TW201321823A - Image sensor module - Google Patents

Abstract

An image sensor module is provided. The image sensor module includes an image sensing unit and an imaging unit. The image sensing unit has an image sensing surface. The imaging unit faces the image sensing surface. The imaging unit includes at least one optical diffraction sheet. An optical diffraction pattern is formed on the optical diffraction sheet. The optical diffraction pattern is adapted to form an image of an object on the image sensing surface.

Description

Image sensor module

The present invention relates to an image device, and more particularly to an image sensor module.

With the development of imaging technology, image sensor modules have been widely used in electronic devices for various purposes. The combination of image sensor modules and various portable electronic devices such as mobile phones and notebook computers has been favored by many consumers.

Referring to FIG. 1 , the conventional image sensor module 10 includes a geometric optical lens set 12 , a lens barrel 14 that houses the geometric optical lens set 12 , an image sensor 16 , and a lens holder 18 . The image sensor 16 is disposed in the lens holder 18, and the lens holder 18 and the lens barrel 14 are coupled by threads. However, such an image sensor module 10 is bulky and cannot meet the market demand for a miniaturized image sensor module.

The invention provides an image sensor module, which has a small volume and can meet the market demand for a miniaturized image sensor module.

An embodiment of the invention provides an image sensor module. The image sensor module includes an image sensing unit and an imaging unit. The image sensing unit has a sensing surface, and the imaging unit is opposite to the sensing surface. The imaging unit is composed of at least one optical diffraction sheet. The optical diffraction sheet is formed with a diffractive optical pattern, and the diffractive optical pattern is adapted to image an object outside the image sensor module on the sensing surface.

In an embodiment of the invention, the image sensing unit is a complementary metal-oxide-semiconductor (CMOS) wafer.

In an embodiment of the invention, the diffractive optical pattern includes a plurality of diffractive optical regions, each diffractive optical region being an independent imaging portion, each imaging portion being adapted to image a portion of the object at the sensing On the surface.

In an embodiment of the invention, the image sensing unit includes a die and a package. The bare crystal has the above sensing surface, and the package covers the bare crystal. A signal output portion is formed on the bottom surface of the package. The image sensor module further includes a fixing frame for fixing the imaging unit.

In an embodiment of the invention, the signal output unit includes a plurality of metal balls.

In an embodiment of the invention, the image sensor module further includes a circuit board. The fixing frame and the image sensing unit are disposed on the circuit board, and the signal output portion is electrically connected to the circuit board.

In an embodiment of the invention, the image sensing unit includes a bare crystal.

The image sensor module described above further includes a carrier board and a bracket. The carrier has opposite first and second surfaces. The die is disposed on the first surface of the carrier and electrically connected to the carrier. A second surface of the carrier is formed with a signal output. The bracket is disposed on the first surface of the carrier and fixes the imaging unit.

In an embodiment of the invention, the signal output unit includes a plurality of metal balls.

In an embodiment of the invention, the image sensor module further includes a circuit board. The carrier board is disposed on the circuit board, and the signal output part is electrically connected to the circuit board.

In an embodiment of the invention, the image sensing unit includes a bare crystal. The image sensor module described above further includes a circuit board and a fixing frame. The die is disposed on the circuit board and electrically connected to the circuit board. The fixing frame is disposed on the circuit board, and the imaging unit is fixed on the fixing frame.

The image sensor module of the present invention has an optical diffraction sheet and an image sensing unit, wherein the optical diffraction sheet serves as an imaging unit. Since the thickness of the optical diffraction sheet is thinner than the geometric optical lens set used in the prior art, the image sensor module of the present invention is smaller in volume than the prior art.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

