[go: up one dir, main page]

TW201318749A - Laser processing device for three-dimensional circuit - Google Patents

Laser processing device for three-dimensional circuit Download PDF

Info

Publication number
TW201318749A
TW201318749A TW100141586A TW100141586A TW201318749A TW 201318749 A TW201318749 A TW 201318749A TW 100141586 A TW100141586 A TW 100141586A TW 100141586 A TW100141586 A TW 100141586A TW 201318749 A TW201318749 A TW 201318749A
Authority
TW
Taiwan
Prior art keywords
units
dimensional circuit
processing
laser
laser engraving
Prior art date
Application number
TW100141586A
Other languages
Chinese (zh)
Inventor
Hui-Hsiung Chen
Original Assignee
3D Circuit Taiwan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3D Circuit Taiwan filed Critical 3D Circuit Taiwan
Priority to TW100141586A priority Critical patent/TW201318749A/en
Priority to CN2012104593416A priority patent/CN103100793A/en
Publication of TW201318749A publication Critical patent/TW201318749A/en

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

A laser processing device for a three-dimensional circuit is applied to a 3D laser engraving machine for laser engraving a three-dimensional circuit pattern on a plurality of workpieces, and comprises a processing platform, a plurality of fixture units, a plurality of driving units, and a control unit. The fixture units are disposed on the processing platform and used to clamp the workpieces, and through the drive of the driving units connected to fixture units, the three-dimensional circuit patterns can be respectively laser engraved on the workpieces, wherein the driving units are controlled in accordance with the control unit so that the workpieces can be sequentially laser engraved. This invention adopts sequential processing so that a layout of three-dimensional circuit patterns can be formed on the workpieces in order to achieve efficiently saving the waiting time in laser engraving and increase the production capacity of workpieces.

Description

三維電路雷射加工裝置Three-dimensional circuit laser processing device

本發明係一種雷射加工裝置,特別是應用於雷射雕刻機在複數加工件上雷雕一三維電路圖樣的一種三維電路雷射加工裝置。The invention relates to a laser processing device, in particular to a three-dimensional circuit laser processing device which is applied to a laser engraving machine for blasting a three-dimensional circuit pattern on a plurality of workpieces.

傳統的三維電路雷射加工係藉由將加工件設置於平台上,用以藉由雷射雷雕的方式,將三維電路圖樣雷雕在該加工件上。然而,由於該加工件係為立體狀,具有多個面,若要在該等加工件的該等面進行三維的電路佈局,則需將該加工件經由多次的置換與裝卸,方能將該等三維電路圖樣完全地雷雕在該加工件之該等面上,然而不斷的置換與裝卸加工件將浪費大量之加工時間,造成機器設備稼動率(activation)太低的缺失。The conventional three-dimensional circuit laser processing is performed by placing a workpiece on a platform for laser-engraving a three-dimensional circuit pattern on the workpiece. However, since the workpiece is three-dimensional and has a plurality of faces, if the three-dimensional circuit layout is to be performed on the faces of the workpieces, the workpieces need to be replaced and loaded by multiple times. These three-dimensional circuit patterns are completely embossed on the faces of the workpiece, however, continuous replacement and handling of the workpieces wastes a large amount of processing time, resulting in a lack of activation of the machine equipment.

為解決上述的缺失,習知技術係利用以一套裝置同時夾持多個加工件在多個加工單元上,以減少置換與裝卸加工件的時間,但此種解決方案雖然能夠減少置換與裝卸加工件的時間,但每一加工件完成任一面的加工時,無法立即轉換至另一加工面等待下一個加工程序的進行,而必須等待所有加工件完成後,同時轉換至另一加工面,然後再一一進行下一個加工程序,亦即如果有任一加工件尚未完成該面的加工,其他加工件都必須等待該加工件完成該面的加工後,才能再同時轉換至另一面,而後再進行雷雕。因此,該等習知技術具有仍無法充分利用雷射加工機,以達到最大稼動率的問題In order to solve the above-mentioned deficiencies, the prior art utilizes a set of devices to simultaneously hold a plurality of workpieces on a plurality of processing units to reduce the time for replacement and handling of the workpieces, but such a solution can reduce replacement and handling. The time of processing the workpiece, but when each workpiece is processed on either side, it cannot be immediately converted to another processing surface to wait for the next machining program, but must wait for all the workpieces to be completed and simultaneously switch to another processing surface. Then, the next processing program is performed one by one, that is, if any of the processed parts has not been processed yet, the other processed parts must wait for the processed parts to complete the processing of the surface before being simultaneously converted to the other side, and then Then carry out the Lei eagle. Therefore, these prior art techniques have problems in that the laser processing machine cannot be fully utilized to achieve maximum utilization rate.

故本發明有鑑於上述的缺失,係提出一種三維電路雷射加工裝置,用以解決習知技術的缺點。Therefore, in view of the above-mentioned deficiencies, the present invention provides a three-dimensional circuit laser processing apparatus for solving the shortcomings of the prior art.

本發明之一目的係提供一種三維電路雷射加工裝置,以達成加工件的二維及/或三維的控制,用以達到對加工件進行三維電路圖樣雷雕的目的。One object of the present invention is to provide a three-dimensional circuit laser processing apparatus for achieving two-dimensional and/or three-dimensional control of a workpiece to achieve the purpose of performing three-dimensional circuit pattern lithography on the workpiece.

