TW201330377A - Antenna cover structure for mobile device and method of manufacturing the same - Google Patents
Antenna cover structure for mobile device and method of manufacturing the same Download PDFInfo
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- TW201330377A TW201330377A TW101100503A TW101100503A TW201330377A TW 201330377 A TW201330377 A TW 201330377A TW 101100503 A TW101100503 A TW 101100503A TW 101100503 A TW101100503 A TW 101100503A TW 201330377 A TW201330377 A TW 201330377A
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000945 filler Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 18
- 239000004922 lacquer Substances 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims 1
- 239000002519 antifouling agent Substances 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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Abstract
Description
本發明係有關於一種殼體結構及其製作方法,尤指一種行動裝置用之具天線殼體結構及其製作方法。The present invention relates to a housing structure and a manufacturing method thereof, and more particularly to an antenna housing structure for a mobile device and a manufacturing method thereof.
雷射直接成型(Laser Direct Structuring)是一種雷射加工、射出與電鍍製程的3D-MID(Three-dimensional moulded interconnect device)生產技術,其原理是將普通的塑膠元件/電路板賦予電氣互連功能、支撐元器件功能和塑料殼體的支撐、防護等功能,以及由機械實體與導電圖形結合而產生的屏蔽、天線等功能結合於一體,即形成所謂3D-MID。Laser Direct Structuring is a 3D-MID (Three-dimensional moulded interconnect device) production technology for laser processing, injection and electroplating. The principle is to give ordinary plastic components/circuit boards electrical interconnection. The function of supporting components and the support and protection of the plastic casing, as well as the functions of shielding, antenna and the like generated by the combination of mechanical entities and conductive patterns, form a so-called 3D-MID.
此技術可應用在手機天線、汽車用電子電路、提款機外殼及醫療級助聽器。上述雷射直接成型製程,先透過雷射光束活化,藉由添加特殊化學劑雷射活化使物體產生物理化學反應行成金屬核,除了活化並形成粗糙的表面,使銅在金屬化過程中在塑料上紮根;再進行電鍍,此為雷射直接成型製程中的清潔步驟,在僅用作電極的金屬化塑膠表面進行電鍍5~8微米的電路,如銅、鎳等,使塑料成為一個具備導電線路的MID元件。藉此,以手機天線為例,其可避免天線受手機內部金屬干擾,更縮小手機體積。This technology can be applied to cell phone antennas, automotive electronic circuits, cash dispenser housings and medical grade hearing aids. The laser direct forming process is first activated by a laser beam, and a special chemical agent is used to activate the laser to cause a physical chemical reaction of the object into a metal core, in addition to activating and forming a rough surface, so that copper is in the metallization process. The plastic is rooted; the electroplating is carried out. This is the cleaning step in the direct laser forming process. The 5~8 micron circuit, such as copper and nickel, is plated on the metalized plastic surface used only as an electrode to make the plastic a MID component of the conductive line. Taking the mobile phone antenna as an example, the antenna can be prevented from being interfered by the metal inside the mobile phone, and the size of the mobile phone is further reduced.
然而,手機需要良好的收訊品質時,會將天線直接雷射於殼體外部,並在殼體上開設一貫孔,使天線延伸一導接段,讓導接段穿經貫孔成型至殼體內部,而與手機內部的電路板電性連接。但是,上述導致手機殼體存有孔洞之問題,造成殼體的表面不平整,進而降低手機的美觀性。However, when the mobile phone needs good receiving quality, the antenna is directly laser-exposed to the outside of the casing, and a uniform hole is formed in the casing, so that the antenna extends through a guiding section, and the guiding section is formed through the through hole to the casing. Inside the body, it is electrically connected to the circuit board inside the phone. However, the above-mentioned problem of causing a hole in the mobile phone case causes the surface of the casing to be uneven, thereby reducing the aesthetics of the mobile phone.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人開發之目標。In view of the above, the inventors of the present invention have made great efforts to solve the above problems by focusing on the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of development by the present inventors.
