a;隔著黏著層F2a而能分離地層積於光 學組件本體F1a之一側之面的分離層片F3a;以及層積於光學組件本體F1a之另一側之面(第4圖的下側面)的表面保護薄膜F4a。光學組件本體F1a具有偏光板之功能,橫跨貼合於液晶面板P之顯示區域P4全區及其周邊區域。另外,為了圖示方便起見,省略第4圖中各層之剖面線。 Fig. 4 is a partial cross-sectional view of the optical component layer FX attached to the liquid crystal panel P. The optical component layer FX has a film-shaped optical module body F1a, an adhesive layer F2a provided on one surface side (the upper side of FIG. 4) of the optical module body F1a, and a layer 15b that can be separated and separated by the adhesive layer F2a. Light The separation layer F3a on the side of one side of the module body F1a; and the surface protection film F4a laminated on the other side (the lower side of FIG. 4) of the optical unit body F1a. The optical module body F1a has a function of a polarizing plate across the entire area of the display area P4 of the liquid crystal panel P and its peripheral area. In addition, for convenience of illustration, the hatching of each layer in Fig. 4 is omitted.
光學組件本體F1a係於其一側之面殘留有黏著層F2a且與分離層片F3a分離之狀態下,隔著黏著層F2a貼合至液晶面板P。以下,將從光學組件層FX去除分離層片F3a後的部分稱作貼合層片F5。 The optical module main body F1a is bonded to the liquid crystal panel P via the adhesive layer F2a in a state where the adhesive layer F2a remains on the one surface and is separated from the separation layer F3a. Hereinafter, a portion from which the separation layer sheet F3a is removed from the optical module layer FX is referred to as a bonding layer sheet F5.
從黏著層F2a處分離前之期間,分離層片F3a係可保護黏著層F2a及光學組件本體F1a。 The separation layer F3a protects the adhesive layer F2a and the optical module body F1a before being separated from the adhesive layer F2a.
表面保護薄膜F4a係與光學組件本體F1a一同貼合至液晶面板P。表面保護薄膜F4a係相對光學組件本體F1a而配置於液晶面板P之反對側,以保護光學組件本體F1a。表面保護薄膜F4a會在特定時點從光學組件本體F1a處分離。 The surface protective film F4a is bonded to the liquid crystal panel P together with the optical module body F1a. The surface protective film F4a is disposed on the opposite side of the liquid crystal panel P with respect to the optical module body F1a to protect the optical module body F1a. The surface protective film F4a is separated from the optical module body F1a at a specific time point.
另外,光學組件層FX亦可為不包含表面保護薄膜F4a之結構,表面保護薄膜F4a亦可為無法從光學組件本體F1a處分離之結構。 Further, the optical component layer FX may be a structure that does not include the surface protective film F4a, and the surface protective film F4a may be a structure that cannot be separated from the optical component body F1a.
光學組件本體F1a具有:層片狀之偏光鏡F6;於偏光鏡F6之一側之面以接著劑等接合的第一薄膜F7;以及於偏光鏡F6之另一側之面以接著劑等接合的第二薄膜F8。第一薄膜F7及第二薄膜F8係保護例如偏光鏡F6的保護薄膜。 The optical module body F1a has a sheet-like polarizing mirror F6, a first film F7 joined by an adhesive or the like on one side of the polarizing mirror F6, and a bonding agent or the like on the other side of the polarizing mirror F6. The second film F8. The first film F7 and the second film F8 protect the protective film such as the polarizer F6.
另外,光學組件本體F1a可由一層之光學層所構成的單層構造,亦可為由複數個光學層相互層積的層積構造。除了偏光鏡F6之外,該光學層亦可為相位差薄膜或輝度增加薄膜等。第一薄膜F7與第二薄膜F8中至少任一者 亦可施以表面處理,以獲得包含保護液晶顯示單元最外層之硬塗層處理或防眩光處理之防眩等效果。光學組件本體F1a亦可不包含有第一薄膜F7與第二薄膜F8中至少任一者。例如省略第一薄膜F7之情況,亦可將分離層片F3a隔著黏著層F2a而貼合至光學組件本體F1a之一側之面。 Further, the optical module body F1a may have a single layer structure composed of one optical layer, or may be a laminated structure in which a plurality of optical layers are laminated to each other. In addition to the polarizer F6, the optical layer may be a retardation film or a luminance increasing film. At least one of the first film F7 and the second film F8 A surface treatment may also be applied to obtain an anti-glare effect including a hard coat treatment or an anti-glare treatment for protecting the outermost layer of the liquid crystal display unit. The optical module body F1a may not include at least one of the first film F7 and the second film F8. For example, when the first film F7 is omitted, the separation layer sheet F3a may be bonded to the surface on one side of the optical module body F1a via the adhesive layer F2a.
第5圖係薄膜貼合系統1之平面圖(俯視圖)。以下,參考第1圖、第5圖說明薄膜貼合系統1。另外,圖中箭頭F係顯示液晶面板P之搬送方向。以下說明中,液晶面板P之搬送方向上游側稱為面板搬送上游側,液晶面板P之搬送方向下游側則稱為面板搬送下游側。 Fig. 5 is a plan view (top view) of the film bonding system 1. Hereinafter, the film bonding system 1 will be described with reference to Figs. 1 and 5 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport upstream side, and the downstream side in the transport direction of the liquid crystal panel P is referred to as the panel transport downstream side.
薄膜貼合系統1係將主輸送設備5之特定位置作為貼合步驟之起點5a及終點5b。薄膜貼合系統1具備:由起點5a從主輸送設備5朝直角方向延伸之第一副輸送設備6及第二副輸送設備7;從起點5a朝第一副輸送設備6之第一初始位置6a搬送液晶面板P的第一搬送裝置8;設置於第一副輸送設備6上的洗淨裝置9;設置於第一副輸送設備6之面板搬送下游側的第一轉台式機床11;從第一副輸送設備6之第一終點位置6b朝第一轉台式機床11之第一轉台初始位置11a搬送液晶面板P的第二搬送裝置12;以及設置於第一轉台式機床11周圍的第一貼合裝置13、第二貼合裝置15與薄膜剝離裝置14。 The film bonding system 1 uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding step. The film bonding system 1 is provided with a first sub-conveying device 6 and a second sub-conveying device 7 extending from the main conveying device 5 in the right-angle direction from the starting point 5a; from the starting point 5a toward the first initial position 6a of the first sub-conveying device 6 a first transfer device 8 that transports the liquid crystal panel P, a cleaning device 9 that is disposed on the first sub-transport device 6, and a first rotary machine tool 11 that is disposed on the downstream side of the panel transport of the first sub-conveying device 6; a first transfer position 6b of the sub-conveying device 6 transports the second transfer device 12 of the liquid crystal panel P toward the first turntable initial position 11a of the first rotary machine tool 11; and a first fit disposed around the first rotary machine tool 11 The device 13, the second bonding device 15, and the film peeling device 14.
又,薄膜貼合系統1具備:設置於第一轉台式機床11之面板搬送下游側的第二轉台式機床16;將第一轉台式機床11從第一轉台終點位置11b朝第二轉台式機床16之第二轉台初始位置16a搬送液晶面板P的第三搬送裝置17;設置於第二轉台式機床16周圍的第三貼合裝置18及檢查裝置19;設置於第二轉台式機床16之面板搬送下游側的第二副輸送設備7;從第二轉台式機床16之第二轉台終點位置16b朝第二副輸送設備7之第二初始位置7a搬送液晶面 板P的第四搬送裝置21;以及從第二副輸送設備7之第二終點位置7b朝主輸送設備5之終點5b搬送液晶面板P的第五搬送裝置22。 Further, the film bonding system 1 includes a second rotary machine tool 16 provided on the downstream side of the panel transfer of the first rotary machine tool 11; and the first rotary machine tool 11 from the first turntable end position 11b to the second rotary machine tool a third transfer device 17 that transports the liquid crystal panel P at the second turntable initial position 16a of 16; a third bonding device 18 and an inspection device 19 that are disposed around the second rotary machine tool 16; and a panel that is disposed on the second rotary machine tool 16 Transporting the second sub-conveying device 7 on the downstream side; transporting the liquid crystal surface from the second turret end position 16b of the second rotary machine tool 16 toward the second initial position 7a of the second sub-conveying device 7 The fourth conveying device 21 of the plate P; and the fifth conveying device 22 that conveys the liquid crystal panel P from the second end position 7b of the second sub-conveying device 7 toward the end point 5b of the main conveying device 5.
薄膜貼合系統1係使用由驅動式之主輸送設備5、各副輸送設備(第一副輸送設備6及第二副輸送設備7)及各轉台式機床(第一轉台式機床11及第二轉台式機床16)所形成之生產線搬送液晶面板P,且對液晶面板P依序施以特定處理。液晶面板P係以其正/反面呈水平狀態下於生產線上進行搬送。 The film bonding system 1 uses a driven main conveying device 5, each auxiliary conveying device (the first auxiliary conveying device 6 and the second auxiliary conveying device 7), and each rotary machine tool (the first rotary machine tool 11 and the second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is transported on the production line with its front/reverse surfaces horizontal.
液晶面板P係例如於主輸送設備5中,將顯示區域P4之短邊朝向搬送方向來進行搬送;與主輸送設備5垂直之各副輸送設備(第一副輸送設備6及第二副輸送設備7)中,將顯示區域P4之長邊朝向搬送方向來進行搬送;於各轉台式機床(第一轉台式機床11及第二轉台式機床16)中,顯示區域P4之長邊朝向各轉台式機床(第一轉台式機床11及第二轉台式機床16)之半徑方向來進行搬送。圖中符號5c係對應於液晶面板P,顯示沿主輸送設備5上運送之料架。 The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 toward the transport direction; each of the sub transport devices (the first sub transport device 6 and the second sub transport device that are perpendicular to the main transport device 5) 7), the long side of the display area P4 is transported in the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display area P4 is oriented toward each of the rotary tables. The machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) is transported in the radial direction. The symbol 5c in the figure corresponds to the liquid crystal panel P, and displays the rack transported along the main transport device 5.
相對於該液晶面板P之正/反面,將從條狀的光學組件層FX切割出特定長度的貼合層片F5之層片(相當於光學組件F1X)進行貼合。薄膜貼合系統1之各部位係透過作為電子控制裝置的控制裝置25進行整體控制。 The layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P. Each part of the film bonding system 1 is integrally controlled by a control device 25 as an electronic control unit.
第一搬送裝置8可保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。 The first conveying device 8 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction.
第一搬送裝置8係例如將藉由吸附作用所保持之液晶面板P朝第一副輸送設備6之第一初始位置6a(第5圖之左端部)直接以水平狀態進行搬送,於該位置處解除該吸附作用,將液晶面板P傳遞給第一副輸送設備6。 The first conveying device 8 conveys, for example, the liquid crystal panel P held by the adsorption to the first initial position 6a (the left end portion of the fifth drawing) of the first sub-conveying device 6 in a horizontal state, at which position The adsorption is released, and the liquid crystal panel P is transferred to the first sub-conveying device 6.
洗淨裝置9係例如水洗式洗淨,對液晶面板P之正/反面的刷洗及水洗,其後,進行液晶面板P之正/反面的液體清除。另外,洗淨裝置9亦可 為乾式洗淨,對液晶面板P之正/反面進行靜電消除及集塵。 The cleaning device 9 is, for example, washed by water, brushed and washed with respect to the front/reverse surface of the liquid crystal panel P, and thereafter, the liquid on the front/rear surface of the liquid crystal panel P is removed. In addition, the cleaning device 9 can also For dry cleaning, static elimination and dust collection are performed on the front/back side of the liquid crystal panel P.
第二搬送裝置12可保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。第二搬送裝置12係例如將藉由吸附作用所保持之液晶面板P朝第一轉台式機床11之第一轉台初始位置11a直接以水平狀態進行搬送,於該位置處解除該吸附作用,將液晶面板P傳遞給第一轉台式機床11。 The second transfer device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The second transfer device 12 directly transports the liquid crystal panel P held by the adsorption to the first turntable initial position 11a of the first rotary machine tool 11 in a horizontal state, and at this position, the adsorption action is released, and the liquid crystal is discharged. The panel P is delivered to the first rotary machine tool 11.
第一轉台式機床11係具有沿垂直方向之迴轉軸的圓盤狀迴轉台,以第5圖(平面視圖)之左端部作為第一轉台初始位置11a,並朝順時針方向進行迴轉驅動。第一轉台式機床11係以從第一轉台初始位置11a朝順時針方向迴轉90°迴轉之位置(第5圖之上端部)作為第一貼合位置11c。於該第一貼合位置11c處,以第一貼合裝置13進行背光側之第一光學組件F11的貼合。 The first rotary machine tool 11 is a disk-shaped turntable having a rotary axis in the vertical direction, and the left end portion of Fig. 5 (plan view) is used as the first turntable initial position 11a, and is rotationally driven in the clockwise direction. The first rotary machine tool 11 is a first bonding position 11c at a position (the upper end portion of Fig. 5) that is rotated 90° in the clockwise direction from the first turret initial position 11a. At the first bonding position 11c, the bonding of the first optical component F11 on the backlight side is performed by the first bonding apparatus 13.
第一轉台式機床11係以從第一貼合位置11c朝順時針方向迴轉45°迴轉之位置(第5圖之右上端部)作為薄膜剝離位置11e。於該薄膜剝離位置11e處,以薄膜剝離裝置14進行第一光學組件F11之表面保護薄膜F4a的剝離。 The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of Fig. 5) which is rotated by 45° in the clockwise direction from the first bonding position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first optical component F11 is performed by the film peeling device 14.
第一轉台式機床11係以從薄膜剝離位置11e朝順時針方向迴轉45°迴轉之位置(第5圖之右端位置)作為第二貼合位置11d。於該第二貼合位置11d處,以第二貼合裝置15進行背光側之第二光學組件F12的貼合。 The first rotary machine tool 11 is a second attachment position 11d at a position (right end position in Fig. 5) that is rotated by 45° in the clockwise direction from the film peeling position 11e. At the second bonding position 11d, the bonding of the second optical component F12 on the backlight side is performed by the second bonding apparatus 15.
第一轉台式機床11係以從第二貼合位置11d朝順時針方向迴轉90°之位置(第5圖之下端部)作為第一轉台終點位置11b。於該第一轉台終點位置11b處,以第三搬送裝置17進行搬出動作。 The first rotary table machine 11 is a first turntable end position 11b at a position (the lower end portion in Fig. 5) which is rotated 90° clockwise from the second bonding position 11d. At the first turntable end position 11b, the carry-out operation is performed by the third transfer device 17.
第三搬送裝置17係保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。第三搬送裝置17係例如將藉由吸附作用所保持之液晶面板P朝第二轉台式機床16之第二轉台初始位置16a進行搬送,並於該搬送時,進行液 晶面板P之正/反面反轉,於第二轉台初始位置16a處解除該吸附作用,將液晶面板P傳遞給第二轉台式機床16。 The third transport device 17 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The third transport device 17 transports the liquid crystal panel P held by the adsorption to the second turntable initial position 16a of the second rotary machine tool 16, for example, and performs liquid transfer during the transfer. The positive/negative surface of the crystal panel P is reversed, and the adsorption is released at the second turntable initial position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.
第二轉台式機床16係具有沿垂直方向之迴轉軸的圓盤狀迴轉台,以第5圖(平面視圖)之上端部作為第二轉台初始位置16a,並朝順時針方向進行迴轉驅動。第二轉台式機床16係以從第二轉台初始位置16a朝順時針方向迴轉90°之位置(第5圖之右端部)作為第三貼合位置16c。於該第三貼合位置16c處,以第三貼合裝置18進行顯示面側之第三光學組件F13的貼合。 The second rotary machine tool 16 is a disk-shaped turntable having a rotary axis in the vertical direction, and the upper end portion of Fig. 5 (plan view) is used as the second turntable initial position 16a, and is rotationally driven in the clockwise direction. The second rotary machine tool 16 is a third bonding position 16c at a position (right end portion of Fig. 5) that is rotated 90° clockwise from the second turret initial position 16a. At the third bonding position 16c, the third bonding apparatus 18 performs bonding of the third optical component F13 on the display surface side.
第二轉台式機床16係以從第三貼合位置16c朝順時針方向迴轉90°之位置(第5圖之下端部)作為貼合檢查位置16d。於該貼合檢查位置16d處,以檢查裝置19對貼合有薄膜之加工件(液晶面板P)進行檢查(光學組件F1X之位置是否適當(位置偏差是否在公差範圍內)等檢查)。相對液晶面板P之光學組件F1X的位置被判斷為不正確的加工件,便透過圖中未顯示之排除部而送出系統外。 The second rotary machine tool 16 is a position (the lower end portion in Fig. 5) which is rotated 90° clockwise from the third bonding position 16c as the bonding inspection position 16d. At the bonding inspection position 16d, the inspection device 19 inspects the workpiece (liquid crystal panel P) to which the film is bonded (inspection of whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.
第二轉台式機床16係以從貼合檢查位置16d朝順時針方向迴轉90°迴轉之位置(第5圖之左端部)作為第二轉台終點位置16b。於該第二轉台終點位置16b處,以第四搬送裝置21進行搬出動作。 The second rotary machine tool 16 is a second turntable end position 16b at a position (left end of Fig. 5) that is rotated 90° clockwise from the bonding inspection position 16d. At the second turntable end position 16b, the carry-out operation is performed by the fourth transfer device 21.
第四搬送裝置21係保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。第四搬送裝置21係例如將藉由吸附作用所保持之液晶面板P朝第二副輸送設備7之第二初始位置7a進行搬送,於第二初始位置7a處解除該吸附作用,將液晶面板P傳遞給第二副輸送設備7。 The fourth conveying device 21 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fourth conveying device 21 conveys, for example, the liquid crystal panel P held by the adsorption to the second initial position 7a of the second sub-transporting device 7, and releases the adsorption at the second initial position 7a, and the liquid crystal panel P is removed. It is transmitted to the second sub-conveying device 7.
第五搬送裝置22係保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。第五搬送裝置22係例如將藉由吸附作用所保持之液晶面板P朝 主輸送設備5之終點5b進行搬送,於終點5b處解除該吸附作用,將液晶面板P傳遞給主輸送設備5。經由以上完成薄膜貼合系統1之貼合步驟。 The fifth conveying device 22 holds the liquid crystal panel P and is freely transported in the vertical direction and the horizontal direction. The fifth conveying device 22 is, for example, a liquid crystal panel P held by adsorption The end point 5b of the main conveying device 5 is conveyed, and the suction action is released at the end point 5b, and the liquid crystal panel P is transferred to the main conveying device 5. The bonding step of the film bonding system 1 is completed via the above.
以下,參考第6圖詳細說明第一貼合裝置13。 Hereinafter, the first bonding apparatus 13 will be described in detail with reference to FIG.
第6圖係顯示第一貼合裝置13之主要部位側面圖。另外,第二貼合裝置15及第三貼合裝置18亦具有相同結構而省略其詳細說明。第6圖中,為了圖示方便起見,第一貼合裝置13之主要部位係分為上下二層來記載。於第6圖中,上層係顯示驅動貼合頭時的情況,下層係顯示於光學顯示部件之背光側中,將層片之剩餘部分切斷時的情況。 Fig. 6 is a side view showing the main part of the first bonding apparatus 13. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted. In Fig. 6, for the sake of convenience of illustration, the main parts of the first bonding apparatus 13 are described as being divided into upper and lower layers. In Fig. 6, the upper layer shows the case where the bonding head is driven, and the lower layer is displayed on the backlight side of the optical display member, and the remaining portion of the layer is cut.
第一貼合裝置13係針對搬送至第一貼合位置11c的液晶面板P之上側面,將第一光學組件層F1中切斷成特定尺寸的貼合層片F5之第一層片F1m進行貼合。其後,第一貼合裝置13係從第一層片F1m切割出對應於顯示區域大小的第一光學組件F11。 The first bonding apparatus 13 performs the first layer sheet F1m of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1 with respect to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c. fit. Thereafter, the first bonding apparatus 13 cuts out the first optical component F11 corresponding to the size of the display area from the first layer F1m.
第一貼合裝置13係具有:層片搬送裝置31,係從捲取有該第一光學組件層F1之料捲滾筒R1將該第一光學組件層F1捲出,且沿其長邊方向搬送該第一光學組件層F1;貼合頭32,於層片搬送裝置31保持從第一光學組件層F1切割出的貼合層片F5之第一層片F1m的同時,貼合頭32將第一層片F1m貼合至搬送到第一貼合位置11c的液晶面板P之上側面;以及第二切斷裝置50,將第一層片F1m之顯示區域P4的對向部分與該對向部分外側的剩餘部分切斷,從第一層片F1m切割出對應於顯示區域P4大小的第一光學組件F11。 The first bonding apparatus 13 includes a layer sheet conveying device 31 that winds the first optical component layer F1 from the roll drum R1 that has taken up the first optical component layer F1 and transports it along the longitudinal direction thereof. The first optical component layer F1 and the bonding head 32 hold the first layer F1m of the bonding layer sheet F5 cut from the first optical component layer F1 while the layer conveying device 31 holds the bonding head 32 a layer F1m is attached to the upper side of the liquid crystal panel P conveyed to the first bonding position 11c; and a second cutting device 50 is used to face the opposite portion of the display area P4 of the first layer F1m and the opposite portion The remaining portion of the outer side is cut, and the first optical component F11 corresponding to the size of the display region P4 is cut out from the first layer sheet F1m.
層片搬送裝置31係以分離層片F3a作為載件來搬送貼合層片F5。層片搬送裝置31係具有:捲出部31a,係保持捲取有該條狀第一光學組件層F1之料捲滾筒R1,且沿其長邊方向將第一光學組件層F1捲出;第一切斷裝 置31b,對從料捲滾筒R1捲出之第一光學組件層F1施以半切斷;刀刃31c(剝離部),將施以半切斷後之第一光學組件層F1於銳角處捲繞,以使貼合層片F5從分離層片F3a處分離;以及捲取部31d,保持捲取通過刀刃31c後獨自存在之分離層片F3a的分離滾筒R2。 The layer sheet conveying device 31 conveys the bonding layer sheet F5 with the separation layer sheet F3a as a carrier. The sheet conveying device 31 has a winding portion 31a that holds the roll drum R1 in which the strip-shaped first optical component layer F1 is wound, and winds the first optical component layer F1 along the longitudinal direction thereof; Cut off 31b, the first optical component layer F1 taken up from the roll drum R1 is half-cut; the blade 31c (peeling part) is wound around the first optical component layer F1 after the half cut, so that The bonding layer sheet F5 is separated from the separation layer sheet F3a, and the winding portion 31d holds the separation roller R2 of the separation layer sheet F3a which is wound by the blade edge 31c.
