TW201302616A - A method for preparing indium sulfide thin film - Google Patents
A method for preparing indium sulfide thin film Download PDFInfo
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- TW201302616A TW201302616A TW100124552A TW100124552A TW201302616A TW 201302616 A TW201302616 A TW 201302616A TW 100124552 A TW100124552 A TW 100124552A TW 100124552 A TW100124552 A TW 100124552A TW 201302616 A TW201302616 A TW 201302616A
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- Prior art keywords
- indium
- sulfide film
- preparing
- indium sulfide
- ions
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- GKCNVZWZCYIBPR-UHFFFAOYSA-N sulfanylideneindium Chemical compound [In]=S GKCNVZWZCYIBPR-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000010409 thin film Substances 0.000 title description 27
- 229910001449 indium ion Inorganic materials 0.000 claims abstract description 53
- 239000011259 mixed solution Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000008139 complexing agent Substances 0.000 claims abstract description 22
- RWSOTUBLDIXVET-UHFFFAOYSA-M hydrosulfide Chemical compound [SH-] RWSOTUBLDIXVET-UHFFFAOYSA-M 0.000 claims abstract description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 5
- 239000001257 hydrogen Substances 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 4
- 238000006243 chemical reaction Methods 0.000 claims description 27
- -1 hydrogen sulfide ions Chemical class 0.000 claims description 21
- 229910000037 hydrogen sulfide Inorganic materials 0.000 claims description 18
- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 claims description 16
- DLFVBJFMPXGRIB-UHFFFAOYSA-N thioacetamide Natural products CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 12
- 239000011975 tartaric acid Substances 0.000 claims description 12
- 235000002906 tartaric acid Nutrition 0.000 claims description 12
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 11
- 229910052738 indium Inorganic materials 0.000 claims description 11
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 11
- 229910052750 molybdenum Inorganic materials 0.000 claims description 11
- 239000011733 molybdenum Substances 0.000 claims description 11
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 10
- 229910000337 indium(III) sulfate Inorganic materials 0.000 claims description 9
- XGCKLPDYTQRDTR-UHFFFAOYSA-H indium(iii) sulfate Chemical compound [In+3].[In+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGCKLPDYTQRDTR-UHFFFAOYSA-H 0.000 claims description 9
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 claims description 3
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- VBXWCGWXDOBUQZ-UHFFFAOYSA-K diacetyloxyindiganyl acetate Chemical compound [In+3].CC([O-])=O.CC([O-])=O.CC([O-])=O VBXWCGWXDOBUQZ-UHFFFAOYSA-K 0.000 claims description 2
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000010408 film Substances 0.000 description 56
- 239000000243 solution Substances 0.000 description 22
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 10
- 125000002843 carboxylic acid group Chemical group 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 230000006911 nucleation Effects 0.000 description 9
- 238000010899 nucleation Methods 0.000 description 9
- 239000002981 blocking agent Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 4
- 238000000224 chemical solution deposition Methods 0.000 description 4
- 239000001384 succinic acid Substances 0.000 description 4
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- SIXIBASSFIFHDK-UHFFFAOYSA-N indium(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[In+3].[In+3] SIXIBASSFIFHDK-UHFFFAOYSA-N 0.000 description 3
- IGUXCTSQIGAGSV-UHFFFAOYSA-K indium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[In+3] IGUXCTSQIGAGSV-UHFFFAOYSA-K 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000009920 chelation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000138 intercalating agent Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052976 metal sulfide Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 238000001237 Raman spectrum Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1233—Organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
本發明係有關於硫化銦薄膜的製備,且特別是有關於一種利用化學浴沉積(chemical bath deposition)法形成硫化銦薄膜的方法。The present invention relates to the preparation of indium sulfide thin films, and more particularly to a method of forming an indium sulfide thin film by a chemical bath deposition method.
在薄膜太陽能電池中,緩衝層是相當重要的一部分,其能與吸收層形成p-n接面(p-n junction),幫助電子有效傳導,使光能得以充份轉換成為電能。In thin-film solar cells, the buffer layer is a very important part, which can form a p-n junction with the absorption layer to help the electrons to conduct efficiently, so that the light energy can be fully converted into electrical energy.
自從1982年波音公司發表了化學浴鍍膜法(chemical bath deposition,CBD),化學浴鍍膜法便成為一廣為人知的薄膜製備技術。該技術的優點包括容易實施、設備成本低廉、鍍膜品質優良等,因此適用於太陽能電池緩衝層的製備。Since Boeing published chemical bath deposition (CBD) in 1982, chemical bath coating has become a well-known film preparation technology. The advantages of this technology include easy implementation, low equipment cost, excellent coating quality, etc., and therefore are suitable for the preparation of a solar cell buffer layer.
在化學浴鍍膜法製程當中,會牽涉到兩種成核機制,包括同質成核以及異質成核。異質成核係溶液當中的陰陽離子在異質介面上形成晶核,該晶核經過後續離子繼續堆疊的化學反應,成長並在異質介面處形成薄膜。同質成核則為在液體中陰陽離子直接形成晶核,經過後續離子繼續堆疊的化學反應之後,在溶液中形成了顆粒狀的懸浮物。In the chemical bath coating process, two nucleation mechanisms are involved, including homogenous nucleation and heterogeneous nucleation. The anion and cation in the heterogeneous nucleating system solution form a crystal nucleus on the heterogeneous interface, and the nucleus continues to stack chemical reaction through the subsequent ions, and grows and forms a thin film at the hetero interface. Homogeneous nucleation is the formation of a nucleus directly in the liquid, and after the chemical reaction of the subsequent ions to continue stacking, a granular suspension is formed in the solution.