本發明之ㄧ目的,在於提供一種行動裝置用之具天線殼體結構及其製作方法,因雷射直接成型製成天線,會於行動裝置的殼體上形成貫孔,其係利用填充劑填補貫孔,使殼體的表面呈現平整一致性,以增加行動裝置的美觀性。The object of the present invention is to provide an antenna housing structure for a mobile device and a manufacturing method thereof. The antenna is directly formed by laser, and a through hole is formed in the housing of the mobile device, which is filled with a filler. The through holes make the surface of the housing flat and uniform to increase the aesthetics of the mobile device.
為了達成上述之目的,本發明係提供一種行動裝置用之具天線殼體結構,包括:一基板,具有相對的一第一表面及一第二表面,並在該基板開設一貫孔,該貫孔具有一內壁;一天線,具有一本體及自該本體延伸出的一導接段,該本體披覆在該第一表面上,該導接段沿著該內壁而披覆至該第二表面;一填充劑,填注在該貫孔中並固化成型;以及一保護漆層,披覆並遮蔽於該第一表面、該本體及該貫孔上。In order to achieve the above object, the present invention provides an antenna housing structure for a mobile device, comprising: a substrate having a first surface and a second surface opposite to each other, and a uniform hole is formed in the substrate, the through hole An inner wall; an antenna having a body and a guiding portion extending from the body, the body covering the first surface, the guiding portion covering the second wall along the inner wall a surface; a filler filled in the through hole and cured; and a protective lacquer layer coated and shielded on the first surface, the body and the through hole.
為了達成上述之目的,本發明係提供一種行動裝置用之具天線殼體製作方法,其步驟包括:In order to achieve the above object, the present invention provides a method for fabricating an antenna housing for a mobile device, the steps of which include:
a)將該本體披覆在該第一表面上,並使該導接段沿著該內壁而披覆至該第二表面;a) covering the body on the first surface and causing the guiding section to cover the second surface along the inner wall;
b)提供一填注輔具,透過該填注輔具注射該填充劑以填入於該貫孔中;b) providing a filling aid through which the filler is injected to fill the through hole;
c)對該填充劑進行固化處理,使該填充劑固化成型以填補該貫孔;以及c) curing the filler to cure the filler to fill the through hole;
d)將該保護漆層披覆並遮蔽於該第一表面、該本體及該貫孔上。d) coating and shielding the protective lacquer layer on the first surface, the body and the through hole.
本發明還具有以下功效:The invention also has the following effects:
因利用雷射直接成型(Laser Direct Structuring)製程,而於行動裝置的殼體外部製造出天線,此過程必須在殼體上開設貫孔,進而導致殼體存有孔洞之問題;藉此,本發明具天線殼體結構及其製作方法利用填充劑填補貫孔,使基板的表面呈現平整一致性,同時方便後續披覆之保護漆層也維持表面平整性,以達到提高行動裝置之美觀性。By using a Laser Direct Structuring process, an antenna is fabricated outside the housing of the mobile device, and the process must have a through hole in the housing, thereby causing a problem of holes in the housing; The invention has an antenna shell structure and a manufacturing method thereof, which utilizes a filler to fill the through hole, so that the surface of the substrate is flat and uniform, and at the same time, the protective lacquer layer of the subsequent coating is also maintained to maintain the surface flatness, so as to improve the aesthetics of the mobile device.
另外,本發明行具天線殼體製作方法因填充劑利用針頭進行點膠,並採用從第二開口沿著內壁注射填充劑至貫孔內,其可避免注射過程於填充劑及貫孔中產生氣泡。In addition, in the manufacturing method of the antenna housing of the present invention, the filling agent is dispensed by the filler, and the filler is injected into the through hole from the second opening along the inner wall, which can avoid the injection process in the filler and the through hole. Create bubbles.
又,本發明具天線殼體製作方法因止擋輔具貼附並堵塞第一開口,使填充劑受止擋輔具止擋,以達到填充劑固化成型後獲得較佳的表面平整度。Moreover, in the method for fabricating the antenna housing of the present invention, the stopper is attached and blocked by the stopper, so that the filler is stopped by the stopper, so as to obtain a better surface flatness after the filler is solidified.
有關本發明之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本發明。The detailed description and technical content of the present invention will be described with reference to the accompanying drawings.
請參考第一至三圖所示,本發明係提供一種行動裝置用之具天線殼體結構及其製作方法,此具天線殼體結構主要包括一基板1、一天線2、一填充劑3及一保護漆層4。Referring to the first to third embodiments, the present invention provides an antenna housing structure for a mobile device and a manufacturing method thereof. The antenna housing structure mainly includes a substrate 1, an antenna 2, a filler 3, and A protective lacquer layer 4.