本發明之另一目的係根據上述的加工裝置,藉由提供不同的工作區域,使得在加工過程中可以減少整體裝卸加工件時,雷射加工機的閒置時間(idle time),以提高生產效能,而可達到大量地進行生產並具有降低生產成本的功效。Another object of the present invention is to improve the production efficiency of the laser processing machine by reducing the idle time of the entire loading and unloading workpiece during processing by providing different working areas according to the above processing apparatus. It can achieve a large amount of production and has the effect of reducing production costs.

為達成上述目的及其它目的,本發明係提供一種三維電路雷射加工裝置,係應用於雷射雕刻機在複數加工件上雷雕一三維電路圖樣,其包含加工平台、複數夾具單元、複數驅動單元與控制單元。該等夾具單元係設置於該加工平台上,該等夾具單元係夾持該等加工件;該等驅動單元係設置於該加工平台上,該等驅動單元係分別地連接該等夾具單元,且該等驅動單元係分別地驅動該等夾具單元,用於供該等夾具單元進行移動;以及,該控制單元係連接該等驅動單元,且該控制單元係根據該三維電路圖樣產生控制訊號用以控制該等夾具單元,用於供位於該等夾具單元上的該等加工件係輪序地雷雕該三維電路圖樣。In order to achieve the above and other objects, the present invention provides a three-dimensional circuit laser processing apparatus, which is applied to a laser engraving machine to blast a three-dimensional circuit pattern on a plurality of workpieces, including a processing platform, a plurality of fixture units, and a complex drive. Unit and control unit. The clamp units are disposed on the processing platform, and the clamp units are configured to clamp the workpieces; the drive units are disposed on the processing platform, and the drive units are respectively connected to the clamp units, and The driving units respectively drive the clamping units for movement of the clamping units; and the control unit is connected to the driving units, and the control unit generates control signals according to the three-dimensional circuit patterns for The gripper units are controlled for the workpieces located on the gripper units to sequentially engrave the three-dimensional circuit pattern.

與習知技術相較,本發明之三維電路雷射加工裝置,係可提供複數射出成型(injection molding)的加工件,放置於本發明的裝置上,並應用於雷射雕刻機,以供雷射雕刻機在該等加工件上以雷射活化(laser activation)的技術直接地形成三維電路圖樣,且在活化的過程中,藉由本發明的裝置可由獨立的驅動單元,分別地對該等加工件的每一個加工面進行位移、旋轉或位移旋轉的輪序作動方式,以完成二維或三維的線路雷雕,亦即本發明係透過獨立驅動、輪序的加工及裝置可用以節省每一加工件等待雷射進行雷雕的等待時間。換言之,當進行下一個加工件加工時,上一個加工件可以提前地根據該驅動單元的驅動,翻轉或移動至預定雷雕的雷雕面上,以在下一次的雷雕程序中,該雷射可以直接地進行雷雕,而可有效地節省雷射加工機的閒置時間(idle time),以提高生產效能。再者,本發明係亦可透過旋轉平台的複數工作區域,用以提升加工流程的工作效率,用以同時提供二維、三維或其結合的方式輪序地進行雷雕。此外,在該等加工件進行雷雕加工之後,即具有三維電路圖樣,再經由化學鍍(Metallization)的作用,將金屬導電層形成在該三維電路圖樣,使得該等加工件的該三維電路圖樣具有導電性。故藉由本發明係可有效地節省雷射加工機的閒置時間(idle time),以提高生產效能,達到大量生產並具有低生產成本的功效。Compared with the prior art, the three-dimensional circuit laser processing apparatus of the present invention is capable of providing a plurality of injection molding workpieces, placed on the apparatus of the present invention, and applied to a laser engraving machine for thunder. The engraving machine directly forms a three-dimensional circuit pattern on the workpieces by a laser activation technique, and in the process of activation, the apparatus of the present invention can be separately processed by independent driving units. Each working surface of the piece is subjected to displacement, rotation or displacement rotation to complete the two-dimensional or three-dimensional line ray carving, that is, the invention can be used to save each by independent driving, wheel sequence processing and device. Waiting time for the workpiece to wait for the laser to perform the eagle carving. In other words, when processing the next workpiece, the previous workpiece can be flipped or moved to the surface of the predetermined laser engraving according to the driving of the driving unit in advance, so that in the next laser engraving program, the laser The laser engraving can be performed directly, and the idle time of the laser processing machine can be effectively saved to improve the production efficiency. Furthermore, the present invention can also pass through a plurality of working areas of the rotating platform to improve the working efficiency of the processing flow, and to provide the two-dimensional, three-dimensional or a combination thereof in a round-robin manner. In addition, after the processing of the workpieces, the three-dimensional circuit pattern is formed, and then the metal conductive layer is formed on the three-dimensional circuit pattern by the action of metallization, so that the three-dimensional circuit pattern of the workpieces is obtained. Conductive. Therefore, the invention can effectively save the idle time of the laser processing machine to improve the production efficiency, achieve mass production and have low production cost.

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:參考第一圖,係本發明第一實施例之三維電路雷射加工裝置的立體示意圖。在第一圖中,該三維電路雷射加工裝置10係應用於立體雷射雕刻機2在複數加工件4上雷雕一三維電路圖樣6。其中,該等加工件4係藉由射出成型的方式所形成。In order to fully understand the object, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings. A perspective view of a three-dimensional circuit laser processing apparatus of an embodiment. In the first figure, the three-dimensional circuit laser processing apparatus 10 is applied to a three-dimensional laser engraving machine 2 to blast a three-dimensional circuit pattern 6 on a plurality of workpieces 4. Among them, the workpieces 4 are formed by injection molding.

其中,該三維電路雷射加工裝置10係包含加工平台12、複數夾具單元14、複數驅動單元16與控制單元18。The three-dimensional circuit laser processing apparatus 10 includes a processing platform 12, a plurality of clamp units 14, a plurality of driving units 16, and a control unit 18.