一般而言,將化學浴鍍膜法運用在製備太陽能電池緩衝層材料時,反應主要由氫硫根離子(HS-)以及金屬離子反應,形成金屬硫化物薄膜沉積於基材上。傳統上,由於用以提供氫硫根離子的化學品為硫脲,其必須在鹼性環境下與氫氧根(OH-)作用才會將氫硫根離子釋放至溶液中,在酸性環境下則會釋放硫離子(S2-),因此以化學浴鍍膜法製備緩衝層時一般係在鹼性環境下進行。然而,若所使用的金屬離子在鹼性環境下容易形成不溶性的氫氧化物沉澱,則無法利用化學浴鍍膜法來製備所需的金屬硫化物薄膜。In general, when the chemical bath coating method is applied to the preparation of a solar cell buffer layer material, the reaction is mainly carried out by reacting hydrogen sulfide ions (HS - ) and metal ions to form a metal sulfide film deposited on the substrate. Traditionally, since the chemical used to supply the hydrogen sulfide ion is thiourea, it must react with hydroxide (OH - ) in an alkaline environment to release the hydrogen sulfide ion into the solution, in an acidic environment. Sulfide ions (S 2− ) are released, so that the buffer layer is prepared by a chemical bath coating method generally in an alkaline environment. However, if the metal ions used are likely to form an insoluble hydroxide precipitate in an alkaline environment, the desired metal sulfide film cannot be prepared by a chemical bath plating method.
常見的緩衝層材料為硫化鎘(CdS),但鎘為重金屬,對人與環境易造成危害,故開發無鎘緩衝層為未來研發的重要方向。硫化銦(In2S3)為目前研究較多的無鎘緩衝層材料。硫化銦的製備方法例如為原子層沉積法(atomic layer deposition,ALD)、蒸鍍法(evaporation)及濺射法(sputtering)等。然而,氣相製備的方法大多需要真空、高溫等嚴苛的條件,容易破壞薄膜原有的形貌。The common buffer layer material is cadmium sulfide (CdS), but cadmium is a heavy metal, which is easy to cause harm to people and the environment. Therefore, the development of cadmium-free buffer layer is an important direction for future research and development. Indium sulfide (In 2 S 3 ) is a cadmium-free buffer layer material which is currently studied. The preparation method of indium sulfide is, for example, atomic layer deposition (ALD), evaporation, sputtering, or the like. However, most methods for gas phase preparation require harsh conditions such as vacuum and high temperature, which easily destroy the original morphology of the film.
因此,目前亟需開發一種方法簡單、成本低廉、毒性危害少、且可大規模生產的緩衝層製備方法。Therefore, there is an urgent need to develop a buffer layer preparation method which is simple in method, low in cost, less toxic and harmful, and can be mass-produced.
本發明一實施例提供一種硫化銦薄膜的製備方法,包括:提供一含有錯合劑、銦離子、以及氫硫根離子的混合溶液;以及將該混合溶液與一基板接觸,以於該基板上形成一硫化銦(In2S3)薄膜;其中該錯合劑具有下列化學式:An embodiment of the present invention provides a method for preparing an indium sulfide film, comprising: providing a mixed solution containing a binder, indium ions, and hydrogen sulfide ions; and contacting the mixed solution with a substrate to form on the substrate An indium sulfide (In 2 S 3 ) film; wherein the compounding agent has the following chemical formula:
其中,R1及R2各自獨立地為氫或羥基。Wherein R 1 and R 2 are each independently hydrogen or a hydroxyl group.
為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉出較佳實施例,並配合所附圖式,作詳細說明如下:The above and other objects, features and advantages of the present invention will become more <RTIgt;
以下依本發明之不同特徵舉出數個不同的實施例。本發明中特定的元件及安排係為了簡化,但本發明並不以這些實施例為限。舉例而言,於第二元件上形成第一元件的描述可包括第一元件與第二元件直接接觸的實施例,亦包括具有額外的元件形成在第一元件與第二元件之間、使得第一元件與第二元件並未直接接觸的實施例。此外,為簡明起見,本發明在不同例子中以重複的元件符號及/或字母表示,但不代表所述各實施例及/或結構間具有特定的關係。Several different embodiments are set forth below in accordance with various features of the invention. The specific elements and arrangements of the present invention are intended to be simplified, but the invention is not limited to these embodiments. For example, a description of forming a first element on a second element can include an embodiment in which the first element is in direct contact with the second element, and also includes having additional elements formed between the first element and the second element such that An embodiment in which one element is not in direct contact with the second element. In addition, the present invention is represented by the repeated reference numerals and/or letters in the different examples for the sake of brevity, but does not represent a particular relationship between the various embodiments and/or structures.
本發明實施例提供一種硫化銦薄膜的製備方法,其反應時間短、鍍膜品質佳、反應溫度低、方法簡單、成本低廉且毒性危害少,故產業應用性佳,例如可作為硒化銅銦鎵(Copper Indium Gallium Diselenide,簡稱為CIGS)薄膜太陽能電池的緩衝層。The embodiment of the invention provides a preparation method of an indium sulfide film, which has the advantages of short reaction time, good coating quality, low reaction temperature, simple method, low cost and less toxicity, so the industrial application is good, for example, it can be used as copper indium gallium selenide. (Copper Indium Gallium Diselenide, abbreviated as CIGS) buffer layer of thin film solar cells.