基板1具有相對的一第一表面11及一第二表面12,並在基板1開設一貫孔13,此貫孔13具有一第一開口131、一第二開口132及一內壁133,第一開口131形成在第一表面11,第二開口132形成在第二表面12。其中,貫孔13可呈一漏斗狀並由第一開口131至第二開口132逐漸縮小口徑尺寸,但不以此為限。The substrate 1 has a first surface 11 and a second surface 12, and a uniform hole 13 is defined in the substrate 1. The through hole 13 has a first opening 131, a second opening 132 and an inner wall 133. The opening 131 is formed on the first surface 11 and the second opening 132 is formed on the second surface 12. The through hole 13 can be in a funnel shape and gradually reduced in size from the first opening 131 to the second opening 132, but is not limited thereto.
天線2具有一本體21及自本體21延伸出的一導接段22,本體21披覆在第一表面11上,導接段22沿著內壁133而披覆至第二表面12,詳細說明如下,本體21係以雷射直接成型(Laser Direct Structuring)方式鍍著在第一表面11,導接段22係以雷射直接成型(Laser Direct Structuring)方式穿經貫孔13鍍著至第二表面12。The antenna 2 has a body 21 and a guiding portion 22 extending from the body 21. The body 21 is coated on the first surface 11, and the guiding portion 22 is coated along the inner wall 133 to the second surface 12. As follows, the body 21 is plated on the first surface 11 by laser direct structuring (Laser Direct Structuring), and the guiding section 22 is plated through the through hole 13 to the second by laser direct structuring (Laser Direct Structuring). Surface 12.
填充劑3填注在貫孔13中並固化成型;此填充劑3可為紫外光固化樹脂(UV膠)、瞬間膠、SGA膠或厭氧膠等壓克力系固化膠。The filler 3 is filled in the through hole 13 and solidified and formed; the filler 3 may be an acrylic curing adhesive such as an ultraviolet curing resin (UV adhesive), an instant adhesive, an SGA adhesive or an anaerobic adhesive.
保護漆層4披覆並遮蔽於第一表面11、本體21及貫孔13上;其中,保護漆層4可以噴佈方式披覆於第一表面11、本體21及貫孔13上,但不以此為限。The protective lacquer layer 4 is covered and shielded on the first surface 11, the body 21 and the through hole 13; wherein the protective lacquer layer 4 can be sprayed on the first surface 11, the body 21 and the through hole 13, but not This is limited to this.
本發明行動裝置用之具天線殼體結構之組合,其係利用基板1具有相對的第一表面11及第二表面12,並在基板1開設貫孔13,貫孔13具有內壁133;天線2具有本體21及自本體21延伸出的導接段22,本體21披覆在第一表面11上,導接段22沿著內壁133而披覆至第二表面12;填充劑3填注在貫孔13中並固化成型;保護漆層4披覆並遮蔽於第一表面11、本體21及貫孔13上。因利用雷射直接成型(Laser Direct Structuring)製程,而於行動裝置的殼體外部製造出天線2,此過程必須在殼體上開設貫孔13,進而導致殼體存有孔洞之問題;藉此,本發明具天線殼體結構利用填充劑3填補貫孔13,使基板1的表面呈現平整一致性,同時方便後續披覆之保護漆層4也維持表面平整性,以達到提高行動裝置之美觀性。The combination of the antenna housing structure of the mobile device of the present invention has a first substrate 11 and a second surface 12, and a through hole 13 is formed in the substrate 1. The through hole 13 has an inner wall 133; the antenna 2 having a body 21 and a guiding portion 22 extending from the body 21, the body 21 is coated on the first surface 11, and the guiding portion 22 is coated along the inner wall 133 to the second surface 12; the filler 3 is filled Formed in the through hole 13 and cured; the protective lacquer layer 4 is covered and shielded on the first surface 11, the body 21 and the through hole 13. By using a Laser Direct Structuring process, the antenna 2 is fabricated outside the housing of the mobile device, and the process must have a through hole 13 in the housing, thereby causing a problem of the hole in the housing; The antenna housing structure of the present invention fills the through hole 13 with the filler 3, so that the surface of the substrate 1 is flat and uniform, and the protective lacquer layer 4 for the subsequent coating is also maintained to maintain the surface flatness, so as to improve the appearance of the mobile device. Sex.
