201243665 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種感測裝置的製作方法，且特別是 有關於一種觸控裝置的製作方法。 【先前技術】 觸控面板包括電卩且式驗面板與電容式驗©板。投 ^電谷式觸控面板的製程主要包括感測電極的製程與周 隨著電子裝置朝向多功能化發展，傳統的滑鼠式或按 鍵式人機介面已漸漸無法滿足使用者的需求。在此情況 下’觸控面板便開始蓬勃地發展。相較於傳統的滑鼠式或 ，鍵式的操作介面之操作方式，觸控面板的操作方式更為 簡，且直覺化。藉由觸控面板，使用者可直接以手指或觸 控筆直接點選螢幕晝面上的物件、選單或圖形，或利用各 種不同的手勢（gesture)來操作這些物件、選單或圖形。 邊線路的製程。在周邊線路的製程中，習 光製程或網版印刷製程來形成。然而，201243665 VI. Description of the Invention: [Technical Field] The present invention relates to a method of fabricating a sensing device, and more particularly to a method of fabricating a touch device. [Prior Art] The touch panel includes an electric cymbal and an inspection panel and a capacitance test panel. The process of investing in the electric valley type touch panel mainly includes the process and the circumference of the sensing electrode. With the development of the electronic device toward the multi-functionality, the traditional mouse-type or button-type human-machine interface has gradually failed to meet the needs of users. In this case, the touch panel began to flourish. Compared with the traditional mouse-type or key-type operation interface, the touch panel operates in a simpler and more intuitive manner. With the touch panel, users can directly click on objects, menus or graphics on the screen surface with their fingers or stylus, or use a variety of different gestures to manipulate these objects, menus or graphics. The process of the side line. In the process of the peripheral circuit, the Xiguang process or the screen printing process is formed. however,
程中’習知技術是採用黃 然而’以黃光製程與網版 作流程較為繁複。此外， 4 201243665 Ξ了接ί圖ί二的方法，包括在基板上提供待圖案化的薄 覆蓋層與薄膜4===層°之後’以高能光束炫損 了形成高解析度圖利 = 案第麵7656號揭露 厕細號揭露法。中華民國專利公開案第 成此導電部你夕士、了種位於基板上之導電部件及用於形 觸控面板之佈缘民國專利第1285334 揭露了 號揭露了實體t;:印專利公開案第2_24575 【發明内容】 甯供—種觸控裝置的製作方法，可實現小線 精準度，且此製作方法較為簡化 術特徵帽到進4目的的了和 =點可以從本發明所揭露的技 明之切份或全部目的或是其他目的，本發 驟。提:置的製作方法，包括挪 X 】用網版印刷製程（screen printing 祕刻製程（1繼abiatiGn㈣㈣之其一 程成—第―_化透料電層。喷墨製 基板上形成ρ複數之其一在第一 線路盘第一圖荦化邊線路。電性連接這些第一周邊 製程之其-形成-層。利用網版印刷製程及嗜墨 成遮先邊框。使遮光邊框的面積涵蓋這些 201243665 第周邊線路的面積，並使遮光邊框所圍繞而成的開口對 應第一圖案化透明導電層。 在本發明之實施例之觸控裝置的製作方法中’由於採 用了噴墨製程及雷射蝕刻製程之其一來製作第一周邊線 路因此第一周邊線路的線寬與線距可以作得較精細，且 第周邊線路的位置精確度亦較高。此外，搭配使用網版 印刷製程及雷射蝕刻製程之其一來製作第—圖案化透明導 電層及使用網版印刷製程及噴墨製程之其一形成遮光邊 框，本發明之實施例之觸控裝置的整體製作方法的步驟較 為簡化。 ^為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 、有關本發明之前述及其他技術内容、特點與功效，在 =下配合參考圖式之—紐實施例的詳細說射，將可清 的呈現。以下實施例中所提到的方向用語，例如：上、 下、左、右、前或後等，僅是參考附加圖式的方向。因此， 使用的方向用語是用來說明並非絲限制本發明。 圖1A至圖1M為繪示本發明之一實施例之觸控裝置 土 作方法之流程的剖面示意圖，圖2A為圖iAt上視示 忍圖’ 11 2B為圖1F的上視示意圖，圖2C為圖1K的上 =不思圖，且圖2D為圖1Μ中的第__圖案化透明導電層、 第二圖案化透明導電層、第—周邊線路與第二周邊線路的 6 201243665 上視示意圖。請參照圖1A至圖1M，本實施例之觸控裝置 的製作方法包括下列步驟。首先，請參照圖1A，提供一基 板110。在本實施例中，基板11()例如為一觸碰蓋板。觸 碰蓋板用以接受一觸碰物體的觸碰，此觸碰物體例如為使 用者的手指、觸控筆或其他適當的用以觸碰觸控裝置的物 體。換言之’當使用者以觸碰物體操作觸控裝置時，是以 觸碰物體按壓於觸碰蓋板（即基板11〇)上。此外，基板 110例如為一透光基板。在本實施例中，基板n〇例如為 一塑膠基板。然而，在其他實施例中，基板11()亦可以是 玻璃基板。接著’利用網版印刷製程及喷墨製程之其一（圖 ία是以噴墨製程為例）形成一遮光邊框16〇，其中遮光邊 框160的上視圖如圖2A所繪示。在本實施例中，可將遮 光邊框160形成於基板ι1〇上。舉例而言，可利用一喷墨 頭50a於基板no的邊緣喷上黑色墨水，接著在利用光固 化、熱固化或自然固化的方式讓墨水固化後，即形成遮光 邊框160。在將墨水噴印於基板n〇之前，可對基板u〇 的表面作表面特性處理，以使墨水喷印於基板11〇上時可 匯聚於預定噴印的位置而不會攤開。表面特性處理包括在 基板110上塗佈一層薄膜，接著再將墨水噴印於此薄膜 上’而此薄膜的特性可使墨水匯聚而不攤開。此外，在本 實施例中’形成之遮光邊框160具有一開口 162，且開口 162暴露出基板11〇的中央區域。 接著，請參照圖1B，在本實施例中，可在基板u〇 上形成一透明絕緣層170，並使透明絕緣層170覆蓋遮光 201243665 邊框160。透明絕緣層170可填平遮光邊框16〇在基板n〇 上所形成的咼度落差，以使後續製程的進行更為順利，而 不會受到此高度落差的影響。在一實施例中，透明絕緣層 170的透光率例如為99%，其霧度（haze)例如小於0 5， 而其於Lab色座標上的b*色度值例如趨近於〇。此外，透 明絕緣層170可藉由網版印刷、喷墨或狹縫模具式塗佈 (slot die coating)的方式形成於基板11()上。 、 然後，請參照圖1C與圖1D，利用網版印刷製程及雷 射蝕刻製程之其一（在本實施例中是利用雷射蝕刻製程） 在基板110上形成一第一圖案化透明導電層12〇。在本實 施例中，利用雷射蝕刻製程在基板11〇上形成第一圖案化 透明導電層120的步驟包括下列步驟。首先，請參照圖 1C，在基板no上形成一透明導電層31〇，在本實施例中， 即在透明絕緣層170上形成透明導電層31〇。透明導電層 310例如為氧化銦錫（indiuin tin oxide，IT0)層、紹摻雜 氧化鋅層（aluminum doped zinc oxide，AZ0 )、奈求碳管 (carbonnano-tube)層、導電高分子層或其他適當的透明 導電層。此外，在本實施例中，在基板11〇上形成透明導 電層310的步驟例如為在基板11〇上濺鍍出透明導電層 310。然後，請參照圖id，利用一雷射光束72蝕刻部分透 明導電層310 ’以形成第一圖案化透明導電層12〇。舉例而 。，可例用一雷射光源70於基板11〇的上方的特定位置掃 描部分透明導電層310，而透明導電層31〇之未被掃描的 部分即形成第一圖案化透明導電層12〇。 8 201243665 之後，睛參照圖1E與圖ip ,利用喷墨製程及雷射蝕 刻製程之其一（圖1E與圖1F是以雷射蝕刻製程為例）在 基板110上形成複數個第一周邊線路23〇，例如是在遮光 邊框160上形成這些第一周邊線路23〇。在本實施例中， 利用雷射蝕刻製程在基板110上形成這些第一周邊線路 230的步驟包括下列步驟。首先，請參照圖1E，在基板11〇 上形成-導電層322。舉例而f，可利用網版印刷的方式 在基板110上形成一導電層322,例如是在透明絕緣層17〇 上形成導電層322。具體而言，在本實施例中，可將一具 有圖案化孔洞的網版60a 置於基板n〇上，接著將銀毅 或其他金屬溶液塗佈於網版6〇a的圖案化孔洞中。如此一 來’銀i：或其他金屬溶液會經由圖案化孔洞塗佈於基板 110上，例如是塗佈於透明絕緣層17〇上。然後，再利用 到刀將銀漿或其他金屬溶液之溢出圖案化孔洞的部分刮 去。之後’再將網版60a移開，且利用光固化、熱固化或 自然固化的方式使銀漿或其他金屬溶液固化，以形成導電 層322因此導電層322為金屬層，且導電層η2的材 質例如為銀、其他金屬或多種金屬的組合。再來，請參照 圖1F ’利用-雷射光束72名虫刻部分導電層奶，以形成 這些第一周邊線路23〇。 第在線路230與第一圖案化透明導電層120的上 視圖可參‘、、、圖2B。如g2B所输*，在本實施例中，第一 圖案化透明導電層12G包括複數行第—電極串122，每一 行第電極串122包括複數個第—感測電極⑵及複數個 201243665 第一連接段123，且每一第一連接段123電性連接相鄰二 第一感測電極121。此外’這些第一感測電極121各為一 透明導電塾（pad )。 當第一周邊線路230與第一圖案化透明導電層12〇的 形狀與位置經過適當設計後，即可如圖2B所繪示那樣， 使這些第一周邊線路230與第一圖案化透明導電層12〇電 性連接。在本實施例中，這些第一周邊線路230分別電性 連接至這些第一電極串122。此外，當第一周邊線路23〇 與第一圖案化透明導電層120的形狀與位置經過適當設計 後，即可如圖1F與圖2B所繪示那樣，使遮光邊框16〇的 面積涵蓋這些第一周邊線路230的面積，並使遮光邊框16〇 所圍繞而成的開口 162對應第一圖案化透明導電層12〇。 換言之，第一周邊線路230在遮光邊框160上的正投影位 於遮光邊框160所涵蓋的面積内，且第一圖案化透明導電 層120在基板110上的正投影位於開口 162内。 然後，請參照圖1G，在本實施例中，可在基板ι1〇 之一側形成一硬膜層190，其中基板110位於第一圖案化 透明導電層120與硬膜層190之間。硬膜層190可保護基 板110 (即觸碰蓋板），以免基板11〇受到觸碰物體的刮 傷或衝撞。然後，在其他實施例中，當基板11〇不是塑膠 基板，而是玻璃基板時，則可以不採用硬膜層19〇。在本 實施例中，硬膜層190的材質例如包含二氧化矽。此外， 在本實施例中’硬膜層丨90亦為一抗反射層，以提升觸控 裝置100的光穿透率。在一實施例中，硬膜層19〇的鉛筆 201243665 硬度大於4H，且硬膜層190的透光率大於94%。 之後，請參照圖1H，提供一基板14〇〇基板14〇例如 為一塑膠基板。然而，在其他實施例中，基板14〇亦可以 是一玻璃基板。此外，基板140例如為一透光基板。然後， 凊參照圖1H與圖II，利用網版印刷製程及雷射姓刻製程 之其一（在本實施例中例如是利用雷射蝕刻製程）在基板 140上形成一第二圖案化透明導電層13〇。具體而言，^本 實施例中，利用雷射蝕刻製程在基板14〇上形成第二圖案 化透明導電層130的步驟包括下列步驟。首先，請參照圖 1H’在基板140上形成一透明導電層33〇。透明導電層33〇 例如為氧化銦錫（indium tin oxide, ITO)層、鋁摻雜氧化 辞層（aluminum doped zinc oxide，AZ0 )、奈米碳管 Uarb〇n nano-tube)層、導電高分子層或其他適當的透明導電層。 此外，在本實施例中，在基板14〇上形成透明導電層曰33〇 的步驟例如為在基板14〇上濺鍍出透明導電層33〇。然後， 請參照圖II ’利用一雷射光束蝕刻部分透明導電層， 以形成第-圖案化透明導騎13〇。利用雷射^製程來 形成第二圖案化透明導電層13〇的其他細節可參照上 用雷射蝕刻製程來形成第一圖案化透明導電層> =細 節，如圖1C與圖1D所繪示，在此不再重述。 . 接著，請參照圖1J與圖1K，利用喷墨製程 刻製程之其-（在本實施例巾例如是利用雷射細〗製程） 在基板140上形成複數個第二周邊線路24〇。在^ = 中’利用雷射钮刻製程在基板140上形成這些第二周 11 201243665 路·的步驟包括下列步驟。首先，請參照目u，在基板 H0上形成-導電層34〇。舉例而言，可利用網版印刷的方 式在基板M0上形成-導電们仙。詳細的網版印刷的細 節可參照上述網版印刷導電層322的細節，如圖1E所繪 示’在此不再重述。