首先,提供含有錯合劑、銦離子、以及氫硫根離子的混合溶液。例如,可先添加錯合劑,再添加銦離子及氫硫根離子。而後,將上述混合溶液與基板接觸,在室溫或加熱條件下於基板上形成硫化銦(In2S3)薄膜。First, a mixed solution containing a binder, indium ions, and hydrogen sulfide ions is provided. For example, a miscible agent may be added first, followed by addition of indium ions and hydrogen sulfide ions. Then, the mixed solution is brought into contact with the substrate, and an indium sulfide (In 2 S 3 ) film is formed on the substrate at room temperature or under heating.
上述錯合劑可具有下列化學式:The above complexing agent may have the following chemical formula:
其中,R1及R2獨立地包括氫或羥基。錯合劑的具體實施例包括酒石酸(tartaric acid)、琥珀酸(succinic acid)、或前述之組合。Wherein R 1 and R 2 independently comprise hydrogen or a hydroxyl group. Specific examples of the complexing agent include tartaric acid, succinic acid, or a combination of the foregoing.
上述錯合劑的功能,在於以兩個羧酸基螯合溶液中的銦離子。一般而言,在進行螯合時,必須依照螯合目標的尺寸大小選擇適當的錯合劑,因此不同的離子所適用的錯合劑也不相同。發明人發現,對於銦離子而言,使用的錯合劑上的羧酸基之間需恰好相隔兩個碳,才能使得兩個羧酸基之間的距離與銦離子大小相配,因而可與銦離子有良好的螯合能力。若錯合劑的兩個羧酸基之間只有一個碳的距離,例如以丙二酸為錯合劑,則會因為羧酸基間的距離太小,而無法順利螯合銦離子。反之,若錯合劑的兩個羧酸基之間具有超過兩個碳的距離,例如錯合劑為兩個羧酸基之間距離三個碳的檸檬酸,則會因為羧酸基間的距離太大且可自由轉動的範圍大,也無法對銦離子有良好的螯合能力。The function of the above-mentioned complexing agent is to sequester the indium ions in the solution with two carboxylic acid groups. In general, when chelation is performed, it is necessary to select an appropriate complexing agent according to the size of the chelate target, and thus the different intercalating agents for different ions are also different. The inventors have found that for indium ions, the carboxylic acid groups on the complexing agent used need to be exactly two carbons apart, so that the distance between the two carboxylic acid groups matches the size of the indium ions, and thus can be combined with indium ions. Have good chelation ability. If there is only one carbon distance between the two carboxylic acid groups of the wrong agent, for example, malonic acid is used as a blocking agent, the indium ions cannot be smoothly sequestered because the distance between the carboxylic acid groups is too small. Conversely, if the two carboxylic acid groups of the wrong agent have a distance of more than two carbons, for example, the wrong agent is citric acid having a distance of three carbons between the two carboxylic acid groups, because the distance between the carboxylic acid groups is too It has a large and freely rotatable range and does not have a good chelating ability for indium ions.
混合溶液中銦離子來源可藉由在溶液中加入含有銦的金屬鹽類而得,例如加入硫酸銦、氯化銦、醋酸銦、其他可溶於水而產生銦離子的鹽類、或前述之組合。另外,混合溶液中的氫硫根離子來源,則可利用在溶液中加入硫代乙醯胺而得。所形成的混合溶液的pH值可介於1至3之間。在本發明一實施例中,上述具有錯合劑、銦離子、以及氫硫根離子的混合溶液,其錯合劑、銦離子、以及氫硫根離子的濃度比例介於0.01 M~0.5 M:0.025 M~0.1 M:0.01 M~1 M,較佳介於0.05 M~0.15 M:0.04 M~0.12 M:0.04 M~0.4 M。The source of indium ions in the mixed solution can be obtained by adding a metal salt containing indium to the solution, for example, adding indium sulfate, indium chloride, indium acetate, other salts soluble in water to generate indium ions, or the foregoing combination. In addition, the source of the hydrogen sulfide ion in the mixed solution can be obtained by adding thioacetamide to the solution. The pH of the resulting mixed solution may be between 1 and 3. In an embodiment of the invention, the mixed solution having the wrong agent, the indium ion, and the hydrogen sulfide ion has a concentration ratio of the wrong agent, the indium ion, and the hydrogen sulfide ion of 0.01 M to 0.5 M: 0.025 M. ~0.1 M: 0.01 M~1 M, preferably between 0.05 M and 0.15 M: 0.04 M~0.12 M: 0.04 M~0.4 M.
在製得具有錯合劑、銦離子、以及氫硫根離子的混合溶液後,可利用化學浴鍍膜法在各種基板(包括,但不限於,硒化銅銦鎵(Copper Indium Gallium Diselenide,簡稱為CIGS)基板)上沉積硫化銦薄膜。化學浴鍍膜法的反應溫度並無特別限制,一般可介於25℃至80℃之間。硫化銦薄膜的沉積厚度可依實際需要進行調整。當作為硒化銅銦鎵薄膜太陽能電池的緩衝層時,其厚度一般可介於20至100 nm之間。After preparing a mixed solution having a wrong agent, indium ions, and hydrogen sulfide ions, a chemical bath coating method can be used on various substrates (including, but not limited to, Copper Indium Gallium Diselenide (CIGS). A film of indium sulfide is deposited on the substrate). The reaction temperature of the chemical bath coating method is not particularly limited and may generally be between 25 ° C and 80 ° C. The thickness of the indium sulfide film can be adjusted according to actual needs. When used as a buffer layer for a copper indium gallium selenide thin film solar cell, the thickness is generally between 20 and 100 nm.
