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TW201237103A - Curable composition, cured article, and method for using curable composition - Google Patents

Curable composition, cured article, and method for using curable composition Download PDF

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TW201237103A
TW201237103A TW100143910A TW100143910A TW201237103A TW 201237103 A TW201237103 A TW 201237103A TW 100143910 A TW100143910 A TW 100143910A TW 100143910 A TW100143910 A TW 100143910A TW 201237103 A TW201237103 A TW 201237103A
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curable composition
group
optical element
decane
compound
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TW100143910A
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Chinese (zh)
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TWI537339B (en
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Mikihiro Kashio
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Lintec Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • C09J183/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5435Silicon-containing compounds containing oxygen containing oxygen in a ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
  • Sealing Material Composition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

The present invention is a curable composition containing: (A) a specific silane compound random copolymer and (B) a silane coupling agent having a reactive cyclic ether structure, the mass ratio of (A) and (B) being (A):(B) = 95:5 to 80:20. The present invention is also a cured article formed when the composition is cured, and a method for using the composition as an adhesive or the like for a material with which an optical element is fixed. The present invention provides a curable composition from which a cured article having superior heat resistance and transparency and having high adhesive strength is obtained, a cured article formed when the composition is cured, and a method for using the composition as an adhesive or the like for a material with which an optical element is fixed.

Description

201237103 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 五、本案,有化學式時,請揭示最能顯讀明特徵的化學式201237103 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None. 5. In this case, when there is a chemical formula, please reveal the chemical formula that best describes the characteristics.

R1 六、發明說明: 【發明所屬之技術領域】 一本發明係關於可得透明性及耐熱性優良’並且且有很 之硬化物之硬化性組成物;硬化該組成物而成 ,及使用該組成物作為光元件固定材用接著劑或 次*疋件固定材用封裝劑之方法。 先前技術】 至今’硬化性組成物按照用途做了各式各樣的改良 2 201237103 廣泛地用於作為光學零件及成形體的原料、接著劑、塗層 劑等產業上。例如,可形成透明性優良的硬化物之硬化性 ,,成物彳良好地用於作為光學零件的原料及塗層劑,此 外,可形成具有很高的接著力的硬化物之硬化性組成物, 可良好地用於作為接著劑及塗層劑。 此外近歲年,硬化性組成物,亦用於作為製造光元 件封裝體時之光元件固定材用接著劑及光元件固定材用封 裝劑等的光元件固定材用組成物。 光元件,有半導體雷射(LD)等的各種雷射及發光二極 體(LED)等的發光元件、光接收元件、複合光元件、光積體 電路等。在近幾年,比發光的波峰波長更短波長的藍色光 及白光的光元件被開發而被廣泛地使用。 如此之發光的波峰波長短的發光元件的高亮度化飛躍 地進步,亦伴隨著該光元件的發熱量有變得更大的趨勢。 然而,隨著近幾年的光元件的高亮度化,光元件固定 材用組成物的硬化物,長時間曝於更高能量的光及光元件 所發出的更高溫的熱,而產生惡化發生裂紋或剝離等的問 題。 為解決該問題,在於專利文獻卜3,有以聚矽倍半氧 貌化合物作為主要成分的光元件固定材用組成物之提案。 但是’即使是專利文獻1〜3所述的聚矽倍半氧烧化合 物作為主要成分的光元件固定材用組成物的硬化物,亦有 難以維持充份的接著力,得到耐熱性及透明性之情形。 此外,作為用於光元件封裝用的組成物,於專利文獻 3 201237103 m 4有使用月旨環環氧樹脂之環氧樹脂組成物於專利文獻5 有含有聚硫醇化合物之環氧樹脂組成物之提案。 但是,即使使用該等組成物之情形,亦有無法滿足伴 隨經時變化之充分的耐光亞 J尤惡化性,或接者力下降等情形。 因二匕’迫切期望開發,可得财熱性、透明性優良,且 具有很咼的接著力之硬化物之硬化性組成物。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2004_359933號公報 [專利文獻2]本特開2〇〇5_263869號公報 [專利文獻3]日本特開2〇〇6_328231號公報 [專利文獻4]曰本特開平7_3〇9927號公報 [專利文獻5]日本特開2009-001 752號公報 【發明内容】 [發明所欲解決的課題] 本發明係有鑑於先前技術之實情而完成者,其課題在 於提供可得耐熱性及透明性優良,且具有很高的接著力之 硬化物之硬化組成物;硬化該組成物而成的硬化物;及使 用該組成物作為光元件固定材用接著劑或光元件固定材用 封裝劑之方法。 [用以解決課題的手段] 本發明者們為解決上述課題專心反覆研究的結果,發 現以特定比例包含:(A)特定矽烷化合物之隨機共聚物;及 4 201237103 (B)特疋比例矽烷偶合劑的組成物,可長期保持優良的透明 耐熱!·生,且在於兩溫亦可具有很高的接著力的硬化物, 而達至完成本發明。 根據本發明的第1,可提供如下[1]〜[8]之硬化性組成 [1 ] 一種硬化性組成物,其係將(A)矽烷化合物隨機共 聚物,其係於分子内,以下述式(i)、(ii)及(iii)所示反 覆單位之中,具有(i)及(ii)、(i)及(iii)、(ii)及(iii)、 或(i)、(ii)及(iii)的反覆單位,重量平均分子量為 i,000〜30, 〇〇〇;及(β)具有反應性環醚構造之矽烷偶合劑, 以(Α)與(Β)與質量比,以(Α):(Β) = 95:5〜8〇:2〇的比例包含R1 VI. Description of the Invention: [Technical Field to Which the Invention Is Applicable] The present invention relates to a hardenable composition which is excellent in transparency and heat resistance and which has a hardened material; it is obtained by hardening the composition, and using the same The composition is used as an adhesive for an optical element fixing material or a secondary encapsulating agent for a fixing material. [Prior Art] Up to now, the curable composition has been improved in various ways according to the use. 2 201237103 It is widely used as a raw material, an adhesive, and a coating agent for optical parts and molded bodies. For example, the hardenability of the cured product excellent in transparency can be formed, and the product can be favorably used as a raw material and a coating agent for optical parts, and a hardenable composition of a cured product having a high adhesion can be formed. It can be used well as an adhesive and a coating agent. In the recent years, the curable composition is also used as a composition for an optical element fixing material such as an adhesive for an optical element fixing material and a sealing agent for an optical element fixing material when the optical element package is manufactured. The optical element includes various types of lasers such as semiconductor lasers (LDs) and light-emitting elements such as light-emitting diodes (LEDs), light-receiving elements, composite optical elements, and optical integrated circuits. In recent years, optical elements of blue light and white light having shorter wavelengths than the peak wavelength of light have been developed and widely used. The high luminance of the light-emitting element having a short peak wavelength of such light emission is progressing rapidly, and the heat generation amount of the optical element tends to become larger. However, with the increase in the brightness of the optical element in recent years, the cured product of the composition for the optical element fixing material is exposed to higher-energy light and higher-temperature heat emitted from the optical element for a long time, and deterioration occurs. Problems such as cracks or peeling. In order to solve this problem, there is a proposal for a composition for an optical element fixing material containing a polyfluorene sesquioxide compound as a main component. However, even in the cured product of the composition for an optical element fixing material which is a main component of the polyfluorene sesquioxide compound described in Patent Documents 1 to 3, it is difficult to maintain a sufficient adhesive force to obtain heat resistance and transparency. The situation. Further, as a composition for optical element packaging, Patent Document 3 201237103 m 4 has an epoxy resin composition using a Moon-ring epoxy resin, and Patent Document 5 has an epoxy resin composition containing a polythiol compound. Proposal. However, even in the case of using such a composition, there is a case where it is impossible to satisfy the sufficient deterioration of the light-resistance with the change with time, or the contact force is lowered. Because of the urgent development of the company, it is possible to obtain a hardenable composition of a cured product which is excellent in heat and transparency and has a strong adhesion. [Patent Document 1] [Patent Document 1] JP-A-2004-359933 [Patent Document 2] JP-A-2002-359869 [Problems to be Solved by the Invention] The present invention has been completed in view of the facts of the prior art. [Patent Document 5] JP-A-2009-001 752 (Patent Document 5) A problem is to provide a cured composition of a cured product which is excellent in heat resistance and transparency and has a high adhesion, a cured product obtained by curing the composition, and a composition for use as an optical element fixing material. A method of encapsulating agent for a subsequent agent or an optical element fixing material. [Means for Solving the Problem] The inventors of the present invention have found that a specific ratio includes: (A) a random copolymer of a specific decane compound; and 4 201237103 (B) a special ratio of a cetane couple. The composition of the mixture can maintain excellent transparent heat resistance for a long time! · The raw material, and the hardened material which can also have a high adhesion force at both temperatures, achieves the completion of the present invention. According to a first aspect of the present invention, there is provided a curable composition of the following [1] to [8] [1] a curable composition which is a (A) decane compound random copolymer which is attached to a molecule, and is described below. Among the recurring units shown in formula (i), (ii) and (iii), there are (i) and (ii), (i) and (iii), (ii) and (iii), or (i), The reciprocal units of ii) and (iii), the weight average molecular weight is i,000~30, 〇〇〇; and (β) the decane coupling agent having a reactive cyclic ether structure, with (Α) and (Β) and mass ratio To (Α):(Β) = 95:5~8〇: The ratio of 2〇 contains

式中’ R係表示氫原子或碳數1〜6的烧基,D係單鍵結或 可具有取代基的碳數卜20之2價有機基。R2係表示碳數 1〜20之烷基或可具有取代基之苯基。 [2]如[1]所述的硬化性組成物,其中上述(Α)的石夕烧化 5 201237103 合物隨機共聚物,係以式Ri-CiKCiO-D -表示之基的存在量 ([R'-CHCCfO-D]),與R2的存在量([R2]),以莫耳比為 [t-CHCCfO-D]: [R2]=5:95~50:50之矽烷化合物隨機共聚 物。 [3 ] —種硬化性組成物,其係將 (A’)石夕烧化合物隨機共聚物,其係式(i):ri_ch(cn)-D -SiCORS^x1)3”所示之石夕烧化合物(1)之至少一種;及气 (2).RSi(〇R )q(X )3-q所示的碎院化合物(2)之至少_種的 石夕烷化合物的混合物縮合而得,重量平均分子量為 1,〇〇〇〜30, 〇〇〇 ;及 (B)具有反應性環醚構造之矽烷偶合劑,以(A,)與(b) 與質量比,以(八,):^) = 95:5〜80:20的比例包含者: 式中R1係表示氫原子或碳數^之烷基,D係單鍵結 或可具有取代基的碳數卜20之2價有機基,R3係表示碳數 1〜6之烷基,X1係表示齒素原子,p係表示〇〜3的整數; 式中R2係表示碳數卜20之烷基或可具有取代基的笨 基’ R4係表示碳數Η㈣基,X2係表示_素原子,^係表 示0~3的整數。 ^ [4]如[3]所述的硬化性組成物’其中上述(a,)之矽俨 化合物隨機共聚物,係錢化合物⑴與残化合物(/ 二莫_耳比為[石夕燒化合物⑴]…夕燒化合物 5.95 50.50之比例縮合而得之矽烷化合物隨機 物。 /、永 [5 ]如[1 ]〜[4 ]之任何一項 所述的硬化性組成物, 其中 201237103 上述(B )石夕烧偶合劑係具有環己稀氧化物基的石夕烧偶合劑。 [6 ]如[1 ]〜[5 ]之任何一項所述的硬化性組成物,其中 進一步含有(C)金屬原子為鋁、鍅或鈦之金屬錯合物,(c) 成分的含量對(A)成分或(a,)成分丨00質量部,包含〇質量 部以上,1 0質量部以下。 [7 ]如[1 ]〜[5 ]之任何一項所述的硬化性組成物,其中 進一步含有(D)具有羧基之脂環酸酐,(d)成分的含量對(a) 成分或(A’)成分1〇〇質量部包含〇質量部以上,1〇質量部 以下。 [8 ]如[1 ]〜[7 ]之任何一項所述的硬化性組成物,其係 光元件固定材用組成物。 根據本發明的第2,可提供如下[9]、[1〇]之硬化物。 [9 ] 一種硬化物,其係硬化[丨]〜[7 ]之任何一項所述的 硬化性組成物而成。 [10]一種硬化物,其係硬化[n〜[7]之任何一項所述的 硬化性組成物而成。 根據本發明的第3,可提供如下[11;]、[12]的使用本 發明之硬化性組成物之方法。 [11 ] 一種方法,其係將[丨〜I; 7 ]之任何一項所述的硬化 性組成物,使用於作為光元件固定材用接著劑。 [12]—種方法,其係將π]〜[7]之任何一項所述的硬化 性組成物,使用於作為光元件固定材用封裝劑。 [發明效果] 根據本發明之硬化性組成物,可得即使以高能量的光 7 201237103 照射之情形或高溫狀態, 長期 並不會有著色而降低透明性, 性,可In the formula, R represents a hydrogen atom or a carbon group having 1 to 6 carbon atoms, and D is a single bond or a carbon number of 20 which may have a substituent. R2 represents an alkyl group having 1 to 20 carbon atoms or a phenyl group which may have a substituent. [2] The curable composition according to [1], wherein the above-mentioned (Α) 夕 烧 5 5 201237103 compound random copolymer is represented by a group represented by the formula Ri-CiKCiO-D - ([R '-CHCCfO-D]), a random copolymer of decane compound having a molar amount of R2 ([R2]) and a molar ratio of [t-CHCCfO-D]: [R2]=5:95 to 50:50. [3] A hardening composition which is a random copolymer of (A') Shixi-sinter compound, which is represented by the formula (i): ri_ch(cn)-D-SiCORS^x1)3" Burning at least one of the compound (1); and a mixture of at least one of the oxalate compounds of the fragment compound (2) represented by the gas (2).RSi(〇R)q(X)3-q , a weight average molecular weight of 1, 〇〇〇 30, 〇〇〇; and (B) a decane coupling agent having a reactive cyclic ether structure, with (A,) and (b) to mass ratio, (eight) :^) = 95:5~80:20 ratio of inclusion: where R1 represents a hydrogen atom or an alkyl group of carbon number, D is a single bond or a carbon number which may have a substituent. a group, R3 represents an alkyl group having 1 to 6 carbon atoms, X1 represents a dentate atom, and p represents an integer of 〇~3; wherein R2 represents an alkyl group of carbon number 20 or a stupid group which may have a substituent 'R4 is a carbon number 四(tetra) group, X2 is a _ atom, and ^ is an integer of 0 to 3. ^ [4] The sclerosing composition as described in [3], wherein the above (a,) a random copolymer of a compound, a compound (1) and a residual compound (/ The molar ratio of the oxime compound is 随机 化合物 化合物 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 5.9 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物The curable composition, wherein 201237103, the above (B), is a sulphur coupling agent having a cyclohexene oxide group. [6] The hardening according to any one of [1] to [5] The composition further contains (C) a metal complex in which the metal atom is aluminum, ruthenium or titanium, and the content of the component (c) is (A) component or (a,) component 丨 00 mass part, including 〇 mass part The hardening composition according to any one of [1] to [5] further comprising (D) an alicyclic acid anhydride having a carboxyl group, and a content of the component (d) The (a) component or the (A') component 1 〇〇 mass portion includes a 〇 mass portion or more, and a 〇 mass portion or less. [8] The curable composition according to any one of [1] to [7] According to the second aspect of the present invention, the cured product of the following [9] and [1〇] can be provided. [9] A cured product which is hard. [10] A hardened composition according to any one of [n] to [7], wherein the hardening composition according to any one of [n] to [7] is cured. According to the third aspect of the present invention, there is provided a method of using the curable composition of the present invention as follows [11;], [12] [11] A method of any of [丨~I; 7] One of the curable compositions described above is used as an adhesive for fixing an optical element. [12] The curable composition according to any one of [7] to [7], which is used as an encapsulant for an optical element fixing material. [Effect of the Invention] According to the curable composition of the present invention, even when irradiated with high-energy light 7 201237103 or a high temperature state, coloring is not caused for a long period of time, and transparency is lowered.