該加工平台12係用於設置該等夾具單元14與該等驅動單元16,並用於提供該等夾具單元14與該等驅動單元16穩固地設置,以提供該立體雷射雕刻機2可精準地進行該三維電路圖樣6的雷雕加工。The processing platform 12 is configured to provide the clamp units 14 and the drive units 16 and to provide the clamp units 14 and the drive units 16 to be stably disposed to provide the stereo laser engraving machine 2 with precise precision The laser engraving of the three-dimensional circuit pattern 6 is performed.

該等夾具單元14係設置於該加工平台12上,且該等夾具單元14係用於夾持該等加工件4。於此,該等夾具單元14係以矩形容置槽用以夾持矩形的該等加工件4為例說明,於其它實施例中,該等夾具單元14係配合該等加工件4而配置。The clamp units 14 are disposed on the processing platform 12, and the clamp units 14 are used to clamp the workpieces 4. For example, the clamp unit 14 is exemplified by a rectangular receiving groove for holding the rectangular workpieces 4 . In other embodiments, the clamp units 14 are configured to match the workpieces 4 .

該等驅動單元16係設置於該加工平台12上,該等驅動單元16係分別地連接該等夾具單元14,且該等驅動單元16係分別地驅動該等夾具單元14於一矩形線性滑軌單元141,用以供該等夾具單元14於該線性滑軌單元141上直線運動。於此,該等驅動單元16係於X軸直線運動,用以在X軸上進行往復移動,而該立體雷射雕刻機2則於固定之雷射加工區域範圍內(標準為160mmx160mm)進行雷射雕刻作業,藉此完成長形加工件的雷雕作業。其中,該驅動單元16係為伺服步進馬達。The driving units 16 are disposed on the processing platform 12, and the driving units 16 are respectively connected to the clamping units 14, and the driving units 16 respectively drive the clamping units 14 to a rectangular linear slide. The unit 141 is configured to linearly move the clamp unit 14 on the linear slide unit 141. Here, the driving units 16 are linearly moved on the X-axis for reciprocating movement on the X-axis, and the stereo laser engraving machine 2 is subjected to lightning in a fixed laser processing area (standard: 160 mm x 160 mm). The engraving operation is performed to complete the eagle carving operation of the elongated workpiece. The drive unit 16 is a servo stepping motor.

該控制單元18係連接該等驅動單元16,且該控制單元18係根據該三維電路圖樣6加工順序安排產生控制訊號TDCS用以控制該等驅動單元16驅動該夾具單元14於該等線性滑軌單元141上移動,以供位於該等夾具單元14上的該等加工件4係輪序地雷雕該三維電路圖樣6。The control unit 18 is connected to the driving units 16 , and the control unit 18 generates a control signal TDCS according to the processing sequence of the three-dimensional circuit pattern 6 for controlling the driving units 16 to drive the clamping unit 14 on the linear sliding rails. The unit 141 is moved to allow the workpieces 4 located on the gripper units 14 to blast the three-dimensional circuit pattern 6 in a sequence.

於一實施例中,該等夾具單元14a、14b係分別地連接獨立的該等驅動單元16a、16b,且其中,該等驅動單元16a、16b係分別用以驅動該等夾具單元14a、14b,使其分別獨立地於線性滑軌單元141a與線性滑軌單元141b上移動。當該夾具單元14a上已完成對加工件4a雷雕該三維電路圖樣6之一部分之後,則該立體雷射雕刻機2立即轉移至對該加工件4b進行雷雕;而當該立體雷射雕刻機2對該加工件4b進行雷雕時,該控制訊號TDCS則同時地控制該等驅動單元16a,將該夾具單元14a預先地移動至下一階段雷雕作業的位置等待雷雕。In an embodiment, the clamp units 14a, 14b are respectively connected to the independent drive units 16a, 16b, and wherein the drive units 16a, 16b are respectively used to drive the clamp units 14a, 14b, It is moved independently of the linear rail unit 141a and the linear rail unit 141b, respectively. After the portion of the three-dimensional circuit pattern 6 is polished to the workpiece 4a on the fixture unit 14a, the stereo laser engraver 2 is immediately transferred to the workpiece 4b for laser engraving; and when the stereo laser engraving is performed When the machine 2 performs the laser engraving on the workpiece 4b, the control signal TDCS simultaneously controls the driving units 16a, and moves the fixture unit 14a to the position of the next stage of the laser engraving operation to wait for the laser engraving.

請參考第二圖與第三圖。第二圖係本發明第二實施例之三維電路雷射加工裝置的立體示意圖;第三圖係本發明第三實施例之三維電路雷射加工裝置的立體示意圖。圖中,該三維電路雷射加工裝置10’係同樣應用於立體雷射雕刻機2在複數加工件4上雷雕一三維電路圖樣6。Please refer to the second and third figures. 2 is a perspective view of a three-dimensional circuit laser processing apparatus according to a second embodiment of the present invention; and a third diagram is a perspective view of a three-dimensional circuit laser processing apparatus according to a third embodiment of the present invention. In the figure, the three-dimensional circuit laser processing apparatus 10' is also applied to the three-dimensional laser engraving machine 2 to blast a three-dimensional circuit pattern 6 on a plurality of workpieces 4.

與前述實施例不同的是,於第二與第三實施例中該三維電路雷射加工裝置10’係包含加工平台12、轉軸支撐架20、複數夾具單元21、複數轉軸單元22、複數驅動單元24與該控制單元18。Different from the foregoing embodiment, in the second and third embodiments, the three-dimensional circuit laser processing apparatus 10' includes a processing platform 12, a rotating shaft support frame 20, a plurality of clamp units 21, a plurality of shaft units 22, and a plurality of driving units. 24 and the control unit 18.