第1圖顯示一典型的硒化銅銦鎵薄膜太陽能電池的示意圖。如第1圖所示,薄膜太陽能電池包括一基材102,在基材102上依序為背電極104、硒化銅銦鎵吸收層106、硫化銦薄膜緩衝層108、以及透明導電層110。在上述中,基材102例如為玻璃、高分子基材、或金屬基板。背電極104例如鉬。透明導電層110例如為氧化鋅層。Figure 1 shows a schematic of a typical copper indium gallium selenide thin film solar cell. As shown in FIG. 1, the thin film solar cell includes a substrate 102 on which a back electrode 104, a copper indium gallium selenide absorber layer 106, an indium sulfide thin film buffer layer 108, and a transparent conductive layer 110 are sequentially disposed. In the above, the substrate 102 is, for example, glass, a polymer substrate, or a metal substrate. Back electrode 104 is, for example, molybdenum. The transparent conductive layer 110 is, for example, a zinc oxide layer.
在一特定實施例中,可將已形成有背電極104以及硒化銅銦鎵吸收層106的基材102浸入前述之混合溶液,以形成硫化銦薄膜緩衝層108。以本發明實施例中所形成的硫化銦薄膜具有平整緻密的表面,應用於太陽能電池的緩衝層可使電池的性能具有良好的可靠度。In a specific embodiment, the substrate 102 on which the back electrode 104 and the copper indium gallium selenide absorbing layer 106 have been formed may be immersed in the aforementioned mixed solution to form an indium sulfide thin film buffer layer 108. The indium sulfide film formed in the embodiment of the invention has a flat and dense surface, and the buffer layer applied to the solar cell can have good reliability of the performance of the battery.
一般而言,化學浴鍍膜法包括同質成核及異質成核兩種機制。因此,在形成硫化銦薄膜時,若錯合劑與銦離子有良好的螯合能力,例如使用本發明所述兩個羧酸基之間恰好相隔兩個碳的錯合劑,則傾向進行異質成核的步驟。亦即,溶液中的氫硫根離子先接上被錯合劑螯合上的銦離子後,錯合劑才從銦離子上離開。此時,另一個氫硫根離子可再接在此銦離子上,並重複進行上述步驟。因此,在異質成核的過程中,薄膜係由一個個原子逐步堆疊形成,而成為一種短程有序長程無序的狀態,故所形成的硫化銦薄膜為非晶態(amorphous)的型態。在此條件下所形成的硫化銦薄膜表面平整,因此在作為太陽能薄膜電池的緩衝層時,可與上方的透明導電層有良好的接合,而不會有空隙產生。In general, chemical bath coating methods include both homogenous nucleation and heterogeneous nucleation. Therefore, in the formation of an indium sulfide thin film, if the complexing agent has a good chelating ability with the indium ion, for example, the use of the two carboxylic acid groups in the present invention is precisely a two-carbon intercalating agent, which tends to undergo heterogeneous nucleation. A step of. That is, after the hydrogen sulfide ion in the solution is first connected to the indium ion chelated by the wrong agent, the complexing agent is separated from the indium ion. At this time, another hydrogen sulfide ion can be re-attached to the indium ion, and the above steps are repeated. Therefore, in the process of heterogeneous nucleation, the film is formed by stacking one atom at a time, and becomes a short-range ordered long-range disorder state, so the formed indium sulfide film is in an amorphous state. The indium sulfide thin film formed under this condition has a flat surface, and therefore, when used as a buffer layer of a solar thin film battery, it can be joined well to the upper transparent conductive layer without voids.
然而,若錯合劑與銦離子的螯合能力不佳,例如使用兩個羧酸基之間相隔少於或多於兩個碳的錯合劑,則傾向進行同質成核的步驟。由於當錯合劑與銦離子無法良好的螯合,銦離子會大量的存在於溶液中,因而迅速的和溶液中的硫離子反應形成硫化銦。而後,溶液中的硫化銦再進行堆疊,而形成結晶態(crystalline)的硫化銦薄膜。這種結晶態的硫化銦薄膜具有針狀的表面,若作為太陽能電池的緩衝層,其粗糙的表面會造成很多電池內部的空洞,因而造成電阻值過大。However, if the chelating ability of the complexing agent with indium ions is not good, for example, a complexing agent in which two carboxylic acid groups are separated by less than or more than two carbons is used, the step of homogenous nucleation tends to proceed. Since the indium ions are not well chelated in the solution when the complexing agent is not well-bonded with the indium ions, the indium ions are rapidly reacted with the sulfur ions in the solution to form indium sulfide. Then, the indium sulfide in the solution is further stacked to form a crystalline indium sulfide film. Such a crystalline indium sulfide film has a needle-like surface. If it is used as a buffer layer of a solar cell, the rough surface thereof causes a lot of voids inside the battery, thereby causing an excessive resistance value.