及光元件固定材用封裝劑。 時,特別是,可 【實施方式】 以下、將本發明分項為丨)硬化性組成物、2)硬化物、 及3)硬化性組成物的使用方法,詳細地說明。 1)硬化性組成物 本發明的硬化性組成物’其特徵在於將(A)矽烷化合物 隨機共聚物,其係於分子内,以下述式(i)、( i丨)及(i i i) 所示反覆單位之中,具有(i)及(ii)、(i)&(iii)、(ii) 及(i i i )、或(i)、( i i)及(i i i)的反覆單位,重量平均分子 量為1,000〜30, 000 ;及(B)具有反應性環醚構造之矽烷偶 合劑,以(八)與(6)與質量比,以(八):(8) = 95:5~80:20的比 例包含者: 201237103And an encapsulant for optical component fixing materials. In particular, the following is a description of the method of using the curable composition, 2) the cured product, and 3) the curable composition, which will be described in detail below. 1) Curable composition The curable composition of the present invention is characterized in that (A) a random copolymer of a decane compound, which is attached to the molecule, is represented by the following formulas (i), (i), and (iii) Among the recurring units, there are repetitive units of (i) and (ii), (i) & (iii), (ii) and (iii), or (i), (ii) and (iii), weight average molecular weight. Between 1,000 and 30, 000; and (B) a decane coupling agent having a reactive cyclic ether structure, with (8) and (6) and mass ratio, (8): (8) = 95:5-80 The ratio of :20 is included: 201237103

CH—CNCH-CN

(i) ⑻ (iii) 式中,R1係表示氩原子或碳數1〜6的烷基,D係單鍵結或 可具有取代基的碳數1~20之2價有機基。r2係表示碳數 1〜20之烷基或可具有取代基之笨基。 (A )矽烷化合物隨機共聚物 本發明的硬化性組成物,作為(A)成分,包含於上述式 (i) 、(ii)及(iii)所述之反覆單位之中,具有(i)及(h)、 (Ο 及(iii)、(ii)及(iii)、或(i)' 及(iii)的反覆單 位,重量平均分子量為丨,000〜30, 000之矽烷化合物隨機共 聚物(以下,有稱為「矽烷化合物隨機共聚物(A )」之情 形〇 )。 矽烷化合物隨機共聚物(A),可分別具有一種以(丨)、 (ii) (iii)所示之反覆單位’亦可具有二種以上。 式(1)〜(1 1 1)中,R1係表示氫原子或碳數卜6之烷基, 以氫原子為佳。 以Ri表示之碳數i~6之烷基,可舉甲基、乙基、正丙 基、異丙基、正丁基、第三丁基、異丁基、第二丁基、正 201237103 戊基、正己基等。 D係單鍵結或可具有取代基之碳數1〜2 0之2價有機基。 該2價的有機基’可舉可具有取代基之碳數1〜2〇之亞 烧基、可具有取代基之碳數2〜20之亞烯基、可具有取代基 之碳數2〜20之亞炔基、可具有取代基之碳數6〜20之亞芳 基、由可具有取代基之(亞烷基、亞烯基或亞炔基)與可具 有取代基之亞芳基之組合所組成,可具有取代基之碳數 7〜20之2價有機基等。 上述亞院基之亞烷基,可舉亞甲基、亞乙基、亞丙基、 三亞曱基、四亞曱基、五亞甲基、六亞曱基等。 上述亞烯基之亞烯基’可舉亞乙烯基、亞丙烯基、亞 丁烯基、亞戊烯基等。 上述亞炔基之亞炔基,可舉亞乙炔基、亞丙快基等。 上述亞芳基之亞芳基,可舉鄰亞笨基、間亞苯基、對 亞苯基' 2, 6-亞奈基等。 上述亞烧基、亞稀基及亞炔基的取代基’可舉氟原子、 氣原子等的函素原子;曱氧基、乙氧基等的烷氧基;甲基 硫代基、乙基硫代基等的烷基硫代基;甲氧基羰基、乙氧 基幾基等的烧氧基幾基等。 上述亞芳基之取代基,可舉氰基;硝基;氟原子、氯 原子、溴原子等的鹵素原子;甲基、乙基等的烷基;甲氧 基、乙氧基等的烷氧基、甲基硫代基、乙基硫代基等的烷 基硫代基等。 該等取代基、可鍵結於亞烷基、亞烯基、亞炔基及亞 10 201237103 '芳基等的基的任意位置,可為同一或不同的複數個鍵結。 可具有取代基之(亞烷基、亞烯基或亞炔基)與可具有 取代基的亞芳基的組合所組成,可具有取代基的碳數 之2價有機基,可舉可具有上述取代基(亞烷基、亞烯基或 亞炔基)之至少一種,與上述可具有取代基的亞芳基之至少 一種直鏈鍵結之基。具體而言,可舉以下式表示之(i) (8) (iii) In the formula, R1 represents an argon atom or an alkyl group having 1 to 6 carbon atoms, and D is a single bond or a divalent organic group having 1 to 20 carbon atoms which may have a substituent. R2 represents an alkyl group having 1 to 20 carbon atoms or a stupid group which may have a substituent. (A) Cycloal Compound Random Copolymer The curable composition of the present invention, as the component (A), is contained in the reversing unit described in the above formulas (i), (ii) and (iii), and has (i) and (h), (Ο) and (iii), (ii) and (iii), or (i)' and (iii) of the recurring unit, a weight average molecular weight of 丨, 000~30, 000 decane compound random copolymer ( Hereinafter, there is a case called "the decane compound random copolymer (A)".) The decane compound random copolymer (A) may have a reversal unit represented by (丨), (ii) (iii), respectively. In the formulae (1) to (1 1 1), R1 represents a hydrogen atom or an alkyl group having a carbon number of 6, and preferably a hydrogen atom. The alkane of the carbon number i to 6 represented by Ri The base may, for example, be a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a t-butyl group, an isobutyl group, a second butyl group, a positive 201237103 pentyl group or a n-hexyl group. Or a divalent organic group having a carbon number of 1 to 2 carbon which may have a substituent. The divalent organic group ' may be a calcined group having a carbon number of 1 to 2 Å having a substituent, and a carbon which may have a substituent 2 to 20 alkenylene group, alkynylene group having 2 to 20 carbon atoms which may have a substituent, an arylene group having 6 to 20 carbon atoms which may have a substituent, and an alkylene group which may have a substituent a combination of an alkenyl group or an alkynylene group and a arylene group which may have a substituent, and a divalent organic group having 7 to 20 carbon atoms which may have a substituent, etc. a methyl group, an ethylene group, a propylene group, a triadenylene group, a tetrakisinyl group, a pentamethylene group, a hexamethylene group, etc. The alkenylene group of the above alkenylene group may be a vinylidene group or a propylene group. a butenylene group, a pentenylene group, etc. The alkynylene group of the above alkynylene group may, for example, be an ethynylene group or a propylene group. The arylene group of the above arylene group may be an adjacent sub-phenyl group or m-phenylene group. a p-phenylene '2,6-yarnylene group, etc. The substituent of the above-mentioned alkylene group, a sub-base group and an alkynylene group may be a functional atom of a fluorine atom or a gas atom; An alkoxy group such as an oxy group; an alkylthio group such as a methylthio group or an ethylthio group; an alkoxy group such as a methoxycarbonyl group or an ethoxy group; or the like. Substituent a cyano group; a nitro group; a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom; an alkyl group such as a methyl group or an ethyl group; an alkoxy group such as a methoxy group or an ethoxy group; a methylthio group; An alkylthio group such as a thio group, etc. These substituents may be bonded to an alkylene group, an alkenylene group, an alkynylene group, and a group of the group 10 201237103 'aryl group, etc., may be the same Or a plurality of different bonds. It may be composed of a combination of an (alkylene, alkenylene or alkynylene group) having a substituent and an arylene group which may have a substituent, and may have a carbon number of 2 The organic group may have at least one of the above substituents (alkylene, alkenylene or alkynylene) and at least one linear bond to the above-mentioned arylene group having a substituent. Specifically, it can be represented by the following formula