2 is a cross-sectional view of the image sensor module of the first embodiment of the present invention, and FIG. 3 is a schematic view of the optical diffraction sheet of FIG. Referring to FIG. 2 and FIG. 3, the image sensor module 20 of the first embodiment of the present invention includes an image sensing unit 22 and an imaging unit for imaging, and the imaging unit is composed of at least one optical diffraction sheet 24, and The embodiment is based on a piece. The optical diffraction sheet 24 is fixed above the image sensing unit 22. The optical diffraction sheet 24 includes, for example, a substrate 241 and a diffractive optical pattern 240 formed on the substrate 241 , wherein the diffractive optical pattern 240 is adapted to image an object external to the image sensor module 20 at the image sensing unit 22 . The sensing surface is 2600. In particular, the diffractive optical pattern 240 includes a plurality of diffractive optical regions 242. Each diffractive optical region 242 is an independent imaging portion with an independent imaging function. Each diffractive optical region 242 corresponds to a portion of the object and is adapted to image the portion of the object to a particular region of the sensing surface 2600 of the image sensing unit 22. That is, each of the diffractive optical regions 242 is adapted to image a portion of the object on the image sensing unit 22, and the image of the entire object sensed by the image sensing unit 22 is composed of the partial images.

In the above, the diffractive optical pattern 240 may be a dimple, a protrusion, an opening, or a combination thereof formed on the substrate 241. The number and arrangement of the diffractive optical regions 242 can also be determined according to specific needs, and are not limited to the arrangement and number shown in FIG. In the present embodiment, the optical diffraction sheet 24 is a single piece, and of course, the imaging unit formed by stacking a plurality of optical diffraction sheets 24 is also suitable for the present invention. In embodiments of multiple optical diffracts, the diffractive optical patterns of the optical dips may be different. The shape of the optical diffraction sheet 24 is not limited to the rectangular shape shown in FIG. 3, and may be circular or other shapes, and the invention is not limited thereto.

Referring to FIG. 2 again, in the embodiment, the image sensing unit 22 is, for example, a packaged image sensor, which includes a die 260 and a package 262 . The die 260 is a light sensing component, such as a complementary metal oxide semiconductor wafer. The die 260 has a sensing surface 2600 for receiving an optical signal, the package 262 covers the die 260, and the top surface 2620 of the package 262 exposes the sensing surface 2600. The sensing surface 2600 is opposite the optical diffractive sheet 24 to sense light passing through the optical diffracting sheet 24. In addition, the bottom surface 2622 of the package body 262 is provided with a signal output portion 28. In this embodiment, the signal output unit 28 is exemplified by a plurality of metal balls (such as solder balls). Of course, the signal output portion 28 can also be a metal lead or the like, and the invention is not limited thereto.

The image sensor module 20 of the present embodiment further includes a fixing frame 25 for fixing the optical diffraction sheet 24, and the image sensing unit 22 is disposed in the fixing frame 25. In the present embodiment, the fixing frame 25 has, for example, a hollow cylindrical shape having a first open end 250 and a second open end 252 opposite to the first open end 250. The inner wall of the first open end 250 of the retainer 25 extends radially inwardly to define an annular shoulder 254 having an upper surface 2540, a lower surface 2542 opposite the upper surface 2540, and an annular inner side 2544 . The optical diffractive sheet 24 is, for example, an opening that is fixed to the first open end 250 and covers the first open end 250. In this embodiment, the outer edge of the optical diffraction sheet 24 can be adhered to the annular inner side surface 2544 of the shoulder 254 by an adhesive. Of course, in other embodiments, the adhesive can be adhered to the shoulder 254. Surface 2540 or lower surface 2542. In the actual application, the fixing frame 25 can have many different deformations, and the fixing manner of the optical diffraction sheet 24 can be changed according to the specific structure of the fixing frame 25, and is not limited to the pasting manner in the embodiment.

The image sensor module 20 of the present embodiment may further include a circuit board 27, and the image sensing unit 22 and the mounting frame 25 are fixed to the upper surface 270 of the circuit board 27, for example, and disposed on the bottom surface 2622 of the package body 262. The signal output unit 28 is fixed to the circuit board 27, for example, and is electrically connected to the circuit board 27. In the present embodiment, the end surface of the second open end 252 of the holder 25 is fixed to the upper surface 270 of the circuit board 27.