此外,當錯合劑與銦離子的螯合能力不佳而造成溶液中有大量銦離子時,銦離子會跟溶液中的氫氧根離子反應,形成銦的氫氧化物沉澱,而無法形成純度高的硫化銦薄膜。由於銦的氫氧化物會影響能隙(energy gap)的大小,亦即當氫氧化物含量越高時,其能隙越大。因此將導致硫化銦薄膜與CIGS吸收層的能階不匹配,且容易形成異質介面(Heterointerface),造成結構的缺陷。此時,將使得電池穿透度下降及電阻值上升,故電池效率無法達到最佳狀態。故傳統上在形成硫化銦薄膜時,為了避免氫氧化物的產生,必須在製程過程中加入酸,例如為鹽酸,以中和溶液中的氫氧根。In addition, when the chelating ability of the complexing agent with indium ions is poor and a large amount of indium ions are present in the solution, the indium ions react with the hydroxide ions in the solution to form a hydroxide precipitate of indium, which cannot form a high purity. Indium sulfide film. Since the hydroxide of indium affects the size of the energy gap, that is, the higher the hydroxide content, the larger the energy gap. Therefore, the indium sulfide film does not match the energy level of the CIGS absorber layer, and the Hetero interface is easily formed, causing structural defects. At this time, the battery penetration is lowered and the resistance value is increased, so that the battery efficiency cannot be optimized. Therefore, in order to avoid the generation of hydroxide when forming an indium sulfide film, it is necessary to add an acid such as hydrochloric acid during the process to neutralize the hydroxide in the solution.
然而,由於本發明所使用的錯合劑與銦離子有良好的螯合能力,溶液中不會有大量的銦離子與氫氧根反應,因此不需添加額外的酸調整溶液pH值,即可避免銦的氫氧化物的產生,而可得到高純度的硫化銦薄膜。However, since the complexing agent used in the present invention has a good chelating ability with indium ions, a large amount of indium ions do not react with the hydroxide in the solution, so that it is possible to avoid the addition of an additional acid to adjust the pH of the solution. The formation of a high purity indium sulfide thin film can be obtained by the formation of a hydroxide of indium.
【實施例1】[Example 1]
首先,以酒石酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:酒石酸:硫代乙醯胺的濃度比為0.008 M:0.1 M:0.04 M。將上述混合溶液置於反應容器中。First, tartaric acid is used as a blocking agent, and it is dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which can release indium ions is added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: tartaric acid: thioacetamide is 0.008 M: 0.1 M: 0.04 M. The above mixed solution was placed in a reaction vessel.
以印刷硒化銅銦鎵(printing CIGS)層作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應105分鐘,而得到黃色的硫化銦薄膜。硫化銦薄膜在硒化銅銦鎵層上的覆蓋率大於99%,且其膜厚約為30 nm。參照第2圖為所形成硫化銦薄膜的二次電子影像圖(secondary electron image;SEI)。A printed CIGS layer was printed as a substrate, and immersed in a mixed solution having a binder, an indium ion, and a hydrogen sulfide ion in a face down manner, and the reaction vessel was covered. The reaction was carried out for 105 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film. The coverage of the indium sulfide film on the copper indium gallium selenide layer is greater than 99%, and the film thickness is about 30 nm. Referring to Fig. 2, a secondary electron image (SEI) of the formed indium sulfide thin film is shown.
【實施例2】[Example 2]
首先,以酒石酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:酒石酸:硫代乙醯胺的濃度比為0.008 M:0.1 M:0.24 M。將上述混合溶液置於反應容器中。First, tartaric acid is used as a blocking agent, and it is dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which can release indium ions is added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: tartaric acid: thioacetamide is 0.008 M: 0.1 M: 0.24 M. The above mixed solution was placed in a reaction vessel.
以濺鍍硒化銅銦鎵(sputtering CIGS)層作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應45分鐘,而得到黃色的硫化銦薄膜。硫化銦薄膜在硒化銅銦鎵層上的覆蓋率大於99%,且其膜厚約為50-100nm。參照第3圖為所形成硫化銦薄膜的二次電子影像圖。A sputtering CIGS layer is sputtered as a substrate, and is immersed in a mixed solution having a dissimilar agent, an indium ion, and a hydrogen sulfide ion in a face down manner, and the reaction container is covered. . The reaction was carried out for 45 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film. The coverage of the indium sulfide film on the copper indium gallium selenide layer is greater than 99%, and the film thickness thereof is about 50-100 nm. Referring to Fig. 3, a secondary electron image of the formed indium sulfide film is shown.
【實施例3】[Example 3]
首先,以酒石酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:酒石酸:硫代乙醯胺的濃度比為0.008M:0.1M:0.4M。將上述混合溶液置於反應容器中。First, tartaric acid is used as a blocking agent, and it is dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which can release indium ions is added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: tartaric acid: thioacetamide is 0.008 M: 0.1 M: 0.4 M. The above mixed solution was placed in a reaction vessel.
印刷硒化銅銦鎵(printing CIGS)層作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應20分鐘,而得到黃色的硫化銦薄膜。硫化銦薄膜在CIGS的基板上的覆蓋率大於99%,且其膜厚約為20-40 nm。參照第4圖為所形成硫化銦薄膜的二次電子影像圖。A printed CIGS layer was printed as a substrate, and immersed in a mixed solution having a binder, indium ions, and hydrogen sulfide ions in a face down manner, and the reaction vessel was covered. The reaction was carried out for 20 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film. The coverage of the indium sulfide film on the substrate of CIGS is greater than 99%, and the film thickness is about 20-40 nm. Referring to Fig. 4, a secondary electron image of the formed indium sulfide thin film is shown.