ch2 (CH2)2 CH, CH II CH 該等之中,D由可得具有很高的接著力的硬化物, 碳數1〜10之亞烷基為佳,以碳數卜6的亞烷基更加,以 數卜3的亞烷基特別佳。 式(i) (iii)之中’ R係表示碳數1~2〇的烧基或可 有取代基的苯基。 以R2表示之碳數1〜20之烷基,可舉曱基、乙基、 丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基 正戊基、正己基、正辛基、異辛基、正壬基、正癸基、 十二烧基等。 可具有R2所示取代基之苯基之取代基,可舉甲基、 基、正丙基、異丙基、正丁基、第二丁基、異丁基、第 丁基、正戊基、正己基、正庚基、正辛基、異辛基等的 11 201237103 基,甲氧基、乙氧基等的烧氧基;氣原子、氣原子等的鹵 素原子等。 以R2表示之可具有取代基的苯基的具體例,可舉苯 基、2-氣笨基4-甲基笨基、3-乙基苯基、2, 4-二甲基苯基、 2-甲氧基苯基等。 在於矽烷化合物隨機共聚物(A),以式:t — ciKCN)-!)-表示之基的存在量([t-CHCCfO-D])與R2的存在量([f])的 莫耳比’以[R^CHCC^-D)] : [R2] = 5:95〜50:50 為佳,以 10:90〜40:60更佳。藉由在於該範圍内,所得硬化物透明 性及接著性優良’且,由於耐熱性優良即使是放置於高溫 之後亦可抑制該等性質之下降。 以式:t-CIKCiO-D-表示之基及R2的存在量,可藉由 測定例如以矽烷化合物隨機共聚物(A)之NMR光譜定量。 石夕院化合物隨機共聚物(A)之重量平均分子量(Mw),係 1,〇〇〇〜30, 〇〇〇的範圍’以i 500_6, 〇〇〇的範圍為佳。藉由 在於該範圍内,組成物的操作性優良,且可得接著性 '耐 熱性優良的硬化物。重量平均分子量(),可例如以四氫 °夫痛(THF)為溶劑之凝膠滲透層析(GPC)以標準聚苯乙稀換 算值求得。。 矽烷化合物隨機共聚物(A)之分子量分佈(Mw/Mn)並無 特別限制,通常為1.0〜3.0,以1.卜2.0的範圍為佳。藉 由在於該範圍内,可得接著性、耐熱性優良的硬化物。 矽烷化合物隨機共聚物(A)可以一種單獨,或組合二種 以上使用。 12 201237103 於本發明的硬化性組成物,上述(A)成分之矽烷化合物 隨機共聚物 u),以縮合(A,)式(1):Rl_CH(CN)_D_si(〇R3)p (X1)31(式中R1係表示氫原子或碳數Η之烷基,D係單鍵 結或可具有取代基的碳數卜20之2價有機基。^係表示碳 數卜6之烷基,Γ係表示鹵素原子,p係表示的整數) 表,之矽烷化合物(1)之至少一種;及式(2):R2si(〇R4)q (X )3-q(式中R係表示碳數卜2〇之烷基或可具有取代基的 本基,R係表示碳數i〜6的烷基,χ2係表示鹵素原子,口 係表示0 3的整數)所示所示的石夕院化合物(?)之至少一種 的夕院化合物的混合物而得之重量平均分子量為 1,〇〇〇~3〇,000之矽烷化合物隨機共聚物(以下,有稱為「矽 烷化。物隨機共聚物(Α’)」之情形。),矽烷化合物隨機共 聚物(Α),以矽烷化合物隨機共聚物(Α,)為佳。 [矽烷化合物(1)] 矽烷化合物(1),係以式(1):Rl_CH(CN) D_Si(〇R3)p (X )3p表示之化合物。藉由使用石夕院化合物(1),可得於硬 化之後具有透明性、接著力良好的矽烷化合物隨機共聚物。 式(1)之中,R1係表示氫原子或碳數卜6的烷基,以氫 原子為佳。具體例,可舉作為矽烷化合物隨機共聚物 之R所例示者。 式(1)之中’ D係表示單鍵結或可具有取代基的碳數 1 20之2價有機基。該2價有機基的具體例,可舉作為矽 烷化合物隨機共聚物(4)之D所例示者。 R係表不曱基、乙基、正丙基、異丙基、正丁基、第 13 201237103 二丁基、異丁基、第三丁基、正戊基、正己基等的碳數1〜6 之院基。 X1係表示氟原子、氣原子、溴原子等的_素原子。 P係表示0-3之整數。 P為2以上時’ 〇R3可為相互相同或不同者。此外(3-p) 為2以上時,X1可為相互相同或不同者。 矽烷化合物(1)的具體例,可舉氰基甲基三甲氧基矽 烷、氰基甲基三乙氧基矽烷、1-氰基乙基三甲氧基矽烷、 2-氰基乙基三丁氧基矽烷、2-氰基乙基三乙氧基矽烷、2-氰基乙基三丙氧基矽烷、3-氰基丙基三甲氧基矽烷、3-氰 基丙基三乙氧基矽烷、3-氰基丙基三丙氧基矽烷、3-氰基 丙基三丁氧基矽烷、4-氰基丁基三甲氧基矽烷、5-氰基戊 基三甲氧矽烷、2-氰基丙基三曱氧基矽烷、2-(氰基曱氧基) 乙基三曱氧基矽烷、2-(2-氰基乙氧基)乙基三曱氧基矽 院、鄰(氰基曱基)笨基三丙氧基矽烷 '間(氰基甲基)苯基 三甲氧基矽烷、對(氰基曱基)苯基三乙氧基矽烷、對气2_ 氰基乙基)苯基三曱氧基矽烷等三烷氧基矽烷化合物類; 氰基曱基三氯矽烷、氰基甲基溴二甲氧基矽烷、2-氰 基乙基二氣甲氧基矽烷、2-氰基乙基二氣乙氧基矽烷' 3_ 氰基丙基三氯矽烷、3-氰基丙基三溴矽烷、3-氰基丙基二 氣甲氧基矽烷、3-氰基丙基二氣乙氧基矽烷、3-氰基丙基 氣二甲氧基矽烷、3-氰基丙基氣二乙氧基矽烷、4-氰基丁 基氣二乙氧基矽烷、3-氰基正丁基氯二乙氧基矽烷、2-(2-氰基乙氧基)乙基三氣矽烷、2-(2-氰基乙氧基)乙基溴二乙 14 201237103 氧基矽烧、2-(2-氰基乙氧基)乙基二氯 土 虱丙虱基矽烷、鄰(2- 氰基乙基)苯基三氯矽烷、間(2_氰基乙基)苯基甲氧基二演 矽烷、對(2-氰基乙基)苯基二甲氧基氯矽烷 對(2 -氰基乙 類等》 ’或組合二種以上使 基)苯基三溴矽烷等的齒素矽烷化合物 該等矽烷化合物(1)可以一種單獨 用。 該等之中,我化合物⑴,由可得具有更優良的接著 性之硬化物’以三烧氧基石夕烧化合物類為佳,以具有2_氰 基乙基之二烷氧基矽烷化合物類、或具有3_氰基丙基之三 院氧基碎炫化合物類更佳。 [矽烷化合物(2)] 矽烷化合物(2),係以式(2):R2Si(〇R4)q(x2)3q表示之 化合物。 式(2)之中,R係表示碳數1〜2〇之烧基或可具有取代 基的苯基。具體例’可舉作為矽烷化合物隨機共聚物(a) 之R2例示者。 R4係表示與上述R3同樣的碳數卜6的烷基。 X2係表示與上述Xi同樣的鹵素原子。 q係表示0〜3的整數。 q為2以上時,OR4可為相互相同或不同者。此外,(3_q) 為2以上時,X2可為相互相同或不同者。 石夕院化合物(2 )的具體例,可舉曱基三甲氧基矽烷、甲 基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、 正丙基三甲氧基矽烷、正丁基三乙氧基矽烷、異丁基三甲 15 201237103 氧基矽烧、正戊基三乙氧基矽烷、正己基三曱氧基矽烷、 異辛基三乙氧基矽烷、十二烷基三曱氧基矽烷、甲基二甲 氧基乙氧基矽烷、甲基二乙基甲氧基矽烷等的烷基三烷氣 基石夕院化合物類; 甲基氣二甲氧基矽烷、甲基二氣曱氧基矽烷、甲基二 氣曱氧基矽烷、曱基氯二乙氧基矽烷、乙基氯二甲氧基矽 院、乙基二氣曱氧基矽烷、正丙基氣二曱氧基矽烷、正丙 基二氣甲氧基矽烷等的烷基鹵化烷氧基矽烷化合物類; 甲基三氣矽烷、甲基三溴矽烷、乙基三氣矽烷、乙基 三溴矽烷、正丙基三氣矽烷等的烷基三函化矽烷化合物類; 苯基三甲氧基矽烷、4-曱氧基苯基三甲氧基矽烷、2-氣苯基三曱氧基矽烷、苯基三乙氧基矽烷、2 -曱氧基苯基 三乙氧基矽烷、苯基二甲氧基乙氧基矽烷、苯基二乙氧機 曱氧基矽烷等的可具有取代基之笨基三烷氧基矽烷化合物 類; 苯基氣二甲氧基矽烷、苯基二氣甲氧基矽烷、苯基氣 甲氧基乙氧基石夕院、苯基氯二乙氧基石夕院、苯基二氣乙氧 基石夕烧4的可具有取代基之苯基函化院氧基;g夕烧化合物 類; 苯基三氣矽烷、笨基三溴矽烷、4-甲氧基苯基三氣石夕 烷、苯基三氣矽烷、2-乙氧基笨基三氣矽烷、2 -氣苯基三 氣矽烷等可具有取代基之苯基三!|化矽烷化合物。 該等矽烷化合物(2)可以一種單獨,或組合兩種以上使 用。 16 201237103 [矽烷化合物之混合物] 用於製造矽烷化合物隨機共聚合物(A’ )時之矽燒化 合物之混合物’可為矽烷化合物(1)及矽烷化合物(2)所矣且 成之混合物,亦可在不阻礙本發明之目的的範圍進一步包 含其他的矽烷化合物之混合物,惟以矽烷化合物(1)及石夕境 化合物(2)所組成之混合物為佳。 矽烷化合物(1)與矽烷化合物(2)之使用比例,以莫耳 比,以[矽烷化合物(1)]:[矽烷化合物(2)] =5:95-50:50 為佳’以10 : 90〜40 : 60更佳。 使上述矽烷化合物的混合物縮合的方法,並無特別限 制,可舉將碎烧化合物(1 )、石夕院化合物(2 )、及根據所期 望之其他的石夕烧化合物溶解於溶劑,添加既定量的觸媒, 以既定溫度攪拌的方法。 使用的觸媒,以酸觸媒及鹼觸媒均可。 酸觸媒,可舉鹽酸、硫酸、硝酸、磷酸等的無機酸; 甲磺酸、三氟甲磺酸、苯磺酸、對甲苯磺酸、醋酸、三氟 醋酸荨的有機酸。 驗觸媒’可舉三甲胺、三乙胺、二異丙基胺基鋰、雙(三 甲基矽基)胺基鋰、吡啶、L 8_二氮雙環[5· 4· 〇]_7_十一碳 烯、笨胺、甲基吡啶、1,4-二氮雙環[2· 2. 2]辛烷、咪唑等 的有機鹼,氫氧化四甲基銨、氫氧化四乙基銨等的有機鹼 氫氧化合物;曱醇鈉 '乙醇鈉、第三丁醇納、第三丁醇鉀 等的金屬烷氧化物;氫化鈉、氫化鈣等的金屬氫化物;氫 氧化鈉、氫氧化鉀、氫氧化鈣等的金屬氫氧化合物;碳酸 201237103 鈉、碳酸鉀、碳酸鎂等的金屬碳酸鹽;碳酸氫鈉、碳酸氫 鉀等的金屬碳酸氫鹽等。 觸媒的使用量,對矽烷化合物合計1莫耳,通常為〇. i 質量部以上10質量部以下,以0 · 5質量部分以上5質量部 以下為佳。 使用之溶解’可按照矽烷化合物的種類,適宜選擇。 例如水,笨、曱笨、二曱笨等芳香烴類;醋酸曱酯、醋酸 乙酯、醋酸丙酯、丙酸甲酯等的酯類;丙酮、曱乙酮、曱 基異丁酮、甲基環己酮等的酮類;曱醇、乙醇、正丙醇、 異丙醇、正丁醇、異丁醇、第二丁醇、第三丁醇等的醇類 4。該專浴劑可以一種單獨,或組合二種以上使用。 浴劑的使用量,溶劑每1公升,矽烷化合物的總莫耳 量,通常為0. ImoWOmol,以〇. 5m〇1〜10m〇1的量為佳。 使矽烷化合物縮合(反應)時的溫度,通常係由〇至 所使用的溶解的沸點的溫度範圍,以2〇t: ~1〇〇它的範圍為 佳。反應溫度過低,貝1有縮合反應的進行並不充分的情形, 另方面,反應溫度過馬,則難以抑制凝膠化。反應,通 吊以3 0分鐘至2 0小時結束。 反應結束後,使用酸觸媒時,藉由對反應溶液添加碳 酸氫鈉等的驗性水溶液’使用驗觸媒時,#由對反應溶液 添加鹽酸等的酸進行中#,將此時所產生的鹽藉由過滤或 水洗等去除,可得目的之矽烷化合物隨機共聚物。 (β)具有反應性環醚構造之矽烷偶合劑 本發明之硬化性組成物’作為⑻成分,包含具有反應 18 201237103 性5哀驗構造之矽烷偶合劑有反應性環醚機造的矽烷偶合劑 (以下,有稱為 矽烷偶合劑(B)」之情形。)。 本發明的硬化性組成物’由於包含石夕炫偶合劑(B ),可 得不會相分離(白濁),具有透明性優良,接著力很高的硬 化物。 在於碎燒偶合劑(B)之反應性環醚構造,係具有反應性 環醚基的構造。反應性環醚基,可舉例如,環氧基;3, 4-裱氧$衣己基等的環己烯氧化物基;氧雜環丁烷基;四氫呋 喃基,四氫吡喃基等。該等之中,環氧基、環己烯氧化物 基、氧雜% 丁烷基為佳,以環己烯氧化物基更佳,以3, 4_ 兔氧基環己基特別為佳。 反應性環醚構造之具體例,可舉以下述(E丨)〜(£3)所示 之基:Ch2 (CH2)2 CH, CH II CH Among these, D is a hardened material having a high adhesion, an alkylene group having 1 to 10 carbon atoms, and an alkylene group having a carbon number of 6 More, the alkylene group of the number 3 is particularly preferred. In the formula (i) (iii), 'R is a phenyl group having 1 to 2 carbon atoms or a phenyl group which may have a substituent. The alkyl group having 1 to 20 carbon atoms represented by R2 may, for example, be an alkyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, a second butyl group, an isobutyl group, a t-butyl-n-pentyl group or a hexyl group. Base, n-octyl, isooctyl, n-decyl, n-decyl, twelfthylene, and the like. The substituent of the phenyl group which may have a substituent represented by R2 may, for example, be a methyl group, a propyl group, a n-propyl group, an isopropyl group, a n-butyl group, a second butyl group, an isobutyl group, a butyl group or a n-pentyl group. 11 201237103 group of n-hexyl group, n-heptyl group, n-octyl group, isooctyl group, etc., an alkoxy group such as a methoxy group or an ethoxy group; a halogen atom such as a gas atom or a gas atom; Specific examples of the phenyl group which may have a substituent represented by R2 include a phenyl group, a 2-gas group, a 4-methylphenyl group, a 3-ethylphenyl group, a 2,4-dimethylphenyl group, and 2 - methoxyphenyl and the like. In the random copolymer of decane compound (A), the molar amount of the group represented by the formula: t - ciKCN)-!)- ([t-CHCCfO-D]) and the molar amount of R2 ([f]) 'With [R^CHCC^-D)] : [R2] = 5:95~50:50 is better, preferably 10:90~40:60. In this range, the obtained cured product is excellent in transparency and adhesion, and the heat resistance is excellent, and even if it is placed at a high temperature, the deterioration of the properties can be suppressed. The amount represented by the formula: t-CIKCiO-D- and the amount of R2 can be quantified by, for example, NMR spectroscopy using a random copolymer of decane compound (A). The weight average molecular weight (Mw) of the random copolymer (A) of the Shi Xiyuan compound is 1, 〇〇〇 30, and the range 〇〇〇 is preferably 500 Å, and the range of 〇〇〇 is preferable. In this range, the workability of the composition is excellent, and a cured product excellent in heat resistance can be obtained. The weight average molecular weight () can be determined, for example, by gel permeation chromatography (GPC) using tetrahydrogen flu (THF) as a solvent in a standard polystyrene conversion value. . The molecular weight distribution (Mw/Mn) of the decane compound random copolymer (A) is not particularly limited, and is usually 1.0 to 3.0, preferably in the range of 1. By this range, a cured product excellent in adhesion and heat resistance can be obtained. The decane compound random copolymer (A) may be used alone or in combination of two or more. 12 201237103 In the curable composition of the present invention, the above-mentioned (A) component decane compound random copolymer u) is condensed (A,) formula (1): Rl_CH(CN)_D_si(〇R3)p (X1)31 (wherein R1 represents a hydrogen atom or an alkyl group having a carbon number of ,, and D is a single bond or a carbon number of 20 which may have a substituent; 20 is an alkyl group having a carbon number of 6; a halogen atom, an integer represented by p), at least one of the decane compound (1); and a formula (2): R2si(〇R4)q(X)3-q (wherein R represents a carbon number 2 The base of the alkyl group or the group which may have a substituent, R represents an alkyl group having a carbon number of i to 6, and the oxime 2 represents a halogen atom, and the mouth system represents an integer of 0 3 ) a mixture of a compound of at least one kind of Xiyuan compound having a weight average molecular weight of 1, 〇〇〇~3〇,000 of a decane compound random copolymer (hereinafter, referred to as "decaneated. Random copolymer (Α' In the case of .), a random copolymer of decane compound (Α), preferably a random copolymer of decane compound (Α,). [decane compound (1)] The decane compound (1) is a compound represented by the formula (1): R1_CH(CN) D_Si(〇R3)p(X)3p. By using the Shi Xi Yuan compound (1), a random copolymer of a decane compound having transparency and good adhesion after hardening can be obtained. In the formula (1), R1 represents a hydrogen atom or an alkyl group having a carbon number of 6, and a hydrogen atom is preferred. Specific examples are exemplified as R of a random copolymer of a decane compound. In the formula (1), 'D' represents a single bond or a hexavalent organic group having 1 to 20 carbon atoms which may have a substituent. Specific examples of the divalent organic group are exemplified as D of the random copolymer of silane compound (4). R is a carbon number of 1 to 2, ethyl, n-propyl, isopropyl, n-butyl, 13 201237103 dibutyl, isobutyl, tert-butyl, n-pentyl, n-hexyl, etc. 6 yard base. X1 represents a γ atom such as a fluorine atom, a gas atom or a bromine atom. P represents an integer of 0-3. When P is 2 or more, 〇R3 may be the same or different from each other. Further, when (3-p) is 2 or more, X1 may be the same or different from each other. Specific examples of the decane compound (1) include cyanomethyltrimethoxydecane, cyanomethyltriethoxydecane, 1-cyanoethyltrimethoxydecane, and 2-cyanoethyltributoxide. Baseline, 2-cyanoethyltriethoxydecane, 2-cyanoethyltripropoxydecane, 3-cyanopropyltrimethoxydecane, 3-cyanopropyltriethoxydecane, 3-cyanopropyltripropoxydecane, 3-cyanopropyltributoxydecane, 4-cyanobutyltrimethoxydecane, 5-cyanopentyltrimethoxydecane, 2-cyanopropyl Tris-methoxydecane, 2-(cyanomethoxy)ethyltrimethoxy decane, 2-(2-cyanoethoxy)ethyltrimethoxy oxime, o-(cyanoguanidino Stupyl tripropoxydecane 'm-(cyanomethyl)phenyl trimethoxy decane, p-(cyanoindolyl)phenyl triethoxy decane, p- 2 - cyanoethyl) phenyl triterpene a trialkoxy decane compound such as oxydecane; cyanodecyltrichlorodecane, cyanomethylbromodimethoxydecane, 2-cyanoethyldimethoxymethoxynonane, 2-cyanoethyl Dioxoethoxy decane ' 3 cyanopropyl trichloro decane, 3-cyano Propyltribromodecane, 3-cyanopropyldimethoxymethoxynonane, 3-cyanopropyldimethoxyethoxydecane, 3-cyanopropyldimethoxydecane, 3-cyanopropane Base gas diethoxy decane, 4-cyanobutyl gas diethoxy decane, 3-cyano-n-butyl chloride diethoxy decane, 2-(2-cyanoethoxy)ethyl three gas Decane, 2-(2-cyanoethoxy)ethylbromidediyl 14 201237103 Oxygen oxime, 2-(2-cyanoethoxy)ethyldichloromethane fluorenyl decane, o- (2 - cyanoethyl)phenyltrichloromethane, m-(2-cyanoethyl)phenylmethoxydihydrononane, p-(2-cyanoethyl)phenyldimethoxychlorodecane pair (2 A dentate decane compound such as cyanoethane or the like, or a combination of two or more kinds of phenyl tribromodecane, and the like. The decane compound (1) may be used alone. Among these, my compound (1), which is obtained from a hardened material having a more excellent adhesion, is preferably a tri-oxo-oxygen compound, and a dialkoxy decane compound having a 2-cyanoethyl group. Or a compound having a 3-cyanopropyl group of three compounds is more preferred. [decane compound (2)] The decane compound (2) is a compound represented by the formula (2): R2Si(〇R4)q(x2)3q. In the formula (2), R is a phenyl group having 1 to 2 carbon atoms or a phenyl group which may have a substituent. Specific examples are exemplified as R2 of the decane compound random copolymer (a). R4 represents an alkyl group having the same carbon number as the above R3. X2 represents the same halogen atom as the above Xi. The q system represents an integer of 0 to 3. When q is 2 or more, OR4 may be the same or different from each other. Further, when (3_q) is 2 or more, X2 may be the same or different from each other. Specific examples of the compound (2) of the Shi Xiyuan compound include mercaptotrimethoxydecane, methyltriethoxydecane, ethyltrimethoxydecane, ethyltriethoxydecane, n-propyltrimethoxydecane. , n-butyltriethoxydecane, isobutyltrimethyl 15 201237103 oxysulfonium, n-pentyltriethoxydecane, n-hexyltrimethoxy decane, isooctyltriethoxydecane, dodecane Alkylene trialkyl gas based on tris-methoxydecane, methyl dimethoxyethoxy decane, methyl diethyl methoxy decane, etc.; methyl dimethyl dimethoxy decane, Dioxaterpene, methyl dioxodecane, mercaptochlorodiethoxydecane, ethyl chlorodimethoxy oxime, ethyl dioxomethoxy decane, n-propyl hexane An alkyl halogenated alkoxy decane compound such as decyloxydecane or n-propyldimethoxymethoxydecane; methyl trioxane, methyltribromodecane, ethyl trioxane, ethyltribromodecane, Alkyltrifunctional decane compounds such as n-propyl trioxane; phenyltrimethoxydecane, 4-decyloxyphenyltrimethoxy矽, 2-phenylphenyl trimethoxy decane, phenyl triethoxy decane, 2- methoxy phenyl triethoxy decane, phenyl dimethoxy ethoxy decane, phenyl diethoxy a stupidyl trialkoxy decane compound which may have a substituent such as a methoxy oxane or the like; a phenyl dimethoxy decane, a phenyl dimethoxy methoxy decane, a phenyl methoxy ethoxy oxime a phenyl group which can have a substituent, a phenyl sulfonate compound, a phenyl trioxane, a phenyl trioxane, a phenyl trioxane a phenyl group which may have a substituent such as tribromodecan, 4-methoxyphenyl triazepine, phenyl trioxane, 2-ethoxyphenyl trioxane, 2-p-phenyltrioxane or the like three! | Hydrazine compounds. These decane compounds (2) may be used singly or in combination of two or more. 16 201237103 [Mixed mixture of decane compounds] The mixture of the smoldering compound used in the manufacture of the decane compound random copolymer (A') can be a mixture of the decane compound (1) and the decane compound (2). Further, a mixture of other decane compounds may be further included in the range which does not hinder the object of the present invention, but a mixture of the decane compound (1) and the cerium compound (2) is preferred. The ratio of the decane compound (1) to the decane compound (2) is preferably in the molar ratio of [decane compound (1)]: [decane compound (2)] = 5: 95-50:50 by 10: 90~40: 60 is better. The method of condensing the mixture of the above decane compounds is not particularly limited, and the pulverized compound (1), the ishixiyuan compound (2), and other desired ceramsite compounds are dissolved in a solvent, and the method is added. Amount of catalyst, a method of stirring at a given temperature. The catalyst used may be either an acid catalyst or an alkali catalyst. The acid catalyst may, for example, be an inorganic acid such as hydrochloric acid, sulfuric acid, nitric acid or phosphoric acid; or an organic acid of methanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, acetic acid or cesium trifluoroacetate. The catalyst can be exemplified by trimethylamine, triethylamine, lithium diisopropylamide, lithium bis(trimethylsulfonyl)amine, pyridine, L 8_diazabicyclo[5·4· 〇]_7_ An organic base such as undecene, strepamine, picoline, 1,4-diazabicyclo[2.2.2]octane or imidazole, tetramethylammonium hydroxide or tetraethylammonium hydroxide Organic alkali hydroxide; sodium alkoxide sodium ethoxide, metal alkoxide such as sodium butoxide, potassium butoxide; metal hydride such as sodium hydride or calcium hydride; sodium hydroxide, potassium hydroxide, A metal hydroxide such as calcium hydroxide; a metal carbonate such as sodium carbonate, 201237103, potassium carbonate or magnesium carbonate; or a metal hydrogencarbonate such as sodium hydrogencarbonate or potassium hydrogencarbonate. The amount of the catalyst used is 1 mole in total of the decane compound, and is usually 〇. i. The mass portion or more is 10 parts by mass or less, and preferably 0.5 parts by mass or more and 5 parts by mass or less. The dissolution used may be appropriately selected depending on the kind of the decane compound. For example, water, stupid, stupid, dioxane and other aromatic hydrocarbons; esters of decyl acetate, ethyl acetate, propyl acetate, methyl propionate, etc.; acetone, acetophenone, decyl isobutyl ketone, A A ketone such as cyclohexanone; an alcohol 4 such as decyl alcohol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, second butanol or third butanol. The bath may be used singly or in combination of two or more. The amount of the bathing agent, the total molar amount of the decane compound per 1 liter of the solvent, is usually 0. ImoWOmol, preferably in an amount of 5 m〇1 to 10 m〇1. The temperature at which the decane compound is condensed (reacted) is usually in the range of from 〇 to the boiling point of the dissolved boiling point used, and it is preferably in the range of 2 〇 t: ~1 。. When the reaction temperature is too low, the progress of the condensation reaction in the shell 1 is insufficient, and on the other hand, when the reaction temperature is over-the-counter, it is difficult to suppress gelation. The reaction is terminated by a lapse of 30 minutes to 20 hours. When an acid catalyst is used, when an inert aqueous solution such as sodium hydrogencarbonate is added to the reaction solution, when the catalyst is used, # is added to the reaction solution by adding an acid such as hydrochloric acid to the reaction solution. The salt is removed by filtration or water washing to obtain a random copolymer of the desired decane compound. (β) a decane coupling agent having a reactive cyclic ether structure. The curable composition of the present invention as the component (8), and a decane coupling agent having a reactive cyclic ether machine having a decane coupling agent having a reaction structure of 18 201237103 (Hereinafter, there is a case called decane coupling agent (B)".). Since the curable composition of the present invention contains the Shi Xi Xuan coupling agent (B), it can be obtained without phase separation (white turbidity), and has excellent transparency and high adhesion. The structure of the reactive cyclic ether of the breaker coupling agent (B) is a structure having a reactive cyclic ether group. The reactive cyclic ether group may, for example, be an epoxy group; a cyclohexene oxide group such as a cyclopentadienyl group; an oxetanyl group; a tetrahydrofuranyl group; a tetrahydropyranyl group; Among these, an epoxy group, a cyclohexene oxide group, an oxa% butane group is preferred, a cyclohexene oxide group is more preferred, and a 3,4_ rabbitoxycyclohexyl group is particularly preferred. Specific examples of the structure of the reactive cyclic ether include the groups shown by the following (E丨) to (£3):

h係2〜8之整數之基特別佳。The base of the h series 2 to 8 is particularly preferred.