請參考第四至八圖所示,係一種製備如上所述之行動裝置用之具天線殼體製作方法之步驟,其詳細說明如下。Referring to Figures 4 to 8, there is shown a step of fabricating a method for fabricating an antenna housing for a mobile device as described above, which is described in detail below.
如第四圖之步驟a及第五圖所示,首先,a步驟中將本體21披覆在第一表面11上,並使導接段22沿著內壁133而披覆至第二表面12;詳細說明如下,貫孔13具有第一開口131及第二開口132,第一開口131形成在第一表面11,第二開口132形成在第二表面12,貫孔13呈漏斗狀,貫孔13由第一開口131至第二開口132逐漸縮小口徑尺寸;再者,先透過第一表面11、第二表面12及第二開口132進行雷射光束活化,使本體21以雷射直接成型方式鍍著在第一表面11,導接段22以雷射直接成型方式穿經貫孔13鍍著至第二表面12,以達到天線2成型在基板1上。As shown in steps a and fifth of the fourth figure, first, in a step, the body 21 is coated on the first surface 11 and the guiding section 22 is coated along the inner wall 133 to the second surface 12. As described in detail below, the through hole 13 has a first opening 131 and a second opening 132. The first opening 131 is formed on the first surface 11, the second opening 132 is formed on the second surface 12, and the through hole 13 is funnel-shaped. 13 is gradually reduced in size from the first opening 131 to the second opening 132; further, the laser beam is activated through the first surface 11, the second surface 12 and the second opening 132, so that the body 21 is directly formed by laser. The first surface 11 is plated, and the guiding portion 22 is plated through the through hole 13 to the second surface 12 by laser direct molding to form the antenna 2 on the substrate 1.
此外,本發明行動裝置用之具天線殼體製作方法更包括在在b步驟之前的一個步驟b’,其中b’步驟中提供一止擋輔具100,此止擋輔具100為一膠布,將止擋輔具100固定在第一表面11並堵塞第一開口131。In addition, the antenna housing manufacturing method for the mobile device of the present invention further includes a step b' before the step b, wherein the b' step provides a stop assisting device 100, and the stop assisting device 100 is a tape. The stop aid 100 is fixed to the first surface 11 and blocks the first opening 131.
如第四圖之步驟b及第六圖所示,又,b步驟中提供一填注輔具200,透過填注輔具200注射填充劑3以填入於貫孔13中。其中,填注輔具200為一針頭201,填充劑3可為紫外光固化樹脂(UV膠)、瞬間膠、SGA膠或厭氧膠等壓克力系固化膠,將針頭201沿著內壁133注射填充劑3至貫孔13中。As shown in steps b and 6 of the fourth figure, in addition, in step b, a filling aid 200 is provided, and the filling agent 3 is injected through the filling aid 200 to be filled in the through hole 13. Wherein, the filling aid 200 is a needle 201, and the filler 3 may be an ultraviolet curing resin (UV glue), an instant glue, an SGA glue or an anaerobic adhesive, etc., and the needle 201 is along the inner wall. 133 is injected with the filler 3 into the through hole 13.
藉此,因填充劑3利用針頭201進行點膠,並採用從第二開口132沿著內壁133注射填充劑3至貫孔13內,其可避免注射過程於填充劑3及貫孔13中產生氣泡。Thereby, since the filler 3 is dispensed by the needle 201, and the filler 3 is injected from the second opening 132 along the inner wall 133 into the through hole 13, it can avoid the injection process in the filler 3 and the through hole 13. Create bubbles.
如第四圖之步驟c及第七圖所示,再者,c步驟中對填充劑3進行固化處理,使填充劑3固化成型以填補貫孔13;以填充劑3為紫外光固化樹脂為例,固化處理則為提供紫外燈,將紫外燈對紫外光固化樹脂進行照射。As shown in the steps c and 7 of the fourth figure, in addition, in step c, the filler 3 is cured to cure the filler 3 to fill the through hole 13; and the filler 3 is used as the ultraviolet curing resin. For example, the curing process is to provide an ultraviolet lamp, and the ultraviolet lamp is irradiated to the ultraviolet curing resin.