此外,將上述硫化銦薄膜實際作為電池的緩衝層,並測試其電池效率。首先,將氧化銅、氧化鎵及氧化銦依特定比例(Cu/(In+Ga)=0.85/(0.7+0.3)混合,經由球磨製成奈米氧化物粒子。然後,將前述粒子以刮刀塗佈於鉬/鉻/不鏽鋼基板上。接著經過氫還原(H2 reduction process)與硒化(selenized)後即可得到CIGS吸收層薄膜。之後,以上述化學浴沉積法將硫化銦薄膜沉積於吸收層上。再將ZnO/AZO(摻鋁氧化鋅)濺鍍於硫化銦層上,最後再鍍上電極,即完成電池元件的製作。將2×2平方公分的電池分割成九個小面積(0.141平方公分)的電池(cell1-9),以電流-電壓及量子效率來測量光伏性質性質。Further, the above-mentioned indium sulfide film was actually used as a buffer layer of the battery, and its battery efficiency was tested. First, copper oxide, gallium oxide, and indium oxide are mixed in a specific ratio (Cu/(In+Ga)=0.85/(0.7+0.3), and nano-oxide particles are formed by ball milling. Then, the aforementioned particles are coated with a doctor blade. after the cloth. then after hydrogen reduction (H 2 reduction process) after selenide (selenized) to give the CIGS absorber layer is a thin film on a molybdenum / chromium / steel substrate., by the chemical bath deposition film deposited on the indium sulfide absorbent On the layer, ZnO/AZO (aluminum-doped zinc oxide) is sputtered on the indium sulfide layer, and finally the electrode is plated to complete the fabrication of the battery element. The 2×2 square centimeter battery is divided into nine small areas ( The 0.141 cm2 battery (cell1-9) measures the nature of the photovoltaic properties with current-voltage and quantum efficiency.
第5圖顯示利用硫化銦薄膜作為CIGS電池的緩衝層時,其電池效率的結果。由第5圖中可看出,以硫化銦薄膜作為CIGS電池的緩衝層可有良好的電池效率(電池效率約為11%),故可用以取代傳統的硫化鎘緩衝層,以避免鎘對環境的污染。Fig. 5 shows the results of battery efficiency when an indium sulfide thin film was used as a buffer layer of a CIGS battery. As can be seen from Figure 5, the indium sulfide film can be used as a buffer layer for CIGS cells with good battery efficiency (cell efficiency is about 11%), so it can be used to replace the traditional cadmium sulfide buffer layer to avoid cadmium to the environment. Pollution.
【實施例4】[Embodiment 4]
首先,以酒石酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:酒石酸:硫代乙醯胺的濃度比為0.008M:0.1M:0.4M。將上述混合溶液置於反應容器中。First, tartaric acid is used as a blocking agent, and it is dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which can release indium ions is added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: tartaric acid: thioacetamide is 0.008 M: 0.1 M: 0.4 M. The above mixed solution was placed in a reaction vessel.
以鉬玻璃作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應30分鐘,而得到黃色的硫化銦薄膜。硫化銦薄膜在鉬玻璃的基板上的覆蓋率大於99%,且其膜厚約為50~60 nm。參照第6圖為所形成硫化銦薄膜的二次電子影像圖。Molybdenum glass was used as a substrate, and immersed in a mixed solution having a binder, indium ions, and hydrogen sulfide ions in a face down manner, and the reaction vessel was covered. The reaction was carried out for 30 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film. The coverage of the indium sulfide film on the substrate of the molybdenum glass is greater than 99%, and the film thickness thereof is about 50 to 60 nm. Referring to Fig. 6, a secondary electron image of the formed indium sulfide film is shown.
第7圖為所形成的硫化銦薄膜的萊曼光譜圖。由於圖中沒有銦與氫氧根鍵結及氧化銦的訊號,只有硫化銦的訊號,亦即,所形成的硫化銦薄膜沒有銦的氫氧化物或氧化物的污染,而可以得到高純度的硫化銦薄膜。Fig. 7 is a Raman spectrum of the formed indium sulfide thin film. Since there is no signal of indium and hydroxide bonding and indium oxide in the figure, only the signal of indium sulfide, that is, the formed indium sulfide film is not contaminated by indium hydroxide or oxide, and high purity can be obtained. Indium sulfide film.
【實施例5】[Embodiment 5]
首先,以琥珀酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:琥珀酸:硫代乙醯胺的濃度比為0.008M:0.1M:0.4M。將上述混合溶液置於反應容器中。First, succinic acid was used as a blocking agent, and it was dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which released indium ions was added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: succinic acid: thioacetamide was 0.008 M: 0.1 M: 0.4 M. The above mixed solution was placed in a reaction vessel.
以鉬玻璃作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應30分鐘,而得到黃色的硫化銦薄膜。硫化銦薄膜在鉬玻璃的基板上的覆蓋率大於99%,且其膜厚約為50~60 nm。參照第8圖為所形成硫化銦薄膜的二次電子影像圖。Molybdenum glass was used as a substrate, and immersed in a mixed solution having a binder, indium ions, and hydrogen sulfide ions in a face down manner, and the reaction vessel was covered. The reaction was carried out for 30 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film. The coverage of the indium sulfide film on the substrate of the molybdenum glass is greater than 99%, and the film thickness thereof is about 50 to 60 nm. Referring to Fig. 8, a secondary electron image of the formed indium sulfide film is shown.
另外,將上述硫化銦薄膜應用在濺鍍硒化銅銦鎵(sputtering CIGS)電池元件上,並利用與實施例3中類似的方法測試其電池效率。其中,將所得2×2平方公分的電池分割成6個小面積(0.38平方公分)的電池,其電池效率的結果如第9圖所示。參照第9圖,其最佳電池效率為5.2%。Further, the above-mentioned indium sulfide film was applied to a sputtered CIGS battery element, and its battery efficiency was tested by a method similar to that in Example 3. Among them, the obtained 2 × 2 cm 2 battery was divided into six small-area (0.38 cm 2 ) batteries, and the battery efficiency results are shown in Fig. 9. Referring to Figure 9, the optimum battery efficiency is 5.2%.