另外,雖然圖式中省略,但層片搬送裝置31具有沿特定搬送路線捲繞第一光學組件層F1的複數個導引滾筒。第一光學組件層F1在與其搬送方向垂直之水平方向(層片寬度方向)上,具有寬度較液晶面板P之顯示區域P4(相當於本實施形態中顯示區域P4之短邊長度)更寬的寬度。 Further, although omitted from the drawings, the layer sheet conveying device 31 has a plurality of guide rollers that wind the first optical module layer F1 along a specific conveyance path. The first optical component layer F1 has a width wider than the display region P4 of the liquid crystal panel P (corresponding to the short side length of the display region P4 in the present embodiment) in the horizontal direction (ply width direction) perpendicular to the conveyance direction. width.
位於層片搬送裝置31起點之捲出部31a與位於層片搬送裝置31終點之捲取部31d,係例如為相互同步驅動。藉此,捲出部31a係朝其搬送方向不斷捲出第一光學組件層F1,且捲取部31d則捲取通過刀刃31c後的分離層片F3a。以下,於層片搬送裝置31中,第一光學組件層F1(分離層片F3a)之搬送方向上游側稱作層片搬送上游側,搬送方向下游側稱作層片搬送下游側。 The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a continuously winds up the first optical component layer F1 in the conveyance direction, and the winding portion 31d winds up the separation layer sheet F3a that has passed through the blade edge 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.
第一切斷裝置31b係配置於第一光學組件層F1上方。例如,第一切斷裝置31b具備圓形切斷刀片。又,切斷刀片係藉由圖中未顯示之驅動機構,能在一方向上沿導引部長邊方向移動的結構。另外,導引部之長度較第一光學組件層F1寬度方向之長度更長。導引部係根據藉由控制裝置25所調整之切斷方向,在與第一光學組件層F1平行之面內進行迴轉驅動。 The first cutting device 31b is disposed above the first optical component layer F1. For example, the first cutting device 31b is provided with a circular cutting blade. Further, the cutting blade is configured to be movable in the direction of the leading side in one direction by a driving mechanism not shown. Further, the length of the guiding portion is longer than the length of the first optical component layer F1 in the width direction. The guide portion is rotationally driven in a plane parallel to the first optical module layer F1 in accordance with the cutting direction adjusted by the control device 25.
每當第一切斷裝置31b在與該層片寬度方向垂直之長度方向上將第一光學組件層F1捲出達顯示區域P4之長度(相當於本實施形態中顯示區域P4之長邊長度)更長之長度時,沿該層片寬度方向橫跨整體寬度切斷第一光學組件層F1厚度方向之一部分(施以半切斷)。 Each time the first cutting device 31b winds up the first optical component layer F1 in the longitudinal direction perpendicular to the layer width direction up to the length of the display region P4 (corresponding to the long side length of the display region P4 in the present embodiment) When the length is longer, one part of the thickness direction of the first optical component layer F1 is cut across the entire width in the width direction of the layer (half-cut).
第一切斷裝置31b係透過第一光學組件層F1搬送中的張力,在不使得第一光學組件層F1(分離層片F3a)斷裂的情況下(殘留有特定厚度之分離層片F3a),調整切斷刀片的前後位置,施以該半切斷,其深至黏著層F2a與分離層片F3a交界面附近。另外,亦可使用雷射裝置代替切斷刀片。 The first cutting device 31b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken (the separation layer F3a having a specific thickness remains). The front and rear positions of the cutting blade are adjusted, and the half cut is applied to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.
經半切斷後之第一光學組件層F1中,依其厚度方向切斷光學組件本體F1a及表面保護薄膜F4a,以形成橫跨第一光學組件層F1之層片寬度方向上整體寬度的橫切線。第一光學組件層F1係藉由該橫切線,在長邊方向上劃分出具有相當於顯示區域P4之長邊長度的分區。該分區係各自為貼合層片F5中的一個層片(第一層片F1m)。 In the half-cut first optical component layer F1, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the long side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the plies (first ply F1m) of the ply F5.
第一層片F1m的大小或形狀可對應光學組件的形狀或光學組件中的光軸設定方向,而任意地進行設定。本實施形態中,在與其長邊方向交叉的方向上將第一光學組件層F1進行半切斷(斜角切斷),於第一光學組件層F1形成相距特定間隔的橫切線,而獲得第一層片F1m。 The size or shape of the first layer sheet F1m can be arbitrarily set in accordance with the shape of the optical component or the optical axis setting direction in the optical component. In the present embodiment, the first optical component layer F1 is half-cut (beveled) in a direction crossing the longitudinal direction thereof, and a transverse line is formed at a predetermined interval from the first optical component layer F1 to obtain a first layer. Slice F1m.
於本實施形態中,形成料捲滾筒R1的條狀第一光學組件層F1係藉由光學組件層之製造裝置40所製成者。以下,參考第7圖至第10圖,詳細說明光學組件層之製造裝置40。 In the present embodiment, the strip-shaped first optical component layer F1 forming the roll drum R1 is made of the optical component layer manufacturing apparatus 40. Hereinafter, the manufacturing apparatus 40 of the optical component layer will be described in detail with reference to FIGS. 7 to 10.
第7圖係製造光學組件層FX之光學組件層之製造裝置40的側面圖。另外,光學組件層之製造裝置40係構成生產光學顯示設備的生產系統之一部分。 Fig. 7 is a side view showing a manufacturing apparatus 40 for manufacturing an optical component layer of the optical component layer FX. Further, the manufacturing apparatus 40 of the optical component layer constitutes a part of a production system for producing an optical display device.
光學組件層之製造裝置40係具有:捲出部41a,係保持捲取有寬度較第一光學組件層F1更寬之條狀光學組件層(以下,可稱作母片F0。)的原紙捲筒R0,且沿其長邊方向將母片F0捲出;檢查裝置42,於母片F0寬度方向 之複數個檢查位置處檢查從原紙捲筒R0捲出的母片F0之光軸;捲取部41b,係保持捲取通過檢查裝置42之檢查後層片F0A的檢查後捲筒R0A;捲出部41c,係保持檢查後捲筒R0A,且沿其長邊方向將檢查後層片F0A捲出;切刀45,用於從檢查後捲筒R0A所捲出之檢查後層片F0A切割出複數個光學組件層FX;以及捲取部41d,捲取透過切刀45所切割出之光學組件層FX,並保持料捲滾筒R1。 The manufacturing apparatus 40 of the optical component layer has a winding-out portion 41a that holds a raw paper roll in which a strip-shaped optical component layer (hereinafter, referred to as a mother sheet F0) having a wider width than the first optical component layer F1 is wound. The cylinder R0 is rolled out along the longitudinal direction thereof; the inspection device 42 is oriented in the width direction of the mother sheet F0 The optical axis of the mother sheet F0 rolled out from the original paper roll R0 is inspected at a plurality of inspection positions; the take-up portion 41b holds the post-inspection roll R0A of the post-inspection layer F0A which is taken up by the inspection device 42; The portion 41c holds the post-inspection reel R0A and winds up the inspected layer sheet F0A in the longitudinal direction thereof; the cutter 45 is used to cut the plural layer F0A from the inspected layer sheet F0A which is unwound from the inspected reel R0A. The optical component layer FX; and the winding portion 41d winds up the optical component layer FX cut through the cutter 45 and holds the roll drum R1.
原紙捲筒R0具有較料捲滾筒R1更寬之寬度。例如,原紙捲筒R0之寬度約為1300mm。料捲滾筒R1係藉由捲取部41d捲取從原紙捲筒R0捲出之母片F0所切割出的複數個光學組件層FX中之一者。例如,係從寬度約1300mm之母片F0切割出的複數個光學組件層FX。藉此,光學組件層FX之寬度約為200mm~300mm。 The base paper roll R0 has a wider width than the roll drum R1. For example, the width of the base paper roll R0 is about 1300 mm. The take-up reel R1 is one of a plurality of optical component layers FX cut by the mother sheet F0 wound from the original paper roll R0 by the take-up portion 41d. For example, it is a plurality of optical component layers FX cut out from a mother piece F0 having a width of about 1300 mm. Thereby, the width of the optical component layer FX is approximately 200 mm to 300 mm.
檢查裝置42具備:光源43,係配置於母片F0之上方;以及分析儀44,係配置於母片F0之下方。分析儀44具備接收從光源43放射出並透射過母片F0之光線的光線接收元件(圖式中省略)。檢查裝置42中,藉由以光線接收元件檢測出穿透過母片F0及分析儀44的光線強度,以檢測出母片F0之光軸。分析儀44係能於母片F0寬度方向上移動的結構。檢查裝置42係於母片F0寬度方向上移動分析儀44,且藉由分析儀44所檢測出的母片F0之光軸,以在母片F0寬度方向之複數個檢查位置處檢查母片F0之光軸。 The inspection device 42 includes a light source 43 disposed above the mother sheet F0, and an analyzer 44 disposed below the mother sheet F0. The analyzer 44 is provided with a light receiving element (not shown in the drawings) that receives the light emitted from the light source 43 and transmitted through the mother sheet F0. In the inspection device 42, the optical axis of the mother sheet F0 is detected by detecting the intensity of light passing through the mother sheet F0 and the analyzer 44 by the light receiving element. The analyzer 44 is a structure that can move in the width direction of the mother sheet F0. The inspection device 42 moves the analyzer 44 in the width direction of the mother sheet F0, and checks the mother sheet F0 at a plurality of inspection positions in the width direction of the mother sheet F0 by the optical axis of the mother sheet F0 detected by the analyzer 44. The optical axis.
另外,檢查裝置42並不限於能在母片F0寬度方向上移動分析儀44的結構,亦可為於母片F0寬度方向上具備複數個分析儀的結構。 Further, the inspection device 42 is not limited to a configuration in which the analyzer 44 can be moved in the width direction of the mother sheet F0, and a configuration in which a plurality of analyzers are provided in the width direction of the mother sheet F0.
第8圖係顯示光學組件層之製造裝置40的主要部位平面圖。 Fig. 8 is a plan view showing the main part of the manufacturing apparatus 40 of the optical component layer.
如第8圖所示,於母片F0寬度方向上設置有複數個檢查點CP。分析儀44 能沿該等複數個檢查點CP之排列方向移動。藉此,於母片F0寬度方向上檢測出各檢查點CP中的光軸之方向。 As shown in Fig. 8, a plurality of checkpoints CP are provided in the width direction of the mother piece F0. Analyzer 44 It can move along the arrangement direction of the plurality of checkpoints CP. Thereby, the direction of the optical axis in each of the inspection points CP is detected in the width direction of the mother piece F0.
檢查裝置42所檢測出之母片F0的光軸資料係與母片F0之位置(母片F0長邊方向上之位置及寬度方向上之位置)資料連結地儲存於第1圖所示之儲存裝置24。 The optical axis data of the mother piece F0 detected by the inspection device 42 is stored in the storage shown in FIG. 1 in association with the position of the mother piece F0 (the position in the longitudinal direction of the mother piece F0 and the position in the width direction). Device 24.
第9A圖至第9C圖係顯示母片F0之光軸面內分佈圖。另外,第9A圖至第9C圖中,係顯示從捲出部41a將母片F0朝該母片F0長邊方向上進行搬送的情況。 Figs. 9A to 9C are diagrams showing the in-plane distribution of the optical axis of the mother sheet F0. In addition, in the case of FIG. 9A to FIG. 9C, the case where the mother sheet F0 is conveyed from the unwinding portion 41a in the longitudinal direction of the mother sheet F0 is shown.
如第9A圖至第9C圖所示,母片F0之光軸面內分佈中存在有各種分佈。母片F0之光軸係概略沿母片F0長邊方向上配置。 As shown in Figs. 9A to 9C, various distributions exist in the in-plane distribution of the optical axis of the mother piece F0. The optical axis of the mother piece F0 is roughly arranged along the longitudinal direction of the mother piece F0.
但是,第9A圖所示的母片F0之光軸面內分佈可見,相對母片F0長邊方向,光軸方向略指向右下。第9B圖所示的母片F0之光軸面內分佈可見,相對母片F0長邊方向,沿母片F0寬度方向上交互地配置有指向右上與指向右下的光軸方向。第9C圖所示的母片F0之光軸面內分佈可見,於母片F0寬度方向之兩端部,與母片F0之中央部分相比,光軸方向略朝內側偏移。 However, the distribution of the optical axis in the mother piece F0 shown in Fig. 9A is visible, and the optical axis direction slightly points to the lower right side with respect to the longitudinal direction of the mother piece F0. The distribution of the optical axis in the mother piece F0 shown in Fig. 9B is visible, and the optical axis direction pointing to the upper right direction and the lower right direction is alternately arranged in the width direction of the mother piece F0 with respect to the longitudinal direction of the mother piece F0. The inner surface of the mother piece F0 shown in Fig. 9C is distributed in the in-plane direction, and the optical axis direction is slightly shifted inward from the central portion of the mother piece F0 at both end portions in the width direction of the mother piece F0.
第9C圖之光軸面內分佈的理由如下,構成母片F0之偏光鏡薄膜係例如經二色性染料進行染色之聚乙烯醇(PVA)薄膜,並朝一軸延伸所形成的情況中,由於延伸時會有聚乙烯醇(PVA)薄膜厚度不均勻或二色性染料染色不均勻等,母片F0中央部分的光軸方向與接近母片F0端部之部分(邊緣部分)的光軸方向之間會產生偏差的問題。以下,列舉第9C圖所示具有光軸面內分佈之母片F0作為一例進行說明。從原紙捲筒R0捲出之母片F0係通過檢查裝置42,作為檢查後層片F0A被捲取至捲取部41b。 The reason why the optical axis in the plane of Fig. 9C is distributed is as follows. In the case where the polarizing film constituting the mother sheet F0 is, for example, a polyvinyl alcohol (PVA) film dyed with a dichroic dye and formed to extend toward one axis, When extending, there may be uneven thickness of the polyvinyl alcohol (PVA) film or uneven dyeing of the dichroic dye, etc., and the optical axis direction of the central portion of the mother piece F0 and the optical axis direction of the portion (edge portion) close to the end of the mother piece F0. There will be problems with deviations. Hereinafter, a mother sheet F0 having an in-plane distribution of the optical axis shown in FIG. 9C will be described as an example. The mother sheet F0 taken up from the base paper roll R0 passes through the inspection device 42 and is taken up as a post-inspection layer sheet F0A to the winding unit 41b.
第10圖係顯示從檢查後捲筒R0A捲出之檢查後層片F0A切割出複數個光學組件層FX之情況的立體圖。另外,於第10圖中,為方便起見,省略料捲滾筒R1、捲取部41d的圖示。 Fig. 10 is a perspective view showing a state in which a plurality of optical component layers FX are cut after the inspection layer F0A is unrolled from the inspection roll R0A. Further, in Fig. 10, the illustration of the take-up reel R1 and the take-up portion 41d is omitted for the sake of convenience.
如第10圖所示,從保持於捲出部41c之檢查後捲筒R0A所捲出的檢查後層片F0A之上方處,於該檢查後層片F0A寬度方向上配置有相距特定間隔的複數個切刀45。例如,可使用雷射裝置或切斷刀片作為切刀45。透過複數個切刀45,從檢查後捲筒R0A捲出之檢查後層片F0A切割出複數個光學組件層FX。 As shown in Fig. 10, a plurality of predetermined intervals are arranged in the width direction of the post-inspection layer F0A from above the post-inspection layer sheet F0A which is taken up by the unwinding roll ROA held by the unwinding portion 41c. A cutter 45. For example, a laser device or a cutting blade can be used as the cutter 45. A plurality of optical component layers FX are cut out from the post-inspection layer F0A which is unwound from the post-inspection reel R0A through a plurality of cutters 45.
從檢查後層片F0A切割出光學組件層FX之情況中,對應於檢查後層片F0A內之光軸偏差,而光學組件層FX內亦產生光軸偏差。於本實施形態中,光學組件層FX係切割檢查後層片F0A寬度方向之一部分所形成者。即,將檢查後層片F0A於寬度方向上進行分割,形成複數條光學組件層,使用其一條光學組件層作為光學組件層FX。因此,光學組件層FX中光軸偏差之程度較檢查後層片F0A中光軸偏差之程度更小。 In the case where the optical component layer FX is cut out from the post-inspection layer F0A, the optical axis deviation in the optical component layer FX is also generated in accordance with the optical axis deviation in the post-inspection layer F0A. In the present embodiment, the optical component layer FX is formed by cutting one of the widthwise directions of the layer F0A after inspection. That is, the inspected layer sheet F0A is divided in the width direction to form a plurality of optical component layers, and one optical component layer is used as the optical component layer FX. Therefore, the degree of deviation of the optical axis in the optical component layer FX is smaller than the degree of deviation of the optical axis in the layer F0A after inspection.
順帶一提,從光學組件層FX切割出光學組件之情況中,對應於該光軸偏差,而光學組件內亦產生光軸偏差。因此,裝載該光學組件之光學顯示設備內亦產生光軸方向上的偏差,於該偏差較大之情況中,光學顯示設備則為不良品而無法使用,會減少光學顯示設備之生產數量。 Incidentally, in the case where the optical component is cut out from the optical component layer FX, an optical axis deviation is generated in the optical component corresponding to the optical axis deviation. Therefore, the optical display device in which the optical component is mounted also has a deviation in the optical axis direction. In the case where the deviation is large, the optical display device is defective and cannot be used, and the number of optical display devices is reduced.
在此,於本實施形態中,係根據預先儲存於儲存裝置24的光學組件層FX之光軸面內分佈資料,算出光學組件層FX之面內平均光軸方向,調整光學組件層FX之切斷方向,使得光學組件層FX之面內平均光軸方向相對光學組件層FX之切斷方向而呈目標角度。 Here, in the present embodiment, the in-plane average optical axis direction of the optical component layer FX is calculated based on the distribution data in the optical axis plane of the optical component layer FX stored in advance in the storage device 24, and the optical component layer FX is cut. The direction of the break is such that the in-plane average optical axis direction of the optical component layer FX is at a target angle with respect to the cutting direction of the optical component layer FX.
藉此,可降低光學顯示設備內所產生之光軸偏差。 Thereby, the optical axis deviation generated in the optical display device can be reduced.
第11圖係從光學組件層FX切割出第一層片FXm之方法的說明圖。第11圖中,係顯示從光學組件層FX之一例的第一光學組件層F1切割出第一層片F1m之方法。但是,從第二光學組件層F2切割出第二層片F2m之方法和從第三光學組件層F3切割出第三層片F3m之方法亦為相同。 Fig. 11 is an explanatory view showing a method of cutting the first layer sheet FXm from the optical component layer FX. In Fig. 11, a method of cutting the first ply F1m from the first optical component layer F1 of one example of the optical component layer FX is shown. However, the method of cutting the second ply F2m from the second optical component layer F2 and the method of cutting the third ply F3m from the third optical component layer F3 are also the same.
本實施形態中,從捲出部31a搬送之第一光學組件層F1係藉由第一切斷裝置31b而呈斜角切斷。藉此,切割出複數個第一層片F1m。圖式中雖未顯示,但第一層片F1m具有光軸面內分佈。從第一光學組件層F1切割出第一層片F1m時,係根據第一層片F1m之光軸面內分佈,調整第一切斷裝置的第一光學組件層F1之切斷方向。以下,說明從第一光學組件層F1切割出第一層片F1m之方法的一例。 In the present embodiment, the first optical component layer F1 conveyed from the winding portion 31a is cut at an oblique angle by the first cutting device 31b. Thereby, a plurality of first layer sheets F1m are cut out. Although not shown in the drawings, the first layer sheet F1m has an in-plane distribution of the optical axis. When the first layer sheet F1m is cut out from the first optical component layer F1, the cutting direction of the first optical component layer F1 of the first cutting device is adjusted in accordance with the in-plane distribution of the optical axis of the first layer sheet F1m. Hereinafter, an example of a method of cutting the first layer sheet F1m from the first optical module layer F1 will be described.
第12A圖及第12B圖係調整第一光學組件層F1之切斷方向之方法的說明圖。第12A圖係顯示第一光學組件層F1之光軸面內分佈圖。第12B圖係顯示調整第一光學組件層F1之切斷方向後的第一切斷裝置31b之設置狀態圖。 12A and 12B are explanatory views of a method of adjusting the cutting direction of the first optical component layer F1. Fig. 12A is a view showing the in-plane distribution of the optical axis of the first optical component layer F1. Fig. 12B is a view showing a state in which the first cutting device 31b is adjusted after the cutting direction of the first optical module layer F1 is adjusted.
另外,第12A圖及第12B圖中,符號L1係特定軸(沿第一光學組件層F1邊緣線(寬度方向端緣)之軸)。符號L2、符號L3係各自相對軸L1而呈平行之軸。符號V1係與軸L1夾有最大偏移角的光軸(以下,稱作第一光軸)。符號V2係與軸L2夾有最小偏移角的光軸(以下,稱作第二光軸)。符號V3係為第一光軸V1和第二光軸V2所夾角度的均分之軸(以下,稱作平均光軸)。θmax係特定軸L1與第一光軸V1的所夾角度(以下,稱作最大偏移角)。θmin係特定軸L2與第二光軸V2的所夾角度(以下,稱作最小偏移角)。θmid係特定軸L3與平 均光軸V3的所夾角度(以下,稱作平均偏移角)。 Further, in FIGS. 12A and 12B, the symbol L1 is a specific axis (the axis along the edge line (width edge) of the first optical component layer F1). The symbol L2 and the symbol L3 are axes parallel to each other with respect to the axis L1. The symbol V1 is an optical axis (hereinafter referred to as a first optical axis) having a maximum offset angle with the axis L1. The symbol V2 is an optical axis (hereinafter referred to as a second optical axis) having a minimum offset angle with the axis L2. The symbol V3 is an axis (hereinafter referred to as an average optical axis) which is an average of the angles between the first optical axis V1 and the second optical axis V2. θ max is an angle between the specific axis L1 and the first optical axis V1 (hereinafter referred to as a maximum offset angle). θ min is an angle between the specific axis L2 and the second optical axis V2 (hereinafter referred to as a minimum offset angle). θ mid is an angle between the specific axis L3 and the average optical axis V3 (hereinafter referred to as an average offset angle).
此處,第12A圖及第12B圖中之「偏移角」,以相對特定軸朝順時針方向時為正角度,以相對特定軸朝逆時針方向時為負角度。 Here, the "offset angle" in FIGS. 12A and 12B is a positive angle with respect to a specific axis in a clockwise direction, and a negative angle with respect to a specific axis in a counterclockwise direction.
於本實施形態中,控制裝置25係檢測出第一光學組件層F1的面內相互以最大角度交叉的第一光軸V1、第二光軸V2,算出第一光軸V1與第二光軸V2所夾角度均分之軸,以作為第一光學組件層F1之面內平均光軸(平均光軸V3)。 In the present embodiment, the control device 25 detects the first optical axis V1 and the second optical axis V2 that intersect each other at the maximum angle in the plane of the first optical component layer F1, and calculates the first optical axis V1 and the second optical axis. The angle at which V2 is sandwiched is equally divided as the in-plane average optical axis (average optical axis V3) of the first optical component layer F1.
