TW201339597A - Integrated circuits probe card having a thermometer apparatus for probes - Google Patents

Abstract

A probe card for integrated circuit devices includes a circuit board, at least one cantilever probe, a temperature sensing apparatus and at least one supporting structure. The circuit board includes at least one first electrical via and a plurality of second electrical via. The temperature sensing apparatus is disposed on the at least one supporting structure for sensing a temperature. The temperature sensing apparatus is configured to couple the plurality of second electrical via. The at least one cantilever is configured to couple the at least one first electrical via. The at least one supporting structure is disposed on the circuit board to support the at least one cantilever probe.

Description

Integrated circuit test card with temperature sensing element

The present invention relates to an integrated circuit test card, and more particularly to an integrated circuit test card having a temperature sensing element.

In general, integrated circuit components on a wafer must first be tested for electrical characteristics to determine if the integrated circuit components are good. A good integrated circuit will be selected for subsequent packaging processes, and defective products will be discarded to avoid additional packaging costs. The completed integrated circuit component must be subjected to another electrical test to screen out the defective package, thereby improving the final product yield. In other words, the integrated circuit component must be tested for electrical characteristics several times during the manufacturing process.

The integrated circuit test card is manufactured according to the specifications of the component to be tested, such as the pin count, the pitch, the pad size, and the probe depth set by the measuring machine. Body circuit test card. When the electrical measurement of the device to be tested is performed, the test signal of the measuring device is transmitted to the device under test by the probe of the integrated circuit test card, and the measured electrical parameters are transmitted back to the measuring machine. Taiwan for electrical analysis.

However, in the process of measuring the integrated circuit, the ambient temperature of the machine increases as the frequency of use of the machine increases. Further, when measuring the integrated circuit, more measurement errors are generated. In particular, when measuring an integrated circuit with an analog circuit, the ambient temperature of the machine increases, which causes a large error in the measured data, and increases the defective product of the integrated circuit.

One embodiment of the present invention discloses an integrated circuit test card comprising a circuit board, at least one cantilever probe, at least one support structure, and a temperature sensing element. In an embodiment of the disclosure, the circuit board includes at least one first electrical via and a plurality of second electrical vias, and the at least one support structure is disposed on the circuit board to support the at least one cantilever probe The temperature sensing component is disposed on the at least one support structure to sense a temperature, and is configured to couple the plurality of second electrical vias.

An embodiment of the invention discloses an integrated circuit test card comprising a circuit board, at least a vertical probe, a support structure and a temperature sensing element. In an embodiment of the disclosure, the circuit board includes at least one first electrical via and a plurality of second electrical vias, the at least one vertical probe configured to couple the at least one first Sexual vias. The at least one support structure is disposed on the circuit board to support the at least upright probe. The temperature sensing component is disposed on the at least one support structure to sense a temperature, and is configured to couple the plurality of second electrical vias.

The technical features of the present disclosure have been briefly described above, so that a detailed description of the present disclosure will be better understood. Other technical features that form the subject matter of the claims of the present disclosure will be described below. It is to be understood by those of ordinary skill in the art that the present invention disclosed herein may be It is also to be understood by those of ordinary skill in the art that this invention is not limited to the spirit and scope of the disclosure disclosed in the appended claims.

1 and 2 illustrate an integrated circuit test card 40 according to an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view taken along line 1-1 of FIG. The integrated circuit test card 40 includes a circuit board 42, at least one support structure 44, at least one cantilever probe 46, an adhesive 48, and a temperature sensing element 43. The at least one supporting structure 44 is disposed on the circuit board 42 to support the cantilever probe 46. The circuit board 42 includes at least one first electrical via hole 33 and a plurality of second electrical via holes 33 ′. A cantilever probe 46 is configured to couple the at least one electrical via 33 of the circuit board 42 . The at least one cantilever probe 46 further has a tip 47 . The tip 47 is configured to contact a wafer to be tested.

The temperature sensing component 43 is disposed on the at least one support structure 44 to sense a temperature that is configured to couple the plurality of second electrical vias 33 ′ via the wires 35 . This temperature is the ambient temperature at which the wafer is measured. The temperature sensing component 43 can include a thermistor, a resistance temperature detector, or a thermal transducer. The adhesive 48 secures the at least one cantilevered probe 46 to the at least one support structure 44. The at least one cantilevered probe 46, the at least one electrical via 33 of the circuit board 42 and the wire 31 coupled to the at least one electrical via 33 form an electrical signal conducting path. The temperature sensing component 43 , the plurality of second electrical vias 33 ′ of the circuit board 42 , the wires 35 , and the wires 31 coupled to the plurality of second electrical vias 33 ′ form a sense of temperature The electrical signal transmission path. The circuit board 42 has a central opening 42' that is a support ring that surrounds the central opening 42'.