此外，導電層·例如為金屬層，且 導電層340的材質例如為銀、其他金屬或多種金屬的組 合。再來，請參照圖1K，利用雷射光束72蝕刻部分導電 層340,以形成這些第二周邊線路24〇。利用雷射光束72 蝕刻部分導電層340的細節可參照上述利用雷射光束72 蝕刻部分導電層322的細節，如圖m與圖1F所繪示，在 此不再重述。 第二周邊線路240與第二圖案化透明導電層13〇的上 視圖可參照圖2C。如圖2C所繪示，在本實施例中，第二 圖案化透明導電層130包括複數行第二電極串132，每一 行第二電極串132包括複數個第二感測電極131及複數個 第一連接·^又133，且母一第一連接段133電性連接相鄰二 第一感測電極131。此外，這些第二感測電極κι各為一 透明導電墊（pad)。 §第一周邊線路240與第二圖案化透明導電層I%的 形狀與位置經過適當設計後，即可如圖2C所繪示那樣， 使這些第二周邊線路240與第二圖案化透明導電層13〇電 性連接。在本實施例中’這些第二周邊線路24〇分別電性 連接至這些第二電極串132。 然後，請參照圖1L，在基板140上形成一透光保護層 12 201243665 150’並使透光保護層150覆蓋第二圖案化透明導電層no 與這些第二周邊線路240。透光保護層15〇可用以保護第 二圖案化透明導電層130與第二周邊線路24〇，使其免於 受到外來因素的破壞。在一實施例中，透光保護層的 透光率例如為99%，其霧度（haze)例如小於0 5，而其於 Lab色座標上的b *色度值例如趨近於〇。此外，透光保護 層150可採用滾筒式塗佈或狹縫模具式塗佈來形成。 之後，請參照圖1M，將基板140與第一圖案化透明 導電層120貼合，例如是利用一光學透明膠（〇pdcaldear adhesive，0CA) 180來將兩者貼合。此外，在本實施例中， 光學透明膠180亦貼合第一周邊線路230與基板140，且 貼合透明絕緣層170與基板140。至此，即可完成本實施 例之觸控裝置100。觸控裝置100中的第一圖案化透明導 電層120、第二圖案化透明導電層13〇、第一周邊線路23〇 與第二周邊線路24〇的上視圖可參照圖2D所繪示者。 在本實施例中’這些第一感測電極121於基板110上 的正投影不重疊於這些第二感測電極131於基板U〇上的 正投影。換言之，從如圖2D之上視圖來看，這些第一感 測電極121與這些第二感測電極131互不重疊。此外，在 本貫施例中，這些第一連接段123分別與這些第二連接段 133互相交又，且基板140分隔這些第一連接段123與這 些第二連接段133。 ^使用者利用手指或觸控筆等觸碰物體觸碰基板u0 時這些第一電極串122與這些第二電極串132之間的電 13 201243665 谷會隨著觸碰位置而有所變化，如此觸控裝置1〇〇便能夠 ，由這些第一電極串122與這些第二電極串132之間的電 谷的改變而偵測出疋否有觸碰動作產生及觸碰位置的變 此外，第一周邊線路230與第二周邊線路24〇可外接 至一外部線路，例如連接至-可撓式印刷線路板（驗脇 printed circuit，FPC )。然後，此外部線路再將這些第一電 極串122與這些第二電極串132㈣訊號傳遞至一處理單 元，而此處理單元便能夠依據這些第一電極串122與這些 第二電極串132所傳來的電訊號判斷出是否有觸碰動作^ 生及觸碰位置的變化。 本實施例之觸控裝置100可貼附於顯示器的顯示勞幕 上，並使遮光邊框16〇所圍繞出的透光區域（即開口 162) 對準顯示螢幕。如此-來，便可顧出制者觸碰榮幕中 的物件或圖形而對其操作的效果。 在本實施例之觸控裝置100的製作方法中，由於採用 了喷墨製程及雷射⑽製程之其—來製作第—周邊線路 23〇與第二周邊線路，因此第—周邊線路挪與第二周 邊線路24.G的錢與線距可以作得較精細，且第 路230與第二周邊線路的位置精確度亦較高。此外、、、， 搭配使用網版印刷製程及雷射蝕刻製程之其一來 圖案化透明導電層12G與第二圖案化透明導電層⑽ 使用網版印刷製程及喷墨製程之其—形成遮光邊框⑽， 本實施例之觸㈣置廳的整難作方法的步驟較為簡 201243665 化^奐言之’本實施例之觸控^⑻的製作方法可以在 用:复光製ΐ的前提下’仍達到高精細度與高精 又α此一來，本實施例之觸控裝置100的製作方法便 可以降低設備成本’提高製程效率，且同時能夠減少污毕 性酸驗溶液的使用。當第—圖案化透明導電層120、第二 圖案化透明導電層130、第一周邊線路230與第二周邊線 路240以雷射钮刻製程來形成時，其最小線寬例如可以達 到30微米’且最小線距亦例如可達到3〇微米。此外，當 第一周，線路230與第二周邊線路24〇以喷墨製程來形: 時’其最小線寬例如可以達到20微米，且最小線距亦例如 可達到20微米。 圖3為本發明之另一實施例之觸控裝置的製作方法之 其中一個步驟的示意圖。請參照圖3,上述圖1Ai利用喷 墨製程形成遮光邊框160的步驟可以被圖3之利用網版印 刷製程形成遮光邊框160的步驟所取代。具體而言，在本 實施例中，可將一具有圖案化孔洞的網版配置於基板 110上，接著將墨水（例如黑色墨水）塗佈於網版的 圖案化孔洞中。如此一來，墨水會經由圖案化孔洞塗佈於 基板110上，以形成墨水層352。然後，再利用到刀8〇將 墨水之溢出圖案化孔洞的部分刮去。之後，再將網版6〇b 移開，且利用光固化、熱固化或自然固化的方式使墨水固 化，以形成如圖1A所繪示之遮光邊框160。 圖4為本發明之又一實施例之觸控裝置的製作方法之 其中一個步驟的示意圖。請參照圖4,上述圖1C之利用濺 15 201243665 鏡的方法將透明導電層310形成於基板110上的步驟可以 被圖4之利用網版印刷製程在基板110上形成透明導電層 362的步驟所取代。具體而言，在本實施例中，可將—丄 有圖案化孔洞的網版60c配置於基板11〇上，接著將透^ 導電材料之溶液塗佈於網版60c的圖案化孔洞中。如此一 來，透明導電材料之溶液會經由圖案化孔洞塗佈於基板 110上，例如是塗佈於透明絕緣層170上。然後，再^用 刮刀將透料電材料之綠之溢㈣案化孔洞的部分刮 去。、之後，再將網版6〇c移開，且利用光固化、熱固化或 自然固化的方式使透明導電材料之溶液固化，以形成透明 導電層362。接著，在本實施例巾，可利用化學蝴或物 理韻刻等方式钮刻部分透明導電層362,而透明導電層362 之未被侧的部分則可形成如圖1D之第-圖案化透曰明導 電層12G。此外’圖4之網版印刷製程及侧製程亦可用 以形成圖II之第二圖案化透明導電層13()。 圖5為本發明之再—實施例之觸控裝置的製作方法之 、中-個步驟的示意圖。請參照圖5，上述圖ie與圖π =利用雷射姓刻製程在基板11〇上形成第一周邊線路23〇 的步驟可被圖5之利用嘴墨製程在基板m上形成第一周 邊線路230的步驟所取代。具體而言，可利用一喷墨頭鄕 ^基板110的邊緣喷上銀毁或其他金屬溶液，接著在利用 =1匕、W固化的方式讓銀衆或其他金屬溶液 周邊魏23G。在將墨树印於基板 則〇，土板110的表面作表面特性處理，以使銀 201243665 聚或其他金屬溶液噴印於基板11〇上時可匯聚於預定喷印 的位置而不會攤開。此表面特性處理包括在基板110上塗 佈一層薄膜’例如是塗佈於透明絕緣層170，接著再將銀 毁或其他金屬溶夜噴印於此薄膜上，而此薄膜的特性可使 銀漿或其他金屬溶液匯聚而不攤開。此外，在本實施例中， 喷墨頭50b例如為可抵抗銀腐蝕之壓電式喷墨頭。 圖6為本發明之另一實施.例之觸控裝置的製作方法之 其中一個步驟的示意圖。請參照圖6，本實施例之觸控裝 置100a的製作方法與圖ία至圖1M之觸控裝置1〇〇的製 作方法類似，而兩者的差異如下所述。在本實施例中，遮 光邊框160是形成於基板11〇上，而第一圖案化透明導電 層120與第—圖案化周邊線路230是形成於基板140上。 形成遮光邊框16〇、第一圖案化透明導電層12〇與第一圖 案化周邊線路230的詳細細節可參照上述實施例，在此不 再重述。此外，本實施例之觸控裝置100a的製作方法更包 括下列步驟。首先，提供一基板220。在本實施例中，基 板220例如為塑膠基板。然而，在其他實施例中，基板 亦可以是玻璃基板。此外，在本實施例中，基板110、基 板140及基板220皆為透光基板。接著，利用網版印刷製 程及雷刻製程之其一在基板220上形成第二圖案化透 =導電層13〇。形成第二圖案化透明導電層㈣的製程細 節"I參,¾上述貫施例，在此不再重述。然後，利用喷墨製 程及雷射_製程之其__在基板22()上職複數個第二周 邊線路240。形成第二周邊線路24〇的製程細節可參照上 17 201243665 述實施例，在此不再重述。經由適當設計第二周邊線路24〇 與第二圖案化透明導電層130的位置與形狀，可使這些第 二周邊線路與第二圖案化透明導電層電性連接。之後，將 第一圖案化透明導電層120與基板11〇貼合，例如是藉由 光學透明膠180貼合第一圖案化透明導電層120與基板 110，貼合基板140與基板110，貼合第一周邊線路230與 遮光邊框160 ’且貼合基板140與遮光邊框160。然後，將 第一圖案化透明導電層130與基板14〇貼合，例如是藉由 光學透明膠210貼合第二圖案化透明導電層13〇與基板 140，貼合第二周邊線路240與基板14〇，且貼合基板220 與基板140。如此，即完成本實施例之觸控裝置1〇〇a。 圖7A至圖7C為繪示本發明之又一實施例之觸控裝置 的製作方法之部分流程的示意圖，圖8a為圖7A之沿著I-I 線的剖面示意圖，而圖8B為圖7B之沿著II-II線的剖面 不意圖。請參照圖7A至圖7c及圖8A至圖8B，本實施例 之觸控裝置l〇〇b的製作方法類似於圖ία至圖1M之觸控 裝置100的製作方法，而兩者的差異如下所述。首先，請 參照圖7A與圖8A，當利用網版印刷製程及雷射蝕刻製程 之其一在基板11〇上形成第一圖案化透明導電層12〇的 時’亦利用相同的製程在基板110上形成一第二圖案化透 明導電層130b，其中第二圖案化導電層13〇b包括複數列 第一電極串132b ’每一列第二電極串i32b包括複數個彼 此分離的第二感測電極131。此外，當利用喷墨製程及雷 射钮刻製程之其一在基板110上形成這些第一周邊線路 18 201243665 230時，亦利用相同的製程在基板11〇上形成複數個第二 周邊線路240。當適當地設計第二周邊線路24〇與第二圖 案化導電層130b的位置與形狀時，便可使這些第二周邊線 路240與部分第二圖案化透明導電層13%電性連接。然 後，請參照圖7B與圖8B，在這些第一連接段123上形成 複數個絕緣圖案142b，例如可利用喷墨製程在這些第一連 接段123上喷上絕緣膠，而絕緣膠固化後即可形成絕緣圖 案142b。接著，在這些絕緣圖案142|3上形成複數個第二 連接^又133b，其中母一連接段133b電性連接相鄰二第二 感測電極131，如此一來，這些第二周邊線路24〇便可分 別電性連接這些第二電極串132b。此外，這些絕緣圖案 142b分別分隔這些第一連接段123與這些第二連接段 133b。形成連接段133b的方式例如為利用噴墨製程在絕緣 圖案142b上噴上銀膠、金屬溶液或透明材料之溶液，而當 銀膠、金屬溶液或透明材料之溶液固化後，即形成第二連 接段133b。 再來，請參照圖7C，於基板110的相對兩侧分別形 成透光保護層150與硬膜層190，其中透光保護層15〇覆 蓋並保護第一圖案化透明導電層120、第二圖案化透明導 電層130b、第一周邊線路230與第二周邊線路240。 本實施例之觸控裝置l〇〇b的製作方法除了可達到上 述實施例之優點與功效外，亦可使觸控裝置1〇〇b的厚度縮 小，且重量減輕。換言之，本實施例可實現單一基板 的觸控裝置l〇〇b。 201243665 值得注意的是，上述實施例的製作方法是以先形成第 一圖案化透明導電層而後形成第一周邊線路為例，且以先 形成第一圖案化透明導電層而後形成第二周邊線路為例。 然而，在其他實施例中，亦可以是先形成第一周邊線路而 後形成第一圖案化透明導電層，且可以是先形成第二周邊 線路而後形成第一圖案化透明導電層。 綜上所述，在本發明之實施例之觸控裝置的製作方法 中，由於採用了喷墨製程及雷射蝕刻製程之其一來製作第 一周邊線路與第二周邊線路，因此第一周邊線路與第二周 邊線路的線寬與線距可以作得較精細，且第一周邊線&與 第二周邊線路的位置精確度亦較高。此外，搭配使用網版 印刷製程及雷射姓刻製程之其一來製作第一圖案化透明導 電層與第二圖案化透明導電層及使用網版印刷製程及喷墨 製程之其一形成遮光邊框，本發明之實施例之觸控裝置的 整體製作方法的步驟較為簡化。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之_，即纽依本發明申請專利 I巳圍及發縣_容所作之簡單的等效變化與修飾，皆仍 本發明專利涵蓋之範圍内。另外本發制任—實施例或 =請專利範圍不須達成本發明所揭露之全部目的或優點或 特點。此外’摘要部分和標題僅是时_專利文件搜尋 並非用來限制本發明之權利範圍。此外，本說明書 或=請專利範圍中提及的“第“第二，，等用語僅用 以命名兀件(element)的名稱或區別不同實施例或範圍，而 201243665 並非用來限制元件數量上的上限或下限。 【圖式簡單說明】 圖1A至圖為緣示本發明之 的製作方法之流程的剖面示意圖。 丨之觸控裝置 圖2A為圖1A之上視示意圖。 圖2B為圖ip的上視示意圖。 圖2C為圖1K的上視示意圖。 料Πί® 1M中的第一圖案化透明導電層、第二圖 ^ 4電層、第-周邊線路與第二周邊線路的上視示 思圖。 圖3為本發明之另一實施例之觸控裝 。 $作方法之 圖4為本發明之又—實施例之觸控裝置的製作方法之 其中一個步驟的示意圖。 / 圖5為本發明之再—實施例之觸控裝置的製作方法之 其中一個步驟的示意圖。 / 圖6為本發明之另一實施例之觸控裝置的製作方法之 其中一個步驟的示意圖。 圖7A至圖7C為繪示本發明之又一實施例之觸控裝置 的製作方法之部分流程的示意圖。 圖8A為圖7A之沿著14線的剖面示意圖。 圖8B為圖冗之沿著㈣、線的剖面示意圖。 