於本實施形態中,最大偏移角θmax與最小偏移角θmin的角度差為△α。該情況中,最小偏移角θmin為0時,如第12A圖所示,最大偏移角θmax表示為角度(△α)。又,平均偏移角θmid表示為角度(△α/2)。 In the present embodiment, the angular difference between the maximum offset angle θ max and the minimum offset angle θ min is Δα. In this case, when the minimum offset angle θ min is 0, as shown in Fig. 12A, the maximum offset angle θ max is expressed as an angle (Δα). Further, the average offset angle θ mid is expressed as an angle (Δα/2).
例如,為製造第一光學組件F11(參考第13圖),以特定角度進行切割,以使得第一光學組件F11之面內平均光軸方向適合目標液晶顯示裝置的方向。例如,偏光板之吸收軸的情況,特定角度為7°。 For example, in order to manufacture the first optical component F11 (refer to FIG. 13), the cutting is performed at a specific angle so that the in-plane average optical axis direction of the first optical component F11 is adapted to the direction of the target liquid crystal display device. For example, in the case of the absorption axis of the polarizing plate, the specific angle is 7°.
此處,考慮到以沿第一光學組件層F1邊緣線之軸L1作為第一光學組件中目標光軸方向的情況。該情況中,最小偏移角θmin為0時,由於第二光軸V2與軸L2夾有最小之偏移角,係略為對齊第一光學組件中的目標光軸方向。另一方面,由於第一光軸V1與軸L1夾有最大之偏移角,係顯著偏離第一光學組件中的目標光軸方向。第一光軸V1將從第一光學組件中目標光軸方向偏移角度△α。 Here, a case where the axis L1 along the edge line of the first optical component layer F1 is taken as the target optical axis direction in the first optical component is considered. In this case, when the minimum offset angle θ min is 0, since the second optical axis V2 and the axis L2 have the smallest offset angle, they are slightly aligned with the target optical axis direction in the first optical component. On the other hand, since the first optical axis V1 has the largest offset angle with the axis L1, it is significantly deviated from the target optical axis direction in the first optical component. The first optical axis V1 is offset from the target optical axis direction in the first optical component by an angle Δα.
對此,於本實施形態中,控制裝置25係為能迴轉第一切斷裝置31b,使得第一光學組件層F1之面內平均光軸方向相對第一光學組件層F1之切斷方向Vc而呈目標角度的結構。於本實施形態中,如第12B圖所示,迴轉第一 切斷裝置31b,調整第一光學組件層F1之切斷方向,使得相對平均光軸V3的特定角度γ所形成之軸(軸L4)作為從第一光學組件層F1切割出第一光學組件F11時的基準。 On the other hand, in the present embodiment, the control device 25 is configured to be able to rotate the first cutting device 31b such that the in-plane average optical axis direction of the first optical component layer F1 is opposite to the cutting direction Vc of the first optical component layer F1. The structure at the target angle. In this embodiment, as shown in FIG. 12B, the first rotation The cutting device 31b adjusts the cutting direction of the first optical component layer F1 such that the axis (axis L4) formed with respect to the specific angle γ of the average optical axis V3 as the first optical component F11 is cut out from the first optical component layer F1. Time base.
例如,第一切斷裝置31b之切斷方向設定為初期狀態中與沿第一光學組件層F1邊緣線之軸L1垂直的方向之情況中,將第一切斷裝置31b從該初期狀態位置朝順時針方向僅迴轉角度(γ+△α/2)。藉此,切斷方向Vc係相對初期狀態之切斷方向具有角度(γ+△α/2)。 For example, in the case where the cutting direction of the first cutting device 31b is set to a direction perpendicular to the axis L1 along the edge line of the first optical component layer F1 in the initial state, the first cutting device 31b is moved from the initial state position toward Turn the angle only in the clockwise direction (γ + △ α / 2). Thereby, the cutting direction Vc has an angle (γ+Δα/2) with respect to the cutting direction of the initial state.
如此一來,軸L4係從第一層片F1m切割出第一光學組件F11時的基準。換言之,與切斷方向Vc垂直之方向係從第一層片F1m切割出第一光學組件F11時的基準。又,平均光軸V3係對應於第一光學組件F11中作為目標之光軸方向。 In this way, the shaft L4 is a reference when the first optical component F11 is cut out from the first layer F1m. In other words, the direction perpendicular to the cutting direction Vc is the reference when the first optical component F11 is cut out from the first ply F1m. Further, the average optical axis V3 corresponds to the optical axis direction as the target in the first optical component F11.
該情況中,第二光軸V2係相對軸L4僅偏移角度(γ-△α/2)。另一方面,第一光軸V1係相對軸L4僅偏移角度(γ+△α/2)。即,第二光軸V2係相對第一光學組件F11中目標光軸方向僅偏移角度(-△α/2)。另一方面,第一光軸V1係相對第一光學組件F11中目標光軸方向僅偏移角度(△α/2)。 In this case, the second optical axis V2 is only shifted by an angle (γ-Δα/2) with respect to the axis L4. On the other hand, the first optical axis V1 is shifted by only an angle (γ + Δα/2) with respect to the axis L4. That is, the second optical axis V2 is shifted by only an angle (-Δα/2) with respect to the target optical axis direction in the first optical component F11. On the other hand, the first optical axis V1 is shifted by only an angle (Δα/2) with respect to the target optical axis direction in the first optical component F11.
如此,根據本實施形態,由於平均光軸V3對應第一光學組件F11中目標光軸方向,與以沿第一光學組件層F1邊緣線之軸L1作為光學組件中目標光軸方向的情況相比,可使得第一光軸V1及第二光軸V2兩者的偏移角均降低至一半(偏移角△α→△α/2)。 As described above, according to the present embodiment, since the average optical axis V3 corresponds to the target optical axis direction in the first optical component F11, compared with the case where the axis L1 along the edge line of the first optical component layer F1 is used as the target optical axis direction in the optical component. The offset angles of both the first optical axis V1 and the second optical axis V2 can be reduced to half (offset angle Δα → Δα/2).
回到第6圖,刀刃31c係位於從第6圖左側朝右側略呈水平地搬送之第一光學組件層F1下方,於第一光學組件層F1之層片寬度方向上至少橫跨延伸其整體寬度地形成。刀刃31c係於半切斷後之第一光學組件層F1的分 離層片F3a側呈滑動接觸地使其捲繞過此銳角。 Returning to Fig. 6, the blade 31c is located below the first optical component layer F1 which is conveyed slightly horizontally from the left side to the right side of Fig. 6, and extends at least across the entire width direction of the first optical component layer F1. Formed in width. The blade 31c is divided into the first optical component layer F1 after the half cut The acute angle is wound by sliding contact with the side of the layer F3a.
刀刃31c係讓第一光學組件層F1於銳角處捲繞過其銳角狀之前端部。第一光學組件層F1於刀刃31c之前端部呈銳角處折返時,分離層片F3a會從貼合層片F5處剝離。此時,貼合層片F5之黏著層F2a(與液晶面板P之貼合面)係朝向下方。刀刃31c之前端部正上方為分離層剝離位置31e,貼合頭32之圓弧狀的保持面32a從上方接觸到該刀刃31c之前端部,使得貼合層片F5之層片的表面保護薄膜F4a(與貼合面的反對側之面)黏著至貼合頭32之保持面32a。 The blade 31c is such that the first optical component layer F1 is wound at its acute angle at its acute angle. When the first optical component layer F1 is folded back at an acute front end of the blade 31c, the separation layer F3a is peeled off from the bonding layer F5. At this time, the adhesive layer F2a of the bonding layer sheet F5 (the bonding surface with the liquid crystal panel P) faces downward. Immediately above the front end portion of the blade 31c is a separation layer peeling position 31e, and the arc-shaped holding surface 32a of the bonding head 32 comes into contact with the front end portion of the blade edge 31c from above, so that the surface protective film of the layer of the laminated layer sheet F5 is adhered F4a (the opposite side to the facing surface) is adhered to the holding surface 32a of the fitting head 32.
貼合頭32係與該層片寬度方向平行,且於下方具有凸形圓弧狀之保持面32a。保持面32a具有例如較貼合層片F5之貼合面(黏著層F2a)更弱的黏著力,可將貼合層片F5之表面保護薄膜F4a重複進行黏著、剝離。 The bonding head 32 is parallel to the width direction of the layer, and has a convex arc-shaped holding surface 32a below. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer sheet F5, for example, and the surface protective film F4a of the bonding layer sheet F5 can be repeatedly adhered and peeled off.
貼合頭32係於刀刃31c上方,沿該層片寬度方向之軸作為中心,與該長度方向平行,且沿保持面32a之彎曲傾斜移動。於黏著保持貼合層片F5時,及將黏著保持好之貼合層片F5貼合至液晶面板P時,適當地進行貼合頭32之傾斜移動。 The bonding head 32 is attached to the blade 31c, and has an axis along the width direction of the layer as a center, is parallel to the longitudinal direction, and is inclined to move along the curved surface of the holding surface 32a. When the bonding layer sheet F5 is adhered and adhered, and the bonding layer sheet F5 which is adhered and adhered is bonded to the liquid crystal panel P, the tilting movement of the bonding head 32 is appropriately performed.
貼合頭32係在使保持面32a朝向下方,且保持面32a之彎曲一端側(第6圖之右側)為下側的傾斜狀態下,從上方將保持面32a之彎曲一端側貼附至刀刃31c之前端部,而將分離層剝離位置31e處的貼合層片F5之前端部黏著至保持面32a。其後,繼續捲出貼合層片F5且使貼合頭32傾斜移動,藉以將貼合層片F5之層片整體黏著至保持面32a。 The bonding head 32 is attached to the blade at the curved end side of the holding surface 32a from above with the holding surface 32a facing downward and the curved end side of the holding surface 32a (the right side of FIG. 6) being the lower side. The front end portion of 31c is adhered to the front end portion of the bonding layer sheet F5 at the separation layer peeling position 31e to the holding surface 32a. Thereafter, the bonding layer sheet F5 is continuously unwound and the bonding head 32 is tilted and moved, whereby the layer of the bonding layer sheet F5 is entirely adhered to the holding surface 32a.
貼合頭32可於分離層剝離位置31e及第一貼合位置11c之上方進行特定距離的昇降動作,且可於分離層剝離位置31e與第一貼合位置11c之間 適當地進行移動。貼合頭32係連結至驅動裝置,而可進行該昇降時、該移動時和該傾斜移動時之驅動。 The bonding head 32 can perform a lifting operation of a specific distance above the separation layer peeling position 31e and the first bonding position 11c, and can be between the separation layer peeling position 31e and the first bonding position 11c. Move as appropriate. The bonding head 32 is coupled to the driving device, and can be driven during the lifting, the moving, and the tilting movement.
貼合頭32在將貼合層片F5黏著至保持面32a時,係例如在將貼合層片F5之前端部黏著至保持面32a後,切斷與驅動裝置33的銜接而自由地傾斜移動,從該狀態被動地伴隨著貼合層片F5之捲出而傾斜移動。當貼合頭32傾斜移動直到貼合層片F5整體黏著至保持面32a時,於該傾斜狀態下藉由例如與驅動裝置33之銜接等來鎖死該傾斜移動,並於該狀態下朝第一貼合位置11c上方移動。 When the bonding layer sheet F5 is adhered to the holding surface 32a, the bonding head 32 is detached from the driving device 33, for example, after the end portion of the bonding layer sheet F5 is adhered to the holding surface 32a. From this state, the tilting movement is passively accompanied by the unwinding of the bonding layer sheet F5. When the bonding head 32 is tilted to move until the bonding layer F5 is entirely adhered to the holding surface 32a, the tilting movement is locked in the inclined state by, for example, engagement with the driving device 33, and in this state, the tilting movement is performed. Moves over a fitting position 11c.
貼合頭32在將黏著保持好之貼合層片F5貼合至液晶面板P時,藉由例如驅動裝置33之作動而主動地傾斜移動,沿保持面32a之彎曲將貼合層片F5貼附至液晶面板P之上側面以確實地進行貼合。 When the bonding layer 32 is adhered to the liquid crystal panel P, the bonding head 32 is actively tilted by, for example, the driving device 33, and the bonding layer F5 is attached along the bending of the holding surface 32a. Attached to the upper side of the liquid crystal panel P to be surely bonded.
於刀刃31c之前端部下方處,設置有第一檢測攝影機34,其係檢測在該部位處的貼合層片F5之層片的層片搬送下游側之前端部。第一檢測攝影機34之檢測資料係傳送至控制裝置25。控制裝置25於例如第一檢測攝影機34檢測出貼合層片F5之下游側端的時點時,係暫時停止層片搬送裝置31,其後,降下貼合頭32以將貼合層片F5之前端部黏著至該保持面32a。 Below the end portion before the blade 31c, a first detecting camera 34 is provided which detects the edge portion of the layer of the bonding layer sheet F5 at the portion on the downstream side of the layer. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the downstream end of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31, and thereafter lowers the bonding head 32 to fix the front end of the bonding layer sheet F5. The portion is adhered to the holding surface 32a.
在第一檢測攝影機34檢測出貼合層片F5之下游側端並暫時停止層片搬送裝置31時,控制裝置25係藉由第一切斷裝置31b實施貼合層片F5之切斷。即,沿第一檢測攝影機34之檢出位置(第一檢測攝影機34之光軸延長位置)與沿第一切斷裝置31b之切斷位置(第一切斷裝置31b之切斷刀片之進退刀位置)間的層片搬送路線之距離係相當於貼合層片F5之層片(第一層片F1m)的長度。 When the first detecting camera 34 detects the downstream side end of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs the cutting of the bonding layer sheet F5 by the first cutting device 31b. That is, along the detection position of the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the first cutting device 31b (the cutting blade of the first cutting device 31b is advanced and retracted) The distance of the layer transport route between the positions is equivalent to the length of the layer sheet (first layer sheet F1m) to which the layer sheet F5 is bonded.
第一切斷裝置31b可沿層片搬送路線移動,藉由該移動使得沿第一檢測攝影機34之檢出位置與第一切斷裝置31b之切斷位置間的層片搬送路線之距離產生改變。第一切斷裝置31b之移動係透過控制裝置25所控制,在以例如第一切斷裝置31b進行貼合層片F5的切斷之後,捲出一個貼合層片F5之層片(第一層片F1m)的距離時,當其切斷端與特定之基準位置間有偏差的情況中,便藉由第一切斷裝置31b之移動來補正該偏差。另外,亦可藉由第一切斷裝置31b的移動來對應長度相異之貼合層片F5的切斷。 The first cutting device 31b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting position between the cutting positions of the first cutting device 31b is changed by the movement. . The movement of the first cutting device 31b is controlled by the control device 25, and after the cutting of the bonded layer sheet F5 by, for example, the first cutting device 31b, a layer of the laminated layer sheet F5 is wound up (first In the case of the distance of the layer F1m), when there is a deviation between the cut end and the specific reference position, the deviation is corrected by the movement of the first cutting device 31b. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the first cutting device 31b.
第一檢測攝影機34亦可檢測出印於貼合層片F5之缺陷標誌。該缺陷標誌在料捲滾筒R1製造時,係對於第一光學組件層F1中發現缺陷部位處,從該表面保護薄膜F4a側藉由噴墨等加以標記。檢測出該缺陷標誌之貼合層片F5在黏著至貼合頭32之後,不貼合至液晶面板P,而是移動至避開第一貼合位置11c的捨棄位置,重疊貼合至廢料層片等處。另外,在檢測出缺陷標誌時,亦可設計將貼合層片F5以最小寬度切斷而捨棄的步驟。 The first detecting camera 34 can also detect the defect mark printed on the bonding layer F5. This defect mark is marked by inkjet or the like from the side of the surface protective film F4a when the defect roll is found in the first optical component layer F1 at the time of manufacture of the roll reel R1. The bonding layer sheet F5 on which the defect mark is detected does not adhere to the liquid crystal panel P after being adhered to the bonding head 32, but moves to a discarding position avoiding the first bonding position 11c, and is overlapped and attached to the waste layer. Pieces and so on. Further, when the defect mark is detected, a step of cutting the bonded layer sheet F5 with a minimum width and discarding it may be designed.
貼合層片F5從分離層剝離位置31e朝第一貼合位置11c移動時,黏著保持於保持面32a的貼合層片F5之兩角部(例如相對該前端部的近端部之兩角部),係各自以一對第二檢測攝影機35進行拍攝。換言之,透過一對第二檢測攝影機35,對第一層片F1m之保持面32a上的保持狀態進行攝影。各第二檢測攝影機35之檢測資料係傳送至控制裝置25。控制裝置25係例如根據各第二檢測攝影機35之攝影資料,確認相對貼合頭32的貼合層片F5之水平方向(貼合頭32移動方向及其垂直方向、以及垂直軸中心之迴轉方向)位置。在貼合頭32及貼合層片F5之相對位置具有偏差的情況中,貼合頭32係以貼合層片F5之位置作為特定之基準位置來進行位置校準。 When the bonding layer sheet F5 moves from the separation layer peeling position 31e toward the first bonding position 11c, it adheres to the two corners of the bonding layer sheet F5 of the holding surface 32a (for example, the two corners of the proximal end portion of the front end portion) The respective units are photographed by a pair of second detecting cameras 35. In other words, the holding state on the holding surface 32a of the first layer sheet F1m is photographed by the pair of second detecting cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms, for example, the horizontal direction of the bonding layer sheet F5 of the bonding head 32 based on the photographic data of each of the second detecting cameras 35 (the moving direction of the bonding head 32 and its vertical direction, and the rotation direction of the center of the vertical axis). )position. In the case where the relative positions of the bonding head 32 and the bonding layer sheet F5 are different, the bonding head 32 performs position alignment by using the position of the bonding layer sheet F5 as a specific reference position.
於第一轉台式機床11之第一貼合位置11c處,設置有用於進行第一貼合位置11c上液晶面板P之水平方向的位置校準之一對第三檢測攝影機36。於第一轉台式機床11之第二貼合位置11d處,設置有用於進行同一液晶面板P之第二貼合位置11d上水平方向的位置校準之一對第四檢測攝影機37。各第三檢測攝影機36係各自拍攝例如液晶面板P之玻璃基板(第一基板P1)中之第1圖中左側的兩角部。各第四檢測攝影機37係各自拍攝例如液晶面板P之玻璃基板中之第1圖中左側的兩角部。 At the first bonding position 11c of the first rotary machine tool 11, one of the position detection alignments for performing the horizontal alignment of the liquid crystal panel P on the first bonding position 11c is performed. At the second bonding position 11d of the first rotary machine tool 11, a pair of fourth detection cameras 37 for performing positional alignment in the horizontal direction on the second bonding position 11d of the same liquid crystal panel P are provided. Each of the third detecting cameras 36 captures, for example, the two corner portions on the left side in the first drawing of the glass substrate (first substrate P1) of the liquid crystal panel P. Each of the fourth detecting cameras 37 captures, for example, the two corner portions on the left side in the first drawing of the glass substrate of the liquid crystal panel P.
於第二轉台式機床16之第三貼合位置16c處,設置有用於進行液晶面板P之第三貼合位置16c上水平方向的位置校準之一對第五檢測攝影機38。各第五檢測攝影機38係各自拍攝例如液晶面板P之玻璃基板中之第1圖中左側的兩角部。各檢測攝影機(第一檢測攝影機34至第五檢測攝影機38)之檢測資料係傳送至控制裝置25。另外,亦可使用感測器代替各檢測攝影機(第一檢測攝影機34至第五檢測攝影機38)。 At the third bonding position 16c of the second rotary machine tool 16, a pair of fifth detection cameras 38 for performing positional alignment in the horizontal direction on the third bonding position 16c of the liquid crystal panel P are provided. Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in the first drawing of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Alternatively, a sensor may be used instead of each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38).
於各轉台式機床(第一轉台式機床11與第二轉台式機床16)上,設置有載置液晶面板P且可進行其水平方向之位置校準的位置校準台39(位置校準平台)。位置校準台39係根據各檢測攝影機(第一檢測攝影機34至第五檢測攝影機38)之檢測資料,經由控制裝置25所驅動控制。藉此,可進行相對第一轉台式機床11與第二轉台式機床16(各貼合位置(第一貼合位置11c、第二貼合位置11d與第三貼合位置16c)的液晶面板P之位置校準。 A position calibration table 39 (position calibration platform) on which the liquid crystal panel P is placed and whose positional alignment in the horizontal direction can be performed is provided on each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16). The position calibration table 39 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, the liquid crystal panel P with respect to the first rotary machine tool 11 and the second rotary machine tool 16 (the respective bonding positions (the first bonding position 11c, the second bonding position 11d, and the third bonding position 16c) can be performed. Position calibration.
相對該液晶面板P,將經貼合頭32位置校準後的貼合層片F5進行貼合,藉以抑制層片FXm之貼合偏差,可改善相對液晶面板P之光學組件F1X的光軸方向之精度,提高光學顯示設備之色彩度及對比。 The laminated layer F5 which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the bonding deviation of the layer FXm is suppressed, and the optical axis direction of the optical component F1X of the liquid crystal panel P can be improved. Accuracy, improve the color and contrast of optical display devices.
第13圖係相對液晶面板P將第一層片F1m貼合之方法的說明圖。 Fig. 13 is an explanatory view showing a method of bonding the first layer sheet F1m with respect to the liquid crystal panel P.
另外,於第13圖中,符號Lc係第一層片F1m之切斷邊。又,符號Lp係光學顯示部件之一邊。又,符號Lp1係沿第一層片F1m之顯示區域P4外周緣從第一層片F1m切割出第一光學組件F11時的切割線中之一部分(矩形切割線的一邊)。 Further, in Fig. 13, the symbol Lc is the cut edge of the first layer sheet F1m. Further, the symbol Lp is one side of the optical display member. Further, the symbol Lp1 is one of the cutting lines (one side of the rectangular cutting line) when the first optical unit F11 is cut out from the first layer sheet F1m along the outer peripheral edge of the display region P4 of the first layer sheet F1m.
驅動裝置33可使得貼合頭32與位置校準台39進行相對移動。驅動裝置33係透過控制裝置25之控制訊號,讓貼合頭32與位置校準台39進行相對移動,使得經第一切斷裝置31b切斷後之第一層片F1m的切斷邊Lc與液晶面板P的一邊Lp呈一致或平行。例如,驅動裝置33係於位置校準台39中平行液晶面板P之載置面39a的第一方向上、平行於載置面39a且垂直於第一方向之第二方向上、載置面39a之法線方向的第三方向上、繞第三方向之軸迴轉的θ方向上,讓貼合頭32與位置校準台39進行相對移動。於本實施形態中,驅動裝置33係不移動位置校準台39,僅進行貼合頭32之移動。 The drive unit 33 can cause the mating head 32 to move relative to the position calibration stage 39. The driving device 33 transmits the control signal of the control device 25 to move the bonding head 32 and the position calibration table 39 so that the cutting edge Lc of the first layer F1m and the liquid crystal panel are cut by the first cutting device 31b. One side of P is consistent or parallel. For example, the driving device 33 is disposed in the first direction parallel to the mounting surface 39a of the liquid crystal panel P in the position alignment table 39, parallel to the mounting surface 39a and perpendicular to the first direction, and the mounting surface 39a. The aligning head 32 and the position aligning table 39 are relatively moved in the θ direction in which the third direction of the normal direction is rotated in the direction of the axis in the third direction. In the present embodiment, the drive unit 33 does not move the position calibration table 39, and only the movement of the bonding head 32 is performed.