19 201237103 佳,具體而言,可舉下式(3)所示的化合物。 dSi—(〇Rb)k (a) 式(a)之中,E係表示反應性環醚構造,Ra係表示碳數1~6 的烷基或可具有取代基的笨基,Rb係表示碳數1〜6的烷基, i係表示1 3的整數,j係表示〇〜2整數,k係表示1〜3的 整數,i + j +k = 4。 式(a)之中' Γ、Rb係表示碳數ι〜6的烷基,上述Rl 係表不碳數1~6的烷基,可舉於先前例示者同樣的基,以 上述R表不之可具有取代基之苯基,可舉於先前例示作為 上述R2所示之可具有取代基之笨基同樣的基。 以上述式(a)表示的矽烷偶合劑(B)之具體例,可舉 2-(3’4-環氧基環己基)乙基三曱氧基矽烷、2_(34_環氧基 環己基)乙基三乙氧基矽烷等的環己烯氧化物基的矽烷偶 合劑; 3-縮水甘油醚丙基三甲氧基矽烷、3_縮水甘油醚丙基 三乙氧基矽烷、3-縮水甘油醚丙基甲基二甲氧基矽烷、3_ 縮水甘油醚丙基甲基二乙氧矽烷等的縮水甘油醚基的矽烷 偶合劑; (氧雜環丁烷-3-基)甲基三甲氧基矽烷、(氧雜環丁烷 一3-基)甲基三乙氧基矽烷、(氧雜環丁烷_3_基)甲基甲基一 甲氧基矽烷、(氧雜環丁烷—3-基)甲基甲基二乙氧基矽烷 (氧雜環丁烷-3-基)甲基乙基二甲氧基矽烷、(氧雜環丁烷 -3-基)甲基乙基二乙氧基矽烷、(氧雜環丁烷—弘基) = 20 201237103 基二甲氧基矽烷、(氧雜環丁烷_3_基)曱基苯基二乙氧基矽 烷、2-(氧雜環丁烷基)乙基三曱氧基矽烷、2_(氧雜環 丁烷-3-基)乙基三乙氧基矽烷等的氧雜環丁烷基的矽烷偶 合劑等。 該專之中 硬化物之觀點 由可得取得容易性及具有很高的接著力之 以下式(b)所示之化合物為佳。19 201237103 Preferably, the compound represented by the formula (3) is exemplified. dSi—(〇Rb)k (a) In the formula (a), E represents a reactive cyclic ether structure, and Ra represents an alkyl group having 1 to 6 carbon atoms or a stupid group which may have a substituent, and Rb represents a carbon. The alkyl group has a number of 1 to 6, i represents an integer of 1 3, j represents an integer of 〇 2, and k represents an integer of 1 to 3, and i + j + k = 4. In the formula (a), Γ and Rb represent an alkyl group having a carbon number of 1-6, and the above R1 is an alkyl group having 1 to 6 carbon atoms, and is represented by the same group as exemplified above, and is represented by the above R. The phenyl group which may have a substituent may, for example, be exemplified as the same group as the stupid group which may have a substituent represented by the above R2. Specific examples of the decane coupling agent (B) represented by the above formula (a) include 2-(3'4-epoxycyclohexyl)ethyltrimethoxy decane and 2-(34-epoxycyclohexyl). a cyclohexene oxide-based decane coupling agent such as ethyl triethoxy decane; 3-glycidyl ether propyl trimethoxy decane, 3-glycidyl ether propyl triethoxy decane, 3-glycidol a glycidyl ether-based decane coupling agent such as ether propyl methyl dimethoxy decane or 3 _ glycidyl ether propyl methyl ethoxy oxane; (oxetane-3-yl)methyltrimethoxy Decane, (oxetane-3-yl)methyltriethoxydecane, (oxetane-3-yl)methylmethyl-methoxydecane, (oxetane-3 -yl)methylmethyldiethoxydecane (oxetan-3-yl)methylethyldimethoxydecane, (oxetan-3-yl)methylethyldiethyl Oxydecane, (oxetane-yungyl) = 20 201237103-based dimethoxydecane, (oxetane-3-yl)nonylphenyldiethoxydecane, 2-(oxo-heterocycle) Butyryl)ethyltrimethoxy decane, 2_(oxa 3-yl) ethyl triethoxy silane-oxetanyl like a silane-coupling agent and the like. The viewpoint of the hardened material is preferably a compound represented by the following formula (b) which is easy to obtain and has a high adhesion.

(CH 丨3) E2-+-S1- (〇Rb)k 〇,) 式(b)之中’ E2、Rb、i、j、k係表示與上述相同的意 思。Rb’以甲基、乙基、丙基、曱氧基甲基等的可具有取 代基之碳數1~6的烷基為佳。 以式(b)表不之矽烷偶合劑之具體例,可舉2_(3, 4-環 氧基裱己基)乙基三曱氧基矽烷' 2-(3,4-環氧環己基)乙基 三曱氧基矽烷等。 矽烷偶合劑(B)可以一種單獨,或組合二種以上使用。 本發明之硬化性組成物,將上述(A)及(B)成分,以(a) 與(B)的質量比’以(a):(b) = 95:5〜之比例含有。 藉由如此之比例使用(A)及(B)成分,可得透明性、接 著性優良、並且耐熱性優良,即使在高溫接著力亦不容易 下降的硬化物之硬化性組成物。由該觀點,以(A): (B) = 95 : 5〜85 :15之比例為佳,以92: 8〜87:13之比例特別佳。 本發明之硬化性組成物’加上(A)及(B)成分,包含(c) 金屬原子為紹、锆或鈦之金屬錯合物(以下,有稱為「金屬 21 201237103 錯合物(c)之情形」。)為佳。藉由使用金屬錯合物(c)可促 進硬化反應,可得接著力更高的硬化物。 金屬原子為鋁的金屬錯合物(c),可舉二異丙氧基鋁乙 醯乙酸單油基s旨、#異丙氧基紅酿乙酸二油基自旨、單異 :氧基鋁單油酸酯乙醯乙酸乙酯、二異丙氧基鋁乙醯乙酸 單月桂醋、二異丙氧基鋁乙醯乙酸單硬脂酯、二異丙氧基 铭乙醯乙酸單異硬脂§旨、單異丙氧基料U桂酿1 — 丙胺酸醋乙醯乙酸單月桂醋、三乙醯丙酸紹等的紹的乙酿 乙酸錯合物;單乙醯丙酸紹二(異丁基乙酿乙酸)整合物、 單乙醯丙酸紹二(2_乙基己基乙酿乙酸)螯合物、單乙醯丙 酸铭二(十二基乙醯乙酸)螯合物、單乙酿丙酸紹二(油基乙 醯乙酸)螯合物等的鋁的乙醯丙酸錯合物等。 金屬原子為錯的金屬錯合物(c),可舉第二丁基錯、_ ★乙氧基第三丁基錯等的鍅的酿化錯合物、乙醯二: 專的錯的乙酿丙_酸錯合物;四異丙氧基鉛等的錯的 基金屬錯合物等β 可舉四異丙氧基鈦、 三乙醇胺二丙酸鈦, 欽酸四辛二醇酯、銀 醇S旨錯合物。 金屬原子作鈦的金屬錯合物(c), 四正丁氧基鈦、四2-乙基己氧基鈦、 乳酸鈦的銨鹽等的鈦的醯化錯合物; 酸二辛氧基雙(辛二醇酯)等的鈦的二 金屬錯合物(C),可以一種單獨,或組合兩種以上估 用。使用金屬錯合物⑹時,其含量係對⑴成分或 :二質量部,以。質量部以上10質量部以下為佳,以。 質量。卩分已上5質量部以下更佳。 22 201237103 本發明的硬化性組成物’加上(A)及(b)成分,包含(D) 具有羧基的脂環酸酐(以下,有稱為「脂環酸酐(D)」之情 形。)為佳。藉由使用脂環酸酐(D ),可得接著力更高的硬 化物。 脂環酸酐(D ),係至少一個羧基取代的脂環酸酐。 脂環酸酐的具體例,可舉3-甲基-1,2, 3, 6-四氫鄰笨 一曱酸針、4_甲基1,2,3,6-四鼠鄰苯二甲酸肝、四氫鄰笨 -一甲酸肝、3_曱基-六風鄰本·一甲酸軒、4-曱基-六氫鄰笨 二甲酸酐、六氫鄰苯二甲酸酐、曱基降冰片烯二酸軒、5_ 降冰片稀-2, 3 -二叛酸酐、降获烧-2,3 -二缓酸酐、甲基_5_ 降冰片稀-2, 3 -二敌酸針、甲基-降获烧-2,3 -二缓酸酐等。 羧基,可取代脂環酸酐的脂環構造的任意位置,取代 位及取代的羧基數並無特別限定。 脂環酸酐(D) ’以對六氫鄰苯二曱酸酐取代緩基之環己 烷-1,2,4-三羧酸-1,2-酐、環己烷-1,2,3-三羧酸-i,2-軒 為佳,以環己烷-1,2, 4-三羧酸-1,2-酐特別為佳。該化合 物,雖有立體異構體的存在,但以任一異性體均可。 脂環酸酐(D),可以一種單獨’或組合二種以上使用。 使用脂環酸酐(D)時,其含量對(A)成分或(A’)成分質 量部,以0質量部以上10質量部以下為佳,以〇質量部以 上5質量部以下為佳。 本發明的硬化性組成物,只要在不阻礙本發明之目的 範圍,上述成分亦可進一步含有別的成分。 別的成分,可舉上述(B)以外的矽烷偶合劑、氧化防止 23 201237103 劑、紫外線吸收劑、光安定劑、稀釋劑等。 上述(B)以外的矽烷偶合劑,係矽烷偶合劑(β)之外的 石夕烧偶合劑,只要不阻礙本發明之目㈣,並無特別限制。 其中,由可得接著力更高的硬化物的觀點,使用具有酸針 構造之矽烷偶合劑為佳。 矽烷偶合劑之具體例,可舉2_三乙氧基矽基琥拍酸 酐、3-三乙基矽基琥珀酸酐。 酸針構造的石夕院偶合劑,可以一種單獨或組合二種以 上使用。 使用具有酸酐構造的矽烷偶合劑時,其使用量對(α) 成分或(A,)成分100質量部,通常為質量部以上 質量邛以下’卩〇. 5質量部以上! 5質量部以下為佳。 上述氧化防止劑,係為防止加熱時之氧化惡化而添 加。氧化防止劑,可舉磷系氧化防止劑、酚系氧化防止劑、 硫糸氧化防止劑等。 磷系氧化防止劑,可舉磷酸酯類、氧雜磷雜菲氧化物 類等。 可舉單酚、雙酚、高分子型酚等。 ,可舉二月桂基-3, 3’ -硫代二丙酸 -硫代二丙酸酯、二硬脂基-3,3’ -硫 紛系氧化防止劑 硫系氧化防止劑 酯、二肉豆蔻基3, 3, 代二丙酸酯等。 該等氧化防止劑可以一種單獨,或組合二種以上使 用。氧化防止劑的使用量,對(A)成分或(A,)成分1〇〇質量 部,通常為1〇質量部以下。 24 201237103 上述紫外線吸收劑,係以提升硬化物的耐光性的目的 而添力口0 紫外線吸收劑’可舉柳酸類、二苯甲酮類'苯並三唑 類、受阻胺類等。 紫外線吸收劑’可以一種單獨,或組合兩種以上使用。 紫外線吸收劑的使用量,對(A)成分或(A’)成分100質 量部’通常為10質量部以下。 上述光女疋劑,係以提升硬化物的耐光性的目的而添 加。 光安定劑’可舉例如聚四曱基丁基)胺 基-1’3,5-三嗪-2,4-基}{(2,2,6,6-四曱基_4_哌啶)亞胺 基}六亞甲基{(2,2,6,6-四甲基-4-哌啶)亞胺基}]等的受 阻胺類等。 該等光安定劑可以一種單獨,或組合二種以上使用 光安定劑的使用量,對(A)成分或(A,)成分1〇〇質量 通常為10質量部以下。 連稀釋劑,係、為調整硬化性組成物之黏度而添加。 稀釋劑,可舉例如,甘油二縮水甘油喊、丁二醇二縮 :油醚、二縮水甘油基苯胺、新戊基乙二醇縮水甘油醚、 環己院二甲醇縮水甘油醚、亞炫基二縮水甘油St、聚二醇 ^ 丙—醇二縮水甘油醚、三羥甲基丙燒二 縮水甘:醚、甘油三縮水甘油醚、I 2-環氧-4-乙烯基環己 &amp; -乳化環己烯乙烯、二氧化曱基乙烯基環己烯等。 〇等稀釋劑可以—種單獨’或組合兩種以上使用。 25 201237103 本發明之硬化性 成分、及根據所期望 方法混合、脫泡而得 '组成物’可藉由例如,將上述(A)、(B) 之其他成分以既定比例調合,以習知 根據如以上所得之本發明 在高能量的光照射時或高溫狀 性,可長期具有優良的透明性 化物。 之硬化性組成物,可得即使 態,並不會著色或降低透明 ’且具有很高的接著力之硬 因此,本發明之硬化性組成物,可良好地使用於光學 零件或成形體的原料、接著劑、塗層劑。特別[由於可 解決關於隨著光元件的高亮度化,而光元件固定材的惡化 的問題,本發明的硬化性組成物,可良好地使用於作為光 元件固定材用組成物。 2)硬化物 本發明之第2,係硬化本發明之硬化性組成物而成之 硬化物。 硬化本發明之硬化性組成物的方法,可舉加熱硬化。 硬化時的加熱溫度通常為100〜2001:,加熱時間通常為1〇 分鐘至20小時’以分鐘至1 〇小時為佳。 本發明之硬化物,即使以高能量的光照射之情形或在 南/里狀態,並不會著色或降低透明性,可長期具有優良的 透明性’且具有很高的接著力。 因此’本發明的硬化物,由於可解決關於隨著光元件 的高亮度化’而光元件固定材的惡化的問題,本發明的硬 化性組成物,可良好地使用於作為光元件固定材用組成 26 201237103 物。例如,可良好地使用於光學零 著劑、塗層齊卜 件戍成形體的原料、接 硬化本發明之硬化性紐 接“叶 化性、、且成物而成的硬化物具有很高的 力’可藉由例如,以如下測定接 义接者力而確認,即,於 硬日日片的鏡面塗佈硬化性 μ腋拉 ⑨物將塗佈面放置於被著體 上辽接,加熱處理使之硬化。 —、σιίε, 敌置於預先加熱為既 疋/皿度(例如23t、l〇(Tc )接著測試哭沾、日,^ 、— 牧有州式态的測試台上30秒, 由被著體以高5 0 # m的位置,對接荖 耵按者面以水平方法(剪方向) 施加應力,測定試驗片與被著體之接著力。 、硬化物的接著力,在於咖及1〇〇t,以瞻2龍口 以上為佳’ 80N/2mm□以上更佳。 上述硬化物的透明性優良,可藉由測定光穿透率而確 認。硬化物的光穿透率,於波長4〇〇nm的光,以8〇%以上 為佳’以m以上特別為佳,於波長45〇nm的光,以m 以上為佳。 上述硬化物之耐熱性優良,可藉由即使將硬化物放置 於高溫下之後,接著力及透明性的變化小而確認。接著力, 係於100°C放置30秒後,保持在23t的接著力的5〇%以上 接著力為佳,保持65%以上接著力更佳。透明性,係於15〇 °C放置500小時之後,於波長4〇〇nm的穿透率在初期穿透 率的80%以上為佳 3)硬化性組成物的使用方法 本發明之第3係將本發明的硬化性組成物,使用於作 為光元件固定材用接著劑或光元件固定材用封裝劑之方 27 201237103 法0 光凡件,可舉led、LD等的發光元件、光接收元件、 複合光元件、光積體電路等。 〈光元件固定材用接著劑〉 本發明的硬化性組成物,可良好地使用於作為光元件 固定材用接著劑。 將本發明之硬化性組成物使用於作為光元件固定材用 接著劑之方法,可舉將接著對象之材料(光元件及其電路板 等)之一方或雙方的接著面塗佈該組成物、壓接後,加熱使 之硬化’將接著對象之材料相互牢固地接著之方法。 接著光疋件之主要的基板材料,可舉鈉玻璃、耐熱性 硬質玻璃等的玻璃類;陶瓷;鐵、銅、鋁、金、銀、鉑、 絡、欽及該等的金屬合金、不銹鋼(SUS302、SUS304、 SUS304L、SUS309等)等的金屬類;聚對苯二甲酸乙二醇酯、 聚對笨二甲酸丁二醇酯、聚萘二甲酸丁二醇酯、乙烯_醋酸 乙烯酯共聚物、聚笨乙烯、聚碳酸酯、聚曱基戊烯、聚砜、 聚醚醚酮、聚醚砜、聚苯硫醚、聚醚醯亞胺、聚醯亞胺、 聚酿胺、丙烯酸樹脂、降冰片烯系樹脂、環烯烴樹脂、玻 璃環氧樹脂等的合成樹脂等。 加熱硬化時之加熱溫度,雖依所使用的硬化性組成 物’通常為1 〇 〇〜2 0 0。(:,加熱時間通常為1 0分鐘至2 0小 時,以30分鐘至1〇小時為佳。 〈光疋件固定材用封裝劑〉 本發明之硬化性組成物,可良好地使用於作為光元件 28 201237103 封全體的封裝劑。 將本發明之硬化性組成物,使用於作為光元件固定材 用封裝劑之方法,可舉例如,將該組成物成形為所期望的 形狀’得到内包光元件之成形體之後,藉由將其加熱使之 硬化而製造光元件封裝體的方法等。 將本發明的硬化性組成物成形為所期望的形狀的方 法’並無特別限定,可採用通常的轉移成料,或注模法 等習知的鑄造法。 ^加熱硬化時之加熱溫度,雖依使用的硬化性組成物 等,通常為100〜200°c。加熱時間通常為1〇分鐘至2〇小 時’以30分鐘至10小時為佳。 所得之光元件封裝體,由於使用本發明的硬化性組成 物,故即使在光元件,使用白色和藍色發光LED等的發光 的波峰波長在400〜490nm之短波長者’並不會因熱或光而 者色惡化之透明性、耐熱性優良者。 [實施例] 接著,以實施例及比較例更加詳細地說明本發明,惟 本發明並非受限於下述實施例。 (重量平均分子量測定) 於製造例所得之矽烷化合物隨機共聚物的重量平均分 子量(Mw),係以標準聚苯乙稀換算值,以如下裝置及條件 測定。 裝置名:HLC-8220GPC、TOSO公司社製(CH 丨 3) E2-+-S1-(〇Rb)k 〇,) In the formula (b), 'E2, Rb, i, j, and k are the same as the above. Rb' is preferably an alkyl group having 1 to 6 carbon atoms which may have a substituent such as a methyl group, an ethyl group, a propyl group or a decyloxymethyl group. Specific examples of the decane coupling agent represented by the formula (b) include 2-(3,4-epoxyfluorenyl)ethyltrimethoxy decane '2-(3,4-epoxycyclohexyl)B. Base trimethoxy decane and the like. The decane coupling agent (B) may be used alone or in combination of two or more. In the curable composition of the present invention, the components (A) and (B) are contained in a ratio of (a):(b) = 95:5 to a mass ratio of (a) to (B). By using the components (A) and (B) in such a ratio, it is possible to obtain a curable composition of a cured product which is excellent in transparency and adhesion, and which is excellent in heat resistance and which is not easily lowered even at a high temperature. From this point of view, the ratio of (A): (B) = 95: 5 to 85:15 is preferred, and the ratio of 92:8 to 87:13 is particularly good. The curable composition of the present invention 'adds the components (A) and (B), and contains (c) a metal complex of a metal atom of cerium, zirconium or titanium (hereinafter, referred to as "metal 21 201237103 complex ( c) The situation".) is better. By using the metal complex (c), the hardening reaction can be promoted, and a cured product having a higher adhesion can be obtained. The metal complex (a) in which the metal atom is aluminum may be exemplified by diisopropoxy aluminum acetoacetate monooleate s, #isopropoxy red-branched acetic acid dioleyl-based, monoisomeric: oxy aluminum Monooleate ethyl acetate ethyl acetate, diisopropoxy aluminum acetoacetate monolaurin vinegar, diisopropoxy aluminum acetoacetate monostearyl ester, diisopropoxy acetonitrile acetic acid monoisostearyl § Purpose, monoisopropoxy hydride U gu 1 - alanine vinegar acetoacetate monolauric vinegar, triethyl hydrazine propionate and so on, the acetic acid complex; succinic acid sulphate Butyl ethanoacetate) integrator, succinic acid monosuccinate (2-ethylhexyl ethoxyacetic acid) chelate, monoethyl phthalic acid succinyl (dodecyl acetoacetate) chelate, single An aluminum acetopropionic acid complex such as a bismuth (oleylacetic acid) chelate compound. The metal complex (c) in which the metal atom is wrong may be a chitosan complex such as a second butyl group, an ethoxy group, or a third butyl group. Styrene-acid complex; a wrong base metal complex such as tetraisopropoxy lead, etc. β may be titanium tetraisopropoxide, titanium triethanolamine dipropionate, tetraoctyl glycolate, silver Alcohol S is a complex. a metal atom as a metal complex of titanium (c), a titanium hydride complex of tetra-n-butoxytitanium, tetra-ethylhexyloxytitanium or an ammonium salt of titanium lactate; dioctyloxy acid The titanium dimetal complex (C) such as bis(octyl glycol ester) may be used alone or in combination of two or more. When the metal complex (6) is used, the content is in the component (1) or the mass portion. The quality department is more than 10 parts by mass or less. quality. The score is better than 5 quality parts. 22 201237103 The curable composition of the present invention 'adds the components (A) and (b), and contains (D) an alicyclic acid anhydride having a carboxyl group (hereinafter referred to as "alicyclic acid anhydride (D)"). good. By using the alicyclic anhydride (D), a hardener having a higher adhesion can be obtained. The alicyclic anhydride (D) is at least one carboxyl-substituted alicyclic anhydride. Specific examples of the alicyclic acid anhydride include 3-methyl-1,2,3,6-tetrahydron-butyric acid, 4-methyl-1,2,3,6-tetrazolium phthalate liver , tetrahydro-o-st-one-formic acid liver, 3_mercapto-hexazone, benzoic acid, 4-mercapto-hexahydrophthalic anhydride, hexahydrophthalic anhydride, decyl norbornene Diacid Xuan, 5_ norbornazole dilute-2, 3 - di-anhydrous anhydride, reduced calcination-2,3 - bis-alkali anhydride, methyl _5_ norbornene dilute-2, 3-dione acid needle, methyl-lower Obtained -2,3 - bis-anhydride and the like. The carboxyl group may be substituted at any position of the alicyclic structure of the alicyclic acid anhydride, and the substitution position and the number of substituted carboxyl groups are not particularly limited. Alicyclic anhydride (D) 'substituted cyclohexyl-1,2,4-tricarboxylic acid-1,2-anhydride, cyclohexane-1,2,3- substituted with hexahydrophthalic anhydride The tricarboxylic acid-i, 2-oxan is preferred, and cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride is particularly preferred. Although the compound has the existence of a stereoisomer, it may be any anisotropic body. The alicyclic acid anhydride (D) may be used singly or in combination of two or more. When the alicyclic acid anhydride (D) is used, the content of the component (A) or the component (A') is preferably 0 parts by mass or more and 10 parts by mass or less, more preferably 5% by mass or less. The curable composition of the present invention may further contain other components as long as it does not inhibit the object of the present invention. Other components include a decane coupling agent other than the above (B), an oxidation prevention 23 201237103 agent, an ultraviolet absorber, a photostabilizer, a diluent, and the like. The decane coupling agent other than the above (B) is a sulphur coupling agent other than the decane coupling agent (β), and is not particularly limited as long as it does not inhibit the object (4) of the present invention. Among them, a decane coupling agent having an acid needle structure is preferably used from the viewpoint of obtaining a cured product having a higher adhesion. Specific examples of the decane coupling agent include 2-triethoxydecylsuccinic anhydride and 3-triethyldecyl succinic anhydride. The Shixiyuan coupling agent of the acid needle structure may be used alone or in combination of two or more. When a decane coupling agent having an acid anhydride structure is used, the amount of the decane coupling agent used is 100 parts by mass of the (α) component or (A,) component, usually less than or equal to the mass portion 卩〇. 5 mass parts or more! 5 quality parts are better. The above oxidation preventing agent is added to prevent deterioration of oxidation during heating. Examples of the oxidation inhibitor include a phosphorus oxidation inhibitor, a phenol oxidation inhibitor, and a sulfur oxidation inhibitor. Examples of the phosphorus-based oxidation preventing agent include phosphates and oxaphosphorus oxides. A monophenol, a bisphenol, a polymeric phenol, etc. are mentioned. It can be used as a sulphur-based oxidation inhibitor of dilauro-3, 3'-thiodipropionic acid-thiodipropionate, distearyl-3,3'-sulfur-based oxidation inhibitor, and two meats. Myristyl 3, 3, substituted dipropionate and the like. These oxidation inhibitors may be used singly or in combination of two or more. The amount of the oxidation preventing agent to be used is usually 1 part by mass or less per part of the component (A) or the component (A). 24 201237103 The above-mentioned ultraviolet absorber is added to the purpose of improving the light resistance of the cured product. The ultraviolet absorber is an acid absorber, a benzophenone, a benzotriazole or a hindered amine. The ultraviolet absorbers ' may be used singly or in combination of two or more. The amount of the ultraviolet absorber to be used is usually 10 parts by mass or less for the (A) component or the (A') component 100 mass portion. The above-mentioned light female mites are added for the purpose of improving the light resistance of the cured product. The light stabilizer "for example, polytetradecylbutyl)amino-1'3,5-triazine-2,4-yl}{(2,2,6,6-tetradecyl-4-ispiperidine a hindered amine such as an imido}hexamethylene {(2,2,6,6-tetramethyl-4-piperidinyl)imido}}. These photosensitizers may be used singly or in combination of two or more kinds of photosensitizers, and the mass of the component (A) or the component (A) is usually 10 parts by mass or less. The diluent is added to adjust the viscosity of the curable composition. The diluent may, for example, be glycerol diglycidyl shunt, butanediol dimer: oleyl ether, diglycidyl aniline, neopentyl glycol glycidyl ether, cycloheximide dimethanol glycidyl ether, subditch Diglycidyl St, polyglycol ^ propanol diglycidyl ether, trimethylol propyl diglycidyl ether, ether, glycerol triglycidyl ether, I 2-epoxy-4-vinylcyclohexene &amp; Emulsified cyclohexene ethylene, cerium oxide-based vinyl cyclohexene, and the like. The diluent such as hydrazine may be used singly or in combination of two or more. 25 201237103 The curable component of the present invention and the 'composition' obtained by mixing and defoaming according to a desired method can be prepared by, for example, blending the other components of the above (A) and (B) in a predetermined ratio. The present invention obtained as described above can have an excellent transparent compound for a long period of time at the time of high-energy light irradiation or high-temperature property. The curable composition can be obtained in a state where it does not color or reduce transparency and has a high adhesion force. Therefore, the curable composition of the present invention can be favorably used as a raw material for an optical component or a molded body. , adhesive, coating agent. In particular, the curable composition of the present invention can be suitably used as a composition for a fixing member for an optical element because it can solve the problem of deterioration of the fixing member of the optical element with the increase in the brightness of the optical element. 2) Hardened material The second aspect of the present invention is a cured product obtained by curing the curable composition of the present invention. The method of hardening the curable composition of the present invention is heat hardening. The heating temperature at the time of hardening is usually from 100 to 2001: and the heating time is usually from 1 Torr to 20 hrs, preferably from 1 minute to 1 hr. The cured product of the present invention has excellent transparency and long-lasting force even if it is irradiated with high-energy light or in the south/in-state state without coloring or lowering transparency. Therefore, the cured product of the present invention can solve the problem of deterioration of the optical element fixing material with the increase in brightness of the optical element. The curable composition of the present invention can be suitably used as an optical element fixing material. Composition 26 201237103. For example, it can be suitably used for an optical toner, a material for coating a molded article, and a hardened material of the present invention, which has a high degree of hardenability. The force ' can be confirmed, for example, by measuring the contact force as follows, that is, the mirror-coated hardening property of the hard-day film is placed on the object to be attached, and heated. Treatment to harden it. —, σιίε, the enemy is preheated to the 疋/ 度 degree (eg 23t, l〇 (Tc) and then test the crying, day, ^, — on the test bench of the state of the state for 30 seconds , by the position of the body at a height of 5 0 # m, the butt joint surface is applied with a horizontal method (shear direction) to measure the adhesion between the test piece and the object. The adhesion of the hardened object lies in the coffee. And 1〇〇t, it is better to look at 2 Longkou or above '80N/2mm□ or more. The cured product is excellent in transparency and can be confirmed by measuring the light transmittance. The light transmittance of the cured product is Light having a wavelength of 4 〇〇 nm is preferably 8 〇 % or more, and particularly preferably m or more, and light having a wavelength of 45 〇 nm. Preferably, the cured product is excellent in heat resistance, and can be confirmed by changing the force and transparency after the cured product is placed at a high temperature. The adhesive force is placed at 100 ° C for 30 seconds. It is preferable to maintain the adhesion force of 5〇% or more at 23t, and to maintain the force more than 65%, and the transparency is better. The transparency is set at a wavelength of 4〇〇nm after being placed at 15〇°C for 500 hours. 3% or more of the initial transmittance is preferable. 3) Method of using the curable composition The third embodiment of the present invention is used for the adhesive agent for an optical element fixing material or an optical element fixing material. In the case of the encapsulant, the light-emitting element, the light-receiving element, the composite optical element, the optical integrated circuit, etc. of LED, LD, etc., etc. <Adhesive for optical element fixing material> The hardening property of this invention The composition can be suitably used as an adhesive for fixing an optical element. The curable composition of the present invention is used as a method for using an adhesive for an optical element fixing material, and the material to be used (the optical element and the optical element thereof) One of the boards, etc.) The composition is applied to the adhesive surface of the square or both sides, and after crimping, it is heated and hardened. The method of adhering the materials of the object to each other is firmly followed. Next, the main substrate material of the optical element is sodium glass and heat resistance. Glass such as hard glass; ceramics; metal such as iron, copper, aluminum, gold, silver, platinum, ruthenium, metal alloys, stainless steel (SUS302, SUS304, SUS304L, SUS309, etc.); polyparaphenylene Ethylene glycol dicarboxylate, poly(p-butylene dicarboxylate), polybutylene naphthalate, ethylene-vinyl acetate copolymer, polystyrene, polycarbonate, polydecylene, polysulfone Synthesis of polyetheretherketone, polyethersulfone, polyphenylene sulfide, polyetherimide, polyimine, polyamine, acrylic resin, norbornene resin, cyclic olefin resin, glass epoxy resin, etc. Resin, etc. The heating temperature at the time of heat curing is usually 1 〇 〇 〜 2 0 0 depending on the hardenable composition used. (: The heating time is usually from 10 minutes to 20 hours, preferably from 30 minutes to 1 hour. <Encapsulant for optical element fixing material> The curable composition of the present invention can be favorably used as light Element 28 201237103 Sealing the entire encapsulating agent. The curable composition of the present invention is used as a sealing agent for an optical element fixing material, and for example, the composition is molded into a desired shape to obtain an inner optical element. After the molded body, the method of producing the optical element package by heating and hardening it is used. The method of forming the curable composition of the present invention into a desired shape is not particularly limited, and a general transfer can be employed. Conventional casting method such as material formation or injection molding method. ^The heating temperature during heat curing is usually 100 to 200 ° C depending on the curable composition used, etc. The heating time is usually 1 minute to 2 inches. The hour is '30 minutes to 10 hours. The obtained optical element package uses the curable composition of the present invention, so that the peak of the light emitted by the white and blue light-emitting LEDs is used even in the optical element. The short-wavelength of 400 to 490 nm is not excellent in transparency and heat resistance due to heat or light. [Examples] Next, the present invention will be described in more detail by way of examples and comparative examples. The invention is not limited to the following examples. (Measurement of weight average molecular weight) The weight average molecular weight (Mw) of the random copolymer of decane compound obtained in the production example is determined by the following apparatus and conditions in terms of standard polystyrene conversion value. Device name: HLC-8220GPC, TOSO company system