該加工平台12係用於設置該等轉軸支撐架20,該等轉軸支撐架20係用於設置該等轉軸單元22與該等驅動單元24,並用於提供該等轉軸單元22與該等驅動單元24係可穩固地設置,以提供該立體雷射雕刻機2可精準地進行該三維電路圖樣6的雷雕加工。The processing platform 12 is configured to provide the rotating shaft support frames 20 for providing the rotating shaft units 22 and the driving units 24, and for providing the rotating shaft units 22 and the driving units The 24 series can be stably arranged to provide the three-dimensional laser engraving machine 2 to accurately perform the laser engraving processing of the three-dimensional circuit pattern 6.

該等夾具單元21係設置於該等轉軸單元22上,且該等夾具單元21係用於夾持該等加工件4。於第三圖中,該等夾具單元21係為一矩形凸塊用以夾持該等加工件4為例說明,於其它實施例中,該等三維夾具單元21係配合該等加工件4而配置。值得注意的是,該等夾具單元21係包括第一組夾具單元21a與第二組夾具單元21b,而該等夾具單元21a與21b係又分別地連接第一組驅動單元24a與第二組驅動單元24b。The clamp units 21 are disposed on the spindle units 22, and the clamp units 21 are used to clamp the workpieces 4. In the third embodiment, the clamp unit 21 is a rectangular projection for holding the workpieces 4 as an example. In other embodiments, the three-dimensional clamp units 21 are matched with the workpieces 4 . Configuration. It should be noted that the clamp unit 21 includes a first group of clamp units 21a and a second group of clamp units 21b, and the clamp units 21a and 21b are respectively connected to the first group of drive units 24a and the second group of drives. Unit 24b.

該等驅動單元24係設置於該轉軸支撐架20上,該等驅動單元24係分別地連接該等轉軸單元22,且該等驅動單元24係分別地驅動該等轉軸單元22,用於供該等轉軸單元22以進行旋轉運動。於此,舉例而言,該等轉軸單元22係設置於X軸,而該等驅動單元24係驅動該等轉軸單元22於Y-Z平面上旋轉,該立體雷射雕刻機2則會對已完成旋轉後的該等加工件4進行雷射雕刻作業,完成該等加工件4完整的三維雷射雕刻作業。The driving units 24 are disposed on the rotating shaft support frame 20, and the driving units 24 are respectively connected to the rotating shaft units 22, and the driving units 24 respectively drive the rotating shaft units 22 for the The spindle unit 22 is rotated to perform a rotary motion. Here, for example, the rotating shaft units 22 are disposed on the X-axis, and the driving units 24 drive the rotating shaft units 22 to rotate on the YZ plane, and the stereoscopic laser engraving machine 2 will complete the rotation. The subsequent processing members 4 perform laser engraving operations to complete the complete three-dimensional laser engraving operation of the workpieces 4.

同樣地,該控制單元18係根據該三維電路圖樣6加工順序安排產生控制訊號TDCS’用以控制該等驅動單元24用以驅動該等轉軸單元22,將該等夾具單元21上的該等加工件4控制於一特定加工位置、路徑與程序,係如上所述地進行輪序式雷雕該三維電路圖樣6。Similarly, the control unit 18 generates a control signal TDCS' according to the processing sequence of the three-dimensional circuit pattern 6 for controlling the driving units 24 for driving the rotating shaft units 22, and processing the same on the clamping unit 21. The piece 4 is controlled by a specific processing position, path and program, and the three-dimensional circuit pattern 6 is subjected to wheel-sequence laser engraving as described above.

於第三圖中,該立體雷射雕刻機2係首先地對該第一組夾具單元21a上的該加工件4進行該三維電路圖樣6的雷雕加工,其中於本階段中係對該加工件4的第一加工面42進行加工;接著,該立體雷射雕刻機2係對該第二組夾具單元21b上的該加工件4進行該三維電路圖樣6的雷雕加工,其中於本階段中係對該加工件4的第二加工面44進行加工,且在此同時,該第一組三維夾具單元21a係透過該第一組驅動單元24a進行旋轉,使得該加工件4的第三加工面46係朝向該立體雷射雕刻機2可進行加工的方向;再接著,該立體雷射雕刻機2係直接地對該第一組夾具單元21a上的該加工件4的該第三加工面46進行加工,而無須讓該立體雷射雕刻機2等待該第一組驅動單元24a的翻轉,且同樣地,該第二組夾具單元21b係透過該第二組驅動單元24b預先地進行旋轉,而讓該加工件4的第四加工面48係朝向該立體雷射雕刻機2可進行加工的方向;以及,再接著讓該立體雷射雕刻機2係直接地對該第二組夾具單元21b上的該加工件4的該第四加工面48進行加工,如此反覆,直到在該加工件4的每一面上完成該三維電路圖樣6的雷雕加工作業。In the third figure, the three-dimensional laser engraving machine 2 first performs the laser-engraving processing of the three-dimensional circuit pattern 6 on the workpiece 4 on the first group of clamp units 21a, wherein the processing is performed in this stage. The first processing surface 42 of the workpiece 4 is processed; then, the solid laser engraving machine 2 performs the laser processing of the three-dimensional circuit pattern 6 on the workpiece 4 on the second group of clamp units 21b, wherein The second processing surface 44 of the workpiece 4 is processed, and at the same time, the first group of three-dimensional clamp units 21a is rotated by the first group of driving units 24a, so that the third processing of the workpiece 4 is performed. The face 46 is oriented toward the direction in which the stereo laser engraving machine 2 can be processed; and then, the stereo laser engraving machine 2 directly directly faces the third processed surface of the workpiece 4 on the first set of gripper units 21a. Processing 46 without waiting for the stereo laser engraving machine 2 to wait for the inversion of the first group of driving units 24a, and similarly, the second group of clamping units 21b is rotated in advance through the second group of driving units 24b, And the fourth processing surface 48 of the workpiece 4 is oriented The direction in which the stereo laser engraving machine 2 can be processed; and, subsequently, the stereo laser engraving machine 2 directly performs the fourth processing surface 48 of the workpiece 4 on the second group of clamping units 21b. The processing is repeated until the laser-engraving operation of the three-dimensional circuit pattern 6 is completed on each side of the workpiece 4.