此外,本發明行動裝置用之具天線殼體製作方法更包括在在d步驟之前的一個步驟d’, 其中d’步驟中移除止擋輔具100。上述步驟b’及d’是可以省略的,但是因止擋輔具100貼附並堵塞第一開口131,使填充劑3受止擋輔具100止擋,以達到填充劑3固化成型後獲得較佳的表面平整度。Further, the method of fabricating the antenna housing for the mobile device of the present invention further includes a step d' before the step d, wherein the stop assisting device 100 is removed in the step d'. The above steps b' and d' can be omitted, but because the stopper assisting device 100 is attached and blocks the first opening 131, the filler 3 is stopped by the stopper assisting device 100 to obtain the filler 3 after curing. Preferred surface flatness.
如第四圖之步驟d及第八圖所示,最後,d步驟中將保護漆層4披覆並遮蔽於第一表面11、本體21及貫孔13上。其中,保護漆層4可以噴佈方式披覆於第一表面11、本體21及貫孔13上,但不以此為限。As shown in steps d and VIII of the fourth figure, finally, in step d, the protective lacquer layer 4 is covered and shielded on the first surface 11, the body 21 and the through hole 13. The protective lacquer layer 4 can be sprayed on the first surface 11, the body 21 and the through hole 13, but not limited thereto.
是以,藉由上述之構造組成,即可得到本發明行動裝置用之具天線殼體結構及其製作方法。Therefore, the antenna housing structure for the mobile device of the present invention and the method of fabricating the same can be obtained by the above-described structural composition.
請參考第九圖所示,係本發明具天線殼體結構之使用狀態,其中天線2之本體21形成在第一表面11,即天線2形成在行動裝置的殼體外部,會獲得較好的收訊品質,但是必須自本體21延伸導接段22穿經貫孔13至第二表面12,即形成至行動裝置的殼體內部,而透過導電片300與電路板400電性連接。Please refer to the ninth figure, which is a state of use of the antenna housing structure of the present invention, wherein the body 21 of the antenna 2 is formed on the first surface 11, that is, the antenna 2 is formed outside the housing of the mobile device, which is better. The receiving quality, but the guiding portion 22 must extend from the body 21 through the through hole 13 to the second surface 12, that is, to the inside of the housing of the mobile device, and electrically connected to the circuit board 400 through the conductive sheet 300.
然而,天線2形成在行動裝置的殼體外部,此過程必須在殼體上開設貫孔13,進而導致殼體存有孔洞之問題,藉此,本發明行動裝置用之具天線殼體結構及其製作方法利用填充劑3填補貫孔13,使基板1的表面呈現平整一致性,同時方便後續披覆之保護漆層4也維持表面平整性,以達到提高行動裝置之美觀性。However, the antenna 2 is formed outside the casing of the mobile device, and the process must have a through hole 13 in the casing, thereby causing a problem that the casing has a hole, thereby using the antenna casing structure of the mobile device of the present invention and The manufacturing method utilizes the filler 3 to fill the through hole 13, so that the surface of the substrate 1 is flat and uniform, and at the same time, the protective lacquer layer 4 for the subsequent coating is also maintained to maintain the surface flatness, so as to improve the aesthetics of the mobile device.
綜上所述,本發明之行動裝置用之具天線殼體結構及其製作方法,亦未曾見於同類產品及公開使用,並具有產業利用性、新穎性與進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, the antenna housing structure and the manufacturing method thereof for the mobile device of the present invention have not been seen in similar products and are used publicly, and have industrial utilization, novelty and progress, and fully comply with the requirements for invention patent applications. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the inventor.
1...基板1. . . Substrate
11...第一表面11. . . First surface
12...第二表面12. . . Second surface
13...貫孔13. . . Through hole
131...第一開口131. . . First opening
132...第二開口132. . . Second opening
133...內壁133. . . Inner wall
2...天線2. . . antenna
21...本體twenty one. . . Ontology
22...導接段twenty two. . . Junction section
3...填充劑3. . . Filler
4...保護漆層4. . . Protective paint
100...止擋輔具100. . . Stop aid
200...填注輔具200. . . Filling aids
201...針頭201. . . Needle
300...導電片300. . . Conductive sheet
400...電路板400. . . Circuit board
第一圖係本發明具天線殼體結構之立體示意圖。The first figure is a perspective view of the antenna housing structure of the present invention.