21 201243665 【主要元件符號說明】 50a、50b :喷墨頭 60a、60b、60c :網版 70 :雷射光源 72 :雷射光束 80 :刮刀 100、100a、100b :觸控裝置 110、140、220 :基板 120 :第一圖案化透明導電層 121 :第一感測電極 122 :第一電極串 123 :第一連接段 130、130b :第二圖案化透明導電層 131 :第二感測電極 132、 132b :第二電極串 133、 133b :第二連接段 142b :絕緣圖案 150 :透光保護層 160 :遮光邊框 162 :開口 170 :透明絕緣層 180、210 :光學透明膠 190 :硬膜層 230 :第一周邊線路 22 201243665 240 :第二周邊線路 310、330、362 :透明導電層 322、340 :導電層 352 :墨水層 23In the process, the conventional technology is yellow. However, the process of Huangguang process and screen is more complicated. In addition, 4 201243665 Ξ 的 的 的 的 的 , , 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 No. 7656 exposes the toilet number disclosure method. The Patent Publication of the Republic of China is the first part of this conductive part, the conductive part on the substrate, and the cloth edge of the Republic of China Patent No. 1285334, which discloses the entity t; 2_24575 [Summary] The method for manufacturing a touch device can realize small line precision, and the manufacturing method can simplify the feature cap and the point of the target can be obtained from the invention. For the purpose of cutting or all or other purposes, this is a preliminary report. To mention: the production method of the set, including the move X] screen printing process (screen printing secret process (1 followed by abiatiGn (four) (four) one of the process - the first _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The first line of the first circuit board is electrically connected to the first forming process of the first peripheral process. The screen printing process and the ink-repellent are used to cover the front frame. 201243665 The area of the peripheral line, and the opening surrounded by the light-shielding frame corresponds to the first patterned transparent conductive layer. In the manufacturing method of the touch device according to the embodiment of the present invention, 'the inkjet process and the laser are adopted. One of the etching processes is used to fabricate the first peripheral line, so the line width and line spacing of the first peripheral line can be made finer, and the position accuracy of the peripheral line is also higher. In addition, the screen printing process and the thunder are used together. One of the etch process is used to form the first patterned transparent conductive layer and one of the screen printing process and the ink jet process is used to form a light-shielding frame. The overall touch device of the embodiment of the present invention The steps of the present invention are more simplified. The above-described features and advantages of the present invention will be more apparent and understood. The following detailed description of the embodiments will be described in detail below with reference to the accompanying drawings. And other technical content, features and effects, in conjunction with the reference pattern - the detailed description of the embodiment, will be clearly presented. Directional terms mentioned in the following examples, such as: up, down, left , the right, the front or the rear, etc., only refer to the direction of the additional drawings. Therefore, the directional terminology used is used to illustrate that the invention is not limited. FIG. 1A to FIG. 1M are diagrams showing a touch according to an embodiment of the present invention. FIG. 2A is a top view of FIG. 1F, FIG. 2C is a top view of FIG. 1F, FIG. 2C is a top view of FIG. 1K, and FIG. 2D is a top view of FIG. 1K, and FIG. 2D is a top view of FIG. The first __ patterned transparent conductive layer, the second patterned transparent conductive layer, the first peripheral line and the second peripheral line 6 201243665 top view. Referring to FIG. 1A to FIG. 1M, the touch device of the embodiment The production method includes the following steps First, referring to FIG. 1A, a substrate 110 is provided. In the embodiment, the substrate 11 () is, for example, a touch cover. The touch cover is adapted to receive a touch of a touch object, the touch object For example, the user's finger, stylus or other suitable object for touching the touch device. In other words, when the user operates the touch device with the touch object, the touch object is pressed against the touch cover. In addition, the substrate 110 is, for example, a transparent substrate. In the embodiment, the substrate n is, for example, a plastic substrate. However, in other embodiments, the substrate 11 () may also be a glass. Substrate. Next, one of the screen printing process and the inkjet process is used (the inkjet process is taken as an example) to form a light-shielding frame 16〇, wherein the upper view of the light-shielding frame 160 is as shown in FIG. 2A. In this embodiment, the light-shielding frame 160 can be formed on the substrate ι1. For example, black ink may be sprayed on the edge of the substrate no by an ink jet head 50a, and then the light-shielding frame 160 may be formed after the ink is cured by photocuring, heat curing or natural curing. Before the ink is printed on the substrate n, the surface of the substrate u can be subjected to surface characteristics treatment so that the ink can be concentrated on the substrate 11 while being spread on the substrate 11 without being spread out. The surface property treatment includes coating a film on the substrate 110 and then printing the ink onto the film. The characteristics of the film allow the ink to converge without spreading. Further, the light-shielding frame 160 formed in the present embodiment has an opening 162, and the opening 162 exposes a central portion of the substrate 11A. Next, referring to FIG. 1B, in the embodiment, a transparent insulating layer 170 may be formed on the substrate u, and the transparent insulating layer 170 may be covered by the blackout 201243665 frame 160. The transparent insulating layer 170 can fill in the thickness difference formed by the light-shielding frame 16 on the substrate n〇, so that the subsequent process can be performed more smoothly without being affected by the height drop. In one embodiment, the transparent insulating layer 170 has a light transmittance of, for example, 99%, a haze of, for example, less than 0 5, and its b* chromaticity value on the Lab color coordinates, for example, approaches 〇. Further, the transparent insulating layer 170 may be formed on the substrate 11 () by screen printing, ink jet or slot die coating. Then, referring to FIG. 1C and FIG. 1D, a first patterned transparent conductive layer is formed on the substrate 110 by using one of a screen printing process and a laser etching process (in this embodiment, using a laser etching process). 