另外,驅動裝置33的相對移動之形態並不限於此。例如,透過不移動貼合頭32而僅移動位置校準台39,或移動貼合頭32及位置校準台39兩者,亦可適用本發明的貼合頭32與位置校準台39進行相對移動之形態。 In addition, the form of the relative movement of the drive unit 33 is not limited thereto. For example, by moving the position calibration table 39 or moving both the bonding head 32 and the position calibration table 39 without moving the bonding head 32, the bonding head 32 of the present invention and the position calibration table 39 can be used for relative movement. form.
於本實施形態中,係以相對平均光軸V3的特定角度γ所形成之軸Lp1(L4)作為從第一層片F1m切割出第一光學組件F11時的基準。 In the present embodiment, the axis Lp1 (L4) formed at a specific angle γ with respect to the average optical axis V3 is used as a reference when the first optical module F11 is cut out from the first layer F1m.
又,於第一切斷裝置31b之搬送方向下游側處,設置有第二切斷裝置50,其係用於切斷第一層片F1m之顯示區域P4的對向部分與該對向部分外側的剩餘部分。 Further, on the downstream side in the transport direction of the first cutting device 31b, a second cutting device 50 for cutting the opposite portion of the display region P4 of the first layer F1m and the outside of the opposite portion is provided. The rest of the.
如第6圖所示,第二切斷裝置50係於液晶面板P之背光側,以攝影機151等檢測部檢測出顯示區域P4之外周緣,且沿顯示區域P4之外周緣等切斷第一層片F1m。 As shown in Fig. 6, the second cutting device 50 is attached to the backlight side of the liquid crystal panel P, and detects a peripheral edge of the display region P4 by a detecting portion such as the camera 151, and cuts the first edge along the outer periphery of the display region P4. Layer F1m.
同樣地,第二切斷裝置50亦於液晶面板P之顯示面側,以攝影機等檢測部檢測出顯示區域P4之外周緣,且沿顯示區域P4之外周緣等切斷第三層片F3m。 In the same manner, the second cutting device 50 detects the outer periphery of the display region P4 by the detecting portion such as a camera on the display surface side of the liquid crystal panel P, and cuts the third layer sheet F3m along the outer periphery of the display region P4.
於顯示區域P4之外側處,係設置有特定寬度的邊框部G,其係用於設置將第一基板P1及第二基板P2接合之密封劑等,於該邊框部G之寬度內以第二切斷裝置50進行雷射切斷。 A frame portion G having a specific width is provided on the outer side of the display region P4 for providing a sealant or the like for bonding the first substrate P1 and the second substrate P2, and a second inside the width of the frame portion G The cutting device 50 performs laser cutting.
如此,第二切斷裝置50係將第一層片F1m之顯示區域P4的對向部分與該對向部分外側的剩餘部分切斷,從第一層片F1m切割出對應於顯示區域P4大小的第一光學組件F11。 In this manner, the second cutting device 50 cuts the opposing portion of the display region P4 of the first layer sheet F1m and the remaining portion of the outside of the facing portion, and cuts the size corresponding to the display region P4 from the first layer sheet F1m. First optical component F11.
第二貼合裝置及第三貼合裝置亦會進行相同作業。即,從第二光學組件層F2切割出(斜角切斷)第二層片F2m,將第二層片F2m貼合至液晶面板P之後,將第二層片F2m之顯示區域P4的對向部分與該對向部分外側的剩餘部分切斷,從第二層片F2m切割出對應於顯示區域P4大小的第二光學組件F12。又,從第三光學組件層F3切割出(斜角切斷)第三層片F3m,將第三層片F3m貼合至液晶面板P之後,將第三層片F3m之顯示區域P4的對向部分與該對向部分外側的剩餘部分切斷,從第三層片F3m切割出對應於顯示區域P4大小的第三光學組件F13。 The second bonding device and the third bonding device perform the same operation. That is, the second ply F2m is cut out (beveled) from the second optical component layer F2, and after the second ply F2m is bonded to the liquid crystal panel P, the opposite portion of the display region P4 of the second ply F2m is The remaining portion outside the opposite portion is cut, and the second optical component F12 corresponding to the size of the display region P4 is cut out from the second layer F2m. Further, the third layer sheet F3m is cut out (beveled) from the third optical component layer F3, and after the third layer sheet F3m is bonded to the liquid crystal panel P, the opposite portion of the display region P4 of the third layer sheet F3m is formed. The remaining portion outside the opposite portion is cut, and the third optical component F13 corresponding to the size of the display region P4 is cut out from the third layer sheet F3m.
藉由以上,可獲得貼合有液晶面板P與重疊於該液晶面板P之光學組件F1X所形成的光學顯示設備。 According to the above, an optical display device in which the liquid crystal panel P and the optical module F1X superposed on the liquid crystal panel P are bonded can be obtained.
本實施形態中光學顯示設備之生產方法,其中具有下列步驟:第一步驟,係將寬度較液晶面板P之顯示區域P4更寬之條狀光學組件層FX從料捲滾筒R1與分離層片F3a一同捲出;第二步驟,係取得光學組件層FX之光軸面內分佈資料,根據光學組件層FX之光軸面內分佈資料,算出光學組件層FX之面內平均光軸方向,調整光學組件層FX之切斷方向,使得光學組件層FX之面內平均光軸方向相對光學組件層FX之切斷方向而呈目標角度;第三步驟,係於調整好之切斷方向上,讓分離層片F3a殘留於光學組件層FX的狀態下,將光學組件層FX切斷成較顯示區域P4更大尺寸以獲得層片FXm;第四步驟,將層片FXm從分離層片F3a處剝離;第五步驟,係將層片FXm貼附而保持於貼合頭32的圓弧狀之保持面32a處,且為讓保持於保持面32a之層片FXm貼合至液晶面板P,而沿保持面32a之彎曲使貼合頭32傾斜移動;第六步驟,係讓貼合頭32與位置校準台39進行相對移動,使得切斷後之層片FXm的切斷邊Lc與液晶面板P之一邊Lp呈一致或平行,並為讓該傾斜移動實施層片FXm之保持及貼合,而驅動貼合頭32;以及第七步驟,係將層片FXm之顯示區域P4的對向部分與該對向部分外側之剩餘部分切斷,從層片FXm切割出對應於顯示區域P4大小的光學組件F1X。 The production method of the optical display device of the present embodiment has the following steps: the first step is to use a strip-shaped optical component layer FX having a width wider than the display region P4 of the liquid crystal panel P from the roll reel R1 and the separation layer F3a. In the second step, the in-plane distribution data of the optical component layer FX is obtained, and the in-plane average optical axis direction of the optical component layer FX is calculated according to the in-plane distribution data of the optical component layer FX, and the optical adjustment is performed. The cutting direction of the component layer FX is such that the in-plane average optical axis direction of the optical component layer FX is at a target angle with respect to the cutting direction of the optical component layer FX; the third step is to adjust the cutting direction to allow separation The layer F3a remains in the state of the optical component layer FX, and the optical component layer FX is cut into a larger size than the display region P4 to obtain the layer FXm; and in the fourth step, the layer FXm is peeled off from the separation layer F3a; In the fifth step, the layer FXm is attached and held by the arc-shaped holding surface 32a of the bonding head 32, and the layer FXm held by the holding surface 32a is attached to the liquid crystal panel P while being held The bending of the face 32a causes the fitting head 32 to tilt The sixth step is to move the bonding head 32 relative to the position calibration table 39 such that the cut edge Lc of the cut layer FXm is aligned or parallel with one side Lp of the liquid crystal panel P, and the tilt is made Moving the bonding layer FXm to maintain and fit, and driving the bonding head 32; and the seventh step of cutting off the opposite portion of the display region P4 of the layer FXm and the remaining portion outside the facing portion, the layer The sheet FXm cuts out the optical component F1X corresponding to the size of the display area P4.
以下,使用第14圖進行具體說明。 Hereinafter, specific description will be given using FIG.
第14圖係顯示光學顯示設備之生產方法的流程圖。 Figure 14 is a flow chart showing a method of producing an optical display device.
首先,第一步驟係將寬度較液晶面板P之顯示區域P4更寬的條狀第一光學組件層F1從料捲滾筒R1與分離層片F3a一同捲出(第14圖所示之步驟S1)。 First, the first step is to roll out the strip-shaped first optical component layer F1 having a width wider than the display region P4 of the liquid crystal panel P from the roll drum R1 and the separation layer F3a (step S1 shown in Fig. 14). .
其次,第二步驟係使控制裝置25取得儲存於儲存裝置24的第一光學組件層F1之光軸面內分佈資料,調整第一光學組件層F1之切斷方向(第14圖所示之步驟S2)。 Next, in the second step, the control device 25 obtains the data distributed in the optical axis plane of the first optical component layer F1 stored in the storage device 24, and adjusts the cutting direction of the first optical component layer F1 (step shown in FIG. 14). S2).
具體而言,根據第一光學組件層F1之光軸面內分佈資料,算出第一光學組件層F1面內平均光軸方向。接著,調整第一光學組件層F1之切斷方向,使得第一光學組件層F1之面內平均光軸方向相對第一光學組件層F1之切斷方向而呈目標角度。 Specifically, the in-plane average optical axis direction of the first optical component layer F1 is calculated from the in-plane distribution data of the optical axis of the first optical component layer F1. Next, the cutting direction of the first optical component layer F1 is adjusted such that the in-plane average optical axis direction of the first optical component layer F1 is at a target angle with respect to the cutting direction of the first optical component layer F1.
例如,藉由控制裝置25,根據第一光學組件層F1之光軸面內分佈資料,算出第一光學組件層F1之面內平均光軸方向,迴轉第一切斷裝置31b,使得第一光學組件層F1面內之平均光軸方向相對第一光學組件層F1之切斷方向Vc而呈目標角度。於本實施形態中,如第12B圖所示,迴轉第一切斷裝置31b,調整第一光學組件層F1切斷方向,使得相對平均光軸V3的特定角度γ所形成之軸(軸L4)作為從第一光學組件層F1切割出第一光學組件F11時的基準。 For example, by the control device 25, the in-plane average optical axis direction of the first optical component layer F1 is calculated according to the in-plane distribution data of the first optical component layer F1, and the first cutting device 31b is rotated to make the first optical The average optical axis direction in the plane of the component layer F1 is at a target angle with respect to the cutting direction Vc of the first optical component layer F1. In the present embodiment, as shown in Fig. 12B, the first cutting device 31b is rotated to adjust the cutting direction of the first optical module layer F1 so that the axis formed by the specific angle γ with respect to the average optical axis V3 (axis L4) As a reference when the first optical component F11 is cut out from the first optical component layer F1.
此處,根據檢查裝置42檢測出的第一光學組件層F1寬度方向之光軸分佈,算出第一光學組件層F1之面內平均光軸方向。從第一光學組件層F1切割出第一光學組件F11的情況中,用於計算之光軸資料亦可使用該第一光學組件F11所切割出的部分之光軸資料。又,用於計算之光軸資料亦可使用,較該第一光學組件F11所切割出的部分更上游側之光軸資料。由於光軸方向於第一光學組件層F1長邊方向上的變化不大,只要算出第一光學組件層F1長邊方向上任一處的光軸方向,可使用其光軸方向作為第一光學組件層F1長邊方向上的任意位置之光軸方向。該情況中,以第一光學組件層F1長邊方向上的複數位置算出第一光學組件層F1寬度方向之平均光軸方向,將各位置處所算出之平 均光軸方向依該複數位置加以平均化所獲得的光軸方向,可作為第一光學組件層F1之面內平均光軸方向。 Here, the in-plane average optical axis direction of the first optical component layer F1 is calculated based on the optical axis distribution in the width direction of the first optical component layer F1 detected by the inspection device 42. In the case where the first optical component F11 is cut out from the first optical component layer F1, the optical axis data used for the calculation may also use the optical axis data of the portion cut by the first optical component F11. Further, the optical axis data for calculation can also be used, and the optical axis data on the upstream side is larger than the portion cut by the first optical component F11. Since the optical axis direction does not change much in the longitudinal direction of the first optical component layer F1, as long as the optical axis direction of any one of the longitudinal directions of the first optical component layer F1 is calculated, the optical axis direction can be used as the first optical component. The optical axis direction of any position in the longitudinal direction of the layer F1. In this case, the average optical axis direction in the width direction of the first optical component layer F1 is calculated from the complex position in the longitudinal direction of the first optical component layer F1, and the calculated position at each position is flat. The optical axis direction obtained by averaging the average optical axis direction by the complex position can be used as the in-plane average optical axis direction of the first optical component layer F1.
其次,第三步驟,係於調整後之切斷方向上,殘留分離層片F3a地將第一光學組件層F1切斷成較顯示區域P4更大尺寸而獲得第一層片F1m(第14圖所示之步驟S3)。 Next, in the third step, the first optical component layer F1 is cut into a larger size than the display region P4 by the residual separation layer F3a in the adjusted cutting direction to obtain the first layer F1m (Fig. 14). Step S3) shown.
其次,第四步驟,將第一層片F1m從分離層片F3a處剝離(第14圖所示之步驟S4)。 Next, in the fourth step, the first layer sheet F1m is peeled off from the separation layer sheet F3a (step S4 shown in Fig. 14).
其次,第五步驟,係將第一層片F1m貼附而保持於貼合頭32的圓弧狀之保持面32a處,且為讓保持於保持面32a之第一層片F1m貼合至液晶面板P,而沿保持面32a之彎曲使貼合頭32傾斜移動(第14圖所示之步驟S5)。 Next, in the fifth step, the first layer sheet F1m is attached and held by the arc-shaped holding surface 32a of the bonding head 32, and the first layer sheet F1m held by the holding surface 32a is bonded to the liquid crystal. The panel P is moved along the holding surface 32a so that the bonding head 32 is tilted (step S5 shown in Fig. 14).
其次,第六步驟,係讓貼合頭32與位置校準台39進行相對移動,使得切斷後之第一層片F1m的切斷邊Lc與液晶面板P之一邊Lp呈一致或平行。再者,為了讓該傾斜移動實施第一層片F1m之保持及貼合,而驅動貼合頭32(第14圖所示之步驟S6)。 Next, in the sixth step, the bonding head 32 and the position aligning table 39 are relatively moved so that the cut edge Lc of the cut first layer F1m and the one side Lp of the liquid crystal panel P are aligned or parallel. Further, in order to allow the tilting movement to hold and bond the first layer sheet F1m, the bonding head 32 is driven (step S6 shown in Fig. 14).
例如,貼合頭32與位置校準台39之相對移動係不移動位置校準台39移動,僅進行貼合頭32之移動。具體而言,貼合頭32係於位置校準台39中平行於液晶面板P之載置面39a的第一方向上、平行於載置面39a且垂直於第一方向之第二方向上、載置面39a之法線方向的第三方向上、繞第三方向之軸迴轉的θ方向上進行相對移動。 For example, the relative movement of the bonding head 32 and the position calibration table 39 does not move the position calibration table 39, and only the movement of the bonding head 32 is performed. Specifically, the bonding head 32 is disposed in a first direction parallel to the mounting surface 39a of the liquid crystal panel P in the position alignment table 39, parallel to the mounting surface 39a, and perpendicular to the first direction. The third direction of the normal direction of the surface 39a is relatively moved in the θ direction of the axis rotation about the third direction.
其後,第七步驟,係將第一層片F1m之顯示區域P4的對向部分與該對向部分外側的剩餘部分切斷,從第一層片F1m切割出對應於顯示區域P4大小的第一光學組件F11(窗型切斷)(第14圖所示之步驟S7)。 Thereafter, in the seventh step, the opposite portion of the display region P4 of the first layer F1m and the remaining portion outside the opposite portion are cut, and the size corresponding to the size of the display region P4 is cut out from the first layer F1m. An optical unit F11 (window type cut) (step S7 shown in Fig. 14).
對第二層片F2m、第三層片F3m亦進行同樣步驟,各自切割出對應於顯示區域P4大小的第二光學組件F12、第三光學組件F13(窗型切斷)。 The same steps are also performed for the second layer sheet F2m and the third layer sheet F3m, and the second optical unit F12 and the third optical unit F13 (window type cut) corresponding to the size of the display area P4 are cut out.
透過以上步驟,可獲得貼合有液晶面板P與重疊於該液晶面板P之光學組件F1X所形成的光學顯示設備。 Through the above steps, an optical display device formed by bonding the liquid crystal panel P and the optical component F1X overlapping the liquid crystal panel P can be obtained.
本實施形態之薄膜貼合系統1,依光學顯示設備之生產方法,係根據預先儲存於儲存裝置24的第一光學組件層F1之光軸面內分佈資料,調整第一光學組件層F1之切斷方向。於該調整中,係調整第一光學組件層F1之切斷方向,使得第一光學組件層F1面內之平均光軸方向相對第一光學組件層F1之切斷方向而呈目標角度。接著,經前述調整後之切斷方向上,從第一光學組件層F1切割出第一層片F1m。接著,讓貼合頭32與位置校準台39進行相對移動,使得切割出之第一層片F1m的切斷邊Lc與液晶面板P之一邊Lp呈一致或平行。接著,將第一層片F1m之顯示區域P4的對向部分與該對向部分外側的剩餘部分切斷,從第一層片F1m切割出對應於顯示區域P4大小的第一光學組件F11,即進行所謂的窗型切斷。同樣地,亦從第二層片F2m、第三層片F3m各自切割出對應於顯示區域P4大小的第二光學組件F12、第三光學組件F13。藉此,獲得貼合有液晶面板P與重疊於該液晶面板P之光學組件F1X所形成的光學顯示設備。因此,可降低光學顯示設備內產生的光軸偏差。 In the film bonding system 1 of the present embodiment, according to the production method of the optical display device, the first optical component layer F1 is cut according to the distribution data in the optical axis plane of the first optical component layer F1 stored in advance in the storage device 24. Broken direction. In this adjustment, the cutting direction of the first optical component layer F1 is adjusted such that the average optical axis direction in the plane of the first optical component layer F1 is at a target angle with respect to the cutting direction of the first optical component layer F1. Next, the first layer sheet F1m is cut out from the first optical component layer F1 in the above-described adjusted cutting direction. Next, the bonding head 32 is moved relative to the position aligning table 39 such that the cut edge Lc of the cut first layer sheet F1m is aligned or parallel with one side Lp of the liquid crystal panel P. Next, the opposite portion of the display region P4 of the first layer F1m and the remaining portion outside the opposite portion are cut, and the first optical component F11 corresponding to the size of the display region P4 is cut out from the first layer F1m, that is, A so-called window cut is performed. Similarly, the second optical component F12 and the third optical component F13 corresponding to the size of the display region P4 are also cut out from the second layer F2m and the third layer F3m, respectively. Thereby, an optical display device formed by bonding the liquid crystal panel P and the optical module F1X overlapping the liquid crystal panel P is obtained. Therefore, the optical axis deviation generated in the optical display device can be reduced.
根據該結構,將對應於顯示區域P4之寬度的條狀光學組件層FX切斷成特定長度以作為層片FXm,藉由貼合頭32之傾斜移動將該層片FXm保持於圓弧狀之保持面32a處,且藉由同一貼合頭32之傾斜移動將層片FXm貼合至液晶面板P,然後進行窗型切斷,以抑制層片FXm之尺寸偏差或貼合偏差,可縮小顯示區域P4周邊之邊框部G,以達成顯示區域之擴大及機器之小型化的 目的。 According to this configuration, the strip-shaped optical component layer FX corresponding to the width of the display region P4 is cut into a specific length as the layer FXm, and the layer FXm is held in an arc shape by the tilting movement of the bonding head 32. At the holding surface 32a, the layer sheet FXm is bonded to the liquid crystal panel P by the tilting movement of the same bonding head 32, and then the window type cutting is performed to suppress the dimensional deviation or the fitting deviation of the layer sheet FXm, thereby reducing the display. The frame portion G around the area P4 is used to achieve enlargement of the display area and miniaturization of the machine. purpose.
又,可使得層片FXm之連續貼合變得容易,提高光學顯示設備之生產效率。 Moreover, the continuous bonding of the layer sheets FXm can be facilitated, and the production efficiency of the optical display device can be improved.
又,藉由圓弧狀的保持面32a之傾斜移動可平滑地保持層片FXm,且藉由同一圓弧狀的保持面32a之傾斜移動可將層片FXm確實地貼合至液晶面板P。 Moreover, the layer sheet FXm can be smoothly held by the oblique movement of the arc-shaped holding surface 32a, and the layer sheet FXm can be surely bonded to the liquid crystal panel P by the tilting movement of the same arc-shaped holding surface 32a.
又,前述薄膜貼合系統1中,該刀刃31c係於該液晶面板P之貼合面朝向下方地,將該層片FXm從該分離層片F3a處剝離,該貼合頭32係將該貼合面與反對側之上側面貼附而保持於該保持面32a處,讓該貼合面朝向下方的狀態下,在該剝離位置與該貼合位置之間進行移動,使得黏著層F2a側之貼合面朝向下方地搬送光學組件層FX,可抑制光學組件層FX之貼合面的刮痕或異物之附著等,可抑制貼合不良的發生。 Further, in the film bonding system 1, the blade 31c is directed downward from the bonding surface of the liquid crystal panel P, and the layer FXm is peeled off from the separation layer F3a, and the bonding head 32 is attached. The joint surface is attached to the upper surface of the opposite side and held at the holding surface 32a, and the bonding surface is directed downward, and is moved between the peeling position and the bonding position so that the adhesive layer F2a side When the bonding surface is conveyed downward toward the optical component layer FX, scratches on the bonding surface of the optical component layer FX, adhesion of foreign matter, and the like can be suppressed, and occurrence of poor bonding can be suppressed.
又,前述薄膜貼合系統1係具備轉台式機床(第一轉台式機床11與第二轉台式機床16),其係讓該液晶面板P移動至搬入位置(各轉台初始位置(第一轉台初始位置11a與第二轉台初始位置16a))、該貼合位置(各貼合位置(第一貼合位置11c、第二貼合位置11d與第三貼合位置16c))及搬出位置(各轉台終點位置(第一轉台終點位置11b與第二轉台終點位置16b)),以使得液晶面板P可有效率地切換搬送方向,且轉台式機床(第一轉台式機床11與第二轉台式機床16)亦可作為生產線之一部分而可抑制生產線長度,可提高系統之設置自由度。 Further, the film bonding system 1 includes a rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) for moving the liquid crystal panel P to the loading position (the initial position of each turntable (the first turntable initial) Position 11a and second turntable initial position 16a)), the bonding position (each bonding position (first bonding position 11c, second bonding position 11d, and third bonding position 16c)) and carrying-out position (each turntable) End position (first turntable end position 11b and second turntable end position 16b)) so that the liquid crystal panel P can efficiently switch the conveyance direction, and the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) ) It can also be used as part of the production line to suppress the length of the production line and increase the freedom of installation of the system.