管柱:TSKgelGMHXL—TSKgelGMHXL〜TSKgel 200 0HXL 29 201237103 溶劑:四氫°夫喃Column: TSKgelGMHXL—TSKgelGMHXL~TSKgel 200 0HXL 29 201237103 Solvent: tetrahydrofuran

測定溫度:4(TC 流速:1 m 1 /分 偵測器:示差折射計 (IR光譜的測定) 於製造例所得之矽烷化合物隨機共聚物的IR光譜,係 使用如下裝置測定。 傅立葉變換紅外光譜儀(S p e c t r u m 1 0 0、珀金埃爾默公 司製) (製造例1) 於300ml的水滴型燒瓶,放入本基三曱氧基矽烷(東京 化成工業公司製)20. 2g(102mmol)、2-氰基乙基三甲氧基矽 院(AZMAX公司製)3. 15g(18mmol)、作為溶劑的丙酮96ml、 蒸溜水24ml之後’邊攪拌加入磷酸(關東化學公司 製)0. 1 5g(1. 5mmo 1)作為觸媒,於室溫持續攪拌16小時。 反應結束之後,以減壓濃縮機濃縮至5〇m 1,加入醋酸 乙醋10 0 m 1,以飽和碳酸氫鈉水溶液中和,靜置一陣子之 後’分取有機層。接著,將有機層以蒸溜水清洗2次之後, 以無水硫酸鎂乾燥。過濾硫酸鎂後’將濾液以減壓濃縮機 濃縮至5 0 m 1,將此滴入大量的正己院之中使之沉殿,將沉 澱物以傾析分離。將所得沉澱物以甲乙酮(MEK)溶解回收, 以減壓濃縮機將溶劑減壓傲除’藉由真空乾燥,得到石夕院 化合物隨機共聚物(A1) 1 3. 5 g。 〆 碎烧化合物隨機共聚物(A1)之重量平均分子量(Mw)為 30 201237103 1,900。 此外’將矽烷化合物隨機共聚物(A1 ) IR光譜數據表示 如下。Measurement temperature: 4 (TC flow rate: 1 m 1 /minator: differential refractometer (measurement of IR spectrum) The IR spectrum of the random copolymer of decane compound obtained in the production example was measured using the following apparatus. Fourier transform infrared spectrometer (Spectrum 100, manufactured by Perkin Elmer Co., Ltd.) (Production Example 1) Into a 300 ml water-drop flask, a nonyloxydecane (manufactured by Tokyo Chemical Industry Co., Ltd.) was placed in an amount of 20. 2 g (102 mmol), 2 5g(1) 1 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 5mmo 1) As a catalyst, stirring was continued for 16 hours at room temperature. After the reaction was completed, it was concentrated to 5 〇m with a reduced pressure concentrator, and then added with ethyl acetate acetonitrile 10 0 m 1 and neutralized with a saturated aqueous solution of sodium hydrogencarbonate. After standing for a while, the organic layer was separated. Then, the organic layer was washed twice with distilled water and dried over anhydrous magnesium sulfate. After filtering magnesium sulfate, the filtrate was concentrated to 50 m 1 using a vacuum condenser. This is dripped into a large number of homes in the courtyard. The precipitate was separated by decantation. The obtained precipitate was dissolved in methyl ethyl ketone (MEK), and the solvent was depressurized under reduced pressure. The vacuum was dried to obtain a random copolymer of Shi Xiyuan compound (A1) 1 3 5 g. The weight average molecular weight (Mw) of the smoldering compound random copolymer (A1) is 30 201237103 1,900. Further, the IR spectrum data of the decane compound random copolymer (A1) is expressed as follows.

Si-Ph^gBcm'1 &gt; 740cm'1 ' Si-0 : 1132cmM ^ -CN : 2259cm'1 (製造例2) 在於製造例1,使苯基三曱氧基矽烷之使用量為 16. 7g(84mmol) ’ 2-氫基乙基三甲氧基矽烷的使用量為 6. 31g(36mmol)以外,以與製造例1同樣地,得到矽烷化合 物隨機共聚物(A2)12. 9g。 矽院化合物隨機共聚物(A2)之重量平均分子量(||^)為 2, 000 〇 此外’將化合物隨機共聚物(A2)之IR光譜數據表示如 下。The amount of phenyl tridecyloxy decane is 16. 7g. The amount of phenyl trimethoxy decane used is 16.7g. 9克。 The decane compound random copolymer (A2) 12. 9g was obtained in the same manner as in Production Example 1. The weight average molecular weight (||^) of the random copolymer (A2) of the broth compound is 2,000 Å. Further, the IR spectrum data of the compound random copolymer (A2) is expressed as follows.