3 and 4 illustrate an integrated circuit test card 60 according to another embodiment of the present invention, and FIG. 4 is a partial cross-sectional view taken along line 2-2 of FIG. The integrated circuit test card 60 includes a circuit board 61, a support structure 81, a temperature sensing element 73, and at least an upright vertical probe 76. The support structure 81 has an upper guiding plate 83 and a lower guiding plate 87, and the supporting structure 81 is disposed on the circuit board 61 to support the vertical probe 76. The circuit board 61 includes at least one first electrical property. The via hole 63 and the plurality of second electrical via holes 63' are electrically conductive vias, and the at least upright probe 76 has a tip portion 77 configured to contact a wafer to be tested, the at least standing upright The probe 76 is configured to couple the at least one first electrical via 63. The at least one vertical probe 76, the at least one first electrical via 63 of the circuit board 61, and the wire 65 coupled to the at least one electrical via 63 form an electrical signal conducting path. The temperature sensing component 73, the plurality of second electrical vias 63' of the circuit board 61, the wires 67, and the wires 65 coupled to the plurality of second electrical vias 63' form a sense of temperature. The electrical signal transmission path.

The technical content and the technical features of the present disclosure have been disclosed as above, but those skilled in the art should understand that the teachings and disclosures of the present disclosure are disclosed without departing from the spirit and scope of the disclosure as defined by the appended claims. Can be used for various substitutions and modifications. For example, many of the processes disclosed above may be implemented in different ways or in other processes, or a combination of the two.

Moreover, the scope of the present invention is not limited to the particular process, machine, manufacture, composition, means, method or method of the particular embodiments disclosed. It should be understood by those of ordinary skill in the art that, based on the teachings of the present disclosure, the process, the machine, the manufacture, the composition of the material, the device, the method, or the steps, whether present or future developers, The revealer performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present disclosure. Accordingly, the scope of the following claims is intended to cover such <RTIgt; </ RTI> processes, machines, manufactures, compositions, devices, methods or steps.

31. . . wire

33. . . Electrical via

35. . . wire

40. . . Integrated circuit test card

42. . . Circuit board

42'. . . Central opening

43. . . Temperature sensing element

44. . . supporting structure

46. . . Cantilever probe

47. . . Tip

48. . . Adhesive

60. . . Integrated circuit test card

61. . . Circuit board

63. . . Electrical via

65. . . wire

76. . . Upright probe

77. . . Tip

81. . . supporting structure

83. . . Upper guide plate

87. . . Lower guide

1 illustrates an integrated circuit test card according to an embodiment of the present invention;

2 is a partial cross-sectional view showing an integrated circuit test card according to an embodiment of the present invention;

FIG. 3 illustrates an integrated circuit test card according to an embodiment of the present invention; and

4 is a partial cross-sectional view showing an integrated circuit test card according to an embodiment of the present invention.

31. . . wire

33. . . First electrical via

33'. . . Second electrical via

35. . . wire

40. . . Integrated circuit test card

42. . . Circuit board

42'. . . Central opening

43. . . Temperature sensing element

44. . . supporting structure

46. . . Cantilever probe

47. . . Tip

48. . . Adhesive

Claims (14)

An integrated circuit test card comprising: a circuit board comprising at least one first electrical via and a plurality of second electrical vias; at least one cantilever probe; at least one support structure disposed on the circuit board The at least one cantilever probe is supported; and a temperature sensing component is disposed on the at least one support structure to sense a temperature, and is configured to couple the plurality of second electrical vias. The integrated circuit test card of claim 1, wherein the temperature sensing element comprises a thermistor, a resistance temperature detector or a thermal transducer. The integrated circuit test card of claim 1, wherein the temperature is an ambient temperature at which the wafer is measured. The integrated circuit test card of claim 1, further comprising an adhesive configured to fix the at least one cantilever probe to the at least one support structure. The integrated circuit test card of claim 1, wherein the tip is configured to contact a wafer to be tested. The integrated circuit test card of claim 1, wherein the at least one first electrical via is configured to electrically connect the probe and a wire. The integrated circuit test card of claim 1, wherein the second electrical via is configured to electrically connect the temperature sensing component and a wire. An integrated circuit test card includes: a circuit board including at least one first electrical via and a plurality of second electrical vias; at least a vertical probe configured to couple the at least one first a conductive via; a support structure disposed on the circuit board to support the at least one vertical probe; and a temperature sensing component disposed on the at least one support structure to sense a temperature, configured to The plurality of second electrical vias are coupled to the plurality of second conductive vias. The integrated circuit test card of claim 8, wherein the support structure comprises an upper guiding plate and a lower guiding plate. The integrated circuit test card of claim 8, wherein the temperature sensing element comprises a thermistor, a resistance temperature detector or a thermal transducer. The integrated circuit test card of claim 8, wherein the temperature is an ambient temperature at which the wafer is measured. The integrated circuit test card of claim 8, wherein the tip is configured to contact a wafer to be tested. The integrated circuit test card of claim 8, wherein the at least one first electrical via is configured to electrically connect the probe and a wire. The integrated circuit test card of claim 8, wherein the second electrical via is configured to electrically connect the temperature sensing component and a wire.