另外,本發明不限於前述實施形態,例如,亦可透過貼合頭32或位置校準台39其中之一進行液晶面板P與貼合層片F5之相對位置校準。 Further, the present invention is not limited to the above embodiment, and for example, the relative positional alignment of the liquid crystal panel P and the bonding layer sheet F5 may be performed through one of the bonding head 32 or the position alignment table 39.
接著,前述實施形態中之結構為本發明之一例,於不偏離該發明之主旨的 範圍內,各種變化皆為可能,其中包含部件結構或構造、形狀、大小、數量及配置等。 Next, the configuration in the above embodiment is an example of the present invention, and does not deviate from the gist of the invention. Within the scope, various changes are possible, including component structure or construction, shape, size, quantity and configuration.
以下,參考圖式說明本發明之另一實施形態。本實施形態中,係說明作為光學顯示設備之生產系統,構成其一部分的薄膜貼合系統。 Hereinafter, another embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a film bonding system which is a part of a production system of an optical display device will be described.
第16圖係顯示第二實施形態之薄膜貼合系統1A的示意側面圖。第16圖中,與第一實施形態共通之結構元件賦予相同元件符號並省略詳細說明。又,關於第一實施形態之第2圖至第4圖的內容,對本實施形態中亦共通之內容,則省略其說明。 Fig. 16 is a schematic side view showing the film bonding system 1A of the second embodiment. In the sixteenth embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. In addition, the contents of the second embodiment to the fourth embodiment of the first embodiment are not described in the same manner in the present embodiment.
另外,於本實施形態中,第一光學組件F11、第二光學組件F12及第三光學組件F13係從後述第一層片F1m、第二層片F2m及第三層片F3m(以下,總稱為層片FXm。)切斷其顯示區域外側的剩餘部分所形成者。 In the present embodiment, the first optical module F11, the second optical component F12, and the third optical component F13 are mainly composed of a first layer F1m, a second layer F2m, and a third layer F3m (hereinafter, collectively referred to as The layer FXm.) cuts off the formation of the remaining portion of the outside of the display area.
第17圖係薄膜貼合系統1A之平面圖(俯視圖)。以下,參考第16圖、第17圖說明薄膜貼合系統1A。另外,圖中箭頭F係顯示液晶面板P之搬送方向。以下說明中,液晶面板P之搬送方向上游側稱作面板搬送上游側,液晶面板P之搬送方向下游側稱作面板搬送下游側。 Fig. 17 is a plan view (top view) of the film bonding system 1A. Hereinafter, the film bonding system 1A will be described with reference to Figs. 16 and 17 . In addition, the arrow F in the figure shows the conveyance direction of the liquid crystal panel P. In the following description, the upstream side of the liquid crystal panel P in the transport direction is referred to as the panel transport upstream side, and the downstream side of the liquid crystal panel P in the transport direction is referred to as the panel transport downstream side.
薄膜貼合系統1A係將主輸送設備5之特定位置作為貼合步驟之起點5a及終點5b。薄膜貼合系統1A具備:由起點5a從主輸送設備5朝直角方向延伸之第一副輸送設備6及第二副輸送設備7;從起點5a朝第一副輸送設備6之第一初始位置6a搬送液晶面板P的第一搬送裝置8;設置於第一副輸送設備6上的洗淨裝置9;設置於第一副輸送設備6之面板搬送下游側的第一轉台式機床11;從第一副輸送設備6之第一終點位置6b朝第一轉台式機床11之第一 轉台初始位置11a搬送液晶面板P的第二搬送裝置12;以及設置於第一轉台式機床11周圍的第一貼合裝置13及第二貼合裝置15、薄膜剝離裝置14與第一切斷裝置51。 The film bonding system 1A uses the specific position of the main conveying device 5 as the starting point 5a and the ending point 5b of the bonding step. The film bonding system 1A is provided with a first sub-conveying device 6 and a second sub-conveying device 7 extending from the main conveying device 5 in the right-angle direction from the starting point 5a; from the starting point 5a toward the first initial position 6a of the first sub-conveying device 6 a first transfer device 8 that transports the liquid crystal panel P, a cleaning device 9 that is disposed on the first sub-transport device 6, and a first rotary machine tool 11 that is disposed on the downstream side of the panel transport of the first sub-conveying device 6; The first end position 6b of the sub-conveying device 6 is toward the first of the first rotary machine tool 11 a second transfer device 12 that transports the liquid crystal panel P at the turntable initial position 11a; and a first bonding device 13 and a second bonding device 15, which are disposed around the first rotary machine tool 11, the film peeling device 14, and the first cutting device 51.
又,薄膜貼合系統1A具備:設置於第一轉台式機床11之面板搬送下游側的第二轉台式機床16;從第一轉台式機床11之第一轉台終點位置11b朝第二轉台式機床16之第二轉台初始位置16a搬送液晶面板P的第三搬送裝置17;設置於第二轉台式機床16周圍的第三貼合裝置18及第二切斷裝置52;設置於第二轉台式機床16之面板搬送下游側的第二副輸送設備7;從第二轉台式機床16之第二轉台終點位置16b朝第二副輸送設備7之第二初始位置7a搬送液晶面板P的第四搬送裝置21;以及從第二副輸送設備7之第二終點位置7b朝主輸送設備5之終點5b搬送液晶面板P的第五搬送裝置22。 Further, the film bonding system 1A includes: a second rotary machine tool 16 provided on the downstream side of the panel transfer of the first rotary machine tool 11; and a first rotary table end position 11b of the first rotary machine tool 11 toward the second rotary machine tool a third transfer device 17 that transports the liquid crystal panel P at the second turntable initial position 16a of 16; a third bonding device 18 and a second cutting device 52 that are disposed around the second rotary machine tool 16; and is disposed on the second rotary machine tool The panel of 16 transports the second sub-conveying device 7 on the downstream side; the fourth conveying device that transports the liquid crystal panel P from the second turret end position 16b of the second rotary machine tool 16 toward the second initial position 7a of the second sub-conveying device 7 21; and a fifth conveying device 22 that conveys the liquid crystal panel P from the second end position 7b of the second sub-conveying device 7 toward the end point 5b of the main conveying device 5.
薄膜貼合系統1A係使用由驅動式之主輸送設備5、各副輸送設備(第二副輸送設備6與第三副輸送設備7)及各轉台式機床(第一轉台式機床11與第二轉台式機床16)所形成之生產線搬送液晶面板P,且對液晶面板P依序施以特定處理。液晶面板P係以其正/反面呈水平狀態下於生產線上進行搬送。 The film bonding system 1A uses the driven main conveying device 5, each auxiliary conveying device (the second auxiliary conveying device 6 and the third auxiliary conveying device 7), and each rotary machine tool (the first rotary machine tool 11 and the second The production line formed by the rotary machine tool 16) transports the liquid crystal panel P, and sequentially applies specific processing to the liquid crystal panel P. The liquid crystal panel P is transported on the production line with its front/reverse surfaces horizontal.
液晶面板P係例如於主輸送設備5中,將顯示區域P4之短邊朝向沿搬送方向來進行搬送;與主輸送設備5垂直之各副輸送設備(第一副輸送設備6與第二副輸送設備7)中,將顯示區域P4之長邊朝向沿搬送方向來進行搬送;於各轉台式機床(第一轉台式機床11與第二轉台式機床16)中,將顯示區域P4之長邊朝向各轉台式機床(第一轉台式機床11與第二轉台式機床16)之半徑方向進行搬送。圖中符號5c係對應於液晶面板P,顯示沿主輸送設備5上運送之料架。 The liquid crystal panel P is, for example, in the main transport device 5, and transports the short side of the display region P4 in the transport direction; the sub transport devices (the first sub transport device 6 and the second sub transport) that are perpendicular to the main transport device 5 In the device 7), the long side of the display region P4 is transported in the transport direction; in each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16), the long side of the display region P4 is oriented. The rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16) are transported in the radial direction. The symbol 5c in the figure corresponds to the liquid crystal panel P, and displays the rack transported along the main transport device 5.
相對於該液晶面板P之正/反面,將從條狀光學組件層FX切割出特定長度的貼合層片F5之層片(相當於光學組件F1X)進行貼合。薄膜貼合系統1A之各部位係透過作為電子控制裝置的控制裝置25進行整體控制。 The layer (corresponding to the optical component F1X) of the bonding layer sheet F5 of a specific length is cut out from the strip-shaped optical component layer FX with respect to the front/rear surface of the liquid crystal panel P. Each part of the film bonding system 1A is integrally controlled by a control device 25 as an electronic control unit.
第一搬送裝置8可保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。 The first conveying device 8 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction.
第一搬送裝置8係例如將藉由吸附作用所保持之液晶面板P朝第一副輸送設備6之第一初始位置6a(第17圖之左端部)直接以水平狀態進行搬送,於該位置處解除該吸附作用,將液晶面板P傳遞給第一副輸送設備6。 The first transfer device 8 directly transports the liquid crystal panel P held by the adsorption to the first initial position 6a (the left end portion of FIG. 17) of the first sub-transport device 6 in a horizontal state, at which position The adsorption is released, and the liquid crystal panel P is transferred to the first sub-conveying device 6.
洗淨裝置9係例如水洗式洗淨,對液晶面板P之正/反面進行刷洗及水洗,其後進行液晶面板P之正/反面的液體清除。另外,洗淨裝置9亦可為乾式洗淨,對液晶面板P之正/反面進行靜電消除及集塵。 The cleaning device 9 is, for example, washed by water, and is brushed and washed on the front/rear surface of the liquid crystal panel P, and then the liquid on the front/rear surface of the liquid crystal panel P is removed. Further, the cleaning device 9 may be dry-cleaned to perform static elimination and dust collection on the front/rear surfaces of the liquid crystal panel P.
第二搬送裝置12可保持液晶面板P並自由地朝垂直方向及水平方向進行搬送。第二搬送裝置12係例如將藉由吸附作用所保持之液晶面板P朝第一轉台式機床11之第一轉台初始位置11a直接以水平狀態進行搬送,於該位置處解除該吸附作用,將液晶面板P傳遞給第一轉台式機床11。 The second transfer device 12 can hold the liquid crystal panel P and freely transport it in the vertical direction and the horizontal direction. The second transfer device 12 directly transports the liquid crystal panel P held by the adsorption to the first turntable initial position 11a of the first rotary machine tool 11 in a horizontal state, and at this position, the adsorption action is released, and the liquid crystal is discharged. The panel P is delivered to the first rotary machine tool 11.
第一轉台式機床11係具有沿垂直方向之迴轉軸的圓盤狀迴轉台,以從第二搬送裝置12之搬入位置(第17圖平面視圖中左端部)作為第一轉台初始位置11a,朝順時針方向進行迴轉驅動。第一轉台式機床11係以從第一轉台初始位置11a朝順時針方向迴轉90°迴轉之位置(第17圖之上端部)作為第一貼合位置11c。於該第一貼合位置11c處,以第一貼合裝置13進行背光側之第一光學組件F11的貼合。 The first rotary table machine 11 is a disk-shaped turntable having a rotary axis in the vertical direction, and is moved from the second transfer device 12 (the left end portion in the plan view of Fig. 17) as the first turntable initial position 11a toward Rotary drive in a clockwise direction. The first rotary machine tool 11 is a first bonding position 11c at a position (the upper end portion of Fig. 17) that is rotated 90° in the clockwise direction from the first turret initial position 11a. At the first bonding position 11c, the bonding of the first optical component F11 on the backlight side is performed by the first bonding apparatus 13.
第一層片F1m係較液晶面板P之顯示區域更大尺寸的第一光學 組件層F1之層片。藉由第一貼合裝置13將第一層片F1m貼合至液晶面板P之正/反面中一側之面,以形成第一光學組件貼合體PA1。 The first layer F1m is a first optical larger than the display area of the liquid crystal panel P Layer of component layer F1. The first layer sheet F1m is bonded to one of the front/reverse sides of the liquid crystal panel P by the first bonding device 13 to form the first optical component bonding body PA1.
第一轉台式機床11係以從第一貼合位置11c朝順時針方向迴轉45°迴轉之位置(第17圖之右上端部)作為薄膜剝離位置11e。於該薄膜剝離位置11e處,以薄膜剝離裝置14進行第一層片F1m之表面保護薄膜F4a的剝離。 The first rotary machine tool 11 is a film peeling position 11e at a position (the upper right end portion of FIG. 17) that is rotated by 45° in the clockwise direction from the first bonding position 11c. At the film peeling position 11e, peeling of the surface protective film F4a of the first layer sheet F1m is performed by the film peeling device 14.
第一轉台式機床11係以從薄膜剝離位置11e朝順時針方向迴轉45°迴轉之位置(第17圖之右端位置)作為第二貼合位置11d。於該第二貼合位置11d處,以第二貼合裝置15進行背光側之第二層片F2m的貼合。 The first rotary machine tool 11 is a second bonding position 11d at a position (right end position in FIG. 17) that is rotated by 45° in the clockwise direction from the film peeling position 11e. At the second bonding position 11d, the second bonding apparatus 15 performs bonding of the second layer sheet F2m on the backlight side.
第二層片F2m係較液晶面板P之顯示區域更大尺寸的第二光學組件層F2之層片。藉由第二貼合裝置15將第二層片F2m貼合至第一光學組件貼合體PA1之第一層片F1m側之面,以形成第二光學組件貼合體PA2。 The second layer F2m is a layer of the second optical component layer F2 that is larger in size than the display area of the liquid crystal panel P. The second layer sheet F2m is bonded to the surface of the first layer F1m side of the first optical component bonding body PA1 by the second bonding device 15 to form the second optical component bonding body PA2.
第一轉台式機床11係以從第二貼合位置11d朝順時針方向迴轉90°之位置(第17圖之下端部)作為第一轉台終點位置11b。 The first rotary table machine 11 is a first turntable end position 11b at a position (the lower end portion in Fig. 17) that is rotated 90° clockwise from the second bonding position 11d.
第一轉台終點位置11b係藉由第一切斷裝置51進行第一層片F1m及第二層片F2m之切斷的第一切斷位置。第一切斷裝置51係從貼合至液晶面板P的第一層片F1m及第二層片F2m各自地將配置於液晶面板P之顯示區域的對向部分外側的剩餘部分一併切斷,使得由第一光學組件層F1組成之第一光學組件F11及由第二光學組件層F2組成之第二光學組件F12,形成作為對應於液晶面板P之顯示區域大小的光學組件。 The first turret end position 11b is a first cutting position at which the first layer F1m and the second layer F2m are cut by the first cutting device 51. The first cutting device 51 cuts off the remaining portion of the first layer sheet F1m and the second layer sheet F2m that are bonded to the liquid crystal panel P, respectively, on the outer side of the opposite portion of the display portion of the liquid crystal panel P. The first optical component F11 composed of the first optical component layer F1 and the second optical component F12 composed of the second optical component layer F2 are formed as optical components corresponding to the size of the display region of the liquid crystal panel P.
將第一層片F1m與第二層片F2m貼合至液晶面板P後一併切斷,使得第一光學組件F11與第二光學組件F12之位置無偏差,藉以獲得與顯示區域P4之外周緣形狀相符的第一光學組件F11及第二光學組件F12。又,亦 簡化了第一層片F1m與第二層片F2m之切斷步驟。 After the first layer F1m and the second layer F2m are attached to the liquid crystal panel P, the first optical component F11 and the second optical component F12 are not separated, so as to obtain a peripheral edge of the display region P4. The shape corresponds to the first optical component F11 and the second optical component F12. Also The cutting step of the first layer F1m and the second layer F2m is simplified.
藉由第一切斷裝置51從第二光學組件貼合體PA2將第一層片F1m及第二層片F2m之剩餘部分切斷,以形成將第一光學組件F11及第二光學組件F12貼合至液晶面板P之正/反面中一側之面的第三光學組件貼合體PA3。從第一層片FX1及第二層片F2m所切斷之剩餘部分係透過圖式中省略之剝離裝置,從液晶面板P進行剝離回收。第三光學組件貼合體PA3係於第一轉台終點位置11b處,藉由第三搬送裝置17而搬出。 The remaining portions of the first layer F1m and the second layer F2m are cut from the second optical component bonding body PA2 by the first cutting device 51 to form the first optical component F11 and the second optical component F12. The third optical component is bonded to the surface of one of the front/reverse sides of the liquid crystal panel P. The remaining portion cut from the first layer sheet FX1 and the second layer sheet F2m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings. The third optical component bonding body PA3 is attached to the first turntable end position 11b, and is carried out by the third transfer device 17.
第三搬送裝置17係可保持液晶面板P(第三光學組件貼合體PA3)而自由地朝垂直方向及水平方向進行搬送。第三搬送裝置17係例如將藉由吸附作用所保持之液晶面板P朝第二轉台式機床16之第二轉台初始位置16a進行搬送,且於該搬送時進行液晶面板P之正/反面反轉,於第二轉台初始位置16a處解除該吸附作用,將液晶面板P傳遞給第二轉台式機床16。 The third transport device 17 can hold the liquid crystal panel P (the third optical component bonding body PA3) and can be freely transported in the vertical direction and the horizontal direction. The third transport device 17 transports the liquid crystal panel P held by the adsorption to the second turntable initial position 16a of the second rotary machine tool 16, and performs the front/reverse reverse of the liquid crystal panel P at the time of the conveyance. The adsorption is released at the second turntable initial position 16a, and the liquid crystal panel P is transferred to the second rotary machine tool 16.
第二轉台式機床16係具有沿垂直方向之迴轉軸的圓盤狀迴轉台,以從第三搬送裝置17之搬入位置(第17圖俯視圖中上端部)作為第二轉台初始位置16a,朝順時針方向進行迴轉驅動。第二轉台式機床16係以從第二轉台初始位置16a朝順時針方向迴轉90°之位置(第17圖之右端部)作為第三貼合位置16c。於該第三貼合位置16c處,以第三貼合裝置18進行顯示面側之第三層片F3m的貼合。 The second rotary table machine 16 is a disk-shaped turntable having a rotary axis in the vertical direction, and is moved from the third transfer device 17 (the upper end portion in the plan view of Fig. 17) as the second turntable initial position 16a. The slewing drive is performed in the hour hand direction. The second rotary machine tool 16 is a third bonding position 16c at a position (the right end portion of FIG. 17) that is rotated 90° clockwise from the second turret initial position 16a. At the third bonding position 16c, the third bonding apparatus 18 performs bonding of the third layer sheet F3m on the display surface side.
第三層片F3m係較液晶面板P之顯示區域更大尺寸的第三光學組件層F3之層片。藉由第三貼合裝置18將第三層片F3m貼合至液晶面板P之正/反面中另一面(第三光學組件貼合體PA3之第一光學組件F11及第二光學組件F12所貼合之面的反對側之面),以形成第四光學組件貼合體PA4。 The third layer sheet F3m is a layer of the third optical component layer F3 having a larger size than the display area of the liquid crystal panel P. The third layer sheet F3m is bonded to the other of the front/rear surfaces of the liquid crystal panel P by the third bonding device 18 (the first optical component F11 and the second optical component F12 of the third optical component bonding body PA3 are attached to each other). The opposite side of the face) to form the fourth optical component bonding body PA4.
第二轉台式機床16係以從第三貼合位置16c朝順時針方向迴轉90°之位置(第17圖之下端部)作為第二切斷位置16d。於該第二切斷位置16d處,藉由第二切斷裝置52進行第三層片F3m之切斷。第二切斷裝置52係從貼合至液晶面板P之第三層片F3m將配置於液晶面板P之顯示區域的對向部分外側的剩餘部分切斷,形成對應於液晶面板P之顯示區域大小的光學組件(第三光學組件F13)。 The second rotary machine tool 16 is a second cutting position 16d at a position (the lower end portion in Fig. 17) that is rotated 90° clockwise from the third bonding position 16c. At the second cutting position 16d, the third layer piece F3m is cut by the second cutting device 52. The second cutting device 52 cuts the remaining portion of the outer side of the facing portion of the display region of the liquid crystal panel P from the third layer sheet F3m bonded to the liquid crystal panel P to form a display area corresponding to the liquid crystal panel P. Optical component (third optical component F13).
藉由第二切斷裝置52從第四光學組件貼合體PA4將第三層片F3m之剩餘部分切斷,於液晶面板P之正/反面中另一面貼合有第三光學組件F13,且於液晶面板P之正/反面中一側之面貼合有第一光學組件F11及第二光學組件F12而形成第五光學組件貼合體PA5。從第三層片F3m所切斷之剩餘部分係透過圖式中省略之剝離裝置,從液晶面板P進行剝離回收。 The remaining portion of the third layer sheet F3m is cut from the fourth optical component bonding body PA4 by the second cutting device 52, and the third optical component F13 is bonded to the other side of the front/rear surface of the liquid crystal panel P, and The first optical component F11 and the second optical component F12 are bonded to one side of the front/rear surface of the liquid crystal panel P to form a fifth optical component bonding body PA5. The remaining portion cut from the third layer sheet F3m is peeled off from the liquid crystal panel P through a peeling device omitted in the drawings.
此處,第一切斷裝置51及第二切斷裝置52例如為二氧化碳(CO2)雷射切割機。第一切斷裝置51及第二切斷裝置52係沿顯示區域P4之外周緣不間斷地切斷貼合至液晶面板P之層片FXm。第一切斷裝置51與第二切斷裝置52係連接至同一個雷射輸出裝置53。藉由第一切斷裝置51、第二切斷裝置52及雷射輸出裝置53而構成切斷部,從層片FXm將配置於顯示區域P4之對向部分外側的剩餘部分切斷,形成對應於顯示區域P4大小的光學組件FX。由於各層片(第一層片F1m、第二層片F2m與第三層片F3m)之切斷所需雷射輸出並不大,本實施形態中,將雷射輸出裝置53所輸出之高輸出雷射光線分歧為二,供給至第一切斷裝置51與第二切斷裝置52。 Here, the first cutting device 51 and the second cutting device 52 are, for example, a carbon dioxide (CO 2 ) laser cutting machine. The first cutting device 51 and the second cutting device 52 cut the layer sheet FXm bonded to the liquid crystal panel P without interruption along the outer periphery of the display region P4. The first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The first cutting device 51, the second cutting device 52, and the laser output device 53 constitute a cutting portion, and the remaining portion disposed outside the opposing portion of the display region P4 is cut off from the layer FXm to form a corresponding portion. The optical component FX is displayed in the size of the display area P4. Since the laser output required for cutting each of the layers (the first layer F1m, the second layer F2m, and the third layer F3m) is not large, in the present embodiment, the output of the laser output device 53 is high. The laser light is divided into two and supplied to the first cutting device 51 and the second cutting device 52.