The image sensor module 20 of the present embodiment uses an optical diffraction sheet 24 in place of the geometric optical lens set used in the prior art. Since the thickness of the optical diffraction sheet 24 can be reduced to several millimeters, or even several micrometers, the image sensor 20 of the present embodiment can be made to have a small volume.

It can be understood that the image sensing unit of the present invention can also adopt other different packaging manners. Two other embodiments will be described below, but it is not intended to limit the present invention.

4 is a cross-sectional view showing an image sensor module according to a second embodiment of the present invention. Referring to FIG. 4 , in the embodiment, the image sensor module 30 includes an image sensing unit 32 and an optical diffraction sheet 34 as an imaging unit. The image sensing unit 32 is, for example, a bare crystal. In addition, the image sensor module 30 further includes a carrier 36 and a bracket 37, for example. The structure and function of the optical diffraction sheet 34 and the bare crystal of the present embodiment are substantially similar to those of the optical diffraction sheet 24 and the bare crystal 260 of the first embodiment, and are not described herein again.

In this embodiment, the carrier board 36 is used to carry the image sensing unit 32 and the bracket 37. The carrier plate 36 has opposing first and second surfaces 360, 362. The image sensing unit 32 is disposed on the first surface 360 of the carrier 36 and is located within the bracket 37. The sensing surface 350 of the image sensing unit 32 faces the optical diffraction sheet 34 , and the image sensing unit 32 is electrically connected to the carrier 36 via the metal wire 31 , for example, but the invention does not limit the image sensing unit 32 and the carrier. The way in which the board 36 is electrically connected. The second surface 362 of the carrier 36 is formed, for example, with a signal output portion 39. The signal output unit 39 of the present embodiment is exemplified by a plurality of metal balls (such as solder balls), but is not limited thereto.

The bracket 37 is used to fix the optical diffraction sheet 34. In the present embodiment, the bracket 37 is, for example, hollow, and includes an opposite first open end 370 and a second open end 372. The outer edge of the optical diffraction sheet 34 may be fixed to the inner wall of the first open end 370 by an adhesive and cover the opening of the first open end 370.

In the present embodiment, the end face of the second port 372 of the bracket 37 is fixed to the first surface 360 of the carrier plate 36, for example, by an adhesive. In addition, the image sensor module 30 of the present embodiment may further include a circuit board 38 disposed on the circuit board 38 and electrically connected to the circuit board 38.

It should be noted that the present invention does not limit the electrical connection between the carrier board 36 and the circuit board 38. In another embodiment, the carrier board and the circuit board can also be electrically connected by wire bonding. Sexual connection.

FIG. 5 is a cross-sectional view of an image sensor module according to a third embodiment of the present invention. Referring to FIG. 5 , in the embodiment, the image sensor module 40 includes an image sensing unit 42 , an optical diffraction sheet 44 as an imaging unit, a fixing frame 46 , and a circuit board 47 . The image sensing unit 42 of the present embodiment is, for example, a bare crystal, and the structure and function of the optical diffraction sheet 44 and the bare crystal are substantially similar to those of the first embodiment, and details are not described herein again. In the embodiment, the image sensing unit 42 is directly disposed on the upper surface 470 of the circuit board 47 and electrically connected to the circuit board 47. Specifically, the image sensing unit 42 is electrically connected to the circuit board 47 through the metal wire 48 , for example.

The holder 46 includes opposing first open ends 460 and second open ends 462. Optical diffractive sheet 44 is secured to first open end 460 and covers its opening. The image sensing unit 42 is disposed in the fixing frame 46 , and the sensing surface 450 of the image sensing unit 42 faces the optical diffraction sheet 44 . The second open end 462 of the mount 46 is secured to the upper surface 470 of the circuit board 47.