【比較例1】[Comparative Example 1]
首先,以檸檬酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:檸檬酸:硫代乙醯胺的濃度比為0.008M:0.1M:0.4M。將上述混合溶液置於反應容器中。First, citric acid was used as a blocking agent, and it was dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which released indium ions was added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: citric acid: thioacetamide is 0.008 M: 0.1 M: 0.4 M. The above mixed solution was placed in a reaction vessel.
以鉬玻璃作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應30分鐘,而得到黃色帶有結晶片狀的硫化銦薄膜。硫化銦薄膜在鉬玻璃的基板上的覆蓋率大於99%,且其膜厚約為120~130 nm。參照第10圖為所形成硫化銦薄膜的二次電子影像圖。將上述硫化銦薄膜應用在濺鍍硒化銅銦鎵(sputtering CIGS)電池元件上的效率為3.4%,如第11圖所示。Molybdenum glass was used as a substrate, and immersed in a mixed solution having a binder, indium ions, and hydrogen sulfide ions in a face down manner, and the reaction vessel was covered. The reaction was carried out for 30 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film having a crystalline plate shape. The coverage of the indium sulfide film on the substrate of the molybdenum glass is greater than 99%, and the film thickness thereof is about 120 to 130 nm. Referring to Fig. 10, a secondary electron image of the formed indium sulfide thin film is shown. The efficiency of applying the above indium sulfide film to sputtered CIGS battery elements was 3.4%, as shown in FIG.
【比較例2】[Comparative Example 2]
首先,以丙二酸作為錯合劑,並將其溶於去離子水中,攪拌至完全溶解後,再加入可釋放出銦離子的硫酸銦(In2(SO4)3),攪拌至完全溶解。而後,再加入硫代乙醯胺(SC(NH2)(CH3))溶液,攪拌混合均勻,以形成具有錯合劑、銦離子、氫硫根離子的混合溶液。其中,硫化銦:丙二酸:硫代乙醯胺的濃度比為0.008M:0.1M:0.4M。將上述混合溶液置於反應容器中。First, malonic acid was used as a blocking agent, and it was dissolved in deionized water, stirred until completely dissolved, and then indium sulfate (In 2 (SO 4 ) 3 ) which released indium ions was added, and stirred until completely dissolved. Then, a solution of thioacetamide (SC(NH 2 )(CH 3 ))) was added, and the mixture was stirred and mixed uniformly to form a mixed solution having a complexing agent, indium ions, and hydrogen sulfide ions. Among them, the concentration ratio of indium sulfide: malonic acid: thioacetamide is 0.008 M: 0.1 M: 0.4 M. The above mixed solution was placed in a reaction vessel.
以鉬玻璃作為基板,並以面朝下(face down)的方式浸入具有錯合劑、銦離子、氫硫根離子的混合溶液中,並將反應容器蓋好。在65℃的水浴下反應30分鐘,而得到黃色的硫化銦薄膜。硫化銦薄膜在鉬玻璃的基板上的覆蓋率大於99%,且其膜厚約為50~60 nm。參照第12圖為所形成硫化銦薄膜的二次電子影像圖。將上述硫化銦薄膜應用在濺鍍硒化銅銦鎵(sputtering CIGS)電池元件上的效率為5.6%,如第13圖所示。Molybdenum glass was used as a substrate, and immersed in a mixed solution having a binder, indium ions, and hydrogen sulfide ions in a face down manner, and the reaction vessel was covered. The reaction was carried out for 30 minutes in a water bath at 65 ° C to obtain a yellow indium sulfide film. The coverage of the indium sulfide film on the substrate of the molybdenum glass is greater than 99%, and the film thickness thereof is about 50 to 60 nm. Referring to Fig. 12, a secondary electron image of the formed indium sulfide film is shown. The efficiency of applying the above indium sulfide film to sputtered CIGS battery elements was 5.6%, as shown in FIG.
【比較例3】[Comparative Example 3]
第14圖為分別以比較例2的丙二酸(Malonic acid)、比較例1的檸檬酸(Citric acid)、實施例5的琥珀酸(Succinic acid)及實施例4的酒石酸(Tartaric acid)當錯合劑所形成的硫化銦薄膜的萊曼光譜圖。由於圖中以琥珀酸及酒石酸當錯合劑時,沒有銦與氫氧根鍵結及氧化銦的訊號,只有硫化銦的訊號,亦即,所形成的硫化銦薄膜沒有銦的氫氧化物或氧化物的污染,而可以得到高純度的硫化銦薄膜。圖中以丙二酸及檸檬酸當錯合劑時,有銦與氫氧根鍵結的訊號,亦即,所形成的硫化銦薄膜有銦的氫氧化物或氧化物的污染。硫化銦薄膜中之銦的氫氧化物會影響能隙(energy gap)的大小。氫氧化物含量越高能隙越大,導致與CIGS吸收層的能階不匹配,且容易形成異質介面(Heterointerface),造成結構的缺陷,使穿透度下降及電阻值上升,故電池效率無法達到最佳狀態。Figure 14 is a comparison between Malonic acid of Comparative Example 2, Citric acid of Comparative Example 1, Succinic acid of Example 5, and Tartaric acid of Example 4, respectively. A Lehman spectrum of an indium sulfide film formed by a binder. Since succinic acid and tartaric acid are used as the wrong agent in the figure, there is no signal of indium and hydroxide bonding and indium oxide, only the signal of indium sulfide, that is, the formed indium sulfide film has no indium hydroxide or oxidation. The contamination of the substance can obtain a high-purity indium sulfide film. In the figure, when malonic acid and citric acid are used as the staggering agent, there is a signal in which indium and hydroxide are bonded, that is, the formed indium sulfide thin film is contaminated with indium hydroxide or oxide. The hydroxide of indium in the indium sulfide film affects the size of the energy gap. The higher the hydroxide content, the larger the energy gap, resulting in a mismatch with the energy level of the CIGS absorber layer, and the formation of a hetero interface (Heterointerface), resulting in structural defects, reduced penetration and increased resistance, so battery efficiency cannot be achieved. Best state.