第二轉台式機床16係以從第二切斷位置16d朝順時針方向迴轉90°之位置(第17圖之左端部)作為第二轉台終點位置16b。於該第二轉台終點位 置16b處,以第四搬送裝置21進行第五光學組件貼合體PA5的搬出動作。 The second rotary machine tool 16 is a second turntable end position 16b at a position (left end portion of Fig. 17) that is rotated 90° clockwise from the second cutting position 16d. At the end of the second turntable At the position 16b, the fourth optical device bonding body PA5 is carried out by the fourth conveying device 21.
第四搬送裝置21係可保持液晶面板P(第五光學組件貼合體PA5)而自由地朝垂直方向及水平方向進行搬送。第四搬送裝置21係例如將藉由吸附作用所保持之液晶面板P朝第二副輸送設備7之第二初始位置7a進行搬送,於第二初始位置7a處解除該吸附作用,將液晶面板P傳遞給第二副輸送設備7。 The fourth transfer device 21 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fourth conveying device 21 conveys, for example, the liquid crystal panel P held by the adsorption to the second initial position 7a of the second sub-transporting device 7, and releases the adsorption at the second initial position 7a, and the liquid crystal panel P is removed. It is transmitted to the second sub-conveying device 7.
第五搬送裝置22係可保持液晶面板P(第五光學組件貼合體PA5)而自由地朝垂直方向及水平方向進行搬送。第五搬送裝置22係例如將藉由吸附作用所保持之液晶面板P朝主輸送設備5之終點5b進行搬送,於終點5b處解除該吸附作用,將液晶面板P傳遞給主輸送設備5。 The fifth transport device 22 can hold the liquid crystal panel P (the fifth optical component bonding body PA5) and can be freely transported in the vertical direction and the horizontal direction. The fifth transport device 22 transports the liquid crystal panel P held by the adsorption to the end point 5b of the main transport device 5, and releases the suction at the end point 5b to transfer the liquid crystal panel P to the main transport device 5.
第二轉台終點位置16b後之液晶面板P(第五光學組件貼合體PA5)的搬送路線上設置有圖式中省略之貼合檢查位置,於該貼合檢查位置處,以檢查裝置(圖式中省略)對貼合有薄膜之加工件(液晶面板P)進行檢查(光學組件F1X之位置是否適當(位置偏差是否在公差範圍內)等檢查)。相對液晶面板P之光學組件F1X的位置被判斷為不正確的加工件,便透過圖中未顯示之排除部而送出系統外。 The conveyance route of the liquid crystal panel P (the fifth optical component bonding body PA5) after the second turntable end position 16b is provided with a bonding inspection position omitted in the drawing, and at the bonding inspection position, the inspection device (pattern) (Omit omitted) Check the workpiece (liquid crystal panel P) to which the film is bonded (check whether the position of the optical component F1X is appropriate (whether the positional deviation is within the tolerance) or the like). When the position of the optical module F1X of the liquid crystal panel P is judged to be an incorrect workpiece, it is sent out of the system through the exclusion portion not shown in the drawing.
經由以上完成薄膜貼合系統1A之貼合步驟。 The bonding step of the film bonding system 1A is completed via the above.
以下,參考第18圖詳細說明第一貼合裝置13。另外,第二貼合裝置15及第三貼合裝置18亦具有相同結構而省略其詳細說明。 Hereinafter, the first bonding apparatus 13 will be described in detail with reference to FIG. 18. In addition, the second bonding apparatus 15 and the third bonding apparatus 18 have the same configuration, and detailed description thereof will be omitted.
第一貼合裝置13係針對搬送至第一貼合位置11c的液晶面板P之上側面,將第一光學組件層F1中切斷成特定尺寸的貼合層片F5之層片(第一層片F1m)進行貼合。 The first bonding apparatus 13 is a layer (the first layer) of the bonding layer sheet F5 cut into a specific size in the first optical component layer F1 with respect to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c. Sheet F1m) is attached.
第一貼合裝置13係具有:層片搬送裝置31,係從捲取有第一光 學組件層F1之料捲滾筒R1將該第一光學組件層F1捲出,且沿其長邊方向搬送該第一光學組件層F1;以及貼合頭32,使層片搬送裝置31保持從第一光學組件層F1切割出的貼合層片F5之層片(第一層片F1m),並將該層片貼合至搬送到第一貼合位置11c的液晶面板P之上側面。 The first bonding apparatus 13 has a layer sheet conveying device 31 that takes the first light from the coil The roll drum R1 of the component layer F1 winds up the first optical component layer F1, and conveys the first optical component layer F1 along the longitudinal direction thereof; and the bonding head 32 to keep the layer conveying device 31 from the first A layer (first layer sheet F1m) of the bonding layer sheet F5 cut by the optical component layer F1 is bonded to the upper surface of the liquid crystal panel P conveyed to the first bonding position 11c.
層片搬送裝置31係以分離層片F3a作為載件來搬送貼合層片F5,其具有:捲出部31a,係保持捲取有條狀第一光學組件層F1之料捲滾筒R1,且沿其長邊方向將第一光學組件層F1捲出;切斷部131b,對從料捲滾筒R1捲出之第一光學組件層F1施以半切斷;刀刃31c(剝離部),使得施以半切斷後之第一光學組件層F1於銳角處捲繞,以使貼合層片F5從分離層片F3a處分離;以及捲取部31d,保持捲取通過刀刃31c後獨自存在之分離層片F3a的分離滾筒R2。 The layer sheet conveying device 31 conveys the bonding layer sheet F5 by using the separation layer sheet F3a as a carrier, and has a winding portion 31a for holding the roll drum R1 in which the strip-shaped first optical unit layer F1 is wound, and The first optical component layer F1 is wound up along the longitudinal direction thereof; the cutting portion 131b applies a half cut to the first optical component layer F1 taken up from the roll drum R1; and the blade 31c (peeling portion) is applied The first optical component layer F1 after the half cut is wound at an acute angle to separate the bonding layer sheet F5 from the separation layer sheet F3a; and the winding portion 31d is kept separated by the separation layer sheet F3a which is separately wound after passing through the blade edge 31c. Separation roller R2.
另外,雖然圖式中省略,但層片搬送裝置31具有沿特定搬送路線捲繞第一光學組件層F1的複數個導引滾筒。第一光學組件層F1在與其搬送方向垂直之水平方向(層片寬度方向)上,具有寬度較液晶面板P之顯示區域P4(顯示區域P4之長邊與短邊中任一邊的長度,相當於本實施形態中顯示區域P4之長邊長度)更寬的寬度。 Further, although omitted from the drawings, the layer sheet conveying device 31 has a plurality of guide rollers that wind the first optical module layer F1 along a specific conveyance path. The first optical component layer F1 has a width in a horizontal direction (ply width direction) perpendicular to the conveyance direction, and has a width corresponding to the display region P4 of the liquid crystal panel P (the length of either the long side and the short side of the display region P4 is equivalent to In the present embodiment, the length of the long side of the display region P4 is wider.
位於層片搬送裝置31起點之捲出部31a與位於層片搬送裝置31終點之捲取部31d係例如為相互同步驅動。藉此,捲出部31a係朝其搬送方向捲出第一光學組件層F1,且捲取部31d則捲取通過刀刃31c後的分離層片F3a。以下,於層片搬送裝置31中,第一光學組件層F1(分離層片F3a)之搬送方向上游側稱作層片搬送上游側,搬送方向下游側稱作層片搬送下游側。 The winding portion 31a located at the beginning of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are, for example, driven in synchronization with each other. Thereby, the unwinding portion 31a winds up the first optical component layer F1 in the conveyance direction, and the winding portion 31d winds up the separation layer sheet F3a that has passed through the blade 31c. In the layer conveyance device 31, the upstream side in the conveyance direction of the first optical module layer F1 (separation layer sheet F3a) is referred to as the layer conveyance upstream side, and the downstream side in the conveyance direction is referred to as the sheet conveyance downstream side.
每當切斷部131b在與該層片寬度方向垂直之長度方向上將第一 光學組件層F1捲出達顯示區域P4之長度(顯示區域P4之長邊與短邊中另一邊長度。相當於本實施形態中顯示區域P4之短邊長度)更長之長度時,沿該層片寬度方向橫跨整體寬度切斷第一光學組件層F1厚度方向之一部分(施以半切斷)。藉此,從第一光學組件層F1切割出較液晶面板P之顯示區域P4更大的貼合層片F5之層片(第一層片F1m)。 Each time the cutting portion 131b is first in the longitudinal direction perpendicular to the width direction of the layer sheet When the optical component layer F1 is wound up to the length of the display region P4 (the length of the other side of the display region P4 and the other side of the short side, which corresponds to the length of the short side of the display region P4 in the present embodiment), along the layer The sheet width direction cuts a portion of the thickness direction of the first optical component layer F1 across the entire width (half cut). Thereby, the layer (first layer sheet F1m) of the bonding layer sheet F5 which is larger than the display region P4 of the liquid crystal panel P is cut out from the first optical component layer F1.
切斷部131b係透過第一光學組件層F1搬送中的張力,在不使得第一光學組件層F1(分離層片F3a)斷裂的情況下(殘留有特定厚度之分離層片F3a),調整切斷刀片的前後位置,施以該半切斷,其深至黏著層F2a與分離層片F3a交界面附近。另外,亦可使用雷射裝置代替切斷刀片。 The cutting portion 131b transmits the tension in the first optical component layer F1, and does not cause the first optical component layer F1 (the separation layer F3a) to be broken (the separation layer F3a having a specific thickness remains). The front and rear positions of the broken blade are subjected to the half cut, which is deep to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device can be used instead of cutting the blade.
於半切斷後之第一光學組件層F1中,依其厚度方向切斷光學組件本體F1a及表面保護薄膜F4a,以形成橫跨第一光學組件層F1之層片寬度方向上整體寬度的橫切線。第一光學組件層F1係藉由該橫切線,在長邊方向上劃分出具有相當於顯示區域P4之短邊長度的分區。該分區係各自為貼合層片F5中的一個層片(第一層片F1m)。 In the first optical component layer F1 after the half cutting, the optical module body F1a and the surface protective film F4a are cut in the thickness direction thereof to form a transverse line across the entire width of the first optical component layer F1 in the layer width direction. The first optical component layer F1 is divided into sections having a length corresponding to the short side of the display region P4 in the longitudinal direction by the transverse line. The partitions are each one of the plies (first ply F1m) of the ply F5.
刀刃31c係位於從第18圖左側朝右側略呈水平地搬送之第一光學組件層F1下方,於第一光學組件層F1之層片寬度方向上至少橫跨延伸其整體寬度地形成。刀刃31c係於半切斷後之第一光學組件層F1的分離層片F3a側呈滑動接觸地使其捲繞過此銳角。 The blade 31c is located below the first optical component layer F1 which is conveyed slightly horizontally from the left side to the right side of Fig. 18, and is formed to extend at least across the entire width of the first optical component layer F1 in the layer width direction. The blade 31c is wound in such a manner that it is wound in a sliding contact with the side of the separation layer F3a of the first optical component layer F1 after the half cutting.
刀刃31c係讓第一光學組件層F1於銳角處捲繞過其銳角狀之前端部。第一光學組件層F1於刀刃31c之前端部呈銳角處折返時,分離層片F3a會從第一層片F1m處剝離。此時,第一層片F1m之黏著層F2a(與液晶面板P之貼合面)係朝向下方。刀刃31c之前端部正上方為分離層剝離位置31e,貼合頭 32之圓弧狀的保持面32a從上方接觸到該刀刃31c之前端部,使得第一層片F1m的表面保護薄膜F4a(與貼合面的反對側之面)黏著至貼合頭32之保持面32a。 The blade 31c is such that the first optical component layer F1 is wound at its acute angle at its acute angle. When the first optical component layer F1 is folded back at an acute front end of the blade 31c, the separation layer F3a is peeled off from the first layer F1m. At this time, the adhesive layer F2a of the first layer sheet F1m (the bonding surface with the liquid crystal panel P) faces downward. The separation layer peeling position 31e is directly above the front end of the blade 31c, and the fitting head The arc-shaped holding surface 32a of 32 is brought into contact with the front end portion of the blade edge 31c from above, so that the surface protective film F4a of the first layer sheet F1m (the surface opposite to the opposite side of the bonding surface) is adhered to the holding of the bonding head 32. Face 32a.
貼合頭32係與該層片寬度方向平行且於下方具有凸的圓弧狀之保持面32a。保持面32a具有例如較貼合層片F5之貼合面(黏著層F2a)更弱的黏著力,可將第一層片F1m之表面保護薄膜F4a重複進行黏著、剝離。 The bonding head 32 is a holding surface 32a having a convex arc shape in parallel with the width direction of the layer. The holding surface 32a has a weaker adhesive force than the bonding surface (adhesive layer F2a) of the bonding layer F5, for example, and the surface protective film F4a of the first layer F1m can be repeatedly adhered and peeled off.
貼合頭32係以刀刃31c上方沿該層片寬度方向之軸作為中心,與該長度方向平行,且沿保持面32a之彎曲傾斜移動。於黏著保持第一層片F1m時,及將黏著保持好之第一層片F1m貼合至液晶面板P時,適當地進行貼合頭32之傾斜移動。 The bonding head 32 is centered on the axis of the blade 31c in the width direction of the layer, parallel to the longitudinal direction, and is inclined to move along the curved surface of the holding surface 32a. When the first layer sheet F1m is adhered and adhered to the liquid crystal panel P, the tilting movement of the bonding head 32 is appropriately performed.
貼合頭32係使保持面32a朝向下方,且保持面32a之彎曲一端側(第18圖之右側)為下側的傾斜狀態下,從上方將保持面32a之彎曲一端側貼附至刀刃31c之前端部,而將分離層剝離位置31e的第一層片F1m之前端部黏著至保持面32a。其後,捲出第一層片F1m且使貼合頭32傾斜移動,藉以將第一層片F1m之整體黏著至保持面32a。 The bonding head 32 is such that the holding surface 32a faces downward, and the curved end side of the holding surface 32a (the right side of FIG. 18) is in the lower side, and the curved end side of the holding surface 32a is attached to the blade 31c from above. At the front end portion, the front end portion of the first ply F1m of the separation layer peeling position 31e is adhered to the holding surface 32a. Thereafter, the first layer sheet F1m is taken up and the bonding head 32 is tilted to move, thereby bonding the entire first layer sheet F1m to the holding surface 32a.
貼合頭32可於分離層剝離位置31e及第一貼合位置11c之上方進行特定距離的昇降動作,且可於分離層剝離位置31e與第一貼合位置11c之間適當地進行移動。貼合頭32係連結至驅動裝置,而可進行該昇降時、該移動時和該傾斜移動時之驅動。 The bonding head 32 can perform a lifting operation of a specific distance above the separation layer peeling position 31e and the first bonding position 11c, and can appropriately move between the separation layer peeling position 31e and the first bonding position 11c. The bonding head 32 is coupled to the driving device, and can be driven during the lifting, the moving, and the tilting movement.
貼合頭32在將第一層片F1m黏著至保持面32a時,係例如在將第一層片F1m之前端部黏著至保持面32a後,切斷與驅動裝置33的銜接而自由地傾斜移動,從該狀態被動地伴隨第一層片F1m之捲出而傾斜移動。當貼合頭32傾斜移動直到第一層片F1m整體黏著至保持面32a時,於該傾斜狀態下藉由 例如與驅動裝置33之銜接等來鎖死該傾斜移動,並於該狀態下朝第一貼合位置11c上方移動。 When the first layer sheet F1m is adhered to the holding surface 32a, the bonding head 32 is detached from the driving device 33, for example, after the end portion of the first layer sheet F1m is adhered to the holding surface 32a. From this state, the tilting movement is passively accompanied by the unwinding of the first layer sheet F1m. When the bonding head 32 is tilted until the first layer F1m is entirely adhered to the holding surface 32a, by the inclined state For example, it is engaged with the driving device 33 or the like to lock the tilting movement, and moves to the upper side of the first bonding position 11c in this state.
貼合頭32在將黏著保持好之第一層片F1m貼合至液晶面板P時,藉由例如驅動裝置33之作動而主動地傾斜移動,沿保持面32a之彎曲將第一層片F1m貼附至液晶面板P之上側面以確實地進行貼合。 When the first layer F1m which is adhered and adhered to the liquid crystal panel P is attached, the bonding head 32 actively moves obliquely by, for example, the driving device 33, and the first layer F1m is attached along the bending of the holding surface 32a. Attached to the upper side of the liquid crystal panel P to be surely bonded.
刀刃31c之前端部下方處,設置有第一檢測攝影機34,其係檢測在該部位處的貼合層片F5的層片搬送下游側之前端部。第一檢測攝影機34之檢測資料係傳送至控制裝置25。控制裝置25於例如第一檢測攝影機34檢測出貼合層片F5之下游側端的時點時,係暫時停止層片搬送裝置31,其後,降下貼合頭32以將貼合層片F5之前端部黏著至該保持面32a。 Below the front end portion of the blade 31c, a first detecting camera 34 is provided which detects the front end portion on the downstream side of the layer transporting of the bonding layer sheet F5 at the portion. The detection data of the first detection camera 34 is transmitted to the control device 25. When the first detecting camera 34 detects the downstream end of the bonding layer sheet F5, for example, the control device 25 temporarily stops the layer sheet conveying device 31, and thereafter lowers the bonding head 32 to fix the front end of the bonding layer sheet F5. The portion is adhered to the holding surface 32a.
在第一檢測攝影機34檢測出貼合層片F5之下游側端並暫時停止層片搬送裝置31時,控制裝置25係藉由切斷部131b實施貼合層片F5之切斷。即,沿第一檢測攝影機34之檢出位置(第一檢測攝影機34之光軸延長位置)與沿切斷部131b之切斷位置(切斷部131b之切斷刀片之進退刀位置)間的層片搬送路線之距離係相當於貼合層片F5之層片(第一層片F1m)的長度。 When the first detecting camera 34 detects the downstream side end of the bonding layer sheet F5 and temporarily stops the layer sheet conveying device 31, the control device 25 performs the cutting of the bonding layer sheet F5 by the cutting portion 131b. That is, the detection position along the first detection camera 34 (the optical axis extension position of the first detection camera 34) and the cutting position along the cutting portion 131b (the cutting edge position of the cutting blade of the cutting portion 131b) The distance of the layer transport route corresponds to the length of the layer sheet (first layer sheet F1m) to which the layer sheet F5 is bonded.
第一切斷裝置31b可沿層片搬送路線移動,藉由該移動使得沿第一檢測攝影機34之檢出位置與切斷部131b之切斷位置間的層片搬送路線之距離產生改變。切斷部131b之移動係透過控制裝置25所控制,在以例如切斷部131b進行貼合層片F5的切斷之後,捲出一個貼合層片F5之層片(第一層片F1m)的距離時,當其切斷端與特定之基準位置間有偏差的情況中,便藉由切斷部131b之移動來補正該偏差。另外,亦可藉由切斷部131b的移動來對應長度相異之貼合層片F5的切斷。 The first cutting device 31b is movable along the layer transport path, and the distance between the detection position of the first detecting camera 34 and the cutting position between the cutting positions of the cutting portion 131b is changed by the movement. The movement of the cutting portion 131b is controlled by the transmission control device 25, and after the cutting layer sheet F5 is cut by, for example, the cutting portion 131b, the layer sheet (the first layer sheet F1m) of one bonding layer sheet F5 is wound up. In the case of a distance, when there is a deviation between the cut end and the specific reference position, the deviation is corrected by the movement of the cut portion 131b. Further, the cutting of the bonding layer sheet F5 having a different length may be performed by the movement of the cutting portion 131b.
第一檢測攝影機34亦可檢測出印於貼合層片F5之缺陷標誌。該缺陷標誌在料捲滾筒R1製造時,係對於第一光學組件層F1發現缺陷部位處,從該表面保護薄膜F4a側藉由噴墨等加以標記。檢測出該缺陷標誌之貼合層片F5(包含缺陷之第一層片F1m)在黏著至貼合頭32之後,不貼合至液晶面板P,而是移動至避開第一貼合位置11c的捨棄位置(廢棄位置),重疊貼合至廢料層片等處。另外,在檢測出缺陷標誌時,亦可設計將包含貼合層片F5之缺陷部分以最小寬度切斷而捨棄的步驟。 The first detecting camera 34 can also detect the defect mark printed on the bonding layer F5. This defect mark is marked by the ink jet or the like from the side of the surface protective film F4a when the defect roll is found in the first optical component layer F1 at the time of manufacture of the roll reel R1. The bonding layer sheet F5 (the first layer sheet F1m including the defect) on which the defect mark is detected does not adhere to the liquid crystal panel P after being adhered to the bonding head 32, but moves to avoid the first bonding position 11c. The discarded position (discarded position), overlapped to the waste layer and the like. Further, when the defect mark is detected, the step of cutting off the defective portion including the bonding layer sheet F5 with a minimum width may be designed.
另外,光學組件層FX之缺陷係例如於光學組件層FX內部處存在由固體與液體與氣體至少一者組成之異物的部分,或於光學組件層FX表面處存在凹凸或傷痕的部分,因光學組件層FX歪斜或材質偏差等導致之亮點的部分等。 In addition, the defect of the optical component layer FX is, for example, a portion where the solid matter is composed of a foreign matter composed of at least one of a liquid and a gas, or a portion where the surface of the optical component layer FX has irregularities or scratches due to the optical portion. The part of the component layer FX skew or material deviation, etc., which causes bright spots.
貼合頭32從分離層剝離位置31e朝第一貼合位置11c移動時,黏著保持於保持面32a的第一層片F1m之兩角部(例如相對該前端部的近端部之兩角部),係各自以一對第二檢測攝影機35進行拍攝。各第二檢測攝影機35之檢測資料係傳送至控制裝置25。控制裝置25係例如根據各第二檢測攝影機35之攝影資料,確認相對貼合頭32的第一層片F1m之水平方向(貼合頭32的移動方向及其垂直方向以及垂直軸中心之迴轉方向)位置。在貼合頭32及第一層片F1m之相對位置具有偏差的情況中,貼合頭32係以第一層片F1m之位置作為特定之基準位置來進行位置校準。 When the bonding head 32 moves from the separation layer peeling position 31e toward the first bonding position 11c, it is adhered and held at both corners of the first layer sheet F1m of the holding surface 32a (for example, at the corners of the proximal end portion of the front end portion) Each of the cameras is photographed by a pair of second detecting cameras 35. The detection data of each of the second detecting cameras 35 is transmitted to the control device 25. The control device 25 confirms, for example, the horizontal direction of the first layer sheet F1m with respect to the bonding head 32 based on the photographic data of each of the second detecting cameras 35 (the moving direction of the bonding head 32 and its vertical direction and the direction of rotation of the vertical axis center). )position. In the case where the relative positions of the bonding head 32 and the first layer sheet F1m are different, the bonding head 32 performs position alignment by using the position of the first layer sheet F1m as a specific reference position.