請參考第四圖,係本發明之三維電路雷射加工裝置的立體應用示意圖。於本實施例中,該三維電路雷射加工裝置10或該三維電路雷射加工裝置10’係固設於一立體雷射雕刻機旋轉平台26上,其中該立體雷射雕刻機旋轉平台26具有第一工作區域FA與第二工作區域SA同時設置該三維電路雷射加工裝置10或第一工作區域FA與第二工作區域SA分別設置該三維電路雷射加工裝置10與該三維電路雷射加工裝置10’(圖未示)。且該立體雷射雕刻機旋轉平台26係藉由該立體雷射雕刻機旋轉驅動單元28進行驅動旋轉且一雷射雕刻機之旋轉平台切換鈕(圖未示)係與該立體雷射雕刻機旋轉平台26相連接,藉由該立體雷射雕刻機之旋轉平台切換鈕(圖未示)對該立體雷射雕刻機旋轉平台26進行不同區域切換控制。一三維電路雷射加工裝置平台感應器32係與該控制單元18電性連接,該控制單元18可藉由三維電路雷射加工裝置平台感應器32來判斷該立體雷射雕刻機旋轉平台26上的第一工作區域FA與第二工作區域SA何者位於雷射加工區中。Please refer to the fourth figure, which is a schematic diagram of a three-dimensional application of the three-dimensional circuit laser processing apparatus of the present invention. In the embodiment, the three-dimensional laser processing device 10 or the three-dimensional laser processing device 10 ′ is fixed on a stereo laser engraving machine rotating platform 26 , wherein the stereo laser engraving machine rotating platform 26 has The first working area FA and the second working area SA are simultaneously disposed with the three-dimensional circuit laser processing apparatus 10 or the first working area FA and the second working area SA, respectively, and the three-dimensional circuit laser processing apparatus 10 and the three-dimensional circuit laser processing Device 10' (not shown). And the stereo laser engraving machine rotating platform 26 is driven and rotated by the stereo laser engraving machine rotation driving unit 28, and a rotating platform switching button (not shown) of the laser engraving machine is coupled with the stereo laser engraving machine. The rotating platform 26 is connected, and the rotating platform switching button (not shown) of the stereo laser engraving machine performs different area switching control on the rotating platform 26 of the stereo laser engraving machine. A three-dimensional circuit laser processing device platform sensor 32 is electrically connected to the control unit 18, and the control unit 18 can be judged by the three-dimensional circuit laser processing device platform sensor 32 to determine the stereo laser engraving machine rotating platform 26 The first working area FA and the second working area SA are located in the laser processing area.

此外,一監控單元30係設置於該立體雷射雕刻機旋轉平台26之雷射加工側,且與該控制單元18電性連接,用以監控該三維電路雷射加工裝置10或10’上的一預設座標點。其中,當該立體雷射雕刻機2完成一加工面之加工程序,該立體雷射雕刻機2之雷射光束即移動至該預設座標點,該監控單元30偵測得該雷射光束,即可判斷該立體雷射雕刻機2已經完成該加工面之加工程序。舉例而言,當該立體雷射雕刻機2完成第一組加工件4之加工程序,並將此訊息回饋至該控制單元18,該立體雷射雕刻機2的雷射光束離開該預設座標點至第二組加工件4進行加工程序,其同時,該驅動單元24即驅動該第一組加工件4進行線性移動或旋轉運動至另一待加工面,等待該立體雷射雕刻機2進行雷雕加工作業。換言之,藉由監控該等加工件4上是否已完成該面的三維電路圖樣6,可用以決定是否對該加工件4進行二維或/及三維的位移、旋轉以等待執行下一階段的雷雕加工,直到該三維電路圖樣6係完全地雷雕在該等加工件4上;且當一加工件4進行二維或/及三維的位移、旋轉以等待執行下一階段的雷雕加工時,該立體雷射雕刻機2係正對另一組加工件4進行雷雕加工作業而並未停機。因此,本發明係透過裝置可用以節省每一加工件等待雷射進行雷雕的等待時間,而可有效地節省雷射加工機的閒置時間(idle time),以提高生產效能。In addition, a monitoring unit 30 is disposed on the laser processing side of the rotating platform 26 of the stereo laser engraving machine, and is electrically connected to the control unit 18 for monitoring the laser processing device 10 or 10' on the three-dimensional circuit. A preset coordinate point. Wherein, when the stereo laser engraving machine 2 completes a processing procedure of a processing surface, the laser beam of the stereo laser engraving machine 2 moves to the preset coordinate point, and the monitoring unit 30 detects the laser beam. It can be judged that the stereo laser engraving machine 2 has completed the processing procedure of the processing surface. For example, when the stereo laser engraving machine 2 completes the processing procedure of the first group of workpieces 4 and feeds this message back to the control unit 18, the laser beam of the stereo laser engraving machine 2 leaves the preset coordinates. Pointing to the second group of processing members 4 for processing, at the same time, the driving unit 24 drives the first group of processing members 4 to perform linear movement or rotational movement to another surface to be processed, waiting for the stereo laser engraving machine 2 to perform Lei carving processing operations. In other words, by monitoring whether the three-dimensional circuit pattern 6 of the surface has been completed on the workpieces 4, it can be used to determine whether the workpiece 4 is subjected to two-dimensional or/and three-dimensional displacement and rotation to wait for the next stage of lightning. Engraving processing until the three-dimensional circuit pattern 6 is completely embossed on the workpieces 4; and when a workpiece 4 is subjected to two-dimensional or/and three-dimensional displacement and rotation to wait for the next stage of the laser processing, The three-dimensional laser engraving machine 2 is performing a laser engraving operation on another set of workpieces 4 without stopping. Therefore, the present invention can be used to save the waiting time for each workpiece to wait for the laser to perform the laser engraving, and can effectively save the idle time of the laser processing machine to improve the production efficiency.