第二圖係本發明具天線殼體結構之另一立體示意圖。The second figure is another perspective view of the antenna housing structure of the present invention.
第三圖係本發明具天線殼體結構之剖面示意圖。The third figure is a schematic cross-sectional view of the antenna housing structure of the present invention.
第四圖係本發明具天線殼體製作方法之步驟流程圖。The fourth figure is a flow chart of the steps of the method for fabricating the antenna housing of the present invention.
第五圖係本發明止擋輔具欲堵塞第一開口之示意圖。The fifth figure is a schematic view of the stop aid of the present invention to block the first opening.
第六圖係本發明填充劑填注於貫孔中之示意圖。The sixth drawing is a schematic view of the filler of the present invention being filled in a through hole.
第七圖係本發明對填充劑進行固化處理之示意圖。The seventh drawing is a schematic view of the curing treatment of the filler in the present invention.
第八圖係本發明保護漆層披覆並遮蔽於第一表面、本體及貫孔上之示意圖。The eighth figure is a schematic view of the protective paint layer of the present invention being covered and shielded on the first surface, the body and the through hole.
第九圖係本發明具天線殼體結構之使用狀態示意圖。The ninth drawing is a schematic view showing the state of use of the antenna housing structure of the present invention.
1...基板1. . . Substrate
11...第一表面11. . . First surface
12...第二表面12. . . Second surface
13...貫孔13. . . Through hole
131...第一開口131. . . First opening
132...第二開口132. . . Second opening
133...內壁133. . . Inner wall
2...天線2. . . antenna
21...本體twenty one. . . Ontology
22...導接段twenty two. . . Junction section
3...填充劑3. . . Filler
4...保護漆層4. . . Protective paint
Claims (10)
一基板,具有相對的一第一表面及一第二表面,並在該基板開設一貫孔,該貫孔具有一內壁;
一天線,具有一本體及自該本體延伸出的一導接段,該本體披覆在該第一表面上,該導接段沿著該內壁而披覆至該第二表面;
一填充劑,填注在該貫孔中並固化成型;以及
一保護漆層,披覆並遮蔽於該第一表面、該本體及該貫孔上。An antenna housing structure for a mobile device includes:
a substrate having a first surface and a second surface opposite to each other, and a uniform hole is formed in the substrate, the through hole having an inner wall;
An antenna having a body and a guiding portion extending from the body, the body covering the first surface, the guiding portion covering the second surface along the inner wall;
a filler filled in the through hole and cured; and a protective lacquer layer covering and shielding the first surface, the body and the through hole.
a)將該本體披覆在該第一表面上,並使該導接段沿著該內壁而披覆至該第二表面;
b)提供一填注輔具,透過該填注輔具注射該填充劑以填入於該貫孔中;
c)對該填充劑進行固化處理,使該填充劑固化成型以填補該貫孔;以及
d)將該保護漆層披覆並遮蔽於該第一表面、該本體及該貫孔上。A method for fabricating an antenna housing for a mobile device according to any one of claims 1 to 5, wherein the steps include:
a) covering the body on the first surface and causing the guiding section to cover the second surface along the inner wall;
b) providing a filling aid through which the filler is injected to fill the through hole;
c) curing the filler to cure the filler to fill the through hole;
d) coating and shielding the protective lacquer layer on the first surface, the body and the through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101100503A TW201330377A (en) | 2012-01-05 | 2012-01-05 | Antenna cover structure for mobile device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101100503A TW201330377A (en) | 2012-01-05 | 2012-01-05 | Antenna cover structure for mobile device and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
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TW201330377A true TW201330377A (en) | 2013-07-16 |
Family
ID=49225863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW101100503A TW201330377A (en) | 2012-01-05 | 2012-01-05 | Antenna cover structure for mobile device and method of manufacturing the same |
Country Status (1)
Country | Link |
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TW (1) | TW201330377A (en) |
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2012
- 2012-01-05 TW TW101100503A patent/TW201330377A/en unknown
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