於第一轉台式機床11之第一貼合位置11c處,設置有用於進行第一貼合位置11c上液晶面板P之水平方向的位置校準之一對第三檢測攝影機36。於第一轉台式機床11之第二貼合位置11d處,設置有用於進行同一液晶面 板P之第二貼合位置11d上水平方向的位置校準之一對第四檢測攝影機37。各第三檢測攝影機36係各自拍攝例如液晶面板P之玻璃基板(第一基板P1)中之第17圖中左側的兩角部。各第四檢測攝影機37係各自拍攝例如液晶面板P之玻璃基板中之第17圖中左側的兩角部。 At the first bonding position 11c of the first rotary machine tool 11, one of the position detection alignments for performing the horizontal alignment of the liquid crystal panel P on the first bonding position 11c is performed. At the second bonding position 11d of the first rotary machine tool 11, the same liquid crystal surface is provided. One of the positional alignments in the horizontal direction on the second bonding position 11d of the board P is directed to the fourth detecting camera 37. Each of the third detecting cameras 36 captures, for example, the two corner portions on the left side in the seventeenth image of the glass substrate (first substrate P1) of the liquid crystal panel P. Each of the fourth detecting cameras 37 captures, for example, the two corner portions on the left side in Fig. 17 of the glass substrate of the liquid crystal panel P.
於第二轉台式機床16之第三貼合位置16c處,設置有用於進行液晶面板P之第三貼合位置16c上水平方向的位置校準之一對第五檢測攝影機38。各第五檢測攝影機38係各自拍攝例如液晶面板P之玻璃基板中之第17圖中左側的兩角部。各檢測攝影機(第一檢測攝影機34至第五檢測攝影機38)之檢測資料係傳送至控制裝置25。另外,亦可使用感測器代替各檢測攝影機(第一檢測攝影機34至第五檢測攝影機38)。 At the third bonding position 16c of the second rotary machine tool 16, a pair of fifth detection cameras 38 for performing positional alignment in the horizontal direction on the third bonding position 16c of the liquid crystal panel P are provided. Each of the fifth detecting cameras 38 captures, for example, the two corner portions on the left side in Fig. 17 of the glass substrate of the liquid crystal panel P. The detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38) is transmitted to the control device 25. Alternatively, a sensor may be used instead of each of the detecting cameras (the first detecting camera 34 to the fifth detecting camera 38).
於各轉台式機床(第一轉台式機床11與第二轉台式機床16)上,設置有載置液晶面板P且可進行其水平方向之位置校準的位置校準台39。位置校準台39係根據各檢測攝影機(第一檢測攝影機34至第五檢測攝影機38)之檢測資料,經由控制裝置25所驅動控制。藉此,可進行相對第一轉台式機床11與第二轉台式機床16(各貼合位置(第一貼合位置11c、第二貼合位置11d與第三貼合位置16c)的液晶面板P之位置校準。 A position alignment table 39 on which the liquid crystal panel P is placed and whose positional alignment in the horizontal direction can be performed is provided on each of the rotary machine tools (the first rotary machine tool 11 and the second rotary machine tool 16). The position calibration table 39 is driven and controlled by the control device 25 based on the detection data of each of the detection cameras (the first detection camera 34 to the fifth detection camera 38). Thereby, the liquid crystal panel P with respect to the first rotary machine tool 11 and the second rotary machine tool 16 (the respective bonding positions (the first bonding position 11c, the second bonding position 11d, and the third bonding position 16c) can be performed. Position calibration.
相對該液晶面板P,將經貼合頭32位置校準後的貼合層片F5(層片FXm)進行貼合,藉以抑制光學組件F1X之貼合偏差,可改善相對液晶面板P之光學組件F1X光軸方向的精度,提高光學顯示設備之色彩度及對比。 The laminated layer F5 (layer sheet FXm) which has been aligned with the position of the bonding head 32 is bonded to the liquid crystal panel P, whereby the bonding deviation of the optical component F1X is suppressed, and the optical component F1X of the liquid crystal panel P can be improved. The accuracy of the optical axis direction improves the color and contrast of the optical display device.
此處,構成光學組件層FX之偏光鏡薄膜係例如經二色性染料進行染色之聚乙烯醇(PVA)薄膜朝一軸延伸地形成。此時,由於延伸時會有聚乙烯醇(PVA)薄膜厚度之不均勻或二色性染料染色不均勻等,易造成於光學組件層 FX面內產生光軸方向偏差的情況。 Here, the polarizing film constituting the optical component layer FX is formed, for example, by a polyvinyl alcohol (PVA) film dyed with a dichroic dye toward one axis. At this time, since the thickness of the polyvinyl alcohol (PVA) film is uneven or the dyeing of the dichroic dye is uneven, it is easy to cause the optical component layer. The deviation of the optical axis direction occurs in the FX plane.
該處,本實施形態中,係根據預先儲存於儲存裝置24(參考第16圖)的光學組件層FX各部位中光軸面內分佈之檢查資料,使控制裝置25決定相對光學組件層FX的液晶面板P之貼合位置(相對貼合位置)。接著,各貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)係配合該貼合位置,相對從光學組件層FX切割出之層片FXm進行液晶面板P之位置校準,將液晶面板P貼合至層片FXm。 In this embodiment, the control device 25 determines the relative optical component layer FX based on the inspection data distributed in the optical axis plane in each portion of the optical component layer FX stored in the storage device 24 (refer to FIG. 16). The bonding position of the liquid crystal panel P (relative bonding position). Next, each of the bonding apparatuses (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) is fitted to the bonding position, and the liquid crystal panel is formed on the layer FXm cut out from the optical component layer FX. Position calibration of P, and the liquid crystal panel P is attached to the layer FXm.
相對液晶面板P之層片FXm的貼合位置(相對貼合位置)之決定方法係例如以下說明。 The method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P is as follows.
首先,如第19A圖所示,設定有光學組件層FX之寬度方向上的複數個檢查點CP,於各檢查點CP處檢測出光學組件層FX之光軸方向。檢測光軸的時點為料捲滾筒R1製造時;亦可為從料捲滾筒R1捲出光學組件層FX進行半切斷前之期間。光學組件層FX之光軸方向的資料係與光學組件層FX位置(光學組件層FX之長邊方向位置及寬度方向位置)資料連結地儲存於儲存裝置24(參考第16圖)。 First, as shown in FIG. 19A, a plurality of checkpoints CP in the width direction of the optical component layer FX are set, and the optical axis direction of the optical component layer FX is detected at each checkpoint CP. The time when the optical axis is detected is the time when the roll drum R1 is manufactured, or may be the period before the half of the optical component layer FX is unwound from the roll drum R1. The data in the optical axis direction of the optical component layer FX is stored in the storage device 24 in association with the position of the optical component layer FX (the position in the longitudinal direction and the width direction of the optical component layer FX) (refer to Fig. 16).
控制裝置25係從儲存裝置24取得各檢查點CP之光軸資料(光軸面內分佈之檢查資料),以檢測出切割出層片FXm之部分的光學組件層FX(以橫切線CL所劃分之區域)之平均光軸方向。 The control device 25 acquires the optical axis data (inspection data of the in-plane distribution of the optical axis) of each of the inspection points CP from the storage device 24 to detect the optical component layer FX (which is divided by the transverse line CL) of the portion in which the slice FXm is cut out. The average optical axis direction of the area).
例如,如第19B圖所示,每次於檢查點CP檢測出光軸方向與光學組件層FX之邊緣線EL所夾角度(偏移角),以該偏移角中最大角度(最大偏移角)作為θmax,最小角度(最小偏移角)作為θmin時,檢測出最大偏移角θmax與最小偏移角θmin的平均值θmid(=(θmax+θmin)/2)作為平均偏移角。接著,檢測出相對 光學組件層FX之邊緣線EL的平均偏移角θmid方向作為光學組件層FX之平均光軸方向。 For example, as shown in FIG. 19B, the angle (offset angle) between the optical axis direction and the edge line EL of the optical component layer FX is detected at the checkpoint CP each time, and the maximum angle (maximum offset angle) among the offset angles When θ max and the minimum angle (minimum offset angle) are taken as θ min , the average value θ mid (=(θ max +θ min )/2) of the maximum offset angle θ max and the minimum offset angle θ min is detected. As the average offset angle. Next, the average offset angle θ mid direction of the edge line EL with respect to the optical component layer FX is detected as the average optical axis direction of the optical component layer FX.
另外,該偏移角係例如以相對光學組件層FX之邊緣線EL的逆時針方向為正角度,順時針方向為負角度而加以算出。 Further, the offset angle is calculated, for example, by a counterclockwise direction with respect to the edge line EL of the optical component layer FX being a positive angle and a clockwise direction being a negative angle.
接著,依前述方法所檢測出之光學組件層FX的平均光軸方向,決定相對液晶面板P之層片FXm的貼合位置(相對貼合位置),使得相對液晶面板P之顯示區域P4的長邊或短邊呈目標角度。例如,根據設計規格將光學組件F1X之光軸方向設定為相對顯示區域P4的長邊或短邊呈90°之方向的情況中,光學組件層FX之平均光軸方向係相對顯示區域P4的長邊或短邊呈90°地,將層片FXm貼合液晶面板P。 Next, the bonding position (relative bonding position) of the layer sheet FXm with respect to the liquid crystal panel P is determined according to the average optical axis direction of the optical component layer FX detected by the above method, so that the display area P4 of the liquid crystal panel P is long. The edge or short side is at the target angle. For example, in the case where the optical axis direction of the optical component F1X is set to be 90° with respect to the long side or the short side of the display region P4 according to the design specification, the average optical axis direction of the optical component layer FX is longer than the display region P4. The layer FXm is bonded to the liquid crystal panel P with the side or the short side at 90°.
前述之切斷裝置(第一切斷裝置51與第二切斷裝置52)係以攝影機等檢測部檢測出液晶面板P之顯示區域P4外周緣,沿顯示區域P4外周緣不間斷地切斷貼合至液晶面板P之層片FXm。透過拍攝液晶面板P之端部、設置於液晶面板P之位置校準標誌、或設置於顯示區域P4之黑色矩陣最外緣等,來檢測出顯示區域P4之外周緣。於顯示區域P4之外側處,設置有特定寬度的邊框部G(參考第3圖),其係用於設置將液晶面板P之第一及第二基板接合之密封劑等,於該邊框部G之寬度內以切斷裝置(第一切斷裝置51與第二切斷裝置52)進行層片FXm之切斷(切斷線:WCL)。 The cutting device (the first cutting device 51 and the second cutting device 52) detects the outer peripheral edge of the display region P4 of the liquid crystal panel P by a detecting unit such as a camera, and cuts the patch continuously along the outer periphery of the display region P4. The layer FXm of the liquid crystal panel P is joined. The outer periphery of the display region P4 is detected by photographing the end portion of the liquid crystal panel P, the position alignment mark provided on the liquid crystal panel P, or the outermost edge of the black matrix provided in the display region P4. A frame portion G (refer to FIG. 3) having a specific width is provided on the outer side of the display region P4, and is used to provide a sealant or the like for bonding the first and second substrates of the liquid crystal panel P to the frame portion G. The cutting piece FXm is cut (cut line: WCL) by the cutting device (the first cutting device 51 and the second cutting device 52) in the width.
如以上說明,本實施形態之薄膜貼合系統1A,係具備:貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18),係將寬度較液晶面板P顯示區域P4之長邊與短邊中任一邊長度更寬的條狀光學組件層FX從料捲滾筒R1捲出,且以較顯示區域P4之長邊與短邊中另一邊長度更長地將光學組 件層FX切斷而形成層片FXm後,將層片FXm貼合至液晶面板P,以作為光學組件貼合體;以及切斷裝置(第一切斷裝置51與第二切斷裝置52),係從貼合至液晶面板P之層片FXm將配置於顯示區域P4之對向部分外側的剩餘部分切斷,以形成作為對應於顯示區域P4大小的光學組件F1X。因此,可設計使得光學組件F1X對應顯示區域P4時的精度較佳,縮小顯示區域P4外側之邊框部G(參考第3圖),達成顯示區域之擴大及機器之小型化的目的。 As described above, the film bonding system 1A of the present embodiment includes the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15 and the third bonding apparatus 18), and the width is higher than that of the liquid crystal panel P. The strip-shaped optical component layer FX having a longer length on either side of the long side and the short side of the display area P4 is unwound from the roll reel R1, and is longer than the other side of the longer side and the shorter side of the display area P4. Optical group After the layer FX is cut to form the layer sheet FXm, the layer sheet FXm is bonded to the liquid crystal panel P as an optical component bonding body; and the cutting device (the first cutting device 51 and the second cutting device 52), The remaining portion disposed outside the opposite portion of the display region P4 is cut from the layer FXm bonded to the liquid crystal panel P to form an optical component F1X corresponding to the size of the display region P4. Therefore, it is possible to design the optical unit F1X to correspond to the display area P4 with better precision, and to reduce the frame portion G outside the display area P4 (refer to FIG. 3), thereby achieving the purpose of expanding the display area and miniaturizing the device.
又,薄膜貼合系統1A具有控制裝置25,係根據光學組件層FX之光軸方向的檢查資料,決定液晶面板P與層片FXm的相對貼合位置。貼合頭32係根據控制裝置25所決定之相對貼合位置,將保持於保持面32a的層片FXm貼合至液晶面板P。因此,即使是在光學組件層FX面內存在有光軸方向之偏差的情況中,可對應光軸方向之偏差,適當地調整層片FXm與液晶面板P的相對貼合位置。藉此,可改善相對液晶面板P的光學組件F1X之光軸方向精度,提高光學顯示設備之色彩度及對比。 Moreover, the film bonding system 1A has the control device 25, and determines the relative bonding position of the liquid crystal panel P and the layer sheet FXm based on the inspection data of the optical axis direction of the optical component layer FX. The bonding head 32 bonds the layer sheet FXm held by the holding surface 32a to the liquid crystal panel P in accordance with the relative bonding position determined by the control device 25. Therefore, even when there is a deviation in the optical axis direction in the FX surface of the optical component layer, the relative bonding position of the layer FXm and the liquid crystal panel P can be appropriately adjusted in accordance with the deviation of the optical axis direction. Thereby, the optical axis direction accuracy of the optical component F1X with respect to the liquid crystal panel P can be improved, and the color degree and contrast of the optical display device can be improved.
又,薄膜貼合系統1A中,貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)具有:捲出部31a,係將光學組件層FX從料捲滾筒R1與分離層片F3a一同捲出;切斷部131b,係讓分離層片F3a殘留於光學組件層FX的狀態下,將光學組件層FX切斷以形成層片FXm;刀刃31c,係將層片FXm從分離層片F3a處剝離;以及貼合頭32,係將層片FXm貼附而保持於保持面32a處,且將保持於保持面32a之層片FXm貼合至液晶面板P。因此,易於進行層片FXm之連續貼合,可提高光學顯示設備之生產效率。又,使用具有圓弧狀的保持面32a作為貼合頭32者。因此,藉由圓弧狀的保持面32a之傾斜移動可平滑地保持層片FXm,且藉由同一圓弧狀的保持面32a之傾斜移動可 將層片FXm確實地貼合至液晶面板P。 Further, in the film bonding system 1A, the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) has a winding portion 31a for taking the optical component layer FX from the roll The roller R1 is unwound together with the separation layer sheet F3a; the cutting portion 131b is such that the separation layer sheet F3a remains in the optical module layer FX, and the optical component layer FX is cut to form the layer sheet FXm; the blade edge 31c is The layer sheet FXm is peeled off from the separation layer sheet F3a, and the bonding head 32 is attached to the holding surface 32a by attaching the layer sheet FXm, and the layer sheet FXm held on the holding surface 32a is bonded to the liquid crystal panel P. Therefore, the continuous bonding of the layer sheets FXm is facilitated, and the production efficiency of the optical display device can be improved. Further, a retaining surface 32a having an arc shape is used as the bonding head 32. Therefore, the layer FXm can be smoothly held by the oblique movement of the arc-shaped holding surface 32a, and the tilting movement of the same arc-shaped holding surface 32a can be performed. The layer sheet FXm is surely attached to the liquid crystal panel P.
又,薄膜貼合系統1A中,刀刃31c係於液晶面板P之貼合面朝向下方地,將光學組件F1X從分離層片F3a處剝離,貼合頭32係將貼合面與反對側之上側面貼附而保持於保持面32a處,讓貼合面朝向下方的狀態下,在剝離位置與貼合位置之間進行移動。因此,黏著層F2a側之貼合面朝向下方地搬送光學組件層FX,可抑制光學組件層FX之貼合面的刮痕或異物之附著等,可抑制貼合不良的發生。 Further, in the film bonding system 1A, the blade 31c is directed downward from the bonding surface of the liquid crystal panel P, and the optical module F1X is peeled off from the separation layer F3a, and the bonding head 32 is attached to the bonding surface and the opposing side. The side surface is attached to the holding surface 32a, and the bonding surface is directed downward, and is moved between the peeling position and the bonding position. Therefore, the optical component layer FX is conveyed downward by the bonding surface of the adhesive layer F2a side, and the scratch of the bonding surface of the optical component layer FX, the adhesion of a foreign material, etc. can be suppressed, and the occurrence of a bonding defect can be suppressed.
又,薄膜貼合系統1A係具備轉台式機床(第一轉台式機床11與第二轉台式機床16),其係讓液晶面板P移動至搬入位置(各轉台初始位置(第一轉台初始位置11a與第二轉台初始位置16a))、貼合位置(各貼合位置(第一貼合位置11c、第二貼合位置11d與第三貼合位置16c)及搬出位置(各轉台終點位置(第一轉台終點位置11b與第二轉台終點位置16b))。因此,液晶面板P可有效率地切換搬送方向,且轉台式機床(第一轉台式機床11與第二轉台式機床16)亦可作為生產線之一部分而可抑制生產線長度,可提高系統之設置自由度。 Further, the film bonding system 1A includes a rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) for moving the liquid crystal panel P to the loading position (the initial position of each turntable (the first turntable initial position 11a) And the second turntable initial position 16a)) and the bonding position (each bonding position (first bonding position 11c, second bonding position 11d, and third bonding position 16c) and the carrying-out position (each turntable end position (first) a turntable end position 11b and a second turntable end position 16b)). Therefore, the liquid crystal panel P can efficiently switch the transport direction, and the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) can also function as One part of the production line can suppress the length of the production line, which can increase the freedom of installation of the system.
又,薄膜貼合系統1A中,貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)具有檢測印於光學組件層FX之缺陷標誌的檢測部(第一檢測攝影機34),檢測出有光學組件層FX之缺陷標誌的部位會保持於貼合頭32並搬送至捨棄位置(廢棄位置)。因此,可提供一種提升光學顯示設備之產率比、生產率佳的光學顯示設備之生產系統。 Further, in the film bonding system 1A, the bonding apparatus (the first bonding apparatus 13, the second bonding apparatus 15, and the third bonding apparatus 18) has a detecting unit that detects a defect mark printed on the optical component layer FX (No. Upon detecting the camera 34), the portion where the defect mark of the optical component layer FX is detected is held by the bonding head 32 and transported to the discarded position (discarded position). Therefore, it is possible to provide a production system of an optical display device which improves the yield ratio of an optical display device and which is excellent in productivity.
又,薄膜貼合系統1A中,第一切斷裝置51及第二切斷裝置52係雷射切割機,第一切斷裝置51及第二切斷裝置52係連接至同一雷射輸出裝置53,從雷射輸出裝置53所輸出之雷射係分歧而供給至第一切斷裝置51及第 二切斷裝置52。因此,與第一切斷裝置51和第二切斷裝置52各自連接至各別雷射輸出裝置的情況相比,可達成光學顯示設備之生產系統小型化的目的。 Further, in the film bonding system 1A, the first cutting device 51 and the second cutting device 52 are laser cutting machines, and the first cutting device 51 and the second cutting device 52 are connected to the same laser output device 53. The laser output from the laser output device 53 is supplied to the first cutting device 51 and the first Second cutting device 52. Therefore, compared with the case where the first cutting device 51 and the second cutting device 52 are each connected to the respective laser output devices, the purpose of miniaturizing the production system of the optical display device can be achieved.
第20圖係顯示第三實施形態之薄膜貼合系統2的示意結構圖。 Fig. 20 is a schematic structural view showing a film bonding system 2 of the third embodiment.
本實施形態與第二實施形態相異之處為第一光學組件層F1之搬送方向、第二光學組件層F2之搬送方向與第三光學組件層F3之搬送方向相互平行。因此,本實施形態中與第二實施形態相同結構者則賦予相同元件符號並省略詳細說明。 The present embodiment differs from the second embodiment in that the transport direction of the first optical component layer F1, the transport direction of the second optical component layer F2, and the transport direction of the third optical component layer F3 are parallel to each other. Therefore, in the embodiment, the same components as those in the second embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.
另外,第20圖中係顯示轉台式機床(第一轉台式機床11與第二轉台式機床16)及配置於其周邊部分之貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)的示意結構。第20圖中省略第17圖所示之主輸送設備5、副輸送設備(第一副輸送設備6與第二副輸送設備7)及薄膜剝離裝置14等。第20圖中,第一光學組件層F1、第二光學組件層F2及第三光學組件層F3所示之箭頭係顯示各光學組件層(第一光學組件層F1、第二光學組件層F2與第三光學組件層F3)的平均光軸方向,符號140係顯示將包含缺陷之貼合層片廢棄的捨棄位置(廢棄位置)。 In addition, in FIG. 20, the rotary machine tool (the first rotary machine tool 11 and the second rotary machine tool 16) and the bonding device disposed on the peripheral portion thereof (the first bonding device 13 and the second bonding device 15) are shown. Schematic structure with the third bonding device 18). In Fig. 20, the main conveying device 5, the sub conveying device (the first sub conveying device 6 and the second sub conveying device 7), the film peeling device 14, and the like shown in Fig. 17 are omitted. In Fig. 20, the arrows indicated by the first optical component layer F1, the second optical component layer F2, and the third optical component layer F3 show the optical component layers (the first optical component layer F1 and the second optical component layer F2). The average optical axis direction of the third optical component layer F3), and reference numeral 140, shows the discarded position (discarded position) in which the bonded laminated sheet containing the defect is discarded.
第17圖所示的第二實施形態之薄膜貼合系統1A中,彼此結構相同的二個貼合裝置(第一貼合裝置13與第二貼合裝置15)係設置於第一轉台式機床11圓周上相距90°度角的位置。因此,具備各貼合裝置(第一貼合裝置13與第二貼合裝置15)的層片搬送裝置之搬送方向係相互呈垂直,在二方向上形成長層片搬送生產線。 In the film bonding system 1A of the second embodiment shown in Fig. 17, two bonding devices (the first bonding device 13 and the second bonding device 15) having the same configuration are provided on the first rotary machine tool. 11 positions on the circumference at an angle of 90°. Therefore, the conveyance directions of the layer conveyance apparatuses provided with the respective bonding apparatuses (the first bonding apparatus 13 and the second bonding apparatus 15) are perpendicular to each other, and the long layer sheet conveying production line is formed in both directions.