12〇. In the present embodiment, the step of forming the first patterned transparent conductive layer 120 on the substrate 11 by a laser etching process comprises the following steps. First, referring to Fig. 1C, a transparent conductive layer 31 is formed on the substrate no. In the present embodiment, a transparent conductive layer 31 is formed on the transparent insulating layer 170. The transparent conductive layer 310 is, for example, an indium oxide tin oxide (ITO) layer, an aluminum doped zinc oxide (AZ0) layer, a carbon nanotube-tube layer, a conductive polymer layer or the like. A suitable transparent conductive layer. Further, in the present embodiment, the step of forming the transparent conductive layer 310 on the substrate 11 is, for example, sputtering a transparent conductive layer 310 on the substrate 11A. Then, referring to Figure id, a portion of the transparent conductive layer 310' is etched using a laser beam 72 to form a first patterned transparent conductive layer 12A. For example. For example, a laser light source 70 can be used to scan a portion of the transparent conductive layer 310 at a specific position above the substrate 11A, and the unscanned portion of the transparent conductive layer 31 forms the first patterned transparent conductive layer 12A. 8 201243665, after referring to FIG. 1E and FIG. 1 ip, one of the first peripheral lines is formed on the substrate 110 by using one of the inkjet process and the laser etching process (FIG. 1E and FIG. 1F are examples of the laser etching process). 23〇, for example, these first peripheral lines 23〇 are formed on the light-shielding frame 160. In the present embodiment, the step of forming these first peripheral lines 230 on the substrate 110 by a laser etching process includes the following steps. First, referring to Fig. 1E, a conductive layer 322 is formed on the substrate 11A. For example, a conductive layer 322 may be formed on the substrate 110 by means of screen printing, for example, a conductive layer 322 is formed on the transparent insulating layer 17A. Specifically, in this embodiment, a screen 60a having patterned holes can be placed on the substrate n, and then a silver or other metal solution is applied to the patterned holes of the screen 6〇a. In this way, the silver i: or other metal solution is applied to the substrate 110 via patterned holes, for example, on the transparent insulating layer 17〇. Then, use a knife to scrape off the portion of the silver or other metal solution that overflows the patterned holes. Then, the screen 60a is removed, and the silver paste or other metal solution is cured by photocuring, heat curing or natural curing to form the conductive layer 322. Therefore, the conductive layer 322 is a metal layer, and the material of the conductive layer η2 is used. For example, silver, other metals, or a combination of metals. Further, referring to Fig. 1F', a portion of the conductive layer milk is inscribed by a laser beam 72 to form these first peripheral lines 23A. The upper view of the first line 230 and the first patterned transparent conductive layer 120 can be referred to as ',, and 2B. In this embodiment, the first patterned transparent conductive layer 12G includes a plurality of rows of first electrode strings 122, and each row of the second electrode strings 122 includes a plurality of first sensing electrodes (2) and a plurality of 201243665 first. The segments 123 are connected, and each of the first connecting segments 123 is electrically connected to the adjacent two first sensing electrodes 121. Further, these first sensing electrodes 121 are each a transparent conductive pad. After the shape and position of the first peripheral line 230 and the first patterned transparent conductive layer 12 are properly designed, the first peripheral line 230 and the first patterned transparent conductive layer may be formed as shown in FIG. 2B. 12〇 electrical connection. In this embodiment, the first peripheral lines 230 are electrically connected to the first electrode strings 122, respectively. In addition, when the shape and position of the first peripheral line 23〇 and the first patterned transparent conductive layer 120 are appropriately designed, the area of the light-shielding frame 16〇 can be covered as shown in FIG. 1F and FIG. 2B. An area of the peripheral line 230 and an opening 162 surrounded by the light-shielding frame 16A correspond to the first patterned transparent conductive layer 12A. In other words, the orthographic projection of the first peripheral line 230 on the light-shielding frame 160 is within the area covered by the light-shielding frame 160, and the orthographic projection of the first patterned transparent conductive layer 120 on the substrate 110 is located within the opening 162. Then, referring to FIG. 1G, in the embodiment, a hard coat layer 190 may be formed on one side of the substrate ι1 ,, wherein the substrate 110 is located between the first patterned transparent conductive layer 120 and the hard coat layer 190. The hard coat layer 190 protects the substrate 110 (i.e., touches the cover) to prevent the substrate 11 from being scratched or collided by the touching object. Then, in other embodiments, when the substrate 11 is not a plastic substrate but a glass substrate, the hard coat layer 19 can be omitted. In the present embodiment, the material of the hard coat layer 190 contains, for example, cerium oxide. In addition, in the present