Si-Ph : 698cm·' 5 740cm'1 » Si-0 : 1132cm'1 &gt; -CN : 2255cm·1 (製造例3) 於300ml的水滴型燒瓶’放入笨基三甲氧基石夕院(東亨 化成工業公司製)11. 9g(60mmol)、3-縮水甘油醚丙基三甲 氧基石夕统(東京化成工業公司製)14· 2g(6〇mm〇l),作為溶解 的甲苯60ml、蒸溜水30ml之後,邊攪拌加入磷酸(關東化 學公司製)0. 15g(l_ 5mmol)作為觸媒,於室溫持續授摔16 小時。 反應結束之後’對反應混合物加入醋酸乙醋1 〇 〇 m 1 31 201237103 以飽和碳酸氫鈉水溶液中和。靜置一陣子之後,分取有機 層。接著,將有機層以蒸溜水清洗2次之後,以無水硫酸 鎮乾燥。過濾硫酸鎂後,將濾液以減壓濃縮機濃縮至50m i, 將此滴入大量的正己院之中使之沉澱,將沉殿物以傾析分 離。將所得沉澱物以甲乙酮(MEK)溶解回收,以減壓濃縮機 將溶劑減壓餾除,藉由真空乾燥,得到矽烷化合物隨機共 聚物(A3)16. 3g。 石夕院化合物隨機共聚物(A3)之重量平均分子量(Mw)為 2, 800。 此外’碎院化合物隨機共聚物(A3)之IR光譜數據表示 如下。Si-Ph: 698cm·' 5 740cm'1 » Si-0 : 1132cm'1 &gt; -CN : 2255cm·1 (Production Example 3) Into a 300ml water drop type flask, put in a stupid trimethoxy stone court (east) 11g (60mmol), 3-glycidyl ether propyl trimethoxy sulphate (made by Tokyo Chemical Industry Co., Ltd.) 14·2g (6〇mm〇l), as dissolved toluene 60ml, steamed After 30 ml of water, 0.15 g (1 - 5 mmol) of phosphoric acid (manufactured by Kanto Chemical Co., Ltd.) was added as a catalyst, and the mixture was continuously allowed to fall for 16 hours at room temperature. After the end of the reaction, the reaction mixture was added with ethyl acetate 1 〇 〇 m 1 31 201237103 and neutralized with a saturated aqueous solution of sodium hydrogencarbonate. After standing for a while, the organic layer was taken. Next, the organic layer was washed twice with distilled water and then dried with anhydrous sulfuric acid. After filtering the magnesium sulfate, the filtrate was concentrated to 50 m i with a reduced pressure concentrator, and the mixture was dropped into a large amount of Zhenghexi to precipitate it, and the sediment was separated by decantation. The decane compound random copolymer (A3) 16.3 g was obtained by a solution of the decane compound random copolymer (A3). The weight average molecular weight (Mw) of the random copolymer of the Shi Xiyuan compound (A3) was 2,800. Further, the IR spectrum data of the random compound of the broken compound (A3) is shown below.

Si-Ph : 699cm-1 ’ WlcnT1,Si-0 : 1132CHT1,環氧基: 1 254cm'1 (實施例1) 於製造例1所得之矽烷化合物隨機共聚物(A1) 1 Og,加 入2-(3’4-環氧基環己基)乙基三甲氧基矽烷(東京化成工 業公司製)1. Og作為矽烷偶合劑(B),藉由將全容充分混 合、脫泡,得到硬化性組成物(1)。 (實施例2) 在於實施例1,將2-(3,4-環氧基環己基)乙基三曱氧 基石夕院的置變更為1. 5g以外,以與實施例1同樣地得到硬 化性組成物(2)。 (實施例3) 在於實施例1,取代矽烷化合物隨機共聚物(A1)使用 32 201237103 製造例2所得之矽烷化合物隨機共聚物(A2)1 〇g以外,以 與實施例1同樣地得到硬化性組成物(3 )。 (實施例4) 在於實施例1 ’作為金屬錯合物(C),進一步,加入四 乙醯丙酮酸锆(東京化成工業公司製)(於下述第1表中,記 載為「C1」。)0· Olg以外’以與實施例1同樣地得到硬化 性組成物(4)。 (實施例5) 在於實施例4,將四乙醯丙酮酸锆的量變更為〇.〇5g 以外,以與實施例4同樣地得到硬化性組成物(5)。 (實施例6) 在於實施例4,將四乙醯丙酮酸錘的量變更為〇. lg以 外,以與實施例4同樣地得到硬化性組成物(6)。 (實施例7) 在於實施例4,將四乙醯丙酮酸鍅的量變更為1. 0g以 外,以與實施例4同樣地得到硬化性組成物(7)。 (實施例8) 在於實施例1,作為金屬錯合物(C ),進一步,加入三 乙醯丙酮酸鋁(東京化成工業公司製)(於下述第1表中,記 載為「C2」。)〇. 0 5g以外,以與實施例1同樣地得到硬化 性組成物(8)。 (實施例9) 在於實施例1 ’作為金屬錯合物(C ),進一步,加入鈦 酸二辛氧基雙(辛二醇酯)(Matsumoto Fine Chemical公司 33 201237103 製’ Orgatics TC-200)(於下述第1表中,記載為 「C3」。)〇. 05g以外’以與實施例丄同樣地得到硬化性組 成物(9)。 (實施例10) 在於實施例10,作為具有羧基之脂環酸酐(D),進一 步加入環己统1,2,4 -三叛酸-1,2 -酐(三菱氣體化學公司 製)0 · 0 5 g以外’以與實施例1同樣地得到硬化性組成物 (10)。 (實施例11) 在於實施例1 0,將環己烷1,2, 4-三羧酸-1, 2-酐的量 變更為1. 0g以外,以與實施例1 〇同樣地得到硬化性組成 物(11)。 (比較例1) 在於實施例1,將2-(3,4-環氧基環己基)乙基三甲氧 基矽烷的量變更為0. 1 g以外,以與實施例1同樣地得到硬 化性組成物(12 )。 (比較例2 ) 在於實施例1,將2-(3, 4-環氧基環己基)乙基三曱氧 基矽烷的量變更為3. 0g以外,以與實施例1同樣地得到硬 化性組成物(13)。 (比較例3) 在於實施例5,取代矽烷化合物隨機共聚物(A1 ),使 用製造例3所得之石夕烧化合物隨機共聚物(A 3 )以外,以與 實施例6同樣地得到硬化性組成物(14)。 34 201237103 (比較例4) 在於實施例1 0,取代矽烷化合物隨機共聚物(A1)使用 製造例3所得之矽烷化合物隨機共聚物(A3)以外,以與實 施例1 0同樣地得到硬化性組成物(1 5)。 35 201237103 CQ AJ •. tt㈣ Q娜 1 &lt; CO i i 卜 oo CT3 C75 CJ3 CD C^&gt; CD i i CO CNJ O- 卜 CH) CD S S S s s s CH) OD 脂環酸酐 ⑻ (質量比) 1 1 1 1 1 1 1 1 t 1 1 LO CD CD CD 1 1 1 LO cr&gt; o 金屬錯合物(C)(質量比) CO 1 1 1 1 1 1 1 1 LO 〇) o’ 1 1 1 1 i 1 〇〇 1 1 1 1 1 1 1 LO o czi 1 1 1 1 1 1 1 1 4 1 1 1 o CD LO 〇 CD 1 &lt; o Q 1 1 1 1 1 1 LO o 1 矽烷 偶合劑 (B) (質量部) Ο LO 〇) τ—Η O r—H C5 CZ5 1 〇 ” ·Η o o O H o i—H 1 &lt; CZ? CD CO cr&gt; 〇 矽烷化合物隨機共聚物(A) (質量部) 〇) cr&gt; o 〇&gt; 〇&gt; Ο cr&gt; CZD o o o o o cr&gt; T™H 組成比(莫耳°/0) 矽烷 化合物(3) 1 1 1 1 1 1 1 1 1 1 1 1 1 s s CNI a3 LO oo LO oo LO oo LO oo LO oo LO OO LO oo LO OO LO OO LO oo LO oo LO OO s s 矽烷 化合物(1) LO i i LO LO LO LO LO LO LO LO LO LO LO 1 種類 Γ-— t &quot; t τ—H i 1 i i i i r 1 1 1&quot;· &lt; r-_H i—l τ—H CO CO 硬化性 組成物質 Ρ···( &lt;N1 CO 寸 LO CO 卜 OO o τ—H F ) OO CO 呀 i i in —&lt; 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 實施例7 實施例8 實施例9 實施例10 實施例11 比較例1 比較例2 比較例3 比較例4 9ε 201237103 將實施例卜11及比較例1〜4所得之硬化性組成物卜15 之硬化物,如下測定接著力、初期穿透率及加熱後穿透率, 評估接著耐熱性、初期透明性、耐熱性(加熱後透明性)^ 將測定結果及評估示於下述第2表。 (接著力試驗) 於2mm四方的石夕晶片的鏡面’分別塗佈硬化性組成物 1〜15成厚度約2em,將塗佈面載置於被著體(鍍銀銅板) 上壓接之。之後,以180°C加熱處理2小時使之硬化,得 到附有試驗片之被著體。將該附有試驗片之被著體,放置 於預先加熱為既定溫度(23°C、l〇(TC )之接著測試器 (Series 4000, DAGE公司製)的測試台上3〇秒’由被著體 以高50&quot; m的位置,以200 &quot; ni/s的速度對接著面以水平方 法(剪方向)施加應力,測定在於23t、1〇〇。〇之試驗片與 被著體之接著力)。 (接著耐熱性) 在於100 C之接著力試驗,接著力為8〇N/2_□以上時 '平估為〇」,6〇N/2mm□以上未滿8〇N/2mm□時則「△」, 未滿60N/2mm□時為「x」。 (初期穿透率的測定) 將硬化性組成物卜15,分別灌入成為長度25mm,寬度 2〇咖,厚度lmm之模具,以14〇t加熱6小時使之硬化, 分別製作試驗片。將所得試驗片,以分光光度計 (MPC-3100、島幸製作所公司製),測定波長4〇〇隨、45〇⑽ 之初期穿透率(%)。 201237103 (初期透明性) 在於初期穿透率測定,400nm的穿透率為80%以上評估 為「〇」,70%以上未滿8〇%則「△」,未滿7〇%為「χ」。 (加熱後之穿透率測定) 將測定初期穿透率之各試驗片,投入丨5〇〇c的烘箱5〇〇 小時’再度,測定波長400nm、45〇nm之穿透率(%)。將此 作為加熱後穿透率。 [耐熱性(加熱後透明性)] 在於加熱後穿透率測定,4〇〇nm之穿透率在初期穿透 率的80%以上則評估為「〇」,7〇%以上未滿8〇%則「△」, 未滿70%為「X」。 第2表Si-Ph: 699 cm-1 'WlcnT1, Si-0: 1132CHT1, epoxy group: 1 254 cm'1 (Example 1) The random copolymer of decane compound (A1) obtained in Production Example 1 was 1 Og, and 2-(2) was added. 3'4-Epoxycyclohexyl)ethyltrimethoxydecane (manufactured by Tokyo Chemical Industry Co., Ltd.) 1. Og as a decane coupling agent (B), which is sufficiently mixed and defoamed to obtain a curable composition ( 1). (Example 2) In the same manner as in Example 1, except that the amount of the 2-(3,4-epoxycyclohexyl)ethyltrimethoxyxanthene was changed to 1.5 g, the hardening was carried out in the same manner as in Example 1. Sex composition (2). (Example 3) The hardening property was obtained in the same manner as in Example 1 except that the decane compound random copolymer (A1) was used in Example 1, except that the decane compound random copolymer (A2) obtained in Production Example 2 was used. Composition (3). (Example 4) In Example 1 'as a metal complex (C), zirconium tetraacetate pyruvate (manufactured by Tokyo Chemical Industry Co., Ltd.) was added (in the following Table 1, it is described as "C1"). In the same manner as in Example 1, except for 0· Olg, a curable composition (4) was obtained. (Example 5) A curable composition (5) was obtained in the same manner as in Example 4 except that the amount of zirconium tetraacetate pyruvate was changed to 〇.〇5g. (Example 6) A curable composition (6) was obtained in the same manner as in Example 4 except that the amount of the tetraethylpyruvate hammer was changed to 〇. lg. (Example 7) A curable composition (7) was obtained in the same manner as in Example 4 except that the amount of ruthenium tetraacetate pyruvate was changed to 1.0 g. (Example 8) In the first embodiment, aluminum triacetate pyruvate (manufactured by Tokyo Chemical Industry Co., Ltd.) was added as the metal complex (C) (in the following Table 1, it is described as "C2"). The curable composition (8) was obtained in the same manner as in Example 1 except that 0 5 g. (Example 9) In Example 1 'as a metal complex (C), further, dioctyloxybisbis(octyl glycolate) (Matsumoto Fine Chemical Co., Ltd. 33 201237103 'Orgatics TC-200) was added ( In the following Table 1, it is described as "C3".) 〇. Other than 05g, the curable composition (9) was obtained in the same manner as in Example 。. (Example 10) In Example 10, as a alicyclic acid anhydride (D) having a carboxyl group, a cycloheximide 1,2,4-trisoleic acid-1,2-anhydride (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was further added. The curable composition (10) was obtained in the same manner as in Example 1 except for 0 5 g. (Example 11) The curing property was obtained in the same manner as in Example 1 except that the amount of the cyclohexane 1,2,4-tricarboxylic acid-1,2-anhydride was changed to 1.0 g. Composition (11). (Comparative Example 1) The curability was obtained in the same manner as in Example 1 except that the amount of 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane was changed to 0.1 g. Composition (12). (Comparative Example 2) The curability was obtained in the same manner as in Example 1 except that the amount of 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane was changed to 3. 0 g. Composition (13). (Comparative Example 3) A curable composition was obtained in the same manner as in Example 6 except that the random copolymer (A1) of the decane compound was used in the same manner as in Example 6 except that the random copolymer (A3) of the decane compound obtained in Production Example 3 was used. (14). 34 201237103 (Comparative Example 4) The curable composition was obtained in the same manner as in Example 10 except that the random copolymer (A3) of the substituted decane compound (A1) was used in the same manner as in Example 10 except that the decane compound random copolymer (A3) obtained in Production Example 3 was used. (1 5). 35 201237103 CQ AJ •. tt(4) Q Na 1 &lt; CO ii oo CT3 C75 CJ3 CD C^&gt; CD ii CO CNJ O- Bu CH) CD SSS sss CH) OD alicyclic anhydride (8) (mass ratio) 1 1 1 1 1 1 1 1 t 1 1 LO CD CD CD 1 1 1 LO cr&gt; o Metal complex (C) (mass ratio) CO 1 1 1 1 1 1 1 1 LO 〇) o' 1 1 1 1 i 1 〇〇1 1 1 1 1 1 1 LO o czi 1 1 1 1 1 1 1 1 4 1 1 1 o CD LO 〇CD 1 &lt; o Q 1 1 1 1 1 1 LO o 1 decane coupling agent (B) ( Quality Department) Ο LO 〇) τ—Η O r—H C5 CZ5 1 〇” ·Η oo OH oi—H 1 &lt; CZ? CD CO cr> 〇矽 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物 化合物Cr&gt; o 〇&gt;〇&gt; Ο cr&gt; CZD ooooo cr&gt; TTMH composition ratio (mole °/0) decane compound (3) 1 1 1 1 1 1 1 1 1 1 1 1 1 ss CNI a3 LO Oo LO oo LO oo LO oo LO oo LO OO LO oo LO OO LO OO LO oo LO oo LO OO ss decane compound (1) LO ii LO LO LO LO LO LO LO LO LO LO Type Γ-- t &quot; t τ—H i 1 iiiir 1 1 1&quot;· &lt; r-_H i−l τ—H CO CO hardening constituent substance Ρ···( &lt;N1 C O inch LO CO OO o τ - HF ) OO CO 呀 ii in - &lt; Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Implementation Example 11 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 9ε 201237103 The cured product of the curable composition of Example 11 and Comparative Examples 1 to 4 was measured for the adhesion, initial transmittance, and heating as follows. After the penetration rate, the heat resistance, the initial transparency, and the heat resistance (transparency after heating) were evaluated. The measurement results and evaluation are shown in Table 2 below. (Continuous force test) The curable composition 1 to 15 was applied to the mirror surface of the 2 mm square stone wafer to have a thickness of about 2 cm, and the coated surface was placed on the object (silver-plated copper plate). Thereafter, it was heat-treated at 180 °C for 2 hours to be hardened, and a subject with a test piece was obtained. The object to which the test piece is attached is placed on a test stand preheated to a predetermined temperature (23 ° C, 1 〇 (TC), tester (Series 4000, manufactured by DAGE), 3 sec. The body is placed at a height of 50&quot; m, and the horizontal surface (shear direction) is applied to the joint surface at a speed of 200 &quot; ni/s, and the measurement is at 23t, 1〇〇. The test piece and the object are followed by the object. force). (Subsequent to heat resistance) is the 100 C adhesion test. When the force is 8〇N/2_□ or more, it is 'flattened as 〇,' and 6〇N/2mm□ or more is less than 8〇N/2mm□. "x" when less than 60N/2mm□. (Measurement of initial penetration rate) The curable composition 15 was poured into a mold having a length of 25 mm, a width of 2 Å, and a thickness of 1 mm, and was heated at 14 Torr for 6 hours to be hardened, and a test piece was prepared. The obtained test piece was measured for the initial transmittance (%) at a wavelength of 4 Torr and 45 Å (10) by a spectrophotometer (MPC-3100, manufactured by Shima Seisakusho Co., Ltd.). 201237103 (Initial transparency) In the initial transmittance measurement, the transmittance at 400 nm is 80% or more, and it is evaluated as "〇", 70% or more is less than 8〇%, then "△", and less than 7〇% is "χ". . (Measurement of penetration rate after heating) Each test piece for measuring the initial transmittance was placed in an oven of 5 〇〇c for 5 hrs, and the transmittance (%) at a wavelength of 400 nm and 45 〇 nm was measured. This is taken as the penetration rate after heating. [Heat resistance (transparency after heating)] The transmittance after heating is measured. The transmittance at 4 〇〇 nm is estimated to be “〇” at 80% or more of the initial transmittance, and 7〇% or less is less than 8〇. % is "△", less than 70% is "X". Table 2