對此,第20圖所示的本實施形態之薄膜貼合系統2中,第一貼 合裝置13的層片搬送裝置之搬送方向、第二貼合裝置15的層片搬送裝置之搬送方向與第三貼合裝置18的層片搬送裝置之搬送方向呈平行。因此,具備各貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)的層片搬送裝置之搬送方向係呈相互平行地,僅在一方向上形成長層片搬送生產線。 On the other hand, in the film bonding system 2 of the embodiment shown in Fig. 20, the first sticker The conveying direction of the layer conveying device of the joining device 13 and the conveying direction of the layer conveying device of the second bonding device 15 are parallel to the conveying direction of the layer conveying device of the third bonding device 18. Therefore, the conveying direction of the layer conveying apparatus including the respective bonding apparatuses (the first bonding apparatus 13, the second bonding apparatus 15 and the third bonding apparatus 18) is parallel to each other, and only a long layer is formed in one direction. The film is transported to the production line.
例如,第20圖之範例中,第一光學組件層F1係於垂直第一轉台式機床11之迴轉中心與第一貼合位置11c的結合方向上進行搬送。切斷部131b所切割出之第一層片F1m係藉由貼合頭32搬送至與第一光學組件層F1搬送方向垂直的方向上,於第一貼合位置11c處貼合至液晶面板P的正/反面中一側之面。 For example, in the example of Fig. 20, the first optical component layer F1 is transported in the joining direction of the center of rotation of the vertical first rotary machine tool 11 and the first bonding position 11c. The first layer sheet F1 m cut by the cutting portion 131 b is conveyed to the liquid crystal panel P at the first bonding position 11 c by the bonding head 32 in a direction perpendicular to the conveying direction of the first optical module layer F1. The side of the side of the positive/negative side.
第二光學組件層F2係於平行第一轉台式機床11之迴轉中心與第二貼合位置11e的結合方向上進行搬送。切斷部131b所切割出之第二層片F2m係藉由貼合頭32搬送至與第二光學組件層F2方向平行的方向上,於第二貼合位置11e處貼合至第一光學組件貼合體PA1的第一層片F1m側之面。 The second optical component layer F2 is transported in a direction in which the center of rotation of the first rotary table machine 11 and the second bonding position 11e are coupled. The second layer sheet F2 m cut by the cutting portion 131b is conveyed by the bonding head 32 in a direction parallel to the direction of the second optical component layer F2, and bonded to the first optical component at the second bonding position 11e. The surface of the first layer sheet F1m side of the bonded body PA1 is bonded.
第三光學組件層F3係於平行第二轉台式機床16之迴轉中心與第三貼合位置16c的結合方向上進行搬送。切斷部131b所切割出之第三層片F3m係藉由貼合頭32搬送至與第三光學組件層F3之搬送方向平行的方向上,於第三貼合位置16c處貼合至液晶面板P之另一面。 The third optical component layer F3 is conveyed in a joining direction of the center of rotation of the parallel second rotary machine tool 16 and the third bonding position 16c. The third layer piece F3 m cut by the cutting portion 131b is conveyed to the liquid crystal panel at the third bonding position 16c by the bonding head 32 in the direction parallel to the conveying direction of the third optical component layer F3. The other side of P.
前述本實施形態之薄膜貼合系統2中,由各貼合裝置(第一貼合裝置13、第二貼合裝置15與第三貼合裝置18)之層片搬送裝置31所搬送的各光學組件層FX之搬送方向係相互平行。因此,與各別地設定各光學組件層FX之搬送方向的情況相比,可達成光學顯示設備之生產系統小型化的目的。 In the film bonding system 2 of the present embodiment, each of the opticals transported by the layer transfer device 31 of each of the bonding devices (the first bonding device 13, the second bonding device 15, and the third bonding device 18) The conveying directions of the component layers FX are parallel to each other. Therefore, the purpose of miniaturizing the production system of the optical display device can be achieved as compared with the case where the transport direction of each optical component layer FX is set separately.
第21圖係適用於第四實施形態薄膜貼合系統之貼合裝置的示意圖。 Fig. 21 is a schematic view of a bonding apparatus applied to the film bonding system of the fourth embodiment.
第21(a)圖係將層片FXm保持於貼合頭60之狀態的示意圖,第21(b)圖係將層片FXm貼合至液晶面板P之狀態的示意圖。 Fig. 21(a) is a schematic view showing a state in which the layer sheet FXm is held by the bonding head 60, and Fig. 21(b) is a view showing a state in which the layer sheet FXm is bonded to the liquid crystal panel P.
本實施形態與第二實施形態相異之處為,相對於第二實施形態之貼合裝置所使用之具有圓弧狀的保持面32a之貼合頭32,本實施形態之貼合裝置係使用具有平面狀之保持面60a的貼合頭60。因此,此處係以貼合頭60之結構為主進行說明,與第二實施形態共通之結構元件賦予相同元件符號並省略詳細說明。 The present embodiment differs from the second embodiment in that the bonding head 32 having the arc-shaped holding surface 32a used in the bonding apparatus of the second embodiment is used in the bonding apparatus of the present embodiment. A bonding head 60 having a planar holding surface 60a. Therefore, the structure of the bonding head 60 is mainly described here, and the same components as those of the second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
本實施形態之貼合裝置具有:貼合頭60;貼合滾筒62;支撐貼合頭60及貼合滾筒62的導桿61;以及相對液晶面板P使導桿61呈傾斜移動之狀態下進行水平移動的驅動裝置(圖中未顯示)。雖然圖式中未顯示,但於本實施形態之貼合裝置處,設置有與第18圖所示相同的捲出部、切斷部及刀刃(剝離部)。 The bonding apparatus of the present embodiment includes a bonding head 60, a bonding roller 62, a guide bar 61 that supports the bonding head 60 and the bonding roller 62, and a state in which the guiding rod 61 is tilted with respect to the liquid crystal panel P. Horizontally moving drive (not shown). Although not shown in the drawings, the unwinding portion, the cutting portion, and the blade (peeling portion) which are the same as those shown in Fig. 18 are provided in the bonding apparatus of the present embodiment.
貼合頭60係具有保持從分離層片處剝離之層片FXm的平面狀之保持面60a。保持面60a係透過導桿61之傾斜移動,而相對液晶面板P呈傾斜。層片FXm之一端部突出於保持面60a外側地進行定位,以吸附於保持面60a。層片FXm之吸附力較弱,因此層片FXm在保持於保持面60a之狀態下,可平滑地在保持面60a上進行水平方向移動。 The bonding head 60 has a planar holding surface 60a that holds the layer sheet FXm peeled off from the separation layer sheet. The holding surface 60a is inclined by the guide rod 61 and inclined with respect to the liquid crystal panel P. One end of the layer FXm protrudes outside the holding surface 60a to be positioned to be adsorbed to the holding surface 60a. Since the adsorption force of the layer sheet FXm is weak, the layer sheet FXm can smoothly move in the horizontal direction on the holding surface 60a while being held by the holding surface 60a.
貼合滾筒62係配置於貼合頭60之側面,貼附液晶面板P並黏著從貼合頭60之保持面60a突出的層片FXm。該狀態下,藉由驅動裝置(圖中未顯示)使導桿61在水平方向上移動時,在層片FXm之一端部黏著於液晶面板P之狀態下,貼合頭60及貼合滾筒62係從層片FXm之一端部側朝向另一端部側進行水平移動。藉此,層片FXm係藉由貼合滾筒62從一端部側緩緩地貼合 至液晶面板P。 The bonding roller 62 is disposed on the side surface of the bonding head 60, and the liquid crystal panel P is attached thereto and adheres to the layer FXm protruding from the holding surface 60a of the bonding head 60. In this state, when the guide rod 61 is moved in the horizontal direction by a driving device (not shown), the bonding head 60 and the bonding roller 62 are adhered to the liquid crystal panel P in a state where one end portion of the layer FXm is adhered to the liquid crystal panel P. The horizontal movement is performed from one end side of the layer FXm toward the other end side. Thereby, the layer sheet FXm is gradually attached from the one end side by the bonding roller 62. To the liquid crystal panel P.
貼合頭60係將保持於保持面60a之層片FXm,藉由水平方向之貼合頭之移動方向及其垂直方向、以及迴轉方向上進行位置校準。層片FXm與液晶面板P之貼合位置(相對貼合位置)係與第二實施形態同樣地,根據光學組件層FX之光軸方向的檢查資料,由控制裝置25(參考第16圖)進行決定。貼合頭60係根據控制裝置25所決定之相對貼合位置,將保持於保持面60a之層片FXm貼合至液晶面板P。 The bonding head 60 is held by the layer FXm of the holding surface 60a, and is aligned by the moving direction of the bonding head in the horizontal direction, the vertical direction thereof, and the rotation direction. The bonding position (relative bonding position) of the layer FXm and the liquid crystal panel P is performed by the control device 25 (refer to Fig. 16) based on the inspection data in the optical axis direction of the optical module layer FX as in the second embodiment. Decide. The bonding head 60 is bonded to the liquid crystal panel P by the layer sheet FXm held by the holding surface 60a in accordance with the relative bonding position determined by the control device 25.
因此,本實施形態中,可提供一種顯示縮小區域周邊之邊框部,達成顯示區域之擴大及機器之小型化的目的之光學顯示設備之生產系統。 Therefore, in the present embodiment, it is possible to provide a production system of an optical display device which is intended to display a frame portion around the reduced area, and to achieve an enlargement of the display area and miniaturization of the device.
前述實施形態中,雖使用二氧化碳(CO2)雷射切斷機作為切斷裝置(第一切斷裝置51與第二切斷裝置52)之一範例,但切斷裝置(第一切斷裝置51與第二切斷裝置52)並不限定於此。亦可使用切斷刀片等其它切斷部作為切斷裝置(第一切斷裝置51與第二切斷裝置52)。 In the above embodiment, a carbon dioxide (CO 2 ) laser cutting machine is used as an example of the cutting device (the first cutting device 51 and the second cutting device 52), but the cutting device (the first cutting device) The 51 and the second cutting device 52) are not limited thereto. Other cutting portions such as a cutting blade may be used as the cutting device (the first cutting device 51 and the second cutting device 52).
例如,如第22圖所示,第一基板P1的外周緣之三個側邊沿著相對應之第二基板P2之三邊的同時,其外周緣剩餘之一邊則較相對應的第二基板P2之一邊朝外側延伸的情況,第二基板P2之大小係與顯示區域P4之大小概略一致。因此,只要切斷刀片沿第二基板P2外周圍進行移動,便可讓接合至第二基板P2之第三層片F3m形成對應於顯示區域P4大小的第三光學組件F13。 For example, as shown in FIG. 22, the three sides of the outer periphery of the first substrate P1 are along the three sides of the corresponding second substrate P2, and the remaining side of the outer periphery is the corresponding second substrate. When one of the sides of P2 extends outward, the size of the second substrate P2 is substantially the same as the size of the display area P4. Therefore, as long as the cutting blade moves along the outer periphery of the second substrate P2, the third layer F3m joined to the second substrate P2 can be formed into the third optical component F13 corresponding to the size of the display region P4.
該情況,液晶面板P之剩餘部分幾乎沒有黏著於液晶面板P之面,第三光學組件F13與其周邊之剩餘部分係概略地僅以黏著層F2a之黏著力進行黏合。因此,將第三層片F3m之剩餘部分從液晶面板P處進行剝離回收的 裝置,亦只需為夾住剩餘部分之端部並拉出的簡單結構即可,裝置結構簡單。又,前述實施形態中,層片(第一層片F1m與第二層片F2m)之剩餘部分與第三層片F3m之剩餘部分係以不同步驟從液晶面板P處進行剝離回收。但是,於本實施形態中,第三層片F3m之剩餘部分的回收係非常地容易,因此在將層片(第一層片F1m與第二層片F2m)之剩餘部分從液晶面板P處進行剝離回收時,亦可將第三層片F3m之剩餘部分從液晶面板P處一併剝離回收。該情況,由於不需在二個部位設置剩餘部分之剝離裝置,因此可使得光學顯示設備之生產系統小型化。 In this case, the remaining portion of the liquid crystal panel P hardly adheres to the surface of the liquid crystal panel P, and the third optical component F13 and the remaining portion of the periphery thereof are roughly bonded only by the adhesive force of the adhesive layer F2a. Therefore, the remaining portion of the third layer sheet F3m is peeled off from the liquid crystal panel P. The device can also be simply configured to clamp the end of the remaining portion and pull out, and the device has a simple structure. Further, in the above embodiment, the remaining portions of the plies (the first ply F1m and the second ply Fm) and the remaining portions of the third ply F3m are peeled off from the liquid crystal panel P in different steps. However, in the present embodiment, the recovery of the remaining portion of the third layer sheet F3m is extremely easy, and therefore the remaining portions of the layer sheets (the first layer sheet F1m and the second layer sheet F2m) are made from the liquid crystal panel P. In the case of peeling and recycling, the remaining portion of the third layer sheet F3m may be collectively peeled off from the liquid crystal panel P. In this case, since the peeling means of the remaining portion is not required to be provided at two places, the production system of the optical display device can be miniaturized.
前述實施形態中,相對液晶面板P之層片FXm的貼合位置(相對貼合位置)之決定方法,係說明了使用光學組件層FX之面內平均光軸方向的方法。前述實施形態中,以光學組件層FX之面內最大偏移角θmax與最小偏移角θmin的平均值θmid作為平均偏移角的情況中,係檢測出相對光學組件層FX邊緣線與平均偏移角θmid所夾方向,作為光學組件層FX之面內平均光軸方向。但是,光學組件層FX之面內平均光軸方向的檢出方法並不限定於此。 In the above-described embodiment, a method of determining the in-plane average optical axis direction of the optical module layer FX is described with respect to the method of determining the bonding position (relative bonding position) of the layer sheet FXm of the liquid crystal panel P. In the above embodiment, in the case where the average deviation angle θ max of the in-plane of the optical component layer FX and the average value θ mid of the minimum offset angle θ min are taken as the average offset angle, the edge line of the relative optical component layer FX is detected. The direction in which the average offset angle θ mid is sandwiched is the in-plane average optical axis direction of the optical component layer FX. However, the method of detecting the in-plane average optical axis direction of the optical component layer FX is not limited to this.
例如,從光學組件層FX之寬度方向上設定的複數個檢查點CP(參考第19A圖)中選擇一個或複數個檢查點CP,對每一個所選擇之檢查點CP,檢測出光軸方向與光學組件層FX之邊緣線EL所夾角度度(偏移角)。接著,檢測出所選擇之一個或複數個檢查點CP之光軸方向的偏移角平均值,作為平均偏移角,亦可檢測出相對光學組件層FX之邊緣線EL與該平均偏移角所夾方向,作為光學組件層FX之平均光軸方向。 For example, one or a plurality of checkpoints CP are selected from a plurality of checkpoints CP (refer to FIG. 19A) set in the width direction of the optical component layer FX, and the optical axis direction and the optical are detected for each of the selected checkpoints CP. The angle (offset angle) of the edge line EL of the component layer FX. Then, an average value of the offset angles of the selected one or a plurality of checkpoints CP in the optical axis direction is detected. As the average offset angle, the edge line EL of the optical component layer FX and the average offset angle can also be detected. The direction of the clip is the average optical axis direction of the optical component layer FX.
以上,雖參考所附加之圖面說明了關於本發明的合適實施形態 例,當然關於本發明之範例並不限定於此。上述範例中所示之各結構組件的各種形狀或組合等係為一範例,於不偏離本發明之主旨的範圍內根據設計要求等的各種變化皆為可能,可運用適當地加以組合。 Hereinabove, a suitable embodiment of the present invention has been described with reference to the attached drawings. For example, of course, the examples of the present invention are not limited thereto. The various shapes and combinations of the structural components shown in the above examples are merely examples, and various changes in design requirements and the like are possible without departing from the gist of the present invention, and may be appropriately combined.
1‧‧‧薄膜貼合系統 1‧‧‧Film bonding system
5‧‧‧主輸送設備 5‧‧‧Main conveying equipment
5a‧‧‧起點 5a‧‧‧ starting point
5b‧‧‧終點 5b‧‧‧end point
6‧‧‧第一副輸送設備 6‧‧‧First delivery equipment
6a‧‧‧第一初始位置 6a‧‧‧First initial position
6b‧‧‧第一終點位置 6b‧‧‧first end position
7‧‧‧第二副輸送設備 7‧‧‧Second secondary conveyor
7a‧‧‧第二初始位置 7a‧‧‧ second initial position
7b‧‧‧第二終點位置 7b‧‧‧second end position
8‧‧‧第一搬送裝置 8‧‧‧First transport device
9‧‧‧洗淨裝置 9‧‧‧cleaning device
11‧‧‧第一轉台式機床 11‧‧‧First rotary machine tool
11a‧‧‧第一轉台初始位置 11a‧‧‧ Initial position of the first turntable
11b‧‧‧第一轉台終點位置 11b‧‧‧First turntable end position
11c‧‧‧第一貼合位置 11c‧‧‧First fit position
11d‧‧‧第二貼合位置 11d‧‧‧Second fitting position
11e‧‧‧薄膜剝離位置 11e‧‧‧film stripping position
12‧‧‧第二搬送裝置 12‧‧‧Second transport device
13‧‧‧第一貼合裝置 13‧‧‧First bonding device
14‧‧‧薄膜剝離裝置 14‧‧‧film stripping device
15‧‧‧第二貼合裝置 15‧‧‧Second laminating device
16‧‧‧第二轉台式機床 16‧‧‧Second rotary machine tool
16a‧‧‧第二轉台初始位置 16a‧‧‧Second turntable initial position
16b‧‧‧第二轉台終點位置 16b‧‧‧second turntable end position
16c‧‧‧第三貼合位置 16c‧‧‧ third fit position
16d‧‧‧貼合檢查位置 16d‧‧‧Finished inspection position
17‧‧‧第三搬送裝置 17‧‧‧ Third transport device
18‧‧‧第三貼合裝置 18‧‧‧ Third bonding device
19‧‧‧檢查裝置 19‧‧‧Checking device
21‧‧‧第四搬送裝置 21‧‧‧fourth transport device
22‧‧‧第五搬送裝置 22‧‧‧ fifth transport device
24‧‧‧儲存裝置 24‧‧‧Storage device
25‧‧‧控制裝置 25‧‧‧Control device
31‧‧‧層片搬送裝置 31‧‧‧Ply conveying device
31c‧‧‧刀刃 31c‧‧‧ Blade
32‧‧‧貼合頭 32‧‧‧Fitting head
33‧‧‧驅動裝置 33‧‧‧ drive
F‧‧‧搬送方向 F‧‧‧Transfer direction
F1‧‧‧第一光學組件層 F1‧‧‧First optical component layer
F2‧‧‧第二光學組件層 F2‧‧‧Second optical component layer
F3‧‧‧第三光學組件層 F3‧‧‧ third optical component layer
P‧‧‧液晶面板 P‧‧‧ LCD panel
R1‧‧‧料捲滾筒 R1‧‧‧ Roller
R2‧‧‧分離滾筒 R2‧‧‧Separation roller
Claims (27)
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JP2012042840 | 2012-02-29 | ||
JP2012084832 | 2012-04-03 |
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TW102106186A TWI537113B (en) | 2012-02-29 | 2013-02-22 | Manufacturing system of optical display device and manufacturing method of optical display device |
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JP (1) | JP5618283B2 (en) |
KR (1) | KR101608164B1 (en) |
CN (1) | CN104145211B (en) |
TW (1) | TWI537113B (en) |
WO (1) | WO2013129219A1 (en) |
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JP6146921B2 (en) * | 2014-12-02 | 2017-06-14 | 日東電工株式会社 | Optical film manufacturing method and manufacturing apparatus |
JP2019087566A (en) * | 2017-11-02 | 2019-06-06 | Liande・J・R&D株式会社 | Support equipment, and sticking system including the same |
KR102241016B1 (en) * | 2020-01-30 | 2021-04-28 | 주식회사 제이스텍 | Inspection process method of display laser cutting equipment |
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JP2001133607A (en) * | 1999-08-25 | 2001-05-18 | Sumitomo Chem Co Ltd | Light scattering layer, light scattering plate, color filter and liquid crystal display device utilizing them |
JP2003107452A (en) * | 2001-09-17 | 2003-04-09 | Internatl Business Mach Corp <Ibm> | Method of manufacturing liquid crystal display panel, method of manufacturing liquid crystal display device, and device for manufacturing the liquid crystal display device |
JP4342829B2 (en) * | 2003-05-01 | 2009-10-14 | 富士フイルム株式会社 | Optical film sticking device, method and substrate |
JP4371709B2 (en) * | 2003-06-05 | 2009-11-25 | 富士フイルム株式会社 | Optical film sticking apparatus and method |
JP2006259542A (en) * | 2005-03-18 | 2006-09-28 | Sharp Corp | Method for manufacturing liquid crystal display panel |
WO2006129523A1 (en) * | 2005-05-30 | 2006-12-07 | Sharp Kabushiki Kaisha | Liquid crystal display device manufacturing method and liquid crystal display device manufacturing device |
JP5299736B2 (en) * | 2007-09-04 | 2013-09-25 | Nltテクノロジー株式会社 | Film sticking device |
JP4855493B2 (en) * | 2008-04-14 | 2012-01-18 | 日東電工株式会社 | Optical display device manufacturing system and optical display device manufacturing method |
JP4406043B2 (en) * | 2008-04-16 | 2010-01-27 | 日東電工株式会社 | Roll original fabric set and method for manufacturing roll original fabric |
JP2010175611A (en) * | 2009-01-27 | 2010-08-12 | Seiko Instruments Inc | Method for manufacturing liquid crystal display device |
JP2011123146A (en) * | 2009-12-09 | 2011-06-23 | Yodogawa Medekku Kk | Polarizing plate-sticking device and polarizing plate-sticking method using the device |
TWI441703B (en) * | 2011-11-21 | 2014-06-21 | Sumitomo Chemical Co | Manufacturing system of optical component pasted material, manufacturing method and computer-readable recording medium |
JP5280581B2 (en) * | 2011-11-21 | 2013-09-04 | 住友化学株式会社 | Manufacturing system, manufacturing method and recording medium for optical member bonded body |
JP5924726B2 (en) * | 2011-12-12 | 2016-05-25 | 住友化学株式会社 | Manufacturing apparatus and manufacturing method of optical member bonded body |
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- 2013-02-21 KR KR1020147023397A patent/KR101608164B1/en not_active Expired - Fee Related
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- 2013-02-21 JP JP2013543458A patent/JP5618283B2/en not_active Expired - Fee Related
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JPWO2013129219A1 (en) | 2015-07-30 |
CN104145211A (en) | 2014-11-12 |
JP5618283B2 (en) | 2014-11-05 |
CN104145211B (en) | 2017-03-29 |
TWI537113B (en) | 2016-06-11 |
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