In summary, the imaging unit of the image sensor module of the present invention is composed of an optical diffraction sheet. Since the thickness of the optical diffraction sheet is thinner than that of the conventional optical lens group used in the prior art, According to the prior art, the image sensor module of the present invention is smaller in size.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

10. . . Image sensor module

12. . . Geometric optics lens set

14. . . Lens barrel

16. . . Image sensor

18. . . Mirror holder

20, 30, 40. . . Image sensor module

22, 32, 42. . . Image sensing unit

24, 34, 44. . . Optical diffraction sheet

240. . . Diffractive optical pattern

241. . . Substrate

242. . . Diffractive optical zone

25, 46. . . Fixing frame

250, 460. . . First open end of the holder

252, 462. . . Second open end of the holder

254. . . Shoulder

2540. . . Upper surface of the shoulder

2542. . . Lower surface of the shoulder

2544. . . Ring inner side of the shoulder

260. . . Bare crystal

2600, 350, 450. . . Sensing surface

262. . . Package

2620. . . Top surface

2622. . . Bottom

27, 38, 47. . . Circuit board

270, 380, 470. . . Upper surface of the board

28, 39. . . Signal output

31, 48. . . metal wires

36. . . Or board

360. . . First surface

362. . . Second surface

37. . . support

370. . . First open end of the bracket

372. . . Second open end of the bracket

1 is a cross-sectional view of a conventional image sensor module.

2 is a cross-sectional view showing an image sensor module according to a first embodiment of the present invention.

3 is a schematic view of the optical diffraction sheet of FIG. 2.

4 is a cross-sectional view showing an image sensor module according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view showing an image sensor module according to a third embodiment of the present invention.

20. . . Image sensor module

twenty two. . . Image sensing unit

twenty four. . . Optical diffraction sheet

25. . . Fixing frame

250. . . First open end

252. . . Second open end

254. . . Shoulder

2540. . . Upper surface of the shoulder

2542. . . Lower surface of the shoulder

2544. . . Ring inner side of the shoulder

260. . . Bare crystal

2600. . . Sensing surface

262. . . Package

2620. . . Top surface

2622. . . Bottom

27. . . Circuit board

270. . . Upper surface of the board

28. . . Signal output

Claims (10)

An image sensor module includes: an image sensing unit having a sensing surface; and an imaging unit opposite to the sensing surface, the imaging unit being composed of at least one optical diffraction sheet, the optical diffraction The sheet has a diffractive optical pattern adapted to image an object on the sensing surface. The image sensor module of claim 1, wherein the image sensing unit is a complementary metal oxide semiconductor wafer. The image sensor module of claim 1, wherein the diffractive optical pattern comprises a plurality of diffractive optical regions, each diffractive optical region being an independent imaging portion, each imaging portion being adapted A portion of the object is imaged on the sensing surface. The image sensor unit of claim 1, wherein the image sensing unit comprises a die and a package, the die has the sensing surface, and the package covers the die A signal output portion is formed on a bottom surface of the package, and the image sensor module further includes a fixing frame, and the fixing frame fixes the imaging unit. The image sensor module of claim 4, wherein the signal output portion comprises a plurality of metal balls. The image sensor module of claim 4, further comprising a circuit board, the fixing frame and the image sensing unit are disposed on the circuit board, and the signal output portion is electrically connected to the circuit board. The image sensor module of claim 1, wherein the image sensing unit comprises a die, the image sensor module further comprising: a carrier plate having an opposite first surface and a second surface, the die is disposed on the first surface and electrically connected to the carrier, and the second surface is formed with a signal output portion; and a bracket disposed on the first surface and fixing the imaging unit. The image sensor module of claim 7, wherein the signal output portion comprises a plurality of metal balls. The image sensor module of claim 7, further comprising a circuit board, the carrier board is disposed on the circuit board, and the signal output portion is electrically connected to the circuit board. The image sensor module of claim 1, wherein the image sensing unit comprises a die, the image sensor module further comprising: a circuit board, the die is disposed on the circuit board And electrically connected to the circuit board; and a fixing frame disposed on the circuit board and fixing the imaging unit.