故本創作之三維電路雷射加工裝置,可藉由獨立的驅動單元,分別地對該等加工件進行移動以將每一個面雷雕,且當一加工件進行雷雕時,另一加工件即可進行移動,亦即本發明係透過裝置可用以節省雷射雕刻機等待加工件移動至定位的待機閒置時間。換言之,當進行下一個加工件加工時,上一個加工件可以提前地根據該驅動單元的驅動,翻轉或移動至預定雷雕的雷雕面上,以在下一次的雷雕程序中,該雷射可以直接地進行雷雕,而可有效地節省時間。再者,本發明係亦可透過旋轉平台的複數工作區域,於一工作區域進行雷雕作業時,可於另一工作區域進行換裝加工件或換裝加工平台之作業,用以提升加工流程的工作效率,用以可同時提供二維、三維或其結合的方式輪序地進行雷雕作業。Therefore, the three-dimensional circuit laser processing apparatus of the present invention can separately move the workpieces by a separate driving unit to etch each surface, and when one workpiece is subjected to ray carving, another processing part The movement can be performed, that is, the present invention can be used to save the standby idle time of the laser engraving machine waiting for the workpiece to move to the positioning. In other words, when processing the next workpiece, the previous workpiece can be flipped or moved to the surface of the predetermined laser engraving according to the driving of the driving unit in advance, so that in the next laser engraving program, the laser It is possible to carry out the lightning sculpture directly, which can effectively save time. Furthermore, the present invention can also carry out the work of changing the workpiece or changing the processing platform in another working area by performing the ray carving operation in a working area through the plurality of working areas of the rotating platform, thereby improving the processing flow. The work efficiency is used to perform the laser engraving work in a sequential manner by providing two-dimensional, three-dimensional or a combination thereof.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention.

2...立體雷射雕刻機2. . . Stereo laser engraving machine

4、4a、4b...加工件4, 4a, 4b. . . Machined parts

6...三維電路圖樣6. . . Three-dimensional circuit pattern

10、10’、10”...三維電路雷射加工裝置10, 10', 10"... three-dimensional circuit laser processing device

12...加工平台12. . . Processing platform

14、14a、14b...夾具單元14, 14a, 14b. . . Fixture unit

141、141a、141b...線性滑軌單元141, 141a, 141b. . . Linear slide unit

16、16a、16b...驅動單元16, 16a, 16b. . . Drive unit

18...控制單元18. . . control unit

20...轉軸支撐架20. . . Rotary support frame

20a...第一轉軸支撐架20a. . . First shaft support

20b...第二轉軸支撐架20b. . . Second shaft support frame

20c...第三轉軸支撐架20c. . . Third shaft support frame

20d...第四轉軸支撐架20d. . . Fourth shaft support frame

21...夾具單元twenty one. . . Fixture unit

21a...第一組夾具單元21a. . . First set of fixture units

21b...第二組夾具單元21b. . . Second set of fixture units

22...轉軸單元twenty two. . . Shaft unit

24...驅動單元twenty four. . . Drive unit

24a...第一組驅動單元24a. . . First group of drive units

24b...第二組驅動單元24b. . . Second group of drive units

26...立體雷射雕刻機旋轉平台26. . . Stereo laser engraving machine rotating platform

28...立體雷射雕刻機旋轉驅動單元28. . . Stereo laser engraving machine rotary drive unit

30...監控單元30. . . Monitoring unit

32...三維電路雷射加工裝置平台感應器32. . . Three-dimensional circuit laser processing device platform sensor

42...第一加工面42. . . First working surface

44...第二加工面44. . . Second working surface

46...第三加工面46. . . Third working surface

48...第四加工面48. . . Fourth processing surface

TDCS、TDCS’...控制訊號TDCS, TDCS’. . . Control signal

FA...第一工作區域FA. . . First work area

SA...第二工作區域SA. . . Second work area

X、Y、Z...座標X, Y, Z. . . coordinate

第一圖係本發明第一實施例之三維電路雷射加工裝置之線性滑動加工模組的立體示意圖。The first figure is a perspective view of a linear sliding processing module of a three-dimensional circuit laser processing apparatus according to a first embodiment of the present invention.

第二圖係本發明第二實施例之三維電路雷射加工裝置的立體示意圖。The second drawing is a perspective view of a three-dimensional circuit laser processing apparatus according to a second embodiment of the present invention.

第三圖係本發明第三實施例之三維電路雷射加工裝置的立體示意圖。The third figure is a perspective view of a three-dimensional circuit laser processing apparatus according to a third embodiment of the present invention.