embodiment, the hard coat layer 90 is also an anti-reflection layer to improve the light transmittance of the touch device 100. In one embodiment, the hard coat layer 19 〇 pencil 201243665 has a hardness greater than 4H and the hard coat layer 190 has a light transmission greater than 94%. Thereafter, referring to FIG. 1H, a substrate 14 is provided, and the substrate 14 is, for example, a plastic substrate. However, in other embodiments, the substrate 14A can also be a glass substrate. Further, the substrate 140 is, for example, a light transmissive substrate. Then, referring to FIG. 1H and FIG. II, a second patterned transparent conductive is formed on the substrate 140 by using one of a screen printing process and a laser surname process (in this embodiment, for example, by using a laser etching process). Layer 13〇. Specifically, in the embodiment, the step of forming the second patterned transparent conductive layer 130 on the substrate 14 by using a laser etching process includes the following steps. First, a transparent conductive layer 33 is formed on the substrate 140 with reference to FIG. 1H'. The transparent conductive layer 33 is, for example, an indium tin oxide (ITO) layer, an aluminum doped zinc oxide (AZ0), a carbon nanotube Uarb〇n nano-tube layer, and a conductive polymer. Layer or other suitable transparent conductive layer. Further, in the present embodiment, the step of forming the transparent conductive layer 曰33 on the substrate 14 is, for example, sputtering a transparent conductive layer 33 on the substrate 14A. Then, a portion of the transparent conductive layer is etched using a laser beam to form a first-patterned transparent lead 13 〇 with reference to FIG. For other details of forming the second patterned transparent conductive layer 13 by using a laser process, reference may be made to the first patterned transparent conductive layer using a laser etching process > detail, as shown in FIG. 1C and FIG. 1D. , will not repeat here. Next, referring to Fig. 1J and Fig. 1K, a plurality of second peripheral lines 24 are formed on the substrate 140 by the ink jet process (which is, for example, a laser thinning process). The steps of forming these second weeks on the substrate 140 using the laser button engraving process in ^ = "the steps of 201243665 include the following steps. First, referring to the item u, a conductive layer 34 is formed on the substrate H0. For example, the screen printing can be formed on the substrate M0 by using a screen printing method. Detailed details of the screen printing can be referred to the details of the screen printing conductive layer 322 described above, as shown in Fig. 1E, and will not be repeated here. Further, the conductive layer is, for example, a metal layer, and the material of the conductive layer 340 is, for example, a combination of silver, other metals, or a plurality of metals. Referring again to Figure 1K, a portion of conductive layer 340 is etched using laser beam 72 to form these second peripheral lines 24A. For details of etching a portion of the conductive layer 340 by the laser beam 72, reference may be made to the above-described details of etching a portion of the conductive layer 322 by the laser beam 72, as shown in FIG. 1 and FIG. 1F, and will not be repeated here. A top view of the second peripheral line 240 and the second patterned transparent conductive layer 13A can be referred to FIG. 2C. As shown in FIG. 2C, in the embodiment, the second patterned transparent conductive layer 130 includes a plurality of rows of second electrode strings 132, and each row of second electrode strings 132 includes a plurality of second sensing electrodes 131 and a plurality of A first connection segment 133 is electrically connected to the adjacent two first sensing electrodes 131. In addition, the second sensing electrodes κι are each a transparent conductive pad. § The shape and position of the first peripheral line 240 and the second patterned transparent conductive layer I% are appropriately designed, so that the second peripheral line 240 and the second patterned transparent conductive layer can be formed as shown in FIG. 2C. 13〇 electrical connection. In the present embodiment, these second peripheral lines 24 are electrically connected to the second electrode strings 132, respectively. Then, referring to FIG. 1L, a light-transmissive protective layer 12 201243665 150' is formed on the substrate 140 and the transparent protective layer 150 covers the second patterned transparent conductive layer no and the second peripheral lines 240. The light transmissive protective layer 15 can be used to protect the second patterned transparent conductive layer 130 from the second peripheral line 24 from external elements. In one embodiment, the light transmissive protective layer has a light transmittance of, for example, 99%, a haze of, for example, less than 0 5, and its b* chromaticity value on the Lab color coordinates, for example, approaches 〇. Further, the light-transmitting protective layer 150 may be formed by roll coating or slit die coating. Thereafter, referring to FIG. 1M, the substrate 140 is bonded to the first patterned transparent conductive layer 120, for example, by using an optical transparent adhesive (0Cdcaldear adhesive, 0CA) 180. In addition, in the embodiment, the optical transparent adhesive 180 also adheres to the first peripheral line 230 and the substrate 140, and the transparent insulating layer 170 and the substrate 140 are adhered. Thus, the touch device 100 of the present embodiment can be completed. The top view of the first patterned transparent conductive layer 120, the second patterned transparent conductive layer 13A, the first peripheral line 23A and the second peripheral line 24A in the touch device 100 can be referred to FIG. 2D. In the present embodiment, the orthographic projection of the first sensing electrodes 121 on the substrate 110 does not overlap the orthographic projection of the second sensing electrodes 131 on the substrate