硬化性 組成物 接著力 (N/2mm匚 ) 初期穿透率 (%) 初期 透明性 加熱後穿透率 (°/〇) 耐熱性 (加熱後 透明性) 23〇C 10(TC 接著 耐熱性 400nm 450nm 400nm 450nm 實施例1 1 122.1 93.7 〇 90.1 90.7 〇 84.7 88.4 〇 實施例2 2 110.3 86.2 〇 88.9 90.6 〇 84.2 88.2 〇 實施例3 3 115.4 95.1 〇 89.3 91.4 〇 85.1 88.5 〇 實施例4 4 「149.2 110.6 〇 88.6 90.5 〇 84.4 89.0 〇 實施例5 5 168.5 128.9 〇 88.2 90.2 〇 84.0 88.3 〇 實施例6 6 172.7 121.4 〇 87.6 90.1 〇 83.9 87.7 〇 實施例7 7 137.0 69.5 Δ 87.8 90.4 〇 80.5 85.8 〇 實施例8 8 130.0 103.8 〇 88.1 90.3 〇 84.2 87.1 〇 實施例9 9 155.6 117.3 〇 88.5 90. 6 〇 83.3 86.8 〇 實施例10 10 157.2 110.0 〇 87.7 89.9 〇 83.5 85.9 〇 實施例11 11 142.0 73.3 Δ 89.2 90.8 〇 78.4 82.6 〇 比較例1 12 71.3 58.1 X 89.8 91.0 〇 86.3 88.8 〇 比較例2 13 60.9 35.7 X 86.9 89.8 〇 82.2 86.2 〇 比較例3 14 148.6 105.8 〇 88.3 90.4 〇 14.4 50.7 X 比較例4 15 163.5 110.2 〇 87.2 90.8 〇 10.4 46.1 X 由第2表可知’實施例1〜11的硬化性組成物1〜u的 硬化物’在23°C與10(TC的雙方,均為6〇N/2mm□以上, 38 201237103 接著性及接著耐熱性優良。此外,波長4〇〇nm、45〇nm的初 期穿透率、加熱後穿透率都很高’初期透明性、耐熱性(加 熱後透明性)亦優良。 另一方面,比較例1、2的硬化性組成物12、1 3的硬 化物,接著性差。此外,比較例3、4的硬化性組成物i 4、 15的硬化物,加熱會使穿透率大大地下降。 【圖式簡單說明】 益〇 【主要元件符號說明】 益〇 39Curing composition adhesion force (N/2mm匚) initial penetration rate (%) initial transparency after heating (v/h) heat resistance (transparency after heating) 23〇C 10(TC followed by heat resistance 400nm 450 nm 400 nm 450 nm Example 1 1 122.1 93.7 〇90.1 90.7 〇84.7 88.4 〇Example 2 2 110.3 86.2 〇88.9 90.6 〇84.2 88.2 〇Example 3 3 115.4 95.1 〇89.3 91.4 〇85.1 88.5 〇Example 4 4 “149.2 110.6 〇 88.6 90.5 〇84.4 89.0 〇Example 5 5 168.5 128.9 〇88.2 90.2 〇84.0 88.3 〇Example 6 6 172.7 121.4 〇87.6 90.1 〇83.9 87.7 〇Example 7 7 137.0 69.5 Δ 87.8 90.4 〇80.5 85.8 〇Example 8 8 130.0 103.8 〇88.1 90.3 〇84.2 87.1 〇Example 9 9 155.6 117.3 〇88.5 90. 6 〇83.3 86.8 〇Example 10 10 157.2 110.0 〇87.7 89.9 〇83.5 85.9 〇Example 11 11 142.0 73.3 Δ 89.2 90.8 〇78.4 82.6 〇Compare Example 1 12 71.3 58.1 X 89.8 91.0 〇86.3 88.8 〇Comparative Example 2 13 60.9 35.7 X 86.9 89.8 〇82.2 86.2 〇Comparative Example 3 14 148.6 105.8 〇88.3 90.4 〇14.4 50.7 X Comparative Example 4 15 163.5 110.2 〇87.2 90.8 〇10.4 46.1 X As is clear from the second table, 'the cured product of the curable composition 1 to u of Examples 1 to 11' is at 23 ° C and 10 (both of TC, both) 6〇N/2mm□ or more, 38 201237103 The adhesion and subsequent heat resistance are excellent. In addition, the initial transmittance at a wavelength of 4〇〇nm and 45〇nm and the transmittance after heating are high. 'Initial transparency and heat resistance. (The transparency after heating is also excellent.) On the other hand, the cured products of the curable compositions 12 and 13 of Comparative Examples 1 and 2 have poor adhesion, and the curable compositions i 4 and 15 of Comparative Examples 3 and 4. The hardened material, heating, will greatly reduce the penetration rate. [Simple description of the schema] Benefits [Description of main component symbols]

Claims (1)