第四圖係本發明之三維電路雷射加工裝置的立體應用示意圖。The fourth figure is a schematic diagram of a three-dimensional application of the three-dimensional circuit laser processing apparatus of the present invention.

2...立體雷射雕刻機2. . . Stereo laser engraving machine

4、4a、4b...加工件4, 4a, 4b. . . Machined parts

6...三維電路圖樣6. . . Three-dimensional circuit pattern

10...三維電路雷射加工裝置10. . . Three-dimensional circuit laser processing device

12...加工平台12. . . Processing platform

14、14a、14b...夾具單元14, 14a, 14b. . . Fixture unit

141、141a、141b...線性滑軌單元141, 141a, 141b. . . Linear slide unit

16、16a、16b...驅動單元16, 16a, 16b. . . Drive unit

18...控制單元18. . . control unit

TDCS...控制訊號TDCS. . . Control signal

X、Y...座標X, Y. . . coordinate

Claims (5)

一種三維電路雷射加工裝置,係於立體雷射雕刻機在複數加工件上雷雕一三維電路圖樣,其包含:加工平台;複數線性滑軌單元,係設置於該加工平台上;複數夾具單元,係設置於該線性滑軌單元上,該等夾具單元係用以夾持該等加工件;複數驅動單元,係設置於該加工平台上,該等驅動單元係分別地連接該等線性滑軌單元,且該等驅動單元係分別地驅動該等線性滑軌單元,用於供該等夾具單元進行直線運動;以及控制單元,係連接該等驅動單元,且該控制單元係根據該三維電路圖樣加工順序安排產生控制訊號用以控制該等夾具單元,用於供位於該等夾具單元上的該等加工件係輪序地雷雕該三維電路圖樣。A three-dimensional circuit laser processing device is a three-dimensional circuit pattern of a three-dimensional laser engraving machine on a plurality of processing parts, comprising: a processing platform; a plurality of linear sliding rail units disposed on the processing platform; a plurality of clamping unit Provided on the linear slide unit, the clamp unit is for holding the workpieces; the plurality of drive units are disposed on the processing platform, and the drive units are respectively connected to the linear slides Units, wherein the drive units respectively drive the linear slide units for linear movement of the clamp units; and a control unit that connects the drive units, and the control unit is based on the three-dimensional circuit pattern The processing sequence is arranged to generate control signals for controlling the fixture units for the workpieces located on the fixture units to sequentially engrave the three-dimensional circuit pattern. 一種三維電路雷射加工裝置,係於立體雷射雕刻機在複數加工件上雷雕一三維電路圖樣,其包含:加工平台;複數轉軸支撐架,係設置於該加工平台上;複數轉軸單元,係設置於該等轉軸支撐架上;複數夾具單元,係設置於該等轉軸單元上,該等夾具單元係用以夾持該等加工件;複數驅動單元,係設置於該等轉軸支撐架上,該等驅動單元係分別地連接該等轉軸單元,且該等驅動單元係分別地驅動該等轉軸單元,用以供該等夾具單元進行旋轉運動;以及控制單元,係連接該等驅動單元,且該控制單元係根據該三維電路圖樣加工順序安排產生控制訊號用以控制該等夾具單元,用於供位於該等夾具單元上的該等加工件係輪序地雷雕該三維電路圖樣。A three-dimensional circuit laser processing device is a three-dimensional circuit pattern of a three-dimensional laser engraving machine on a plurality of processing parts, comprising: a processing platform; a plurality of rotating shaft support frames disposed on the processing platform; a plurality of rotating shaft units, The plurality of clamp units are disposed on the shaft units, and the clamp units are configured to clamp the workpieces; the plurality of drive units are disposed on the shaft support frames The driving units are respectively connected to the rotating shaft units, and the driving units respectively drive the rotating shaft units for the rotary movement of the clamping units; and the control unit is connected to the driving units, And the control unit generates a control signal according to the processing sequence of the three-dimensional circuit pattern for controlling the fixture units, and the workpieces located on the fixture units are sequentially engraved to the three-dimensional circuit pattern. 如申請專利範圍第1項或第2項所述之三維電路雷射加工裝置,其中該三維電路雷射加工裝置係可固設於一立體雷射雕刻機旋轉平台上,且該立體雷射雕刻機旋轉平台由立體雷射雕刻機旋轉驅動單元驅動;其中,該立體雷射雕刻機旋轉平台具有第一工作區域與第二工作區域,用以分別設置一三維電路雷射加工裝置,該三維電路雷射加工裝置平台感應器係連接該控制單元,用於判斷該立體雷射雕刻機旋轉平台之第一工作區域與第二工作區域何者位於雷射加工區中;一立體雷射雕刻機之旋轉平台切換紐係連接該立體雷射雕刻機旋轉平台,其係用於旋轉切換該立體雷射雕刻機旋轉平台,令該立體雷射雕刻機旋轉平台於該第一工作區域與該第二工作區域之間進行切換。The three-dimensional circuit laser processing apparatus according to claim 1 or 2, wherein the three-dimensional circuit laser processing apparatus is fixed on a rotating platform of a stereo laser engraving machine, and the three-dimensional laser engraving The rotating platform of the machine is driven by a rotating driving unit of a stereo laser engraving machine; wherein the rotating platform of the stereo laser engraving machine has a first working area and a second working area for respectively respectively setting a three-dimensional circuit laser processing device, the three-dimensional circuit The laser processing device platform sensor is connected to the control unit for determining whether the first working area and the second working area of the rotating platform of the stereo laser engraving machine are located in the laser processing area; the rotation of a stereo laser engraving machine The platform switching button is connected to the rotating platform of the stereo laser engraving machine, and is used for rotating and switching the rotating platform of the stereo laser engraving machine, so that the stereo laser engraving machine rotates the platform in the first working area and the second working area. Switch between. 如申請專利範圍第3項所述之三維電路雷射加工裝置,其中該驅動單元係為伺服步進馬達。The three-dimensional circuit laser processing apparatus of claim 3, wherein the driving unit is a servo stepping motor. 如申請專利範圍第4項所述之三維電路雷射加工裝置,更包含監控單元,係設置於該立體雷射雕刻機旋轉平台之雷射加工側,且與該控制單元電性連接,其中,監控單元係用以監控該三維電路雷射加工裝置上的一預設座標點,其中,當該立體雷射雕刻機完成一加工面之加工程序,該立體雷射雕刻機之雷射光束即移動至該預設座標點,該監控單元偵測得該雷射光束,即可判斷該雷射雕刻機已經完成該加工面之加工程序。The three-dimensional circuit laser processing apparatus of claim 4, further comprising a monitoring unit disposed on a laser processing side of the rotating platform of the stereo laser engraving machine, and electrically connected to the control unit, wherein The monitoring unit is configured to monitor a preset coordinate point on the three-dimensional circuit laser processing device, wherein when the stereo laser engraving machine completes a processing process of the processing surface, the laser beam of the stereo laser engraving machine moves Up to the preset coordinate point, the monitoring unit detects the laser beam, and can determine that the laser engraving machine has completed the processing procedure of the processing surface.
TW100141586A 2011-11-15 2011-11-15 Laser processing device for three-dimensional circuit TW201318749A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100141586A TW201318749A (en) 2011-11-15 2011-11-15 Laser processing device for three-dimensional circuit
CN2012104593416A CN103100793A (en) 2011-11-15 2012-11-15 Three-dimensional circuit laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100141586A TW201318749A (en) 2011-11-15 2011-11-15 Laser processing device for three-dimensional circuit