U?. In other words, from the top view of Fig. 2D, the first sensing electrodes 121 and the second sensing electrodes 131 do not overlap each other. Moreover, in the present embodiment, the first connecting segments 123 and the second connecting segments 133 are mutually overlapped, and the substrate 140 separates the first connecting segments 123 from the second connecting segments 133. When the user touches the substrate u0 with a finger or a stylus or the like, the electricity between the first electrode string 122 and the second electrode string 132 varies with the touch position. The touch device 1 can detect the occurrence of a touch action and a change in the touch position by the change of the electric valley between the first electrode string 122 and the second electrode string 132. A peripheral line 230 and a second peripheral line 24A can be externally connected to an external line, such as a flexible printed circuit board (FPC). Then, the external line transmits the first electrode string 122 and the second electrode string 132 (four) signals to a processing unit, and the processing unit can transmit the first electrode string 122 and the second electrode string 132 according to the first electrode string 122. The signal number determines whether there is a change in the touch action and the touch position. The touch device 100 of the present embodiment can be attached to the display screen of the display, and the light-transmitting area (ie, the opening 162) surrounded by the light-shielding frame 16 is aligned with the display screen. In this way, you can see how the maker touches the objects or graphics in the screen. In the manufacturing method of the touch device 100 of the present embodiment, since the inkjet process and the laser (10) process are used to fabricate the first peripheral line 23〇 and the second peripheral line, the first-peripheral line is moved. The money and line spacing of the two peripheral lines 24.G can be made finer, and the positional accuracy of the second road 230 and the second peripheral line is also higher. In addition, using a screen printing process and a laser etching process to pattern the transparent conductive layer 12G and the second patterned transparent conductive layer (10) using a screen printing process and an inkjet process to form a light-shielding frame (10), the steps of the whole difficulty mode of the touch (four) room of the present embodiment are relatively simple 201243665. The method of making the touch ^ (8) of the present embodiment can be used under the premise of: re-lighting The method of manufacturing the touch device 100 of the present embodiment can reduce the cost of the device and improve the process efficiency, and at the same time, can reduce the use of the fouling acid test solution. When the first patterned transparent conductive layer 120, the second patterned transparent conductive layer 130, the first peripheral line 230 and the second peripheral line 240 are formed by a laser button process, the minimum line width can reach, for example, 30 micrometers. And the minimum line spacing can also reach, for example, 3 〇 micrometers. Further, when the first week, the line 230 and the second peripheral line 24 are shaped by an ink jet process: the minimum line width thereof can be, for example, 20 μm, and the minimum line pitch can also be, for example, 20 μm. FIG. 3 is a schematic diagram showing one step of a method of fabricating a touch device according to another embodiment of the present invention. Referring to FIG. 3, the step of forming the light-shielding frame 160 by the ink-jet process described above with reference to FIG. 1Ai can be replaced by the step of forming the light-shielding frame 160 by the screen printing process of FIG. Specifically, in the present embodiment, a screen having patterned holes may be disposed on the substrate 110, and then ink (e.g., black ink) may be applied to the patterned holes of the screen. As a result, the ink is applied to the substrate 110 via the patterned holes to form the ink layer 352. Then, the portion of the ink patterning hole is scraped off by the knife 8 。. Thereafter, the screen 6〇b is removed, and the ink is cured by photocuring, heat curing or natural curing to form a light-shielding frame 160 as shown in FIG. 1A. 4 is a schematic diagram of one of the steps of a method of fabricating a touch device according to still another embodiment of the present invention. Referring to FIG. 4, the step of forming the transparent conductive layer 310 on the substrate 110 by the method of using the mirror 15201243665 of FIG. 1C can be performed by the step of forming the transparent conductive layer 362 on the substrate 110 by the screen printing process of FIG. 4. Replace. Specifically, in the present embodiment, the screen 60c having the patterned holes can be disposed on the substrate 11, and then the solution of the conductive material can be applied to the patterned holes of the screen 60c. In this way, the solution of the transparent conductive material is applied to the substrate 110 via the patterned holes, for example, on the transparent insulating layer 170. Then, use a scraper to scrape off the green spill (4) of the hole in the material. Then, the screen 6〇c is removed, and the solution of the transparent conductive material is cured by photocuring, heat curing or natural curing to form the transparent conductive layer 362. Then, in the towel of the embodiment, the partially transparent conductive layer 362 can be engraved by chemical butterfly or physical rhyme, and the non-side portion of the transparent conductive layer 362 can be formed as shown in FIG. 1D. The conductive layer 12G. Further, the screen printing process and the side process of Fig. 4 can also be used to form the second patterned transparent conductive layer 13 (Fig. II). FIG. 5 is a schematic diagram showing a middle step of a method for fabricating a touch device according to still another embodiment of the present invention. Referring