201237103 七、申請專利範圍: 1. 一種硬化性組成物,將 (A) 矽烷化合物隨機共聚物,其係於分子内,以下述式 (i)、(ii)及(iii)所示反覆單位之中,具有(i)及(ii)、(i) 及(iii)、(ii)及(iii)、或(i)、(ii)及(iii)的反覆單位, 重量平均分子量為1,〇〇〇〜30, 〇〇〇;及 (B) 具有反應性環醚構造之矽烷偶合劑’以(a )與(B) 與質量比,以(A): (B) = 95: 5〜80: 20的比例包含者:201237103 VII. Patent application scope: 1. A curable composition, which is a random copolymer of (A) decane compound, which is in a molecule and is represented by the following formulas (i), (ii) and (iii) A recurring unit having (i) and (ii), (i) and (iii), (ii) and (iii), or (i), (ii) and (iii), having a weight average molecular weight of 1, 〇 〇〇~30, 〇〇〇; and (B) a decane coupling agent having a reactive cyclic ether structure with a mass ratio of (a) to (B) to (A): (B) = 95: 5 to 80 : The ratio of 20 is included: 式中’ R1係表示氫原子或碳數卜6的烷基,D係單鍵結或 可具有取代基的碳數1〜20之2價有機基,R2係表示碳數 1〜20之烷基或可具有取代基之苯基。 2.如申請專利範圍第1項所述的硬化性組成物,其中 上述(A)的矽烷化合物隨機共聚物,係以式Ri-CH(CN)_D_ 表示之基的存在量([f-CHCCiO-D-]),與R2的存在量 ([R2]) ’ 以莫耳比為[Ri_CH(CN)_D_] : [R2] = 5:95〜5〇:5〇 之 矽烷化合物隨機共聚物。 40 201237103 4 3. —種硬化性組成物,將 (A’)矽烷化合物隨機共聚物,其係式(i):ri_ch(cn)__d -SiCOlOpU1)3。所示之矽烷化合物之至少—種;及式 (2) :R2Si(0R4)q(X2)3-q所示的矽烷化合物(2)之至少一種的 矽烷化合物的混合物縮合而得,重量平均分子量為 1,000〜30, 000 ;及 (B)具有反應性環醚構造之矽烷偶合劑,以(A’)與(B) 與質量比,以(A,):(B) = 95:5~80:20的比例包含者: 式中R係表示氫原子或碳數1〜6之烧基,])係單鍵結 或可具有取代基的碳數1〜20之2價有機基;R3係表示碳數 卜6之烧基’ X1係表示鹵素原子,ρ係表示〇〜3的整數; 式中R2係表示碳數1〜20之烷基或可具有取代基的笨 基,R係表不碳數1 ~ 6的烷基,Χ2係表示鹵素原子,q係表 示0〜3的整數。 4. 如申請專利範圍第3項所述的硬化性組成物,其中 上述(A )之矽烷化合物隨機共聚物,係矽烷化合物(丨)與 矽烷化合物(2),以莫耳比為[矽烷化合物(1)]:[矽烷化合 物(2)] 5 . 9 5〜5 0 : 5 0之比例縮合而得之石夕烧化合物隨機共 聚物。 5·如申請專利範圍第1至4項中任一項所述的硬化性 、且成物其中上述矽烷偶合劑係具有環己烯氧化物基的 石夕烧偶合劑D 6.如申明專利範圍第1至5項中任一項所述的硬化性 組成物’其中進—步含有⑹金屬原子為銘、結或鈦之金屬 41 201237103 錯合物’(C)成分的含量對(a)成分或(a,)成分loo質量 部’包含〇質量部以上,1 〇質量部以下。 7 ·如申請專利範圍第1至5項中任一項所述的硬化性 組成物’其中進一步含有(D)具有羧基之脂環酸酐,(D)成 分的含量對(A)成分或(A,)成分1〇〇質量部包含〇質量部以 上’ 10質量部以下。 8. 如申請專利範圍第1至7項中任一項所述的硬化性 組成物’其係光元件固定材用組成物。 9. 一種硬化物’係硬化申請專利範圍第1至7項中任 一項所述的硬化性組成物而成。 1 〇·如申請專利範圍第9項所述的硬化物,其係光元件 固定材。 11. 一種方法,將申請專利範圍第1至7項中任一馆 ^所 述的硬化性組成物,使用於作為光元件固定材用接著劑 12. —種方法,將申請專利範圍第1至7項中任一 項所 述的硬化性組成物’使用於作為光元件固定材用封裝劑 42 201237103 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 五、本案,有化學式時,請揭示最能顯讀明特徵的化學式Wherein R 1 represents a hydrogen atom or an alkyl group having a carbon number of 6; D is a single bond or a divalent organic group having 1 to 20 carbon atoms which may have a substituent; and R 2 represents an alkyl group having 1 to 20 carbon atoms. Or a phenyl group which may have a substituent. 2. The curable composition according to claim 1, wherein the random copolymer of the above-mentioned (A) decane compound is in the presence of a group represented by the formula Ri-CH(CN)_D_ ([f-CHCCiO -D-]), the amount of R2 present ([R2])' is a random copolymer of decane compound with a molar ratio of [Ri_CH(CN)_D_]: [R2] = 5:95~5〇:5〇. 40 201237103 4 3. A curable composition comprising a (A') decane compound random copolymer of the formula (i): ri_ch(cn)__d - SiCOlOpU1)3. a mixture of at least one of the decane compounds shown; and a mixture of the decane compounds of the formula (2): at least one of the decane compounds (2) represented by R2Si(0R4)q(X2)3-q, the weight average molecular weight Between 1,000 and 30, 000; and (B) a decane coupling agent having a reactive cyclic ether structure, with (A') and (B) to mass ratio, (A,): (B) = 95:5 The ratio of ~80:20 includes: wherein R represents a hydrogen atom or a carbon number of 1 to 6, and is a single bond or a divalent organic group having 1 to 20 carbon atoms which may have a substituent; R3 The system represents a carbon number of the alkyl group, wherein X1 represents a halogen atom, and ρ represents an integer of 〇~3; wherein R2 represents an alkyl group having 1 to 20 carbon atoms or a stupid group which may have a substituent, and the R series is The alkyl group having no carbon number of 1 to 6, the oxime 2 is a halogen atom, and the q is an integer of 0 to 3. 4. The curable composition according to claim 3, wherein the random copolymer of the above (A) decane compound is a decane compound (丨) and a decane compound (2) in a molar ratio of [decane compound] (1)]: [decane compound (2)] 5 . 9 5 to 5 0 : 5 0 ratio of the obtained sulphur compound compound random copolymer. 5. The sclerosing agent according to any one of claims 1 to 4, wherein the decane coupling agent has a cyclohexene oxide group D. The hardenable composition according to any one of items 1 to 5, wherein the step (b) contains (6) a metal atom as a metal, a metal, or a titanium metal 41 201237103 complex compound (C) component content (a) component Or (a,) component loo mass part 'includes more than 〇 mass part, and 1 〇 mass part or less. The curable composition as described in any one of claims 1 to 5 which further contains (D) an alicyclic acid anhydride having a carboxyl group, and the content of the component (D) is (A) component or (A) ,) The component 1 〇〇 mass part includes 〇 mass part or more '10 mass parts or less. 8. The curable composition as described in any one of claims 1 to 7 which is a composition for an optical element fixing material. A hardened composition according to any one of the first to seventh aspects of the present invention. 1A. The cured product according to claim 9, which is a fixing member for an optical element. 11. A method of using the curable composition according to any one of claims 1 to 7 for use as an adhesive for an optical element fixing material 12. The method of applying the patent range 1 to The curable composition according to any one of the items 7 is used as an encapsulant for an optical element fixing material. 42 201237103 IV. Designated representative drawings: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None. 5. In this case, when there is a chemical formula, please reveal the chemical formula that best describes the characteristics. R1 六、發明說明: 【發明所屬之技術領域】 一本發明係關於可得透明性及耐熱性優良’並且且有很 之硬化物之硬化性組成物;硬化該組成物而成 ,及使用該組成物作為光元件固定材用接著劑或 次*疋件固定材用封裝劑之方法。 先前技術】 至今’硬化性組成物按照用途做了各式各樣的改良 2 201237103 10 號 替換頁 取年月日 微,L 上述(B)矽烷偶合劑係具有環己烯1.氧-._化-物衆,燒偶合 劑。 [6 ]如[1 ]〜[5 ]之任何一項所述的硬化性組成物,其中 進一步含有(C)金屬原子為鋁、鍅或鈦之金屬錯合物,(c) 成分的含量對(A)成分或(A,)成分100質量部,包含〇質量 部以上,1 0質量部以下。 [7 ]如[1 ]〜[5 ]之任何一項所述的硬化性組成物,其中 〇 進一步含有(D)具有羧基之脂環酸酐’(d)成分的含量對(A) 成分或(A’)成分1〇〇質量部包含〇質量部以上,1〇質量部 以下。 [8 ]如[1 ]〜[7 ]之任何一項所述的硬化性組成物,其係 光元件固定材用組成物。 根據本發明的第2,可提供如下[9]、[1〇]之硬化物。 [9] 一種硬化物’其係硬化[丨]〜[7]之任何一項所述的 硬化性組成物而成。 Ο [10]如[9]所述的硬化物,其係光元件固定材。 根據本發明的第3,可提供如下[u]、[12]的使用本 發明之硬化性組成物之方法。 [11] 一種方法’其係將[丨]〜[7]之任何一項所述的硬化 性組成物,使用於作為光元件固定材用接著劑。 [12] 種方法’其係將[1]〜[7]之任何一項所述的硬化 性組成物,使用於作為光元件固定材用封裝劑。 [發明效果] 根據本發明之硬化性組成物,可得即使以高能量的光 7 201237103 照射之情形或高溫狀態,並不會 a $有著色而降低透明性,可 長期具有優良的透明性,且具有稂古 + $很回的接者力的硬化物。 本發明之硬化性組成物,可使用於形成光元件固定材 時’特別是,τ良好地使用於作為光元件以材用接著劑 及光元件固定材用封裝劑。 【實施方式】 以下、將本發明分項為1)硬化性組成物、2)硬化物、 及3)硬化性組成物的使用方法,詳細地說明。 1)硬化性組成物 本發明的硬化性組成物,其特徵在於將(A)碎院化合物 隨機共聚物’其係於分子内,以下述式(i)、(ii)及(iii) 所示反覆單位之中,具有(i)及(ii)、(i)及(iii)、(ii) 及(iii)、或(i)、(ii)及(iii)的反覆單位,重量平均分子 量為1,0 00〜30, 〇〇〇 ;及(B)具有反應性環醚構造之矽烷偶 合劑,以(^)與(^)與質量比,以(^):“)= 95:5〜80:2〇的比 例包含者: 201237103 10 號 101年4月24日修正替換頁 — 可良好地使用於光學零件或成形體的原料、接 著劑、塗層劑。 — 本發明之硬化性組成物而成的硬化物具有很高的 接:力,可藉由例如’以如下測定接著力而確認,即,於 矽晶片的鏡面塗佈硬化性組成物,將塗佈面放置於被著體 上壓接,加熱處理使之硬化。將此,放置於預先加熱為既 定温f (例如2代、10(rc)接著測試器的測試台上3〇秒, 〇由被著體以冑50 ^的位置,對接著面以水平方向(剪方向) 施加應力,測定試驗片與被著體之接著力。 、硬化物的接著力,在於23t及l〇(TC,以6〇n/2mD 以上為佳’ 80N/2mm □以上更佳。 上述硬化物的透明性優良,可藉由測定光穿透率而確 認。硬化物的光穿透率,於波長4〇〇nm的光,以8〇%以上 為佳,以86%以上特別為佳,於波長45〇nm的光,以87% 以上為佳。 ϋ 上述硬化物之耐熱性優良,可藉由即使將硬化物放置 於高溫下之後’接著力及透明性的變化小而確認。接著力, 係於loot:放置30秒後,保持在23t的接著力的5〇%以上 接著力為佳,保持65%以上接著力更佳。透明性,係於15〇 。。放置500小時之後,於波長4〇〇nm的穿透率在初期穿透 率的80%以上為佳 3 )硬化性組成物的使用方法 本發明之第3係將本發明的硬化性組成物,使用於作 為光元件固定材用接著劑或光元件固定材用封裝劑之方 201237103 法。 、:牛可舉LED、LD等的發光元件、光接收元件、 複合光元件、光積體電路等。 〈光元件固定材用接著劑〉 本發明的硬化性組成物,可良好地使用於作為光元件 固定材用接著劑。 將本發明之硬化性組成物使用於作為光元件固定材用 接著劑之方法,可舉將接著對象之材料(光元件及其電路板 等)之#或雙方的接著面塗佈該組成才勿、壓接後,加熱使 之硬化將接著對象之材料相互牢固地接著之方法。 接著光元件之主要的基板材料,可舉鈉玻璃、耐熱性 硬質玻璃等的玻璃類;陶瓷;鐵、銅、鋁、金、銀、鉑、 鉻、鈦及該等的金屬合金、不銹鋼(SUS3〇2、SUS3〇4、 SUS3 04L、SUS309等)等的金屬類;聚對苯二甲酸乙二醇酯、 聚對苯二曱酸丁二醇酯、聚萘二曱酸丁二醇酯、乙烯—醋酸 乙烯酯共聚物、聚笨乙烯、聚碳酸酯、聚曱基戊烯、聚砜' 1趟趟酮、聚醚碾、聚苯硫醚、聚醚醯亞胺、聚醯亞胺、 聚酿胺、丙烯酸樹脂、降冰片烯系樹脂、環烯烴樹脂、玻 璃環氧樹脂等的合成樹脂等。 加熱硬化時之加熱溫度,雖依所使用的硬化性組成 物,通常為100〜200。(:,加熱時間通常為10分鐘至20小 時,以30分鐘至10小時為佳。 〈光元件固定材用封裝劑〉 本發明之硬化性組成物,可良好地使用於作為光元件 28 201237103 10 號 101年4月24日修正替換頁 將實施例1〜11及比較例1〜4所得之硬化性組成物丨〜j 5 之硬化物,如下測定接著力、初期穿透率及加熱後穿透率, 評估接著耐熱性、初期透明性、耐熱性(加熱後透明性)。 將測定結果及評估示於下述第2表。 (接著力試驗) 於2mm四方的矽晶片的鏡面’分別塗佈硬化性組成物 1〜15成厚度約2//m,將塗佈面載置於被著體(鍍銀銅板) 〇 上壓接之。之後,以180。(:加熱處理2小時使之硬化,得 到附有試驗片之被著體。將該附有試驗片之被著體,放置 於預先加熱為既疋溫度(2 3 C、1 〇 〇 )之接著測試5| (Series 4000,MGE公司製)的測試台上3〇秒,由被著體 以咼50 // m的位置,以200以m/s的速度對接著面以水平方 向(剪方向)施加應力,測定在於23t、1〇(rc之試驗片與 被著體之接著力(N/2_〇)。 (接著耐熱性) ϋ 在於100c之接著力試驗,接著力為8 ON/2mm□以上時 評估為「〇」,60N/2mm□以上未滿8〇N/2_□時則「△」, 未滿60N/2mm□時為「X」。 (初期穿透率的測定) 將硬化性組成物1〜15,分別灌入成為長度25mm,寬度 20mm,厚度1 _之模具,以14加熱6小時使之硬化, 刀別製作試驗片。將所得試驗片,以分光光度計 (MPC-3100、島津製作所公司製),測定波長4〇〇nm、45〇nm 之初期穿透率(%)。 37 201237103 (初期透明性) 在於初期穿透率測定,400nm的穿透率為8〇%以上評估 為〇」,70%以上未滿80%則「△」,未滿7〇%為「&amp; 。 (加熱後之穿透率測定) 將測定初期穿透率之各試驗片,投入15〇t的烘箱5〇〇 】蚪,再度,測定波長4〇〇nm、之穿透率(%)。將此 作為加熱後穿透率。 [耐熱性(加熱後透明性)] 在於加熱後穿透率測定,400nm之穿透率在初期穿透 率的80%以上則評估為「〇」,7〇%以上未滿8〇%則「△」, 未滿70%為「x_j 。 見2表 ------ -- 硬化性 組成物 0 接著力 Ί/2πιιη[ ) 初期穿透率 (%) 初期 透明性 加熱後穿透率 (%) 耐熱性 (加熱後 透明性) 23 °C loot: 接著 耐熱性 400nm 450nm 400nm 450nm 實施例1 1 122.1 93. 7 〇 90.1 90.7 〇 84.7 88.4 〇 ^例 2 2 110.3 86.2 〇 88.9 90.6 〇 84.2 88.2 〇 例 3 3 115.4 95.1 〇 89.3 91.4 〇 85.1 88.5 〇 _夏施例4 4 149.2 110.6 〇 88.6 90. 5 〇 84.4 89.0 〇 _^&amp;例 5 5 168.5 128.9 〇 88.2 90. 2 〇 84.0 88.3 〇 實施例6 6 172.7 121.4 〇 87.6 90.1 〇 83.9 87.7 〇 實施例7 7 1 137.0 69.5 Δ 87.8 90.4 〇 80.5 85.8 〇_ _^例8 8 130.0 103.8 〇 88.1 90.3 〇 84.2 87.1 〇 實施例9 9 155.6 117.3 〇 88.5 90.6 〇 83.3 86.8 〇 _^例 10 10 157.2 110.0 〇 87.7 89. 9 〇 83.5 85.9 〇 11 11 142.0 73.3 Δ 89.2 90.8 〇 78.4 82.6 〇 例 1 12 71.3 58. 1 X 89.8 91. 0 〇 86.3 88.8 〇 __^例 2 13 60.9 35.7 X 86.9 89.8 〇 82.2 86.2 〇 __^較例3 14 148.6 105.8 〇 88.3 90.4 〇 14.4 50.7 ------ X 例 4 15 163.5 110.2 〇 87.2 90.8 〇 10.4 46.1 X 由第2表可知,實施例1〜11的硬化性組成物1〜11的 硬化物,在23°C與l〇〇°C的雙方,均為6〇N/2_□以上 38R1 VI. Description of the Invention: [Technical Field to Which the Invention Is Applicable] The present invention relates to a hardenable composition which is excellent in transparency and heat resistance and which has a hardened material; it is obtained by hardening the composition, and using the same The composition is used as an adhesive for an optical element fixing material or a secondary encapsulating agent for a fixing material. Prior Art] So far, the hardening composition has been modified according to the use. 2 201237103 No. 10 Replacement page, the date of the month, the above (B) decane coupling agent has cyclohexene 1. Oxygen-. - the public, the smoulder mixture. [6] The curable composition according to any one of [1] to [5] further comprising (C) a metal complex of a metal atom of aluminum, ruthenium or titanium, and a content of (c) component (A) component or (A,) component 100 mass parts, including a mass part or more, and 10 mass parts or less. [7] The curable composition according to any one of [1], wherein the hydrazine further contains (D) a content of the alicyclic anhydride having a carboxyl group as the component (A) or ( A') Component 1〇〇 The mass portion includes the mass portion or more and the mass portion or less. [8] The curable composition according to any one of [1] to [7], which is a composition for a fixing member for a light element. According to the second aspect of the present invention, the cured product of the following [9] and [1] can be provided. [9] A cured product which is a hardenable composition according to any one of [7] to [7]. [10] The cured product according to [9], which is a light element fixing material. According to the third aspect of the present invention, there is provided a method of using the curable composition of the present invention as described in [u] and [12] below. [11] A method of using the curable composition according to any one of [A] to [7] as an adhesive for an optical element fixing material. [12] The curable composition according to any one of [1] to [7], which is used as an encapsulant for an optical element fixing material. [Effect of the Invention] According to the curable composition of the present invention, even when irradiated with high-energy light 7 201237103 or a high-temperature state, it is possible to reduce the transparency without coloring, and it is excellent in transparency for a long period of time. And has a hardened object of the ancient + $ very back. The curable composition of the present invention can be used for forming an optical element fixing material. In particular, τ is favorably used as an encapsulant for an optical element and an encapsulant for an optical element fixing material. [Embodiment] Hereinafter, the present invention will be described in detail with reference to 1) a curable composition, 2) a cured product, and 3) a method of using a curable composition. 1) Curable composition The curable composition of the present invention is characterized in that (A) a random compound of a broken compound is attached to a molecule, as shown by the following formulas (i), (ii) and (iii) Among the recurring units, the recurring units of (i) and (ii), (i) and (iii), (ii) and (iii), or (i), (ii) and (iii) have a weight average molecular weight of 1,0 00~30, 〇〇〇; and (B) a decane coupling agent having a reactive cyclic ether structure, with (^) and (^) and mass ratio, (^): ") = 95:5~ The ratio of 80:2 包含 is included: 201237103 No. 10, April 24, 101, revised replacement page - raw material, adhesive, and coating agent which can be suitably used for optical parts or molded bodies. - Curable composition of the present invention The cured product has a high bonding force, and can be confirmed, for example, by measuring the adhesion force as follows, that is, applying a curable composition to the mirror surface of the tantalum wafer, and placing the coated surface on the object. Crimping, heat treatment to harden it. Place this on a test bench preheated to a predetermined temperature f (for example, 2 generations, 10 (rc) and then the tester for 3 seconds, 〇 Stress is applied to the joint surface at a position of 胄50 ^ in the horizontal direction (shear direction), and the adhesion between the test piece and the object is measured. The adhesion of the hardened material is 23t and l〇 (TC, It is preferably 6 〇 n / 2 mD or more, preferably 80 N / 2 mm □ or more. The cured product is excellent in transparency and can be confirmed by measuring the light transmittance. The light transmittance of the cured product is at a wavelength of 4 〇〇. The light of nm is preferably 8 〇 or more, particularly preferably 86% or more, and the light having a wavelength of 45 〇 nm is preferably 87% or more. ϋ The cured product has excellent heat resistance and can be hardened by even After the object is placed at a high temperature, the change in the force and transparency is small. Confirm the force. After the pressure is placed on the loot: after 30 seconds, the adhesion is maintained at 5% or more of the adhesion force of 23 t, and the adhesion is preferably maintained at 65% or more. The force is better. The transparency is 15 〇. After 500 hours of standing, the transmittance at a wavelength of 4 〇〇 nm is preferably 80% or more of the initial transmittance. 3) The method of using the curable composition According to a third aspect of the invention, the curable composition of the present invention is used as a fixing member for an optical element. Next, the method of the encapsulant for an optical element fixing material is 201237103. The following: a light-emitting element such as an LED or an LD, a light-receiving element, a composite optical element, an optical unit circuit, etc. The curable composition of the present invention can be suitably used as an adhesive for an optical element fixing material. The curable composition of the present invention is used as a method for using an adhesive for an optical element fixing material, and The coating of the material (the optical element and its circuit board, etc.) or the surface of the two sides is applied to the composition, and after the crimping, heating is performed to harden it, and then the materials of the object are firmly adhered to each other. The main substrate material of the optical element may be glass such as soda glass or heat-resistant hard glass; ceramics; iron, copper, aluminum, gold, silver, platinum, chromium, titanium, and metal alloys thereof, stainless steel (SUS3) Metals such as 〇2, SUS3〇4, SUS3 04L, SUS309, etc.; polyethylene terephthalate, polybutylene terephthalate, butylene naphthalate, ethylene - vinyl acetate copolymer, polystyrene, polycarbonate, polydecylpentene, polysulfone 1 ketone, polyether mill, polyphenylene sulfide, polyether phthalimide, polyimine, poly A synthetic resin such as a brewing amine, an acrylic resin, a norbornene resin, a cycloolefin resin, or a glass epoxy resin. The heating temperature at the time of heat curing is usually from 100 to 200 depending on the hardenable composition to be used. (: The heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours. <Packaging agent for optical element fixing material> The curable composition of the present invention can be favorably used as the optical element 28 201237103 10 No. 4, the correction of the replacement page, the cured products of the curable compositions 丨 to j 5 obtained in Examples 1 to 11 and Comparative Examples 1 to 4 were measured as follows, and the adhesion, initial transmittance, and penetration after heating were measured as follows. Rate, evaluation followed by heat resistance, initial transparency, and heat resistance (transparency after heating). The measurement results and evaluations are shown in Table 2 below. (Continuous force test) Coating on the mirror surface of a 2 mm square tantalum wafer The curable composition 1 to 15 is formed to have a thickness of about 2/m, and the coated surface is placed on the substrate (silver-plated copper plate) and pressure-bonded thereto. Thereafter, it is 180. (: heat treatment for 2 hours to harden it) The object with the test piece is obtained, and the subject with the test piece is placed in a preheated temperature (2 3 C, 1 〇〇) and then tested 5| (Series 4000, MGE) 3 sec on the test bench, by the position of 被50 // m The stress was applied to the joint surface at a speed of 200 m/s in the horizontal direction (shear direction), and the measurement was at 23 t, 1 〇 (the test piece of rc and the adhesion force of the object (N/2_〇). Heat resistance) 在于 In the adhesion test of 100c, the evaluation is "〇" when the force is 8 ON/2mm□ or more, and "△" when 60N/2mm□ or more is less than 8〇N/2_□, less than 60N/ In the case of 2 mm □, it is "X". (Measurement of initial penetration rate) The curable compositions 1 to 15 were poured into a mold having a length of 25 mm, a width of 20 mm, and a thickness of 1 mm, and were cured by heating for 14 hours for 14 hours. The test piece was prepared, and the obtained test piece was measured for the initial transmittance (%) at a wavelength of 4 〇〇 nm and 45 〇 nm by a spectrophotometer (MPC-3100, manufactured by Shimadzu Corporation). 37 201237103 (Initial transparency) In the initial transmittance measurement, the transmittance at 400 nm is estimated to be 〇 〇 〇 , , , , , , , , , , , , , , , , , , 〇 〇 〇 〇 70 〇 〇 70 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 Measurement of the penetration rate) Each test piece for measuring the initial penetration rate was placed in an oven of 15 〇t 5 〇〇, and again, the wavelength was measured 4 〇nm, the transmittance (%). This is taken as the transmittance after heating. [Heat resistance (transparency after heating)] Measured by the transmittance after heating, the transmittance at 400 nm is 80% of the initial transmittance. % or more is evaluated as "〇", 7〇% or more is less than 8〇%, then "△", and less than 70% is "x_j. See 2 Table ------ -- Sturdy composition 0 Next force /2πιιη[ ) Initial transmittance (%) Initial transparency, transmittance after heating (%) Heat resistance (transparency after heating) 23 °C loot: Next heat resistance 400 nm 450 nm 400 nm 450 nm Example 1 1 122.1 93. 7 〇90.1 90.7 〇84.7 88.4 〇^example 2 2 110.3 86.2 〇88.9 90.6 〇84.2 88.2 〇例3 3 115.4 95.1 〇89.3 91.4 〇85.1 88.5 〇_夏施例4 4 149.2 110.6 〇88.6 90. 5 〇84.4 89.0 〇_ ^&amp;Example 5 5 168.5 128.9 〇88.2 90. 2 〇84.0 88.3 〇Example 6 6 172.7 121.4 〇87.6 90.1 〇83.9 87.7 〇Example 7 7 1 137.0 69.5 Δ 87.8 90.4 〇80.5 85.8 〇_ _^ Example 8 8 130.0 103.8 〇88.1 90.3 〇84.2 87.1 〇Example 9 9 155.6 117.3 〇88.5 90.6 〇83.3 86.8 _^Example 10 10 157.2 110.0 〇87.7 89. 9 〇83.5 85.9 〇11 11 142.0 73.3 Δ 89.2 90.8 〇78.4 82.6 〇例1 12 71.3 58. 1 X 89.8 91. 0 〇86.3 88.8 〇__^Example 2 13 60.9 35.7 X 86.9 89.8 〇82.2 86.2 〇__^ Comparative Example 3 14 148.6 105.8 〇88.3 90.4 〇14.4 50.7 ------ X Example 4 15 163.5 110.2 〇87.2 90.8 〇10.4 46.1 X From Table 2, Example The cured product of the hardening compositions 1 to 11 of 1 to 11 is 6 〇N/2_□ or more at both 23 ° C and 10 ° C.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637030B (en) * 2013-02-28 2018-10-01 日商琳得科股份有限公司 Curable composition, cured material, method of using curable composition, optical element package and method of manufacturing the same

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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MY171727A (en) * 2012-10-30 2019-10-25 Lintec Corp Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like
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MY175492A (en) * 2013-09-20 2020-06-30 Lintec Corp Curable composition, curing product, and method for using curable composition
WO2015041344A1 (en) * 2013-09-20 2015-03-26 リンテック株式会社 Curable composition, cured product, and method for using curable composition
TWI700314B (en) 2014-05-07 2020-08-01 日商琳得科股份有限公司 Curable polysilsesquioxane compound, its manufacturing method, curing composition, curing product, curing composition, etc. use method
TWI700313B (en) * 2014-05-07 2020-08-01 日商琳得科股份有限公司 Curable polysilsesquioxane compound, its manufacturing method, curable composition, curing object and use method of curable composition
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KR101887993B1 (en) 2016-07-27 2018-08-13 주식회사 엘지화학 Photo-curable resin composition and use of the same
TW201938648A (en) 2018-03-12 2019-10-01 日商琳得科股份有限公司 Curable composition, cured product, method for producing cured product, and method for using curable composition
KR20210148069A (en) * 2019-03-26 2021-12-07 린텍 가부시키가이샤 Curable composition, cured product, and method of using the curable composition

Family Cites Families (9)

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JPH1160734A (en) * 1997-08-14 1999-03-05 Showa Denko Kk Polymer, resist resin composition and formation of pattern using the same
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JP2009059651A (en) * 2007-09-03 2009-03-19 Osaka City Silsesquioxane insulating material
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TWI443167B (en) * 2008-02-19 2014-07-01 Lintec Corp And a polyorganosiloxane compound as a main component
TWI452068B (en) * 2008-03-26 2014-09-11 Lintec Corp A silane compound polymer, and a light element sealing body
KR101757497B1 (en) * 2010-02-10 2017-07-12 린텍 가부시키가이샤 Curable composition, cured article, and use of curable composition
TWI504681B (en) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
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