Publications (1)

Publication Number Publication Date
TW201318749A true TW201318749A (en) 2013-05-16

Family

ID=48309177

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100141586A TW201318749A (en) 2011-11-15 2011-11-15 Laser processing device for three-dimensional circuit

Country Status (2)

Country Link
CN (1) CN103100793A (en)
TW (1) TW201318749A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109108475A (en) * 2018-09-11 2019-01-01 佛山运安激光制版有限公司 A kind of laser engraving workbench for ceramic panel

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102547729B1 (en) * 2018-06-29 2023-06-27 주식회사 고영테크놀러지 Object inspection device and object inspection method using the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW445013U (en) * 1999-07-02 2001-07-01 Enlight Corp Tilter with improved turnover holding device
JP4215677B2 (en) * 2003-08-25 2009-01-28 日立ビアメカニクス株式会社 Laser processing machine and laser processing method
US7820942B1 (en) * 2004-03-30 2010-10-26 Hillerich & Bradsby Co. Automatic leveling fixture
US7760331B2 (en) * 2007-02-20 2010-07-20 Electro Scientific Industries, Inc. Decoupled, multiple stage positioning system
CN201046525Y (en) * 2007-03-14 2008-04-16 上海加扬光电科技有限公司 Laser cutting positioning means having double-station switching work bench
TWM323355U (en) * 2007-07-06 2007-12-11 Kin Tec Technology Corp Improved structure for laser sculpturing machine
TWI333437B (en) * 2007-10-30 2010-11-21 Mirle Automation Corp Automatic control method of laser cutting apparatus
CN201353692Y (en) * 2008-12-30 2009-12-02 武汉楚天激光(集团)股份有限公司 Turntable multi-station fixture
CN201371318Y (en) * 2009-03-09 2009-12-30 深圳市大族激光科技股份有限公司 Rotary clamping device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109108475A (en) * 2018-09-11 2019-01-01 佛山运安激光制版有限公司 A kind of laser engraving workbench for ceramic panel

Also Published As

Publication number Publication date
CN103100793A (en) 2013-05-15

Similar Documents

Publication Publication Date Title
CN103878535B (en) Metalwork processing method
JP6457177B2 (en) Machine tool control system
CN103878588B (en) Metalwork processing method
JP6071862B2 (en) Metal processing method
JP6457178B2 (en) Machine tool control system
CN106736630A (en) Five- sided machining machine
JP5687854B2 (en) Multi-face processing machine
JP2006297520A (en) Multi-axis spherical grinding device and grinding method
KR101297125B1 (en) Apparatus for glass processing and control method for the same
JP2017205838A (en) One-surface polishing device of plate-like substrate
CN105328500A (en) Numerical control machine tool internally provided with automatic feeding and discharging mechanism and method for conducting workpiece feeding and discharging
JP5305733B2 (en) Printed circuit board dividing apparatus and method
US9566648B2 (en) Lathe control system
KR100928288B1 (en) Combined machines with individually movable cutting machines
TW201318749A (en) Laser processing device for three-dimensional circuit
TW201424923A (en) Machining method for metallic workpiece
CN106181386A (en) A kind of continous drilling machine
CN107132816B (en) A kind of control method and its corresponding control system of digital-control two-head milling machine
JP2013136137A (en) Multiple face machining apparatus
CN202701914U (en) Processing machine structure with several independent processing stations
TWI597114B (en) Horizontal turning machine for milling machines (1)
CN114473742A (en) Grinding machines for machining grooved components
JP6071864B2 (en) Metal processing method
CN206286900U (en) A kind of processing head is not shut down and takes material-changing device
JP2015072993A (en) Cutting method