to FIG. 5, the above figure and FIG. π=step of forming the first peripheral line 23〇 on the substrate 11 by using the laser surname process can be used to form the first peripheral line on the substrate m by using the nozzle ink process of FIG. Replaced by the step of 230. Specifically, a silver ruin or other metal solution may be sprayed on the edge of the substrate 110 by using an ink jet head, and then the silver or other metal solution may be surrounded by a 23 Å, W curing method. After the ink tree is printed on the substrate, the surface of the soil plate 110 is treated as a surface characteristic so that the silver 201243665 or other metal solution can be collected on the substrate 11 when it is printed on the substrate 11〇 without being spread out. . The surface characteristic treatment includes coating a film on the substrate 110, for example, by coating on the transparent insulating layer 170, and then printing silver or other metal solution on the film, and the characteristics of the film can be silver paste. Or other metal solutions converge without spreading. Further, in the present embodiment, the ink jet head 50b is, for example, a piezoelectric ink jet head which is resistant to silver corrosion. FIG. 6 is a schematic diagram showing one step of a method of fabricating a touch device according to another embodiment of the present invention. Referring to FIG. 6, the manufacturing method of the touch device 100a of the present embodiment is similar to the method for manufacturing the touch device 1A of FIG. 1M, and the difference between the two is as follows. In this embodiment, the light-shielding frame 160 is formed on the substrate 11A, and the first patterned transparent conductive layer 120 and the first patterned peripheral line 230 are formed on the substrate 140. For details of forming the light-shielding frame 16A, the first patterned transparent conductive layer 12A, and the first patterned peripheral line 230, reference may be made to the above embodiment, and will not be repeated here. In addition, the manufacturing method of the touch device 100a of the embodiment further includes the following steps. First, a substrate 220 is provided. In the present embodiment, the substrate 220 is, for example, a plastic substrate. However, in other embodiments, the substrate can also be a glass substrate. In addition, in this embodiment, the substrate 110, the substrate 140, and the substrate 220 are all transparent substrates. Next, a second patterned through-conducting layer 13 is formed on the substrate 220 by one of a screen printing process and a laser engraving process. The process details of the second patterned transparent conductive layer (4) are formed, and the above-mentioned embodiments are not repeated here. Then, a plurality of second peripheral lines 240 are employed on the substrate 22() by the ink jet process and the laser process. For details of the process of forming the second peripheral line 24, refer to the embodiment of the above-mentioned 17 201243665, which is not repeated here. These second peripheral lines can be electrically connected to the second patterned transparent conductive layer via appropriate design of the second peripheral line 24 and the position and shape of the second patterned transparent conductive layer 130. Then, the first patterned transparent conductive layer 120 is bonded to the substrate 11 , for example, the first patterned transparent conductive layer 120 and the substrate 110 are bonded together by the optical transparent adhesive 180 , and the substrate 140 and the substrate 110 are bonded to each other. The first peripheral line 230 and the light-shielding frame 160 ′ are attached to the substrate 140 and the light-shielding frame 160 . Then, the first patterned transparent conductive layer 130 is bonded to the substrate 14 , for example, the second patterned transparent conductive layer 13 〇 and the substrate 140 are bonded by the optical transparent adhesive 210, and the second peripheral line 240 and the substrate are bonded. 14〇, and the substrate 220 and the substrate 140 are bonded. Thus, the touch device 1A of the embodiment is completed. 7A to 7C are schematic diagrams showing a part of the flow of a touch device according to still another embodiment of the present invention, wherein FIG. 8a is a cross-sectional view along line II of FIG. 7A, and FIG. 8B is a cross-sectional view of FIG. 7B. The section of line II-II is not intended. Referring to FIG. 7A to FIG. 7C and FIG. 8A to FIG. 8B, the manufacturing method of the touch device 100b of the present embodiment is similar to the manufacturing method of the touch device 100 of FIG. 1M, and the difference between the two is as follows. Said. First, referring to FIG. 7A and FIG. 8A, when one of the screen printing process and the laser etching process is used to form the first patterned transparent conductive layer 12 on the substrate 11A, the same process is also used on the substrate 110. Forming a second patterned transparent conductive layer 130b, wherein the second patterned conductive layer 13B includes a plurality of columns of first electrode strings 132b'. Each column of second electrode strings i32b includes a plurality of second sensing electrodes 131 separated from each other. . In addition, when the first peripheral lines 18 201243665 230 are formed on the substrate 110 by one of the ink jet process and the laser button engraving process, a plurality of second peripheral lines 240 are also formed on the substrate 11 by the same process. When the positions and shapes of the second peripheral lines 24 and the second patterned conductive layer 130b are appropriately designed, the second peripheral lines 240 can be electrically connected to the portion of the second patterned transparent conductive layer 13%. Then, referring to FIG. 7B and FIG. 8B, a plurality of insulating patterns 142b are formed on the first connecting segments 123. For example, an insulating paste can be sprayed on the