雖然本發明已以數個較佳實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作任意之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the scope of the present invention, and any one of ordinary skill in the art can make any changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.
102...基材102. . . Substrate
104...電極104. . . electrode
106...吸收層106. . . Absorbing layer
108...緩衝層108. . . The buffer layer
110...透明導電層110. . . Transparent conductive layer
第1圖為一典型的薄膜太陽能電池的剖面圖。Figure 1 is a cross-sectional view of a typical thin film solar cell.
第2-4圖為根據本發明數個實施例所形成硫化銦薄膜的SEI圖。Figures 2-4 are SEI diagrams of indium sulfide thin films formed in accordance with several embodiments of the present invention.
第5圖為根據本發明一實施例所形成CIGS電池之電壓與電流密度的關係。Figure 5 is a graph showing the relationship between voltage and current density of a CIGS battery formed in accordance with an embodiment of the present invention.
第6圖為根據本發明一實施例所形成硫化銦薄膜的SEI圖。Fig. 6 is a SEI diagram of an indium sulfide thin film formed in accordance with an embodiment of the present invention.
第7圖為根據本發明一實施例所形成的硫化銦薄膜的萊曼光譜圖譜。Figure 7 is a diagram showing the Leyman spectrum of an indium sulfide film formed in accordance with an embodiment of the present invention.
第8-13圖為根據本發明數個比較例所形成硫化銦薄膜的SEI圖,以及所形成CIGS電池之電壓與電流密度的關係。Figures 8-13 are SEI diagrams of indium sulfide thin films formed in accordance with several comparative examples of the present invention, and the relationship between voltage and current density of the formed CIGS cells.
第14圖為根據本發明數個實施例及比較例,所形成的硫化銦薄膜的萊曼光譜圖譜。Fig. 14 is a diagram showing the Leyman spectrum of the formed indium sulfide thin film according to several examples and comparative examples of the present invention.
102...基材102. . . Substrate
104...電極104. . . electrode
106...吸收層106. . . Absorbing layer
108...緩衝層108. . . The buffer layer
110...透明導電層110. . . Transparent conductive layer
Claims (12)
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TW100124552A TW201302616A (en) | 2011-07-12 | 2011-07-12 | A method for preparing indium sulfide thin film |
CN2011102424279A CN102877042A (en) | 2011-07-12 | 2011-08-17 | Preparation method of indium sulfide thin film |
US13/304,534 US20130017322A1 (en) | 2011-07-12 | 2011-11-25 | Method for forming an indium (iii) sulfide film |
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RU2533888C1 (en) * | 2013-07-15 | 2014-11-27 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Уральский федеральный университет имени первого Президента России Б.Н. Ельцина" | Solution for hydrochemical sedimentation of semi-conductor films of indium sulphide |
US9382618B2 (en) * | 2014-07-18 | 2016-07-05 | UChicago Argnonne, LLC | Oxygen-free atomic layer deposition of indium sulfide |
CN109285919A (en) * | 2018-09-28 | 2019-01-29 | 王敏 | A kind of preparation method of copper indium gallium selenide solar cell thin film buffer layer material |
CN109706437A (en) * | 2018-12-20 | 2019-05-03 | 德州易能新能源科技有限公司 | Prepare metal sulfide film method and film obtained by this method |
CN114105188A (en) * | 2021-12-01 | 2022-03-01 | 徐州医科大学 | In2S3Preparation method of nano-flake array material |
CN114751655B (en) * | 2022-04-20 | 2024-06-14 | 重庆大学 | Indium sulfide-based heterostructure film electrode and preparation method thereof |
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JP2005019839A (en) * | 2003-06-27 | 2005-01-20 | Shinko Electric Ind Co Ltd | Cbd bath for compound solar cell and method for manufacturing compound solar cell |
US8066865B2 (en) * | 2008-05-19 | 2011-11-29 | Solopower, Inc. | Electroplating methods and chemistries for deposition of group IIIA-group via thin films |
JP5497261B2 (en) * | 2006-12-15 | 2014-05-21 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | Indium composition |
CN101177783B (en) * | 2007-11-30 | 2010-09-01 | 华南师范大学 | Button cell cathode cover exterior conducting surface plating method |
WO2010065851A2 (en) * | 2008-12-05 | 2010-06-10 | Omg Americas, Inc. | Electroless palladium plating solution and method of use |
CN101608304A (en) * | 2009-07-20 | 2009-12-23 | 北京工业大学 | A kind of method of chemical bath deposition indium sulfide thin film |
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US20130017322A1 (en) | 2013-01-17 |
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