first connecting segments 123 by using an inkjet process, and the insulating adhesive is cured. An insulating pattern 142b may be formed. Then, a plurality of second connections 133b are formed on the insulating patterns 142|3, wherein the mother-connecting segments 133b are electrically connected to the adjacent two second sensing electrodes 131, and thus the second peripheral lines 24〇 These second electrode strings 132b can be electrically connected separately. Further, these insulating patterns 142b separate the first connecting segments 123 and the second connecting segments 133b, respectively. The method of forming the connecting portion 133b is, for example, spraying a solution of silver paste, a metal solution or a transparent material on the insulating pattern 142b by an inkjet process, and forming a second connection after the solution of the silver paste, the metal solution or the transparent material is cured. Segment 133b. Referring to FIG. 7C, a transparent protective layer 150 and a hard coat layer 190 are respectively formed on opposite sides of the substrate 110, wherein the transparent protective layer 15 covers and protects the first patterned transparent conductive layer 120 and the second pattern. The transparent conductive layer 130b, the first peripheral line 230, and the second peripheral line 240 are formed. In addition to the advantages and effects of the above embodiments, the touch device 100b can reduce the thickness of the touch device 1b and reduce the weight. In other words, the present embodiment can realize the touch device 100b of a single substrate. 201243665 It is noted that the above embodiment is formed by first forming a first patterned transparent conductive layer and then forming a first peripheral line, and first forming a first patterned transparent conductive layer and then forming a second peripheral line. example. However, in other embodiments, the first peripheral conductive line may be formed first and then the first patterned transparent conductive layer may be formed, and the second peripheral conductive line may be formed first and then the first patterned transparent conductive layer may be formed. In summary, in the manufacturing method of the touch device according to the embodiment of the present invention, since the first peripheral line and the second peripheral line are formed by using one of an inkjet process and a laser etching process, the first periphery is The line width and the line spacing of the line and the second peripheral line can be made finer, and the positional accuracy of the first peripheral line & and the second peripheral line is also higher. In addition, the first patterned transparent conductive layer and the second patterned transparent conductive layer are formed by using one of a screen printing process and a laser marking process, and one of the screen printing process and the inkjet process is used to form a light shielding frame. The steps of the overall manufacturing method of the touch device according to the embodiment of the present invention are simplified. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the implementation of the present invention by this, i.e., the simple equivalent change of the patent application of the present invention. And modifications are still within the scope of the invention. In addition, the present invention is not limited to the full scope of the invention. Further, the 'summary section and the title are only time-patent document search and are not intended to limit the scope of the invention. In addition, the terms "second", etc. mentioned in the specification or the scope of the patent are only used to name the element or distinguish different embodiments or ranges, and 201243665 is not used to limit the number of components. Upper or lower limit. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. 1A are schematic cross-sectional views showing the flow of a manufacturing method of the present invention.触控Touch device FIG. 2A is a top view of FIG. 1A. 2B is a top view of the image ip. 2C is a top plan view of FIG. 1K. A top view of the first patterned transparent conductive layer, the second electrical layer, the first peripheral line, and the second peripheral line in the material Πί® 1M. 3 is a touch device according to another embodiment of the present invention. FIG. 4 is a schematic diagram showing one step of a method of fabricating a touch device according to still another embodiment of the present invention. / Figure 5 is a schematic diagram showing one of the steps of a method of fabricating a touch device according to still another embodiment of the present invention. FIG. 6 is a schematic diagram showing one step of a method of fabricating a touch device according to another embodiment of the present invention. 7A to 7C are schematic diagrams showing a part of the flow of a method for fabricating a touch device according to still another embodiment of the present invention. Figure 8A is a cross-sectional view taken along line 14 of Figure 7A. Fig. 8B is a schematic cross-sectional view of the line along the line (4). 21 201243665 [Description of main component symbols] 50a, 50b: inkjet heads 60a, 60b, 60c: screen 70: laser light source 72: laser beam 80: doctor blades 100, 100a, 100b: touch devices 110, 140, 220 The substrate 120: the first patterned transparent conductive layer 121: the first sensing electrode 122: the first electrode string 123: the first connecting segment 130, 130b: the second patterned transparent conductive layer 131: the second sensing electrode 132, 132b: second electrode string 133, 133b: second connection segment 142b: insulation pattern 150: light-transmissive protective layer 160: light-shielding frame 162: opening 170: transparent insulating layer 180, 210: optically transparent adhesive 190: hard-film layer 230: First peripheral line 22 201243665 240 : second peripheral line 310 , 330 , 362 : transparent conductive layer 322 , 340 : conductive layer 352 : ink layer 23